Electronic components

Abstract

In a configuration where multiple circuits are included within a single body, the present invention provides an electronic component that improves the characteristics of multiple circuits while simultaneously improving the isolation between them. [Solution] The electronic component comprises a base body, a plurality of terminal electrodes arranged on the outer surface of the base body, a plurality of first patterns arranged inside the base body and constituting a first circuit that processes signals with frequencies within a first frequency band, a plurality of second patterns arranged inside the base body and constituting a second circuit that processes signals with frequencies within a second frequency band, and a shield pattern arranged inside the base body and constituting a shield between the first and second patterns. The plurality of terminal electrodes include a first ground terminal electrically connected to the first circuit, a second ground terminal electrically connected to the second circuit, and a third ground terminal electrically connected to the shield. The first ground terminal, the second ground terminal, and the third ground terminal are electrically insulated from each other.

Description

Technical Field

[0001] The present invention relates to electronic components.

Background Art

[0002] Patent Document 1 discloses an electronic component including a laminated filter formed of a plurality of dielectric layers, a first LC parallel resonator including a first inductor and a first capacitor, a second LC parallel resonator including a second inductor and a second capacitor, and an LC series resonator including third to fifth capacitors and a third inductor having one end connected to a ground point.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] As an electronic component, there is one in which a plurality of circuits (filters) having different characteristics are included in one element. In this configuration, when a ground terminal for connecting each of the plurality of circuits to the ground is common to the plurality of circuits, there is a problem that the attenuation amount decreases in the attenuation amount frequency characteristics. Further, in a configuration in which a plurality of circuits having different characteristics are included in one element, since the plurality of circuits are arranged in a limited space within the element, the plurality of circuits are arranged close to each other. Therefore, the isolation between the plurality of circuits decreases.

[0005] One aspect of the present invention aims to provide an electronic component capable of improving the characteristics of a plurality of circuits and improving the isolation between the plurality of circuits in a configuration in which a plurality of circuits are included in one element.

Means for Solving the Problems

[0006] (1) An electronic component according to one aspect of the present invention comprises a base body formed by stacking a plurality of dielectric layers, a plurality of terminal electrodes arranged on the outer surface of the base body, a plurality of first patterns arranged inside the base body and constituting a first circuit that processes signals with frequencies within a first frequency band, a plurality of second patterns arranged inside the base body and constituting a second circuit that processes signals with frequencies within a second frequency band, and a shield pattern arranged inside the base body and constituting a shield between the first and second patterns, wherein the plurality of terminal electrodes include a first ground terminal electrically connected to the first circuit, a second ground terminal electrically connected to the second circuit, and a third ground terminal electrically connected to the shield, and the first ground terminal, the second ground terminal and the third ground terminal are electrically insulated from each other.

[0007] An electronic component according to one aspect of the present invention is equipped with a shield composed of a shield pattern. The shield pattern is arranged between a first pattern and a second pattern within the component. In this configuration, the multiple terminal electrodes include a first ground terminal electrically connected to a first circuit, a second ground terminal electrically connected to a second circuit, and a third ground terminal electrically connected to the shield, and the first ground terminal, second ground terminal and third ground terminal are electrically insulated from each other. In this way, because the first ground terminal, second ground terminal and third ground terminal are electrically insulated from each other in the electronic component, the attenuation can be improved in the attenuation frequency characteristics. Furthermore, in the electronic component, the isolation between the first circuit and the second circuit can be improved by the shield connected to the third ground terminal, which is electrically insulated from the first and second ground terminals. As described above, in an electronic component with a configuration that includes multiple circuits within a single component, the characteristics of the multiple circuits can be improved while improving the isolation between the multiple circuits.

[0008] (2) In the electronic component described in (1) above, the first circuit has a first capacitor which is configured to include a first capacitor pattern from among a plurality of first patterns, and the second circuit has a second capacitor which is configured to include a second capacitor pattern from among a plurality of second patterns, and the second capacitor pattern may be arranged in a region closer to the shield pattern than the first capacitor pattern.

[0009] (3) In the electronic component described in (1) or (2) above, the third ground terminal may be located in the center of the outer surface when the outer surface of the element is viewed from the direction of stacking of the multiple dielectric layers. In this configuration, the third ground terminal can be efficiently positioned on the outer surface in relation to the other terminals.

[0010] (4) In the electronic component described in (3) above, the shield pattern may extend in a direction that intersects the direction in which the first region where multiple first patterns are arranged and the second region where multiple second patterns are arranged are aligned, when viewed from the stacking direction. In this configuration, the shield pattern can further ensure isolation between the first circuit and the second circuit.

[0011] (5) In the electronic component described in (4) above, the end of the shield pattern in the direction of extension may extend beyond the end in the direction of intersection of the first region and the second region, as viewed from the stacking direction. This configuration allows for better isolation between the first circuit and the second circuit.

[0012] (6) In any one of the electronic components described in (1) to (5) above, the multiple terminal electrodes include input / output terminals to which signals are input and output in the second circuit, and the first ground terminal and the input / output terminals may be arranged opposite each other with a shield pattern in between, when viewed from the stacking direction of the multiple dielectric layers. This configuration makes it possible to suppress signal interference between the first circuit and the second circuit.

[0013] (7) Any one of the electronic components described in (6) above may be provided with a dummy pattern that is positioned in the stacking direction to overlap with the first ground terminal, the second ground terminal, or the input / output terminal, and is not electrically connected to the first ground terminal, the second ground terminal, or the input / output terminal. In this configuration, by providing the dummy pattern, it is possible to suppress the displacement of other patterns in the stacking direction.

[0014] (8) In any one of the electronic components described in (1) to (7) above, the shielding patterns are arranged in multiple locations in the stacking direction of the multiple dielectric layers, and the multiple shielding patterns are positioned to overlap with the third ground terminal in the stacking direction and are electrically connected to the third ground terminal by multiple conductors stacked in the stacking direction. In this configuration, the formation of stray capacitance between the conductor and the circuit pattern can be suppressed. Therefore, the characteristics of the electronic component can be improved. [Effects of the Invention]

[0015] According to one aspect of the present invention, in a configuration in which multiple circuits are included within a single substrate, it is possible to improve the characteristics of the multiple circuits while also improving the isolation between the multiple circuits. [Brief explanation of the drawing]

[0016] [Figure 1] Figure 1 is an equivalent circuit diagram of an electronic component according to one embodiment. [Figure 2] Figure 2 is a perspective view of the electronic component shown in Figure 1. [Figure 3] Figure 3 shows the conductor pattern of the first conductor layer of the electronic component shown in Figure 1. [Figure 4] Figure 4 shows the conductor pattern of the second conductor layer of the electronic component shown in Figure 1. [Figure 5] Figure 5 shows the conductor pattern of the third conductor layer of the electronic component shown in Figure 1. [Figure 6] Figure 6 shows the conductor pattern of the fourth conductor layer of the electronic component shown in Figure 1. [Figure 7] FIG. 7 is a diagram showing a conductor pattern included in the electronic component shown in FIG. 1. [Figure 8] FIGS. 8(a) and 8(b) are diagrams showing simulation results of the relationship between the frequency band and isolation in the electronic component and the comparative example. [Figure 9] FIG. 9 is a diagram showing a conductor pattern included in an electronic component according to another embodiment. [Figure 10] FIG. 10 is a diagram showing a conductor pattern included in an electronic component according to another embodiment. [Figure 11] FIGS. 11(a) and 11(b) are diagrams showing simulation results of the relationship between the frequency band and isolation in the electronic component and the modified example. [Figure 12] FIG. 12 is a diagram showing a conductor pattern included in an electronic component according to another embodiment. BEST MODE FOR CARRYING OUT THE INVENTION

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted.

[0018] FIG. 1 is an equivalent circuit diagram of an electronic component according to an embodiment. The electronic component 1 includes a first filter (first circuit) F1, a second filter (second circuit) F2, and a shield S. The first filter F1 processes signals having frequencies within a first frequency band (first pass band). The second filter F2 processes signals having frequencies within a second frequency band (second pass band). The first frequency band may be a lower frequency band than the second frequency band or a higher frequency band.

[0019] The first filter F1 includes a signal input / output port P11, a signal input / output port P12, a ground Gnd11, a ground Gnd12, an inductor L1, an inductor L2, an inductor L3, an inductor L4, an inductor L5, an inductor L6, an inductor L7, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, and a capacitor C12.

[0020] Capacitors C1, C2, C3, C4, C5, and C6 are electrically connected in series. Inductors L1, C7, L2, L3, C8, and L4 are electrically connected in series. Capacitors C9, L5, C10, L6, C11, L7, and C12 are electrically connected in parallel.

[0021] The second filter F2 includes a signal input / output port P21, a signal input / output port P22, a ground Gnd21, a ground Gnd22, inductors L10, L11, L12, L13, L14, L15, L16, a capacitor (second capacitor) C13, a capacitor (second capacitor) C14, a capacitor (second capacitor) C15, a capacitor C16, a capacitor C17, a capacitor C18, a capacitor C19, a capacitor C20, and a capacitor C21.

[0022] Capacitors C13, C14, and C15 are electrically connected in series. Inductors L10, C16, L11, L12, C17, and L13 are electrically connected in series. Capacitors C18, L14, C19, L15, C20, L16, and C21 are electrically connected in parallel.

[0023] Shield S is installed between the first filter F1 and the second filter F2. Shield S is connected to ground Gnd31.

[0024] In electronic component 1, ground Gnd11 and ground Gnd12, ground Gnd21 and ground Gnd22, and ground Gnd31 are electrically isolated from each other.

[0025] Next, the configuration of electronic component 1 will be described. Figure 2 is a perspective view of electronic component 1 shown in Figure 1. As shown in Figure 2, electronic component 1 comprises a base body 2 and a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode (first ground terminal) 5, a fourth terminal electrode (first ground terminal) 6, a fifth terminal electrode 7, a sixth terminal electrode 8, a seventh terminal electrode (second ground terminal) 9, an eighth terminal electrode (second ground terminal) 10, and a ninth terminal electrode (third ground terminal) 11.

[0026] Body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges. Body 2 has a pair of opposing end faces 2a, 2b, a pair of opposing main faces 2c, 2d, and a pair of opposing side faces 2e, 2f as its outer surface. The opposing direction of the pair of opposing end faces 2a, 2b is the first direction (intersecting direction) D1. The opposing direction of the pair of opposing main faces 2c, 2d is the second direction D2. The opposing direction of the pair of opposing side faces 2e, 2f is the third direction D3.

[0027] In this embodiment, the first direction D1 is the width direction of the base body 2. The second direction D2 is the height direction of the base body 2 and is perpendicular to the second direction D2. The third direction D3 is the length direction of the base body 2 and is perpendicular to both the second direction D2 and the first direction D1.

[0028] A pair of end faces 2a and 2b extend in a second direction D2 to connect a pair of main faces 2c and 2d. The pair of end faces 2a and 2b also extend in a third direction D3 (the direction of the shorter sides of the pair of main faces 2c and 2d). A pair of side faces 2e and 2f extend in a second direction D2 to connect a pair of main faces 2c and 2d. The pair of side faces 2e and 2f also extend in a first direction D1 (the direction of the longer sides of the pair of end faces 2a and 2b). The main face 2d may be defined as the mounting surface that faces other electronic equipment when mounting the electronic component 1 onto other electronic equipment (for example, a circuit board or other electronic component).

[0029] The base body 2 is constructed by stacking multiple insulating layers (dielectric layers). Each insulating layer is stacked in the second direction D2; that is, the second direction D2 is the stacking direction. The base body 2 has multiple stacked insulating layers. Each insulating layer can be formed from an organic insulating material such as polyimide resin, epoxy resin, or benzocyclobutene resin. In the actual base body 2, the multiple insulating layers are integrated to such an extent that the boundaries between the layers are not visible.

[0030] The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, eighth terminal electrode 10, and ninth terminal electrode 11 are provided on the base body 2. Each of the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, eighth terminal electrode 10, and ninth terminal electrode 11 is positioned on the main surface 2c of the base body 2.

[0031] The first terminal electrode 3 and the second terminal electrode 4 are positioned near side surface 2e. The seventh terminal electrode 9 and the eighth terminal electrode 10 are positioned near side surface 2f. The first terminal electrode 3, the third terminal electrode 5, the fifth terminal electrode 7, and the seventh terminal electrode 9 are positioned near end surface 2a. The first terminal electrode 3, the third terminal electrode 5, the fifth terminal electrode 7, and the seventh terminal electrode 9 are arranged side by side with a gap in between in the third direction D3. The second terminal electrode 4, the fourth terminal electrode 6, the sixth terminal electrode 8, and the eighth terminal electrode 10 are positioned near end surface 2b. The second terminal electrode 4, the fourth terminal electrode 6, the sixth terminal electrode 8, and the eighth terminal electrode 10 are arranged side by side with a gap in between in the third direction D3.

[0032] The first terminal electrode 3 and the second terminal electrode 4 are positioned opposite each other in the first direction D1. The third terminal electrode 5 and the fourth terminal electrode 6 are positioned opposite each other in the first direction D1. The fifth terminal electrode 7 and the sixth terminal electrode 8 are positioned opposite each other in the first direction D1. The seventh terminal electrode 9 and the eighth terminal electrode 10 are positioned opposite each other in the first direction D1.

[0033] The ninth terminal electrode 11 is located in the center of the main surface 2d. The center is the portion of the main surface 2d that includes parts of the center of the first direction D1 and the third direction D3. The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, and fourth terminal electrode 6 are located closer to the side surface 2e than the ninth terminal electrode 11. The fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, and eighth terminal electrode 10 are located closer to the side surface 2f than the ninth terminal electrode 11.

[0034] The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, eighth terminal electrode 10, and ninth terminal electrode 11 each have a roughly rectangular shape in plan view. The rectangular shape includes shapes where the corners and edges are chamfered, and shapes where the corners and edges are rounded. The first terminal electrode 3, second terminal electrode 4, seventh terminal electrode 9, and eighth terminal electrode 10 have one corner that is rounded (curved).

[0035] The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, eighth terminal electrode 10, and ninth terminal electrode 11 protrude beyond the main surface 2d. That is, in this embodiment, the surfaces of the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, eighth terminal electrode 10, and ninth terminal electrode 11 are not flush with the main surface 2c. The first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, eighth terminal electrode 10, and ninth terminal electrode 11 are made of a conductive material (for example, Cu).

[0036] Each of the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, eighth terminal electrode 10, and ninth terminal electrode 11 may be provided with a plating layer (not shown) containing, for example, Ni, Sn, Au, etc., by electroplating or electroless plating. The plating layer may have, for example, a Ni plating film containing Ni that covers the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, eighth terminal electrode 10, and ninth terminal electrode 11, and an Au plating film containing Au that covers the Ni plating film.

[0037] The first terminal electrode 3 constitutes port P11 (see Figure 1). The second terminal electrode 4 constitutes port P12 (see Figure 1). The third terminal electrode 5 constitutes ground Gnd11 (see Figure 1). The fourth terminal electrode 6 constitutes ground Gnd12 (see Figure 1). The fifth terminal electrode 7 constitutes port P21 (see Figure 1). The sixth terminal electrode 8 constitutes port P22 (see Figure 1). The seventh terminal electrode 9 constitutes ground Gnd21 (see Figure 1). The eighth terminal electrode 10 constitutes ground Gnd22 (see Figure 1). The ninth terminal electrode 11 constitutes ground Gnd31 (see Figure 1). The first terminal electrode 3, the second terminal electrode 4, the fifth terminal electrode 7, and the sixth terminal electrode 8 are input / output terminals to which signals are input and output. The third terminal electrode 5, the fourth terminal electrode 6, the seventh terminal electrode 9, the eighth terminal electrode 10, and the ninth terminal electrode 11 are ground terminal electrodes (earthing terminals) that are connected to the ground of the electronic equipment.

[0038] Figure 3 shows the conductor pattern of the first conductor layer of the electronic component 1 shown in Figure 1. Figure 4 shows the conductor pattern of the second conductor layer of the electronic component 1 shown in Figure 1. Figure 5 shows the conductor pattern of the third conductor layer of the electronic component 1 shown in Figure 1. Figure 6 shows the conductor pattern of the fourth conductor layer of the electronic component 1 shown in Figure 1.

[0039] In electronic component 1, the layers are arranged in the following order from the main surface 2c side of the base body 2: first conductor layer CL1, second conductor layer CL2, third conductor layer CL3, and fourth conductor layer CL4. In electronic component 1, the first conductor layer CL1, second conductor layer CL2, third conductor layer CL3, and fourth conductor layer CL4 are arranged in different layers in the second direction D2.

[0040] As shown in Figure 3, the first conductor layer CL1 has conductor patterns 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, and a shield pattern 28. Conductor patterns 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, and shield pattern 28 can be formed from a suitable conductor (for example, copper).

[0041] For ease of explanation, Figure 3 also shows the conductor pattern formed on the first conductor layer CL1, the conductor pattern (capacitor pattern) which is laminated via a suitable dielectric film (e.g., silicon nitride) and constitutes the upper electrode of the capacitor described later, as well as via conductors.

[0042] Conductor pattern 15 is positioned near end face 2a and near side face 2e. Conductor pattern 15 is not electrically connected to other conductors. Conductor pattern 15 is a dummy pattern. Conductor pattern 16 is positioned near end face 2b and near side face 2e. Conductor pattern 16 is not electrically connected to other conductors. Conductor pattern 16 is a dummy pattern. The dummy patterns are provided to suppress misalignment of the conductor patterns of other conductor layers in the second direction D2.

[0043] The conductor pattern 17 includes a first pattern section 17A, a second pattern section 17B, and a third pattern section 17C. The first pattern section 17A, the second pattern section 17B, and the third pattern section 17C are electrically connected and may be formed integrally. A via conductor 30 is connected to the first pattern section 17A. The via conductor 30 electrically connects the conductor pattern 17 to the conductor pattern 102 (described later) of the second conductor layer CL2. A via conductor 31 is connected to the third pattern section 17C. The via conductor 31 electrically connects the conductor pattern 17 to the conductor pattern 100 (described later) of the second conductor layer CL2.

[0044] A capacitor pattern 32 is provided on the second pattern section 17B via a dielectric film. A via conductor 33 is connected to the capacitor pattern 32. The via conductor 33 electrically connects the capacitor pattern 32 to the conductor pattern 104 of the second conductor layer CL2. A capacitor pattern 34 is provided on the third pattern section 17C via a dielectric film. A via conductor 35 is connected to the capacitor pattern 34. The via conductor 35 electrically connects the capacitor pattern 34 to the conductor pattern 105 of the second conductor layer CL2. A capacitor pattern 36 is provided on the third pattern section 17C via a dielectric film. A via conductor 37 is connected to the capacitor pattern 36. The via conductor 37 electrically connects the capacitor pattern 36 to the conductor pattern 104 of the second conductor layer CL2.

[0045] The conductor pattern 18 includes a first pattern section 18A, a second pattern section 18B, and a third pattern section 18C. The first pattern section 18A, the second pattern section 18B, and the third pattern section 18C are electrically connected and may be formed integrally. A via conductor 38 is connected to the first pattern section 18A. The via conductor 38 electrically connects the conductor pattern 18 to the conductor pattern 103 (described later) of the second conductor layer CL2. A via conductor 39 is connected to the third pattern section 18C. The via conductor 39 electrically connects the conductor pattern 18 to the conductor pattern 101 (described later) of the second conductor layer CL2.

[0046] A capacitor pattern 40 is provided on the second pattern section 18B via a dielectric film. A via conductor 41 is connected to the capacitor pattern 40. The via conductor 41 electrically connects the capacitor pattern 40 to the conductor pattern 104 (described later) of the second conductor layer CL2. A capacitor pattern 42 is provided on the third pattern section 18C via a dielectric film. A via conductor 43 is connected to the capacitor pattern 42. The via conductor 43 electrically connects the conductor pattern 18 to the conductor pattern 107 (described later) of the second conductor layer CL2. A capacitor pattern 44 is provided on the third pattern section 17C via a dielectric film. A via conductor 45 is connected to the capacitor pattern 44. The via conductor 45 electrically connects the capacitor pattern 44 to the conductor pattern 104 (described later) of the second conductor layer CL2.

[0047] The conductor pattern 19 includes a first pattern section 19A, a second pattern section 19B, a third pattern section 19C, a fourth pattern section 18D, and a fifth pattern section 18E. The first pattern section 19A, the second pattern section 19B, the third pattern section 19C, the fourth pattern section 18D, and the fifth pattern section 18E are electrically connected and may be formed integrally.

[0048] Via conductors 46 and 47 are connected to the first pattern section 19A. Via conductors 46 and 47 electrically connect the conductor pattern 19 to the conductor pattern 104 (described later) of the second conductor layer CL2. Via conductors 48, 49 and 50 are connected to the third pattern section 19C. Via conductors 48, 49 and 50 electrically connect the conductor pattern 19 to the conductor pattern 104 (described later) of the second conductor layer CL2. A capacitor pattern 51 is provided on the fourth pattern section 19D via a dielectric film. Via conductors 52 and 53 are connected to the capacitor pattern 51. Via conductors 52 and 53 electrically connect the capacitor pattern 51 to the conductor pattern 104 (described later) of the second conductor layer CL2. A capacitor pattern 54 is provided on the fifth pattern section 19E via a dielectric film. Via conductors 55 and 56 are connected to the capacitor pattern 54. Via conductors 55 and 56 electrically connect the capacitor pattern 54 to the conductor pattern 104 (described later) of the second conductor layer CL2.

[0049] Capacitor patterns 57 and 58 are provided on the conductor pattern 20 via a dielectric film. A via conductor 59 is connected to the capacitor pattern 57. The via conductor 59 electrically connects the capacitor pattern 57 to the conductor pattern 105 (described later) of the second conductor layer CL2. A via conductor 60 is connected to the capacitor pattern 58. The via conductor 60 electrically connects the capacitor pattern 58 to the conductor pattern 106 (described later) of the second conductor layer CL2.

[0050] Capacitor patterns 61 and 62 are provided on the conductor pattern 21 via a dielectric film. A via conductor 63 is connected to capacitor pattern 61. The via conductor 63 electrically connects capacitor pattern 61 to conductor pattern 106 (described later) of the second conductor layer CL2. A via conductor 64 is connected to capacitor pattern 62. The via conductor 64 electrically connects conductor pattern 21 to conductor pattern 107 (described later) of the second conductor layer CL2.

[0051] Conductor pattern 22 is positioned near end face 2a. Conductor pattern 22 is not electrically connected to any other conductors. Conductor pattern 22 is a dummy pattern. Conductor pattern 23 is positioned near end face 2b. Conductor pattern 23 is not electrically connected to any other conductors. Conductor pattern 23 is a dummy pattern.

[0052] The conductor pattern 24 includes a first pattern section 24A, a second pattern section 24B, and a third pattern section 24C. The first pattern section 24A, the second pattern section 24B, and the third pattern section 24C are electrically connected and may be formed integrally. A via conductor 65 is connected to the first pattern section 24A. The via conductor 65 electrically connects the conductor pattern 24 to the conductor pattern 110 (described later) of the second conductor layer CL2. A via conductor 66 is connected to the third pattern section 24C. The via conductor 66 electrically connects the conductor pattern 24 to the conductor pattern 108 (described later) of the second conductor layer CL2.

[0053] A capacitor pattern 67 is provided on the second pattern section 24B via a dielectric film. A via conductor 68 is connected to the capacitor pattern 67. The via conductor 68 electrically connects the capacitor pattern 67 to the conductor pattern 112 of the second conductor layer CL2. A capacitor pattern 69 is provided on the third pattern section 24C via a dielectric film. A via conductor 70 is connected to the capacitor pattern 69. The via conductor 70 electrically connects the capacitor pattern 69 to the conductor pattern 113 of the second conductor layer CL2. A capacitor pattern 71 is provided on the third pattern section 24C via a dielectric film. A via conductor 72 is connected to the capacitor pattern 71. The via conductor 72 electrically connects the capacitor pattern 71 to the conductor pattern 112 of the second conductor layer CL2.

[0054] The conductor pattern 25 includes a first pattern section 25A, a second pattern section 25B, and a third pattern section 25C. The first pattern section 25A, the second pattern section 25B, and the third pattern section 25C are electrically connected and may be formed integrally. A via conductor 73 is connected to the first pattern section 25A. The via conductor 73 electrically connects the conductor pattern 25 to the conductor pattern 111 (described later) of the second conductor layer CL2. A via conductor 74 is connected to the third pattern section 25C. The via conductor 74 electrically connects the conductor pattern 25 to the conductor pattern 109 (described later) of the second conductor layer CL2.

[0055] A capacitor pattern 75 is provided on the second pattern section 25B via a dielectric film. A via conductor 76 is connected to the capacitor pattern 75. The via conductor 76 electrically connects the capacitor pattern 75 to the conductor pattern 112 of the second conductor layer CL2. A capacitor pattern 77 is provided on the third pattern section 25C via a dielectric film. A via conductor 78 is connected to the capacitor pattern 77. The via conductor 78 electrically connects the capacitor pattern 77 to the conductor pattern 114 of the second conductor layer CL2. A capacitor pattern 79 is provided on the third pattern section 25C via a dielectric film. A via conductor 80 is connected to the capacitor pattern 79. The via conductor 80 electrically connects the capacitor pattern 79 to the conductor pattern 112 of the second conductor layer CL2.

[0056] The conductor pattern 26 includes a first pattern section 26A, a second pattern section 26B, a third pattern section 26C, a fourth pattern section 26D, and a fifth pattern section 26E. The first pattern section 26A, the second pattern section 26B, the third pattern section 26C, the fourth pattern section 26D, and the fifth pattern section 26E are electrically connected and may be formed integrally.

[0057] Via conductors 81 and 82 are connected to the first pattern section 26A. Via conductors 81 and 82 electrically connect the conductor pattern 26 to the conductor pattern 112 (described later) of the second conductor layer CL2. Via conductors 83, 84 and 85 are connected to the third pattern section 26C. Via conductors 83, 84 and 85 electrically connect the conductor pattern 19 to the conductor pattern 112 (described later) of the second conductor layer CL2. A capacitor pattern 86 is provided on the fourth pattern section 26D via a dielectric film. Via conductors 87 and 88 are connected to the capacitor pattern 86. Via conductors 87 and 88 electrically connect the capacitor pattern 86 to the conductor pattern 112 (described later) of the second conductor layer CL2. A capacitor pattern 89 is provided on the fifth pattern section 26E via a dielectric film. Via conductors 90 and 91 are connected to the capacitor pattern 89. Via conductors 90 and 91 electrically connect the capacitor pattern 89 to the conductor pattern 112 (described later) of the second conductor layer CL2.

[0058] A via conductor 92 is connected to the conductor pattern 27. The via conductor 92 electrically connects the conductor pattern 27 to the conductor pattern 114 (described later) of the second conductor layer CL2. A capacitor pattern 93 is provided on the conductor pattern 27 via a dielectric film. A via conductor 94 is connected to the capacitor pattern 93. The via conductor 94 electrically connects the capacitor pattern 93 to the conductor pattern 113 (described later) of the second conductor layer CL2.

[0059] The shield pattern 28 is positioned between the conductors (patterns) constituting the first filter F1 and the conductors constituting the second filter F2. The shield pattern 28 is positioned to demarcate (separate) the region where the conductors constituting the first filter F1 are located and the region where the conductors constituting the second filter F2 are located.

[0060] The shield pattern 28 includes a first pattern section 28A, a second pattern section 28B, and a third pattern section 28C. The first pattern section 28A is located in the center. The first pattern section 28A has a rectangular shape. A via conductor 95 is connected to the first pattern section 28A. The via conductor 95 electrically connects the shield pattern 28 to the shield pattern 115 (described later) of the second conductor layer CL2.

[0061] The second pattern section 28B extends along the first direction D1. One end of the second pattern section 28B is connected to the first pattern section 28A. The other end of the second pattern section 28B is a free end (an end not connected to anything else). The third pattern section 28C extends along the first direction D1. One end of the third pattern section 28C is connected to the first pattern section 28A. The other end of the third pattern section 28C is a free end.

[0062] The other end of the second pattern section 28B (the end on the end face 2a side) is located above the end face 2a side of each of the multiple conductor patterns (first region A1) constituting the first filter F1 and the multiple conductor patterns (second region A2) constituting the second filter F2. The other end of the third pattern section 28C (the end on the end face 2b side) is located above the end face 2b side of each of the multiple conductor patterns (first region A1) constituting the first filter F1 and the multiple conductor patterns (second region A2) constituting the second filter F2.

[0063] As shown in Figure 4, the second conductor layer CL2 has conductor pattern 100, conductor pattern 101, conductor pattern 102, conductor pattern 103, conductor pattern 104, conductor pattern 105, conductor pattern 106, conductor pattern 107, conductor pattern 108, conductor pattern 109, conductor pattern 110, conductor pattern 111, conductor pattern 112, conductor pattern 113, conductor pattern 114, and shield pattern 115. Conductor patterns 100, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114, and shield pattern 115 can be formed from a suitable conductor (for example, copper). For the sake of explanation, via conductors are also shown in Figure 4.

[0064] Conductor pattern 100 is positioned near end face 2a and near side face 2e. A via conductor 116 is connected to conductor pattern 100. The via conductor 116 electrically connects conductor pattern 100 to conductor pattern 140 (described later) of the third conductor layer CL3. Conductor pattern 101 is positioned near end face 2b and near side face 2e. A via conductor 117 is connected to conductor pattern 101. The via conductor 117 electrically connects conductor pattern 101 to conductor pattern 141 (described later) of the third conductor layer CL3.

[0065] A via conductor 118 is connected to conductor pattern 102. The via conductor 118 electrically connects conductor pattern 102 to conductor pattern 142 (described later) of the third conductor layer CL3. A via conductor 119 is connected to conductor pattern 103. The via conductor 119 electrically connects conductor pattern 103 to conductor pattern 142 (described later) of the third conductor layer CL3.

[0066] The conductor pattern 104 includes a first pattern section 104A, a second pattern section 104B, a third pattern section 104C, a fourth pattern section 104D, and a fifth pattern section 104E. A via conductor 120 is connected to the second pattern section 104B. A via conductor 121 is connected to the third pattern section 104C. Via conductors 122, 123, 124, and 125 are connected to the fifth pattern section 104E. Via conductors 120, 121, 122, 123, 124, and 125 electrically connect the conductor pattern 104 to the conductor pattern 142 (described later) of the third conductor layer CL3.

[0067] Conductor patterns 105, 106, and 17 are positioned closer to the side surface 2e.

[0068] A via conductor 126 is connected to conductor pattern 108. The via conductor 126 electrically connects conductor pattern 108 to conductor pattern 143 (described later) of the third conductor layer CL3. A via conductor 127 is connected to conductor pattern 109. The via conductor 127 electrically connects conductor pattern 109 to conductor pattern 144 (described later) of the third conductor layer CL3.

[0069] A via conductor 128 is connected to conductor pattern 110. The via conductor 128 electrically connects conductor pattern 110 to conductor pattern 145 (described later) of the third conductor layer CL3. A via conductor 129 is connected to conductor pattern 111. The via conductor 129 electrically connects conductor pattern 111 to conductor pattern 145 (described later) of the third conductor layer CL3.

[0070] The conductor pattern 112 includes a first pattern section 112A, a second pattern section 112B, a third pattern section 112C, a fourth pattern section 112D, and a fifth pattern section 112E. A via conductor 130 is connected to the second pattern section 112B. A via conductor 131 is connected to the third pattern section 112C. Via conductors 132, 133, 134, and 135 are connected to the fifth pattern section 112E. Via conductors 130, 131, 132, 133, 134, and 135 electrically connect the conductor pattern 112 to the conductor pattern 145 (described later) of the third conductor layer CL3.

[0071] The shield pattern 115 is positioned between the conductors (patterns) constituting the first filter F1 and the conductors constituting the second filter F2. The shield pattern 115 is positioned to demarcate (separate) the region where the conductors constituting the first filter F1 are located and the region where the conductors constituting the second filter F2 are located.

[0072] The shield pattern 115 includes a first pattern section 115A, a second pattern section 115B, and a third pattern section 115C. The first pattern section 115A is located in the center. The first pattern section 115A has a rectangular shape. A via conductor 136 is connected to the first pattern section 115A. The via conductor 136 electrically connects the shield pattern 115 to the shield pattern 146 (described later) of the third conductor layer CL3.

[0073] The second pattern section 115B extends along the first direction D1. One end of the second pattern section 115B is connected to the first pattern section 115A. The other end of the second pattern section 115B is a free end (an end not connected to anything else). The third pattern section 115C extends along the first direction D1. One end of the third pattern section 115C is connected to the first pattern section 115A. The other end of the third pattern section 115C is a free end.

[0074] The other end of the second pattern section 115B (the end on the end face 2a side) is located above the end face 2a side of each of the multiple conductor patterns (first region A1) constituting the first filter F1 and the multiple conductor patterns (second region A2) constituting the second filter F2. The other end of the third pattern section 115C (the end on the end face 2b side) is located above the end face 2b side of each of the multiple conductor patterns (first region A1) constituting the first filter F1 and the multiple conductor patterns (second region A2) constituting the second filter F2.

[0075] The shield pattern 115 has the same shape (dimensions) as the shield pattern 28 of the first conductor layer CL1. The first pattern portion 115A is positioned to overlap with the first pattern portion 28A of the shield pattern 28 in the second direction D2. The second pattern portion 115B is positioned to overlap with the second pattern portion 28B of the shield pattern 28 in the second direction D2. The third pattern portion 115C is positioned to overlap with the third pattern portion 28C of the shield pattern 28 in the second direction D2.

[0076] As shown in Figure 5, the first conductor layer CL1 has conductor patterns 140, 141, 142, 143, 144, 145, and a shield pattern 146. Conductor patterns 140, 141, 142, 143, 144, 145, and the shield pattern 146 can be formed from a suitable conductor (for example, copper). For convenience of explanation, via conductors are also shown in Figure 5.

[0077] A via conductor 147 is connected to conductor pattern 140. Via conductor 147 electrically connects conductor pattern 140 to the first terminal electrode 3. A via conductor 148 is connected to conductor pattern 141. Via conductor 148 electrically connects conductor pattern 141 to the second terminal electrode 4. A via conductor 149 is connected to conductor pattern 142. Via conductor 149 electrically connects conductor pattern 142 to the third terminal electrode 5. A via conductor 150 is connected to conductor pattern 142. Via conductor 150 electrically connects conductor pattern 142 to the fourth terminal electrode 6.

[0078] A via conductor 151 is connected to conductor pattern 143. Via conductor 151 electrically connects conductor pattern 143 to the fifth terminal electrode 7. A via conductor 152 is connected to conductor pattern 144. Via conductor 152 electrically connects conductor pattern 144 to the sixth terminal electrode 8. A via conductor 153 is connected to conductor pattern 145. Via conductor 153 electrically connects conductor pattern 145 to the seventh terminal electrode 9. A via conductor 154 is connected to conductor pattern 145. Via conductor 154 electrically connects conductor pattern 145 to the eighth terminal electrode 10.

[0079] The shield pattern 146 is positioned between the conductors (patterns) constituting the first filter F1 and the conductors constituting the second filter F2. The shield pattern 146 is positioned to demarcate (separate) the region where the conductors constituting the first filter F1 are located and the region where the conductors constituting the second filter F2 are located.

[0080] The shield pattern 146 includes a first pattern section 146A, a second pattern section 146B, and a third pattern section 146C. The first pattern section 146A is located in the center. The first pattern section 146A has a rectangular shape. A via conductor 155 is connected to the first pattern section 146A. The via conductor 155 electrically connects the shield pattern 146 to the ninth terminal electrode 11.

[0081] The second pattern section 146B extends along the first direction D1. One end of the second pattern section 146B is connected to the first pattern section 146A. The other end of the second pattern section 146B is a free end (an end not connected to anything else). The third pattern section 146C extends along the first direction D1. One end of the third pattern section 146C is connected to the first pattern section 146A. The other end of the third pattern section 146C is a free end.

[0082] The other end of the second pattern section 146B (the end on the end face 2a side) is located above the end face 2a side of each of the multiple conductor patterns (first region A1) constituting the first filter F1 and the multiple conductor patterns (second region A2) constituting the second filter F2. The other end of the third pattern section 146C (the end on the end face 2b side) is located above the end face 2b side of each of the multiple conductor patterns (first region A1) constituting the first filter F1 and the multiple conductor patterns (second region A2) constituting the second filter F2.

[0083] The shield pattern 146 has the same shape (dimensions) as the shield pattern 115 of the second conductor layer CL2. The first pattern portion 146A is positioned to overlap with the first pattern portion 115A of the shield pattern 115 in the second direction D2. The second pattern portion 146B is positioned to overlap with the second pattern portion 115B of the shield pattern 115 in the second direction D2. The third pattern portion 146C is positioned to overlap with the third pattern portion 115C of the shield pattern 115 in the second direction D2.

[0084] As shown in Figure 5, the fourth conductor layer CL4 has a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, a fourth terminal electrode 6, a fifth terminal electrode 7, a sixth terminal electrode 8, a seventh terminal electrode 9, an eighth terminal electrode 10, and a ninth terminal electrode 11.

[0085] Next, the patterns constituting each part of the electronic component 1 shown in Figure 1 will be described. Inductor L1 is composed of conductor pattern 100 and conductor pattern 140. Inductor L2 is composed of conductor pattern 19, conductor pattern 104 and conductor pattern 142. Inductor L3 is composed of conductor pattern 19, conductor pattern 104 and conductor pattern 142. Inductor L4 is composed of conductor pattern 101 and conductor pattern 141.

[0086] Inductor L5 is composed of conductor patterns 17, 102, and 142. Inductor L6 is composed of conductor patterns 19, 104, and 142. Inductor L7 is composed of conductor patterns 18, 103, and 142.

[0087] Capacitor C1 is composed of conductor pattern 17 and capacitor pattern 34. Capacitor C2 is composed of conductor pattern 20 and capacitor pattern 57. Capacitor C3 is composed of conductor pattern 20 and capacitor pattern 58. Capacitor C4 is composed of conductor pattern 21 and capacitor pattern 61. Capacitor C5 is composed of conductor pattern 21 and capacitor pattern 62. Capacitor C6 is composed of conductor pattern 18 and capacitor pattern 42.

[0088] Capacitor C7 is composed of conductor pattern 17 and capacitor pattern 36. Capacitor C8 is composed of conductor pattern 18 and capacitor pattern 44. Capacitor C9 is composed of conductor pattern 17 and capacitor pattern 32. Capacitor C10 is composed of conductor pattern 19 and capacitor pattern 51. Capacitor C11 is composed of conductor pattern 19 and capacitor pattern 54. Capacitor C12 is composed of conductor pattern 18 and capacitor pattern 40.

[0089] Inductor L10 is composed of conductor pattern 108 and conductor pattern 143. Inductor L11 is composed of conductor pattern 26 and conductor pattern 112. Inductor L12 is composed of conductor pattern 26 and conductor pattern 112. Inductor L13 is composed of conductor pattern 109 and conductor pattern 144.

[0090] Inductor L14 is composed of conductor patterns 17, 110, and 145. Inductor L15 is composed of conductor patterns 26, 112, and 145. Inductor L16 is composed of conductor patterns 25, 111, and 145.

[0091] Capacitor C13 is composed of conductor pattern 24 and capacitor pattern 69. Capacitor C14 is composed of conductor pattern 27 and capacitor pattern C93. Capacitor C15 is composed of conductor pattern 25 and capacitor pattern 77. Capacitor C16 is composed of conductor pattern 24 and capacitor pattern 71. Capacitor C17 is composed of conductor pattern 25 and capacitor pattern 79.

[0092] Capacitor C18 is composed of conductor pattern 24 and capacitor pattern 67. Capacitor C19 is composed of conductor pattern 26 and capacitor pattern 86. Capacitor C20 is composed of conductor pattern 26 and capacitor pattern 89. Capacitor C21 is composed of conductor pattern 25 and capacitor pattern 75.

[0093] Shield S is composed of shield pattern 28, shield pattern 115, and shield pattern 146.

[0094] Figure 7 shows the conductive pattern of the electronic component 1 shown in Figure 1. In Figure 7, the conductive patterns are shown superimposed. As shown in Figure 7, the shield S (shield pattern 28, shield pattern 115, and shield pattern 146) is positioned between the first filter F1 and the second filter F2. The pattern constituting the first filter F1 (first pattern) is positioned in the first region A1 on the side 2e side of the base body 2. The pattern constituting the second filter F2 (second pattern) is positioned in the second region A2 on the side 2f side of the base body 2. The shield S is positioned between the first filter F1 and the second filter F2 in the direction in which the first filter F1 and the second filter F2 are aligned (third direction D3), and extends in a direction perpendicular to that direction (first direction D1).

[0095] Capacitors C13, C14, and C15 of the second filter F2 are located in a region closer to the shield S than capacitors C1, C2, C3, C4, C5, and C6 of the first filter F1.

[0096] As shown in Figure 6, the third terminal electrode 5 (ground Gnd11) and the fifth terminal electrode 7 (port P21) are positioned opposite each other in the third direction D3, with the shield S in between. The fourth terminal electrode 6 (ground Gnd12) and the sixth terminal electrode 8 (port P22) are positioned opposite each other in the third direction D3, with the shield S in between.

[0097] As described above, the electronic component 1 according to this embodiment is equipped with a shield S composed of a shield pattern 28, a shield pattern 115, and a shield pattern 146. The shield patterns 28, 115, and 146 are arranged within the base body 2 between the pattern constituting the first filter F1 and the pattern constituting the second filter F2. In this configuration, the third terminal electrode 5 and the fourth terminal electrode 6, the seventh terminal electrode 9 and the eighth terminal electrode 10, and the ninth terminal electrode 11 are electrically insulated from each other. In this way, because the third terminal electrode 5 and the fourth terminal electrode 6, the seventh terminal electrode 9 and the eighth terminal electrode 10, and the ninth terminal electrode 11 are electrically insulated from each other in the electronic component 1, the attenuation can be improved in the attenuation frequency characteristics.

[0098] Furthermore, in electronic component 1, the isolation between the first filter F1 and the second filter F2 can be improved by the shield S connected to the ninth terminal electrode 11, which is electrically insulated from the third terminal electrode 5 and the fourth terminal electrode 6, as well as the seventh terminal electrode 9 and the eighth terminal electrode 10. As described above, in electronic component 1, in a configuration in which two first filters F1 and second filters F2 are included in a single body 2, the isolation between the first filter F1 and the second filter F2 can be improved while improving the characteristics of the first filter F1 and the second filter F2.

[0099] Figures 8(a) and 8(b) show the simulation results of the relationship between frequency band and isolation for electronic component 1 and the comparative example. In Figures 8(a) and 8(b), the horizontal axis represents frequency band [MHz] and the vertical axis represents isolation [dB]. In Figures 8(a) and 8(b), the solid line shows the results for electronic component 1, and the dashed line shows the results for the comparative example. The comparative example is an electronic component that does not have the shield S found in electronic component 1. Figure 8(a) shows the results for the S31 parameter. Figure 8(b) shows the results for the S32 parameter. As shown in Figures 8(a) and 8(b), it was confirmed that electronic component 1 with shield S achieves higher isolation than electronic component without shield S.

[0100] In the electronic component 1 according to this embodiment, the ninth terminal electrode 11 is positioned in the center of the main surface 2c of the base body 2. With this configuration, the ninth terminal electrode 11 can be efficiently positioned on the main surface 2d in relation to the first terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, sixth terminal electrode 8, seventh terminal electrode 9, and eighth terminal electrode 10.

[0101] In the electronic component 1 according to this embodiment, the ends of the shield patterns 28, 115, and 146 in the extending direction are located above the ends of the first region A1 and the second region A2 in the first direction D1, as viewed from the second direction D2. This configuration allows for better isolation between the first filter F1 and the second filter F2.

[0102] In the electronic component 1 according to this embodiment, the third terminal electrode 5 (ground Gnd11) and the fifth terminal electrode 7 (port P21) are positioned opposite each other at positions that straddle the shield patterns 28, 115, and 146 when viewed from the second direction D2. The fourth terminal electrode 6 (ground Gnd12) and the sixth terminal electrode 8 (port P22) are positioned opposite each other at positions that straddle the shield patterns 28, 115, and 146 when viewed from the second direction D2. This configuration makes it possible to suppress signal interference between the first filter F1 and the second filter F2.

[0103] In the electronic component 1 according to this embodiment, the first conductor layer CL1 is provided with a conductor pattern 15. The conductor pattern 15 is positioned to overlap with the first terminal electrode 3 in the second direction D2. The conductor pattern 15 is not electrically connected to the first terminal electrode 3 or other patterns. The conductor pattern 15 is a dummy pattern that does not constitute the first filter F1. If the conductor pattern 15 is not provided, the conductor pattern 100 of the second conductor layer CL2, the conductor pattern 140 of the third conductor layer CL3, and the first terminal electrode 3 may be misaligned (recessed) in the second direction D2. By providing the conductor pattern 15, it is possible to suppress the misalignment of the conductor pattern 100 of the second conductor layer CL2, the conductor pattern 140 of the third conductor layer CL3, and the first terminal electrode 3 in the second direction D2. Similar effects can be obtained for conductor patterns 16, 22, and 23.

[0104] While embodiments of the present invention have been described above, the present invention is not necessarily limited to the embodiments described above, and various modifications are possible without departing from the spirit of the invention.

[0105] In the above embodiment, a configuration in which the shield pattern 28, shield pattern 115, and shield pattern 146 extend linearly along the first direction D1 was described as an example. However, the shield pattern 28, shield pattern 115, and shield pattern 146 may be at an angle with respect to the first direction D1. Furthermore, the shield pattern 28, shield pattern 115, and shield pattern 146 do not have to be linear.

[0106] In the above embodiment, one example described is a configuration in which the first pattern portion 28A of the shield pattern 28, the first pattern portion 115A of the shield pattern 115, and the first pattern portion 146A of the shield pattern 146 are electrically connected by via conductors 95 and 136, and the first pattern portion 146A of the shield pattern 146 is electrically connected to the ninth terminal electrode 11 by via conductor 155. However, the method of connecting the shield patterns is not limited to this.

[0107] Figure 9 shows a conductor pattern provided in an electronic component according to another embodiment. As shown in Figure 9, in electronic component 1A, the shield pattern 28 and shield pattern 115, and the shield pattern 115 and shield pattern 146 may be electrically connected by via conductors 156 and 157. Via conductor 156 is located at the end face 2a side of shield pattern 28, shield pattern 115, and shield pattern 146. Via conductor 157 is located at the end face 2b side of shield pattern 28, shield pattern 115, and shield pattern 146. In this configuration as well, the third terminal electrode 5 and the fourth terminal electrode 6, the seventh terminal electrode 9 and the eighth terminal electrode 10, and the ninth terminal electrode 11 are electrically insulated from each other. As a result, in electronic component 1A, the third terminal electrode 5 and the fourth terminal electrode 6, the seventh terminal electrode 9 and the eighth terminal electrode 10, and the ninth terminal electrode 11 are electrically insulated from each other, which improves the attenuation in the attenuation frequency characteristics. Furthermore, in electronic component 1A, the shield S improves the isolation between the first filter F1 and the second filter F2.

[0108] Figure 10 shows a conductor pattern provided in an electronic component according to another embodiment. As shown in Figure 10, in electronic component 1B, the shield pattern 28 and shield pattern 115, and the shield pattern 115 and shield pattern 146 may be electrically connected by via conductors 158 and 159. Via conductor 158 extends along the extending direction of shield pattern 28, shield pattern 115, and shield pattern 146. Via conductor 159 extends along the extending direction of shield pattern 28, shield pattern 115, and shield pattern 146. In this configuration as well, the third terminal electrode 5 and the fourth terminal electrode 6, the seventh terminal electrode 9 and the eighth terminal electrode 10, and the ninth terminal electrode 11 are electrically insulated from each other. As a result, in electronic component 1B, the third terminal electrode 5 and the fourth terminal electrode 6, the seventh terminal electrode 9 and the eighth terminal electrode 10, and the ninth terminal electrode 11 are electrically insulated from each other, which improves the attenuation in the attenuation frequency characteristics. Furthermore, in electronic component 1B, the shield S improves the isolation between the first filter F1 and the second filter F2.

[0109] Figures 11(a) and 11(b) show the simulation results of the relationship between frequency band and isolation for electronic component 1 and electronic component 1B. In Figures 11(a) and 11(b), the horizontal axis represents frequency band [MHz] and the vertical axis represents isolation [dB]. In Figures 11(a) and 11(b), the solid line shows the results for electronic component 1, and the dashed line shows the results for the comparative example of electronic component 1B. Figure 11(a) shows the results for the S31 parameter. Figure 11(b) shows the results for the S32 parameter. As shown in Figures 11(a) and 11(b), it was confirmed that electronic component 1B, like electronic component 1, can achieve high isolation.

[0110] In the above embodiment, a configuration in which the ninth terminal electrode 11, which is the third grounding terminal, is located in the center of the main surface 2d was described as an example. However, as shown in Figure 12, in the electronic component 1C, the terminal electrodes 11A and 11B, which are the third grounding terminals, may be located at both ends of the shield pattern 160. In this configuration as well, the third terminal electrode 5 and the fourth terminal electrode 6, the seventh terminal electrode 9 and the eighth terminal electrode 10, and the terminal electrodes 11A and 11B are electrically insulated from each other. As a result, in the electronic component 1C, the third terminal electrode 5 and the fourth terminal electrode 6, the seventh terminal electrode 9 and the eighth terminal electrode 10, and the terminal electrodes 11A and 11B are electrically insulated from each other, so that the attenuation can be improved in the attenuation frequency characteristics. Furthermore, in the electronic component 1C, the shield S can improve the isolation between the first filter F1 and the second filter F2. [Explanation of symbols]

[0111] 1, 1A, 1B, 1C... Electronic components, 2... Base body, 5... Third terminal electrode (first ground terminal), 6... Fourth terminal electrode (first ground terminal), 9... Seventh terminal electrode (second ground terminal), 10... Eighth terminal electrode (second ground terminal), 11... Ninth terminal electrode (third ground terminal), 11A, 11B... Terminal electrode (third ground terminal), 28, 115, 146, 160... Shield pattern, A1... First region, A2... Second region, F1... First filter (first circuit), F2... Second filter (second circuit), S... Shield.

Claims

1. A base body formed by stacking multiple dielectric layers, A plurality of terminal electrodes arranged on the outer surface of the aforementioned body, A plurality of first patterns, which are arranged within the element and constitute a first circuit that processes signals of frequencies within a first frequency band, Multiple second patterns, which are arranged within the element and constitute a second circuit that processes signals with frequencies within the second frequency band, The substrate comprises a shield pattern which constitutes a shield disposed between the first pattern and the second pattern, The multiple terminal electrodes include a first ground terminal electrically connected to the first circuit, a second ground terminal electrically connected to the second circuit, and a third ground terminal electrically connected to the shield. An electronic component in which the first grounding terminal, the second grounding terminal, and the third grounding terminal are electrically insulated from each other.

2. The first circuit has a first capacitor which is configured to include a first capacitor pattern among a plurality of first patterns, The second circuit has a second capacitor which is configured to include a second capacitor pattern among a plurality of the second patterns, The electronic component according to claim 1, wherein the second capacitor pattern is located in a region closer to the shield pattern than the first capacitor pattern.

3. The electronic component according to claim 1 or 2, wherein the third grounding terminal is located in the center of the outer surface of the base body when viewed from the stacking direction of the plurality of dielectric layers.

4. The electronic component according to claim 3, wherein the shield pattern extends in an intersecting direction that intersects the direction in which the first region where a plurality of the first patterns are arranged and the second region where a plurality of the second patterns are arranged are aligned, when viewed from the stacking direction.

5. The electronic component according to claim 4, wherein the end of the shield pattern in the extending direction extends beyond the end in the intersecting direction of the first region and the second region, as viewed from the stacking direction.

6. The plurality of terminal electrodes include input / output terminals to which the signal is input and output in the second circuit. The electronic component according to claim 1 or 2, wherein the first grounding terminal and the input / output terminal are arranged opposite each other at a position with the shielding pattern in between, when viewed from the stacking direction of the plurality of dielectric layers.

7. The electronic component according to claim 6, further comprising a dummy pattern that is positioned in the stacking direction to overlap with the first ground terminal, the second ground terminal, or the input / output terminal, and is not electrically connected to the first ground terminal, the second ground terminal, or the input / output terminal.

8. The shield pattern is arranged in multiple locations in the stacking direction of the multiple dielectric layers. The electronic component according to claim 1 or 2, wherein the plurality of shield patterns are arranged in a position that overlaps with the third ground terminal in the stacking direction and are electrically connected to the third ground terminal by a plurality of conductors stacked in the stacking direction.

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