Substrate processing method and substrate processing system

Abstract

The first and second substrates are appropriately peeled off from the polymerized substrate into which the first and second substrates are bonded. [Solution] A substrate processing method for peeling a first substrate and a second substrate from a polymer substrate in which a first substrate and a second substrate are joined, comprising: pulsed irradiation of a laser beam onto a laser absorption layer formed between the first substrate and the second substrate from the back side of the second substrate; and peeling the second substrate from the first substrate, wherein pulsed irradiation of the laser beam from the back side of the second substrate includes: scanning the laser beam within a predetermined scan range when irradiating the laser absorption layer with the laser beam; moving the polymer substrate in the X-axis direction while stopping the irradiation of the laser beam after scanning the laser beam within the scan range; and repeatedly irradiating the laser beam and scanning and moving the polymer substrate to irradiate the laser beam in a line in the X-axis direction.

Claims

1. In a substrate processing method for peeling off the first substrate and the second substrate from a polymerized substrate in which a first substrate and a second substrate are joined, The laser absorption layer formed between the first substrate and the second substrate is irradiated in a pulsed manner with laser light from the back side of the second substrate, This includes peeling the second substrate from the first substrate, Irradiating the second substrate with the laser light in a pulsed manner from the back side is When irradiating the laser absorption layer with the laser light, the laser light is scanned within a predetermined scan range. After scanning the laser beam within the aforementioned scan range, the polymerization substrate is moved in the X-axis direction while the irradiation of the laser beam is stopped. A substrate processing method comprising repeatedly irradiating and scanning with the laser light and moving the polymerized substrate, thereby irradiating the laser light in a line in the X-axis direction.

2. The substrate processing method according to claim 1, wherein irradiating the second substrate with the laser light in a pulsed manner from the back side includes irradiating the laser light in a line in the X-axis direction and then moving the polymerized substrate in the Y-axis direction.

3. The substrate processing method according to claim 2, wherein irradiating the second substrate with the laser light in a pulsed manner from the back side comprises repeatedly irradiating the laser light in a line in the X-axis direction and moving the polymerized substrate in the Y-axis direction.

4. A first surface film is formed on the first substrate. The laser absorption layer, the device layer, and the second surface film are formed on the second substrate in this order from the surface side. The first substrate and the second substrate are bonded together by the first surface film and the second surface film. The substrate processing method according to claim 1, comprising peeling the second substrate from the first substrate and transferring the device layer and the second surface film to the first substrate.

5. The substrate processing method according to claim 4, comprising peeling the second substrate from the first substrate between the laser absorption layer and the second substrate, and transferring the device layer and the second surface film to the first substrate.

6. The substrate processing method according to claim 4, comprising peeling the second substrate from the first substrate between the laser absorption layer and the device layer, and transferring the device layer and the second surface film to the first substrate.

7. The first surface film is an oxide film, The substrate processing method according to claim 4, wherein the second surface film is an oxide film.

8. A substrate processing system for peeling off the first substrate and the second substrate from a polymerized substrate in which a first substrate and a second substrate are joined, A holding portion for holding the back surface of the first substrate, An X-axis movement mechanism for moving the holding portion along the X-axis, A laser irradiation unit that emits laser light, A program storage unit for storing programs, The control device includes a computer that reads the program from the program storage unit and operates the program, The aforementioned program, A program that runs on the computer of the control device that controls the substrate processing system to cause the substrate processing system to execute a substrate processing method, The substrate processing method is The laser light is pulsed onto the laser absorption layer formed between the first substrate and the second substrate from the back side of the second substrate, This includes peeling the second substrate from the first substrate, Irradiating the second substrate with the laser light in a pulsed manner from the back side is When irradiating the laser absorption layer with the laser light, the laser light is scanned within a predetermined scan range. After scanning the laser beam within the aforementioned scan range, the polymerization substrate is moved in the X-axis direction while the irradiation of the laser beam is stopped. A substrate processing system comprising repeatedly irradiating and scanning with the laser light and moving the polymerized substrate to irradiate the laser light in a line in the X-axis direction.

9. The holding portion has a Y-axis movement mechanism that moves it along the Y axis, The substrate processing system according to claim 8, wherein the substrate processing method involves irradiating the second substrate with the laser light in a pulsed manner from the back side, and then moving the polymerized substrate in the Y-axis direction after irradiating it with the laser light in a line in the X-axis direction.

10. The substrate processing system according to claim 9, wherein the pulsed irradiation of the laser light from the back side of the second substrate includes repeatedly irradiating the laser light in a line in the X-axis direction and moving the polymerized substrate in the Y-axis direction.

11. A first surface film is formed on the first substrate. The laser absorption layer, the device layer, and the second surface film are formed on the second substrate in this order from the surface side. The first substrate and the second substrate are bonded together by the first surface film and the second surface film. The substrate processing system according to claim 8, wherein the substrate processing method includes peeling the second substrate from the first substrate and transferring the device layer and the second surface film to the first substrate.

12. The substrate processing system according to claim 11, wherein the substrate processing method includes peeling the second substrate from the first substrate between the laser absorption layer and the second substrate, and transferring the device layer and the second surface film to the first substrate.

13. The substrate processing system according to claim 11, wherein the substrate processing method includes peeling the second substrate from the first substrate between the laser absorption layer and the device layer, and transferring the device layer and the second surface film to the first substrate.

14. The first surface film is an oxide film, The substrate processing system according to claim 11, wherein the second surface film is an oxide film.

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