Exhaust gas treatment equipment

Abstract

This technology provides a method for suppressing the adhesion of large amounts of by-products generated during exhaust gas treatment to the surface of the treatment partition. [Solution] The exhaust gas treatment device 1 comprises a treatment partition 10, the treatment partition having a treatment space SP1 on the inside of the treatment partition where exhaust gas Ge is treated, and an electric heater 20, the heater being positioned on the outside of the treatment partition and positioned between it and the treatment partition such that an air space SP2 into which air Ga is introduced is provided. The treatment partition has a porous portion made of a porous material that allows air to pass through, and is configured so that air from the air space passes through the porous portion and is introduced into the treatment space.

Description

Technical Field

[0001] The present invention relates to an exhaust gas treatment device.

Background Art

[0002] Conventionally, an exhaust gas treatment device capable of treating exhaust gas has been known (for example, see Patent Document 1). Specifically, such an exhaust gas treatment device includes a treatment partition wall provided inside with a treatment space (in Patent Document 1, the partition wall of the gas treatment furnace corresponds to this), and in this treatment space, the exhaust gas is oxidized by reacting the exhaust gas with air. Further, Patent Document 1 also discloses a technique for raising the temperature of the exhaust gas by using the heat generated by an electric heating heater.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the conventional exhaust gas treatment device as described above, there is a possibility that a large amount of by-products generated during the treatment of exhaust gas adheres to the surface of the treatment partition wall. In this regard, there is room for improvement in the conventional exhaust gas treatment device.

[0005] The present invention has been made in view of the above, and one of the objectives is to provide a technology capable of suppressing the large amount of adhesion of by-products generated during the treatment of exhaust gas to the surface of the treatment partition wall.

Means for Solving the Problems

[0007] According to this embodiment, since the air in the air space is introduced into the processing space by passing through the porous portion of the processing partition, it is possible to suppress the adhesion of a large amount of by-products generated during exhaust gas treatment to the surface (inner surface) of the processing partition in the processing space. This makes it possible to suppress blockage inside the processing space where the exhaust gas is treated.

[0008] (Aspect 2) In the above embodiment 1, the processing partition comprises a first processing partition plate and a second processing partition plate arranged opposite to the first processing partition plate, the processing space is provided between the first processing partition plate and the second processing partition plate, and the first processing partition plate and the second processing partition plate may each have the porous portion.

[0009] (Aspect 3) In the above embodiment 2, the heater may include a first heater member disposed on the outside of the first processing partition plate and a second heater member disposed on the outside of the second processing partition plate.

[0010] (Aspect 4) In any one of the above embodiments 1 to 3, the heater may have a plurality of through holes, and may be configured so that air is introduced into the air space by passing through the plurality of through holes.

[0011] (Appendix 5) Any one of the above embodiments 1 to 4 includes an exhaust gas introduction passage configured to introduce exhaust gas into the exhaust gas inlet of the processing space, wherein the exhaust gas introduction passage has a portion located on the side of the heater opposite to the side where the air space is provided, and the exhaust gas passing through the exhaust gas introduction passage is preheated by the heat of the heater.

[0012] (Aspect 6) In any one of the above embodiments 1 to 4, an internal exhaust gas introduction passage is provided inside the processing space, and the exhaust gas that has passed through the internal exhaust gas introduction passage is mixed with the air that has passed through the processing partition and processed in the processing space, and the exhaust gas passing through the internal exhaust gas introduction passage is preheated by the heat of the heater.

[0013] (Aspect 7) Any one of the above embodiments 1 to 6 may include an inert gas introduction device configured to introduce an inert gas into the processing space.

[0014] (Pattern 8) Any one of the above embodiments 1 to 7 may include a post-processing device configured to remove by-products contained in the exhaust gas that has passed through the processing space. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic cross-sectional view showing the main components of the exhaust gas treatment apparatus according to the embodiment. [Figure 2] This is a cross-sectional view of the exhaust gas treatment device according to the embodiment, taken along the line A1-A1. [Figure 3] This is a schematic diagram showing a magnified portion of the surface of the processing partition according to the embodiment. [Figure 4] This is a schematic cross-sectional view illustrating an exhaust gas treatment apparatus according to a modified example 1 of the embodiment. [Figure 5] This is a schematic cross-sectional view illustrating an exhaust gas treatment apparatus according to a modified example 2 of the embodiment. [Figure 6]It is a schematic diagram for explaining a post-treatment device according to Modification Example 3 of the embodiment.

Mode for Carrying Out the Invention

[0016] (Embodiment) Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings are schematically illustrated for easy understanding of the features, and the dimensional ratios of each component are not necessarily the same as the actual ones. In the drawings, X-Y-Z orthogonal coordinates are illustrated as necessary. Among these orthogonal coordinates, the Z direction corresponds to upward, and the -Z direction corresponds to downward (the direction in which gravity acts).

[0017] FIG. 1 is a schematic cross-sectional view showing the main configuration of the exhaust gas treatment device 1 according to the present embodiment. FIG. 2 is a cross-sectional view taken along line A1-A1 of the exhaust gas treatment device 1. Specifically, FIG. 2 schematically illustrates a cross-section of the exhaust gas treatment device 1 cut along a plane (X-Y plane) perpendicular to the flow direction (Z-axis direction) of the exhaust gas in the treatment space SP1 described later. Note that, in FIG. 2, the illustration of the housing 40 described later is omitted. In FIG. 2, the illustration of the housing 40 described later is omitted.

[0018] Referring to FIGS. 1 and 2, the exhaust gas treatment device 1 according to the present embodiment includes a treatment partition 10 and an electrothermal heater 20 (hereinafter simply referred to as "heater 20"). The exhaust gas treatment device 1 also includes a heat insulating material 30 and a housing 40. In the present embodiment, the treatment partition 10, the heater 20, and the heat insulating material 30 are arranged inside the housing 40.

[0019] In the present embodiment, an exhaust gas inlet 41, which is an inlet for exhaust gas (Ge), is provided at the upper part (ceiling part) of the housing 40. Also, an exhaust gas outlet 42, which is an outlet for exhaust gas (Ge), is provided at the lower part (bottom) of the housing 40. The exhaust gas flows into the inside of the exhaust gas treatment device 1 from the exhaust gas inlet 41 and is discharged from the exhaust gas outlet 42.

[0020] The specific type of exhaust gas is not particularly limited, but in this embodiment, as an example, exhaust gas emitted in a semiconductor manufacturing process (i.e., exhaust gas emitted from semiconductor manufacturing equipment) is used.

[0021] Exhaust gases emitted during semiconductor manufacturing processes include, for example, flammable gases and / or halogenated gases. When the exhaust gas contains monosilane as a flammable gas, one example of a by-product generated during treatment in the processing space SP1 (described later) is dust containing silicon dioxide (SiO2). When the exhaust gas contains halogenated gases, one example of this by-product is acidic gas containing NOx.

[0022] The processing partition 10 has a processing space SP1 on its inside, which is a space where exhaust gas is processed. Specifically, the processing partition 10 according to this embodiment comprises a plate-shaped first processing partition plate 11 and a plate-shaped second processing partition plate 12. The first processing partition plate 11 and the second processing partition plate 12 face each other. The processing space SP1 is provided between the first processing partition plate 11 and the second processing partition plate 12.

[0023] Referring to Figure 2, as an example, the processing space SP1 according to this embodiment is rectangular in cross-sectional view when cut by a plane (XY plane) perpendicular to the flow direction of exhaust gas (Z-axis direction) in the processing space SP1. A pair of end partitions 50 are provided at both ends of the longitudinal direction (Y-axis direction) of the processing space SP1 having this rectangular cross-section. That is, the processing space SP1 according to this embodiment is provided in a space enclosed by the processing partition 10 and the end partitions 50 described above. The processing partition 10 constitutes a wall surface (a wall surface extending in the Y direction) that extends in the longitudinal direction of the processing space SP1 in cross-sectional view, and the end partitions 50 constitute a wall surface (a wall surface extending in the X direction) that extends in the short direction (or width direction) of the processing space SP1.

[0024] The specific material of the end partition wall 50 is not particularly limited, but in this embodiment, as an example, a ceramic material so dense that air cannot pass through is used. The material of the end partition wall 50 may be the same as that of the first treated partition plate 11 and the second treated partition plate 12, or it may be a metal that has excellent corrosion resistance to corrosive gases such as F2 (fluorine) and HF (hydrogen fluoride), as well as excellent heat resistance.

[0025] Furthermore, a narrower width (length in the X direction) of the rectangular processing space SP1 is preferable because it improves the heating efficiency of the exhaust gas in the processing space SP1.

[0026] Figure 3 is a schematic diagram showing an enlarged portion of the surface of the processing partition 10. The processing partition 10 according to this embodiment has a porous portion 10a composed of a porous material that has air permeability.

[0027] Specifically, as an example, the processing partition wall 10 according to this embodiment is composed entirely of porous portions 10a. That is, the processing partition wall 10 according to this embodiment is composed of a porous material (the volume ratio (vol%) of the porous portions 10a in the processing partition wall 10 is 100%). The first processing partition wall plate 11 and the second processing partition wall plate 12 are also each composed entirely of porous portions 10a.

[0028] This porous portion 10a has multiple pores 13. As a result, the processing partition 10 is configured so that the air (Ga) in the air space SP2, which will be described later, passes through the porous portion 10a of the processing partition 10 (specifically, the portion with pores 13) and is introduced into the processing space SP1.

[0029] The average diameter of the multiple holes 13 is not particularly limited, but in this embodiment, as an example, it is 1 mm or less. The multiple holes 13 may penetrate the porous portion 10a in a straight line, or they may bend inside the porous portion 10a. Furthermore, the multiple holes 13 may communicate with each other inside the porous portion 10a.

[0030] The specific material of the porous body described above is not particularly limited, but in this embodiment, ceramics are used as an example. That is, the processing partition wall 10 according to this embodiment is made of porous ceramics that have permeability. The specific material of these porous ceramics is not particularly limited, but for example, porous alumina (aluminum oxide) can be used.

[0031] The processing partition 10 may have porous portions 10a in part or entirely. The volume ratio of porous portions 10a in the processing partition 10 is not limited to 100%, as described above. The volume ratio of porous portions 10a in the processing partition 10 may be less than 100%. However, the larger the volume ratio of porous portions 10a in the processing partition 10, the more effectively the air in the air space SP2 can pass through the processing partition 10 and be introduced into the processing space SP1. As a preferred numerical example for the volume ratio of porous portions 10a in the processing partition 10, for example, this volume ratio is preferably 60% or more, more preferably 80% or more, and even more preferably 100%.

[0032] Furthermore, if the volume ratio of the porous portion 10a is less than 100%, as an example of the material for the portion of the processing partition wall 10 other than the porous portion 10a, non-porous ceramics, specifically ceramics so dense that air cannot pass through, may be used, or a metal with excellent corrosion resistance to corrosive gases such as F2 and HF and excellent heat resistance may be used.

[0033] The heater 20 is configured to generate heat when energized. The heater 20 is electrically connected to a power source (which is located outside the exhaust gas treatment device 1 and is not shown in the figure). The heater 20 is located on the outside of the treatment partition 10 (on the side opposite to the side where the treatment space SP1 is provided). The heater 20 is also positioned such that an air space SP2, into which air (Ga) is introduced, is provided between the treatment partition 10 and the heater 20.

[0034] In other words, the exhaust gas treatment device 1 according to this embodiment has a structure in which the air space SP2 is sandwiched between the treatment partition 10 and the heater 20. The heater 20 according to this embodiment is mainly provided for heating the air in the air space SP2, the treatment partition 10, and the air in the treatment space SP1.

[0035] In this way, by using an electric heater 20 to thermally decompose the gas emitted from the semiconductor manufacturing equipment, compared to, for example, burning fossil fuels to thermally decompose this gas, This can effectively reduce carbon dioxide emissions.

[0036] Specifically, the heater 20 according to this embodiment includes, as an example, a plate-shaped first heater member 21 and a plate-shaped second heater member 22. The first heater member 21 is located on the outside of the first processing partition plate 11. The second heater member 22 is located on the outside of the second processing partition plate 12. The first heater member 21 and the second heater member 22 according to this embodiment have a configuration in which a heating wire (for example, Kanthal wire) is arranged inside a plate-shaped heater housing.

[0037] According to this embodiment, as described above, the structure is such that the air space SP2 is sandwiched between the processing partition 10 and the heater 20, so the radiant heat from the heater 20 can be effectively utilized to effectively heat the air in the air space SP2.

[0038] Furthermore, according to this embodiment, since the heater 20 heats the processing partition 10, the exhaust gas (Ge) in the processing space SP1 can be effectively heated by the radiant heat generated from the processing partition 10. With this structure, even if an inexpensive electric heater such as Kanthal wire for general industrial use is used as the heater 20, instead of using an expensive heater such as a ceramic heater, the exhaust gas (Ge) and air in the processing space SP1 can be heated to a temperature of, for example, 1200°C. In addition, according to this embodiment, the air in the air space SP2 can absorb the radiant heat emitted from the processing partition 10 toward the heater 20. This allows the heat inside the enclosure 40 to be effectively conducted to the exhaust gas in the processing space SP1.

[0039] Furthermore, according to this embodiment, since a plate-shaped heater member is used as the heater 20 as described above, the heat generated by the heater 20 can be effectively conducted in the direction in which the processing space SP1 is provided, compared to, for example, the case where a cylindrical heater member is used as the heater 20. In other words, according to this embodiment, the direction of heat radiation can be restricted by sandwiching the object to be heated. As a result, heat radiation to areas other than the object to be heated is minimized, and the thermal efficiency is increased, so that heat can be effectively conducted to the object to be heated. This improves the heating efficiency of the heater 20.

[0040] Referring to Figure 1, the heater 20 according to this embodiment has a plurality of through holes 23. This allows air (Ga) to be introduced into the air space SP2 by passing through the plurality of through holes 23. The air (Ga) may be introduced into the air space SP2 using equipment such as a blower, or it may be introduced into the air space SP2 by natural suction without the use of equipment. In Figure 1, the through holes 23 are exemplified as extending linearly in the horizontal direction, but the configuration of the through holes 23 is not limited to this. For example, the through holes 23 may extend inclined with respect to the horizontal direction, or they may be bent inside the heater 20.

[0041] Furthermore, since the exhaust gas treatment device 1 according to this embodiment includes an insulating material 30 and a housing 40, the through-hole 23 may also be provided so as to penetrate the insulating material 30 and the housing 40 (specifically, the side wall portion of the housing 40 that extends in the vertical direction).

[0042] The thermal insulation material 30 is positioned on the outside of the heater 20, in contact with the outer surface of the heater 20. The thermal insulation material 30 is provided to prevent heat from the heater 20 from leaking to the outside. The specific material of the thermal insulation material 30 is not particularly limited, and thermal insulation materials used in known exhaust gas treatment devices 1 can be used. Examples of materials for the thermal insulation material 30 include glass wool and ceramics.

[0043] In the exhaust gas treatment device 1, the exhaust gas (Ge) flowing in from the exhaust gas inlet 41 is processed in the treatment space The air (Ga) flows into SP1. The air also flows into the air space SP2 through the through hole 23 and is heated by the heater 20. Next, the air flows into the processing space SP1 through the porous portion 10a of the processing partition wall 10. In the processing space SP1, the exhaust gas is treated (thermal decomposition treatment) by being heated by the heated air. The treated exhaust gas is discharged from the exhaust gas outlet 42.

[0044] This configuration allows heat from the heater 20 to be recovered by air (Ga) from areas other than the object being heated (processing space SP1, air space SP2, and processing partition wall 10), contributing to energy savings for the heater 20. In addition, the air (Ga) in air space SP2 acts as an insulating layer, which can reduce the amount of insulating material needed.

[0045] As illustrated in Figure 1, the exhaust gas treatment device 1 may include an inert gas introduction device 60. This inert gas introduction device 60 is configured to introduce an inert gas (Gn), such as nitrogen, into the treatment space SP1. The inert gas introduction device 60 illustrated in Figure 1 includes, as an example, a nozzle 61 located at the exhaust gas inlet 41. A cylinder containing inert gas is connected to this nozzle 61, for example. The nozzle 61 supplies the inert gas supplied from the cylinder towards the inside of the exhaust gas inlet 41. This allows the inert gas to be introduced into the treatment space SP1.

[0046] With this configuration, the introduction of an inert gas into the exhaust gas can lower the partial pressure of the exhaust gas and / or the partial pressure of the air (Ga). This suppresses the rapid thermal decomposition of the exhaust gas by the oxygen contained in the air (Ga) in the processing space SP1. As a result, for example, the rapid generation of by-products in the processing space SP1 can be suppressed.

[0047] As described above, according to this embodiment, since the air in the air space SP2 passes through the porous portion 10a of the processing partition wall 10 and is introduced into the processing space SP1, it is possible to suppress the adhesion of a large amount of by-products generated during exhaust gas treatment to the surface (inner surface) of the processing partition wall 10 in the processing space SP1.

[0048] Specifically, according to this embodiment, even if by-products attempt to adhere to the surface of the porous portion 10a of the processing partition wall 10, the air flowing into the processing space SP1 through the porous portion 10a can blow away the by-products attempting to adhere to the surface of the porous portion 10a. As a result, compared to the case where the processing partition wall 10 does not have a porous portion 10a, it is possible to suppress the adhesion of a large amount of by-products to the surface of the processing partition wall 10. Consequently, according to this embodiment, it is possible to suppress a decrease in the performance of the exhaust gas treatment device 1 caused by the adhesion of a large amount of by-products to the surface of the processing partition wall 10. Furthermore, it is also possible to suppress blockage inside the processing space SP1.

[0049] The exhaust gas treatment device 1 illustrated in Figure 1 is vertically oriented, allowing the exhaust gas (Ge) to flow from top to bottom in the Z-axis direction. However, the device is not limited to this configuration. The exhaust gas treatment device 1 may also be horizontally oriented, allowing the exhaust gas (Ge) to flow in the Y-axis direction (lateral direction). By directing the flow direction of the exhaust gas (Ge) to the lateral direction, convection can be generated in the treatment space SP1, increasing the time the exhaust gas (Ge) passes through the treatment space SP1 and thereby improving heat transfer efficiency.

[0050] (Modification of Embodiment 1) Figure 4 is a schematic cross-sectional view illustrating the exhaust gas treatment device 1A according to the first modified embodiment. The exhaust gas treatment device 1A according to this modified embodiment differs from the exhaust gas treatment device 1 illustrated in Figure 1, mainly in that it is equipped with an exhaust gas introduction passage 70.

[0051] The exhaust gas introduction passage 70 is configured to introduce exhaust gas (Ge) into the exhaust gas inlet 41 of the processing space SP1. The exhaust gas introduction passage 70 also has a portion 71 that extends vertically, and this portion 71 is located on the opposite side of the heater 20 from the side where the air space SP2 is provided (i.e., outside the heater 20). As a result, the exhaust gas introduction passage 70 is configured so that the exhaust gas passing through the exhaust gas introduction passage 70 is preheated by the heat of the heater 20.

[0052] With this configuration, the exhaust gas in the exhaust gas introduction passage 70 (i.e., the exhaust gas introduced into the processing space SP1) can be preheated by the heat from the heater 20, thereby improving the heating efficiency of the exhaust gas in the processing space SP1. Furthermore, the exhaust gas flowing through the exhaust gas introduction passage 70 acts as an insulating layer, suppressing heat transfer to the outside of the exhaust gas introduction passage 70, which reduces the amount of insulating material and saves power for the heater 20 through waste heat recovery.

[0053] Furthermore, as illustrated in Figure 4, an insulating material 30a may be provided to cover the exhaust gas inlet passage 70. This insulating material 30a can reduce the heat radiated from the exhaust gas inlet passage 70 to the outside of the exhaust gas treatment device 1A, thereby increasing the exhaust gas preheating efficiency.

[0054] Furthermore, as illustrated in Figure 4, the exhaust gas treatment device 1A may further include an upper treatment partition 80a positioned above the treatment partition 10 and a lower treatment partition 80b positioned below the treatment partition 10, as partitions of the treatment space SP1. The specific materials of the upper treatment partition 80a and the lower treatment partition 80b are not particularly limited, and for example, porous ceramics may be used, or dense ceramics may be used, or other materials may be used.

[0055] Furthermore, the exhaust gas treatment device 1A may include an air introduction passage 90 configured to introduce air into the air space SP2. In this modified example, the air introduction passage 90 is configured to introduce air from the lower end side of the air space SP2.

[0056] Furthermore, the exhaust gas treatment device 1A may be equipped with an upper partition wall 81. And an air space SP2 may be provided below this upper partition wall 81.

[0057] Furthermore, the exhaust gas treatment device 1A may be configured such that the tip (outlet) of the nozzle 61 of the inert gas introduction device 60 penetrates a part of the upper treatment partition wall 80a to reach the treatment space SP1. In this modified example, since the inert gas is introduced into the treatment space SP1 by the inert gas introduction device 60, it is possible to suppress the rapid heating of the exhaust gas in the treatment space SP1, the rapid generation of by-products, and the blockage of the area near the inlet of the treatment space SP1.

[0058] (Modified embodiment 2) Figure 5 is a schematic cross-sectional view illustrating the exhaust gas treatment device 1B according to the second modified embodiment. The exhaust gas treatment device 1B according to this modified embodiment differs from the exhaust gas treatment device 1 illustrated in Figure 1 mainly in that the internal exhaust gas introduction passage 41b into which the exhaust gas (Ge) is introduced is located inside the treatment space SP1a, that is, the preheating treatment space SP3 into which the exhaust gas (Ge) is preheated is located inside the treatment space SP1a.

[0059] In the exhaust gas treatment device 1B, an exhaust gas inlet 41a is provided at the bottom (bottom) of the housing 40a through which exhaust gas (Ge) flows in. Furthermore, an exhaust gas outlet 42a, which is the outlet for exhaust gas (Ge), is provided at the bottom (bottom) of the housing 40a, outside the outer circumference of the exhaust gas inlet 41a. The exhaust gas (Ge) flows into the interior of the exhaust gas treatment device 1B from the exhaust gas inlet 41a and is discharged from the exhaust gas outlet 42a.

[0060] The exhaust gas (Ge) flowing into the exhaust gas treatment device 1B from the exhaust gas inlet 41a flows into the preheating treatment space SP3 located in the area inside the internal exhaust gas introduction passage 41b. The internal exhaust gas introduction passage 41b may be made of ceramics such as alumina or metal such as stainless steel. The internal exhaust gas introduction passage 41b is located within the space enclosed by the treatment partition wall 10 (i.e., within the treatment space SP1a).

[0061] The heat generated from the heater 20 is transferred to the internal exhaust gas introduction passage 41b via the processing partition wall 10. This raises the temperature in the preheating treatment space SP3 within the internal exhaust gas introduction passage 41b. As the exhaust gas (Ge) passes through the high-temperature preheating treatment space SP3, the exhaust gas (Ge) is effectively preheated.

[0062] The exhaust gas (Ge) that has passed through the preheating treatment space SP3 flows into the treatment space SP1a through the gap between the internal exhaust gas introduction passage 41b and the housing 40a. The treatment space SP1a is composed of the space sandwiched between the internal exhaust gas introduction passage 41b and the treatment partition wall 10. In the treatment space SP1a, the exhaust gas (Ge) is treated (thermal decomposition treatment) by being heated by the air that has passed through the treatment partition wall 10 and the heated air.

[0063] The exhaust gas treatment device 1B according to this modified example is configured to introduce an inert gas (Gn), such as nitrogen, into the preheating treatment space SP3. Specifically, the exhaust gas treatment device 1B illustrated in Figure 6 is equipped with a nozzle 61a located at the exhaust gas inlet 41a, as an example. A cylinder containing an inert gas is connected to this nozzle 61a, for example. The nozzle 61a supplies the inert gas supplied from the cylinder towards the inside of the exhaust gas inlet 41a. This allows the inert gas to be introduced into the preheating treatment space SP3.

[0064] As described above, the exhaust gas treatment device 1B according to this modified example is equipped with an internal exhaust gas introduction passage 41b inside the treatment space SP1a, and the exhaust gas (Ge) that has passed through the internal exhaust gas introduction passage 41b is treated in the treatment space SP1a while mixing with the air that has passed through the treatment partition wall 10, and the exhaust gas (Ge) passing through the internal exhaust gas introduction passage 41b is preheated by the heat of the heater 20.

[0065] With this configuration, the heat from the heater 20 can preheat the exhaust gas (Ge) passing through the internal exhaust gas introduction passage 41b (preheating treatment space SP3), thereby improving the heating efficiency of the exhaust gas in the treatment space SP1a.

[0066] Furthermore, the exhaust gas treatment apparatus 1 according to the embodiment described in Figure 1 above may be used, for example, to treat exhaust gas discharged in a semiconductor substrate film formation process, such as a chemical vapor deposition (CVD) process. On the other hand, the exhaust gas treatment apparatus 1A according to Modification 1 and the exhaust gas treatment apparatus 1B according to Modification 2 may be used, for example, to treat exhaust gas discharged in a semiconductor substrate cleaning process.

[0067] (Modification of Embodiment 3) The exhaust gas treatment device 1 according to the above-described embodiment, the exhaust gas treatment device 1A according to Modification 1, and the exhaust gas treatment device 1B according to Modification 2 may further include the aftertreatment device 100 described below. Figure 6 is a schematic diagram illustrating the aftertreatment device 100.

[0068] The aftertreatment device 100 is configured to remove by-products and other contaminants contained in the exhaust gas (exhaust gas discharged from the exhaust gas outlet 42) that has passed through the treatment space SP1. Specifically, the aftertreatment device 100 illustrated in Figure 6 comprises a tank 110, a mist trap 120, and a first scrubber. The system includes a 130a and a second scrubber 130b. The post-treatment device 100 may further include a fan scrubber 140 and a third scrubber 130c.

[0069] The exhaust gas outlet 42 and the tank 110 are connected by a connecting passage 150a. The tank 110 and the fan scrubber 140 are connected by a connecting passage 150b. The fan scrubber 140 and the mist trap 120 are connected by a connecting passage 150c.

[0070] Tank 110 is configured to store water L1 for exhaust gas aftertreatment. In this modified example, the area inside Tank 110 above the liquid level of water L1 functions as a passage through which exhaust gas passes (an "internal passage for exhaust gas" provided inside Tank 110).

[0071] However, the configuration of the aftertreatment device 100 is not limited to this. For example, the exhaust gas that has passed through the exhaust gas outlet 42 may flow directly into the fan scrubber 140 or mist trap 120 without passing through the inside of the tank 110.

[0072] The first scrubber 130a is located at the exhaust gas outlet 42. The second scrubber 130b is located at the connecting passage 150b. The third scrubber 130c is located inside the fan scrubber 140. These scrubbers are so-called wet scrubbers. These scrubbers are configured to remove by-products and other contaminants contained in the exhaust gas (Ge) using a liquid. In this modified example, the by-products and other contaminants contained in the exhaust gas include, for example, dust. Specific examples of this dust include dust containing silicon dioxide and dust containing NOx.

[0073] Specifically, water L1 from tank 110 is supplied to the first scrubber 130a through piping 151a. Water L1 from tank 110 is supplied to the second scrubber 130b through piping 151b. A pump 152 for pressurizing the water L1 is located in the middle of piping 151a and piping 151b. The first scrubber 130a and the second scrubber 130b are configured to spray the supplied water L1.

[0074] Water L2 is supplied to the third scrubber 130c through piping 151c. This water L2 can be water that does not contain components contained in exhaust gas (i.e., uncontaminated water), such as tap water. The third scrubber 130c is configured to spray the supplied water L2.

[0075] The first scrubber 130a is configured to remove by-products and other contaminants contained in the exhaust gas passing through the exhaust gas outlet 42 by spraying water L1 into the exhaust gas outlet 42. The second scrubber 130b is configured to remove by-products and other contaminants contained in the exhaust gas passing through the connecting passage 150b by spraying water L1 into the connecting passage 150b. The third scrubber 130c is configured to remove by-products and other contaminants contained in the exhaust gas passing through the fan scrubber 140 by spraying water L2 into the fan scrubber 140.

[0076] A fan 141 is located inside the fan scrubber 140. Inside the tank 110, exhaust gas (Ge) that has passed above the water L1 flows into the fan scrubber 140 through the connecting passage 150b. In the fan scrubber 140, the fan 141 blows air toward the third scrubber 130c, while the third scrubber 130c sprays water L2.

[0077] Furthermore, any moisture accumulated inside the fan scrubber 140 will pass through the return path 153. Then, it is returned to tank 110.

[0078] The exhaust gas that has passed through the fan scrubber 140 is introduced into the mist trap 120 via the connecting passage 150c. The mist trap 120 is configured to remove the liquid component (mist) contained in the exhaust gas. The exhaust gas that has passed through the mist trap 120 is released into the atmosphere.

[0079] As described above, by including the aftertreatment device 100 in the exhaust gas treatment device, by-products and other contaminants contained in the exhaust gas can be effectively removed.

[0080] Although embodiments and variations of the present invention have been described in detail above, the present invention is not limited to these specific embodiments and variations, and various modifications and changes are possible within the scope of the present invention as described in the claims. [Explanation of Symbols]

[0081] 1: Exhaust gas treatment device 10: Processing partition 10a: Porous part 11: First processing partition plate 12: Second processing partition plate 20: Electric heater 21: First heater component 22: Second heater component 23: Through hole 41: Exhaust gas inlet 60: Inert gas introduction device 70: Exhaust gas inlet 100: Post-processing equipment SP1: Processing space SP2: Air space Access: Exhaust gas Ga: air

Claims

1. A processing partition, wherein a processing space for processing exhaust gas is provided inside the processing partition, An electric heater, wherein the heater is positioned outside the processing partition and is arranged such that an air space into which air is introduced is provided between the processing partition and the electric heater, An exhaust gas treatment apparatus wherein the processing partition has a porous portion made of a porous material that allows air to pass through, and the air in the air space is introduced into the processing space by passing through the porous portion.

2. The processing partition comprises a first processing partition plate and a second processing partition plate positioned opposite the first processing partition plate. The processing space is provided between the first processing partition plate and the second processing partition plate. The exhaust gas treatment apparatus according to claim 1, wherein the first treatment partition plate and the second treatment partition plate each have the porous portion.

3. The exhaust gas treatment apparatus according to claim 2, wherein the heater comprises a first heater member disposed on the outside of the first processing partition plate and a second heater member disposed on the outside of the second processing partition plate.

4. The exhaust gas treatment apparatus according to claim 1, wherein the heater has a plurality of through holes and is configured so that air is introduced into the air space by passing through the plurality of through holes.

5. The processing space is equipped with an exhaust gas introduction passage configured to introduce exhaust gas into the exhaust gas inlet, The exhaust gas treatment apparatus according to claim 1, wherein the exhaust gas introduction passage has a portion located on the side opposite to the side of the heater where the air space is provided, and is configured such that the exhaust gas passing through the exhaust gas introduction passage is preheated by the heat of the heater.

6. The processing space is provided with an internal exhaust gas introduction passage inside, The exhaust gas that has passed through the internal exhaust gas introduction passage is mixed with the air that has passed through the processing partition and processed in the processing space. The exhaust gas treatment apparatus according to claim 1, wherein the exhaust gas passing through the internal exhaust gas introduction passage is preheated by the heat of the heater.

7. The exhaust gas treatment apparatus according to claim 1, comprising an inert gas introduction device configured to introduce an inert gas into the processing space.

8. The exhaust gas treatment apparatus according to claim 1, further comprising a post-treatment apparatus configured to remove by-products contained in the exhaust gas that has passed through the processing space.

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