Monitoring board and monitoring method

Abstract

In operating circuit board processing equipment, it is sometimes necessary to know the internal state of the equipment. It is also sometimes necessary to select a maintenance method based on the internal state. This invention provides a monitoring board and monitoring method that can acquire images to more accurately estimate the maintenance timing. [Solution] A monitoring board 100 for monitoring the inside of a substrate processing apparatus, comprising: a position detection sensor having a gyro sensor 141 and an acceleration sensor 142 for detecting the position of the monitoring board; a camera 120 for imaging the inside of the substrate processing apparatus in a vacuum atmosphere; a light source 130 for illuminating the inside of the substrate processing apparatus; a storage unit 160 for storing images captured by the camera; and a control unit 170 for controlling the camera and the light source.

Description

Technical Field

[0001] The present disclosure relates to a monitoring substrate and a monitoring method.

Background Art

[0002] In an operating substrate processing apparatus, there may be a case where it is desired to know the internal state of the substrate processing apparatus. For example, when a conveyance trouble of a substrate occurs inside the substrate processing apparatus, there may be a case where it is desired to select a maintenance method according to the internal state. In such a case, it has been proposed to convey a substrate-like member equipped with a camera inside the substrate processing apparatus and photograph the location where the trouble has occurred (Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a monitoring substrate and a monitoring method capable of acquiring an image for more accurately estimating a maintenance timing.

Means for Solving the Problems

[0005] A monitoring substrate according to an aspect of the present disclosure is a monitoring substrate for monitoring the inside of a substrate processing apparatus, including a position detection sensor for detecting the position of the monitoring substrate, a camera for imaging the inside of the substrate processing apparatus in a vacuum atmosphere, a light source for illuminating the inside of the substrate processing apparatus, a storage unit for storing an image captured by the camera, a control unit for controlling the camera and the light source, and a heat conduction member or a heat capacity member for diffusing heat received from the outside into the inside of the monitoring substrate.

Effects of the Invention

[0006] According to this disclosure, images can be obtained to more accurately estimate the maintenance schedule. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 shows an example of a substrate processing apparatus in one embodiment of the present disclosure. [Figure 2] Figure 2 shows an example of the upper surface of the monitoring substrate in this embodiment. [Figure 3] Figure 3 shows an example of the lower surface of the monitoring substrate in this embodiment. [Figure 4] Figure 4 shows an example of a cross-section of the monitoring substrate in this embodiment. [Figure 5] Figure 5 shows an example of a transport route for a monitoring substrate. [Figure 6] Figure 6 shows an example of the position of the monitoring circuit board immediately before it is brought into the processing room. [Figure 7] Figure 7 shows an example of the position of the monitoring substrate during imaging within the processing chamber. [Figure 8] Figure 8 is a flowchart showing an example of the monitoring process in this embodiment. [Figure 9] Figure 9 shows an example of a display screen that shows the captured image and the estimated cleaning time. [Modes for carrying out the invention]

[0008] The embodiments of the disclosed monitoring substrate and monitoring method will be described in detail below with reference to the drawings. However, the disclosed technology is not limited to the embodiments described below.

[0009] In substrate processing equipment, reaction by-products (hereinafter also referred to as deposits) adhere to the inner wall of the chamber as the processing of substrates is repeated. Therefore, as part of maintenance, a process of cleaning the inside of the chamber is performed, for example, after a predetermined number of substrates. At this time, the cleaning timing is set with a margin, but if consumable parts inside the chamber, such as edge rings or upper electrodes, are worn out, there may not be enough time before cleaning. On the other hand, if the consumable parts inside the chamber are new, there will be ample time before cleaning. As a result, maintenance such as cleaning may not be performed at the appropriate time, which may lead to a longer downtime for the substrate processing equipment. Therefore, it is hoped that images will be acquired to more accurately estimate the maintenance timing.

[0010] [Configuration of substrate processing apparatus 1] Figure 1 shows an example of a substrate processing apparatus in one embodiment of the present disclosure. The substrate processing apparatus 1 shown in Figure 1 is a cluster structure (multi-chamber type) system. The substrate processing apparatus 1 comprises processing chambers PM (Process Module) 1 to PM6, a transport chamber VTM (Vacuum Transfer Module), load lock chambers LLM (Load Lock Module) 1 to LLM2, a loader module LM (Load Module), load ports LP (Load Port) 1 to LP3, and a control unit 10.

[0011] Processing chambers PM1 to PM6 are reduced to a predetermined vacuum atmosphere, and within them, a desired process (e.g., etching, film deposition, cleaning, ashing, etc.) is performed on a substrate such as a semiconductor wafer W (hereinafter also referred to as "wafer W"). Processing chambers PM1 to PM6 are examples of chambers for processing substrates. Processing chambers PM1 to PM6 are arranged adjacent to the transport chamber VTM. The transport of wafer W between processing chambers PM1 to PM6 and the transport chamber VTM is performed via transport ports by opening and closing gate valves GV1 to GV6. Processing chambers PM1 to PM6 have mounting sections S1 to S6 on which wafer W is placed. The operation of each part for processing in processing chambers PM1 to PM6 is controlled by the control unit 10. Although the substrate processing apparatus 1 has been described as having six processing chambers PM1 to PM6, the number of processing chambers PM is not limited to this, and one or more are sufficient.

[0012] The transport chamber VTM is depressurized to a predetermined vacuum atmosphere. Inside the transport chamber VTM, a transport device 30 for transporting wafers W is provided. The transport device 30 loads and unloads wafers W between the processing chambers PM1 to PM6 and the transport chamber VTM in accordance with the opening and closing of gate valves GV1 to GV6. The transport device 30 also loads and unloads wafers W between the load lock chambers LLM1 to LLM2 and the transport chamber VTM in accordance with the opening and closing of gate valves GV7 and GV8. The operation of the transport device 30 and the opening and closing of gate valves GV1 to GV8 are controlled by the control unit 10.

[0013] The transport device 30 has a first arm 31 and a second arm 32. The first arm 31 is configured as a multi-joint arm, and can hold wafers W and monitoring substrates 100 (described later) with a pick 31a attached to the tip of the multi-joint arm. Similarly, the second arm 32 is configured as a multi-joint arm, and can hold wafers W and monitoring substrates 100 with a pick 32a attached to the tip of the multi-joint arm. Although the transport device 30 has been described as having two picks 31a and 32a, the number of picks is not limited to this, and one or more are sufficient.

[0014] The load lock chambers LLM1 to LLM2 are located between the transport chamber VTM and the loader module LM. The load lock chambers LLM1 to LLM2 can switch between an atmospheric atmosphere and a vacuum atmosphere. The load lock chamber LLM1 and the transport chamber VTM in a vacuum atmosphere are connected by opening and closing the gate valve GV7. The load lock chamber LLM1 and the loader module LM in an atmospheric atmosphere are connected by opening and closing the gate valve GV9. The load lock chamber LLM1 has a mounting section S7 on which wafers W and monitoring substrates 100 are placed. Similarly, the load lock chamber LLM2 and the transport chamber VTM in a vacuum atmosphere are connected by opening and closing the gate valve GV8. The load lock chamber LLM2 and the loader module LM in an atmospheric atmosphere are connected by opening and closing the gate valve GV10. The load lock chamber LLM2 has a mounting section S8 on which wafers W and monitoring substrates 100 are placed. The switching between a vacuum atmosphere and an atmospheric atmosphere in the load lock chambers LLM1 to LLM2 is controlled by the control unit 10. Although the substrate processing apparatus 1 has been described as having two load lock chambers LLM1 to LLM2, the number of load lock chambers LLM is not limited to this, and one or more are sufficient.

[0015] The loader module LM is in an atmospheric environment, for example, with a downflow of clean air. Inside the loader module LM, there is an alignment device 50 for aligning the wafer W and the monitoring substrate 100, and a transport device 40 for transporting the wafer W and the monitoring substrate 100. The transport device 40 loads and unloads the wafer W and the monitoring substrate 100 between the load lock chambers LLM1 to LLM2 and the loader module LM in accordance with the opening and closing of gate valves GV9 to GV10. The transport device 40 also loads and unloads the wafer W and the monitoring substrate 100 to and from the alignment device 50. The operation of the transport device 40, the operation of the alignment device 50, and the opening and closing of gate valves GV9 to GV10 are controlled by the control unit 10.

[0016] The transfer device 40 has a first arm 41 and a second arm 42. The first arm 41 is configured as an articulated arm, and a pick 41a attached to the tip of the articulated arm can hold the wafer W and the monitoring substrate 100. Similarly, the second arm 42 is configured as an articulated arm, and a pick 42a attached to the tip of the articulated arm can hold the wafer W and the monitoring substrate 100. Although the transfer device 40 has been described as having two picks 41a and 42a, the number of picks is not limited to this, and one or more picks may be used.

[0017] The alignment device 50 detects the positions of the notch, alignment marks, etc. provided on the wafer W and the monitoring substrate 100, and detects the misalignment of the wafer W and the monitoring substrate 100. Further, the alignment device 50 aligns the positions of the wafer W and the monitoring substrate 100 based on the detected misalignment.

[0018] Load ports LP1 to LP3 are provided on the wall surface of the loader module LM. The load ports LP1 to LP3 are attached with carriers C containing the wafer W and the monitoring substrate 100, and empty carriers C. As the carrier C, for example, a FOUP (Front Opening Unified Pod) or the like can be used. In the example of FIG. 1, it is illustrated that a carrier C containing the wafer W is attached to the load port LP1, a carrier C containing the monitoring substrate 100 is attached to the load port LP2, and an empty carrier C is attached to the load port LP3.

[0019] The transfer device 40 can hold the wafer W and the monitoring substrate 100 contained in the carriers C of the load ports LP1 to LP3 with the picks 41a and 42a and take them out of the carriers C. Further, the transfer device 40 can accommodate the wafer W and the monitoring substrate 100 held by the picks 41a and 42a in the carriers C of the load ports LP1 to LP3. Although the substrate processing apparatus 1 has been described as including three load ports LP1 to LP3, the number of load ports LP is not limited to this, and one or more load ports may be used.

[0020] The control unit 10 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and HDD (Hard Disk Drive). The control unit 10 may have other storage areas such as an SSD (Solid State Drive) in addition to the HDD. The storage areas such as the HDD and RAM store recipes in which process procedures, process conditions, and transport conditions are set. The control unit 10 also has a communication interface that manages information communication with the monitoring board 100, such as a wireless LAN (Local Area Network) like Wi-Fi (registered trademark) or a communication module that supports Bluetooth (registered trademark).

[0021] The CPU controls the processing of wafers W in each processing chamber PM according to a recipe, and controls the transport of wafers W. The HDD or RAM may store programs for executing the processing and transport of wafers W in each processing chamber PM. These programs may be provided on a storage medium or provided by an external device via a network.

[0022] [Operation of the substrate processing device 1] Next, an example of the operation of the substrate processing apparatus 1 will be described. Here, as an example of the operation of the substrate processing apparatus 1, a wafer W housed in a carrier C attached to the load port LP1 is processed in the processing chamber PM1 and then housed in an empty carrier C attached to the load port LP3. At the start of the operation, gate valves GV1 to GV10 are closed, and the load lock chamber LLM is under an atmospheric environment.

[0023] The control unit 10 controls the transport device 40 to remove the wafer W from the carrier C of the load port LP1 and transport the removed wafer W to the alignment device 50. The control unit 10 controls the alignment device 50 to align the position of the wafer W. The control unit 10 controls the transport device 40 to remove the wafer W from the alignment device 50. The control unit 10 opens the gate valve GV9. The control unit 10 controls the transport device 40 to place the wafer W held by the pick 41a onto the mounting section S7 of the load lock chamber LLM1. When the transport device 40 retracts from the load lock chamber LLM1, the control unit 10 closes the gate valve GV9.

[0024] The control unit 10 controls the exhaust device (not shown) of the load lock chamber LLM1 to exhaust the air inside the chamber, switching the load lock chamber LLM from an atmospheric environment to a vacuum environment.

[0025] The control unit 10 opens the gate valve GV7. The control unit 10 controls the transport device 30 to hold the wafer W placed on the loading section S7 of the load lock chamber LLM and transport it to the transport chamber VTM. When the transport device 30 moves away from the load lock chamber LLM1, the control unit 10 closes the gate valve GV7. The control unit 10 opens the gate valve GV1. The control unit 10 controls the transport device 30 to place the wafer W held by the pick 31a on the loading section S1 of the processing chamber PM1. When the transport device 30 moves away from the processing chamber PM1, the control unit 10 closes the gate valve GV1.

[0026] The control unit 10 controls the processing chamber PM1 to perform the desired processing on the wafer W.

[0027] When the processing of wafer W is complete, the control unit 10 opens the gate valve GV1. The control unit 10 controls the transport device 30 to hold the wafer W, which is placed on the loading section S1 of the processing chamber PM1, with the pick 31a and transport it to the transport chamber VTM. When the transport device 30 moves away from the processing chamber PM1, the control unit 10 closes the gate valve GV1. The control unit 10 opens the gate valve GV7. The control unit 10 controls the transport device 30 to place the wafer W, which is held by the pick 31a, on the loading section S7 of the load lock chamber LLM1. When the transport device 30 moves away from the load lock chamber LLM1, the control unit 10 closes the gate valve GV7.

[0028] The control unit 10 controls the intake device (not shown) of the load lock chamber LLM1 to supply, for example, clean air into the chamber, and switches the load lock chamber LLM1 from a vacuum atmosphere to an atmospheric atmosphere.

[0029] The control unit 10 opens the gate valve GV9. The control unit 10 controls the transport device 40 to remove the wafer W placed on the loading section S7 of the load lock chamber LLM1 and to place the removed wafer W into the carrier C of the load port LP3.

[0030] The above describes an example of transporting and unloading wafer W to processing room PM1, but wafer W may be similarly transported and unloaded to processing rooms PM2 to PM6. Alternatively, wafer W processed in processing room PM1 may be transported to, for example, processing room PM2, where it may be further processed.

[0031] [Configuration of monitoring board 100] Next, the configuration of the monitoring substrate 100 will be described using Figures 2 to 4. Figure 2 is a diagram showing an example of the upper surface of the monitoring substrate in this embodiment. Figure 3 is a diagram showing an example of the lower surface of the monitoring substrate in this embodiment. As shown in Figure 2, the monitoring substrate 100 has a plurality of cameras 121 and a plurality of light sources 131 on the upper surface 111 of the substrate 110. Also, as shown in Figure 3, the monitoring substrate 100 has a plurality of cameras 122 and a plurality of light sources 132 on the lower surface 112 of the substrate 110. In the following description, if cameras 121 and 122 are not distinguished, they will be referred to as camera 120. Similarly, in the following description, if light sources 131 and 132 are not distinguished, they will be referred to as light source 130. The cameras 120 and light sources 130 are arranged so that there are no irregularities on the surface of the upper surface 111 or the lower surface 112.

[0032] The monitoring board 100 further includes a position detection sensor 140, a wireless communication unit 150, a storage unit 160, a control unit 170, a battery 180, and a heat pipe 190 inside the board 110. The position detection sensor 140 also includes a gyro sensor 141 and an acceleration sensor 142. Note that the electrical connections of each part are not shown in Figures 2 to 4.

[0033] Figure 4 shows an example of a cross-section of the monitoring substrate in this embodiment. Figure 4 is a cross-section of the monitoring substrate 100 along line AA shown in Figure 2. The substrate 110 is, for example, a substrate with a printed circuit board (not shown) at its center, surrounded by a heat insulating material. The camera 120, light source 130, gyro sensor 141, acceleration sensor 142, wireless communication unit 150, memory unit 160, control unit 170, battery 180, and heat pipe 190 are arranged on or inside the printed circuit board and sealed with a heat insulating material. The monitoring substrate 100 has the same diameter as the wafer W to be processed and a thickness (for example, about 5 mm) that can be transported inside the substrate processing apparatus 1.

[0034] Camera 120 can, for example, image the inside of processing chamber PM1, that is, the upper electrodes and mounting section S1 located above and below the monitoring substrate 100, within processing chamber PM1. Camera 120 captures images using, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor as the image sensor. Camera 120 generates an image by photoelectric conversion of the light received by the image sensor and A / D (Analog / Digital) conversion. Camera 120 outputs the captured image to the control unit 170. Furthermore, camera 120 is a camera with a short startup, focusing, and exposure time, meaning that the time from receiving an imaging instruction from the control unit 170 to being able to capture an image is short.

[0035] The cameras 120 are arranged, for example, at four locations on the top surface 111 and four locations on the bottom surface 112, for example, on the same circumference, as shown in Figures 2 and 3. The cameras 122 on the bottom surface 112 are positioned so as not to overlap with the pick 31a when the monitoring substrate 100 is held by the pick 31a of the transport device 30. Furthermore, the shutters of each camera 121 on the top surface 111 are synchronized. Similarly, the shutters of each camera 122 on the bottom surface 112 are synchronized.

[0036] As shown by the dotted line in Figure 4, camera 120 has a field of view of approximately 90° and a focal length of about 300mm to 500mm, so it can image the entire interior of the processing chamber PM1. Note that camera 122, which is positioned on the lower surface 112 side of the monitoring substrate 100, may have a shorter focal length, for example, about 20mm, if it is close to the mounting section S1 inside the processing chamber PM1. Furthermore, camera 120 is designed so that it can operate in a vacuum atmosphere, without any space at atmospheric pressure inside. In other words, camera 120 is designed not to malfunction due to pressure differences between the inside and outside.

[0037] As shown in Figures 2 and 3, the light sources 130 are positioned near the cameras 120. Each light source 130 illuminates the field of view of each camera 120, for example, inside the processing chamber PM1. The light sources 130 can be, for example, white LEDs (Light Emitting Diodes). The light sources 130 are controlled to maintain a constant brightness and color.

[0038] The gyro sensor 141 is a sensor that detects the orientation of the monitoring board 100. For example, a vibration-type gyro sensor can be used as the gyro sensor 141. The gyro sensor 141 outputs orientation data to the control unit 170.

[0039] The acceleration sensor 142 is a sensor that detects the acceleration of the monitoring board 100. The acceleration sensor 142 can be a 3-axis acceleration sensor such as a piezoresistive type or a capacitive type. The acceleration sensor 142 outputs acceleration data to the control unit 170.

[0040] The wireless communication unit 150 is implemented by, for example, a wireless LAN such as Wi-Fi (registered trademark) or a communication module compatible with Bluetooth (registered trademark). The wireless communication unit 150 is a communication interface that manages the communication of information with the control unit 10 of the substrate processing device 1.

[0041] The storage unit 160 is implemented by a storage device such as a semiconductor memory element like RAM or flash memory. The storage unit 160 stores images captured by the camera 120, as well as the image acquisition location and acquisition date and time associated with the images. The storage unit 160 also stores information (programs and data) used for processing in the control unit 170.

[0042] The control unit 170 is implemented, for example, by a CPU or MPU (Micro Processing Unit) executing a program stored in its internal memory using RAM as the working area. Alternatively, the control unit 170 may be implemented by an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array).

[0043] The control unit 170 controls various parts of the monitoring board 100. The control unit 170 detects the position of the monitoring board 100 based on direction data and acceleration data input from the gyro sensor 141 and the acceleration sensor 142. For example, the control unit 170 detects the direction of movement of the monitoring board 100 based on the direction data. The control unit 170 also detects the distance traveled by the monitoring board 100, the start of movement (acceleration), movement in progress (constant speed), and stopping (deceleration) based on the acceleration data. Furthermore, the control unit 170 may detect the holding of the monitoring board 100 by pins (not shown) in the mounting sections S7, S8, etc., or by a pick 31a, etc., based on the waveform of the acceleration data. In other words, by using the gyro sensor 141 and the acceleration sensor 142, the control unit 170 can estimate its own position even in situations where radio waves cannot reach from the outside.

[0044] For example, when the monitoring board 100 detects a stop inside the processing room PM1, the control unit 170 activates the camera 120 and controls the light source 130 to turn on. The control unit 170 controls the camera 120 to capture images of the inside of the processing room PM1 and stores the captured images in the storage unit 160, associating them with the position of the monitoring board 100 and the date and time of capture. At this time, the position of the monitoring board 100 to be associated with the image is, for example, the position of a module unit such as the processing room PM1. In other words, the control unit 170 tags the image with the position and date and time of capture. Furthermore, the captured image may be a still image or a moving image.

[0045] The control unit 170 controls the camera 120 to stop and the light source 130 to turn off after a predetermined time has elapsed. Subsequently, when the monitoring board 100 is transported to the loader module LM, which is in an atmospheric environment, the control unit 170 controls the wireless communication unit 150 to transmit the image stored in the storage unit 160 to the control unit 10 of the board processing device 1. At this time, the control unit 170 controls the wireless communication unit 150 to start transmitting the image, triggered by, for example, the wireless communication unit 150 being able to connect with the control unit 10 of the board processing device 1.

[0046] The battery 180 supplies power to the camera 120, light source 130, gyro sensor 141, acceleration sensor 142, wireless communication unit 150, memory unit 160, and control unit 170, etc.

[0047] The heat pipe 190 connects the camera 120, the light source 130, the gyro sensor 141, and the accelerometer 142. The heat pipe 190 may also connect the wireless communication unit 150, the memory unit 160, the control unit 170, and the battery 180. The heat pipe 190 is arranged inside the substrate 110 in a spiral pattern, as shown in Figure 2, for example. Note that the arrangement of the heat pipe 190 is not limited to a spiral pattern; other arrangements, such as a zigzag pattern, are also possible.

[0048] The heat pipe 190 diffuses the heat absorbed by the camera 120 and light source 130, which are exposed on the surface of the monitoring substrate 100, into the interior of the monitoring substrate 100. The heat pipe 190 also diffuses the heat absorbed by the gyro sensor 141, acceleration sensor 142, wireless communication unit 150, memory unit 160, control unit 170, and battery 180 through thermal conduction into the interior of the monitoring substrate 100. In other words, the heat pipe 190 is positioned to equalize the temperature of areas within the monitoring substrate 100 where no devices are present with the temperature of areas where each device, such as the camera 120, light source 130, gyro sensor 141, and acceleration sensor 142, is present. By using the heat pipe 190, imaging with the camera 120 is possible even in processing chambers PM1 to PM6 at elevated temperatures (e.g., 750°C). Note that the heat pipe 190 is an example of a heat conductive member or a heat capacity member.

[0049] [Transport path for monitoring board 100] Next, using Figures 5 to 7, the transport path when imaging inside the processing room PM1 and the position of the monitoring substrate 100 during imaging will be explained. Figure 5 is a diagram showing an example of the transport path for the monitoring substrate. As shown in Figure 5, for example, the monitoring substrate 100 is transported from the load port LP2 through the alignment device 50, the load lock room LLM1, and the transport room VTM, via the transport path 200 to the processing room PM1. Also, for example, after imaging the inside of the processing room PM1, the monitoring substrate 100 is transported from the processing room PM1 to the load port LP2, traveling in the reverse direction along the transport path 200. Note that, after imaging, the transport path 200 does not necessarily have to pass through the alignment device 50.

[0050] The monitoring substrate 100, stored in the carrier C of the load port LP2, is held by the pick 41a of the first arm 41 of the transport device 40 and removed from the carrier C. The removed monitoring substrate 100 moves through the loader module LM and is transported to the alignment device 50, where it is aligned. The monitoring substrate 100 is again held by the pick 41a and moves through the loader module LM, passing through the open gate valve GV9 and being placed on the mounting section S7 of the load lock chamber LLM1 in an atmospheric environment. In the load lock chamber LLM1, after the gate valve GV9 is closed, the interior is switched to a vacuum atmosphere and the gate valve GV7 is opened.

[0051] Figure 6 shows an example of the position of the monitoring substrate immediately before being transported into the processing chamber. The monitoring substrate 100 is held by the pick 31a of the first arm 31 of the transport device 30 and transported to just before the gate valve GV1 of the transport chamber VTM, as shown in Figure 6. Since the temperature inside the processing chamber PM1 is high, for example, 750°C, it is necessary to minimize the time it takes to transport the monitoring substrate 100 into the processing chamber PM1. At this point, the control unit 170 of the monitoring substrate 100 detects that it is in a standby state just before the processing chamber PM1 based on the data from the position detection sensor 140.

[0052] Figure 7 shows an example of the position of the monitoring substrate when imaging the inside of the processing chamber. As shown in Figure 7, when the gate valve GV1 is opened, the monitoring substrate 100 held by the pick 31a is moved up to the top of the mounting section S1. The control unit 170 of the monitoring substrate 100 detects its own stop based on the data from the position detection sensor 140, and controls the camera 120 and light source 130 to image the inside of the processing chamber PM1, and stores the image, imaging position, and shooting date and time in the storage unit 160. At this time, the monitoring substrate 100 is not placed on the mounting section S1, but remains held by the pick 31a. After a predetermined time has elapsed, the monitoring substrate 100 is removed from the processing chamber PM1 and transported to the front of the processing chamber PM1 as shown in Figure 6. In other words, the monitoring substrate 100 completes imaging the inside of the processing chamber PM1 within a predetermined time and is quickly removed from the processing chamber PM1, so that the thermal effects due to the high temperature of the processing chamber PM1 can be minimized. Subsequently, the monitoring board 100 is transported in the reverse direction along the transport path 200 to the load port LP2.

[0053] [Monitoring method] Next, the monitoring process according to this embodiment will be described. Figure 8 is a flowchart showing an example of the monitoring process in this embodiment.

[0054] In the monitoring process according to this embodiment, first, monitoring is performed using a monitoring substrate 100 in the operating substrate processing apparatus 1, that is, for example, between lots of wafers W to be processed. The control unit 10 of the substrate processing apparatus 1 controls each part of the substrate processing apparatus 1 to transport the monitoring substrate 100 from one of the load ports LP1 to LP3 to one of the processing chambers PM1 to PM6 to be monitored (step S101). That is, the control unit 10 controls the substrate processing apparatus 1 to transport the monitoring substrate 100 to a part of the substrate processing apparatus 1 that is in a vacuum atmosphere.

[0055] The control unit 170 of the monitoring board 100 detects the stopping of either the first arm 31 or the second arm 32, which it holds, within the transported processing chamber PM, based on data from the position detection sensor 140 (step S102). Upon detecting the stopping of either the first arm 31 or the second arm 32, the control unit 170 controls the camera 120 and the light source 130 to image the inside of the transported processing chamber PM (step S103). In other words, the control unit 170 controls the camera 120 and the light source 130 to capture an image based on the position of the monitoring board 100 detected by the position detection sensor 140. The control unit 170 stores the position where the stopping of either the first arm 31 or the second arm 32 was detected as the image capture position, along with the date and time of capture, in the storage unit 160, associating it with the captured image (step S104). That is, the control unit 170 stores the position of the monitoring board 100 where the image was captured, associating it with the image, in the storage unit 160.

[0056] The control unit 10 of the substrate processing apparatus 1 controls each part of the substrate processing apparatus 1 to transport the monitoring substrate 100 from the processing chamber PM, where the monitoring substrate 100 was brought in, to the transport chamber VTM after a predetermined time has elapsed (step S105). The control unit 10 controls each part of the substrate processing apparatus 1 to transport the monitoring substrate 100 to the loader module LM (step S106). In other words, the control unit 10 controls each part of the substrate processing apparatus 1 to transport the monitoring substrate 100 to a part of the substrate processing apparatus 1 that is in an atmospheric environment. That is, the monitoring substrate 100 is transported to a location where its own wireless communication unit 150 and the control unit 10 of the substrate processing apparatus 1 can communicate wirelessly.

[0057] When the control unit 170 of the monitoring board 100 detects that the wireless communication unit 150 can communicate with the control unit 10, it controls the wireless communication unit 150 to transmit the image stored in the storage unit 160 to the control unit 10 of the board processing device 1 (step S107). The transmitted image also includes the image acquisition location and date and time of acquisition associated with the image. In other words, when the board is transported to a part of the atmosphere, the control unit 170 controls the wireless communication unit 150 to transmit the stored image to the board processing device 1 via wireless communication.

[0058] When the control unit 10 of the substrate processing apparatus 1 receives an image from the monitoring substrate 100, it estimates the cleaning time based on the received image (step S108). The cleaning here refers to, for example, dry cleaning. The control unit 10 estimates the cleaning time based on, for example, the RGB values ​​and brightness values ​​of the received image. For example, the lower the RGB values ​​and brightness values ​​of the image, that is, the darker the image's colors, the closer the cleaning time is estimated to be. As an estimation method, for example, threshold values ​​for the RGB values ​​and brightness values ​​of the image to be cleaned are predetermined, and the value at which the RGB values ​​and brightness values ​​decrease per process is determined, for example, from experimental results. Based on the RGB values ​​and brightness values ​​of the received image, the threshold values ​​for the RGB values ​​and brightness values ​​to be cleaned, and the value at which the RGB values ​​and brightness values ​​decrease per process, the control unit 10 can estimate how many more processes can be performed. Furthermore, the estimation method may also incorporate other information such as process conditions and the degradation status of the upper electrodes.

[0059] The control unit 10 displays the name of the processing room where the image was captured, the image itself, and the estimated cleaning time on a display unit (not shown), for example. This allows for the acquisition of images that more accurately estimate maintenance timings, such as cleaning times, while maintaining the vacuum atmosphere of the processing room PM. Furthermore, maintenance timings can be estimated more accurately based on the acquired images. In addition, because maintenance timings can be estimated more accurately, maintenance man-hours and downtime of the substrate processing device 1 can be reduced, and the overall maintenance can be optimized.

[0060] [Display screen example] Here, the display screen will be explained using Figure 9. Figure 9 is a diagram showing an example of a display screen that displays an captured image and an estimated cleaning time. The display screen 210 shown in Figure 9 has three regions: region 211, region 212, and region 213. Region 211 is the region where the image captured by the camera 121 on the upper surface 111 side of the monitoring substrate 100 is displayed. Images captured by multiple cameras 121 may be combined and displayed in region 211. In addition, outside the upper frame of region 211, for example, "PM1" and "Chamber Upper Photograph" are displayed to indicate where the image was taken. In this case, it indicates that the image of the upper part of the processing chamber PM1 is displayed in region 211.

[0061] Area 212 is the area where images captured by the camera 122 on the lower surface 112 side of the monitoring substrate 100 are displayed. Images captured by multiple cameras 122 may be combined and displayed in area 212. In addition, outside the upper frame of area 212, the location from which the image was captured is indicated, for example, "Lower Chamber Photograph". In this case, it indicates that the image displayed in area 212 is an image of the lower part of the processing chamber PM1, captured in the same monitoring process as the image displayed in area 211.

[0062] The images displayed in regions 211 and 212 show that the darker the color, the more reaction byproducts are deposited inside the chamber. In the example of display screen 210, it can be seen that a large amount of reaction byproducts are deposited on the upper part of the chamber, for example, the upper electrode, while not many are deposited on the lower part of the chamber, for example, the mounting section S1. If there are areas in the image where the color intensity is uneven, for example, the average value of the RGB or brightness values ​​of the entire image, or the RGB or brightness values ​​of a specific location may be used as indicators.

[0063] Area 213 displays the estimated cleaning time. Area 213 may display, for example, "** more processes possible until Dry Cleaning." The cleaning time can be estimated, for example, by the estimation method described above. Alternatively, the cleaning time may be estimated by correcting an estimated value based on the number of processes and processing conditions, based on the RGB and brightness values ​​of the image. This correction can be performed, for example, by determining the color of the top of the chamber according to the amount of reaction byproducts based on the number of processes and processing conditions, and comparing the determined color with the color of the captured image.

[0064] In the embodiment described above, the imaging direction of the camera 120 was set to the vertical direction, but this is not the only option. For example, the imaging direction of one or more of the cameras 120 may be set to the horizontal direction. This allows, for example, observation of the condition of the side walls inside the processing chamber PM.

[0065] Furthermore, although processing chambers PM1 to PM6 were described as one example of imaging locations in the above embodiment, the imaging locations are not limited to these. For example, the load lock chambers LLM1 to LLM2, transport chamber VTM, and gate valves GV1 to GV10 on the transport path 200 may also be used as imaging locations. In other words, the monitoring substrate 100 can image the inside of the substrate processing apparatus 1 in a vacuum atmosphere. Similarly, the monitoring substrate 100 can also image the inside of the substrate processing apparatus 1 in an atmospheric atmosphere.

[0066] As described above, according to this embodiment, the monitoring substrate 100 is a monitoring substrate that monitors the inside of the substrate processing apparatus 1, and includes a position detection sensor 140 for detecting the position of the monitoring substrate 100, a camera 120 for imaging the inside of the substrate processing apparatus 1 which is in a vacuum atmosphere, a light source 130 for illuminating the inside of the substrate processing apparatus 1, a storage unit 160 for storing the image captured by the camera 120, and a control unit 170 for controlling the camera 120 and the light source 130. As a result, images can be obtained to estimate the maintenance timing more accurately. In other words, since images of the inside of the substrate processing apparatus 1 can be captured, the maintenance timing can be estimated more accurately.

[0067] Furthermore, according to this embodiment, the position detection sensor 140 is a gyro sensor 141 and an acceleration sensor 142. As a result, the monitoring board 100 can detect its own position and determine the timing of image capture.

[0068] Furthermore, according to this embodiment, the interior of the substrate processing apparatus 1 is the interior of the chambers (processing chambers PM1 to PM6) that process the substrate (wafer W). As a result, the interior of the chambers can be imaged.

[0069] Furthermore, according to this embodiment, the camera 120 is positioned to capture images of one or more of the mounting platforms (mounting sections S1 to S6) and upper electrodes located inside the chamber. As a result, images of one or more of the mounting platforms and upper electrodes can be captured.

[0070] Furthermore, according to this embodiment, the control unit 170 controls the camera 120 and light source 130 to capture an image based on the position of the monitoring substrate 100 detected by the position detection sensor 140. As a result, an image can be captured at a desired position inside the substrate processing apparatus 1.

[0071] Furthermore, according to this embodiment, the control unit 170 stores the position of the monitoring board 100 on which the image was captured in the storage unit 160, associating it with the image. As a result, the location where the image was captured can be easily determined.

[0072] Furthermore, according to this embodiment, the monitoring board 100 also has a heat conductive member or heat capacity member (heat pipe 190) that connects the position detection sensor 140, the camera 120, and the light source 130. As a result, the heat from these can be diffused into the interior of the monitoring board 100.

[0073] Furthermore, according to this embodiment, the heat conductive member or heat capacity member is arranged to equalize the temperature inside the monitoring substrate 100 with the temperatures of the position detection sensor 140, camera 120, and light source 130. As a result, it is possible to ensure operating time in the high-temperature environment of the chamber (processing chambers PM1 to PM6).

[0074] Furthermore, according to this embodiment, the monitoring substrate 100 also has a wireless communication unit 150 that communicates wirelessly with the substrate processing device 1. As a result, the captured image can be transmitted to the substrate processing device 1.

[0075] Furthermore, according to this embodiment, the control unit 170 controls the wireless communication unit 150 to transmit the stored image to the substrate processing device 1 when the monitoring substrate 100 is transported to an atmospheric environment. As a result, the captured image can be transmitted to the substrate processing device 1 at the moment when communication becomes possible between the monitoring substrate 100 and the substrate processing device 1.

[0076] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various forms without departing from the scope and spirit of the appended claims.

[0077] Furthermore, although the above-described embodiment uses the case where the substrate is a semiconductor wafer as an example, it is not limited to this. For example, the substrate may be a glass substrate, an LCD substrate, etc., and the shape of the monitoring substrate 100 may also be changed as appropriate.

[0078] Furthermore, this disclosure can also be structured as follows: (1) A monitoring board for monitoring the inside of a substrate processing device, A position detection sensor for detecting the position of the monitoring board, A camera for imaging the inside of the substrate processing apparatus, which is in a vacuum atmosphere, A light source for illuminating the inside of the substrate processing apparatus, A storage unit that stores images captured by the aforementioned camera, A control unit that controls the camera and the light source, A monitoring board having [a certain feature]. (2) The position detection sensor is a gyroscope and an acceleration sensor. The monitoring board described in (1) above. (3) The interior of the substrate processing apparatus is the interior of the chamber that processes the substrate. The monitoring board described in (1) or (2) above. (4) The camera is positioned to capture images from one or more of the mounting platform and upper electrodes located inside the chamber. The monitoring board described in (3) above. (5) The control unit is configured to control the camera and the light source to capture an image based on the position of the monitoring substrate detected by the position detection sensor. A monitoring board as described in any one of (1) to (4) above. (6) The control unit is configured to store the position of the monitoring board on which the image was captured in the storage unit in association with the image. The monitoring board described in (5) above. (7) Furthermore, the system has a heat conductive member or heat capacitive member connecting the position detection sensor, the camera, and the light source. A monitoring board as described in any one of (1) to (6) above. (8) The heat conductive member or the heat capacity member is arranged to equalize the temperature inside the monitoring substrate with the temperatures of the position detection sensor, the camera, and the light source. The monitoring board described in (7) above. (9) Furthermore, it has a wireless communication unit that communicates wirelessly with the substrate processing apparatus, A monitoring board as described in any one of (1) to (8) above. (10) The control unit is configured to control the wireless communication unit to transmit the stored image to the substrate processing device when the monitoring substrate is transported to an atmospheric environment. The monitoring board described in (9) above. (11) Furthermore, a heat conductive member or heat-capacitating member is provided to connect the position detection sensor, the camera, and the light source, and to equalize the internal temperature of the monitoring board with the temperatures of the position detection sensor, the camera, and the light source. The substrate processing apparatus and the wireless communication unit that performs wireless communication are provided. The control unit, The system is configured to control the camera and the light source to capture the image based on the position of the monitoring substrate detected by the position detection sensor. The system is configured to store the position of the monitoring board on which the image was captured in the storage unit in correspondence with the image. The wireless communication unit is configured to control the transmission of the stored image to the substrate processing device when the monitoring substrate is transported to an atmospheric environment. The monitoring board described in (1) above. (12) A monitoring method for a monitoring substrate used to monitor the inside of a substrate processing apparatus, The aforementioned monitoring board is A position detection sensor for detecting the position of the monitoring board, A camera for imaging the inside of the substrate processing apparatus, which is in a vacuum atmosphere, A light source for illuminating the inside of the substrate processing apparatus, A storage unit that stores images captured by the aforementioned camera, The substrate processing apparatus and a wireless communication unit that performs wireless communication are provided. The substrate processing apparatus transports the monitoring substrate to a portion of the substrate processing apparatus's interior that is in a vacuum atmosphere. The monitoring board captures an image based on the position of the monitoring board detected by the position detection sensor. The monitoring board stores the position of the monitoring board on which the image was captured in the storage unit, in association with the image. The substrate processing apparatus transports the monitoring substrate to a portion of the interior of the substrate processing apparatus that is in an atmospheric environment. When the monitoring substrate is transported to the area that is in the atmosphere of air, the stored image is transmitted to the substrate processing device via wireless communication. The substrate processing apparatus includes estimating the timing of cleaning based on the RGB values ​​and brightness values ​​of the received image. Monitoring method. [Explanation of symbols]

[0079] 1. Substrate processing device 10 Control Unit 30,40 Conveyor equipment 50 Alignment device 100 Monitoring board 110 circuit boards 120, 121, 122 Cameras 130,131,132 light source 140 Position detection sensors 141 Gyroscope Sensor 142 Accelerometer 150 Wireless Communication Section 160 Storage section 170 Control Unit 180 batteries 190 Heat Pipe GV1~GV10 Gate Valve LLM1~LLM2 Load Lock Room LM Loader Module LP1~LP3 Load Port PM1-PM6 Processing Room S1~S8 Mounting section VTM transport room W wafer

Claims

1. A monitoring board for monitoring the inside of a substrate processing device, A position detection sensor for detecting the position of the monitoring board, A camera for imaging the inside of the substrate processing apparatus, which is in a vacuum atmosphere, A light source for illuminating the inside of the substrate processing apparatus, A storage unit that stores images captured by the aforementioned camera, A control unit that controls the camera and the light source, A heat conductive member or heat-capacitating member that diffuses heat received from the outside into the interior of the monitoring substrate, A monitoring board having [a certain feature].

2. The heat conductive member or the heat capacity member connects the position detection sensor, the camera, and the light source. The monitoring substrate according to claim 1.

3. The heat conductive member or the heat capacity member is arranged to equalize the temperature inside the monitoring substrate with the temperatures of the position detection sensor, the camera, and the light source. The monitoring substrate according to claim 2.

4. A monitoring board for monitoring the inside of a substrate processing device, A position detection sensor for detecting the position of the monitoring board, A camera for imaging the inside of the substrate processing apparatus, which is in a vacuum atmosphere, A light source for illuminating the inside of the substrate processing apparatus, A storage unit that stores images captured by the aforementioned camera, A control unit that controls the camera and the light source, The substrate processing apparatus and the wireless communication unit that performs wireless communication are provided. The control unit is configured to control the wireless communication unit to transmit the stored image to the substrate processing device when the monitoring substrate is transported to an atmospheric environment. Monitoring board.

5. The control unit stores the captured image in the storage unit, associating it with the position of the monitoring board and the date and time of capture. A monitoring substrate according to claim 1 or 4.

6. A monitoring method for a monitoring substrate used to monitor the inside of a substrate processing apparatus, A step of detecting the position of the monitoring board, A process for controlling the camera and light source, A step of imaging the inside of the substrate processing apparatus, which is in a vacuum atmosphere, using the camera, A step of diffusing heat received from the outside into the interior of the monitoring substrate using a heat conductive member or a heat capacity member, A method for monitoring with a tactile pausing device.

7. The above detection step involves detecting the position of the monitoring substrate using a position detection sensor. The heat conductive member or the heat capacity member connects the position detection sensor, the camera, and the light source. The monitoring method according to claim 6.

8. The aforementioned diffusion step involves diffusing heat received from the outside in order to equalize the temperature inside the monitoring substrate with the temperatures of the position detection sensor, the camera, and the light source. The monitoring method according to claim 7.

9. A monitoring method for a monitoring substrate used to monitor the inside of a substrate processing apparatus, A step of detecting the position of the monitoring board, A process for controlling the camera and light source, A step of imaging the inside of the substrate processing apparatus, which is in a vacuum atmosphere, using the camera, A step of storing the image captured by the aforementioned camera, When the monitoring substrate is transported to an atmospheric environment, the stored image is transmitted to the substrate processing device. A method for monitoring with a tactile pausing device.

10. The storage step involves storing the captured image in association with the position and date and time of the monitoring board. The monitoring method according to claim 9.

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