Electrical connection unit

Abstract

One embodiment provides an electrical connection unit that can be miniaturized. [Solution] An electrical connection unit according to one embodiment comprises a support, a first busbar, a second busbar, a first electronic component, and a second electronic component. The support has a first surface and a second surface located opposite to the first surface. The first busbar is supported by the support. The second busbar is supported by the support. The first electronic component faces the first surface of the support and is electrically connected to the first busbar. The second electronic component faces the second surface of the support and is electrically connected to the second busbar.

Description

Technical Field

[0001] Embodiments of the present invention relate to an electrical connection unit.

Background Art

[0002] An electrical connection unit having an electronic component and a bus bar connected to the electronic component is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, miniaturization of the electrical connection unit is expected.

[0005] One embodiment provides an electrical connection unit capable of achieving miniaturization.

Means for Solving the Problems

[0006] An electrical connection unit according to one embodiment includes a support, a first bus bar, a second bus bar, a first electronic component, and a second electronic component. The support has a first surface and a second surface located on the opposite side of the first surface. The first bus bar is supported by the support. The second bus bar is supported by the support. The first electronic component faces the first surface of the support and is electrically connected to the first bus bar. The second electronic component faces the second surface of the support and is electrically connected to the second bus bar.

Effects of the Invention

[0007] According to one embodiment, miniaturization of the electrical connection unit can be achieved. [Brief explanation of the drawing]

[0008] [Figure 1] A cross-sectional view showing the electrical connection unit of the first embodiment. [Figure 2] A perspective view illustrating the main body of the first embodiment. [Figure 3] A perspective view illustrating a subunit of the first embodiment. [Figure 4] A perspective view showing a partially disassembled subunit of the first embodiment. [Figure 5] A perspective view illustrating the electronic components and connecting components of the first embodiment. [Figure 6] A perspective view illustrating the electronic components and connecting components of the first embodiment. [Figure 7] A perspective view showing the connecting components of the first embodiment. [Figure 8] A perspective view showing a wiring substrate of the first embodiment. [Figure 9] A perspective view showing a partially disassembled wiring substrate of the first embodiment. [Figure 10] A plan view showing the wiring substrate of the first embodiment. [Figure 11] A perspective view showing a partially disassembled electrical connection unit of the first embodiment. [Figure 12] A bottom view showing the wiring substrate of the first embodiment. [Figure 13] A cross-sectional view of the structure shown in Figure 10, along the line F13-F13. [Figure 14] A plan view showing a part of the electrical connection unit of a first modified example of the first embodiment. [Figure 15] A cross-sectional view of the structure shown in Figure 14, along the line F15-F15. [Figure 16] A plan view showing a portion of the electrical connection unit of a second modified example of the first embodiment. [Figure 17] A cross-sectional view showing an electrical connection unit of a third modified example of the first embodiment. [Figure 18] A cross-sectional view showing an electrical connection unit of a fourth modified example of the first embodiment. [Figure 19]Perspective view showing a part of the electrical connection unit according to the fifth modification of the first embodiment. [Figure 20] Cross-sectional view taken along line F20 - F20 of the structure shown in FIG. 19. [Figure 21] Cross-sectional view showing the electrical connection unit according to the second embodiment. [Figure 22] Perspective view showing a part of the electrical connection unit according to the second embodiment. [Figure 23] Cross-sectional view taken along line F23 - F23 of the structure shown in FIG. 22. [Figure 24] Cross-sectional view taken along line F24 - F24 of the structure shown in FIG. 22. [Figure 25] Cross-sectional view showing the electrical connection unit according to the third embodiment. [Figure 26] Exploded perspective view showing a part of the electrical connection unit according to the third embodiment. [Figure 27] Cross-sectional view showing a part of the electrical connection unit according to the third embodiment.

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described with reference to the drawings. In the following description, components having the same or similar functions are denoted by the same reference numerals. And redundant descriptions of those components may be omitted. Note that the configurations described below do not limit the scope of the embodiments.

[0010] In this disclosure, terms are defined as follows: “Connection” may include electrical connections, not just mechanical ones. That is, “Connection” may include cases where two elements to be connected are directly connected, not just cases where two elements to be connected are connected with another element in between. “Accommodation” may include cases where only a part of a part is accommodated, not just cases where the entire part is accommodated (with another part of the part protruding). “Facing” means that the virtual projections of two objects overlap when viewed from a particular direction. That is, “Facing” may include cases where two objects face each other with another member present between them, not just cases where two objects face each other. “Adjacent” may include cases where two elements are adjacent, not just cases where two elements are touching, not just cases where two elements are placed side by side but separated from each other. “Parallel,” “orthogonal,” or “same” may include cases where they are “approximately parallel,” “approximately orthogonal,” or “approximately the same,” respectively.

[0011] In this disclosure, the +X direction, -X direction, +Y direction, -Y direction, +Z direction, and -Z direction are defined as follows: The +X direction is the direction from the first end 80e1 to the second end 80e2 of the metal plate 80, which will be described later (see Figure 2). The -X direction is the direction opposite to the +X direction. Hereinafter, when the +X direction and the -X direction are not distinguished, they will simply be referred to as the "X direction". The +Y direction and the -Y direction are directions that intersect (e.g., are orthogonal to) the X direction. The +Y direction is the direction from the third end 80e3 to the fourth end 80e4 of the metal plate 80, which will be described later (see Figure 2). The -Y direction is the direction opposite to the +Y direction. Hereinafter, when the +Y direction and the -Y direction are not distinguished, they will simply be referred to as the "Y direction". The +Z direction and the -Z direction are directions that intersect (e.g., are orthogonal to) the X direction and the Y direction. The +Z direction is the direction from the second surface 40s2 to the first surface 40s1 of the wiring substrate 40M, which will be described later (see Figure 1). The -Z direction is the opposite direction to the +Z direction. Hereafter, if the +Z direction and the -Z direction are not distinguished, they will simply be referred to as the "Z direction". The Z direction is an example of the "first direction". One of the X and Y directions is an example of the "second direction".

[0012] In the following, the X and Y directions may be referred to as the "horizontal direction" if they are not distinguished. In the following, the Z direction may be referred to as the "vertical direction." Also, in the following, the +Z direction may be referred to as "up" and the -Z direction as "down." However, these expressions are for the sake of explanation and do not limit the direction of gravity of the electrical connection unit 1 (the installation orientation of the electrical connection unit 1).

[0013] (First Embodiment) <1. Configuration of the electrical connection unit> Figure 1 is a cross-sectional view showing an electrical connection unit 1 according to an embodiment. The electrical connection unit 1 is an in-vehicle device installed in vehicles such as EVs (Electric Vehicles), HEVs (Hybrid Electric Vehicles), or PHEVs (Plug-in Hybrid Electric Vehicles). The electrical connection unit 1 may also be referred to as an "electrical connection box" or "junction box." However, the electrical connection unit 1 is not limited to a box-shaped device.

[0014] The electrical connection unit 1 includes, for example, a main body MU, a metal plate 80, insulating sheets 91A, 91B, a plurality of heat transfer members 92, a plurality of heat transfer parts 93, and an insulating cover 94.

[0015] <2. Main body> First, let me explain the main unit (MU). Figure 2 is a perspective view illustrating the main body MU. The main body MU is the part of the electrical connection unit 1 that performs the main function (e.g., switching of electrical connection states or overcurrent protection). In this embodiment, the main body MU is divided into a plurality of subunits SU. The main body MU is formed by connecting a plurality of subunits SU. In this embodiment, the main body MU has three subunits SU (subunits SUX, SUY, SUZ). Each subunit SU may be referred to as a "circuit configuration".

[0016] Subunit SUX has a first electrical function. Subunit SUX includes, for example, a plurality of electronic components 10X and a first wiring board 40X. The plurality of electronic components 10X are electrically connected to the first wiring board 40X. The plurality of electronic components 10X includes, for example, one or more electronic components 10XU and one or more electronic components 10XL (see Figure 1). Electronic component 10XU is positioned on the +Z side with respect to the first wiring board 40X (wiring board 40M). Electronic component 10XU faces the first surface 40s1 of the wiring board 40M. On the other hand, electronic component 10XL is positioned on the -Z side with respect to the first wiring board 40X (wiring board 40M). Electronic component 10XL faces the second surface 40s2 of the wiring board 40M.

[0017] Subunit SUY has a second electrical function, which is different from the first function. Subunit SUY includes, for example, a plurality of electronic components 10Y and a second wiring board 40Y. The plurality of electronic components 10Y are electrically connected to the second wiring board 40Y. The plurality of electronic components 10Y include, for example, one or more electronic components 10YU and one or more electronic components 10YL (see Figure 1). The electronic component 10YU is positioned on the +Z side relative to the second wiring board 40Y (wiring board 40M). The electronic component 10YU faces the first surface 40s1 of the wiring board 40M. On the other hand, the electronic component 10YL is positioned on the -Z side relative to the second wiring board 40Y (wiring board 40M). The electronic component 10YL faces the second surface 40s2 of the wiring board 40M.

[0018] Subunit SUZ has a third electrical function. This third function is different from the first and second functions. Subunit SUZ includes, for example, a plurality of electronic components 10Z and a third wiring board 40Z. The plurality of electronic components 10Z are electrically connected to the third wiring board 40Z. The plurality of electronic components 10Z includes, for example, one or more electronic components 10ZU and one or more electronic components 10ZL (see Figure 1). Electronic component 10ZU is positioned on the +Z side relative to the third wiring board 40Z (wiring board 40M). Electronic component 10ZU faces the first surface 40s1 of the wiring board 40M. On the other hand, electronic component 10ZL is positioned on the -Z side relative to the third wiring board 40Z (wiring board 40M). Electronic component 10ZL faces the second surface 40s2 of the wiring board 40M.

[0019] In this embodiment, the three subunits SUX, SUY, and SUZ are arranged side by side in the X direction. For example, subunit SUX is positioned on the +X side relative to subunit SUY. Subunits SUX and SUY are electrically connected via a plurality of connecting busbars 75 spanning the first wiring board 40X and the second wiring board 40Y. On the other hand, subunit SUZ is positioned on the -X side relative to subunit SUY. Subunits SUZ and SUY are electrically connected via a plurality of connecting busbars 75 (only one is shown in Figure 2) spanning the third wiring board 40Z and the second wiring board 40Y. The connecting busbars 75 may be positioned on the +Z side or the -Z side relative to the plurality of subunits SU.

[0020] In this embodiment, the three cable routing substrates 40X, 40Y, and 40Z included in the three subunits SUX, SUY, and SUZ are arranged on the same plane. In other words, the three cable routing substrates 40X, 40Y, and 40Z are positioned at the same height in the Z direction. As a result, the three cable routing substrates 40X, 40Y, and 40Z form one large cable routing substrate 40M.

[0021] The cable routing substrate 40M has a first surface 40s1 and a second surface 40s2 (see Figure 1). The first surface 40s1 is a surface oriented in the +Z direction. The first surface 40s1 is formed, for example, by the first surface 51a (described later) of the planar portion 51 of the base plate 41 of the three cable routing substrates 40X, 40Y, and 40Z. On the other hand, the second surface 40s2 is located on the opposite side from the first surface 40s1. The second surface 40s2 is a surface oriented in the -Z direction. The second surface 40s2 is formed, for example, by the second surface 51b (described later) of the planar portion 51 of the base plate 41 of the three cable routing substrates 40X, 40Y, and 40Z.

[0022] In this embodiment, the three subunits SUX, SUY, and SUZ have the same or similar basic structure as each other. Therefore, the following description will focus on one subunit, SU, as a representative. Hereafter, when subunits SUX, SUY, and SUZ are not distinguished, they will simply be referred to as "subunit SU". Similarly, when electronic components 10X, 10Y, and 10Z are not distinguished, they will simply be referred to as "electronic component 10". Likewise, when electronic components 10XU, 10YU, and 10ZU are not distinguished, they will simply be referred to as "electronic component 10U". When electronic components 10XL, 10YL, and 10ZL are not distinguished, they will simply be referred to as "electronic component 10L". Furthermore, when the first wiring substrate 40X, the second wiring substrate 40Y, and the third wiring substrate 40Z are not distinguished, they will simply be referred to as "wiring substrate 40". One subunit SU, included in the three subunits SUX, SUY, and SUZ, is an example of a "first subunit." On the other hand, another subunit SU, also included in the three subunits SUX, SUY, and SUZ, is an example of a "second subunit."

[0023] Furthermore, the main body MU does not necessarily have to be divided into multiple subunits SU, as in the example described above. That is, the main body MU may be formed from multiple electronic components 10 and one wiring substrate 40. Also, the two or more subunits SU are not limited to subunits SU having different functions, but may also be subunits SU having the same function.

[0024] <3. Subunit Configuration> Next, we will explain the configuration of the subunit SU. Figure 3 is a perspective view illustrating subunit SU. Figure 4 is a perspective view showing subunit SU partially disassembled. Subunit SU includes, for example, a plurality of electronic components 10, a plurality of connecting components 20 for component connection, a plurality of connecting components 30 for external connection, and a wiring substrate 40. The connecting components 20 and 30 are members that form vertical electrical circuits. The connecting components 20 and 30 may also be referred to as "vertical wiring members".

[0025] <3.1 Electronic components and connectors for connecting components> First, we will describe the electronic component 10 and the connecting component 20 for connecting the component. Electronic component 10 is an electronic component mounted on the subunit SU according to the required functions. Electronic component 10 may be, for example, a connector, fuse, relay (e.g., mechanical relay or semiconductor relay), capacitor, branching component, various sensors (e.g., current sensor or voltage sensor), electronic control unit, or an electronic component unit that combines two or more of these. The type of electronic component 10 is not limited to the above examples. Electronic component 10 may be, for example, a heat-generating component that generates heat when energized. Below, a first type electronic component 10M and a second type electronic component 10N will be described as examples of electronic component 10.

[0026] The connecting component 20 is a component that electrically connects the electronic component 10 and the wiring substrate 40. The connecting component 20 forms part of the current-carrying circuit in the subunit SU. The connecting component 20 is made of metal (for example, copper or a copper alloy). The connecting component 20 may also be referred to as a "metal component". Below, a first type of connecting component 20M and a second type of connecting component 20N will be described as examples of the connecting component 20.

[0027] <3.1.1 Type 1 Electronic Components> Figure 5 is a perspective view showing a first-type electronic component 10M and a first-type connecting component 20M. For the sake of explanation, in Figure 5, the orientation of the electronic component 10 (electronic component 10U), which is positioned on the +Z direction side with respect to the wiring substrate 40, is used as the reference for illustrating the electronic component 10M and the connecting component 20M. The first-type electronic component 10M is an electronic component in which a plurality of terminals 13 are arranged in a row at one end of the electronic component 10M. The electronic component 10M has, for example, a case 11, a component body 12, a plurality of terminals 13, and a plurality of mounting parts 14.

[0028] (case) The case 11 is an outer casing that forms most of the external shape of the electronic component 10M. The case 11 is made of, for example, synthetic resin and has insulating properties. The case 11 houses the component body 12. The case 11 and the component body 12 may be formed as a single unit.

[0029] In this embodiment, the case 11 has insulating ribs 11a that protrude horizontally (e.g., in the X direction) and extend in the Z direction. The insulating ribs 11a are, for example, plate-shaped and aligned horizontally (e.g., in the X direction) and in the Z direction. The insulating ribs 11a extend, for example, along the entire length of the case 11 in the Z direction. The insulating ribs 11a are positioned between a plurality of terminals 13 (terminals 13A and 13B, described later). The insulating ribs 11a electrically insulate terminals 13A and 13B. In this embodiment, a portion of the insulating ribs 11a is positioned between the first portions 21 (described later) of two connecting components 20M connected to the electronic component 10M. The insulating ribs 11a electrically insulate between the first portions 21 of the two connecting components 20M connected to the electronic component 10M.

[0030] (Main part of the component) The main body of the component 12 is the part that performs the main function of the electronic component 10M. For example, if the electronic component 10M is a relay, the main body of the component 12 includes a switching part (e.g., a contact part) that switches between a conductive state and a non-conductive state. For example, if the electronic component 10M is a fuse, the main body of the component 12 includes a fuse that melts when an overcurrent flows. For example, if the electronic component 10M is a capacitor, the main body of the component 12 includes a part that stores electric charge.

[0031] (Terminals) Terminal 13 is an electrical connection part exposed to the outside of case 11. Terminal 13 is electrically connected to the component body 12 inside case 11. In this embodiment, the electronic component 10M includes terminals 13A and terminal 13B as a plurality of terminals 13. One of terminals 13A and terminal 13B is the positive terminal. The other of terminals 13A and terminal 13B is the negative terminal. One of terminals 13A and terminal 13B is an example of a "first terminal". The other of terminals 13A and terminal 13B is an example of a "second terminal".

[0032] In this embodiment, terminals 13A and 13B are provided at one end of the electronic component 10M in the horizontal direction (e.g., the X direction). Terminals 13A and 13B are arranged side by side in the horizontal direction (e.g., the Y direction). Each terminal 13 has a mounting hole 13h into which a fastening member 71 (e.g., a screw or bolt), described later, is attached. The mounting hole 13h opens in the horizontal direction (e.g., the X direction). The inner circumferential surface of the mounting hole 13h of the electronic component 10M has a screw groove.

[0033] (Mounting part) The mounting portion 14 is a part for fixing the electronic component 10M. The mounting portion 14 has a mounting hole 14h into which a fastening member 112 (for example, a screw or bolt, see Figure 11) described later is attached. The mounting hole 14h opens in the Z direction. The mounting hole 14h is a through hole through which the fastening member 112 passes. The destination for fixing the mounting portion 14 will be described later.

[0034] <3.1.2 Type 1 Connectors> The first type of connecting component 20M is a component that electrically connects the first type of electronic component 10M to the routing board 40. In this embodiment, the connecting component 20M electrically connects the electronic component 10M to the busbar 42 (see Figure 8) included in the routing board 40. In this embodiment, the width L12 of the connecting component 20M in the longitudinal direction (e.g., X direction) of the electronic component 10M is smaller than the longitudinal width L11 of the electronic component 10M. The connecting component 20M has, for example, a first portion 21 and a second portion 22.

[0035] (Part 1) The first portion 21 of the connecting component 20M is the portion that connects to the terminal 13 of the electronic component 10M. The first portion 21 is a plate-like or rectangular parallelepiped portion that extends in the Z direction. The first portion 21 extends in the Z direction along one end of the electronic component 10M (for example, the end in the X direction). The first portion 21 is an upright portion that stands upright in the Z direction relative to the routing substrate 40 (for example, relative to the bus bar 42 described later). The first portion 21 is adjacent to the electronic component 10M in the horizontal direction (for example, the X direction). For example, the first portion 21 is adjacent to the terminal 13 of the electronic component 10M in the horizontal direction (for example, the X direction) and is connected to the terminal 13 of the electronic component 10M from the horizontal direction (for example, the X direction).

[0036] The first portion 21 of the connecting component 20M has a first mounting hole 21h through which a fastening member 71 (e.g., a screw or bolt) is passed. The first mounting hole 21h opens horizontally (e.g., in the X direction). The first portion 21 also has a recess 25 around the first mounting hole 21h. The recess 25 is a accommodating part that houses the head of the fastening member 71 inserted into the first mounting hole 21h. The first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10M by the fastening member 71 passed through the first mounting hole 21h engaging with the mounting hole 13h of the terminal 13 of the electronic component 10M. Note that the first portion 21 does not necessarily have a recess 25.

[0037] (Second part) The second portion 22 of the connecting component 20M is the portion that connects to the bus bar 42 (see Figure 8). The second portion 22 protrudes horizontally (e.g., in the X direction) from the -Z direction end of the first portion 21. The second portion 22 is a plate portion that runs horizontally. The second portion 22 is adjacent to the bus bar 42 in the Z direction and connects to the bus bar 42 from the Z direction. The second portion 22 of the connecting component 20M is attached from the Z direction to a fastening member 43 (e.g., a screw or bolt, see Figure 8) that protrudes from the bus bar 42 in the +Z direction, and is physically and electrically connected to the bus bar 42. In this embodiment, the second portion 22 of the connecting component 20M has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The second portion 22 has the fastening member 43 passing through the second mounting hole 22h. Then, the second portion 22 is fixed to the busbar 42 by engaging the tip of the fastening member 43, which is passed through the second mounting hole 22h, with the engaging member 44 (for example, a nut, see Figure 3). In this embodiment, the first portion 21 and the second portion 22 form an L-shaped single connecting component 20M.

[0038] <3.1.3 Second Type Electronic Components> Figure 6 is a perspective view showing a second type electronic component 10N and a second type connecting component 20N. For the sake of explanation, in Figure 6, the orientation of the electronic component 10 (electronic component 10U), which is positioned on the +Z side relative to the wiring substrate 40, is used as the reference for illustrating the electronic component 10N and the connecting component 20N. The second type electronic component 10N is an electronic component in which two terminals 13 are arranged separately at both ends in the horizontal direction of the electronic component 10N. The electronic component 10N has, for example, a case 11, a component body 12, and multiple terminals 13. In the configuration of the electronic component 10N, components that have the same function as electronic component 10M are denoted by the same reference numerals. In this case, the explanation of electronic component 10N can be explained by replacing "electronic component 10M" with "electronic component 10N" in the explanation of electronic component 10M described above.

[0039] In the electronic component 10N, terminals 13A and 13B are arranged separately at both ends of the electronic component 10N in the horizontal direction (e.g., the X direction). Each terminal 13 has a mounting hole 13h into which a fastening member 72 (e.g., a screw or bolt), described later, is attached. The mounting hole 13h opens in the Z direction. For example, the mounting hole 13h of the electronic component 10N is a through hole through which the fastening member 72 passes. One of terminals 13A and 13B is an example of a "first terminal". The other of terminals 13A and 13B is an example of a "second terminal".

[0040] <3.1.4 Type 2 Connectors> The second type of connecting component 20N is a component that electrically connects the second type of electronic component 10N to the routing substrate 40. In this embodiment, the connecting component 20N electrically connects the electronic component 10N to the busbar 42 (see Figure 8) included in the routing substrate 40. In this embodiment, the width L12 of the connecting component 20N in the longitudinal direction (e.g., X direction) of the electronic component 10N is smaller than the longitudinal width L11 of the electronic component 10N. The connecting component 20N has, for example, a first part 21, a second part 22, and a third part 23.

[0041] (Part 1) The first portion 21 of the connecting component 20N is the portion that connects to the terminal 13 of the electronic component 10N. The first portion 21 is a rectangular parallelepiped portion that extends in the Z direction. The first portion 21 is an upright portion that stands upright in the Z direction relative to the routing substrate 40 (for example, relative to the bus bar 42). The first portion 21 is adjacent to the terminal 13 of the electronic component 10N in the Z direction and connects to the terminal 13 of the electronic component 10N from the Z direction. The first portion 21 of the connecting component 20N has a first mounting hole 21h into which a fastening member 72 engages. The first mounting hole 21h opens in the Z direction. The inner circumferential surface of the first mounting hole 21h of the connecting component 20N has a screw groove. The first portion 21 is physically and electrically connected to the terminal 13 of the electronic component 10N by the fastening member 72, which is passed through the mounting hole 13h of the terminal 13 of the electronic component 10N, engaging with the mounting hole 21h of the first portion 21.

[0042] (Second part) The second portion 22 of the connecting component 20N is the portion that connects to the bus bar 42 (see Figure 8). The second portion 22 protrudes horizontally (e.g., in the X direction) from the -Z direction end of the first portion 21. The second portion 22 is a plate portion that runs horizontally. The second portion 22 is adjacent to the bus bar 42 in the Z direction and connects to the bus bar 42 from the Z direction. The second portion 22 of the connecting component 20N is attached from the Z direction to a fastening member 43 (e.g., a screw or bolt, see Figure 8) that protrudes from the bus bar 42 in the +Z direction, and is physically and electrically connected to the bus bar 42. In this embodiment, the second portion 22 of the connecting component 20N has a second mounting hole 22h through which the fastening member 43 passes. The second mounting hole 22h is open in the Z direction. The fastening member 43, described later, passes through the second mounting hole 22h of the second portion 22. Then, the second portion 22 is fixed to the busbar 42 by engaging the tip of the fastening member 43, which is passed through the second mounting hole 22h, with the engaging member 44 (for example, a nut, see Figure 3).

[0043] (3rd part) The third part 23 is an upright wall (side wall) that rises in the +Z direction from both horizontal ends of the second part 22. The third part 23 is a wall along the Z direction. The third part 23 is connected to the first part 21 and also to the second part 22. The third part 23 extends with an inclination such that it increases in the X direction as it moves in the -Z direction, for example. The third part 23 may be provided on the connecting component 20M described above. On the other hand, the connecting component 20N does not have to have the third part 23.

[0044] <3.1.5 Structure of connecting components> In this embodiment, the connecting component 20 (for example, connecting component 20M and connecting component 20N) is a heat storage member (heat absorption member) that increases the heat capacity of the current-carrying path of the electrical connection unit 1. The connecting component 20 stores (absorbs) at least a portion of the heat emitted by the electronic component 10, for example. Alternatively / in addition, the connecting component 20 may also store (absorb) at least a portion of the heat emitted by the busbar 42 itself when energized. The connecting component 20 may be referred to as a "heat storage component" or a "heat absorption component".

[0045] In this embodiment, the busbar 42 is positioned at a distance from the terminal 13 of the electronic component 10 (for example, at a distance in the Z direction). The connecting component 20 is positioned between the electronic component 10 and the busbar 42. In this disclosure, "the connecting component is positioned between the electronic component and the busbar" is not limited to cases where a portion of the connecting component is located between the electronic component and the busbar when viewed from the X or Y direction. "The connecting component is positioned between the electronic component and the busbar" may also refer to cases where a portion of the connecting component is located between the electronic component and the busbar when viewed from a direction inclined with respect to the X or Y direction. The connecting component 20 electrically connects the terminal 13 of the electronic component 10 and the busbar 42.

[0046] In this embodiment, the thickness of at least a portion of the connecting component 20 is greater than the thickness (thickness in the Z direction) T3 of the busbar 42 (see Figure 13). For example, the thickness T1 in the X direction of at least a portion of the connecting component 20 is greater than the thickness T3 of the busbar 42. In this embodiment, the thickness T1 in the X direction of the first portion 21 of the connecting component 20 is greater than the thickness T3 of the busbar 42. In this embodiment, the first portion 21 has a thickness T1 in the X direction that is greater than the thickness T3 of the busbar 42 as a thickness over its entire length in the Z direction. The thickness T1 in the X direction of the first portion 21 of the connecting component 20 is, for example, more than twice the thickness T3 of the busbar 42. In another view, the thickness T2 in the Z direction of the second portion 22 of the connecting component 20 may be greater than the thickness T3 of the busbar 42.

[0047] In this embodiment, the thickness T1 in the X direction of the first portion 21 of the connecting component 20 is greater than the thickness T2 in the Z direction of the second portion 22 of the connecting component 20. In this embodiment, the first portion 21 has a thickness T1 in the X direction that is greater than the thickness T2 in the Z direction of the second portion 22, over its entire length in the Z direction.

[0048] <3.2 Connection components for external connections> Next, we will describe the connection component 30 for external connection. Figure 7 is a perspective view showing a connecting component 30 for external connection. The connecting component 30 is a component that electrically connects the external connection bus bar 76 and the wiring board 40. In this embodiment, the connecting component 30 electrically connects the external connection bus bar 76 and the bus bar 42 (see Figure 8) included in the wiring board 40. The external connection bus bar 76 is electrically connected to an external device. In this disclosure, "external device" refers to an electrical device located outside the electrical connection unit 1. The external device is, for example, a battery unit mounted on a vehicle or an inverter for driving the vehicle's motor, but is not limited to these examples. The connecting component 30 has, for example, a first part 31, a second part 32, and a third part 33.

[0049] (Part 1) The first portion 31 is the portion that connects to the external bus bar 76. The first portion 31 is a rectangular parallelepiped portion that extends in the Z direction. The first portion 31 is an upright portion that stands upright in the Z direction relative to the routing base plate 40 (for example, relative to the bus bar 42). The first portion 31 is adjacent to the external bus bar 76 in the Z direction and connects to the external bus bar 76 from the Z direction. The first portion 31 has a first mounting hole 31h through which a fastening member 73 (for example, a screw or bolt) passes. The first mounting hole 31h opens in the Z direction. The inner circumferential surface of the first mounting hole 31h has a screw groove. The first portion 31 is physically and electrically connected to the external bus bar 76 by the fastening member 73, which is passed through the mounting hole 76h of the external bus bar 76, engaging with the mounting hole 31h of the first portion 31.

[0050] (Second part) The second portion 32 is the portion that connects to the busbar 42 (see Figure 8). The second portion 32 protrudes horizontally (e.g., in the X direction) from the -Z direction end of the first portion 31. The second portion 32 is a plate portion that runs horizontally. The second portion 32 is adjacent to the busbar 42 in the Z direction and connects to the busbar 42 from the Z direction. The second portion 32 is attached from the Z direction to a fastening member 43 (e.g., a screw or bolt, see Figure 8) that protrudes from the busbar 42 in the +Z direction, and is physically and electrically connected to the busbar 42. In this embodiment, the second portion 32 has a second mounting hole 32h through which the fastening member 43 passes. The second mounting hole 32h is open in the Z direction. The fastening member 43, described later, passes through the second mounting hole 32h of the second portion 32. Then, the second portion 32 is fixed to the busbar 42 by engaging the tip of the fastening member 43, which is passed through the second mounting hole 32h, with the engaging member 44 (for example, a nut, see Figure 3).

[0051] (3rd part) The third part 33 is an upright wall (side wall) that rises in the +Z direction from both horizontal ends of the second part 32. The third part 33 is a wall that runs along the Z direction. The third part 33 is connected to the first part 31 and also to the second part 32. The third part 33 extends with an inclination such that it increases in the X direction (or Y direction) as it proceeds in the -Z direction, for example. Note that the connecting part 30 does not necessarily have to have the third part 33.

[0052] Furthermore, the dimensional relationships between the connecting component 20 and the busbar 42 described above (for example, the dimensional relationships related to thicknesses T1, T2, and T3) are the same for the connecting component 30 to which the external connecting busbar 76 is connected. For example, the explanation of the connecting component 30 can be given by replacing "connecting component 20" with "connecting component 30", "first part 21" with "first part 31", and "second part 22" with "second part 32" in the explanation of the connecting component 20 described above.

[0053] <3.3 Circuit board for cable routing> Next, the wiring substrate 40 will be described. Figure 8 is a perspective view showing the wiring substrate 40. The wiring substrate 40 is a component that forms at least a portion of the electrical conduction paths between a plurality of electronic components 10, and / or at least a portion of the electrical conduction paths between the electronic components 10 and external equipment. In this disclosure, "wiring substrate" means a substrate-type wiring structure. "Substrate-type" means that, when viewed as a whole, regardless of the fine shape, it is in the shape of a plate along a single plane. In this disclosure, "plate-like," "sheet-like," or "plane" is not limited to cases where it is perfectly flat, but may include cases where there are fixing structures or ribs protruding in the Z direction, or where there are uneven shapes on the surface that follow the thickness of the busbars. In this embodiment, the wiring substrate 40 is in the shape of a plate along the X and Y directions.

[0054] The cable routing substrate 40 includes, for example, a base plate 41, one or more (e.g., multiple) busbars 42, and multiple fastening members 43. In this embodiment, the base plate 41 and the multiple busbars 42 are integrated by insert molding. For example, the cable routing substrate 40 is formed as a single piece by insert molding of the busbars 42 with the base plate 41 after the fastening members 43 have been fixed to the busbars 42. That is, the busbars 42 are integrated with the base plate 41 without using fastening members such as screws or bolts. The cable routing substrate 40 may be formed by a different structure instead of insert molding. Modified examples in which the cable routing substrate 40 is formed by a different structure will be described later.

[0055] Figure 9 is a perspective view showing the cable routing board 40 in a partially disassembled state. For the sake of convenience, the base plate 41, bus bar 42, and fastening member 43 will be described below with reference to the partially disassembled drawing of the cable routing board 40.

[0056] <3.3.1 Base Plate> The base plate 41 is a holding member that integrally holds (supports) a plurality of busbars 42 arranged horizontally with spacing between them. The base plate 41 is made of, for example, synthetic resin and has insulating properties. The base plate 41 electrically insulates the plurality of busbars 42. The base plate 41 is an example of a "base member". The base plate 41 may also be called an "insulating substrate". In this embodiment, the base plate 41 forms a support SB that is placed between a plurality of electronic components 10U, 10L. In this embodiment, the support SB is formed by a single insulating member (base plate 41). The base plate 41 has, for example, a flat portion 51, a plurality of fixing portions 52, and a plurality of fixing portions 53. Here, the flat portion 51 and the fixing portions 53 will be described. The fixing portions 52 will be described later.

[0057] (Plane part) The flat portion 51 is a plate-shaped part formed within the base plate 41. The flat portion 51 is plate-shaped and oriented horizontally. The flat portion 51 forms the main part of the base plate 41. The flat portion 51 forms the base (insulating base) of the base plate 41. In this embodiment, the flat portion 51 extends across the entire width of the base plate 41 in the X direction, except for the four corners of the base plate 41, and also extends across the entire width of the base plate 41 in the Y direction.

[0058] The planar portion 51 has a first surface 51a and a second surface 51b. The first surface 51a is a surface oriented in the +Z direction. The first surface 51a is a plane aligned with the horizontal direction. The first surface 51a forms at least a part of the first surface 41s1 of the wiring substrate 40M described above. The first surface 51a faces one or more (e.g., multiple) electronic components 10U and also faces the insulating cover 94 (see Figure 1) of the electrical connection unit 1. The second surface 51b is located on the opposite side from the first surface 51a. The second surface 51b is a surface oriented in the -Z direction. The second surface 51b is a plane aligned with the horizontal direction. The second surface 51b forms at least a part of the second surface 41s2 of the wiring substrate 40M described above. The second surface 51b faces one or more (e.g., multiple) electronic components 10L and also faces the metal plate 80 (see Figure 1). The thickness direction (plate thickness direction) of the flat portion 51 is the Z direction.

[0059] The flat section 51 has, for example, one or more (e.g., multiple) housing sections 55, each of which accommodates a busbar 42. The multiple housing sections 55 are formed apart from each other in the X or Y direction. Each housing section 55 is, for example, a through hole that penetrates the flat section 51 (penetrates the base plate 41) in the Z direction. Alternatively, the housing section 55 may be a recess provided on the first surface 51a or the second surface 51b of the flat section 51 and recessed in the Z direction. For example, the housing section 55 may be a recess recessed from the first surface 51a of the flat section 51 toward the -Z direction, or a recess recessed from the second surface 51b of the flat section 51 toward the +Z direction. In this disclosure, "the housing portion penetrates the planar portion in the first direction (Z direction)" may also include cases where a portion of the total length of the housing portion 55 penetrates the planar portion 51 in the Z direction (for example, the remaining portion of the housing portion 55 may be a recess in the Z direction, or it may be provided inside the base plate 41 and not exposed to the outside of the base plate 41). Similarly, in this disclosure, "the housing portion is recessed in the first direction (Z direction)" may also include cases where a portion of the total length of the housing portion 55 is recessed in the Z direction (for example, the remaining portion of the housing portion 55 may be a through hole penetrating the planar portion 51 in the Z direction, or it may be provided inside the base plate 41 and not exposed to the outside of the base plate 41).

[0060] Each housing section 55 has an external shape corresponding to the shape of the bus bar 42 it houses when viewed from the Z direction. In this embodiment, the planar section 51 includes, for example, five housing sections 55A, 55B, 55C, 55D, and 55E as a plurality of housing sections 55. Housing section 55A is provided in correspondence with the bus bar 42A described later and houses the bus bar 42A. Housing section 55B is provided in correspondence with the bus bar 42B described later and houses the bus bar 42B. Housing section 55C is provided in correspondence with the bus bar 42C described later and houses the bus bar 42C. Housing section 55D is provided in correspondence with the bus bar 42D described later and houses the bus bar 42D. Housing section 55E is provided in correspondence with the bus bar 42E described later and houses the bus bar 42E.

[0061] (Fixed part) The fixing portion 53 is a fixing portion to which the electronic component 10 is attached. The fixing portion 53 is, for example, a boss protruding in the Z direction from the flat portion 81. The fixing portion 83 faces the mounting portion 14 of the electronic component 10 in the Z direction. The fixing portion 53 has an engagement hole 53h that opens in the +Z direction. The inner circumferential surface of the engagement hole 53h has a screw groove. The fixing portion 53 is formed, for example, by embedding a metal part having the engagement hole 53h in the flat portion 51 of the base plate 41.

[0062] A fastening member 112 (for example, a screw or bolt) is passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 along the Z direction. When the fastening member 112 passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 engages with the engagement hole 53h of the fixing portion 53, the electronic component 10 is fixed to the base plate 41.

[0063] In this embodiment, the fixing portion 53 to which the electronic component 10U is fixed protrudes in the +Z direction from the flat portion 51 of the base plate 41. The mounting portion 14 of the electronic component 10U is fixed to the fixing portion 53 from the +Z direction side. On the other hand, the fixing portion 53 to which the electronic component 10L is fixed protrudes in the -Z direction from the flat portion 51 of the base plate 41. The mounting portion 14 of the electronic component 10L is fixed to the fixing portion 53 from the -Z direction side.

[0064] <3.3.2 Busbar> The busbar 42 is a routing member (electrical connection member) included in the routing substrate 40. The busbar 42 is, for example, a routing member for electrically connecting a plurality of electronic components 10. Alternatively, the busbar 42 may be a routing member for connecting the electronic components 10 to an external device. The busbar 42 is made of metal (for example, copper or a copper alloy) and is conductive. In this embodiment, the routing substrate 40 has a plurality of busbars 42, for example, five busbars 42A, 42B, 42C, 42D, and 42E. The five busbars 42A, 42B, 42C, 42D, and 42E are arranged horizontally with space between them. The five busbars 42A, 42B, 42C, 42D, and 42E include portions that are arranged on the same plane. The five busbars 42A, 42B, 42C, 42D, and 42E are at least partially adjacent in the X or Y direction. The five busbars 42A, 42B, 42C, 42D, and 42E are supported by the planar portion 51 of the base plate 41.

[0065] Each of the five busbars 42A, 42B, 42C, 42D, and 42E is housed in a housing 55 and is at least partially exposed to the first surface 51a of the base plate 41 and at least partially exposed to the second surface 51b of the base plate 41. Each of the five housings 55A, 55B, 55C, 55D, and 55E corresponding to these five busbars 42 may be a recess in the -Z direction from the first surface 51a of the flat portion 51, or a recess in the +Z direction from the second surface 51b of the flat portion 51, instead of a through hole penetrating the base plate 41 in the Z direction.

[0066] (Bus bar cable routing structure) At least a portion of each busbar 42 is plate-shaped and oriented horizontally. At least a portion of each busbar 42 is housed in the housing 55 and extends along the planar portion 51. That is, at least a portion of each busbar 42 extends along the first surface 51a of the planar portion 51. At least a portion of each busbar 42 extends horizontally within the housing 55. In this embodiment, each busbar 42 is plate-shaped and oriented horizontally throughout its entire length. Each busbar 42 is housed in the housing 55 and extends along the planar portion 51 throughout its entire length. Hereinafter, the portion of each busbar 42 that is housed in the housing 55 and extends along the planar portion 51 may be referred to as the "plate portion 42p". The busbar 42 is a member that forms a horizontal electrical circuit. The busbar 42 may also be referred to as a "horizontal wiring member".

[0067] Figure 10 is a plan view showing the wiring substrate 40. Each busbar 42 has, for example, a first connecting portion 61, a second connecting portion 62, and an extended portion 63.

[0068] The first connection portion 61 is the part that contacts one connection component 20 (hereinafter referred to as "first connection component 20"). The first connection component 20 is a connection component that connects one electronic component 10 (hereinafter referred to as "first electronic component 10") to the bus bar 42. The first connection portion 61 is the part of the bus bar 42 that overlaps with the first connection component 20 when viewed from the Z direction. The first connection portion 61 is adjacent to the first connection component 20 in the Z direction and is connected to the first connection component 20 from the Z direction.

[0069] The second connection portion 62 is the portion that contacts another connection component 20 (hereinafter referred to as "second connection component 20"). The second connection component 20 is a connection component that connects another electronic component 10 (hereinafter referred to as "second electronic component 10") included in the plurality of electronic components 10 to the bus bar 42. The second connection portion 62 is the portion of the bus bar 42 that overlaps with the second connection component 20 when viewed from the Z direction. The second connection portion 62 is adjacent to the second connection component 20 in the Z direction and is connected to the second connection component 20 from the Z direction.

[0070] Note that the second connection portion 62 may be a portion that contacts another connection component 30 (hereinafter referred to as "second connection component 30") instead of the above example. The connection component 30 is a connection component for connecting an external device to the busbar 42. In this case, the second connection portion 62 is the portion of the busbar 42 that overlaps with the second connection component 30 when viewed from the Z direction. The second connection portion 62 is adjacent to the second connection component 30 in the Z direction and is connected to the second connection component 30 from the Z direction.

[0071] Alternatively, the second connection portion 62 may be a portion that contacts a connecting busbar 75 for connecting to another subunit SU, instead of the connection parts 20 and 30. In this case, the second connection portion 62 is the portion of the busbar 42 that overlaps with the connecting busbar 75 when viewed from the Z direction. The second connection portion 62 is adjacent to the connecting busbar 75 in the Z direction and is connected to the connecting busbar 75 from the Z direction.

[0072] The extension portion 63 extends from the first connecting portion 61 in the X or Y direction. The extension portion 63 is provided between the first connecting portion 61 and the second connecting portion 62. The extension portion 63 extends across the first connecting portion 61 and the second connecting portion 62. The extension portion 63 connects the first connecting portion 61 and the second connecting portion 62.

[0073] In this embodiment, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are plate-shaped and oriented horizontally. In this embodiment, each busbar 42 is housed in the housing portion 55 over at least the first connecting portion 61 and the second connecting portion 62 and extends along the planar portion 51. For example, the first connecting portion 61, the second connecting portion 62, and the extension portion 63 are housed in the housing portion 55 and extend along the planar portion 51.

[0074] In this embodiment, the extensions 63 of some busbars 42 are housed in the housing 55, so that they extend across both sides of region R, which overlaps with the electronic component 10 when viewed from the Z direction. For example, the extensions 63 extend in a straight line along the X direction. The extensions 63 extend across the region R that overlaps with the electronic component 10 when viewed from the Z direction, so that they extend across the +X and -X sides of region R. In other words, by being housed in the housing 55, the busbars 42 can be routed along a better path (for example, a shorter path) without being obstructed by the presence of the electronic component 10.

[0075] Furthermore, one or more busbars 42 may have an extension portion 64 in addition to the first connection portion 61, the second connection portion 62, and the extension portion 63. The extension portion 64 is a portion of the busbar 42 that is extended for the purpose of increasing the heat dissipation area and / or increasing the heat capacity for heat storage (heat absorption). The extension portion 64 is a portion that is not used for electrical connection. For example, the extension portion 64 is located on the opposite side of the extension portion 63 from the first connection portion 61 (or the second connection portion 62). The extension portion 64 is plate-shaped and oriented horizontally. The extension portion 64 is housed in the housing portion 55 and extends along the planar portion 51. The extension portion 64 extends to a region R that overlaps with the electronic component 10 when viewed from the Z direction, and has the end 42e1 of the busbar 42 at a position that overlaps with the electronic component 10 when viewed from the Z direction.

[0076] The following describes some routing examples for the busbar 42. Note that the multiple electronic components 10 include three electronic components 10A, 10B, and 10C. Electronic components 10A and 10B are, for example, first-type electronic components 10M. Electronic component 10C is, for example, second-type electronic component 10N. Note that the types of electronic components 10 are not limited to the above examples.

[0077] In this embodiment, each of the electronic components 10A and 10B is an example of an electronic component 10 (electronic component 10U) positioned on the +Z direction side with respect to the base plate 41. The electronic components 10A and 10B face the first surface 51a of the planar portion 51 of the base plate 41 (the first surface 40s1 of the wiring substrate 40M) from the +Z direction side. Each of the electronic components 10A and 10B is an example of a "first electronic component". From another viewpoint, electronic component 10A is an example of a "first electronic component", and electronic component 10B is an example of a "third electronic component".

[0078] On the other hand, electronic component 10C is an example of an electronic component 10 (electronic component 10L) positioned on the -Z side relative to the base plate 41. Electronic component 10C faces the second surface 51b of the planar portion 51 of the base plate 41 (the second surface 40s2 of the wiring substrate 40M) from the -Z side. Electronic component 10C is an example of a "second electronic component".

[0079] In this embodiment, when viewed from the Z direction, electronic component 10B (electronic component 10U) and electronic component 10C (electronic component 10L) overlap at least partially. For example, when viewed from the Z direction, electronic component 10B overlaps with terminal 13A of electronic component 10C.

[0080] Multiple connection components 20 include six connection components 20A, 20B, 20C, 20D, 20E, and 20F. Multiple connection components 30 include two connection components 30A and 30B. Multiple connecting busbars 75 include two connecting busbars 75A and 75B. Multiple external connection busbars 76 include two external connection busbars 76A and 76B.

[0081] (1st wiring example) First, an example of wiring for busbar 42A will be described. Busbar 42A has a first connection part 61, a second connection part 62, and an extension part 63. The first connection part 61 is located on the +X side relative to the electronic component 10A when viewed from the Z direction. The first connection part 61 is electrically connected to terminal 13A of the electronic component 10A via a connection part 20A, which is the first connection part 20. The second connection part 62 is located on the -X side relative to the electronic component 10A when viewed from the Z direction. The second connection part 62 is electrically connected to another subunit SU via a connecting busbar 75A.

[0082] The extension portion 63, when housed in the housing portion 55, extends across both sides of region R, passing through a region R that overlaps with the electronic component 10A when viewed from the Z direction. For example, the extension portion 63 extends in a straight line along the X direction. The extension portion 63 extends across the region R that overlaps with the electronic component 10A when viewed from the Z direction, spanning both the +X and -X sides of region R. The busbar 42A is, for example, a busbar included in the positive electrode line PL of the electrical connection unit 1. The busbar 42A is an example of a "first busbar". The housing portion 55A is an example of a "first housing portion".

[0083] (Second wiring example) Next, an example of wiring for the busbar 42B will be described. The busbar 42B has a first connection part 61, a second connection part 62, an extension part 63, and an extension part 64. The first connection part 61 is electrically connected to the terminal 13B of the electronic component 10A via a connection part 20B, which is the first connection part 20. The second connection part 62 is electrically connected to the external connection busbar 76A via a connection part 30A, which is the second connection part 30. The extension part 64 extends to a region R that overlaps with the electronic component 10A when viewed from the Z direction, and has the end 42e1 of the busbar 42 at a position that overlaps with the electronic component 10A. Note that, similar to the busbar 42A, the busbar 42B may have an extension part 63 that extends through the region R that overlaps with the electronic component 10 when viewed from the Z direction, and spans both sides of the region R. The busbar 42B is, for example, a busbar included in the positive electrode line PL of the electrical connection unit 1.

[0084] (3rd wiring example) Next, an example of the busbar 42C will be described. The busbar 42C has a first connection part 61, a second connection part 62, an extension part 63, and an extension part 64. The first connection part 61 is electrically connected to terminal 13B of the electronic component 10B via a connection part 20C, which is a first connection part 20. The second connection part 62 is electrically connected to another subunit SU via a connecting busbar 75B. The extension part 64 extends to a region R that overlaps with the electronic component 10B when viewed from the Z direction, and has an end 42e1 of the busbar 42 at a position that overlaps with the electronic component 10B when viewed from the Z direction. The busbar 42C is, for example, a busbar included in the negative electrode line NL of the electrical connection unit 1. The busbar 42C is another example of the "first busbar". The housing part 55C is another example of the "first housing part".

[0085] (4th wiring example) Next, an example of wiring for the busbar 42D will be described. The busbar 42D has a first connection part 61, a second connection part 62, and an extension part 63. The first connection part 61 is electrically connected to terminal 13A of electronic component 10B via a connection part 20D, which is a first connection part 20. The second connection part 62 is electrically connected to terminal 13A of electronic component 10C via a connection part 20E, which is a second connection part 20. The busbar 42D is, for example, a busbar included in the negative electrode line NL of the electrical connection unit 1. The busbar 42D is an example of a "second busbar". The housing part 55D is an example of a "second housing part".

[0086] (5th wiring example) Next, an example of wiring for the busbar 42E will be described. The busbar 42E has a first connection portion 61, a second connection portion 62, and an extension portion 63. The first connection portion 61 is electrically connected to the terminal 13B of the electronic component 10C via a connection portion 20F, which is a first connection component 20. The second connection portion 62 is electrically connected to the external connection busbar 76B via a connection portion 30B, which is a second connection component 30. The busbar 42E is, for example, a busbar included in the negative electrode line NL of the electrical connection unit 1.

[0087] (Exposed busbar structure) Next, we will describe the exposed structure of the busbar 42. The exposed structure of the busbar 42 will be described with reference to Figures 8 and 9. In this embodiment, at least a portion of the extended portion 63 of the busbar 42 is exposed to the outside of the base plate 41 on the upper and lower sides. For example, the extended portion 63 of the busbar 42 is exposed to the outside of the base plate 41 on the upper and lower sides in at least a portion of the region R (see Figure 10) that overlaps with the electronic component 10 when viewed from the Z direction.

[0088] In this embodiment, the busbar 42 is housed in the housing 55 over its entire length, at least between the first connection portion 61 and the second connection portion 62, and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed to the outside of the base plate 41 on both the upper and lower sides over its entire length, at least between the first connection portion 61 and the second connection portion 62.

[0089] In this embodiment, the busbar 42 is housed in the housing portion 55 along its entire length and extends along the first surface 51a of the planar portion 51. The busbar 42 is exposed to the outside of the base plate 41 on both the upper and lower sides along its entire length.

[0090] <3.3.3 Fastening Members> Next, with reference to Figure 9, the fastening member 43 will be described. The fastening member 43 is a component for fixing the bus bar 42 to the component to which the bus bar 42 is connected (connecting component 20, connecting component 30, or connecting bus bar 75). The fastening member 43 is, for example, a crimping bolt fixed to the bus bar 42. The fastening member 43 is an example of a "fastening part".

[0091] In this embodiment, each of the first connecting portion 61 and the second connecting portion 62 of the bus bar 42 has a through hole 42h. The through hole 42h penetrates the bus bar 42 in the Z direction. The fastening member 43 is, for example, a bolt having a shaft portion 43a and a head portion 43b. The circumferential surface of the shaft portion 43a has screw grooves. The head portion 43b has a larger diameter than the shaft portion 43a. The fastening member 43 is crimped and fixed to the bus bar 42 with the shaft portion 43a passing through the through hole 42h of the bus bar 42, and the head portion 43b being crimped and fixed. With this fixing, the fastening member 43 is electrically and physically connected to the bus bar 42 with the shaft portion 43a protruding in the Z direction from the through hole 42h of the bus bar 42. Note that the fastening member 43 is not limited to crimping and may be fixed to the bus bar 42 by welding or other methods.

[0092] In this embodiment, the connecting component 20 is attached to the fastening member 43 from the Z direction, with the connecting component 20 already fixed to the electronic component 10 by the fastening member 71 or fastening member 72. For example, the connecting component 20 is inserted into the mounting hole 22h of the second portion 22 of the fastening member 43 by inserting the shaft portion 43a of the fastening member 43. Then, the engaging member 44 (e.g., a nut) is engaged with the shaft portion 43a of the fastening member 43 that protrudes from the mounting hole 22h of the second portion 22 of the connecting component 20. The engaging member 44 is attached to the shaft portion 43a, for example, along the Z direction. This engagement fixes the second portion 22 of the connecting component 20 to the fastening member 43.

[0093] In this embodiment, the busbar 42 has a first surface 42s1 and a second surface 42s2 (see Figure 13). The first surface 42s1 is a surface oriented in the +Z direction. On the other hand, the second surface 42s2 is located on the opposite side from the first surface 42s1. The second surface 42s2 is a surface oriented in the -Z direction.

[0094] In this embodiment, the fastening member 43 to which the connecting component 20 corresponding to the electronic component 10U is attached protrudes from the first surface 42s1 of the bus bar 42 toward the +Z direction. The connecting component 20 corresponding to the electronic component 10U is attached to the bus bar 42 from the +Z direction side such that the shaft portion 43a of the fastening member 43 is inserted into the mounting hole 22h of the connecting component 20. The connecting component 20 corresponding to the electronic component 10U is fixed to the bus bar 42 by, for example, an engaging member 44, while in contact with the first surface 42s1 of the bus bar 42 from the +Z direction side.

[0095] On the other hand, the fastening member 43 to which the connecting component 20 corresponding to the electronic component 10L is attached protrudes from the second surface 42s2 of the bus bar 42 toward the -Z direction. The connecting component 20 corresponding to the electronic component 10L is attached to the bus bar 42 from the -Z direction side such that the shaft portion 43a of the fastening member 43 is inserted into the mounting hole 22h of the connecting component 20. The connecting component 20 corresponding to the electronic component 10L is fixed to the bus bar 42 by, for example, an engaging member 44, while in contact with the second surface 42s2 of the bus bar 42 from the -Z direction side.

[0096] <4. Metal plate, insulating sheet, heat transfer component, and insulating cover> Next, the metal plate 80, insulating sheets 91A and 91B, heat transfer member 92, heat transfer section 93, and insulating cover 94 will be described.

[0097] <4.1 Metal Plate> Figure 11 is a perspective view showing a partially disassembled electrical connection unit 1. The metal plate 80 is a component that ensures the rigidity of the electrical connection unit 1 and improves its heat dissipation. The metal plate 80 is made of metal (for example, aluminum or an aluminum alloy). The metal plate 80 is an example of a "rigid member". The metal plate 80 may also be referred to as a "metal member" or a "heat dissipation member". In this embodiment, the metal plate 80 is positioned on the opposite side of the wiring substrate 40M from the electronic component 10L, and the wiring substrate 40M is fixed to it.

[0098] The metal plate 80 is rectangular in shape when viewed from the Z direction, oriented along the X direction. The metal plate 80 has a first end 80e1, a second end 80e2, a third end 80e3, and a fourth end 80e4 (see Figure 2). The first end 80e1 and the second end 80e2 are a pair of longitudinal ends of the metal plate 80, separated in the X direction. The third end 80e3 and the fourth end 80e4 are a pair of transverse ends of the metal plate 80, separated in the Y direction. The metal plate 80 includes, for example, a flat portion 81 and a plurality of fixing portions 82.

[0099] The flat portion 81 is a plate-shaped part formed within the metal plate 80. The flat portion 81 is plate-shaped and oriented horizontally. The flat portion 81 forms the main part of the metal plate 80. The flat portion 81 forms the base (metal base) of the metal plate 80. In this embodiment, the flat portion 81 is large enough to cover the three subunits SU from below. The flat portion 81 faces the routing substrate 40 of the three subunits SU. In this embodiment, the metal plate 80 leaves a space S1 (see Figure 13) between itself and the second surface 51b of the flat portion 51 of each subunit SU, and faces the second surface 51b of the flat portion 51 of each subunit SU. The electronic component 10L is housed in the space S1. That is, the electronic component 10L is positioned between the routing substrate 40M and the metal plate 80 in the Z direction.

[0100] The fixing portion 82 is a fixing portion for fixing the base plate 41 of each subunit SU to the metal plate 80. When viewed from the Z direction, the fixing portion 82 is provided at a position corresponding to the fixing portion 52 of the base plate 41 of each subunit SU. The fixing portion 82 is a cylindrical or prismatic boss that protrudes in the +Z direction from the planar portion 81 of the metal plate 80. In the Z direction, the fixing portion 82 faces the fixing portion 52 of the base plate 41. The fixing portion 82 has an engagement hole 82h that opens in the +Z direction. The inner circumferential surface of the engagement hole 82h has a screw groove.

[0101] The base plate 41 has a fixing portion 52 that is fixed to the fixing portion 82 of the metal plate 80. The fixing portion 52 has a through hole 52h that faces the engagement hole 82h of the fixing portion 82 of the metal plate 80. A fastening member 111 (e.g., a screw or bolt) is passed through the through hole 52h. When the fastening member 111 passed through the through hole 52h of the fixing portion 52 of the base plate 41 engages with the engagement hole 82h of the fixing portion 82 of the metal plate 80, the base plate 41 is fixed to the metal plate 80.

[0102] <4.2 Insulating Sheet> The insulating sheets 91A and 91B are insulating materials for electrically insulating the metal plate 80 from the wiring substrate 40M. The insulating sheets 91A and 91B are made of synthetic resin such as polyester or polyimide and have insulating properties.

[0103] The insulating sheet 91A is rectangular in shape and follows the flat portion 81 of the metal plate 80. The insulating sheet 91A is a sheet that follows the horizontal direction. The insulating sheet 91A is placed between the flat portion 81 of the metal plate 80 and the wiring substrate 40 of each subunit SU. In this embodiment, the insulating sheet 91A has an opening through which the heat transfer section 93, which will be described later, passes. Note that if the necessary insulation is ensured by other means, the insulating sheet 91A may be omitted.

[0104] The insulating sheet 91B is rectangular in shape and follows the upper surface of the heat transfer section 93. The insulating sheet 91B is sheet-shaped and follows the horizontal direction. The insulating sheet 91B is placed between the heat transfer section 93 and the heat transfer member 92. In addition, the insulating sheet 91B may be provided between the wiring substrate 40 of each subunit SU and the multiple heat transfer members 92 instead of in the above example. If the necessary insulation is ensured by other means, the insulating sheet 91B may be omitted. For example, if the heat transfer member 92 has insulating properties and the necessary insulation is ensured by the heat transfer member 92, the insulating sheet 91B may be omitted.

[0105] <4.3 Heat Transfer Components> The heat transfer member 92 is a member for transferring heat generated by the electronic component 10 when energized, and / or heat generated by the busbar 42 itself (Joule heat) when energized, to the metal plate 80. The heat transfer member 92 is, for example, an elastic heat transfer sheet (for example, a thermally conductive silicone sheet). The heat transfer member 92 is formed of a material with a higher thermal conductivity than, for example, the base plate 41. However, the heat transfer member 92 is not limited to the above example, and may be a heat transfer member formed of a thermally conductive gel or other material.

[0106] Figure 12 is a bottom view showing the wiring substrate 40. In this embodiment, the multiple heat transfer members 92 are partially provided on the wiring substrate 40. For example, the multiple heat transfer members 92 are positioned so as to overlap with a part of the busbar 42 when viewed from the Z direction. More specifically, the multiple heat transfer members 92 are positioned so as to overlap with a part of the busbar 42 near the electronic components 10 (e.g., electronic components 10A, 10B) when viewed from the Z direction. In this embodiment, the multiple heat transfer members 92 are positioned so as to overlap with the connecting components 20 when viewed from the Z direction. Note that the arrangement of the heat transfer members 92 is not limited to the examples described above. For example, the heat transfer members 92 may be positioned so as not to overlap with the connecting components 20 when viewed from the Z direction, or so as not to overlap with the electronic components 10.

[0107] Figure 13 is a cross-sectional view along the line F13-F13 of the structure shown in Figure 10. In this embodiment, the heat transfer member 92 is positioned between the metal plate 80 and the busbar 42. The heat transfer member 92 transfers heat from the electronic component 10 to the busbar 42, and / or heat generated by the busbar 42, from the busbar 42 to the metal plate 80.

[0108] In this embodiment, a portion of the heat transfer member 92 is in contact with the busbar 42 at a position that overlaps with the connecting component 20 when viewed from the Z direction. In this case, the heat transfer member 92 facilitates the transfer of heat from the terminal 13 of the electronic component 10 to the connecting component 20, and from the connecting component 20 to the metal plate 80 via the busbar 42. Alternatively, a portion of the heat transfer member 92 may be in contact with the busbar 42 at a position that overlaps with the connecting component 30 when viewed from the Z direction. In this case, the heat transfer member 92 facilitates the transfer of heat from the external device to the connecting component 30, and from the connecting component 30 to the metal plate 80 via the busbar 42.

[0109] In this embodiment, a portion of the heat transfer member 92 is positioned to overlap with the head 43b of the fastening member 43 when viewed from the Z direction, and is in contact with the head 43b of the fastening member 43. In this case, the heat transfer member 92 can more easily transfer heat from the terminal 13 of the electronic component 10 to the connecting component 20 from the fastening member 43 to the metal plate 80. Also, when a portion of the heat transfer member 92 is in contact with the head 43b of the fastening member 43, the heat transfer member 92 can more easily transfer heat from the external device to the connecting component 30 from the fastening member 43 to the metal plate 80.

[0110] A portion of the heat transfer member 92 may be in contact with the busbar 42 at a position that overlaps with the electronic component 10 when viewed from the Z direction. In this case, the heat transfer member 92 can more easily transfer heat from the electronic component 10 to the busbar 42 and from the busbar 42 to the metal plate 80. A heat transfer member may also be provided between the busbar 42 and the electronic component 10.

[0111] In this embodiment, in the region where the connecting component 20 attached to the electronic component 10L and the electronic component 10U overlap in the Z direction, the electronic component 10U is not in contact with the busbar 42. That is, in the region where the connecting component 20 attached to the electronic component 10L and the electronic component 10U overlap in the Z direction, an air layer AS is provided between the electronic component 10U and the busbar 42. When an air layer AS is provided between the electronic component 10U and the busbar 42, the heat transferred from the electronic component 10L to the busbar 42 is suppressed from being transferred from the busbar 42 to the electronic component 10U.

[0112] This also applies when the correspondence between electronic component 10U and electronic component 10L is reversed. In the region where the connecting component 20 attached to electronic component 10U and electronic component 10L overlap in the Z direction, electronic component 10L is not in contact with the bus bar 42. That is, in the region where the connecting component 20 attached to electronic component 10U and electronic component 10L overlap in the Z direction, an air layer AS is provided between electronic component 10L and the bus bar 42.

[0113] <4.4 Heat Transfer Section> The heat transfer section 93 is a structure that fills the space S1 between the flat portion 81 of the metal plate 80 and the heat transfer member 92, and transfers heat from the heat transfer member 92 to the flat portion 81 of the metal plate 80. The heat transfer section 93 is an example of a protrusion that extends from the metal plate 80 toward the wiring substrate 40M. The heat transfer section 93 is, for example, a block member made of metal (e.g., copper, copper alloy, aluminum, or aluminum alloy). The heat transfer section 93 is made of a material with a higher thermal conductivity than the heat transfer member 92. The heat transfer section 93 is made of a rigid member that is less prone to deformation than the heat transfer member 92. The heat transfer section 93 is positioned to overlap with the heat transfer member 92 when viewed from the Z direction. For example, the heat transfer section 93 has the same area as the heat transfer member 92 when viewed from the Z direction. The thickness of the heat transfer section 93 in the Z direction is greater than the thickness of the heat transfer member 92 in the Z direction.

[0114] The heat transfer section 93 is fixed to the flat portion 81 of the metal plate 80 and protrudes from the flat portion 81 of the metal plate 80 toward the heat transfer member 92. In this embodiment, the heat transfer member 92 is compressed and held between the busbar 42 and the heat transfer section 93. The heat transfer section 93 is fixed to the metal plate 80, for example, using fastening members (screws or bolts). However, the method of fixing the heat transfer section 93 to the metal plate 80 is not limited to the above example and may be achieved by means such as adhesive or welding.

[0115] <4.5 Insulating Cover> Returning to Figure 1, the insulating cover 94 will be described. The insulating cover 94 is a component for preventing fingers from touching the current-carrying path of the main body MU. The insulating cover 94 is made of, for example, synthetic resin and has insulating properties. The insulating cover 94 is, for example, box-shaped with the -Z direction side open. The insulating cover 94 has a plurality of ventilation holes 94h. The insulating cover 94 is attached to the metal plate 80 along the Z direction. Note that the insulating cover 94 is not limited to a box-shaped component, but may also be a sheet-like component that covers the current-carrying path of the main body MU.

[0116] <5. Advantages> As a first comparative example, consider an electrical connection unit in which electronic components are arranged only on the +Z side of the wiring substrate 40. In this configuration of the first comparative example, it is necessary to arrange multiple electronic components on only one side of the wiring substrate 40 while avoiding interference between electronic components, which can make it difficult to miniaturize the electrical connection unit (for example, by reducing the area when viewed from the Z direction).

[0117] As a second comparative example, consider a module in which electronic components are arranged only on the +Z direction side of the wiring substrate 40, and a rigid member (e.g., a metal plate 80) is provided on the -Z direction side of the wiring substrate 40. Then, consider an electrical connection unit formed by stacking multiple such modules in the Z direction. In the configuration of this second comparative example, there are multiple rigid members that are spaced apart in the Z direction, which can make it difficult to reduce the height of the electrical connection unit.

[0118] On the other hand, in this embodiment, the electrical connection unit 1 includes a support (e.g., a base plate 41), a first busbar (e.g., a busbar 42C), a second busbar (e.g., a busbar 40D), a first electronic component (e.g., an electronic component 10B), and a second electronic component (e.g., an electronic component 10C). The support has a first surface (e.g., a first surface 51a) and a second surface (e.g., a second surface 51b) located on the opposite side of the first surface. The first busbar is supported by the support. The second busbar is supported by the support. The first electronic component is positioned facing the first surface of the support and is electrically connected to the first busbar. The second electronic component is positioned facing the second surface of the support and is electrically connected to the second busbar.

[0119] With this configuration, the multiple electronic components 10 are arranged separately on the +Z and -Z sides of the support, making it less likely for the multiple electronic components 10 to interfere with each other, and making it easier to arrange the multiple electronic components 10 close to each other when viewed from the Z direction. For this reason, compared to the case where multiple electronic components 10 are arranged on only one side of the support (for example, only the +Z side), it is possible to miniaturize the electrical connection unit 1 (for example, reduce the area when viewed from the Z direction).

[0120] From another perspective, in addition to the above-described configuration, the electrical connection unit 1 has a rigid member (e.g., a metal plate 80) positioned on the -Z side relative to the support and the plurality of electronic components 10. The support is fixed to the rigid member. With this configuration, in a configuration where the plurality of electronic components 10 are arranged separately on the +Z side and the -Z side of the support, it becomes easier to secure the necessary strength for the electrical connection unit 1 with a single rigid member. For this reason, the height of the electrical connection unit 1 can be reduced compared to, for example, a case where there are multiple rigid members arranged far apart in the Z direction.

[0121] In this embodiment, when viewed from the Z direction, the first electronic component and the second electronic component overlap at least partially. With this configuration, when viewed from the Z direction, multiple electronic components 10 can be placed even closer to each other. Therefore, the electrical connection unit 1 can be further miniaturized (for example, further reduction in area when viewed from the Z direction).

[0122] In this embodiment, the support has a first housing portion (e.g., housing portion 55C) recessed from the first or second surface or penetrating the support in the Z direction, and a second housing portion (e.g., 55D) recessed from the first or second surface or penetrating the support in the Z direction. At least a portion of the first busbar is housed in the first housing portion. At least a portion of the second busbar is housed in the second housing portion. With this configuration, the height of the integrated structure of the support and the busbar can be reduced compared to the case where the busbar is placed on the surface of the support. This makes it possible to further reduce the height of the electrical connection unit 1.

[0123] In this embodiment, the second busbar is at least partially exposed to the first surface and at least partially exposed to the second surface. With this configuration, both the electronic component 10U located on the +Z side of the support and the electronic component 10L located on the -Z side of the support can be easily connected to the second busbar. This improves the freedom of the wiring path or component arrangement of the electrical connection unit 1. As a result, the electrical connection unit 1 can be further miniaturized.

[0124] In this embodiment, the first busbar and the second busbar are at least partially adjacent in the X or Y direction. With this configuration, compared to the case where the first busbar is placed on the first surface of the support (on the surface on the +Z direction side) and the second busbar is placed on the second surface of the support (on the surface on the -Z direction side), the height of the integrated structure of the support and busbar can be reduced. This makes it possible to further reduce the height of the electrical connection unit 1.

[0125] In this embodiment, the first electronic component is electrically connected to the second busbar in addition to the first busbar. This configuration improves the flexibility of the wiring path or component placement of the electrical connection unit 1. As a result, the electrical connection unit 1 can be further miniaturized.

[0126] In this embodiment, the support is formed by one or more insulating members (e.g., a base plate 41). With this configuration, multiple electronic components 10, which are arranged separately on the +Z and -Z sides of the support, can be electrically connected with a simple configuration. This makes it possible to further miniaturize the electrical connection unit 1.

[0127] <6. Variation> Next, we will describe some variations. Note that, apart from the configurations described below, the configurations in each variation are the same as those of the first embodiment.

[0128] (First variation) Figure 14 is a plan view showing a part of the electrical connection unit 1 of the first modified example. The electrical connection unit 1 of this modified example has electronic components 10A, 10B, 10C, and 10D as electronic components 10 (electronic component 10U) arranged on the +Z direction side with respect to the base plate 41. The electrical connection unit 1 also has electronic component 10E as an electronic component 10 (electronic component 10L) arranged on the -Z direction side with respect to the base plate 41. Electronic component 10A is an example of the "first component". Electronic component 10E is an example of the "second component". In this embodiment, when viewed from the Z direction, electronic component 10A and electronic component 10E overlap at least partially. For example, when viewed from the Z direction, the component body portion 12 of electronic component 10A and the component body portion 12 of electronic component 10E overlap at least partially.

[0129] In this modified example, the electrical connection unit 1 includes seven busbars 42A, 42B, 42C, 42D, 42E, 42F, and 42G as a plurality of busbars 42. The seven busbars 42A, 42B, 42C, 42D, 42E, 42F, and 42G are at least partially adjacent in the X or Y direction. Each of the seven busbars 42A, 42B, 42C, 42D, 42E, 42F, and 42G is at least partially exposed to the first surface 51a of the base plate 41 and at least partially exposed to the second surface 51b of the base plate 41.

[0130] In this modified example, the electrical connection unit 1 includes multiple connection components 20, namely connection components 20A, 20B, 20C, 20D, 20E, 20F, 20H, 20I, and 20J. The electrical connection unit 1 also includes multiple connecting busbars 75, namely connecting busbars 75A, 75B, and 75C. Here, the connection relationships between busbars 42B, 42C, 42D, and 42E and electronic components 10A, 10B, and 10C are the same as in the first embodiment. Therefore, a detailed explanation of these connection relationships is omitted.

[0131] The first connection portion 61 of busbar 42A is electrically connected to terminal 13A of electronic component 10A via connection component 20A. The second connection portion 62 of busbar 42A is electrically connected to terminal 13A of electronic component 10D via connection component 20G. Busbar 42A is an example of a "first busbar".

[0132] Busbar 42B includes a first connector 61, a second connector 62, and a third connector 65. The first connector 61 of busbar 42B is electrically connected to terminal 13B of electronic component 10A via connector 20A. The second connector 62 of busbar 42B is electrically connected to connector 30A. The third connector 65 of busbar 42B is electrically connected to terminal 13A of electronic component 10E via connector 20I. Busbar 42B is an example of a "second busbar".

[0133] The first connection point 61 of busbar 42F is electrically connected to terminal 13B of electronic component 10D via connection component 20H. The second connection point 62 of busbar 42F is electrically connected to connecting busbar 75A. Busbar 42F is an example of a "first powered circuit".

[0134] The first connection portion 61 of busbar 42G is electrically connected to terminal 13B of electronic component 10E via connection component 20J. The second connection portion 62 of busbar 42G is electrically connected to connecting busbar 75C. Busbar 42G is an example of a "second power supply circuit".

[0135] Figure 15 is a cross-sectional view along the line F15-F15 of the structure shown in Figure 14. In this modified example, electronic component 10A and connecting components 20A and 20B are located on the +Z side relative to the base plate 41. Electronic component 10E and connecting components 20I and 20J are located on the -Z side relative to the base plate 41.

[0136] In this modified example, the extended portion 63 of the busbar 42G to which the electronic component 10E is connected is in contact with the heat transfer member 92 from the -Z direction side. An insulating sheet 91B and a heat transfer portion 93 are provided between the heat transfer member 92 and the flat portion 81 of the metal plate 80. A portion of the heat transferred from the electronic component 10E to the busbar 42G is transferred to the metal plate 80 via the heat transfer member 92 and the heat transfer portion 93.

[0137] With this configuration, the electrical connection unit 1 can be miniaturized, similar to the first embodiment. In this modified example, in an electrical connection unit where the first and second current-carrying circuits can be switched, the electronic component 10A electrically connected to the first current-carrying circuit and the electronic component 10E electrically connected to the second current-carrying circuit can be placed close to each other. This makes it easier to miniaturize the electrical connection unit 1 (for example, by reducing the area when viewed from the Z direction) compared to the case where the electronic components 10A and 10E are arranged on one side of the support.

[0138] (Second variation) Figure 16 is a plan view showing a part of the electrical connection unit 1 of the second modified example. In this modified example, the electrical connection unit 1 has an electronic component 10A as an electronic component 10 (multiple electronic components 10U) arranged on the +Z direction side with respect to the base plate 41. The electrical connection unit 1 has electronic components 10B and 10C as electronic components 10 (electronic components 10L) arranged on the -Z direction side with respect to the base plate 41. Electronic component 10A is an example of the "first component". Electronic component 10B is an example of the "second component". In this embodiment, when viewed from the Z direction, electronic component 10A and electronic component 10B overlap at least partially. For example, when viewed from the Z direction, the component body portion 12 of electronic component 10A and the component body portion 12 of electronic component 10B overlap at least partially.

[0139] In this modified example, the electrical connection unit 1 includes five busbars 42A, 42B, 42C, 42D, and 42E as a plurality of busbars 42. The connection relationships between these five busbars 42A, 42B, 42C, 42D, and 42E and the electronic components 10A, 10B, and 10C are the same as in the first embodiment. Therefore, a description of these connection relationships will be omitted.

[0140] In this modified example, electronic component 10A and connecting components 20A and 20B are positioned on the +Z side relative to the base plate 41. On the other hand, electronic component 10B and connecting components 20C and 20D are positioned on the +Z side relative to the base plate 41. Furthermore, electronic component 10C and connecting components 20E and 20F are positioned on the +Z side relative to the base plate 41.

[0141] With this configuration, the electrical connection unit 1 can be miniaturized, similar to the first embodiment. In this modified example, in an electrical connection unit having a positive electrode line PL and a negative electrode line NL, the electronic component 10A associated with the positive electrode line PL and the electronic component 10B associated with the negative electrode line NL can be placed close to each other. This makes it easier to miniaturize the electrical connection unit 1 (for example, reduce the area when viewed from the Z direction) compared to the case where the electronic components 10A and 10B are arranged on one side of the support.

[0142] (Third variation) Figure 17 is a cross-sectional view showing the electrical connection unit 1 of the third modified example. In the first embodiment described above, the heat transfer section 93 and the metal plate 80 are formed as separate parts. On the other hand, in this modified example, the heat transfer section 93 and the metal plate 80 are provided integrally as a single component. That is, the heat transfer section 93 is provided as part of the metal plate 80 and is formed integrally with the flat section 81. The heat transfer section 93 is a projection that protrudes in the +Z direction from a part of the flat section 81. The heat transfer section 93 is, for example, rectangular parallelepiped. The shape of the heat transfer section 93 is the same as the shape of the heat transfer section 93 of the first embodiment.

[0143] With this configuration, the electrical connection unit 1 can be miniaturized, similar to the first embodiment. In this modified example, the heat transfer section 93 and the metal plate 80 are provided as a single component. With this configuration, it is easier to improve the heat transfer between the heat transfer section 93 and the flat section 81 compared to the case where the heat transfer section 93 and the flat section 81 are separate components.

[0144] (Fourth variation) Figure 18 is a cross-sectional view showing the electrical connection unit 1 of the fourth modified example. In the third modified example described above, the heat transfer section 93 is rectangular parallelepiped. On the other hand, in this modified example, the heat transfer section 93 is formed by deforming a part of the flat section 81 toward the +Z direction by press working or the like. In this modified example as well, the heat transfer section 93 is provided as part of the metal plate 80 and is formed integrally with the flat section 81. The heat transfer section 93 is a protruding part that extends in the +Z direction from a part of the flat section 81. Even with this configuration, it is easier to improve the heat transfer between the heat transfer section 93 and the flat section 81 compared to the case where the heat transfer section 93 and the flat section 81 are separate parts.

[0145] (Fifth variation) Figure 19 is a perspective view showing the electrical connection unit 1 of the fifth modified example. Figure 20 is a cross-sectional view along the line F20-F20 of the structure shown in Figure 19. The electrical connection unit 1 of this modified example, like the first embodiment, has a space S1 between the base plate 41 and the metal plate 80 in which the electronic component 10L is housed. When the electronic component 10L generates heat when energized, heat may accumulate in the space S1.

[0146] In this modified example, the flat portion 51 of the base plate 41 has a heat dissipation opening 121. The opening 121 penetrates the flat portion 51 in the Z direction and communicates with the space S1 between the cable routing substrate 40 and the metal plate 80. Air can pass through the opening 121. The air in the space S1 between the cable routing substrate 40 and the metal plate 80 rises, for example, when heated, and can move above the cable routing substrate 40 through the opening 121.

[0147] With this configuration, heat is less likely to accumulate in the space S1 between the wiring substrate 40 and the metal plate 80. When heat is less likely to accumulate in space S1, the heat dissipation performance of the busbar 42 is improved. When the heat dissipation performance of the busbar 42 is improved, the heat dissipation performance of the electrical connection unit 1 can be further improved.

[0148] (Second Embodiment) Next, a second embodiment will be described. The second embodiment differs from the first embodiment in that the busbars 42 are arranged in a two-layer structure on the routing substrate 40M. Other than what is described below, the configuration is the same as that of the first embodiment.

[0149] Figure 21 is a cross-sectional view showing an electrical connection unit 1 of a second embodiment. In this embodiment, the wiring substrate 40M includes one or more base plates 41 (see Figure 22) and a plurality of bus bars 42. The plurality of bus bars 42 includes one or more bus bars 42U and one or more bus bars 42L.

[0150] The cable routing substrate 40M (cable routing substrate 40) includes, for example, a first cable routing layer 40Ma, a second cable routing layer 40Mb, and an insulating layer 40Mc. Each of the first cable routing layer 40Ma, the second cable routing layer 40Mb, and the insulating layer 40Mc is spread horizontally in a plate-like manner. The first cable routing layer 40Ma, the second cable routing layer 40Mb, and the insulating layer 40Mc are stacked in the Z direction.

[0151] The surface of the first cable routing layer 40Ma is exposed on the +Z side and forms the first surface 40s1 of the cable routing substrate 40M. The surface of the second cable routing layer 40Mb is exposed on the -Z side and forms the second surface 40s2 of the cable routing substrate 40M. The insulating layer 40Mc is located between the first cable routing layer 40Ma and the second cable routing layer 40Mb in the Z direction. A portion of the insulating layer 40Mc is located between the busbars 42U and 42L in the Z direction. The insulating layer 40Mc electrically insulates the busbars 42U and 42L.

[0152] In this embodiment, the first cable layer 40Ma, the second cable layer 40Mb, and the insulating layer 40Mc are integrally formed from a single insulating member. Alternatively, the first cable layer 40Ma, the second cable layer 40Mb, and the insulating layer 40Mc may be formed separately from each other and then laminated. Furthermore, if the insulation between the busbar 42U and the busbar 42L, as described later, is ensured by other means, the insulating layer 40Mc may be omitted.

[0153] The busbar 42U is a busbar 42 in which more than half of the busbar 42 is located on the first cable routing layer 40Ma. At least a portion of the busbar 42U is housed in a housing portion 55 provided on the first cable routing layer 40Ma and extends horizontally along the first cable routing layer 40Ma. At least a portion of the busbar 42U is exposed on the first surface 40s1 of the cable routing substrate 40M. A portion of the busbar 42U may be bent and located on the second cable routing layer 40Mb. The busbar 42U may be electrically connected to an electronic component 10U or to an electronic component 10L.

[0154] The busbar 42L is a busbar 42 in which more than half of the busbar 42 is located on the second cable routing layer 40Mb. At least a portion of the busbar 42L is housed in a housing portion 55 provided on the second cable routing layer 40Mb and extends horizontally along the second cable routing layer 40Mb. At least a portion of the busbar 42L is exposed on the second surface 40s2 of the cable routing substrate 40M. A portion of the busbar 42L may be bent and located on the first cable routing layer 40Ma. The busbar 42L may be electrically connected to the electronic component 10U or to the electronic component 10L.

[0155] Figure 22 is a perspective view showing a part of the electrical connection unit 1. Figure 23 is a cross-sectional view along the line F23-F23 of the structure shown in Figure 22. Figure 24 is a cross-sectional view along the line F24-F24 of the structure shown in Figure 22. The electrical connection unit 1 includes, for example, a base plate 41 and a plurality of busbars 42 (busbars 42A, 42B).

[0156] The base plate 41 includes a first layer 41a, a second layer 41b, and a third layer 41c. The first layer 41a forms at least a portion of the first wiring layer 40Ma of the wiring substrate 40M. The second layer 41b forms at least a portion of the second wiring layer 40Mb of the wiring substrate 40M. The third layer 41c forms at least a portion of the insulating layer 40Mc of the wiring substrate 40M. As described above, the first layer 41a, the second layer 41b, and the third layer 41c may be integrally formed from a single insulating member, or they may be formed separately and then laminated.

[0157] Busbar 42A is an example of the busbar 42U described above. At least a portion of busbar 42A is housed in a housing 55 provided in the first layer 41a of the base plate 41 and extends horizontally.

[0158] Busbar 42B is an example of the busbar 42L described above. At least a portion of busbar 42B is housed in a housing 55 provided in the second layer 41b of the base plate 41 and extends horizontally.

[0159] In this embodiment, when viewed from the Z direction, busbars 42A and 42B overlap at least partially. For example, when viewed from the Z direction, the extended portion 63 of busbar 42A located in the first layer 41a and the extended portion 63 of busbar 42B located in the second layer 41b intersect and extend at a distance from each other in the Z direction.

[0160] Next, returning to Figure 21, the heat dissipation structure of the second embodiment will be described. In this embodiment, the wiring substrate 40M has an opening 40g that exposes at least a portion of the bus bar 42U to the -Z direction. In this embodiment, the plurality of heat transfer members 92 include one or more heat transfer members 92U that are in contact with the bus bar 42U and one or more heat transfer members 92L that are in contact with the bus bar 42L. The plurality of heat transfer sections 93 include one or more heat transfer sections 93U that correspond to the bus bar 42U and one or more heat transfer sections 93L that correspond to the bus bar 42L.

[0161] The heat transfer member 92U is inserted into an opening 40g provided in the cable routing substrate 40M and contacts the bus bar 42U from the -Z direction side inside the cable routing substrate 40M. The heat transfer member 92U contacts the bus bar 42U while positioned inside the opening 40g. The heat transfer section 93U protrudes significantly in the +Z direction compared to the heat transfer section 93L. The heat transfer member 92U is compressed and held between the bus bar 42U and the heat transfer section 93U. On the other hand, the heat transfer member 92L contacts the bus bar 42L from the -Z direction side outside the cable routing substrate 40M. The heat transfer member 92L is compressed and held between the bus bar 42L and the heat transfer section 93L.

[0162] With this configuration, compared to the configuration of the first embodiment, it becomes easier to form a structure in which multiple busbars 42 intersect in three dimensions. This increases the degree of freedom in the routing layout of the busbars 42 in a structure in which multiple electronic components 10 are arranged separately on the +Z direction side and the -Z direction side of the support. This makes it possible to further miniaturize the electrical connection unit 1 (for example, reduce the area when viewed from the Z direction).

[0163] (Third embodiment) Next, a third embodiment will be described. The third embodiment differs from the first embodiment in that multiple routing substrates 40M are separately arranged on the +Z direction side and the -Z direction side of the metal plate 80. Other than what is described below, the configuration is the same as that of the first embodiment.

[0164] Figure 25 is a cross-sectional view showing an electrical connection unit 1 of a third embodiment. In this embodiment, the support SB includes a plurality of wiring substrates 40M (wiring substrates 40MU, 40ML) and a metal plate 80.

[0165] The cable routing substrate 40MU is positioned on the +Z side relative to the metal plate 80. The first surface 40s1 of the cable routing substrate 40MU facing the +Z direction is an example of a "first surface of the support". The base plate 41 included in the cable routing substrate 40MU is an example of a "first insulating member". The first surface 51a of the base plate 41 forms at least a part of the first surface 40s1 of the cable routing substrate 40MU facing the +Z direction.

[0166] Multiple electronic components 10U are arranged on the +Z side relative to the wiring substrate 40MU. Multiple electronic components 10U face the first surface 40s1 of the wiring substrate 40MU. Multiple electronic components 10U are electrically connected to one or more busbars 42 included in the wiring substrate 40MU. The busbars 42 included in the wiring substrate 40MU are an example of a "first busbar".

[0167] On the other hand, no electronic components 10 are placed between the wiring substrate 40MU and the metal plate 80. A heat transfer member 92 is placed between the wiring substrate 40MU and the metal plate 80.

[0168] The cable routing substrate 40ML is positioned on the -Z side relative to the metal plate 80. The second surface 40s2 of the cable routing substrate 40ML facing the -Z direction is an example of a "second surface of the support." The base plate 41 included in the cable routing substrate 40ML is an example of a "second insulating member." The second surface 51b of the base plate 41 forms at least a portion of the second surface 40s2 of the cable routing substrate 40ML facing the -Z direction.

[0169] Multiple electronic components 10L are arranged on the -Z side relative to the routing board 40ML. Multiple electronic components 10L face the second surface 40s2 of the routing board 40ML. Multiple electronic components 10L are electrically connected to one or more busbars 42 included in the routing board 40ML. The busbars 42 included in the routing board 40ML are an example of a "second busbar".

[0170] On the other hand, no electronic components 10 are placed between the wiring substrate 40ML and the metal plate 80. A heat transfer member 92 is placed between the wiring substrate 40ML and the metal plate 80.

[0171] In this embodiment, the electrical connection unit 1 has a plurality of insulating covers 94, namely insulating cover 94U and insulating cover 94L. Insulating cover 94U is, for example, box-shaped with the -Z side open. Insulating cover 94U is attached to the metal plate 80 from the +Z side and covers a plurality of electronic components 10U and a wiring substrate 40MU. Insulating cover 94L is, for example, box-shaped with the +Z side open. Insulating cover 94L is attached to the metal plate 80 from the -Z side and covers a plurality of electronic components 10L and a wiring substrate 40ML.

[0172] Figure 26 is a perspective view showing a part of the electrical connection unit 1 of the third embodiment. Figure 27 is a cross-sectional view showing a part of the electrical connection unit 1 of the third embodiment. In this embodiment, the metal plate 80 includes a flat portion 81, a plurality of fixing portions 82, and a plurality of fixing portions 83.

[0173] The multiple fixing portions 82 include multiple fixing portions 82 that protrude from the planar portion 81 in the +Z direction and multiple fixing portions 82 that protrude from the planar portion 81 in the -Z direction. The fixing portions 52 of the cable routing substrate 40MU are fixed to the multiple fixing portions 82 that protrude from the planar portion 81 in the +Z direction. The fixing portions 52 of the cable routing substrate 40ML are fixed to the multiple fixing portions 82 that protrude from the planar portion 81 in the -Z direction.

[0174] The fixing portion 83 is a fixing portion for directly fixing the electronic component 10 to the metal plate 80 without using the base plate 41. The fixing portion 83 is provided at a position corresponding to the mounting portion 14 of the electronic component 10 when viewed from the Z direction. The fixing portion 83 is a cylindrical or prismatic boss that protrudes from the planar portion 81 in the Z direction. The plurality of fixing portions 83 includes a plurality of fixing portions 83 that protrude from the planar portion 81 in the +Z direction and a plurality of fixing portions 83 that protrude from the planar portion 81 in the -Z direction.

[0175] In this embodiment, a through hole 51h is provided in the flat portion 51 of the base plate 41. The through hole 51h penetrates the base plate 41 in the Z direction. The fixing portion 83 is inserted into the through hole 51h in the flat portion 51 of the base plate 41. The fixing portion 83 faces the mounting portion 14 of the electronic component 10 in the Z direction. The fixing portion 83 has an engagement hole 83h that opens in the Z direction. The inner circumferential surface of the engagement hole 83h has a screw groove.

[0176] A fastening member 112 (for example, a screw or bolt) is passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 along the Z direction. When the fastening member 112 passed through the mounting hole 14h of the mounting portion 14 of the electronic component 10 engages with the engagement hole 83h of the fixing portion 83 of the metal plate 80, the electronic component 10 is fixed to the metal plate 80 without the base plate 41.

[0177] Next, we will return to Figure 25 and describe the heat dissipation structure of the third embodiment. In this embodiment, the metal plate 80 has one or more (e.g., multiple) heat dissipation sections 101U and one or more (e.g., multiple) heat dissipation sections 101L.

[0178] The heat dissipation section 101U is a heat dissipation section for promoting heat dissipation from the metal plate 80. The heat dissipation section 101U is, for example, a metal protrusion or fin. The heat dissipation section 101U may be formed integrally with the metal plate 80 by a single metal member, or it may be formed separately from the metal plate 80 and then attached to the metal plate 80.

[0179] In this embodiment, at least one heat dissipation section 101U overlaps with a heat transfer member 92 that contacts a busbar 42 included in the wiring substrate 40ML when viewed from the Z direction. That is, at least one heat dissipation section 101U overlaps with a heat transfer member 92 that transfers heat from the electronic component 10L to the metal plate 80 when viewed from the Z direction. Note that the arrangement of the heat dissipation section 101U is not limited to the above example.

[0180] The base plate 41 of the cable routing substrate 40MU has an opening 41h at a position corresponding to the heat dissipation portion 101U. The opening 41h penetrates the base plate 41 of the cable routing substrate 40MU in the Z direction. The heat dissipation portion 101U is passed through the opening 41h of the base plate 41 of the cable routing substrate 40MU. The heat dissipation portion 101U protrudes from the flat portion 81 of the metal plate 80 beyond at least a portion of the base plate 41 of the cable routing substrate 40MU in the +Z direction. The heat dissipation portion 101U is exposed in the space A1 between the insulating cover 94U and the cable routing substrate 40MU. The heat dissipation portion 101U releases some of the heat transferred from the electronic component 10U or electronic component 10L to the metal plate 80 into the space A1 between the insulating cover 94U and the cable routing substrate 40MU.

[0181] The heat dissipation section 101L is a heat dissipation section for promoting heat dissipation from the metal plate 80. The heat dissipation section 101L is, for example, a metal protrusion or fin. The heat dissipation section 101L may be formed integrally with the metal plate 80 by a single metal member, or it may be formed separately from the metal plate 80 and then attached to the metal plate 80.

[0182] In this embodiment, at least one heat dissipation section 101L overlaps with a heat transfer member 92 that is in contact with a busbar 42 included in the wiring substrate 40MU when viewed from the Z direction. That is, at least one heat dissipation section 101L overlaps with a heat transfer member 92 that transfers heat from the electronic component 10U to the metal plate 80 when viewed from the Z direction. Note that the arrangement of the heat dissipation section 101L is not limited to the above example.

[0183] The base plate 41 of the cable routing substrate 40ML has an opening 41h at a position corresponding to the heat dissipation section 101L. The opening 41h penetrates the base plate 41 of the cable routing substrate 40ML in the Z direction. The heat dissipation section 101L passes through the opening 41h of the base plate 41 of the cable routing substrate 40ML. The heat dissipation section 101L protrudes from the flat portion 81 of the metal plate 80 beyond at least a portion of the base plate 41 of the cable routing substrate 40ML in the -Z direction. The heat dissipation section 101L is exposed in the space A2 between the insulating cover 94L and the cable routing substrate 40ML. The heat dissipation section 101L releases some of the heat transferred from the electronic component 10U or electronic component 10L to the metal plate 80 into the space A2 between the insulating cover 94L and the cable routing substrate 40ML.

[0184] With this configuration, similar to the first embodiment, the electrical connection unit can be miniaturized (for example, its area can be reduced when viewed from the Z direction). Furthermore, according to this embodiment, one metal plate 80 can be shared by multiple wiring substrates 40M. This makes it possible to reduce the height of the electrical connection unit 1 compared to a configuration in which, for example, multiple modules are arranged in the Z direction, each having one metal plate 80 per wiring substrate 40M.

[0185] Several embodiments and variations have been described above. However, the embodiments and variations are not limited to the examples described above. For example, some embodiments and variations may be implemented in combination with each other.

[0186] The routing substrate 40 is not limited to a structure in which the base plate 41 and the busbar 42 are integrated by insert molding. For example, the base plate 41, which is provided with a housing portion 55 for housing the busbar 42, may be molded, and then the busbar 42 may be placed in the housing portion 55. In this case, the busbar 42 may be fixed to the housing portion 55 by fitting, or by adhesive or other fastening means. In these cases, potting may be applied to fill the gap between the busbar 42 and the housing portion 55.

[0187] The base member of the routing substrate 40 is not limited to a base plate 41 having a plate-shaped flat portion 51. The routing substrate 40 may also be a base member having a sheet-shaped flat portion 51 (for example, an insulating sheet). In this case, a portion of the flat portion 51 may conform to the outer shape of the bus bar 42 to form the housing portion 55. In this disclosure, "sheet-shaped" or "sheet" is not limited to a member with a thickness of 1 mm or more, and may also include a member with a thickness of less than 1 mm (so-called film).

[0188] The base plate 41 of the cable routing substrate 40 may include a plurality of members (plate members or sheet members). The plurality of members are provided so as to sandwich a plurality of bus bars 42 arranged in the horizontal direction. For example, the plurality of members may be integrated by sandwiching a plurality of bus bars 42, for example, by lamination molding. The plurality of members form a planar portion 51. In this case, the housing portion 55 may be formed hollow inside the base plate 41 (between the plurality of members). The plurality of members may be a plurality of plate members, a plurality of sheet members, or a combination of plate members and sheet members. The sheet members may be, for example, flexible sheet members. The planar portion 51 formed by the plurality of members has openings that expose at least the first connection portion 61 and the second connection portion 62 of the bus bars 42.

[0189] The connection between the electronic component 10 and the busbar 42 is not limited to a connection via the connecting component 20. The electronic component 10 may be directly connected to the busbar 42 using fastening members (e.g., bolts or screws) or welding. [Explanation of Symbols]

[0190] 1…Electrical connection unit SU... Subunit 10…Electronic components 13, 13A, 13B… terminals 20…Connecting parts 30…Connecting parts 40… Circuit board for cable routing 41…Base plate 42... Bus bar 51...Plane part 51a…Side 1 51b…Second side 55...Detention Unit 80…Metal plate (rigid member) 101U...Heat radiation part 101L...Heat radiation part SB…Support

Claims

1. A support having a first surface and a second surface located on the opposite side of the first surface, A first busbar supported by the aforementioned support, A second busbar supported by the aforementioned support, A first electronic component facing the first surface of the support and electrically connected to the first busbar, A second electronic component facing the second surface of the support and electrically connected to the second busbar, An electrical connection unit equipped with [a specific feature].

2. The direction from the first surface toward the second surface is defined as the first direction, and when viewed from the first direction, the first electronic component and the second electronic component overlap at least partially. The electrical connection unit according to claim 1.

3. When the direction from the first surface toward the second surface is defined as the first direction, The support has a first housing portion recessed from the first or second surface or penetrating the support in the first direction, and a second housing portion recessed from the first or second surface or penetrating the support in the first direction. At least a portion of the first busbar is housed in the first housing, At least a portion of the second busbar is housed in the second housing. The electrical connection unit according to claim 1 or claim 2.

4. The second busbar is at least partially exposed on the first surface and at least partially exposed on the second surface. The electrical connection unit according to claim 1 or claim 2.

5. When the direction from the first surface toward the second surface is defined as the first direction, and the direction intersecting the first direction is defined as the second direction, The first busbar and the second busbar are at least partially adjacent in the second direction. The electrical connection unit according to claim 1 or claim 2.

6. The first electronic component is electrically connected to the second busbar in addition to the first busbar. The electrical connection unit according to claim 1 or claim 2.

7. The support further comprises a third electronic component that faces the first surface of the support and is electrically connected to the second busbar, The electrical connection unit according to claim 1 or claim 2.

8. The system further comprises a rigid member positioned on the opposite side of the support from the second electronic component, to which the support is fixed. The electrical connection unit according to claim 1 or claim 2.

9. The aforementioned support is Rigid members and A first insulating member is located on the first side with respect to the rigid member, has the first surface, and supports the first busbar, A second insulating member is located on the second side opposite to the first side with respect to the rigid member, has the second surface, and supports the second busbar, including, The electrical connection unit according to claim 1 or claim 2.

10. The rigid member further comprises a heat dissipation portion that protrudes toward the first side beyond at least a portion of the first insulating member, The electrical connection unit according to claim 9.

Images