Electronic component module and method for manufacturing the same

Abstract

This improves convenience by allowing the use of common retaining members and substrates for electronic components with the same or similar outer diameters but different lead terminal pitches. [Solution] The electronic component (4) has a pair of lead terminals (10-1, 10-2), and a housing section (14) for housing the electronic component, and a holding member (6) is provided in the housing section, which has a plurality of pairs of terminal through holes (through holes 18-1, 18-2) with different hole pitches corresponding to the spacing between the pair of lead terminals. By fitting the lead terminals into one of the terminal through holes, the electronic component is housed in the housing section and held by the holding member.

Description

【Technical Field】 【0001】 The present disclosure relates to an electronic component module for holding a plurality of electronic components and a method for manufacturing the same. 【Background Art】 【0002】 An electronic component module is a unit in which a plurality of electronic components are assembled and integrated. In addition to electric double layer capacitors, various capacitors and the like are used as the electronic components constituting this electronic component module. This electronic component includes two lead terminals having a terminal pitch that is an arrangement interval. 【0003】 Regarding such an electronic component module, there is one in which a plurality of capacitors having lead terminals are held by a holding structure and mounted on a mounting substrate (for example, Patent Document 1). Further, there is a motor having a pair of terminals and a substrate having a first fixing portion and a second fixing portion where the terminals of the motor are arranged, and each fixing portion forms a plurality of long holes having different arrangement distances arranged side by side, so that motors having different terminal pitches can be connected to a common substrate (for example, Patent Document 2). 【Prior Art Documents】 【Patent Documents】 【0004】 【Patent Document 1】 WO2020 / 116138 Publication 【Patent Document 2】 Japanese Patent Application Laid-Open No. 2024-93305 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 Incidentally, electronic component modules hold multiple electronic components together with a holding member, and by passing lead terminals through through holes inside the holding member, they can be properly connected to the target circuit board, while maintaining the set placement position and spacing. Electronic components such as capacitors have different capacitances depending on the length of the elements housed inside the outer casing, and the outer diameter of the casing may be the same or differ by up to 5 mm. Furthermore, these electronic components may have different terminal pitches even if the outer diameter of the casing is the same or close to it, depending on factors such as specifications, the relationship between the connection position of the lead terminals and the internal resistance. Conventionally, electronic component modules have faced the challenge of requiring different holding members and connecting boards for electronic components with different terminal pitches. Furthermore, during the assembly process of electronic component modules, if electronic components with incompatible terminal pitches are placed on the holding member, the lead terminals may not be able to be positioned in the designated through-holes, potentially leading to damage to the lead terminals. 【0006】 Such problems are not disclosed or suggested, and the configurations disclosed in Patent Documents 1 and 2 cannot solve these problems. 【0007】 Therefore, the purpose of this disclosure is to improve convenience by enabling the use of common retaining members and substrates for electronic components that have the same or similar outer diameters but different lead terminal pitches. [Means for solving the problem] 【0008】 To achieve the above objective, according to one aspect of the electronic component module of this disclosure, the module comprises an electronic component having a pair of lead terminals, and a holding member having a housing portion for housing the electronic component, the housing portion having a plurality of pairs of terminal through-holes with different hole pitches corresponding to the spacing between the pairs of lead terminals, and the electronic component is housed in the housing portion and held by the holding member by fitting the lead terminals into any of the terminal through-holes. 【0009】 In the above-described electronic component module, the terminal through-holes are arranged such that the multiple virtual hole pitch lines connecting pairs of terminal through-holes do not overlap on the same straight line, and these hole pitch lines intersect at a predetermined angle. In the above-described electronic component module, the housing portion of the holding member is capable of housing an electronic component selected from a plurality of electronic components each having lead terminals corresponding to any of the different hole pitches of the terminal through-holes, and these electronic components are each enclosed in an outer case having the same or substantially the same outer diameter. The above-described electronic component module includes a substrate having a terminal insertion hole that opens opposite to the terminal through hole of the holding member and through which the lead terminal inserted from the terminal through hole passes, and a conductor pattern that connects the electronic components housed in the holding member in series or in parallel, wherein the substrate is housed in the holding member, and the lead terminals of a plurality of electronic components, each having the same or different terminals corresponding to the hole pitch, are connected by the conductor pattern. The above-described electronic component module includes connecting components that connect the electronic components held by the holding member and the electronic components to the holding member. In the above-described electronic component module, the holding member has a space formed between the electronic component housed in the housing and the substrate, and other electronic components to be mounted on the substrate are arranged in this space. 【0010】 To achieve the above objective, according to one aspect of the manufacturing method for an electronic component module of the present disclosure, a method for manufacturing an electronic module in which an electronic component having a pair of lead terminals can be used, comprising: a step of fixing a substrate having terminal insertion holes that open opposite the terminal through holes of the substrate and allow the lead terminals inserted through the terminal through holes to pass through, and a conductor pattern that connects the electronic component housed in the substrate in series or parallel, by fitting the lead terminals to one of the terminal through holes, thereby housing the electronic component in the substrate and holding it in the substrate, and soldering the conductor pattern and the lead terminals. [Effects of the Invention] 【0011】 The technology described herein provides one of the following effects: 【0012】 (1) Multiple electronic components with a common or nearly common outer diameter of the case, but with different terminal pitches (the spacing between pairs of lead terminals), can be mounted on a common retaining member and substrate. 【0013】 (2) By providing terminal insertion holes that correspond to different terminal pitches in the conductor pattern on the substrate, the structure of the substrate can be simplified and the number of components in the conductor pattern can be reduced. 【0014】 (3) With respect to the retaining member and conductor pattern, through holes and terminal insertion holes are formed concentrically with respect to the central axis of the housing, and pairs of through holes are formed offset by a predetermined angle in the rotational direction, thereby enabling the formation of terminal insertion holes with different terminal pitches on a common conductor pattern. 【0015】 (4) By shifting the connection positions of electronic components with different terminal pitches of the lead terminals in the rotational direction and accommodating them, even lead terminals with close terminal pitches can be prevented from having interference between through holes and between terminal insertion holes, and a decrease in the installation workability of the electronic components can be prevented. 【Brief Description of the Drawings】 【0016】 [Figure 1] It is a diagram showing the configuration of an electronic component module according to the first embodiment. [Figure 2] It is a diagram showing a configuration example of a through hole formed in a holding member. [Figure 3] It is a diagram showing the external configuration of an electronic component module according to the second embodiment. [Figure 4] It is a diagram showing the configuration of a substrate. 【Modes for Carrying Out the Invention】 【0017】 〔First Embodiment〕 FIG. 1 shows a partially disassembled view of an electronic component module 2 (hereinafter simply referred to as "module 2") according to the first embodiment. The module 2 and its respective parts shown in FIG. 1 are examples, and the technology of the present disclosure is not limited to such a configuration. 【0018】 This module 2 has a function of accommodating, for example, a plurality of electronic components 4 and connecting and cooperating the electronic components with each other. The module 2 includes, for example, as shown in FIG. 1, a holding member 6 that accommodates the electronic components 4 and a substrate 8 that connects the plurality of electronic components 4. 【0019】 <Electronic Component 4> The electronic component 4 is an energy storage device, such as an electric double-layer capacitor, and has two lead terminals 10-1 and 10-2 protruding from the outer casing in the same direction as a pair. Lead terminal 10-1 functions as the anode terminal, for example, and lead terminal 10-2 functions as the cathode terminal. The module 2 can accommodate two different types of electronic components 4-1 and 4-2, for example, with different terminal pitches, which are the spacing between the lead terminals 10-1 and 10-2, and either electronic component 4-1 or 4-2 is selected and housed in the retaining member 6. 【0020】 Electronic components 4-1 and 4-2 are formed with, for example, the same or approximately the same outer diameters φx and φy of their cases, and are both set to be the same as or smaller than the inner diameter φz of the housing portion 14 of the retaining member 6, so that they can be accommodated. In other words, the outer diameter of the case and the inner diameter of the housing portion 14 of the retaining member 6 have the following relative sizes. φx≒φy≦φz ···(1) Electronic components 4-1 and 4-2 house a wound element, for example, an anode foil, a cathode foil, and a separator interposed between them, within a bottomed cylindrical case with one end open, and further have a sealing member to seal the case opening. In electronic components 4-1 and 4-2, for example, one end of lead terminal 10-1 is connected to the anode foil, and one end of lead terminal 10-2 is connected to the cathode foil, with the other ends of lead terminals 10-1 and 10-2 protruding from one end of the case through the sealing member. The lead terminals 10-1 and 10-2 are configured such that, for example, the terminal pitch W1 of electronic component 4-1 is set to be larger than the terminal pitch W2 of electronic component 4-2. The terminal pitches W1 and W2 are set based on differences in capacitance and specifications of electronic component 4, and other design considerations. Furthermore, the lead terminals 10-1 and 10-2 are arranged approximately symmetrically with respect to the central axis that passes through the end face of the protruding cylindrical case. As a result, electronic components 4-1 and 4-2 are formed such that the imaginary hole pitch line connecting the lead terminals 10-1 and 10-2 intersects with the central axis of the electronic component. 【0021】 <Holding member 6> The holding member 6 is a member that holds either the selected electronic component 4-1 or 4-2, and has a vertical wall portion 12 (Figure 2) that covers the entire case of the electronic component 4 or up to a predetermined height, and this vertical wall portion 12 becomes a housing portion 14 that houses the electronic components 4-1 and 4-2. The housing portion 14 of the holding member 6 also has a bottom portion 16 on which the end faces with the protruding lead terminals 10-1 and 10-2 of the electronic components 4-1 and 4-2 are placed, or which are opposed to each other at a predetermined distance apart. The bottom portion 16 has through holes 18-1 and 18-2 through which the lead terminals 10-1 and 10-2 of the housed electronic components 4-1 and 4-2 are inserted. That is, each housing portion 14 has four through holes 18-1 and 18-2, in two pairs with different opening pitches, to accommodate electronic components 4-1 and 4-2 having different terminal pitches W1 and W2. These through holes 18-1 and 18-2 are divided into a first group C1, whose hole pitch corresponds to the terminal pitch W1 of the electronic component 4-1 with a wider terminal pitch, and a second group C2, whose hole pitch corresponds to the terminal pitch W2 of the electronic component 4-2 with a narrower terminal pitch. The through holes 18-1 and 18-2 of the first group C1 and the second group C2 are formed so as to intersect on the bottom portion 16. 【0022】 The holding member 6 has, for example, a number of housing sections 14 corresponding to the number of electronic components 4 to be arranged in the electronic component module 2, and two pairs of through holes 18-1 and 18-2 are formed in each housing section 14. The retaining member 6 is made of, for example, a resin material, and has adjacent vertical wall portions 12 and bottom portions 16 that form the housing portion 14. In other words, the vertical wall portion 12 surrounds and holds the case surface of the electronic component 4 to be housed, and also has the function of blocking contact between at least the cases of other electronic components 4 housed in adjacent housing portions 14. 【0023】 The through-holes 18-1 and 18-2 are arranged on the periphery of the bottom surface 16, which has a circular or nearly circular outer shape, with respect to the central axis O, as shown in Figure 2, for example. The central axis O of the bottom surface 16 is the central axis of the housing section 14, and coincides with or is parallel to the central axis of the case of the electronic component 4 housed in the housing section 14. These through-holes 18-1 and 18-2 are arranged in groups C1 and C2 on concentric circles with predetermined radii r1 and r2 taken from the central axis O, with respect to the central axis O. In other words, the through holes 18-1 and 18-2 in group C1 correspond to the terminal pitch W1 of, for example, electronic component 4-1, and have a hole pitch of diameter (2 × r1) through the central axis O. Similarly, the through holes 18-1 and 18-2 in group C2 correspond to the terminal pitch W2 of, for example, electronic component 4-2, and have a hole pitch of diameter (2 × r2), which is shorter than the hole pitch of group C1. 【0024】 Furthermore, the through holes 18-1 and 18-2 of each group C1 and the through hole 18-2 of group C2 are positioned at predetermined angles θ1 and θ2, respectively, with respect to the central axis O or its vicinity. These angles θ1 and θ2 can be set by, for example, the terminal pitch value, the external dimensions of the electronic component 4, or other factors. By setting the angles θ1 and θ2 to 90°, the hole pitch lines of the terminal pitch become orthogonal. These angles θ1 and θ2 are related to the rotation angle of the electronic component 4 in order to align it with the through holes 18-1 and 18-2 corresponding to the terminal pitch of the selected electronic component 4 during the process of housing the electronic component 4 in the housing section 14. 【0025】 Furthermore, the through holes 18-1 and 18-2 of the same groups C1 and C2 are formed on opposite sides of the bottom surface 16, either left-right or top-bottom, via the central axis O, and within the left-right or top-bottom range of the bottom surface 16, lead terminals 10-1 and 10-2 of other groups with the same polarity are passed through in close proximity. 【0026】 <Substrate 8> The substrate 8 is a component that has the function of connecting the electronic components 4 housed in each housing portion 14 of the holding member 6 in series or in parallel, and is positioned on the side of the holding member 6 opposite to the side where the housing portion 14 is formed. The substrate 8 and the holding member 6 are fixed and held together using fixing means such as screws or bolts. In addition, for fixing the substrate 8 and the holding member 6, means such as fitting a projection formed on a part of the holding member 6 into a hole in the substrate 8 may be used. Multiple conductor patterns corresponding to the number of electronic components 4 connected are formed on the substrate 8. Terminal insertion holes 38-1 and 38-2 (Figure 4) are formed on these conductor patterns at positions opposite to all the through holes 18-1 and 18-2 in the housing portion 14 of the holding member 6, and are the same diameter as, or close to, the through holes 18-1 and 18-2. The lead terminals 10-1 and 10-2 of the selected electronic component 4 are inserted into these terminal insertion holes 38-1 and 38-2 through the corresponding through holes 18-1 and 18-2. The substrate 8 and the electronic component 4 are then fixedly connected by soldering to the terminal insertion holes 38-1 and 38-2 into which the lead terminals 10-1 and 10-2 are inserted, for example, on the back surface of the electronic component 4 (not shown). 【0027】 <Manufacturing process for Module 2> Next, an example of the manufacturing process for module 2 will be described. This manufacturing process for module 2 includes, for example, a molding process, assembly process, and connection process for the retaining member 6. The manufacturing process shown here is just an example, and the technology of this disclosure is not limited to the processing content and processing order of each process. The manufacturing process for module 2 is an example of a manufacturing method for the electronic component module of this disclosure. 【0028】 Molding process for the retaining member 6: The molding process for the retaining member 6 may involve integrally molding a material such as an insulating rigid resin using a mold (not shown), or it may involve methods such as cutting. 【0029】 Assembly process for module 2: This assembly process includes the steps of integrating the retaining member 6 and the substrate 8, and integrating the selected electronic component 4 into the housing portion 14 of the retaining member 6 into which the substrate 8 has been integrated, with the component set in place. The retaining member 6 and the substrate 8 are aligned using, for example, a position adjustment means (not shown) that serves as a reference for placement, or through holes 18-1 and 18-2 in the housing portion 14, and then integrated at the set position using fixing means. For this integration, for example, screws, bolts, or other latches may be passed through opposing through holes formed in both the retaining member 6 and the substrate 8 to secure them, or fixing means that clamp the outer circumferences of both may be used. Furthermore, the position adjustment means may be provided in either the holding member 6 or the substrate 8, or both. 【0030】 The electronic component 4 is placed in the housing portion 14 of the retaining member 6, which is integrated with the substrate 8, and integrated together. In this integration process, when one of several electronic components 4-1, 4-2 with different terminal pitches is selected, the hole pitch of the housing portion 14 is determined according to the terminal pitch of the electronic component 4, and the lead terminals 10-1, 10-2 of the electronic component 4 are positioned toward the corresponding through holes 18-1, 18-2. 【0031】 The selected electronic component 4 is positioned, for example, with its end face parallel to or nearly parallel to the holding member 6, and then rotated in a predetermined direction at a predetermined angle to face the lead terminals 10-1 and 10-2 with respect to the hole pitch groups C1 and C2 corresponding to the terminal pitch. Once the position and orientation of the electronic component 4 are set, it is housed in the housing 14. As a result, the electronic component 4 is held in place, with its protruding end face and part or all of its case surrounded by the vertical wall portion 12 and bottom portion 16 of the holding member 6. The lead terminals 10-1 and 10-2 also pass through the corresponding through holes 18-1 and 18-2 and are inserted into the terminal insertion holes 38-1 and 38-2 (Figure 4) of the substrate 8. 【0032】 Connection process: In the connection process, the lead terminals 10-1 and 10-2 are inserted into the terminal insertion holes 38-1 and 38-2 of the circuit board 8 and soldered to connect the electronic component 4 to the circuit board 8. 【0033】 <Effects of the First Embodiment> With this configuration, one of the following effects can be obtained: 【0034】 (1) By having through holes 18-1, 18-2 and terminal insertion holes 38-1, 38-2 with different hole pitches, a common retaining member 6 and substrate 8 can be used for multiple electronic components 4-1, 4-2 having the same or nearly the same outer diameter and different terminal pitches for lead terminals. 【0035】 (2) By using a retaining member having multiple through holes 18-1, 18-2 that correspond to multiple terminal pitches, the number of parts can be reduced and the burden of checking whether the corresponding parts match during the manufacturing process of module 2 can be reduced. 【0036】 (3) With respect to the retaining member 6, groups C1 and C2 are set on concentric circles with respect to the central axis O of the housing portion 14, with different terminal pitches for the through holes 18-1 and 18-2. By forming the through holes 18-1 and 18-2 in groups C1 and C2 such that the imaginary pitch lines connecting the through holes 18-1 and 18-2 in a straight line take a predetermined arrangement angle, interference between the through holes 18-1 and 18-2 in the groups can be prevented. In other words, by forming the through holes 18-1 and 18-2 spaced apart on the bottom surface portion 16, when forming solder fillets in the through holes 18-1 and 18-2 into which the lead terminals 10-1 and 10-2 are inserted, it is possible to prevent molten solder from flowing into the through holes 18-1 and 18-2 of other adjacent groups and connecting with the conductor pattern on the substrate 8. 【0037】 (4) With respect to the selected electronic component 4, by rotating the electronic component 4 at a predetermined angle when housing it in the housing section 14, the lead terminals 10-1 and 10-2 can be positioned toward the through holes 18-1 and 18-2 with the corresponding terminal pitches, thereby improving the ease of installation of the electronic component 4. 【0038】 [Second Embodiment] Figure 3 shows an example of the overall configuration of module 2 according to the second embodiment. The module 2 and its parts shown in Figure 3 are examples, and the technology of this disclosure is not limited to such configurations. Also, in Figure 3, some of the electronic components 4 in the housing portion 14 of the holding member 6 are omitted, but this does not represent the module 2 in its original operating state, but rather a state for the purpose of explaining this embodiment. 【0039】 In this module 2, for example, as shown in Figure 3, six electronic components 4 are used as multiple electronic components 4, and as an example of arranging the electronic components 4 using the holding member 6, the case where the six electronic components 4 are arranged in 2 rows and 3 columns is shown. Each housing section 14 has two pairs of through holes 18-1 and 18-2 that correspond to multiple terminal pitches, as described above. Module 2 is housed in a housing section 14 and has external terminals 20-1 and 20-2 that can store energy in a plurality of electronic components 4 connected in series, or receive power from the electronic components 4. External terminal 20-1 is, for example, the anode terminal, and external terminal 20-2 is, for example, the cathode terminal, both of which are formed on a substrate 8 and exposed to the outside from a part of the holding member 6. External terminals 20-1 and 20-2 are connected to a power supply circuit or other circuits, etc. (not shown). 【0040】 Furthermore, in module 2, for example, a notch 21 is formed in a part of the vertical wall portion 12 of the holding member 6 where multiple electronic components 4 are adjacent, and a fixing resin 22 is filled into this notch 21. This fixing resin 22 is, for example, an example of a means of holding three electronic components 4 that are adjacent to each other in an oblique direction, and is filled after at least all housing portions 14 adjacent to the notch 21 have been housed with electronic components 4. The fixing resin 22 may be, for example, one that solidifies from a liquid or gel state due to a decrease in temperature or the passage of time, or it may be a clay-like resin material with a predetermined hardness that is pressurized into the notch 21. As a result, the electronic components 4 housed in the housing section 14 are fixed and held in place by the fixing resin 22 together with the vertical wall section 12. 【0041】 Furthermore, the retaining member 6 has, for example, ribs 24 for reinforcement on the periphery of the vertical wall portion 12, and a barrier wall 26 to separate the external terminals 20-1 and 20-2 in the portion where the external terminals are exposed. The retaining member 6 also has a through hole 28 formed therein for integration with the substrate 8 located on the back side, and is opposite to a through hole 30 (Figure 4) formed on the substrate 8 side. These through holes 28 and 30 may be used, for example, as a reference for adjusting the positioning of the retaining member 6 and the substrate 8. As previously described, in the process of connecting the retaining member 6 and the substrate 8, the fixing means can be passed through the opposing through holes 28 and 30. In addition, the holding member 6 has multiple openings 32 formed therein for determining the placement position of module 2 with respect to equipment (not shown) and for connecting to equipment. 【0042】 <Example configuration of circuit board 8> Figure 4 shows an example of the configuration of the substrate 8. As shown in Figure 4A, for example, the substrate 8 has at least external terminals 20-1 and 20-2 mounted on its front surface, which faces the back surface of the retaining member 6 after the assembly of module 2. On its back side, it is provided with a conductor pattern 34 for connecting multiple electronic components 4 housed in the retaining member 6, and a conductor pattern 36 for connecting the electronic components 4 with the external terminals 20-1 and 20-2. 【0043】 This conductor pattern 34 is, for example, a means for connecting the anode-side lead terminal 10-1 and the cathode-side lead terminal 10-2 of an adjacent electronic component 4, and multiple such patterns are mounted on the substrate 8 depending on the number of electronic components 4 housed in the module 2. The conductor pattern 36 has either an external terminal 20-1 or an external terminal 20-2 connected to one end, and one of the lead terminals 10-1 and 10-2 of the electronic component 4 adjacent to the external terminals 20-1 and 20-2 connected to the other end. 【0044】 On the substrate 8, if the positions facing each housing portion 14 of the holding member 6 are designated as connection regions 40, then within each connection region 40, two conductor patterns 34, or conductor patterns 34 and 36, are arranged to connect to different lead terminals 10-1 and 10-2 of the same electronic component 4. The substrate 8 also has terminal insertion holes 38-1 and 38-2 formed in the portions facing the through holes 18-1 and 18-2, overlapping with the conductor patterns 34 and 36. Similar to the through holes 18-1 and 18-2 of the housing portion 14, the substrate 8 has two pairs of terminal insertion holes 38-1 and 38-2, four in total, formed at positions facing the housing portion 14 to accommodate different terminal pitches. 【0045】 More specifically, the connection region 40 has two terminal insertion holes 38-1 at different positions on a conductor pattern 34, for example, located on the left side, into which the anode lead terminal 10-1 is inserted. Also, in the same connection region 40, there are two cathode lead terminals 10-2 at different positions on a conductor pattern 34, for example, located on the right side. A first group C1 corresponds to the terminal pitch of an electronic component 4 when a terminal insertion hole 38-1 is paired with a terminal insertion hole 38-2 of another conductor pattern 34, which is positioned relative to the central axis of the connection region 40. Similarly, a first group C1 corresponds to the terminal insertion hole 38-2 of another conductor pattern 34, which is positioned relative to the central axis of the connection region 40 when a terminal insertion hole 38-1 is paired with another terminal insertion hole 38-2 of the other conductor pattern 34, which is positioned relative to the central axis of the connection region 40. Similarly, for some of the conductor patterns 34 and 36, a second group C2 corresponds to a second group C2 when a terminal insertion hole 38-1 is paired with a terminal insertion hole 38-2 of another conductor pattern 34, which is positioned relative to the central axis of the connection region 40. 【0046】 In other words, this substrate 8 has opposing terminal insertion holes 38-1 and 38-2 within the connection area 40 that correspond to different terminal pitches of the electronic component 4, and allows selection of terminal insertion holes 38-1 and 38-2 to connect to lead terminals 10-1 and 10-2 that have passed through the through holes 18-1 and 18-2. 【0047】 In this module 2, for example, in the arrangement of electronic components 4 in a 2x3 grid, the front row has the anode lead terminal 10-1 on the left and the cathode lead terminal 10-2 on the right, while the back row is arranged in the opposite way, with the anode lead terminal 10-1 on the left and the cathode lead terminal 10-2 on the right. 【0048】 As a result, in module 2, for example as shown in Figure 4B, the electronic components 4 are connected in series depending on the arrangement direction of the lead terminals 10-1 and 10-2 of the housed electronic components 4 and the arrangement direction of the conductor patterns 34 and 36, and the selected terminal insertion holes 38-1 and 38-2 become the anode and cathode, respectively. Then, through the conductor patterns 34 and 36, the external terminal 20-1 can be set as the anode and the external terminal 20-2 as the cathode. 【0049】 This arrangement is, for example, an example configuration for connecting electronic components 4 in a 2x3 grid in series. In module 2, the shapes of the conductor patterns 34 and 36 may be changed based on, for example, how the electronic components 4 housed in the holding member 6 are connected. 【0050】 <Effects of the second embodiment> With this configuration, one of the following effects can be obtained: (1) Similar to the first embodiment, a common retaining member 6 and substrate 8 can be used for multiple lead terminals with different terminal pitches. 【0051】 (2) By providing terminal insertion holes 38-1 and 38-2 corresponding to different terminal pitches in the conductor patterns 34 and 36 on the substrate 8, the structure of the substrate 8 can be simplified and the number of components in the conductor pattern can be reduced. 【0052】 (3) Similarly, with respect to the substrate 8 formed in accordance with the arrangement positions of the through holes 18-1 and 18-2, interference between the terminal insertion holes 38-1 and 38-2 between groups can be prevented. [Other embodiments] The technology disclosed herein includes the following: 【0053】 (1) In the case of the electronic component 4, either inside the vertical wall portion 12, the bottom portion 16, or in each through hole 18-1, 18-2, a marking or other mechanism may be provided to guide the worker to avoid incorrectly connecting the lead terminals 10-1, 10-2 of the electronic component by visual inspection or other means. Furthermore, the housing section may be provided with means for guiding groups of through-holes 18-1 and 18-2 corresponding to the terminal pitch of the selected electronic component 4, as well as guide markings that allow either the anode terminal or the cathode terminal, or both, of the through-holes 18-1 and 18-2 in each group to be visible. 【0054】 (2) In the above embodiment, each housing section 14 has two pairs of through holes 18-1, 18-2 in total to accommodate different terminal pitches, and correspondingly, the substrate 8 has two pairs of four terminal insertion holes 38-1, 38-2, but it is not limited to this. Each housing section 14 and the substrate 8 may have three or more pairs, i.e., six or more through holes 18-1, 18-2 and terminal insertion holes 38-1, 38-2. In this case, the bottom surface 16 forming the housing section 14 may have through holes 18-1, 18-2 at positions on a plurality of concentric circles with a central axis O as the reference and the terminal pitch W as the radius r, at predetermined arrangement angles θ from each other. Also, on the substrate 8, it is sufficient to have three or more pairs of terminal insertion holes 38-1, 38-2 at positions opposite to the through holes 18-1, 18-2. 【0055】 (3) In the above embodiments, the selected electronic components were shown to have the same or similar outer diameters, but the technology of this disclosure is not limited thereto. This electronic component module is equipped with lead terminals corresponding to a set terminal pitch, and can be used as long as the outer diameter of the body of the electronic component is smaller than the inner diameter of the housing. In this case, for example, a spacer member or engaging member (not shown) is attached to or placed in the housing for an electronic component with a small diameter body, and interposed between the body of the electronic component and the housing. As a result, any electronic component with a terminal pitch set in the housing can be used in the electronic component module. 【0056】 (4) In the above embodiments, the relationship between the terminal pitches of the electronic components housed in the electronic component module is not specified, but the technology of this disclosure is not limited thereto. The electronic component module employs electronic components having terminal pitches that can be inserted into either of the two pairs of terminal through-holes formed therein, and electronic components with different terminal pitches may be mixed together. The electronic component module may combine electronic components with different capacities to accommodate conditions such as set capacitance, current value, and voltage value. 【0057】 As described above, the most preferred embodiments of the technology of this disclosure have been described. The technology of this disclosure is not limited to those described above. Various modifications and changes are possible for those skilled in the art based on the gist of the invention as described in the claims or disclosed in the forms for carrying out the invention. It goes without saying that such modifications and changes are within the scope of this technology. [Industrial applicability] 【0058】 According to the electronic component module and its manufacturing method disclosed herein, a common retaining member and substrate can be used in combination for multiple electronic components with different terminal pitches, which is useful. [Explanation of Symbols] 【0059】 2 Electronic component modules 4 Electronic Components 6. Retaining member 8 circuit boards 10-1, 10-2 lead terminals 12 Vertical wall section 14. Detention Unit 16 Bottom part 18-1, 18-2, 28, 30 through holes 20-1, 20-2 External terminals 21 Notch 22 Fixing resin 24 Ribs 26 Barrier wall 32 openings 34, 36 Conductor Patterns 38-1, 38-2 Terminal insertion holes 40 connection areas

Claims

[Claim 1] An electronic component having a pair of lead terminals, A retaining member comprising a housing portion for housing the aforementioned electronic components, wherein multiple pairs of terminal through-holes with different hole pitches corresponding to the spacing between pairs of lead terminals are formed in the housing portion, An electronic component module comprising the lead terminals being fitted into any of the terminal through-holes, thereby housing the electronic component in the housing and holding it in the holding member. [Claim 2] The electronic component module according to claim 1, wherein the housing portion is arranged such that a plurality of virtual hole pitch lines connecting pairs of terminal through holes do not overlap on the same straight line, and these hole pitch lines intersect at a predetermined angle. [Claim 3] The housing portion of the holding member is capable of housing an electronic component selected from a plurality of electronic components, each having a lead terminal corresponding to one of the different hole pitches of the terminal through-holes. The electronic component module according to claim 1, wherein these electronic components are provided with an outer casing having the same or substantially the same outer diameter. [Claim 4] The substrate comprises a terminal insertion hole that opens opposite the terminal through hole of the retaining member and allows the lead terminal inserted through the terminal through hole to pass through, and a conductor pattern that connects the electronic components housed in the retaining member in series or parallel, The electronic component module according to claim 1, wherein the substrate is housed in the holding member, and the lead terminals of a plurality of electronic components, each having the same or different terminals corresponding to the hole pitch, are connected by the conductor pattern. [Claim 5] The electronic component module according to claim 4, further comprising connecting parts that connect the electronic components held by the holding member and the electronic components and the holding member. [Claim 6] The electronic component module according to claim 5, wherein the holding member has a space formed between the electronic component housed in the housing and the substrate, and other electronic components to be mounted on the substrate are arranged in the space. [Claim 7] A method for manufacturing an electronic module that can use an electronic component having a pair of lead terminals, A retaining member comprising a plurality of housing sections for housing the aforementioned electronic components, wherein a plurality of pairs of terminal through-holes with different hole pitches corresponding to the spacing between pairs of lead terminals are formed in the housing sections, A step of fixing a substrate having a terminal insertion hole that opens opposite to the terminal through hole of the retaining member and through which the lead terminal inserted from the terminal through hole passes, and a conductor pattern that connects the electronic components housed in the retaining member in series or parallel, The steps include fitting the lead terminals into one of the terminal through-holes to house the electronic component in the housing and hold it in the holding member, A step of soldering the conductor pattern and the lead terminal, A method for manufacturing electronic component modules that include [specific component].

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