Composition for Andafil and method for producing the Andafil composition

By using shape memory polymer composite particles with ceramic powder bonded to spherical particles, the underfill composition maintains low viscosity for filling and high thermal conductivity post-curing, addressing the viscosity-conductivity trade-off in semiconductor packaging.

JP2026091252APending Publication Date: 2026-06-03KOREA ADVANCED INST OF SCI & TECH
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
KOREA ADVANCED INST OF SCI & TECH
Filing Date
2025-11-05
Publication Date
2026-06-03

AI Technical Summary

Technical Problem

Existing underfill compositions for semiconductor packaging face a contradiction between maintaining low viscosity for capillary filling and achieving high thermal conductivity, as increasing thermal conductivity through ceramic fillers often leads to increased viscosity, and high aspect ratio particles hinder filling fairness.

Method used

Incorporating shape memory polymer composite particles with spherical shape memory polymer particles bonded to ceramic powder, which maintain low viscosity during filling and restore to a high aspect ratio shape post-curing, forming a heat conduction network.

Benefits of technology

The composition achieves low viscosity for capillary flow during filling and high thermal conductivity post-curing, enhancing heat dissipation and capillary filling characteristics in semiconductor packaging.

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Abstract

The present invention provides an underfill composition that maintains low viscosity during the underfill filling process and achieves high thermal conductivity after the underfill curing process, and a method for manufacturing the underfill composition. [Solution] The present invention presents an underfill material and a method for manufacturing the same, which can simultaneously achieve low filling viscosity and high heat dissipation performance by applying spherical, temporarily fixed, highly thermally conductive shape memory polymer composite particles to underfill, maintaining low viscosity during the filling process, and restoring the particles to a high aspect ratio shape at the curing temperature to form a heat conduction network between ceramics.
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