Multilayer ceramic capacitor

Abstract

We provide multilayer ceramic capacitors that reduce acoustic noise. [Solution] The multilayer ceramic capacitor includes a body comprising a plurality of dielectric layers 140 and a plurality of internal electrodes 150, 160, a first cover layer 153 positioned on the outermost side in a first direction, and a second cover layer 145 positioned on the opposite side of the first cover layer in the T direction and having an average thickness greater than the average thickness of the first cover layer; and external electrodes 200, 300 positioned outside the body and connected to the plurality of internal electrodes, comprising connection portions 211, 311 connected to the internal electrodes, a first band portion 212 connected to the connection portion and covering a part of the first surface S1, a second band portion 213 connected to the connection portion and covering a part of the second surface S2, a first conductive resin layer 220 positioned on the first band portion, a second conductive resin layer 230 positioned on the second band portion, and a first plating layer 280 connected to the connection portion and covering the first conductive resin layer and the second conductive resin layer.

Description

[Technical Field]

[0001] This disclosure relates to multilayer ceramic capacitors. [Background technology]

[0002] Electronic components that use ceramic materials include capacitors, inductors, piezoelectric elements, varistors, and thermistors. Among these ceramic electronic components, multilayer ceramic capacitors (MLCCs) can be used in a variety of electronic devices due to their advantages such as small size, guaranteed high capacitance, and ease of mounting.

[0003] The body of a multilayer ceramic capacitor includes multiple dielectric layers and multiple internal electrodes positioned between them. Because the dielectric layers are piezoelectric, when a DC or AC voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon occurs between the internal electrodes, generating periodic vibrations while expanding and contracting the volume of the body depending on the frequency.

[0004] Such vibrations are transmitted to the substrate via the external electrodes and the solder connecting the external electrodes to the substrate, causing the substrate to generate vibration noise. This vibration noise falls within the audible frequency range of 20 Hz to 20,000 Hz, which is unpleasant to humans, and is called acoustic noise.

[0005] External electrodes may include an electrode layer and a conductive resin layer covering it, but there is a need for technology that can reduce acoustic noise even with such a structure. [Overview of the project] [Problems that the invention aims to solve]

[0006] One embodiment aims to provide a multilayer ceramic capacitor that can reduce acoustic noise.

[0007] However, the problems that the embodiments of the present invention aim to solve are not limited to those described above, and can be extended in various ways within the scope of the technical ideas included in the present invention. [Means for solving the problem]

[0008] A multilayer ceramic capacitor according to one embodiment includes a body having a first surface and a second surface arranged opposite to each other in a first direction, and including a plurality of dielectric layers and a plurality of internal electrodes, a first cover layer arranged on the outermost side in the first direction, and a second cover layer arranged on the opposite side of the first cover layer in the first direction and having an average thickness greater than the average thickness of the first cover layer; and an external electrode arranged outside the body and connected to the plurality of internal electrodes, wherein the external electrode includes a connection portion connected to the plurality of internal electrodes in a second direction intersecting the first direction, a first band portion connected to the connection portion and covering a part of the first surface, a second band portion connected to the connection portion and covering a part of the second surface, a first conductive resin layer arranged on the first band portion, a second conductive resin layer arranged on the second band portion, and a plating layer connected to the connection portion and covering the first conductive resin layer and the second conductive resin layer.

[0009] The body may further include an insulating resin layer covering a portion of the second surface.

[0010] The insulating resin layer can cover a portion of the second band portion, and the second conductive resin layer can cover a portion of the insulating resin layer.

[0011] The insulating resin layer may include epoxy, urethane, silicon dioxide (SiO2), or titanium dioxide (TiO).

[0012] The plurality of dielectric layers and the plurality of internal electrodes can be stacked in the first direction.

[0013] The plurality of dielectric layers and the plurality of internal electrodes can be stacked in a third direction that intersects simultaneously with the first and second directions.

[0014] The first conductive resin layer and the second conductive resin layer may each include a metal and a resin.

[0015] A multilayer ceramic capacitor according to one embodiment includes a body having a first surface and a second surface arranged opposite to each other in a first direction, and including a plurality of dielectric layers and a plurality of internal electrodes; an external electrode disposed outside the body and connected to the plurality of internal electrodes; and an interposer connected to the external electrode on the second surface side of the body, wherein the external electrode may include a connection portion connected to the plurality of internal electrodes in a second direction intersecting the first direction; a first band portion connected to the connection portion and covering a part of the first surface; a second band portion connected to the connection portion and covering a part of the second surface; a first conductive resin layer disposed on the first band portion; a second conductive resin layer disposed on the second band portion; and a plating layer connected to the connection portion and covering the first conductive resin layer and the second conductive resin layer.

[0016] The interposer may include an interposer body and a connecting electrode located outside the interposer body and connected to the external electrode.

[0017] The interposer body may include an insulator.

[0018] The interposer body includes a first main surface facing the second surface of the body, and a second main surface positioned opposite the first main surface in the first direction, and the connecting electrode may include a junction positioned on the first main surface.

[0019] The connecting electrode may include a mounting portion disposed on the second main surface.

[0020] The connection electrode can include a connecting portion that connects the bonding portion and the mounting portion.

[0021] The multilayer ceramic capacitor can further include an insulating resin layer that covers a part of the second surface of the body.

[0022] The insulating resin layer can be separated from the interposer.

[0023] The insulating resin layer can include epoxy, urethane, silicon oxide (SiO2), or titanium oxide (TiO).

[0024] The plurality of dielectric layers and the plurality of internal electrodes can be laminated in the first direction.

[0025] The plurality of dielectric layers and the plurality of internal electrodes can be laminated in a third direction that intersects the first direction and the second direction simultaneously.

[0026] A multilayer ceramic capacitor according to an embodiment has a first surface and a second surface that are arranged on opposite sides in the first direction, and includes a body including a plurality of dielectric layers and a plurality of internal electrodes, an external electrode disposed outside the body and connected to the plurality of internal electrodes, and a bump electrode connected to the external electrode on the second surface side of the body. The external electrode includes a connection portion connected to the plurality of internal electrodes in a second direction intersecting the first direction, a first band portion connected to the connection portion and covering a part of the first surface, a second band portion connected to the connection portion and covering a part of the second surface, a first conductive resin layer disposed on the first band portion, a second conductive resin layer disposed on the second band portion, and a plating layer connected to the connection portion and covering the first conductive resin layer and the second conductive resin layer.

[0027] The body includes a third and a fourth surface arranged opposite to each other in the second direction, the external electrode includes a first external electrode connected to the plurality of internal electrodes at the third surface and a second external electrode connected to the plurality of internal electrodes from the fourth surface, and the bump electrode may include a first bump electrode connected to the first external electrode and a second bump electrode connected to the second external electrode at a distance from the first bump electrode in the second direction.

[0028] The bump electrode may include a bump body and a conductive layer disposed on the surface of the bump body and connected to the external electrode.

[0029] The bump body may include metal or an insulator.

[0030] The multilayer ceramic capacitor may further include an insulating resin layer that covers a portion of the second surface of the body.

[0031] The plurality of dielectric layers and the plurality of internal electrodes can be stacked in the first direction.

[0032] The plurality of dielectric layers and the plurality of internal electrodes can be stacked in a third direction that intersects simultaneously with the first and second directions. [Effects of the Invention]

[0033] According to the multilayer ceramic capacitor of this embodiment, acoustic noise can be reduced. [Brief explanation of the drawing]

[0034] [Figure 1] This is a schematic perspective view showing a multilayer ceramic capacitor according to one embodiment. [Figure 2] Figure 1 is a schematic, separated perspective view showing the layered structure of the internal electrodes of the multilayer ceramic capacitor. [Figure 3]Figure 1 is a schematic plan view showing the first internal electrode of the multilayer ceramic capacitor. [Figure 4] Figure 1 is a schematic plan view showing the second internal electrode of the multilayer ceramic capacitor. [Figure 5] This is a cross-sectional view along the line I-I' in Figure 1. [Figure 6] This is a cross-sectional view along the line II-II' in Figure 1. [Figure 7] This is a cross-sectional view along the line III-III' in Figure 1. [Figure 8] Figure 1 is a schematic cross-sectional view showing the multilayer ceramic capacitor mounted on a circuit board. [Figure 9] This is a perspective view illustrating a modified example of Figure 1. [Figure 10] This is a schematic cross-sectional view of Figure 9. [Figure 11] This is a schematic perspective view showing a multilayer ceramic capacitor according to another embodiment. [Figure 12] This is a cross-sectional view along the line IV-IV' in Figure 11. [Figure 13] Figure 11 is a schematic cross-sectional view showing the multilayer ceramic capacitor mounted on a circuit board. [Figure 14] This is a perspective view illustrating a modified example of Figure 13. [Figure 15] This is a schematic cross-sectional view of Figure 14. [Figure 16] This is a schematic perspective view showing a multilayer ceramic capacitor according to another embodiment. [Figure 17] This is a cross-sectional view along the line V-V' in Figure 16. [Figure 18] This is a bottom view of Figure 16. [Figure 19] Figure 16 is a schematic cross-sectional view showing the multilayer ceramic capacitor mounted on a circuit board. [Figure 20] This is a bottom view schematicly showing a modified example of Figure 16. [Figure 21] This is a perspective view illustrating a modified example of Figure 16. [Figure 22]This is a schematic cross-sectional view of Figure 21. [Figure 23] This is a schematic perspective view showing a multilayer ceramic capacitor according to another embodiment. [Figure 24] This is a cross-sectional view along the line VI-VI' in Figure 23. [Figure 25] This is a perspective view illustrating a modified example of Figure 23. [Figure 26] This is a perspective view illustrating a modified example of Figure 23. [Figure 27] This is a schematic cross-sectional view of Figure 26. [Figure 28] This is a schematic cross-sectional view showing a multilayer ceramic capacitor according to another embodiment. [Figure 29] This is a schematic cross-sectional view showing a modified example of Figure 28. [Figure 30] This is a schematic cross-sectional view showing a modified example of Figure 28. [Figure 31] This is a schematic cross-sectional view showing a multilayer ceramic capacitor according to another embodiment. [Figure 32] This is a schematic cross-sectional view showing a modified example of Figure 31. [Modes for carrying out the invention]

[0035] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that those with ordinary skill in the art to which the present invention pertains can easily implement it. In order to clearly illustrate the present invention in the drawings, parts not relevant to the description have been omitted, and the same or similar components are denoted by the same reference numerals throughout the specification. In addition, some components in the accompanying drawings are exaggerated, omitted, or shown schematically, and the sizes of each component do not fully reflect their actual sizes.

[0036] The accompanying drawings are provided to facilitate understanding of the embodiments disclosed herein and should not be understood as limiting the technical ideas disclosed herein, but rather as including all modifications, equivalents, or substitutions that fall within the concept and scope of the present invention.

[0037] Terms including ordinal numbers, such as "first," "second," etc., can be used to describe various components, but the components are not limited by such terms. These terms are used solely for the purpose of distinguishing one component from another.

[0038] Furthermore, when a layer, membrane, region, plate, or other part is said to be "on top of" or "above" another part, it includes not only cases where it is "directly above" the other part, but also cases where there is another part in between. Conversely, when one part is said to be "directly above" another part, it means that there is no other part in the middle. Also, when a part is said to be "on top of" or "above" a reference part, it means that it is located above or below the reference part, and does not necessarily mean that it is located "above" or "above" in the opposite direction of gravity.

[0039] Throughout the specification, terms such as “includes” or “has” should be understood to indicate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and not to preemptively exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Therefore, when a part says that a component “includes,” this means, unless otherwise stated, that it may include other components rather than excluding them.

[0040] Furthermore, throughout the specification, "on a plane" means when the subject is viewed from above, and "on a cross-section" means when the subject is viewed from the side of a cross-section cut perpendicularly into it.

[0041] Furthermore, throughout this specification, "connected" does not only mean that two or more components are directly connected, but can also mean that two or more components are indirectly connected through other components, that they are not only physically connected but also electrically connected, or that they are a single unit but are called by different names depending on their location or function.

[0042] Figure 1 is a schematic perspective view showing a multilayer ceramic capacitor according to one embodiment.

[0043] Referring to Figure 1, the multilayer ceramic capacitor 1000 according to this embodiment includes a body 110, a first external electrode 200, and a second external electrode 300.

[0044] First, to clearly explain this embodiment, the directions are defined as follows: the T-axis, L-axis, and W-axis shown in the drawing represent the first, second, and third directions of the multilayer ceramic capacitor 1000, respectively.

[0045] The first direction (T-axis direction) may be perpendicular to the broad surface (main surface) of the sheet-shaped component. For example, the first direction (T-axis direction) can be used in the same way as the direction in which the dielectric layer 140 is stacked. Hereafter, the first direction will be referred to as the "thickness direction" when necessary.

[0046] The second direction (L-axis direction) is a direction parallel to the broad surface (main surface) of the sheet-shaped component and may intersect (or be perpendicular to) the thickness direction (T-axis direction). For example, the second direction (L-axis direction) may be the direction in which the first external electrode 200 and the second external electrode 300 face each other. Hereafter, the second direction will be referred to as the "length direction" when necessary.

[0047] The third direction (W-axis direction) is a direction parallel to the wide surface (main surface) of the sheet-shaped component, and may intersect (or be perpendicular to) the first direction (T-axis direction) and the second direction (L-axis direction) simultaneously. Hereafter, the third direction will be referred to as the "width direction" when necessary.

[0048] The body 110 can be constructed in a substantially hexahedral shape, but this embodiment is not limited to this. Due to shrinkage during sintering, the body 110 may not be a perfect hexahedron, but may have a substantially hexahedral shape. For example, the body 110 may be a substantially orthogonal hexahedron, but may have rounded corners and vertices.

[0049] In this embodiment, for the sake of explanation, we define the surfaces of the body 110 that face each other in the thickness direction (T-axis direction) as the first surface (S1) and the second surface (S2), the surfaces that face each other in the length direction (L-axis direction) of the body 110 and connect the first surface (S1) and the second surface (S2) as the third surface (S3) and the fourth surface (S4), and the surfaces that face each other in the width direction (W-axis direction) of the body 110 and connect the first surface (S1) and the second surface (S2) as the fifth surface (S5) and the sixth surface (S6).

[0050] The length of body 110 can be defined as the maximum length among multiple line segments parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of body 110 that are opposite each other in the length direction (L-axis direction) as seen in the aforementioned cross-sectional photograph of body 110 in the width direction (W-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-section in the length direction (L-axis direction) of body 110. Alternatively, the length of body 110 can be defined as the minimum length among multiple line segments parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of body 110 that are opposite each other in the length direction (L-axis direction) as seen in the aforementioned cross-sectional photograph. Or, the length of body 110 can be defined as the arithmetic mean of the lengths of at least two line segments parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of body 110 that are opposite each other in the length direction (L-axis direction) as seen in the aforementioned cross-sectional photograph.

[0051] The thickness of body 110 can be defined as the maximum length of a plurality of line segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of body 110 in the length direction (L-axis direction) - thickness direction (T-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-sectional photograph of body 110 in the width direction (W-axis direction). Alternatively, the thickness of body 110 can be defined as the minimum length of a plurality of line segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of body 110 in the thickness direction (T-axis direction). Or, the thickness of body 110 can be defined as the arithmetic mean of the lengths of at least two line segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of body 110 in the thickness direction (T-axis direction).

[0052] The width of body 110 can be defined as the maximum length of a plurality of line segments parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines facing each other in the width direction (W-axis direction) of body 110 as seen in the aforementioned cross-sectional photograph of the length direction (L-axis direction) - width direction (W-axis direction) at the center of body 110 in the thickness direction (T-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph. Alternatively, the width of body 110 can be defined as the minimum length of a plurality of line segments parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines facing each other in the width direction (W-axis direction) of body 110 as seen in the aforementioned cross-sectional photograph. Or, the width of body 110 can be defined as the arithmetic mean of the lengths of at least two line segments parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines facing each other in the width direction (W-axis direction) of body 110 as seen in the aforementioned cross-sectional photograph.

[0053] Figure 2 is a schematic separated perspective view showing the laminated structure of the internal electrodes of the multilayer ceramic capacitor shown in Figure 1. Figure 3 is a schematic plan view showing the first internal electrode of the multilayer ceramic capacitor shown in Figure 1. Figure 4 is a schematic plan view showing the second internal electrode of the multilayer ceramic capacitor shown in Figure 1. Figure 5 is a cross-sectional view along the line I-I' in Figure 1. Figure 6 is a cross-sectional view along the line II-II' in Figure 1. Figure 7 is a cross-sectional view along the line III-III' in Figure 1. Figure 8 is a schematic cross-sectional view showing the multilayer ceramic capacitor shown in Figure 1 mounted on a circuit board.

[0054] Referring to Figures 2, 3, 4, 5, 6, 7, and 8, the body 110 may include multiple dielectric layers 140, a first cover layer 143, a second cover layer 145, a first internal electrode 150, and a second internal electrode 160.

[0055] The plurality of dielectric layers 140 are stacked in the thickness direction (T-axis direction) of the body 110. The boundaries between the dielectric layers 140 may be unclear. For example, the boundaries between the dielectric layers 140 are difficult to confirm without using a scanning electron microscope (SEM), and the plurality of dielectric layers 140 may appear to be an integral structure.

[0056] The dielectric layer 140 can include a ceramic material. For example, the ceramic material can include a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Further, these components can further include auxiliary components such as manganese (Mn) compounds, iron (Fe) compounds, chromium (Cr) compounds, cobalt (Co) compounds, nickel (Ni) compounds, etc. For example, the dielectric layer is (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1), 0 < y < 1 or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc., but the present invention is not limited thereto.

[0057] The dielectric layer 140 can further include one or more of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant. The ceramic additive may be, for example, a transition metal oxide or carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like.

[0058] The first internal electrode 150 and the second internal electrode 160 can be alternately stacked with a dielectric layer 140 in between. Such a stacked structure can be repeated within the body 110, and the internal electrode closest to the first surface (S1) of the body 110 can be the first internal electrode 150 or the second internal electrode 160, and the internal electrode closest to the second surface (S2) can be the first internal electrode 150 or the second internal electrode 160.

[0059] The first internal electrode 150 and the second internal electrode 160 have different polarities and can be electrically insulated from each other by the dielectric layer 140 placed between them.

[0060] The first internal electrode 150 and the second internal electrode 160 can be arranged so as to be offset from each other in the longitudinal direction (L-axis direction) with respect to the dielectric layer 140. One end of the first internal electrode 150 can be exposed through the third surface (S3) of the body 110, and one end of the second internal electrode 160 can be exposed through the fourth surface (S4) of the body 110. The end of the first internal electrode 150 exposed from the third surface (S3) of the body 110 can be connected to the first external electrode 200. The end of the second internal electrode 160 exposed from the fourth surface (S4) of the body 110 can be connected to the second external electrode 300.

[0061] The first internal electrode 150 and the second internal electrode 160 can be formed by printing a conductive paste containing a metal onto the surface of the dielectric layer 140. For example, the internal electrodes can be formed by printing a conductive paste containing nickel (Ni) or a nickel (Ni) alloy onto the surface of the dielectric layer using screen printing or gravure printing. However, this embodiment is not limited to this.

[0062] When a voltage is applied to the first external electrode 200 and the second external electrode 300, charge accumulates between the first internal electrode 150 and the second internal electrode 160. That is, capacitance can be obtained between the first internal electrode 150, which is electrically connected to the first external electrode 200, and the second internal electrode 160, which is electrically connected to the second external electrode 300. The capacitance of the multilayer ceramic capacitor 1000 is proportional to the overlapping area of ​​the first internal electrode 150 and the second internal electrode 160, which overlap each other along the thickness direction (T-axis direction).

[0063] In other words, the multilayer ceramic capacitor 1000 may include an active region (AR) and a margin region (MR).

[0064] The active region (AR) can be defined as the region where the first internal electrode 150 and the second internal electrode 160 overlap along the thickness direction (T-axis direction).

[0065] The margin region (MR) is a region that includes the same dielectric layer 140 as the rest of the body 110, but where the internal electrodes 150 and 160 are not located.

[0066] Referring to Figures 5 and 7, the first cover layer 143 and the second cover layer 145 may be placed on the outermost part of the active region (AR) in the thickness direction (T-axis direction).

[0067] The first cover layer 143 is positioned between the first surface (S1) of the body 110 and the internal electrode closest to it. The second cover layer 145 is positioned between the second surface (S2) of the body 110 and the internal electrode closest to it.

[0068] In other words, the first cover layer 143 can be placed on top of the uppermost internal electrode within the body 110, and the second cover layer 145 can be placed on top of the lowermost internal electrode. The first cover layer 143 and the second cover layer 145 can have the same composition as the dielectric layer 140. The first cover layer 143 and the second cover layer 145 can be formed by laminating one or more dielectric layers on the outer surface of the uppermost internal electrode and the outer surface of the lowermost internal electrode, respectively. On the other hand, the first cover layer 143 and the second cover layer 145 can have a different composition from the dielectric layer 140.

[0069] The first cover layer 143 and the second cover layer 145 can serve to prevent damage to the first internal electrode 150 and the second internal electrode 160 due to physical or chemical stress.

[0070] The average thickness (H2) of the second cover layer 145 can be greater than the average thickness (H1) of the first cover layer 143.

[0071] Here, the average thickness (H1) of the first cover layer 143 and the average thickness (H2) of the second cover layer 145 are measured based on optical microscope or scanning electron microscope (SEM) images of the cross section (length direction (L direction) - thickness direction (T direction)) at the center of the width direction (W direction) of the multilayer ceramic capacitor 1000. The average thickness (H1) of the first cover layer 143 can be taken as the arithmetic mean of the distances measured from 30 points that are equally spaced in the length direction (L direction) on the internal electrode closest to the first surface (S1) of the body 110, among the internal electrodes shown in the aforementioned cross section images, to the first surface (S1). The aforementioned 30 points can be selected within the active region. The average thickness (H2) of the second cover layer 145 can be taken as the arithmetic mean of the distances measured from 30 points that are equally spaced in the length direction (L direction) on the internal electrode closest to the second surface (S2) of the body 110, among the internal electrodes shown in the aforementioned cross section images, to the second surface (S2). The aforementioned 30 locations can be selected within the active area.

[0072] For example, the second cover layer 145 can be made even thicker by increasing the number of dielectric layers in the second cover layer 145 compared to the number of dielectric layers in the first cover layer 143.

[0073] Referring to Figure 8, the multilayer ceramic capacitor 1000 can be mounted on the circuit board 500. A first electrode pad 511 and a second electrode pad 513 are arranged on the circuit board 500. The first electrode pad 511 is electrically connected to the first external electrode 200 by a conductive bonding member 515, and the second electrode pad 513 can be electrically connected to the second external electrode 300 by a conductive bonding member 515. The conductive bonding member 515 may include, for example, solder.

[0074] When current is applied to the multilayer ceramic capacitor 1000, the body 110 expands in the longitudinal direction (L-axis direction) due to the piezoelectric effect. However, because the second cover layer 145 is thicker than the first cover layer 143, an inverse phase occurs in the second cover layer 145, resulting in a phase shift suppression effect. Consequently, vibrations transmitted to the circuit board 500 are reduced, and acoustic noise can be reduced.

[0075] The first external electrode 200 and the second external electrode 300 are positioned outside the body 110.

[0076] The first external electrode 200 is positioned on the third surface (S3) of the body 110 and can extend to the first surface (S1), second surface (S2), fifth surface (S5), and sixth surface (S6). The second external electrode 300 is positioned on the fourth surface (S4) of the body 110 and can extend to the first surface (S1), second surface (S2), fifth surface (S5), and sixth surface (S6).

[0077] The first external electrode 200 may include a first electrode layer 210, a first conductive resin layer 220, a second conductive resin layer 230, a third conductive resin layer 240, and a fourth conductive resin layer 250.

[0078] The first electrode layer 210 contains a metal. The first electrode layer 210 may include, for example, one or more of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), copper (Cu), and alloys thereof.

[0079] The first electrode layer 210 may include a first connection portion 211, a first band portion 212, a second band portion 213, a third band portion 214, and a fourth band portion 215.

[0080] The first connection portion 211 covers the third surface (S3) of the body 110 and is electrically connected to the exposed ends of the multiple first internal electrodes 150.

[0081] The first band portion 212 extends from the first connecting portion 211 and covers a part of the first surface (S1) of the body 110, and the second band portion 213 extends from the first connecting portion 211 and covers a part of the second surface (S2) of the body 110.

[0082] The third band section 214 extends from the first connecting section 211 and covers a portion of the fifth surface (S5) of the body 110, and the fourth band section 215 extends from the first connecting section 211 and covers a portion of the sixth surface (S6) of the body 110.

[0083] The first conductive resin layer 220 covers the first band portion 212 and exposes the first connection portion 211. That is, the first conductive resin layer 220 may not be placed on the first connection portion 211, or it may be placed only partially on the first connection portion 211. For example, the first conductive resin layer 220 can extend from the first band portion 212 to the first connection portion 211 and cover a part of the first connection portion 211.

[0084] The first conductive resin layer 220 can cover part or all of the first band portion 212. Furthermore, the first conductive resin layer 220 can cover part of the first surface (S1) of the body 110.

[0085] The second conductive resin layer 230 covers the second band portion 213, exposing the first connection portion 211. That is, the second conductive resin layer 230 may not be placed on the first connection portion 211, or it may be placed only partially on the first connection portion 211. For example, the second conductive resin layer 230 can extend from the second band portion 213 to the first connection portion 211, covering a part of the first connection portion 211.

[0086] The second conductive resin layer 230 can cover part or all of the second band portion 213. Furthermore, the second conductive resin layer 230 can cover part of the second surface (S2) of the body 110.

[0087] The third conductive resin layer 240 covers the third band portion 214 and exposes the first connection portion 211. That is, the third conductive resin layer 240 may not be located on the first connection portion 211, or it may be located only partially on the first connection portion 211. For example, the third conductive resin layer 240 can extend from the third band portion 214 to the first connection portion 211 and cover a part of the first connection portion 211.

[0088] The third conductive resin layer 240 can cover part or all of the third band portion 214. Furthermore, the third conductive resin layer 240 can cover part of the fifth surface (S5) of the body 110.

[0089] The fourth conductive resin layer 250 covers the fourth band portion 215 and exposes the first connection portion 211. That is, the fourth conductive resin layer 250 may not be located on the first connection portion 211, or it may be located only partially on the first connection portion 211. For example, the fourth conductive resin layer 250 can extend from the fourth band portion 215 to the first connection portion 211 and cover a part of the first connection portion 211.

[0090] The fourth conductive resin layer 250 can cover part or all of the fourth band portion 215. Furthermore, the fourth conductive resin layer 250 can cover part of the sixth surface (S6) of the body 110.

[0091] The first conductive resin layer 220 may contain a metal and a resin.

[0092] The metal contained in the first conductive resin layer 220 may include, for example, copper (Cu), silver (Ag), nickel (Ni), tin (Sn), or alloys thereof.

[0093] The resin contained in the first conductive resin layer 220 may be any known thermosetting resin, such as epoxy resin, phenolic resin, urethane resin, silicone resin, or polyimide resin.

[0094] Since the second conductive resin layer 230, the third conductive resin layer 240, and the fourth conductive resin layer 250 contain the same or similar components as those of the first conductive resin layer 220 described above, a repeated explanation of them will be omitted.

[0095] After the first electrode layer 210 is formed, a conductive resin composition containing metal powder and a thermosetting resin can be applied onto the first electrode layer 210. Here, the thermosetting resin may be, but is not limited to, a resin with a small molecular weight and liquid at room temperature, such as bisphenol A resin, glycol epoxy resin, novolac epoxy resin, or derivatives thereof. For example, the conductive resin composition can be produced by mixing silver (Ag) powder, copper (Cu) powder, silver (Ag) coated copper (Cu) powder, tin (Sn)-based solder powder, and a thermosetting resin, and then dispersing them using a 3-roll mill. The tin (Sn)-based solder powder is tin (Sn), Sn 96.5 Ag 3.0 Cu 0.5 Sn 42 Bi 58 and Sn 72 Bi 28The present disclosure may include, but is not limited to, any one of the following. After removing the conductive resin composition on the first connection portion 211, the first conductive resin layer 220 on the first band portion 212, the second conductive resin layer 230 on the second band portion 213, the third conductive resin layer 240 on the third band portion 214, and the fourth conductive resin layer 250 on the fourth band portion 215 can be formed by curing heat treatment. Thus, the first connection portion 211 is located on the third surface (S3) of the body 110, the first band portion 212, the second band portion 213, the third band portion 214, and the fourth band portion 215 are located on the first surface (S1), the second surface (S2), the fifth surface (S5), and the sixth surface (S6), respectively, and the first conductive resin layer 220, the second conductive resin layer 230, the third conductive resin layer 240, and the fourth conductive resin layer 250 can be located on them, respectively.

[0096] Unlike this embodiment, if the electrode layer and the resin layer covering it are all arranged on the third surface (S3) of the body 110, the resin layer has lower electrical connectivity than the electrode layer, which may cause a problem in which the equivalent series resistance (ESR) of the first external electrode increases. During the high-temperature reflow process, out-gassing from the resin layer may cause lifting. Furthermore, because the resin layer is present on the electrode layer, the thickness of the external electrode is greater and the relative volume of the ceramic body is smaller compared to when only the electrode layer is present, which leads to a problem in which the effective capacitance of the multilayer ceramic capacitor decreases.

[0097] On the other hand, according to this embodiment, the first connecting portion 211 is arranged on the third surface (S3) of the body 110, and the first conductive resin layer 220, the second conductive resin layer 230, the third conductive resin layer 240, and the fourth conductive resin layer 250 are not arranged on the third surface (S3), or are only partially arranged therein, so the aforementioned problem may not occur.

[0098] On the other hand, the first external electrode 200 may further include a first plating layer 280.

[0099] The first plating layer 280 is connected to the first connector 211 and covers the first conductive resin layer 220, the second conductive resin layer 230, the third conductive resin layer 240, and the fourth conductive resin layer 250. The first plating layer 280 may include a first layer 281 and a second layer 283. The first layer 281 is placed on the first connector 211, the first conductive resin layer 220, the second conductive resin layer 230, the third conductive resin layer 240, and the fourth conductive resin layer 250, and the second layer 283 may be placed on the first layer 281. The first layer 281 may contain nickel (Ni), and the second layer 283 may contain tin (Sn), but this embodiment is not limited thereto.

[0100] On the other hand, if the first conductive resin layer 220 covers a portion of the first band portion 212, the remaining portion of the first band portion 212, i.e., the portion not covered by the first conductive resin layer 220, can be covered by the first plating layer 280. This is similarly applicable to the second band portion 213, the third band portion 214, and the fourth band portion 215.

[0101] The second external electrode 300 includes a second electrode layer 310, a fifth conductive resin layer 320, a sixth conductive resin layer 330, a seventh conductive resin layer 340, and an eighth conductive resin layer 350.

[0102] The second electrode layer 310 contains a metal. The second electrode layer 310 may contain, for example, one or more of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), copper (Cu), and alloys thereof.

[0103] The second electrode layer 310 includes a second connecting portion 311, a fifth band portion 312, a sixth band portion 313, a seventh band portion 314, and an eighth band portion 315.

[0104] The second connection portion 311 covers the fourth surface (S4) of the body 110 and is electrically connected to the exposed ends of the multiple second internal electrodes 160.

[0105] The fifth band section 312 extends from the second connecting section 311 and covers a portion of the first surface (S1) of the body 110, and the sixth band section 313 extends from the second connecting section 311 and covers a portion of the second surface (S2) of the body 110.

[0106] The seventh band section 314 extends from the second connecting section 311 and covers a portion of the fifth surface (S5) of the body 110, and the eighth band section 315 extends from the second connecting section 311 and covers a portion of the sixth surface (S6) of the body 110.

[0107] The fifth conductive resin layer 320 covers the fifth band portion 312, exposing the second connection portion 311. That is, the fifth conductive resin layer 320 may not be located on the second connection portion 311, or it may be located only partially on the second connection portion 311. For example, the fifth conductive resin layer 320 can extend from the fifth band portion 312 to the second connection portion 311, covering a portion of the second connection portion 311.

[0108] The fifth conductive resin layer 320 can cover part or all of the fifth band portion 312. Furthermore, the fifth conductive resin layer 320 can cover part of the first surface (S1) of the body 110.

[0109] The sixth conductive resin layer 330 covers the sixth band portion 313, exposing the second connection portion 311. That is, the sixth conductive resin layer 330 may not be placed on the second connection portion 311, or it may be placed only partially on the second connection portion 311. For example, the sixth conductive resin layer 330 can extend from the sixth band portion 313 to the second connection portion 311, covering a part of the second connection portion 311.

[0110] The sixth conductive resin layer 330 can cover part or all of the sixth band portion 313. Furthermore, the sixth conductive resin layer 330 can cover part of the second surface (S2) of the body 110.

[0111] The fifth conductive resin layer 320 may contain metal and resin.

[0112] The metal contained in the fifth conductive resin layer 320 may include, for example, copper (Cu), silver (Ag), nickel (Ni), tin (Sn), or alloys thereof.

[0113] The resin contained in the fifth conductive resin layer 320 may be any known thermosetting resin, such as epoxy resin, phenolic resin, urethane resin, silicone resin, or polyimide resin.

[0114] Since the sixth conductive resin layer 330, the seventh conductive resin layer 340, and the eighth conductive resin layer 350 contain the same or similar components as the fifth conductive resin layer 320 described above, a repeated explanation of them will be omitted.

[0115] The second external electrode 300 may further include a second plating layer 380.

[0116] The second plating layer 380 is connected to the second connector 311 and covers the fifth conductive resin layer 320, the sixth conductive resin layer 330, the seventh conductive resin layer 340, and the eighth conductive resin layer 350. The second plating layer 380 may include a third layer 381 and a fourth layer 383. The third layer 381 is placed on the second connector 311, the fifth conductive resin layer 320, the sixth conductive resin layer 330, the seventh conductive resin layer 340, and the eighth conductive resin layer 350, and the fourth layer 383 may be placed on the third layer 381. The third layer 381 may contain nickel (Ni), and the fourth layer 383 may contain tin (Sn), but this embodiment is not limited thereto.

[0117] On the other hand, if the fifth conductive resin layer 320 covers a portion of the fifth band portion 312, the remaining portion of the fifth band portion 312, i.e., the portion not covered by the fifth conductive resin layer 320, can be covered by the second plating layer 380. This is similarly applicable to the sixth band portion 313, the seventh band portion 314, and the eighth band portion 315.

[0118] Since the second external electrode 300 corresponds to the first external electrode 200 except for its position, we will omit a repeated explanation regarding it.

[0119] Figure 9 is a schematic perspective view showing a modified example of Figure 1, and Figure 10 is a schematic cross-sectional view of Figure 9.

[0120] Referring to Figures 9 and 10, the multilayer ceramic capacitor 1001 includes a body 110, a first external electrode 200, and a second external electrode 300. The body 110 may include a plurality of dielectric layers 140, a first cover layer 143, a second cover layer 145, a first internal electrode 150, and a second internal electrode 160.

[0121] The average thickness (H2) of the second cover layer 145 may be greater than the average thickness (H1) of the first cover layer 143.

[0122] The first internal electrode 150 and the second internal electrode 160 are stacked in the width direction (W-axis direction).

[0123] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 1, so we will omit any further explanation of them.

[0124] Figure 11 is a schematic perspective view showing a multilayer ceramic capacitor according to another embodiment, Figure 12 is a cross-sectional view along the line IV-IV' in Figure 11, and Figure 13 is a schematic cross-sectional view showing the multilayer ceramic capacitor of Figure 11 mounted on a circuit board.

[0125] Referring to Figures 11, 12, and 13, the multilayer ceramic capacitor 2000 includes a body 110, a first external electrode 200, a second external electrode 300, and an interposer 400.

[0126] The interposer 400 may include an interposer body 410, a first connecting electrode 420, and a second connecting electrode 430.

[0127] The interposer body 410 can be made of an insulator.

[0128] For example, the insulator may be an elastic insulating resin or a glass epoxy resin. Since insulating resins and glass epoxy resins are elastic, they can reduce acoustic noise by absorbing vibrations of the multilayer ceramic capacitor.

[0129] As another example, the insulator may be alumina (Al2O3). Because alumina does not have piezoelectric properties, it can suppress the transmission of vibrations generated from the multilayer ceramic capacitor itself, ultimately reducing acoustic noise.

[0130] The interposer body 410 may be, for example, plate-shaped. The interposer body 410 may include a first main surface 411, a second main surface 413, a first cross section 415, and a second cross section 417.

[0131] The first main surface 411 faces the second surface (S2) of the body 110, and the second main surface 413 is positioned on the opposite side of the first main surface 411 in the thickness direction (T-axis direction).

[0132] The first section 415 connects the first main surface 411 and the second main surface 413. The second section 417 is located on the opposite side of the first section 415 in the longitudinal direction (L-axis direction) and connects the first main surface 411 and the second main surface 413.

[0133] The first connecting electrode 420 may include a first junction 421, a first mounting portion 423, and a first connecting portion 425.

[0134] The first connecting electrode 420 may include, but is not limited to, copper (Cu), nickel (Ni), or tin (Sn).

[0135] The first joint 421 is positioned on the first main surface 411 of the interposer body 410 and can be electrically connected to the first external electrode 200.

[0136] The first mounting section 423 is positioned on the second main surface 413 of the interposer body 410. The first mounting section 423 can be connected to the first electrode pad 511 of the circuit board 500.

[0137] The first connecting portion 425 is positioned on the first cross section 415 of the interposer body 410 and can connect the first joint portion 421 and the first mounting portion 423.

[0138] The second connecting electrode 430 may include a second junction 431, a second mounting portion 433, and a second connecting portion 435.

[0139] The second joint 431 is positioned on the first main surface 411 of the interposer body 410 and can be electrically connected to the second external electrode 300.

[0140] The second mounting section 433 is positioned on the second main surface 413 of the interposer body 410. The second mounting section 433 can be connected to the second electrode pad 513 of the circuit board 500.

[0141] The second connecting portion 435 is positioned on the second cross section 417 of the interposer body 410 and can connect the second joint portion 431 and the second mounting portion 433.

[0142] Referring to Figure 13, the multilayer ceramic capacitor 2000 can be mounted on the circuit board 500. A first electrode pad 511 and a second electrode pad 513 are arranged on the circuit board 500. The first electrode pad 511 is electrically connected to the first connecting electrode 420 and the first external electrode 200 by a conductive bonding member 515, and the second electrode pad 513 can be electrically connected to the second connecting electrode 430 and the second external electrode 300 by a conductive bonding member 515. The conductive bonding member 515 may include, for example, solder.

[0143] Here, since the multilayer ceramic capacitor 2000 includes the interposer 400, vibrations transmitted to the circuit board 500 can be reduced. This reduces acoustic noise.

[0144] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 1, so we will omit any further explanation of them.

[0145] Figure 14 is a schematic perspective view showing a modified example of Figure 13, and Figure 15 is a schematic cross-sectional view of Figure 14.

[0146] Referring to Figures 14 and 15, the multilayer ceramic capacitor 2001 includes a body 110, a first external electrode 200, a second external electrode 300, and an interposer 400.

[0147] The body 110 may include multiple dielectric layers 140, a first cover layer 143, a second cover layer 145, a first internal electrode 150, and a second internal electrode 160.

[0148] The first internal electrode 150 and the second internal electrode 160 are stacked in the width direction (W-axis direction).

[0149] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 13, so we will omit any further explanation of them.

[0150] Figure 16 is a schematic perspective view showing a multilayer ceramic capacitor according to another embodiment, Figure 17 is a cross-sectional view along the line V-V' in Figure 16, Figure 18 is a bottom view of Figure 16, and Figure 19 is a schematic cross-sectional view showing the multilayer ceramic capacitor of Figure 16 mounted on a circuit board.

[0151] Referring to Figures 16, 17, 18, and 19, the multilayer ceramic capacitor 3000 includes a body 110, a first external electrode 200, a second external electrode 300, and a bump electrode 600.

[0152] The bump electrode 600 includes a first bump electrode 610 and a second bump electrode 620.

[0153] The first bump electrode 610 can be electrically connected to the first external electrode 200 on the second surface (S2) side of the body 110.

[0154] The first bump electrode 610 may include a first bump body 611 and a first conductive layer 613. The first bump electrode 610 may, for example, have a substantially hexahedral shape.

[0155] The first bump body 611 may include metal or an insulator.

[0156] For example, the metal contained in the first bump body 611 may be copper (Cu), and the insulator may be alumina (Al2O3). However, this embodiment is not limited to these examples.

[0157] The first conductive layer 613 is disposed on the surface of the first bump body 611 and can be connected to the first external electrode 200. For example, the first conductive layer 613 can be formed by plating a metal onto the surface of the first bump body 611. As an example, the first conductive layer 613 may include nickel (Ni), tin (Sn), or gold (Au).

[0158] The second bump electrode 620 can be electrically connected to the second external electrode 300 on the second surface (S2) side of the body 110. The second bump electrode 620 is separated from the first bump electrode 610 in the longitudinal direction (L-axis direction).

[0159] The second bump electrode 620 may include a second bump body 621 and a second conductive layer 623. The second bump electrode 620 may, for example, have a substantially hexahedral shape.

[0160] The second bump body 621 may include metal or an insulator.

[0161] For example, the metal contained in the second bump body 621 may be copper (Cu), and the insulator may be alumina (Al2O3). However, this embodiment is not limited to these examples.

[0162] The second conductive layer 623 is positioned on the surface of the second bump body 621 and can be connected to the second external electrode 300. For example, the second conductive layer 623 can be formed by plating a metal onto the surface of the second bump body 621. As an example, the second conductive layer 623 may include nickel (Ni), tin (Sn), or gold (Au).

[0163] Since the multilayer ceramic capacitor 3000 includes a first bump electrode 610 and a second bump electrode 620, when the multilayer ceramic capacitor 3000 is mounted on the circuit board 500, the distance between the circuit board 500 and the multilayer ceramic capacitor 3000 can be increased. This reduces vibrations transmitted to the circuit board 500, thereby reducing acoustic noise.

[0164] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 1, so we will omit repeated explanations regarding them.

[0165] Figure 20 is a schematic bottom view showing a modified version of Figure 16.

[0166] Referring to Figure 20, the first bump electrode 610' includes the first recess 615, and the second bump electrode 620' includes the second recess 625.

[0167] The first recess 615 may have a shape in which a part of the side surface in the longitudinal direction (L-axis direction) of the first bump electrode 610' is recessed, and the second recess 625 may have a shape in which a part of the side surface in the longitudinal direction (L-axis direction) of the second bump electrode 620' is recessed.

[0168] The specific shapes of the first recess 615 and the second recess 625 can be modified in various ways to improve mountability or reduce acoustic noise.

[0169] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 16, so we will omit further explanation of them.

[0170] Figure 21 is a schematic perspective view showing a modified example of Figure 16, and Figure 22 is a schematic cross-sectional view of Figure 21.

[0171] Referring to Figures 21 and 22, the multilayer ceramic capacitor 3001 includes a body 110, a first external electrode 200, a second external electrode 300, and a bump electrode 600. The body 110 may include a plurality of dielectric layers 140, a first cover layer 143, a second cover layer 145, a first internal electrode 150, and a second internal electrode 160.

[0172] The first internal electrode 150 and the second internal electrode 160 are stacked in the width direction (W-axis direction).

[0173] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 16, so we will omit further explanation of them.

[0174] Figure 23 is a schematic perspective view of a multilayer ceramic capacitor according to another embodiment, and Figure 24 is a cross-sectional view along the line VI-VI' in Figure 23.

[0175] Referring to Figures 23 and 24, the multilayer ceramic capacitor 4000 includes a body 110, a first external electrode 200, a second external electrode 300, and an insulating resin layer 700.

[0176] The body 110 may include multiple dielectric layers 140, a first cover layer 143, a second cover layer 145, a first internal electrode 150, and a second internal electrode 160.

[0177] The insulating resin layer 700 is positioned on the second surface (S2) of the body 110 and can cover a portion of the second band portion 213 and a portion of the sixth band portion 313. Both ends of the insulating resin layer 700 in the longitudinal direction (L-axis direction) can be covered by the second conductive resin layer 230 and the sixth conductive resin layer 330, respectively. Therefore, one end of the insulating resin layer 700 in the longitudinal direction (L-axis direction) can be positioned between the second band portion 213 and the second conductive resin layer 230, and the other end can be positioned between the sixth band portion 313 and the sixth conductive resin layer 330.

[0178] The insulating resin layer 700 may contain organic or inorganic materials having a certain level of strength and moisture resistance. The aforementioned organic material may be at least one of epoxy and urethane, and the inorganic material may be at least one of silicon dioxide (SiO2) and titanium dioxide (TiO).

[0179] The insulating resin layer 700 can partially absorb vibrations generated from the multilayer ceramic capacitor 4000. This reduces acoustic noise.

[0180] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 1, so we will omit any further explanation of them.

[0181] Figure 25 is a schematic cross-sectional view showing a modified example of Figure 23.

[0182] Referring to Figure 25, both ends of the insulating resin layer 700' in the longitudinal direction (L-axis direction) can be extended to the first connection portion 211 and the second connection portion 311, respectively. In this case, one end of the insulating resin layer 700' in the longitudinal direction (L-axis direction) can be positioned between the first plating layer 280 and the first connection portion 211, and the other end can be positioned between the second plating layer 380 and the second connection portion 311.

[0183] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 23, so we will omit any further explanation of them.

[0184] Figure 26 is a schematic perspective view showing a modified version of Figure 23, and Figure 27 is a schematic cross-sectional view of Figure 26.

[0185] Referring to Figures 26 and 27, the multilayer ceramic capacitor 4001 includes a body 110, a first external electrode 200, a second external electrode 300, and an insulating resin layer 700. The body 110 may include a plurality of dielectric layers 140, a first cover layer 143, a second cover layer 145, a first internal electrode 150, and a second internal electrode 160.

[0186] The first internal electrode 150 and the second internal electrode 160 are stacked in the width direction (W-axis direction).

[0187] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 23, so we will omit any further explanation of them.

[0188] Figure 28 is a schematic cross-sectional view showing a multilayer ceramic capacitor according to another embodiment.

[0189] Referring to Figure 28, the multilayer ceramic capacitor 5000 includes a body 110, a first external electrode 200, a second external electrode 300, an interposer 400, and an insulating resin layer 700. The body 110 may include a plurality of dielectric layers 140, a first cover layer 143, a second cover layer 145, a first internal electrode 150, and a second internal electrode 160.

[0190] The insulating resin layer 700 is positioned on the second surface (S2) of the body 110 and can cover a portion of the second band portion 213 and a portion of the sixth band portion 313. Both ends of the insulating resin layer 700 in the longitudinal direction (L-axis direction) can be covered by the second conductive resin layer 230 and the sixth conductive resin layer 330, respectively. Therefore, one end of the insulating resin layer 700 in the longitudinal direction (L-axis direction) is positioned between the second band portion 213 and the second conductive resin layer 230, and the other end is positioned between the sixth band portion 313 and the sixth conductive resin layer 330.

[0191] For example, the insulating resin layer 700 can be separated from the interposer 400 in the thickness direction (T-axis direction).

[0192] The insulating resin layer 700 may contain organic or inorganic materials having a certain level of strength and moisture resistance. The aforementioned organic material may be at least one of epoxy and urethane, and the inorganic material may be at least one of silicon dioxide (SiO2) and titanium dioxide (TiO).

[0193] The insulating resin layer 700 can partially absorb vibrations generated from the multilayer ceramic capacitor 5000. This reduces acoustic noise.

[0194] Since the components other than the insulating resin layer 700 are the same as those of the multilayer ceramic capacitor shown in Figure 12, a repeated explanation of them will be omitted.

[0195] Figure 29 is a schematic cross-sectional view showing a modified example of Figure 28.

[0196] Referring to Figure 29, both ends of the insulating resin layer 700' in the longitudinal direction (L-axis direction) can be extended to the first connection portion 211 and the second connection portion 311, respectively. In this case, one end of the insulating resin layer 700' in the longitudinal direction (L-axis direction) can be positioned between the first plating layer 280 and the first connection portion 211, and the other end can be positioned between the second plating layer 380 and the second connection portion 311.

[0197] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 28, so we will omit any further explanation of them.

[0198] Figure 30 is a schematic cross-sectional view showing a modified example of Figure 28.

[0199] Referring to Figure 30, the multilayer ceramic capacitor 5001 includes a body 110, a first external electrode 200, a second external electrode 300, an interposer 400, and an insulating resin layer 700. The body 110 may include a first internal electrode 150 and a second internal electrode 160.

[0200] The first internal electrode 150 and the second internal electrode 160 are stacked in the width direction (W-axis direction).

[0201] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 28, so we will omit any further explanation of them.

[0202] Figure 31 is a schematic cross-sectional view showing a multilayer ceramic capacitor according to another embodiment.

[0203] Referring to Figure 31, the multilayer ceramic capacitor 6000 includes a body 110, a first external electrode 200, a second external electrode 300, a bump electrode 600, and an insulating resin layer 700. The body 110 may include a plurality of dielectric layers 140, a first cover layer 143, a second cover layer 145, a first internal electrode 150, and a second internal electrode 160.

[0204] The insulating resin layer 700 is positioned on the second surface (S2) of the body 110 and can cover a portion of the second band portion 213 and a portion of the sixth band portion 313. Both ends of the insulating resin layer 700 in the longitudinal direction (L-axis direction) can be covered by the second conductive resin layer 230 and the sixth conductive resin layer 330, respectively. Therefore, one end of the insulating resin layer 700 in the longitudinal direction (L-axis direction) can be positioned between the second band portion 213 and the second conductive resin layer 230, and the other end can be positioned between the sixth band portion 313 and the sixth conductive resin layer 330.

[0205] The insulating resin layer 700 may contain organic or inorganic materials having a certain level of strength and moisture resistance. The aforementioned organic material may be at least one of epoxy and urethane, and the inorganic material may be at least one of silicon dioxide (SiO2) and titanium dioxide (TiO).

[0206] The insulating resin layer 700 can partially absorb vibrations generated from the multilayer ceramic capacitor 6000. This reduces acoustic noise.

[0207] Since the components other than the insulating resin layer 700 are the same as those of the multilayer ceramic capacitor shown in Figure 16, a repeated explanation of them will be omitted.

[0208] Figure 32 is a schematic cross-sectional view showing a modified example of Figure 31.

[0209] Referring to Figure 32, the multilayer ceramic capacitor 6001 includes a body 110, a first external electrode 200, a second external electrode 300, a bump electrode 600, and an insulating resin layer 700. The body 110 may include a first internal electrode 150 and a second internal electrode 160.

[0210] The first internal electrode 150 and the second internal electrode 160 are stacked in the width direction (W-axis direction).

[0211] The remaining components, excluding those mentioned above, are the same as those of the multilayer ceramic capacitor shown in Figure 31, so we will omit any further explanation of them.

[0212] Although embodiments of the present invention have been described above, the present invention is not limited thereto, and can be implemented in various ways within the scope of the claims, description of the invention, and attached drawings, and these also naturally fall within the scope of the present invention. [Explanation of symbols]

[0213] 1000 Multilayer Ceramic Capacitors 110 Body 140 Dielectric Layer 143. First Cover Layer 145 Second Cover Layer 150 1st internal electrode 160 2nd internal electrode 200 1st external electrode 211 First connection section 212 First Band Section 213 Second Band Section 220 First conductive resin layer 230 Second conductive resin layer 300 2nd external electrode 311 Second connection section 312. 5th Band Section 313 6th Band 320 5th conductive resin layer 330 6th conductive resin layer 400 Interposers 600 Bump Electrodes 700 Insulating resin layer

Claims

1. A body having a first surface and a second surface arranged opposite to each other in a first direction, comprising a plurality of dielectric layers and a plurality of internal electrodes, a first cover layer arranged on the outermost side in the first direction, and a second cover layer arranged on the opposite side of the first cover layer in the first direction and having an average thickness greater than the average thickness of the first cover layer, An external electrode is positioned outside the body and connected to the plurality of internal electrodes, Includes, The aforementioned external electrode is A connecting portion connected to the plurality of internal electrodes in a second direction intersecting the first direction, A first band portion connected to the aforementioned connection portion and covering a part of the first surface, A second band portion connected to the aforementioned connection portion and covering a part of the second surface, A first conductive resin layer disposed on the first band portion, A second conductive resin layer is disposed on the second band portion, A plating layer connected to the aforementioned connection portion and covering the first conductive resin layer and the second conductive resin layer, Multilayer ceramic capacitors, including those mentioned above.

2. The multilayer ceramic capacitor according to claim 1, further comprising an insulating resin layer covering a portion of the second surface of the body.

3. The insulating resin layer covers a portion of the second band portion, The multilayer ceramic capacitor according to claim 2, wherein the second conductive resin layer covers a portion of the insulating resin layer.

4. The insulating resin layer is made of epoxy, urethane, silicon dioxide (SiO ２ The multilayer ceramic capacitor according to claim 2, comprising ), or titanium oxide (TiO).

5. The multilayer ceramic capacitor according to claim 1, wherein the plurality of dielectric layers and the plurality of internal electrodes are stacked in the first direction.

6. The multilayer ceramic capacitor according to claim 1, wherein the plurality of dielectric layers and the plurality of internal electrodes are stacked in a third direction that intersects simultaneously with the first and second directions.

7. The multilayer ceramic capacitor according to claim 1, wherein the first conductive resin layer and the second conductive resin layer each contain a metal and a resin.

8. A body having a first surface and a second surface arranged opposite to each other in a first direction, and including a plurality of dielectric layers and a plurality of internal electrodes, An external electrode is positioned outside the body and connected to the plurality of internal electrodes, An interposer connected to the external electrode on the second surface side of the body, Includes, The aforementioned external electrode is A connecting portion connected to the plurality of internal electrodes in a second direction intersecting the first direction, A first band portion connected to the aforementioned connection portion and covering a part of the first surface, A second band portion connected to the aforementioned connection portion and covering a part of the second surface, A first conductive resin layer disposed on the first band portion, A second conductive resin layer is disposed on the second band portion, A plating layer connected to the aforementioned connection portion and covering the first conductive resin layer and the second conductive resin layer, Multilayer ceramic capacitors, including those mentioned above.

9. The aforementioned interposer, Interposer body and A connecting electrode is located outside the interposer body and is connected to the external electrode, The multilayer ceramic capacitor according to claim 8, including the above.

10. The multilayer ceramic capacitor according to claim 9, wherein the interposer body includes an insulator.

11. The aforementioned interposer body is The first main surface of the body facing the second surface, A second main surface is positioned on the opposite side of the first main surface in the first direction, Includes, The multilayer ceramic capacitor according to claim 9, wherein the connecting electrode includes a junction portion disposed on the first main surface.

12. The multilayer ceramic capacitor according to claim 11, wherein the connecting electrode includes a mounting portion disposed on the second main surface.

13. The multilayer ceramic capacitor according to claim 12, wherein the connecting electrode includes a connecting portion that connects the junction and the mounting portion.

14. The multilayer ceramic capacitor according to claim 8, further comprising an insulating resin layer covering a portion of the second surface of the body.

15. The multilayer ceramic capacitor according to claim 14, wherein the insulating resin layer is separated from the interposer.

16. The insulating resin layer is made of epoxy, urethane, silicon dioxide (SiO ２ A multilayer ceramic capacitor according to claim 14, comprising ), or titanium oxide (TiO).

17. The multilayer ceramic capacitor according to claim 8, wherein the plurality of dielectric layers and the plurality of internal electrodes are stacked in the first direction.

18. The multilayer ceramic capacitor according to claim 8, wherein the plurality of dielectric layers and the plurality of internal electrodes are stacked in a third direction that intersects the first and second directions simultaneously.

19. A body having a first surface and a second surface arranged opposite to each other in a first direction, and including a plurality of dielectric layers and a plurality of internal electrodes, An external electrode is positioned outside the body and connected to the plurality of internal electrodes, A bump electrode connected to the external electrode on the second surface side of the body, Includes, The aforementioned external electrode is A connecting portion connected to the plurality of internal electrodes in a second direction intersecting the first direction, A first band portion connected to the aforementioned connection portion and covering a part of the first surface, A second band portion connected to the aforementioned connection portion and covering a part of the second surface, A first conductive resin layer disposed on the first band portion, A second conductive resin layer is disposed on the second band portion, A plating layer connected to the aforementioned connection portion and covering the first conductive resin layer and the second conductive resin layer, Multilayer ceramic capacitors, including those mentioned above.

20. The body includes a third surface and a fourth surface that are arranged opposite to each other in the second direction, The external electrode includes a first external electrode connected to the plurality of internal electrodes on the third surface, and a second external electrode connected to the plurality of internal electrodes on the fourth surface. The multilayer ceramic capacitor according to claim 19, wherein the bump electrode includes a first bump electrode connected to the first external electrode and a second bump electrode spaced apart from the first bump electrode in the second direction and connected to the second external electrode.

21. The multilayer ceramic capacitor according to claim 19, wherein the bump electrode includes a bump body and a conductive layer disposed on the surface of the bump body and connected to the external electrode.

22. The multilayer ceramic capacitor according to claim 21, wherein the bump body comprises a metal or an insulator.

23. The multilayer ceramic capacitor according to claim 19, further comprising an insulating resin layer covering a portion of the second surface of the body.

24. The multilayer ceramic capacitor according to claim 19, wherein the plurality of dielectric layers and the plurality of internal electrodes are stacked in the first direction.

25. The multilayer ceramic capacitor according to claim 19, wherein the plurality of dielectric layers and the plurality of internal electrodes are stacked in a third direction that intersects simultaneously with the first and second directions.

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