Solvent composition containing hexafluoroisopropanol

Abstract

To provide a solvent composition that has excellent resin solubility and high safety, or to provide a simple and efficient new application for resin solvents. [Solution] The present invention relates to a solvent composition comprising (A) 1,1,1,3,3,3-hexafluoroisopropanol and (B) a halogenated organic compound, wherein the (B) halogenated organic compound is one or more selected from the group consisting of (b1) fluorine-containing olefin, (b2) hydrofluoroether (excluding (b1) fluorine-containing olefin), (b3) hydrofluorocarbon, (b4) hydrobromocarbon, (b5) perfluoropolyether, (b6-1) p-chlorobenzotrifluoride and (b6-2) trans-1,2-dichloroethylene, a solvent composition, a resin solvent using the solvent composition, and a resin adhesive, clearing agent, coating agent, liquid chromatography method, release agent and cleaning agent using the (A) component or the solvent composition.

Description

Technical Field

[0001] The present invention relates to a solvent composition containing hexafluoroisopropanol.

Background Art

[0002] Currently, in applications such as resin molding and adhesion, a method of dissolving a resin in a good solvent to form a solution is widely used. Patent Document 1 discloses a mixed solvent composed of hexafluoroisopropanol (HFIP) and methylene chloride as a solvent for dissolving peptides.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] <The First Problem of the Present Invention> However, methylene chloride combined with hexafluoroisopropanol (HFIP) as described in Patent Document 1 has a problem of high harmfulness to the human body and concerns about safety. In addition to such concerns, high dissolution and other effects are required in terms of the performance as a solvent. Therefore, the first object of the present invention is to solve the above problems and provide a solvent composition that is excellent in resin solubility and has high safety.

[0005] <The Second Problem of the Present Invention> However, since methylene chloride falls under the Specified Chemical Substances Control Law (Specified Substances Law), there are problems in terms of working environment, handling, and labor management. Therefore, the second object of the present invention is to solve the above problems and provide a new use using a resin solvent that is simple and efficient.

[0006] The first aspect of the present invention has the following configuration. [1] A solvent composition comprising (A) 1,1,1,3,3,3-hexafluoroisopropanol and (B) a halogenated organic compound, wherein the (B) halogenated organic compound is one or more selected from the group consisting of (b1) fluorine-containing olefin, (b2) hydrofluoroether (excluding (b1) fluorine-containing olefin), (b3) hydrofluorocarbon, (b4) hydrobromocarbon, (b5-1) p-chlorobenzotrifluoride and (b5-2) trans-1,2-dichloroethylene. [2](b1)Fluorine-containing olefins are (b1-1) cis-1-chloro-3,3,3-trifluoropropene, (b1-2) (E)-1-chloro-2,3,3-trifluoropropene, (b1-3) (Z)-1-chloro-2,3,3-trifluoropropene, (b1-4) (Z)-1,1,1,4,4,4-hexafluoro-2-butene, (b1-5) Methoxyperfluoroheptene, (b1-6) 1,1-dichloro-3,3,3-trifluoropropene, (b1 A solvent composition of [1], which is one or more selected from the group consisting of (b1-7) 1,2-dichloro-3,3,3-trifluoropropene, (b1-8) 1-chloro-1,3,3-trifluoropropene, (b1-9) (Z)-1-chloro-2,3,3,4,4,5,5-heptafluoro-1-pentene, (b1-10) (E)-1-chloro-2,3,3,4,4,5,5-heptafluoro-1-pentene and (b1-11) 1,3-dichloro-3,3-difluoropropene. [3] (b2) Hydrofluoroethers (excluding (b1) fluorinated olefins) are (b2-1) 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether, (b2-2) methyl nonafluorobutyl ether, (b2-3) methyl nonafluoroisobutyl ether, (b2-4) ethyl nonafluoroisobutyl ether, (b2-5) ethyl nonafluorobutyl ether, (b2-6) 1,1,1,2,2,3,4,5,5,5 A solvent composition of [1] or [2], which is one or more selected from the group consisting of -decafluoro-3-methoxy-4-(trifluoromethyl)-pentane, (b2-7)1,1,1,2,3,3-hexafluoro-4-(1,1,2,3,3,3-hexafluoropropoxy)pentane, (b2-8)1,1,1,2,3,4,4,4-octafluoro-2-methoxy-3-(trifluoromethyl)butane, and (b2-9)methyl perfluoropropyl ether. [4](b3)A solvent of any of [1] to [3], wherein the hydrofluorocarbon is one or more selected from the group consisting of (b3-1)1,1,1,3,3-pentafluorobutane, (b3-2)1,1,1,2,2,3,4,5,5,5-decafluoropentane, (b3-3)1,1,2,2,3,3,4-heptafluorocyclopentane, (b3-4)1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorooctane, (b3-5)1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane and (b3-6)1,1,1,2,2,3,3,4,4-nonafluorohexane. [5] A solvent composition according to any of [1] to [4], wherein (b4) hydrobromocarbon is one or more selected from the group consisting of (b4-1) 1-bromopropane and (b4-2) isobutyl bromide. A solvent for resins using one of the solvent compositions [6][1] to [5]. [7] A solvent for the resin of [6], wherein the resin is one or more selected from the group consisting of polyester resin, polyamide resin, acrylic resin, polycarbonate resin, polylactic acid resin, acrylonitrile-butadiene-styrene resin, urethane resin, polyacetal resin, styrene resin, fluororesin, polyphenylene ether resin, and polyetherimide resin.

[0007] The second aspect of the present invention has the following configuration. [8] A resin adhesive using (A) 1,1,1,3,3,3-hexafluoroisopropanol or any of the solvent compositions [1] to [5], wherein the adhesive is used to form an adhesive portion by dissolving the surface of the resin with (A) 1,1,1,3,3,3-hexafluoroisopropanol or any of the solvent compositions [1] to [5], and to bond to another substrate via the adhesive portion. [9] A method for manufacturing an adhesive, comprising: step (A1): applying (A) 1,1,1,3,3,3-hexafluoroisopropanol or any solvent composition from [1] to [5] to a substrate containing one resin to form an adhesive portion; and step (B1): laminating a substrate containing the other resin to bond the substrates together via the adhesive portion.

[10] (A) A resin clearing agent using a solvent composition of any of [1] to [5], comprising the step of applying the clearing agent to the surface of the resin to dissolve the surface of the resin and removing the solvent portion of the clearing agent. A method for making a resin transparent using the transparentizing agent of

[11]

[10] , comprising the step of applying the transparentizing agent to the surface of the resin to dissolve the surface of the resin and remove the solvent portion of the transparentizing agent, wherein the method of applying the transparentizing agent is a method of contacting the transparentizing agent with vapor or a method of coating the transparentizing agent.

[12] A method for dissolving a resin, characterized by dissolving the resin by bringing the vapor of (A) 1,1,1,3,3,3-hexafluoroisopropanol or any of the solvent compositions [1] to [5] into contact with the resin.

[13] A method for dissolving a resin, characterized by dissolving the resin by applying (A) 1,1,1,3,3,3-hexafluoroisopropanol or any of the solvent compositions from [1] to [5] to the surface of the resin.

[14] (A)A resin coating agent in which a resin is dissolved in 1,1,1,3,3,3-hexafluoroisopropanol or any of the solvent compositions [1] to [5].

[15] A method for manufacturing a resin-coated substrate, comprising: step (C1): applying the resin coating agent of

[14] to a substrate to obtain a resin-coated substrate; and step (D1): removing the solvent portion of the coating agent from the resin-coated substrate to obtain a resin-coated substrate.

[16] (A)A resin adhesive in which a resin is dissolved in any of the solvent compositions of [1] to [5], or 1,1,1,3,3,3-hexafluoroisopropanol.

[17] A method for manufacturing an adhesive, comprising the steps of: (E1) applying the adhesive

[16] to one substrate; and (F1) laminating the other substrate and bonding the substrates together via the adhesive.

[18] (A) A liquid chromatography method characterized by performing liquid chromatography of a resin using 1,1,1,3,3,3-hexafluoroisopropanol or any of the solvent compositions from [1] to [5] as a mobile phase.

[19] (A) A liquid chromatography method characterized by dissolving a resin, which is an analytical sample, with a solvent composition of any of [1] to [5], such as 1,1,1,3,3,3-hexafluoroisopropanol.

[20] The liquid chromatography method of

[18] or

[19] , wherein the liquid chromatography method is size exclusion chromatography.

[21] (A)A resin release agent using 1,1,1,3,3,3-hexafluoroisopropanol or any of the solvent compositions [1] to [5].

[22] A release agent according to

[21] , wherein the resin is one or more selected from the group consisting of polyester resin, polyamide resin, acrylic resin, polycarbonate resin, polylactic acid resin, acrylonitrile-butadiene-styrene resin, urethane resin, polyacetal resin, styrene resin, fluororesin, polyphenylene ether resin, and polyetherimide resin.

[23] (A)A cleaning agent for removing resin from an object to be cleaned that has resin attached to it, using a solvent composition of 1,1,1,3,3,3-hexafluoroisopropanol or any of [1] to [5]. [Effects of the Invention]

[0008] The first aspect of the present invention provides a solvent composition that exhibits excellent resin solubility and higher safety compared to existing mixed solvents. Furthermore, the second aspect of the present invention provides a new application for resin solvents that is simple and efficient. [Modes for carrying out the invention]

[0009] (Definition of terms) "(A) 1,1,1,3,3,3-hexafluoroisopropanol" is sometimes referred to as "(A)" or "component (A)". The same applies to other components such as "(B) halogenated organic compounds". Regarding numerical ranges, "~" means that the values ​​at both ends are included. That is, "70~90 parts by weight" means "70 parts by weight or more and 90 parts by weight or less." Also, "or less" means "the same or less," and "or more" means "the same or greater."

[0010] 1. The First Invention [First solvent composition] The first solvent composition contains (A) 1,1,1,3,3,3 - hexafluoroisopropanol and at least one (B) halogen - based organic compound selected from the group consisting of (b1) fluorinated olefin, (b2) hydrofluoroether (excluding fluorinated olefin of (b1)), (b3) hydrofluorocarbon, (b4) hydrobromocarbon, (b5) perfluoropolyether, (b6 - 1) p - chlorobenzotrifluoride, and (b6 - 2) trans - 1,2 - dichloroethylene.

[0011] Since the (A) component and the (B) component do not fall under the specialization rule, they are excellent in safety. Also, in some embodiments of the first solvent composition, it may be equal to or higher than the drying property of the (A) component alone.

[0012] <(A) 1,1,1,3,3,3 - hexafluoroisopropanol> The (A) component is the main component of the solvent composition. 1,1,1,3,3,3 - hexafluoroisopropanol is also called HFIP (hexafluoroisopropanol) and 1,1,1,3,3,3 - hexafluoro - 2 - propanol.

[0013] <(B) halogen - based organic compound> The (B) component is one or more selected from the group consisting of (b1) fluorinated olefin, (b2) hydrofluoroether (excluding fluorinated olefin of (b1)), (b3) hydrofluorocarbon, (b4) hydrobromocarbon, (b5) perfluoropolyether, (b6 - 1) p - chlorobenzotrifluoride, and (b6 - 2) trans - 1,2 - dichloroethylene. The (B) component is a component that imparts the solubility and / or drying property of the resin and safety to the solvent composition containing the (A) component.

[0014] ≪(b1) fluorinated olefin≫ (b1) The fluorine-containing olefin is a fluoroolefin compound that may contain one or more atoms selected from the group consisting of chlorine atoms and bromine atoms, and may be substituted with an alkoxy group. The number of carbon atoms in component (b1) is preferably 3 to 8, and particularly preferably 3 to 7. The number of unsaturated bonds in component (b1) is preferably 1 or more, and particularly preferably 1 to 2. Furthermore, component (b1) may be a hydrochlorofluoroolefin compound that contains a hydrogen atom and a chlorine atom but does not contain a bromine atom, or it may be a hydrofluoroolefin that contains a hydrogen atom but does not contain a chlorine atom or a bromine atom. (b1) The components are (b1-1) cis-1-chloro-3,3,3-trifluoropropene (HCFO-1233zd(Z)), (b1-2) (E)-1-chloro-2,3,3-trifluoropropene ((E)-1-chloro-2,3,3-trifluoro-1-propene, HCFO-1233yd(E)), (b1-3) (Z)-1-chloro-2,3,3-tri Fluoropropene ((Z)-1-chloro-2,3,3-trifluoro-1-propene, HCFO-1233yd(Z)), (b1-4)(Z)-1,1,1,4,4,4-hexafluoro-2-butene (HCFO-1336mzz(Z)), (b1-5)Methoxyperfluoroheptene (Methoxytridecafluoroheptene), (b1-6)1,1-dichloro-3 Examples include ,3,3-trifluoropropene, (b1-7)1,2-dichloro-3,3,3-trifluoropropene, (b1-8)1-chloro-1,3,3-trifluoropropene, (b1-9)(Z)-1-chloro-2,3,3,4,4,5,5-heptafluoro-1-pentene (HCFO-1437dycc(Z)), (b1-10)(E)-1-chloro-2,3,3,4,4,5,5-heptafluoro-1-pentene (HCFO-1437dycc(E)), (b1-11)1,3-dichloro-3,3-difluoropropene, 2-bromo-3,3,3-trifluoro-1-propene, etc. It is preferable that one or more are selected from the group consisting of components (b1-1) to (b1-5), and a mixture of isomers may also be used.Commercially available fluorinated olefins include CELEFIN® 1233Z (HCFO-1233zd(Z), HFO-1233zd(Z)) (manufactured by Central Glass Co., Ltd.), AMOLEA® AS-300 (manufactured by AGC Inc.) ((E)-1-chloro-2,3,3-trifluoropropene (HCFO-1233yd(E)), (Z)-1-chloro-2,3,3-trifluoropropene (HCFO-1233yd(Z)) and a stabilizer mixture), Opteon® SF33 (HCFO-1336mzz(Z) 90% to 100% by mass) (manufactured by Mitsui Chemours Fluoroproducts Co., Ltd.), Opteon® SF10 (methoxyperfluoroheptene isomer mixture exceeding 99% by mass) (manufactured by Mitsui Chemours Fluoroproducts Co., Ltd.), DR Examples include CFX70 (development product) (manufactured by Mitsui Chemours Fluoroproducts Co., Ltd.). Note that component (b1) may not be perfluoroheptene, nor may it be perfluoroolefin.

[0015] ≪(b2) Hydrofluoroethers (excluding (b1) fluorinated olefins)≫ (b2) Hydrofluoroether (HFE) (excluding fluorinated olefins in (b1)) is a compound containing carbon atoms, fluorine atoms, hydrogen atoms and an ether bond (-O-). The total number of carbon atoms in the (b2) component is preferably 2 to 20, and particularly preferably 3 to 10. The number of ether bonds in the (b2) component is preferably 1 or more, and particularly preferably 1 to 2. Examples of the (b2) component include (b2-1) 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether (also known as 1,1,2,2-tetrafluoro-1-(2,2,2-trifluoroethoxy)ethane, HFE-347pc-f), (b2-2) methyl nonafluorobutyl ether, (b2-3) methyl nonafluoroisobutyl ether, (b2-4) ethyl nonafluoroisobutyl ether, (b2-5) ethyl nonafluorobutyl ether, (b2-6) 1,1,1,2,2,3,4,5,5,5-decafluoro-3-methoxy-4-(trifluoromethyl)-pentane, (b2-7) 1,1,1,2,3,3-hexafluoro-4-(1,1,2,3,3,3-hexafluoropropoxy)pentane, (b2-8) 1,1,1,2,3,4,4,4-octafluoro-2-methoxy-3-(trifluoromethyl)butane, (b2-9) methyl perfluoropropyl ether, etc. It is preferably at least one selected from the group consisting of the (b2-1) component to the (b2-6) component.

[0016] ≪(b3) Hydrofluorocarbon≫ (b3) Hydrofluorocarbons (HFCs) are compounds consisting only of carbon atoms, fluorine atoms, and hydrogen atoms, and do not have carbon-carbon double bonds. (b3) Components include (b3-1) 1,1,1,3,3-pentafluorobutane (HFC-365mfc), (b3-2) 1,1,1,2,2,3,4,5,5,5-decafluoropentane (HFC-43-10mee), (b3-3) 1,1,2,2,3,3,4-heptafluorocyclopentane (HFC-c447ef), (b3-4) 1,1,1,2,2,3,3,4,4,5,5,6,6 Examples include tridecafluorooctane (HFC-76-13sf), (b3-5)1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane (HFC-52-13p), (b3-6)1,1,1,2,2,3,3,4,4-nonafluorohexane (HFC-569sf), and it is preferable that one or more are selected from the group consisting of components (b3-1) to (b3-3).

[0017] ≪(b4) Hydrobromocarbon≫ (b4) Hydrobromocarbon is a compound consisting only of carbon atoms, bromine atoms, and hydrogen atoms. (b4) The component is preferably one or more selected from the group consisting of (b4-1) 1-bromopropane and (b4-2) isobutyl bromide.

[0018] (b5) Perfluoropolyether (b5) Perfluoropolyethers (PFPEs) are compounds consisting only of carbon atoms, fluorine atoms, and oxygen atoms. Examples of commercially available (b5) include Galden® HT135 (manufactured by Solvay Specialty Polymers Japan Ltd.), Galden® HT55 (manufactured by Solvay Specialty Polymers Japan Ltd.), and Galden® HT70 (manufactured by Solvay Specialty Polymers Japan Ltd.).

[0019] ≪(b6) Other (B) components≫ (b6) The other (B) components are (b6-1) p-chlorobenzotrifluoride and (b6-2) trans-1,2-dichloroethylene.

[0020] (B) Component (B) is preferably a component that does not have a flash point, from the viewpoint of superior safety. (B) Component may be one or more types. Also, components (b1) to (b6) may each be one or a combination of two or more types.

[0021] <Components other than component (A) and component (B)> The solvent composition may contain components other than components (A) and (B) as long as it does not impair the effects of the present invention. Examples of such components include (C) further components and (D) additives.

[0022] (C) Further ingredients (C) Further components include (c1) nitro compounds, (c2) ethers, (c3) esters (excluding (c2) ethers), (c4) alcohols (excluding (c2) ethers), (c5) amide compounds, (c6) chloroolefins, (c7) hydrocarbons, and (c8) chlorinated hydrocarbons (excluding (c6) chloroolefins and (c7) hydrocarbons).

[0023] (c1) Nitro compounds (c1) The nitro compound is not particularly limited as long as it is a compound having one or more nitro groups in its molecule. (c1) Examples of components include nitromethane, nitroethane, 1-nitropropane, 2-nitropropane, and other nitroalkanes.

[0024] ≪(c2) Ether≫ (c2) The ether is an ether-based solvent that contains carbon atoms, hydrogen atoms and ether bonds (-O-), and may be linear or branched, and may be cyclic or acyclic. (c2)Specific examples of components include dipropyl ether, diisopropyl ether, tetrahydrofuran, methyltetrahydrofuran, 4-methyltetrahydropyran, 1,4-dioxane, 1,3-dioxolane, diethyl ether, diisobutyl ether, dibutyl ether, methyl tert-butyl ether, methyl cellosolve, ethyl cellosolve, isopropyl cellosolve, 1,2-butylene oxide, epichlorohydrin, propylene oxide, cyclohexene oxide, cyclopentene oxide, pentene oxide, heptene oxide, octen oxide, alkyl glycidyl ether, alkyl glycidyl ester, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, diethylene glycol monoethyl ether, triethylene glycol monoethyl ether, ethylene glycol monopropyl ether, diethylene glycol monopropyl ether, triethylene glycol monopropyl ether, ethylene glycol monobutyl ether Diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monoethyl ether, tripropylene glycol monoethyl ether, propylene glycol monopropyl ether, dipropylene glycol monopropyl ether, tripropylene glycol monopropyl ether, propylene glycol monobutyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monobutyl ether, propylene glycol, ethylene glycol, dipropylene glycol, diethylene glycol, tripropylene glycol, diethylene glycol monobutyl ether, ethylene glycol dimethyl ether (monoglym), diethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol diethyl ether,Examples include triethylene glycol dimethyl ether, diethylene glycol dibutyl ether, dimethoxytetraethylene glycol, dipropylene glycol dimethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethylene glycol monophenyl ether, ethylene glycol methyl ether, ethylene glycol ethyl ether, 3-methoxy-3-methyl-1-butanol, diethylene glycol monohexyl ether, diethylene glycol ethyl methyl ether, and dipropylene glycol ethyl methyl ether.

[0025] ≪(c3) Ester (excluding (c2) ether)≫ Examples of (c3) esters (excluding (c2) ethers) include monoester solvents, ester solvents having two carbonyl groups, carbonate ester solvents, and cyclic ester solvents. Specific examples of the (c3) component include methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, butyl acetate, sec-butyl acetate, methoxybutyl acetate, amyl acetate, soybean fatty acid methyl ester, methyl lactate, ethyl lactate, propyl lactate, dibasic acid ester (DCE), ethyl acetoethyl, γ-butyrolactone, dimethyl carbonate, diethyl carbonate, dimethyl oxalate, and diethyl oxalate. The (c3) component may also be dimethyl carbonate.

[0026] ≪(c4) Alcohols (excluding (c2) ethers)≫ Examples of (c4) alcohols (excluding (c2) ethers) include monoalcohol solvents. Specific examples of (c4) components include ethanol, methanol, 1-propanol, isopropyl alcohol, 1-butanol, isobutyl alcohol, tertiary butanol, secondary butyl alcohol, benzyl alcohol, diacetone alcohol, 2-propyne-1-ol, and 2-ethylhexanol.

[0027] ≪(c5) Amide Compounds≫ (c5) Amide compounds are cyclic or acyclic compounds having an amide bond. Examples of (c5) components include N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, 2-pyrrolidone, 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, dimethylformamide, dimethylacetamide, and dimethylacetacetamide.

[0028] ≪(c6) Chloroolefin (excluding (b6-2)trans-1,2-dichloroethylene)≫ (c6) Chloroolefins (excluding (b6-2)trans-1,2-dichloroethylene) are olefin compounds that contain carbon atoms and chlorine atoms, and may also contain hydrogen atoms.

[0029] (c7) Hydrocarbons (c7) Hydrocarbons are hydrocarbon solvents consisting only of carbon and hydrogen, which may be linear or branched, cyclic or acyclic, and which may have carbon-carbon double bonds. (c7) Examples of components include hexane, isohexane, cyclohexane, n-heptane, isoheptane, cycloheptane, n-octane, isooctane, nonane, isononane, decane, methylcyclohexane, ethylcyclohexane, limonene, 2-methyl-2-butene, 2-methyl-1-pentene, 2-methyl-2-pentene, 3-ethyl-2-butene, 2,3-dimethyl-2-butene, 2,4,4-trimethyl-1-pentene, 2,4,4-trimethyl-2-pentene, 2,2,4,6,6-pentamethylheptane, isododecane, isoparaffins, naphthenes, aromatic hydrocarbons, etc. Hydrocarbon solvents may be synthetic compounds.

[0030] ≪(c8) Chlorinated hydrocarbons (excluding (c6) chloroolefins and (c7) hydrocarbons)≫ (c8) Chlorinated hydrocarbons (excluding (c6) chloroolefins and (c7) hydrocarbons) are hydrocarbon solvents that contain chlorine atoms and carbon atoms, and may also contain hydrogen atoms.

[0031] (C) Further components may be one or a combination of two or more. Also, components (c1) to (c8) may each be one or a combination of two or more.

[0032] <<(D) Additives>> (D) Additives are not particularly limited as long as they are components other than component (C) and are commonly used in the field of solvent compositions. Examples of (D) additives include one or more selected from the group consisting of water, ultraviolet absorbers, antioxidants, rust inhibitors, defoamers, surfactants, and chelating agents.

[0033] UV absorbers and antioxidants are components that improve the stability of solvent compositions during long-term storage. Examples of UV absorbers include benzotriazole-based UV absorbers, benzophenone-based UV absorbers, and hindered amine-based UV absorbers. Examples of antioxidants include phenol-based antioxidants, amine-based antioxidants, sulfur-based antioxidants, and phosphorus-based antioxidants.

[0034] Phenolic antioxidants, 2,6-di-t-butyl-4-methylphenol, triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, pentaerythrityl-tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,2-thio- Diethylenebis[3-(3,5-di-t-butyl-hydroxyphenyl)propionate], Octadodecyl-3-[3,5-di-t-butyl-4-hydroxyphenyl]propionate], N,N-Hexamethylenebis(3,5-di-t-butyl-4-hydroxyhydrocinnamide), 3,5-di-t-butyl-4-hydroxybenzylphosphonate-diethyl ester, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, 2,4-bis[(octylthio)methyl]-o-cresol, 4-Methoxyphenyl Examples include methylhydroquinone (2,5-dihydroxytoluene) and 4-methoxyphenol.

[0035] Examples of amine-based antioxidants include alkylated diphenylamine, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, N,N-di-sec-butyl-p-phenylenediamine, p-phenylenediamine derivatives, and 1,3,5-tris(4-t-butyl-3-hydroxy-2,6-dimethyl)isocyanurate. Examples of sulfur-based antioxidants include 2,4-bis[(octylthio)methyl]-o-cresol, dilauryl-3,3-thiodipropionate, dimyristyl-3,3-didipropionate, distearyl-3,3-thiodipropionate, pentaerythrityltetrakis(3-laurylthiopropionate), ditridecyl-3,3-thiodipropionate, 2-mercaptobenzimidazole, and bis[2-methyl-4-(3-n-alkylthiopropionyloxy)-5-t-butylphenyl]sulfide. Examples of phosphorus-based antioxidants include tris-nonylphenyl phosphite, triphenyl phosphite, tris(2,4-di-t-butylphenyl) phosphite, and tris(isodecyl) phosphite.

[0036] Examples of chelating agents include aminocarboxylic acid-based chelating agents, with hydroxyethylaminoacetic acid, hydroxyethyliminodiacetic acid, ethylenediaminetetraacetic acid, and their salts being preferred.

[0037] Rust inhibitors include cyclohexylamine, dicyclohexylamine, and N,N-bis(2-hydroxyethyl)-N-cyclohexylamine. Suitable surfactants include nonionic surfactants, such as higher alcohol ethylene oxide adducts, alkylphenol ethylene oxide adducts, fatty acid ethylene oxide adducts, higher alkylamine ethylene oxide adducts, fatty acid esters of sorbitol and sorbitan, sucrose fatty acid esters, silicone-based surfactants, and fluorine-based surfactants.

[0038] Other additives besides those listed above are not particularly limited and can be used as appropriate, as long as they are components commonly used in the field of solvent compositions. (D) Component may be one type or a combination of two or more types.

[0039] <Composition of the solvent composition> In a solvent composition, when the total of component (A) and component (B) is 100 parts by weight, the lower limit of the content of component (A) may be 10, 20, 30, 50, 70, or 90 parts by weight, and the upper limit of the content of component (A) may be 99, 90, 80, 70, 50, 30, or 10 parts by weight. The range of the content of component (A) when the total of component (A) and component (B) is 100 parts by weight can be set from the above upper and lower limits according to the type of resin being targeted, for example, it may be 10 to 99 parts by weight, 30 to 90 parts by weight, or 10 to 50 parts by weight.

[0040] From the viewpoint of achieving superior effectiveness as a solvent composition, it is preferable that the total content of component (A) and component (B) be 60 parts by weight or more, more preferably 70 parts by weight or more, even more preferably 80 parts by weight or more, and particularly preferably 90 parts by weight or more, when the total amount of the solvent composition is 100 parts by weight. In the above case, the remainder is the total content of component (C) and component (D). The solvent composition may also have a total content of component (A) and component (B) of 100 parts by weight when the total amount of the solvent composition is 100 parts by weight.

[0041] When the total amount of the solvent composition is 100 parts by weight, the sum of the content of component (C) and component (D) is preferably 40 parts by weight or less, more preferably 30 parts by weight or less, even more preferably 20 parts by weight or less, and particularly preferably 10 parts by weight or less. The respective content of component (C) and component (D) is not particularly limited as long as it does not exceed the sum of the content of component (C) and component (D) as described above, and may be 20 parts by weight or less, 10 parts by weight or less, or 5 parts by weight or less.

[0042] The solvent composition may also contain component (A) and component (B), optionally containing component (C) and / or component (D), wherein when the total amount of component (A) and component (B) is 100 parts by weight, the content of component (A) is 10 to 99 parts by weight, and when the total amount of the solvent composition is 100 parts by weight, the total amount of component (A) and component (B) is 60 parts by weight or more, the content of component (C) is 20 parts by weight or less, and the content of component (D) is 20 parts by weight or less.

[0043] [Method for producing solvent compositions] The method for producing the solvent composition is arbitrary. The raw material components contained in the solvent composition can be produced by appropriately selecting known methods, for example, by performing one or more means selected from the group consisting of stirring, mixing, dissolving, and dispersion.

[0044] [Uses of the first solvent composition: Solvent for resins] Because solvent compositions exhibit excellent solubility of resins, they can be used as solvents for resins. The resin may be completely dissolved in the solvent to form a uniform composition, or it may be swollen or softened by the solvent, resulting in the resin disintegrating into small pieces. Therefore, a resin solvent encompasses a resin swelling agent, a resin softener, and a resin disintegrant.

[0045] <Resin> Resins include uncured resins, cured resins, and cured resin compositions containing additives blended into the resin. Cured resins also include not only cured resins that harden due to accelerated curing reactions (for example, cured resins of ultraviolet (UV) curing adhesives), but also cured resins with elasticity such as elastomers, and solidified resins that solidify due to increased viscosity caused by the volatilization of additives blended into the resin, such as reaction diluents.

[0046] The resin is not particularly limited and may be a thermosetting resin or a thermoplastic resin. Specific examples of resins include polyester resin, polyamide resin, acrylic resin, polycarbonate resin, polylactic acid resin, acrylonitrile-butadiene-styrene resin, urethane resin, polyacetal resin, styrene resin, fluororesin, polyphenylene ether resin, polyetherimide resin, polyetheramide resin, and polyimide resin.

[0047] Examples of polyester resins include polyethylene terephthalate resin, polybutylene terephthalate resin, polybutylene adipate terephthalate resin, polyethylene naphthalate resin, polyhydroxyalkanoate resin, polyhydroxybutyrate resin, polybutylene succinate resin, unsaturated polyester resin, polyesteramide resin, polyesterimide resin, and polyesteramideimide resin.

[0048] Polyethylene terephthalate resin is a polyester obtained by the dehydration condensation of ethylene glycol and terephthalic acid. Additives that can be added to polyethylene terephthalate resin include compatibilizers, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant enhancers, antistatic agents, colorants, antistatic agents, foldability modifiers, impact resistance modifiers, and reaction diluents. Cured polyethylene terephthalate resin is used in PET bottles, films, magnetic tapes, clothing fibers, and the like.

[0049] Polybutylene terephthalate resin is a polyester obtained by the dehydration condensation of 1,4-butanediol and terephthalic acid. Additives used in polyethylene terephthalate resin include compatibilizers, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, antistatic agents, foldability modifiers, impact resistance modifiers, and reaction diluents. Cured polyethylene terephthalate resins are used in thermal conductive resins for electronic components, automotive lamp housings, laser welding materials, fuse cases, capacitor cases, connectors, and the like.

[0050] Polybutylene adipate terephthalate resin is a type of biodegradable copolyester and is expected to be used in a variety of applications, including packaging materials, medical devices, agricultural films, synthetic fibers, and nonwoven fabrics. Additives that can be incorporated into polybutylene adipate terephthalate resin include compatibilizers, foaming agents, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant enhancers, antistatic agents, colorants, antistatic agents, foldability modifiers, impact resistance modifiers, and reaction diluents.

[0051] Polyamide resins are copolymers having amide bonds and may be synthesized by polycondensation reactions of ω-amino acids or by copolymerization reactions of diamines and dicarboxylic acids. Polyamide resins may be aliphatic or aromatic. Additives that can be added to polyamide resins include compatibilizers, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, antistatic agents, foldability modifiers, impact resistance modifiers, and reaction diluents. Cured polyamide resins are used in automotive parts such as engine covers, industrial valves, filaments, etc. Polyamide resins may also be polyamide-imide resins.

[0052] Examples of acrylic resins include compounds having an acryloyl group and / or a methacryloyl group, specifically methyl (meth)acrylate and 2-hydroxyethyl (meth)acrylate. Here, (meth)acrylate means at least one of acrylate and methacrylate. It is preferable that the acrylic resin does not contain fluorine atoms, and it is particularly preferable that it does not contain halogen atoms. Examples of additives blended into the acrylic resin include compatibilizers, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, electrostatic imparters, foldability modifiers, impact resistance modifiers, and reaction diluents. Because acrylic resins have good processability and excellent transparency, cured acrylic resins are used in windshields, windows for aircraft, ships, and automobiles, aquariums, lenses, lighting fixtures, displays, signs, etc.

[0053] Polycarbonate resin is a type of thermoplastic plastic. The bonding sites between monomer units are composed of carbonate groups (-O-(C=O)-O-). Additives used in polycarbonate resin include compatibilizers, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant enhancers, antistatic agents, colorants, electrostatic imparters, foldability modifiers, impact resistance modifiers, and reaction diluents. Cured polycarbonate resins are widely used in components of automobiles and other vehicles, such as roofs and headlamp lenses.

[0054] Polylactic acid resin is a polymer formed by the polymerization of lactic acid through ester bonds. Additives used in polylactic acid resin include compatibilizers, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant enhancers, antistatic agents, colorants, antistatic agents, foldability modifiers, impact resistance modifiers, and reaction diluents. Cured polylactic acid resin is used in materials for 3D printers, agricultural films, greenhouse sheets, food trays, packaging films, shopping bags, chemical fibers, and the like.

[0055] Acrylonitrile-butadiene-styrene resin is an acrylonitrile-styrene copolymer in which polybutadiene, a rubbery polymer, is dispersed, and it is a copolymer of acrylonitrile and styrene, mainly composed of three components: acrylonitrile, butadiene, and styrene. Additives that can be added to acrylonitrile-butadiene-styrene resin include compatibilizers, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant enhancers, antistatic agents, colorants, antistatic agents, foldability modifiers, impact resistance modifiers, and reaction diluents. Cured products of acrylonitrile-butadiene-styrene resin are widely used in interior and exterior components of automobiles, etc., and are used in wheel caps, wheel covers, dashboards, etc.

[0056] Examples of urethane resins include reaction products of diisocyanates such as tolylene diisocyanate (TDI) and diphenylmethane diisocyanate (MDI) with polyols such as polypropylene glycol. When the urethane resin is in foam form, it may be a flexible foam, semi-rigid foam, or rigid foam. Examples of additives blended into the urethane resin include compatibilizers, curing agents, curing accelerators, emulsifiers, foaming agents, stabilizers, plasticizers, flame retardants, antistatic agents, colorants, foldability modifiers, and impact resistance modifiers. Cured urethane resins are used as thermal insulation materials and coatings for electronic circuit boards, etc.

[0057] Polystyrene resin is a polymer with styrene as the monomer, and its cured product is also called polystyrene. When polystyrene resin is in foam form, the cured foam of polystyrene resin is also called expanded polystyrene. Additives that can be added to polystyrene resin include compatibilizers, foaming agents, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, antistatic agents, foldability modifiers, impact resistance modifiers, and reaction diluents. Cured polystyrene resin is used in automotive lamp lenses and covers, among other applications.

[0058] Polyacetal resin is a polymer containing polyoxymethylene units. In addition to oxymethylene units, polyacetal resin may also contain oxyalkylene units such as oxyethylene units, oxypropylene units, and oxybutylene units in its molecule. Additives used in polyacetal resin include compatibilizers, foaming agents, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, antistatic agents, folding modifiers, impact modifiers, and reaction diluents. Cured polyacetal resins are used in gears, bearings, fasteners, and the like.

[0059] Fluororesins are a general term for synthetic resins obtained by polymerizing fluorine-containing olefins, and include PTFE (polytetrafluoroethylene), PCTFE (polychlorotrifluoroethylene), CTFE (polychlorotrifluoroethylene), PVDF (polyvinylidene difluoride), PVF (polyvinylidene fluoride), PFA (tetrafluoroethylene-perfluoroalkoxyethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), ETFE (tetrafluoroethylene-ethylene copolymer), ECTFE (chlorotrifluoroethylene-ethylene copolymer), etc. Additives that are blended into fluororesins include compatibilizers, foaming agents, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, electrostatic imparters, foldability modifiers, impact resistance modifiers, and reaction diluents. Cured fluororesin products are used as sealing materials such as gaskets and packings, linings for piping materials, tanks, pumps, and flow meters, cables, rollers, and more.

[0060] Polyphenylene ether resin is obtained by the oxidative polymerization of 2,6-dimethylphenol (2,6-xylenol). Additives that can be blended into polyacetal resin include compatibilizers, foaming agents, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, electrostatic imparters, foldability modifiers, impact resistance modifiers, and reaction diluents. Polyphenylene ether may be a modified polyphenylene ether (m-PPE), which is a polymer alloy with other resins, or a polymer alloy with resins such as polystyrene, polypropylene, polyamide, and polyphenylene sulfide. Cured polyacetal resins are used in mechanical parts of home appliances, chassis of office automation equipment, exterior parts of automobiles, and water-related parts such as pumps.

[0061] Polyetherimide resin is a polymer that combines imide bonds with ether bonds, which have good processability. Additives that can be added to polyetherimide resin include compatibilizers, foaming agents, curing agents, curing accelerators, fillers, stabilizers, plasticizers, lubricants, flame retardants, flame retardant aids, antistatic agents, colorants, antistatic agents, folding modifiers, impact modifiers, and reaction diluents. Polyetherimide resin is used in precision instruments, automotive parts (bearing retainers, speed sensor parts), cooking utensils (Tupperware, etc.), home appliances, medical equipment, and electrical and electronic components (connectors, printed circuit boards, sockets, etc.). Polyetherimide resin may also be polyetheramideimide resin.

[0062] <How to use the dissolving agent> A method for dissolving a resin using a solvent includes a step of bringing the solvent into contact with the resin. In the step of bringing the solvent into contact with the resin, the resin dissolves in the solvent. The contact time between the solvent and the resin is not particularly limited as long as it is long enough to achieve the desired effect. The contact time is preferably 0.01 seconds to 96 hours, more preferably 0.1 seconds to 48 hours, even more preferably 0.1 seconds to 24 hours, even more preferably 0.5 seconds to 8 hours, and particularly preferably 1 second to 2 hours. Within the above time range, the resin can be sufficiently swollen, softened and / or disintegrated, and preferably sufficiently dissolved. The amount of resin to be dissolved is not particularly limited as long as it is long enough to achieve the desired effect, and may be 0.1 parts by weight or more, 0.5 parts by weight or more, 2.0 parts by weight or more, 3.0 parts by weight or more, 10.0 parts by weight or more, or 20.0 parts by weight or more per 100 parts by weight of the solvent. If the amount of resin to be dissolved exceeds the saturation dissolution amount of the solvent, it is acceptable for some of the resin to remain undissolved.

[0063] The temperature of the solvent when it is brought into contact with the resin is not particularly limited, but is preferably 0°C to 50°C, more preferably 5°C to 40°C, even more preferably 10°C to 30°C, and particularly preferably 15°C to 25°C.

[0064] The solvent is preferably a solvent for the cured resin. When the solvent is a solvent for the cured resin, the entire cured resin may dissolve and form a uniform phase with the solvent, or the entire or a part of the cured resin may become a swollen substance due to the solvent, and the solvent and the swollen substance may exist as two layers. It is preferable that the entire cured resin dissolves and forms a uniform phase with the solvent.

[0065] Furthermore, if the resin to which the solvent is applied is a combination of two or more resins, the solvent may be one that dissolves only one of the resins. In such a combination of two or more resins, it is preferable that the resin dissolved by the solvent is one or more selected from the group consisting of polylactic acid resin, acrylic resin, ABS resin, polycarbonate resin, polybutylene terephthalate resin, polyamide resin, polyurethane resin, lipid polyetherimide resin, and polybutylene adipate terephthalate resin. The other resin is appropriately selected according to the solubility of the resin dissolved by the solvent. That is, the other resin is appropriately selected from resins that have lower solubility in the solvent than the resin dissolved by the solvent.

[0066] <Possible compositions of the solvent> If the solvent is a solvent for polyester resin (especially polyethylene terephthalate resin), and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 20 to 99 parts by weight, 30 to 99 parts by weight, 35 to 99 parts by weight, 40 to 99 parts by weight, 45 to 99 parts by weight, or 50 to 99 parts by weight.

[0067] If the solvent is an acrylic resin solvent and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 85 parts by weight, 20 to 80 parts by weight, 15 to 25 parts by weight, or 15 to 20 parts by weight.

[0068] If the solvent is a solvent for polycarbonate resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 99 parts by weight, 20 to 99 parts by weight, 15 to 85 parts by weight, or 15 to 80 parts by weight.

[0069] If the solvent is a solvent for polylactic acid resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 85 parts by weight or 20 to 80 parts by weight.

[0070] If the solvent is a solvent for ABS resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 55 parts by weight, 15 to 50 parts by weight, 15 to 25 parts by weight, or 20 parts by weight.

[0071] If the solvent is a solvent for polyester resin (especially polybutylene terephthalate resin), and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 99 parts by weight, 25 to 99 parts by weight, 30 to 99 parts by weight, 55 to 99 parts by weight, 60 to 99 parts by weight, 35 to 95 parts by weight, or 40 to 90 parts by weight.

[0072] If the solvent is a solvent for polyacetal resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 75 to 99 parts by weight or 80 to 99 parts by weight.

[0073] If the solvent is a solvent for polyetherimide resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 99 parts by weight.

[0074] If the solvent is a solvent for polybutylene adipate terephthalate resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 20 to 99 parts by weight or 25 to 99 parts by weight.

[0075] If the solvent is a solvent for nylon 66 (PA66) resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 99 parts by weight, 20 to 99 parts by weight, 35 to 99 parts by weight, 40 to 99 parts by weight, 55 to 99 parts by weight, or 60 to 99 parts by weight.

[0076] If the solvent is a solvent for nylon 11 (PA11) resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 99 parts by weight, 20 to 99 parts by weight, 25 to 99 parts by weight, or 30 to 99 parts by weight.

[0077] If the solvent is a solvent for nylon 46 (PA46) resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 25 to 99 parts by weight or 30 to 99 parts by weight.

[0078] If the solvent is a solvent for nylon 6 (PA6) resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 99 parts by weight.

[0079] If the solvent is a solvent for nylon 12 (PA12) resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 15 to 99 parts by weight or 20 to 99 parts by weight.

[0080] If the solvent is a solvent for polyphthalamide (PPA) resin, and component (B) contains one or more selected from the group consisting of (b1-2)(E)-1-chloro-2,3,3-trifluoropropene and (b1-3)(Z)-1-chloro-2,3,3-trifluoropropene, then when the total of component (A) and component (B) is 100 parts by weight, the content of component (A) may be 20 to 99 parts by weight or 40 to 99 parts by weight.

[0081] [Second Invention: Uses of Component (A)] The second aspect of the present invention relates to a solvent composition (hereinafter also referred to as "the second solvent composition") that comprises (A) 1,1,1,3,3,3-hexafluoroisopropanol, or (A) 1,1,1,3,3,3-hexafluoroisopropanol and (B) a halogenated organic compound, wherein the (B) halogenated organic compound is one or more selected from the group consisting of (b1) fluorine-containing olefin, (b2) hydrofluoroether (excluding (b1) fluorine-containing olefin), (b3) hydrofluorocarbon, (b4) hydrobromocarbon, (b5) perfluoropolyether, (b6-1) p-chlorobenzotrifluoride, and (b6-2) trans-1,2-dichloroethylene, and is used as an adhesive for resins, a clearing agent, a coating agent, a release agent, a cleaning agent, and a liquid chromatography method.

[0082] (A) Component or the second solvent composition can dissolve at least the surface of the resin, and can therefore be used as an adhesive for resins or as a resin clearing agent.

[0083] (A) Component or the second solvent composition can dissolve resins, and can therefore be used as a solvent for resin adhesives, a resin coating agent, a mobile phase in liquid chromatography, or a solvent for dissolving analytes in liquid chromatography.

[0084] (A) Component or the second solvent composition has the above-mentioned characteristics and can therefore be used as a resin release agent or a resin cleaning agent.

[0085] The solvent component used in the second invention is either component (A) alone or the solvent composition described above in the first invention. Examples of such components include trichloroethylene and tetrachloroethylene in (c6) chloroolefins, and methylene chloride in (c8) chlorinated hydrocarbons. Except as specifically described below, the components contained in the second solvent composition and their content are as described above in the first solvent composition, including preferred embodiments.

[0086] <Resin adhesive (1)> (A) Component or the second solvent composition can dissolve at least the surface of the resin (preferably the cured resin), and therefore can be used as an adhesive for resins. In order to distinguish it from the resin-containing adhesive described later, the adhesive according to this embodiment is also referred to as the "first adhesive".

[0087] The first adhesive refers to a solvent-based adhesive. Specifically, the first adhesive is a resin adhesive that forms an adhesive portion by dissolving the surface of a cured resin product with component (A) or a solvent composition, and then bonding it to another substrate via the adhesive portion. By using a solvent composition as the first adhesive, the bonding surface can be firmly bonded without the need for intermediaries such as reaction-curing adhesives (for example, cyanoacrylate in cyanoacrylate-based adhesives).

[0088] A method for manufacturing an adhesive using the first adhesive includes the steps of (A1) applying the first adhesive to a substrate containing one resin to form an adhesive portion, and (B1) laminating the substrate containing the other resin to bond the substrates together via the adhesive portion. In step (A1), the adhesive portion is formed by applying the solvent to the substrate containing one resin, which causes a portion of the resin in the substrate to dissolve.

[0089] Furthermore, a method for manufacturing a further adhesive using the first adhesive includes the steps of (A1) applying the first adhesive to a substrate containing one resin to form an adhesive portion, (A2) applying the first adhesive to a substrate containing the other resin to form an adhesive portion, and (B2) bonding the substrate containing one resin to the substrate containing the other resin, thereby bonding the substrates together via the adhesive portion. The method for manufacturing an adhesive may also include the steps of (A1) and (B1) above, and the steps of (A1), (A2) and (B2) above, to bond further substrates containing resin.

[0090] The substrate in the first adhesive is a substrate containing the resin described above in the first invention, or it may be a substrate consisting only of resin. There are no particular restrictions on the method of applying the first adhesive, and examples include coating, spraying, and using a spray gun. The time for bonding the substrates together is not particularly limited as long as it is a time that achieves the desired effect. The contact time is preferably 1 minute to 10 hours, and particularly preferably 30 minutes to 2 hours. When the time is within the above range, the adhesive strength between the substrates is sufficiently exhibited. After the step of bonding the substrates together, a step of heating at a temperature of 50 to 80°C may be included if necessary. This further accelerates curing and increases the adhesive strength.

[0091] Preferred embodiment of the first adhesive The component (B) contained in the first adhesive preferably has a boiling point of 100°C or less, and particularly preferably 80°C or less. The inclusion of component (B) having the above boiling point in the first adhesive shortens the drying time after steps (B1) and (B2).

[0092] <Resin transparency agent> Since component (A) or the second solvent composition can dissolve at least the surface of the resin (preferably the cured resin), it can be used as a clearing agent that can smooth the surface of the resin and make it transparent. Specifically, the resin clearing agent is a resin clearing agent that includes the step of applying component (A) or the second solvent composition to the surface of the resin to dissolve the surface of the resin and removing the solvent portion of component (A) or the second solvent composition.

[0093] A method for making a resin transparent using a transparent agent includes the step of applying the transparent agent to the surface of the resin to dissolve the surface of the resin and remove the solvent portion of the transparent agent, wherein the method of applying the transparent agent is a method of contacting the transparent agent with its vapor or a method of coating the transparent agent.

[0094] The surface shape of the resin used in the resin transparency method is not particularly limited. For example, it may be a resin after molding or surface treatment. It may also be opaque due to surface treatment.

[0095] The method of applying the clearing agent is not particularly limited and may involve contacting the resin with the vapor of the solvent composition, or applying the solvent composition to the surface of the resin. A vapor generator can be used as an example of a method for contacting the resin with the vapor of the solvent composition.

[0096] In the step of removing the solvent portion of the clearing agent, the solvent portion of the clearing agent is removed by leaving the resin to stand. As a result, the dissolved resin solidifies, and a resin with a transparent surface is obtained. The time and temperature at which the resin is left to stand are not particularly limited, as long as they are the time and temperature required for the dissolved resin to harden and the surface to form.

[0097] The present invention also relates to a method for dissolving a resin, characterized by dissolving the resin (preferably the surface of a cured resin) by bringing the vapor of component (A) or a second solvent composition into contact with the resin. The present invention also relates to a method for dissolving a resin, characterized by dissolving the resin (preferably the surface of a cured resin) by applying component (A) or a second solvent composition to the surface of the resin.

[0098] Preferred embodiment of the clearing agent The boiling point difference between component (B) in the clearing agent and component (A) is preferably 30°C or less, more preferably 20°C or less, and particularly preferably 10°C or less. The inclusion of component (B) having the aforementioned boiling point in the clearing agent makes it easier for the clearing agent to become an azeotropic (pseudo-azeotropic) composition, resulting in a closer relationship between the liquid phase and the generated vapor composition. Furthermore, when the clearing agent is an azeotropic composition, the amount of component (A) in the vapor is easier to predict, allowing for easy adjustment of the resin dissolution rate. Additionally, when the clearing agent is an azeotropic composition, the liquid balance of the composition is less likely to be disrupted during continuous use, making it easier to achieve stable solubility.

[0099] <Resin coating agent> (A) Component or the second solvent composition has excellent resin solubility and can therefore be used as a resin coating agent.

[0100] The resin coating agent is a composition in which a resin is dissolved in component (A) or a second solvent composition. Therefore, the resin coating agent can be manufactured by a method that includes the step of dissolving a resin in component (A) or a second solvent composition. Furthermore, if the resin coating agent is a composition in which a resin is dissolved in a second solvent composition, the resin coating agent may be manufactured by a method that includes the step of dissolving a resin in component (A) to obtain a mixture in which the resin is dissolved in component (A), and the step of mixing the mixture obtained in the above step with component (B). The conditions for dissolving the resin include the conditions described above for the solvent.

[0101] A resin coating film may be formed by applying (e.g., coating) the coating agent to a substrate and removing (e.g., volatilizing) the solvent portion of the coating agent, or resin nanofibers may be obtained by electrospinning. Alternatively, a resin molded product of a desired shape can be obtained by pouring the coating agent into a mold of any shape and removing (e.g., volatilizing) the solvent portion of the coating agent. It should be noted that some of the resin in the coating agent may remain undissolved. However, it is preferable that the resin content in the coating agent is below the saturation dissolution amount of the resin. With such a content, there is no undissolved resin, and a homogeneous coating and / or resin molded product can be obtained.

[0102] A method for manufacturing a substrate with a resin coating film using a coating agent includes steps (C1): applying a resin coating agent to a substrate to obtain a substrate with a resin coating agent, and (D1): removing the solvent portion of the coating agent from the substrate with the resin coating agent to obtain a substrate with a resin coating film.

[0103] In step (C1), the substrate may be an organic substrate, an inorganic substrate, or a combination thereof, and may include metals, fibers, glass, ceramics, plastics, wood, etc. Examples of metals include gold, silver, zinc, nickel, iron, aluminum, copper, manganese, magnesium, stainless steel, and aluminum alloys (alloys of aluminum with one or more metals consisting of copper, manganese, silicon, magnesium, zinc, and nickel). Examples of plastics include FRP resin, polyethylene resin, polypropylene resin, polyethylene terephthalate resin, epoxy resin, acrylic resin, polycarbonate resin, silicone resin, and ABS resin (acrylonitrile butadiene styrene resin), and it is preferable that the plastic is not a resin contained in the coating agent.

[0104] In step (C1), there are no particular limitations on the means of applying the coating agent, and known application methods can be used.

[0105] In step (D1), one method for removing the solvent portion of the coating agent is to leave the resin-coated substrate to stand. The standing temperature and time are not particularly limited as long as they are sufficient to remove the solvent portion of the coating agent, and the substrate may be left in a constant temperature bath at 30°C to 40°C.

[0106] Furthermore, a method for manufacturing a resin molded product using a coating agent includes the steps of: pouring the coating agent into a mold of any shape; removing the solvent portion of the coating agent to obtain a resin molded product of a desired shape; and peeling the mold off the resin molded product.

[0107] Preferred form of coating agent The boiling point difference between component (B) and component (A) in the coating agent is preferably 40°C or less, more preferably 30°C or less, and particularly preferably 20°C or less. When the coating agent contains component (B) having the aforementioned boiling point, the composition of the vapor that evaporates and the composition of the remaining liquid component tend to become similar when the liquid component of the coating agent evaporates. In particular, when component (B) has a high boiling point and the boiling point difference between it and component (A) is small, component (A) is less likely to evaporate first, and the amount of component (A) in the remaining liquid component tends to increase. In such cases, the dissolved resin does not precipitate, making it easier to obtain a more uniform coating film.

[0108] Furthermore, a method for manufacturing a substrate with a resin coating film may be included in a method for manufacturing a resin coating film. Therefore, the present invention also relates to a method for manufacturing a resin coating film, comprising the steps of obtaining a substrate with a resin coating film by the method for manufacturing a substrate with a resin coating film, and peeling the resin coating film from the substrate obtained in the above step to obtain a resin coating film.

[0109] <Resin adhesive (2)> (A) Component or the second solvent composition has excellent resin solubility and can therefore be used as a solvent for dissolving reaction-curing resins (inclusions), such as in reaction-curing adhesives. The adhesive according to this embodiment is also referred to as the "second adhesive."

[0110] The second adhesive is a composition in which a resin having adhesive properties is dissolved in a solvent. The second adhesive can be manufactured in the same way as the coating agent. Depending on the desired properties of the adhesive, adhesion promoters, reaction accelerators, etc., may be dissolved in addition to the resin.

[0111] A method for manufacturing an adhesive using the second adhesive includes steps (E1) applying the resin adhesive (2) to one substrate and (F1) laminating the other substrate and bonding the substrates together via the adhesive. In step (E1), a portion of the substrate may be dissolved by applying the resin adhesive (2) to one of the substrates. The method may also include a heating step after step (E1).

[0112] Furthermore, a method for manufacturing a further adhesive using the second adhesive includes the steps of (E1) applying the second adhesive to one substrate, (E2) applying the second adhesive to the other substrate, and (F2) bonding one substrate to the other substrate, thereby bonding the substrates together via the adhesive portion. The method for manufacturing the adhesive may also include the steps (E1) and (F1) above, and the steps (E1), (E2) and (F2) above, to bond further substrates.

[0113] The conditions for applying the second adhesive are as described above for the coating agent. The time for bonding the substrates together and the heating conditions after step (E1) are as described above for the first adhesive.

[0114] Preferred embodiment of the second adhesive The component (B) contained in the second adhesive preferably has a boiling point of 100°C or lower, and particularly preferably 80°C or lower. The inclusion of component (B) having the above boiling point in the second adhesive allows for a shorter drying time after steps (F1) and (F2).

[0115] <Liquid Chromatography of Resins> (A) Component or the second solvent composition has excellent resin solubility and can therefore be used as a mobile phase in liquid chromatography of resins, or as a solvent for dissolving the resin, which is the analytical sample, in liquid chromatography of resins.

[0116] Liquid chromatography is not particularly limited as long as the solvent used as the mobile phase or the solvent used to dissolve the resin, which is the analytical sample, is component (A) or a solvent composition. However, it is preferable that the solvent used in liquid chromatography of resin is not a solvent composition containing component (A) and Novec7300.

[0117] Examples of liquid chromatography methods include normal-phase liquid chromatography, where the polarity of the stationary phase is higher than that of the mobile phase; reverse-phase liquid chromatography, where the polarity of the stationary phase is lower than that of the mobile phase; hydrophilic interaction chromatography; ion exchange chromatography; size exclusion chromatography (SEC); and supercritical fluid chromatography.

[0118] In SEC (Electron-Secured Analysis), the resin to be analyzed is dissolved in the mobile phase and then subjected to SEC. The solvent used in the mobile phase is appropriately selected depending on the type of resin to be analyzed.

[0119] When performing SEC, it is preferable to use polymethyl methacrylate (hereinafter also referred to as "PMMA") with a known molecular weight as the standard substance for molecular weight measurement. Commercially available PMMA with a known molecular weight can be used. Since the mobile phase is component (A) or a solvent composition, there is almost no risk of suppressing the adsorption of PMMA to the column and reducing the column's separation performance. As a result, the peak width in the chromatogram tends to become narrower, and the reproducibility of the chromatogram tends to improve dramatically.

[0120] Examples of columns used in SEC include SEC columns packed with polymer gels (for example, porous polystyrene-divinylbenzene copolymer gels).

[0121] The apparatus used in SEC is not particularly limited, and commercially available apparatus may be used, and may include equipment for recycling component (A) or the solvent composition. Examples of detectors used in the apparatus for SEC include refractive index differential detectors, ultraviolet absorption detectors, visible light absorption detectors, infrared absorption detectors, light scattering intensity detectors, and evaporative light scattering detectors. In some cases, absolute molecular weight can be measured by using a refractive index differential detector and a light scattering detector simultaneously, in which case it is not always necessary to use a standard sample for molecular weight measurement. The mobile phase delivery rate is appropriately determined according to the column size, the type of column packing material, etc., and is preferably 0.1 to 10 ml / min.

[0122] According to SEC, the molecular weight of a resin can be measured from its column retention time. Furthermore, if the resin consists of two or more compounds with different molecular weights, the molecular weight distribution can be determined. Additionally, if the analyte is a composition of two or more resins with different molecular weights, SEC allows for separation according to a specific molecular weight range. Therefore, SEC may be used to purify resins with specific molecular weights.

[0123] <Resin release agent> Component (A) or the second solvent composition can be used as a resin release agent. Specifically, component (A) or the second solvent composition can be used as a release agent for removing cured resin from a substrate to which cured resin is attached. When component (A) or cured resin comes into contact with the solvent composition, it is believed that all or part of the cured resin softens by dissolving or swelling on the surface of the cured resin and / or at the interface between the substrate and the cured resin, reducing the adhesion between the substrate and the cured resin, and thus the cured resin is removed. However, if the cured resin is removed by peeling off from the interface between the substrate and the cured resin, the cured resin may retain its shape, and a part of it may be dissolved and / or swollen.

[0124] The resin is as described above in the first part of the present invention. The substrate is as described above in the coating agent step (C1).

[0125] The cured resin may adhere to further substrates. In this case, the substrate may be an adhesive in which two or more substrates are bonded together via the cured resin. In this case, the solvent composition can be used as a release agent to separate the two or more substrates from the adhesive in which the two or more substrates are bonded together via the cured resin. The phenomenon of the adhesive separating into two or more substrates by the release agent is thought to occur because, when the release agent comes into contact with the adhesive, all or part of the cured resin softens by dissolving on the surface of the cured resin and / or at the interface between the substrate and the cured resin, thereby reducing the adhesion between the two or more substrates. Here, the adhesive only needs to be separated into two or more substrates by the release agent, and the cured resin may adhere to at least one of the separated substrates. Furthermore, the cured resin adhering to at least one of the separated substrates may maintain its shape, or a part of it may be dissolved and / or swollen. The cured resin adhering to at least one of the separated substrates can be removed from the substrate by further contact with the release agent.

[0126] There are no particular limitations on the method for bringing the release agent into contact with a substrate to which cured resin is attached, or with an adhesive in which two or more substrates are bonded together via cured resin, and examples include immersion and spraying. In the immersion method, in order to enhance the removal effect, means such as stirring, shaking, ultrasonic vibration, or air bubbling may be combined with immersion. In addition, in order to promote the removal of cured resin from the substrate, physical force may be applied, such as by inserting a spatula into the interface between the cured resin and the substrate, at the same time as and / or after contact between the release agent and the cured resin, and the swollen cured resin may be removed by wiping. If the substrate to which cured resin is attached cannot be immersed, the cured resin can be removed from the substrate by continuously spraying the release agent. Also, if an adhesive in which two or more substrates are bonded together via cured resin cannot be immersed, the two or more substrates can be separated from the adhesive by continuously spraying the release agent.

[0127] The contact time between the release agent and the substrate to which cured resin is attached, or the adhesive in which two or more substrates are bonded together via cured resin, is not particularly limited as long as it is a time that can achieve the desired effect (removal of cured resin attached to the substrate, or separation of the substrate from the adhesive), but the time specified in the method of use of the solvent composition is preferred. The temperature of the release agent is also specified in the time and temperature specified above. Furthermore, the temperature of the release agent when it is brought into contact with the substrate to which cured resin is attached, or the adhesive in which two or more substrates are bonded together via cured resin, is preferably the temperature specified in the method of use of the solvent composition. Furthermore, it is preferable that the release agent does not contain perfluoroheptene.

[0128] <Resin cleaning agent> (A) Component or the second solvent composition has excellent resin solubility and can be used as a resin solvent or release agent, and can therefore be used as a cleaning agent to remove resin from objects to be cleaned that have resin attached to them.

[0129] (A) There are no particular limitations on the method for bringing the component or solvent composition into contact with the object to be cleaned. Examples include hand wiping, immersion cleaning (liquid phase cleaning), spray cleaning (including spraying with a cleaning aerosol composition), shower cleaning, ultrasonic cleaning, steam cleaning (gas phase cleaning), and combinations thereof. However, hand wiping, immersion cleaning, steam cleaning, spray cleaning (including spray cleaning by spraying a cleaning aerosol composition), and combinations of immersion cleaning and steam cleaning are preferred. Hand wiping is usually performed by rubbing the area where the resin is attached with paper, cloth, etc. impregnated with the composition while bringing it into contact with the area where the resin is attached, or by rubbing the area where the resin is attached with paper, cloth, etc. impregnated with the composition while bringing it into contact with the area where the resin is attached. Spray cleaning by spraying a cleaning aerosol composition is performed by spraying the cleaning aerosol composition as an aerosol onto the area where the resin is attached.

[0130] Examples of objects to be cleaned include the substrates mentioned above in the coating agent step (C1). Furthermore, it is preferable that the cleaning agent does not contain perfluoroheptene.

[0131] (Further possible compositions of the first and second solvent compositions) In addition to the foregoing, in resin solvents, resin adhesive solvents, resin coatings, mobile phases in liquid chromatography, and solvents for dissolving analytes in liquid chromatography, the preferred range for the content of component (A) when the total of component (A) and component (B) is 100 parts by weight may be the content described in the examples below that allows for the achievement of the desired effect (dissolution, adhesion, peeling, etc.) measured in each test example for a larger number of resins, and / or the content described that allows for the achievement of the desired effect measured in each test example for any resin in a shorter time. For example, in Table 1, when component (B) contains the component (B) shown in Table 1, the upper limit of the content of component (A) when the total of component (A) and component (B) is 100 parts by weight can be the content from Examples 1 to 17, and the lower limit of the content of component (A) can be the content from Examples 2 to 18, within the range that does not exceed the upper limit. The same applies to the content of component (A) described in other tables. [Examples]

[0132] The present invention will be described in further detail below with reference to examples, reference examples, and comparative examples, but the present invention is not limited to these examples. Unless otherwise specified, parts refer to parts by weight.

[0133] (Products used) The components used in the examples are as follows. The compositions of the examples, reference examples, and comparative examples were prepared by using the following components as they are or by mixing them, according to the composition (parts by weight) shown in the table.

[0134] 1. (A) Hexafluoroisopropanol (a-1) HFIP: 1,1,1,3,3,3-Hexafluoroisopropanol (1,1,1,3,3,3-Hexafluoro-2-propanol, manufactured by Tokyo Chemical Industry Co., Ltd.)

[0135] 2. (B) Halogenated organic compounds (b1) Fluorine-containing olefin (b1-1)1233Z: cis-1-chloro-3,3,3-trifluoropropene (HCFO-1233zd(Z), manufactured by Central Glass Co., Ltd.) (b1-2,b1-3) AS-300: AMOLEA (registered trademark) AS-300 (a mixture of (E)-1-chloro-2,3,3-trifluoropropene and (Z)-1-chloro-2,3,3-trifluoropropene exceeding 99% by mass and a stabilizer less than 1% by mass) (manufactured by AGC Inc.) (b1-4) SF33: Opteon (trademark) SF33 (HCFO-1336mzz(Z) 90% to 100% by mass) (manufactured by Mitsui Chemours Fluoroproducts Co., Ltd.) (b1-5) SF10: Opteon™ SF10 (Methoxyperfluoroheptene isomer mixture, over 99% by mass) (Manufactured by Mitsui Chemours Fluoroproducts Co., Ltd.) (b2) Hydrofluoroethers (excluding (b1) fluorinated olefins) (b2-1) HFE-347pc-f: 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether (manufactured by AGC Inc., Asahi Clean AE-3000) (b2-2,b2-3) Novec® 7100: A mixture of methyl nonafluoroisobutyl ether and methyl nonafluorobutyl ether (manufactured by 3M Japan Ltd., 3M® Novec® 7100 high-performance liquid) (b2-3) Methyl nonafluorobutyl ether (manufactured by Tokyo Chemical Industry Co., Ltd.) (b2-4,b2-5) Novec® 7200: A mixture of ethyl nonafluoroisobutyl ether and ethyl nonafluorobutyl ether (manufactured by 3M Japan Ltd., 3M® Novec® 7200 high-performance liquid) (b2-5) Ethyl nonafluorobutyl ether (manufactured by Tokyo Chemical Industry Co., Ltd.) (b2-6) Novec(trademark) 7300: 1,1,1,2,2,3,4,5,5,5-Decafluoro-3-methoxy-4-(trifluoromethyl)-pentane 99% to 100% by mass (manufactured by 3M Japan Limited, 3M(trademark) Novec(trademark) 7300 high-performance liquid) (b2-2) Methyl nonafluoroisobutyl ether (b2-4) Ethyl nonafluoroisobutyl ether In all of the following test examples, equivalent results were obtained when (b2-2, b2-3) was replaced with (b2-2) or (b2-3). Similarly, equivalent results were obtained when (b2-4, b2-5) was replaced with (b2-4) or (b2-5). (b3) Hydrofluorocarbon (b3-1) HFC-365mfc: 1,1,1,3,3-Pentafluorobutane (manufactured by Solvay Japan Ltd., SOLKANE® 365mfc) (b3-2) HFC-43-10mee: 1,1,1,2,2,3,4,5,5,5-Decafluoropentane 90% to 100% by mass (manufactured by Mitsui Chemours Fluoroproducts Co., Ltd., Vertrel® XF) (b3-3) HFC-c447ef: 1,1,2,2,3,3,4-heptafluorocyclopentane 98% or more (manufactured by Zeon Corporation, Zeolora® H) (b4) Hydrobromocarbon (b4-1) 1-Bromopropane (manufactured by Tokyo Chemical Industry Co., Ltd.) (b4-2) Isobutyl bromide (1-Bromo-2-methylpropane, manufactured by Tokyo Chemical Industry Co., Ltd.) (b5) Perfluoropolyether: Garden® HT135 (manufactured by Solvay Specialty Polymers Japan Ltd.) (b6-1) p-chlorotrifluorotoluene (manufactured by Tokyo Chemical Industry Co., Ltd.) (b6-2)trans-1,2-dichloroethylene (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0136] 3. (C) Further ingredients (c1) Ethanol (manufactured by Tokyo Chemical Industry Co., Ltd.) (c2) N-methyl-2-pyrrolidone (manufactured by Tokyo Chemical Industry Co., Ltd.) (c3) Propylene glycol monomethyl ether (manufactured by Tokyo Chemical Industry Co., Ltd.) (c4) Benzyl alcohol (manufactured by Tokyo Chemical Industry Co., Ltd.) (c5) Tetrahydrofuran (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0137] 4. Cured resin [Used in Test Examples 1, 2, 3, and 7] (1) Polylactic acid (PLA): (Polylactic acid) biodegradable plastic, natural, N, standard grade, purchased from Standard Test Piece Co., Ltd. (2) Acrylic: Acrypet (registered trademark) VH 001, Natural, Clear, manufactured by Mitsubishi Chemical Corporation (3) Acrylonitrile butadiene styrene (ABS): Denka ABS GR-2000, natural, milky white, manufactured by Denka Co., Ltd. (4) Polycarbonate (PC): Ranlite (registered trademark) AD5503, clear, manufactured by Teijin Limited. (5) Polybutylene terephthalate (PBT): DURANEX (registered trademark) 733LD EF2001, natural, white, manufactured by Polyplastics Co., Ltd. (6) Polyethylene terephthalate (PET(1)): BELLPET IP121B, natural, milky white, manufactured by Bell Polyester Products Co., Ltd. (7) Nylon 11 (PA11): Rilsan (registered trademark) BMN O NATURAL, manufactured by Arkema Corporation. (8) Nylon 66 (PA66): AMILAN (registered trademark) CM3006, natural, manufactured by Toray Industries, Inc. (9) Polyacetal (POM): Polypental acetal sheet, POM-NC1.0-500-1000, manufactured by Mitsubishi Chemical Advanced Materials Corporation. (10) Urethane: Urethane adhesive LOCTITE® Super Clear (manufactured by Henkel Japan Ltd.) was applied to a clear polypropylene cup (manufactured by Asahi Kasei Pax Corporation), left to stand for two days, peeled off the clear cup, and cut to prepare the product. (11) Nylon 12 (PA12): Risamid (registered trademark) AMN-O, natural, standard grade, manufactured by Arkema Corporation. (12) Nylon 6 (PA6): Amiran (registered trademark) CM1017, natural, milky white, unreinforced, manufactured by Toray Industries, Inc. (13) Nylon 46 (PA46): Novamid (registered trademark) 1010GN2-30, natural, white, manufactured by DSM Engineering Plastics Co., Ltd. (14) Polyphthalamide (PPA): Zytel (registered trademark) HTN51G35HSL BK083, black, manufactured by DuPont Ltd. (15) Polyetherimide (PEI): ULTEM® 1000, yellow transparent, general grade, manufactured by Saudi Basic Industries Corporation. (16) Polybutylene adipate terephthalate (PBAT) (17) Polyethylene terephthalate (PET(2)): Partition plate, transparent PET, 1.0mm thick, Order code: 74529157, No brand (MonotaRO) (18) Polyethylene terephthalate (PET(3)): A commercially available PET beverage bottle cut into approximately 5mm squares. [Used in Test Example 6] (19) Acrylic: Acrylic sheet (transparent), Specifications: Thickness 1mm, Width 100mm, Length 100mm, Order code: 45547101, No brand (Purchased from Monotaro) (20) Acrylonitrile butadiene styrene (ABS): ABS resin sheet, Model number: ABS-2B, Dimensions: 300mm x 200mm, Thickness: 1.0mm, Manufactured by Takachi Electric Industry Co., Ltd. (21) Polycarbonate (PC): Polycarbonate resin sheet, Part number: KPAC2005-1, Length 300mm, Thickness 0.5mm, Manufactured by Hikari Co., Ltd. (22) Polyethylene terephthalate (PET(2)): Partition plate, transparent PET, 1.0mm thick, Order code: 74529157, No brand (MonotaRO) (23) Nylon 66 (PA66): 66 nylon sheet, specifications: width 500mm, length 1m, thickness 1mm, manufactured by Kokugo Co., Ltd. (24) Polycarbonate film (PC film): Panlight (registered trademark) PC-2151, thickness 0.2 mm, manufactured by Teijin Limited.

[0138] 5. Equipment, instruments, etc. (1) Bottle: Standard bottle (manufactured by AS ONE Corporation, capacity 24 mL) (2) Balance: Electronic balance (Shimadzu Corporation, TX323N)

[0139] [Test Example 1] Curing Resin Dissolution Test (1) (Resin Amount: 3% by mass) 1. 0.3 g of the resin to be dissolved was weighed using an electronic balance and placed in a standard bottle. 2. 9.7 g of the solvent for the test was placed in the bottle prepared in step 1, and the lid was closed. 3. The time it took for the resin to disappear and dissolve was measured. 4. If resin remained after 48 hours, the test was terminated at that point. In the case of PEI resin, the test was terminated not after 48 hours, but after 10 days if PEI resin remained. [Judgment criteria] The time (in hours) required for the resin to completely dissolve is indicated. If the resin swelled or disintegrated, it was indicated with "●". Additionally, if the mixture of resin and solvent separated into two layers after 48 hours (or 10 days if the resin is PEI), it was indicated with "*". In the case of "*", there are two possibilities: either the resin and solvent have separated, or the solvent itself has separated into two layers. For example, if there is a time and an asterisk, such as "8*", it indicates that the resin dissolved into one layer of the solvent after 8 hours, and the solvent itself has separated into two layers.

[0140] [Test Example 2] Curing Resin Dissolution Test (2) (Resin Amount: 10% by mass) 1. 0.5 g of the resin to be dissolved was weighed using an electronic balance and placed in a standard bottle. 2. Place 4.5g of the solvent for the test into the bottle prepared in step 1 and close the lid. 3. The time it took for the resin to disappear and dissolve was measured. 4. If resin remained after 48 hours, the test was terminated at that point. [judgement] The evaluation criteria are the same as in "Test Example 1".

[0141] [Test Example 3] Curing Resin Dissolution Test (3) (Resin Amount: 0.1% by mass) 1. 0.01 g of the resin to be dissolved was weighed using an electronic balance and placed in a standard bottle. 2. Place 10g of the solvent for the test into the bottle prepared in step 1 and close the lid. 3. The time it took for the resin to disappear and dissolve was measured. 4. If resin remained after 48 hours, the test was terminated at that point. [Judgment criteria] The evaluation criteria are the same as in "Test Example 1".

[0142] [Test Example 4] Drying Test 1. A SUS flat plate (10cm square) was placed on the weighing pan of the electronic balance to stabilize it. 2. Using a Pasteur pipette, 0.2 g of the solvent composition was dropped onto the center of a SUS plate. 3. The time (in seconds) from the moment the solvent composition was added dropwise in step 2 until the solvent composition was completely dry (the balance showed 0.00 g) was measured.

[0143] [Test Example 5] Peel Test Peel test (1) 0.1g of UV-curing acrylic resin (Padico Corporation, UV Resin Taiyo no Shizuku Hard Type) was dropped onto a 1.20mm x 20mm x 0.1mm stainless steel plate, and cured for 10 minutes using a UV light EKO-UV36WEKO-U (product number: LU-36W-WN, manufactured by Eiko Co., Ltd.). 2. The SUS plate with the above UV-curable acrylic resin attached was immersed in a solvent composition (10g) in a 100ml beaker. 3. The immersion was continued for 24 hours, and the time it took for the UV-curing acrylic resin to peel off the SUS plate was observed. [Judgment criteria] ◎: The paint was removed within 8 hours. ○: The paint was removed within 24 hours, but not exceeding 8 hours. ×: The paint did not peel off even after more than 24 hours.

[0144] Peel test (2) 1. Brass grounding terminal green bolts (acrylic baked coating, manufactured by Takigen Manufacturing Co., Ltd., part number: C-209CS-M5 x 10) were immersed in the solvent composition (10g) in the standard bottle. 2. Four hours after the start of immersion, the degree of paint removal was checked. If the paint remained and had not been removed, the bolt was removed from the solvent composition and checked whether the paint could be rubbed off with a cloth. [Judgment criteria] ◎: The paint peeled off naturally. ○: The paint did not peel off naturally, but it could be mostly removed by rubbing it with a cloth. ×: The paint did not peel off naturally, and even when rubbing the paint with a cloth, most of the paint could not be removed.

[0145] Peel test (3) 1. An anodized aluminum plate, coated with a polyester primer (lower layer) and a urethane acrylic coating (upper layer), was immersed in a solvent composition (10g) in a standard bottle. 2. After 24 hours from the start of immersion, the degree of paint removal was checked. If the paint remained and had not been removed, the bolt was removed from the solvent composition and checked whether the paint could be rubbed off with a cloth. [Judgment criteria] The evaluation criteria are the same as for the peel test (2).

[0146] Peel test (4) 1. A polyester-coated copper wire (manufactured by Kyowa Harmonette Co., Ltd., product number: 1PEW) was cut into 4cm lengths and immersed in the solvent (10g) in the standard bottle. 2. The time it took for the polyester coating to peel off was checked. [Judgment criteria] The time required for peeling was recorded. If peeling did not occur after 24 hours, it was marked with "×".

[0147] [Test Example 6] Adhesion Test 1. The various resin sheets to be bonded were cut to 10mm x 30mm. 2. Two identical resin plates were prepared, and approximately 0.1 g of adhesive solvent was dropped onto the center of one side of each plate using a Pasteur pipette. (Only in the test examples marked ABS / PC, adhesion tests were conducted using different materials, ABS and PC.) 3. The two resin plates were brought into contact with each other at the points where the dissolving agent had been dropped, so that they were perpendicular (forming a cross shape), and then pressed down for 10 seconds. 4. After drying for 20 minutes, the adhesive strength was checked. [Judgment criteria] ◎: The adhesive was strong, and it was impossible to remove it by force. ○: The adhesive was working. However, it could be forcibly removed by hand. ×: It wasn't glued at all.

[0148] [Test Example 7] UV-curing resin disintegration test (1) 1. In the [Test Example 5] peel test (1), immersion was continued even when the resin peeled off, and the condition of the resin was observed after 24 hours. [Results] In the peel test (1), the example that received a "◎" rating showed that the resin fragmented and disintegrated. In the peel test (1), the example that received a "○" rating did not disintegrate spontaneously, but disintegrated when poked with tweezers. In the peel test (1), the comparative example that received a "×" rating did not disintegrate spontaneously and did not disintegrate even when poked with tweezers.

[0149] [Test Example 8] UV-curing resin disintegration test (2) 1. 0.1g of UV-curable urethane acrylate resin (manufactured by Henkel Japan Ltd., LOCTITE® 350) was dropped onto the surface and cured for 10 minutes using a UV light EKO-UV36WEKO-U (product number: LU-36W-WN, manufactured by Eiko Co., Ltd.). 2. The hardened resin was immersed in a solvent (10g). 3. We checked the time it took for the resin to disintegrate. [Judgment criteria] The time required for collapse is recorded. If collapse did not occur after 24 hours, it was marked with "×".

[0150] [Test Example 9] Resin Transparency Test 50 ml of each composition was placed in a 300 ml three-necked flask, a condenser (cooling water temperature: approximately 15°C) was attached to the top, and the mixture was heated and refluxed using a mantle heater. One PC plate or one acrylic plate (50 mm x 5 mm), suspended by wire, was placed in the vapor phase where vapor was being generated and dissolved. The time it took for the opaque cut surface to become transparent was measured. [Judgment criteria] ◎: Transparent effect achieved within 5 seconds. ○: It was made transparent within 10 seconds. ●: Partial transparency was achieved within 10 seconds. ×: Even after being exposed to steam for 10 seconds, it did not become transparent at all.

[0151] [Test Example 10] Liquid Chromatography Test In Test Example 1, the same procedure was followed except that 0.05 g of resin and 9.95 g of solvent were used to obtain a resin solution (resin amount: 0.5 mass%). This solution was subjected to size exclusion chromatography (SEC, gel permeation chromatography (GPC)) using a solvent of the same composition. The procedure was carried out using a Shodex GPC-104 (manufactured by Showa Denko K.K.) under the following conditions. Polymethyl methacrylate (PMMA) was used as the standard substance. Two LF-604 columns (manufactured by Showa Denko Corporation) were connected in series. Flow rate: 0.3ml / min Column temperature: 50°C Detector: Differential refractive index detector [Results] In the results of Test Example 1, when the compositions of Reference Example 1 and the examples in which the resin was dissolved within 24 hours (for PEI resin, examples in which it was dissolved within 5 days) were used with the resin in question, sharp waveform detection was possible when used as a solvent and mobile phase for sample preparation, and reproducibility was high. For the convenience of sample preparation, it was preferable when the sample could be dissolved within 8 hours. In the results of Test Example 1, when dissolution took more than 24 hours, and when dissolution was not possible after 48 hours (for PEI resin, when dissolution took more than 5 days, and when dissolution was not possible after 10 days), broad waveform detection was observed, and in the case of a mixture of multiple types, peaks overlapped, making analysis impossible. There was also concern about adsorption of the sample to the column.

[0152] [Test Example 11] Coating Test 1. 0.3 g of the resin to be used as the coating film was weighed using an electronic balance (Shimadzu Corporation, TX323N), dissolved in a solvent (9.7 g), and the coating agent was prepared. 2. Using a Pasteur pipette, 0.2 g of the solvent was dropped onto the center of the SUS plate. 3. The dropped coating agent was dried, and it was confirmed whether a film was formed as the resin dried. [Results] In Test Example 1, when the solvent compositions and component (A) of all examples in which the resin could be dissolved within 48 hours (all examples in which the resin could be dissolved within 10 days for PEI resin) were used as the solvent, a resin coating could be formed on a SUS plate. It became clear that even with the same resin, the coating pattern differed depending on the solvent used. Some of these are described below. Note that even when the resin was first dissolved in component (A), and then mixed with component (B) to obtain the composition of each example below, the results were the same as those of each example below.

[0153] [Example 515: Composition of Reference Example 1 (Component (A))] PLA, ABS, PET (PET(1). The same applies hereafter in Test Example 11.), PPA, PBAT: Transparent or translucent, and could be peeled off as a film. Acrylic, PA46, PA6: White in color, and could be peeled off as a film. PC: It was white and had several small holes, but it could be peeled off as a film. PBT and POM were white and could not be peeled off as a film. PA66, PA11, PA12: White in color and peeled off naturally as a film. [Example 516: Composition of Example 3] PLA, ABS, PET: Transparent or translucent, and could be peeled off as a film. Acrylic: It was white and could be peeled off as a film. PC: It was white and had several large holes, but it could be peeled off as a film. PBT and POM were white and could not be peeled off as a film. PA66 and PA11 were white and peeled off naturally as a film. [Example 517: Composition of Example 8] PLA, acrylic, ABS, PC, PET, PPA, PBAT: Transparent or translucent, and could be peeled off as a film. PA46 and PA6 were white and could be peeled off as a film. PBT: It was white and could not be peeled off as a film. PA66, PA11, PA12: White in color and peeled off naturally as a film. [Example 518: Composition of Example 13] PLA, acrylic, ABS, PC: Transparent or translucent, and could be peeled off as a film. PBT: It was white and could not be peeled off as a film. PA66 and PA11 were white and peeled off naturally as a film. [Example 519: Composition of Example 22] PLA, acrylic, ABS, PET: Transparent or translucent, and could be peeled off as a film. PC: It was white and had several large holes, but it could be peeled off as a film. PBT and POM were white and could not be peeled off as a film. PA66 and PA11 were white and peeled off naturally as a film. [Example 520: Composition of Example 27] PLA, acrylic, ABS, PET, PPA, PBAT: Transparent or translucent, and could be peeled off as a film. PA46 and PA6 were white and could be peeled off as a film. PC: It was white and had several large holes, but it could be peeled off as a film. PBT: It was white and could not be peeled off as a film. PA66, PA11, PA12: White in color and peeled off naturally as a film. [Example 521: Composition of Example 33] PLA, acrylic, ABS: Transparent or translucent, and could be peeled off as a film. PC: It was white, had several small holes, and showed significant unevenness, but it was possible to peel it off as a film. PBT: It was white and could not be peeled off as a film. PA66 and PA11 were white and peeled off naturally as a film. [Example 513: Composition of Example 41] PLA, acrylic, ABS, PET: Transparent or translucent, and could be peeled off as a film. PC: It was white and had several small holes, but it could be peeled off as a film. PBT and POM were white and could not be peeled off as a film. PA66 and PA11 were white and peeled off naturally as a film. [Example 523: Composition of Example 44] PLA, acrylic, ABS, PPA, PBAT: Transparent or translucent, and could be peeled off as a film. PA46 and PA6 were white and could be peeled off as a film. PBT: It was white and could not be peeled off as a film. PA66, PA11, PA12: White in color and peeled off naturally as a film. [Example 524: Composition of Example 60] PLA, acrylic, ABS, PET: Transparent or translucent, and could be peeled off as a film. PC: It was white and had several small holes, but it could be peeled off as a film. PBT and POM were white and could not be peeled off as a film. PA66 and PA11 were white and peeled off naturally as a film. [Example 525: Composition of Example 64] PLA, ABS, PPA, PBAT: Transparent or translucent, and could be peeled off as a film. Acrylic, PA46, PA6: White in color, and could be peeled off as a film. PBT: It was white and could not be peeled off as a film. PA66, PA11, PA12: White in color and peeled off naturally as a film. [Example 526: Composition of Example 69] PLA and ABS: Transparent or translucent, and could be peeled off as a film. PA66: It was white and peeled off naturally as a film. [Example 527: Composition of Example 101] PLA, ABS, PET: Transparent or translucent, and could be peeled off as a film. Acrylic: It was white and could be peeled off as a film. PBT: It was white and could not be peeled off as a film. PA66 and PA11 were white and peeled off naturally as a film. [Example 528: Composition of Example 104] PLA, acrylic, ABS, PPA, PBAT: Transparent or translucent, and could be peeled off as a film. PA46 and PA6 were white and could be peeled off as a film. PBT: It was white and could not be peeled off as a film. PA66, PA11, PA12: White in color and peeled off naturally as a film. [Example 529: Composition of Example 56] ABS: It was white and could not be peeled off as a film. PLA and PBT: They were white and had a wrinkled pattern, but could not be peeled off as a film. Acrylic: It was white, had a wrinkled pattern, showed significant unevenness, and could not be peeled off as a film. [Example 530: Composition of Example 52] PC: It was white and had several small holes, but it could be peeled off as a film. [Example 531: Composition of Example 51] PET: Transparent or translucent, and could be peeled off as a film. POM: It was white and could not be peeled off as a film. [Example 532: Composition of Example 55] PA66, PA11, PA46, PA6, PA12, PPA: White in color with a wrinkled pattern, but could be peeled off as a film. PBAT: Transparent or translucent, with multiple small holes, but it could be peeled off as a film. [Example 533: Composition of Example 149] PLA, acrylic, ABS, PET: Transparent or translucent, and could be peeled off as a film. PC: It was white, and a significant bias was observed in film formation. PBT and POM were white and could not be peeled off as a film. PA66 and PA11 were white and could be peeled off as a film. [Example 534: Composition of Example 150] PLA, acrylic, ABS, PET: Transparent or translucent, and could be peeled off as a film. PC: It was white, and a significant bias was observed in film formation. PBT: It was white and could not be peeled off as a film. PA66, PA11, PA46, PA6, PA12, PPA, PBAT: These were white and had a wrinkled pattern, but could be peeled off as a film.

[0154] [Test Example 12] Adhesives using resin-containing solvents The adhesion test of Test Example 6 was performed using a solvent containing the resin after testing in Example 8 or Example 27 of Test Example 1. [result] Acrylic, ABS, PC, PET(2), and PA66 were all bondable with any of the solvents containing the resins tested in Example 8 or Example 27 (equivalent to "◎" in Test Example 6).

[0155] [Test Example 13] Hand-washing test of UV-curable ink A Teflon® sheet (manufactured by Hakko Corporation, product number: A1542) coated with UV-curable ink (FD Acwares NGP Blue, manufactured by Toyo Ink Co., Ltd.) was hand-wiped twice with a cloth soaked in 10g of each composition. [result] The compositions of Reference Example 1 and Examples 1 to 163 were able to remove UV-curable ink.

[0156] [Test Example 14] Dissolution Test of PET Bottles A commercially available PET beverage bottle was cut into approximately 5mm squares to obtain PET resin pieces. Using an electronic balance, 0.3g of the PET resin piece was weighed and placed in a standard bottle. Furthermore, 9.7g of the composition for each example was added. After 24 hours, it was checked whether the PET resin piece had completely dissolved. If it was completely dissolved, the dissolved solution was spread on a stainless steel tray and dried for 24 hours. Note that the PET resin used in Test Example 14 is the same PET(3) used in Test Example 1, etc. [result] In Test Example 1, the PET(1) sample that was able to be dissolved within 24 hours was also able to be completely dissolved in the PET resin sample used in this test example. Furthermore, a film-like recycled PET resin material was obtained on a SUS (stainless steel) tray.

[0157] [Test Example 15] Washing Test Approximately 1.5 L of each composition was placed in an ultrasonic cleaner US-1KS manufactured by SND Corporation (oscillation frequency: 38 kHz, high-frequency output: 60 W). A SUS420 mold (approximately 50 mm x 40 mm x 30 mm) used for resin injection molding was immersed in the solution and ultrasonic cleaning was performed. Before immersion, each mold had hardened resin material adhering to it, consisting of one of the following: polycarbonate resin, ABS resin, acrylic resin, polyamide resin (PA11), polyethylene terephthalate resin, or polyvinyl chloride resin. At this time, the liquid temperature was approximately 35°C. After a certain period of time, the mold was removed from the solution and its cleanliness was visually evaluated. [judgement] The methods by which the cured resin material was removed from the mold included dissolution, swelling and disintegration, and peeling. These methods were evaluated as follows. ◎: After 1 hour of ultrasonic cleaning, no residual hardened resin was found on the surface of any of the molds. ○: After 3 hours of ultrasonic cleaning, no residual hardened resin was found on the surface of any of the molds. ●: After 8 hours of ultrasonic cleaning, no residual hardened resin was found on the surface of any of the molds. ×: Even after 8 hours of ultrasonic cleaning, residual hardened resin was observed on the surface of one of the molds.

[0158] [Test Example 16] Curing Resin Dissolution Test (4) (Resin Amount: 20% by mass) 1. 4.0 g of the resin to be dissolved was weighed using an electronic balance and placed in a standard bottle. 2. 16.0 g of the solvent for the test was placed in the bottle prepared in step 1, and the lid was closed. 3. The time it took for the resin to disappear and dissolve was measured. 4. If resin remained after 48 hours, the test was terminated at that point. [Judgment criteria] The evaluation criteria are the same as in "Test Example 1".

[0159] The results are summarized in the table below. In the table, "-" indicates that the task was not performed. Also, if "days" is not specified, the unit is "hours".

[0160] [Table 1]

[0161] [Table 2]

[0162] [Table 3]

[0163] [Table 4]

[0164] [Table 5]

[0165] [Table 6]

[0166] [Table 7]

[0167] [Table 8]

[0168] [Table 9]

[0169] [Table 10]

[0170] Table 11

[0171] Table 12

[0172] Table 13

[0173] Table 14

[0174] Table 15

[0175] Table 16

[0176] Table 17

[0177] Table 18

[0178] Table 19

[0179] Table 20

[0180] Table 21

[0181] Table 22

[0182] Table 23

[0183] Table 24

[0184] Table 25

[0185] Table 26

[0186] Table 27

[0187] Table 28

[0188] Table 29

[0189] Table 30

[0190] Table 31

[0191] Table 32

[0192] Table 33

[0193] Table 34

[0194] Table 35

[0195] Table 36

[0196] Table 37

[0197] Table 38

[0198] Table 39

[0199] Table 40

[0200] Table 41

[0201] Table 42

[0202] Table 43

[0203] Table 44

[0204] Table 45

[0205] Table 46

[0206] Table 47

[0207] Table 48

[0208] Table 49

[0209] Table 50

[0210] Table 51

[0211] [Table 52]

[0212] [Table 53]

[0213] [Table 54]

[0214] [Table 55]

[0215] [Table 56]

[0216] [Table 57]

[0217] The first solvent composition according to the present invention has excellent resin solubility and high safety. Furthermore, the second component (A) and the second solvent composition according to the present invention can be used as a resin adhesive, a clearing agent, a coating agent, a liquid chromatography method, a release agent, and a cleaning agent. Furthermore, the resin dissolving agents in Test Examples 1-3 and the resin stripping agent in Test Example 5 can dissolve or strip resins, respectively, and therefore can be used as cleaning agents for objects to be cleaned that have resin attached to them.

Claims

1. A solvent composition comprising (A) 1,1,1,3,3,3-hexafluoroisopropanol and (B) a halogenated organic compound, wherein the (B) halogenated organic compound is one or more selected from the group consisting of (b1) fluorine-containing olefin, (b2) hydrofluoroether (excluding (b1) fluorine-containing olefin), (b3) hydrofluorocarbon, (b4) hydrobromocarbon, (b5) perfluoropolyether, (b6-1) p-chlorobenzotrifluoride and (b6-2) trans-1,2-dichloroethylene.

2. (b1) Fluorine-containing olefins are (b1-1) cis-1-chloro-3,3,3-trifluoropropene, (b1-2) (E)-1-chloro-2,3,3-trifluoropropene, (b1-3) (Z)-1-chloro-2,3,3-trifluoropropene, (b1-4) (Z)-1,1,1,4,4,4-hexafluoro-2-butene, (b1-5) methoxyperfluoroheptene, (b1-6) 1,1-dichloro-3,3,3-trifluoropropene, (b1-7) 1 The solvent composition according to claim 1, wherein one or more are selected from the group consisting of 2-dichloro-3,3,3-trifluoropropene, (b1-8)1-chloro-1,3,3-trifluoropropene, (b1-9)(Z)-1-chloro-2,3,3,4,4,5,5-heptafluoro-1-pentene, (b1-10)(E)-1-chloro-2,3,3,4,4,5,5-heptafluoro-1-pentene and (b1-11)1,3-dichloro-3,3-difluoropropene.

3. (b2) Hydrofluoroethers (excluding (b1) fluorinated olefins) include (b2-1) 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether, (b2-2) methyl nonafluorobutyl ether, (b2-3) methyl nonafluoroisobutyl ether, (b2-4) ethyl nonafluoroisobutyl ether, (b2-5) ethyl nonafluorobutyl ether, and (b2-6) 1,1,1,2,2,3,4,5,5,5-deca. The solvent composition according to claim 1 or 2, comprising one or more selected from the group consisting of fluoro-3-methoxy-4-(trifluoromethyl)-pentane, (b2-7) 1,1,1,2,3,3-hexafluoro-4-(1,1,2,3,3,3-hexafluoropropoxy)pentane, (b2-8) 1,1,1,2,3,4,4,4-octafluoro-2-methoxy-3-(trifluoromethyl)butane, and (b2-9) methyl perfluoropropyl ether.

4. (b3) The solvent composition according to any one of claims 1 to 3, wherein the hydrofluorocarbon is one or more selected from the group consisting of (b3-1) 1,1,1,3,3-pentafluorobutane, (b3-2) 1,1,1,2,2,3,4,5,5,5-decafluoropentane, (b3-3) 1,1,2,2,3,3,4-heptafluorocyclopentane, (b3-4) 1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorooctane, (b3-5) 1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane and (b3-6) 1,1,1,2,2,3,3,4,4-nonafluorohexane.

5. (b4) The solvent composition according to any one of claims 1 to 4, wherein the hydrobromocarbon is one or more selected from the group consisting of (b4-1) 1-bromopropane and (b4-2) isobutyl bromide.

6. A resin solvent using the solvent composition described in any one of claims 1 to 5.

7. The resin solvent according to claim 6, wherein the resin is one or more selected from the group consisting of polyester resin, polyamide resin, acrylic resin, polycarbonate resin, polylactic acid resin, acrylonitrile-butadiene-styrene resin, urethane resin, polyacetal resin, styrene resin, fluororesin, polyphenylene ether resin, and polyetherimide resin.

8. (A) A resin adhesive using 1,1,1,3,3,3-hexafluoroisopropanol or a solvent composition according to any one of claims 1 to 5, wherein the adhesive forms an adhesive portion by dissolving the surface of the resin with component (A) or the solvent composition, and the adhesive is used to bond to another substrate via the adhesive portion.

9. A method for manufacturing an adhesive, comprising: step (A1): applying (A) 1,1,1,3,3,3-hexafluoroisopropanol or a solvent composition according to any one of claims 1 to 5 to a substrate containing one resin to form an adhesive portion; and step (B1): laminating a substrate containing the other resin to bond the substrates together via the adhesive portion.

10. (A) A resin clearing agent using 1,1,1,3,3,3-hexafluoroisopropanol or a solvent composition according to any one of claims 1 to 5, comprising the step of applying the clearing agent to the surface of the resin to dissolve the surface of the resin and remove the solvent portion of the clearing agent.

11. A method for making a resin transparent using the transparentizing agent described in claim 10, comprising the step of applying the transparentizing agent to the surface of the resin to dissolve the surface of the resin and remove the solvent portion of the transparentizing agent, wherein the method of applying the transparentizing agent is a method of contacting the transparentizing agent with its vapor or a method of coating the transparentizing agent.

12. (A) A method for dissolving a resin, characterized by dissolving the resin by bringing the vapor of 1,1,1,3,3,3-hexafluoroisopropanol or a solvent composition according to any one of claims 1 to 5 into contact with the resin.

13. (A) A method for dissolving a resin, characterized by dissolving the resin by applying 1,1,1,3,3,3-hexafluoroisopropanol or the solvent composition described in any one of claims 1 to 5 to the surface of the resin.

14. (A) A resin coating agent in which a resin is dissolved in 1,1,1,3,3,3-hexafluoroisopropanol or the solvent composition described in any one of claims 1 to 5.

15. A method for manufacturing a resin-coated substrate, comprising: step (C1): applying the resin coating agent described in claim 14 to a substrate to obtain a resin-coated substrate; and step (D1): removing the solvent portion of the coating agent from the resin-coated substrate to obtain a resin-coated substrate.

16. (A) A resin adhesive in which a resin is dissolved in 1,1,1,3,3,3-hexafluoroisopropanol or the solvent composition described in any one of claims 1 to 5.

17. A method for manufacturing an adhesive, comprising: step (E1): applying the adhesive described in claim 16 to one substrate; and step (F1): laminating the other substrate and bonding the substrates together via the adhesive.

18. (A) A liquid chromatography method characterized by performing liquid chromatography of a resin using 1,1,1,3,3,3-hexafluoroisopropanol or the solvent composition described in any one of claims 1 to 5 as the mobile phase.

19. (A) A liquid chromatography method characterized by dissolving a resin, which is an analytical sample, with 1,1,1,3,3,3-hexafluoroisopropanol or the solvent composition described in any one of claims 1 to 5.

20. The liquid chromatography method according to claim 18 or 19, wherein the liquid chromatography method is size exclusion chromatography.

21. (A) A resin release agent using 1,1,1,3,3,3-hexafluoroisopropanol or the solvent composition described in any one of claims 1 to 5.

22. The resin release agent according to claim 21, wherein the resin is one or more selected from the group consisting of polyester resin, polyamide resin, acrylic resin, polycarbonate resin, polylactic acid resin, acrylonitrile-butadiene-styrene resin, urethane resin, polyacetal resin, styrene resin, fluororesin, polyphenylene ether resin, and polyetherimide resin.

23. (A) A cleaning agent for removing resin from an object to be cleaned to which resin has adhered, using 1,1,1,3,3,3-hexafluoroisopropanol or the solvent composition described in any one of claims 1 to 5.

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