High-efficiency double heat dissipation type aluminum substrate for printing
By combining heat-conducting pillars and copper foil with a cooling fan for dual heat dissipation, along with a micro-motor driven rotating block and a filter system, the heat dissipation problem of aluminum substrates in devices with large thickness or high power is solved, achieving efficient dual heat dissipation and dust prevention.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JOINTLY BUILD NEW MATERIALS (SUZHOU) CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-06-19
AI Technical Summary
Existing aluminum substrates have poor heat dissipation performance when the thickness exceeds 3mm or when used in high-power devices, especially when there are no external heat dissipation components, internal heat is prone to accumulate.
The system employs a combination of heat-conducting pillars and copper foil with a cooling fan for dual heat dissipation. This, along with a micro-motor-driven rotating block and a filter system, ensures smooth airflow and prevents heat buildup.
It achieves efficient heat dissipation for thicker aluminum substrates or high-power devices, avoids heat accumulation, improves heat dissipation efficiency, and prevents dust and impurities from affecting heat dissipation through a filter system.
Smart Images

Figure CN224385779U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of aluminum substrates, specifically a high-efficiency dual heat dissipation type aluminum substrate for printing. Background Technology
[0002] Printed aluminum substrate is a type of printed circuit board with aluminum alloy as the base material. It has good heat dissipation, electrical and mechanical properties and is widely used in many fields such as LED lighting, power supply equipment and industrial control equipment.
[0003] The patent with publication number CN219499630U discloses a thermally conductive aluminum substrate for aluminum-based printed circuit boards. Specifically, the patent discloses the thermally conductive aluminum substrate for aluminum-based printed circuit boards provided by this utility model. Multiple through convection holes are opened on the side of the aluminum substrate. Heat is first conducted to the aluminum substrate through thermal conduction. Then, when the heat inside the aluminum substrate reaches the convection holes through thermal conduction, the air velocity at both ends is different due to the different diameter of the convection holes and the opposite direction of adjacent convection holes, resulting in a pressure difference. Therefore, under the action of hot air, a negative pressure exhaust effect is generated, which increases the heat exchange effect, increases the heat exchange surface, and improves the heat exchange efficiency.
[0004] To address the aforementioned issues, existing technologies utilize components such as convection holes to achieve heat exchange and dissipation. However, in practical applications, the thickness of aluminum substrates varies, and heat dissipation via convection holes is only suitable for thinner and lighter devices with a thickness of less than 3mm. For aluminum substrates thicker than 4mm or for devices with higher power, in addition to necessary external heat dissipation components, internal heat tends to accumulate, resulting in poor heat dissipation. Utility Model Content
[0005] The purpose of this invention is to provide a high-efficiency dual-heat dissipation type aluminum substrate for printing, so as to solve the problems mentioned in the background art and overcome its technical defects.
[0006] To solve the above technical problems, the technical solution adopted by this utility model is: including a mounting frame, in which a substrate body is inserted, and heat-conducting columns are fixedly installed on both sides of the outer wall of the substrate body, and a heat dissipation mechanism is provided at one end of the mounting frame;
[0007] The heat dissipation mechanism includes a mounting shell, which is slidably connected to one end of a mounting bracket. An assembly shell is fixedly installed at one end of the mounting shell that passes through the mounting bracket. An mounting plate is fixedly installed on one side of the inner side of the assembly shell, and a heat dissipation fan is embedded in the inner wall of the mounting plate. A first copper foil is fixedly installed at the top of the substrate body, and a second copper foil is fixedly installed at the bottom of the substrate body.
[0008] As a further improvement of this utility model: a micro motor is embedded in the inner wall of the assembly shell, and a drive rod is fixedly installed at the power output end of the micro motor.
[0009] As a further embodiment of this utility model: a transmission component is fixedly installed on the outer wall of the drive rod, and a rotating rod extends through the inside of the transmission component. A rotating block is fixedly installed on the outer wall of one end of the rotating rod that extends through the transmission component.
[0010] As a further improvement of this utility model: the outer wall of the mounting shell is fitted with a coarse-pore filter screen, and ventilation grooves are provided at the top and bottom of the substrate body.
[0011] As a further improvement of this utility model: the interior of the assembly shell is provided with a flow channel, and a cleaning mechanism is provided on one side of the flow channel.
[0012] As a further embodiment of this utility model: the cleaning mechanism includes a fine-pore filter screen, which is fixedly installed on one side of the mounting plate inside the mounting housing, and the outer wall of the rotating block is provided with a mounting groove.
[0013] As a further improvement of this utility model: an installation rod extends through the interior of the installation groove, and a rotating locking block is fixedly installed at one end of the installation rod that enters the installation groove.
[0014] As a further improvement of this utility model: a rubber sleeve is fixedly installed on the outer wall of the mounting rod, and a rubber protrusion is fixedly installed on the outer wall of the rubber sleeve.
[0015] Compared with the prior art, the beneficial effects of this utility model include:
[0016] 1. This utility model achieves dual heat dissipation by combining a cooling fan, a first copper foil, and a second copper foil, which conducts heat and dissipates heat while simultaneously providing air cooling. This improves the overall heat dissipation of the aluminum substrate and is suitable for thicker aluminum substrates or high-power devices. Furthermore, it is equipped with a micro motor to drive the rotating block to rotate back and forth, thereby adjusting the airflow direction and avoiding dead zones that could lead to heat accumulation and affect the heat dissipation effect.
[0017] 2. This utility model, through the cooperation of components such as a fine-pore filter screen, mounting groove, mounting rod, rotating block, rubber sleeve, and rubber protrusion, can achieve further filtration, preventing dust and impurities from entering the adsorption substrate body and affecting heat dissipation. With the drive of the rotating block, the rubber sleeve can rotate to contact the fine-pore filter screen, and the rubber protrusion can be inserted into the pores of the fine-pore filter screen to avoid blockage that affects gas flow and thus reduces the effect of air cooling. Attached Figure Description
[0018] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:
[0019] Figure 1 The schematic diagram shows an overall structural schematic diagram according to one embodiment of the present invention;
[0020] Figure 2 The schematic diagram shows the internal structure of the mounting bracket according to one embodiment of the present invention;
[0021] Figure 3 The schematic diagram shows a mounting plate structure according to one embodiment of the present invention;
[0022] Figure 4 The schematic diagram shows a flow channel structure according to one embodiment of the present invention;
[0023] Figure 5 The schematic diagram shows a rubber sleeve structure according to one embodiment of the present invention.
[0024] The following are the labeling elements in the diagram: 1. Mounting bracket; 2. Substrate body; 3. Heat-conducting pillar; 4. Heat dissipation mechanism; 401. Mounting shell; 402. Assembly shell; 403. Cooling fan; 404. Mounting plate; 405. First copper foil; 406. Second copper foil; 407. Micro motor; 408. Drive rod; 409. Transmission assembly; 410. Rotating rod; 411. Rotating block; 5. Coarse-pore filter screen; 6. Ventilation slot; 7. Flow channel; 8. Cleaning mechanism; 801. Fine-pore filter screen; 802. Mounting slot; 803. Mounting rod; 804. Rotating locking block; 805. Rubber sleeve; 806. Rubber protrusion. Detailed Implementation
[0025] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.
[0026] An embodiment of the present invention is shown in conjunction with the accompanying drawings.
[0027] Please see Figures 1 to 5A high-efficiency dual-heat dissipation type aluminum substrate for printing includes a mounting frame 1, a substrate body 2 inserted inside the mounting frame 1, heat-conducting pillars 3 fixedly mounted on both sides of the outer wall of the substrate body 2, and a heat dissipation mechanism 4 provided at one end of the mounting frame 1. The heat dissipation mechanism 4 includes a mounting shell 401, which is slidably connected to one end of the mounting frame 1. An assembly shell 402 is fixedly mounted at the end of the mounting shell 401 that is inserted into the mounting frame 1. A mounting plate 404 is fixedly mounted on one side of the inner wall of the assembly shell 402, and a cooling fan 403 is embedded in the inner wall of the mounting plate 404. The top of the substrate body 2 is fixedly mounted with a heat dissipation mechanism 403. The substrate body 2 is equipped with a first copper foil 405 and a second copper foil 406 is fixedly installed at the bottom. A micro motor 407 is embedded in the inner wall of the assembly shell 402. A drive rod 408 is fixedly installed at the power output end of the micro motor 407. A transmission assembly 409 is fixedly installed on the outer wall of the drive rod 408. A rotating rod 410 extends through the inside of the transmission assembly 409. A rotating block 411 is fixedly installed on the outer wall of one end of the rotating rod 410 that extends through the transmission assembly 409. A coarse-pore filter screen 5 is embedded in the outer wall of the mounting shell 401. Ventilation slots 6 are provided at both the top and bottom of the substrate body 2.
[0028] By adopting the above technical solution, the copper mounting bracket 1 and heat-conducting column 3 can initially conduct heat to the substrate body 2, and together with the first copper foil 405 and the second copper foil 406, a double-layer heat conduction and heat dissipation effect is achieved. Subsequently, the heat dissipation fan 403 embedded in the mounting plate 404 through the mounting shell 401 improves the air circulation, and the air circulation through the ventilation slot 6 achieves air cooling. The heat conduction and air cooling achieve a dual heat dissipation effect. The heat-conducting column 3 and the ventilation slot 6 reserve circulation space to facilitate air cooling, and together with the coarse-pore filter screen 5, a filtration effect is achieved. At the same time as air cooling, the micro motor 407 works, and with the cooperation of the drive rod 408 and several sets of transmission components 409, the corresponding rotating rod 410 of the transmission component 409 drives the rotating block 411 to rotate. The rotation speed is relatively slow and guides the airflow direction, avoiding dead corners inside the mounting bracket 1 that would prevent sufficient heat dissipation.
[0029] Specifically, such as Figures 3 to 5 As shown, the assembly housing 402 has a flow channel 7 inside, and a cleaning mechanism 8 is provided on one side of the flow channel 7. The cleaning mechanism 8 includes a fine-mesh filter screen 801, which is fixedly installed on one side of the mounting plate 404 inside the assembly housing 401. The outer wall of the rotating block 411 has a mounting groove 802, and a mounting rod 803 extends out of the mounting groove 802. A rotating locking block 804 is fixedly installed at one end of the mounting rod 803 that enters the mounting groove 802. A rubber sleeve 805 is fixedly installed on the outer wall of the mounting rod 803, and a rubber protrusion 806 is fixedly installed on the outer wall of the rubber sleeve 805.
[0030] By adopting the above technical solution, when the gas enters the mounting frame 1 through the flow channel 7, it is filtered again by the fine mesh filter 801 to prevent dust and impurities from entering the adsorption substrate body 2 and affecting the heat dissipation effect. The rotating block 411 rotates and engages with the mounting rod 803 through the mounting groove 802 and the rotating locking block 804. Following the rotation of the rotating block 411, the rubber sleeve 805 rotates and contacts the fine mesh filter 801. The rubber protrusion 806 is inserted into the pores of the fine mesh filter 801 to prevent blockage and affect gas flow. At the same time, the falling dust and impurities enter the mounting shell 401 for easy cleaning after disassembly and assembly. The micro motor 407 rotates at a slow speed to prevent the rubber sleeve 805 from rotating too fast.
[0031] Working principle: The mounting bracket 1 is made of copper for easy heat conduction and dissipation. It is fixed to the substrate body 2 via heat-conducting pillars 3, improving the heat conduction effect. Meanwhile, the substrate body 2 has an insulating layer on its exterior, and first copper foil 405 and second copper foil 406 are fixed at the top and bottom for initial heat dissipation. The mounting shell 401 and assembly shell 402 are integrated and are slidably engaged with the mounting bracket 1 and fixed with bolts for easy disassembly and maintenance. The cooling fan 403 embedded in the mounting plate 404 inside the mounting shell 401 improves airflow and prevents heat accumulation, achieving dual heat dissipation. Coarse-pore filter screens 5 are embedded at one end of the mounting bracket 1 and on the outer wall of the mounting shell 401 to form a convection space for airflow. This, combined with the ventilation slots 6 on the substrate body 2, facilitates airflow and improves heat dissipation. A micro motor 407 drives the drive rod 408 to rotate, which, through the active gear and driven gear... The gear-driven transmission assembly 409 drives the rotating rod 410 to slowly and reciprocate the rubber rotating block 411 inside the flow channel 7, thereby guiding the airflow and avoiding dead zones that could lead to heat buildup. The fine-pore filter 801 further filters the air, preventing dust and impurities from entering. The mounting slots 802 on the rotating block 411 are rotatably connected to the mounting rods 803 via rotating clips 804. The rubber sleeves 805 fixed to the outside of the mounting rods 803 can rotate to contact the fine-pore filter 801, and during rotation, the rubber protrusions 806 contact the pores of the fine-pore filter 801 to prevent clogging. Fallen impurities can enter the mounting housing 401. Regular disassembly, cleaning, and maintenance are required. The cooling fan 403 and the micro motor 407 are powered by cables connected to the equipment's own power supply system.
[0032] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.
Claims
1. A high-efficiency dual-heat dissipation type aluminum substrate for printing, characterized in that, The mounting bracket (1) includes a substrate body (2) inserted inside the mounting bracket (1), and heat-conducting columns (3) are fixedly installed on both sides of the outer wall of the substrate body (2). A heat dissipation mechanism (4) is provided at one end of the mounting bracket (1). The heat dissipation mechanism (4) includes a mounting shell (401), which is slidably connected to one end of the mounting frame (1). An assembly shell (402) is fixedly installed at one end of the mounting shell (401) that passes through the mounting frame (1). An mounting plate (404) is fixedly installed on one side inside the assembly shell (402), and a heat dissipation fan (403) is embedded in the inner wall of the mounting plate (404). A first copper foil (405) is fixedly installed at the top of the substrate body (2), and a second copper foil (406) is fixedly installed at the bottom of the substrate body (2).
2. The high-efficiency dual-heat dissipation type aluminum substrate for printing according to claim 1, characterized in that, The inner wall of the assembly shell (402) is fitted with a micro motor (407), and the power output end of the micro motor (407) is fixedly mounted with a drive rod (408).
3. The high-efficiency dual-heat dissipation type aluminum substrate for printing according to claim 2, characterized in that, A transmission assembly (409) is fixedly installed on the outer wall of the drive rod (408), and a rotating rod (410) extends through the inside of the transmission assembly (409). A rotating block (411) is fixedly installed on the outer wall of one end of the rotating rod (410) that extends through the transmission assembly (409).
4. The high-efficiency dual-heat dissipation type aluminum substrate for printing according to claim 1, characterized in that, The outer wall of the mounting shell (401) is fitted with a coarse-pore filter screen (5), and ventilation slots (6) are provided at the top and bottom of the substrate body (2).
5. The high-efficiency dual heat dissipation type aluminum substrate for printing according to claim 3, characterized in that, The assembly shell (402) has a flow channel (7) inside, and a cleaning mechanism (8) is provided on one side of the flow channel (7).
6. The high-efficiency dual heat dissipation type aluminum substrate for printing according to claim 5, characterized in that, The cleaning mechanism (8) includes a fine-mesh filter (801), which is fixedly installed on one side of the mounting plate (404) inside the mounting housing (401), and the outer wall of the rotating block (411) is provided with a mounting groove (802).
7. The high-efficiency dual-heat dissipation type aluminum substrate for printing according to claim 6, characterized in that, An installation rod (803) extends through the inside of the installation groove (802), and a rotating locking block (804) is fixedly installed at one end of the installation rod (803) that enters the installation groove (802).
8. The high-efficiency dual heat dissipation type aluminum substrate for printing according to claim 7, characterized in that, A rubber sleeve (805) is fixedly installed on the outer wall of the mounting rod (803), and a rubber protrusion (806) is fixedly installed on the outer wall of the rubber sleeve (805).