Joint structure, accelerator, method for manufacturing the joint structure

Abstract

The present invention provides a junction structure, an accelerator, and a method for manufacturing the junction structure that can read out the combined signals from both sides of a flexible substrate regardless of the conditions. [Solution] In the bonded structure, the bonding member 3 makes electrical conductivity between the first conductor layer 11 and the second conductor layer 12 at an out-of-plane position on the flexible substrate 2, thereby enabling the reading of signals from the flexible substrate 2. In this way, the bonding member 3 can make electrical conductivity between both sides of the flexible substrate 2 simultaneously without forming vias on the flexible substrate 2. Therefore, regardless of the conditions, the signals from both sides of the flexible substrate can be summed and read out.

Description

Technical Field

[0001] The present invention relates to a bonding structure, an accelerator, and a method for manufacturing a bonding structure.

Background Art

[0002] A structure for reading signals from a multi-channel sensor or the like using a flexible substrate has been known (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, when reading signals using a flexible substrate, it has been required to sum and read the signals on both sides of the flexible substrate. In this case, a method of conducting both sides using vias penetrating the flexible substrate may be adopted. However, depending on the flexible substrate, it may be difficult to form vias. Therefore, it has been required to sum and read the signals on both sides of the flexible substrate regardless of the conditions.

[0005] Therefore, an object of the present invention is to provide a bonding structure, an accelerator, and a method for manufacturing a bonding structure that can sum and read the signals on both sides of a flexible substrate regardless of the conditions.

Means for Solving the Problems

[0006] A bonding structure according to one aspect of the present invention comprises a flexible substrate having a first conductor pattern formed on one surface and a second conductor pattern formed on the other surface, and a bonding member having a first conductor layer bonded to the first conductor pattern and a second conductor layer bonded to the second conductor pattern, wherein the bonding member can read signals from the flexible substrate by making electrical contact between the first conductor layer and the second conductor layer at an out-of-plane position of the flexible substrate.

[0007] In this bonding structure, a first conductor pattern is formed on one side of the flexible substrate, and a second conductor pattern is formed on the other side. The bonding member has a first conductor layer bonded to the first conductor pattern and a second conductor layer bonded to the second conductor pattern. As a result, the bonding member can read the signal from one side of the flexible substrate using the first conductor layer and the signal from the other side of the flexible substrate using the second conductor layer. Here, the bonding member can read the signal from the flexible substrate by making the first and second conductor layers electrically conductive at an out-of-plane position on the flexible substrate. In this way, the bonding member can make electrical contact with both sides of the flexible substrate simultaneously without forming vias on the flexible substrate. Therefore, regardless of the conditions, the signals from both sides of the flexible substrate can be summed and read.

[0008] The joining structure may have a joint where the joining member and the flexible substrate are joined by a pressing force created by a combination of a protruding member and a grooved member. For example, when joining using an anisotropic conductive paste, specialized equipment is required for pressing and high temperatures. In contrast, joining using a pressing force created by a combination of a protruding member and a grooved member eliminates the need for specialized equipment. Furthermore, the joining member can be removed from the flexible substrate by releasing the pressing force. In addition, even when the conductive layer of the joining member and the conductive pattern of the flexible substrate are made of dissimilar metals, they can be joined together.

[0009] The bonding member may have a continuous sheet member, on which a first conductive layer and a second conductive layer are electrically connected. In this case, a single bonding member can provide electrical connection to both sides of the flexible substrate.

[0010] The bonding member may include a first substrate having a first conductor layer and a second substrate having a second conductor layer and being a separate component of the first substrate. In this case, compared to a structure in which a single bonding member bonds both sides of a flexible substrate, the lamination process is simplified because there is no bending step.

[0011] An accelerator according to one aspect of the present invention includes a detection unit that detects particle beams using the above-described junction structure. This allows the detection unit used in the accelerator to read out the signals from both sides of the flexible substrate when handling signals from multiple channels.

[0012] A method for manufacturing a bonded structure according to one aspect of the present invention comprises a flexible substrate having a first conductor pattern formed on one surface and a second conductor pattern formed on the other surface, and a bonding member having a first conductor layer to be bonded to the first conductor pattern and a second conductor layer to be bonded to the second conductor pattern, and is a method for manufacturing a bonded structure capable of reading signals from a flexible substrate, wherein the first conductor layer is brought into contact with the first conductor pattern, the second conductor layer is brought into contact with the second conductor pattern, and the bonding member and the flexible substrate are pressed together to bond the first conductor layer to the first conductor pattern, bond the second conductor layer to the second conductor pattern, and make the first conductor layer and the second conductor layer electrically connected at an out-of-plane position on the flexible substrate.

[0013] The bonding member enables the reading of signals from the flexible substrate by providing electrical conductivity between the first and second conductor layers at an out-of-plane position on the flexible substrate. In this way, the bonding member can provide electrical conductivity to both sides of the flexible substrate simultaneously without forming vias on the flexible substrate. Therefore, regardless of the conditions, the signals from both sides of the flexible substrate can be summed and read. Furthermore, by employing bonding using pressing force, specialized equipment can be eliminated. The bonding member can also be removed from the flexible substrate by releasing the pressing force. In addition, it is possible to bond the conductor layers of the bonding member and the conductor patterns of the flexible substrate even if they are made of dissimilar metals. [Effects of the Invention]

[0014] According to the present invention, it is possible to provide a bonding structure, an accelerator, and a method for manufacturing a bonding structure that can read out the combined signals from both sides of a flexible substrate regardless of the conditions. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic diagram showing a particle beam therapy apparatus equipped with an accelerator using a junction structure according to one embodiment of the present invention. [Figure 2] This is an exploded view of the joint structure according to this embodiment. [Figure 3] This is a plan view of the joint structure. [Figure 4] This is an unfolded view of the joint structure related to a modified example. [Figure 5] This is an unfolded view of the joint structure related to a modified example. [Figure 6] This is an unfolded view of the joint structure related to a modified example. [Modes for carrying out the invention]

[0016] An accelerator according to one embodiment of the present invention will be described below with reference to the attached drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant explanations are omitted.

[0017] FIG. 1 is a schematic configuration diagram showing a particle beam therapy apparatus 101 including an accelerator 100 using a bonding structure according to an embodiment of the present invention. The particle beam therapy apparatus 101 is a system used for cancer treatment by radiation therapy or the like. The particle beam therapy apparatus 101 includes an accelerator 100 that accelerates charged particles generated by an ion source device and emits them as a particle beam, an irradiation unit 102 that irradiates a subject with the particle beam, and a transport path 131 that transports the particle beam emitted from the accelerator 100 to the irradiation unit 102. The irradiation unit 102 is attached to a rotating gantry 105 provided so as to surround a treatment table 104. The irradiation unit 102 is rotatable around the treatment table 104 by the rotating gantry 105.

[0018] The accelerator 100 is a device that accelerates charged particles and emits a particle beam having a preset intensity. Examples of the accelerator 100 include a cyclotron, a synchrocyclotron, and the like. The particle beam generated by the accelerator 100 is transported to the irradiation unit 102 through the transport path 131. The accelerator 100 includes a detection unit 106 such as an ionization chamber that detects the particle beam. The detection unit 106 is a device that utilizes the bonding structure 1 described later.

[0019] The irradiation unit 102 irradiates a tumor in the body of the patient 115 with a particle beam. The particle beam is obtained by accelerating charged particles at high speed, and examples thereof include a proton beam, a heavy particle (heavy ion) beam, an electron beam, and the like. Specifically, the irradiation unit 102 is a device that irradiates a tumor with a particle beam emitted from an accelerator 100 that accelerates charged particles generated by an ion source (not shown) and transported through the transport path 131. The irradiation unit 102 irradiates the particle beam by a scanning method. The scanning method is not particularly limited, and line scanning, raster scanning, spot scanning, or the like may be employed. Further, the irradiation method of the irradiation unit 102 is not limited to the scanning method.

[0020] The irradiation unit 102 includes a scanning electromagnet 150, various monitors 151, etc. As the scanning electromagnet 150, an X-axis direction scanning electromagnet 150X and a Y-axis direction scanning electromagnet 150Y are used. The X-axis direction scanning electromagnet 150X scans the particle beam in the X-axis direction, and the Y-axis direction scanning electromagnet 150Y scans the particle beam in the Y-axis direction. The scanning electromagnet 150 scans the particle beam so that the particle beam B is irradiated in a scan pattern planned in advance by the treatment planning device.

[0021] The transport path 131 connects the accelerator 100 and the exit of the irradiation unit 102, and transports the particle beam emitted from the accelerator 100 to the irradiation unit 102. The transport path 131 has a beam adjustment unit 130 that adjusts the beam size, beam position, beam symmetry, and transmission efficiency of the particle beam. The beam adjustment unit 130 includes a plurality of electromagnets. The beam adjustment unit 130 has a quadrupole electromagnet for adjusting the beam size, a deflection electromagnet for adjusting the beam position, etc.

[0022] Note that the accelerator 100 using the joining structure 1 may be applied not only to the particle beam therapy device 101 but also to a neutron capture therapy device, an accelerator for research institutions, etc. Further, the joining structure 1 may be applied not only to accelerators but also to sensors on various flexible substrates.

[0023] Next, referring to FIG. 2, the joining structure 1 according to the present embodiment will be described. FIG. 2 is a developed view of the joining structure 1 according to the present embodiment. The joining structure 1 includes a flexible substrate 2 and a joining member 3.

[0024] The flexible substrate 2 comprises a base material 4, a first conductor pattern 6, and a second conductor pattern 7. The flexible substrate 2 is a flexible electronic circuit board that can be physically bent and folded without cracking. The base material 4 is a sheet member made of a flexible insulating material. Examples of materials for the base material 4 include polyimide, polyester, and PET. The first conductor pattern 6 is a pattern formed by a conductive material on one side of the flexible substrate 2. The second conductor pattern 7 is a pattern formed by a conductive material on the other side of the flexible substrate 2. The materials for the conductor patterns 6 and 7 are not particularly limited, but the effect of the bonding structure 1 becomes more pronounced when aluminum is used. Other materials such as copper and aluminum may be used for the conductor patterns 6 and 7. In this embodiment, the conductor patterns 6 and 7 may form a circuit pattern for detecting particle beams.

[0025] The joining member 3 is a member having a first conductor layer 11 that is joined to the first conductor pattern 6 and a second conductor layer 12 that is joined to the second conductor pattern 7. In this embodiment, the joining member 3 has a continuous sheet member 13. The joining member 3 also has a first conductor layer 11 and a second conductor layer 12 that are in communication with each other on the sheet member 13. The joining member 3 is joined to the flexible substrate 2 at the joining portion 15.

[0026] Specifically, the joining member 3 has a sheet member 13 and a conductor layer 14 formed on one side of the sheet member 13. The joining member 3 is made of a flexible substrate. Therefore, the sheet member 13 is made of a flexible material, similar to the base material 4. The joining member 3 sandwiches the flexible substrate 2 from both sides by folding a portion of it. At this time, the joining member 3 has a region E1 where the conductor layer 14 is joined to the first conductor pattern 6, a region E2 where the conductor layer 14 is joined to the second conductor pattern 7, and a third region E3 that is folded and connects regions E1 and E2. In this case, the conductor layer 14 in region E1 becomes the first conductor layer 11. The conductor layer 14 in region E2 becomes the second conductor layer 12. The conductor layer 14 in the third region E3 becomes a conductor that connects the first conductor layer 11 and the second conductor layer 12.

[0027] A connector 20 is connected to the end of the joining member 3 opposite to the joint 15. The pins 21 of the connector 20 pass through the joining member 3 and are connected to the conductor layer 14.

[0028] With the above configuration, the joining member 3 can read signals from the flexible substrate 2 by making the first conductor layer 11 and the second conductor layer 12 electrically connected at an out-of-plane position on the flexible substrate 2. An out-of-plane position on the flexible substrate 2 is a position that does not overlap with the flexible substrate 2 when the flexible substrate 2 is extended into a planar state and viewed from a direction perpendicular to the flexible substrate 2 (plan view). The region E3 of the joining member 3 does not overlap with the flexible substrate 2 in a plan view. An external device is connected to the connector 20. The external device reads signals from the flexible substrate 2 via the conductor layer 14 of the joining member 3 and the connector 20.

[0029] Next, the joint portion 15 of the joint structure 1 will be described. The joint structure 1 has a joint portion 15 in which the joint member 3 and the flexible substrate 2 are joined by a pressing force from a combination of a protruding member 30 and a grooved member 31. The grooved member 31 is a member in which a groove portion 33 is formed in a part of a flat plate member 32. In the example in Figure 3, the groove portion 33 penetrates the flat plate member 32. The protruding member 30 is a member in which a protruding portion 35 protrudes from a part of a flat plate member 34. The protruding portion 35 has a shape that fits into the grooved member 31.

[0030] During joining, the flexible substrate 2 and the joining member 3, which covers the flexible substrate 2 from both sides, are placed between the protruding member 30 and the grooved member 31 (as shown in Figure 3). The protruding portion 35 of the protruding member 30 is inserted into the grooved portion 33 of the grooved member 31 via the joining member 3 and the flexible substrate 2, and pressed. This forms the joint 15. Figure 3 is a plan view of the joining structure 1. Figure 3(a) is a plan view from the grooved member 31 side. Figure 3(b) is a plan view from the protruding member 30 side. As shown in Figure 3, the protruding member 30 and the grooved member 31 may be fixed together by fastening means 36 with bolts and nuts while maintaining the pressing force. The protruding member 30 and the grooved member 31 may be removed by releasing the fastening means 36, thereby releasing the joint between the flexible substrate 2 and the joining member 3.

[0031] Next, the operation and effects of the bonding structure 1, accelerator 100, and manufacturing method of the bonding structure 1 according to this embodiment will be described.

[0032] In this bonding structure 1, a first conductor pattern 6 is formed on one surface 2a of the flexible substrate 2, and a second conductor pattern 7 is formed on the other surface 2b. The bonding member 3 has a first conductor layer 11 that is bonded to the first conductor pattern 6, and a second conductor layer 12 that is bonded to the second conductor pattern 7. As a result, the bonding member 3 can read the signal from one surface 2a of the flexible substrate 2 using the first conductor layer 11, and read the signal from the other surface 2b of the flexible substrate 2 using the second conductor layer 12.

[0033] One method for summing and reading signals from both sides of the flexible substrate 2 is to form vias on the flexible substrate 2. However, if the conductor patterns 6 and 7 are copper plated, for example, the via method is acceptable, but it requires the creation of a mask, which increases the initial cost for small-scale production. Also, if the conductor patterns 6 and 7 are aluminum, it is difficult to form vias. Aluminum is a suitable material for radiation detection. In contrast, in the bonding structure according to this embodiment, the bonding member 3 can read the signal from the flexible substrate 2 by making the first conductor layer 11 and the second conductor layer 12 electrically connected at an out-of-plane position on the flexible substrate 2. In this way, the bonding member 3 can make simultaneous electrical contact with both sides of the flexible substrate 2 without forming vias on the flexible substrate 2. Therefore, regardless of the conditions, the signals from both sides of the flexible substrate can be summed and read. For example, the bonding structure 1 can summage and read signals from a sensor electrode that has sensitive regions on both sides.

[0034] The joining structure 1 may have a joint portion 15 in which the joining member 3 and the flexible substrate 2 are joined by a pressing force created by a combination of a protruding member 30 and a grooved member 31. For example, when joining using an anisotropic conductive paste, special equipment is required for pressing and heating. In contrast, joining using a pressing force created by a combination of a protruding member 30 and a grooved member 31 eliminates the need for special equipment. Furthermore, the joining member 3 can be removed from the flexible substrate 2 by releasing the pressing force. In addition, even when the conductive layers 11 and 12 of the joining member 3 and the conductive patterns 6 and 7 of the flexible substrate 2 are made of dissimilar metals, they can be joined together.

[0035] The bonding member 3 has a continuous sheet member 13, and may have a first conductive layer 11 and a second conductive layer 12 on the sheet member 13 that are electrically conductive to each other. In this case, a single bonding member 3 can provide electrical contact with both sides of the flexible substrate 2.

[0036] The accelerator 100 according to this embodiment includes a detection unit 106 that detects particle beams using the junction structure 1 described above. This allows the detection unit 106 used in the accelerator 100 to sum and read out the signals from both sides of the flexible substrate 2 when handling signals from multiple channels.

[0037] The manufacturing method for the bonded structure 1 according to this embodiment comprises a flexible substrate 2 having a first conductor pattern 6 formed on one surface 2a and a second conductor pattern 7 formed on the other surface 2b, and a bonding member 3 having a first conductor layer 11 to be bonded to the first conductor pattern 6 and a second conductor layer 12 to be bonded to the second conductor pattern 7, and is a manufacturing method for a bonded structure 1 that can read signals from the flexible substrate 2. By bringing the first conductor layer 11 into contact with the first conductor pattern 6 and the second conductor layer 12 into contact with the second conductor pattern 7, and by pressing the bonding member 3 and the flexible substrate 2, the first conductor layer 11 is bonded to the first conductor pattern 6 and the second conductor layer 12 is bonded to the second conductor pattern 7, and the first conductor layer 11 and the second conductor layer 12 are electrically connected at an out-of-plane position on the flexible substrate 2.

[0038] The bonding member 3 enables the reading of signals from the flexible substrate 2 by providing electrical conductivity between the first conductor layer 11 and the second conductor layer 12 at an out-of-plane position on the flexible substrate 2. In this way, the bonding member 3 can provide electrical conductivity to both sides of the flexible substrate 2 simultaneously without forming vias on the flexible substrate 2. Therefore, regardless of the conditions, the signals from both sides of the flexible substrate 2 can be summed and read. Furthermore, by employing bonding using pressing force, dedicated equipment can be eliminated. In addition, the bonding member 3 can be removed from the flexible substrate 2 by releasing the pressing force. Moreover, even when the conductor layers 11 and 12 of the bonding member 3 and the conductor patterns 6 and 7 of the flexible substrate 2 are made of dissimilar metals, they can still be bonded together.

[0039] The present invention is not limited to the embodiments described above.

[0040] For example, the arrangement and bonding of the bonding member 3 to the flexible substrate 2 is not limited to that shown in Figure 2. For instance, as shown in Figure 4, bonding may be performed with the bonding member 3 facing inverted.

[0041] In the above-described embodiment, a flexible substrate was used as the joining member 3, but it is not particularly limited. For example, a member using wires or springs as the conductive layers 11 and 12 may be used as the joining member 3.

[0042] In the above-described embodiment, the bonding member 3 had a single sheet member 13. Alternatively, a configuration in which the bonding member 3 has multiple members may be adopted. For example, the structure shown in Figure 5 may be adopted. As shown in Figure 5, the bonding member 3 may have a first base material 40 having a first conductor layer 11, and a second base material 41 which is a separate member of the first base material 40 and has a second conductor layer 12. As base materials 40 and 41, conductive layers may be formed by vapor deposition of metal onto a film substrate. In this case, compared to a structure in which a single bonding member 3 bonds both sides of the flexible substrate 2, the lamination process is easier because there is no bending process. The first conductor layer 11 of the first base material 40 and the second conductor layer 12 of the second base material 41 are joined by contacting each other at an out-of-plane position on the flexible substrate 2. Furthermore, since the conductive layers 11 and 12 are joined together by pressing force, the protruding member 30 may have two protrusions 35A and 35B, and the grooved member 31 may have two grooves 33A and 33B. The protrusion 35A and groove 33A are used to join the flexible substrate 2, the first base material 40, and the second base material 41. The protrusion 35B and groove 33B are used to join the first base material 40 and the second base material 41. In the structure shown in Figure 2, since there is only one protrusion 35 and one groove 33, the pressing structure can be made smaller compared to the structure in Figure 5.

[0043] In the above-described embodiment, the joining member 3 and the flexible substrate 2 were joined by the pressing force of the combination of the protruding member 30 and the grooved member 31. Alternatively, as shown in Figure 6, joining may be performed using an anisotropic conductive paste. As shown in Figure 6(a), instead of the protruding member 30 and grooved member 31 in Figure 2, the first conductor layer 11 may be joined to the first conductor pattern 6 via the anisotropic conductive paste 46, and the second conductor layer 12 may be joined to the second conductor pattern 7 via the anisotropic conductive paste 46. Also, as shown in Figure 6(b), instead of the protruding member 30 and grooved member 31 in Figure 5, the first conductor layer 11 may be joined to the first conductor pattern 6 via the anisotropic conductive paste 46, and the second conductor layer 12 may be joined to the second conductor pattern 7 via the anisotropic conductive paste 46, and the conductor layers 11 and 12 may be joined to each other via the anisotropic conductive paste 46. [Explanation of Symbols]

[0044] 1...Joint structure, 2...Flexible substrate, 3...Joint member, 6...First conductor pattern, 7...Second conductor pattern, 11...First conductor layer, 12...Second conductor layer, 15...Joint part, 30...Protruding member, 31...Groove member, 40...First base material, 41...Second base material, 100...Accelerator, 106...Detection unit.

Claims

1. A flexible substrate having a first conductor pattern formed on one side and a second conductor pattern formed on the other side, The device comprises a joining member having a first conductor layer joined to the first conductor pattern and a second conductor layer joined to the second conductor pattern, The bonding member has a bonding structure that allows the signals of the flexible substrate to be read by electrically connecting the first conductor layer and the second conductor layer at an out-of-plane position of the flexible substrate.

2. The joining structure according to claim 1, having a joint portion in which the joining member and the flexible substrate are joined by a pressing force formed by a combination of a protruding member and a grooved member.

3. The joining structure according to claim 1, wherein the joining member has a continuous sheet member, and on the sheet member, there is a first conductive layer and a second conductive layer that are electrically conductive to each other.

4. The joining structure according to claim 1, wherein the joining member comprises a first base material having the first conductor layer and a second base material having the second conductor layer and being a separate member of the first base material.

5. An accelerator comprising a detection unit for detecting particle beams using the junction structure described in any one of claims 1 to 4.

6. A flexible substrate having a first conductor pattern formed on one side and a second conductor pattern formed on the other side, A method for manufacturing a bonded structure that can read signals from a flexible substrate, comprising a bonding member having a first conductor layer bonded to the first conductor pattern and a second conductor layer bonded to the second conductor pattern, The first conductor layer is brought into contact with the first conductor pattern. The second conductor layer is brought into contact with the second conductor pattern. A method for manufacturing a bonded structure, comprising pressing the bonding member and the flexible substrate to bond the first conductor layer to the first conductor pattern, bonding the second conductor layer to the second conductor pattern, and making the first conductor layer and the second conductor layer electrically connected at an out-of-plane position of the flexible substrate.

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