Camera module

Abstract

This provides a camera module that can improve heat dissipation efficiency by improving its structure. [Solution] The camera module comprises a first housing, a lens module disposed in the first housing, a second housing coupled to the first housing, a first printed circuit board disposed in the internal space between the first housing and the second housing, an image sensor disposed on the first printed circuit board, and a shield can disposed below the first printed circuit board within the second housing, wherein the shield can has ribs that contact the lower surface of the first printed circuit board.

Description

Technical Field

[0001] This embodiment relates to a camera module.

Background Art

[0002] In recent years, ultra-small camera modules have been developed and are widely used in small electronic products such as smartphones, notebooks, and game consoles.

[0003] As automobiles become more popular, ultra-small cameras are not only used in small electronic products but also in vehicles. For example, a black box camera for vehicle protection or objective materials for traffic accidents, a rear monitoring camera that allows a driver to monitor a blind spot area at the rear of the vehicle via a screen to ensure safety when reversing, a peripheral sensing camera that can monitor the periphery of the vehicle, etc. are provided.

[0004] A camera can include a lens, a lens holder that houses the lens, an image sensor that converts an image of a subject collected by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted. The housing that forms the outer shape of the camera has a structure in which the entire area is sealed to prevent internal components from being contaminated by foreign matter containing moisture.

Summary of the Invention

Problems to be Solved by the Invention

[0005] This embodiment provides a camera module capable of improving heat dissipation efficiency by improving the structure.

Means for Solving the Problems

[0006] The camera module according to this embodiment includes a first housing, a lens module disposed in the first housing, a second housing coupled to the first housing, a first printed circuit board disposed in the internal space between the first and second housings, an image sensor disposed on the first printed circuit board, and a shield can disposed below the first printed circuit board within the second housing, wherein the shield can has ribs that contact the lower surface of the first printed circuit board.

[0007] The shield can has side plates, and the ribs are bent inward at least partially from the upper edge of the side plates so that their upper surfaces can contact the lower surface of the first printed circuit board. The lower surface of the first printed circuit board is soldered to the upper surface of the ribs.

[0008] On the underside of the first printed circuit board facing the rib, an exposed portion can be placed where the electrodes within the first printed circuit board are exposed.

[0009] Multiple ribs can be provided and arranged to be spaced apart from one another.

[0010] The material of the first housing may be resin or plastic, and the material of the shield can may be metal.

[0011] A second printed circuit board is positioned below the first printed circuit board and separated from the shield can, and the second printed circuit board can be positioned below the rib.

[0012] The cross-sectional area of ​​the second printed circuit board may be smaller than the cross-sectional area of ​​the first printed circuit board.

[0013] The second printed circuit board may include a cable electrically connected to the underside of the second printed circuit board, and a flexible circuit board that electrically connects the first printed circuit board and the second printed circuit board.

[0014] A camera module according to another embodiment includes a first housing, a lens module disposed in the first housing, a second housing coupled to the first housing, a first printed circuit board disposed in the internal space between the first and second housings, an image sensor disposed on the first printed circuit board, and a shield can disposed below the first printed circuit board within the second housing, wherein the lower surface of the first printed circuit board is soldered to the upper surface of the shield can. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a camera module that can improve heat dissipation efficiency by transferring heat generated in the substrate module to the outside through a shielding can. [Brief explanation of the drawing]

[0016] [Figure 1] This is a perspective view of a camera module according to the first embodiment of the present invention. [Figure 2] This is a cross-sectional view showing the internal configuration of a camera module according to the first embodiment of the present invention. [Figure 3] This is an exploded perspective view of a camera module according to the first embodiment of the present invention. [Figure 4] Figure 3 is an exploded perspective view showing the figure from a different angle. [Figure 5] This is an exploded perspective view of a substrate module and a shielding can according to the first embodiment of the present invention. [Figure 6] This is an exploded perspective view of a first printed circuit board and a shielding can according to a first embodiment of the present invention. [Figure 7] This is a perspective view illustrating the connection between a substrate module and a shielding can according to a second embodiment of the present invention. [Figure 8] This is a perspective view of a shield can according to a second embodiment of the present invention. [Figure 9] This is a perspective view of a first printed circuit board according to a second embodiment of the present invention. [Modes for carrying out the invention]

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0018] However, the technical idea of the present invention is not limited to some of the described embodiments, and can be embodied in various different forms. Within the scope of the technical idea of the present invention, one or more (one or more) of the components can be selectively combined (combined) or replaced between the embodiments and used.

[0019] Also, the terms (including technical and scientific terms) used in the embodiments of the present invention are construed as meanings generally understood by those having ordinary knowledge in the technical field to which the present invention pertains, unless explicitly defined and described specially, and for generally used terms like pre-defined terms, the meaning can be construed considering the meaning in the context of the related technology.

[0020] Also, the terms used in the embodiments of the present invention are for explaining the embodiments and are not intended to limit the present invention.

[0021] In this specification, the singular form can also include the plural form unless otherwise specifically mentioned in the text. When described as "at least one (or one or more) of A and (or) B, C", it can include one or more of all combinations that can be combined with A, B, and C.

[0022] Also, when explaining the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. can be used. Such terms are only for distinguishing the component from another component, and are not limited to the essence, order, or sequence of the corresponding component by such terms.

[0023] Furthermore, when it is stated that one component is 'connected', 'joined', or 'connected' to another component, this can include not only cases where the component is directly 'connected', 'joined', or 'connected' to that other component, but also cases where it is 'connected', 'joined', or 'connected' by yet another component between that component and the other component. Also, when it is stated that a component is formed or positioned 'above' or 'below' each component, 'above' or 'below' can include cases where two components are in direct contact with each other, as well as cases where one or more yet another component is formed or positioned between the two components. In addition, when expressed as 'above' or 'below', this can include not only an upward direction but also a downward direction relative to one component.

[0024] In the following, 'optical axis direction' is defined as the optical axis direction of the lens. On the other hand, 'optical axis direction' can correspond to 'vertical direction', 'z-axis direction', etc.

[0025] The present invention will be described in more detail below with reference to the attached drawings.

[0026] Figure 1 is a perspective view of a camera module according to the first embodiment of the present invention; Figure 2 is a cross-sectional view showing the internal configuration of the camera module according to the first embodiment of the present invention; Figure 3 is an exploded perspective view of the camera module according to the first embodiment of the present invention; Figure 4 is an exploded perspective view of Figure 3 from a different angle; Figure 5 is an exploded perspective view of a substrate module and shield can according to the first embodiment of the present invention; and Figure 6 is an exploded perspective view of a first printed circuit board and shield can according to the first embodiment of the present invention.

[0027] Referring to Figures 1 to 6, the camera module 100 according to an embodiment of the present invention may include a first housing 110, a second housing 120, a first printed circuit board 130, a second printed circuit board 140, a shielding can 150, a cable 160, a lens module 170, a separation member, and a flexible circuit board 190, but it may also be implemented without some of these components, and without excluding any other additional components.

[0028] The camera module 100 may include a first housing 110. The first housing 110 may form the exterior of the camera module 100. The first housing 110 may be coupled with the second housing 120. The first housing 110 may be positioned on one side of the second housing 120. The first housing 110 may be formed in a hexahedral shape with an open bottom. The first housing 110 may be coupled with the second housing 120 by heat fusion. The material of the first housing 110 may include plastic or resin. The lens module 170 may be disposed in the first housing 110.

[0029] The camera module 100 may include a second housing 120. The second housing 120 may form the exterior of the camera module 100. The second housing 120 may be coupled with the first housing 110. The second housing 120 may be positioned on the other side of the first housing 110. The second housing 120 may be formed in a hexahedral shape with an open top. The second housing 120 may house a first printed circuit board 130, a second printed circuit board 140, a shielding can 150, a cable 160, a bracket 180, and a flexible circuit board 190. The material of the second housing 120 may include resin or plastic. Alternatively, the second housing 120 may be formed from a metal material.

[0030] The camera module 100 may include a lens module 170. The lens module 170 may be placed in the first housing 110. The lens module 170 may include at least one lens. The lens module 170 may include a plurality of lenses, which may be arranged along the optical axis. The outermost lens 172 of these may be exposed above the first housing 110. A lens coupling portion 112 may be formed on the upper surface of the first housing 110, which protrudes upward and has a receiving groove 112a formed therein so that the outermost lens 172 is placed inside. The plurality of lenses, excluding the outermost lens 172, may be placed in the opening 116 of the first housing 110. The lens module 170 may be coupled to the first housing 110. The lens module 170 may be screw-coupled to the first housing 110. The lens module 170 may be positioned opposite the image sensor 131, which will be described later.

[0031] The camera module 100 may include a circuit board module. The circuit board module may include a first printed circuit board 130, a second printed circuit board 140, a separation member, and a flexible circuit board 190.

[0032] The first printed circuit board 130 can be placed in the internal space between the first housing 110 and the second housing 120. The first printed circuit board 130 can be placed in the second housing 120. An image sensor 131 can be placed on the first printed circuit board 130. The image sensor 131 can be placed facing the lens module in the optical axis direction as well. The image sensor 131 can form an image with light passing through the lens module 170.

[0033] The first printed circuit board 130 may have a rectangular cross-sectional shape. The first printed circuit board 130 may have four sides. The first printed circuit board 130 may have four sides. A first groove 136 and a second groove 137 may be arranged on the sides of the first printed circuit board 130. The first groove 136 and the second groove 137 may each be formed to be recessed inward from other areas on the side of the first printed circuit board 130. The length of the first groove 136 in the direction perpendicular to the optical axis may be formed to be shorter than the length of the second groove 137. The first groove 136 may be arranged on three of the four sides of the first printed circuit board 130. The second groove 137 may be arranged on the remaining sides of the first printed circuit board 130, excluding the three sides mentioned above.

[0034] The second printed circuit board 140 can be positioned below the first printed circuit board 130. The second printed circuit board 140 can be positioned so as to be separated from the first printed circuit board 130 in the vertical direction. The cross-sectional area of ​​the second printed circuit board 140 can be made smaller than the cross-sectional area of ​​the first printed circuit board 130. The second printed circuit board 140 can have a rectangular cross-sectional shape. A cable 160 can be connected to the lower surface of the second printed circuit board 140. The second printed circuit board 140 can be positioned inside the shield can 150. The side surface of the second printed circuit board 140 can be separated from the inner surface of the shield can 150.

[0035] Grooves can also be formed on the side surface of the second printed circuit board 140. On the side surface of the second printed circuit board 140, a third groove 146 facing the first groove 136 in the vertical direction, and a fourth groove 147 facing the second groove 137 in the vertical direction can be arranged.

[0036] The first printed circuit board 130 and the second printed circuit board 140 can be connected to each other via a separating member. The separating member may include a bracket 180. The bracket 180 may be made of a metal material. The bracket 180 may be a shield can in which the first printed circuit board 130 and the second printed circuit board 140 are arranged inside. In this case, the shield can 150 in which the first printed circuit board 130 is arranged on top and the second printed circuit board 140 is arranged inside and is received within the second housing 120 may be named the first shield can, and the bracket 180 that separates the first printed circuit board 130 and the second printed circuit board 140 may be named the second shield can.

[0037] The bracket 180 can be coupled at its upper end to the first printed circuit board 130 via the first groove 136 and at its lower end to the second printed circuit board 140 via the third groove 146. Multiple first grooves 136 and third grooves 146 are provided, and the first printed circuit board 130 and the second printed circuit board 140 can have a coupling structure in multiple areas via the bracket. The bracket 180 can be made of a metal material. The bracket 180 may include a side plate 184 at which the upper end supports the lower surface of the first printed circuit board 130 and the lower end supports the upper surface of the second printed circuit board 140. The side plate 184 allows the first printed circuit board 130 and the second printed circuit board 140 to be separated in the vertical direction. The area of ​​the bracket 180 connected to the first groove 136 and the third groove 146 may be rib-shaped, extending upward and downward from the upper and lower ends of the side plate 184, respectively.

[0038] More specifically, the bracket 180 may include a side plate 184 positioned between the first printed circuit board 130 and the second printed circuit board 140, an upper rib 181 extending upward from the upper end of the side plate 184 and engaging with the first groove 136, and a lower rib 182 extending downward from the lower end of the side plate and engaging with the third groove 146. The upper rib 181 and the lower rib 182 may each include a region that has been bent at least once and may have a region that contacts the upper surface of the first printed circuit board 130 and the lower surface of the second printed circuit board 140, respectively. This allows the first printed circuit board 130 and the second printed circuit board 140 to be fixed to each other while being separated in the vertical direction.

[0039] The first printed circuit board 130 and the second printed circuit board 140 can be electrically connected to each other via a flexible circuit board (FPCB) 190. The flexible circuit board 190 may have a region that has been bent at least once. The flexible circuit board 190 is made of a flexible material and its upper end can be electrically connected to the first printed circuit board 130, and its lower end can be electrically connected to the second printed circuit board 140. At least a portion of the flexible circuit board 190 can be placed in the second groove 137 and the fourth groove 147, respectively.

[0040] The cable 160 can be connected to the underside of the board module. The cable 160 can be connected to the underside of the second printed circuit board 140. The cable 160 can be electrically connected to the second printed circuit board 140. The cable 160 can supply external power to the board module.

[0041] The cable 160 can be placed in the second housing 120. An external terminal coupling portion 128 can be formed on the lower surface of the second housing 120, extending downward and having a space for housing the cable 160 inside. An external terminal can be coupled to the external terminal coupling portion 128. The external terminal can supply power to the camera module 100 or transmit and receive signals with the camera module 100. The space within the external terminal coupling portion 128 can communicate with the space 121 within the second housing 120. The lower surface of the external terminal coupling portion 128 can be opened.

[0042] A shield can 150 can be placed inside the second housing 120. The shield can 150 can be placed in the space 121 inside the second housing 120. The outer surface of the shield can 150 can be positioned facing the inner surface of the second housing 120. The outer surface of the shield can 150 can be in contact with the inner surface of the second housing 120.

[0043] The shield can 150 may have an open top surface. A hole 156 can be formed on the bottom surface of the shield can 150 for the cable 160 to pass through. A space 151 for housing the substrate module can be formed inside the shield can 150. The second printed circuit board 140 and the flexible circuit board 180 can be arranged in the space 151. That is, the remaining components of the substrate module, excluding the first printed circuit board 130, are arranged in the space 151 inside the shield can 150, and the first printed circuit board 130 can be arranged above the shield can 150 via a rib 152, which will be described later.

[0044] The shield can 150 can be made of a metal material. The shield can 150 can be formed integrally with the second housing 120 by insert injection molding.

[0045] The shield can 150 can support the lower surface of the first printed circuit board 130. The upper end of the shield can 150 can contact the lower surface of the first printed circuit board 130. The first printed circuit board 130 is soldered onto the shield can 150. The shield can 150 can be used for energizing or grounding the board module including the first printed circuit board 130.

[0046] The shield can 150 may include a side plate 158 that forms the side and a bottom plate (panel) 159 that forms the bottom. The hole 156 described above may be formed in the bottom plate 159. The space 151 may be formed inside the side plate 158.

[0047] The shield can 150 may include a rib 152 that supports the first printed circuit board 130. The rib 152 can support the lower surface of the first printed circuit board 130. The lower surface of the first printed circuit board 130 and the upper surface of the rib 152 are soldered together. The lower surface of the first printed circuit board 130 can be in contact with the rib 152.

[0048] The rib 152 may have at least a portion of its region parallel to the first printed circuit board 130.

[0049] The rib 152 may include a vertical portion 153 extending upward from the upper end of the side plate 158 and a horizontal portion 154 bent inward from the end of the vertical portion 153. The horizontal portion 154 may be positioned to cover at least a portion of the space 151. The horizontal portion 154 may be positioned parallel to the first printed circuit board 130. The upper surface of the horizontal portion 154 may be in contact with the lower surface of the first printed circuit board 130. The lower surface of the first printed circuit board 130 may be soldered to the upper surface of the horizontal portion 154. The upper surface of the horizontal portion 154 may be in surface contact with the lower surface of the first printed circuit board 130.

[0050] Multiple ribs 152 can be provided and arranged to be spaced apart from each other. When the shield can 150 is formed with a rectangular cross-section having four sides, two ribs 152 can be arranged on each side. In this case, multiple ribs 152 having a single side can be arranged to be spaced apart from each other.

[0051] On the other hand, the cross-sectional area of ​​the virtual region formed by connecting the inner ends of the multiple horizontal sections 154 can be formed to be smaller than the cross-sectional area of ​​the second printed circuit board 140. This prevents the second printed circuit board 140 from unnecessarily detaching from the space 151. The cross-sectional area of ​​the second printed circuit board 140 can be formed to be equal to or smaller than the cross-sectional area of ​​the space 151.

[0052] An exposed portion 138, in which an electrode within the first printed circuit board 130 is exposed, can be arranged in the region of the lower surface of the first printed circuit board 130 that faces the rib 152. This electrode may be a ground electrode.

[0053] Multiple exposed portions 138 can be provided. Multiple exposed portions 138 can be arranged along the edge of the lower surface of the first printed circuit board 130 so as to be spaced apart from each other to form a pattern. The exposed portions 138 can be provided on the lower surface of the first printed circuit board 130 so as to correspond to the position and number of ribs 152. Multiple exposed portions 138 can be arranged along the edge of the first printed circuit board 130 so as to be spaced apart from each other. As a result, the first printed circuit board 130 can form a contact structure with the shield can 150 in different regions, thereby improving heat dissipation efficiency.

[0054] When the cross-section of the first printed circuit board 130 is rectangular, the multiple exposed portions 138 arranged on one side can be arranged symmetrically with respect to each other, centered on the first groove 136 or the second groove 137.

[0055] Therefore, the exposed portion 138 is soldered to the rib 152, and the substrate module is grounded.

[0056] The structure described above has the advantage of improving heat dissipation efficiency by transferring heat generated in the circuit board module to the outside through the shielding can. In particular, even if the first housing is made of plastic, the heat generated in the module can be transferred towards the second housing through the metal shielding can, thus creating an efficient heat dissipation path.

[0057] Furthermore, the first printed circuit board on which the image sensor is located is firmly fixed onto the shielding can, which has the advantage of making the focusing process with the lens module easier.

[0058] Figure 7 is a perspective view illustrating the connection between a substrate module and a shielding can according to a second embodiment of the present invention, Figure 8 is a perspective view of a shielding can according to a second embodiment of the present invention, and Figure 9 is a perspective view of a first printed circuit board according to a second embodiment of the present invention.

[0059] In this embodiment, other parts are the same as in the first embodiment, except for differences in the arrangement of the ribs and exposed parts. Below, only the characteristic parts of this embodiment will be described, and the remaining parts will refer to the first embodiment.

[0060] Referring to Figures 7 to 9, the shield can 250 according to this embodiment may include a plurality of ribs 252. The plurality of ribs 252 may be positioned on the upper part of the shield can 250. Each of the plurality of ribs 252 may include a vertical portion 253 extending upward from the side plate of the shield can 250 and a horizontal portion 254 bent inward from the upper end of the vertical portion 253. The upper surface of the horizontal portion 254 may support the lower surface of the first printed circuit board 230.

[0061] The shield can 250 may include a first side plate 257a, a second side plate 257b and a third side plate 257c adjacent to the first side plate 257a, and a fourth side plate 257d positioned opposite the first side plate 257a. Three ribs 252 may be arranged on the upper part of each of the first to third side plates 257a, 257b, and 257c.

[0062] The fourth side plate 257d, which is positioned opposite the first side plate 257a, may have fewer ribs 252 than the other side plates. In one example, two ribs 252 may be positioned on the upper part of the fourth side plate 257d. A separation space 258 can be formed between the two ribs 252.

[0063] The first printed circuit board 230 can be positioned on top of the shield can 250. The lower surface of the first printed circuit board 230 can be in contact with the ribs 252. An exposed portion 238 with exposed copper foil can be formed on the lower surface of the first printed circuit board 230. The exposed portion 238 can be positioned to correspond to the number and location of the ribs 252.

[0064] A first groove 236 and a second groove 237 can be arranged on the side surface of the first printed circuit board 230. The first groove 236 and the second groove 237 can each be formed to be recessed inward from other areas on the side surface of the first printed circuit board 230. The length of the first groove 236 can be formed to be shorter than the length of the second groove 237.

[0065] In the first printed circuit board 230 having a rectangular cross-section, the side surface of the first printed circuit board 230 in which the first groove 236 is formed can be arranged to face the first to third side plates 257a, 257b, and 257c in the vertical direction. Furthermore, the side surface of the first printed circuit board 230 in which the second groove 237 is located can be arranged to face the fourth side plate 257d in the vertical direction.

[0066] Therefore, when the first printed circuit board 230 is coupled to the upper surface of the shield can 250, a space for the flexible circuit board 180 (see Figures 1 to 6) to be placed can be formed via the second groove 237 and the separation space 258.

[0067] The above-described structure has the advantage of firmly fixing the first printed circuit board 230 within the camera module with the rib 252, while simultaneously providing more space for arranging the flexible circuit board for electrical connection with the second printed circuit board.

[0068] Although embodiments of the present invention have been described above with reference to the attached drawings, those with ordinary skill in the art to which the present invention pertains should understand that the present invention can be implemented in other specific forms without altering its technical idea or essential features. Therefore, the embodiments described above should be understood to be illustrative and not limiting in all respects.

Claims

1. The first housing and A lens module disposed in the first housing, A second housing coupled to the first housing, A first printed circuit board disposed within the first housing and the second housing, A second printed circuit board is positioned below the first printed circuit board, A flexible circuit board electrically connects the first printed circuit board and the second printed circuit board, An image sensor placed on the first printed circuit board, The second housing includes a shielding can located below the first printed circuit board, The second printed circuit board is placed inside the shield can. The shield can includes a side plate and ribs that contact the lower surface of the first printed circuit board. The rib includes a vertical portion extending upward from the upper end of the side plate and a horizontal portion bent inward from the upper end of the vertical portion. On the lower surface of the first printed circuit board facing the rib, an exposed portion is provided in which the electrodes within the first printed circuit board are exposed. The exposed portion is soldered to the upper surface of the horizontal portion. The aforementioned ribs are provided in multiple quantities and are arranged to be spaced apart from each other. A camera module in which a separation space is formed between the plurality of ribs, on which the flexible circuit board is arranged.

2. The material of the first housing is resin or plastic. The camera module according to claim 1, wherein the material of the shield can is metal.

3. The camera module according to claim 1 or 2, further comprising a bracket disposed between the first printed circuit board and the second printed circuit board.

4. The camera module according to any one of claims 1 to 3, wherein the cross-sectional area of ​​the second printed circuit board is smaller than the cross-sectional area of ​​the first printed circuit board.

5. The camera module according to any one of claims 1 to 4, having a cable electrically connected to the lower surface of the second printed circuit board.

Images