Method for manufacturing a light-emitting device

Abstract

To provide a highly reliable method for manufacturing light-emitting devices. [Solution] The method includes the steps of preparing a structure comprising: a base; a first light source unit having a base, a first substrate located on the upper surface of the base, one or more first light-emitting parts disposed on the first upper surface of the first substrate, and a first photocurable adhesive provided at a position surrounding the first light-emitting parts; and a second light source unit adjacent to the first light source unit having a second substrate, a second light-emitting part disposed on the second upper surface of the second substrate, and a second photocurable adhesive provided at a position surrounding the second light-emitting parts; placing a first translucent member to be bonded to the first upper surface on the first upper surface using a mounting jig / transportation holding jig having a first side surface; and a first photocuring step of curing the first photocurable adhesive by irradiating it with light while the first translucent member is held down by the mounting jig described above, wherein the first photocuring step includes a first light-shielding part located between the first light source unit and the second light source unit on the first side surface.

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing a light-emitting device. [Background technology]

[0002] For example, Patent Document 1 discloses a method of curing a photocurable resin applied to the outer edge of an adhesive part or the mounting area of ​​an object to be bonded by irradiating it with light while holding the adhesive part in place. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2012-007075 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] The embodiments described herein aim to provide a method for manufacturing a highly reliable light-emitting device. [Means for solving the problem]

[0005] A method for manufacturing a light-emitting device according to one embodiment of the present disclosure is a step of preparing a structure, comprising: a base having an upper surface; a first light source unit having a first substrate located on the upper surface of the base, one or more first light-emitting units disposed on the first upper surface of the first substrate, and an uncured first photocurable adhesive provided on the first upper surface at a position surrounding the one or more first light-emitting units; and a second light source unit having a second substrate located on the upper surface of the base, one or more second light-emitting units disposed on the second upper surface of the second substrate, and an uncured second photocurable adhesive provided on the second upper surface at a position surrounding the one or more second light-emitting units, adjacent to the first light source unit. The process includes: preparing a structure comprising a source unit; placing a first translucent member, which includes a first lower surface facing the first upper surface and bonded to the first upper surface via the first photocurable adhesive, on the first upper surface using a mounting jig transport holding jig having a first side surface; and a first photocuring step of curing the uncured first photocurable adhesive provided on the first upper surface by irradiating it with light while the first translucent member is held down by the mounting jig described above, wherein the mounting jig described above has a first light-shielding portion provided on the first side surface and located between the first light source unit and the second light source unit in the first photocuring step. [Effects of the Invention]

[0006] According to embodiments of this disclosure, a method for manufacturing a highly reliable light-emitting device can be provided. [Brief explanation of the drawing]

[0007] [Figure 1] This is a flowchart showing a method for manufacturing a light-emitting device according to the first embodiment. [Figure 2] This is a schematic top view of a structure illustrating the process of preparing the structure in the manufacturing method of a light-emitting device according to the first embodiment. [Figure 3] This is a schematic cross-sectional view of the line III-III in Figure 2. [Figure 4] Figure 2 shows a schematic cross-sectional view of the line IV-IV. [Figure 5]It is a schematic top view of a structure and a mounting jig for explaining a step of arranging a first light-transmissive member in a method for manufacturing a light-emitting device according to a first embodiment. [Figure 6] It is a schematic cross-sectional view taken along line VI-VI in FIG. 5. [Figure 7] It is a schematic cross-sectional view of a structure and a mounting jig for explaining a first photocuring step in a method for manufacturing a light-emitting device according to a first embodiment. [Figure 8] It is a schematic cross-sectional view of a structure and a mounting jig for explaining the action of an inner light-shielding portion provided in a mounting jig in a method for manufacturing a light-emitting device according to a first embodiment. [Figure 9] It is a flowchart showing a method for manufacturing a light-emitting device according to a second embodiment. [Figure 10] It is a schematic top view showing a structure and a mounting jig in a method for manufacturing a light-emitting device according to a second embodiment. [Figure 11] It is a schematic cross-sectional view taken along line XI-XI in FIG. 10. [Figure 12] It is a schematic cross-sectional view taken along line XII-XII in FIG. 10. [Figure 13] It is a schematic cross-sectional view of a structure and a mounting jig for explaining a step of arranging a third light-transmissive member in a method for manufacturing a light-emitting device according to a second embodiment. [Figure 14] It is a schematic cross-sectional view of a structure and a mounting jig for explaining the configuration of a first light-transmissive member in a method for manufacturing a light-emitting device according to a first modification. [Figure 15] It is a schematic cross-sectional view of a structure and a mounting jig for explaining the configuration of a mounting jig in a method for manufacturing a light-emitting device according to a second modification. [Figure 16] It is a schematic cross-sectional view of a structure and a mounting jig for explaining the configuration of a mounting jig in a method for manufacturing a light-emitting device according to a third modification.

Embodiments for Carrying Out the Invention

[0008] A manufacturing method of a light-emitting device according to an embodiment of the present disclosure will be described in detail with reference to the drawings. However, the following embodiments are merely examples of a manufacturing method of a light-emitting device for embodying the technical idea of the present embodiment, and are not limited thereto. In addition, dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present disclosure only to a specific form, and are merely illustrative examples, unless there is a description to limit to only a specific form. Note that the sizes and positional relationships of the members shown in each drawing may be exaggerated for clarity of explanation. In the following description, the same names and reference numerals indicate the same or similar members, and detailed descriptions will be appropriately omitted. As a cross-sectional view, an end view showing only the cut surface may be used.

[0009] In the following figures, the directions may be indicated by the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis are directions perpendicular to each other. The X-direction along the X-axis and the Y-direction along the Y-axis shall indicate the directions along the light-emitting surface of the light-emitting portion included in the light-emitting device according to the embodiment. The Z-direction along the Z-axis shall indicate the direction perpendicular to the light-emitting surface. That is, the light-emitting surface of the light-emitting portion is parallel to the XY plane, and the Z-axis is perpendicular to the XY plane.

[0010] The direction in which the arrow points in the X-direction is denoted as the +X side, and the opposite side of the +X side is denoted as the -X side. The direction in which the arrow points in the Y-direction is denoted as the +Y side, and the opposite side of the +Y side is denoted as the -Y side. The direction in which the arrow points in the Z-direction is denoted as the +Z side, and the opposite side of the +Z side is denoted as the -Z side. The Z-direction is the direction along the normal line of the light-emitting surface of the light-emitting portion in the manufacturing method of the light-emitting device according to the embodiment. In addition, the top view in the terms of the embodiment means looking at the object from the +Z side. In this specification, in addition to the portions that can be directly visually recognized from above, for portions that cannot be directly visually recognized from above, the term top view may be used to describe as if they can be seen through. However, these do not limit the orientation during the use of the manufacturing method of the light-emitting device according to the embodiment, and the orientation during the use of the manufacturing method of the light-emitting device according to the embodiment is arbitrary.

[0011] In the embodiments described below, "along the X, Y, and Z axes" includes the object having an inclination within ±10° of these axes. Furthermore, in these embodiments, "orthogonal" may include an error of ±10° from 90°. "Placing" is not limited to direct contact, but also includes indirect placement, such as through other components.

[0012] In this specification or in the claims, when there are multiple components and each is to be expressed separately, the components may be distinguished by adding "1st," "2nd," etc., to their names. Furthermore, the objects being distinguished may differ between this specification and the claims. Therefore, even if a component with the same designation as in this specification is described in the claims, the objects identified by this component may not be the same in this specification and the claims.

[0013] For example, if there are components in this specification that are distinguished by being designated as "1st," "2nd," and "3rd," and the claims include components designated as "1st" and "3rd" in this specification, or components designated as "1st" and components without a specific ordinal number included in the claims, then for readability, the claims may be designated as "1st" and "2nd" to distinguish the components. In this case, the components designated as "1st" and "2nd" in the claims refer to the components designated as "1st" and "3rd" in this specification, or components without a specific ordinal number included, respectively. Note that this rule is not limited to components, but can be applied reasonably and flexibly to other objects as well.

[0014] [First Embodiment] <Method for manufacturing a light-emitting device according to the first embodiment> A method for manufacturing a light-emitting device according to the first embodiment will be described with reference to Figures 1 to 7.

[0015] Figure 1 is a flowchart showing a method for manufacturing a light-emitting device according to the first embodiment. The method for manufacturing a light-emitting device according to this embodiment includes a step of preparing a structure 100 (S11), a step of arranging a first light-transmitting member 24-1 (S12), and a first photocuring step (S13) of irradiating an uncured first photocurable adhesive 23-1 with light to cure it.

[0016] (S11: Process of preparing structure 100) The process (S11) for preparing the structure 100 will be described with reference to Figures 2 to 4. Figure 2 is a schematic top view of the structure 100 illustrating the process (S11) for preparing the structure 100. Figure 3 is a schematic cross-sectional view taken along line III-III in Figure 2. Figure 4 is a schematic cross-sectional view taken along line IV-IV in Figure 2.

[0017] In S11, the structure 100 is prepared. As shown in Figures 2 and 3, the structure 100 includes a base 1 having an upper surface 10, a first light source unit 2-1 located on the upper surface 10 of the base 1, and a second light source unit 2-2 located on the upper surface 10 of the base 1. The first light source unit 2-1 includes a first substrate 21-1, one or more first light-emitting units 22-1 arranged on the first upper surface 210-1 of the first substrate 21-1, and an uncured first photocurable adhesive 23-1 provided on the first upper surface 210-1 in a position surrounding the one or more first light-emitting units 22-1. The second light source unit 2-2 includes a second substrate 21-2, one or more second light-emitting units 22-2 arranged on the second upper surface 210-2 of the second substrate 21-2, and an uncured second photocurable adhesive 23-2 provided on the second upper surface 210-2 at a position surrounding the one or more second light-emitting units 22-2. The structure 100 may be prepared by acquisition, including purchase. The individual components of the structure 100 will be described in detail below.

[0018] (Base 1) The base 1 is a plate-shaped member used to manufacture multiple light-emitting devices. The base 1 is made up of a metal material or the like. However, the base 1 may also be made up of a resin material or the like. In the example shown in Figure 2, the first light source unit 2-1 and the second light source unit 2-2 are placed side by side in the X direction on the upper surface 10 of the base 1. Also, the shape of the base 1 in a top view is a roughly rectangular shape with the X direction, where the first light source unit 2-1 and the second light source unit 2-2 are aligned, as its longest side. However, the shape of the base 1 in a top view is not limited to a roughly rectangular shape and can be changed as appropriate.

[0019] (1st light source section 2-1) Since the first light source unit 2-1 and the second light source unit 2-2 can have the same configuration, the configuration of the first light source unit 2-1 will be described below as representative. However, the first light source unit 2-1 and the second light source unit 2-2 do not necessarily have the same configuration and may have different configurations. The first light source unit 2-1 comprises a first substrate 21-1, one or more first light-emitting units 22-1, and a first photocurable adhesive 23-1.

[0020] (First board 21-1) The first substrate 21-1 of the first light source unit 2-1 is a plate-shaped member equipped with wiring on which various electronic components can be mounted. In the example shown in Figure 2, the outer shape of the first substrate 21-1 in a top view is approximately circular. However, the outer shape of the first substrate 21-1 in a top view may be approximately rectangular, approximately elliptical, or approximately polygonal, etc.

[0021] In the example shown in Figure 2, four first light-emitting units 22-1, a first electronic component 25-1, and a second electronic component 26-1 are mounted on the first upper surface 210-1 of the first substrate 21-1. The first electronic component 25-1 and the second electronic component 26-1 are Zener diodes, thermistors, capacitors, light-receiving sensors, etc. Protective members are placed on top of the first electronic component 25-1 and the second electronic component 26-1 to protect them.

[0022] The first substrate 21-1 preferably uses an insulating material as its base material, and it is preferable to use a material that does not easily transmit light emitted from the first light-emitting part 22-1 or ambient light. Furthermore, it is preferable to use a material that has a certain strength for the first substrate 21-1. Specifically, the first substrate 21-1 can be constructed using ceramics such as alumina, aluminum nitride, mullite, and silicon nitride, or resins such as phenolic resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide, and polyester resin as its base material.

[0023] (First light-emitting section 22-1) In the example shown in Figure 2, the first light source unit 2-1 has four first light-emitting units 22-1, each containing a light-emitting surface 221. The four first light-emitting units 22-1 are arranged vertically, horizontally, or in a matrix when viewed from above. In the example shown in Figure 2, two first light-emitting units 22-1 are aligned along the X-axis, and two first light-emitting units 22-1 are aligned along the Y-axis. However, the number and arrangement of the first light-emitting units 22-1 can be changed as appropriate. Since all four first light-emitting units 22-1 have the same configuration, Figure 4 shows a representative cross-section of one first light-emitting unit 22-1. However, the four first light-emitting units 22-1 do not necessarily have the same configuration and may have different configurations.

[0024] Each of the four first light-emitting units 22-1 emits light from its light-emitting surface 221 upwards toward the first light source unit 2-1. The first light-emitting unit 22-1 includes the light-emitting surface 221 on its upper surface, and the side opposite to the light-emitting surface 221 is used as the mounting surface, and is positioned on the first upper surface 210-1 of the first substrate 21-1. In the example shown in Figure 4, the first light-emitting unit 22-1 includes a light-emitting element 222, a wavelength conversion member 224 positioned above the light-emitting element 222, and a covering member 225 that covers the sides of the light-emitting element 222 and the wavelength conversion member 224, respectively. The sides of the light-emitting element 222 and the wavelength conversion member 224 are each covered by the covering member 225. This configuration reduces light leakage from the sides of the light-emitting element 222 and the wavelength conversion member 224, allowing light to be efficiently extracted from the light-emitting surface 221, thereby increasing the light extraction efficiency of the first light-emitting unit 22-1.

[0025] The first light-emitting unit 22-1 includes a light-emitting element 222 and a wavelength conversion member 224, allowing it to emit mixed light of the color of light emitted from the light-emitting element 222 and the color of light emitted from the wavelength conversion member 224. The combination of the light-emitting element 222 and the wavelength conversion member 224 in the first light-emitting unit 22-1 increases the degree of freedom in the color of the light emitted from the first light-emitting unit 22-1.

[0026] The light-emitting element 222 has at least one pair of positive and negative electrodes 223 on the side opposite to the light-emitting surface 221 (i.e., the bottom surface). Various semiconductors are available, such as III-V compound semiconductors and II-VI compound semiconductors. As for semiconductors, In X Al Y Ga 1-X-Y It is preferable to use nitride semiconductors such as N(0≦X, 0≦Y, X+Y≦1), and InN, AlN, GaN, InGaN, AlGaN, InGaAlN, etc. can also be used. The light-emitting element 222 is, for example, an LED or an LD (Laser Diode). The emission peak wavelength of the light-emitting element 222 is preferably 400 nm to 530 nm, more preferably 420 nm to 490 nm, and even more preferably 450 nm to 475 nm, from the viewpoint of luminous efficiency and excitation of the wavelength conversion material described later.

[0027] The wavelength conversion member 224 is, for example, a substantially rectangular member in a top view. The wavelength conversion member 224 is provided so as to cover the upper surface of the light-emitting element 222. The wavelength conversion member 224 contains a wavelength conversion substance that wavelength-converts at least a part of the light from the light-emitting element 222. The wavelength conversion member 224 can be formed using a translucent resin material, an inorganic substance such as ceramics or glass. As the resin material, thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, epoxy-modified resin, and phenolic resin can be used. In particular, a silicone resin or its modified resin having excellent light resistance and heat resistance is suitable. Here, the translucency preferably means transmitting 60% or more of the light from the light-emitting element 222. Also, the wavelength conversion member 224 can be formed using thermoplastic resins such as polycarbonate resin, acrylic resin, methylpentene resin, and polynorbornene resin. For example, the wavelength conversion member 224 may be a material in which a wavelength conversion substance is contained in a resin material, ceramics, glass, etc., or a sintered body of the wavelength conversion substance. Further, the wavelength conversion member 224 may contain a light diffusion substance described later in the above resin. Also, the wavelength conversion member 224 may be a multilayer structure in which a resin layer containing a wavelength conversion substance or a light diffusion substance is disposed on the ±Z side surface of a molded body of resin, ceramics, glass, etc.

[0028] Examples of the wavelength conversion substance contained in the wavelength conversion member 224 include yttrium aluminum garnet-based phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (e.g., Ca8MgSi4O 16(Cl2:Eu), silicate phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β - sialon phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α - sialon phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu), etc., oxynitride phosphors, LSN phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA phosphors (e.g., SrLiAl3N4:Eu), CASN phosphors (e.g., CaAlSiN3:Eu) or SCASN phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc., nitride phosphors, KSF phosphors (e.g., K2SiF6:Mn), KSAF phosphors (e.g., K2(Si 1-x Al x )F 6-x :Mn where 0 < x < 1. ), or fluoride phosphors such as MGF phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II - VI group quantum dots (e.g., CdSe), III - V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2), etc. can be used. The above wavelength - converting substances are particles. Also, one of these wavelength - converting substances can be used alone, or two or more of these wavelength - converting substances can be used in combination.

[0029] For example, the first light-emitting unit 22-1 uses a blue LED as the light-emitting element 222, and the wavelength conversion member 224 includes a wavelength conversion material that converts the light emitted from the light-emitting element 222 to yellow. As a result, the first light source unit 2-1, which includes the first light-emitting unit 22-1, emits white light. Depending on the intended use of the light-emitting device, the wavelength or chromaticity of the light emitted from the first light source unit 2-1 may be appropriately selected. The wavelength conversion member 224 may also include a light-diffusing material. Examples of light-diffusing materials include titanium oxide, barium titanate, aluminum oxide, and silicon oxide.

[0030] The covering member 225 is a member that covers the sides of the light-emitting element 222 and the wavelength conversion member 224. The covering member 225 directly or indirectly covers the sides of the light-emitting element 222 and the wavelength conversion member 224. The covering member 225 also integrally holds a plurality of light-emitting elements 222 and a plurality of wavelength conversion members 224. In Figure 4, the upper surface of the wavelength conversion member 224 is exposed from the covering member 225 and is the light-emitting surface 221 of the first light-emitting section 22-1. The covering member 225 is preferably made of a material with high light reflectivity in order to improve light extraction efficiency. For example, the covering member 225 can be made of a resin material containing a light-reflective substance such as a white pigment. Alternatively, the covering member 225 may be a light-reflective member made of an inorganic material containing, for example, boron nitride or alkali metal silicate. In this case, it may further contain titanium oxide or zirconium oxide.

[0031] Examples of light-reflecting materials include titanium dioxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, silicon oxide, etc. It is preferable to use one of these alone or two or more of them in combination. Furthermore, as the resin material, it is preferable to use a resin material mainly composed of thermosetting resins such as epoxy resin, epoxy-modified resin, silicone resin, silicone-modified resin, and phenolic resin as the base material. The coating member 225 may be composed of a material that is transparent to or absorbs visible light as needed. The absorbent material includes, for example, carbon black.

[0032] The first light source unit 2-1 is electrically connected to the wiring 212 provided on the first substrate 21-1. The first substrate 21-1 has wiring 212 on its surface. The first substrate 21-1 may also have wiring 212 inside. The first light source unit 2-1 and the first substrate 21-1 are electrically connected by connecting the wiring 212 of the first substrate 21-1 to at least one pair of positive and negative electrodes 223 of the light-emitting element 222 via a conductive member 213. The configuration and size of the wiring 212 of the first substrate 21-1 are set according to the configuration and size of the electrodes 223 of the light-emitting element 222.

[0033] (First photocurable adhesive 23-1) The first photocurable adhesive 23-1 is an adhesive used to fix the first translucent member 24-1, described below, to the first upper surface 210-1 of the first substrate 21-1. In this embodiment, the first photocurable adhesive 23-1 is an adhesive containing a photocurable, for example, ultraviolet light-curable resin material. In the example shown in Figure 2, the first photocurable adhesive 23-1 is continuously provided on the first upper surface 210-1 in a substantially circular shape in a top view, in the outer edge region of the first substrate 21-1, surrounding the four first light-emitting parts 22-1. However, the first photocurable adhesive 23-1 is not limited to being provided continuously; it may also be provided intermittently with gaps between applications.

[0034] (S12: Step of placing the first light-transmitting member 24-1) Next, the step of arranging the first light-transmitting member 24-1 (S12) will be described with reference to Figures 5 and 6. Figure 5 is a schematic top view of the structure 100 and mounting jig 3 illustrating the step of arranging the first light-transmitting member 24-1 (S12) in the manufacturing method of the light-emitting device according to the first embodiment. Figure 6 is a schematic cross-sectional view taken along the line VI-VI in Figure 5. Note that in Figure 5, the top surface of the mounting jig is omitted in order to clearly show the positional relationship between the mounting jig and the various internal components.

[0035] In S12, the first translucent member 24-1, which includes a first lower surface 240-1 facing the first upper surface 210-1 and bonded to the first upper surface 210-1 via the first photocurable adhesive 23-1, is placed on the first upper surface 210-1 using the mounting jig 3.

[0036] The first light-transmitting member 24-1 is a member composed of, for example, a resin material or glass material that is light-transmitting to visible light. The first light-transmitting member 24-1 may include various forms such as a flat plate, a biconvex lens, a plano-convex lens, a biconcave lens, a plano-concave lens, a meniscus lens, a Fresnel lens, a diffractive lens, a lens array, a spherical lens, or an aspherical lens.

[0037] The mounting jig 3 is a jig used to position the first light-transmitting member 24-1 on the first upper surface 210-1. As shown in Figures 5 and 6, the mounting jig 3 has a first side surface 31 and a first light-shielding section 310 provided on the first side surface 31, which is located between the first light source section 2-1 and the second light source section 2-2 in the first light-curing step (S13) described below. In the example shown in Figures 5 and 6, the mounting jig 3 also has a second opening 33-2 provided on the first side surface 31, a second side surface 32 located on the opposite side of the first side surface 31, and a first opening 33-1 provided on the second side surface 32. Furthermore, the mounting jig 3 has an inner light-shielding portion 34 positioned between the first opening 33-1 and the second opening 33-2 inside the mounting jig 3, and a third side surface 33 that intersects with the first side surface 31 and the second side surface 32, respectively.

[0038] The mounting jig 3 is constructed by including a metal material or resin material that has light-shielding properties against the light used to cure the first photocurable adhesive 23-1. In the example shown in Figure 5, the mounting jig 3 has a U-shape with an inner space when viewed from above. A third side surface 33 is positioned on the -Y side of the first light-emitting part 22-1, and the opposite side of the third side surface 33, i.e., the +Y side of the first light-emitting part 22-1, is open.

[0039] An inner light-shielding section 34 is positioned in the inner space of the mounting jig 3. In a top view, the inner light-shielding section 34 is an X-shaped portion that extends diagonally within the inner space of the mounting jig 3. In the example shown in Figure 5, the inner light-shielding section 34 is connected to the vicinity of the ends of the first side surface 31, the second side surface 32, and the third side surface 33. However, the shape of the mounting jig 3 can be appropriately changed depending on the shape of the first translucent member 24-1 to be mounted, the form of the light source that emits light to cure the first photocurable adhesive 23-1, etc.

[0040] In the example shown in Figure 6, the first side surface 31 includes a first light-shielding portion 310, a first side surface connecting portion 311, and a first side surface upper portion 312 located above the first side surface connecting portion 311 and connected to the first light-shielding portion 310 via the first side surface connecting portion 311. The second opening 33-2 is provided in the first side surface upper portion 312.

[0041] The first light-shielding portion 310 is a plate-shaped portion extending in the Y and Z directions. The first light-shielding portion 310 is positioned offset to the +X side from the first upper side surface 312. In the first light-curing step (S13) described below, the first light-shielding portion 310 is located between the first light source unit 2-1 and the second light source unit 2-2. The size and thickness of the first light-shielding portion 310 are determined to be sufficient to reduce the amount of light that cures the first photocurable adhesive 23-1 irradiated onto the second photocurable adhesive 23-2 in the second light source unit 2-2 during the first light-curing step (S13).

[0042] The second side surface 32 includes a second side surface connection portion 321 and a second side surface upper portion 322 located above the second side surface connection portion 321 and connected to the second side surface connection portion 321. The first opening 33-1 is provided in the second side surface upper portion 322.

[0043] The mounting jig 3 holds the first translucent member 24-1 by bringing the first connecting lower surface 313 of the first side connecting portion 311 and the second connecting lower surface 323 of the second side connecting portion 321 into contact with the upper surface 241-1 of the first translucent member 24-1 in order to position the first translucent member 24-1 on the first upper surface 210-1. For example, the mounting jig 3 can hold the first translucent member 24-1 by air suction using one or more air suction holes formed in the first connecting lower surface 313 and the second connecting lower surface 323. Furthermore, the mounting jig 3 is connected to a moving mechanism and is movable by the moving mechanism.

[0044] The mounting jig 3 moves by its moving mechanism to the position where the first translucent member 24-1 is placed. After reaching this position, it brings the first connecting lower surface 313 and the second connecting lower surface 323 into contact with the upper surface 241-1 of the first translucent member 24-1, and holds the first translucent member 24-1 by air suction. Then, while holding the first translucent member 24-1, the mounting jig 3 moves by its moving mechanism to a position on the first photocurable adhesive 23-1 placed on the first upper surface 210-1 of the first substrate 21-1. After reaching this position, the mounting jig 3 brings the first lower surface 240-1 of the held first translucent member 24-1 into contact with the first photocurable adhesive 23-1, and places the first translucent member 24-1 on the first upper surface 210-1. In this way, in S12, the first translucent member 24-1 can be placed on the first upper surface 210-1 using the mounting jig 3. In the manufacturing method of the light-emitting device according to this embodiment, after placing the first translucent member 24-1 on the first upper surface 210-1, the process proceeds to the next first photocuring step (S13) while the first translucent member 24-1 is held down by the mounting jig 3.

[0045] (S13: 1st light curing step) The first photocuring process (S13) will be described with reference to Figure 7. Figure 7 is a schematic cross-sectional view of the structure 100 and mounting jig 3 illustrating the first photocuring process (S13). Note that Figure 7 shows a schematic cross-section of the structure 100 and mounting jig 3 corresponding to the line VI-VI in Figure 5.

[0046] In step S13, with the first translucent member 24-1 positioned on the first upper surface 210-1 held down by the mounting jig 3, light is irradiated onto the uncured first photocurable adhesive 23-1 provided on the first upper surface 210-1 to cure it.

[0047] In the example shown in Figure 7, the light L1 that cures the first photocurable adhesive 23-1 is irradiated onto the first photocurable adhesive 23-1 through the first aperture 33-1. Similarly, the light L2 that cures the first photocurable adhesive 23-1 is irradiated onto the first photocurable adhesive 23-1 through the second aperture 33-2. Note that the dashed arrow in Figure 7 indicates a portion of the light L1 that irradiates the first photocurable adhesive 23-1 through the first aperture 33-1. Similarly, the dashed arrow in Figure 7 indicates a portion of the light irradiated onto the first photocurable adhesive 23-1 through the second aperture 33-2. In subsequent examples, a portion of the light may also be represented by an arrow.

[0048] Light L1 and light L2 are light emitted from a light source that emits ultraviolet light. From the viewpoint of appropriately irradiating a desired location with ultraviolet light emitted from the light source, it is preferable that the ultraviolet light emitted from the light source is guided to the first aperture 33-1 and the second aperture 33-2 using a light guide or other light guide member.

[0049] In the example shown in Figure 7, the first opening 33-1 and the second opening 33-2 are open. Light L1 enters the mounting jig 3 from the outside by passing through the first opening 33-1. A portion of the light L1 that enters the mounting jig 3 passes through the first light-transmitting member 24-1 and irradiates the first photocurable adhesive 23-1. The first photocurable adhesive 23-1 irradiated with light L1 hardens. A plate-like member that is light-transmitting to the light that hardens the first photocurable adhesive 23-1 may be placed in the first opening 33-1. In this case, the light L1 passes through the plate-like member placed in the first opening 33-1 and enters the mounting jig 3 from the outside.

[0050] Light L2 passes through the second opening 33-2 and enters the mounting jig 3 from the outside to the inside. A portion of the light L2 that enters the mounting jig 3 passes through the first light-transmitting member 24-1 and irradiates the first photocurable adhesive 23-1. The first photocurable adhesive 23-1 irradiated with light L2 hardens. In addition, a plate-like member that is light-transmitting to the light that hardens the first photocurable adhesive 23-1 may be placed in the second opening 33-2. In this case, light L2 passes through the plate-like member placed in the second opening 33-2 and enters the mounting jig 3 from the outside to the inside.

[0051] The direction of light incident from the outside to the inside of the mounting jig 3 is not limited to the two directions from which light L1 and light L2 are incident. For example, in Figure 5, light may be incident from four directions: the first side surface 31, the second side surface 32, the third side surface 33, and the open area on the +Y side, and irradiated onto the first photocurable adhesive 23-1.

[0052] The first light-transmitting member 24-1 is fixed to the first substrate 21-1 by bonding the first lower surface 240-1 of the first light-transmitting member 24-1 to the first upper surface 210-1 of the first substrate 21-1 and by curing the first light-curable adhesive 23-1.

[0053] After the first translucent member 24-1 is fixed to the first substrate 21-1, the mounting jig 3 stops air adsorption of the first translucent member 24-1. Subsequently, the mounting jig 3 moves by the movement mechanism and, after separating from the first translucent member 24-1, returns to its initial position if the manufacturing method of the light-emitting device is to be completed. If the manufacturing method of the light-emitting device is to be continued, the mounting jig 3 moves by the movement mechanism and moves toward the position where the translucent members other than the first translucent member 24-1 are placed in order to hold those translucent members.

[0054] In this embodiment, the light-emitting device can be manufactured as described above.

[0055] <Effects and Effects of the Method for Manufacturing a Light-Emitting Device According to the First Embodiment> In this embodiment, during the first photocuring step (S13), the first light-shielding section 310 is positioned between the first light source unit 2-1 and the second light source unit 2-2. As a result, the light directed from the second light source unit 2-2 toward the second photocurable adhesive 23-2, out of the light irradiated onto the first photocurable adhesive 23-1, is blocked by the first light-shielding section 310. Consequently, in this embodiment, the amount of light irradiated onto the uncured second photocurable adhesive 23-2 is reduced. Furthermore, by reducing the amount of light irradiated onto the uncured second photocurable adhesive 23-2, the curing of the uncured second photocurable adhesive 23-2 at an unintended timing can be reduced.

[0056] In this embodiment, the first light-curable adhesive 23-1 is cured while the first light-transmitting member 24-1 is held in place by the mounting jig 3. As a result, the first light-transmitting member 24-1 is fixed to the first substrate 21-1 while positioned in a predetermined location. Consequently, in this embodiment, the first light-transmitting member 24-1 can be positioned and fixed with high positional accuracy relative to the first light-emitting unit 22-1.

[0057] The mounting jig 3 has a second side surface 32 and a first opening 33-1. In the first photocuring step (S13), the light that cures the first photocurable adhesive 23-1 is irradiated onto the first photocurable adhesive 23-1 through the first opening 33-1. By passing the light that cures the first photocurable adhesive 23-1 through the first opening 33-1 provided on the second side surface 32, the light is more easily irradiated onto the uncured first photocurable adhesive 23-1 located on the side where the first side surface 31 is located. In addition, of the light that enters through the first opening 33-1 and irradiates the first photocurable adhesive 23-1, the light directed toward the second photocurable adhesive 23-2 of the second light source unit 2-2 is blocked by the first light shielding unit 310. This makes it easier for the light irradiated onto the first photocurable adhesive 23-1 to irradiate the uncured first photocurable adhesive 23-1, while reducing the amount of light irradiated onto the uncured second photocurable adhesive 23-2. Furthermore, by making it easier for the light to irradiate the uncured first photocurable adhesive 23-1, a larger amount of light is irradiated onto the first photocurable adhesive 23-1, shortening the curing time of the first photocurable adhesive 23-1.

[0058] The mounting jig 3 has a second opening 33-2 provided on the first side surface 31, and an inner light-shielding portion 34 positioned between the first opening 33-1 and the second opening 33-2 inside the mounting jig 3. Here, Figure 8 is a schematic cross-sectional view of the structure 100 and the mounting jig 3 illustrating the function of the inner light-shielding portion 34. Note that Figure 8 shows a schematic cross-section of the structure 100 and the mounting jig 3 corresponding to the line VI-VI in Figure 5.

[0059] As shown in Figure 8, in the first photocuring step (S13), of the light that enters the interior of the mounting jig 3 through the first opening 33-1, the light L1a that travels toward the second opening 33-2 is blocked by the inner light-shielding portion 34. This reduces the amount of light L1a traveling toward the second opening 33-2 that exits the mounting jig 3 through the second opening 33-2 and irradiates the uncured second photocurable adhesive 23-2. As a result, the amount of light irradiated onto the uncured second photocurable adhesive 23-2 that is directed towards the first photocurable adhesive 23-1 is reduced.

[0060] Lights L1 and L2 pass through the first aperture 33-1 or the second aperture 33-2 and enter the mounting jig 3 from the outside into the inside. By placing the light source outside the mounting jig 3 and directing the light towards the inside of the mounting jig 3, an optical lens for light control becomes unnecessary, compared to a mounting jig in which the light source is located inside, as shown in, for example, Japanese Patent Application Publication No. 2012-007075, making it easier to make the mounting jig smaller. In addition, by placing the light source outside the mounting jig 3, the number of light sources and the direction of irradiation of the light sources can be set with a high degree of freedom. Furthermore, it is preferable that the light source has a light-gathering structure. By irradiating the photocurable adhesive with the focused light, the intensity of the light from the light source can be increased, and the curing time of the photocurable adhesive can be shortened. Furthermore, since the mounting jig 3 is equipped with a first light-shielding section 310, etc., even if light is incident from the outside, it is possible to reduce the amount of light that irradiates, for example, the first photocurable adhesive 23-1, which irradiates the uncured second photocurable adhesive 23-2, etc.

[0061] [Second Embodiment] <Manufacturing method for a light-emitting device according to the second embodiment> Next, a method for manufacturing a light-emitting device according to the second embodiment will be described with reference to Figures 9 to 13. Note that names and reference numerals identical to those used in the previously described embodiments indicate the same or identical components or configurations, and detailed explanations will be omitted as appropriate. This also applies to the modifications described hereafter.

[0062] Figure 9 is a flowchart illustrating the manufacturing method of the light-emitting device according to the second embodiment. Figure 10 is a schematic top view showing the structure 100a and mounting jig 3a in the manufacturing method of the light-emitting device according to the second embodiment. Figure 11 is a schematic cross-sectional view taken along line XI-XI in Figure 10. Figure 12 is a schematic cross-sectional view taken along line XII-XII in Figure 10. Figure 13 is a schematic cross-sectional view of the structure 100a and mounting jig 3a illustrating the process of arranging the third translucent member 24-3 in the manufacturing method of the light-emitting device according to the second embodiment. Note that Figure 13 shows schematic cross-sections of the structure 100a and mounting jig 3a corresponding to line XI-XI in Figure 10.

[0063] In the manufacturing method of the light-emitting device according to this embodiment, the structure 100a prepared in S21 of Figure 9 includes a third light source unit 2-3 located on the upper surface 10 of the base 1, which is different from the structure 100 in the manufacturing method of the light-emitting device according to the first embodiment.

[0064] Furthermore, in the manufacturing method of the light-emitting device according to this embodiment, the mounting jig 3a used in S22, S24, and S26 of Figure 9 has a second light-shielding portion 320 located between the first light source unit 2-1 and the third light source unit 2-3, and a third light-shielding portion 330 provided on the second side surface 32, which is different from the mounting jig 3 in the manufacturing method of the light-emitting device according to the first embodiment.

[0065] Furthermore, the method for manufacturing the light-emitting device according to this embodiment differs from the method for manufacturing the light-emitting device according to the first embodiment in that it includes a step of arranging the second light-transmitting member 24-2 (S24), a second photo-curing step (S25), a step of arranging the third light-transmitting member 24-3 (S26), and a third photo-curing step (S27).

[0066] In the example shown in Figure 10, the third light source unit 2-3 includes a third substrate 21-3 and one or more third light-emitting units 22-3 arranged on the third upper surface 210-3 of the third substrate 21-3. The third light source unit 2-3 also includes an uncured third photocurable adhesive 23-3 provided on the third upper surface 210-3 at a position surrounding one or more third light-emitting units 22-3. The third light source unit 2-3 is adjacent to the first light source unit 2-1 in the second direction Y which is orthogonal to the first direction X. The second light source unit 2-2 is adjacent to the first light source unit 2-1 in the first direction X. The one or more third light-emitting units 22-3 are four third light-emitting units 22-3. The four third light-emitting units 22-3 are arranged in a 2x2 matrix. However, the number and arrangement of the third light-emitting units 22-3 can be changed as appropriate.

[0067] Structure 100a includes a fourth light source unit 2-4, a fifth light source unit 2-5, a sixth light source unit 2-6, a seventh light source unit 2-7, an eighth light source unit 2-8, and a ninth light source unit 2-9. In other words, structure 100a has nine light source units. The nine light source units are arranged in a 3x3 matrix on the upper surface 10 of the base 1.

[0068] The fourth light source unit 2-4 is located furthest to the +Y and -X side of the nine light sources. The fifth light source unit 2-5 is located on the +X side of the fourth light source unit 2-4. The sixth light source unit 2-6 is located on the +X side of the fifth light source unit 2-5. The seventh light source unit 2-7 is located on the -Y side of the fourth light source unit 2-4. The first light source unit 2-1 is located on the +X side of the seventh light source unit 2-7. The second light source unit 2-2 is located on the +X side of the first light source unit 2-1. The eighth light source unit 2-8 is located on the -Y side of the seventh light source unit 2-7. The third light source unit 2-3 is located on the -Y side of the first light source unit 2-1. The ninth light source unit 2-9 is located on the +X side of the third light source unit 2-3.

[0069] The fourth light source unit 2-4 has the fourth light-transmitting member 24-4 fixed to it. The fifth light source unit 2-5 has the fifth light-transmitting member 24-5 fixed to it. The sixth light source unit 2-6 has the sixth light-transmitting member 24-6 fixed to it. The seventh light source unit 2-7 has the seventh light-transmitting member 24-7 fixed to it. The first light source unit 2-1 has the first light-transmitting member 24-1 positioned inside it.

[0070] In the example shown in Figure 10, the mounting jig 3a holds each translucent member one by one and moves to the +X side and -Y side respectively, placing the translucent member in the light source corresponding to that member. Note that in Figure 10, only the first light-shielding part 310, the second light-shielding part 320, and the third light-shielding part 330 of the mounting jig 3a are shown. With the translucent member held in place by the mounting jig 3a, light is irradiated onto the uncured photocurable adhesive to cure it, and the translucent member is fixed to the light source.

[0071] In the example shown in Figure 10, first, the fourth light-transmitting member 24-4 is fixed to the fourth light source unit 2-4. Then, the fifth light source unit 2-5, the sixth light source unit 2-6, the seventh light source unit 2-7, and the first light source unit 2-1 are fixed in that order, with the corresponding fifth light-transmitting member 24-5, sixth light-transmitting member 24-6, seventh light-transmitting member 24-7, and first light source unit 2-1 being fixed to them respectively.

[0072] (S23: 1st light curing step) In step S23, with the first translucent member 24-1 positioned on the first upper surface 210-1 held down by the mounting jig 3a, light is irradiated onto the uncured first photocurable adhesive 23-1 provided on the first upper surface 210-1 to cure it.

[0073] At this time, as shown in Figure 11, the second light-shielding section 320 is positioned between the first light-emitting section 2-1 and the third light-emitting section 2-3. In the example shown in Figure 11, the third side surface 33 includes the second light-shielding section 320, the third side surface connection section 331, and the upper part of the third side surface 332, which is located above the third side surface connection section 331 and connects to the second light-shielding section 320 via the third side surface connection section 331. The third opening 33-3 is provided in the upper part of the third side surface 332.

[0074] The second light-shielding portion 320 is a plate-shaped portion extending in the X and Z directions. The second light-shielding portion 320 is positioned offset to the -Y side from the upper part of the third side surface 332. By positioning the second light-shielding portion 320 offset to the -Y side from the upper part of the third side surface 332, it can be positioned between the first light source unit 2-1 and the third light source unit 2-3 in the first light curing step (S23). The size and thickness of the second light-shielding portion 320 are determined to be sufficient to reduce the amount of light irradiated onto the first light curable adhesive 23-1 by the light irradiated onto the uncured third light curable adhesive 23-3 of the third light source unit 2-3.

[0075] The third light-shielding portion 330 is a plate-shaped portion extending in the Y and Z directions. The third light-shielding portion 330 is positioned offset to the -X side from the upper part of the second side surface 322. By positioning the third light-shielding portion 330 offset to the -X side from the upper part of the second side surface 322, it can be positioned between the first light source unit 2-1 and the seventh light source unit 2-7 in the first photocuring step (S23). By positioning the third light-shielding portion 330, in the first photocuring step (S23), the light L3 that is irradiated onto the first photocurable adhesive 23-1 and directed toward the eighth light source unit 2-8, indicated by the dashed arrow in Figure 10, can be prevented from irradiating the uncured eighth photocurable adhesive 23-8. Note that the light L3 in Figure 10 represents light that does not reach the eighth photocurable adhesive 23-8 because it is shielded by the third light-shielding portion 330. The size and thickness of the third light-shielding portion 330 are determined to be sufficient to reduce the amount of light that irradiates the first light-curing adhesive 23-1 onto the uncured eighth light-curing adhesive 23-8 of the eighth light source portion 2-8.

[0076] The first light-transmitting member 24-1 is fixed to the first substrate 21-1 by bonding the first lower surface 240-1 of the first light-transmitting member 24-1 to the first upper surface 210-1 of the first substrate 21-1 and by curing the first photocurable adhesive 23-1. The light irradiated onto the first photocurable adhesive 23-1 is incident from four directions, for example, the first opening 33-1, the second opening 33-2, the third opening 33-3, and the surface facing the third opening 33-3.

[0077] (S24: Step of placing the second light-transmitting member 24-2) In step S24, as shown in Figure 12, the second translucent member 24-2, which includes a second lower surface 240-2 facing the second upper surface 210-2 and bonded to the second upper surface 210-2 via a second photocurable adhesive 23-2, is placed on the second upper surface 210-2 using a mounting jig 3a.

[0078] (S25: 2nd light curing process) In step S25, with the second translucent member 24-2 positioned on the second upper surface 210-2 held down by the mounting jig 3a, the uncured second photocurable adhesive 23-2 provided on the second upper surface 210-2 is irradiated with light to cure it.

[0079] The second light-transmitting member 24-2 is fixed to the second substrate 21-2 by bonding the second lower surface 240-2 of the second light-transmitting member 24-2 to the second upper surface 210-2 of the second substrate 21-2 and by curing the second photocurable adhesive 23-2. The light irradiated onto the second photocurable adhesive 23-2 is incident from four directions, for example, the first opening 33-1, the second opening 33-2, the third opening 33-3, and the surface facing the third opening 33-3.

[0080] (S26: Step of placing the third light-transmitting member 24-3) In S24, as shown in Figure 13, the third translucent member 24-3, which includes a third lower surface 240-3 facing the third upper surface 210-3 and bonded to the third upper surface 210-3 via a third photocurable adhesive 23-3, is placed on the third upper surface 210-3 using a mounting jig 3a.

[0081] (S27: 3rd light curing process) In S27, with the third translucent member 24-3 positioned on the third upper surface 210-3 held down by the mounting jig 3a, the uncured third photocurable adhesive 23-3 provided on the third upper surface 210-3 is irradiated with light to cure it.

[0082] The third light-transmitting member 24-3 is fixed to the third substrate 21-3 by bonding the third lower surface 240-3 of the third light-transmitting member 24-3 to the third upper surface 210-3 of the third substrate 21-3 and by curing the third photocurable adhesive 23-3. The light irradiated onto the third photocurable adhesive 23-3 is incident from four directions, for example, the first opening 33-1, the second opening 33-2, the third opening 33-3, and the surface facing the third opening 33-3.

[0083] In this embodiment, the step of placing the second translucent member 24-2 on the second upper surface 210-2 using the mounting jig 3a (S24) is performed after the first photocuring step (S23). Also, the step of placing the third translucent member 24-3 on the third upper surface 210-3 using the mounting jig 3a (S26) is performed after the second photocuring step (S25).

[0084] Since the step of placing the second light-transmitting member 24-2 (S24) is performed after the first light-curing step (S23), when the step of placing the second light-transmitting member 24-2 (S24) is performed, the first light-curable adhesive 23-1 of the first light source unit 2-1 adjacent to the second light source unit 2-2 has already cured. Therefore, even if light is irradiated to cure the second light-curable adhesive 23-2 of the second light source unit 2-2 in the second light-curing step (S25) after placing the second light-transmitting member 24-2, it is possible to avoid affecting the first light-curable adhesive 23-1 of the first light source unit 2-1.

[0085] Furthermore, since the step of placing the third light-transmitting member 24-3 (S26) is performed after the second photocuring step (S25), when the step of placing the third light-transmitting member 24-3 (S26) is performed, the second photocurable adhesive 23-2 of the second light source unit 2-2 adjacent to the third light source unit 2-3 has already cured. Therefore, even if light is irradiated to cure the third photocurable adhesive 23-3 of the third light source unit 2-3 in the third photocuring step (S27) after placing the third light-transmitting member 24-3, it is possible to avoid affecting the second photocurable adhesive 23-2 of the second light source unit 2-2.

[0086] <Effects and Effects of the Method for Manufacturing a Light-Emitting Device According to the Second Embodiment> In this embodiment, the mounting jig 3a has a second light-shielding section 320 located between the first light source unit 2-1 and the third light source unit 2-3 during the first photocuring step (S23). As a result, during the first photocuring step (S23), the light that irradiates the second photocurable adhesive 23-2 and is directed toward the uncured third photocurable adhesive 23-3 from the third light source unit 2-3 is blocked by the second light-shielding section 320. Consequently, during the first photocuring step (S23), the amount of light irradiated onto the uncured third photocurable adhesive 23-3 by the light irradiated onto the first photocurable adhesive 23-1 can be reduced. Furthermore, by reducing the amount of light irradiated onto the uncured third photocurable adhesive 23-3 by the light irradiated onto the first photocurable adhesive 23-1, the curing of the uncured third photocurable adhesive 23-3 at an unintended timing can be reduced.

[0087] The mounting jig 3a has a third light-shielding portion 330 provided on the second side surface 32. As a result, in the first photocuring step (S23), the light that is irradiated onto the first photocurable adhesive 23-1 and directed toward the uncured eighth photocurable adhesive 23-8 is blocked by the third light-shielding portion 330. This reduces the amount of light that is irradiated onto the first photocurable adhesive 23-1 onto the uncured eighth photocurable adhesive 23-8 located on the eighth light source 2-8 side.

[0088] Other effects and advantages of the manufacturing method of the light-emitting device according to the second embodiment are the same as those of the manufacturing method of the light-emitting device according to the first embodiment.

[0089] [Differentiation] The following describes some modified examples of the method for manufacturing the light-emitting device according to the embodiment.

[0090] (First variation) Figure 14 is a schematic cross-sectional view of the structure 100 and mounting jig 3 illustrating the configuration of the first translucent member 24-1 in the manufacturing method of the light-emitting device according to the first modified example. Note that Figure 14 shows a schematic cross-section of the structure 100 and mounting jig 3 corresponding to the line VI-VI in Figure 5.

[0091] In this modified example, the first light-transmitting member 24-1 includes a light-transmitting portion 241 and a support portion 242 that supports the light-transmitting portion 241, and at least a part of the support portion 242 has light-shielding properties, which is different from the manufacturing method of the light-emitting device according to the first embodiment.

[0092] For example, light irradiated onto the first photocurable adhesive 23-1 of the first light source unit 2-1 may pass through a portion of the first translucent member 24-1 and exit the mounting jig 3, irradiating the uncured second photocurable adhesive 23-2 in the second light source unit 2-2 adjacent to the first light source unit 2-1. For example, light that has passed through the lower part of the first translucent member 24-1 may leak out of the mounting jig 3 through the gap between the lower end 243 of the mounting jig 3 and the upper surface 10 of the base 1, irradiating the uncured second photocurable adhesive 23-2 in the second light source unit 2-2. Irradiation of the uncured second photocurable adhesive 23-2 with light may cause the second photocurable adhesive 23-2 to harden at an unintended time.

[0093] In this modified example, the support portion 242 positioned on the lower part of the first light-transmitting member 24-1 has light-shielding properties. This reduces the amount of light that leaks out of the mounting jig 3 through the gap between the lower end 243 of the mounting jig 3 and the upper surface 10 of the base 1. As a result, the amount of light irradiated onto the uncured second light-curable adhesive 23-2 that is irradiated onto the first light-curable adhesive 23-1 is reduced, and the curing of the second light-curable adhesive 23-2 at an unintended time is reduced.

[0094] The support portion 242 is composed of, for example, a light-reflecting substance such as titanium oxide that reflects light used to cure the first photocurable adhesive 23-1, or a light-absorbing substance such as carbon black that absorbs light. The first light-transmitting member 24-1 can be manufactured by two-color molding of a light-transmitting resin material and a light-shielding resin material. By using two-color molding, the manufacturing efficiency of the first light-transmitting member 24-1 can be increased.

[0095] (Second variation) Figure 15 is a schematic cross-sectional view of the structure 100 and the mounting jig 3 illustrating the configuration of the mounting jig 3 in the manufacturing method of the light-emitting device according to the second modified example. Note that Figure 15 shows a schematic cross-section of the structure 100 and the mounting jig 3 corresponding to the line VI-VI in Figure 5.

[0096] In this modified example, the first light-curing step differs from the manufacturing method of the light-emitting device according to the first modified example in that, in a cross-section including a central axis 24C that passes through the center of the first light-transmitting member 24-1 in a top view and extends in a direction along the normal to the upper surface 10 of the base 1, the first light-shielding portion 310 covers the entire side surface 244 of the light-transmitting portion 241.

[0097] Even if the support portion 242 has light-shielding properties, light irradiated onto the first photocurable adhesive 23-1 of the first light source portion 2-1 may pass through the inside of the light-transmitting portion 241 and exit from the side 244, etc., and leak out to the outside of the mounting jig 3 through the space between the lower end 243 of the mounting jig 3 and the upper surface 10 of the base 1. The leaked light may irradiate the uncured second photocurable adhesive 23-2 of the second light source portion 2-2. If the uncured second photocurable adhesive 23-2 is irradiated, the second photocurable adhesive 23-2 may harden at an unintended time.

[0098] In this modified example, the first light-shielding portion 310 covers the entire side surface 244 of the light-transmitting portion 241. As a result, light emitted from the side surface 244 of the light-transmitting portion 241 is blocked by the first light-shielding portion 310. This reduces the leakage of light emitted from the side surface 244 of the light-transmitting portion 241 to the outside of the mounting jig 3 through the space between the lower end 243 of the mounting jig 3 and the upper surface 10 of the base 1, thereby reducing the curing of the second light-curable adhesive 23-2 at an unintended timing.

[0099] (Third variation) Figure 16 is a schematic cross-sectional view of the structure 100 and the mounting jig 3 illustrating the configuration of the mounting jig 3 in the manufacturing method of the light-emitting device according to the third modified example. Note that Figure 16 shows a schematic cross-section of the structure 100 and the mounting jig 3 corresponding to the line VI-VI in Figure 5.

[0100] In this modified example, in the direction from the inside to the outside of the first translucent member 24-1 when viewed from above, the thickness t1 of the opposing portion 314 of the first light-shielding portion 310 that faces the side surface 244 of the light-transmitting portion 241 is greater than the thickness t2 of the portion 315 located below the opposing portion 314 of the first light-shielding portion 310, which is different from the manufacturing method of the light-emitting device according to the first modified example.

[0101] For example, the thicker the first light-shielding portion 310 is in the direction from the inside to the outside of the first translucent member 24-1 when viewed from above, the better the light-shielding performance of the first light-shielding portion 310. This reduces the amount of light that irradiates the first photocurable adhesive 23-1 onto the second photocurable adhesive 23-2. On the other hand, if the thickness of the first light-shielding portion 310 is thick, the first light-shielding portion 310 interferes with a part of the second light source unit 2-2 adjacent to the first light source unit 2-1, making it impossible to narrow the gap between the first light source unit 2-1 and the second light source unit 2-2. If the gap between the first light source unit 2-1 and the second light source unit 2-2 cannot be narrowed, the number of light-emitting devices that can be manufactured using one base 1 will decrease, resulting in lower manufacturing efficiency for light-emitting devices.

[0102] In this modified example, the thickness t1 of the opposing portion 314 is greater than the thickness t2 of the portion 315 located below the opposing portion 314. This allows the opposing portion 314, from which light irradiated onto the first photocurable adhesive 23-1 is more likely to leak, to be made thicker compared to the case where thicknesses t1 and t2 are equal, thereby improving light shielding. Furthermore, because thickness t2 is thinner than thickness t1, interference between a portion of the second light source unit 2-2 adjacent to the first light source unit 2-1 and the first light shielding portion 310 is reduced compared to the case where thicknesses t1 and t2 are equal, allowing the distance between the first light source unit 2-1 and the second light source unit 2-2 to be narrowed. A narrower distance between the first light source unit 2-1 and the second light source unit 2-2 allows for a greater number of light-emitting devices to be manufactured using one base 1. As a result, the manufacturing efficiency of the light-emitting devices is increased. Thus, in this modified example, the manufacturing efficiency of the light-emitting devices can be increased while improving the light shielding performance of the first light shielding portion 310.

[0103] In this modified example, the first translucent member 24-1 has a flange portion 245 that includes the first lower surface 240-1 and the outer edge G of the first translucent member 24-1 in a top view. In a side view with the first translucent member 24-1 positioned on the first upper surface 210-1 pressed down by the mounting jig 3, the lower end 243 of the first light-shielding portion 310 overlaps with the flange portion 245. In the example shown in Figure 16, in a side view of the mounting jig 3 from the +X direction, the lower end 243 of the first light-shielding portion 310 overlaps with the flange portion 245.

[0104] For example, in a side view of the mounting jig 3 from the +X direction, if the lower end 243 of the first light-shielding portion 310 and the flange portion 245 do not overlap, and the lower end 243 of the first light-shielding portion 310 is located above, for example, on the +Z side, then the light irradiated onto the first light-curable adhesive 23-1 may pass between the lower end 243 of the first light-shielding portion 310 and the flange portion 245 and irradiate the second light-curable adhesive 23-2.

[0105] In this modified example, in a side view of the mounting jig 3 from the +X direction, the lower end 243 of the first light-shielding portion 310 and the flange portion 245 overlap. As a result, the light irradiated onto the first photocurable adhesive 23-1 is blocked by the first light-shielding portion 310 and does not pass between the lower end 243 of the first light-shielding portion 310 and the flange portion 245, making it less likely for the light to irradiate the uncured second photocurable adhesive 23-2. This reduces the amount of light irradiated onto the uncured second photocurable adhesive 23-2 that is irradiated onto the first photocurable adhesive 23-1, thereby reducing the chance of the second photocurable adhesive 23-2 curing at an unintended time.

[0106] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0107] The ordinal numbers, quantities, and other figures used in the description of the embodiments are all illustrative to specifically illustrate the technology of this disclosure, and this disclosure is not limited to the illustrative figures. Furthermore, the connection relationships between the components are illustrative to specifically illustrate the technology of this disclosure, and are not limited to the connection relationships that realize the functions of this disclosure.

[0108] The method for manufacturing a light-emitting device according to this disclosure can reduce the amount of light irradiated onto the uncured first photocurable adhesive 23-1 of the first light source unit 2-1, which is also irradiated onto the uncured photocurable adhesive of a light source unit adjacent to the first light source unit 2-1. For this reason, the method for manufacturing a light-emitting device according to this disclosure is suitably applicable to the manufacture of light-emitting devices used in a variety of applications. Examples of light-emitting devices include those used in lighting fixtures, lighting devices, camera flashes, and automotive headlights. However, the method for manufacturing a light-emitting device according to this disclosure is not limited to the above applications.

[0109] The aspects of this disclosure are, for example, as follows: <Item 1> A step of preparing a structure, comprising: a base having an upper surface; a first light source unit located on the upper surface of the base and having a first substrate; one or more first light-emitting parts disposed on the first upper surface of the first substrate; and an uncured first photocurable adhesive provided on the first upper surface at a position surrounding the one or more first light-emitting parts; and a second light source unit located on the upper surface of the base and adjacent to the first light source unit, having a second substrate; one or more second light-emitting parts disposed on the second upper surface of the second substrate; and an uncured second photocurable adhesive provided on the second upper surface at a position surrounding the one or more second light-emitting parts. A method for manufacturing a light-emitting device, comprising: a step of: placing a first translucent member, which includes a first lower surface facing the first upper surface and bonded to the first upper surface via the first photocurable adhesive, on the first upper surface using a mounting jig having a first side surface; and a first photocuring step of curing the uncured first photocurable adhesive provided on the first upper surface by irradiating it with light while the first translucent member is held down by the mounting jig, wherein the mounting jig has a first light-shielding portion provided on the first side surface and located between the first light source and the second light source in the first photocuring step. <Item 2> The mounting jig has a second side surface located opposite to the first side surface and a first opening provided on the second side surface, and in the first photocuring step, the light that cures the first photocurable adhesive is irradiated onto the first photocurable adhesive through the first opening, the method for manufacturing the light-emitting device described in <Item 1>. <Item 3> The mounting jig has a second opening provided on the first side surface and an inner light-shielding portion disposed between the first opening and the second opening inside the mounting jig, and in the first light-curing step, the light that cures the first light-curable adhesive is irradiated onto the first light-curable adhesive through the first opening and the second opening, respectively, in the method for manufacturing the light-emitting device described in <Item 2>. <Item 4> The structure further includes a third light source unit located on the upper surface of the base, having a third substrate, one or more third light-emitting parts disposed on the third upper surface of the third substrate, and an uncured third photocurable adhesive provided on the third upper surface at a position surrounding the one or more third light-emitting parts, wherein the second light source unit is adjacent to the first light source unit in a first direction, and the third light source unit is adjacent to the first light source unit in a second direction perpendicular to the first direction, and the above-described mounting jig further has a second light-shielding part located between the first light source unit and the third light source unit in the first photocuring step, and the steps of placing a second translucent member, which is facing the second upper surface and includes a second lower surface that is bonded to the second upper surface via the second photocurable adhesive, on the second upper surface using the above-described mounting jig, and the steps of placing the second translucent member placed on the second upper surface using the above-described mounting jig A method for manufacturing a light-emitting device according to item 2 or item 3, comprising: a second photocuring step of curing an uncured second photocurable adhesive provided on the second upper surface by irradiating it with light while it is held down by a jig; a step of placing a third translucent member, which faces the third upper surface and includes a third lower surface that is bonded to the third upper surface via the third photocurable adhesive, on the third upper surface using the aforementioned placement jig; and a third photocuring step of curing an uncured third photocurable adhesive provided on the third upper surface by irradiating it with light while the third translucent member placed on the third upper surface is held down by the aforementioned placement jig, wherein the step of placing the member on the second upper surface using the aforementioned placement jig is performed after the first photocuring step, and the step of placing the member on the third upper surface using the aforementioned placement jig is performed after the second photocuring step. <Clause 5> The method for manufacturing a light-emitting device according to Clause 4, wherein the mounting jig further comprises a third light-shielding portion provided on the second side surface. <Item 6> The method for manufacturing a light-emitting device according to any one of <Item 1> to <Item 5>, wherein the first light-transmitting member includes a light-transmitting portion and a support portion that supports the light-transmitting portion, and at least a part of the support portion has light-shielding properties. <Item 7> The method for manufacturing a light-emitting device according to <Item 6>, wherein in the first light-curing step, the first light-shielding portion covers the entire side surface of the light-transmitting portion in a cross section that includes a central axis passing through the center of the first light-transmitting member in a top view and extending in a direction along the normal to the upper surface of the base. <Item 8> A method for manufacturing a light-emitting device according to <Item 6> or <Item 7>, wherein, in a top view, in the direction from the inside to the outside of the first light-transmitting member, the thickness of the opposing portion of the first light-shielding portion that faces the side surface of the light-transmitting portion is greater than the thickness of the portion of the first light-shielding portion that is located below the opposing portion. <Item 9> The first light-transmitting member has a flange portion including the first lower surface and the outer edge of the first light-transmitting member in a top view, and in a side view with the first light-transmitting member held down by the mounting jig described above, the lower end of the first light-shielding portion overlaps with the flange portion, the method for manufacturing a light-emitting device according to any one of <Item 1> to <Item 8>. [Explanation of Symbols]

[0110] 1 base 2-1 1st light source section 2-2 Second light source section 2-3 Third light source section 2-4 4th light source section 2-5 5th light source section 2-6 6th light source section 2-7 7th light source section 2-8 8th light source section 2-9 9th light source section 3, 3a Mounting jig 10 Top side 21-1 First substrate 22-1 First light-emitting section 23-1 First-generation light-curing adhesive 21-2 Second board 22-2 Second light-emitting section 23-2 Second type of light-curing adhesive 21-3 Third substrate 22-3 Third light-emitting section 23-3 Third-type light-curing adhesive 24-1 First translucent member 24-2 Second translucent member 24-3 Third translucent member 24-4 4th translucent member 24-5 5th translucent member 24-6 6th translucent member 24-7 7th translucent member 25-1, 25-2 First Electronic Component 26-1, 26-2 Second Electronic Components 31 First aspect 32 Second aspect 33 Third aspect 33-1 First opening 33-2 Second opening 33-3 Third opening 34 Inner light-blocking section 100, 100a structure 210-1 1st top surface 210-2 2nd top surface 210-3 Third top surface 221 Light-emitting surface 222 Light-emitting element 223 Electrode 224 wavelength conversion component 225 Covering member 240-1 1st bottom surface 240-2 2nd bottom surface 240-3 3rd bottom surface 241-1 Top surface 241 Light transmission part 242 Support part 243 Bottom end 244 Side view 245 Guard section 310 First light-shielding section 311 First side connection section 312 Upper part of the first side 313 First connection bottom 314 Opposing part 315 parts 320 Second light-shielding section 321 Second side connection section 322 2nd side upper part 323 Second connection bottom 330 Third light-shielding section 331 Third side connection 332 Third side upper part G outer edge L1, L2, L1a, L3 Light t1, t2 thickness

Claims

1. The process of preparing a structure, A base having an upper surface, A first light source unit located on the upper surface of the base, comprising a first substrate, one or more first light-emitting parts disposed on the first upper surface of the first substrate, and an uncured first photocurable adhesive provided on the first upper surface at a position surrounding the one or more first light-emitting parts, A step of preparing a structure comprising: a second substrate located on the upper surface of the base; one or more second light-emitting parts disposed on the second upper surface of the second substrate; and an uncured second photocurable adhesive provided on the second upper surface in a position surrounding the one or more second light-emitting parts, and a second light-emitting part adjacent to the first light-emitting part; A step of placing a first translucent member, which includes a first lower surface facing the first upper surface and bonded to the first upper surface via the first light-curable adhesive, on the first upper surface using a mounting jig having a first side surface, The process includes a first photocuring step in which, while the first translucent member is held in place by the aforementioned mounting jig, light is irradiated onto the uncured first photocurable adhesive provided on the first upper surface to cure it, A method for manufacturing a light-emitting device, wherein the mounting jig is provided on the first side surface and has a first light-shielding portion located between the first light source and the second light source in the first light curing step.

2. The aforementioned mounting jig is, The second side located opposite the first side, It has a first opening provided on the second side surface, The method for manufacturing a light-emitting device according to claim 1, wherein in the first photocuring step, the light for curing the first photocurable adhesive is irradiated onto the first photocurable adhesive through the first aperture.

3. The aforementioned mounting jig is, The second opening provided on the first side surface, The mounting jig has an inner light-shielding portion positioned between the first opening and the second opening inside the jig, The method for manufacturing a light-emitting device according to claim 2, wherein in the first photocuring step, the light for curing the first photocurable adhesive is irradiated onto the first photocurable adhesive through the first aperture and the second aperture, respectively.

4. The aforementioned structure is The third light source unit is located on the upper surface of the base and further includes a third substrate, one or more third light-emitting parts disposed on the third upper surface of the third substrate, and an uncured third photocurable adhesive provided on the third upper surface in a position surrounding the one or more third light-emitting parts. The second light source unit is adjacent to the first light source unit in the first direction, The third light source unit is adjacent to the first light source unit in a second direction perpendicular to the first direction, The mounting jig further includes a second light-shielding portion located between the first light source and the third light source in the first light curing step, A step of placing a second translucent member, which includes a second lower surface facing the second upper surface and being bonded to the second upper surface via the second photocurable adhesive, on the second upper surface using the placement jig described above, With the second translucent member placed on the second upper surface held down by the mounting jig described above, a second photocuring step is performed in which light is irradiated onto the uncured second photocurable adhesive provided on the second upper surface to cure it, A step of placing a third translucent member, which includes a third lower surface facing the third upper surface and bonded to the third upper surface via the third photocurable adhesive, on the third upper surface using the placement jig described above, The third light-curing step includes, while the third light-transmitting member placed on the third upper surface is held down by the mounting jig described above, irradiating the uncured third light-curable adhesive provided on the third upper surface with light to cure it, The step of placing the object on the second upper surface using the aforementioned mounting jig is performed after the first light curing step. The method for manufacturing a light-emitting device according to claim 2, wherein the step of placing the device on the third upper surface using the mounting jig is performed after the second photocuring step.

5. The method for manufacturing a light-emitting device according to claim 4, wherein the mounting jig further comprises a third light-shielding portion provided on the second side surface.

6. The first light-transmitting member includes a light-transmitting portion and a support portion that supports the light-transmitting portion, The method for manufacturing a light-emitting device according to claim 1, wherein at least a portion of the support portion has light-shielding properties.

7. The method for manufacturing a light-emitting device according to claim 6, wherein in the first light-curing step, the first light-shielding portion covers the entire side surface of the light-transmitting portion in a cross section including a central axis that passes through the center of the first light-transmitting member in a top view and extends in a direction along the normal to the upper surface of the base.

8. A method for manufacturing a light-emitting device according to claim 6, wherein, in a top view, in the direction from the inside to the outside of the first light-transmitting member, the thickness of the opposing portion of the first light-shielding portion that faces the side surface of the light-transmitting portion is greater than the thickness of the portion of the first light-shielding portion that is located below the opposing portion.

9. The first translucent member has a flange portion including the first lower surface and the outer edge of the first translucent member in a top view, A method for manufacturing a light-emitting device according to claim 1, wherein, in a side view with the first light-transmitting member held down by the mounting jig described above, the lower end of the first light-shielding portion overlaps with the flange portion.

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