Semiconductor equipment
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SEMICON ENERGY LAB CO LTD
- Filing Date
- 2026-02-24
- Publication Date
- 2026-06-09
AI Technical Summary
【0017】 単位面積あたりの記憶容量の大きい半導体装置を提供することができる。または、メモ リセルを積層した新規な構造の半導体装置を提供することができる。または、新規な構造 の半導体装置の駆動方法を提供することができる。
Smart Images

Figure 2026094238000001_ABST
Abstract
Claims
1. The substrate has memory cells on top of it. The memory cell comprises a first transistor, a second transistor, and a capacitive element. The first transistor comprises a cylindrical semiconductor having a height perpendicular to the upper surface of the substrate, and a first conductive layer. The cylindrical semiconductor has a channel-forming region, The first conductive layer has the function of being the gate electrode of the first transistor, one of the electrodes of the capacitive element, and one of the source electrode or drain electrode of the second transistor. The aforementioned second transistor has an oxide semiconductor layer, an insulating layer, and a second conductive layer. The oxide semiconductor layer has a channel formation region, The insulating layer has a region located above the first conductive layer and a region located above the oxide semiconductor layer, and functions as a gate insulating layer for the second transistor. The second conductive layer has a region located above the insulating layer and functions as the gate electrode of the second transistor. The semiconductor device wherein the first conductive layer has a region in contact with the side surface of the oxide semiconductor layer and a region in contact with the top surface.
2. In claim 1, The second transistor has a third conductive layer, The third conductive layer has a region that functions as either a source electrode or a drain electrode, A semiconductor device wherein the third conductive layer has a region in contact with a cylindrical conductor having height in a direction perpendicular to the upper surface of the substrate.