Wiring circuit board

Abstract

The present invention provides a wiring circuit board that can reduce the electrical resistance between a metal layer and electrically connected circuit patterns (first circuit pattern and second circuit pattern). [Solution] The wiring circuit board 1 has a first portion 1A, a second portion 1B, and a connecting portion 1C that connects the first portion 1A and the second portion 1B. The wiring circuit board 1 also includes a metal layer 11, a first insulating layer 12, a first circuit pattern 13, a second circuit pattern 14, and a third circuit pattern 15. The metal layer 11 is arranged continuously across the first portion 1A, the second portion 1B, and the connecting portion 1C. The first circuit pattern 13 is electrically connected to the metal layer 11 of the first portion 1A. The second circuit pattern 14 is electrically connected to the metal layer 11 of the second portion 1B. The third circuit pattern 15 electrically connects the metal layer 11 of the first portion 1A and the metal layer 11 of the second portion 1B.

Description

Technical Field

[0001] The present invention relates to a wiring circuit board.

Background Art

[0002] Conventionally, a wiring circuit board has been proposed that includes a metal support layer, a conductor layer, and a base insulating layer disposed between the metal support layer and the conductor layer, and the conductor layer includes terminals electrically connected to the metal support layer (for example, see Patent Document 1 below).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a wiring circuit board as described in Patent Document 1, when there are a plurality of terminals electrically connected to the metal support layer, reduction of the electrical resistance between those terminals is required.

[0005] The present invention provides a wiring circuit board capable of reducing the electrical resistance between circuit patterns (first circuit pattern and second circuit pattern) electrically connected to a metal layer.

Means for Solving the Problems

[0006] The present invention [1] includes a wiring circuit board having a first portion, a second portion disposed apart from the first portion, and a connecting portion connecting the first portion and the second portion, the metal layer being disposed continuously with respect to the first portion, the second portion and the connecting portion, an insulating layer disposed on one side surface of the metal layer in the thickness direction of the metal layer, a first circuit pattern disposed on one side surface of the insulating layer of the first portion in the thickness direction and electrically connected to the metal layer of the first portion, a second circuit pattern disposed independently of the first circuit pattern on one side surface of the insulating layer of the second portion in the thickness direction and electrically connected to the metal layer of the second portion, and a third circuit pattern that electrically connects the metal layer of the first portion and the metal layer of the second portion, or electrically connects the metal layer of the first portion and the metal layer of the connecting portion.

[0007] With this configuration, the third circuit pattern electrically connects the metal layer of the first part and the metal layer of the second part, or electrically connects the metal layer of the first part and the metal layer of the connecting part.

[0008] Therefore, in addition to the conductive path through the metal layer of the connection portion, a conductive path is formed between the first circuit pattern and the second circuit pattern through the third circuit pattern.

[0009] As a result, the electrical resistance between the first circuit pattern and the second circuit pattern can be reduced.

[0010] The present invention [2] includes the wiring circuit board described in [1] above, wherein the first circuit pattern has a first connection portion connected to the metal layer of the first portion, and the third circuit pattern has a first end portion connected to the metal layer of the first portion and a second end portion connected to the metal layer of the second portion or the metal layer of the connection portion, and the distance between the first connection portion of the first circuit pattern and the first end portion of the third circuit pattern is shorter than the distance between the first connection portion of the first circuit pattern and the metal layer of the connection portion.

[0011] With this configuration, the conduction path through the third circuit pattern is shorter than the conduction path through the metal layer at the connection point. In other words, a conduction path shorter than the conduction path through the metal layer at the connection point (the conduction path through the third circuit pattern) is formed between the first circuit pattern and the second circuit pattern.

[0012] Therefore, the electrical resistance between the first circuit pattern and the second circuit pattern can be reliably reduced.

[0013] The present invention [3] includes the wiring circuit board described in [2] above, wherein the second circuit pattern has a second connection portion connected to the metal layer of the second portion, the second end of the third circuit pattern is connected to the metal layer of the second portion, and the distance between the second connection portion of the second circuit pattern and the second end of the third circuit pattern is shorter than the distance between the second connection portion of the second circuit pattern and the metal layer of the connection portion.

[0014] With this configuration, the conduction path through the third circuit pattern becomes even shorter than the conduction path through the metal layer of the connection.

[0015] Therefore, the electrical resistance between the first circuit pattern and the second circuit pattern can be reduced more reliably.

[0016] The present invention [4] further comprises any one of the wiring circuit boards described in [1] to [3] above, wherein the wiring circuit board is disposed independently of the first and second circuit patterns on one side surface of the insulating layer in the thickness direction and is not electrically connected to the metal layer, the fourth circuit pattern having a first terminal disposed in the first portion, a second terminal disposed in the second portion, and wiring disposed in the first portion, the second portion and the connection portion and electrically connecting the first terminal and the second terminal.

[0017] The present invention [5] includes the wiring circuit board described in [4] above, wherein the first portion comprises a first terminal arrangement portion on which the first terminal is arranged and a first wiring arrangement portion on which a part of the wiring is arranged, the second portion comprises a second terminal arrangement portion on which the second terminal is arranged and a second wiring arrangement portion on which a part of the wiring is arranged, and the third circuit pattern electrically connects the metal layer of the first wiring arrangement portion and the metal layer of the second wiring arrangement portion.

[0018] The present invention [6] includes the wiring circuit board described in [4] above, wherein the first portion comprises a first terminal arrangement portion on which the first terminal is arranged and a first wiring arrangement portion on which a part of the wiring is arranged, the second portion comprises a second terminal arrangement portion on which the second terminal is arranged and a second wiring arrangement portion on which a part of the wiring is arranged, and the third circuit pattern electrically connects the metal layer of the first terminal arrangement portion and the metal layer of the second terminal arrangement portion.

[0019] The present invention [7] includes the wiring circuit board described in [4] above, wherein the first portion comprises a first terminal arrangement portion on which the first terminal is arranged and a first wiring arrangement portion on which a part of the wiring is arranged, the second portion comprises a second terminal arrangement portion on which the second terminal is arranged and a second wiring arrangement portion on which a part of the wiring is arranged, and the third circuit pattern electrically connects the metal layer of the first wiring arrangement portion and the metal layer of the second terminal arrangement portion, or electrically connects the metal layer of the first terminal arrangement portion and the metal layer of the second wiring arrangement portion.

[0020] The present invention [8] includes any one of the above [1] to [7] wiring circuit boards, wherein the third circuit pattern is made of the same material as the metal layer.

[0021] The present invention [9] includes any one of the above [1] to [7] wiring circuit boards, wherein the third circuit pattern is made of the same material as the first circuit pattern, the wiring circuit board is made of the same material as the insulating layer, and further comprises a support layer for supporting the third circuit pattern.

[0022] According to the present invention

[10] , the third circuit pattern has a first end connected to the metal layer of the first portion and a second end connected to the metal layer of the second portion or the metal layer of the connection portion, and the length of the third circuit pattern is longer than the straight-line distance between the first end and the second end, including any one of the wiring circuit boards of [1] to [9] above.

[0023] According to such a configuration, since the length of the third circuit pattern is longer than the straight-line distance between the first end and the second end, the movement of the second portion with respect to the first portion can be allowed.

Effects of the Invention

[0024] According to the wiring circuit board of the present invention, the electrical resistance between the circuit patterns (the first circuit pattern and the second circuit pattern) electrically connected to the metal layer can be reduced.

Brief Description of the Drawings

[0025] [Figure 1] FIG. 1 is a plan view of a wiring circuit board as an embodiment of the present invention (viewed from one side in the thickness direction). [Figure 2] FIG. 2A is a cross-sectional view taken along line A-A of the wiring circuit board shown in FIG. 1. FIG. 2B is a cross-sectional view taken along line B-B of the wiring circuit board shown in FIG. 1. [Figure 3] FIG. 3 is a rear view of the wiring circuit board shown in FIG. 1 (viewed from the other side in the thickness direction). [Figure 4] FIG. 4 is a plan view of a wiring circuit board of Modification (1). [Figure 5] FIG. 5 is a cross-sectional view taken along line C-C of the wiring circuit board shown in FIG. 4. [Figure 6] FIG. 6 is a plan view of a wiring circuit board of Modification (2). [Figure 7] FIG. 7 is a rear view of the wiring circuit board shown in FIG. 6. [Figure 8] FIG. 8 is a plan view of a wiring circuit board of Modification (3). [Figure 9] FIG. 9 is a rear view of the wiring circuit board shown in FIG. 8. [Figure 10] Figure 10 is a plan view of the wiring circuit board of modified example (4). [Figure 11] Figure 11 is a rear view of the wiring circuit board shown in Figure 10. [Figure 12] Figure 12 is a plan view of the wiring circuit board of modified example (5). [Figure 13] Figure 13 is a rear view of the wiring circuit board shown in Figure 12. [Figure 14] Figure 14 is a plan view of the wiring circuit board of modified example (6). [Figure 15] Figure 15 is a rear view of the wiring circuit board shown in Figure 14. [Modes for carrying out the invention]

[0026] 1. Wiring circuit board As shown in Figure 1, the wiring circuit board 1 has a first part 1A, a second part 1B, and a connection part 1C.

[0027] The first part 1A has a width in a first direction and extends in a second direction. The second direction is perpendicular to the first direction. The first part 1A has a first terminal arrangement section 101A and a first wiring arrangement section 102A. The first terminal 161, which will be described later, is arranged in the first terminal arrangement section 101A. The first terminal arrangement section 101A extends in a first direction and a second direction. The first terminal arrangement section 101A has a substantially rectangular shape. A part of the wiring 163, which will be described later, is arranged in the first wiring arrangement section 102A. The first wiring arrangement section 102A extends from the first terminal arrangement section 101A in a second direction.

[0028] The second part 1B is positioned away from the first part 1A in the first direction. The second part 1B has a width in the first direction and extends in the second direction. The second part 1B has a second terminal arrangement section 101B and a second wiring arrangement section 102B. The second terminal arrangement section 101B is positioned away from the first terminal arrangement section 101A in the first direction. The second terminal 162, which will be described later, is arranged in the second terminal arrangement section 101B. The second terminal arrangement section 101B extends in the first and second directions. The second terminal arrangement section 101B has a substantially rectangular shape. The second wiring arrangement section 102B is positioned away from the first wiring arrangement section 102A in the first direction. A portion of the wiring 163 is arranged in the second wiring arrangement section 102B. The second wiring arrangement section 102B extends from the second terminal arrangement section 101B in the second direction.

[0029] The connecting portion 1C connects the first portion 1A and the second portion 1B. The connecting portion 1C is positioned between the first portion 1A and the second portion 1B in the first direction. The connecting portion 1C has a width in the second direction and extends in the first direction. One end of the connecting portion 1C is connected to the first portion 1A. The other end of the connecting portion 1C is connected to the second portion 1B.

[0030] As shown in Figures 2A and 2B, the wiring circuit board 1 comprises a metal layer 11, a first insulating layer 12 as an example of an insulating layer, a first circuit pattern 13 (see Figure 1), a second circuit pattern 14 (see Figure 1), a third circuit pattern 15 (see Figure 1), a fourth circuit pattern 16 (see Figure 1), and a second insulating layer 17 (see Figure 2B).

[0031] (1) Metal layer As shown in Figure 3, the metal layer 11 is arranged continuously across the first portion 1A, the second portion 1B, and the connecting portion 1C. As shown in Figures 2A and 2B, the metal layer 11 supports the first insulating layer 12, the first circuit pattern 13, the second circuit pattern 14, the fourth circuit pattern 16, and the second insulating layer 17. Examples of materials for the metal layer 11 include stainless steel and copper alloys. Preferably, the metal layer 11 is made of a copper alloy.

[0032] The metal layer 11 may be composed of multiple layers. For example, the metal layer 11 may have a metal support layer, a conductor layer, and a protective metal layer.

[0033] The metal support layer supports the conductor layer and the protective metal layer. The metal support layer is made of, for example, the same material as the metal layer 11 described above.

[0034] The conductive layer is positioned on one side surface of the metal support layer in the thickness direction of the metal layer 11. The conductive layer is positioned between the metal support layer and the protective metal layer in the thickness direction. The conductive layer is made of metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and their alloys. The conductive layer is preferably made of copper. The conductive layer is, for example, a plating layer.

[0035] The protective metal layer is disposed on one side surface of the conductor layer in the thickness direction. The protective metal layer covers the conductor layer. The protective metal layer is disposed between the conductor layer and the first insulating layer 12. The protective metal layer protects the conductor layer. Examples of materials for the protective metal layer include chromium, nickel, titanium, and their alloys. The protective metal layer is preferably made of chromium. The protective metal layer is, for example, a sputtering layer.

[0036] (2) First insulating layer The first insulating layer 12 is disposed on one side surface of the metal layer 11 in the thickness direction of the metal layer 11. The first insulating layer 12 is disposed between the metal layer 11 and the first circuit pattern 13, between the metal layer 11 and the second circuit pattern 14, and between the metal layer 11 and the fourth circuit pattern 16 in the thickness direction. The first insulating layer 12 insulates the metal layer 11 from the first circuit pattern 13, the second circuit pattern 14, and the fourth circuit pattern 16. The first insulating layer 12 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The first insulating layer 12 is preferably made of polyimide. The first insulating layer 12 has a first through hole 12A and a second through hole 12B. The first through hole 12A is located in the first portion 1A. The second through hole 12B is located in the second portion 1B.

[0037] (3) First circuit pattern The first circuit pattern 13 is arranged on one side surface of the first insulating layer 12 of the first portion 1A in the thickness direction. The first circuit pattern 13 has a terminal 131. In this embodiment, the first circuit pattern 13 consists only of the terminal 131. The terminal 131 has a first connection portion 131A. In other words, the first circuit pattern 13 has a first connection portion 131A. The first connection portion 131A is arranged in a first through hole 12A of the first insulating layer 12. The first connection portion 131A is connected to the metal layer 11 of the first portion 1A through the first through hole 12A. More specifically, the first connection portion 131A is connected to the metal layer 11 of the first terminal arrangement portion 101A through the first through hole 12A. As a result, the first circuit pattern 13 is electrically connected to the metal layer 11 of the first portion 1A.

[0038] The first circuit pattern 13 may have wiring connected to terminal 131. In this case, the wiring may have a first connection portion 131A.

[0039] Examples of materials for the first circuit pattern 13 include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. The first circuit pattern 13 is preferably made of copper.

[0040] The first circuit pattern 13 may be composed of multiple layers. For example, the first circuit pattern 13 may have a protective metal layer and a conductive layer.

[0041] The protective metal layer is disposed on one side surface of the first insulating layer 12 in the thickness direction. The protective metal layer is disposed between the first insulating layer 12 and the conductor layer of the first circuit pattern 13. The protective metal layer protects the conductor layer of the first circuit pattern 13. Examples of materials for the protective metal layer include chromium, nickel, titanium, and alloys thereof. The protective metal layer is preferably made of chromium. The protective metal layer is, for example, a sputtering layer.

[0042] The conductive layer is arranged on one side surface of the protective metal layer in the thickness direction. The conductive layer is made of, for example, the material of the first circuit pattern 13 described above. The conductive layer is, for example, a plating layer.

[0043] (4) Second circuit pattern The second circuit pattern 14 is positioned on one side surface of the first insulating layer 12 of the second portion 1B in the thickness direction. The second circuit pattern 14 is independent of the first circuit pattern 13. The second circuit pattern 14 has a terminal 141. In this embodiment, the second circuit pattern 14 consists only of the terminal 141. The terminal 141 has a second connection portion 141A. In other words, the second circuit pattern 14 has a second connection portion 141A. The second connection portion 141A is positioned within the second through-hole 12B of the first insulating layer 12. The second connection portion 141A is connected to the metal layer 11 of the second portion 1B through the second through-hole 12B. More specifically, the second connection portion 141A is connected to the metal layer 11 of the second terminal placement portion 101B through the second through-hole 12B. This electrically connects the second circuit pattern 14 to the metal layer 11 of the second portion 1B.

[0044] The second circuit pattern 14 may have wiring connected to terminal 141. In this case, the wiring may have a second connection portion 141A.

[0045] The second circuit pattern 14 is made of the same material as the first circuit pattern 13, for example. The second circuit pattern 14 may consist of multiple layers, similar to the first circuit pattern 13.

[0046] (5) Third circuit pattern As shown in Figure 3, the third circuit pattern 15 electrically connects the metal layer 11 of the first portion 1A and the metal layer 11 of the second portion 1B. This creates a conductive path between the first circuit pattern 13 and the second circuit pattern 14, passing through the metal layer 11 of the connecting portion 1C and passing through the third circuit pattern 15. Therefore, the electrical resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reduced compared to the case where only a conductive path passing through the metal layer 11 of the connecting portion 1C is formed between the first circuit pattern 13 and the second circuit pattern 14.

[0047] The third circuit pattern 15 has a first end 151 and a second end 152. The first end 151 is connected to the metal layer 11 of the first portion 1A. The second end 152 is connected to the metal layer 11 of the second portion 1B. More specifically, in the first direction, the third circuit pattern 15 is positioned between the metal layer 11 of the first wiring arrangement section 102A and the metal layer 11 of the second wiring arrangement section 102B. In the second direction, the third circuit pattern 15 is positioned between the connection section 1C and the first terminal arrangement section 101A. The first end 151 is connected to the metal layer 11 of the first wiring arrangement section 102A. The second end 152 is connected to the metal layer 11 of the second wiring arrangement section 102B. Thus, the third circuit pattern 15 electrically connects the metal layer 11 of the first wiring arrangement section 102A and the metal layer 11 of the second wiring arrangement section 102B.

[0048] The distance D1 between the first connection portion 131A of the first circuit pattern 13 and the first end portion 151 of the third circuit pattern 15 is shorter than the distance D11 between the first connection portion 131A of the first circuit pattern 13 and the metal layer 11 of the connection portion 1C.

[0049] Since distance D1 is shorter than distance D11, the conduction path through the third circuit pattern 15 is shorter than the conduction path through the metal layer 11 of the connection portion 1C. In other words, a conduction path (the conduction path through the third circuit pattern 15) shorter than the conduction path through the metal layer 11 of the connection portion 1C is formed between the first circuit pattern 13 and the second circuit pattern 14. Therefore, the electrical resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reliably reduced.

[0050] The distance D2 between the second connection portion 141A of the second circuit pattern 14 and the second end portion 152 of the third circuit pattern 15 is shorter than the distance D12 between the second connection portion 141A of the second circuit pattern 14 and the metal layer 11 of the connection portion 1C.

[0051] Since distance D1 is shorter than distance D11, and distance D2 is shorter than distance D12, the conduction path through the third circuit pattern 15 is even shorter than the conduction path through the metal layer 11 of the connection portion 1C. Therefore, the electrical resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reduced more reliably.

[0052] In this embodiment, the third circuit pattern 15 is made of the same material as the metal layer 11 and is continuous with the metal layer 11.

[0053] (6) Fourth circuit pattern As shown in Figures 2A and 2B, the fourth circuit pattern 16 is located on one side surface of the first insulating layer 12 in the thickness direction. The fourth circuit pattern 16 is independent of the first circuit pattern 13 and the second circuit pattern 14. The fourth circuit pattern 16 is not electrically connected to the metal layer 11. The fourth circuit pattern 16 is made of the same material as, for example, the first circuit pattern 13. The fourth circuit pattern 16 may consist of multiple layers, similar to the first circuit pattern 13.

[0054] As shown in Figure 1, the fourth circuit pattern 16 has a first terminal 161, a second terminal 162, and wiring 163.

[0055] The first terminal 161 is located in the first section 1A. More specifically, the first terminal 161 is located in the first terminal placement section 101A. The first terminal 161 is located away from the first circuit pattern 13.

[0056] The second terminal 162 is located in the second section 1B. More specifically, the second terminal 162 is located in the second terminal placement section 101B. The second terminal 162 is located away from the second circuit pattern 14.

[0057] Wiring 163 electrically connects the first terminal 161 and the second terminal 162. Wiring 163 is located in the first section 1A, the second section 1B, and the connecting section 1C.

[0058] (7) Second insulating layer As shown in Figure 2B, the second insulating layer 17 is arranged on one side surface of the first insulating layer 12 in the thickness direction. The second insulating layer 17 is made of resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The second insulating layer 17 covers the wiring 163. The second insulating layer 17 does not cover at least a portion of terminals 131, 141, the first terminal 161, and the second terminal 162.

[0059] 2. Effects (1) According to the wiring circuit board 1, as shown in Figure 3, the metal layer 11 of the first part 1A and the metal layer 11 of the second part 1B are electrically connected by the third circuit pattern 15.

[0060] Therefore, a conductive path is formed between the first circuit pattern 13 and the second circuit pattern 14, passing through the metal layer 11 of the connection portion 1C, and a conductive path is formed passing through the third circuit pattern 15.

[0061] As a result, the electrical resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reduced compared to the case where only a conductive path is formed between the first circuit pattern 13 and the second circuit pattern 14 through the metal layer 11 of the connection portion 1C.

[0062] (2) According to the wiring circuit board 1, as shown in Figure 3, the distance D1 between the first connection portion 131A of the first circuit pattern 13 and the first end portion 151 of the third circuit pattern 15 is shorter than the distance D11 between the first connection portion 131A of the first circuit pattern 13 and the metal layer 11 of the connection portion 1C.

[0063] Therefore, the conduction path through the third circuit pattern 15 is shorter than the conduction path through the metal layer 11 of the connection portion 1C. In other words, a conduction path (the conduction path through the third circuit pattern 15) that is shorter than the conduction path through the metal layer 11 of the connection portion 1C is formed between the first circuit pattern 13 and the second circuit pattern 14.

[0064] As a result, the electrical resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reliably reduced.

[0065] (3) According to the wiring circuit board 1, as shown in Figure 3, the distance D2 between the second connection portion 141A of the second circuit pattern 14 and the second end portion 152 of the third circuit pattern 15 is shorter than the distance D12 between the second connection portion 141A of the second circuit pattern 14 and the metal layer 11 of the connection portion 1C.

[0066] Therefore, the conduction path through the third circuit pattern 15 is even shorter than the conduction path through the metal layer 11 of the connection portion 1C.

[0067] As a result, the electrical resistance between the first circuit pattern 13 and the second circuit pattern 14 can be reduced more reliably.

[0068] 3. Variant A modified example will now be described. In the modified example, the same reference numerals are used for components similar to those in the above-described embodiment, and their descriptions are omitted.

[0069] (1) As shown in Figures 4 and 5, the third circuit pattern 20 may be made of the same material as the first circuit pattern 13. In this case, the first insulating layer 12 has a third through hole 12C and a fourth through hole 12D. The third through hole 12C is located in the first wiring arrangement section 102A of the first section 1A. The fourth through hole 12D is located in the second wiring arrangement section 102B of the second section 1B. The third circuit pattern 20 has a third connection section 20A and a fourth connection section 20B.

[0070] The third connection portion 20A is positioned within the third through-hole 12C of the first insulating layer 12. The third connection portion 20A is connected to the metal layer 11 of the first wiring arrangement portion 102A through the third through-hole 12C. As a result, the third circuit pattern 20 is electrically connected to the metal layer 11 of the first portion 1A.

[0071] The fourth connection portion 20B is positioned within the fourth through-hole 12D of the first insulating layer 12. The fourth connection portion 20B is connected to the metal layer 11 of the second wiring arrangement portion 102B through the fourth through-hole 12D. As a result, the third circuit pattern 20 is electrically connected to the metal layer 11 of the second portion 1B.

[0072] The wiring circuit board 1 may also have a support layer 21. The third circuit pattern 20 is arranged on one side surface of the support layer 21 in the thickness direction. In this way, the support layer 21 supports the third circuit pattern 20. The support layer 21 is made of the same material as the first insulating layer 12 and is continuous with the first insulating layer 12.

[0073] (2) As shown in Figures 6 and 7, the third circuit pattern 15 may electrically connect the metal layer 11 of the first terminal arrangement section 101A and the metal layer 11 of the second terminal arrangement section 101B.

[0074] (3) As shown in Figures 8 and 9, the third circuit pattern 15 may electrically connect the metal layer 11 of the first wiring arrangement section 102A and the metal layer 11 of the second terminal arrangement section 101B.

[0075] Although not shown in the diagram, the third circuit pattern 15 may electrically connect the metal layer 11 of the first terminal arrangement section 101A and the metal layer 11 of the second wiring arrangement section 102B.

[0076] (4) As shown in Figures 10 and 11, the second portion 1B may be positioned in the second direction on the opposite side of the first portion 1A from the connecting portion 1C. In other words, the connecting portion 1C may be positioned between the first portion 1A and the second portion 1B in the second direction.

[0077] The third circuit pattern 15 may electrically connect the metal layer 11 of the first portion 1A and the metal layer 11 of the connection portion 1C. Specifically, the first end 151 of the third circuit pattern 15 may be connected to the metal layer 11 of the first portion 1A, and the second end 152 of the third circuit pattern 15 may be connected to the metal layer 11 of the connection portion 1C.

[0078] (5) As shown in Figures 12 and 13, the connection portion 1C may be positioned between the first portion 1A and the second portion 1B in the first direction. The wiring circuit board 1 may have an S-shape in plan view. In this case as well, similar to the modified example (4) described above, the third circuit pattern 15 may electrically connect the metal layer 11 of the first portion 1A and the metal layer 11 of the connection portion 1C. Specifically, the first end 151 of the third circuit pattern 15 may be connected to the metal layer 11 of the first portion 1A, and the second end 152 of the third circuit pattern 15 may be connected to the metal layer 11 of the connection portion 1C.

[0079] (6) As shown in Figures 14 and 15, the length of the third circuit pattern 15 may be longer than the straight-line distance D21 between the first end 151 and the second end 152. If the length of the third circuit pattern 15 is longer than the straight-line distance D21 between the first end 151 and the second end 152, movement of the second part 1B relative to the first part 1A is permitted.

[0080] (7) The same effects and advantages as those of the embodiments described above can be obtained in the above modified examples (1) to (6). [Explanation of Symbols]

[0081] 1 Wiring circuit board 1A 1st part 101A 1st terminal arrangement section 102A 1st wiring arrangement section 1B 2nd part 101B 2nd terminal arrangement section 102B 2nd wiring arrangement section 1C connection section 11 Metal layer 12. First insulating layer 13. First Circuit Pattern 131A First connection section 14. Second Circuit Pattern 141A Second connection section 15 Third Circuit Pattern 151 First end 152 Second end 16. Fourth Circuit Pattern 161 1st terminal 162 2nd terminal 163 Wiring 21 Support layer D1 Distance between the first connection point and the first end D2 Distance between the second connection point and the second end. D11 Distance between the first connection point and the metal layer of the connection point D12 Distance between the second connection point and the metal layer of the connection point D21 Straight-line distance between the first end and the second end

Claims

1. It has a first part, a second part positioned away from the first part, and a connecting part that connects the first part and the second part. A metal layer is arranged continuously in the first portion, the second portion and the connecting portion, An insulating layer disposed on one side surface of the metal layer in the thickness direction of the metal layer, A first circuit pattern is disposed on one side surface of the insulating layer of the first portion in the thickness direction and is electrically connected to the metal layer of the first portion, A second circuit pattern is disposed independently of the first circuit pattern on one side surface of the insulating layer of the second portion in the thickness direction, and is electrically connected to the metal layer of the second portion. A third circuit pattern that electrically connects the metal layer of the first portion and the metal layer of the second portion, or electrically connects the metal layer of the first portion and the metal layer of the connecting portion. A wiring circuit board equipped with the following features.

2. The first circuit pattern has a first connection portion which is connected to the metal layer of the first portion, The third circuit pattern is, The first end portion connected to the metal layer of the first portion, The second portion has the metal layer, or the second end is connected to the metal layer of the connecting portion, The wiring circuit board according to claim 1, wherein the distance between the first connection portion of the first circuit pattern and the first end portion of the third circuit pattern is shorter than the distance between the first connection portion of the first circuit pattern and the metal layer of the connection portion.

3. The second circuit pattern has a second connection portion which is connected to the metal layer of the second portion, The second end of the third circuit pattern is connected to the metal layer of the second portion. The wiring circuit board according to claim 2, wherein the distance between the second connection portion of the second circuit pattern and the second end portion of the third circuit pattern is shorter than the distance between the second connection portion of the second circuit pattern and the metal layer of the connection portion.

4. The aforementioned wiring circuit board is The insulating layer further comprises a fourth circuit pattern that is arranged independently of the first and second circuit patterns on one surface of the insulating layer in the thickness direction and is not electrically connected to the metal layer. The fourth circuit pattern is, A first terminal located in the first portion, The second terminal located in the second part, Wiring arranged in the first part, the second part, and the connecting part, which electrically connects the first terminal and the second terminal. A wiring circuit board according to claim 1, having the following features.

5. The first portion includes a first terminal arrangement section where the first terminal is arranged, and a first wiring arrangement section where a part of the wiring is arranged. The second portion includes a second terminal arrangement section where the second terminal is arranged, and a second wiring arrangement section where a part of the wiring is arranged. The wiring circuit board according to claim 4, wherein the third circuit pattern electrically connects the metal layer of the first wiring arrangement portion and the metal layer of the second wiring arrangement portion.

6. The first portion includes a first terminal arrangement section where the first terminal is arranged, and a first wiring arrangement section where a part of the wiring is arranged. The second portion includes a second terminal arrangement section where the second terminal is arranged, and a second wiring arrangement section where a part of the wiring is arranged. The wiring circuit board according to claim 4, wherein the third circuit pattern electrically connects the metal layer of the first terminal arrangement portion and the metal layer of the second terminal arrangement portion.

7. The first portion includes a first terminal arrangement section where the first terminal is arranged, and a first wiring arrangement section where a part of the wiring is arranged. The second portion includes a second terminal arrangement section where the second terminal is arranged, and a second wiring arrangement section where a part of the wiring is arranged. The wiring circuit board according to claim 4, wherein the third circuit pattern electrically connects the metal layer of the first wiring arrangement portion and the metal layer of the second terminal arrangement portion, or electrically connects the metal layer of the first terminal arrangement portion and the metal layer of the second wiring arrangement portion.

8. The wiring circuit board according to claim 1, wherein the third circuit pattern is made of the same material as the metal layer.

9. The third circuit pattern is made of the same material as the first circuit pattern. The aforementioned wiring circuit board is The wiring circuit board according to claim 1, further comprising a support layer made of the same material as the insulating layer and supporting the third circuit pattern.

10. The third circuit pattern is, The first end portion connected to the metal layer of the first portion, The second portion has the metal layer, or the second end is connected to the metal layer of the connecting portion, The wiring circuit board according to claim 1, wherein the length of the third circuit pattern is longer than the straight-line distance between the first end and the second end.

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