Semiconductor substrates, template substrates, methods and equipment for manufacturing semiconductor substrates, methods and equipment for manufacturing semiconductor devices, semiconductor devices
JP2026090664APending Publication Date: 2026-06-02KYOCERA CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- KYOCERA CORP
- Filing Date
- 2026-03-12
- Publication Date
- 2026-06-02
AI Technical Summary
Technical Problem
The existing methods for separating a grown semiconductor layer from a base substrate are not efficient, making it difficult to separate the two components effectively.
Method used
A semiconductor substrate design is introduced, featuring a base substrate, a mask pattern with specific thickness variations, and a base semiconductor portion, allowing for easier separation by etching along the interface between the mask portion and the base substrate.
Benefits of technology
This design facilitates the separation of the base substrate from the base semiconductor portion, reducing the time and complexity of the separation process while minimizing defects and cracking.
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Smart Images
Figure 2026090664000001_ABST
Abstract
To provide a semiconductor substrate in which the base substrate and the base semiconductor portion are easily separated. [Solution] The semiconductor substrate 10 comprises a base substrate BS, a mask pattern 6 having a mask portion 5 including a first portion B1 and a second portion B2 that is thicker than the first portion B1, and an opening K, and a base semiconductor portion 8 containing a nitride semiconductor and located on the opening K and the second portion B2.
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