Crystal oscillator chip

Abstract

To provide a quartz oscillator chip that can improve vibration characteristics. [Solution] The quartz crystal oscillator chip includes a housing and a quartz crystal oscillator. The quartz crystal oscillator is installed inside the housing. The quartz crystal oscillator includes a planar substrate, two electrodes, and two conductive silver pastes, the two electrodes being installed on two opposing main surfaces of the planar substrate. The planar substrate has at least one recess, which is located on the side of the planar substrate, perpendicular to the side, and recessed in a direction toward the interior of the planar substrate. The height of the recess is the same as the thickness of the planar substrate, and the two conductive silver pastes connect the planar substrate to the housing.

Description

Technical Field

[0001] The present invention relates to a crystal vibration chip.

Background Art

[0002] Due to physical limitations, the frequency in the vicinity of the main wave (e.g., thickness shear vibration mode) of the current crystal vibration chip including a crystal vibration piece often has secondary waves such as bending vibration and surface shear vibration. Secondary waves with frequencies too close are likely to combine with the main wave and deteriorate the vibration characteristics of the chip, becoming unwanted modes. The current chips are pursuing higher frequencies and smaller sizes. To avoid the above problems, the error range of the chip's dimensional design has become smaller, resulting in a decrease in the production yield of the chips, which is disadvantageous for the development of the chips.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present invention provides a crystal vibration chip capable of improving vibration characteristics.

Means for Solving the Problems

[0004] The crystal vibration chip of the present invention includes a housing and a crystal vibration piece. The crystal vibration piece is installed inside the housing. The crystal vibration piece includes a planar substrate, two electrodes, and two conductive silver pastes. The two electrodes are installed on two opposite main surfaces of the planar substrate respectively. The planar substrate has at least one recess, the recess is provided on the side surface of the planar substrate, is perpendicular to the side surface, and is recessed along the direction towards the inside of the planar substrate. The height of the recess is the same as the thickness of the planar substrate, and the two conductive silver pastes connect the planar substrate and the housing.

Effects of the Invention

[0005] As described above, the quartz crystal oscillator of the quartz crystal oscillator chip of the present invention includes a planar substrate, electrodes mounted on the planar substrate, and a recess created from the side surface of the planar substrate. The quartz crystal oscillator improves the vibration characteristics of the quartz crystal oscillator chip through the recess, thereby improving the production yield of the quartz crystal oscillator chip and providing advantages in development. [Brief explanation of the drawing]

[0006] [Figure 1A] This is an exploded view of a quartz crystal oscillator chip according to one embodiment of the present invention. [Figure 1B] This is a schematic diagram of the quartz crystal oscillator shown in Figure 1A, viewed from a different angle. [Figure 2] Figure 1A is a top view of the quartz crystal vibrator. [Figure 3] This is a top view of a quartz crystal vibrator according to another embodiment of the present invention. [Figure 4] This is a top view of a quartz crystal vibrator according to another embodiment of the present invention. [Figure 5] This is a top view of a quartz crystal vibrator according to another embodiment of the present invention. [Figure 6A] This is a top view of a quartz crystal vibrator according to another embodiment of the present invention. [Figure 6B] This is a top view of a quartz crystal vibrator according to another embodiment of the present invention. [Figure 6C] This is a top view of a quartz crystal vibrator according to another embodiment of the present invention. [Figure 7] This is a top view of a quartz crystal vibrator according to another embodiment of the present invention. [Figure 8] This is a top view of a quartz crystal vibrator according to another embodiment of the present invention. [Modes for carrying out the invention]

[0007] Figure 1A is an exploded view of a quartz crystal oscillator chip according to one embodiment of the present invention. Figure 1B is a schematic view of the quartz crystal oscillator of Figure 1A from a different angle. Figure 2 is a top view of the quartz crystal oscillator of Figure 1A. Referring to Figures 1A to 2 together, the quartz crystal oscillator chip 100 includes a housing 110 and a quartz crystal oscillator 120. The quartz crystal oscillator 120 is housed within the housing 110 and includes a planar substrate 121, two electrodes 122 and 126, and two conductive silver pastes 130. The two electrodes 122 and 126 are located on two opposing main surfaces of the planar substrate 121, namely the upper surface 127 and the lower surface 128, respectively. The planar substrate 121 has at least one recess 124. The recess 124 is located on a side surface 123 of the planar substrate 121, is perpendicular to the side surface 123, and is recessed in a direction toward the interior of the planar substrate 121. The height B1 along the recess 124 is the same as the thickness B2 of the flat substrate 121. Two conductive silver pastes 130 connect the flat substrate 121 and the housing 110.

[0008] The recess 124 can be formed by an etching process, but the present invention is not limited thereto. By installing the recess 124 on the side surface 123 of the planar substrate 121, the sub-waves (e.g., bending vibration, surface shear vibration) of the quartz oscillator chip 100 can be effectively suppressed without affecting the main wave (e.g., shear vibration mode in the thickness direction) of the quartz oscillator chip 100. As a result, the quartz oscillator chip 100 can tolerate larger manufacturing tolerances, thereby improving the production yield of the quartz oscillator chip 100 and enabling more efficient development.

[0009] As shown in Figure 1A, the housing 110 includes a first housing 111 and a second housing 112, the first housing 111 being connected to the second housing 112 to form a housing space P, and the quartz crystal oscillator 120 is located within the housing space P. The quartz crystal oscillator chip 100 in this embodiment is rectangular, but the present invention is not limited thereto.

[0010] As shown in Figures 1B and 2, the side surface 123 of the planar substrate 121 includes two first side surfaces 1231 and two second side surfaces 1232 that are connected between and to each other, and between the two main surfaces (upper surface 127 and lower surface 128). The planar substrate 121 in this embodiment is rectangular, but the present invention is not limited thereto. The first side surface 1231 is located between the two second side surfaces 1232. The length W1 of the first side surface 1231 is longer than the length W5 of the second side surfaces 1232. The long side S1 of the first side surface 1231 and the short side S2 of the second side surfaces 1232.

[0011] The shapes of the two electrodes 122 and 126 may be different, but the present invention is not limited thereto. Electrode 122 is the first electrode, and electrode 126 is the second electrode. Electrode 122 includes a side 125, which corresponds to a side 123 of the planar substrate 121. The side 125 includes two first side 1251 and two second side 1252, with the two first side 1251 connected between the two second side 1252. The first side 1251 corresponds to the first side 1231 (long side S1), and the second side 1252 corresponds to the second side 1232 (short side S2). The length W2 of the first side 1251 of electrode 122 is longer than the length W4 of the second side 1252. Electrode 122 is rectangular, but the present invention is not limited thereto. Each side of the rectangular electrode 122 (first side 1251 and second side 1252) is a fixed distance from the corresponding side surface 123 of the planar substrate 121 (first side surface 1231 and second side surface 1232). The length W3 of the recess 124 is shorter than the lengths W2 and W4 of each side of the rectangular electrode 122.

[0012] The planar substrate 121 further includes a chip center C1 and a central axis. The chip center C1 is the geometric center of the planar substrate 121. The central axis passes through the chip center C1 and is perpendicular to the side surface 123 of the planar substrate 121. The central axis includes a first central axis L1 and a second central axis L2. The first central axis L1 is distinct from the second central axis L2. Specifically, the first central axis L1 is perpendicular to the second central axis L2 and intersects with the second central axis L2 at the chip center C1. The first central axis L1 is perpendicular to the two first side surfaces 1231, and the second central axis L2 is perpendicular to the two second side surfaces 1232. In this embodiment, there is a distance G between the chip center C1 of the planar substrate 121 and the geometric center C2 of the electrode 122. That is, the electrode 122 is offset on the planar substrate 121. The geometric center C2 of electrode 122 lies on the second central axis L2, but the present invention is not limited thereto.

[0013] As shown in Figures 1A and 2, the number of recesses 124 in this embodiment is one, but the present invention is not limited thereto. The recess 124 is recessed from the first side surface 1231 of the planar substrate 121 toward the electrode 122, corresponding to the first side surface 1251 of the electrode 122 and the long side S1 (first side surface 1231) of the planar substrate 121. The ratio of the depth H1 of the recess 124 toward the electrode 122 to the length of the corresponding side surface 123 (here, the length W1 of the first side surface 1231) is less than or equal to 0.4. The length W3 of the recess 124 is shorter than or equal to the length of the corresponding side surface 125 (here, the length W2 of the first side surface 1251). There is a distance D1 between the bottom surface 1241 of the recess 124 and the corresponding side surface 125 (first side surface 1251) of the electrode 122. The orthographic projection of the recess 124 onto the electrode 122 lies on the corresponding side 125 (first side 1251), but the present invention is not limited thereto. The recess 124 penetrates the planar substrate 121 in the thickness direction A. The thickness direction A is perpendicular to the extension direction of the central axes (first central axis L1 and second central axis L2).

[0014] Figure 3 is a top view of a quartz crystal diaphragm according to another embodiment of the present invention. Referring to Figures 2 and 3 together, the quartz crystal diaphragm 120a of this embodiment is similar to that of the embodiment described above, the difference being that the recess of the quartz crystal diaphragm 120a of this embodiment includes a pair of first recesses 124a, 124a'. This pair of first recesses 124a, 124a' are symmetrically positioned on two opposing sides 123 (second side 1232) of the planar substrate 121, with the first central axis L1 of the planar substrate 121 as the axis of symmetry, and correspond to the short side S2 of the planar substrate 121. The orthographic projection of the first recesses 124a, 124a' onto the electrode 122 is partially located on the corresponding second side 1252 (side 125). The distance D2 between the first recess 124a and the corresponding second side 1252 is less than or equal to the distance D3 between the first recess 124a' and the corresponding second side 1252. The installation position of the conductive silver paste 130 corresponds to the first recess 124a', but the present invention is not limited thereto. The quartz crystal vibrator 120a in this embodiment has similar effects to those of the embodiments described above, and therefore will not be described again here.

[0015] Figure 4 is a top view of a quartz crystal oscillator according to another embodiment of the present invention. Referring to Figures 3 and 4 together, the quartz crystal oscillator 120b of this embodiment is similar to that of the embodiment described above, the difference being that the quartz crystal oscillator 120b of this embodiment further includes a pair of second recesses 124b and 124b'. These two second recesses 124b and 124b' are positioned corresponding to two sides 123 (second side 1232) of the planar substrate 121. The second recesses 124b and 124b' and the first recesses 124a and 124a' are positioned symmetrically on both sides of the central axis (second central axis L2). Here, the first recesses 124a, 124a' and the second recesses 124b, 124b' are symmetrically positioned on two second sides 1232 of the planar substrate 121, with the first central axis L1 and the second central axis L2 as axes of symmetry, respectively, and can be considered to correspond to the two second sides 1252 of the electrode 122. One conductive silver paste 130 corresponds to the first recess 124a', and the other conductive silver paste 130 corresponds to the second recess 124b', but the present invention is not limited thereto. The quartz crystal oscillator 120b in this embodiment has similar effects to those of the embodiments described above and will not be described again here.

[0016] Figure 5 is a top view of a quartz crystal oscillator according to another embodiment of the present invention. Referring to Figures 3 and 5 together, the quartz crystal oscillator 120c of this embodiment is similar to that of the embodiment described above, the difference being that the two recesses 124 of the quartz crystal oscillator 120c of this embodiment are symmetrically positioned on the side surface 123 (second side surface 1232) of the planar substrate 121, with the second central axis L2 of the planar substrate 121 as the axis of symmetry. The two conductive silver pastes 130 correspond to the two recesses 124, but the present invention is not limited thereto. The quartz crystal oscillator 120c of this embodiment has similar effects to that of the embodiment described above, and therefore will not be described again here.

[0017] FIG. 6A is a top view of a crystal resonator according to another embodiment of the present invention. Referring to FIGS. 3 and 6A simultaneously, the crystal resonator 120d of this embodiment is similar to the above-described embodiment, and the difference between the two is that a pair of first recesses 124d of the crystal resonator 120d of this embodiment are symmetrically installed on both side surfaces 123 (first side surface 1231) of the planar substrate 121 with the second central axis L2 of the planar substrate 121 as the axis of symmetry, corresponding to the two first side edges 1251 of the electrode 122. Since the crystal resonator 120d of this embodiment has an effect similar to that of the above-described embodiment, it will not be repeatedly described here.

[0018] In one embodiment not shown, the crystal resonator 120d can include a pair of second recesses, and the second recesses are symmetrically installed on two first side surfaces 1231 of the planar substrate 121 with the second central axis L2 as the axis of symmetry and can be located near the first recess 124d.

[0019] FIG. 6B is a top view of a crystal resonator according to another embodiment of the present invention. Referring to FIGS. 3 and 6B simultaneously, the crystal resonator 120d' of this embodiment is similar to the above-described embodiment, and the difference between the two is that the recess 124 of the crystal resonator 120d' of this embodiment is symmetrically installed on the side surface 123 (first side surface 1231) of the planar substrate 121 with the first central axis L1 as the axis of symmetry. The orthographic projections of the two recesses 124 on the electrode 122 are located on the corresponding side edges 125 (first side edge 1251). Since the crystal resonator 120d' of this embodiment has an effect similar to that of the above-described embodiment, it will not be repeatedly described here.

[0020] Figure 6C is a top view of a quartz crystal oscillator according to another embodiment of the present invention. Referring to Figures 3 and 6C together, the quartz crystal oscillator 120d" of this embodiment is similar to that of the embodiment described above, the difference being that the quartz crystal oscillator 120d" of this embodiment includes six recesses 124. The six recesses 124 are symmetrically arranged on three sides 123 of the planar substrate 121 (two first sides 1231 and one second side 1232) with the first central axis L1 and second central axis L2 of the planar substrate 121 as axes of symmetry. The quartz crystal oscillator 120d" of this embodiment has similar effects to that of the embodiment described above and will not be described again here.

[0021] When producing conventional quartz crystal oscillators without recesses, the tolerance value of the first side surface of the planar substrate is ±2 micrometers, and the tolerance value of the second side surface is ±2 micrometers. For every 16 conventional quartz crystal oscillator chips produced, only 6 of them can effectively eliminate sub-waves and achieve an equivalent series resistance (ESR) of less than 30 Ω. In this embodiment, by providing the recess 124, when producing the quartz crystal oscillator 120d”, the tolerance value of the first side surface 1231 of the planar substrate 121 can be reduced to ±4 micrometers, and the tolerance value of the second side surface 1232 can be reduced to ±4 micrometers. Quartz crystal oscillator chips having the quartz crystal oscillator 120d” can effectively eliminate all sub-waves and achieve an equivalent series resistance of less than 30 Ω.

[0022] Figure 7 is a top view of a quartz crystal oscillator according to another embodiment of the present invention. Referring to Figures 3 and 7 together, the quartz crystal oscillator 120e of this embodiment is similar to that of the embodiment described above, the difference being that the quartz crystal oscillator 120e of this embodiment includes eight recesses 124. The eight recesses 124 are symmetrically placed on four sides 123 (two first sides 1231 and two second sides 1232) of the planar substrate 121, with the first central axis L1 and second central axis L2 of the planar substrate 121 as axes of symmetry. The electrode 122e is polygonal. The electrode 122e extends to the first side 1231 and second side 1232 of the planar substrate 121. The recesses 124 and the conductive silver paste 130 are offset in position. The quartz crystal oscillator 120e of this embodiment has similar effects to that of the embodiment described above, and therefore will not be described again here.

[0023] Figure 8 is a top view of a quartz crystal diaphragm according to another embodiment of the present invention. Referring to Figures 6C and 8 together, the quartz crystal diaphragm 120f of this embodiment is similar to that of the embodiment described above, the difference being that the recesses 124f and 124f' of the quartz crystal diaphragm 120f of this embodiment include rounded corners R1 and R2. The rounded corners R1 and R2 are placed at the corners of the recesses 124f and 124f', effectively reducing stress concentration at the corners and improving the structural strength of the quartz crystal diaphragm 120f.

[0024] Taking recess 124f as an example, recess 124f includes two opposing sides 1242 and a base 1241, with both ends of the base 1241 (i.e., the corners of recess 124f) connecting to the two sides 1242. The two sides 1242 and the base 1241 of recess 124f are connected by a rounded corner R1, and the recess includes two rounded corners R1. In one embodiment not shown, the sides 1242 and the base 1241 are connected by a rounded corner R1, and the recess may include only one rounded corner R1.

[0025] The four recesses 124f located on the first side surface 1231 are symmetrically positioned with respect to the first central axis L1 and the second central axis L2. The two recesses 124f' located on the second side surface 1232 are symmetrically positioned with respect to the second central axis L2. The R values ​​of the rounded corners R1 and R2 of the recesses 124f and 124f', which have different central axes as axes of symmetry, may be different, and the depths H2 and H3 of the recesses 124f and 124f' may also be different. Specifically, the R value of the rounded corner R1 of the recess 124f is greater than the R value of the rounded corner R2 of the recess 124f', and the depth H2 of the recess 124f is greater than the depth H3 of the recess 124f'. The quartz crystal oscillator 120f of this embodiment has similar effects to the embodiment described above, so it will not be described again here.

[0026] The number and method of installation of the recesses 124 in the quartz crystal oscillators 120, 120a, 120b, 120c, 120d, 120d', 120d'', and 120f can be changed depending on the structure and application of the quartz crystal oscillator and are not limited to the embodiments described above.

[0027] As described above, the quartz crystal vibrator of the quartz crystal vibrator chip of the present invention includes a planar substrate, electrodes mounted on the planar substrate, and a recess created from the side surface of the planar substrate. By improving the vibration characteristics of the quartz crystal vibrator through the recess, the production yield of the quartz crystal vibrator can be improved, which is advantageous for development. [Industrial applicability]

[0028] The quartz crystal vibrator of the present invention can improve vibration characteristics. [Explanation of Symbols]

[0029] A: Thickness direction B1 Height B2 thickness C1 chip center C2 geometric center D1, D2, D3 distance G interval H1, H2, H3 depth L1 1st center axis L2 2nd center axis P Storage space R1, R2 round corner S1 Long side S2 Short side W1, W2, W3, W4, W5 Length 100 crystal oscillator chips 110 cabinets 111 First cabinet 112 Second cabinet 120, 120a, 120b, 120c, 120d, 120d', 120d'', 120f crystal piece 121 Planar board 122, 126, 122e electrode 123 Side view 1231 1st side 1232 Second side 124, 124f, 124f' recess 124a, 124a', 124d First recess 124b, 124b' Second recess 1241 Bottom 1242, 125 side 1251 1st side 1252 Second side 127 Upper surface 128 Lower surface 130 Conductive Silver Paste

Claims

1. The casing and Installed within the housing, the device comprises a planar substrate, two electrodes, and two conductive silver pastes, wherein the two electrodes are each placed on two opposing main surfaces of the planar substrate, the planar substrate has at least one recess, the at least one recess is provided on the side surface of the planar substrate and is recessed perpendicular to the side surface and in a direction toward the interior of the planar substrate, the height of the at least one recess is the same as the thickness of the planar substrate, and the two conductive silver pastes connect the planar substrate and the housing, A crystal oscillator chip that includes this chip.

2. The quartz crystal oscillator chip according to claim 1, wherein the ratio of the depth of the at least one recess to the length of the side surface is less than or equal to 0.

4.

3. The quartz crystal oscillating chip according to claim 1, wherein the at least one recess includes a pair of first recesses, and the pair of first recesses are provided corresponding to two opposing sides of the planar substrate.

4. The quartz crystal oscillating chip according to claim 3, wherein the at least one recess further includes a pair of second recesses, which are positioned corresponding to the two sides of the planar substrate, and the pair of second recesses and the pair of first recesses are positioned symmetrically on both sides of a center line that passes through the chip center of the quartz crystal oscillating piece and is perpendicular to the two sides.

5. The crystal oscillator chip according to claim 1, wherein the side surface includes two first side surfaces and two second side surfaces connected to each other, each of the two first side surfaces is located between the two second side surfaces, and the at least one recess includes a plurality of recesses, the plurality of recesses are symmetrically arranged on at least one of the two first side surfaces or the two second side surfaces with respect to a first central axis of the planar substrate as the axis of symmetry.

6. The crystal oscillator chip according to claim 1, wherein the side surface includes two first side surfaces and two second side surfaces connected to each other, each of the two first side surfaces is located between the two second side surfaces, and the at least one recess includes a plurality of recesses, the plurality of recesses are symmetrically arranged on at least one of the two second side surfaces or the two second side surfaces with respect to the second central axis of the planar substrate as the axis of symmetry.

7. The crystal oscillator chip according to claim 1, wherein there is a distance between the chip center of the planar substrate and the geometric center of the electrode.

8. The crystal oscillator chip according to claim 1, wherein the at least one recess includes two opposing sides and a base whose ends are connected to the two sides, respectively.

9. The crystal oscillator chip according to claim 8, wherein at least one of the two sides and the bottom are connected to each other at a rounded corner.

10. The crystal oscillator chip according to claim 1, wherein the electrode is rectangular, and each side of the rectangle is separated from each corresponding side surface of the planar substrate at a certain distance.

11. The crystal oscillator chip according to claim 10, wherein the length of at least one recess is shorter than the length of the sides of the rectangle.

12. The crystal oscillator chip according to claim 1, wherein the electrode includes a side edge, the side edge corresponds to the side surface of the planar substrate, and the orthogonal projection of the at least one recess onto the electrode is at least partially located on the side edge.

13. The quartz crystal oscillating chip according to claim 1, wherein the housing includes a first housing and a second housing, the first housing is connected to the second housing to form a storage space, and the quartz crystal oscillating chip is located within the storage space.

14. The quartz crystal oscillating chip according to claim 1, wherein the at least one recess penetrates the planar substrate in the thickness direction.

15. The crystal oscillator chip according to claim 1, wherein the first central axis and the second central axis of the planar substrate intersect at the chip center of the planar substrate, and the thickness direction is perpendicular to the extension direction of the first central axis and also perpendicular to the extension direction of the second central axis.

16. The crystal oscillator chip according to claim 1, wherein the at least one recess corresponds to at least one long side of the planar substrate.

17. The crystal oscillator chip according to claim 1, wherein the at least one recess corresponds to at least one short side of the planar substrate.

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