Composition, cured body, and display device

Abstract

The present invention provides a composition capable of improving the reliability of display devices. [Solution] A composition comprising a polymerizable compound (A) and a polymerization initiator (B), wherein the storage modulus E' at 80°C is 0.5 GPa or more and 5.0 GPa or less when a cured product made from the composition is measured using a dynamic viscoelasticity measuring device with a frequency of 1 Hz, a measurement temperature range of 10°C to 200°C, a heating rate of 2°C / min, and in tensile mode.

Description

[Technical Field]

[0001] The present invention relates to a composition, a cured body, and a display device. [Background technology]

[0002] In display devices, there are known devices that include light-emitting diode elements, and in which the light-emitting diode elements are sealed with a encapsulant. An example of such a encapsulant technology is the technology described in Patent Document 1.

[0003] Patent Document 1 describes a curable composition for inkjet coating and LED protection, comprising a first polyfunctional (meth)acrylate compound having a plurality of (meth)acryloyl groups and an aliphatic cyclic skeleton, a second polyfunctional (meth)acrylate compound having a plurality of (meth)acryloyl groups and an alkylene oxide skeleton, and a photopolymerization initiator, wherein the viscosity at 25°C is 80 mPa·s or more and 2000 mPa·s or less. According to Patent Document 1, a curable composition for inkjet coating and LED protection, when the curable composition is applied by an inkjet method to at least one of the gaps between multiple LED chips and the top of multiple LED chips in order to form an LED protective layer, the shape of the edges of the coated material can be well maintained. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] International Publication No. 2022 / 050421 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] The present invention provides a composition that can improve the reliability of a display device. [Means for solving the problem]

[0006] According to the present invention, the following compositions, cured bodies, and display devices are provided.

[0007] [1] A composition, It contains a polymerizable compound (A) and a polymerization initiator (B), A composition wherein the cured product comprising the above composition is measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, a measurement temperature range of 10°C to 200°C, a heating rate of 2°C / min, and in tensile mode, and the storage modulus E' at 80°C is 0.5 GPa or more and 5.0 GPa or less. [2] The composition according to [1], wherein a cured product comprising the above composition is measured using a dynamic viscoelasticity measuring device with a frequency of 1 Hz, a measurement temperature range of 10°C to 200°C, a heating rate of 2°C / min, and in tensile mode, and the storage modulus E' at 25°C is 1.0 GPa or more and 10.0 GPa or less. [3] The polymerizable compound (A) includes a cationic polymerizable compound. The composition according to [1] or [2], wherein the polymerization initiator (B) comprises a cationic polymerization initiator. [4] The composition according to [3] above, wherein the cationic polymerizable compound comprises an epoxy compound. [5] The composition according to [4] above, wherein the epoxy compound comprises an alicyclic epoxy compound. [6] The composition according to any one of [3] to [5], wherein the cationic polymerization initiator comprises at least one selected from the group consisting of photocationic polymerization initiators and thermal cationic polymerization initiators. [7] The polymerizable compound (A) includes a radical polymerizable compound. The composition according to [1] or [2], wherein the polymerization initiator (B) comprises a radical polymerization initiator. [8] The composition according to [7], wherein the radical polymerizable compound comprises (meth)acrylate. [9] The composition according to [7] or [8] above, wherein the radical polymerization initiator contains a photo radical polymerization initiator.

[10] The composition according to any one of [1] to [9] above, further containing a curing retarder (C).

[11] The composition according to any one of [1] to

[10] above, wherein when the cured product made of the composition is measured by a dynamic viscoelasticity measuring apparatus at a frequency of 1 Hz, a temperature increase rate of 2 °C / min, and in a tensile mode, the glass transition temperature is 70 °C or higher.

[12] The composition according to any one of [1] to

[11] above, wherein the refractive index of the cured product made of the composition at 25 °C and 589 nm is 1.45 or more and 1.70 or less.

[13] The composition according to any one of [1] to

[12] above, which is liquid at 25 °C.

[14] The composition according to any one of [1] to

[13] above, wherein the viscosity of the composition by the following <Method 1> is 1 mPa·s or more and 700 mPa·s or less. <Method 1> Apparatus: Cone plate viscometer Temperature: 25 °C Cone: Radius 24 mm, angle 0.8° Rotation speed: 250 rpm Sample amount: 0.5 mL Atmosphere: Air

[15] The composition according to any one of [1] to

[14] above, which can be used for inkjet coating or dispenser coating.

[16] The composition according to

[15] above, which can be used for inkjet coating.

[17] The composition according to any one of [1] to

[16] above, wherein the curing shrinkage rate calculated by the following <Method 2> is 1.0% or more and 15.0% or less. <Method 2> The composition is filled into a specific gravity bottle, and the specific gravity of the liquid is calculated by measuring its mass in air and in pure water. For a cured product made of the composition with a width of 25 mm, a length of 25 mm, and a thickness of 0.5 mm, the specific gravity of the cured product is calculated by measuring its mass in air and in pure water. The curing shrinkage rate is then calculated using the formula: curing shrinkage rate = ((specific gravity of cured product - specific gravity of liquid) / specific gravity of cured product) × 100 (%).

[18] The composition according to any one of [1] to

[17] , wherein the static surface tension obtained by the pendant drop method is 50 mN / m or less.

[19] A composition according to any one of the above [1] to

[18] that can be used to encapsulate microLEDs.

[20] A cured body comprising a cured product comprising any of the compositions described in [1] to

[19] above. [twenty one] A display device comprising a light-emitting diode element, a substrate, and a cured sealing layer containing the cured body described in

[20] between the light-emitting diode element and the substrate. [twenty two] The display device according to

[21] , wherein the light-emitting diode element includes a microLED. [Effects of the Invention]

[0008] According to the present invention, a composition capable of improving the reliability of a display device can be provided. [Modes for carrying out the invention]

[0009] The embodiments of the present invention will be described below. Unless otherwise specified, the numerical range "A~B" represents A or greater and B or less. In this embodiment, the notation "(meth)acrylate" represents a concept that encompasses both acrylate and methacrylate. The same applies to similar notations such as "(meth)acrylic".

[0010] In display devices, there are known devices that include light-emitting diodes, and in which the light-emitting diodes are sealed with a encapsulant. Furthermore, in some cases, reliability in high-temperature and high-humidity environments (for example, 60°C, 90%RH) is required for display devices. The present invention provides a composition that can improve the reliability of a display device.

[0011] [Composition] The composition of this embodiment comprises a polymerizable compound (A) and a polymerization initiator (B), and the storage modulus E' of the cured product made from the composition at 80°C is 0.5 GPa or more and 5.0 GPa or less.

[0012] The inventors have found that, in a composition comprising a polymerizable compound (A) and a polymerization initiator (B), the storage modulus E' of the cured product made from the composition at 80°C is an effective design indicator for improving the reliability of a display device.

[0013] From the viewpoint of further improving the reliability of the display device, the storage modulus E' of the cured product made from the composition of this embodiment at 80°C is preferably 0.6 GPa or more and 4.5 GPa or less, more preferably 0.7 GPa or more and 4.0 GPa or less, even more preferably 0.8 GPa or more and 3.5 GPa or less, even more preferably 0.8 GPa or more and 3.0 GPa or less, and even more preferably 0.8 GPa or more and 2.8 GPa or less.

[0014] The storage modulus E' of the cured product made from the composition at 80°C can be set to a desired value by, for example, appropriately selecting the types of polymerizable compound (A) and polymerization initiator (B), and appropriately adjusting the content ratio of each component.

[0015] The storage modulus E' at 25°C of the cured product comprising the composition of this embodiment is preferably 1.0 GPa or more and 10.0 GPa or less, more preferably 1.2 GPa or more and 8.0 GPa or less, even more preferably 1.3 GPa or more and 6.0 GPa or less, and even more preferably 1.5 GPa or more and 5.0 GPa or less.

[0016] From the viewpoint of further improving the reliability of the display device, the glass transition temperature of the cured product made from the composition of this embodiment is preferably 70°C or higher, more preferably 73°C or higher, even more preferably 75°C or higher, even more preferably 78°C or higher, and even more preferably 80°C or higher. The upper limit is not particularly limited, but may be, for example, 200°C or lower, 180°C or lower, or 170°C or lower. From the viewpoint of further improving the reliability of the display device, the glass transition temperature of the cured product made from the composition of this embodiment is preferably 70°C to 200°C, more preferably 73°C to 180°C, even more preferably 75°C to 170°C, even more preferably 78°C to 170°C, and even more preferably 80°C to 170°C.

[0017] The storage modulus E' at 80°C, the storage modulus E' at 25°C, and the glass transition temperature of the cured product comprising the composition are the values ​​obtained when measured using a dynamic viscoelasticity measuring device with a frequency of 1 Hz, a measurement temperature range of 10°C to 200°C (glass transition temperature measurement temperature range of 10°C or higher), a heating rate of 2°C / min, and in tensile mode.

[0018] The cured product comprising the composition of this embodiment refers to a cured product in the C stage state. If the composition is a cationic polymerizable composition, the cured product made from the composition can be cured by, for example, irradiating a 0.5 mm thick composition with ultraviolet light at a wavelength of 365 nm using an LED lamp at a dose of 1500 mJ / cm². 2 This refers to a cured product obtained by irradiating it in such a manner, and then heating it at 80°C for 30 minutes. If the composition is a cationic polymerizable composition, the method for preparing a cured product from the composition is, for example, to place a 0.5 mm thick silicone sheet mold on a PET film, place the composition inside the mold, sandwich it with the PET film, and then irradiate the 0.5 mm thick composition with ultraviolet light at a wavelength of 365 nm using an LED lamp at a dose of 1500 mJ / cm². 2 (100mW / cm 2One method involves irradiating the composition for 15 seconds, followed by heating at 80°C for 30 minutes to obtain a cured product. If the composition is a radical polymerizable composition, the cured product made from the composition will be irradiated with ultraviolet light at a wavelength of 395 nm at a dose of 1500 mJ / cm² using an LED lamp, for example, on a composition with a thickness of 0.5 mm. 2 This refers to a cured product obtained by irradiating it in such a manner. If the composition is a radical polymerizable composition, the method for producing a cured product from the composition is as follows: For example, a 0.5 mm thick silicone sheet mold is placed on a PET film, the composition is placed inside the mold, and then sandwiched between PET films. Subsequently, the 0.5 mm thick composition is irradiated with ultraviolet light at a wavelength of 395 nm using an LED lamp at a dose of 1500 mJ / cm². 2 (100mW / cm 2 One method involves irradiating the composition for a duration of 15 seconds to obtain a cured product. In the following, "cured product made from the composition" in the measurement of other physical properties is the same as the cured product made from the composition described in this paragraph, unless otherwise specified.

[0019] The refractive index of the cured product made from the composition of this embodiment at 25°C and 589 nm is preferably 1.45 to 1.70, more preferably 1.46 to 1.65, even more preferably 1.47 to 1.60, and even more preferably 1.48 to 1.57, from the viewpoint of more efficiently extracting light from organic EL display elements and LED elements. The refractive index at 25°C and 589nm refers to the value measured by an Abbe refractometer.

[0020] The composition of this embodiment may be liquid or solid at 25°C, but is preferably liquid at 25°C.

[0021] The viscosity of the composition according to Method 1 of this embodiment is preferably 1 mPa·s to 700 mPa·s, more preferably 3 mPa·s to 500 mPa·s, even more preferably 5 mPa·s to 300 mPa·s, even more preferably 7 mPa·s to 100 mPa·s, and even more preferably 10 mPa·s to 50 mPa·s, from the viewpoint of further improving the balance between the coating properties of the composition to a substrate and the discharge properties during coating.

[0022] <Method 1> Equipment: Cone plate viscometer Temperature: 25℃ Cone: Radius 24mm, Angle 0.8° Rotation speed: 250 rpm Sample volume: 0.5 mL Atmosphere: Atmosphere

[0023] The curing shrinkage rate calculated by Method 2 of the composition of this embodiment is preferably 1.0% to 15.0%, more preferably 2.0% to 12.0%, and even more preferably 3.0% to 10.0%.

[0024] <Method 2> The composition is filled into a specific gravity bottle, and the specific gravity of the liquid is calculated by measuring its mass in air and in pure water. For a cured product consisting of a composition with a width of 25 mm, a length of 25 mm, and a thickness of 0.5 mm, the specific gravity of the cured product is calculated by measuring its mass in air and in pure water. The curing shrinkage rate is then calculated using the formula: Curing shrinkage rate = ((Specific gravity of cured product - Specific gravity of liquid) / Specific gravity of cured product) × 100 (%).

[0025] The static surface tension of the composition of this embodiment, obtained by the pendant drop method, is preferably 50 mN / m or less, more preferably 45 mN / m or less, and even more preferably 40 mN / m or less, from the viewpoint of further improving the coatability of the composition to a substrate or the like. The lower limit is not particularly limited, but may be, for example, 10 mN / m or more, 20 mN / m or more, or 25 mN / m or more. The static surface tension of the composition of this embodiment, obtained by the pendant drop method, is preferably 10 mN / m to 50 mN / m, more preferably 20 mN / m to 45 mN / m, and even more preferably 25 mN / m to 40 mN / m, from the viewpoint of further improving the coatability of the composition to substrates and the like. The pendant drop method is a method of calculating surface tension by pushing a liquid out from the end of a tube and observing the shape of the hanging droplet (pendant drop).

[0026] The following describes in detail each component of the composition of this embodiment.

[0027] <Polymerizable compound (A)> The composition of this embodiment contains polymerizable compound (A). A polymerizable compound (A) is a compound that has polymerizable groups. The polymerizable group is not particularly limited and examples include cationic polymerizable groups, radical polymerizable groups, anionic polymerizable groups, etc. Polymerizable compound (A) may be a compound containing one polymerizable group in its molecule, or a compound containing two or more polymerizable groups in its molecule. However, from the viewpoint of further improving the heat resistance of the cured product made from the composition, it is preferably a compound containing two or more polymerizable groups in its molecule, and more preferably a compound containing two polymerizable groups in its molecule.

[0028] Polymerizable compound (A) preferably contains a bromine atom from the viewpoint of further improving the coatability of the composition on substrates, etc. Here, polymerizable compound (A) containing a bromine atom means that it contains a bromine atom-containing compound.

[0029] The polymerizable compound (A) preferably includes a cationic polymerizable compound.

[0030] The cationic polymerizable compound is not particularly limited and includes, for example, at least one selected from the group consisting of epoxy compounds and oxetane compounds, and preferably includes an epoxy compound. The epoxy compound may be a compound containing one epoxy group in its molecule, or it may be a compound containing two or more epoxy groups in its molecule. However, from the viewpoint of further improving the heat resistance of the cured product made from the composition, it is preferably a compound containing two or more epoxy groups in its molecule, and more preferably a compound containing two epoxy groups in its molecule.

[0031] The epoxy compound includes, for example, at least one selected from the group consisting of alicyclic epoxy compounds, epoxy compounds containing aromatic compounds in their molecule, and compounds containing a glycidyl ether group, and preferably includes an alicyclic epoxy compound.

[0032] Alicyclic epoxy compounds are compounds that contain both epoxy and alicyclic groups within their molecules. The alicyclic epoxy compound may be a compound containing one epoxy group in its molecule, or it may be a compound containing two or more epoxy groups in its molecule, but it is preferably a compound containing two or more epoxy groups in its molecule, and more preferably a compound containing two epoxy groups in its molecule.

[0033] Examples of alicyclic epoxy compounds include compounds obtained by epoxidizing a compound having a cycloalkene ring or its derivatives, and compounds obtained by hydrogenating a compound having an epoxy group and an aromatic ring or its derivatives.

[0034] Compounds obtained by epoxidizing a compound having a cycloalkene ring, or derivatives thereof, include, for example, at least one selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexylalkyl (meth)acrylate (e.g., 3,4-epoxycyclohexylmethyl (meth)acrylate, etc.), and (3,3',4,4'-diepoxy)bicyclohexyl.

[0035] Compounds obtained by hydrogenating compounds having epoxy groups and aromatic rings, or their derivatives, include, for example, at least one selected from the group consisting of hydrogenated bisphenol A type epoxy resins and hydrogenated bisphenol F type epoxy resins.

[0036] The alicyclic epoxy compound is preferably a compound having a 1,2-epoxycyclohexane structure. Compounds having a 1,2-epoxycyclohexane structure are preferably compounds represented by formula (A1-1).

[0037] [ka]

[0038] In formula (A1-1), X represents a single bond or a linking group (a divalent group having one or more atoms), and is preferably a linking group.

[0039] When X is a single bond, the compound represented by formula (A1-1) is (3,3',4,4'-diepoxy)bicyclohexyl.

[0040] The linking group may be, for example, a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide bond, or a group in which multiple such groups are linked, preferably a group having an ester bond, and more preferably a group linking an ester bond and a divalent hydrocarbon group. The divalent hydrocarbon group is preferably an alkanediyl group, and more preferably an alkanediyl group having 1 to 3 carbon atoms. When X is a group having an ester bond as a linking group, an example of a compound represented by formula (A1-1) is 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.

[0041] The compound represented by formula (A1-1) preferably includes at least one selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and (3,3',4,4'-diepoxy)bicyclohexyl, and more preferably includes 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.

[0042] The epoxy compound containing an aromatic molecule may be a compound containing one epoxy group, or a compound containing two or more epoxy groups, but it is preferably a compound containing two or more epoxy groups, and more preferably a compound containing two epoxy groups. Epoxy compounds containing aromatic compounds within their molecules may be compounds that do not contain alicyclic groups.

[0043] Epoxy compounds containing aromatic compounds within their molecules can be used as monomers, oligomers, or polymers. The epoxy compound containing aromatics in its molecule preferably includes at least one selected from the group consisting of compounds having a bisphenol structure (e.g., bisphenol A structure, bisphenol F structure, bisphenol S structure, etc.) and bromine atom-containing aromatic epoxy compounds, more preferably includes at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and halophenylglycidyl ether, and even more preferably includes at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and dibromophenylglycidyl ether.

[0044] The compound containing the glycidyl ether group may be a compound containing one epoxy group in its molecule, or a compound containing two or more epoxy groups in its molecule, but it is preferably a compound containing two or more epoxy groups in its molecule, and more preferably a compound containing two epoxy groups in its molecule. Compounds containing a glycidyl ether group may be compounds that do not contain alicyclic groups or aromatic rings.

[0045] Compounds containing a glycidyl ether group preferably include diglycidyl ether compounds. From the viewpoint of further improving the coatability of the composition to substrates, the diglycidyl ether compound preferably comprises at least one selected from the group consisting of: diglycidyl ethers of alkylene glycols such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and neopentyl glycol diglycidyl ether; polyglycidyl ethers of polyhydric alcohols such as di or triglycidyl ether of glycerin or its alkylene oxide adduct; and diglycidyl ethers of polyalkylene glycols such as polyethylene glycol or its alkylene oxide adduct, and diglycidyl ether of polypropylene glycol or its alkylene oxide adduct; and more preferably comprises diglycidyl ether of alkylene glycol. The alkylene glycol diglycidyl ether preferably comprises at least one selected from the group consisting of ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and neopentyl glycol diglycidyl ether, and more preferably comprises one or two selected from the group consisting of 1,6-hexanediol diglycidyl ether and neopentyl glycol diglycidyl ether.

[0046] The content of the cationic polymerizable compound in the composition of this embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or 70 parts by mass or more and 100 parts by mass or 90 parts by mass or more and 100 parts by mass or less, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0047] The content of the epoxy compound in the composition of this embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or 70 parts by mass or more and 100 parts by mass or 90 parts by mass or more and 100 parts by mass or less, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0048] The content of the alicyclic epoxy compound in the composition of this embodiment may be, for example, 5 parts by mass or more and 100 parts by mass or 10 parts by mass or 80 parts by mass or 15 parts by mass or 30 parts by mass, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0049] The amount of aromatic epoxy compound in the composition of this embodiment may be, for example, 5 parts by mass or more and 50 parts by mass or 10 parts by mass or 20 parts by mass or 15 parts by mass or 30 parts by mass, when the amount of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0050] The content of the compound containing a glycidyl ether group in the composition of this embodiment may be, for example, 5 parts by mass or more and 95 parts by mass or 10 parts by mass or 90 parts by mass or 20 parts by mass or 80 parts by mass, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0051] The polymerizable compound (A) preferably includes a radical polymerizable compound.

[0052] The radical polymerizable compound is not particularly limited, but preferably includes (meth)acrylate.

[0053] The (meth)acrylate may contain monofunctional (meth)acrylate or polyfunctional (meth)acrylate, but from the viewpoint of further improving the heat resistance of the cured product made from the composition, it is preferably polyfunctional (meth)acrylate. Here, a polyfunctional (meth)acrylate refers to a compound that contains two or more (meth)acryloyl groups in its molecule.

[0054] The polyfunctional (meth)acrylate is preferably a compound containing 2 to 6 (meth)acryloyl groups, more preferably a compound containing 2 to 4 (meth)acryloyl groups, and even more preferably a compound containing 2 (meth)acryloyl groups.

[0055] The (meth)acrylate includes, for example, at least one selected from the group consisting of (meth)acrylates containing an alicyclic structure within the molecule, (meth)acrylates containing aromatics within the molecule, and acyclic (meth)acrylates, and preferably includes (meth)acrylates containing an alicyclic structure within the molecule.

[0056] (Meth)acrylates, which contain an alicyclic structure within their molecule, are compounds that contain a (meth)acryloyl group and an alicyclic group. The alicyclic group includes, for example, at least one selected from the group consisting of groups having a dicyclopentadiene skeleton such as a dicyclopentanyl group or a dicyclopentenyl group; a cyclohexyl group; an isobornyl group; a cyclodecatriene group; a norbornyl group; an adamantyl group; a tricyclodecane group, etc. Preferably, it includes a group having one or two selected from the group consisting of a dicyclopentadiene skeleton and a tricyclodecane skeleton.

[0057] (Meth)acrylates containing an alicyclic structure within the molecule include, for example, at least one selected from the group consisting of tricyclodecanedimethanol di(meth)acrylate, dicyclopentanyloxyethyl(meth)acrylate, dicyclopentenyl(meth)acrylate, dicyclopentenyloxyethyl(meth)acrylate, etc., and preferably tricyclodecanedimethanol di(meth)acrylate.

[0058] The (meth)acrylate containing an alicyclic structure within the molecule may be a monofunctional (meth)acrylate or a polyfunctional (meth)acrylate, but is preferably a polyfunctional (meth)acrylate, and more preferably a bifunctional (meth)acrylate.

[0059] (Meth)acrylates containing aromatic compounds in the molecule include, for example, at least one selected from the group consisting of ethoxylated bisphenol A di(meth)acrylate, ethoxylated-o-phenylphenol (meth)acrylate, m-phenoxybenzyl (meth)acrylate, and preferably ethoxylated bisphenol A di(meth)acrylate.

[0060] The (meth)acrylate containing aromatic compounds in its molecule may be monofunctional (meth)acrylate or polyfunctional (meth)acrylate, but is preferably polyfunctional (meth)acrylate, and more preferably bifunctional (meth)acrylate.

[0061] The acyclic (meth)acrylate includes, for example, at least one selected from the group consisting of 1,6-hexadiol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, methoxydiethylene glycol (meth)acrylate, and preferably includes 1,12-dodecanediol di(meth)acrylate.

[0062] The acyclic (meth)acrylate may be a monofunctional (meth)acrylate or a polyfunctional (meth)acrylate, but is preferably a polyfunctional (meth)acrylate, and more preferably a bifunctional (meth)acrylate.

[0063] The amount of the radical polymerizable compound in the composition of this embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or 70 parts by mass or more and 100 parts by mass or 90 parts by mass or more and 100 parts by mass or less, when the amount of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0064] The content of (meth)acrylate in the composition of this embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or 70 parts by mass or more and 100 parts by mass or 90 parts by mass or more and 100 parts by mass or less, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0065] The amount of polyfunctional (meth)acrylate in the composition of the embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or 70 parts by mass or more and 100 parts by mass or 90 parts by mass or more and 100 parts by mass or less, when the amount of polymerizable compound (A) in the composition of the embodiment is 100 parts by mass.

[0066] The content of (meth)acrylate containing an alicyclic structure within the molecule in the composition of this embodiment may be, for example, 5 parts by mass or more and 100 parts by mass or 10 parts by mass or 80 parts by mass or 20 parts by mass or 50 parts by mass, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0067] The content of the (meth)acrylate containing aromatic molecules in the composition of this embodiment may be, for example, 1 to 50 parts by mass, or 3 to 30 parts by mass, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0068] The acyclic (meth)acrylate in the composition of this embodiment may be, for example, 50 parts by mass or more and 90 parts by mass or 60 parts by mass or more and 80 parts by mass, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0069] Polymerizable compound (A) may be one polymerizable compound or two or more polymerizable compounds may be used in combination.

[0070] <Polymerization initiator (B)> The composition of this embodiment contains a polymerization initiator (B). The polymerization initiator (B) is not particularly limited as long as it can initiate the polymerization reaction of the polymerizable compound (A). The polymerization initiator (B) may include a photopolymerization initiator that can be activated by light to initiate the polymerization reaction of polymerizable compound (A), or it may include a thermal polymerization initiator that can be activated by heat to initiate the polymerization reaction of polymerizable compound (A).

[0071] The composition of this embodiment preferably comprises a cationic polymerizable compound (A) and a cationic polymerization initiator (B).

[0072] The cationic polymerization initiator includes, for example, at least one selected from the group consisting of photo-cationic polymerization initiators and thermal cationic polymerization initiators, and more preferably includes a photo-cationic polymerization initiator.

[0073] Photocationic polymerization initiators include, for example, aryl sulfonium salt derivatives (e.g., Dow Chemical's Cyracure UVI-6990, Cyracure UVI-6974; ADEKA's ADEKA Optomer SP-150, ADEKA Optomer SP-152, ADEKA Optomer SP-170, ADEKA Optomer SP-172; Sunapro's CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310FG, LW-S1; Doublebond Co., Ltd.) It contains at least one selected from the group consisting of CibaCure-1190 (manufactured by Ciba Specialty Chemicals), aryliodonium salt derivatives (for example, Irgacure 250 from Ciba Specialty Chemicals, RP-2074 from Rhodia Japan, etc.), allen-ion complex derivatives, diazonium salt derivatives, triazine-based initiators, and other acid generators such as halides, preferably containing an arylsulfonium salt derivative, and more preferably containing a triarylsulfonium salt derivative.

[0074] Examples of thermal cationic polymerization initiators include onium salt compounds such as quaternary ammonium salts, phosphonium salts, and sulfonium salts. Examples of commercially available thermal cationic polymerization initiators include ADEKA-Opton CP-66, ADEKA-Opton CP-77 (manufactured by ADEKA Corporation), San-Aid SI-60L, San-Aid SI-80L, San-Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.), and the CI series (manufactured by Nippon Soda Co., Ltd.).

[0075] The composition of this embodiment preferably comprises a radical polymerizable compound (A) and a radical polymerization initiator (B).

[0076] The radical polymerization initiator includes, for example, at least one selected from the group consisting of photoradical polymerization initiators and thermal radical polymerization initiators, and preferably includes a photoradical polymerization initiator.

[0077] The photoradical polymerization initiator includes, for example, at least one selected from the group consisting of benzophenone and its derivatives, benzyl and its derivatives, entraquinone and its derivatives, acetophenone derivatives, thioxanthone and its derivatives, camphorquinone derivatives, α-aminoalkylphenone derivatives, and acylphosphine oxide derivatives, and preferably includes an acylphosphine oxide derivative.

[0078] The acylphosphine oxide derivative includes, for example, at least one selected from the group consisting of benzoyl diphenylphosphine oxide, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, benzoyl diethoxyphosphine oxide, 2,4,6-trimethylbenzoyl dimethoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyl diethoxyphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and ethyl-2,4,6-trimethylbenzoylphenylphosphineate, and preferably at least one selected from the group consisting of 2,4,6-trimethylbenzoyl diphenylphosphine oxide and ethyl-2,4,6-trimethylbenzoylphenylphosphineate.

[0079] The content of the polymerization initiator (B) in the composition of this embodiment is preferably 0.01 parts by mass or more and 10 parts by mass or less, more preferably 0.05 parts by mass or more and 8 parts by mass or less, and even more preferably 0.1 parts by mass or more and 6 parts by mass or less, from the viewpoint of improving the curability of the composition and further improving the transparency of the cured product made from the composition, when the content of the polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0080] The content of the cationic polymerization initiator in the composition of this embodiment is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, and even more preferably 0.1 parts by mass or more, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass, from the viewpoint of further improving the curability of the composition, and preferably 5 parts by mass or less, more preferably 3 parts by mass or less, and even more preferably 1 part by mass or less, from the viewpoint of further improving the transparency of the cured product made from the composition. The content of the cationic polymerization initiator in the composition of this embodiment is preferably 0.01 parts by mass or more and 5 parts by mass or less, more preferably 0.05 parts by mass or more and 3 parts by mass or less, and even more preferably 0.1 parts by mass or more and 1 part by mass or less, from the viewpoint of improving the curability of the composition and further improving the transparency of the cured product made from the composition, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0081] The content of the radical polymerization initiator in the composition of this embodiment is preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more, when the content of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass, from the viewpoint of further improving the curability of the composition, and preferably 10 parts by mass or less, more preferably 8 parts by mass or less, and even more preferably 6 parts by mass or less, from the viewpoint of further improving the transparency of the cured product made from the composition. The amount of radical polymerization initiator in the composition of this embodiment is preferably 0.5 parts by mass or more and 10 parts by mass or less, more preferably 1 part by mass or more and 8 parts by mass or less, and even more preferably 2 parts by mass or more and 6 parts by mass or less, from the viewpoint of improving the curability of the composition and further improving the transparency of the cured product made from the composition, when the amount of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0082] Polymerization initiator (B) may be one type of polymerization initiator, or two or more polymerization initiators may be used in combination.

[0083] <Curing retarder (C)> The composition of this embodiment preferably further comprises a curing retarder (C) from the viewpoint of extending the pot life of the composition.

[0084] The curing retarder (C) is not particularly limited, but preferably comprises at least one selected from the group consisting of phosphoric acid-based curing retarders, ether-based curing retarders, thioether-based curing retarders, metal complex-based curing retarders, and nitroxyl radical-based curing retarders, and more preferably comprises at least one selected from the group consisting of phosphoric acid-based curing retarders and ether-based curing retarders.

[0085] Phosphate-based curing retarders are curing retarders selected from the group consisting of phosphate esters and phosphite esters. The phosphate-based curing retarder preferably contains a phosphate ester.

[0086] Phosphate esters include, for example, diethylbenzyl phosphate, trimethyl phosphate, triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl) phosphate, tris(2-ethylhexyl) phosphate, (RO)3P=O (where R is a lauryl group, cetyl group, stearyl group, or oleyl group), tris(2-chloroethyl) phosphate, tris(2-dichloropropyl) phosphate, triphenyl phosphate, butyl pyrophosphate, tricresyl phosphate, trixylenyl phosphate, octyl diphenyl phosphate, cresyl diphenyl phosphate, xylenyl diphosphate, and more. It comprises at least one selected from the group consisting of nobutyl phosphate, dibutyl phosphate, di-2-ethylhexyl phosphate, monoisodecyl phosphate, ammonium ethyl acid phosphate, 2-ethylhexyl acid phosphate salt, and the like, preferably at least one selected from the group consisting of triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl) phosphate, tris(2-ethylhexyl) phosphate, and (RO)3P=O (where R is a lauryl group, cetyl group, stearyl group, or oleyl group), and more preferably tris(2-ethylhexyl) phosphate.

[0087] Phosphite esters include, for example, at least one selected from the group consisting of trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, and tris(nonylphenyl) phosphite.

[0088] Ether-based curing retarders are curing retarders that contain an ether bond. The ether-based curing retarder may contain a linear ether or a cyclic ether. The ether-based curing retarder preferably contains a cyclic ether, more preferably a crown ether, and even more preferably 18-crown ether-6, from the viewpoint of appropriate reactivity to cations.

[0089] The content of the curing retarder (C) in the composition of this embodiment is preferably 0.10 parts by mass or more, more preferably 0.20 parts by mass or more, and even more preferably 0.30 parts by mass or more, when the content of the polymerizable compound (A) in the composition of this embodiment is 100 parts by mass, from the viewpoint of extending the pot life of the composition, and preferably 10.0 parts by mass or less, more preferably 5.0 parts by mass or less, and even more preferably 2.0 parts by mass or less, from the viewpoint of further improving the moisture resistance of the cured product made from the composition. The content of the curing retarder (C) in the composition of this embodiment is preferably 0.10 parts by mass or more and 10.0 parts by mass or less, more preferably 0.20 parts by mass or more and 5.0 parts by mass or less, and even more preferably 0.30 parts by mass or more and 2.0 parts by mass or less, from the viewpoint of extending the pot life of the composition and further improving the moisture resistance of the cured product made from the composition, when the content of the polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0090] The curing retarder (C) preferably includes a phosphate-based curing retarder and an ether-based curing retarder. The mass ratio of the phosphoric acid-based curing retarder in curing retarder (C) to the ether-based curing retarder in curing retarder (C) is preferably 0.001 or more, more preferably 0.003 or more, and even more preferably 0.005 or more, from the viewpoint of further improving the coatability of the composition to substrates, and from the viewpoint of further improving the moisture resistance of the cured product made from the composition, it is preferably 2.0 or less, more preferably 1.0 or less, and even more preferably 0.5 or less. The mass ratio of the phosphoric acid-based curing retarder in curing retarder (C) to the ether-based curing retarder in curing retarder (C) is preferably 0.001 to 2.0, more preferably 0.003 to 1.0, and even more preferably 0.005 to 0.5, from the viewpoint of further improving the coatability of the composition to substrates and the like, and further improving the moisture resistance of the cured product made of the composition.

[0091] The curing retarder (C) may be one type of curing retarder, or two or more curing retarders may be used in combination.

[0092] <Leveling agent> The composition of this embodiment may further contain a leveling agent from the viewpoint of further improving the coatability of the composition to a substrate or the like. Examples of leveling agents include acrylic leveling agents and silicone leveling agents, and among these, acrylic leveling agents are preferred.

[0093] The amount of leveling agent in the composition of this embodiment may be, for example, 0.005 parts by mass or more and 1 part by mass or 0.01 parts by mass or more and 0.1 parts by mass or less, when the amount of polymerizable compound (A) in the composition of this embodiment is 100 parts by mass.

[0094] The leveling agent may be a single type of leveling agent, or two or more types of leveling agents may be used in combination.

[0095] <Other ingredients> The composition of this embodiment may further contain other components. Other components include, for example, photosensitizers, silane coupling agents, antioxidants, inorganic fillers, resin particles, metal deactivators, fillers, stabilizers, neutralizing agents, lubricants, and antibacterial agents. The amount of other ingredients is appropriate.

[0096] The total content of polymerizable compound (A) and polymerization initiator (B) in the composition of this embodiment is preferably 60% by mass or more and 100% by mass or less, more preferably 70% by mass or more and 100% by mass or less, even more preferably 80% by mass or more and 100% by mass or less, even more preferably 90% by mass or more and 100% by mass or less, and even more preferably 95% by mass or more and 100% by mass or less, when the total content of the composition of this embodiment is considered to be 100% by mass.

[0097] [Uses of the composition] The composition of this embodiment is preferably a composition that can be used to encapsulate light-emitting diode elements, and more preferably a composition that can be used to encapsulate micro-LEDs.

[0098] The composition of this embodiment is preferably a composition that can be used for inkjet coating or dispenser coating, and more preferably a composition that can be used for inkjet coating.

[0099] [Method for producing the composition] A method for producing the composition of this embodiment may include, for example, a method of thoroughly mixing each component. The method of mixing each component is not particularly limited, but examples include a stirring method that utilizes the stirring force generated by the rotation of a propeller, and a method that utilizes a conventional disperser such as a planetary agitator that rotates and revolves.

[0100] [Cured body] The cured body of this embodiment includes a cured product made from the composition of this embodiment. The cured body of this embodiment is preferably a cured body that can be used as a cured sealing layer for a display device.

[0101] The method for obtaining the cured body of this embodiment is not particularly limited, and one example is to obtain the cured body by irradiating the composition of this embodiment with light. From the viewpoint of further promoting the curing reaction, the composition may be heated after light irradiation.

[0102] The light source of the light irradiated on the composition of the present embodiment is not particularly limited, and examples thereof include a halogen lamp, a metal halide lamp, a high-power metal halide lamp (containing indium, etc.), a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a xenon excimer lamp, a xenon flash lamp, an LED, and the like.

[0103] The above light sources each have different emission wavelengths and energy distributions. Therefore, the above light sources can be appropriately selected according to the reaction wavelength of the photoinitiator and the like. In addition, natural light (sunlight) can also be a reaction initiation light source for the sealant.

[0104] As the irradiation method, direct irradiation, condensing irradiation using a mirror or the like, or condensing irradiation using a fiber or the like may be performed. Irradiation using a low wavelength cut filter, a heat ray cut filter, a cold mirror, or the like can also be performed.

[0105] The irradiation amount of light is not particularly limited and may be appropriately adjusted according to the thickness of the coating film of the composition. The irradiation amount of light is, for example, 50 mJ / cm 2 or more and 20000 mJ / cm 2 or less, preferably 100 mJ / cm 2 or more and 10000 mJ / cm 2 or less.

[0106] [Display device] The display device of the present embodiment includes a light-emitting diode element, a base material, and a cured sealant layer containing the cured body of the present embodiment between the light-emitting diode element and the base material.

[0107] The light-emitting diode element includes, for example, an organic electroluminescence display element or a micro LED, and preferably includes a micro LED. In addition, the light-emitting diode element may be in the form of a substrate with a light-emitting diode element (TFT substrate), which is a concavo-convex substrate.

[0108] The substrate is not particularly limited and includes, for example, at least one selected from the group consisting of a color filter, a glass substrate, a silicon substrate, and a plastic substrate, preferably selected from the group consisting of a color filter and a glass substrate. Includes at least one type.

[0109] The cured sealing layer may consist of the cured body of this embodiment, or it may include the cured body of this embodiment and other constituent materials. Other constituent materials include, for example, inorganic layers such as silicon nitride film, silicon oxide film, and silicon nitride / oxide, as well as inorganic fillers such as silica, mica, kaolin, talc, and aluminum oxide.

[0110] The embodiments of the present invention have been described above, but these are merely examples, and various other configurations can also be adopted. Furthermore, the present invention is not limited to the embodiments described above, and any modifications, improvements, etc., that can achieve the objectives of the present invention are included in the present invention. [Examples]

[0111] The embodiment will be described in detail below based on examples and comparative examples. However, this embodiment is not limited in any way to the descriptions of these examples. Unless otherwise specified, the examples were tested at 23°C and 50% relative humidity.

[0112] [Examples 1-12 and Comparative Examples 1-3] The components shown in Tables 1 and 2 were mixed in the compositional proportions (parts by mass) described in Tables 1 and 2 to prepare the compositions of Examples 1 to 12 and Comparative Examples 1 to 3, respectively.

[0113] Each component shown in Tables 1 and 2 has the following meaning:

[0114] <Cationic polymerizable compounds> (A-1) Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: jER828) (A-2) Bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: jER806) (A-3) 3',4'-Epoxycyclohexylmethyl-3,4-Epoxycyclohexanecarboxylate (manufactured by Daicel Corporation, product name: Celoxide 2021P) (A-4) (3,3',4,4'-Diepoxy) Bicyclohexyl (manufactured by Daicel Corporation, product name: Celoxide 8010) (A-5) Dibromophenyl glycidyl ether (manufactured by Nippon Kayaku Co., Ltd., product name: BR-250H) (A-6) 1,6-Hexanediol diglycidyl ether (Manufactured by ADEKA Corporation, Product name: Adekaglycirol ED-503G) (A-7) Neopentyl glycol diglycidyl ether (manufactured by ADEKA Corporation, product name: Adekaglycirol ED-523L) (A-8) 2-Ethylhexyloxetane (manufactured by Toagosei Co., Ltd., product name: OXT-212)

[0115] <Radical polymerizable compounds> (B-1) 1,12-Dodecanediol dimethacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product name: DDD) (B-2) Ethoxylated bisphenol A dimethacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product name: NK Ester BPE-200) (B-3) Tricyclodecanedimethyl diacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product name: NK Ester A-DCP) (B-4) Ethoxylated-o-phenylphenol acrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product name: NK ester A-LEN-10)

[0116] <Cational polymerization initiator> (C-1) Triarylsulfonium salt hexafluoroantimonate (manufactured by ADEKA Corporation, product name: ADEKA Optomer SP-170) (C-2) Triarylsulfonium salt - tetrakispentafluorophenyl gallate (manufactured by Sunapro Co., Ltd., product name: CPI-310FG)

[0117] <Radical polymerization initiator> (D-1) 2,4,6-trimethylbenzoyldiphenylphosphine oxide (manufactured by IGM RESINS, product name: Omnirad TPO) (D-2) Ethyl-2,4,6-trimethylbenzoylphenylphosphinate (manufactured by IGM RESINS, product name: Omnirad TPO-L)

[0118] <Curing retarder> (E-1) 18-Crown Ether-6 (Manufactured by Tokyo Chemical Industry Co., Ltd., Product name: Crown Ether O-18) (E-2) Tris(2-ethylhexyl) phosphate (manufactured by Daihachi Chemical Industry Co., Ltd., product name: TOP)

[0119] <Leveling agent> (F-1) Acrylic leveling agent (manufactured by BYK, product name: BYK-356)

[0120] [Measurement and Evaluation] The following measurements and evaluations were performed on the compositions of each example and comparative example. The evaluation results are shown in Tables 1 and 2.

[0121] <Storage modulus E' and glass transition temperature> A silicone sheet mold measuring 50 mm in length, 7 mm in width, and 0.5 mm in thickness was placed on a PET film (manufactured by Toray Industries, Inc., product name: Lumirror S10, thickness: 50 μm). The composition was placed inside the mold and sandwiched between two PET films (manufactured by Toray Industries, Inc., product name: Lumirror S10, thickness: 50 μm). When the composition is a cationic polymerizable composition (Examples 1-9 and Comparative Examples 1 and 2), a 0.5 mm thick composition was irradiated with 365 nm wavelength ultraviolet light at a dose of 1500 mJ / cm using an LED lamp (manufactured by HOYA Corporation, product name: H64AH4). 2 (100mW / cm 2 After irradiation (irradiation time: 15 seconds), a cured product consisting of a composition with a thickness of 0.5 mm was obtained by heating at 80°C for 30 minutes. When the composition is a radical polymerizable composition (Examples 10-12 and Comparative Example 3), a 0.5 mm thick composition was irradiated with ultraviolet light at a wavelength of 395 nm at a dose of 1500 mJ / cm using an LED lamp (manufactured by HOYA Corporation, product name: H-4MLH200). 2 (Irradiation intensity: 100mW / cm 2 The material was irradiated for 15 seconds to obtain a cured product consisting of a composition with a thickness of 0.5 mm. For a cured product consisting of the obtained composition with a thickness of 0.5 mm, the storage modulus E' and tanδ were measured with respect to temperature using a dynamic viscoelasticity analyzer (Seiko Instruments Inc., product name: DMS210) under the following conditions: frequency of 1 Hz, measurement temperature range of 10°C to 200°C, heating rate of 2°C / min, measurement sample length of 50 mm, measurement sample width of 7 mm, nitrogen atmosphere, and tensile mode. From the measurement results, the storage modulus E' at 80°C and 25°C was determined. The temperature at the peak top of tanδ was defined as the glass transition temperature. The peak top of tanδ was defined as the maximum value in the region where tanδ is 0.3 or greater. If tanδ was 0.3 or less in the region of 10°C to 200°C, the peak top of tanδ was considered to be above 200°C, and the glass transition temperature was considered to be above 200°C (<200).

[0122] <Refractive index> A cured product consisting of a composition with a thickness of 0.5 mm was obtained using the same method as described above for <storage modulus E' and glass transition temperature>. The refractive index of a cured product consisting of a 0.5 mm thick composition was measured at 25°C and 589 nm using an Abbe refractometer (ATAGO Corporation, product name: DR-M2).

[0123] <Viscosity> The viscosity of the composition was measured based on the following conditions. Equipment: Cone-plate viscometer (manufactured by Eiko Seiki Co., Ltd., product name: HB DV3T) Temperature: 25℃ Cone: Radius 24mm, Angle 0.8° Rotation speed: 250 rpm Sample volume: 0.5 mL Atmosphere: Atmosphere

[0124] <Hardening shrinkage rate> The liquid specific gravity was calculated by filling the composition into a pycnometer and measuring the mass in the atmosphere and the mass in pure water. A cured product made of a composition with a thickness of 0.5 mm was obtained in the same manner as the <Storage elastic modulus E' and glass transition temperature> except that the mold of the silicon sheet was set to a length of 25 mm and a width of 25 mm. A cured product made of a composition with a width of 25 mm, a length of 25 mm, and a thickness of 0.5 mm was used as a measurement sample. Next, the cured product specific gravity was calculated by measuring the mass of the measurement sample in the atmosphere and the mass in pure water. The hardening shrinkage rate was calculated from the formula: Hardening shrinkage rate = ((Cured product specific gravity - Liquid specific gravity) / Cured product specific gravity) × 100 (%).

[0125] <Static surface tension> The static surface tension of the composition was measured by the pendant drop method using a contact angle meter (manufactured by Kyowa Interface Science Co., Ltd., product name: DM500) in an atmosphere at 23°C.

[0126] <LED reliability test> As LED light-emitting devices, devices each formed of an LED chip as a light-emitting source, a first lead frame on which the light-emitting source is mounted, a second lead frame, compositions of Examples 1 to 12 and Comparative Examples 1 to 3 that cover the light-emitting source, a bonding wire that electrically connects the light-emitting source and the second lead frame, and a synthetic resin cap that covers these were each prepared. The light-emitting source used was an LED chip that generates light with a wavelength of 300 nm or more and 500 nm or less. When the composition is a cationic polymerizable composition (Examples 1 to 9 and Comparative Examples 1 and 2), using an LED lamp (manufactured by HOYA Corporation, product name: H64AH4), ultraviolet light with a wavelength of 365 nm was irradiated with an irradiation amount of 1500 mJ / cm 2 (100 mW / cm 2 After irradiation so that the irradiation time was 15 seconds), the LED chip was sealed by heating at 80°C for 30 minutes. When the composition is a radical polymerizable composition (Examples 10-12 and Comparative Example 3), an LED lamp (manufactured by HOYA Corporation, product name: H-4MLH200) was used to irradiate ultraviolet light at a wavelength of 395 nm at a dose of 1500 mJ / cm². 2 (Irradiation intensity: 100mW / cm 2 The LED chip was irradiated for 15 seconds and then sealed. After sealing, the LED light-emitting devices were subjected to an energization test at 60°C and 90%RH for 500 hours. Those in which the LED chip did not turn off were classified as A (good), and those in which the LED chip turned off were classified as B (bad).

[0127] [Table 1]

[0128] [Table 2]

[0129] Tables 1 and 2 show that the compositions of the examples all yielded good results in LED reliability tests. Therefore, it can be seen that the compositions of this embodiment can improve the reliability of display devices.

Claims

1. A composition, It comprises a polymerizable compound (A) and a polymerization initiator (B), The polymerizable compound (A) includes a radical polymerizable compound, The radical polymerizable compound comprises (meth)acrylate, The (meth)acrylate includes a (meth)acrylate containing an alicyclic structure within the molecule. The (meth)acrylate includes a (meth)acrylate containing an aromatic compound in its molecule. The content of the (meth)acrylate containing an alicyclic structure within the molecule in the composition is 75 parts by mass or more and 80 parts by mass or less, when the content of the polymerizable compound (A) in the composition is 100 parts by mass. The content of the (meth)acrylate containing aromatic molecules in the composition is 1 part by mass or more and 25 parts by mass or less, when the content of polymerizable compound (A) in the composition is 100 parts by mass. The polymerization initiator (B) includes a radical polymerization initiator. A composition wherein, when a cured product comprising the above composition is measured using a dynamic viscoelasticity measuring device with a frequency of 1 Hz, a measurement temperature range of 10°C to 200°C, a heating rate of 2°C / min, and in tensile mode, the storage modulus E' at 80°C is 0.5 GPa or more and 5.0 GPa or less.

2. A composition, It comprises a polymerizable compound (A) and a polymerization initiator (B), The polymerizable compound (A) includes a radical polymerizable compound, The radical polymerizable compound comprises (meth)acrylate, The (meth)acrylate includes a (meth)acrylate containing an alicyclic structure within the molecule. The (meth)acrylate includes a (meth)acrylate containing an aromatic compound in its molecule. The (meth)acrylate mentioned above includes acyclic (meth)acrylates, The content of the (meth)acrylate containing an alicyclic structure within the molecule in the composition is 25 parts by mass or more and 100 parts by mass or less, when the content of the polymerizable compound (A) in the composition is 100 parts by mass. A composition wherein, when a cured product comprising the above composition is measured using a dynamic viscoelasticity measuring device with a frequency of 1 Hz, a measurement temperature range of 10°C to 200°C, a heating rate of 2°C / min, and in tensile mode, the storage modulus E' at 80°C is 0.5 GPa or more and 5.0 GPa or less.

3. The composition according to claim 2, wherein the acyclic (meth)acrylate comprises at least one selected from the group consisting of 1,6-hexadiol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, and methoxydiethylene glycol (meth)acrylate.

4. The composition according to any one of claims 1 to 3, wherein the (meth)acrylate containing an alicyclic structure within the molecule comprises at least one selected from the group consisting of tricyclodecanedimethanol di(meth)acrylate, dicyclopentanyloxyethyl(meth)acrylate, dicyclopentenyl(meth)acrylate, and dicyclopentenyloxyethyl(meth)acrylate.

5. The composition according to any one of claims 1 to 3, wherein the (meth)acrylate containing an aromatic molecule comprises at least one selected from the group consisting of ethoxylated bisphenol A di(meth)acrylate, ethoxylated-o-phenylphenol (meth)acrylate, and m-phenoxybenzyl (meth)acrylate.

6. The (meth)acrylate mentioned above includes polyfunctional (meth)acrylates, The composition according to any one of claims 1 to 3, wherein the content of the polyfunctional (meth)acrylate in the composition is 50 parts by mass or more and 100 parts by mass or less, when the content of the polymerizable compound (A) in the composition is 100 parts by mass.

7. The composition according to any one of claims 1 to 3, wherein the radical polymerization initiator comprises a photoradical polymerization initiator.

8. The composition according to any one of claims 1 to 3, further comprising a curing retarder (C).

9. The composition according to any one of claims 1 to 3, wherein the storage modulus E' at 25°C is 1.0 GPa or more and 10.0 GPa or less when a cured product comprising the above composition is measured using a dynamic viscoelasticity measuring device with a frequency of 1 Hz, a measurement temperature range of 10°C to 200°C, a heating rate of 2°C / min, and in tensile mode.

10. The composition according to any one of claims 1 to 3, wherein the glass transition temperature of a cured product comprising the above composition is 70°C or higher when measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, a heating rate of 2°C / min, and in tensile mode.

11. The composition according to any one of claims 1 to 3, wherein the refractive index of the cured product comprising the composition is 1.45 or more and 1.70 or less at 25°C and 589 nm.

12. The composition according to any one of claims 1 to 3, which is liquid at 25°C.

13. The composition according to any one of claims 1 to 3, wherein the viscosity of the composition is 1 mPa·s or more and 700 mPa·s or less, according to the method described below. <Method 1> Equipment: Cone-plate viscometer Temperature: 25℃ Cone: Radius 24 mm, angle 0.8° Rotation speed: 250 rpm Sample volume: 0.5 mL Atmosphere: Air

14. The composition according to any one of claims 1 to 3, which can be used for inkjet coating or dispenser coating.

15. The composition according to claim 14, which can be used for inkjet coating.

16. The composition according to any one of claims 1 to 3, wherein the curing shrinkage rate calculated by the method described below is 1.0% or more and 15.0% or less. <Method 2> The composition is filled into a specific gravity bottle, and the specific gravity of the liquid is calculated by measuring its mass in air and in pure water. For a cured product made of the composition with a width of 25 mm, a length of 25 mm, and a thickness of 0.5 mm, the specific gravity of the cured product is calculated by measuring its mass in air and in pure water. The curing shrinkage rate is then calculated using the formula: curing shrinkage rate = ((specific gravity of cured product - specific gravity of liquid) / specific gravity of cured product) × 100 (%).

17. The composition according to any one of claims 1 to 3, wherein the static surface tension obtained by the pendant drop method is 50 mN / m or less.

18. The composition according to any one of claims 1 to 3, which can be used to encapsulate micro-LEDs.

19. A cured body comprising a cured product made from the composition described in any one of claims 1 to 3.

20. A display device comprising a light-emitting diode element, a substrate, and a cured sealing layer containing the cured body described in claim 19 between the light-emitting diode element and the substrate.

21. The display device according to claim 20, wherein the light-emitting diode element includes a microLED.

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