Semiconductor device package and acoustic device equipped therewith

Abstract

The objective is to eliminate the negative impact on the performance of an electronic device caused by miniaturization when various circuits or modules are incorporated into a single electronic device, such as an audio device (e.g., earphones or wireless earphones). [Solution] The wireless earphone of the present invention comprises a battery, a speaker, and a chamber / space. The battery has a first surface, a second surface opposite to the first surface, and a third surface extending between the first and second surfaces, and is isolated from the protection circuit. The speaker is positioned adjacent to the first surface of the battery. The chamber / space is defined by the battery and the speaker. The chamber / space contains no electronic components.

Description

Technical Field

[0001] The present invention generally relates to semiconductor device packages, and more particularly to acoustic devices having semiconductor device packages.

Background Art

[0002] As technology advances, various circuits or modules are incorporated into one electronic device such as an acoustic device (e.g., earphone or wireless earphone) to perform multiple functions. However, miniaturization of the electronic device may adversely affect the performance of the electronic device.

Summary of the Invention

Problems to be Solved by the Invention

[0003] An object of the present invention is to eliminate the adverse effect on the performance of an electronic device due to miniaturization of the electronic device when various circuits or modules are incorporated into one electronic device such as an acoustic device (e.g., earphone or wireless earphone).

Means for Solving the Problems

[0004] In some embodiments, the present invention discloses a wireless earphone. The wireless earphone includes a battery, a speaker, and a chamber / space. The battery has a first surface, a second surface opposite the first surface, and a third surface extending between the first surface and the second surface, and is separated from the protection circuit. The speaker is disposed adjacent to the first surface of the battery. The chamber / space is defined by the battery and the speaker. There are no electronic components in the chamber / space.

[0005] In some embodiments, the present invention further discloses a wireless earphone. The wireless earphone comprises a speaker, a battery, and a first semiconductor device package. The battery is separated from the speaker and has a first surface, a second surface opposite to the first surface, and a third surface extending between the first and second surfaces. The first semiconductor device package is disposed adjacent to the second or third surface of the battery. The first semiconductor device package includes a substrate, a power supply structure, and a encapsulant. The substrate has a first surface and a second surface opposite to the first surface. The power supply structure is disposed on the first surface. The encapsulant encapsulates the entire second surface of the substrate. [Brief explanation of the drawing]

[0006] Some embodiments of the present invention will be readily apparent from the following detailed description with reference to the accompanying drawings. Note that for clarity of explanation, various structures may be drawn to scale, and their dimensions may be arbitrarily enlarged or reduced.

[0007] [Figure 1A] Figure 1A is an exploded view of an acoustic device according to several embodiments of the present invention.

[0008] [Figure 1B] Figure 1B is a perspective view of the acoustic device assembly shown in Figure 1A.

[0009] [Figure 1C] Figure 1C is a side view of the acoustic device assembly shown in Figure 1B.

[0010] [Figure 2A] Figure 2A is an exploded view of an acoustic device according to several embodiments of the present invention.

[0011] [Figure 2B] Figure 2B is a perspective view of the acoustic device assembly shown in Figure 2A.

[0012] [Figure 2C] Figure 2C is a side view of the assembly of the acoustic device shown in Figure 2B.

[0013] [Figure 2D] Figure 2D is another side view of the assembly of the acoustic device shown in Figure 2B.

[0014] [Figure 3A] Figure 3A is an exploded view of the electronic components of the acoustic device according to some embodiments of the present invention.

[0015] [Figure 3B] Figure 3B shows an assembly of the electronic components of the acoustic device according to some embodiments of the present invention.

[0016] [Figure 3C] Figure 3C is an exploded view of the acoustic device according to some embodiments of the present invention.

[0017] [Figure 3D] Figure 3D is a side view of the assembly of the acoustic device shown in Figure 3C.

[0018] [Figure 4A] Figure 4A shows an acoustic device inserted into a human ear according to some embodiments of the present invention.

[0019] [Figure 4B] Figure 4B shows an acoustic device inserted into a human ear according to some other embodiments of the present invention.

[0020] [Figure 4C] Figure 4C shows the acoustic device shown in Figure 4B falling off a human ear.

[0021] [Figure 5] Figure 5 is a cross-sectional view of the semiconductor device package of the acoustic device shown in Figures 1A and 2A.

[0022] [Figure 6A] Figure 6A shows the frequency response of an earphone pair according to an embodiment of the present invention.

[0023] [Figure 6B] Figure 6B shows the frequency response of another earphone pair according to an embodiment of the present invention.

[0024] [Figure 7] Figure 7 is an exploded view of an acoustic device according to several embodiments of the present invention. [Modes for carrying out the invention]

[0025] Figure 1A shows an exploded view of an acoustic device 1 according to several embodiments of the present invention. The acoustic device 1 includes a speaker 10, a battery 11, a semiconductor device package 12, an interconnect structure 13, and a housing 14. The speaker 10 has a surface 10a and a surface 10b opposite to surface 10a. The battery 11 has a surface 11a, a surface 11b opposite to surface 11a, and a surface 11c extending between surfaces 11a and 11b, and is isolated from the protection circuit. The battery 11 also includes a coin-shaped package but does not include an aluminum cover. The capacity of the battery 11 may be greater than 60 mAh. For example, the capacity of the battery 11 may be approximately 63 mAh.

[0026] The speaker 10 is positioned adjacent to the surface 11a of the battery 11. The surface 10a of the speaker 10 faces the surface 11a of the battery 11. The surface 11a of the battery 11 may be the cathode of the battery 11. The structure of the semiconductor device package 12 is shown in the cross-sectional view of the semiconductor device package 5 in Figure 5. The speaker 10 is connected to the semiconductor device package 12 by wires 15. The wires 15 do not penetrate the battery 11. The speaker 10 is also isolated from the battery 11 by a chamber / space S1. The housing 14 encloses the speaker 10, the battery 11, the semiconductor device package 12, and the interconnection structure 13. The interconnection structure 13 connects the battery 11 and the semiconductor device package 12 and includes a flexible printed circuit (FPC) or other interconnection structure.

[0027] Figure 1B is a perspective view of the assembly of the acoustic device 1 shown in Figure 1A. The semiconductor device package 12 is positioned adjacent to the surface 11c of the battery 11 and adjacent to the surface 11b of the battery 11. The semiconductor device package 12 is also electrically connected to the surface 11c of the battery 11 by an interconnection structure 13. The speaker 10 is separated from the surface 11a of the battery 11 by a chamber / space S1. The chamber / space S1 does not contain any electronic components. The chamber / space S1 may have a plate to separate the speaker from the battery 11. The chamber / space S1 may also have wires, or only wires. Furthermore, the chamber / space S1 may not contain any active components, nor may it contain any passive components. There are no electronic components in the space between the surface 11b of the battery 11 and the housing 14.

[0028] The semiconductor device package 12 is positioned between the housing 14 and the surface 11c of the battery 11. The semiconductor device package 12 is also positioned between the housing 14 and the surface 11b of the battery 11. The speaker 10 has a surface 10a facing the surface 11a of the battery 11. The semiconductor device package 12 is positioned between the housing 14, the surface 11c of the battery 11, and the surface 10a of the speaker 10. The semiconductor device package 12 is also positioned between the housing 14, the surface 11b of the battery 11, and the surface 10a of the speaker 10. The semiconductor device package 12 is surrounded by the housing 14, the surface 11c of the battery 11, and the surface 10a of the speaker 10. The semiconductor device package 12 is positioned in a chamber / space defined by the housing 14, the surface 11c of the battery 11, and the speaker 10. Furthermore, the semiconductor device package 12 is placed in a chamber / space defined by the housing 14, the surface 11b of the battery 11, and the speaker 10. The housing 14 surrounds the speaker 10, the battery 11, and the semiconductor device package 12. The housing 14 has an end 14a and an end 14b opposite to the end 14a. An opening (not shown in Figure 1B) may be provided at the end 14a. An antenna pattern 16 is formed on the housing 14. The feed point of the semiconductor device package 12 (not shown in Figure 1B) is in contact with the antenna pattern 16.

[0029] Referring again to Figure 1B, assuming the width or diameter of the speaker 10 is approximately 6 mm, the maximum distance Z1 along the z-axis between end 14a (which can be fitted or inserted into the ear) and end 14b can be 23 mm or less. For example, assuming the width or diameter of the speaker 10 is approximately 6 mm, the distance Z1 along the z-axis between end 14a (which can be fitted or inserted into the ear) and end 14b can be 20 mm or less. Therefore, the semiconductor device package 12 facilitates the miniaturization of the acoustic device 1. In other words, by arranging the semiconductor device package 12, the miniaturization of the acoustic device 1 can be facilitated.

[0030] For example, assuming that the width or diameter of speaker 10 is approximately 10 mm, the distance Z1 along the z-axis between end 14a (which can be fitted into or inserted into the ear) and end 14b could be approximately 23 mm.

[0031] Referring to Figure 1C, assuming that the width or diameter of speaker 10 is approximately 6 mm, the maximum distance of acoustic device 1 along the x-axis may be 17 mm or less. Also, assuming that the width or diameter of speaker 10 is approximately 6 mm, the maximum distance of acoustic device 1 along the y-axis may be 20 mm or less.

[0032] Figure 2A shows an exploded view of an acoustic device 2 according to several embodiments of the present invention. The acoustic device 2 includes a speaker 20, a battery 21, a semiconductor device package 22, an interconnect structure 23, and a housing 24. The speaker has a surface 20a and a surface 20b opposite to surface 20a. The battery 21 has a surface 21a, a surface 21b opposite to surface 21a, and a surface 21c extending between surfaces 21a and 21b, and is isolated from the protective circuit. The battery 21 also includes a coin-shaped package but does not include an aluminum cover. The battery 11 includes a special structure (e.g., a fuse) and a special recipe for the electrolyte so that it does not swell or explode after being used for a certain period of time.

[0033] The speaker 20 is positioned adjacent to the surface 21a of the battery 21. The surface 20a of the speaker 20 faces the surface 21a of the battery 21. The surface 21a of the battery 21 may be the cathode of the battery 21. The structure of the semiconductor device package 22 is illustrated in the cross-sectional view of the semiconductor device package 5 in Figure 5. The speaker 20 is isolated from the battery 21 by a chamber / space S2. The housing 24 encloses the speaker 20, the battery 21, the semiconductor device package 22, and the interconnection structure 23. The interconnection structure 23 connects the battery 21 and the semiconductor device package 22 and includes a flexible printed circuit (FPC) or other interconnection structure.

[0034] Figure 2B shows a perspective view of the assembly of the acoustic device 2 shown in Figure 2A. The semiconductor device package 22 is positioned adjacent to the surface 21c of the battery 21. The semiconductor device package 22 is also positioned adjacent to the surface 21b of the battery 21. The semiconductor device package 22 is electrically connected to the surface 21c of the battery 21 by an interconnection structure 23. The speaker 20 is separated from the surface 21a of the battery 21 by a chamber / space S2. The chamber / space S2 contains no electronic components. The chamber / space S2 may have a plate to separate the speaker from the battery 11. The chamber / space S2 may also have wires, or only wires. Furthermore, the chamber / space S2 may not contain active components, nor may it contain passive components. The space between the surface 21b of the battery 21 and the housing 24 (not shown in Figure 2B) contains no electronic components.

[0035] The semiconductor device package 22 is positioned between the housing 24 and the surface 21c of the battery 21. The semiconductor device package 22 is also positioned between the housing 24 and the surface 21b of the battery 21. The speaker 20 has a surface 20a facing the surface 21a of the battery 21. The semiconductor device package 22 is positioned between the housing 24, the surface 21c of the battery 21, and the surface 20a of the speaker 20. The semiconductor device package 22 is also positioned between the housing 24, the surface 21b of the battery 21, and the surface 20a of the speaker 20. The semiconductor device package 22 is surrounded by the housing 24, the surface 21c of the battery 21, and the surface 20a of the speaker 20. The semiconductor device package 22 is positioned within a chamber / space defined by the housing 24, the surface 21c of the battery 21, and the speaker 20. Furthermore, the semiconductor device package 22 is placed within a chamber / space defined by the housing 24, the surface 21b of the battery 21, and the speaker 20. The housing 24 surrounds the speaker 20, the battery 21, and the semiconductor device package 22. The housing 24 has an end 24a and an end 24b opposite to the end 24a. An antenna pattern 26 is formed on the housing 24. The feed point of the semiconductor device package 22 (not shown in Figure 2B) is in contact with the antenna pattern 26.

[0036] Referring again to Figure 2B, assuming that the width or diameter of speaker 10 is approximately 10 mm, the maximum distance Z2 along the z-axis between end 24a (which can be fitted or inserted into the ear) and end 24b can be 23 mm or less. By using the semiconductor device package 22, a larger speaker can be housed and used in the acoustic device 2. This can improve the acoustic performance of the acoustic device 2. Thus, the semiconductor device package 22 can enhance the acoustic performance of the acoustic device 2. In other words, by using the semiconductor device package 22, the acoustic performance of the acoustic device 2 can be enhanced.

[0037] The connector 23 may include a sensor (not shown in Figure 2B) located on the connector 23 and situated between the housing 24 and the surface 21c of the battery 21. The sensor may be a proximity sensor. The proximity sensor determines the operating mode (after installation) or the standby mode. The housing 24 may have an opening (not shown in Figure 2B) corresponding to the sensing surface (not shown in Figure 2B) of the proximity sensor.

[0038] The connector 23 may include another sensor 25 located on the connector 23 and situated between the housing 24 and the surface 21a of the battery 21. The sensor 25 may be a heart rate sensor. The heart rate sensor may sense the heart rate of a person wearing the acoustic device 2. The housing 24 may have an opening (not shown in Figure 2B) corresponding to the sensing surface of the sensor 25 (not shown in Figure 2B).

[0039] Referring to Figure 2C, if we assume that the acoustic device 2 includes a speaker with a width or diameter of approximately 10 mm, the maximum distance Y1 of the acoustic device 2 along the y-axis can be 24 mm or less.

[0040] Referring to Figure 2D, if we assume that acoustic device 2 contains a speaker with a width or diameter of approximately 10 mm, the maximum distance X1 of acoustic device 2 along the x-axis can be 18 mm or less.

[0041] Figure 3A shows an exploded view of the electronic components of the acoustic device. The circuit boards 31, 32, and 33 of the acoustic device are connected by an interconnection structure 34. The electronic components are formed on the circuit boards 31, 32, and 33. The interconnection structure 34 may include an FPC or other interconnection structure. A battery 35 can be mounted in the acoustic device.

[0042] Figure 3B shows an assembly of electronic components of an acoustic device according to several embodiments of the present invention. Circuit boards 31, 32, and 33 are stacked. The stack thickness is T1. Circuit boards 31, 32, and interconnection structure 34 surround a battery 35. Circuit boards 32, 33, and interconnection structure 34 surround a mechanical component 36.

[0043] Figure 3C shows an exploded view of the acoustic device 3. The acoustic device 3 may include a speaker 30, circuit boards 31, 32, 33, an interconnect structure 34, a battery 35, and a housing 37. The circuit board 33 is located between the speaker 30 and the battery 35 and causes electromagnetic interference with the speaker 30, thus degrading the acoustic performance of the acoustic device 3. The housing 37 surrounds the speaker 30, circuit boards 31, 32, 33, the interconnect structure 34, and the battery 35. An antenna pattern 38 is formed on the housing 37. The feed point of the circuit board 33 (not shown in Figure 3C) is in contact with the antenna pattern 38.

[0044] Figure 3D shows a side view of the assembly of the acoustic device 3 shown in Figure 3C. In some embodiments, assuming that the diameter of the speaker inside the acoustic device 3 is 6 mm, the maximum distance Z3 between end 37a (which can be fitted or inserted into the ear) and end 37b will be 23 mm or more. Because the thickness T1 shown in Figure 3B is greater than the distance along the z-axis in Figure 1B between end 12a of the semiconductor device package 12 and end 11a of the battery 11, the maximum distance Z3 of the acoustic device 3 is greater than the maximum distance Z1 of the acoustic device 1.

[0045] Referring to Figure 4A, the acoustic device 1 shown in Figure 1B is inserted into a human ear. The center of gravity CM1 may be adjacent to or close to the end 14b. The miniaturization of the acoustic device 1 allows it to make contact with point P on the ear when inserted into the ear. Therefore, the acoustic device 1 is well supported by the ear and is less likely to fall out even when the person wearing the acoustic device 1 is moving or sweating.

[0046] Referring to Figure 4B, the acoustic device 3 shown in Figure 3D is inserted into a human ear. The center of gravity CM2 may be adjacent to or near the end 37b.

[0047] A relatively large acoustic device 3 may have a floating part (excluding the plug). The acoustic device 3 may be spaced apart from point P on the human ear. Distance D1 is the distance between the upper surface of the acoustic device 3 and the human ear.

[0048] Figure 4C shows that the acoustic device 3 begins to detach from the ear when the person wearing it sweats, moves, or changes posture. The detachment of the acoustic device 3 may be due to an unstable state as shown in Figure 4B. In this state, the acoustic device 3, lacking support from the ear due to the center of gravity CM2, is relatively more likely to detach from the ear.

[0049] The distance D2 between the top surface of acoustic device 3 and the human ear is thought to have increased due to the detachment of acoustic device 3. Distance D2 is greater than distance D1.

[0050] Figure 5 shows a cross-sectional view of the semiconductor device package 12 of the acoustic device 1 shown in Figure 1A. The semiconductor device package 5 may include a substrate 50, an electronic component 51, another electronic component 52, a encapsulating material 53, and a power supply structure 54.

[0051] The substrate 50 has a surface 50b and a surface 50u opposite to surface 50b.

[0052] The semiconductor device 51 can be placed on the surface 50b of the substrate 50. The electronic component 52 can be placed on the surface 50b of the substrate 50. The encapsulant 53 can encapsulate the electronic component 51 on the surface 50b of the substrate 50. The encapsulant 53 can also encapsulate the electronic component 52 on the surface 50b of the substrate 50. As shown in Figures 1A and 2A, the encapsulant 53 is provided with a shielding layer 57 for separating the semiconductor device package 5 from the battery 11 or 21.

[0053] The power supply structure 54 can be located on the surface 50u of the substrate 50 and has no encapsulating or molding material. The power supply structure 54 is exposed on the surface 50u of the substrate 50. The surface 50u of the substrate 50 has no encapsulating or molding material. Electronic components 55 are located on both the surfaces 50b and 50u of the substrate 50. The microphone 56 is located on the surface 50u. The microphone 56 may include a semiconductor device package, a micro-electromechanical system (MEMS) device, or a micro-electromechanical system (MEMS) device package. The microphone 56 is also exposed. The sensor 52 is located on the surface 50u of the substrate 50. The connector 53 is located on the surface 50u of the substrate 50. Surface 50b includes conductive pads for battery connection and conductive pads for speaker driver connection. The power supply structure 54 has a surface 54u that is higher than the microphone 56. Surface 54u is higher than the sensor 52 and the connector 53. The power supply structure 54 is the tallest of the elements arranged on the surface 50u of the substrate 50.

[0054] Electronic components 51 and 52 may include one or more of the following: application processor, memory, digital signal processor, coder / decoder, power management integrated circuit, DC converter, low dropout output, or filter. The encapsulant 53 may include different types of molding materials. The power supply structure 54 includes a spring or conductive pin. The power supply structure 54 also includes a POGO pin. Furthermore, the power supply structure 54 also includes an anti-oxidation layer. The power supply structure 54 can be configured and used to supply radio frequency (RF) signals to an antenna. Electronic component 55 may include one or more of the following: resistor, inductor, or capacitor. The sensor 52 may include a G-type sensor or other sensors. The connector 53 includes a zero-insertion force connector or board-to-board connector for flexible printed circuit (FPC) connection of peripheral functions.

[0055] Figure 6A shows the frequency response curves of a pair of acoustic devices shown in Figure 3C. The distance Z3 of acoustic device 3 shown in Figure 3D can be 23 mm or less. The earphones include a speaker with a width or diameter of 6 mm. The horizontal axis is frequency (unit: Hz), and the vertical axis is the amplitude of the acoustic device (unit: dB). The two curves in Figure 6A represent the frequency response curves of the left earphone and the right earphone, respectively. As shown in Figure 6A, the performance of the two earphones is almost the same. Also, the difference D3 between the amplitude at relatively low frequencies (approximately 20 Hz to 100 Hz) and the amplitude at intermediate frequencies (approximately 100 Hz to 1 kHz) is approximately 19 dB or more. The difference D4 of the amplitude at low frequencies (approximately 20 Hz to 100 Hz) is approximately 8 dB or more. The smaller the difference D3, the higher the acoustic performance of acoustic device 3. The smaller the difference D4, the higher the acoustic performance of acoustic device 3.

[0056] Figure 6B shows the frequency response curve of an assembly of acoustic devices shown in Figure 2B. The distance Z2 of acoustic device 2 shown in Figure 2B can be 23 mm or less. The earphones include a speaker with a width or diameter of 10 mm. The maximum distance Z2 shown in Figure 2B is the same as or approximately the maximum distance Z3 shown in Figure 3D. The horizontal axis is frequency (unit: Hz), and the vertical axis is the amplitude of the acoustic device (unit: dB). The two curves in Figure 6B represent the frequency response curves of the left earphone and the right earphone, respectively. As shown in Figure 6B, the performance of the two earphones is almost the same. Also, the difference D5 between the amplitude at relatively low frequencies (approximately 20 Hz to 100 Hz) and the amplitude at intermediate frequencies (approximately 100 Hz to 1 kHz) is approximately 14 dB or less. The difference D6 of the amplitude at low frequencies (approximately 20 Hz to 100 Hz) is approximately 3 dB or less. The smaller the difference D5, the higher the acoustic performance of acoustic device 2. The smaller the difference D6, the higher the acoustic performance of acoustic device 2.

[0057] Figure 7 shows an exploded view of an acoustic device 7 according to several embodiments of the present invention. The acoustic device 7 includes a speaker 70, a battery 71, a semiconductor device package 72, an interconnection structure 73, and a housing 74. The speaker has a surface 70a and a surface 70b opposite to surface 70a. The battery 71 has a surface 71a, a surface 71b opposite to surface 71a, and a surface 71c extending between surfaces 71a and 71b. The battery 71 has a different package from the battery 11 shown in Figures 1A and 2A. The battery 71 is connected to a protection circuit 71d and includes a lithium secondary battery. The battery 71 also has an aluminum cover. The protection circuit 71d can control the voltage and current flowing into the battery 71. The protection circuit 71d can control the voltage and current flowing out of the battery 71. The protection circuit 71d can prevent the battery 71 from swelling or exploding after operating for a certain period of time.

[0058] The speaker 70 is positioned adjacent to the semiconductor device package 72. The battery 71 faces the surface 72a of the semiconductor device package 72. The speaker 70 is connected to the semiconductor device package 72 by wires 75 and isolated from the semiconductor device package 72 by a chamber / space S3. The housing 74 encloses the speaker 70, the battery 71, the semiconductor device package 72, and the interconnection structure 73. The interconnection structure 73 connects the battery 71 and the semiconductor device package 72 and includes a flexible printed circuit (FPC) or other interconnection structure.

[0059] The maximum distance of the acoustic device 7 along the x-axis may be 20 mm or more. The maximum distance of the acoustic device 7 along the y-axis may be 28 mm or more. The maximum distance Z4 along the z-axis between end 74a (which can be fitted into or inserted into the ear) and end 74b may be 24 mm or more.

[0060] The size of the battery 71 is temperature-dependent. If the battery 71 is operating for a certain period of time, its temperature will rise, causing it to increase in size. Consequently, because the battery 71 expands after use, a relatively large space (not shown in Figure 7) is required to house the battery 71. This increases the distance between the battery 71 and the semiconductor device package 72.

[0061] Assuming that a lithium secondary battery with an aluminum cover is used as battery 71, the capacity of battery 71 could be less than 50 mAh. For example, the capacity of battery 71 could be approximately 45 mAh.

[0062] Furthermore, since the battery 71 swells after use, a relatively large space (not shown in Figure 7) is required to accommodate it. Assuming that the capacity of battery 11 is approximately the same as the capacity of battery 71, the size of the acoustic device 7 including battery 71 is larger than that of the acoustic device 1 including battery 11.

[0063] Spatial descriptions such as "directly above," "directly below," "up," "left," "right," "down," "top," "bottom," "vertical," "horizontal," "side," "higher," "lower," "upper," and "downward" are indicated relative to the directions shown in the drawings, unless otherwise specified. It is understood that the spatial descriptions used herein are illustrative only, and in practical implementation, the structures described herein can be spatially arranged in any direction or manner, provided that the advantages of the embodiments of the present invention do not deviate from such arrangements.

[0064] The terms “almost,” “substantially,” “effectively,” and “about” used herein are used to describe and mean small variations. When used with circumstances or situations, these terms refer to cases where the circumstances or situations occur exactly as they are, and cases where they occur approximately as they are. For example, when used with numbers, these terms refer to a range of variation of that number of ±10%, such as ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%. For example, a first number may be considered “substantially” the same as a second number if its variation is within a range of ±10%, such as ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%. For example, "effectively" vertical means an angle variation of ±10° or less, such as ±5° or less, ±4° or less, ±3° or less, ±2° or less, ±1° or less, ±0.5° or less, ±0.1° or less, or ±0.05° or less relative to 90°.

[0065] Two surfaces may be considered coplanar or substantially coplanar if the displacement between them is 5 μm or less, 2 μm or less, 1 μm or less, or 0.5 μm or less. A surface may be considered "substantially" planar if the displacement between its highest and lowest points is 5 μm or less, 2 μm or less, 1 μm or less, or 0.5 μm or less.

[0066] As used herein, singular forms may also include plural forms unless otherwise specified in the context.

[0067] As used herein, the terms “conductivity,” “electrical conductivity,” and “electrical conductivity” refer to the ability to conduct electric current. Conductive materials are typically materials that have little or no resistance to the flow of electric current. One unit of measurement for conductivity is siemens per meter (S / m). Typically, conductive materials are those with a conductivity of approximately 10⁴ S / m or higher, for example, at least 10⁵ S / m or at least 10⁶ S / m. The conductivity of a material may vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0068] Furthermore, quantities, ratios, and other numerical values ​​may be expressed in range form as described herein. Such range forms are used for convenience and conciseness, and should be understood to be interpreted flexibly to include not only the numerical values ​​explicitly stated as limits to the range, but also all individual numerical values ​​or subranges contained within that range, as if each numerical value or subrange were explicitly stated.

[0069] The present invention has been described and illustrated with reference to specific embodiments, but these descriptions and drawings are not intended to limit the invention. It will be apparent to those skilled in the art that various modifications are possible in embodiments and that equivalent components can be substituted without departing from the spirit and scope of the invention as limited by the appended claims. The drawings are not necessarily to scale. Manufacturing processes and tolerances may cause distinctions between the drawing representation of the invention and the actual product. There are other embodiments of the invention that are not specifically illustrated. The specifications and drawings are to be considered illustrative, not limiting. Modifications may be made to specific situations, materials, compositions, methods, or processes without departing from the object, spirit, and scope of the invention. All such modifications are intended to fall within the scope of the appended claims. The methods disclosed herein are described with reference to specific operations performed in a specific order, but it is acknowledged that these operations can be combined, subdivided, or rearranged to form equivalent methods without departing from the teachings of the invention. Thus, unless otherwise stated herein, the order and classification of operations are not intended to limit the invention.

[0070] The spatially relative terms used herein, such as “down,” “directly below,” “lower,” “directly above,” “higher,” “lower,” “left,” and “right,” are used here to facilitate the description of the relationship between one element or feature and another element or feature shown in the drawings. The spatially relative terms are intended to include different orientations of the device in use or operation, in addition to the orientation shown in the drawings. The device may be oriented in a different direction (rotated by 90 degrees or oriented in a different direction), and the spatially relative descriptions used herein shall be interpreted accordingly. It should be understood that when one element is “connected” or “linked” to another element, this element may be directly connected or linked to the other element, or there may be an intervening element.

[0071] The terms “almost,” “substantially,” “effectively,” and “about” as used herein are used to describe and mean small variations. When used with circumstances or situations, these terms refer to cases where the circumstances or situations occur exactly as they are, and cases where the circumstances or situations occur approximately as they are. As used herein for a specific number or range, the term “about” means that it is approximately ±10%, ±5%, ±1%, or ±0.5% of that number or range. A range is expressed herein as a range from one endpoint to the other or between two endpoints. All ranges disclosed herein include their endpoints unless otherwise specified. The term “substantially coplanar” means two planes whose difference along the same plane is within a micrometer (μm), for example, a difference of 10 μm, 5 μm, 1 μm, or 0.5 μm along the same plane. When we say that numbers or characteristics are "substantially" the same, this term refers to numbers whose difference lies within ±10%, ±5%, ±1%, or ±0.5% of the mean.

[0072] The features and detailed forms of several embodiments of the present invention have been outlined above. The embodiments described herein can be readily used as a basis for designing or modifying other processes and structures to perform the same or similar purposes and / or achieve the same or similar advantages of the embodiments described herein. Such equivalent structures will not depart from the spirit and scope of the invention, and various modifications, substitutions, and alterations are possible that do not depart from the spirit and scope of the invention.

Claims

1. A battery having a substantially cylindrical outer shape, having a substantially circular first surface, a substantially circular second surface parallel to the first surface and opposite to the first surface, and a third surface extending between the first surface and the second surface, A speaker is positioned parallel to and facing the first surface of the battery, A chamber / space which is a space extending from the surface of the speaker facing the battery to the battery in the direction normal to that surface by a distance equal to the distance to the battery, A semiconductor device package disposed on the third surface, extending beyond the outer edge of the chamber / space in the direction normal to the third surface, and the distance from the second surface of the battery is less than the distance from the first surface of the battery, A flexible printed circuit is positioned along the portion of the third or first surface of the battery outside the chamber / space, and is electrically connected to the semiconductor device package, the battery, and the speaker, and electrically connects the semiconductor device package and the third surface of the battery, A wireless earphone comprising the speaker, the battery, and a housing surrounding the semiconductor device package, The semiconductor device package and the battery are arranged along a first axis of the wireless earphone, and the battery and the speaker are arranged along a second axis substantially perpendicular to the first axis of the wireless earphone. When the direction from the battery to the semiconductor device package is defined as upward on the first axis, and the direction from the semiconductor device package to the battery is defined as downward, The housing has a first outer surface extending upward from the end of the wireless earphone, which is configured to be insertable into the ear canal, to the upper end of the housing, and a second outer surface extending downward from the end of the wireless earphone to the lower end of the housing. The semiconductor device package is located in a first portion of the housing, and the speaker and the battery are located in a second portion of the housing that is different from the first portion. The first outer surface of the housing overlaps the first portion and the second portion in a direction along the second axis, The second outer surface of the housing overlaps the second portion in the direction along the second axis, but does not overlap the first portion. The aforementioned chamber / space contains no electronic components; it is a wireless earphone.

2. The wireless earphone according to claim 1, wherein the third surface of the battery does not face the speaker.

3. The semiconductor device package is placed on the battery, The wireless earphone according to claim 1, wherein the horizontal height of the semiconductor device package is greater than the horizontal height of the battery.

4. The end is designed to be inserted into a person's ear, The wireless earphone according to claim 1, further comprising a first sensor arranged in the flexible printed circuit and configured to sense the heart rate of a person wearing the wireless earphone, and facing the end.

5. The flexible printed circuit further comprises a second sensor, configured to determine an operating mode or a standby mode when a person is wearing the wireless earphones, The wireless earphone according to claim 1, wherein the housing has an opening corresponding to the sensing surface of the second sensor.

6. The wireless earphone according to claim 1, wherein the first surface and the second surface of the battery are two substantially parallel surfaces.

7. The wireless earphone according to claim 1, wherein the flexible printed circuit extends from the top surface of the semiconductor device package and crosses the side surface of the semiconductor device package.

8. The package of the aforementioned semiconductor device is A substrate having a first surface and a second surface opposite to the first surface, A power supply structure disposed on the first surface of the substrate, The wireless earphone according to claim 1, further comprising a sealing material for sealing the second surface of the substrate.

9. The wireless earphone according to claim 8, wherein the housing includes an antenna pattern that contacts the power supply structure.

10. The wireless earphone according to claim 9, wherein the semiconductor device package is disposed between the battery and the antenna pattern.

11. The wireless earphone according to claim 7, wherein the flexible printed circuit extends along the third surface of the battery.

12. The wireless earphone according to claim 7, wherein the flexible printed circuit extends along the first surface of the battery.

13. The wireless earphone according to claim 8, wherein the semiconductor device package further comprises a first electronic component disposed on the first surface of the substrate.

14. The wireless earphone according to claim 13, wherein the semiconductor device package further comprises a second electronic component disposed on the second surface of the substrate.

15. The wireless earphone according to claim 8, wherein the second surface of the substrate is free of sealing material or molding material.

16. The wireless earphone according to claim 8, wherein the power supply structure is the tallest element among those arranged on the second surface of the substrate.

17. The wireless earphone according to claim 8, further comprising a shielding layer disposed on the sealing material to separate the semiconductor device package from the battery.

18. The wireless earphone according to claim 17, wherein the distance from the first surface of the substrate to the battery is smaller than the distance from the second surface of the substrate to the battery, and the distance from the shielding layer to the battery is smaller than the distance from the power supply mechanism to the battery.

19. The wireless earphone according to claim 1, wherein only a conductor is placed in the chamber / space.

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