Masking device for packaging trays

Abstract

The present invention relates to a masking device for packaging trays, and more specifically, to a masking device for packaging trays that enables laser processing of chips without thermal damage to the packaging tray by installing the masking device on the packaging tray while the chips mounted on the packaging tray are vertically raised by a heating block. [Solution] The present invention may include a mask portion that is installed in a grid pattern on the upper side of a packaging tray in which mounting portions on which chips are mounted are formed in a number of rows and columns, and which protects the packaging tray from a heat source.

Description

Technical Field

[0001] The present invention relates to a masking device for a packaging tray. More specifically, the present invention relates to a masking device for a packaging tray that enables laser processing of a chip without thermal damage to the packaging tray by installing the masking device on the packaging tray while the chip mounted on the packaging tray is vertically lifted by a heating block.

Background Art

[0002] A packaging tray means a tray that meets standardized specifications for storing and transporting a large number of semiconductor packages. Generally, a packaging tray can be used for loading semiconductor packages onto a process tray for loading into a pretreatment process, unloading semiconductor packages on a processed process tray, or accommodating semiconductor packages for performing inspection processes such as a vision test. In addition, in order to process a semiconductor package on which a shielding film has been formed by sputtering deposition, a post-treatment process is also required in which the semiconductor package on which the shielding film has been formed is separated from the process tray, and the separated semiconductor package is unloaded from the process tray onto the packaging tray. By the above-described post-treatment process, the semiconductor package on the process tray on which the shielding film has been formed is separated from the process tray by vacuum suction using a picker for pick and place, and the separated semiconductor package must be individually unloaded from the process tray onto the packaging tray using a picker. As described above, loading semiconductor packages for forming a shielding film and unloading semiconductor packages with the shielding film formed are performed individually for each semiconductor package in the process tray or packaging tray. Therefore, loading a large number of semiconductor packages that would normally fit in one packaging tray into a process tray, or unloading a large number of semiconductor packages from a process tray into a packaging tray, takes a lot of time, which reduces productivity. In particular, the smaller the size of the semiconductor package, the greater the number of semiconductor packages that can be accommodated in the packaging tray and process tray. This increases the time required to load the semiconductor packages into the process tray or unload them into the packaging tray before or after the sputtering deposition process, resulting in a greater decrease in productivity. Furthermore, because there is a risk of damaging the semiconductor package during the loading and unloading process between the packaging tray and the process tray, there is a need for a method that allows processes such as laser processing to be performed with the semiconductor package still contained in the packaging tray, without unloading the semiconductor package from the packaging tray to a separate process tray. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Korean Registered Patent No. 10-0874610 (December 11, 2008) [Overview of the project] [Problems that the invention aims to solve]

[0004] The present invention was made to solve the problems of the prior art, and its objective is to provide a masking device for a packaging tray that enables laser processing of chips without thermal damage to the packaging tray by installing a masking device on the packaging tray while the chips mounted on the packaging tray are vertically raised by a heating block. [Means for solving the problem]

[0005] According to one aspect of the present invention for achieving the above objectives, a masking device for a packaging tray is provided, which includes a mask portion that is installed in a grid pattern on the upper side of a packaging tray in which mounting portions on which chips are mounted are formed in a number of rows and columns, and which protects the packaging tray from a heat source, wherein the mask portion includes a first mask installed laterally on the upper side of the packaging tray and a second mask installed vertically on the upper side of the packaging tray so as to intersect with the first mask, and the second mask is installed so as to penetrate or overlap the first mask.

[0006] Furthermore, the first mask may be bar-shaped and installed between the vertical members of the heating block that enter the mounting section of the packaging tray.

[0007] Furthermore, the first mask may have protruding parts.

[0008] Furthermore, the second mask may consist of a number of bars, and one end of each bar may be integrally formed by a connecting portion.

[0009] According to another aspect of the present invention, a masking device for a packaging tray is provided, which includes a mask portion that is installed in a grid pattern on the upper side of a packaging tray in which mounting portions on which chips are mounted are formed in a number of rows and columns, and which protects the packaging tray from a heat source, wherein the mask portion consists of a third mask and a fourth mask stacked vertically, and the third mask and the fourth mask are formed in a grid pattern in a number of rows and columns with through holes having a shape and size that allows chips mounted on at least the vertical members of the heating block to pass through.

[0010] Alternatively, the third and fourth masks may be moved parallel to each other in opposite directions so that one side of the through-hole in the direction of movement is covered by the other mask, thereby covering the packaging tray that was exposed around the chip mounted on the vertical member. [Effects of the Invention]

[0011] According to the present invention, a masking device is installed on the packaging tray while the chip mounted on the packaging tray is vertically raised by a heating block, thereby enabling laser processing of the chip without thermal damage to the packaging tray, which is an excellent effect. [Brief explanation of the drawing]

[0012] [Figure 1] This is a perspective view showing the masking device for packaging trays according to the present invention installed on a packaging tray. [Figure 2] This is a perspective view showing the masking device for packaging trays according to the present invention in a separated state. [Figure 3] This figure shows the first mask of a masking device for packaging trays according to the present invention. [Figure 4] This figure shows the second mask of the masking device for packaging trays according to the present invention. [Figure 5] This is a cross-sectional view along line A-A' in Figure 1. [Figure 6] This is a magnified section of Figure 5. [Figure 7] It is a plan view showing the state where the masking device for a packaging tray according to the present invention is installed. [Figure 8] It is a figure showing the process of installing the masking device for a packaging tray according to the present invention and performing a laser process. [Figure 9] It is a figure showing the process of installing the masking device for a packaging tray according to the present invention and performing a laser process. <00OO080>It is a figure showing the process of installing the masking device for a packaging tray according to the present invention and performing a laser process. [Figure 11] It is a figure showing the process of installing the masking device for a packaging tray according to the present invention and performing a laser process. [Figure 12] It is a figure showing the process of installing the masking device for a packaging tray according to the present invention and performing a laser process. <00OO086>It is a figure showing another embodiment of the masking device for a packaging tray according to the present invention. [Figure 14] It is a figure showing the installation state of the mask part in FIG. 13.

Mode for Carrying Out the Invention

[0013] The embodiments of the present disclosure are exemplified for the purpose of explaining the technical idea of the present disclosure. The scope of rights according to the present disclosure is not limited to the embodiments presented below or the specific descriptions of these embodiments. All technical terms and scientific terms used in the present disclosure have meanings generally understood by those having ordinary knowledge in the technical field to which the present disclosure belongs, unless otherwise defined. All terms used in the present disclosure are selected for the purpose of further clarifying the present disclosure and are not selected for the purpose of limiting the scope of rights according to the present disclosure. As used in the present disclosure, expressions such as "comprising," "including," and "having" should be understood as open-ended terms that encompass the possibility of including other embodiments, unless otherwise specified in the phrase or sentence in which the expression is included. The singular expressions described in the present disclosure can include the plural meanings, unless otherwise specified, and this also applies to the singular expressions described in the claims.

[0014] Hereinafter, with reference to the accompanying drawings, preferred embodiments of the masking device for a packaging tray according to the present invention will be described in detail.

[0015] FIG. 1 is a perspective view showing a state in which a masking device for a packaging tray according to the present invention is installed on a packaging tray, FIG. 2 is a perspective view showing a separated state of the masking device for a packaging tray according to the present invention, FIG. 3 is a view showing a first mask of the masking device for a packaging tray according to the present invention, FIG. 4 is a view showing a second mask of the masking device for a packaging tray according to the present invention, FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 1, FIG. 6 is a partially enlarged view of FIG. 5, FIG. 7 is a plan view showing a state in which the masking device for a packaging tray according to the present invention is installed, FIGS. 8 to 12 are views showing a process of installing the masking device for a packaging tray according to the present invention and performing a laser process, FIG. 13 is a view showing another embodiment of the masking device for a packaging tray according to the present invention, and FIG. 14 is a view showing an installation state of a mask portion of FIG. 13.

[0016] The present invention relates to a masking device 50 for a packaging tray that enables laser processing of a chip without thermal damage to the packaging tray by installing the masking device on the packaging tray in a state where the chip mounted on the packaging tray is vertically lifted by a heating block. As shown in FIGS. 1 to 7, the configuration is installed in a grid pattern on the upper side of a packaging tray 10 in which a mounting portion 12 on which a chip 20 is mounted is formed in a plurality of rows and columns, and can include a mask portion 100 that protects the packaging tray 10 from a heat source.

[0017] The chips 20 mounted on the mounting section 12 of the packaging tray 10 are mounted on the upper part of the heating block 30 when the vertical member 32 of the heating block 30 moves upward from below through the mounting section 12.

[0018] Here, the chip 20 is formed to be larger than the upper area of ​​the vertical member 32 and is mounted in a state that protrudes outward from the upper periphery of the vertical member 32.

[0019] In this configuration, the mask portion 100 is installed in the space between the packaging tray 10 and the chip 20, preventing the packaging tray 10 from being exposed on a flat surface, thereby protecting the packaging tray 10 from heat sources during laser processing of the chip 20.

[0020] More specifically, the mask portion 100 may include a first mask 110 installed horizontally on the packaging tray 10, and a second mask 120 installed vertically on the packaging tray 10 so as to intersect with the first mask 110. At this time, the first mask 110 has a bar shape and is installed between the vertical members 32 of the heating block 30 that have entered the mounting section 12 of the packaging tray 10, with protrusions 112 protruding from both sides in the width direction.

[0021] The protrusion 112 is provided to project toward the vertical member 32 when the first mask 110 is placed on the packaging tray 10, and is located below the chip 20 mounted on the adjacent vertical member 32.

[0022] On the other hand, the second mask 120 consists of a number of bars, and one end of each bar can be integrally formed by a connecting portion 122.

[0023] The second mask 120 is formed such that the width of the bar portion is greater than the spacing between the chips 20 mounted on the vertical member 32, and is installed so as to penetrate the first mask 110 and intersect with each other. In other words, the bar portion of the second mask 120 can be inserted through the through hole 114 formed in the width direction of the first mask 110, allowing the first mask 110 and the second mask 120 to intersect.

[0024] In this case, the second mask 120 supports the first mask 110 while entering the through hole 114 of the first mask 110. It is preferable that the second mask 120 is made of a material having a certain level of rigidity or higher so that it can stably support the first mask 110.

[0025] With the configuration described above, the first mask 110 and the second mask 120 are connected in a grid pattern, and the bar portion of the second mask 120 and the protruding portion 112 of the first mask 110 are located close to the bottom surface of the chip 20. As shown in Figure 7, the packaging tray 10 is not exposed while the chip is placed on a plane. This effectively blocks the laser beam L irradiated toward the top surface of the chip 20 during laser processing of the chip 20 from reaching the packaging tray 10, thereby preventing thermal damage to the packaging tray by the laser.

[0026] The series of processes described above will be explained with reference to Figures 8 to 12.

[0027] First, as shown in Figure 8, the packaging tray 10 with the chip 20 mounted on the mounting section 12 is mounted on the heating block 30. At this time, as shown in Figure 9, the vertical member 32 of the heating block 30 enters through the mounting section 12, causing the chip 20 to rise vertically and separate it from the package tray 10.

[0028] Next, as shown in Figure 10, the first mask 110 is installed so that it is positioned between the vertical members 32 of the heating block 30. At this time, the protrusion 112 of the first mask 110 is located below the tip 20. Next, as shown in Figure 11, the second mask 120 is installed so as to form a grid through the through-holes 114 of the first mask 110, and the installation of the mask portion 100 of the present invention is completed.

[0029] Next, Figure 12(a) is a cross-sectional view along line B-B' in Figure 7, and Figure 12(b) is a cross-sectional view along line C-C' in Figure 7. As shown in Figure 12(a), the protrusion 112 of the first mask 110 blocks the laser beam L irradiated toward the upper surface of the chip 20 during laser processing of the chip 20 from reaching the packaging tray 10, and as shown in Figure 12(b), the second mask 120 blocks the laser beam L from reaching the packaging tray 10, thereby preventing thermal damage to the packaging tray 10 by the laser (heat source).

[0030] On the other hand, the protruding portion 112 of the first mask 110 has inclined surfaces 116 formed at both ends where the through hole 114 is formed, which are inclined downward toward the outside in the width direction of the first mask 110. Therefore, when the second mask 120 enters the through hole 114 of the first mask 110, it is guided along the inclined surface 116 so that it can be easily coupled to the first mask 110. On the other hand, the second mask 120 can be coupled to or uncoupled from the first mask 110 by the moving means 130.

[0031] In this case, the moving means 130 includes a connecting body 132 on which the connecting portion 122 of the second mask 120 is installed, and a linear guide 134 which is connected to the connecting body 132 and moves the connecting body 132 back and forth.

[0032] Therefore, in response to the operation of the linear guide 134, the connecting body 132 and the second mask 120 connected thereto move forward and backward to connect to or disconnect from the first mask 110.

[0033] Here, a movement prevention guide 136 may be provided to guide the connecting body 132 so that it does not move when the connecting body 132 and the second mask 120 connected thereto move.

[0034] On the other hand, although not shown in the diagram, the bar portion of the second mask 120 can be positioned so that it intersects with the first mask 110 by having it enter below the first mask 110 and support it while overlapping with it.

[0035] In this case, the first mask 110 can be configured such that a groove (not shown) corresponding to the width of the bar portion of the second mask 120 is recessed on the upper side of the bottom surface, thereby preventing movement between the two when they are installed in cross-section.

[0036] On the other hand, according to another embodiment of the present invention, as shown in Figure 13, the mask portion 200 consists of a third mask 210 and a fourth mask 220 stacked vertically, and the third mask 210 and the fourth mask 220 are formed such that through holes 212 and 222 having a shape and size 2 through which the chip 20 can pass are arranged in a grid pattern in a number of rows and columns corresponding to the positions of the mounting portion 12 of the packaging tray 10.

[0037] Therefore, the mask portion 200 is placed on the packaging tray 10 in a stacked state such that the through holes 212 and 222 of the third mask 210 and the fourth mask 220 coincide, and the chips 20 pass through the through holes 212 and 222. In other words, as shown in Figures 14(a) and (b), the mask portion 200 is installed with the chip 20 mounted on the vertical member 32 of the heating block 30, which has entered through the mounting portion 12 of the package tray 10.

[0038] Next, as shown in Figure 14(c), when the third mask 210 and the fourth mask 220 are moved in opposite directions, i.e., left and right, up and down, or in opposite diagonal directions, one side of the through-holes 212 and 222 in the direction of movement is covered by the other mask 210 or 220. Therefore, when the third mask 210 and the fourth mask 220 are moved in parallel, the through holes 212 and 222 are covered by each other by the other masks 210 and 220, thereby covering the package tray 10 exposed around the chip 20 mounted on the vertical member 32. The mask portion 200 effectively blocks the laser beam for processing the chip 20 from reaching the packaging tray 10, thus preventing thermal damage to the packaging tray 10 by the laser.

[0039] Therefore, the masking device 100 for packaging trays according to the present invention, as described above, has various advantages, such as enabling laser processing of chips without thermal damage to the packaging tray by installing the masking device on the packaging tray while the chips mounted on the packaging tray are vertically raised by the heating block.

[0040] The embodiments described above illustrate the most preferred examples of the present invention, but it is clear to those ordinary skill in the art that the invention is not limited to these embodiments and that various modifications can be made without departing from the technical spirit of the present invention. [Explanation of Symbols]

[0041] 10 Packaging Trays 12 Mounting section 20 chips 30 Heating Blocks 32 Vertical members 50 Masking device for packaging trays 100, 200 Mask section 110 First Mask 112 Protrusion 114 Through hole 116 Slope 118 Supports 120 Second Mask 122 Connecting part 130 Means of Transportation 132 Linked Body 134 Linear Guide 136 Guide to Preventing Movement 210 Third Mask 212, 222 through hole 220 4th Mask

Claims

1. A mask portion is installed in a grid pattern on the upper side of a packaging tray in which the mounting section on which the chips are mounted is formed in a number of rows and columns, and the mask portion protects the packaging tray from heat sources. The mask portion comprises a first mask that is installed laterally on the upper side of the packaging tray, The present invention includes a second mask which is positioned vertically on the upper side of the packaging tray so as to intersect with the first mask, The second mask is installed so as to penetrate or overlap the first mask, and is a masking device for a packaging tray.

2. The masking device for a packaging tray according to claim 1, wherein the first mask is bar-shaped and is installed between the vertical members of the heating block that enter the mounting portion of the packaging tray.

3. The masking device for a packaging tray according to claim 1, wherein the first mask is provided with a protruding portion.

4. The masking device for a packaging tray according to claim 1, wherein the second mask consists of a number of bars, and one end of each bar is integrally formed by a connecting portion.

5. A mask portion is installed in a grid pattern on the upper side of a packaging tray in which the mounting section on which the chips are mounted is formed in a number of rows and columns, and the mask portion protects the packaging tray from heat sources. The mask portion consists of a third mask and a fourth mask stacked vertically, The third and fourth masks are masking devices for packaging trays, wherein the through-holes, which have a shape and size that allows chips mounted on the vertical members of the heating block to pass through, are formed in a grid pattern with numerous rows and columns.

6. The packaging tray masking device according to claim 5, wherein the third mask and the fourth mask are moved in opposite directions so that one side of the through-hole in the direction of movement is covered by the other mask, thereby covering the packaging tray that was exposed around the chip mounted on the vertical member.

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