A temperature control device for semiconductor products that changes the flow path of test gas depending on the situation.

Abstract

This invention provides a temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation. [Solution] The temperature control device includes: a push section that is relatively close to the test tray carrying the semiconductor product and has a discharge port formed therein for discharging a test gas to adjust the test environment; a duct section having a discharge flow path formed therein for transmitting the test gas transmitted from the outside to the discharge port; and a flow path opening / closing section that, in the initial state, obstructs the flow of the test gas through a discharge communication port located between the discharge port and the discharge flow path to prevent the discharge of the test gas to the discharge port, and allows the discharge of the test gas to the discharge port in a test state when the push section is relatively close to the test tray.

Description

Technical Field

[0001] The present invention relates to a temperature control device for a semiconductor product that changes the flow path of a test gas according to the situation.

Background Art

[0002] HBM (High Bandwidth Memory) was developed mainly in response to the increasing demand for memory bandwidth generated by high-performance application programs such as computers and graphics processing units. Existing GDDR (Graphics Double Data Rate) memory technology was widely used in high-performance graphics cards and systems, but has reached its limit due to the increasing bandwidth requirements. Therefore, memory manufacturers have been required to develop new technologies that can provide higher bandwidth and process data more efficiently.

[0003] To meet such needs, HBM adopted an innovative design to form a memory chip stack. HBM can achieve high bandwidth using vertically stacked memory chips, and has the advantages of occupying less space and reducing power consumption. Such characteristics have become the background for HBM to attract attention as the importance of memory bandwidth and power efficiency becomes even greater in high-performance computing and graphics processing systems.

[0004] On the other hand, considering the efficient aspect of testing, HBM needs to be tested in the die state before packaging. HBM dies are structurally characterized by having far more contact parts than existing memories, and many contact parts are provided with a fine pitch in a limited area.

[0005] In general, the tests performed on semiconductor products involve exposing them to a predetermined thermal environment to determine whether they function correctly. For example, the test temperature can be set to a high-temperature environment in the range of 60 to 200 degrees Celsius, or to a low-temperature environment in the range of -60 to 0 degrees Celsius. Since high-temperature or low-temperature test environments differ considerably from ambient temperature, changing the temperature while the semiconductor product is loaded into the test equipment will cause a considerable delay before it reaches the thermal environment for testing. While pre-adjusting the ambient temperature of the test equipment can shorten this preparation time, it requires a significant amount of energy to maintain the test environment due to continuous heat exchange with the external environment. [Overview of the project] [Problems that the invention aims to solve]

[0006] The problem that this invention aims to solve is to provide a temperature control device that can maximize energy efficiency by preparing a test environment in advance.

[0007] The problems addressed by the present invention are not limited to those mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0008] A temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, according to an embodiment of the present invention for solving the above problems, includes: a push section that is relatively close to a test tray carrying a semiconductor product and has a discharge port formed therein for discharging a test gas to adjust the test environment; a duct section that has a discharge flow path formed therein for transmitting the test gas transmitted from the outside to the discharge port; and a flow path opening / closing section that, in the initial state, obstructs the flow of the test gas through a discharge communication port located between the discharge port and the discharge flow path to prevent the discharge of the test gas to the discharge port, and allows the discharge of the test gas to the discharge port in a test state when the push section is relatively close to the test tray.

[0009] The flow path opening / closing section includes a discharge path push body, which is positioned inside the discharge flow path, is in close contact with the discharge port in the initial state, and is switched to the test state and separated from the discharge port upon receiving an external force.

[0010] The flow path opening / closing section further includes a discharge path elastic member that provides a restoring force to bring the discharge path push body into close contact with the discharge communication port.

[0011] The discharge channel includes a housing section, one end of which is connected to the discharge communication port, and in which the discharge channel push body moves back and forth, and an inner section, which is connected to the other end of the discharge channel housing section and forms a step that supports the discharge channel elastic member.

[0012] The duct section further includes an exhaust passage for exhausting the test gas and a circulation passage for connecting the discharge passage to the exhaust passage.

[0013] The push portion is further formed with an exhaust port that allows fluid communication with the exhaust passage.

[0014] The flow path opening / closing section further includes an exhaust path push body, which is positioned inside the exhaust path and is in close contact with an exhaust communication port located between the exhaust port and the exhaust path in the initial state, and is separated from the exhaust communication port in the test state.

[0015] The circulation channel is exposed on one side of the discharge channel push body in the initial state and faces the discharge channel push body in the test state.

[0016] The push portion includes a push pipe that forms at least a portion of the discharge port, is inserted into the duct portion, and is switched from the initial state to the test state to pressurize the discharge flow path push body.

[0017] In the test state, the push tube is formed with a gas communication groove at its end that communicates with the discharge port so that the test gas inside the discharge channel is transmitted to the discharge port.

[0018] The discharge channel push body is formed such that the cross-sectional size is larger than the cross-section of the discharge communication port and smaller than the cross-section of the discharge channel.

[0019] The push portion further includes a guide end that extends parallel to the push tube and is inserted into the duct portion so as to guide the moving direction of the push portion.

[0020] The push portion further includes a guide end elastic member that elastically supports the guide end in a direction to bring the push tube into close contact with the discharge channel push body.

[0021] The duct portion includes an auxiliary fluid discharge tube that is disposed through the push portion and through which an auxiliary fluid having a temperature different from that of the test gas flows.

[0022] The device further includes a temperature measurement sensor that is adjacent to the discharge port and the exhaust port and is arranged parallel to a virtual line connecting the discharge port and the exhaust port.

[0023] Other specific matters of the present invention are included in the detailed description and drawings.

Effects of the Invention

[0024] According to the embodiments of the present invention, there are at least the following effects.

[0025] The test preparation time can be shortened by preparing the test environment in advance. Also, the heat exchange with the outside can be minimized in the preparation state to maximize the energy efficiency.

[0026] The effects of the present invention are not limited to the contents exemplified above, and more diverse effects are included in this specification.

Brief Description of the Drawings

[0027] [Figure 1] Schematically shows a temperature control system according to an embodiment of the present invention. [Figure 2] Shows a test tray and an insert according to an embodiment of the present invention. [Figure 3] Conceptually shows a temperature control device according to an embodiment of the present invention. [Figure 4] Shows a duct block according to an embodiment of the present invention and a number of push parts connected to the duct block. [Figure 5] Shows a part of a duct block according to an embodiment of the present invention attached to a distribution plate. [Figure 6] Is a perspective view of a push part according to an embodiment of the present invention as viewed from the front. [Figure 7] Is a perspective view of a push part according to an embodiment of the present invention as viewed from the rear. [Figure 8] Shows a first duct housing in a separated state of a push part according to an embodiment of the present invention. [Figure 9] Shows a second duct housing in a separated state of a first duct housing according to an embodiment of the present invention. [Figure 10] Shows an initial state of a temperature control device according to an embodiment of the present invention. [Figure 11] Shows a test state of a temperature control device according to an embodiment of the present invention. [Figure 12] Is a diagram for explaining the flow through an expansion groove according to an embodiment of the present invention. [Figure 13] Is a schematic cross-sectional view of a duct block and a push part according to another embodiment of the present invention.

Mode for Carrying Out the Invention

[0028] The advantages and features of the present invention, and methods for achieving them, will become clearer with reference to the embodiments described below in detail with accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and can be embodied in a variety of different forms, and these embodiments are merely provided to complete the disclosure of the present invention and to fully inform a person ordinary skill in the art to which the invention belongs of the scope of the invention, and the present invention is defined by the scope of the claims.

[0029] Furthermore, the embodiments described herein are explained with reference to the cross-sectional and / or schematic diagrams which are ideal illustrative diagrams of the present invention. Therefore, the form of the illustrative diagrams may be modified due to manufacturing techniques and / or tolerances. Also, each component in each drawing of the present invention is shown slightly enlarged or reduced for the sake of ease of explanation. The same reference numerals throughout the specification refer to the same component.

[0030] The present invention will be described below with reference to drawings illustrating a temperature control device for semiconductor products that changes the flow path of a test gas according to an embodiment of the present invention depending on the situation.

[0031] It is obvious that the up, down, left, and right directions mentioned below can be changed during the implementation of the invention, and these directions are merely used to complete the disclosure of the present invention.

[0032] Figure 1 schematically shows a temperature control system according to one embodiment of the present invention. Figure 2 shows a test tray and insert according to one embodiment of the present invention. The temperature control space referred to below means a space in which the temperature is controlled for testing semiconductor products, and in the present invention, the containment space AS described later can correspond to the temperature control space.

[0033] As shown in Figures 1 and 2, a temperature control system 1 according to one embodiment of the present invention includes a temperature control device 100, a tester 200, an insert 300, and a test tray 400.

[0034] The temperature control device 100 can create a test environment for the semiconductor product D loaded on the insert 300. For example, the semiconductor product D can exchange signals with the tester 200 under high temperature, room temperature, and / or low temperature conditions, undergo performance checks, and be classified as good / defective / re-inspected, etc. At this time, the temperature control device 100 can adjust the temperature atmosphere around the semiconductor product D to create the aforementioned high temperature, room temperature, and / or low temperature conditions. For example, the high temperature can be set in the range of 60 to 200 degrees Celsius, and the low temperature in the range of 0 to -100 degrees Celsius. However, the temperature range can be varied in various ways depending on the characteristics of the semiconductor product.

[0035] Such a temperature control device 100 may include a dry chamber 110, a circulation chamber 120, and a duct section 130.

[0036] The dry chamber 110 can be configured to support the maintenance of the internal temperature of the circulation chamber 120 at a temperature suitable for the test environment and to prevent condensation formation during low-temperature testing. For this purpose, the internal temperature of the dry chamber 110 can be maintained within a predetermined range. Although not shown, in order to maintain the internal temperature of the dry chamber 110 within a predetermined range, a chamber temperature control unit that adjusts the internal temperature to a constant level can be installed in the dry chamber 110. The chamber temperature control unit can be provided with various conventional heat exchangers that create a constant temperature environment inside the chamber. Also, although not shown, a gate can be formed in the dry chamber 110 to allow the duct section 130 to enter and exit.

[0037] More specifically, the internal temperature of the dry chamber 110 can be maintained at approximately 60 degrees Celsius or higher. Such temperature conditions maintain an atmosphere warmer than ambient temperature around the circulation chamber 120, supporting the circulation chamber 120 in maintaining a high temperature environment.

[0038] Furthermore, the dry chamber 110 can be configured to supply dry air at a predetermined temperature from which moisture has been removed, and to maintain and ventilate the internal space by exhausting the internal air to the outside. For example, the dry chamber 110 may have a fan for supplying dry air on one side and a ventilation opening on the other side. In this way, when the internal temperature of the circulation chamber 120 is below freezing, the dry chamber 110 can regulate the humidity and / or temperature around the duct section 130 to prevent condensation from occurring.

[0039] The circulation chamber 120 is located inside the dry chamber 110 and can provide a space through which a test gas is circulated to form a test environment around the semiconductor product D. The circulation chamber 120 can have the effect of shortening the test time by ensuring that the test gas is circulated while being adjusted to a temperature suitable for testing.

[0040] The duct section 130 can be positioned adjacent to one surface of the test tray 400 loaded into the tester 200. The duct section 130 can be configured to selectively inject the test gas circulating in the circulation chamber 120 towards the test tray 400. A detailed explanation of this will follow later.

[0041] The push section 134 is attached to the end of the duct section 130 facing the test tray 400, and can form an outlet for discharging test gas. The push section 134 can be positioned relatively close to the test tray 400. For example, the push section 134 and / or the duct section 130 can be configured to move forward and backward toward the tester 200, or the tester 200 can be configured to move toward or away from the push section 134.

[0042] The tester 200 can be designed to be electrically connected to the semiconductor product D loaded on the insert 300 when the test tray 400 is attached, and to exchange test signals with the semiconductor product D. For this purpose, the tester 200 may have a built-in main board designed to exchange electrical signals for testing. The tester 200 may have sockets formed to correspond to the arrangement of the inserts 300 on the test tray 400. When the test tray 400 is attached to the tester 200, the semiconductor product D and the test terminals of the sockets can be electrically connected. The test terminals of the sockets can be represented by a variety of conventionally known configurations, such as pogo pins or conductive rubber pads.

[0043] The insert 300 has a stacking structure that corresponds to the semiconductor product D, and multiple inserts can be mounted on the test tray 400. The stacking structure that corresponds to the semiconductor product D can be said to be a structure that stacks the semiconductor product D according to its shape and maintains the stacked semiconductor product D in a position corresponding to the socket of the tester 200.

[0044] Such an insert 300 may include an insert body 310, a contact board 320, an interface board 330, and a latch 340. The insert body 310 is formed in a structure and shape that is mounted on a test tray 400, and has a housing space AS with one side open, and is a frame for loading semiconductor products D into the housing space AS. The contact board 320 can be in contact with the bottom surface of the semiconductor products D loaded on the insert 300. The contact board 320 may also have contact terminals that are in physical and electrical contact with the terminals of the loaded semiconductor products D. The interface board 330 is located on the back surface of the contact board 320 and may have a wiring pattern that is electrically connected to the contact terminals and external terminals that are exposed to the outside so as to be electrically connected to a socket. The external terminals may have an expanded pitch compared to the contact terminals to facilitate alignment with the socket. The wiring pattern may be formed to electrically connect the external terminals and the contact terminals. The latch 340 is a device that maintains the position of the semiconductor product D loaded on the insert body 310, and can be implemented in a variety of conventionally known configurations. For example, the latch 340 is a clamper-shaped member that can hold the semiconductor product D with elastic force.

[0045] With this configuration, in one embodiment of the present invention, the semiconductor product D can be electrically connected to the socket via the insert 300 and tested while the test tray 400 is mounted and / or in close contact with the tester 200.

[0046] The test tray 400 can have grooves formed in positions corresponding to the sockets to accommodate individual insert bodies 310. Since the general configuration of the test tray 400 is already known, a detailed explanation will be omitted.

[0047] The following description will refer to Figure 3 to explain a duct section 130 according to one embodiment of the present invention. Figure 3 conceptually shows a temperature control device according to one embodiment of the present invention.

[0048] As shown in Figure 3, a duct section 130 according to one embodiment of the present invention may include a gas circulator 131, a distribution plate 132, and a duct block 133. The duct section 130 can be configured to distribute and transmit test gas transmitted from the outside to a plurality of push sections 134 connected to its end.

[0049] The gas circulator 131 can be configured to circulate a test gas and regulate its temperature. For example, the test gas may be temperature-controlled air or gas. Such a gas circulator 131 may include a circulation housing 1311, a gas temperature controller 1312, a fan 1313, a supply pipe 1314, and a recovery pipe 1315.

[0050] The circulation housing 1311 is located inside the circulation chamber 120 and houses the fan 1313. The gas temperature controller 1312 is either built into or adjacent to the circulation housing 1311 and can be configured to regulate the temperature atmosphere inside the circulation chamber 120. For example, the gas temperature controller 1312 can be provided by a variety of conventionally known heat exchangers. The fan 1313 is a blower that circulates the test gas inside the circulation chamber 120. The supply pipe 1314 is configured to transmit the test gas supplied by the fan 1313 to the distribution plate 132, and the recovery pipe 1315 can be configured to move the test gas exhausted from the distribution plate 132 back into the circulation chamber 120.

[0051] The distribution plate 132 can form a circulation path for test gas between a number of duct blocks 133 and a gas circulator 131. Multiple duct blocks 133 are coupled on one surface of the distribution plate 132, allowing them to distribute and transmit the test gas transmitted from the gas circulator 131 back to a number of push units 134. Additionally, the duct blocks 133 can be connected to the distribution plate 132 to transmit the test gas exhausted from the connected push units 134 back to the distribution plate 132.

[0052] The push unit 134, when the test tray 400 (see Figure 2) is mounted on the tester 200 (see Figure 1), can be in close contact with one side of the test tray 400 or insert 300 (see Figure 2), thereby separating the containment space AS (see Figure 2) from the external space. Furthermore, the push unit 134 can transmit the test gas supplied from the duct block 133 into the containment space AS, thereby regulating the internal temperature of the containment space AS.

[0053] Hereinafter, with reference to Figure 4, a duct block 133 and a push section 134 according to one embodiment of the present invention will be described in detail. Figure 4 shows a duct block and a number of push sections connected to the duct block according to one embodiment of the present invention.

[0054] As shown in Figure 4, the duct block 133 can be separated into a first duct housing 1331 and a second duct housing 1332. The first duct housing 1331 can be configured to have a number of push sections 134 mounted on one side, and to distribute and recover test gas to the push sections 134. The second duct housing 1332 can be configured to have one side connected to the first duct housing 1331 and the back side connected to a distribution plate 132 (see Figure 3), and to supply and recover test gas into the first duct housing 1331. As a result, the test gas supplied to the duct section 130 can be transmitted to the push sections 134 via the distribution plate 132, the second duct housing 1332, and the first duct housing 1331, and discharged to the discharge port 1341 of the push sections 134. In contrast, the test gas exhausted to the exhaust port 1342 of the push unit 134 can reach the distribution plate 132 in the reverse order of the above.

[0055] Multiple push sections 134 are connected to the end of the duct section 130, and each can have a discharge port 1341, an exhaust port 1342, and an auxiliary fluid discharge port 1345 formed on one surface. The discharge port 1341 is a through-hole for discharging the test gas to the outside, and the exhaust port 1342 is a through-hole for the test gas to be exhausted again. In contrast, the auxiliary fluid discharge port 1345 is a through-hole formed for the discharge of an auxiliary fluid. Here, the auxiliary fluid is a fluid having a different temperature from the test gas. The auxiliary fluid can be supplied into the containment space AS (see Figure 2) to provide additional cooling or heating for the semiconductor product facing the push section 134. As an example, the auxiliary fluid is liquid nitrogen (LN2).

[0056] An auxiliary fluid supply pipe 138 can be connected to the second duct housing 1332 so that auxiliary fluid is discharged to each auxiliary fluid outlet 1345. The duct section 130 may also include valves for individually adjusting the flow rate of the flow paths connected to each auxiliary fluid outlet 1345. Thus, according to one embodiment of the present invention, each of the multiple push sections 134 can discharge auxiliary fluid independently of the other push sections 134.

[0057] The discharge port 1341, exhaust port 1342, and auxiliary fluid discharge port 1345 can be arranged in a line along a center line (L1) passing the center point of the cross-section on one surface of the push section 134. In this case, Figure 4 illustrates that the discharge port 1341 and exhaust port 1342 are located adjacent to the center of the push section 134, and the auxiliary fluid discharge port 1345 is located outside the exhaust port 1342, but the present invention is not limited to this positional relationship. Therefore, the positions of the discharge port 1341, exhaust port 1342, and auxiliary fluid discharge port 1345 on the push section 134 can be changed in various ways.

[0058] In this case, if the discharge port 1341 and the exhaust port 1342 are arranged adjacent to each other, the temperature measuring sensor 136 can be positioned alongside the discharge port 1341 and the exhaust port 1342. For example, the temperature measuring sensor can be positioned parallel to a virtual line (L1) connecting the midpoints of the discharge port 1341 and the exhaust port 1342. Such a temperature measuring sensor 136 can be provided by various conventionally known temperature sensing sensors. As an example, the temperature measuring sensor 136 is an RTD sensor that utilizes the fact that its resistance value changes with temperature.

[0059] As described above, the temperature measuring sensor 136 can be built into a groove recessed on one side of the push portion 134. According to the present invention, the temperature measuring sensor 136 measures the temperature of the discharge port 1341, the exhaust port 1342, and the area adjacent to the semiconductor product in the push portion 134, which has the advantage of being able to measure the temperature at a location where the actual temperature of the test gas and the effect of heat generation by the semiconductor product can be understood.

[0060] The push portion 134 may further include a packing member 139 positioned along the periphery of one surface. The packing member 139 can seal the gap between the push portion 134 and the insert when the push portion 134 is in close contact with the test tray or insert, thereby ensuring a tight seal over the storage space. For example, the packing member 139 can be formed from sealing silicone, rubber, or the like, having a roughly rectangular shape.

[0061] The support structure of the duct block 133 according to one embodiment of the present invention will be described below with reference to Figure 5. Figure 5 shows the portion of the duct block according to one embodiment of the present invention that is attached to the distribution plate.

[0062] As shown in Figure 5, a duct block 133 according to one embodiment of the present invention may include a plurality of duct block elastic members 1335. The plurality of duct block elastic members 1335 can elastically support the duct block 133 with respect to the distribution plate 132 (see Figure 3). Assuming that the push portion 134 is installed on the front surface of the duct block 133, the duct block elastic members 1335 can be installed on the rear surface of the duct block 133. For example, the duct block elastic members 1335 can be mounted on the rear surface of the second duct housing 1332 so as to protrude rearward.

[0063] The duct block elastic members 1335 can provide elastic force so that each push portion 134 (see Figure 4) makes contact with the test tray 400 (see Figure 2) or insert 300 (see Figure 2) with uniform force. For this purpose, multiple duct block elastic members 1335 can be arranged at regular intervals behind the duct block 133. As an example, each of the multiple duct block elastic members 1335 can be arranged coaxially with one of the auxiliary fluid outlets 1345 (see Figure 4).

[0064] Meanwhile, a discharge passage 1333 and an exhaust passage 1334 can protrude from the rear of the second duct housing 1332. With the second duct housing 1332 mounted on the distribution plate 132, the discharge passage 1333 can receive the test gas via the distribution plate 132, and the exhaust passage 1334 can transmit the test gas to the distribution plate 132.

[0065] A through-hole (not indicated) can be formed on one side of the second duct housing 1332, to which an auxiliary fluid supply pipe 138 is connected. The auxiliary fluid flowing into the through-hole can be distributed in the second duct housing 1332 and / or the first duct housing 1331 and can move to the respective auxiliary fluid discharge ports 1345.

[0066] Hereinafter, the push portion according to one embodiment of the present invention will be described with reference to Figures 6 and 7. Figure 6 is a perspective view of the push portion according to one embodiment of the present invention, viewed from the front. In contrast, Figure 7 is a perspective view of the push portion according to one embodiment of the present invention, viewed from the rear.

[0067] As shown in Figures 6 and 7, the push portion 134 according to one embodiment of the present invention may include a push plate 1340, push tubes 1351 and 1352, a guide end 1344, and a guide end elastic member 1346.

[0068] The push plate 1340 is a substantially rectangular plate-shaped member that is in close contact with the test tray, separating the internal space of the insert from the external space. For a more secure seal, packing members 139 can be installed around the periphery of the push plate 1340 as described above. Discharge ports 1341, exhaust ports 1342, and auxiliary fluid discharge ports 1345 can each be passed through the push plate 1340. The discharge ports 1341, exhaust ports 1342, and auxiliary fluid discharge ports 1345 can be arranged along the central axis of the push plate 1340.

[0069] The push pipes 1351 and 1352 are tubular members that protrude from the rear of the push plate 1340. The push pipes 1351 and 1352 can be inserted into the duct section 130 (see Figure 3). The push pipes 1351 and 1352 can be divided into a discharge push pipe 1351 that communicates with the discharge passage 1333 (see Figure 5) and an exhaust push pipe 1352 that communicates with the exhaust passage 1334 (see Figure 5). In this case, the discharge port 1341 can be formed in part on the push plate 1340 and the remaining part on the discharge push pipe 1351. Similarly, the exhaust port 1342 can be formed in part on the push plate 1340 and the remaining part on the exhaust push pipe 1352.

[0070] Gas communication grooves 1351a and 1352a can be formed in the discharge push pipe 1351 and the exhaust push pipe 1352. The gas communication grooves 1351a and 1352a can be formed by removing a portion of the rear end area of ​​the push pipes 1351 and 1352. Hereinafter, the gas communication groove 1351a formed in the discharge push pipe 1351 will be referred to as the discharge gas communication groove 1351a, and the gas communication groove 1352a formed in the exhaust push pipe 1352 will be referred to as the exhaust gas communication groove 1351a. The discharge gas communication groove 1351a can be formed so that the discharge port 1341 allows fluid communication with the outside through the rear end of the discharge push pipe 1351. Similarly, the exhaust gas communication groove 1352a can be formed so that the exhaust port 1342 allows fluid communication with the outside through the rear end of the exhaust push pipe 1352. An explanation for this will be given later with reference to Figures 10 to 12.

[0071] The guide end 1344 is an axial member that guides the direction of movement of the push section 134. The guide end 1344 extends parallel to the push pipes 1351 and 1352 and can be inserted into the duct section 130. In addition, multiple guide ends 1344 are provided, each extending backward from one corner of the rear surface of the push plate 1340. The direction of movement is guided by multiple guide ends 1344, and the push section 134 according to one embodiment of the present invention can move along the extension direction of the guide ends 1344 without being biased to one side.

[0072] At this time, the guide end 1344 can be inserted into the guide hole 1331c (see Figure 8) formed in the duct section 130 and move forward and backward. Multiple guide end elastic members 1346 are arranged inside each guide hole 1331c and can elastically support any one of the guide ends 1344. The guide end elastic members 1346 can provide elastic force to the guide end 1344 in a direction that causes the push pipes 1351 and 1352 to be in close contact with the discharge channel push body 510 (see Figure 8) and the exhaust channel push body 520 (see Figure 8), which will be described later.

[0073] The following description will refer to Figure 8 to explain a first duct housing 1331 according to one embodiment of the present invention. Figure 8 shows the first duct housing according to one embodiment of the present invention in a state in which the push portion is separated.

[0074] As shown in Figure 8, the first duct housing 1331 is provided with a discharge port 1331a, an exhaust port 1331b, and a guide hole 1331c, and an auxiliary fluid discharge pipe 1331d can be arranged therein.

[0075] The discharge port 1331a is located between the discharge port 1341 (see Figure 6) and the discharge flow path 1333 (see Figure 5), and is an opening that connects both in a way that allows fluid to pass through them. In contrast, the exhaust port 1331b is located between the exhaust port 1342 (see Figure 6) and the exhaust flow path 1334 (see Figure 5), and is an opening that connects both in a way that allows fluid to pass through them. In the initial state, the discharge port 1331a and the exhaust port 1331b can be tightly fitted to the discharge flow path push body 510 or the exhaust flow path push body 520, respectively. This will be explained later with reference to Figures 10 to 12. On the other hand, the guide hole 1331c penetrates to a position corresponding to each guide end 1344 and can accommodate the guide end 1344.

[0076] The auxiliary fluid discharge pipe 1331d can be positioned to penetrate the first duct housing 1331 and the push plate 1340. That is, the end portion of the auxiliary fluid discharge pipe 1331d can be located inside the auxiliary fluid outlet 1345. The auxiliary fluid discharge pipe 1331d can be fluid-communicable with the auxiliary fluid supply pipe 138 to discharge the aforementioned auxiliary fluid into the containment space AS.

[0077] Hereinafter, a second duct housing 1332 according to one embodiment of the present invention will be described with reference to Figure 9. Figure 9 shows the second duct housing in a state separated from the first duct housing according to one embodiment of the present invention.

[0078] As shown in Figure 9, a discharge passage 1333 and an exhaust passage 1334 are passed through the second duct housing 1332 almost perpendicularly, and expansion grooves 1332a and 1332b can be formed at the ends of each. The expansion grooves 1332a and 1332b are grooves that expand the size of the ends of the discharge passage 1333 and the exhaust passage 1334. For example, as shown in Figure 9, the expansion grooves 1332a and 1332b are formed to have a hemispherical cross-sectional shape, and multiple grooves can be positioned one at a time at regular intervals around the ends of the discharge passage 1333 and / or the exhaust passage 1334. For the sake of explanation, the expansion groove 1332a formed at the end of the discharge passage 1333 will be referred to as the discharge passage expansion groove 1332a, and the expansion groove 1332b formed at the end of the exhaust passage 1334 will be referred to as the exhaust passage expansion groove 1332b. The expansion grooves 1332a and 1332b will be explained later with reference to Figures 10 to 12.

[0079] A temperature control device according to one embodiment of the present invention includes a flow path opening / closing unit 500 for adjusting the flow path of the test gas depending on the situation.

[0080] The flow path opening / closing section 500 can obstruct the flow of test gas through the discharge port 1331a in the initial state when there is no external force, and allow the flow of test gas to the discharge port 1341 (see Figure 4) in the test state when the push section 134 is close to the test tray. Similarly, the flow path opening / closing section 500 can obstruct the flow of test gas through the exhaust port 1331b in the initial state, and allow the flow of test gas that has passed through the exhaust port 1342 (see Figure 4) into the exhaust flow path 1334 in the test state.

[0081] Hereinafter, a method for adjusting the flow path using a flow path opening / closing unit 500 according to one embodiment of the present invention will be described with reference to Figures 10 to 12. First, Figure 10 shows the initial state of the temperature control device according to one embodiment of the present invention. In contrast, Figure 11 shows the test state of the temperature control device according to one embodiment of the present invention. Figure 12 is a diagram for explaining the flow through the expansion groove according to one embodiment of the present invention.

[0082] As shown in Figure 10, the flow path opening / closing section 500 according to one embodiment of the present invention may include a discharge flow path push body 510, an exhaust flow path push body 520, a discharge flow path elastic member 511, and an exhaust flow path elastic member 521. The discharge flow path push body 510 and the exhaust flow path push body 520 can be formed in a stepped shape such that the diameter of the central portion is larger.

[0083] More specifically, the cross-sectional size of the portion protruding from the discharge channel push body 510 is larger than the cross-sectional size of the discharge port 1331a. Also, the cross-sectional size of the portion protruding from the discharge channel push body 510 is smaller than the cross-sectional size of the accommodating section 1333a of the discharge channel 1333, by a tolerance that will be described later. As a result, the discharge channel push body 510 can be accommodated in the accommodating section 1333a, and when it is in close contact with the discharge port 1331a, it can close the discharge port 1331a and obstruct the flow of the test gas. Conversely, when the discharge channel push body 510 is separated from the discharge port 1331a, the movement of the test gas to the discharge port 1331a can be permitted through the available space in the accommodating section 1333a of the discharge channel 1333. At this time, in order to ensure an appropriate flow rate of the test gas, the test gas in the containment section 1333a can be moved to the discharge port 1331a via the discharge flow path expansion groove 1332a, which extends from the outline of the discharge port 1331a.

[0084] Similarly, the cross-sectional size of the portion protruding from the exhaust channel push body 520 is larger than the cross-sectional size of the exhaust communication port 1331b. Also, the cross-sectional size of the portion protruding from the exhaust channel push body 520 is smaller than the cross-sectional size of the accommodating section 1334a of the exhaust channel 1334, as described later, by an allowable tolerance. As a result, the exhaust channel push body 520 can be accommodated in the accommodating section 1334a, and when it is in close contact with the exhaust communication port 1331b, it can close the exhaust communication port 1331b and obstruct the flow of the test gas. Conversely, when the exhaust channel push body 520 is separated from the exhaust communication port 1331b, the test gas can pass through the exhaust communication port 1331b and move into the accommodating section 1334a of the exhaust channel 1334. At this time, in order to ensure an appropriate flow rate of the test gas, the test gas can pass through the exhaust port 1331b and move to the containment section 1334a via the exhaust flow path expansion groove 1332b, which extends from the outline of the exhaust port 1331b.

[0085] In the detailed description, it was illustrated that the test gas passes through the discharge channel 1333, the discharge channel expansion groove 1332a, and the discharge communication port 1331a to be discharged to the discharge port 1341, and then exhausted to the exhaust channel 1334 via the exhaust port 1342, the exhaust communication port 1331b, and the exhaust channel expansion groove 1332b. However, the present invention is not necessarily limited to such examples. For example, the push tubes 1351 and 1352 can pass through the discharge communication port 1331a and the exhaust communication port 1331b and be inserted into the discharge channel 1333 and the exhaust channel 1334 to their internal positions. In this case, the test gas can pass through the discharge channel 1333 and the discharge channel expansion groove 1332a, then flow into the gas communication groove 1351a and be discharged. Alternatively, the test gas can flow into the exhaust channel expansion groove 1332b via the gas communication groove 1352a and be exhausted to the exhaust channel 1334.

[0086] On the other hand, the discharge channel elastic member 511 and the exhaust channel elastic member 521 can be formed to elastically support the discharge channel push body 510 and the exhaust channel push body 520, respectively. For example, the discharge channel elastic member 511 and / or the exhaust channel elastic member 521 can be provided with a helical spring, or with a member that can replace it. The discharge channel elastic member 511 can provide a restoring force in the direction that brings the discharge channel push body 510 into close contact with the discharge port 1331a. Similarly, the exhaust channel elastic member 521 can provide a restoring force in the direction that brings the exhaust channel push body 520 into close contact with the exhaust port 1331b.

[0087] A discharge channel 1333 according to one embodiment of the present invention may include a containment section 1333a and an inner section 1333b. Similarly, an exhaust channel 1334 according to one embodiment of the present invention may include a containment section 1334a and an inner section 1334b. To distinguish between the two, the containment section 1333a and the inner section 1333b formed in the discharge channel 1333 are referred to as the discharge channel containment section 1333a and the discharge channel inner section 1333b, respectively. Similarly, the containment section 1334a and the inner section 1334b formed in the exhaust channel 1334 are referred to as the exhaust channel containment section 1334a and the exhaust channel inner section 1334b, respectively.

[0088] The discharge channel housing section 1333a is connected at one end to the discharge communication port 1331a and at the other end to the discharge channel inner section 1333b, and can house the discharge channel push body 510 inside. The discharge channel push body 510 can move back and forth inside the discharge channel housing section 1333a based on external force and the elastic force of the discharge channel elastic member 511. Test gas supplied externally can pass through the discharge channel inner section 1333b and reach the discharge channel housing section 1333a. For example, the test gas supplied to the discharge channel 1333 is the test gas inside the circulation chamber 120 (see Figure 1) mentioned above.

[0089] On the other hand, the inner discharge channel section 1333b can form a step at the rear end of the discharge channel housing section 1333a to support the discharge channel elastic member 511, based on the difference in inner diameter between it and the discharge channel housing section 1333a. Here, the step can mean a portion that protrudes into the flow path formed by the difference in inner diameter. As an example, the inner discharge channel section 1333b can be formed with a smaller inner diameter than the discharge channel housing section 1333a so that the cross-section of the discharge channel 1333 has a stepped shape. The discharge channel elastic member 511 can be positioned between the step formed by the difference in width between the discharge channel housing section 1333a and the inner discharge channel section 1333b and the discharge channel push body 510.

[0090] Similarly, the exhaust passage housing section 1334a is connected at one end to the exhaust communication port 1331b and at the other end to the inner exhaust passage section 1334b, and can house the exhaust passage push body 520 inside. The exhaust passage push body 520 can move back and forth inside the exhaust passage housing section 1334a based on external forces and the elastic force of the exhaust passage elastic member 521. The test gas inside the housing space AS (see Figure 2) can pass through the exhaust communication port 1331b and be exhausted to the outside via the exhaust passage 1334. For example, the destination of the test gas exhausted into the exhaust passage 1334 is the circulation chamber 120 described above.

[0091] The inner exhaust passage section 1334b can form a step at the rear end of the exhaust passage housing section 1334a to support the exhaust passage elastic member 521, based on the difference in inner diameter between it and the exhaust passage housing section 1334a. Here, the step can mean a protruding portion into the flow path formed by the difference in inner diameter. As an example, the inner exhaust passage section 1334b can be formed with a smaller inner diameter than the exhaust passage housing section 1334a so that the cross-section of the exhaust passage 1334 has a stepped shape. The exhaust passage elastic member 521 can be positioned between the step formed by the difference in width between the exhaust passage housing section 1334a and the inner exhaust passage section 1334b and the exhaust passage push body 520.

[0092] On the other hand, a circulation channel 1332e can be formed in the second duct housing 1332, connecting the discharge channel section 1333a and the exhaust channel section 1334a.

[0093] The circulation channel 1332e is not obstructed by the discharge channel push body 510 and / or exhaust channel push body 520 in the initial state, but can be obstructed at both ends by the discharge channel push body 510 and / or exhaust channel push body 520 in the test state. Specifically, in the initial state, the circulation channel 1332e can be exposed on one side of the discharge channel push body 510 and / or exhaust channel push body 520. Also, in the test state, one end of the circulation channel 1332e can face the discharge channel push body 510 and the other end can face the exhaust channel push body 520.

[0094] The flow of the test gas in the initial state according to one embodiment of the present invention will be described below with reference to Figure 10.

[0095] In the initial state, the guide end elastic member 1346 (see Figure 7) allows the discharge push pipe 1351 and the exhaust push pipe 1352 to be in close contact with the discharge channel push body 510 and the exhaust channel push body 520, respectively. At this time, in order to prevent the discharge push pipe 1351 and the exhaust push pipe 1352 from pushing the discharge channel push body 510 and the exhaust channel push body 520 and entering the area of ​​the discharge channel 1333 or the exhaust channel 1334, the elastic force of the discharge channel elastic member 511 and the exhaust channel elastic member 521 is stronger than the elastic force of the guide end elastic member 1346.

[0096] On the other hand, the portion of the auxiliary fluid discharge pipe 1331d with an expanded radius at its end (the end facing the external space) and the inner wall of the push plate 1340 forming the auxiliary fluid discharge port 1345 act as a kind of stopper, preventing the push plate 1340 from separating from the first duct housing 1331. More specifically, the diameter of the outlet portion of the auxiliary fluid discharge port 1345 is formed to correspond to the diameter of the end portion of the auxiliary fluid discharge pipe 1331d, while the diameter of the opposite portion can be formed to be smaller than the diameter of the end portion of the auxiliary fluid discharge pipe 1331d. This prevents the push plate 1340 from advancing beyond the end portion of the auxiliary fluid discharge pipe 1331d and from separating from the first duct housing 1331.

[0097] In this state, the discharge channel push body 510 and the exhaust channel push body 520 are advanced to their maximum extent, thus preventing gas movement through the discharge port 1331a and the exhaust port 1331b. Therefore, the test gas supplied to the discharge channel 1333 cannot be discharged to the outside and can be returned to the circulation chamber 120 via the circulation channel 1332e and the exhaust channel 1334. As a result, in the initial state, the test gas can be continuously circulated between the circulation chamber 120 and the push plate 1340 to regulate its temperature.

[0098] In this case, according to one embodiment of the present invention, a number of O-rings can be arranged to block minute gaps between each component. For example, the O-rings can be arranged to prevent minute gaps between the push bodies 510, 520 and the communication openings 1331a, 1331b, and between the push pipes 1351, 1352 and the first duct housing 1331 in the initial state.

[0099] The flow of the test gas in a test state according to one embodiment of the present invention will be described below with reference to Figure 11.

[0100] In the test state, the push plate 1340 can be in close contact with the test tray, insert, and / or semiconductor product. The push plate 1340 is in close contact with the test tray or insert when the semiconductor product is fine and intricate and it is necessary to minimize contact and vibration to the semiconductor product. For example, in this case, the semiconductor product is HBM, HBM DIE, etc. Another example is when the push plate 1340 directly contacts the semiconductor product to directly pressurize and exchange heat. For example, in this case, the semiconductor product is a memory module.

[0101] The push plate 1340, pressurized by the force of contact with the test tray, insert, and / or semiconductor product, can be housed inside the first duct housing 1331. This allows the discharge push pipe 1351 to pressurize the discharge channel push body 510 into the housing section 1333a. Similarly, the exhaust push pipe 1352 can pressurize the exhaust channel push body 520 into the housing section 1334a. Thus, during the transition from the initial state to the test state, the ends of the discharge push pipe 1351 and the exhaust push pipe 1352 can be inserted into the discharge channel 1333 or the exhaust channel 1334 by passing through the discharge communication port 1331a and the exhaust communication port 1331b, respectively.

[0102] In this state, the discharge gas passage groove 1351a and the exhaust gas passage groove 1352a can be located in the discharge passage housing section 1333a (or discharge communication port 1331a) and the exhaust passage housing section 1334a (or exhaust communication port 1331b), respectively. More specifically, in this state, at least a portion of the discharge gas passage groove 1351a can be located in the internal space of the discharge passage expansion groove 1332a. Similarly, in this state, at least a portion of the exhaust gas passage groove 1352a can be located in the internal space of the exhaust passage expansion groove 1332b.

[0103] As a result, the test gas inside the discharge channel containment section 1333a can flow to the discharge port 1341 via the discharge channel expansion groove 1332a and the discharge gas communication groove 1351a, and finally be discharged to the outside. Similarly, the test gas flowing into the exhaust port 1342 can flow into the exhaust channel containment section 1333b via the exhaust gas communication groove 1352a and the exhaust channel expansion groove 1332b, and finally be transmitted to the circulation chamber 120.

[0104] At this time, both ends of the circulation channel 1332e are blocked by the discharge channel pusher 510 and the exhaust channel pusher 520, so the flow rate of the test gas flowing through the circulation channel 1331e is zero or negligible.

[0105] On the other hand, if the temperature control device according to one embodiment of the present invention includes a discharge channel expansion groove 1332a and an exhaust channel expansion groove 1332b, it can have the following effects. First, the discharge channel expansion groove 1332a can reduce the velocity of the gas discharged through the discharge port 1341 by diffusing the test gas that was flowing in the narrow space between the discharge channel push body 510 and the inner wall of the discharge channel 1333 into a wider space. As a result, the test gas can be uniformly diffused without being concentrated and injected at one point inside the containment space AS. On the other hand, the exhaust channel expansion groove 1332a can prevent the test gas from being properly exhausted by forming a vortex when exhausted into a narrow space, by increasing the size of the exhaust port through which the test gas is exhausted.

[0106] The structure of the duct block and push section according to another embodiment of the present invention will be described below with reference to Figure 13. Figure 13 is a schematic cross-sectional view of the duct block and push section according to another embodiment of the present invention. In the following description, it will be assumed that the duct block 333 is located below the push section 334. To avoid redundant explanations, parts that are the same or similar to those of the previously described embodiment will be omitted from the description, and the differences will be explained in detail.

[0107] As shown in Figure 13, according to another embodiment of the present invention, one push section 334 can be formed to correspond to a plurality of inserts 300 (see Figure 2). A pair of discharge ports 3341 and exhaust ports 3342 can be formed in the push section 334, each corresponding to one insert 300. In this case, Figure 13 shows the discharge port 3341 located to the right of the exhaust port 3342, but the opposite is also possible. On the other hand, similar to the embodiment described above, the discharge port 3341 and exhaust port 3342 can be extended along the central axis of the push pipe 3343 that protrudes in one direction from the push section 334. Also, similar to the embodiment described above, a discharge port 3341a and an exhaust port 3342a can be formed through the portion of the duct block 333 into which the push pipe 3343 is inserted.

[0108] The core feature of the temperature control device according to the embodiment shown in Figure 13 is that the circulation path of the test gas can be adjusted with a single push element 3335. In other words, the roles of the discharge channel push element 510 and the exhaust channel push element 520 used in previous embodiments can be replaced by a single push element 3335 in this embodiment.

[0109] In this embodiment, the flow path opening / closing sections 3335 and 3336 can be formed to include one push body 3335 and at least one push body elastic member 3336. More specifically, according to this embodiment, the push body 3335 can be placed in a push body housing groove 333a recessed in the upper surface of the duct block 334. The push body housing groove 333a can be connected to a discharge passage 3331 and an exhaust passage 3332, respectively, through an opening formed in its bottom surface. Furthermore, a discharge communication port 3341a and an exhaust communication port 3342a can be formed through the upper surface of the push body housing groove 333a. On the other hand, the push body elastic member 3336 is located inside the push body housing groove 333a between the push body 3335 and the inner wall of the duct block 333, and can be provided in the same or similar manner as the discharge passage elastic member 511 and / or exhaust passage elastic member 521 of the previous embodiment.

[0110] In the connected state of the duct block 333 and the push section 334, the push pipe 3343 of the push section 334 is housed in the push body housing groove 333a, and its end can be tightly fitted to the push body 3335. Similar to the previously described embodiment, gas communication grooves 1351a and 1352a (see Figure 6) can be formed in the push pipe 3343 in this embodiment as well. Therefore, as in the previously described embodiment, fluid communication can be performed between the discharge port 3341 and the exhaust port 3342 and the space inside the push body housing groove 333a via the gas communication grooves 1351a and 1352a (see Figure 6). Although not shown, similar to the previously described embodiment, expansion grooves 1332a and 1332b (see Figure 12) can be formed in this embodiment as well, extending from the discharge communication port 3341a and the exhaust communication port 3342a. As described in the above embodiment, the expansion groove is a groove formed so that fluid communication through the gas communication groove is smooth when the push pipe 3343 is maximally accommodated in the push body housing groove 333a.

[0111] In the absence of external force, the push body 3335 according to the embodiment in Figure 13 can be in close contact with the upper surface of the push body housing groove 333a. As a result, the discharge port 3341a and the exhaust port 3342a are in close contact with the upper surface of the push body 3335, and the internal space of the push body housing groove 333a can be isolated from the external space. For this reason, the push body elastic member 3336 can elastically support the push body 3335 in the direction of the push portion 334. In this state, the test gas discharged through the discharge channel 3331 is blocked by the push body 3335 and cannot be discharged to the outside, but can move through the available space in the push body housing groove 333a or a separate circulation channel 1332e (see Figure 10) and be immediately exhausted into the exhaust channel 3332.

[0112] In contrast, when the push section 334 or the duct block 333 is pressurized by an external force, the push section 334 can be accommodated to its maximum extent inside the duct block 333 by overcoming the elastic force of the push body elastic member 3336, as shown in Figure 13. In this state, the test gas discharged into the discharge channel 3331 can sequentially pass through the expansion groove formed in the push body housing groove 333a and the gas communication groove of the push pipe 3343, and finally be discharged into the discharge port 3341. Similarly, the test gas to be exhausted into the exhaust port 3342 can, after passing through the exhaust port 3342, sequentially pass through the gas communication groove and the expansion groove, and finally be exhausted to the outside via the exhaust channel 3332.

[0113] At this time, the external force that moves the push body 3335 can be obtained by pressurizing the push portion 334 with the test tray, or by a separate member that rises as the test tray approaches, or by a separate drive device.

[0114] On the other hand, in the embodiment shown in Figure 13, the push body 3335 can be formed with an Allan protruding end 3335a protruding from the surface facing the push portion 334. The Allan protruding end 3335a can be inserted into the Allan groove 334a formed between the discharge port 3341 and the exhaust port 3342 in the push portion 334. The Allan protruding end 3335a and the Allan groove 334a extend in a direction parallel to the relative approach direction of the test tray to the push portion 334, and can guide the direction of movement when the push portion 334 and the duct block 333 are in close contact. As a result, according to one embodiment of the present invention, even if the push portion 334 and the duct block 333 deviate slightly from their initial state due to thermal deformation, the push portion 334 can be moved in the correct direction relative to the duct block 333.

[0115] As shown in the embodiment in Figure 13, a single push body 3335 can adjust the fluid movement path for both the discharge channel 3331 and the exhaust channel 3332, which is particularly advantageous when the semiconductor product is small and the gap between the discharge channel 3331 and the exhaust channel 3332 is very narrow.

[0116] A person with ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without altering its technical idea or essential features. Therefore, the embodiments described above should be understood to be illustrative and not limiting in all respects. The scope of the present invention is defined by the claims, which are set forth below in the detailed description, and all modifications or alterations derived from the meaning and scope of the claims and the concept of equivalents thereto should be interpreted as being included within the scope of the present invention. [Explanation of Symbols]

[0117] 1. Temperature control system 100 Temperature control device 110 Dry Chamber 120 Circulation Chamber 130 Duct section 131 Gas Circulator 1311 Circulation Housing 1312 Gas temperature controller 1313 Fans 1314 Supply pipe 1315 Recovery pipe 132 Distribution Plate 133, 333 duct blocks 1331 First duct housing 1331a Discharge communication port 1331b Exhaust port 1331c Guide Hall 1331d Auxiliary fluid discharge pipe 1332 Second duct housing 1332a Discharge channel expansion groove 1332b Exhaust flow path expansion groove 1333, 3331 Discharge channel 1334, 3332 Exhaust passage 1335 Duct block elastic member 134, 334 Push part 1340 Push Plate 1341, 3341 outlet 1342, 3342 Exhaust vents 1344 Guide end 1345 Auxiliary fluid outlet 1346 Guide end elastic member 1351, 1352 Push tubes 1351a, 1352a Gas circulating groove 138 Auxiliary fluid supply pipe 139 Packing components 200 Tester 300 inserts 310 Insert Body 320 Contact Board 330 Interface Board 340 Latch 400 Test Trays 500 Flow path opening / closing section 510 Discharge channel push body 511 Discharge channel elastic member 520 Exhaust flow path pusher 521 Exhaust flow path elastic member AS containment space

Claims

1. A push section that is relatively close to the test tray carrying semiconductor products and has an outlet formed therein for discharging test gas to adjust the test environment; A duct section having a discharge channel formed for transmitting the test gas transmitted from the outside to the discharge port; and, A temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, including a flow path opening / closing section that, in the initial state, obstructs the flow of the test gas through a discharge communication port located between the discharge port and the discharge flow path to prevent the discharge of the test gas to the discharge port, and allows the discharge of the test gas to the discharge port in a test state when the push section is relatively close to the test tray.

2. The aforementioned flow path opening / closing section is A temperature control device for semiconductor products that changes the flow path of a test gas according to claim 1, comprising: a discharge channel push body disposed inside the discharge channel, which is in close contact with the discharge port in the initial state and is switched to the test state by receiving an external force and is separated from the discharge port;

3. The aforementioned flow path opening / closing section is A temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, further comprising: a discharge channel elastic member that provides a restoring force to cause the discharge channel push body to adhere tightly to the discharge port; as described in claim 2.

4. The aforementioned discharge channel is A temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, as described in claim 3, comprising: a housing section, one end of which is connected to the discharge communication port and in which the discharge flow path push body moves back and forth inside; and an inner section, connected to the other end of the housing section and forming a step that supports the discharge flow path elastic member.

5. The aforementioned duct section includes, A temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, according to claim 2, further comprising an exhaust passage for exhausting the test gas and a circulation passage for connecting the discharge passage to the exhaust passage.

6. The temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, wherein the push portion is further formed with an exhaust port that allows fluid communication with the exhaust passage.

7. The aforementioned flow path opening / closing section is A temperature control device for a semiconductor product that changes the flow path of a test gas depending on the situation, according to claim 6, further comprising: an exhaust flow path pusher, which is disposed inside the exhaust flow path and is in close contact with an exhaust communication port located between the exhaust port and the exhaust flow path in the initial state and is separated from the exhaust communication port in the test state;

8. The aforementioned circulation channel is A temperature control device for semiconductor products that changes the flow path of the test gas according to claim 4, which is exposed on one side of the discharge channel push body in the initial state and faces the discharge channel push body in the test state, depending on the situation.

9. The push portion is A temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, according to claim 2, comprising: a push pipe that forms at least a portion of the discharge port, is inserted into the duct portion, and is switched from the initial state to the test state to pressurize the discharge flow path push body;

10. The aforementioned push tube is A temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, as described in claim 9, wherein a gas communication groove communicating with the discharge port is formed at the end portion so that the test gas inside the discharge channel is transmitted to the discharge port in the test state.

11. The aforementioned discharge channel push body is A temperature control device for semiconductor products that changes the flow path of a test gas according to claim 10, wherein the cross-sectional size is larger than the cross-sectional size of the discharge communication port and smaller than the cross-sectional size of the discharge flow path.

12. The push portion is A temperature control device for semiconductor products that modifies the flow path of a test gas depending on the circumstances, according to claim 9, further comprising: a guide end extending parallel to the push pipe and inserted into the duct portion so as to guide the direction of movement of the push portion;

13. The push portion is A temperature control device for semiconductor products that changes the flow path of a test gas depending on the situation, according to claim 12, further comprising: a guide end elastic member that elastically supports the guide end in a direction that brings the push tube into close contact with the discharge flow path push body;

14. The aforementioned duct section is, A temperature control device for a semiconductor product that changes the flow path of a test gas depending on the situation, comprising: an auxiliary fluid discharge pipe disposed through the push portion and through which an auxiliary fluid having a different temperature from the test gas flows; the device according to claim 1.

15. A temperature control device for a semiconductor product that changes the flow path of a test gas depending on the situation, according to claim 1, further comprising: a temperature measuring sensor positioned adjacent to the discharge port and exhaust port and parallel to a virtual line connecting the discharge port and the exhaust port;

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