Shielded connector

Abstract

To stabilize the relative positional relationship between the outer conductor and the inner conductor. [Solution] The shield connector S comprises a dielectric 30 made of synthetic resin, an inner conductor 21 fixed to the circuit board P in an integrated state with respect to the dielectric 30, and an outer conductor 40 fixed to the circuit board P in a state surrounding the dielectric 30. The dielectric 30 has a first projection 61 and a second projection 62 that contact the outer conductor 40 in a plastically deformed state. Since the inner conductor 21 and the dielectric 30 are integrated via the first projection 61 and the second projection 62 which are plastically deformed relative to the outer conductor 40, relative displacement between the inner conductor 21 and the outer conductor 40 is suppressed.

Description

Technical Field

[0001] The present disclosure relates to a shield connector.

Background Art

[0002] Patent Document 1 discloses a shield connector for a printed circuit board. This shield connector has a resin inner housing, terminals, and a metal outer conductor. The terminals are attached to the inner housing by press-fitting or insert molding. The lead portions of the terminals are fixedly connected to be conductive with the circuit pattern of the printed circuit board. The outer shield shell covers the inner housing. The ground terminal of the outer shield shell is fixedly connected to be conductive with the ground pattern of the printed circuit board. In this type of shield connector, generally, the lead portions of the terminals and the ground terminal of the outer shield shell are fixedly attached to the printed circuit board by soldering.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the shield connector of Patent Document 1, the terminals and the inner housing are integrated by press-fitting or insert molding. On the other hand, the inner housing and the outer shield shell are assembled via the inner shield shell and the outer housing, so a relative displacement is possible, although slightly. Therefore, the relative positional relationship between the outer shield shell and the terminals is not stable.

[0005] The shielded connector of this disclosure is completed based on the circumstances described above and aims to stabilize the relative positional relationship between the outer conductor and the inner conductor. [Means for solving the problem]

[0006] The shielded connector disclosed herein is A dielectric made of synthetic resin, An inner conductor is fixed to the circuit board in an integrated state with the dielectric, The system comprises an outer conductor fixed to the circuit board while surrounding the dielectric, The dielectric material has protrusions formed on it that come into contact with the outer conductor in a plastically deformed state. [Effects of the Invention]

[0007] According to this disclosure, the relative positional relationship between the outer conductor and the inner conductor can be stabilized. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view showing the shield connector of Example 1 separated into the shield terminal and the housing. [Figure 2] Figure 2 is an exploded perspective view of the shield terminal. [Figure 3] Figure 3 is a perspective view of the shield terminal. [Figure 4] Figure 4 is a rear view of the shield terminal. [Figure 5] Figure 5 is a cross-sectional view taken along line AA in Figure 4. [Figure 6] Figure 6 is a cross-sectional view along line BB in Figure 4. [Figure 7] Figure 7 is a cross-sectional view along the CC line in Figure 4. [Figure 8] Figure 8 is a cross-sectional view of the DD line in Figure 4. [Modes for carrying out the invention]

[0009] [Description of Embodiments in this Disclosure] First, embodiments of this disclosure will be listed and described. Any combination of the following embodiments, insofar as they do not contradict each other, is also included as a form for carrying out the invention.

[0010] The shielded connector disclosed herein is (1) The device comprises a dielectric made of synthetic resin, an inner conductor fixed to a circuit board in an integrated state with respect to the dielectric, and an outer conductor fixed to the circuit board in a state surrounding the dielectric. The dielectric has protrusions formed thereon that contact the outer conductor in a plastically deformed state. According to the configuration of this disclosure, the inner conductor and the dielectric are integrated via the plastically deformed protrusions with respect to the outer conductor, so that the relative positional relationship between the outer conductor and the inner conductor is stable.

[0011] (2) In (1), the outer surface of the dielectric includes a positioning surface and a play-reducing surface positioned so as to sandwich the inner conductor between them and facing each other in opposite directions. Preferably, the positioning surface is in surface contact with the outer conductor, and the projection is formed on the play-reducing surface. With this configuration, the position of the dielectric and the inner conductor relative to the outer conductor is stabilized by making the positioning surface of the dielectric contact the outer conductor. This makes it possible to suppress changes in the position of the dielectric and the inner conductor relative to the outer conductor when the shield connector is subjected to vibration, etc.

[0012] (3)(2) In the play-reducing surface, a press-fit hole for housing the inner conductor is provided, and it is preferable that the protrusions are formed on both of the pair of non-opening regions of the play-reducing surface that sandwich the press-fit hole. With this configuration, the orientation of the dielectric relative to the outer conductor is more stable compared to a configuration in which the protrusions are formed on only one of the pair of non-opening regions.

[0013] (4) In (3), the opening of the press-fitting hole on the backlash filling surface has an elongated slit shape, and in the pair of non-opening regions, it is preferable that a plurality of the protruding portions are arranged at intervals in the length direction of the opening. According to this configuration, compared with a form in which the formation position of the protruding portion in each non-opening region is only at one place, the postures of the dielectric and the inner conductor with respect to the outer conductor are stabilized.

[0014] (5) In (4), the non-opening region has a shape elongated along the opening, and it is preferable that two of the protruding portions are arranged at both ends in the length direction of the non-opening region. According to this configuration, compared with a form in which the formation position of the protruding portion is set only in a region other than both ends of the non-opening region, the posture of the dielectric with respect to the outer conductor can be stabilized.

[0015] (6) In (5), it is preferable that the protruding portion forms an elongated rib extending along the opening. According to this configuration, within a limited range in the non-opening region, a wide contact area between the protruding portion and the outer conductor can be ensured, so that the displacement between the dielectric and the outer conductor can be effectively suppressed.

[0016] (7) In (2) to (6), the dielectric has the positioning surface and the backlash filling surface, and has a first accommodating portion whose length direction is oriented in a direction intersecting the circuit board, and a second accommodating portion protruding from an end portion of the positioning surface on the side opposite to the circuit board in the first accommodating portion. It is preferable that the protruding portion is arranged at both ends in the length direction of the first accommodating portion on the backlash filling surface. According to this configuration, in the length direction of the first accommodating portion, the protruding portion is arranged at two positions, the same position as the second accommodating portion and a position different from the second accommodating portion. Thereby, not only the posture of the first accommodating portion with respect to the outer conductor but also the posture of the second accommodating portion with respect to the outer conductor can be stabilized.

[0017] In (8) and (7), the outer conductor is formed by combining a first shell surrounding the first accommodating portion and a second shell surrounding the second accommodating portion, and the protruding portion preferably includes a first protruding portion that abuts against the first shell and a second protruding portion that abuts against the second shell. According to this configuration, one dielectric abuts against both the first shell and the second shell through the first protruding portion and the second protruding portion. According to this configuration, compared with a form in which the protruding portion abuts against only one of the first shell and the second shell, the contact range of the protruding portion with respect to the outer conductor becomes wider, so the posture of the dielectric with respect to the outer conductor becomes stable.

[0018] [Details of Embodiments of the Present Disclosure] [Example 1] The shield connector S of Example 1 embodying the present disclosure will be described with reference to FIGS. 1 to 8. The present invention is not limited to these examples, but is shown by the claims, and includes all modifications within the meaning and scope equivalent to the claims. In Example 1, for the front-back direction, the F direction in FIGS. 1 to 3, 5 to 8 is defined as the front. For the up-down direction, the H direction in FIGS. 1 to 6 is defined as the up. For the left-right direction, the R direction in FIGS. 1 to 4, 7, 8 is defined as the right.

[0019] The shield connector S of Example 1 is mounted in a state of being placed on the mounting surface M of the circuit board P (see FIGS. 4 to 6) and is fitted with a mating connector (not shown) attached to the terminal portion of a wire harness (not shown). The shield connector S is configured by assembling a housing 10 and shield terminals 20. Inside the housing 10, a terminal accommodating chamber 11 for accommodating the shield terminals 20 is formed. The terminal accommodating chamber 11 is open to the rear surface and the lower surface of the housing 10.

[0020] The shield terminal 20 is constructed by assembling an inner conductor 21, a dielectric 30, and an outer conductor 40. In a side view of the shield terminal 20, the inner conductor 21 is a single component with an L-shaped bend. The inner conductor 21 has a vertically elongated substrate connection portion 22 and a terminal connection portion 23 extending forward from the upper end of the substrate connection portion 22. The lower end of the substrate connection portion 22 is connected to the circuit board P. The terminal connection portion 23 is connected to the terminal fitting (not shown) of the mating connector.

[0021] The dielectric 30, like the inner conductor 21, has an L-shaped bend. The dielectric 30 is a single component having a first housing portion 31 that houses the substrate connection portion 22 and a second housing portion 32 that houses the terminal connection portion 23. The first housing portion 31 is a vertically elongated rectangular prism. The second housing portion 32 is a cylindrical portion that protrudes forward from the upper end of the first housing portion 31. The upper end of the first housing portion 31 is concentric with the second housing portion 32 and has an arc shape. A press-fit hole 33 for housing the inner conductor 21 is formed inside the dielectric 30. The press-fit hole 33 opens to the rear and bottom surfaces of the first housing portion 31 and to the front end surface of the second housing portion 32. The inner conductor 21 is integrated with the dielectric 30 by being press-fitted into the press-fit hole 33 from the rear of the dielectric 30.

[0022] The front surface of the first housing section 31 consists of a single plane. The front surface of the first housing section 31 is defined as the positioning surface 35. The rear surface of the first housing section 31 is defined as the first play-reducing surface 36. The opening 34 of the press-fit hole 33 in the first play-reducing surface 36 is a vertically elongated slit shape. The areas of the first play-reducing surface 36 adjacent to the left and right sides of the opening 34 are defined as a pair of symmetrical non-opening areas 37. The non-opening areas 37 have a vertically elongated shape. The areas of the left and right outer surfaces of the first housing section 31 below the arc-shaped portion concentric with the second housing section 32 are defined as the second play-reducing surface 38.

[0023] The outer conductor 40 is constructed by assembling a first metal shell 41 and a second metal shell 42. The first shell 41 and the second shell 42 are parts formed by casting, forging, machining, etc. The first shell 41 is a single part having a bottom wall portion 43 and a rear wall portion 44 that protrudes upward from the rear end of the bottom wall portion 43. A positioning hole 45 is formed in the bottom wall portion 43, penetrating the bottom wall portion 43 in the front-rear direction. In a plan view of the shield connector S (outer conductor 40) from above, the opening shape of the positioning hole 45 is rectangular. The rear surface of the inner circumferential surface of the positioning hole 45 is continuous and flush with the front surface of the rear wall portion 44.

[0024] The second shell 42 is a single component having a box portion 46 and a cylindrical portion 52. The box portion 46 has a front wall portion 47, an upper wall portion 48, and a pair of left and right side wall portions 49. The upper wall portion 48 is a portion that extends rearward from the upper edge of the front wall portion 47. The pair of side wall portions 49 are portions that are connected perpendicularly to the left and right side edges of the front wall portion 47 and the left and right side edges of the upper wall portion 48. The lower ends of the side wall portions 49 protrude downward below the lower end of the front wall portion 47. The second shell 42 has a plurality (two pairs in this embodiment 1) of grounding connection portions 50 for connecting to the ground circuit (not shown) of the circuit board P. The grounding connection portions 50 protrude downward from both the front and rear ends on the lower surface of each side wall portion 49. The cylindrical portion 52 is a portion that protrudes forward from the front wall portion 47 with its axis in the front-rear direction. The internal space of the box section 46 and the internal space of the cylindrical section 52 are in communication with each other. The internal space of the box section 46 is open to the rear and bottom surfaces of the box section 46.

[0025] The outer conductor 40 is constructed by assembling the first shell 41 to the second shell 42 from below. The first shell 41 and the second shell 42 are integrated by press-fitting. The press-fitting locations are, for example, between the left and right outer surfaces of the rear wall portion 44 and the left and right inner surfaces of the side wall portion 49, and between the left and right outer surfaces of the bottom wall portion 43 and the left and right inner surfaces of the side wall portion 49. When the first shell 41 and the second shell 42 are assembled, the bottom wall portion 43 closes the opening on the lower surface of the box portion 46, and the rear wall portion 44 closes the opening on the rear surface of the box portion 46. Inside the outer conductor 40, an L-shaped housing space 53 is formed for housing the dielectric 30. When the dielectric 30 is not housed, the front end of the housing space 53 opens to the front end surface of the cylindrical portion 52. The lower end of the housing space 53 opens to the lower surface of the bottom wall portion 43 at the positioning hole 45.

[0026] When assembling the shield connector S, first, the inner conductor 21 is press-fitted into the press-fit hole 33 from the rear of the dielectric 30. The dielectric 30 with the press-fitted inner conductor 21 is then housed in the internal space of the second shell 42 from the rear of the second shell 42. Next, the first shell 41 is assembled onto the second shell 42 by fitting the positioning hole 45 into the lower end of the first housing portion 31. Once the first shell 41 and the second shell 42 are assembled, the outer conductor 40 is formed, and at the same time, the dielectric 30 is housed within the housing space 53 of the outer conductor 40. This completes the assembly of the shield terminal 20. The assembly of the shield connector S is completed by housing the assembled shield terminal 20 inside the housing 10.

[0027] When the shield connector S is mounted on the circuit board P, the grounding connection portion 50 of the outer conductor 40 is inserted into the grounding insertion hole G of the circuit board P and is fixed in a conductive manner to the ground circuit (not shown) by soldering. The board connection portion 22 of the inner conductor 21, which protrudes downward from the lower end surface of the first housing portion 31, is inserted into the through hole H of the circuit board P and is fixed in a conductive manner to the printed circuit of the circuit board P by soldering.

[0028] The lower end of the first housing portion 31 is fitted into a positioning hole 45 that opens into the bottom surface of the outer conductor 40 (first shell 41). Due to dimensional tolerances between the first housing portion 31 and the first shell 41, there is a concern that the first housing portion 31 and the substrate connection portion 22 may be misaligned or become loose in the front-to-back or left-to-right directions within the positioning hole 45. To address this, the dielectric 30 (first housing portion 31) is provided with a positioning surface 35, a plurality of first protrusions 61, and a plurality of second protrusions 62.

[0029] The first projection 61 is the portion of the outer conductor 40 that is in close contact with the first shell 41. The first projection 61 is located at six locations: the upper and lower ends of the pair of non-opening regions 37 (first backfill surfaces 36) and the lower ends of both the left and right second backfill surfaces 38. The second projection 62 is the portion of the outer conductor 40 that is in close contact with the second shell 42. The second projection 62 is located at the upper ends of both the left and right second backfill surfaces 38. The two second projections 62 protrude in opposite directions from the second backfill surfaces 38 in the left-right direction.

[0030] In a plan view, the outer surfaces of the first projection 61 and the second projection 62 are arc-shaped. In a rear view of the dielectric 30 (shield connector S) viewed from behind, the first projection 61 has an elongated shape in the vertical direction. In a side view of the dielectric 30 viewed from the side, the first projection 61 and the second projection 62 have an elongated shape in the vertical direction. The longitudinal direction of the first projection 61 is parallel to the assembly direction of the dielectric 30 and the first shell 41.

[0031] When the outer conductor 40 and dielectric 30 are assembled, the positioning surface 35 abuts the inner surface of the outer conductor 40 (housing space 53) from the rear in a surface contact state. Specifically, the lower end region of the positioning surface 35 is in close contact with the front surface of the inner circumferential surface of the positioning hole 45 from the rear. The upper end region of the positioning surface 35 is in close contact with the rear surface of the front wall portion 47 of the second shell 42 from the rear. Two first protrusions 61 located at the lower end of the first play-reducing surface 36 (non-opening region 37) are in close contact with the rear surface of the inner circumferential surface of the positioning hole 45 from the front. By the positioning surface 35 and the first protrusions 61 of the non-opening region 37 being in close contact with the inner surface of the positioning hole 45 (first shell 41) in the front-rear direction, the first housing portion 31 and the lower end of the inner conductor 21 are positioned in the front-rear direction relative to the first shell 41.

[0032] When the outer conductor 40 and dielectric 30 are assembled, the two first protrusions 61 located at the lower end of the second play-reducing surface 38 are in close contact with the left and right inner surfaces of the inner circumferential surface of the positioning hole 45 in the left-right direction. The two second protrusions 62 located at the upper end of the second play-reducing surface 38 are in close contact with the inner surfaces of the left and right side wall portions 49 of the second shell 42 in the left-right direction and from opposite directions. The first housing portion 31 is positioned in the left-right direction relative to the outer conductor 40 by the close contact of the first protrusions 61 and the second protrusions 62 with the side wall portions 49. The two first protrusions 61 located at the upper end of the first play-reducing surface 36 (non-opening region 37) are in close contact with the front surface of the rear wall portion 44 of the first shell 41 from the front.

[0033] The first projection 61 and the second projection 62 undergo plastic deformation due to interference with the outer conductor 40 during the assembly process of the dielectric 30 and the outer conductor 40, and adhere tightly to the outer conductor 40 under pressure. The contact of the positioning surface 35 with respect to the outer conductor 40 and the tight adhesion of the first projection 61 and the second projection 62 with respect to the outer conductor 40 under pressure position the lower ends of the first housing portion 31 and the substrate connection portion 22 within the positioning hole 45 in a two-dimensional direction (front-to-back and left-to-right direction) parallel to the mounting surface M of the circuit board P. As a result, the outer conductor 40 and the inner conductor 21 are maintained in the desired positional relationship on the mounting surface M of the circuit board P.

[0034] The shield connector S of this embodiment 1 comprises a dielectric 30 made of synthetic resin, an inner conductor 21, and an outer conductor 40. The inner conductor 21 is fixed to the circuit board P in an integrated state with respect to the dielectric 30. The outer conductor 40 is fixed to the circuit board P in a state surrounding the dielectric 30. The dielectric 30 has a first projection 61 and a second projection 62 formed thereon that contact the outer conductor 40 in a state of plastic deformation. With this configuration, the inner conductor 21 and the dielectric 30 are integrated via the first projection 61 and the second projection 62 which are plastically deformed relative to the outer conductor 40, so that the relative displacement between the inner conductor 21 and the outer conductor 40 is suppressed. As a result, the relative positional relationship between the outer conductor 40 and the inner conductor 21 is stabilized. Furthermore, when the shield connector S is subjected to vibration, it is possible to suppress the concentration of stress at the fixing points between the inner conductor 21 and the circuit board P, and between the outer conductor 40 and the circuit board P, due to the relative displacement between the inner conductor 21 and the outer conductor 40.

[0035] The outer surface of the dielectric 30 has a positioning surface 35 and a first backlash reduction surface 36. The positioning surface 35 and the first backlash reduction surface 36 are positioned so as to sandwich the inner conductor 21 between them and face each other in opposite directions in the front-rear direction. The positioning surface 35 is in surface contact with the first shell 41 and the second shell 42 of the outer conductor 40. A first projection 61 is formed on the first backlash reduction surface 36. With this configuration, by making the positioning surface 35 of the dielectric 30 surface contact with the outer conductor 40, the orientation of the dielectric 30 and the inner conductor 21 relative to the outer conductor 40 is stabilized. This makes it possible to suppress changes in the orientation of the dielectric 30 and the inner conductor 21 relative to the outer conductor 40 when the shield connector S is subjected to vibration, etc.

[0036] A press-fit hole 33 for housing the inner conductor 21 is opened in the first play-reducing surface 36. First protrusions 61 are formed in both of the pair of non-opening regions 37 on the left and right sides of the first play-reducing surface 36 that straddle the opening 34 of the press-fit hole 33. With this configuration, the orientation of the dielectric 30 relative to the outer conductor 40 is more stable compared to a configuration in which a protrusion is formed in only one of the pair of non-opening regions 37.

[0037] The opening 34 of the press-fit hole 33 in the first play-filling surface 36 is elongated in the vertical direction, forming a slit shape. In the pair of non-opening regions 37, a plurality of first protrusions 61 are arranged at intervals along the length of the opening 34. With this configuration, the orientation of the dielectric 30 and the inner conductor 21 relative to the outer conductor 40 is more stable compared to a configuration in which there is only one position for forming a protrusion in each non-opening region 37.

[0038] The non-opening region 37 has an elongated shape that extends vertically along the opening 34. Two first protrusions 61 are positioned at both ends of the non-opening region 37 in the longitudinal direction. With this configuration, the orientation of the dielectric 30 relative to the outer conductor 40 can be stabilized compared to a configuration in which the protrusions are formed only in areas other than both ends of the non-opening region 37.

[0039] The first projection 61 and the second projection 62 form elongated ribs that extend along the opening 34. With this configuration, within the limited range of the non-opening region 37, the contact area between the first projection 61 and the outer conductor 40, and the contact area between the second projection 62 and the outer conductor 40 can be made large, thereby effectively suppressing misalignment between the dielectric 30 and the outer conductor 40.

[0040] The dielectric 30 has a first housing portion 31 and a second housing portion 32. The first housing portion 31 has a positioning surface 35 and a first backlash reduction surface 36. The first housing portion 31 is oriented in a vertical direction that intersects the circuit board P along its length. The second housing portion 32 is shaped to protrude forward from the end of the positioning surface 35 of the first housing portion 31 opposite to the circuit board P. The first projection 61 is positioned at both ends of the first backlash reduction surface 36 along the length of the first housing portion 31. With this configuration, the first projection 61 is positioned at two locations along the length of the first housing portion 31: at the same position as the second housing portion 32 and at a different position from the second housing portion 32. This stabilizes not only the orientation of the first housing portion 31 relative to the outer conductor 40, but also the orientation of the second housing portion 32 relative to the outer conductor 40.

[0041] The outer conductor 40 is formed by combining a first shell 41 that surrounds the first housing portion 31 and a second shell 42 that surrounds the second housing portion. The projection includes a first projection 61 that abuts against the first shell 41 and a second projection 62 that abuts against the second shell 42. With this configuration, one dielectric 30 abuts against both the first shell 41 and the second shell 42 via the first projection 61 and the second projection 62. With this configuration, the contact range of the projection with respect to the outer conductor 40 is wider compared to a configuration in which the projection abuts against only one of the shells, so the orientation of the dielectric 30 with respect to the outer conductor 40 is more stable.

[0042] [Other examples] The present invention is not limited to the embodiments described above and in the drawings, but is shown in the claims. The present invention includes the meaning of equivalents of the claims and all modifications within the claims, and also includes the following embodiments. The dielectric material does not necessarily have a positioning surface that makes surface contact with the outer conductor. In this case, a projection can be formed on the outer surface corresponding to the positioning surface. A projection may be formed in only one of the two non-opening regions on the gap-filling surface. The formation location of the protrusion in each non-opening region may be one location or three or more locations. The protrusions may be placed only in areas other than the edges of the non-opening region. The shape of the protrusion is not limited to an elongated rib with an arc-shaped cross-section; it may also be spherical or a rib with a triangular cross-section. The projection may be configured to contact only one of the shells, either the first shell or the second shell. The protrusion may be formed on both the first and second housing portions, or it may be formed only on the second housing portion. The opening shape of the press-fit hole in the play-filling surface is not limited to a slit shape; it may also be a wide rectangle or the like. The inner conductor and dielectric may have shapes other than L-shape. The inner conductor may be integrated with the dielectric by insert molding. In this case, the dielectric may have no press-fit holes, openings, or non-opening regions. [Explanation of symbols]

[0043] G... Grounding insertion hole H...Through hole M…Mounting surface P...Circuit board S...Shielded connector 10… Housing 11…Terminal housing room 20...Shield terminal 21...Inner conductor 22... Circuit board connection section 23...Terminal connection section 30…Dielectric 31...First Detention Unit 32...Second Detention Unit 33…Press-fit hole 34…Opening of the press-fit hole 35…Positioning surface 36...First gap-filling surface (gap-filling surface) 37…Non-opening area 38...Second groove filling surface 40…Outer conductor 41...First Shell 42... Second Shell 43...Bottom wall 44...Rear wall part 45…Positioning holes 46...Hakobe 47...Front wall part 48...Top wall part 49... Side wall section 50...Grounding connection 52...Cylindrical part 53…Containment space 61...First protrusion (protrusion) 62…Second protrusion (protrusion)

Claims

1. A dielectric made of synthetic resin, An inner conductor is fixed to the circuit board in an integrated state with the dielectric, The system comprises an outer conductor fixed to the circuit board while surrounding the dielectric, A shielded connector having a projection formed on the dielectric that contacts the outer conductor in a plastically deformed state.

2. The outer surface of the dielectric includes a positioning surface and a backlash-reducing surface that are positioned so as to sandwich the inner conductor between them and face each other in opposite directions. The positioning surface contacts the outer conductor in a surface contact state, The shield connector according to claim 1, wherein the projection is formed on the play-reducing surface.

3. The aforementioned play-reducing surface has an opening for a press-fit hole in which the inner conductor is housed. The shield connector according to claim 2, wherein the projection is formed on both of the pair of non-opening regions of the play-reducing surface that sandwich the press-fit hole.

4. The opening of the press-fit hole in the aforementioned play-filling surface is in the shape of an elongated slit. The shield connector according to claim 3, wherein a plurality of the protrusions are arranged at intervals in the longitudinal direction of the opening in the pair of non-opening regions.

5. The non-opening region has a long, narrow shape that extends along the opening. The shield connector according to claim 4, wherein the two protrusions are arranged at both ends in the longitudinal direction of the non-opening region.

6. The shield connector according to claim 5, wherein the projection is an elongated rib extending along the opening.

7. The dielectric is A first housing portion having the positioning surface and the play-reducing surface, and whose longitudinal direction is oriented in a direction intersecting the circuit board, The positioning surface has a second housing portion that protrudes from the end of the first housing portion opposite to the circuit board, The aforementioned projection is The shield connector according to any one of claims 2 to 5, wherein the play-reducing surface is arranged at both ends in the longitudinal direction of the first housing portion.

8. The outer conductor is formed by combining a first shell that surrounds the first housing portion and a second shell that surrounds the second housing portion. The shield connector according to claim 7, wherein the projection includes a first projection that abuts against the first shell and a second projection that abuts against the second shell.

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