electrostatic chuck
JP2026090623APending Publication Date: 2026-06-02TOTO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOTO LTD
- Filing Date
- 2026-03-06
- Publication Date
- 2026-06-02
AI Technical Summary
Technical Problem
Existing electrostatic chucks face issues with material compatibility and durability due to the interaction between the bonding layer and sealing portion, limiting the freedom in selecting optimal materials for both components.
Method used
The electrostatic chuck design incorporates a gap between the bonding layer and sealing portion, allowing for independent material selection based on their respective required properties, thereby preventing material interaction and enhancing durability.
Benefits of technology
This configuration enables the selection of optimal materials for both the bonding layer and sealing portion with high freedom, ensuring effective adhesion, heat transfer, and plasma resistance, while minimizing material alteration and stress.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026090623000001_ABST
Abstract
The present invention provides an electrostatic chuck that allows for the selection of the optimal material for both the bonding layer and the sealing portion with a high degree of freedom. [Solution] The electrostatic chuck 10 comprises a dielectric substrate 100, a base plate 200 that supports the dielectric substrate 100, a bonding layer 300 that joins the dielectric substrate 100 and the base plate 200, and a sealing portion 350 that covers the bonding layer 300 from the outer periphery. In this electrostatic chuck 10, there is a gap between the bonding layer 300 and the sealing portion 350.
Need to check novelty before this filing date? Find Prior Art