Soldering materials, solder paste, foam solder, and solder joints
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SENJU METAL IND CO LTD
- Filing Date
- 2024-12-05
- Publication Date
- 2026-06-17
AI Technical Summary
【0010】 本発明のはんだ材料は、1次実装時の核材料に対するはんだの濡れ上がり性能を改善することにより不濡れを抑制できる。
Smart Images
Figure 2026098189000001_ABST
Abstract
Claims
1. It is a soldering material, A conductive core material, and Solder layer surrounding the aforementioned nuclear material Includes, The solder material that satisfies the following formula (1): Ts≧-0.25Dc+105 (1) (Dc: diameter of the core material (μm), Ts: thickness of the solder layer on both sides of the core material (μm)).
2. The solder material according to claim 1, wherein the Dc is 75 to 425 μm.
3. The solder material according to claim 1 or 2, wherein the Ts is 20 to 425 μm.
4. The solder material according to claim 1 or 2, wherein the solder layer comprises at least one selected from the group consisting of Sn, Ag, Cu, In, Ni, Bi, Sb, Zn, Ti, Ce, P, Ge, Ga, As, Fe, Co, Pd, Pb, and alloys thereof.
5. The solder material according to claim 1 or 2, wherein the core material comprises at least one selected from the group consisting of Cu, Ni, Au, Al, Mo, Mg, Zn, Co, and alloys thereof.
6. The solder material according to claim 1 or 2, wherein the core material is a spherical core ball.
7. The solder material according to claim 1 or 2, wherein the nucleus material is a columnar nucleus column.
8. The solder material according to claim 1 or 2, further comprising a barrier layer between the core material and the solder layer, the barrier layer comprising at least one selected from the group consisting of Ni and Co.
9. A solder paste comprising the solder material according to claim 1 or 2.
10. A foam solder comprising the solder material according to claim 1 or 2.
11. A solder joint comprising the solder material according to claim 1 or 2.