Semiconductor equipment

Abstract

To provide a semiconductor device that can stably maintain a connection with external terminals over a long period of time. [Solution] The semiconductor device comprises a substrate, a semiconductor chip mounted on the substrate, terminals electrically connected to the semiconductor chip, a resin component provided with a first groove and a second groove, a first fastening member fitted into the first groove, and a second fastening member fitted into the second groove. The ends of the terminals are positioned to be fastened to the first fastening member or the second fastening member. The resin component includes a weld portion positioned between the first groove and the second groove.

Claims

1. circuit board and A semiconductor chip mounted on the aforementioned substrate, The aforementioned semiconductor chip has a terminal that is electrically connected to it, A resin part having a first groove and a second groove, The first fastening member fitted into the first groove, The device comprises a second fastening member fitted into the second groove, The end of the terminal is positioned to be fastened with the first fastening member or the second fastening member. The resin component includes a weld portion disposed between the first groove and the second groove, and is a semiconductor device.

2. The semiconductor device according to claim 1, wherein at least one of the first fastening member and the second fastening member is a nut.

3. The semiconductor device according to claim 1 or claim 2, wherein the strength per unit volume of the resin in the first region located between the outer circumferential surface of the resin part and the first groove is higher than the strength per unit volume of the resin in the second region located between the first groove and the second groove.

4. circuit board and A semiconductor chip mounted on the aforementioned substrate, The aforementioned semiconductor chip has a terminal that is electrically connected to it, A resin part having a first groove and a second groove, The first fastening member fitted into the first groove, The device comprises a second fastening member fitted into the second groove, The end of the terminal is positioned to be fastened with the first fastening member or the second fastening member. A semiconductor device wherein the strength per unit volume of the resin in the first region located between the outer circumferential surface of the resin part and the first groove is higher than the strength per unit volume of the resin in the second region located between the first groove and the second groove.

5. The semiconductor device according to claim 4, wherein the resin injection hole is located at a position with high resin strength.

6. The semiconductor device according to claim 1 or claim 4, wherein the resin material is polyphenylene sulfide or polybutylene terephthalate.

7. The external shape of the resin component is rectangular when viewed in the thickness direction of the substrate. The aforementioned resin part is provided with a third groove and a fourth groove. The semiconductor device further comprises a third fastening member fitted into the third groove and a fourth fastening member fitted into the fourth groove, The first groove, the second groove, the third groove, and the fourth groove are each provided in areas close to the four corners when viewed in the thickness direction of the substrate. The distance between the first groove and the second groove is shorter than the distance between the first groove and the third groove. The semiconductor device according to claim 1 or claim 2, wherein the weld portion includes a first weld region disposed between the first groove and the second groove, and a second weld region disposed between the third groove and the fourth groove.

8. The external shape of the resin component is rectangular when viewed in the thickness direction of the substrate. The aforementioned resin part is provided with a fifth groove, The semiconductor device further comprises a fifth fastening member fitted into the fifth groove, When viewed in the thickness direction of the substrate, the first groove, the second groove, and the fifth groove are arranged in a line with the second groove in the center. The semiconductor device according to claim 1 or claim 2, wherein the weld portion includes a third weld region disposed between the first groove and the second groove, and a fourth weld region disposed between the second groove and the fifth groove.

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