Exposure apparatus, control method, and method for manufacturing electronic devices

Abstract

The present invention provides an exposure apparatus for controlling exposure to an exposure target, an exposure method, and a method for manufacturing an electronic device, which includes exposing the exposure target using the exposure method. [Solution] The control unit controls a first step of performing a first exposure to the resist layer and a second step of performing a second exposure to the resist layer. Each of the first and second steps includes moving the stage on which the substrate is placed from one side to the other in the scanning direction relative to the spatial light modulator so that light from the exposure module system is irradiated onto a first region in the resist layer that extends in the scanning direction, and onto a second region in the resist layer that includes an overlapping region that overlaps with the first region and a region that does not overlap.

Description

Technical Field

[0001] The present invention relates to an exposure apparatus, a control method, and a method of manufacturing an electronic device. This application claims priority based on Japanese Patent Application No. 2021-111762 filed on July 5, 2021, and incorporates its content herein by reference.

Background Art

[0002] Conventionally, as an exposure apparatus that irradiates a substrate with illumination light through an optical system, an exposure apparatus is known that uses a spatial light modulator to modulate light, passes the modulated light through a projection optical system, and forms an image of this light on a resist applied on the substrate for exposure (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] According to a first aspect of the present invention, there is provided an exposure apparatus including an illumination optical system, a spatial light modulator illuminated by light from the illumination optical system, a projection optical system that irradiates light emitted from the spatial light modulator onto an exposure target, a stage on which the exposure target is placed and that relatively moves the exposure target and the projection optical system in a predetermined scanning direction, and a control unit that controls exposure to the exposure target and has a storage unit that stores information regarding an exposure pattern. The control unit controls exposure to the exposure target such that a first step of performing a first exposure based on information regarding the exposure pattern and a second step of performing a second exposure based on at least a part of the information regarding the exposure pattern used in the first step are executed.

[0005] A second aspect of the present invention provides an exposure apparatus comprising: an illumination optical system; a spatial light modulator illuminated by light from the illumination optical system; a projection optical system that irradiates an exposure target with light emitted from the spatial light modulator; a stage on which the exposure target is placed and which moves the exposure target and the projection optical system relative to each other in a predetermined scanning direction; and a control unit having a storage unit for storing information about an exposure pattern and controlling exposure to the exposure target, the exposure method comprising: a first step of performing a first exposure based on information about the exposure pattern; and a second step of performing a second exposure based on at least a portion of the information about the exposure pattern used in the first step.

[0006] A third aspect of the present invention provides a method for manufacturing an electronic device, which includes exposing the object to be exposed by the exposure method described above. [Brief explanation of the drawing]

[0007] [Figure 1] This figure shows an overview of the external configuration of the exposure apparatus in this embodiment. [Figure 2] This diagram shows an overview of the configuration of the lighting module and projection module. [Figure 3] This is a diagram illustrating the configuration of a lighting module. [Figure 4] This diagram shows an overview of the configuration of the optical modulation section. [Figure 5] This diagram shows an overview of the configuration of the optical modulation unit, specifically the ON state of the mirror in the center of the page. [Figure 6] This diagram shows an overview of the configuration of the optical modulation unit, specifically the state in which the mirror in the center of the page is turned off. [Figure 7A] This is a schematic plan view showing an example of an exposure pattern when the pattern to be exposed is exposed twice. [Figure 7B] This is an explanatory diagram that specifically shows an example of the arrangement of multiple exposure modules. [Figure 7C] This is an explanatory diagram that specifically shows another example of the arrangement of multiple exposure modules. [Figure 8] This is a schematic plan view illustrating a second example of an exposure pattern. [Figure 9] This is a schematic plan view illustrating a third example of an exposure pattern. [Figure 10] This is a schematic plan view illustrating a fourth example of an exposure pattern. [Modes for carrying out the invention]

[0008] Embodiments of the present invention will be described below with reference to the drawings. The following detailed description of the present invention is illustrative and not limiting. The same or similar reference numerals are used throughout the drawings and the following detailed description.

[0009] [Synthesis equipment] Figure 1 is a diagram showing an overview of the external configuration of the exposure apparatus 1 of this embodiment. The exposure apparatus 1 is a device that irradiates an object to be exposed with modulated light. In a particular embodiment, the exposure apparatus 1 is a step-and-scan type projection exposure apparatus, a so-called scanner, which uses a rectangular (square) glass substrate used in electronic devices such as liquid crystal displays (flat panel displays) as the object to be exposed. The glass substrate, which is the object to be exposed, may have at least one side length or diagonal length of 500 mm or more. The glass substrate, which is the object to be exposed, may also be a substrate for a flat panel display. The object to be exposed by the exposure apparatus 1 (for example, a substrate for a flat panel display) is developed and used as a product. A resist is formed on the surface of the object to be exposed. The main body of the exposure apparatus 1 is configured similarly to the main body of the apparatus disclosed in, for example, U.S. Patent Application Publication No. 2008 / 0030702.

[0010] The exposure apparatus 1 comprises a base 11, a vibration isolation table 12, a main column 13, a stage 14, an optical table 15, a lighting module 16, a projection module 17 (projection optical system), a light source unit 18, an optical fiber 19, an optical modulation unit 20 (not shown in Figure 1), and a control unit 21. In the following description, we will use a three-dimensional Cartesian coordinate system as needed, where the Z-axis direction is defined as the direction parallel to the optical axis of the projection module 17 that irradiates the object to be exposed with light modulated by the light modulation unit 20, and the X-axis direction and Y-axis direction are defined as the directions of a predetermined plane perpendicular to the Z-axis. The X-axis direction and the Y-axis direction are mutually orthogonal (intersecting) directions. In this embodiment, the X-axis direction is the scanning movement direction of the object to be exposed (substrate) 23, and the Y-axis direction is the stepping direction of the object to be exposed (substrate) 23.

[0011] The base 11 is the base of the exposure apparatus 1 and is installed on the vibration isolation table 12. The base 11 supports the stage 14 on which the object to be exposed is placed, so that it can move in the X-axis and Y-axis directions.

[0012] Stage 14 supports the object to be exposed. In scanning exposure, Stage 14 is used to precisely position the object to be exposed relative to multiple partial images of the circuit pattern projected via the projection module 17. Stage 14 drives the object to be exposed in six degrees of freedom directions (the X, Y, and Z axis directions and rotational directions relative to each axis as described above).

[0013] Stage 14 is moved in the X-axis direction during scanning exposure and in the Y-axis direction when changing the exposure area on the object to be exposed. Note that the object to be exposed has multiple exposure areas. Stage 14 moves the object to be exposed and the projection module 17 relative to each other in the scanning direction.

[0014] The exposure apparatus 1 is capable of exposing a plurality of exposure target regions on a single exposure target object respectively. The configuration of the stage 14 is not particularly limited, but a stage apparatus as disclosed in, for example, U.S. Patent Application Publication No. 2012 / 0057140 can be used. The stage apparatus is, for example, a so-called coarse and fine movement configuration stage apparatus including a gantry type two-dimensional coarse movement stage and a fine movement stage that is finely driven with respect to the two-dimensional coarse movement stage. The stage apparatus with a coarse and fine movement configuration enables the exposure target object to move in three degrees of freedom in the horizontal plane by the coarse movement stage and to move finely in six degrees of freedom by the fine movement stage.

[0015] The main column 13 supports the optical table 15 above the stage 14 (in the positive direction of the Z axis). The optical table 15 supports the illumination module 16, the projection module 17, and the optical modulation unit 20.

[0016] FIG. 2 is a diagram showing an outline of the configurations of the illumination module 16, the projection module 17, and the optical modulation unit 20. The illumination module 16 is disposed above the optical table 15 and is connected to the light source unit 18 via the optical fiber 19. In an example of the present embodiment, the illumination module 16 includes a first illumination module 16A, a second illumination module 16B, a third illumination module 16C, and a fourth illumination module 16D. In the following description, when the first illumination module 16A to the fourth illumination module 16D are not distinguished, they are collectively referred to as the illumination module 16.

[0017] Each of the first illumination module 16A to the fourth illumination module 16D guides the light emitted from the light source unit 18 via the optical fiber 19 to each of the first optical modulation unit 20A, the second optical modulation unit 20B, the third optical modulation unit 20C, and the fourth optical modulation unit 20D. The illumination module 16 illuminates the optical modulation unit 20.

[0018] The light modulation unit 20, as will be described in more detail later, is controlled based on drawing data (data in a two-dimensional bitmap format, etc.) of the circuit pattern to be transferred to the object to be exposed, and spatially modulates the illumination light from the illumination module 16. The modulated light (light distribution corresponding to the pattern) modulated by the light modulation unit 20 is guided to the projection module 17. The first light modulation unit 20A to the fourth light modulation unit 20D are arranged at different positions on the XY plane. In the following description, when the first light modulation unit 20A to the fourth light modulation unit 20D are not distinguished, they will be collectively referred to as the light modulation unit 20.

[0019] The projection module 17 is positioned below the optical platen 15 and irradiates the object to be exposed, placed on the stage 14, with modulated light modulated by the spatial light modulator 201. The projection module 17 images the light modulated by the light modulation unit 20 onto the object to be exposed, thereby exposing the object. In other words, the projection module 17 projects the pattern on the light modulation unit 20 onto the object to be exposed. In one example of this embodiment, the projection module 17 includes the first projection module 17A to the fourth projection module 17D, which correspond to the first illumination module 16A to the fourth illumination module 16D and the first light modulation unit 20A to the fourth light modulation unit 20D described above. In the following description, when the first projection module 17A to the fourth projection module 17D are not distinguished, they will be collectively referred to as the projection module 17.

[0020] The unit comprising the first illumination module 16A, the first light modulation unit 20A, and the first projection module 17A is called the first exposure module. Similarly, the unit comprising the second illumination module 16B, the second light modulation unit 20B, and the second projection module 17B is called the second exposure module. Each exposure module is positioned at different locations on the XY plane, allowing patterns to be exposed at different locations on the object to be exposed placed on the stage 14. By moving the stage 14 relative to the exposure modules in the X-axis direction, which is the scanning direction, the entire surface of the object to be exposed or the entire area of ​​the object to be exposed can be scanned and exposed. As can also be seen from Figure 1, the modules of the first illumination module 16A, the first projection module 17A, and the first light modulation unit 20A in Figure 2 are arranged in multiples along the Y-axis direction. Similarly, the modules of the second illumination module 16B, the second projection module 17B, and the second light modulation unit 20B in Figure 2 are arranged in multiples along the Y-axis direction. Similarly, the modules of the third illumination module 16C, the third projection module 17C, and the third light modulation unit 20C in Figure 2 are arranged in a row in the Y-axis direction. Similarly, the modules of the fourth illumination module 16D, the fourth projection module 17D, and the fourth light modulation unit 20D in Figure 2 are arranged in a row in the Y-axis direction.

[0021] The lighting module 16 is also referred to as the lighting system. The lighting module 16 (lighting system) illuminates the spatial light modulator 201 (spatial light modulation element) of the light modulation unit 20, which will be described later. The projection module 17 is also called the projection unit. The projection module 17 (projection unit) may be a 1:1 magnification system that projects the image of the pattern on the light modulation unit 20 at 1:1 magnification, or it may be an enlargement system or a reduction system. Furthermore, it is preferable that the projection module 17 is composed of one or two types of glass materials (particularly quartz or fluorite).

[0022] As shown in Figure 1, a pair of light source units 18 (light source unit R18R, light source unit L18L) are provided. The light source units 18 can include a light source unit using a highly coherent laser, a light source unit using a semiconductor laser type UV-LD, and a light source unit using a lens relay type retarder. The light source 18a in the light source unit 18 can be a lamp or laser diode emitting wavelengths such as 405 nm or 365 nm. The light source unit 18 may also include an optical distribution system that supplies illumination light (pulsed light) of approximately the same illuminance to each optical fiber 19.

[0023] In addition to the parts described above, the exposure apparatus 1 includes a position measurement unit (not shown) consisting of an interferometer and an encoder, which measures the relative position of the stage 14 with respect to the optical platen 15. In addition to the parts described above, the exposure apparatus 1 includes an AF (Auto Focus) unit 42 that measures the position of the stage 14 or the object to be exposed on the stage 14 in the Z-axis direction. Furthermore, the exposure apparatus 1 includes an alignment unit 41 that measures the relative position of each pattern when another pattern is superimposed on a pattern (underlayer) that has already been exposed on the object to be exposed. The AF unit 42 and / or the alignment unit 41 may be configured as a TTL (Through the lens) that measures via the projection module 17.

[0024] Figure 3 shows an overview of the configuration of the exposure module. Using the first exposure module as an example, a specific example of the configuration of the illumination module 16, the light modulation unit 20, and the projection module 17 will be described.

[0025] The lighting module 16 comprises a module shutter 161 and an illumination optical system 162. The module shutter 161 switches whether or not to guide pulsed light supplied from the optical fiber 19 to the illumination optical system 162.

[0026] The illumination optical system 162 illuminates the light modulation unit 20 almost uniformly by emitting pulsed light supplied from the optical fiber 19 to the light modulation unit 20 via a collimator lens 162A, a fly-eye lens 162C, a condenser lens 162E, and the like. The fly-eye lens 162C wavefront-splits the pulsed light incident on the fly-eye lens 162C, and the condenser lens 162E superimposes the wavefront-split light onto the light modulation unit. The illumination optical system 162 may also include a rod integrator instead of the fly-eye lens 162C. The illumination optical system 162 of this embodiment further includes a variable neutral density filter 162B, a variable aperture diaphragm 162D, and a plane mirror 162F. The variable neutral density filter 162B adjusts the exposure amount by attenuating the illuminance of the illumination light (pulsed light) incident on the fly-eye lens 162C. The variable aperture diaphragm 162D adjusts the size (diameter) of the nearly circular light source image formed on the exit side of the fly-eye lens 162C, thereby changing the illumination σ. The plane mirror 162F reflects the illumination light (pulsed light) from the condenser lens 162E so as to illuminate the spatial light modulator 201 at an angle.

[0027] The light modulation unit 20 is a spatial light modulator (SLM) that functions as a variable mask to dynamically and rapidly change the distribution of reflected light.

[0028] The light modulation unit 20 comprises a spatial light modulator 201 and an off-light absorbing plate 202. The spatial light modulator 201 is a digital mirror device (digital micromirror device, DMD). The spatial light modulator 201 can modulate illumination light spatially and temporally.

[0029] Figure 4 is a diagram illustrating the configuration of the spatial light modulator 201 of this embodiment. In this figure, a three-dimensional Cartesian coordinate system of Xm-Ym-Zm axes will be used for explanation. The spatial light modulator 201 comprises a plurality of micromirrors 203 (mirrors) arranged in the XmYm plane. The micromirrors 203 constitute the elements (pixels) of the spatial light modulator 201. The tilt angle of the micromirrors 203 can be changed around the Xm axis and the Ym axis, respectively. For example, as shown in Figure 5, the micromirrors 203 are turned on when tilted around the Ym axis, and as shown in Figure 6, they are turned off when tilted around the Xm axis.

[0030] The spatial light modulator 201 controls the reflection direction of incident light for each element by switching the tilt direction of each micromirror 203 according to the drawing data. For example, the digital micromirror device of the spatial light modulator 201 has a pixel count of about 4 megapixels and can switch the on and off states of the micromirrors 203 with a period of about 10 kHz. The spatial light modulator 201 has multiple elements that are individually controlled at predetermined time intervals. If the spatial light modulator 201 is a DMD, the elements are micromirrors 203, and the predetermined time interval is the period during which the on and off states of the micromirrors 203 are switched (for example, a period of 10 kHz).

[0031] Returning to Figure 3, the off-light absorbing plate 202 absorbs the light (off-light) emitted (reflected) from the elements of the spatial light modulator 201 that are in the off state. The light emitted from the elements of the spatial light modulator 201 that are in the on state is guided to the projection module 17.

[0032] The projection module 17 projects light emitted from the element of the spatial light modulator 201 that is turned on onto the object to be exposed. The projection module 17 includes a magnification adjustment unit 171 and a focus adjustment unit 172. Modulated light (modulated light) from the spatial light modulator 201 is incident on the magnification adjustment unit 171.

[0033] The magnification adjustment unit 171 adjusts the magnification of the imaging plane 163 of the modulated light emitted from the spatial light modulator 201 by driving some of the lenses in the optical axis direction. The imaging plane 163 is the imaging plane (best focus plane) that is conjugate to the overall reflective surface of the spatial light modulator 201, which is created by the projection module 17. In other words, the magnification adjustment unit 171 adjusts the magnification of the image on the surface of the object to be exposed 23.

[0034] The focus adjustment unit 172 drives the entire lens group in the optical axis direction to adjust the imaging position, or focus, so that the modulated light emitted from the spatial light modulator 201 is imaged on the surface of the object to be exposed, as measured by the AF unit 42 described above.

[0035] The projection module 17 projects only the image of light emitted from the ON-state elements of the spatial light modulator 201 onto the surface of the object to be exposed. Therefore, the projection module 17 can project an image of the pattern formed by the ON-state elements of the spatial light modulator 201 onto the surface of the object to be exposed. In other words, the projection module 17 can form spatially modulated light on the surface of the object to be exposed. Furthermore, as mentioned above, the spatial light modulator 201 can switch the ON and OFF states of the micromirror 203 at a predetermined period (frequency), so the projection module 17 can form temporally modulated light (i.e., modulated light in which the shape of brightness and darkness (light distribution) in the XY plane of the imaging light beam reflected by the spatial light modulator 201 and incident on the projection module 17 changes rapidly over time) on the surface of the object to be exposed. A variable aperture diaphragm 173 is provided at the pupil position of the projection module 17. This diaphragm is used to adjust (limit) the numerical aperture (NA) on the substrate 23 side of the imaging light beam reflected by the micromirror in the ON state of the spatial light modulator 201, thereby changing the resolution and depth of focus (DOF). The variable aperture diaphragm 162D and the variable aperture diaphragm 173 are optically nearly conjugate.

[0036] In the spatial light modulator 201 shown in Figures 4 to 6, the Xm axis is parallel to the X axis, and the Ym axis is parallel to the Y axis. As a result, the ON-state micromirror 203 (micromirror 203 tilted around the Ym axis) is tilted with respect to the X axis direction, which is the scanning direction.

[0037] The Ym axis is also called the first tilt axis T1. In the spatial light modulator 201, multiple micromirrors 203 each rotate around the first tilt axis T1 (Ym axis), and the multiple micromirrors 203 adjust their tilt relative to the scanning direction to turn on, thereby emitting light to the projection module 17. In the spatial light modulator 201, multiple micromirrors 203 are arranged linearly in the scanning direction, and multiple micromirrors 203 are also arranged in the direction of the first tilt axis T1.

[0038] As shown in Figure 2, the control unit 21 is composed of a computer having, for example, a CPU or other arithmetic unit and a memory unit. The computer controls each part of the exposure apparatus 1 according to a program that executes the control of each part that operates in the exposure process. The control unit 21 controls, for example, the operation of the illumination module 16, the light modulation unit 20, the projection module 17, and the stage 14.

[0039] The storage unit is configured using a computer-readable storage medium such as memory. The storage unit stores various information related to the exposure process. For example, the storage unit stores information related to the exposure pattern during the exposure process (drawing data information, recipe information such as target exposure amount and scanning exposure sequence). The storage unit stores information input via, for example, the communication unit or input unit. The communication unit is configured to include a communication interface for connecting the exposure device to an external device. The input unit is configured to include input devices such as a mouse, keyboard, or touch panel. The input unit receives various types of information input to the exposure device.

[0040] [Exposure method] The control unit 21 controls the exposure of the object to be exposed 23 so that the first and second steps shown below are executed. Stage 14 moves the object to be exposed relative to the exposure module in a predetermined scanning direction. As a result, the light irradiated by the exposure module scans the object to be exposed based on the exposure pattern information stored in the memory unit, and a predetermined exposure pattern is formed.

[0041] (1st step) Figure 7A is a schematic plan view showing an example of an exposure pattern when the pattern to be exposed is exposed twice. As shown in Figure 7A, the projection module 17 of each exposure module moves the object to be exposed (substrate) 23 along the movement trajectory Sa to perform the exposure process (first exposure) and form a first exposure pattern on the substrate 23. The movement trajectory Sa proceeds linearly to the right in Figure 7A, then reverses direction and proceeds to the left, completing one or more round trip paths. The pattern formed as a latent image in the resist layer of the substrate 23 by the first exposure along the movement trajectory Sa in Figure 7A is called the first exposure pattern P1. In Figure 7A, the movement trajectory Sa (first exposure pattern P1) is shown as a solid line. In the second exposure, the substrate 23 is moved along a movement trajectory Sb that overlaps with the movement trajectory Sa. The pattern exposed in the second exposure is called the second exposure pattern P2.

[0042] Figure 7B is an explanatory diagram specifically showing one example of the arrangement of multiple exposure modules. Figure 7C is an explanatory diagram specifically showing another example of the arrangement of multiple exposure modules, different from that in Figure 7B. Based on the arrangements in Figures 1 and 2, a specific example of the arrangement of multiple exposure modules will be explained using Figures 7B and 7C. In Figure 7B, reference numerals 17A, 17B, 17C, and 17D indicate projection modules, and reference numerals 201a, 201b, 201c, and 201d indicate the projection area (projection image range) of the spatial light modulator 201 projected onto the substrate 23 (on the imaging surface 163) by each projection module.

[0043] Each rectangular projection area 201a to 201d is set to be tilted in the XY plane. In this arrangement, a single scanning movement of the substrate 23 in the X direction allows for continuous exposure across the entire width in the Y direction. In the arrangement shown in Figure 7B, a first exposure is performed by scanning in the +X direction, and then a second exposure is performed by scanning in the -X direction without changing the position of the substrate 23 in the Y direction.

[0044] Furthermore, as shown in Figure 7C, a sequential exposure mode using only one row of projection modules 17A is also possible. In this case, the substrate 23 is moved using a scan and step method as follows: scanning movement Xa in the +X direction, step movement Ya in the Y direction, scanning movement Xb in the -X direction, step movement Yb in the Y direction, scanning movement Xc in the +X direction, step movement Yc in the Y direction, scanning movement Xd in the -X direction, etc. Between each of the scanning movements Xa, Xb, Xc, and Xd, patterns corresponding to each region may be exposed.

[0045] Even when using only two rows of projection modules 17A and 17B from the arrangement shown in Figure 7B, continuous exposure may be performed with one round trip of scanning movement Xa in the +X direction, step movement Ya in the Y direction, and scanning movement Xb in the -X direction. In this case, scanning movements Xa, Xb, Xc, Xd and step movements Ya, Yb, Yc correspond to the movement trajectories Sa and Sb in Figure 7A.

[0046] When exposing the entire pattern by scanning or stepping the substrate 23 in the +X (or -X) direction, as shown in Figure 7B or Figure 7C, the amount of exposure (DOSE) applied to the resist on the substrate 23 can be increased by making the movement trajectory of the substrate 23 (stage 14) during the first exposure the same as the movement trajectory of the substrate 23 (stage 14) during the second exposure, and by making the patterns generated by each spatial light modulator 201 the same in the first and second exposures.

[0047] If the exposure amount is to be changed between the first and second exposures, the illuminance can be adjusted using the variable neutral density filter 162B in Figure 3, or the illuminance sent to the optical fiber 19 within the light source unit 18 can be adjusted. This makes it possible to use low-sensitivity resists or to intentionally change the line width of the resist pattern after exposure and development.

[0048] Furthermore, the line width may be intentionally varied by shifting the movement trajectory of the first exposure and the movement trajectory of the second exposure in the X or Y direction by an amount smaller than the designed line width exposed on the substrate 23. In other words, the line width may be intentionally varied by making small XY movements of each spatial light modulator 201 or by making small changes to the movement trajectory of the stage 14. In this case, the drawing data of the pattern to be exposed can be the same for the first exposure and the second exposure, so the process of partially modifying and correcting the drawing data for the second exposure relative to the drawing data for the first exposure can be omitted, enabling precise exposure amount control and line width control, as well as improving productivity.

[0049] (2nd process) The control unit 21 (see Figure 2) controls the operation of the illumination module 16, the light modulation unit 20, the projection module 17, and the stage 14 so as to repeat the formation of the same exposure pattern multiple times. Specifically, the exposure process (second exposure) of the object to be exposed 23 is performed so as to form the same movement trajectory Sb as the movement trajectory Sa in the first exposure. The movement trajectory Sa in the first exposure and the movement trajectory Sb in the second exposure are, for example, patterns of the same shape and size. In the second step, the second exposure is performed based on the same information as the information regarding the movement trajectory Sa used in the first step. The exposure conditions in the second step may be the same as those in the first step. The pulse emission timing of the exposure module, the movement speed of the stage 14, etc., are the same in the first and second steps. Therefore, the exposure processing data used in the first step can be used in the second step. In Figure 7A, the movement trajectory Sb (second exposure pattern P2) is shown by a dashed line.

[0050] The movement trajectory Sa of the first exposure pattern P1 and the movement trajectory Sb of the second exposure pattern P2 are irradiated onto the object to be exposed 23 in such a way that at least a portion of them overlap. Therefore, the object to be exposed 23 is exposed multiple times (more specifically, twice). The movement trajectories Sa and Sb may be irradiated onto the object to be exposed 23 in such a way that they completely overlap, or they may be irradiated onto the object to be exposed 23 in such a way that only a portion of them overlap.

[0051] The number of repetitions of the exposure pattern may be multiple (any number of two or more). Preferably, the exposure target is illuminated such that two or more of these movement trajectories overlap at least partially. For example, movement trajectory Sb may be a pattern corresponding to a part of movement trajectory Sa (for example, only the first half).

[0052] The second exposure pattern P2 only needs to be formed based on at least a portion of the information regarding the movement trajectory Sa used to form the first exposure pattern P1. In other words, at least a portion of the information regarding the exposure pattern (movement trajectory Sa) can be used multiple times. In the second step, by using at least a portion of the information regarding the movement trajectory Sa used to form the first exposure pattern P1, the effect of suppressing the increase in the amount of data in the storage unit (memory, etc.) can be obtained. Note that the exposure conditions in the second step do not have to be exactly the same as the exposure conditions in the first step.

[0053] For example, the exposure conditions for the first step and the exposure conditions for the second step may have different focus. For example, the first exposure pattern P1 may be defocused, and the second exposure pattern P2 may be in best focus. The first exposure pattern may be defocused towards either the projection module 17 side or the exposure target (substrate 23) side, and the second exposure pattern may be defocused towards the other of either the projection module 17 side or the exposure target (substrate 23) side. The focus can be adjusted by the focus adjustment unit 172 (see Figure 3). This ensures sufficient depth of field.

[0054] In addition to the exposure conditions mentioned above, at least one of the following may be differed between the first and second steps: exposure amount, telecentricity, polarization direction (circular or linear polarization), exposure wavelength, scanning speed, scanning direction inclination, illumination σ (numerical aperture of the illumination optical system / numerical aperture of the projection optical system), light intensity distribution at the pupil position of the illumination optical system (deformed illumination), and exposure position. For example, by appropriately differentiating the exposure amount between the first and second steps, even materials that exhibit a nonlinear response to the exposure amount, such as nonlinear resists, can be suitably exposed. For example, by appropriately differentiating the telecentricity between the first and second steps, telecentric errors can be reduced. For example, by appropriately differentiating the exposure wavelength between the first and second steps, speckle and standing wave effects can be suppressed. For example, by appropriately differentiating the scanning speed and scanning direction inclination between the first and second steps, the contrast of the pattern can be averaged. For example, by appropriately differentiating the light intensity distribution (annular distribution, quadrupole distribution, bipolar distribution, etc.) at the pupil position of the illumination σ and illumination optical system between the first and second steps, the dose amount can be adjusted and the imaging state can be changed. For example, by appropriately differentiating the exposure position between the first and second steps (for example, shifting the exposure position by half a pixel pitch of the DMD), the resolution can be improved and speckle can be suppressed.

[0055] In either the first or second step, a portion of the optical path of the illumination optical system may be shielded by a light-shielding member. For example, if a module shutter 161 is used as the light-shielding member, the overall illuminance will be reduced, resulting in a pattern with a changed line width. Alternatively, if the light-shielding member is placed between the plane mirror 162F and the spatial light modulator 201, the illuminance will be partially reduced, resulting in a pattern with a changed line width. This results in patterns that are different from the first exposure pattern P1 and the second exposure pattern P2. For example, in the second step, a second exposure pattern P2 different from the first exposure pattern P1 can be obtained by shielding a portion of the optical path of the illumination optical system using a light-shielding member. Even in this case, the exposure processing data used in the first step can be used in the second step, thus suppressing an increase in the amount of data in the storage unit (memory, etc.).

[0056] In the exposure apparatus 1, the object to be exposed 23 is exposed using at least a portion of the exposure pattern information stored in the memory unit multiple times. In the second step, the exposure processing data used in the first step can be utilized, thus reducing the amount of data in the memory unit (such as the memory) of the control unit 21. Therefore, the exposure apparatus 1 can handle a variety of exposure processes without putting a strain on the capacity of the memory unit of the control unit 21.

[0057] In the exposure apparatus 1, the object to be exposed 23 is irradiated such that the first exposure pattern P1 and the second exposure pattern P2 overlap in at least a portion of each other, so that high-dose exposure can be achieved in the region where the first exposure pattern P1 and the second exposure pattern P2 overlap. In the exposure apparatus 1, exposure processing that averages out exposure unevenness for each exposure pattern is possible by multiple exposures that overlap in at least a portion of each other.

[0058] In the exposure method using the exposure apparatus 1, the object to be exposed 23 is exposed by using at least a portion of the exposure pattern information stored in the memory unit multiple times. In the second step, the exposure processing data used in the first step can be used, thus reducing the amount of data in the memory unit (memory, etc.) of the control unit 21. Therefore, the exposure apparatus 1 can handle a variety of exposure processes without putting a strain on the capacity of the memory unit of the control unit 21.

[0059] In this exposure method, the object to be exposed 23 is irradiated such that the first exposure pattern P1 and the second exposure pattern P2 overlap in at least part of their respective regions. Therefore, high-dose exposure can be achieved in the region where the first exposure pattern P1 and the second exposure pattern P2 overlap. This exposure method allows for exposure processing that averages out exposure unevenness for each exposure pattern through multiple exposures that overlap in at least part of their respective regions.

[0060] A set of data corresponding to all patterns exposed by each of the projection regions 201a, 201b, 201c, and 201d shown in Figures 7B and 7C is applied at high speed to the spatial light modulator 201 while the substrate 23 is scanned in the X direction. By partially turning off the application of this set of data during the scanning movement, it is possible to turn off multiple exposure (double exposure) in some areas of the substrate 23. That is, a portion of the first exposure pattern (P1) formed in the first exposure is multiple-exposed in the second exposure with a second exposure pattern (P2) of the same shape.

[0061] The exposure apparatus 1 may be equipped with a master clock (an oscillator that emits the master clock) (not shown) that serves as a reference for synchronization. In the exposure apparatus 1, devices such as the stage 14, illumination module 16, projection module 17, and light modulation unit 20 may be driven with reference to the master clock. The control unit 21 can control the operation of each device with reference to the master clock. By referencing the master clock, the operating timing of each device is individually and appropriately adjusted, and the relationship of the operating timings between multiple devices is appropriately set.

[0062] Figure 8 is a schematic plan view showing a second example of an exposure pattern. As shown in Figure 8, the first exposure pattern P11 and the second exposure pattern P12 have the same shape (rectangular) and the same size. The first exposure pattern P11 and the second exposure pattern P12 are in different positions but overlap in some areas.

[0063] In this example, since the first exposure pattern P11 and the second exposure pattern P12 are the same pattern, the data used in the first step can be used in the second step. Therefore, the amount of data in the storage unit (memory, etc.) of the control unit 21 can be reduced. Since the first exposure pattern P11 and the second exposure pattern P12 are irradiated onto the object to be exposed in such a way that they partially overlap, high-dose exposure can be achieved.

[0064] Figure 9 is a schematic plan view showing a third example of an exposure pattern. As shown in Figure 9, the first exposure pattern P21 and the second exposure pattern P22 have the same shape (rectangular), but the second exposure pattern P22 is smaller in size. The first exposure pattern P21 encompasses the second exposure pattern P22.

[0065] In this example, since the first exposure pattern P21 and the second exposure pattern P22 have the same shape (similar shape), the data used in the first step can be used in the second step. Therefore, the amount of data in the memory of the control unit 21 can be reduced. Since the first exposure pattern P21 and the second exposure pattern P22 are irradiated onto the object to be exposed in such a way that they partially overlap, high-dose exposure can be achieved.

[0066] Figure 10 is a schematic plan view showing a fourth example of an exposure pattern. As shown in Figure 10, the first exposure pattern P31 and the second exposure pattern P32 have the same shape (rectangular), but the second exposure pattern P32 is smaller in size. The second exposure pattern P32 encompasses the four corners of the first exposure pattern P31.

[0067] In this example, the first exposure pattern P31 produced by the first exposure and the second exposure pattern P32 produced by the second exposure have the same arrangement shape (similar shape), so the data used in the first step can be used in the second step. However, the second exposure pattern P32 in Figure 10 is exposed using drawing data that has been partially modified using the drawing data of the first exposure pattern P31 so that only the rectangular pixel groups located at each of the four corners are turned on. Therefore, the amount of data in the memory (such as the storage unit) of the control unit 21 can be suppressed. Since the first exposure pattern P31 and the second exposure pattern P32 are irradiated onto the object to be exposed in such a way that they partially overlap, high-dose exposure can be achieved at the four overlapping corners. In addition, in the case of Figure 10, the exposure conditions (at least one of the following, such as exposure amount, focus position, numerical aperture of the projection module 17, illumination σ value, telecentricity, polarization direction, exposure wavelength, scanning speed, tilt of the scanning direction, and light intensity distribution at the pupil position of the illumination optical system) can be made different for the first exposure and the second exposure.

[0068] The exposure apparatus 1 may perform continuous exposure using one projection module 17 (for example, the first projection module 17A) and another projection module 17 (for example, the second projection module 17B).

[0069] [Manufacturing methods for electronic devices] The exposure apparatus 1 can manufacture electronic devices such as liquid crystal display devices (flat panel displays) using the exposure method described above.

[0070] Furthermore, all disclosures of the published U.S. patent applications and U.S. patent specifications relating to the exposure apparatus and the like cited in the above embodiments are incorporated herein by reference as part of this specification.

[0071] Although one embodiment of this invention has been described in detail above with reference to the drawings, the specific configuration is not limited to that described above, and various design changes can be made without departing from the spirit of this invention. [Explanation of Symbols]

[0072] 1. Exposure apparatus 14 stages 17. Projection Module (Projection Optical System) 21 Control Unit 162 Illumination optical system 201 Spatial Light Modulator P1 First exposure pattern P2 Second exposure pattern

Claims

1. An exposure module system includes a spatial light modulator that forms a light intensity distribution, and exposes a resist layer on a substrate with light from the spatial light modulator, A stage on which the substrate can be placed and on which the substrate can be moved in the scanning direction relative to the exposure module system, The system includes a control unit that controls exposure to the resist layer, The control unit controls a first step of performing a first exposure to the resist layer, and a second step performed after the first step of performing a second exposure to the resist layer. Each of the first and second steps is: Move the stage on which the substrate is mounted from one side to the other side in the scanning direction relative to the spatial light modulator, such that light from the exposure module system is irradiated onto a first region extending in the scanning direction in the resist layer. After moving the stage on which the substrate is placed from one side to the other side in the scanning direction, move the stage on which the substrate is placed in a direction intersecting the scanning direction, and The process includes moving the stage on which the substrate is mounted in a direction intersecting the scanning direction, and then moving the stage on which the substrate is mounted from the other side to the one side of the scanning direction relative to the spatial light modulator, such that light from the exposure module system is irradiated onto a second region in the resist layer that extends in the scanning direction and includes an overlapping region that overlaps with the first region and a region other than the overlapping region. Exposure apparatus.

2. The exposure module system includes a variable light-reducing filter with adjustable illuminance, The spatial light modulator is positioned such that light that has passed through the variable dimming filter is directed onto the spatial light modulator. In each of the first and second steps, the illuminance is adjustable. The exposure apparatus according to claim 1.

3. Exposure of a dose that cannot be achieved by the first step alone is achieved by performing the first and second steps. The exposure apparatus according to claim 2.

4. The aforementioned exposure module system is First spatial light modulator, A first projection optical system that projects light from the first spatial light modulator onto the resist layer, The second spatial light modulator, The system includes a second projection optical system that projects light from the second spatial light modulator onto the resist layer, Each of the first and second steps is: Move the stage on which the substrate is placed from one side to the other side in the scanning direction relative to the first spatial light modulator and the second spatial light modulator, such that the first region is illuminated with light from the first projection optical system and light from the second projection optical system. After moving the stage on which the substrate is placed from one side to the other side in the scanning direction, move the stage on which the substrate is placed in a direction intersecting the scanning direction, and This includes moving the stage on which the substrate is mounted in a direction intersecting the scanning direction, and then moving the stage on which the substrate is mounted from the other side of the scanning direction to the one side of the scanning direction relative to the first spatial light modulator and the second spatial light modulator, so that the second region is illuminated with light from the first projection optical system and light from the second projection optical system. An exposure apparatus according to any one of claims 1 to 3.

5. The aforementioned exposure module system is First spatial light modulator, The system includes a first projection optical system that projects light from the first spatial light modulator onto the resist layer, Each of the first and second steps is: Move the stage on which the substrate is placed from one side to the other side in the scanning direction relative to the first spatial light modulator, such that light from the first projection optical system is irradiated onto the first region. After moving the stage on which the substrate is placed from one side to the other side in the scanning direction, move the stage on which the substrate is placed in a direction intersecting the scanning direction, and This includes moving the stage on which the substrate is mounted in a direction intersecting the scanning direction, and then moving the stage on which the substrate is mounted from the other side to the one side of the scanning direction relative to the first spatial light modulator, so that light from the first projection optical system is irradiated onto the second region. An exposure apparatus according to any one of claims 1 to 3.

6. The exposure module system includes a projection optical system, The spatial light modulator includes a plurality of tiltable mirrors, each capable of taking on multiple states. Light from the first mirror among the plurality of mirrors is incident on the projection optical system. Light from the second-state mirror among the plurality of mirrors is incident on an area other than the projection optical system. An exposure apparatus according to any one of claims 1 to 3.

7. Includes a light source unit that supplies pulsed light, The spatial light modulator is positioned such that the pulsed light is irradiated onto the spatial light modulator. In both the first and second steps, the timing of the emission of the pulsed light is the same. An exposure apparatus according to any one of claims 1 to 3.

8. Includes a storage device that stores data on the arrangement or shape of the exposure pattern, The control unit controls the first process using the data, and controls the second process using the data. An exposure apparatus according to any one of claims 1 to 3.

9. The control unit shifts the exposure position in the second step relative to the exposure position in the first step. The shift in the exposure position is at most half the pixel pitch of the spatial light modulator. An exposure apparatus according to any one of claims 1 to 3.

10. The positional difference between the exposure movement trajectory in the first step and the exposure movement trajectory in the second step is smaller than the design line width of the pattern exposed on the resist layer. An exposure apparatus according to any one of claims 1 to 3.

11. The control unit exposes the subject in at least one of the first and second steps in such a way that it achieves the best focus. An exposure apparatus according to any one of claims 1 to 3.

12. The control unit makes the telecentricity in the second step different from the telecentricity in the first step. An exposure apparatus according to any one of claims 1 to 3.

13. The exposure apparatus according to claim 4, wherein the control unit makes one or more of the following different in the first and second steps: exposure amount, polarization direction, exposure wavelength, scanning speed, inclination of scanning direction, and illumination σ.

14. An exposure module system includes a spatial light modulator that forms a light intensity distribution, and exposes a resist layer on a substrate with light from the spatial light modulator, A method for controlling an exposure apparatus, comprising: a stage on which the substrate can be placed and which can move the substrate in a scanning direction relative to the exposure module system, A first step of performing a first exposure on the resist layer, The process includes a second step, which is performed after the first step, and involves a second exposure of the resist layer, Each of the first and second steps is: Move the stage on which the substrate is mounted from one side to the other side in the scanning direction relative to the spatial light modulator, such that light from the exposure module system is irradiated onto a first region extending in the scanning direction in the resist layer. After moving the stage on which the substrate is placed from one side to the other side in the scanning direction, move the stage on which the substrate is placed in a direction intersecting the scanning direction, and The process includes moving the stage on which the substrate is mounted in a direction intersecting the scanning direction, and then moving the stage on which the substrate is mounted from the other side to the one side of the scanning direction relative to the spatial light modulator, such that light from the exposure module system is irradiated onto a second region in the resist layer that extends in the scanning direction and includes an overlapping region that overlaps with the first region and a region other than the overlapping region. Control method.

15. The exposure module system includes a variable light-reducing filter with adjustable illuminance, The spatial light modulator is positioned such that light that has passed through the variable dimming filter is directed onto the spatial light modulator. In each of the first and second steps, the illuminance is adjustable. The control method according to claim 14.

16. Exposure of a dose that cannot be achieved by the first step alone is achieved by performing the first and second steps. The control method according to claim 15.

17. Before starting exposure in the second step, the stage is moved so that the position on the first region where exposure is to be started in the second step overlaps with the position on the first region where exposure is to be started in the first step. The control method according to claim 14.

18. The position on the first region where exposure is started in the second step and the position on the first region where exposure is started in the first step are offset in a direction intersecting the scanning direction. The control method according to claim 14.

19. The spatial light modulator is positioned such that pulsed light from the light source unit irradiates the spatial light modulator. In both the first and second steps, the timing of the emission of the pulsed light is the same. The control method according to any one of claims 14 to 18.

20. The first step is performed using data on the arrangement or shape of the exposure pattern, and the second step is performed using the data. The control method according to any one of claims 14 to 18.

21. The exposure position in the second step is shifted relative to the exposure position in the first step. The shift in the exposure position is at most half the pixel pitch of the spatial light modulator. The control method according to any one of claims 14 to 18.

22. The positional difference between the exposure movement trajectory in the first step and the exposure movement trajectory in the second step is smaller than the design line width of the pattern exposed on the resist layer. The control method according to any one of claims 14 to 18.

23. In at least one of the first and second steps, exposure is performed to achieve best focus. The control method according to any one of claims 14 to 18.

24. The telecentricity in the second step is made different from the telecentricity in the first step. The control method according to any one of claims 14 to 18.

25. The control method according to any one of claims 14 to 18, wherein in the first and second steps, one or more of the exposure amount, polarization direction, exposure wavelength, scanning speed, tilt of the scanning direction, and illumination σ are made different.

26. A method for manufacturing an electronic device, comprising exposing the resist layer by a control method described in any one of claims 14 to 18.

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