Cooling plate component, chip assembly, circuit board assembly and liquid cooling heat dissipation system

Abstract

Provided in the embodiments of the present application are a cooling plate component, a chip assembly, a circuit board assembly, a liquid cooling heat dissipation system and an electronic device. The cooling plate component comprises: a liquid inlet chamber, provided with a liquid inlet for a cooling liquid to flow in; a liquid return chamber, provided with a liquid outlet for the cooling liquid to flow out; and at least one plate-type heat exchange chamber, each plate-type heat exchange chamber being provided with a cooling liquid injection port that leads to the liquid inlet chamber and a cooling liquid return port that leads to the liquid return chamber. The at least one plate-type heat exchange chamber comprises a plurality of heat exchange zones, the heat exchange capacities of the plurality of heat exchange zones matching the thermal power density distribution of the heat exchange surface of a heat-generating electronic part, and at least two heat exchange zones among the plurality of heat exchange zones using different heat exchange structural forms. The technical solution of the embodiments of the present application can reduce the driving power consumption of liquid cooling heat dissipation while meeting the design requirements for a liquid cooling heat dissipation capacity.

Description

Cold plate components, chip assemblies, circuit board assemblies, and liquid cooling systems

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411629459.8, filed on November 14, 2024, with the invention title “Cold Plate Component, Chip Assembly, Circuit Board Assembly, and Liquid Cooling System”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a cold plate component, a chip assembly, a circuit board assembly, a liquid cooling system, and an electronic device. Background Technology

[0004] With the increasing integration of the electronics industry, the power density of chips is constantly increasing, leading to a sharp increase in the heat generated by electronic devices. Currently, traditional air cooling methods are approaching their heat dissipation limits and cannot meet the heat dissipation requirements of chips in scenarios with higher heat power density. Liquid cooling, on the other hand, has been widely used in electronic device heat dissipation due to its advantages such as high heat dissipation efficiency, low noise, energy saving, and compact structure.

[0005] For liquid cooling, how to reduce the driving power consumption of liquid cooling while meeting the design requirements for heat dissipation capacity is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] This application provides a cold plate component, a chip assembly, a circuit board assembly, a liquid cooling system, and an electronic device to reduce the driving power consumption of liquid cooling while meeting the design requirements for liquid cooling capacity.

[0007] According to one aspect of this application, a cold plate component is provided, comprising an inlet chamber, a return chamber, and at least one plate heat exchange chamber, wherein: the inlet chamber has an inlet for coolant to flow into; the return chamber has an outlet for coolant to flow out; each plate heat exchange chamber has a coolant injection port communicating with the inlet chamber and a coolant return port communicating with the return chamber; the at least one plate heat exchange chamber includes multiple heat exchange zones, the heat exchange capacity of the multiple heat exchange zones is matched with the heat power density distribution of the heat exchange surface of the heat-generating electronic component, and at least two of the multiple heat exchange zones adopt different heat exchange structures.

[0008] According to the technical solution of the embodiments of this application, the heat exchange capacity of multiple heat exchange zones is matched with the heat power density distribution of the heat exchange surface of the heat-generating electronic component. In this way, on the one hand, the heat exchange zone with higher heat exchange capacity can ensure the heat exchange effect of the higher heat power density area of ​​the heat-generating electronic component, thereby achieving the heat dissipation requirements in the higher heat power density area and realizing the purpose of efficient heat dissipation of the heat-generating electronic component; on the other hand, for the lower heat power density area of ​​the heat-generating electronic component, a heat exchange zone with relatively lower heat exchange capacity is designed, which can reduce voltage drop waste and save drive power consumption.

[0009] In some embodiments, the multiple heat exchange zones include at least two of the following: a first zone with a jet-type heat exchange structure, a second zone with a microchannel-type heat exchange structure, or a third zone with a topological flow channel-type heat exchange structure. The jet-type heat exchange structure impinges coolant onto the heat exchange surface via a jet, resulting in high flow velocity and low flow resistance, thus achieving high heat exchange efficiency and relatively uniform heat dissipation. The microchannel-type heat exchange structure features a large heat exchange area, high heat exchange efficiency, and high stability; however, the coolant experiences significant flow resistance within the microchannels, leading to less uniform heat dissipation along the flow direction. The topological flow channel-type heat exchange structure, through optimized design of the channel shape and arrangement, can achieve precise flow distribution, thereby achieving a more uniform and efficient heat dissipation effect. Incorporating different heat exchange structure forms into the cold plate component allows for the combination of their respective technological advantages, compensating for each other's shortcomings, thereby balancing the design requirements of liquid cooling capacity with savings in drive power consumption.

[0010] In some embodiments, at least one plate heat exchange cavity is a plate heat exchange cavity, and the plate heat exchange cavity includes a plurality of heat exchange partitions that are interconnected with each other. The plurality of heat exchange partitions include a first partition and a plurality of second partitions, wherein the first partition has a jet heat exchange structure, each of the plurality of second partitions has a microchannel heat exchange structure, the first partition is closer to the coolant inlet than the plurality of second partitions, and the first partition is farther away from the coolant return port than the plurality of second partitions; the coolant inlet is a jet orifice, and the jet direction of the jet orifice is toward the first partition.

[0011] In these embodiments, the first partition can be opposite to the higher heat power density region of the heat-generating electronic components, and the second partition can be opposite to the lower heat power density region of the heat-generating electronic components. After the coolant enters the plate heat exchange chamber through the coolant inlet, it first impacts the heat exchange surface of the first partition in a jet manner and exchanges heat with it, and then flows to the second partition, using its remaining heat capacity to exchange heat with the microchannel surface. Because the coolant has lower flow resistance and higher flow velocity in the first partition, the heat exchange efficiency of the first partition is higher and the heat dissipation capacity is more uniform. Therefore, it is more suitable for rapidly dissipating heat from the higher heat power density region of the heat-generating electronic components. In the second partition, although the coolant has relatively higher flow resistance and a slower flow velocity, the heat dissipation demand of the lower heat power density region of the heat-generating electronic components is relatively lower. Therefore, the second partition can also meet the heat dissipation capacity design requirements by utilizing the remaining heat capacity of the coolant, and the required pressure drop is also lower.

[0012] In some embodiments, at least one of the plurality of second zones may have a columnar microchannel heat exchange structure. In some embodiments, at least one of the plurality of second zones may have a toothed microchannel heat exchange structure. In some embodiments, at least one of the plurality of second zones may have a honeycomb microchannel heat exchange structure. Appropriate structural forms can be selected according to the heat dissipation capacity design requirements of the cold plate component in different heat exchange zones to achieve better heat dissipation and lower pressure drop.

[0013] In some embodiments, at least one plate heat exchange cavity is a plate heat exchange cavity, a plate heat exchange cavity includes a plurality of heat exchange partitions that are in communication with each other, the plurality of heat exchange partitions include a third partition, wherein the third partition is closer to the coolant inlet than the other heat exchange partitions, the third partition has a topological flow channel heat exchange structure, and the flow channel inlet of the topological flow channel heat exchange structure is in communication with the coolant inlet.

[0014] In these embodiments, the third zone can be located opposite to the zone with higher heat power density of the heat-generating electronic components. After the coolant enters the plate heat exchange chamber through the coolant inlet, it first undergoes optimization and adjustment of fluid parameters such as flow rate, flow direction, flow velocity, or pressure through a topological flow channel heat exchange structure. This allows the coolant to provide an appropriate pressure drop along the target flow direction while meeting the heat dissipation capacity design requirements of this zone, thus balancing the heat dissipation capacity with the flow resistance that the coolant needs to overcome to reach other connected zones, and meeting the coolant flow velocity or pressure requirements of other connected zones. Then, it flows to the remaining connected heat exchange zones, which can achieve a more efficient and uniform heat dissipation effect in each heat exchange zone and help save pressure drop.

[0015] In some embodiments, at least two of the multiple heat exchange zones are connected in parallel; and / or, at least two of the multiple heat exchange zones are connected in series. The individual heat exchange zones of the cold plate component and their connection methods can be specifically designed based on the heat power density distribution of the heat exchange surface of the heat-generating electronic components, enabling the cold plate component to achieve more efficient and uniform heat dissipation in each heat exchange zone and to save on pressure drop.

[0016] In some embodiments, at least one plate heat exchange cavity is a plurality of plate heat exchange cavities, which are arranged in a flat manner and spaced apart from each other by partition walls, and the plurality of plate heat exchange cavities define a plurality of heat exchange zones in a one-to-one correspondence.

[0017] In these embodiments, by designing a refined layout and precise flow distribution for multiple heat exchange zones, the heat capacity utilization rate of the coolant can be improved, thereby enhancing the heat dissipation efficiency of the cold plate component and effectively saving drive power consumption. Furthermore, since the coolant flows simultaneously within multiple plate heat exchange cavities without interference, the cold plate component can accommodate a larger heat exchange surface area, thus enabling the use of larger-sized heat-generating electronic components. Moreover, these design schemes can also be considered when the heat power density distribution on the heat exchange surface of the heat-generating electronic component is complex, or when a simplified internal structure of the plate heat exchange cavity is desired.

[0018] In some embodiments, at least a portion of the partition wall is planar, or at least a portion of the partition wall is a folded surface composed of multiple planar portions. The specific location, shape, and size of the partition wall are not limited, and can be determined, for example, by combining design parameters such as the specific layout of multiple heat exchange zones, design flow rate, and design velocity.

[0019] In some embodiments, the cold plate component further includes a bottom shell, a first component, a second component, and a third component, wherein the first component and the bottom shell seal to enclose at least one plate heat exchange cavity, the second component and the side of the first component opposite to the plate heat exchange cavity seal to enclose a liquid inlet cavity, and the third component and the side of the first component opposite to the plate heat exchange cavity and the side of the second component opposite to the liquid inlet cavity seal to enclose a liquid return cavity.

[0020] In these embodiments, the plate heat exchange chamber, the liquid inlet chamber, and the liquid return chamber are arranged in a stacked manner approximately orthogonal to the heat exchange surface of the heat-generating electronic component. This not only helps to shorten the flow path of the coolant in the cold plate component to further improve the heat dissipation effect, but also helps to reduce the overall thickness of the cold plate component, thereby reducing the space occupied by the cold plate component.

[0021] In some embodiments, the base shell is used to assemble and bond with the heat exchange surface of the heat-generating electronic component. For example, the two can be directly contacted and bonded together or bonded together with thermally conductive adhesive. This design facilitates flexible assembly and disassembly of the cold plate component and the heat-generating electronic component.

[0022] In some embodiments, the bottom shell and the heat exchange surface of the heating electronic component are an integral structure, wherein at least a portion of the heat exchange structure of the plurality of heat exchange zones is formed on the heat exchange surface of the heating electronic component.

[0023] Part of the shell of the cold plate component can be formed on the heat exchange surface of the heat-generating electronic component using additive manufacturing. At least a portion of the heat exchange structure can be formed on the heat exchange surface of the heat-generating electronic component by first additive manufacturing and then etching. This design can, on the one hand, reduce thermal resistance and further improve the heat dissipation effect of the heat-generating electronic component; on the other hand, it can also reduce the overall thickness of the cold plate component and the heat-generating electronic component, thereby reducing the volume of the integrated components; furthermore, it can also improve the structural strength of both the cold plate component and the heat-generating electronic component.

[0024] In some embodiments, the heat-generating electronic component is a chip, and at least a portion of the heat exchange structures of the multiple heat exchange zones are formed on the chip's package surface. Forming the heat exchange structures on the chip's package surface can reduce thermal resistance, further improving the chip's heat dissipation effect, and can also reduce the volume of the cold plate component integrated with the chip.

[0025] In some embodiments, the heat-generating electronic component is a chip, and at least a portion of the heat exchange structure of the multiple heat exchange zones is formed on the bare die surface of the chip. A portion of the housing of the cold plate component can be formed on the bare die surface using additive manufacturing, and at least a portion of the heat exchange structure can be formed on the bare die surface using a process of additive manufacturing followed by etching. This design, on the one hand, can further reduce thermal resistance, thereby further improving the chip's heat dissipation effect; on the other hand, it can also reduce the package size after the cold plate component and chip are integrated; furthermore, it can also improve the structural strength of both the cold plate component and the chip.

[0026] According to one aspect of this application, a chip assembly is provided, comprising: a chip and a cold plate component according to the foregoing embodiments, wherein at least a portion of the heat exchange structure of a plurality of heat exchange zones is formed on the package surface of the chip, or on the bare die surface of the chip. This chip assembly exhibits superior heat dissipation performance, requires less power for heat dissipation, and has a compact overall size.

[0027] According to one aspect of this application, a circuit board assembly is provided, comprising a circuit board, a heat-generating electronic component disposed on the circuit board, and a cold plate member according to any of the foregoing embodiments, the cold plate member being used for heat exchange with the heat-generating electronic component. In these embodiments, the heat dissipation effect of the heat-generating electronic component of the circuit board assembly is better, and the driving power consumption required for heat dissipation is lower.

[0028] According to one aspect of this application, a liquid cooling system is provided, comprising: a liquid storage tank connected in a circulation loop via pipelines, a pump, and a cold plate component according to any of the foregoing embodiments, and a heat exchanger for cooling the coolant after it has absorbed heat and increased in temperature in the circulation loop. This liquid cooling system can reliably dissipate heat from the heat-generating electronic components of electronic devices through the cold plate component, achieving excellent heat dissipation performance, and requiring relatively low power consumption for cooling.

[0029] According to one aspect of this application, an electronic device is provided, comprising: a heat-generating electronic component, and a liquid cooling system as described in the foregoing embodiment, wherein a cold plate component of the liquid cooling system is used for heat exchange with the heat-generating electronic component. This electronic device provides better heat dissipation for the heat-generating electronic component and requires less power consumption for heat dissipation. Attached Figure Description

[0030] Figure 1 is a schematic cross-sectional view of a cold plate component according to some embodiments of this application;

[0031] Figure 2 is a top view of a plurality of heat exchange zones of a cold plate component according to some embodiments of the present application;

[0032] Figure 3 is a top view of a plurality of heat exchange zones of a cold plate component according to some embodiments of the present application;

[0033] Figure 4A is a top view of a plurality of heat exchange zones of a cold plate component according to some embodiments of the present application;

[0034] Figure 4B is a schematic cross-sectional view of multiple heat exchange zones of a cold plate component according to some embodiments of the present application at point AA in Figure 4A;

[0035] Figure 5 is a schematic diagram of the integrated structure of the cold plate component and the heat-generating electronic component according to some embodiments of this application;

[0036] Figure 6 is a schematic diagram of the integrated structure of the cold plate component and the heat-generating electronic component according to some embodiments of this application;

[0037] Figure 7 is a schematic diagram of the structure of a circuit board assembly according to some embodiments of this application;

[0038] Figure 8 is a schematic diagram of the structure of a liquid cooling heat dissipation system according to some embodiments of this application;

[0039] Figure 9 is a schematic diagram of the structure of an electronic device according to some embodiments of this application.

[0040] Reference numerals: 100-Cold plate component; 10-Liquid inlet chamber; 11-Liquid inlet; 20-Liquid return chamber; 21-Liquid outlet; 30-Plate heat exchange chamber; 31-Coolant inlet; 32-Coolant return outlet; 33-Heat exchange zone; 500-Heat-generating electronic component; 501-Heat exchange surface; 501a-Higher heat power density zone; 501b-Lower heat power density zone; 330-Heat exchange structure; 331-First zone; 332-Second zone; 333-Third zone; 40-Partition wall; 50-Bottom shell; 51-First component; 52-Second component; 53-Third component; 200-Chip; 210-Bare die; 201-Packaging surface; 600-Chip assembly; 700-Circuit board assembly; 710-Circuit board; 800-Liquid cooling system; 810-Reservoir tank; 820-Pump; 830-Pipeline; 840 - Heat exchanger; 900 - Electronic equipment. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the application will be described in further detail below with reference to the accompanying drawings.

[0042] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0043] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0044] With the increasing integration of the electronics industry, the heat generation of electronic devices has increased dramatically. The heat power density of the heat exchange surfaces of some heat-generating electronic components is non-uniform. For example, based on the heat power density distribution of the heat exchange surface of a heat-generating electronic component, the surface can be roughly divided into high and low heat power density regions, or high, medium, and low heat power density regions. In this paper, heat power density can be understood as the flow of heat through a unit area per unit time. It can be used to describe both the intensity of a heat source (i.e., the rate of heat generation and the size of the heat source) and the intensity of heat conduction (i.e., the rate at which heat is transferred through a substance). Its SI unit is watts per square meter (W / m²).

[0045] In related technologies, the main structure of some liquid cooling heat dissipation systems includes a liquid storage tank, a pump, and a cold plate (often called a liquid cooling plate) connected in a circulation loop by pipes, as well as a heat exchanger. The liquid storage tank is used to store sufficient coolant, the pump is used to drive the coolant to circulate in the liquid storage tank, pipes, and cold plate, the pipes are used to provide the transport path for the coolant circulation, the cold plate is used to remove the heat transferred by the heat-generating electronic components through the flow of coolant inside it, and the heat exchanger is used to cool the coolant after it has absorbed heat and become heated.

[0046] In related technologies, cold plates typically employ microchannel cold plates or jet cold plates. Microchannel cold plates generally refer to cold plates with a microchannel equivalent diameter of approximately 10 to 1000 micrometers. The flow of coolant within the microchannels removes heat transferred from the heat-generating electronic components. Jet cold plates use a jet of coolant to impact the surface of the structure used for heat transfer with the heat-generating electronic components, thereby removing heat through the flow of the coolant.

[0047] The technical deficiency of the aforementioned technologies lies in the fact that the selection and design of the cold plate do not consider the differences in heat power density of the heat exchange surfaces of the heat-generating electronic components. This results in a mismatch between the heat dissipation capacity of different areas of the cold plate and the heat dissipation requirements of the heat exchange surfaces of the heat-generating electronic components. For example, the structural characteristics of microchannel cold plates result in greater flow resistance for the coolant, leading to a larger temperature rise in the coolant within the cold plate and uneven heat dissipation along its flow direction. Similarly, while jet cold plates can maximize pressure drop to meet the heat dissipation requirements of the heat-generating electronic components in higher heat power density areas (such as the aforementioned high heat power density areas), they also cause some pressure drop waste in lower heat power density areas (such as the aforementioned low heat power density areas), resulting in higher overall power consumption of the liquid cooling system, such as higher pump power consumption. In this paper, pressure drop can be understood as the hydraulic driving force applied to the fluid to meet the fluid flow rate.

[0048] In view of this, embodiments of this application provide a cold plate component, a chip assembly, a circuit board assembly, a liquid cooling system, and an electronic device, to reduce the driving power consumption of liquid cooling while meeting the design requirements for liquid cooling capacity. The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0049] Figure 1 shows a cross-sectional structural schematic diagram of a cold plate member 100 according to some embodiments of this application. In these embodiments, the cold plate component 100 includes an inlet chamber 10, a return chamber 20, and at least one plate heat exchange chamber 30 (shown as one in the figure), wherein: the inlet chamber 10 has an inlet 11 for coolant (the general flow direction of the coolant is indicated by a dashed arrow) to flow in; the return chamber 20 has an outlet 21 for coolant to flow out; in the at least one plate heat exchange chamber 30, each plate heat exchange chamber 30 has a coolant inlet 31 communicating with the inlet chamber 10 and a coolant return outlet 32 ​​communicating with the return chamber 20, and the at least one plate heat exchange chamber 30 includes a plurality of heat exchange zones 33 (shown as three in the figure), the heat exchange capacity of the plurality of heat exchange zones 33 is matched with the heat power density distribution of the heat exchange surface 501 of the heat-generating electronic component 500, and at least two of the plurality of heat exchange zones 33 adopt different heat exchange structures (the graphic style of the heat exchange structure 330 of each heat exchange zone 33 in Figure 1 is not used to represent the actual structure).

[0050] In this application embodiment, the specific product type of the heat-generating electronic component 500 may include, but is not limited to, CPU (central processing unit), GPU (graphics processing unit), high-power memory, NVMe (non-volatile memory express) hard disk, OCP (open compute project) network card, power supply, PCIe (peripheral component interconnect express) adapter card, or optical module, etc.

[0051] As shown in Figure 1, when the cold plate component 100 is in operation, the coolant sequentially passes through the inlet chamber 10, the plate heat exchange chamber 30, and the return chamber 20. Within the plate heat exchange chamber 30, it exchanges heat with the surface of the heat exchange structure 330, thereby carrying away the heat transferred by the heat-generating electronic component 500. In this embodiment, the coolant may be selected from, but is not limited to, pure water, ethylene glycol, propylene glycol, alcohol, ammonia, or some mixed solutions, such as a mixture of water and ethylene glycol, or a mixture of water and propylene glycol.

[0052] In this embodiment, at least one plate heat exchange cavity 30 is configured with multiple heat exchange zones 33. These multiple heat exchange zones 33 do not adopt completely identical heat exchange structures, and their heat exchange capabilities are matched with the heat power density distribution of the heat exchange surface 501 of the heat-generating electronic component 500. Thus, on the one hand, heat exchange zones 33 with higher heat exchange capabilities can ensure the heat exchange effect of the higher heat power density region 501a of the heat-generating electronic component 500, thereby achieving the heat dissipation requirements of the higher heat power density region 501a and realizing the purpose of efficient heat dissipation of the heat-generating electronic component 500. On the other hand, for the lower heat power density region 501b of the heat-generating electronic component 500, heat exchange zones 33 with relatively lower heat exchange capabilities are designed. This can reduce pressure drop waste and save drive power consumption. For example, the power consumption of the pump in the liquid cooling system 800 can be reduced by this design.

[0053] In the embodiments of this application, "heat exchange structure" can be understood as the type of heat exchange technology used to achieve heat exchange. For example, jet heat exchange structure, microchannel heat exchange structure, and topological flow channel heat exchange structure are heat exchange structure forms based on different heat exchange technology types. Different heat exchange structure forms differ in terms of heat exchange principle, heat exchange efficiency, heat exchange uniformity, pressure drop design, processing technology, and manufacturing cost. For example, the jet heat exchange structure impacts the coolant onto the heat exchange surface through a jet, resulting in high flow velocity and low flow resistance, thus exhibiting high heat exchange efficiency and relatively uniform heat dissipation capacity. The microchannel heat exchange structure features a large heat exchange area, high heat exchange efficiency, and high stability, but the coolant has high flow resistance in the microchannels, therefore, the heat dissipation capacity along the flow direction is not uniform enough. The topological flow channel heat exchange structure, through optimized design of the flow channel shape and arrangement, can achieve precise flow distribution, thereby achieving a more uniform and efficient heat dissipation effect.

[0054] In some embodiments of this application, the multiple heat exchange zones 33 may include at least two of the following: a first zone 331 with a jet-type heat exchange structure (as shown in FIG. 1), a second zone 332 with a microchannel-type heat exchange structure (as shown in FIG. 1), or a third zone 333 with a topological flow channel-type heat exchange structure (as shown in FIG. 2). In these embodiments, different forms of heat exchange structures can be designed and matched to different heat exchange zones 33 based on the heat power density distribution of the heat exchange surface 501 of the heat-generating electronic component 500. This achieves both the heat dissipation design requirements of the cold plate component 100 and saves the driving power consumption of liquid cooling.

[0055] In this embodiment of the application, the internal structure of at least one plate heat exchange cavity 30 of the cold plate component 100 is configured to form a plurality of heat exchange partitions 33. The plurality of heat exchange partitions 33 may be spaced apart from each other, independent of each other, or may have a certain connection relationship.

[0056] As shown in Figure 1, in some embodiments of this application, the cold plate component 100 specifically includes a plate heat exchange cavity 30, which includes multiple heat exchange zones 33 that are interconnected. The multiple heat exchange zones 33 may include a first zone 331 and multiple second zones 332 (two second zones 332 are shown in the figure). The first zone 331 has a jet-type heat exchange structure 330 (the graphic style shown is not intended to represent the actual structure), and each second zone 332 has a microchannel-type heat exchange structure 330 (the graphic style shown is not intended to represent the actual structure). The first zone 331 is closer to the coolant inlet 31 than the multiple second zones 332, and is further away from the coolant return outlet 32 ​​than the multiple second zones 332. In this embodiment, the coolant inlet 31 is a jet orifice, and the jet direction of the jet orifice is towards the first zone 331. In this embodiment of the application, the interconnection of multiple heat exchange zones 33 can be understood as follows: for any two heat exchange zones 33, they can be directly connected or indirectly connected through other heat exchange zones 33.

[0057] In these embodiments, the first partition 331 may be opposite to the higher heat power density region 501a of the heat-generating electronic component 500, and the second partition 332 may be opposite to the lower heat power density region 501b of the heat-generating electronic component 500. After the coolant enters the plate heat exchange chamber 30 through the coolant injection port 31, it first impacts the heat exchange surface of the first partition 331 in a jet manner and exchanges heat with it, and then flows to the second partition 332 to exchange heat with the microchannel surface using the remaining heat capacity. Because the coolant has a lower flow resistance and a higher flow rate in the first zone 331, the heat exchange efficiency of the first zone 331 is higher and the heat dissipation capacity is more uniform. Therefore, it is more suitable for rapidly dissipating heat in the high heat power density region 501a of the heat-generating electronic component 500. In the second zone 332, although the coolant has a relatively higher flow resistance and a slower flow rate, the heat dissipation requirements of the low heat power density region 501b of the heat-generating electronic component 500 are relatively lower. Therefore, the second zone 332 can also meet the heat dissipation capacity design requirements by utilizing the remaining heat capacity of the coolant, and the required pressure drop is also lower.

[0058] The embodiments of this application do not limit the specific structural form of the microchannel heat exchange structure. For example, the microchannel heat exchange structure can be a columnar microchannel heat exchange structure, in which the inner wall of the microchannel has multiple columnar protrusions; or, the microchannel heat exchange structure can be a toothed microchannel heat exchange structure, in which the inner wall of the microchannel has multiple toothed protrusions; or, the microchannel heat exchange structure can be a honeycomb microchannel heat exchange structure, in which the inner wall of the microchannel has a honeycomb structure.

[0059] In some embodiments of this application, at least one of the plurality of second partitions 332 may be designed with a columnar microchannel heat exchange structure. In other embodiments of this application, at least one of the plurality of second partitions 332 may be designed with a toothed microchannel heat exchange structure, wherein the inner wall of the microchannel has a plurality of toothed protrusions. In still other embodiments of this application, at least one of the plurality of second partitions 332 is designed with a columnar microchannel heat exchange structure, and at least one other second partition 332 is designed with a toothed microchannel heat exchange structure. Appropriate structural forms can be selected according to the heat dissipation capacity design requirements of the cold plate member 100 in different heat exchange partitions 33 to obtain better heat dissipation effect and lower pressure drop.

[0060] Figure 2 shows a top view of a plurality of heat exchange zones 33 of a cold plate member 100 according to some embodiments of this application. In these embodiments, the cold plate member 100 may include a plate heat exchange cavity 30, which includes a plurality of heat exchange zones 33 that are interconnected. The plurality of heat exchange zones 33 may include a third zone 333, which is closer to the coolant inlet 31 and further away from the coolant return outlet 32 ​​than the other heat exchange zones 33. Furthermore, the third zone 333 has a topological flow channel heat exchange structure (the graphic style shown in the figure is not used to represent the actual structure), and the flow channel inlet of the topological flow channel heat exchange structure is connected to the coolant inlet 31.

[0061] In these embodiments, the third zone 333 can be opposite to the zone with higher heat power density of the heat-generating electronic components (not shown in the figure). After the coolant enters the plate heat exchange chamber 30 through the coolant inlet 31, it first undergoes optimization and adjustment of fluid parameters such as flow rate, flow direction, flow velocity, or pressure through the topological flow channel heat exchange structure. This allows the coolant to provide an appropriate pressure drop along the target flow direction while meeting the heat dissipation capacity design requirements of this zone, so as to balance the heat dissipation capacity with the flow resistance that the coolant needs to overcome to reach other connected zones, and meet the requirements of other connected zones for coolant flow velocity or pressure. Then, it flows to the remaining connected heat exchange zones 33. This can achieve a more efficient and uniform heat dissipation effect in each heat exchange zone 33 and help save pressure drop.

[0062] In this embodiment of the application, multiple heat exchange zones are interconnected, wherein at least two heat exchange zones (such as the first zone 331 and one of the second zones 332 in Figure 1) can be connected in series, so that the coolant can pass through the at least two heat exchange zones connected in series in sequence.

[0063] In this embodiment of the application, multiple heat exchange zones are interconnected, wherein at least two heat exchange zones (such as the two second zones 332 in Figure 1) can be connected in parallel, so that the coolant can pass through the at least two heat exchange zones connected in parallel.

[0064] In some embodiments of this application, multiple heat exchange zones can also be connected in a combination of parallel and series connections. For example, some heat exchange zones are connected in series, and some heat exchange zones are connected in parallel.

[0065] The heat exchange zones 33 of the cold plate component 100 and their connection methods can be specifically designed based on the heat power density distribution of the heat exchange surface of the heat-generating electronic components, so that the cold plate component 100 has a more efficient and uniform heat dissipation effect in each heat exchange zone 33 and achieves the effect of saving pressure drop.

[0066] Figure 3 shows a top view of a plurality of heat exchange zones 33 of a cold plate component 100 according to some embodiments of this application. The cold plate component 100 includes a plurality of plate heat exchange cavities 30, which are arranged in a flat manner and spaced apart from each other by partition walls 40. Each plate heat exchange cavity 30 defines a plurality of heat exchange zones 33 in a one-to-one correspondence; that is, each plate heat exchange cavity 30 corresponds to one heat exchange zone 33. In some embodiments, to simplify the structure of the cold plate component 100, the plurality of plate heat exchange cavities 30 may be connected to the same inlet cavity and the same return cavity. In other embodiments, the plurality of plate heat exchange cavities 30 may be connected to different inlet cavities and / or different return cavities. The specific number and corresponding connection relationships of the plate heat exchange cavities, inlet cavities, and return cavities are not specifically limited in the embodiments of this application.

[0067] In this embodiment, partition walls separate multiple plate heat exchange cavities, making them independent of each other. The specific shape of the partition walls is not limited; for example, at least a portion of the partition wall may be planar, or at least a portion may be a folded surface composed of multiple planar parts. Furthermore, at least a portion of the partition wall may also be other shapes, such as curved surfaces. The specific arrangement, shape, and size of the partition walls are not limited; for example, they can be determined by combining design parameters such as the specific layout of multiple heat exchange zones, design flow rate, and design velocity.

[0068] Referring to Figure 3, as an example, the cold plate component 100 includes nine heat exchange zones 33 arranged in a flat manner and spaced apart from each other by partition walls 40. Among the nine heat exchange zones 33, the central heat exchange zone 33 has a jet-type heat exchange structure, and the remaining heat exchange zones 33 have a microchannel-type heat exchange structure and are arranged in a centrally symmetrical manner. The heat exchange capacity of each of the nine heat exchange zones 33 is matched with the heat power density distribution of the heat exchange surface of the heat-generating electronic component.

[0069] In these embodiments, by designing a refined layout and precise flow distribution for multiple heat exchange zones 33, the heat capacity utilization rate of the coolant can be improved, thereby increasing the heat dissipation efficiency of the cold plate component 100 and effectively saving drive power consumption. Furthermore, since the coolant flows simultaneously within multiple plate heat exchange cavities 30 without interference, the cold plate component 100 can accommodate a larger heat exchange surface area, thus enabling the use of larger-sized heat-generating electronic components. Moreover, these design schemes can also be considered when the heat power density distribution of the heat exchange surface of the heat-generating electronic component is complex, or when a simplified internal structure of the plate heat exchange cavity 30 is desired.

[0070] Referring to Figures 4A and 4B, where Figure 4A is a top view of a plurality of heat exchange zones 33 of a cold plate member 100 according to some embodiments of the present application, and Figure 4B is a cross-sectional view at point AA in Figure 4A. In these embodiments, based on the heat power density distribution of the heat exchange surface of the heat-generating electronic components, the cold plate member 100 is designed to include four plate heat exchange cavities 30 arranged in a flat manner and spaced apart from each other by partition walls 40. Each plate heat exchange cavity 30 includes six interconnected heat exchange zones 33, which sequentially employ a toothed microchannel heat exchange structure, a columnar microchannel heat exchange structure, a jet heat exchange structure, a columnar microchannel heat exchange structure, a toothed microchannel heat exchange structure, and a columnar microchannel heat exchange structure. The structures of adjacent plate heat exchange cavities 30 exhibit central symmetry. In these embodiments, the cold plate member 100 is designed to accommodate multiple discontinuous high heat power density areas of the heat-generating electronic components. Simultaneously, because the plate heat exchange cavities 30 are separated by partition walls 40, the mixing of coolants in these high heat power density areas can be avoided, thus preventing thermal crosstalk. As shown in Figure 4A, as an example, three partition walls 40 are illustrated, with the middle partition wall 40 being planar and the two side partition walls 40 being folded surfaces.

[0071] This application does not limit the specific structural form and manufacturing process of the liquid inlet chamber, liquid return chamber, and plate heat exchange chamber of the cold plate component. In some embodiments, as shown in FIG1, the cold plate component 100 further includes a bottom shell 50, a first component 51, a second component 52, and a third component 53, wherein the first component 51 and the bottom shell 50 seal and enclose the plate heat exchange chamber 30, the second component 52 and the side of the first component 51 opposite to the plate heat exchange chamber 30 seal and enclose the liquid inlet chamber 10, and the third component 53 and the side of the first component 51 opposite to the plate heat exchange chamber 30 and the side of the second component 52 opposite to the liquid inlet chamber 10 seal and enclose the liquid return chamber 20. In these embodiments, the plate heat exchange chamber 30, the liquid inlet chamber 10, and the liquid return chamber 20 are arranged in a generally perpendicular direction to the heat exchange surface 501 of the heat-generating electronic component 500. This not only helps to shorten the flow path of the coolant in the cold plate component 100 to further improve the heat dissipation effect, but also helps to reduce the overall thickness of the cold plate component 100, thereby reducing the space occupied by the cold plate component 100.

[0072] As shown in Figure 1, in some embodiments of this application, the cold plate component 100 and the heating electronic component 500 can be two independent components in an electronic device, which are assembled and bonded together. The bottom shell 50 and the heat exchange surface 501 of the heating electronic component 500 are assembled and bonded together, for example, through direct contact or by bonding with thermally conductive adhesive. This design facilitates flexible assembly and disassembly of the cold plate component 100 and the heating electronic component 500.

[0073] As shown in Figure 5, in some embodiments of this application, the cold plate component 100 can be structurally integrated with the heating electronic component 500, wherein the bottom shell 50 and the heat exchange surface 501 of the heating electronic component 500 are integrally formed, and at least a portion of the heat exchange structure of the plurality of heat exchange zones 33 can be formed on the heat exchange surface 501 of the heating electronic component 500. For example, a portion of the shell of the cold plate component 100 can be formed on the heat exchange surface 501 of the heating electronic component 500 by additive manufacturing, and at least a portion of the heat exchange structure (such as a microchannel heat exchange structure or a jet heat exchange structure) can be formed on the heat exchange surface 501 of the heating electronic component 500 by additive manufacturing followed by etching. This design has several advantages. First, it reduces thermal resistance (thermal resistance is the ratio between the temperature difference between the two ends of an object and the heat power of the heat source when heat is transferred through it), further improving the heat dissipation effect of the heat-generating electronic component 500. Second, it reduces the overall thickness of the cold plate component 100 and the heat-generating electronic component 500, thereby reducing the volume of the two components after integration. Third, it also improves the structural strength of the cold plate component 100 and the heat-generating electronic component 500.

[0074] As shown in Figure 5, in some embodiments of this application, the cold plate component 100 can be structurally integrated with the heat-generating electronic component 500, wherein the heat-generating electronic component 500 is a chip 200, and at least a portion of the heat exchange structure of the plurality of heat exchange zones 33 can be formed on the package surface 201 of the chip 200. The main structure of the chip 200 includes a bare die 210 and a package structure. Forming the heat exchange structure on the package surface 201 of the chip 200 can reduce thermal resistance and further improve the heat dissipation effect of the chip 200, and can also reduce the volume of the cold plate component 100 after integration with the chip 200.

[0075] As shown in Figure 6, in some embodiments of this application, the cold plate component 100 can be structurally integrated with the heat-generating electronic component 500, wherein the heat-generating electronic component 500 is a chip 200, and at least a portion of the heat exchange structure of the plurality of heat exchange zones 33 is formed on the surface of the bare die 210 of the chip 200. In these embodiments, the heat exchange structure is first formed on the surface of the bare die 210 of the chip 200, and then the integrated structure of the two is packaged. For example, a portion of the shell of the cold plate component 100 can be formed on the surface of the bare die 210 by additive manufacturing, and at least a portion of the heat exchange structure (such as a microchannel heat exchange structure or a jet heat exchange structure) can be formed on the surface of the bare die 210 by additive manufacturing followed by etching. This design, on the one hand, can further reduce the thermal resistance, thereby further improving the heat dissipation effect of the chip 200; on the other hand, it can also reduce the package volume after the cold plate component 100 and the chip 200 are integrated; and furthermore, it can also improve the structural strength of the cold plate component 100 and the chip 200.

[0076] According to some embodiments of this application, as shown in FIG5 or FIG6, a chip assembly 600 is also provided, which includes an integrated chip 200 and a cold plate component 100. This chip assembly 600 has better heat dissipation performance, requires less power for heat dissipation, and has a smaller overall size.

[0077] According to some embodiments of this application, as shown in FIG. 7, a circuit board assembly 700 is also provided, which includes a circuit board 710, a heat-generating electronic component 500 disposed on the circuit board 710, and a cold plate component 100 disposed on the circuit board 710 according to any of the foregoing embodiments, wherein the cold plate component 100 is used for heat exchange with the heat-generating electronic component 500. In these embodiments, the heat dissipation effect of the heat-generating electronic component 500 of the circuit board assembly 700 is better, and the driving power consumption required for heat dissipation is lower. The heat-generating electronic component 500 may include, but is not limited to, a CPU, GPU, high-power memory, NVMe hard drive, OCP network card, power supply, PCIe adapter card, or optical module.

[0078] According to some embodiments of this application, as shown in FIG8, a liquid cooling heat dissipation system 800 is also provided, which includes a liquid storage tank 810, a pump 820, and a cold plate component 100 according to any of the foregoing embodiments, all connected in a circulation loop via pipes 830. In some embodiments, as shown in FIG8, the liquid cooling heat dissipation system 800 may also be configured with a heat exchanger 840 for cooling the coolant after heat absorption and heating, such as a heat exchange fin assembly, a heat exchange fan, or a cold water tank, etc., which are not specifically limited in this application.

[0079] The liquid cooling system 800 can reliably dissipate heat from the heat-generating electronic components of electronic devices through the cold plate component 100, with good heat dissipation effect and low power consumption required for heat dissipation (such as pump power consumption).

[0080] The liquid cooling system 800 may include one or more cold plate components 100. In some embodiments (not illustrated in the accompanying drawings), the liquid cooling system includes multiple cold plate components arranged in parallel, through which coolant can flow simultaneously to cool different heat-generating electronic components at the same time, thus broadening the application range of heat dissipation.

[0081] According to some embodiments of this application, as shown in FIG9, an electronic device 900 is also provided, which includes a heat-generating electronic component 500 and a liquid cooling system 800 according to the foregoing embodiments, wherein the cold plate component 100 of the liquid cooling system 800 is used for heat exchange with the heat-generating electronic component 500. The heat-generating electronic component 500 of this electronic device 900 has better heat dissipation effect, and the driving power required for heat dissipation is lower. The heat-generating electronic component 500 may include, but is not limited to, a CPU, GPU, high-power memory, NVMe hard drive, OCP network card, power supply, PCIe adapter card, or optical module, etc.

[0082] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A cold plate member, characterized by, include: The inlet chamber has an inlet for coolant to flow in; The return chamber has an outlet for coolant to flow out. as well as At least one plate heat exchange chamber, wherein each plate heat exchange chamber has a coolant inlet communicating with the inlet chamber and a coolant return outlet communicating with the return chamber, the at least one plate heat exchange chamber includes multiple heat exchange zones, the heat exchange capacity of the multiple heat exchange zones is matched with the heat power density distribution of the heat exchange surface of the heat-generating electronic component, and at least two of the multiple heat exchange zones adopt different heat exchange structures.

2. The cold plate member of claim 1, wherein, The plurality of heat exchange zones includes at least two of the following: The first zone has a jet-type heat exchange structure, the second zone has a microchannel-type heat exchange structure, or the third zone has a topological flow channel-type heat exchange structure.

3. The cold-rolled plate component according to claim 1, characterized in that, The at least one plate heat exchange cavity is a single plate heat exchange cavity, which includes a plurality of heat exchange zones that are interconnected. The plurality of heat exchange zones include a first zone and a plurality of second zones, wherein... The first partition has a jet-type heat exchange structure, each of the plurality of second partitions has a microchannel-type heat exchange structure, the first partition is closer to the coolant inlet than the plurality of second partitions, and the first partition is farther away from the coolant return outlet than the plurality of second partitions. The coolant inlet is a jet orifice, and the jet direction of the jet orifice is toward the first partition.

4. The cold-rolled plate component according to claim 3, characterized in that, At least one of the plurality of second partitions has a columnar microchannel heat exchange structure; and / or At least one of the plurality of second partitions has a toothed microchannel heat exchange structure.

5. The cold-rolled plate component according to claim 1, characterized in that, The at least one plate heat exchange cavity is a single plate heat exchange cavity, which includes a plurality of heat exchange zones that are interconnected, and the plurality of heat exchange zones includes a third zone, wherein... The third partition is closer to the coolant injection port than the other heat exchange partitions. The third partition has a topological flow channel heat exchange structure, and the flow channel inlet of the topological flow channel heat exchange structure is connected to the coolant injection port.

6. The cold-rolled plate component according to any one of claims 3 to 5, characterized in that, At least two of the plurality of heat exchange zones are connected in parallel; and / or At least two of the plurality of heat exchange zones are connected in series.

7. The cold-rolled plate component according to claim 1, characterized in that, The at least one plate heat exchange cavity is a plurality of plate heat exchange cavities, which are arranged in a flat manner and separated from each other by partition walls. The plurality of plate heat exchange cavities define the plurality of heat exchange zones in a one-to-one correspondence.

8. The cold-rolled plate component according to claim 7, characterized in that, At least a portion of the partition wall is planar; or At least a portion of the partition wall is a folded surface composed of multiple planar parts.

9. The cold plate member of any one of claims 1-8, wherein, Also includes: Bottom shell; The first component, together with the bottom shell, seals and encloses at least one plate heat exchange cavity; The second component, together with the side of the first component facing away from the plate heat exchanger, seals and encloses the liquid inlet cavity; as well as The third component, together with the side of the first component facing away from the plate heat exchange cavity and the side of the second component facing away from the liquid inlet cavity, seals and encloses the liquid return cavity.

10. The cold-rolled plate component according to claim 9, characterized in that, The bottom shell is used to assemble and fit with the heat exchange surface of the heating electronic component.

11. The cold-rolled plate component according to claim 9, characterized in that, The bottom shell and the heat exchange surface of the heating electronic component are an integral structure, wherein at least a portion of the heat exchange structure of the plurality of heat exchange zones is formed on the heat exchange surface of the heating electronic component.

12. The cold-rolled plate component according to claim 11, characterized in that, The heat-generating electronic component is a chip, and at least a portion of the heat exchange structure of the plurality of heat exchange zones is formed on the package surface of the chip.

13. The cold-rolled plate component according to claim 11, characterized in that, The heat-generating electronic component is a chip, and at least a portion of the heat exchange structure of the plurality of heat exchange zones is formed on the bare surface of the chip.

14. A chip assembly, characterized by include: chip; as well as The cold plate component according to claim 12 or 13.

15. A circuit board assembly, characterized by include: Circuit board; Heating electronic components are located on the circuit board; as well as The cold plate component according to any one of claims 1 to 13 is used for heat exchange with the heat-generating electronic component.

16. A liquid cooling heat dissipation system, characterized in that, include: A liquid storage tank, a pump, and a cold plate component according to any one of claims 1 to 13 are connected in a circulation loop via pipelines. as well as A heat exchanger used to cool the coolant that has absorbed heat and increased in temperature in the circulating loop.

17. An electronic device, comprising: include: Heating electronic components; as well as According to claim 16, the liquid cooling heat dissipation system, wherein the cold plate component of the liquid cooling heat dissipation system is used for heat exchange with the heat-generating electronic component.

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