Method for manufacturing negative thermal expansion materials

JP2026094433APending Publication Date: 2026-06-09NAT UNIV CORP TOKAI NAT HIGHER EDUCATION & RES SYST

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
NAT UNIV CORP TOKAI NAT HIGHER EDUCATION & RES SYST
Filing Date
2026-03-12
Publication Date
2026-06-09

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Benefits of technology

【0009】 本開示によれば、負熱膨張を示す新たな材料を提供できる。

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Abstract

This provides a new material that exhibits negative thermal expansion. [Solution] A method for manufacturing a negative thermal expansion material is provided by the general formula (1) Cu 2-x R x V 2-y P y O7(R contains at least one element selected from Mg, Al, Si, Ti, Cr, Mn, Fe, Co, Ni, Zn, Sn, 0
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Claims

1. General formula (1) Cu 2-x R x V 2-y P y O 7 The process includes a step of preparing an aqueous solution containing a raw material for a compound that exhibits negative thermal expansion in the temperature range of 100 to 500 K and an organic acid, where R is represented as (R contains at least one element selected from Mg, Al, Si, Ti, Cr, Mn, Fe, Co, Ni, Zn, Sn, and satisfies 0 < x < 2 and 0 < y < 2). A method for manufacturing a negative thermal expansion material.

2. The process includes drying and granulating the aforementioned aqueous solution by spray drying to produce an organic acid salt powder. The method according to claim 1.

3. A step of heating the organic acid salt powder to decompose the organic acid, The process includes a step of firing the powder obtained by decomposing the organic acid to produce an oxide sintered body. The method according to claim 2.