Substrate processing apparatus, article manufacturing method, substrate processing method, and substrate processing program

Abstract

The present invention provides a substrate processing apparatus that can sufficiently suppress the occurrence of temperature unevenness within the substrate surface of a substrate even when the substrate is transported at high speed. [Solution] The substrate processing apparatus according to the present invention is characterized by comprising: a stage on which a substrate is placed; a transport unit for transporting the substrate from the stage; a measuring unit for measuring the temperature of the transport unit; an adjustment unit for adjusting the temperature of the substrate placed on the stage; and a control unit that performs an adjustment process to cause the adjustment unit to adjust the temperature of the substrate placed on the stage so that it becomes the temperature of the transport unit measured by the measuring unit.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, a method for manufacturing an article, a substrate processing method, and a substrate processing program.

Background Art

[0002] Conventionally, when temperature unevenness occurs in the substrate plane of a substrate in a substrate processing apparatus, local expansion and contraction occur in the substrate, causing changes in the arrangement and shape of the shot regions in the substrate plane. In a substrate processing apparatus, an actuator that drives in a substrate transfer unit for transferring a substrate generates heat, and this heat is transmitted to a substrate holding unit that holds the substrate in the substrate transfer unit, and thus to the held substrate, resulting in temperature unevenness in the substrate plane of the substrate.

[0003] Patent Document 1 discloses a substrate processing apparatus that suppresses the occurrence of temperature unevenness in the substrate plane of a substrate by adjusting the temperature of a region of the substrate that contacts the substrate holding unit to be lower than the temperature of a region that does not contact the substrate holding unit.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] On the other hand, in recent years, the throughput of substrate processing apparatuses has been improving. Therefore, as the speed and acceleration of transferring a substrate in the substrate transfer unit increase, the heat generation in the driving actuator also increases. Furthermore, in the substrate processing apparatus disclosed in Patent Document 1, when the substrate is transported by the substrate transport unit, which generates increased heat in the actuator, it is difficult to sufficiently suppress the occurrence of temperature unevenness within the substrate surface of the substrate.

[0006] Therefore, the present invention aims to provide a substrate processing apparatus that can sufficiently suppress the occurrence of temperature unevenness within the substrate surface of a substrate even when the substrate is transported at high speed. [Means for solving the problem]

[0007] The substrate processing apparatus according to the present invention is characterized by comprising: a stage on which a substrate is placed; a transport unit for transporting the substrate from the stage; a measuring unit for measuring the temperature of the transport unit; an adjustment unit for adjusting the temperature of the substrate placed on the stage; and a control unit that performs an adjustment process to cause the adjustment unit to adjust the temperature of the substrate placed on the stage so that it becomes the temperature of the transport unit measured by the measuring unit. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a substrate processing apparatus that can sufficiently suppress the occurrence of temperature unevenness within the substrate surface of a substrate even when the substrate is transported at high speed. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic cross-sectional view of an exposure apparatus according to the first embodiment. [Figure 2] A schematic top view of a transport mechanism provided in an exposure apparatus according to the first embodiment. [Figure 3] A partially enlarged schematic top view of an exposure apparatus according to the first embodiment. [Figure 4] A flowchart illustrating the process of adjusting the target temperature of the temperature control plate in the exposure apparatus according to the first embodiment. [Figure 5] This figure shows an example of the time change in the temperature of the transport hand and the substrate in the exposure apparatus according to the first embodiment. [Figure 6] A partially enlarged schematic top view of an exposure apparatus according to the second embodiment. [Figure 7] A flowchart illustrating the process of adjusting the target temperature of the temperature control plate in the exposure apparatus according to the second embodiment. [Figure 8] A partially enlarged schematic cross-sectional view and a diagram showing a thermal resistance circuit in an exposure apparatus according to the third embodiment. [Modes for carrying out the invention]

[0010] The substrate processing apparatus according to this embodiment will be described in detail below with reference to the attached drawings. Note that the drawings shown below may be drawn to a different scale than the actual dimensions in order to facilitate understanding of this embodiment. Furthermore, the embodiments described below do not limit the invention as defined in the claims.

[0011] Furthermore, although the embodiments described below include multiple features, not all of these features are necessarily essential to the invention, and these features may be combined in any way. In the following, the direction parallel to the optical axis of the projection optical system 7 is defined as the Z direction, and the two mutually perpendicular directions within the plane perpendicular to the optical axis are defined as the X direction and the Y direction.

[0012] [First Embodiment] In substrate processing equipment such as exposure equipment and measuring equipment used in the manufacturing of semiconductor devices, generally, before transporting the substrate to the substrate stage where processing takes place, the substrate is positioned and its temperature is adjusted to a predetermined temperature. In recent years, with the miniaturization and increased integration of semiconductor devices, there has been a growing demand for improved alignment and overlay accuracy in these devices, and in particular, for even more stringent control of the substrate temperature.

[0013] Specifically, in order to improve the alignment and overlay accuracy of semiconductor devices, it is necessary to adjust the temperature of the substrate before it is transported to the substrate stage so that it is uniform, taking into account the temperature of the substrate after it has been transported to the substrate stage. If the temperature distribution within the substrate surface becomes uneven, that is, if temperature variations occur within the substrate surface, localized expansion and contraction will occur within the substrate, causing changes in the arrangement and shape of the shot regions within the substrate surface.

[0014] Furthermore, one factor that causes uneven temperature distribution within the substrate surface of a substrate is the substrate transport unit that transports the substrate. The substrate transport section is equipped with multiple drive shafts for transporting substrates, and actuators such as servo motors and linear motors are mounted to drive these drive shafts.

[0015] Furthermore, in the substrate transport section, heat is generated in the actuator that drives the transport of the substrate, and this heat is transferred to the substrate holder that holds the substrate in the substrate transport section. As a result, the temperature of the area of ​​the substrate in contact with the substrate holder rises. Consequently, the temperature distribution across the substrate surface becomes uneven. Therefore, in order to suppress the occurrence of temperature unevenness within the substrate surface of a substrate when the substrate transport unit transports the substrate, a substrate processing device has been proposed that controls the temperature of the area of ​​the substrate that is in contact with the substrate holding unit to be lower than the temperature of the area that is not in contact with the substrate holding unit.

[0016] On the other hand, in recent years, throughput in substrate processing equipment has improved, and as the speed and acceleration of substrate transport in the substrate transport section have increased, the heat generated in the actuators has also increased. Furthermore, in the conventional substrate processing apparatus described above, it is difficult to sufficiently suppress the occurrence of uneven temperature distribution within the substrate surface of the substrate when the substrate is transported by the substrate transport unit, which generates increased heat in the actuator.

[0017] Therefore, the objective of this embodiment is to provide a substrate processing apparatus that can sufficiently suppress the occurrence of non-uniform temperature distribution within the substrate surface of a substrate even when the substrate is transported at high speed. Figure 1 shows a schematic cross-sectional view of an exposure apparatus 100 as a substrate processing apparatus according to the first embodiment.

[0018] The exposure apparatus 100 is a lithography apparatus used in the lithography process included in the manufacturing process of devices such as semiconductor elements and liquid crystal display elements, for forming patterns on a substrate 10. The exposure apparatus 100 includes a light source unit 5, an illumination optical system 6, a projection optical system 7, a reticle stage 8, a substrate stage 50, an alignment scope 80, and a control unit 90.

[0019] The illumination optical system 6 is configured to shape the light from the light source 5 into a predetermined shape optimal for exposure, and then to uniformly illuminate the reticle 9 with the shaped light. The reticle stage 8 is configured to hold the reticle 9 via a reticle chuck (not shown) and is connected to a reticle drive mechanism (not shown).

[0020] The reticle drive mechanism is formed from a linear motor or the like, and drives the reticle stage 8 in the X, Y, and Z directions, and in the rotational directions around the X, Y, and Z axes, respectively. This allows the reticle 9, which is held in the reticle stage 8, to be moved to the target position.

[0021] The reticle 9 used in the exposure apparatus 100 is made of, for example, quartz, and has a pattern (circuit pattern) formed on it that should be transferred to the substrate 10. Furthermore, the position of the reticle stage 8 is detected by, for example, a six-axis laser interferometer (not shown) and controlled by the control unit 90.

[0022] The projection optical system 7 has the function of focusing light from the object surface onto the image plane. Specifically, it guides light (diffracted light) that has passed through the pattern formed on the reticle 9 onto the substrate 10, thereby projecting an image of the pattern onto the substrate surface of the substrate 10 on which the photosensitive material is coated. The substrate stage 50 is configured to hold the substrate 10 via a substrate chuck 51 and is connected to a substrate drive mechanism (not shown).

[0023] The substrate chuck 51 is set to a predetermined temperature by a mechanism provided on the substrate stage 50 through which a temperature-controlled medium, such as coolant oil or cooling water (not shown), flows. The above-mentioned substrate drive mechanism is formed from a linear motor or the like, and drives the substrate stage 50 in the X, Y, and Z directions, and in the rotational directions around the X, Y, and Z axes, respectively.

[0024] This allows the substrate 10, which is held on the substrate stage 50, to be moved to the target position. The substrate 10 used in the exposure apparatus 100 is a workpiece onto which the pattern formed on the reticle 9 is transferred, and includes, for example, a wafer, a liquid crystal substrate, or other workpieces. Furthermore, the position of the substrate stage 50 is detected by, for example, a six-axis laser interferometer (not shown) and controlled by the control unit 90.

[0025] The alignment scope 80 is a measuring unit that measures alignment marks formed on the substrate 10 held on the substrate stage 50. Specifically, when performing overlay exposure on a pattern formed on the substrate 10, the position of the alignment marks formed on the substrate 10 is measured using the alignment scope 80 before performing the overlay exposure.

[0026] Figure 2 shows a schematic top view of the transport mechanism provided in the exposure apparatus 100 for loading and unloading the substrate 10. Specifically, the transport mechanism comprises a first alignment device 20, a discharge table 22, a second alignment temperature control device 30 (stage, adjustment unit), and a temperature control plate control unit 33 (control unit). The transport mechanism also includes a first transport robot 41, a second transport robot 42 (transport section), a third transport robot 43, and a retrieval table 60.

[0027] The first transport robot 41, the second transport robot 42, and the third transport robot 43 are configured to transport the substrate 10 by adsorption and holding it using adsorption parts (not shown) provided on the transport hands 411, 421, and 431, respectively. At this time, heat is generated when actuators (not shown) located inside the first transport robot 41, the second transport robot 42, and the third transport robot 43 are driven.

[0028] Therefore, for example, the bases of the transport hands 411, 421, and 431 may be formed from a material with low thermal conductivity. This makes it possible to suppress the transfer of the heat generated in the first transport robot 41, the second transport robot 42, and the third transport robot 43 to the transport hands 411, 421, and 431, respectively. Therefore, the temperature uniformity of each of the conveying hands 411, 421, and 431 can be improved.

[0029] As shown in Figure 2, the exposure apparatus 100 is connected to a coating and developing apparatus 1 which has the function of coating a photosensitive material onto the substrate 10 and developing the substrate 10 after exposure treatment. The exposure device 100 and the coating and developing device 1 are typically connected to each other via an in-line connection.

[0030] When transferring the substrate 10 from the coating and developing apparatus 1 to the exposure apparatus 100, the substrate 10 is first transported to the first alignment apparatus 20, which is the interface between the inside of the exposure apparatus 100 and the coating and developing apparatus 1. The first alignment device 20 has a holding unit 21, and the substrate 10 transported to the first alignment device 20 is held by the holding unit 21 and then rotated around the Z-axis.

[0031] Specifically, the holding part 21 holds the central part of the substrate 10 from below, and the first alignment device 20 aligns the substrate 10 so that a reference position such as a notch or orientation flat on the substrate 10 faces a predetermined direction. In this alignment, the substrate 10 is transported to the second alignment temperature control device 30, which will be described later, so that the notch on the substrate 10 falls within the detection range of the second alignment temperature control device 30.

[0032] Next, the substrate 10, which has been aligned in the first alignment device 20, is transported to the second alignment temperature control device 30 by the first transport robot 41. The second alignment temperature control device 30 includes a shape detection sensor (not shown) that detects the outer periphery shape and notches of the substrate 10, and an alignment stage (not shown) that performs positional alignment of the mounted substrate 10 in the X direction, Y direction, and rotational direction around the Z axis.

[0033] The second alignment temperature control device 30 also includes a temperature control plate 31 that adjusts the temperature of the substrate 10 to a predetermined temperature by contacting the back surface of the substrate 10 on the mounting surface on which the substrate 10 is placed, and a lift pin 32 for transferring the substrate 10. As shown in Figure 2, the second alignment temperature control device 30 in the exposure apparatus 100 is provided with three lift pins 32, but the number of lift pins 32 is not particularly limited as long as the objective of holding the substrate 10 is achieved.

[0034] Furthermore, the temperature control of the substrate 10 by the temperature control plate 31 is performed by the temperature control plate control unit 33. Specifically, first, the control unit 90 transmits information (command value) about the target temperature of the temperature control plate 31 to the temperature control plate control unit 33.

[0035] The temperature control plate control unit 33 then controls a temperature control device, such as a Peltier element (not shown), based on the received command value and temperature information obtained by a temperature sensor (not shown) mounted on the temperature control plate 31. Here, since the temperature control device is connected to the temperature control plate 31, the temperature control plate 31 is adjusted to a predetermined temperature by the temperature control device. Furthermore, the temperature control plate 31 is made of a material with a large heat capacity so that its own temperature does not fluctuate due to the ambient temperature or the temperature of the substrate 10 that is adsorbed and held on the temperature control plate 31.

[0036] The substrate 10, which has been transported to the second alignment temperature control device 30, is received from the first transport robot 41 by a lift pin 32 in the second alignment temperature control device 30. Subsequently, the substrate 10 is transferred from the lift pin 32 to the temperature control plate 31 by moving the lift pin 32 to the negative side in the Z direction. Then, after the temperature control plate 31 has adsorbed and held the substrate 10, the temperature of the substrate 10 is controlled so that its temperature reaches a predetermined temperature.

[0037] Furthermore, the position of the substrate 10, which is held in place by the temperature control plate 31, is measured by a shape detection sensor (not shown). Then, in order for the output of the shape detection sensor to become a predetermined output, an alignment stage (not shown) in the second alignment temperature control device 30 is driven, thereby aligning the substrate 10 in the X and Y directions with the rotational direction around the Z axis.

[0038] Here, the predetermined output of the shape detection sensor corresponds to the position of the substrate 10 on the temperature-controlled plate 31 such that the alignment marks on the substrate surface of the substrate 10, when it is later transported to the substrate stage 50, are within the detection range of the alignment scope 80. As described above, the second alignment temperature control device 30 performs temperature control and positional alignment of the substrate 10 in parallel.

[0039] Next, the substrate 10, which has been aligned and temperature-controlled in the second alignment temperature control device 30, is transferred from the temperature control plate 31 to the lift pin 32 as the lift pin 32 moves to the positive side in the Z direction. Subsequently, the substrate 10, held by the lift pins 32, is handed over to the second transport robot 42, which then transports it to above the supply position LP. Then, after the substrate stage 50 moves to the supply position LP, the lift pins 52 provided on the substrate stage 50 move to the positive side in the Z direction so that they protrude from the surface of the substrate chuck 51, thereby receiving the substrate 10 from the second transport robot 42.

[0040] Next, the second transport robot 42 moves to the negative side in the Y direction from the supply position LP to retreat. Furthermore, as the lift pin 52 moves to the negative side in the Z direction on the substrate stage 50, the substrate chuck 51 receives the substrate 10 from the lift pin 52 and then holds it in place by suction.

[0041] Next, the substrate 10, held by the substrate stage 50, is transported to a position directly below the alignment scope 80. The alignment scope 80 then detects alignment marks provided on the scribe lines on the substrate 10 and measures the position of the alignment marks to calculate the position (positional displacement) of the shot areas located on the substrate surface of the substrate 10.

[0042] Next, the control unit 90 drives the substrate stage 50 based on the position of the alignment mark acquired by the alignment scope 80 in the X, Y, Z directions and rotational direction around the Z axis. In this way, the substrate 10, whose positional misalignment has been corrected on the substrate stage 50, is transported by the substrate stage 50 to a position below the projection optical system 7, where the image of the pattern formed on the reticle 9 is projected, and then exposure processing is performed via the projection optical system 7.

[0043] Next, once the exposure process on the substrate 10 is complete, the substrate stage 50 moves to the recovery position ULP. Then, the third transport robot 43 retrieves the circuit board 10 from the circuit board stage 50 and transports it to the retrieval table 60.

[0044] Next, the substrate 10, which has been transported to the retrieval table 60, is recovered by the first transport robot 41 and then transported to the unloading table 22, which is the interface between the inside of the exposure apparatus 100 and the coating and developing apparatus 1. The substrate 10, which has been transported to the loading table 22, is then collected by a substrate transport robot (not shown) provided in the coating and developing apparatus 1, and then the developing process is carried out.

[0045] Next, a method for adjusting the target temperature of the temperature control plate 31 provided in the exposure apparatus 100 according to this embodiment will be described. Figure 3 shows a partially enlarged schematic top view of the exposure apparatus 100 according to this embodiment.

[0046] As shown in Figure 3, in the exposure apparatus 100 according to this embodiment, a temperature sensor 422 (measurement unit) is provided at a position immediately adjacent to a substrate holding unit (holding unit) (not shown) of the transport hand 421. Specifically, the temperature sensor 422 is a contact-type temperature sensor such as a resistance thermometer, thermistor, or thermocouple.

[0047] In this embodiment of the exposure apparatus 100, a single temperature sensor 422 is provided in the transport hand 421, but multiple temperature sensors 422 may be provided. Furthermore, instead of a contact-type temperature sensor, a non-contact temperature sensor such as an infrared temperature sensor may be used as the temperature sensor 422.

[0048] Figure 4 is a flowchart showing the process of adjusting the target temperature of the temperature control plate 31 in the exposure apparatus 100 according to this embodiment. When the process starts, first, the control unit 90 causes the temperature sensor 422 to measure the temperature in the vicinity of the substrate holding part (not shown) in the transfer hand 421, that is, in the vicinity of the area where the transfer hand 421 and the substrate 10 contact each other (step S101, first measurement step).

[0049] Next, the control unit 90 acquires the temperature data measured by the temperature sensor 422 in step S101 (step S102). Next, the control unit 90 calculates the target temperature T of the temperature control plate 31 CF and registers a command value indicating the calculated target temperature T CF (step S103).

[0050] FIG. 5(a) shows an example of the temporal change in the temperature measured by the temperature sensor 422 in the transfer hand 421. As described above, after the transfer hand 421 moves to the position of the second alignment temperature control device 30, it receives the substrate 10 from the second alignment temperature control device 30, or after transporting the substrate 10 to the supply position LP, it transfers the substrate 10 to the substrate stage 50.

[0051] When the transfer hand 421 is performing such driving, the temperature measured by the temperature sensor 422 is, for example, within the temperature range between the temperature T F1 and the temperature T F2 and is assumed to be stable after time t0 as shown in FIG. 5(a). At this time, in the exposure apparatus 100 according to the present embodiment, in step S103, the median of the temporal change of the measured temperature within a predetermined period between the temperature T F1 and the temperature T F2 is calculated as the target temperature T of the temperature control plate 31 CF . In step S103, instead of the median value, the average value, the maximum value (i.e., the temperature T F1 and the temperature T F2 of the temporal change of the measured temperature within a predetermined period between F2 ) or the minimum value (i.e., the temperature TF1 ) target temperature T CF You can calculate it as follows.

[0052] Next, the control unit 90 sets the target temperature T of the temperature control plate 31 registered in step S103. CF A command value indicating this is transmitted to the temperature control plate control unit 33 (step S104). Then the temperature control plate control unit 33 sets the target temperature T of the temperature control plate 31 based on the command value received in step S104. CF Based on this, the temperature of the temperature control plate 31 is controlled (step S105, adjustment step), and the process is terminated. In other words, in step S105, the temperature control plate control unit 33 adjusts the temperature of the temperature control plate 31 so that the temperature of the substrate 10 placed on the second alignment temperature control device 30 becomes the temperature measured by the temperature sensor 422.

[0053] Figures 5(b) and 5(c) show examples of temperature changes in the substrate 10 when it is transferred from the temperature control plate 31 to the transport hand 421 in a conventional exposure apparatus and the exposure apparatus 100 according to this embodiment, respectively. The conventional exposure apparatus referred to herein has the same configuration as the exposure apparatus 100 according to this embodiment, except that the method of controlling the temperature of the substrate 10 on the temperature control plate 31 is different. Therefore, the same reference numerals are used for the same components, and their descriptions are omitted.

[0054] Specifically, in conventional exposure apparatuses, the target temperature of the temperature control plate 31 is the temperature T of the internal space of the conventional exposure apparatus. Ca It is set to the same temperature. Therefore, as shown in Figure 5(b), the temperature of the substrate 10 held by the temperature control plate 31 during the period prior to time t1 is the median T Ca , minimum value T a1 and maximum value T a2 It will stabilize within that temperature range. In other words, the temperature range (temperature unevenness) at each position on the substrate surface of the substrate 10 held by the temperature control plate 31 is T a2 -Ta1 This is the result.

[0055] On the other hand, in conventional exposure apparatuses, the temperature measured by the temperature sensor 422 in the transport hand 421 is the median value T CF , minimum value T F1 and maximum value T F2 It is stable within this temperature range. Furthermore, as described above, the transport hand 421 performs various drives, so the temperature of the temperature control plate 31 will be lower than the temperature of the transport hand 421.

[0056] Then, as shown in Figure 5(b), when the substrate 10 is transferred from the temperature control plate 31 to the transport hand 421 at time t1, the temperature of the portion of the substrate 10 held by the transport hand 421 will rise during the period after time t1. As a result, the temperature range (temperature unevenness) at each position on the substrate surface of the substrate 10 held by the transport hand 421 is T F2 -T a1 Therefore, it increases.

[0057] On the other hand, as described above, in the exposure apparatus 100 according to this embodiment, the target temperature of the temperature control plate 31 is the median value T of the time change of the temperature measured by the temperature sensor 422 in the transport hand 421. CF It is set to this. Therefore, as shown in Figure 5(c), the temperature of the substrate 10 held by the temperature control plate 31 during the period prior to time t1 is the median T CF , minimum value T F1 and maximum value T F2 It will stabilize within that temperature range.

[0058] In other words, the temperature range (temperature unevenness) at each position on the substrate surface of the substrate 10 held by the temperature control plate 31 is T F2 -T F1 This is the result. Therefore, even if the substrate 10 is transferred from the temperature control plate 31 to the transport hand 421 at time t1, the temperature range (temperature unevenness) at each position on the substrate surface of the substrate 10 held by the transport hand 421 during the period after time t1 is T F2 -T F1 It is maintained. In other words, in the exposure apparatus 100 according to this embodiment, unlike conventional exposure apparatuses, even when the substrate 10 is transferred from the temperature control plate 31 to the transport hand 421, the temperature range (temperature unevenness) at each position on the substrate surface of the substrate 10 held by the transport hand 421 does not increase.

[0059] In this embodiment of the exposure apparatus 100, it is preferable to repeatedly perform the process of adjusting the target temperature of the temperature control plate 31 shown in Figure 4, specifically at predetermined time intervals, for example, at intervals of a few milliseconds or a few microseconds. Furthermore, in the exposure apparatus 100 according to this embodiment, the median value T of the time change of temperature measured by the temperature sensor 422 provided on the transport hand 421 in step S103 of the process CF It is not necessary to set yourself to the target temperature of the temperature control plate 31.

[0060] In other words, the temperature control plate 31 controls the substrate 10 to a target temperature T CF Even while temperature control is in place, the temperature of the conveyor hand 421 may change due to operation. In this case, the temperature of the substrate 10 when temperature control is completed on the temperature control plate 31 and the temperature of the transport hand 421 will be different from each other. Therefore, in step S103 of the process, the target temperature of the temperature control plate 31 may also be calculated by taking into account the temperature change of the transport hand 421 while the substrate 10 is being controlled to the target temperature on the temperature control plate 31.

[0061] As described above, in the exposure apparatus 100 according to this embodiment, the substrate 10 is temperature-controlled on the temperature control plate 31 so that it is the same temperature as the transport hand 421. Therefore, when the substrate 10 is held by the transport hand 421, the temperature difference between the substrate 10 and the transport hand 421 in the area where the substrate 10 and the transport hand 421 are in contact with each other and in the vicinity thereof is sufficiently reduced.

[0062] Therefore, the substrate 10 can be transferred from the transport hand 421 of the second transport robot 42 to the substrate stage 50 while maintaining a uniform temperature at each position within the substrate surface. In other words, the exposure apparatus 100 according to this embodiment can perform temperature control with high precision even when transporting the substrate 10 at high speed. Furthermore, after the substrate 10 is held by the substrate stage 50, time elapses for the alignment scope 80 to measure the position of the substrate 10 and for the substrate 10 to be exposed, so that the temperature of the substrate 10 changes uniformly to match the temperature of the substrate stage 50.

[0063] In this case, the change in the shape of each shot region due to the temperature change of the substrate 10 can be corrected by magnification correction, so that the decrease in overlay accuracy and alignment accuracy can be sufficiently suppressed. Furthermore, in the exposure apparatus 100 according to this embodiment, the above effect can be obtained by providing a temperature sensor 422 in the transport hand 421.

[0064] Therefore, even when the substrate 10 is transported at high speed by the transport hand 421, the reduction in overlay accuracy and alignment accuracy can be sufficiently suppressed. In other words, in the exposure apparatus 100 according to this embodiment, even when the transport hand 421 transports the substrate 10 at high speed, high temperature control accuracy of the substrate 10 can be achieved, and a decrease in overlay accuracy and alignment accuracy can be sufficiently suppressed. The above configuration in the exposure apparatus 100 according to this embodiment may be applied not only to the transport of the substrate 10 but also to the transport of the reticle 9.

[0065] [Second Embodiment] Figure 6 shows a partially enlarged schematic top view of the exposure apparatus according to the second embodiment. The exposure apparatus according to this embodiment has the same configuration as the exposure apparatus 100 according to the first embodiment, except that the second transport robot 42 is provided with temperature sensors 429a to 429d (measuring unit) instead of temperature sensor 422. Therefore, the same reference numerals are used for the same components, and their descriptions are omitted.

[0066] In the exposure apparatus 100 according to the first embodiment, when the clearance between the second transport robot 42 and the surrounding units is narrow, it becomes difficult to install the temperature sensor 422 in the immediate vicinity of the substrate holding portion of the transport hand 421 of the second transport robot 42. Therefore, in the exposure apparatus according to this embodiment, first, as shown in Figure 6, a temperature sensor 429a is provided in the position closest to the substrate holding portion of the transport hand 421, and temperature sensors 429b to 429d are provided on the portion of the second transport robot 42 other than the transport hand 421. In other words, in the exposure apparatus according to this embodiment, the temperature sensors 429b to 429d are provided in three parts of the drive unit of the second transport robot 42.

[0067] Then, the correlation between the temperature measured by temperature sensor 429a and the temperatures measured by temperature sensors 429b to 429d is obtained in advance. Specifically, for example, at the time (timing, first time) when transport of the substrate 10 is started, temperatures T1, T2, T3, and T4 are measured by temperature sensors 429a to 429d, respectively.

[0068] Furthermore, assume that temperatures T5, T6, T7, and T8 are measured by temperature sensors 429a to 429d at predetermined times (timing, second time) during the transient state of transporting the substrate 10. Furthermore, assume that temperatures T9, T10, T11, and T12 are measured by temperature sensors 429a to 429d at predetermined times (timing, third time) during steady-state transport of substrate 10. Then, from the measurement results in the above measurement process (second measurement process), a temperature table showing the relationship between temperature sensors 429a to 429d, as shown in Table 1 below, can be created and obtained.

[0069] [Table 1]

[0070] In other words, in the exposure apparatus according to this embodiment, when performing exposure processing on the substrate 10, the temperature sensor 429a, which was positioned in the immediate vicinity of the substrate holding portion of the transport hand 421 of the second transport robot 42, can be removed. The temperature at the immediate vicinity of the substrate holder can be obtained by referring to the temperature table acquired as described above, based on the temperatures measured by each of the temperature sensors 429b to 429d.

[0071] Furthermore, the temperature measurements by temperature sensors 429a to 429d when acquiring the temperature table are not limited to the three times mentioned above, but may be performed at at least one time, preferably multiple times. Furthermore, the temperature sensors located on parts of the second transport robot 42 other than the transport hand 421 are not limited to temperature sensors 429b to 429d, and it is sufficient to have at least one.

[0072] Figure 7 is a flowchart showing the process of adjusting the target temperature of the temperature control plate 31 in the exposure apparatus according to this embodiment. When the process begins, the control unit 90 first causes the temperature sensors 429b to 429d, which are located on parts of the second transport robot 42 other than the transport hand 421, to measure the temperature (step S201).

[0073] Next, the control unit 90 acquires the temperature of the portion of the second transport robot 42 where each of the temperature sensors 429b to 429d is located, which was acquired in step S201 (step S202). Then, the control unit 90 determines the temperature at the location of the transport hand 421 where the temperature sensor 429a was located by referring to a temperature table based on the temperatures measured by each of the acquired temperature sensors 429b to 429d (step S203, first determination step).

[0074] In other words, in step S203, the temperature at the location of the transport hand 421 corresponding to the temperature measured by temperature sensors 429b to 429d in step S202 is determined. Specifically, for example, if the temperatures measured by temperature sensors 429b to 429d are T2, T3, and T4 respectively, the temperature at that location on the transport hand 421 is determined to be T1 from the temperature table. Next, the control unit 90 sets the temperature acquired in step S203 to the target temperature T of the temperature control plate 31. CF This is registered as a command value indicating (step S204).

[0075] Then the control unit 90 sets the target temperature T of the temperature control plate 31 that was registered in step S204. CF A command value indicating this is transmitted to the temperature control plate control unit 33 (step S205). Finally, the temperature control plate control unit 33 sets the target temperature T of the temperature control plate 31 based on the command value received in step S205. CF Based on this, the temperature of the temperature control plate 31 is controlled (step S206), and the process is terminated. As described above, in the exposure apparatus according to this embodiment, the substrate 10 is temperature-controlled on the temperature control plate 31 so that it is the same temperature as the temperature at the position where the temperature sensor 429a of the substrate holding part of the transport hand 421 was located. Therefore, when the substrate 10 is held by the transport hand 421, the temperature difference between the substrate 10 and the transport hand 421 in the area where the substrate 10 and the transport hand 421 are in contact with each other and in the vicinity thereof is sufficiently reduced.

[0076] In other words, in the exposure apparatus according to this embodiment, even when it is difficult to directly measure the temperature at a location near the substrate holding portion of the transport hand 421 because it is difficult to place the temperature sensor 429a therein, the temperature at that location can be determined. In other words, in the exposure apparatus according to this embodiment, a temperature table showing the correlation between the temperature at the location near the substrate holding portion of the transport hand 421 of the second transport robot 42 and the temperature of the other portion is acquired in advance. Then, by referring to the temperature table based on the temperature of parts other than the measured location, the temperature of the location can be estimated, and the target temperature of the temperature control plate 31 can be determined.

[0077] [Third Embodiment] Figure 8(a) shows a partially enlarged schematic cross-sectional view of the exposure apparatus according to the third embodiment, cut along the line 8A-8A shown in Figure 3. The exposure apparatus according to this embodiment has the same configuration as the exposure apparatus 100 according to the first embodiment, except that the second transport robot 42 is provided with temperature sensors 422e to 422g (measuring unit) instead of temperature sensor 422. Therefore, the same reference numerals are used for the same components, and their descriptions are omitted.

[0078] Figure 8(a) also shows the thermal resistance model of the second transport robot 42 provided in the exposure apparatus according to this embodiment. Specifically, the heat sources of the second transport robot 42 include the actuator 423 that drives the transport hand 421 in the Y direction and the guide 425 that moves the transport hand 421 along the Y direction.

[0079] Furthermore, the actuator 423 can be, for example, a linear motor. When current flows through the coil 423a in the linear motor, power is generated, which in turn generates heat P. A This will result in the following: Furthermore, as the guide 425, for example, a linear guide using ball bearings can be used, and in such a linear guide, heat P is generated by friction caused by the sliding of the ball bearings and the rails against each other. G This will result in the following:

[0080] Then, heat P generated in actuator 423 A And the heat P generated in guide 425 G This means that the heat flows to each component forming the second transport robot 42 according to conduction, radiation, and convection, and is then dissipated into the surrounding environment. The components forming the second transport robot 42 as referred to herein include, for example, the hand base 421a of the transport hand 421, the fingers 421b of the transport hand 421, the coil 423a of the actuator 423, and the magnet 423b of the actuator 423.

[0081] Furthermore, the components forming the second transport robot 42 include, for example, a base 424 (stator), a guide 425 (stator), and a movable element 426. In the second transport robot 42, the hand base 421a is coupled to the finger 421b and to the drive unit formed from the actuator 423, base 424, guide 425, and movable element 426.

[0082] In the second transport robot 42, as shown in Figure 8(a), thermal resistance θ is formed at the joint surfaces between each component and between each component and the surrounding environment, and the heat mentioned above flows through thermal resistance θ. Here, as shown in Figure 8(a), the ambient temperature is T A The temperature of the movable element 426 is T M The temperature of the hand base 421a of the transport hand 421 is set to T H The temperature of the fingers 421b of the transport hand 421 is T F Let's assume that.

[0083] In this case, the thermal resistance model shown in Figure 8(a) of the second transport robot 42 can be represented as a thermal resistance circuit as shown in Figure 8(b). Furthermore, a thermal resistance circuit including thermal resistance θ, temperature T, and heat source P, as shown in Figure 8(b), can be replaced with an electrical circuit including resistance R, voltage V, and current I.

[0084] In other words, between the thermal resistance circuit and the electrical circuit, the thermal resistance θ, temperature T, and heat source P correspond to resistance R, voltage V, and current I, respectively. Furthermore, the thermal resistances θ1 and θ2 between the transport hand 421 and the surrounding environment, and the temperature T of the surrounding environment are considered. A And the temperature T of the hand base 421a H Therefore, the temperature T of finger 421b is as shown in equation (1) below. F This can be determined (second decision step).

number

[0085] That is, the temperature T of finger 421b F This can be obtained from voltage division calculations in the electrical circuit corresponding to the thermal resistance model in the transport hand 421 of the second transport robot 42. This means that the thermal resistances θ1 and θ2 are known, and the ambient temperature T A and the temperature T of the hand base 421a H Since these are measured by temperature sensors 422e and 422f respectively, the temperature T of finger 421b can be measured from equation (1). F It is possible to calculate this. And, similar to the exposure apparatus 100 according to the first embodiment, the temperature T of the finger 421b is calculated. F The target temperature T of the temperature control plate 31 CF This value is registered as a command value, and the temperature control plate control unit 33 controls the temperature of the temperature control plate 31 based on this command value.

[0086] On the other hand, the temperature T of the movable element 426 M , the temperature T of the hand base 421a H , and the heat P flowing to the hand base 421a from the thermal resistance θ4 between the movable element 426 and the hand base 421a.H By calculating this, the temperature T of finger 421b can also be determined. F It is possible to find this. Specifically, the heat P flowing through the hand base 421a H This can be expressed as shown in equation (2) below.

number

[0087] Next, when the combined thermal resistance of the thermal resistances θ1, θ2, and θ3 in the region of the transport hand 421 is taken as θ0, the heat P flowing through the finger 421b F This can be expressed as shown in equation (3) below, based on current division calculations in electrical circuits.

number

[0088] Also, the temperature T of finger 421b F This can be expressed as equation (4) below, based on Ohm's law in electrical circuits.

number

[0089] That is, the temperature T of finger 421b F By substituting equations (2) and (3) into equation (4), it can be expressed as equation (5) below.

number

[0090] Therefore, thermal resistance θ1, θ 2、 θ3 and θ4 are known, and the temperature T of the movable element 426 is known. M and the temperature T of the hand base 421a H These are measured by temperature sensors 422g and 422f respectively, and from equation (5), the temperature T of finger 421b is obtained. F This can be calculated (decision process). Although omitted in the above discussion, each component forming the second transport robot 42 also has heat capacity, so when heat flows, the temperature will gradually rise according to a predetermined time constant. In this case, since the heat capacity in the thermal resistance circuit can be represented as a capacitor C, adding a capacitor C to the thermal resistance circuit allows for a more precise representation of the thermal resistance model in the second transport robot 42.

[0091] As described above, in the exposure apparatus according to this embodiment, the substrate 10 is temperature-controlled on the temperature control plate 31 so that it is the same temperature as the substrate holding portion of the transport hand 421. In other words, in the exposure apparatus according to this embodiment, the control unit 90 controls the temperature T of the finger 421b. F The temperature control plate control unit 33 calculates the temperature T calculated by the control plate control unit 33. F The temperature of the temperature control plate 31 is controlled to achieve the desired result.

[0092] In other words, in the exposure apparatus according to this embodiment, the temperature T of the finger 421b F Instead of measuring the ambient temperature T using a temperature sensor, A The temperature of the movable element 426 T M The temperature T of the hand base 421a of the transport hand 421 H This is calculated by inputting it into a thermal resistance model. Therefore, when the substrate 10 is held by the transport hand 421, the temperature difference between the substrate 10 and the transport hand 421 in the area where the substrate 10 and the transport hand 421 are in contact with each other and in the vicinity thereof is sufficiently reduced.

[0093] The above describes the configuration of the substrate transport mechanism in the exposure apparatus, but it is not limited to this. In other words, the above configuration can be applied to lithography equipment other than exposure equipment, such as imprint machines and charged particle beam lithography machines, as well as measurement equipment such as pre-alignment measurement machines and inspection equipment such as overlay inspection machines.

[0094] Furthermore, although the substrate processing apparatus according to this embodiment has been described above, the substrate processing method described above and the substrate processing program for causing a computer to execute the substrate processing method are also included in the scope of this embodiment. Furthermore, a computer-readable recording medium on which the substrate processing program is recorded is also included in the scope of this embodiment.

[0095] [Method of manufacturing articles] The method for manufacturing articles according to this embodiment is suitable for manufacturing articles that include devices such as semiconductor elements, magnetic storage media, and liquid crystal display elements.

[0096] Specifically, the method for manufacturing an article according to this embodiment includes a step of exposing a substrate 10 coated with a photosensitive agent to a substrate using an exposure apparatus as a substrate processing apparatus according to any of the first to third embodiments, so as to form a pattern on the substrate surface of the substrate 10. Furthermore, the method for manufacturing an article according to this embodiment includes a step of developing (processing) the exposed substrate 10. The exposure apparatus may also include a step of exposing the substrate 10 using information on the arrangement and shape of multiple shot regions on the substrate 10 measured by a predetermined measuring device.

[0097] Furthermore, the method for manufacturing the article according to this embodiment may also include other well-known steps such as oxidation, film formation, vapor deposition, doping, planarization, etching, photosensitive material removal, dicing, bonding, and packaging. The method for manufacturing articles according to this embodiment can produce articles of higher quality than conventional methods.

[0098] The method for manufacturing an article according to this embodiment is not limited to an exposure apparatus; it may also be carried out using a lithography apparatus such as an imprint apparatus or a drawing apparatus. Although preferred embodiments have been described above, the invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its essence.

[0099] This embodiment includes the following configurations and methods. (Configuration 1) A substrate processing apparatus comprising: a stage on which a substrate is placed; a transport unit for transporting the substrate from the stage; a measurement unit for measuring the temperature of the transport unit; an adjustment unit for adjusting the temperature of the substrate placed on the stage; and a control unit that performs an adjustment process to cause the adjustment unit to adjust the temperature of the substrate placed on the stage so that it becomes the temperature of the transport unit measured by the measurement unit. (Configuration 2) The substrate processing apparatus according to Configuration 1, wherein the transport unit includes a holding unit for holding the substrate and a drive unit for moving the holding unit, the measurement unit is configured to measure the temperature of the holding unit, and the adjustment step includes a first measurement step of causing the measurement unit to measure the temperature of the holding unit, and a step of causing the adjustment unit to adjust the temperature of the substrate placed on the stage so that it becomes the temperature of the holding unit measured in the first measurement step. (Configuration 3) The substrate processing apparatus according to Configuration 1 or 2, characterized in that the adjustment step includes a step of determining the median value of the time change of the temperature of the transport unit measured by the measuring unit within a predetermined period as the temperature of the transport unit. (Configuration 4) The substrate processing apparatus according to any one of Configurations 1 to 3, wherein the transport unit includes a holding unit for holding a substrate and a drive unit for moving the holding unit, the measuring unit is configured to measure the temperature of at least one part of the drive unit, and the adjustment step includes a first determination step of determining the temperature of the holding unit corresponding to the temperature of at least one part of the drive unit measured by the measuring unit from a table showing the relationship between the temperature of at least one part of the drive unit and the temperature of the holding unit, and a step of having the adjustment unit adjust the temperature of the substrate placed on the stage so that it becomes the temperature of the holding unit determined in the first determination step. (Configuration 5) The substrate processing apparatus according to Configuration 4, characterized in that the adjustment step includes a step of having the measuring unit measure the temperature of at least one part of the drive unit. (Configuration 6) The substrate processing apparatus according to Configuration 4 or 5, characterized in that the control unit performs a second measurement step of measuring the temperature of the holding unit and the temperature of at least one part of the drive unit at each of a plurality of time points, including a first time point when substrate transport is started, a second time point during the transient state of substrate transport, and a third time point during the steady state of substrate transport, and a step of creating a table from the temperature of the holding unit and the temperature of at least one part of the drive unit measured at each of the plurality of time points measured in the second measurement step. (Configuration 7) The substrate processing apparatus according to any one of Configurations 1 to 3, wherein the transport unit includes a holding unit for holding a substrate and a drive unit for moving the holding unit, the holding unit includes fingers for holding the substrate and hand bases coupled to the fingers and the drive unit respectively, the measuring unit is configured to measure the temperature of the hand bases, and the adjustment step includes a second determination step of determining the temperature of the fingers based on the temperature of the hand bases measured by the measuring unit in a thermal resistance model of the transport unit, and a step of having the adjustment unit adjust the temperature of the substrate placed on the stage so that it becomes the temperature of the fingers determined in the second determination step. (Configuration 8) The substrate processing apparatus according to Configuration 7, characterized in that the adjustment step includes a step of having the measuring unit measure the temperature of the hand base. (Configuration 9) The substrate processing apparatus according to Configuration 7 or 8, wherein the measurement unit is configured to measure the temperature around the transport unit, and the second determination step includes a step of determining the temperature of the fingers from the temperature of the hand base measured by the measurement unit and the ambient temperature in a thermal resistance model of the transport unit. (Configuration 10) The substrate processing apparatus according to any one of Configurations 7 to 9, characterized in that the control unit performs the step of creating a thermal resistance model of the holding unit as a thermal resistance model of the transport unit. (Configuration 11) The substrate processing apparatus according to any one of Configurations 1 to 10, characterized in that the control unit performs the adjustment process every predetermined amount of time. (Configuration 12) The substrate processing apparatus according to any one of Configurations 1 to 11, characterized in that the stage is an alignment stage in which the substrate is positioned. (Configuration 13) A substrate processing apparatus according to any one of Configurations 1 to 12, comprising a substrate stage on which substrate processing is performed, wherein the transport unit transports substrates from the stage to the substrate stage. (Configuration 14) The substrate processing apparatus according to any one of Configurations 1 to 13, characterized in that the measurement unit includes at least one temperature sensor which measures the temperature of the transport unit by contacting the transport unit. (Configuration 15) The substrate processing apparatus according to any one of Configurations 1 to 14, characterized in that the measurement unit includes at least one temperature sensor that measures the temperature of the transport unit without contacting the transport unit. (Configuration 16) The substrate processing apparatus according to any one of Configurations 1 to 15, characterized in that the adjustment unit is a temperature control plate that contacts the back surface of the substrate on the mounting surface on which the substrate is placed on the stage. (Configuration 17) The substrate processing apparatus according to any one of Configurations 1 to 16, wherein the transport unit includes a holding unit for holding the substrate and a drive unit for moving the holding unit, and the drive unit is a linear motor formed from a movable element and a stator. (Configuration 18) The substrate processing apparatus according to any one of Configurations 1 to 17, characterized in that the substrate processing apparatus is an exposure apparatus, an imprint apparatus, a charged particle beam lithography apparatus, a pre-alignment measurement apparatus, or an overlay inspection apparatus. (Method 1) A method for manufacturing an article, comprising the steps of processing a substrate using a substrate processing apparatus described in any one of the configurations 1 to 18, and manufacturing an article from the processed substrate. (Method 2) A substrate processing method for processing a substrate in a substrate processing apparatus comprising a stage on which a substrate is placed, a transport unit for transporting the substrate from the stage, a measuring unit for measuring the temperature of the transport unit, and an adjustment unit for adjusting the temperature of the substrate placed on the stage, characterized in that the adjustment step involves the adjustment unit adjusting the temperature of the substrate placed on the stage so that it becomes the temperature of the transport unit measured by the measuring unit. (Configuration 19) A substrate processing program that, when executed by a computer, causes the computer to perform an adjustment step in a substrate processing apparatus comprising a stage on which a substrate is placed, a transport unit for transporting the substrate from the stage, a measurement unit for measuring the temperature of the transport unit, and an adjustment unit for adjusting the temperature of the substrate placed on the stage, such that the temperature of the substrate placed on the stage is the temperature of the transport unit measured by the measurement unit. [Explanation of Symbols]

[0100] 30. Second alignment temperature control device (stage) 31 Temperature control plate (adjustment unit) 33 Temperature control plate control unit (control unit) 42. Second transport robot (transport section) 422 Temperature sensor (measurement unit) 90 Control Unit 100 Exposure equipment (substrate processing equipment)

Claims

1. A stage on which the circuit board is placed, A transport unit that transports the substrate from the stage, A measuring unit for measuring the temperature of the conveying unit, An adjustment unit for adjusting the temperature of the substrate placed on the stage, A control unit that performs an adjustment process to cause the adjustment unit to adjust the temperature of the substrate placed on the stage so that it becomes the temperature of the transport unit measured by the measurement unit, A substrate processing apparatus characterized by comprising:

2. The transport unit includes a holding unit for holding the substrate and a drive unit for moving the holding unit. The measurement unit is configured to measure the temperature of the holding unit. The aforementioned adjustment process is, A first measurement step involves having the measuring unit measure the temperature of the holding portion, A step of adjusting the temperature of the substrate placed on the stage so that it becomes the temperature of the holding portion measured in the first measurement step, A substrate processing apparatus according to claim 1, characterized by including the following:

3. The substrate processing apparatus according to claim 1, characterized in that the adjustment step includes a step of determining the median value of the time change of the temperature of the transport section measured by the measuring unit within a predetermined period as the temperature of the transport section.

4. The transport unit includes a holding unit for holding the substrate and a drive unit for moving the holding unit. The measurement unit is configured to measure the temperature of at least one part of the drive unit. The aforementioned adjustment process is, A first determination step of determining the temperature of the holding part corresponding to the temperature of the at least one part of the drive unit measured by the measuring unit, from a table showing the relationship between the temperature of the at least one part of the drive unit and the temperature of the holding part, A step of adjusting the temperature of the substrate placed on the stage so that it becomes the temperature of the holding portion determined in the first determination step, A substrate processing apparatus according to claim 1, characterized by including the following:

5. The substrate processing apparatus according to claim 4, characterized in that the adjustment step includes a step of causing the measuring unit to measure the temperature of at least one part of the drive unit.

6. The control unit, A second measurement step of measuring the temperature of the holding part and the temperature of at least one part of the drive part at each of a plurality of time points, including a first time when the transport of the substrate is started, a second time point during the transient state of the transport of the substrate, and a third time point during the steady state of the transport of the substrate. The second measurement step involves creating a table from the temperature of the holding part and the temperature of at least one part of the drive part at each of the plurality of time points measured in the second measurement step, The substrate processing apparatus according to claim 4, characterized by performing the following.

7. The transport unit includes a holding unit for holding the substrate and a drive unit for moving the holding unit. The holding portion includes fingers for holding the substrate and hand bases that connect the fingers to the drive unit, respectively. The measurement unit is configured to measure the temperature of the hand base. The aforementioned adjustment process is, A second determination step in which the temperature of the finger is determined based on the temperature of the hand base measured by the measurement unit in the thermal resistance model of the transport unit, A step of adjusting the temperature of the substrate placed on the stage so that it becomes the temperature of the finger determined in the second determination step, A substrate processing apparatus according to claim 1, characterized by including the following:

8. The substrate processing apparatus according to claim 7, characterized in that the adjustment step includes a step of causing the measuring unit to measure the temperature of the hand base.

9. The measurement unit is configured to measure the temperature around the transport unit. The substrate processing apparatus according to claim 7, characterized in that the second determination step includes a step of determining the temperature of the finger from the temperature of the hand base measured by the measurement unit and the ambient temperature in the thermal resistance model of the transport unit.

10. The substrate processing apparatus according to claim 7, characterized in that the control unit performs the step of creating a thermal resistance model of the holding unit as the thermal resistance model of the transport unit.

11. The substrate processing apparatus according to claim 1, characterized in that the control unit performs the adjustment process every predetermined time interval.

12. The substrate processing apparatus according to claim 1, characterized in that the stage is an alignment stage in which the substrate is positioned.

13. The substrate stage is provided for processing the aforementioned substrate, The substrate processing apparatus according to claim 1, characterized in that the transport unit transports the substrate from the stage to the substrate stage.

14. The substrate processing apparatus according to claim 1, characterized in that the measurement unit includes at least one temperature sensor that measures the temperature of the transport unit by contacting the transport unit.

15. The substrate processing apparatus according to claim 1, characterized in that the measurement unit includes at least one temperature sensor that measures the temperature of the transport unit without contacting the transport unit.

16. The substrate processing apparatus according to claim 1, characterized in that the adjustment unit is a temperature control plate that contacts the back surface of the substrate on the mounting surface of the stage on which the substrate is placed.

17. The transport unit includes a holding unit for holding the substrate and a drive unit for moving the holding unit. The substrate processing apparatus according to claim 1, characterized in that the drive unit is a linear motor formed from a movable element and a stator.

18. The substrate processing apparatus according to claim 1, characterized in that the substrate processing apparatus is an exposure apparatus, an imprint apparatus, a charged particle beam lithography apparatus, a pre-alignment measurement apparatus, or an overlay inspection apparatus.

19. A step of processing a substrate using a substrate processing apparatus according to any one of claims 1 to 18, A process for manufacturing an article from the processed substrate, A method for manufacturing an article, characterized by including the following:

20. A substrate processing method for processing a substrate in a substrate processing apparatus comprising: a stage on which a substrate is placed; a transport unit for transporting the substrate from the stage; a measuring unit for measuring the temperature of the transport unit; and an adjustment unit for adjusting the temperature of the substrate placed on the stage, A substrate processing method characterized by including an adjustment step in which the adjustment unit adjusts the temperature of the substrate placed on the stage so that it becomes the temperature of the transport unit measured by the measurement unit.

21. When executed by a computer, the computer will A substrate processing apparatus comprising a stage on which a substrate is placed, a transport unit for transporting the substrate from the stage, a measuring unit for measuring the temperature of the transport unit, and an adjustment unit for adjusting the temperature of the substrate placed on the stage, characterized in that an adjustment step is performed to cause the adjustment unit to adjust the temperature of the substrate placed on the stage so that it becomes the temperature of the transport unit measured by the measuring unit.

Images