Light-emitting device

Abstract

To provide a light-emitting device that is lightweight, resistant to damage, and flexible. [Solution] A first flexible substrate, a second flexible substrate, an element layer, a first adhesive layer, and The device has two adhesive layers, and the element layer has a light-emitting element, and the element layer has a first flexible substrate and The first adhesive layer is located between the two flexible substrates, and between the first flexible substrate and the element layer. Furthermore, the second adhesive layer is located between the second flexible substrate and the element layer, and extends beyond the edge of the element layer. On the side, the first adhesive layer and the second adhesive layer are in contact, and the edge of the element layer, the edge of the first adhesive layer, and Outside the edge of the second adhesive layer, the first flexible substrate and the second flexible substrate are in contact. It is a light device.

Description

[Technical Field]

[0001] The present invention relates to products, methods, and methods of manufacture. The present invention also relates to processes, machines, and manufacturing processes. This invention relates to materials and compositions of matter. In particular, the present invention One embodiment includes semiconductor devices, light-emitting devices, display devices, electronic devices, lighting devices, and methods for manufacturing the same. Regarding the law. In particular, electroluminescence. Light-emitting devices, display devices, electronic devices, lighting devices, and utilizing the e (hereinafter also referred to as EL) phenomenon. This concerns the methods for producing them. [Background technology]

[0002] In recent years, light-emitting devices and display devices are expected to have applications in a variety of uses, and diversification is required. Yes, they are.

[0003] For example, light-emitting devices and display devices for portable devices and the like require to be thin and lightweight. Alternatively, it is required to be resistant to damage, etc.

[0004] Light-emitting elements (also written as EL elements) that utilize the EL phenomenon are easy to make thin and light, input signal It has features such as being able to respond quickly to signals and being able to be driven using a DC low-voltage power supply. Applications in light-emitting devices and display devices are being considered.

[0005] For example, Patent Document 1 describes a film substrate on which a switching element such as a transistor or organic A flexible active-matrix light-emitting device equipped with an EL element is disclosed. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2003-174153 [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] One aspect of the present invention provides a novel light-emitting device, display device, electronic device, or lighting device. One of the objectives is to provide a lightweight light-emitting device, display device, electronic device. Alternatively, one aspect of the present invention provides a lightweight light-emitting device, display device, electronic device. One objective is to provide a device or lighting apparatus. Alternatively, one aspect of the present invention is to provide a device or lighting apparatus. The objective is to provide highly reliable light-emitting devices, display devices, electronic devices, or lighting devices. Alternatively, one aspect of the present invention is a light-emitting device, display device, electronic device that is less prone to damage, if One objective is to provide a lighting device. Alternatively, one aspect of the present invention is to provide a thin device. One of the objectives is to provide light-emitting devices, display devices, electronic devices, or lighting devices. Alternatively, one aspect of the present invention relates to a light-emitting device, display device, electronic device, or One objective of this invention is to provide a lighting device. Alternatively, one aspect of this invention provides a high-luminance lighting device. One of the objectives is to provide optical devices, display devices, electronic devices, or lighting devices. One aspect of the present invention relates to a low-power light-emitting device, display device, electronic device, or lighting device. One of the objectives is to provide a place for this purpose.

[0008] Furthermore, one aspect of the present invention relates to a light-emitting device and display device that are lightweight, resistant to damage, and flexible. One of the objectives is to provide electronic equipment or lighting devices.

[0009] It should be noted that one aspect of the present invention does not need to solve all of these problems. [Means for solving the problem]

[0010] A light-emitting device according to one aspect of the present invention includes a first flexible substrate, a second flexible substrate, an element layer, a first adhesive layer, and a second adhesive layer. The element layer has a light-emitting element, and the element layer is located between the first flexible substrate and the second flexible substrate. The first adhesive layer is located between the first flexible substrate and the element layer, and the second adhesive layer is located between the second flexible substrate and the element layer. The first adhesive layer and the second adhesive layer are in contact with each other outside the end of the element layer, and the first flexible substrate and the second flexible substrate are in contact with each other outside the end of the element layer, the end of the first adhesive layer, and the end of the second adhesive layer.

[0011] Alternatively, one aspect of the present invention includes a first flexible substrate, a second flexible substrate, an element layer, a first adhesive layer, a second adhesive layer, and a third adhesive layer. The element layer has a light-emitting element, and the element layer is located between the first flexible substrate and the second flexible substrate. The first adhesive layer is located between the first flexible substrate and the element layer, and the second adhesive layer is located between the second flexible substrate and the element layer. The third adhesive layer, the first flexible substrate, and the second flexible substrate overlap outside the end of the element layer, the end of the first adhesive layer, and the end of the second adhesive layer. It is a light-emitting device.

[0012] For example, it is preferable that the first flexible substrate and the second flexible substrate are bonded together via a low melting point glass, a thermoplastic resin, or the like. That is, it is preferable that the third adhesive layer has a low melting point glass or a thermoplastic resin.

[0013] Alternatively, one aspect of the present invention includes a first flexible substrate, a second flexible substrate, an element layer, a first adhesive layer, and a second adhesive layer. The element layer has a light-emitting element, and the element layer is the first Located between the flexible substrate and the second flexible substrate, the first adhesive layer is connected to the first flexible substrate and the element The second adhesive layer is located between the sublayers, and the second flexible substrate and the element layer are located between the element layer Outside the edges of the first adhesive layer, the second adhesive layer, the first flexible substrate, and This is a light-emitting device in which two flexible substrates overlap. Furthermore, the edges of the element layer and the edges of the first adhesive layer The first flexible substrate and the second flexible substrate are in contact outside the edge of the second adhesive layer. That's fine.

[0014] Furthermore, in the light-emitting device of each of the above configurations, the thermal expansion coefficient of the first flexible substrate and the second flexible group The absolute value of the difference in the thermal expansion coefficients of the plates is the thermal expansion coefficient of the first flexible substrate or the thermal expansion coefficient of the second flexible substrate. The rate is preferably within 10%.

[0015] Furthermore, in the light-emitting device of each of the above configurations, the first flexible substrate and the second flexible substrate are made of the same material. It is preferable to include the ingredient.

[0016] Furthermore, electronic devices and lighting devices using the light-emitting devices of the above configurations are also embodiments of the present invention.

[0017] In this specification, the term "light-emitting device" includes a display device using a light-emitting element. The element has a connector, for example, an anisotropic conductive film, or TCP (Tape Carrier). A module with an er Package attached, and a printed circuit board is installed at the end of the TCP. The module or light-emitting element is equipped with a COG (Chip On Glass) system. Modules with directly mounted ICs (integrated circuits) are also included in the definition of light-emitting devices. This also includes light-emitting devices used in lighting fixtures and the like. [Effects of the Invention]

[0018] In one aspect of the present invention, a novel light-emitting device, display device, electronic device, or lighting device is provided. It is possible to make a lightweight light-emitting device, display device, electronic device, Alternatively, a lighting device can be provided. Or, one aspect of the present invention provides a highly reliable light We can provide optical devices, display devices, electronic devices, or lighting devices. In one embodiment, a durable light-emitting device, display device, electronic device, or lighting device is provided. It is possible. Alternatively, in one aspect of the present invention, a thin light-emitting device, display device, electronic The present invention can provide equipment or lighting devices. Alternatively, in one aspect of the present invention, light-gathering equipment can be provided. We can provide light-emitting devices, display devices, electronic devices, or lighting devices with high emission efficiency. Alternatively, in one aspect of the present invention, a light-emitting device, display device, electronic device with high brightness, or A lighting device can be provided. Alternatively, in one aspect of the present invention, a low-power emitting device can be provided. We can provide a display device, electronic device, or lighting device.

[0019] Furthermore, in one aspect of the present invention, a light-emitting device, a display device, and a display device that are lightweight, resistant to breakage, and flexible are provided. We can provide a stand, electronic equipment, or lighting device. [Brief explanation of the drawing]

[0020] [Figure 1] A diagram showing a light-emitting device. [Figure 2] A diagram showing a light-emitting device. [Figure 3] A diagram showing a light-emitting device. [Figure 4] A diagram showing a light-emitting device. [Figure 5] A diagram showing a light-emitting device. [Figure 6] A diagram showing the method for manufacturing a light-emitting device. [Figure 7]A diagram showing the method for manufacturing a light-emitting device. [Figure 8] A diagram showing electronic equipment. [Figure 9] A diagram showing electronic equipment. [Figure 10] A diagram showing electronic equipment. [Figure 11] A diagram showing electronic equipment. [Figure 12] A diagram showing electronic equipment. [Figure 13] A diagram showing a light-emitting device. [Figure 14] A diagram showing a light-emitting device. [Modes for carrying out the invention]

[0021] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The interpretation is not limited to the content stated herein.

[0022] In the configuration of the invention described below, the same part or part having a similar function is used. The same symbol is used consistently across different drawings, and explanations of its repetition are omitted. When referring to a function, the same hatch pattern may be used, and a specific symbol may not be assigned.

[0023] Furthermore, the position, size, and scope of each component shown in the drawings, etc., are for ease of understanding. The position, size, and range of the edges may not be shown. Therefore, the disclosed invention is not necessarily However, this is not limited to the location, size, and scope disclosed in drawings, etc.

[0024] (Embodiment 1) In this embodiment, a light-emitting device according to one aspect of the present invention is shown in Figures 1 to 7, Figure 13, and Figure 14. We will explain using this method.

[0025] The configuration of a light-emitting device according to one aspect of the present invention will be described.

[0026] Figure 1(A) shows a plan view of a light-emitting device according to one aspect of the present invention, and Figure 1(B) shows a plan view of a light-emitting device according to one aspect of the present invention. A cross-sectional view of the light-emitting device is shown. The light-emitting device has a light extraction unit 104 and a drive circuit unit 106. ru.

[0027] The light-emitting device shown in Figure 1(B) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105 and a flexible substrate 103 are stacked in order. The element layer 101 contains a light-emitting element. The conductive layer contained in the element layer 101 and the FPC 108 are electrically connected by the connector 215. It is connected.

[0028] Figure 2(A) shows a plan view of a light-emitting device according to another embodiment of the present invention, and Figures 2(B) to (G) show the present invention. Cross-sectional views of other embodiments of the light-emitting device are shown. The light-emitting device comprises a light extraction unit 104 and a drive It has a dynamic circuit section 106.

[0029] The light-emitting device shown in Figure 2(B) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105 and a flexible substrate 103 are stacked in order. The element layer 101 contains a light-emitting element. The conductive layer contained in the element layer 101 and the FPC 108 are electrically connected by the connector 215. It is connected.

[0030] Here, the organic compounds and metal materials used in the light-emitting element readily react with impurities such as moisture and oxygen. i. The lifespan of the light-emitting element is significantly reduced when an organic compound or metal material reacts with the impurity. It will decrease. In one aspect of the present invention, outside the edge of the element layer 101, the adhesive layer 105 And the adhesive layer 203 is in contact with it. With this configuration, the element layer 101 is in contact with the water in the air. This prevents the intrusion of impurities such as 100ml. Therefore, it suppresses a decrease in the reliability of the light-emitting device. Possible, and desirable.

[0031] The light-emitting device shown in Figure 2(C) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105 and the flexible substrate 103 are stacked in order. Conductive layer and FP included in element layer 101 C108 is electrically connected by connector 215. On the outside, the flexible substrate 201 and the flexible substrate 103 are in contact.

[0032] Here, in order to improve the adhesion between the flexible substrate 201 and the flexible substrate 103, the flexible substrate 2 Adhesive, glass frit (low melting point glass), thermoplastic in contact with 01 and the flexible substrate 103. It is preferable to arrange resin or the like and then cure or weld it. For example, Figure 2(E) shows the element layer The adhesive layer 206 located outside the edge connects the flexible substrate 201 and the flexible substrate 10 An example of 3 being bonded together is shown. The adhesive layer 206 contains adhesive, glass frit (low melting point Glass, thermoplastic resin, etc. can be used. Alternatively, the flexible substrate 201 and flexible The flexible substrate 103 may be directly welded. The flexible substrate used in one aspect of the present invention is thermal expansion Because the ratio is small and the heat resistance is high, even localized heating such as thermocompression bonding will not damage the light-emitting device. This configuration makes it difficult to impart impurities such as moisture in the atmosphere to the element layer 101. This is preferable because it is difficult for particles to enter the device and suppresses a decrease in the reliability of the light-emitting device.

[0033] The light-emitting device shown in Figure 2(D) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105 and the flexible substrate 103 are stacked in order. Conductive layer and FP included in element layer 101 C108 is electrically connected by connector 215. On the outside, adhesive layer 105 and adhesive layer 203 are in contact. Element layer 101, adhesive layer 203, and Outside the edges of each of the adhesive layers 105, the flexible substrates 201 and 103 They are in contact. Similar to the light-emitting device shown in Figure 2(E), the flexible substrate 201 and the flexible substrate 10 To improve adhesion of 3, an adhesive is applied to the flexible substrate 201 and the flexible substrate 103. It is preferable to arrange and cure or weld lath frit (low melting point glass), thermoplastic resin, etc. In other words, in addition to the configuration in Figure 2(D), there is an adhesive layer 2 located outside the edge of the element layer. It may have 06. Alternatively, the flexible substrate 201 and the flexible substrate 103 may be directly welded together. You may do so.

[0034] Furthermore, as shown in the light-emitting device in Figure 2(F), the edges of the element layer 101 and the edges of the adhesive layer 203 Even if the adhesive layer 105, flexible substrate 201, and flexible substrate 103 overlap outside of this area, The adhesive layer 105 covers the edges of the element layer 101 and the edges of the adhesive layer 203. The flexible substrate 201 and the flexible substrate 103 are bonded together by an adhesive layer 105. Furthermore, as shown in Figure 2(G), the edges of the element layer 101, the edges of the adhesive layer 203, and The flexible substrate 201 and the flexible substrate 103 are in contact outside the edge of the adhesive layer 105. That's good too.

[0035] As shown in Figures 2(C), (D), and (G), the flexible group is located outside the edge of the element layer 101. When the plate 201 and the flexible substrate 103 are in contact, materials with similar properties are used. By doing so, adhesion can be improved. Therefore, the same material can be applied to a pair of flexible substrates. It is preferable to use it.

[0036] Flexible substrates can be made from materials such as glass, quartz, ceramics, sapphire, or organic resins. It is possible to be there.

[0037] Examples of glass include alkali-free glass, barium borosilicate glass, and aluminobole. Silicate glass or the like can be used.

[0038] Materials that are flexible and transparent to visible light include, for example, materials that are flexible to a certain extent. Thick glass, polyethylene terephthalate (PET), polyethylene naphthalate ( Polyester resins such as PEN, polyacrylonitrile resin, polyimide resin, and polymethyl methyl nitrile resin. Polymethacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES ) Resins, polyamide resins, cycloolefin resins, polystyrene resins, polyamide imide Examples include resins and polyvinyl chloride resins. In particular, using materials with a low coefficient of thermal expansion is important. Preferably, for example, polyamide-imide resin, polyimide resin, PET, etc. are used. This can be done. In addition, substrates made by impregnating glass fibers with organic resin, or by impregnating inorganic fillers with organic resin. It is also possible to use substrates that have been mixed to lower the coefficient of thermal expansion.

[0039] Furthermore, in a light-emitting device according to one aspect of the present invention, the flexible substrate that does not need to transmit light is: A substrate with low light transmittance, such as a metal substrate, may be used. The material constituting the metal substrate is particularly... There are no limitations, but for example, aluminum, copper, nickel, or aluminum alloy or Metal alloys such as stainless steel can be suitably used.

[0040] In a light-emitting device according to one aspect of the present invention, the absolute value of the difference in thermal expansion coefficients of a pair of flexible substrates is Preferably, the thermal expansion coefficient of at least one of the flexible substrates is within 10%. By reducing the difference in thermal expansion coefficients of the substrates, it is possible to suppress the light-emitting device from bending in one direction. Furthermore, the fact that the degree of expansion and contraction of a pair of flexible substrates differs due to heat is a factor in light-emitting devices. This is one of the causes of crack formation. Therefore, using the same material on a pair of flexible substrates is not recommended. It is preferable to use this method. This reduces the difference in thermal expansion coefficients between the pair of flexible substrates. It is possible.

[0041] <Specific Example 1> Figure 1(A) shows a plan view of a light-emitting device according to one embodiment of the present invention, and the dashed line A in Figure 1(A) An example of a cross-sectional view between 1 and A2 is shown in Figure 1(C).

[0042] The light-emitting device shown in Figure 1(C) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105, has a flexible substrate 103. The element layer 101 has an insulating layer 205, a plurality of transistors T, conductive layer 157, insulating layer 207, insulating layer 209, multiple light-emitting elements, insulating layer 211, adhesive It has a layer 213, an overcoat 261, a colored layer 259, a light-shielding layer 257, and an insulating layer 255. do.

[0043] The conductive layer 157 is electrically connected to the FPC 108 via the connector 215. Note that Figure 1( In C), an example was shown where the FPC 108 overlaps with the flexible substrate 103, but this is not the only example. For example, as shown in Figure 13(A), the flexible substrate 10 has a smaller area than the flexible substrate 201. When using 3, the FPC10 is placed in the region where the flexible substrate 201 and the flexible substrate 103 do not overlap. An 8 may be provided (that is, the flexible substrate 103 and the FPC 108 do not have to overlap).

[0044] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. Electrode 231 is electrically connected to the source electrode or drain electrode of transistor 240. The end of the lower electrode 231 is covered with an insulating layer 211. The light-emitting element 230 is a top emitter. It has a symmetrical structure. The upper electrode 235 is translucent and transmits light emitted by the EL layer 233. .

[0045] A colored layer 259 is provided in a position that overlaps with the light-emitting element 230, and in a position that overlaps with the insulating layer 211. A light-shielding layer 257 is provided. The colored layer 259 and the light-shielding layer 257 are covered by an overcoat 261. It is covered with an adhesive layer 213 between the light-emitting element 230 and the overcoat 261. It is.

[0046] Furthermore, in one embodiment of the present invention, as shown in Figure 13(B), the light-emitting device overlaps with the colored layer 259. It may have a light-emitting element 230. For example, four colors: red, blue, green, and white. When a single pixel is composed of subpixels, a colored layer 259 is not required for white subpixels. This reduces the amount of light absorbed by the colored layer, thereby reducing the power consumption of the light-emitting device. This can be achieved by using different materials for EL layer 233a and EL layer 233b. Alternatively, a light-emitting element may be fabricated in which each pixel exhibits a different color.

[0047] The light-emitting device has a light extraction unit 104 and a drive circuit unit 106, and multiple transistors 240, etc. It has a transistor. Transistor 240 is provided on the insulating layer 205. The edge layer 205 and the flexible substrate 201 are bonded together by the adhesive layer 203. Layer 255 and the flexible substrate 103 are bonded together by the adhesive layer 105. Insulating layer 205 If a film with low water permeability is used for the insulating layer 255, water may enter the light-emitting element 230 or the transistor 240. This is preferable because it can suppress the intrusion of impurities such as these, thereby increasing the reliability of the light-emitting device.

[0048] In specific example 1, an insulating layer 205, a transistor 240, and a light-emitting element are fabricated on a heat-resistant substrate. A substrate 230 is prepared, the prepared substrate is peeled off, and an insulating layer 203 is used on the flexible substrate 201. A light-emitting device can be fabricated by transposing layer 205, transistor 240, and light-emitting element 230. This is shown. Also, in specific example 1, an insulating layer 255 and a colored layer 25 are used on a heat-resistant fabricated substrate. 9 and the light-shielding layer 257 are prepared, the prepared substrate is peeled off, and a flexible substrate 1 is made using the adhesive layer 105. A light-emitting material can be produced by transposing an insulating layer 255, a colored layer 259, and a light-shielding layer 257 onto 03. This shows the device.

[0049] When using materials with low heat resistance (such as resin) for the substrate, applying high temperatures to the substrate during the manufacturing process can be dangerous. Because this is difficult, there are limitations on the conditions under which transistors and insulating films can be fabricated on the substrate. When using a highly water-permeable material (such as resin) for the substrate of a light-emitting device, between the substrate and the light-emitting element, It is preferable to apply high temperature to form a film with low water permeability. Furthermore, because transistors and other components can be fabricated on a highly heat-resistant substrate, high temperatures can be applied, ensuring reliability. It is possible to form transistors with high permeability and insulating films with sufficiently low water permeability. By transferring these to a substrate with low heat resistance, a highly reliable light-emitting device can be manufactured. In one aspect of the present invention, a lightweight or thin and highly reliable light-emitting device can be realized. Details of the manufacturing method will be described later.

[0050] In specific example 1, light from the light-emitting element 230 is extracted via the flexible substrate 103. Therefore Furthermore, the flexible substrate 103 is made of a material that transmits visible light. Preferably, the transmittance of visible light is higher than that of the adhesive layer 105. This allows the light from the light-emitting device to... This helps to suppress the decrease in extraction efficiency.

[0051] Furthermore, the absolute value of the difference in thermal expansion coefficients between the flexible substrate 103 and the flexible substrate 201 is the flexible substrate 10 3 or it is preferable that it is within 10% of the thermal expansion coefficient of the flexible substrate 201. This can suppress warping of the optical device and the occurrence of cracks in the light-emitting device.

[0052] Furthermore, as shown in Figures 2(C), (D), and (G), outside the edge of the element layer 101, When the flexible substrate 201 and the flexible substrate 103 are in contact, a material with similar properties By using this material, adhesion can be improved. This prevents moisture from the air from getting into the element layer 101. This is preferable because it makes it difficult for impurities such as spores to enter, thus suppressing a decrease in the reliability of the light-emitting device. Furthermore, as shown in Figures 2(B), (E), and (F), the adhesive layer 206 or adhesive layer 105, etc. Alternatively, the flexible substrate 201 and the flexible substrate 103 may be bonded together.

[0053] <Specific Example 2> Figure 3(A) shows another example of the light extraction unit 104 in the light-emitting device. The device is a light-emitting device that can be operated by touch. Note that the following specific examples are the same as in Specific Example 1. I will omit the explanation of its structure.

[0054] The light-emitting device shown in Figure 3(A) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105, has a flexible substrate 103. The element layer 101 has an insulating layer 205, a plurality of transistors T, insulating layer 207, insulating layer 209, multiple light-emitting elements, insulating layer 211, insulating layer 217, adhesive Layer 213, overcoat 261, colored layer 259, light-shielding layer 257, multiple light-receiving elements, conductive Layer 281, conductive layer 283, insulating layer 291, insulating layer 293, insulating layer 295, and insulating layer 25 It has 5.

[0055] In specific example 2, an insulating layer 217 is provided on the insulating layer 211. By providing the insulating layer 217, The distance between the flexible substrate 103 and the flexible substrate 201 can be adjusted.

[0056] Figure 3(A) shows an example in which a light-receiving element is located between the insulating layer 255 and the adhesive layer 213. Because light-receiving elements can be placed on top of transistors and wiring, the aperture of the pixel (light-emitting element) A touch sensor can be installed in the light-emitting device without reducing the efficiency.

[0057] For example, the light-receiving element of the light-emitting device may be a pn-type or pin-type photodiode. This is possible. In this embodiment, the photodetector is a p-type semiconductor layer 271 and an i-type semiconductor layer. A pin-type photodiode having layer 273 and n-type semiconductor layer 275 is used.

[0058] Furthermore, the i-type semiconductor layer 273 contains impurities that impart p-type properties and impurities that impart n-type properties. Each is 1 x 10 20 cm -3 The following concentrations are observed, where the photoconductivity is 100 relative to the dark conductivity. It is more than double. The i-type semiconductor layer 273 contains impurity elements from Group 13 or Group 15 of the periodic table. This category also includes those that possess the following characteristics. In other words, type i semiconductors are designed for the purpose of controlling valence electrons. Because it exhibits weak n-type electrical conductivity when pure elements are not intentionally added, i-type semiconductor layer 2 73 imparts p-type impurity elements during or after film formation, either intentionally or unintentionally. This category includes anything that has been added to it.

[0059] The light-shielding layer 257 is located on the flexible substrate 201 side of the light-receiving element and overlaps with the light-receiving element. The light-shielding layer 257 located between the light-receiving element and the adhesive layer 213 prevents the light-emitting element 230 from emitting light. This can suppress the irradiation of light onto the photodetector.

[0060] Conductive layer 281 and conductive layer 283 are electrically connected to the light-receiving element, respectively. Conductive layer 281 It is preferable to use a conductive layer that transmits light incident on the light-receiving element. The conductive layer 283 is It is preferable to use a conductive layer that blocks the light incident on the light-receiving element.

[0061] When an optical touch sensor is placed between the flexible substrate 103 and the adhesive layer 213, the light-emitting element 230 It is preferable because it is less affected by the light emission and can improve the signal-to-noise ratio.

[0062] The preferred configurations of the flexible substrate 103 and the flexible substrate 201 are the same as in Specific Example 1.

[0063] <Specific Example 3> Figure 3(B) shows another example of the light extraction unit 104 in the light-emitting device. The device is a light-emitting device that can be operated by touch.

[0064] The light-emitting device shown in Figure 3(B) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105, has a flexible substrate 103. The element layer 101 has an insulating layer 205, a plurality of transistors T, insulating layer 207, insulating layer 209a, insulating layer 209b, multiple light-emitting elements, insulating layer 211, Insulating layer 217, adhesive layer 213, colored layer 259, light-shielding layer 257, multiple light-receiving elements, conductive layer 2 It has 80, a conductive layer 281, and an insulating layer 255.

[0065] Figure 3(B) shows an example in which a light-receiving element is located between the insulating layer 205 and the adhesive layer 213. By placing the element between the insulating layer 205 and the adhesive layer 213, the transistor 240 is formed. Using the same materials and processes as the conductive layer and semiconductor layer, the conductive layer and the photodetector are electrically connected to the photodetector. The photoelectric conversion layer that constitutes the light-receiving element can be fabricated. Therefore, the fabrication process is greatly increased. This allows for the creation of a light-emitting device that can be operated by touch.

[0066] The preferred configurations of the flexible substrate 103 and the flexible substrate 201 are the same as in Specific Example 1.

[0067] <Specific Example 4> Figure 4(A) shows another example of a light-emitting device. The light-emitting device in Figure 4(A) is a touch-operable light-emitting device. It is a light device.

[0068] The light-emitting device shown in Figure 4(A) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105, has a flexible substrate 103. The element layer 101 has an insulating layer 205, a plurality of transistors T, conductive layer 156, conductive layer 157, insulating layer 207, insulating layer 209, multiple light-emitting elements, insulation Layer 211, insulating layer 217, adhesive layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, Conductive layer 272, conductive layer 274, insulating layer 276, insulating layer 278, conductive layer 294, and conductive layer It has 296.

[0069] Figure 4(A) shows a capacitive touch sensor between the insulating layer 255 and the adhesive layer 213. An example is shown. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274.

[0070] The conductive layers 156 and 157 are electrically connected to the FPC 108 via the connector 215. The conductive layers 294 and 296 are electrically connected to the conductive layer 274 via the conductive particles 292. It connects to the FPC108. Therefore, it drives the capacitive touch sensor via the FPC108. It is possible.

[0071] The preferred configurations of the flexible substrate 103 and the flexible substrate 201 are the same as in Specific Example 1.

[0072] <Specific Example 5> Figure 4(B) shows another example of a light-emitting device. The light-emitting device in Figure 4(B) is a touch-operable light-emitting device. It is a light device.

[0073] The light-emitting device shown in Figure 4(B) consists of a flexible substrate 201, an adhesive layer 203, an element layer 101, and an adhesive layer 105, has a flexible substrate 103. The element layer 101 has an insulating layer 205, a plurality of transistors T, conductive layer 156, conductive layer 157, insulating layer 207, insulating layer 209, multiple light-emitting elements, insulation Layer 211, insulating layer 217, adhesive layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, It has a conductive layer 270, a conductive layer 272, a conductive layer 274, an insulating layer 276, and an insulating layer 278. .

[0074] Figure 4(B) shows a capacitive touch sensor between the insulating layer 255 and the adhesive layer 213. An example is shown. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274.

[0075] As shown in Figure 14(A), the touch sensor may be provided on the flexible substrate 103. Furthermore, as shown in Figure 14(B), a flexible substrate 102 is provided on the flexible substrate 103, A touch sensor may be provided on the flexible substrate 102. Flexible substrate 103 and flexible substrate 10 2 is bonded by adhesive layer 204. Adhesive layer 204 contains the same material as adhesive layer 203. It is preferable to use this. This can suppress light reflection. Also, the light-emitting device is bent. In this process, positional displacement can be suppressed. Furthermore, similar to the configuration shown in Figure 4(B), it is flexible. An insulating layer 255 and an adhesive layer 105 may be provided between the conductive substrate 103 and the conductive layer 272. .

[0076] The conductive layer 156 and the conductive layer 157 are electrically connected to the FPC 108a via the connector 215a. The conductive layer 270 is electrically connected to the FPC 108b via the connector 215b. Therefore, the light-emitting element 230 and the transistor 240 are driven via the FPC108a, F Capacitive touch sensors can be driven via the PC108b.

[0077] The preferred configurations of the flexible substrate 103 and the flexible substrate 201 are the same as in Specific Example 1. A similar configuration can be applied to the flexible substrate 102. In particular example 5, the flexible substrate 103 (and flexible substrate 102) The light from the light-emitting element 230 is extracted. Therefore, flexible The substrate 103 and the flexible substrate 102 are made of a material that transmits visible light.

[0078] Furthermore, it is preferable that the flexible substrate 102 and the flexible substrate 103 be made of the same material. This makes it possible to reduce the difference in thermal expansion coefficients between the flexible substrate 102 and the flexible substrate 103. It is preferable to use the same material for the flexible substrate 201. This allows the flexible substrate 10 2. The difference in thermal expansion coefficients between the flexible substrate 103 and the flexible substrate 201 can be reduced.

[0079] <Specific Example 6> Figure 5(A) shows another example of the light extraction unit 104 in the light-emitting device.

[0080] The light-emitting device shown in Figure 5(A) consists of a flexible substrate 103, an adhesive layer 105, an element layer 101, and an adhesive layer 213, has a flexible substrate 202. The element layer 101 has an insulating layer 205, a plurality of transistors A, insulating layer 207, conductive layer 208, insulating layer 209a, insulating layer 209b, multiple light-emitting elements, It has an insulating layer 211 and a colored layer 259.

[0081] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. Electrode 231 is connected to the source or drain electrode of transistor 240 via the conductive layer 208. It is electrically connected to the lower electrode 231. The end of the lower electrode 231 is covered with an insulating layer 211. 230 is a bottom emission structure. The lower electrode 231 is translucent, and the EL layer 233 It transmits the light it emits.

[0082] A colored layer 259 is provided in a position that overlaps with the light-emitting element 230, and the light emitted by the light-emitting element 230 The light-emitting element 230 and the flexible substrate 103 are extracted via the colored layer 259. The space between the plates 202 is filled with an adhesive layer 213.

[0083] Furthermore, in one embodiment of the present invention, as shown in Figure 5(C), the light-emitting device does not overlap with the colored layer 259. It may have a light-emitting element 230. For example, four sub-elements of red, blue, green, and white. When a single pixel is formed from multiple pixels, a colored layer 259 is not required for white subpixels. This reduces the amount of light absorbed by the colored layer, thereby reducing the power consumption of the light-emitting device. This is possible. Also, by using different materials for EL layer 233a and EL layer 233b, A light-emitting element may be fabricated in which each pixel exhibits a different color.

[0084] In specific example 6, light from the light-emitting element 230 is extracted via the flexible substrate 103. Therefore Therefore, a material that transmits visible light is used for the flexible substrate 103.

[0085] Furthermore, the absolute value of the difference in thermal expansion coefficients between the flexible substrate 103 and the flexible substrate 202 is the flexible substrate 10 3. Preferably, it is within 10% of the thermal expansion coefficient of the flexible substrate 202.

[0086] Furthermore, as shown in Figures 2(C), (D), and (G), outside the edge of the element layer 101, When the flexible substrate 202 and the flexible substrate 103 are in contact, a material with similar properties By using this material, adhesion can be improved. This prevents moisture from the air from getting into the element layer 101. This is preferable because it makes it difficult for impurities such as spores to enter, thus suppressing a decrease in the reliability of the light-emitting device. Furthermore, as shown in Figures 2(B), (E), and (F), the adhesive layer 206 or adhesive layer 105, etc. Alternatively, the flexible substrate 202 and the flexible substrate 103 may be bonded together.

[0087] <Specific Example 7> Figure 5(B) shows another example of a light-emitting device.

[0088] The light-emitting device shown in Figure 5(B) consists of a flexible substrate 103, an adhesive layer 105, an element layer 101, and an adhesive layer 213, has a flexible substrate 202. The element layer 101 has an insulating layer 205, a conductive layer 310a, It has a conductive layer 310b, a plurality of light-emitting elements, an insulating layer 211, and a conductive layer 212.

[0089] The conductive layers 310a and 310b are external connection electrodes for the light-emitting device, and are electrically connected to FPC and the like. It can be connected to a target.

[0090] The light-emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The ends of the electrode 231 are covered with an insulating layer 211. The light-emitting element 230 is bottom emission It has a conductor structure. The lower electrode 231 is translucent and transmits the light emitted by the EL layer 233. The electrode layer 212 is electrically connected to the lower electrode 231.

[0091] The flexible substrate 103 has a light extraction structure consisting of a hemispherical lens, a microlens array, and uneven surfaces. It may have a structured film, a light-diffusing film, etc. For example, on a resin substrate The above-mentioned lens or film has a refractive index similar to that of the substrate or the lens or film. By bonding them together using an adhesive, a flexible substrate 103 having a light extraction structure is formed. It is possible.

[0092] The conductive layer 212 is not necessarily required, but it does not cause a voltage drop due to the resistance of the lower electrode 231. It is preferable to provide it because it can suppress the electrical effect. Also, for the same purpose, the upper electrode 235 and electrical effect A conductive layer for direct connection is provided on the insulating layer 211, the EL layer 233, or the upper electrode 235, etc. You may leave it.

[0093] The conductive layer 212 is made of copper, titanium, tantalum, tungsten, molybdenum, chromium, and neodymium. Materials selected from scandium, nickel, and aluminum, or compounds mainly composed of these materials. It can be formed using gold material, etc., as a single layer or in layers. The thickness of the conductive layer 212 is For example, it can be 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0. It is 5 μm or less.

[0094] A paste (such as silver paste) is used as the material for the conductive layer that electrically connects to the upper electrode 235. As a result, the metal constituting the conductive layer aggregates into granular form. Therefore, the surface of the conductive layer becomes rough. This configuration has many gaps, and for example, even if the conductive layer is formed on the insulating layer 211, the EL layer 233 However, it is difficult to completely cover the conductive layer, and to make an electrical connection between the upper electrode and the conductive layer. This makes it easier and is preferable.

[0095] The preferred configurations of the flexible substrate 103 and the flexible substrate 202 are the same as in Specific Example 6.

[0096] <Example of materials> Next, we will describe the materials that can be used in the light-emitting device. I will omit the explanation of the revealed structure.

[0097] [Functional element] The element layer 101 has at least an element that emits light. The element that emits light is a self-illuminating element. This category includes elements whose brightness is controlled by current or voltage, which can be used. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc. can be used. can.

[0098] The element layer 101 further includes transistors for driving the light-emitting element, touch sensors, etc. It's okay to do so.

[0099] The structure of the transistors in the light-emitting device is not particularly limited. For example, staggered transistors It can be a standard transistor, or an inverse staggered transistor. Also, a top-gate type or The transistor structure may be any bottom-gate type. The material is not particularly limited; for example, silicon, germanium, etc. Or, I n-Ga-Zn metal oxides, etc., at least one of indium, gallium, and zinc. Oxide semiconductors containing the following may also be used.

[0100] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors, Crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a crystalline region in part) Any semiconductor having the properties of [the semiconductor material] may be used. If a semiconductor having crystalline properties is used, transients may occur. This is preferable because it suppresses the deterioration of the stanic characteristics.

[0101] The light-emitting element of the light-emitting device comprises a pair of electrodes (lower electrode 231 and upper electrode 235), and It has an EL layer 233 provided between a pair of electrodes. One of the pair of electrodes is used as the anode. One side functions as the cathode, and the other side functions as the cathode.

[0102] The light-emitting element has a top emission structure, a bottom emission structure, and a dual emission structure. Any of the structures is acceptable. The electrode on the side that extracts light uses a conductive film that transmits visible light. It is also preferable to use a conductive film that reflects visible light on the electrode that does not extract light. It seems so.

[0103] Conductive films that transmit visible light include, for example, indium oxide and indium tin oxide (ITO:I). Indium zinc oxide, zinc oxide, and gallium are added. It can be formed using zinc oxide, etc. Also, gold, silver, platinum, magnesium, Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or This refers to metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (for example) For example, titanium nitride and the like can also be used by forming them thinly enough to be translucent. Furthermore, the laminated film of the above materials can be used as a conductive film. For example, silver and magnesium. Using a laminated film of this alloy and ITO is preferable because it can improve conductivity. Alternatively, graphene or the like may be used.

[0104] Examples of conductive films that reflect visible light include aluminum, gold, platinum, silver, nickel, and tungsten. Metal materials such as tetracellulose, chromium, molybdenum, iron, cobalt, copper, or palladium, Alloys containing these metal materials can be used. In addition, Lantha It may also contain added elements such as cellulose, neodymium, or germanium. Aluminum alloys such as aluminum alloys, aluminum-nickel alloys, aluminum-neodymium alloys, etc. Alloys containing um (aluminum alloys), alloys of silver and copper, alloys of silver, palladium and copper, silver It can be formed using an alloy containing silver, such as a magnesium alloy. Gold is preferred because of its high heat resistance. Furthermore, the metal film or metal in contact with the aluminum alloy film. By laminating an oxide film, the oxidation of the aluminum alloy film can be suppressed. Examples of materials for films and metal oxide films include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO Multilayer films, such as a silver-magnesium alloy and an ITO multilayer film, can be used.

[0105] The electrodes can be formed using methods such as vapor deposition or sputtering. Formed using extrusion methods such as the cuteting method, printing methods such as screen printing, or plating methods. It is possible.

[0106] A voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode 231 and the upper electrode 235. Then, holes are injected into the EL layer 233 from the anode side, and electrons are injected from the cathode side. The electrons and holes recombine in the EL layer 233, causing the light-emitting material in the EL layer 233 to emit light. do.

[0107] The EL layer 233 has at least an emissive layer. The EL layer 233 has layers other than the emissive layer, Materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential , substances with high electron injection properties, or bipolar substances (substances with high electron transport and hole transport properties) It may further have layers containing (quality, etc.).

[0108] The EL layer 233 can use either low-molecular-weight compounds or high-molecular-weight compounds, and inorganic It may contain compounds. Each layer constituting the EL layer 233 is deposited by a vapor deposition method (vacuum deposition). It can be formed by methods such as (including) transfer, printing, inkjet, and coating. ru.

[0109] In the element layer 101, the light-emitting element is provided between a pair of insulating films with low water permeability. This is preferable. This prevents impurities such as water from entering the light-emitting element, and the light-emitting element This can suppress the decline in reliability of the device.

[0110] Examples of insulating films with low water permeability include silicon nitride films and silicon nitride oxide films, which contain nitrogen and silicon. Examples include films containing nitrogen and aluminum, such as aluminum nitride films. Also, acid A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

[0111] For example, the water vapor transmission rate of an insulating film with low water permeability is 1×10 -5 [g / m 2 ·day] or less , preferably 1×10 -6 [g / m 2 ·day] or less, more preferably 1×10 -7 [g / m 2 ·day] or less, still more preferably 1×10 -8 [g / m 2 ·day] or less. .

[0112] [Adhesive layer] For the adhesive layer, various curable adhesives such as photocurable adhesives such as ultraviolet curable adhesives, reaction curable adhesives, thermosetting adhesives, and anaerobic adhesives can be used. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenolic resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like. In particular, materials with low moisture permeability such as epoxy resins are preferred. Also, a two-component mixed resin may be used. Further, an adhesive sheet or the like may be used.

[0113]

[0114] Also, the above resin may contain a desiccant. For example, substances that adsorb moisture by chemical adsorption, such as oxides of alkaline earth metals (calcium oxide, barium oxide, etc.), can be used. Alternatively, substances that adsorb moisture by physical adsorption, such as zeolite and silica gel, may be used. When a desiccant is included, it is possible to suppress the intrusion of impurities such as moisture into the light-emitting element, which is preferable because the reliability of the light-emitting device is improved.

[0115]

[0114] The adhesive layer 105 is light-transmitting and allows at least the light emitted by the light-emitting element of the element layer 101 to pass through. It is permeable. Furthermore, the refractive index of the adhesive layer 105 is higher than that of the atmosphere.

[0115] By mixing a filler with a high refractive index (such as titanium dioxide) into the above resin, the light-emitting element is produced. This is preferable as it can improve the light extraction efficiency. In comparison, the brightness can be increased. Also, when comparing at the same brightness, the power consumption is lower. The force can be reduced.

[0116] Furthermore, the adhesive layer 105 may have a scattering member that scatters light. For example, the adhesive layer For 105, a mixture of the above-mentioned resin and particles with a different refractive index from the above-mentioned resin can also be used. The particles function as light scattering members.

[0117] Preferably, the difference in refractive index between the resin and the particles with different refractive indices is 0.1 or more. A value of 0.3 or higher is more preferable. Specifically, the resins include epoxy resin and acrylic resin. Resins, imide resins, silicones, etc. can be used. Titanium dioxide can also be used as particles. Barium oxide, zeolite, etc., can be used.

[0118] Titanium dioxide and barium oxide particles are preferred because they have a strong light-scattering property. Using light, it is possible to adsorb water contained in resins, etc., thereby improving the reliability of the light-emitting element. It can be done.

[0119] When extracting light emitted from the light-emitting element via the adhesive layer 213, the same as the adhesive layer 105 described above is used. The following configuration can be applied.

[0120] [Insulating layer] In particular, inorganic insulating materials can be used for insulating layer 205 and insulating layer 255. Using a low-water-based insulating film is preferable because it allows for the realization of a highly reliable light-emitting device.

[0121] The insulating layer 207 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 207 can be a silicon oxide film, a silicon oxide nitride film, a silicon nitride film, or a silicon film. Inorganic insulating films such as silicon oxide films and aluminum oxide films can be used.

[0122] The insulating layer 209, insulating layer 209a, and insulating layer 209b are, respectively, transistors. To reduce surface irregularities caused by various factors, it is preferable to select an insulating film that has a planarization function. For example, using organic materials such as polyimide, acrylic, and benzocyclobutene resins. This is possible. In addition to the above organic materials, low dielectric constant materials (low-k materials), etc., can also be used. This can be achieved. Furthermore, laminated structures using insulating films and inorganic insulating films formed from these materials can be created. That's good too.

[0123] The insulating layer 211 is provided covering the end of the lower electrode 231. In order to ensure good coverage of the formed EL layer 233 and upper electrode 235, an insulating layer 21 It is preferable that the side wall of 1 is an inclined surface formed with a continuous curvature.

[0124] As the material for the insulating layer 211, a resin or an inorganic insulating material can be used. Examples include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. A resin such as silicic acid or phenolic resin can be used. In particular, the insulating layer 211 is easy to produce. Therefore, it is preferable to use a negative-type or positive-type photosensitive resin. .

[0125] The method for forming the insulating layer 211 is not particularly limited, but may include photolithography, sputtering, Vapor deposition, droplet ejection (inkjet, etc.), printing methods (screen printing, offset printing) You can use (etc.) etc.

[0126] The insulating layer 217 can be formed using an inorganic insulating material or an organic insulating material, for example. For organic insulating materials, negative-type and positive-type photosensitive resins, non-photosensitive resins, etc., can be used. This can be done. Alternatively, a conductive layer may be formed instead of the insulating layer 217. For example, a metal material It can be formed using [a specific method]. Examples of metallic materials include titanium and aluminum. This is possible. A conductive layer is used instead of the insulating layer 217, and the conductive layer and the upper electrode 235 are electrically connected. By using a configuration that connects via air, the potential drop caused by the resistance of the upper electrode 235 can be suppressed. Furthermore, the insulating layer 217 may have a forward taper shape or a reverse taper shape.

[0127] Insulating layer 276, insulating layer 278, insulating layer 291, insulating layer 293, insulating layer 295 are, respectively They can be formed using inorganic or organic insulating materials. In particular, insulating layer 278 and insulating layer 295 This involves using an insulating layer with a planarization function to reduce surface irregularities caused by the sensor element. It is preferable.

[0128] [Conductive layer] Conductive layer 156, conductive layer 157, conductive layer 294, and conductive layer 296 are each transient It can be formed using the same material and process as the conductive layer constituting the star or light-emitting element. Layer 280 can be formed using the same material and process as the conductive layers that make up the transistor.

[0129] For example, the conductive layers mentioned above are molybdenum, titanium, chromium, tantalum, and tungsten, respectively. Metal materials such as aluminum, copper, neodymium, scandium, or compounds containing these elements. It can be formed using gold material, either as a single layer or in layers. Furthermore, the conductive layer is These may be formed using conductive metal oxides. Examples of conductive metal oxides include a(I) oxide. Dium (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, Zinc oxide (In2O3-ZnO, etc.) or these metal oxide materials with silicon oxide A product containing n can be used.

[0130] Furthermore, conductive layer 208, conductive layer 212, conductive layer 310a, and conductive layer 310b are also, respectively, It can be formed using the above-mentioned metal material, alloy material, or conductive metal oxide, etc.

[0131] The conductive layers 272 and 274, and the conductive layers 281 and 283 are light-transmitting. It is a conductive layer. For example, indium oxide, ITO, indium zinc oxide, zinc oxide. , zinc oxide with gallium added can be used. Also, conductive layer 270 is conductive layer 2 It can be formed using the same materials and process as 72.

[0132] The conductive particles 292 are particles such as organic resin or silica whose surface is coated with a metallic material. Use the following. Using nickel or gold as the metallic material is preferable because it can reduce contact resistance. Furthermore, particles coated with two or more metal materials in layers, such as nickel coated with gold. It is preferable to use [this].

[0133] As the connecting body 215, a paste-like or sheet-like material obtained by mixing metal particles into a thermosetting resin and exhibiting anisotropic conductivity by thermocompression bonding can be used. As the metal particles it is preferable to use particles in which two or more kinds of metals are layered, such as those obtained by coating nickel particles with gold.

[0134] [Coloring layer, light shielding layer, and overcoat] The coloring layer 259 is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, a blue (B) color filter that transmits light in the blue wavelength band, etc. can be used. Each coloring layer can be formed at a desired position using various materials by an etching method using a printing method, an inkjet method, a photolithography method, etc.

[0135] Also, a light shielding layer 257 is provided between adjacent coloring layers 259. The light shielding layer 257 shields light that wraps around from adjacent light emitting elements and suppresses color mixing between adjacent pixels. Here, by providing the end portion of the coloring layer 259 so as to overlap with the light shielding layer 257, light leakage can be suppressed. The light shielding layer 257 can be formed using a material that shields the light emission of the light emitting element, and can be formed using a metal material, a resin material containing a pigment or a dye, etc. As shown in FIG. 1( C), it is preferable to provide the light shielding layer 257 in a region other than the light extraction portion 104 such as the drive circuit portion 106 because unintended light leakage due to guided light or the like can be suppressed.

[0136] Also, an overcoat 261 that covers the coloring layer 259 and the light shielding layer 257 may be provided. Over By providing an overcoat, diffusion of impurities and the like contained in the coloring layer into the organic EL element can be prevented. The overcoat is composed of a material that transmits light emitted from the organic EL element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film, or an organic insulating film such as an acrylic film or a polyimide film can be used, and a laminated structure of an organic insulating film and an inorganic insulating film may also be used. The overcoat 261 may use the above-mentioned insulating film with low water permeability.

[0137] Also, when applying the material of the adhesive layer 213 onto the coloring layer 259 and the light shielding layer 257, it is preferable to use a material with high wettability with respect to the material of the adhesive layer 213 as the material of the overcoat 261. For example, it is preferable to use an oxide conductive film such as an ITO film or a metal film such as a thin Ag film having a certain degree of light transmissibility.

[0138] <Example of manufacturing method> Next, an example of the manufacturing method of the light emitting device will be illustrated using FIGS. 6 and 7. Here, a light emitting device having the configuration of Specific Example 1 (FIG. 1(C)) will be described as an example.

[0139] First, a release layer 303 is formed on the manufacturing substrate 301, and an insulating layer 205 is formed on the release layer 303. Next, a plurality of transistors, a conductive layer 157, an insulating layer 207, an insulating layer 209, a plurality of light emitting elements, and an insulating layer 211 are formed on the insulating layer 205. Note that the insulating layer 211, the insulating layer 209, and the insulating layer 207 are open so that the conductive layer 157 is exposed (FIG. 6(A)).

[0140] Also, a release layer 307 is formed on the manufacturing substrate 305, and an insulating layer 255 is formed on the release layer 307. Next, a light shielding layer 257, a coloring layer 259, and an overcoat 261 are formed on the insulating layer 255 (FIG. 6(B)).

[0141] The fabricated substrates 301 and 305 are a glass substrate, a quartz substrate, and a sapphire substrate, respectively. A substrate such as an earpiece, ceramic substrate, or metal substrate can be used.

[0142] Furthermore, the glass substrate can be, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as barium borosilicate glass can be used. The temperature of the subsequent heat treatment. If the temperature is high, it is advisable to use a material with a strain point of 730°C or higher. Note that barium oxide (B) By including a large amount of aO, more practical heat-resistant glass can be obtained. You can use things like S.

[0143] When a glass substrate is used for fabrication, a silicon oxide film and an oxide film are placed between the fabricated substrate and the release layer. When insulating films such as silicon nitride films, silicon nitride films, and silicon oxide nitride films are formed, glass This is preferable because it prevents contamination from the substrate.

[0144] The release layer 303 and the release layer 307 are made of tungsten, molybdenum, titanium, and tan, respectively. Talc, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium Elements selected from zinc, osmium, iridium, and silicon, and alloy materials containing said elements or a compound material containing the element, consisting of a single layer or a laminated layer. Contains silicon. The crystalline structure of the layer may be amorphous, microcrystalline, or polycrystalline.

[0145] The release layer can be formed by sputtering, plasma CVD, coating, printing, or other methods. The coating method includes spin coating, droplet dispensing, and dispensing.

[0146] When the release layer has a single-layer structure, it is preferable to form a layer containing a tungsten layer, a molybdenum layer, or a mixture of tungsten and molybdenum. Further, a layer containing an oxide or oxynitride of tungsten, a layer containing an oxide or oxynitride of molybdenum, or a layer containing an oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. Note that the mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

[0147] When forming a laminated structure of a layer containing tungsten and a layer containing an oxide of tungsten as the release layer, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed on the upper layer thereof. By doing so, it may be utilized that a layer containing an oxide of tungsten is formed at the interface between the tungsten layer and the insulating film. Further, the surface of the layer containing tungsten may be subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, treatment with a solution having a strong oxidizing power such as ozone water, etc. to form a layer containing an oxide of tungsten. Further, the plasma treatment and the heat treatment may be performed in an atmosphere of oxygen, nitrogen, nitrous oxide alone, or a mixed gas of the gas and other gases. By changing the surface state of the release layer by the above plasma treatment and heat treatment, it is possible to control the adhesion between the release layer and the insulating layer formed later.

[0148] Each insulating layer can be formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, by forming a film by the plasma CVD method at a film formation temperature of 250 ° C or higher and 400 ° C or lower, a dense and very low water permeability film can be obtained.

[0149] ​​​​​​​​​​​​​​​​ Subsequently, the surface of the fabricated substrate 305 on which the colored layer 259 etc. is provided, or the light-emitting element of the fabricated substrate 301 A material that will become an adhesive layer 213 is applied to the surface provided with 230 etc., and the adhesive layer 213 is used to connect the surface The fabricated substrates 301 and 305 are bonded together so that they face each other (Figure 6(C)). ).

[0150] Then, the fabricated substrate 301 is peeled off, and the exposed insulating layer 205 and the flexible substrate 201 are bonded together. They are bonded together using 203. Also, the fabricated substrate 305 is peeled off, and the exposed insulating layer 255 and The flexible substrate 103 is bonded using the adhesive layer 105. Figure 7(A) shows the flexible substrate Although the configuration was such that 103 does not overlap with the conductive layer 157, the conductive layer 157 and the flexible substrate 103 overlap It's okay if it is.

[0151] Furthermore, various methods can be used as appropriate for the peeling process. For example, as the peeling layer, If a layer containing a metal oxide film is formed on the side in contact with the abscission layer, the metal oxide film is crystallized. It weakens the material, allowing the peelable layer to be removed from the fabricated substrate. Furthermore, it provides a highly heat-resistant fabricated substrate. When an amorphous silicon film containing hydrogen is formed as a release layer between the plate and the layer to be released, the laser light By removing the amorphous silicon film by irradiation or etching, the peeled layer is removed from the fabricated substrate. It can be peeled off. Furthermore, the peeling layer includes a metal oxide film on the side in contact with the layer to be peeled off. This forms a metal oxide film, weakens it through crystallization, and further removes a portion of the peeled layer with a solution or NF3 After being removed by etching with fluoride gases such as BrF3 and ClF3, the weakened gold It can be exfoliated in the oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as the exfoliation layer. Using a film containing hydrogen (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, etc.) The delamination layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained within the delamination layer as gases. A method may be used to promote the separation of the layer to be peeled from the substrate. The fabricated substrate is mechanically removed or removed using a solution or fluorine gas such as NF3, BrF3, or ClF3. Methods such as etching can be used for removal. In this case, it is not necessary to provide a stripping layer. stomach.

[0152] Furthermore, by combining multiple of the above peeling methods, the peeling process can be carried out more easily. In other words, irradiation with laser light, etching of the stripping layer with gas or solution, sharp knife or metal After mechanical removal using tools such as a squeegee to make the peeled layer and the layer to be peeled easier to separate, Detachment can also be performed using physical force (such as machinery).

[0153] Furthermore, even if the layer to be peeled off is removed from the fabricated substrate by permeating a liquid into the interface between the peeling layer and the layer to be peeled, That's fine. Additionally, you can apply a liquid such as water while peeling.

[0154] Other peeling methods include, if the peeling layer is formed with tungsten, using ammonia water and peroxide. It is preferable to perform the stripping process while etching the stripping layer with a mixed solution of hydrogen oxide water.

[0155] Furthermore, if peeling is possible at the interface between the fabricated substrate and the peel-off layer, a peel-off layer may not be necessary. For example, glass is used as the fabrication substrate, and polyimide, polyester, and poly are placed in contact with the glass. Forming organic resins such as olefins, polyamides, polycarbonates, and acrylics, and organic resins An insulating film or transistor is formed on top. In this case, by heating the organic resin, It can be peeled off at the interface between the manufactured substrate and the organic resin. Alternatively, a metal can be placed between the manufactured substrate and the organic resin. A layer is created, and by passing an electric current through the metal layer, the metal layer is heated, and the layer peels off at the interface between the metal layer and the organic resin. Separation may be performed. In this case, an organic resin can be used as the substrate for the light-emitting device. Alternatively, the organic resin and other substrates may be bonded together using an adhesive.

[0156] Finally, the insulating layer 255 and the adhesive layer 213 are opened to expose the conductive layer 157. Figure 7(B)). Note that if the flexible substrate 103 overlaps with the conductive layer 157, the conductive layer 1 To expose 57, the flexible substrate 103 and the adhesive layer 105 are also opened (Figure 7(C)). The means of opening the aperture are not particularly limited, and include, for example, laser ablation, etching, and ion Beam sputtering or similar methods can be used. Also, a sharp blade or similar object can be used on the film on the conductive layer 157. You can also use this tool to make an incision and then physically peel off a portion of the membrane.

[0157] Based on the above, a light-emitting device can be manufactured.

[0158] As described above, the light-emitting device of this embodiment includes a flexible substrate 103 and a flexible substrate 20 It consists of two substrates, one or a flexible substrate 202. Furthermore, it includes a configuration that includes a touch sensor. Even so, it can be constructed with two circuit boards. By minimizing the number of circuit boards, light This makes it easier to improve the extraction efficiency and the clarity of the display. Therefore, with the same power consumption... When comparing, the brightness can be increased. Also, when comparing at the same brightness, the power consumption Power consumption can be reduced.

[0159] In this embodiment, a light-emitting device having an element-emitting element is used as an example, but the present invention is not limited thereto. It is not possible. An apparatus to which a flexible substrate, which is a feature of one aspect of the present invention, can be applied is various semiconductors. Examples include devices and various display devices. For example, as a substrate for the element or device shown below, A flexible substrate, which is a feature of one aspect of the present invention, can be applied. For example, EL elements (organic and non-organic) EL elements including EL elements, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs) (Green LEDs, blue LEDs, etc.), transistors (transistors that emit light according to the current) , electron emission elements, liquid crystal elements, electronic ink, electrophoretic elements, grating light bulbs ( GLV, plasma display (PDP), MEMS (micro-electromechanical systems) Cal System), Digital Micromirror Device (DMD), DMS (Digital Micromirror) Icro Shutter), MIRASOL (registered trademark), IMOD (Interference Modulation elements, electrowetting elements, piezoelectric ceramic displays (i) Carbon nanotubes, etc., through electromagnetic interaction, affect contrast, brightness, reflectivity. Examples include display media whose transmittance and other properties change. Also, display devices using electron emission elements. One example is a field emission display (FED) or SED type flat panel display. Spray (SED: Surface-conduction Electron-emi) Examples include (e.g., a two-dimensional display). Also, an example of a display device using liquid crystal elements. Liquid crystal displays (transmissive liquid crystal displays, semi-transmissive liquid crystal displays, reflective liquid crystal displays) are examples of liquid crystal displays. Examples include LCD displays, direct-view LCD displays, and projection LCD displays. Furthermore, electronic paper is an example of a display device that uses electronic ink or electrophoretic elements. These are some examples.

[0160] One example of an electronic paper display method is one that uses molecules for display (optical anisotropy, dyes). (e.g., molecular orientation), phenomena that are represented by particles (e.g., electrophoresis, particle movement, particle rotation, phase change) (d) things that are displayed by the movement of one end of the film, or by the color development / phase change of molecules Things that are displayed, things that are displayed by the light absorption of molecules, or things that spontaneously occur when electrons and holes combine Light-based displays can be used. Specifically, electronic paper display methods Examples of methods include microcapsule electrophoresis, horizontal-transfer electrophoresis, and vertical-transfer electrophoresis. Electrophoresis, spherical twist balls, magnetic twist balls, cylindrical twist ball method, electrostatic toner Electron powder fluid, magnetophoresis type, magnetic thermal type, electrowetting, light scattering (transparent / white) Turbidity change), cholesteric liquid crystal / photoconductive layer, cholesteric liquid crystal, bistable nematic liquid Crystal, ferroelectric liquid crystal, dichroic dye / liquid crystal dispersion type, movable film, color change by leuco dye, Photochromic, electrochromic, electrodeposition, flexible organic Examples include EL (electroluminescent) displays. However, this is not limited to these; there are various types of electronic paper and their display methods. This can be used. Here, by using microcapsule electrophoresis, This can solve the aggregation and precipitation of electrophoretic particles. Electron powder fluid offers high-speed response and high reflectivity. It offers advantages such as high resolution, wide viewing angle, low power consumption, and memory capacity.

[0161] This embodiment can be combined with other embodiments as appropriate.

[0162] (Embodiment 2) In this embodiment, Figures 8 to 11 show an electronic device to which one aspect of the present invention is applied. explain.

[0163] The electronic device of this embodiment alternates between a strip-shaped region with high flexibility and a strip-shaped region with low flexibility. The electronic device can be folded by bending it in a highly flexible region. The electronic device of this embodiment offers excellent portability when folded, and when unfolded, it is easy to connect. The seamless, wide light-emitting area provides excellent visibility.

[0164] In the electronic device of this embodiment, the highly flexible region is folded either inward or outward. It is also possible to do so.

[0165] In this specification, the case in which the light-emitting surface of the light-emitting device is bent inward is referred to as "inward bending". When a light-emitting device is bent so that the light-emitting surface faces outwards, it is referred to as "outward bending." Also, electronic devices and In a light-emitting device, the light-emitting surface refers to the surface from which light is extracted from the light-emitting element.

[0166] When the electronic device of this embodiment is not in use, bend the light-emitting device so that the light-emitting surface faces inward. This helps to prevent scratches and dirt from getting on the light-emitting surface.

[0167] When using the electronic device of this embodiment, unfolding it creates a seamless, wide light-emitting area. The entire thing can be used, or the light-emitting surface of the light-emitting device can be bent outwards to create a light-emitting area. Partial use is permitted. The luminescent area that is folded and invisible to the user is made non-luminescent. This can reduce the power consumption of electronic devices.

[0168] In the following, we have a structure having two band-shaped highly flexible regions and three band-shaped less flexible regions. Let's explain using a foldable electronic device as an example.

[0169] Figure 8(A) shows the electronic device in its unfolded state. Figure 8(B) shows the device in its unfolded or folded state. This shows an electronic device in an intermediate state, transitioning from one state to the other. (See Figure 8(C) for details.) Figure 10(A) shows the electronic device in its current state. Figure 9 is a perspective view showing the various components of the electronic device. Figure 10(B) is a plan view of the light-emitting surface side of the electronic device, while Figure 10(B) is a plan view of the side of the electronic device facing the light-emitting surface. This is a plan view. Figures 10(C) and (D) show the electronic equipment in Figure 10(A) in the direction of the arrows, respectively. This is an example of a side view seen from the front. Figure 10(E) shows the dashed line AB in Figure 10(A). This is a cross-sectional view.

[0170] The electronic device shown in Figures 8(A) to (C) has a flexible light-emitting device 11. In 11, a light-emitting device according to one embodiment of the present invention described in Embodiment 1 can be applied. A light-emitting device according to one aspect of the present invention is, for example, bent with a radius of curvature of 1 mm or more and 100 mm or less. Because it can be folded inward or outward, it is suitable for use in electronic devices that are folded one or more times. It is possible.

[0171] The electronic equipment shown in Figures 8(A) to (C) further consists of multiple support panels 15a and multiple support panels It has a support panel 15b. Each support panel 15a, 15b has lower flexibility compared to the light-emitting device 11. Multiple support panels 15a are spaced apart from each other. Multiple support panels 15b are spaced apart from each other. They are doing it.

[0172] As shown in Figure 10(A), the electronic device has a highly flexible region E1 and a less flexible region E It has alternating sections of 2. The highly flexible regions and the less flexible regions are each formed in a striped (striped) pattern. In this embodiment, multiple highly flexible regions and multiple less flexible regions are connected to each other. An example of parallel arrangement is shown, but the regions do not necessarily have to be arranged parallel to each other.

[0173] A highly flexible region E1 in an electronic device has at least a flexible light-emitting device. It would be good if it were there. Light-emitting devices using organic EL elements have high flexibility and impact resistance, as well as being thin and light. This is preferable because it allows for quantification.

[0174] The region E2 in the electronic device has low flexibility, and the light-emitting device has at least flexibility. It is sufficient to have a support panel that is less flexible than the optical device, stacked on top of it.

[0175] The support panel is provided on at least one of the light-emitting surface side or the side facing the light-emitting surface of the light-emitting device. It's fine as long as it's done.

[0176] As shown in Figure 10(C), the support panels 15a and 15b are located on the light-emitting surface side and the light-emitting surface of the light-emitting device. If support panels are provided on both sides of the opposing surface, the light-emitting device is sandwiched between the pair of support panels. Because it can be held, it increases the mechanical strength of areas with low flexibility, making electronic devices less prone to damage. preferable.

[0177] Alternatively, instead of support panels 15a and 15b, support panel 15 shown in Figure 10(D) can be used. Alternatively, the light-emitting device 11 may be sandwiched between the support panel 15.

[0178] If the light-emitting device has a support panel only on the side of the light-emitting surface or the side facing the light-emitting surface, the electronic device It is preferable to make it thinner or lighter. For example, using multiple support panels 15a Alternatively, the electronic device may have only a plurality of support panels 15b.

[0179] The highly flexible region E1 and the less flexible region E2 are more flexible than the light-emitting device and the support panel. It is preferable to have a highly protective layer layered on top of it. This increases the flexibility of the electronic device. Region E1 becomes a region that is flexible and has high mechanical strength, making it less likely to damage electronic equipment. This makes it less likely for electronic devices to be affected by external forces, etc., even in areas with high flexibility. This deformation allows for a more durable structure that is less prone to breakage.

[0180] For example, the thickness of the light-emitting device, support panel, and protective layer is such that the support panel is the thickest. The thinnest possible configuration for the optical device is preferred. Alternatively, for example, the light-emitting device, support panel, and protective layer can be... The flexibility of each component is such that the support panel has the lowest flexibility, and the light-emitting device has the highest flexibility. This is preferable. With this configuration, the flexibility of the highly flexible region and the less flexible region can be improved. The difference becomes larger. By creating a structure that can be bent in a region of high flexibility, This can suppress bending in areas with low flexibility, thereby improving the reliability of electronic devices. Furthermore, it can prevent electronic devices from bending unintentionally.

[0181] If a protective layer is provided on both the light-emitting surface side and the surface opposite the light-emitting surface of the light-emitting device, then a pair of protective layers This allows the light-emitting device to be held securely, increasing the mechanical strength of the electronic device and making it less susceptible to breakage. It becomes less likely to happen, which is desirable.

[0182] For example, as shown in Figure 10(C), in the less flexible region E2, a pair of protective layers 13a, 13b is located between a pair of support panels 15a and 15b, and a pair of light-emitting devices (not shown) are located there. It is preferable that it be located between the protective layers 13a and 13b.

[0183] Alternatively, as shown in Figure 10(D), in the less flexible region E2, a pair of protective layers 13a, 13b is located between the support panels 15, and a light-emitting device (not shown) is connected to a pair of protective layers 13a. It is preferable that it be located between 13b.

[0184] Having a protective layer only on the light-emitting surface side of the light-emitting device or on the side facing the light-emitting surface makes the electronic device more... It is preferable to make it thinner or lighter. For example, without using protective layer 13a, protective layer 1 It may also be an electronic device having only 3b.

[0185] Furthermore, if the protective layer 13a on the light-emitting surface side of the light-emitting device is a light-shielding film, then the non-light-emitting region of the light-emitting device will be exposed. This suppresses the emission of light. This allows the drive circuit included in the non-emitting region to... This is preferable because it can suppress photodegradation of transistors and other components.

[0186] As shown in Figure 10(E), the opening of the protective layer 13a provided on the light-emitting surface side of the light-emitting device 11 This overlaps with the light-emitting region 11a of the light-emitting device. The non-light-emitting region 11b surrounds the light-emitting region 11a in a frame-like shape. It is provided so as to overlap with the protective layer 13a. On the side of the light-emitting device 11 facing the light-emitting surface. The provided protective layer 13b overlaps with the light-emitting region 11a and the non-light-emitting region 11b. Layer 13b is provided over a wider area on the side facing the light-emitting surface, and particularly preferably over the entire surface. This allows for better protection of the light-emitting device and increases the reliability of electronic equipment. ru.

[0187] The protective layer and support panel can be formed using plastic, metal, alloy, rubber, etc. By using materials such as plastic or rubber, it is possible to obtain lightweight and damage-resistant protective layers and support panels. Therefore, it is preferable. For example, silicone rubber as the protective layer and stainless steel as the support panel. Aluminum can be used.

[0188] Furthermore, it is preferable to use materials with high toughness for the protective layer and support panels. This improves durability. This enables the creation of electronic devices that are highly impact-resistant and less prone to damage. For example, organic resins and thin gold By using alloy materials, it is possible to create lightweight and durable electronic devices. For similar reasons, it is preferable to use a highly tough material for the substrate that makes up the light-emitting device. It's nice.

[0189] If the protective layer or support panel located on the light-emitting surface side does not overlap with the light-emitting area of ​​the light-emitting device, Transparency is not a requirement. The protective layer or support panel located on the light-emitting surface side must be at least a portion of the light-emitting area. If it overlaps with the area, it is preferable to use a material that transmits light emitted from the light-emitting device. The light transmittance of the protective layer or support panel located on the opposite side is not a concern.

[0190] When bonding any two of the following components—protective layer, support panel, or light-emitting device—various adhesives can be used. This can be done, for example, with two-part resins that cure at room temperature, photocurable resins, and heat Resins such as curable resins can be used. Alternatively, sheet-type adhesives may be used. Also, screws that penetrate two or more of the protective layer, support panel, or light-emitting device, or clamping screws Pins, clips, or the like may be used to secure each component of the electronic device.

[0191] The electronic device of this embodiment has one light-emitting device (one light-emitting area) in a bent portion It can be used by dividing it into two or more parts at the boundary. For example, by folding it, the hidden area can be made non-luminescent. Only the exposed area may emit light. This reduces the power consumption of areas not used by the user. It can reduce the amount of force required.

[0192] The electronic device of this embodiment determines whether or not each highly flexible region is bent. It may have a sensor for this purpose. For example, a switch, a MEMS pressure sensor or a pressure sensor. It can be constructed using elements such as "sa".

[0193] The above explanation uses an electronic device having two highly flexible regions as an example, but the present invention is not limited to this. It is not possible. For example, as shown in Figure 11(A), at least one highly flexible region E1 It is sufficient if it has three highly flexible regions E1, and it is a four-foldable electronic device (Figure 1). 1(B)) and a five-fold electronic device having four highly flexible regions E1 (Figure 11( C)) is also one aspect of the present invention.

[0194] This embodiment can be combined with other embodiments as appropriate.

[0195] (Embodiment 3) In this embodiment, Figure 12 shows an electronic device and a lighting device to which one aspect of the present invention is applied. We will explain using this method.

[0196] Electronic devices and lighting devices can be manufactured by applying a light-emitting device according to one embodiment of the present invention, thereby improving reliability. It can be improved. Furthermore, by applying a light-emitting device according to one aspect of the present invention, the reliability can be increased. It is possible to manufacture flexible electronic devices and lighting equipment.

[0197] Examples of electronic devices include television equipment (also known as televisions or television receivers). (u) Monitors for computers, digital cameras, digital video cameras, digital Photo frames, mobile phones (also called mobile phones or mobile phone devices), portable game consoles, portable Examples include mobile information terminals, sound playback devices, and large game machines such as pachinko machines.

[0198] Furthermore, since the light-emitting device according to one aspect of the present invention is flexible, it can be used on the interior or exterior walls of houses and buildings. Alternatively, it can be incorporated along the curved surfaces of the interior or exterior of a vehicle.

[0199] Figure 12(A) shows an example of a mobile phone. Mobile phone 7400 has a housing 7401 In addition to the display unit 7402 incorporated into it, there are also operation buttons 7403, an external connection port 7404, It is equipped with speaker 7405, microphone 7406, etc. Note that mobile phone 7400 is... This invention is manufactured by using a light-emitting device according to one aspect of the invention in the display unit 7402. Depending on the design, it is possible to provide highly reliable mobile phones with curved displays at a high yield rate. ru.

[0200] The mobile phone 7400 shown in Figure 12(A) allows you to access information by touching the display unit 7402 with your finger or the like. You can enter information. You can also make phone calls or type text. The operation can be performed by touching the display unit 7402 with a finger or the like.

[0201] Furthermore, the operation button 7403 can be used to turn the power ON or OFF, and the display unit 7402 will display... You can switch the type of image displayed. For example, from the email composition screen, You can switch to the menu screen.

[0202] Figure 12(B) shows an example of a wristband-type portable display device. Portable display device 71 00 represents the housing 7101, the display unit 7102, the operation buttons 7103, and the transmitting / receiving device 7104. It is equipped with.

[0203] The portable display device 7100 is capable of receiving video signals by the transceiver 7104, and the received The video can be displayed on the display unit 7102. Additionally, the audio signal can be transmitted to other receiving devices. It is also possible to do so.

[0204] Additionally, the 7103 control button allows you to turn the power on and off, and switch the displayed image. Alternatively, you can adjust the volume of the sound, etc.

[0205] Here, the display unit 7102 incorporates a light-emitting device according to one aspect of the present invention. In one embodiment, a portable display device equipped with a curved display section and with high reliability is provided with a high yield. It can be used.

[0206] Figures 12(C) to (E) show an example of a lighting device. Lighting device 7200, lighting device 7 210 and the lighting device 7220 each have a base 720 equipped with an operating switch 7203 It has 1 and a light-emitting part supported by a base portion 7201.

[0207] The lighting device 7200 shown in Figure 12(C) includes a light-emitting section 7202 having a wave-shaped light-emitting surface. Therefore, it is a lighting fixture with a highly aesthetic design.

[0208] The light-emitting section 7212 of the lighting device 7210 shown in Figure 12(D) has two convexly curved parts The light-emitting parts are arranged symmetrically. Therefore, the entire lighting system is centered around the lighting device 7210. It can illuminate directions.

[0209] The lighting device 7220 shown in Figure 12(E) includes a concavely curved light-emitting section 7222. Therefore, in order to concentrate the light emitted from the light-emitting unit 7222 onto the front of the lighting device 7220, It is suitable for brightly illuminating a wide area.

[0210] Furthermore, each of the light-emitting parts provided in the lighting device 7200, lighting device 7210, and lighting device 7220 Because it is flexible, the light-emitting part can be made of plastic material or a movable frame or other material. The light-emitting surface of the light-emitting part may be freely curved to suit the application, while remaining fixed in place.

[0211] In this example, we have shown a lighting device in which the light-emitting part is supported by a base, but the light-emitting part The enclosure can be fixed to the ceiling or suspended from the ceiling. Because the surface can be curved for use, the light-emitting surface can be curved into a concave shape to brighten a specific area. It can illuminate a room, or the light-emitting surface can be curved into a convex shape to brightly illuminate the entire room.

[0212] Here, each light-emitting unit incorporates a light-emitting device according to one aspect of the present invention. This makes it possible to provide highly reliable lighting devices with curved light-emitting sections, resulting in a high yield.

[0213] Figure 12(F) shows an example of a portable display device. The display device 7300 is housed in a casing 7 301, display unit 7302, operation button 7303, pull-out member 7304, control unit 7305 It is equipped with.

[0214] The display device 7300 has a flexible display unit wound in a roll inside a cylindrical housing 7301. It is equipped with 7302.

[0215] Furthermore, the display device 7300 can receive video signals via the control unit 7305, and the received video This can be displayed on the display unit 7302. Furthermore, the control unit 7305 is equipped with a battery. Furthermore, the control unit 7305 is equipped with a terminal section for connecting a connector, allowing video signals and power to be transmitted via wired connections. This configuration may involve supplying power directly from an external source.

[0216] Additionally, the 7303 control button allows you to turn the power on and off and switch the displayed image. These can be done.

[0217] Figure 12(G) shows the display unit 7302 pulled out by the pull-out member 7304. The device 7300 is shown. In this state, an image can be displayed on the display unit 7302. Also, The operation buttons 7303 located on the surface of the housing 7301 allow for easy one-handed operation. This can be done. Also, as shown in Figure 12(F), the operation button 7303 is located in the center of the housing 7301. By positioning it to one side, it can be easily operated with one hand.

[0218] Furthermore, when the display unit 7302 is pulled out, the display surface of the display unit 7302 is fixed to become flat. To ensure stability, a reinforcing frame may be provided on the side of the display unit 7302.

[0219] In addition to this configuration, a speaker is installed in the enclosure, and the audio signal received along with the video signal is used. It may also be configured to output sound.

[0220] The display unit 7302 incorporates a light-emitting device according to one aspect of the present invention. This allows us to provide lighter and more reliable light-emitting devices with a higher yield.

[0221] This embodiment can be freely combined with other embodiments. [Explanation of symbols]

[0222] 11 Light-emitting device 11a Emitting region 11b Non-emitting region 13a Protective layer 13b Protective layer 15 Support Panel 15a Support panel 15b Support Panel 101 Element Layer 102 Flexible substrate 103 Flexible substrate 104 Light extraction section 105 Adhesive layer 106 Drive circuit section 108 FPC 108a FPC 108b FPC 156 Conductive layer 157 Conductive layer 201 Flexible substrate 202 Flexible substrate 203 Adhesive layer 204 Adhesive layer 205 Insulating layer 206 Adhesive layer 207 Insulating layer 208 Conductive layer 209 Insulating layer 209a Insulating layer 209b Insulating layer 211 Insulating layer 212 Conductive layer 213 Adhesive layer 215 Connectors 215a Connector 215b Connector 217 Insulating layer 230 light-emitting elements 231 Lower electrode 233 EL layer 233a EL layer 233b EL layer 235 Upper electrode 240 transistors 255 Insulating layer 257 Light blocking layer 259 Colored layer 261 Overcoat 270 Conductive layer 271 p-type semiconductor layer 272 Conductive layer 273 i-type semiconductor layer 274 Conductive layer 275 n-type semiconductor layer 276 Insulating layer 278 Insulating layer 280 Conductive layer 281 Conductive layer 283 Conductive layer 291 Insulating layer 292 Conductive particles 293 Insulating layer 294 Conductive layer 295 Insulating layer 296 Conductive layer 301 Fabricated substrate 303 Exfoliation layer 305 Fabricated substrate 307 Delamination layer 310a conductive layer 310b conductive layer 7100 Portable Display Device 7101 enclosure 7102 Display section 7103 Operation Buttons 7104 Transceiver 7200 Lighting device 7201 Daibu 7202 Light-emitting part 7203 Operation switch 7210 Lighting device 7212 Light-emitting part 7220 Lighting device 7222 Light-emitting part 7300 display device 7301 enclosure 7302 Display section 7303 Operation Buttons 7304 component 7305 Control Unit 7400 mobile phones 7401 enclosure 7402 Display section 7403 Operation Buttons 7404 External connection port 7405 Speaker 7406 Microphone

Claims

[Claim 1] A first flexible substrate and A second flexible substrate, Element layer, The first adhesive layer, It has a second adhesive layer, The element layer has a light-emitting element, The element layer is located between the first flexible substrate and the second flexible substrate. The first adhesive layer is located between the first flexible substrate and the element layer. The second adhesive layer is located between the second flexible substrate and the element layer. The first adhesive layer and the second adhesive layer are in contact outside the edge of the element layer, A light-emitting device in which the first flexible substrate and the second flexible substrate are in contact outside the edges of the element layer, the edges of the first adhesive layer, and the edges of the second adhesive layer.

Images