Ultracapacitor module with improved vibration resistance
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- KYOCERA AVX COMPONENTS CORP
- Filing Date
- 2026-03-02
- Publication Date
- 2026-06-02
AI Technical Summary
Ultracapacitor modules fail due to shocks and vibrations, leading to mechanical and performance issues such as damage to the housing, loosening of fasteners, and impaired performance, with existing damping solutions failing to provide adaptive stability over time.
The ultracapacitor module design includes a housing with interlocking mechanisms and adhesive connections that secure ultracapacitors, ensuring they maintain capacitance, equivalent series resistance, leakage current, operating voltage, and energy storage values within rated limits even under vibration profiles.
The module withstands vibration profiles, maintaining structural integrity and performance, passing tests for capacitance, resistance, leakage current, voltage, and energy storage, while minimizing damage and ensuring stability across a wide temperature range.
Smart Images

Figure 2026090549000001_ABST