Image sensor module and imaging device

Abstract

This invention provides an image sensor module capable of properly dissipating the heat generated by the image sensor. [Solution] The image sensor module comprises a sensor substrate on which an image sensor for capturing an image of a subject is mounted on its surface; a base member facing the back surface of the sensor substrate; a front member facing the front surface of the sensor substrate; a biasing member disposed between the sensor substrate and the base member to bias the sensor substrate toward the front member; a first fastening member that fastens the base member and the front member against the biasing force of the biasing member; and a heat dissipation member disposed in a compressed state between the sensor substrate and the base member to dissipate heat generated by the sensor substrate to the base member.

Description

Technical Field

[0001] The present invention relates to an image sensor module and an imaging device.

Background Art

[0002] Conventionally, an imaging device having a function of adjusting the distance between an imaging element and a lens by interposing a coil spring between a bracket supporting the imaging element and a chassis has been known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In recent years, with the increase in the resolution of images, the amount of heat generated by the imaging element has also increased. Therefore, it is conceivable to arrange a heat dissipation member between the imaging element and the chassis to dissipate the heat generated by the imaging element. However, in the structure of Patent Document 1, since the element mounting seat to which the imaging element is attached by a coil spring is biased in a direction away from the chassis, there is a problem that it is difficult to make the heat dissipation member arranged between the element mounting seat and the chassis adhere closely to the element mounting seat.

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide an image sensor module capable of appropriately dissipating heat generated by an image sensor.

Means for Solving the Problems

[0006] To solve the above problems, the image sensor module according to the present invention is characterized by comprising: a sensor substrate on which an image sensor for capturing an image of a subject is mounted on its surface; a base member facing the back surface of the sensor substrate; a front member facing the front surface of the sensor substrate; a biasing member disposed between the sensor substrate and the base member to bias the sensor substrate toward the front member; a first fastening member that fastens the base member and the front member against the biasing force of the biasing member; and a heat dissipation member disposed in a compressed state between the sensor substrate and the base member to dissipate heat generated in the sensor substrate to the base member. [Effects of the Invention]

[0007] According to the present invention, an image sensor module capable of appropriately dissipating heat generated by the image sensor can be obtained. Other problems, configurations, and effects will be clarified by the following description of embodiments. [Brief explanation of the drawing]

[0008] [Figure 1] These are an assembled perspective view and an exploded perspective view of the imaging device as seen from the front. [Figure 2] These are an assembled perspective view and an exploded perspective view of the imaging device as seen from the rear. [Figure 3] This is an exploded perspective view of the image sensor module, seen from the front. [Figure 4] This is an exploded perspective view of the image sensor module, seen from the rear. [Figure 5] This is a three-view drawing of the base component. [Figure 6] This is a view of the sensor board from the back side. [Figure 7] This is a cross-sectional view of the image sensor module at VII-VII in Figure 1. [Modes for carrying out the invention]

[0009] The embodiments of the invention will be described below with reference to the drawings. This embodiment contributes to "Goal 9: Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation" of the United Nations' Sustainable Development Goals (SDGs) by realizing a highly versatile imaging device 1.

[0010] [Overall configuration of imaging device 1] Figure 1 is an assembled perspective view and exploded perspective view of the imaging device 1 viewed from the front. Figure 2 is an assembled perspective view and exploded perspective view of the imaging device 1 viewed from the rear. The imaging device 1 is a device that captures images of a subject. The imaging device 1 is a small imaging device used, for example, in medical fields such as ophthalmology and dentistry. However, the specific use of the imaging device 1 is not particularly limited, and it may also be a surveillance camera for monitoring the surroundings.

[0011] As shown in Figures 1 and 2, the imaging device 1 mainly comprises an image sensor module 10, an optical filter module 20, and a control module 30. The imaging device 1 further comprises an optical lens holder 2, a plurality of bolts 3 (second fastening members), a plurality of bolts 4, and a bottom bracket 5. However, the components of the imaging device 1 are not limited to the examples in Figures 1 and 2. For example, the optical lens holder 2 and the bottom bracket 5 can be omitted.

[0012] Hereinafter, the direction in which the optical axis of the image sensor 111 extends is defined as the "axial direction." Furthermore, the direction of the diameter of a virtual circle perpendicular to the axial direction with respect to the optical axis is defined as the "radial direction," and the direction of the circumference is defined as the "circumferential direction." In the radial direction, the direction toward the optical axis is defined as the radially inward direction, and the direction away from the optical axis is defined as the radially outward direction. The optical axis of the image sensor 111 refers, for example, to the imaging direction of the image sensor 111 (more specifically, the direction toward the center of the field of view of the image sensor 111). Furthermore, within the axial direction, the direction toward the subject is defined as the "forward direction," and the direction opposite to the forward direction is defined as the "rear direction." In addition, the axial direction is an example of the opposing directions of the sensor substrate 11, base member 12, and front member 13, which will be described later. Furthermore, in this specification, the axially forward surface of the sensor substrate 11, base member 12, front member 13, housings 21 and 31 is defined as the front surface, and the rear surface is defined as the back surface.

[0013] The image sensor module 10 is a module that captures images of a subject and generates images (still images and moving images). More specifically, the image sensor module 10 receives power from the control module 30 and operates according to the control of the control module 30. The image sensor module 10 also converts ambient light incident through the optical filter module 20 into photoelectric signals, and outputs an image signal indicating the captured image of the subject to the control module 30. Details of the image sensor module 10 will be described later with reference to Figure 3 and subsequent figures.

[0014] The optical filter module 20 is positioned in front of the image sensor module 10. The optical filter module 20 is a module that allows ambient light to enter the image sensor 111. The optical filter module 20 has a metal (e.g., made of die-cast aluminum) housing 21. The housing 21 houses a filter 22 (e.g., an IR cut filter), a dustproof sheet 23, etc. The housing 21 mainly consists of a base portion 24 and a support portion 25.

[0015] The base portion 24 is a plate-like member having a generally rectangular outer shape. The support portion 25 has a cylindrical outer shape. Also, the support portion 25 protrudes forward from the surface of the base portion 24. And the support portion 25 detachably supports the optical lens holder 2. That is, a plurality of types of optical lenses with different specifications (for example, magnification) can be selectively attached to the optical lens holder 2 (imaging device 1).

[0016] Furthermore, the optical filter module 20 has a bolt hole 26 and a front through hole 27 formed therein. The bolt hole 26 is formed on the back surface of the base portion 24 outside the support portion 25 in the radial direction. A bolt 3 that has passed through the notch 125 of the image sensor module 10 is screwed into the bolt hole 26. Thereby, the image sensor module 10 and the optical filter module 20 are fastened. The front through hole 27 penetrates the housing 21 in the thickness direction (axial direction) outside the support portion 25 in the radial direction. A bolt 4 is inserted into the front through hole 27.

[0017] The control module 30 is disposed behind the image sensor module 10. The control module 30 controls the operation of the image sensor 111. The control module 30 includes a housing 31 made of metal (for example, aluminum die-cast). The housing 31 has a rectangular parallelepiped outer shape with an open surface. The housing 31 houses the image sensor module 10 and a control board 32 that controls the operation of the image sensor 111.

[0018] Also, a connector 33 to which one end of a cable is detachably connected is provided on the back surface of the housing 31. The control module 30 (imaging device 1) is connected to an external device through a cable connected to the connector 33. And the control module 30 operates the image sensor 111 using the power supplied from the external device through the cable, and outputs the image signal output from the image sensor 111 to the external device through the cable.

[0019] Furthermore, bolt holes 34 are formed on the surface of the housing 31. Bolts 4 passing through the front through holes 27 are screwed into the bolt holes 34. As a result, among the image sensor module 10 and the optical filter module 20 fastened by the bolts 3, the image sensor module 10 is housed inside the housing 31, and the optical filter module 20 is fastened to the control module 30. On the other hand, the image sensor module 10 is not in direct contact with the control module 30 (more specifically, the housing 31).

[0020] The bottom bracket 5 is attached to the lower surface of the housing 31 of the control module 30. The bottom bracket 5 serves as, for example, a pedestal when placing the imaging device 1 on a mounting surface. Also, parts for operating the imaging device 1 may be housed inside the bottom bracket 5.

[0021] [Configuration of Image Sensor Module 10] FIG. 3 is an exploded perspective view of the image sensor module 10 as viewed from the front side. FIG. 4 is an exploded perspective view of the image sensor module 10 as viewed from the rear side. As shown in FIGS. 3 and 4, the image sensor module 10 mainly includes a sensor substrate 11, a base member 12, a front member 13, a plurality of coil springs 14 (biasing members), a plurality of bolts 15 (first fastening members), and a heat radiating member 16.

[0022] The sensor substrate 11 is a plate-shaped substrate on which electronic components (for example, an image sensor 111 and a power supply component 112) are mounted. The sensor substrate 11 is, for example, a glass epoxy substrate. Also, the sensor substrate 11 is a double-sided mounting substrate on which the image sensor 111 is mounted on the front surface and the power supply component 112 is mounted on the back surface.

[0023] The image sensor 111 generates an image signal by converting ambient light incident through an optical lens mounted on the optical lens holder 2 into photoelectric energy. The image sensor 111 is, for example, a CMOS (Complementary Metal-Oxide-Semiconductor) or a CCD (Charge-Coupled Device). The power supply component 112 is an IC chip that supplies power output from the control board 32 to the image sensor 111.

[0024] In addition, the sensor board 11 is equipped with electronic components that operate the image sensor 111 according to the control of the control board 32 (for example, an IC chip that outputs the image signal generated by the image sensor 111 to the control board 32). Of the electronic components mounted on the sensor board 11, the image sensor 111 and the power supply component 112 generate particularly large amounts of heat.

[0025] Furthermore, a through-hole 113 is formed in the sensor substrate 11. The through-hole 113 penetrates the sensor substrate 11 in the thickness direction (axial direction) at a location different from the mounting areas of other electronic components, including the image sensor 111 and the power supply component 112. A bolt 15 that has passed through the base through-hole 123 is inserted through the through-hole 113.

[0026] Furthermore, positioning holes 114a and 114b are formed in the sensor substrate 11. The positioning holes 114a and 114b penetrate the sensor substrate 11 in the thickness direction (axial direction) at a location different from the mounting area of ​​other electronic components, including the image sensor 111 and the power supply component 112. Positioning protrusions 133, which will be described later, are inserted through the positioning holes 114a and 114b. Positioning hole 114a is a space that is surrounded all around by the inner wall of the sensor substrate 11. Positioning hole 114b is a space that is partially open at the outer edge of the sensor substrate 11 and extends radially inward from a part of the outer edge of the sensor substrate 11.

[0027] The base member 12 faces the back surface of the sensor substrate 11. The base member 12 is a plate-shaped member made of metal (for example, aluminum die-cast). Figure 5 is a three-view drawing (front view, side view, and back view) of the base member 12. In addition, the VV portion of the front view (left view) in the side view (middle view) of Figure 5 is a cross-section. As shown in Figure 5, the base member 12 has a protruding surface 121, a plurality of recesses 122, a plurality of base through holes 123, a plurality of cylindrical portions 124, a plurality of notches 125, and a plurality of positioning recesses 126.

[0028] The protruding surface 121 is provided on the surface of the base member 12. The protruding surface 121 also protrudes forward (towards the sensor substrate 11) from the surface of the base member 12. Furthermore, the protruding surface 121 is a plane perpendicular to the axial direction. In this embodiment, the protruding surface 121 has a rectangular (rectangular) outer shape when viewed from the axial direction. In addition, the protruding surface 121 is provided at a position spaced apart from the outer circumferential surfaces 124a of the plurality of cylindrical portions 124. In other words, a space is formed between the protruding surface 121 and the outer circumferential surfaces 124a of the cylindrical portions 124. The heat dissipation member 16, which is positioned between the sensor substrate 11 and the base member 12, is in contact with the protruding surface 121.

[0029] Figure 6 is a view of the sensor substrate 11 from the back side. In Figure 6, the mounting area of ​​the image sensor 111 is shown by a dashed line, and the position of the protruding surface 121 is shown by a dashed line. As shown in Figure 6, the protruding surface 121 is located radially inward from the outer edge of the image sensor 111. The power supply component 112 is mounted in a position that overlaps with the mounting area of ​​the image sensor 111 when viewed from the axial direction of the sensor substrate 11. The power supply component 112 is also mounted in a position that overlaps with the protruding surface 121 when viewed from the axial direction of the sensor substrate 11. Furthermore, it is desirable that electronic components that generate a large amount of heat among the electronic components mounted on the sensor substrate 11 be mounted in a position that overlaps with the protruding surface 121 when viewed from the axial direction of the sensor substrate 11.

[0030] Multiple recesses 122 are provided on the back surface of the base member 12 at positions spaced apart from each other. The recesses 122 are recessed forward from the back surface of the base member 12. The depth of the recesses 122 is set to be the same as or slightly deeper than the height of the bolt head 15. Multiple base through holes 123 penetrate the base member 12 in the thickness direction (axial direction) at the location of each of the multiple recesses 122. The bolt 15 is inserted through the base through holes 123. This prevents the head of the bolt 15 from protruding rearward from the back surface of the base member 12 by fitting it into the recess 122.

[0031] Furthermore, the multiple base through holes 123 are composed of large-diameter holes 123a and small-diameter holes 123b. One end of the large-diameter hole 123a opens to the protruding end of the cylindrical portion 124, and the other end communicates with the small-diameter hole 123b inside the base member 12. If the cylindrical portion 124 is omitted, one end of the large-diameter hole 123a opens to the surface of the base member 12. One end of the small-diameter hole 123b opens to the back surface of the base member 12, and the other end communicates with the large-diameter hole 123a inside the base member 12. Also, the diameter of the small-diameter hole 123b is smaller than the diameter of the large-diameter hole 123a. More specifically, the diameter of the large-diameter hole 123a is larger than the diameter of the shaft portion of the coil spring 14 and the bolt 15. On the other hand, the diameter of the small-diameter hole 123b is smaller than the diameter of the coil spring 14 and larger than the diameter of the shaft portion of the bolt 15.

[0032] The large-diameter hole 123a and the small-diameter hole 123b are defined by inner wall surfaces 123c and 123d formed inside the base member 12. The inner wall surfaces 123c and 123d have a circular cross-section perpendicular to the thickness direction of the base member 12 and are cylindrical surfaces extending in the thickness direction of the base member 12. The inner wall surfaces 123c and 123d of the large-diameter hole 123a and the small-diameter hole 123b are connected by a stepped surface 123e. The stepped surface 123e is a surface perpendicular to the extension direction of the base through-hole 123. The outer circumferential surface of the stepped surface 123e is connected to the inner wall surface 123c of the large-diameter hole 123a, and the inner circumferential surface of the stepped surface 123e is connected to the inner wall surface 123d of the small-diameter hole 123b.

[0033] As a result, the bolt 15 inserted into the base through-hole 123 from the back side of the base member 12 passes through the small-diameter hole 123b and the large-diameter hole 123a and protrudes to the front side of the base member 12. On the other hand, the coil spring 14 inserted into the base through-hole 123 from the front side of the base member 12 passes through the large-diameter hole 123a and its rear end abuts against the stepped surface 123e. The coil spring 14 is also externally fitted onto the bolt 15. In other words, the coil spring 14 is positioned to surround the bolt 15. The coil spring 14 is also positioned between the bolt 15 and the inner wall surface 123c of the large-diameter hole 123a.

[0034] Furthermore, the multiple base through holes 123 are arranged to surround the protruding surface 121. As an example, the protruding surface 121 is located inside a virtual circle passing through the centers of each of the multiple base through holes 123. Furthermore, it is desirable that the centroid of the protruding surface 121 coincides with the center of the virtual circle passing through the centers of each of the multiple base through holes 123. As another example, the protruding surface 121 is located inside a polygon (a triangle in this embodiment) with the centers of each of the multiple base through holes 123 as its vertices. Furthermore, it is desirable that the centroid of the protruding surface 121 coincides with the centroid of the polygon with the centers of each of the multiple base through holes 123 as its vertices.

[0035] Multiple cylindrical portions 124 are provided on the surface of the base member 12 at positions surrounding each of the multiple base through holes 123. The cylindrical portions 124 also protrude forward (towards the sensor substrate 11) from the surface of the base member 12. The cylindrical portions 124 are hollow cylinders. The interior of each cylindrical portion 124 forms a space that contributes to the formation of a portion of the large-diameter hole 123a.

[0036] The amount of protrusion of the cylindrical portion 124 is greater than the amount of protrusion of the protruding surface 121. In other words, the protruding end of the cylindrical portion 124 is located in front of the protruding end of the protruding surface 121 (closer to the sensor substrate 11). The amount of protrusion of the cylindrical portion 124 is set so that when the image sensor module 10 is assembled using the assembly method described later, the tip of the cylindrical portion 124 does not come into contact with the sensor substrate 11. The amount of protrusion of the protruding surface 121 is set according to the thickness of the commercially available heat dissipation member 16, described later, and the distance between the sensor substrate 11 and the base member 12 when the image sensor module 10 is assembled.

[0037] The cylindrical portion 124 demarcates the space between the coil spring 14 and the protruding surface 121. More specifically, the outer circumferential surface 124a of the cylindrical portion 124 is located between the coil spring 14, which is positioned within the base through-hole 123, and the protruding surface 121. When the heat dissipation member 16 provided on the protruding surface 121 is compressed, the outer circumferential surface 124a of the cylindrical portion 124 comes into contact with the heat dissipation member 16, thereby suppressing contact of the heat dissipation member 16 with the coil spring 14. In other words, when the heat dissipation member 16, sandwiched between the sensor substrate 11 and the base member 12, is compressed and expands radially outward from the protruding surface 121, the cylindrical portion 124 can prevent the heat dissipation member 16 from coming into contact with the coil spring 14.

[0038] The multiple notches 125 are spaces formed in the base member 12 at positions spaced apart from each other. The notches 125 also penetrate the base member 12 in the thickness direction (axial direction). Furthermore, the outer peripheral end of the base member 12 is open at the locations where the notches 125 are formed. The notches 125 are set to a size that allows the shaft of the bolt 3 to pass through but prevents the head of the bolt 3 from passing through. The image sensor module 10 and the optical filter module 20 are fastened together by screwing the bolt 3, which has passed through the notches 125 from the back side of the base member 12, into the bolt hole 26.

[0039] Multiple positioning recesses 126 are arranged on the base member 12 at positions spaced apart from each other. The positioning recesses 126 may penetrate from the front surface to the back surface of the base member 12, or the back surface may be closed. Positioning projections 133 that have passed through the positioning holes 114a and 114b are accommodated in the positioning recesses 126.

[0040] The front member 13 faces the surface of the sensor substrate 11. The front member 13 is made of metal (for example, zinc die-cast). The front member 13 has a frame-shaped outer shape that is continuous in the circumferential direction so as to surround the image sensor 111. The front member 13 has an opening 131 formed by the inner circumferential side surface of the frame. In other words, an opening 131 with an area larger than the image sensor 111 penetrates the center of the front member 13 in the thickness direction.

[0041] Furthermore, the front member 13 has a plurality of bolt holes 132 formed therein. The plurality of bolt holes 132 are provided around the opening 131 (in other words, the frame portion). The bolt holes 132 are formed on the back surface of the front member 13. On the other hand, the bolt holes 132 may penetrate from the front surface to the back surface of the front member 13. Bolts 15 that have passed through the base through holes 123 and the substrate through holes 113 are screwed into the bolt holes 132. This fastens the sensor substrate 11, the base member 12, and the front member 13 together.

[0042] Furthermore, the front member 13 has a plurality of positioning protrusions 133 formed thereon. The plurality of positioning protrusions 133 are provided around the opening 131 (in other words, the frame portion). The positioning protrusions 133 project rearward from the back surface of the front member 13. The positioning protrusions 133 then pass through the positioning holes 114a and 114b of the sensor substrate 11 and are accommodated in the positioning recesses 126 of the base member 12. As a result, the sensor substrate 11, the base member 12, and the front member 13 are positioned in a direction perpendicular to the axial direction.

[0043] The coil spring 14 is positioned between the sensor substrate 11 and the base member 12. More specifically, as shown in Figure 7, the coil spring 14 is externally fitted onto the bolt 15. The rear end of the coil spring 14 enters the base through-hole 123 from the front side of the base member 12 (i.e., the side with the large diameter hole 123a) and contacts the stepped surface 123e. Furthermore, the front end of the coil spring 14 contacts the back surface of the sensor substrate 11 at a position surrounding the substrate through-hole 113. As a result, the coil spring 14 biases the sensor substrate 11 toward the front member 13. In other words, the coil spring 14 biases the sensor substrate 11 away from the base member 12.

[0044] The heat dissipation member 16 has a generally rectangular parallelepiped shape. Furthermore, the heat dissipation member 16 is flexible. In this specification, "flexibility" refers to the property that, when compressed by the sensor substrate 11 and the base member 12, its thickness decreases in proportion to the distance between the sensor substrate 11 and the base member 12, and it expands radially outward. Alternatively, "flexibility" can also refer to the property that the thickness increases in accordance with the expansion of the distance between the sensor substrate 11 and the base member 12. The increase in thickness should be sufficient to accommodate a slight decrease in the tightening amount of the bolts 15 during the adjustment described later. Furthermore, the heat dissipation member 16 is formed from a material with high thermal conductivity. The material forming the heat dissipation member 16 is not particularly limited, but for example, it may be a combination of polyurethane and ceramic filler, or silicone rubber. As another example, the heat dissipation member 16 may be a gel-like material.

[0045] The heat dissipation member 16 is positioned in a compressed state between the sensor substrate 11 and the base member 12. More specifically, the heat dissipation member 16 is positioned between the back surface of the sensor substrate 11 and the protruding surface 121 of the base member 12. The axial dimensions (i.e., thickness) of the heat dissipation member 16 before compression are selected, for example, from a selection of off-the-shelf products. On the other hand, the size and shape of the heat dissipation member 16 perpendicular to the axial direction before compression match the size and shape of the protruding surface 121. The heat dissipation member 16, compressed by the sensor substrate 11 and the base member 12, expands radially (in the direction perpendicular to the axial direction) outward, becoming larger than the protruding surface 121.

[0046] Therefore, before compression, the heat dissipation member 16 contacts the back surface of the sensor substrate 11 inside the mounting area of ​​the image sensor 111 shown in Figure 6. Furthermore, the area in which the heat dissipation member 16 contacts the back surface of the sensor substrate 11 after compression approaches the mounting area of ​​the image sensor 111. In addition, the heat dissipation member 16 contacts the back surface of the sensor substrate 11 in a manner that covers the power supply component 112 both before and after compression. However, the power supply component 112 may be mounted outside the area in which the heat dissipation member 16 contacts the back surface of the sensor substrate 11 before compression, and within the area in which the heat dissipation member 16 contacts the back surface of the sensor substrate 11 after compression.

[0047] The heat dissipation member 16 absorbs the heat generated by the sensor substrate 11 (more specifically, the image sensor 111 and power supply component 112) and dissipates it toward the base member 12. The heat absorbed by the heat dissipation member 16 is then dissipated to the outside of the imaging device 1 through the metal base member 12, the bolts 15, and the housing 21 of the optical filter module 20. On the other hand, since the base member 12 and the control module 30 (more specifically, the housing 31) are not in direct contact, heat is not directly transferred from the base member 12 to the housing 31.

[0048] [Assembly method for imaging device 1] Figure 7 is a cross-sectional view of the image sensor module 10 at VII-VII in Figure 1. The method for assembling the imaging device 1 will be explained with reference to Figures 1 to 7. Note that the optical filter module 20 and the control module 30 are assumed to be already assembled, and their assembly methods will be omitted. Furthermore, the assembly sequence described below is an example and is not limited thereto.

[0049] First, the worker inserts the bolt 15 into the base through hole 123 from the back side of the base member 12. The worker then attaches the coil spring 14 to the bolt 15 from the front side of the base member 12. This causes the rear end of the coil spring 14 to contact the stepped surface 123e. Furthermore, the worker places the heat dissipation member 16 on the protruding surface 121.

[0050] Next, the worker faces the back surface of the sensor substrate 11 toward the front surface of the base member 12, and inserts the bolt 15, which has passed through the base through hole 123, into the substrate through hole 113 from the back side of the sensor substrate 11. As a result, the tip of the coil spring 14 comes into contact with the back surface of the sensor substrate 11 at a position surrounding the substrate through hole 113. Meanwhile, at this point, the heat dissipation member 16 may or may not be in contact with the back surface of the sensor substrate 11.

[0051] Next, the worker faces the front surface of the sensor substrate 11 toward the back surface of the front member 13 and inserts the positioning projection 133 into the positioning holes 114a, 114b and positioning recess 126 from the front surface side of the sensor substrate 11. This positions the sensor substrate 11, base member 12, and front member 13 in a direction perpendicular to the axial direction, allowing the bolt 15 that has passed through the base through hole 123 and the substrate through hole 113 to be screwed into the bolt hole 132.

[0052] Next, the worker screws the bolt 15 into the bolt hole 132. This fastens the base member 12 and the front member 13 with the sensor substrate 11 in between, and compresses the coil spring 14. In other words, the bolt 15 fastens the base member 12 and the front member 13 against the biasing force of the coil spring 14. Also, during the tightening of the bolt 15, the heat dissipation member 16 sandwiched between the sensor substrate 11 and the base member 12 is compressed and spreads radially outward from the protruding surface 121. The more the bolt 15 is tightened, the greater the amount of compression of the heat dissipation member 16 (in other words, the amount of radial outward expansion). The compressed heat dissipation member 16 that has spread radially outward is then blocked by the outer circumferential surface 124a of the cylindrical portion 124 and flows out into the space between the protruding surface 121 and the outer circumferential surface 124a.

[0053] Furthermore, the worker performs what is known as "tailgating adjustment" by individually adjusting the tightening amount of multiple bolts 15. Tailing adjustment is the process of adjusting (increasing or decreasing) the distance between the sensor substrate 11 and the base member 12 at the position of each of the multiple bolts 15, thereby orthogonal to the optical axis of the optical lens of the image sensor 111. The protruding end of the cylindrical part 124 is spaced apart from the back surface of the sensor substrate 11, so that a gap is always formed between it and the sensor substrate 11. After performing the tailgating adjustment, the worker fixes the bolts 15 by filling the base through-hole 123 and the substrate through-hole 113 with adhesive. This completes the assembly of the image sensor module 10.

[0054] Here, the coil spring 14 generates a biasing force that separates the sensor substrate 11 and the base member 12. Also, during the adjustment process, the amount the bolt 15 is tightened may be reduced. In other words, the axial distance between the sensor substrate 11 and the base member 12 may widen after the heat dissipation member 16 is compressed. In contrast, the flexible heat dissipation member 16 can follow the slight widening of the distance between the sensor substrate 11 and the base member 12 and remain in close contact with the sensor substrate 11 and the base member 12.

[0055] Next, the worker positions the front surface of the image sensor module 10 and the back surface of the optical filter module 20 facing each other, and screws the bolt 3, which has passed through the notch 125 from the back side of the image sensor module 10, into the bolt hole 26. This completes the assembly of the image sensor module 10 and the optical filter module 20. Note that the aforementioned tilt adjustment may be performed after the image sensor module 10 and the optical filter module 20 have been assembled.

[0056] Next, the worker combines the image sensor module 10 and the optical filter module 20 into the housing 31 of the control module 30, and screws the bolt 4, which has passed through the front through-hole 27 from the surface side of the optical filter module 20, into the bolt hole 34. This completes the assembly of the image sensor module 10, the optical filter module 20, and the control module 30. Furthermore, the worker attaches the optical lens and the bottom bracket 5, thereby completing the imaging device 1 shown in Figures 1 and 2.

[0057] [Effects of the Embodiment] According to the above embodiment, by placing the heat dissipation member 16 between the sensor substrate 11 and the base member 12, the heat generated by the image sensor 111 can be dissipated to the base member 12. Furthermore, by compressing the heat dissipation member 16, it can be made to adhere closely to both the sensor substrate 11 and the base member 12. This prevents the heat dissipation member 16 from shifting or peeling off, thus achieving proper heat dissipation.

[0058] Furthermore, according to the above embodiment, providing the protruding surface 121 makes it easier to position the heat dissipation member 16 during assembly. In terms of positioning the heat dissipation member 16, instead of the protruding surface 121, a recess for accommodating the heat dissipation member 16 may be provided on the surface of the base member 12. However, the protruding surface 121 is superior to the recess in order to facilitate the expansion of the compressed heat dissipation member 16 radially outward. Also, by adjusting the amount of protrusion of the protruding surface 121 according to the thickness of the heat dissipation member 16, the amount of compression of a pre-fabricated heat dissipation member 16 can be appropriately adjusted.

[0059] Furthermore, according to the above embodiment, the heat dissipation member 16 before compression is placed inside the mounting area of ​​the image sensor 111. This prevents the heat dissipation member 16, which has been compressed and expanded radially outward, from expanding too far beyond the mounting area of ​​the image sensor 111. This prevents the heat dissipation member 16, which has expanded radially outward, from interfering with other components (for example, the coil spring 14).

[0060] Furthermore, according to the above embodiment, by individually adjusting the tightening amount of the multiple bolts 15, the compression amount of the heat dissipation member 16 can be appropriately adjusted, and tilt adjustment can be achieved. This absorbs manufacturing variations of the components and stabilizes the imaging quality of the imaging device 1.

[0061] Furthermore, according to the above embodiment, the coil spring 14 is externally fitted onto the bolt 15, and the stepped surface 123e of the base through hole 123 is used as a spring seat. This makes it possible to miniaturize the imaging device 1 compared to installing the coil spring 14 and the bolt 15 in separate positions, and also allows the coil spring 14 to expand and contract stably.

[0062] Furthermore, according to the above embodiment, by dividing the space between the base through-hole 123 (in other words, the coil spring 14 inserted into the base through-hole 123) and the protruding surface 121 with the cylindrical portion 124, it is possible to suppress the heat dissipation member 16, which is compressed and expands radially outward, from coming into contact with the coil spring 14.

[0063] Furthermore, according to the above embodiment, by separating the protruding surface 121 from the outer circumferential surface 124a of the cylindrical portion 124, the heat dissipation member 16, which has been compressed and spread radially outward, is blocked by the outer circumferential surface 124a and flows out into the space between the protruding surface 121 and the outer circumferential surface of the cylindrical portion 124. This prevents the heat dissipation member 16 from overflowing the cylindrical portion 124.

[0064] Furthermore, according to the above embodiment, after performing the tilt adjustment, adhesive is filled into the base through-hole 123 and the substrate through-hole 113 to fix the bolt 15. This prevents the distance between the sensor substrate 11 and the base member 12 from changing afterward. As a result, the tilt adjustment state can be maintained, and the displacement or peeling of the heat dissipation member 16 can be prevented.

[0065] Furthermore, according to the above embodiment, by covering the power supply component 112, which generates a large amount of heat, with the heat dissipation member 16, the heat generated in the sensor substrate 11 can be efficiently dissipated to the base member 12.

[0066] Furthermore, according to the above embodiment, the heat absorbed by the heat dissipation member 16 is dissipated to the outside through the base member 12, the bolts 15, and the housing 21 of the optical filter module 20, thereby suppressing the propagation of this heat to the control module 30 (more specifically, the control board 32).

[0067] Although various embodiments have been described above with reference to the drawings, it goes without saying that this disclosure is not limited to such examples. It is clear to those skilled in the art that various modifications, alterations, substitutions, additions, deletions, and equivalents can be conceived within the scope of the claims, and these are also understood to fall within the technical scope of this disclosure. Furthermore, the components of the various embodiments described above can be combined arbitrarily without departing from the spirit of the invention. [Explanation of symbols]

[0068] 1: Imaging device 2: Optical lens 3,4,15: Bolt 5: Bottom Bracket 10: Image sensor module 11: Sensor board 12: Base component 13: Front component 14: Coil spring 16: Heat dissipation component 20: Optical filter module 21,31: Enclosure 22: Filter 23: Dustproof sheet 24: Base section 25: Lens support part 26,34,132: Bolt holes 27: Front through-hole 30: Control Module 32: Control board 33: Connector 111: Image sensor 112: Power supply components 113: Through-hole on circuit board 114a, 114b: Positioning holes 121:Protruding surface 122: Recess 123: Base through hole 123a: Large diameter hole 123b: Small diameter hole 123c, 123d: Interior wall surface 123e: Step surface 124: Cylindrical section 124a: Outer surface 125: Notch 126: Positioning recess 131 :Aperture 133: Positioning projection

Claims

1. A sensor board with an image sensor mounted on its surface to capture images of the subject, A base member facing the back surface of the sensor substrate, A front member facing the surface of the sensor substrate, A biasing member is disposed between the sensor substrate and the base member and biases the sensor substrate toward the front member, A first fastening member fastens the base member and the front member against the biasing force of the biasing member, An image sensor module characterized by comprising a heat dissipation member, which is disposed in a compressed state between the sensor substrate and the base member, and which dissipates heat generated by the sensor substrate to the base member.

2. In the image detection module according to claim 1, A protruding surface is formed on the surface of the base member, which protrudes toward the sensor substrate. The image sensor module is characterized in that the heat dissipation member is arranged in a compressed state between the back surface of the sensor substrate and the protruding surface of the base member.

3. In the image sensor module according to claim 2, The protruding surface is positioned radially inward from the outer edge of the image sensor when viewed from the opposing direction of the sensor substrate and the base member. An image sensor module characterized in that the size of the heat dissipation member before compression matches the size of the protruding surface.

4. In the image sensor module according to claim 2, The first fastening member is a bolt that passes through a base through-hole that penetrates the base member and a substrate through-hole that penetrates the sensor substrate, and is screwed into a bolt hole provided in the front member. An image sensor module characterized in that the distance between the sensor substrate and the base member is adjusted by individually adjusting the tightening amount of each of the multiple bolts.

5. In the image sensor module according to claim 4, The base through-hole is composed of a large-diameter hole opening on the surface of the base member and a small-diameter hole opening on the back surface of the base member and having a smaller diameter than the large-diameter hole. The biasing member is a coil spring arranged around the bolt, with its rear end abutting against a stepped surface connecting the inner wall surface of the base member defining the large-diameter hole and the inner wall surface of the base member defining the small-diameter hole, and its front end abutting against the back surface of the sensor substrate.

6. In the image detection module according to claim 5, The surface of the base member is provided with a cylindrical portion that protrudes toward the sensor substrate. The image sensor module is characterized in that the cylindrical portion partitions the space between the coil spring and the protruding surface.

7. In the image sensor module according to claim 6, The image sensor module is characterized in that the protruding surface is provided at a position spaced apart from the outer circumferential surface of the cylindrical portion.

8. In the image sensor module according to claim 4, The image sensor module is characterized in that the bolts are fixed by adhesive filled into the through-holes in the base and the through-holes in the substrate.

9. In the image detection module according to claim 1, A power supply component for supplying power to the image sensor is mounted on the back surface of the sensor substrate. An image sensor module characterized in that the compressed heat dissipation member contacts the back surface of the sensor substrate so as to cover the power supply component.

10. The image sensor module according to claim 1, An optical filter module positioned in front of the image sensor module to allow ambient light to enter the image sensor, The system includes a control module positioned behind the image sensor module, which controls the operation of the image sensor. An imaging apparatus characterized in that the base member, the housing of the optical filter module, and the second fastening member that fastens the base member and the housing together are made of metal.

Images