Electronic control assembly, electric pump and preparation method for electric pump

Abstract

An electronic control assembly, an electric pump and a preparation method for the electric pump. The electronic control assembly comprises a circuit board, an electronic component and a protective portion, wherein the electronic component comprises pins, the pins being fixedly connected to the circuit board; the electronic component has a lower surface, and in the axial direction of the electronic control assembly, there is a first gap between the lower surface and the circuit board; the electronic component has a second gap; and the protective portion comprises a sealing portion, and the sealing portion comprises a first sealing portion and a second sealing portion, the first sealing portion being located at the first gap, the second sealing portion being located at the second gap, and the first sealing portion being connected to the second sealing portion. The present application has the characteristic of the protective effect on the electronic component being relatively good.

Description

Electrical control components, electric pumps, and methods for manufacturing electric pumps

[0001] This application claims priority to Chinese Patent Application No. 202411745921.0, filed on November 29, 2024, entitled "Electrical Control Component, Method for Preparing Electrical Control Component and Electric Pump Thereof", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of vehicles, and more particularly to electronic control components, electric pumps, and methods for manufacturing electric pumps. Background Technology

[0003] Electric pumps primarily provide a power source for a vehicle's lubrication and / or cooling systems. An electric pump includes an electronic control assembly and an electronic control chamber. The electronic control assembly is located within the electronic control chamber. When the electric pump is operating, the electronic control chamber can contain a working medium. The electronic control assembly includes an insulating layer, a substrate, and multiple electronic components. The substrate and electronic components are fixedly connected. The insulating layer covers the surface of the electronic components to isolate the working medium from the electronic components. However, the gap between the electronic components and the substrate is difficult to completely fill, and the working medium may seep into the electronic components, causing them to fail. Summary of the Invention

[0004] When filling the gaps between electronic components and the substrate, impurities may be adsorbed onto the surface of the coating formed during the filling process, causing coating delamination and insufficient adhesion. This affects the protection of electronic components, and the working medium may penetrate into the electronic components, causing them to fail. Therefore, this application provides an electronic control component that improves the protection of electronic components.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] An electronic control assembly includes a circuit board, electronic components, and a protective portion. The electronic components include pins fixedly connected to the circuit board. Each electronic component has a lower surface, and a first gap exists between the lower surface and the circuit board in the axial direction of the electronic control assembly. The electronic component also has a second gap. The protective portion includes a sealing portion, comprising a first sealing portion and a second sealing portion. The first sealing portion is located at the first gap and is sealed to the electronic component and the circuit board. The second sealing portion is located at the second gap and is sealed to the electronic component. The first sealing portion is connected to the second sealing portion.

[0007] In the above technical solution, there is a first gap between the lower surface of the electronic component and the circuit board, and the electronic component has a second gap. The protective part includes a sealing part, which includes a first sealing part and a second sealing part. The first sealing part is located in the first gap and is sealed to the electronic component and the circuit board. The second sealing part is located in the second gap and is sealed to the electronic component. The first sealing part is connected to the second sealing part. The first gap can be filled by the first sealing part, and the second gap can be filled by the second sealing part. External working media are not easily penetrated into the interior of the electronic component, which is beneficial to improving the protection of the electronic component.

[0008] An electric pump has a first chamber and a second chamber, and an inlet channel communicating with the first chamber and the second chamber. The electric pump includes an electronic control assembly located in the second chamber. The electronic control assembly includes a circuit board, electronic components, and a protective portion. The electronic components include pins fixedly connected to the circuit board. The electronic components have a lower surface, and a first gap exists between the lower surface and the circuit board in the axial direction of the electronic control assembly. The electronic components have a second gap. The protective portion includes a sealing portion, which includes a first sealing portion and a second sealing portion. The first sealing portion is located in the first gap and is sealed to the electronic components and the circuit board. The second sealing portion is located in the second gap and is sealed to the electronic components. The first sealing portion is connected to the second sealing portion.

[0009] In the above technical solution, there is a first gap between the lower surface of the electronic component and the circuit board, and the electronic component has a second gap. The protective part includes a sealing part, which includes a first sealing part and a second sealing part. The first sealing part is located in the first gap and is sealed to the electronic component and the circuit board. The second sealing part is located in the second gap and is connected to the first sealing part. The first gap can be sealed and filled by the first sealing part, and the second sealing part is sealed and connected to the electronic component. The second gap can be sealed and filled by the second sealing part. When the electric pump is working, the working medium can flow into the second chamber. The working medium is not easy to penetrate into the interior of the electronic component, which is beneficial to improving the protection of the electronic component.

[0010] A method for manufacturing an electric pump, the method comprising:

[0011] A first spacer is formed by fixing electronic components and a circuit board together, and a medium is filled into the first spacer and a second spacer in the electronic components that are in communication with the first spacer;

[0012] The medium is cured to form a sealing portion.

[0013] In the above technical solution, a first gap is formed by fixing electronic components and circuit boards, a filling medium is filled into the first gap and the second gap in the electronic components connected to the first gap, and a curing medium forms a sealing part. The first gap and the second gap can be filled by the sealing part, and the external working medium is not easy to penetrate into the interior of the electronic components, which is beneficial to improving the protection of the electronic components. Attached Figure Description

[0014] Figure 1 is a cross-sectional schematic diagram of an embodiment of the electric pump of this application;

[0015] Figure 2 is a schematic diagram of the electronic control components in Figure 1;

[0016] Figure 3 is a schematic diagram of an embodiment of an electronic component;

[0017] Figure 4 is a schematic diagram of the insulating base in Figure 3;

[0018] Figure 5 is a schematic diagram of the electronic control components without protective coating.

[0019] Figure 6 is a cross-sectional schematic diagram of an embodiment of the electronic control component;

[0020] Figure 7 is a cross-sectional schematic diagram of another embodiment of the electronic control component;

[0021] Figure 8 is a cross-sectional schematic diagram of another embodiment of the electronic control component.

[0022] Reference numerals: 1. Pump housing; 11. Motor housing; 12. Bottom cover; 14. Pump cover; 141. Inlet channel; 4. Pump rotor; 5. Stator assembly; 6. Motor rotor; 7. Shaft; 8. Electrical control assembly; 81. Circuit board; 82. Electronic components; 820. Receiving cavity; 821. Pin; 822. Lower surface; 823. Second interval; 8231. First sub-interval; 8232. Second sub-interval; 8233. Third sub-interval; 8234. 824. Fourth partition; 825. Protective part; 826. Electrolyte solution; 827. Shell; 828. Insulating base; 829. Through hole; 820. Groove; 821. End; 822. Protective part; 833. Sealing part; 834. First sealing part; 835. Second sealing part; 836. Third sealing part; 837. Bottom; 838. Side; 839. Insulating part; 84. First partition; 20. First cavity; 30. Second cavity. Detailed Implementation

[0023] To enable those skilled in the art to better understand the technical solution of this application, the embodiments of this application are further described in detail below. The directional terms such as "upper" and "lower" used herein are defined by the relative positions of the components shown in the accompanying drawings, and are merely for the purpose of clearly expressing the technical solution. It should be understood that the directional terms used herein should not limit the scope of protection claimed in this application.

[0024] Electric pumps can be applied to automotive lubrication and / or cooling systems, providing circulating power for the working medium in these systems, which in turn provide lubricating oil and / or cooling oil to the transmission system. In this application, "A and B fixed connection" means that there is no relative displacement between A and B after the connection, such as A and B being welded together; "A and B limiting connection" means that A restricts B's movement in a certain direction, or B restricts A's movement in a certain direction.

[0025] Referring to Figures 1 and 2, the electric pump includes a pump housing 1, which includes a pump cover 14, a motor housing 11, and a bottom cover 12. The pump cover 14 is fixedly connected to the motor housing 11, for example, by screws or bolts. Alternatively, the pump cover 14 and motor housing 11 can be connected by other methods, such as plug-in or snap-fit. The motor housing 11 is also fixedly connected to the bottom cover 12, for example, by screws or bolts, which facilitates the assembly and disassembly of the electric pump. The electric pump includes a pump rotor 4, a stator assembly 5, a motor rotor 6, a shaft 7, and an electrical control assembly 8. The stator assembly 5 is located radially outside the motor rotor 6. The shaft 7 is drively connected to the motor rotor 6. The electric pump has a first chamber 20 and a second chamber 30, which communicate with each other. The electric pump also includes an inlet channel 141, which communicates with the first chamber 20. The pump rotor 4 (or at least part of the pump rotor 4) is located in the first chamber 20, and at least part of the electrical control assembly 8, the motor rotor 6 (or at least part of the motor rotor 6), at least part of the shaft 7, and the stator assembly 5 (or at least part of the stator assembly 5) are located in the second chamber 30. The electrical control assembly 8 and the stator assembly 5 are located in the same chamber, which can reduce the size of the electric pump in the axial direction, making the structure compact and thus reducing the production cost of the electric pump. When the electric pump is working, the electronic control component 8 controls the current of the stator component 5 to change according to a predetermined pattern, thereby controlling the stator component 5 to generate a changing excitation magnetic field. The motor rotor 6 rotates under the action of the excitation magnetic field. The motor rotor 6 can directly or indirectly drive the pump rotor 4 to rotate. When the pump rotor 4 rotates, the volume of the hydraulic chamber of the pump rotor 4 will gradually increase, thus forming a partial vacuum. In this way, the working medium in the inlet channel 141 will be sucked into the hydraulic chamber. When the pump rotor 4 continues to rotate, the volume of the hydraulic chamber of the pump rotor 4 will gradually decrease, and the working medium will be squeezed, thereby forcing out the working medium that has entered the hydraulic chamber and generating the flow power. The first chamber 20 includes the hydraulic chamber, and the second chamber 30 can contain the working medium. The electronic control assembly 8 includes a circuit board 81 and electronic components 82. The electronic components 82 include pins 821, which are fixedly connected to the circuit board 81. At least some of the electronic components 82 are in contact with the working medium in the second cavity 30 and exchange heat. When the electronic components 82 are in contact with the working medium for a long time, the electronic components 82 are prone to failure, thereby reducing the reliability of the electric pump.As described in the invention, during the first coating, it is difficult to completely coat the gap between electronic component 82 and circuit board 81. The working medium may seep into electronic component 82, causing it to malfunction. If a second coating is applied to the gap between electronic component 82 and circuit board 81, since the first coating requires a certain amount of time to fully cure, some impurities may be adsorbed on the coating surface. When the second coating is applied, the coating formed by the second coating may delaminate, resulting in insufficient adhesion and affecting the protection of the electronic component. If adhesive is applied around electronic component 82 to seal the gap between electronic component 82 and circuit board 81, the thickness of the adhesive is affected by the height of the electronic component. In addition, since the coating area is large and a lot of adhesive is used, there may be pores in the adhesive, and the working medium may seep into electronic component 82, causing it to malfunction.

[0026] Please refer to Figures 2 to 8. The electronic component 82 has a lower surface 822. In the axial direction of the electronic control assembly 8, there is a first gap 84 between the lower surface 822 and the circuit board 81, that is, there is a distance between the lower surface 822 and the circuit board 81. The electronic component 82 has a second gap 823. The electronic component 82 includes capacitors, MOS, MCU, resistors, etc. The capacitors include electrolytic capacitors or hybrid capacitors. Compared with surface mount capacitors, electrolytic capacitors or hybrid capacitors can provide larger capacitance. For the same capacitance, electrolytic capacitors are cheaper than surface mount capacitors. The electronic control assembly 8 includes a protective part 83, which includes a sealing part 831. The sealing part 831 includes a first sealing part 8311 and a second sealing part 8312. The first sealing part 8311 is located in a first interval 84 and is sealed to the electronic component 82 and the circuit board 81. The second sealing part 8312 is located in a second interval 823 and is sealed to the electronic component 82. The first sealing part 8311 is connected to the second sealing part 8312.

[0027] First, the first gap 84 can be filled by the first sealing part 8311, for example, the first gap 84 can be completely or partially filled by the first sealing part 8311, and the second gap 823 can be filled by the second sealing part 8312, for example, the second gap 823 can be completely or partially filled by the second sealing part 8312. This makes it less likely for external working media to penetrate into the interior of the electronic component 82, which is beneficial to improving the protection of the electronic component 82. Second, the first sealing part 8311 and the second sealing part 8312 are located in the first gap 84 and the second gap 823, respectively, occupying less space on the circuit board 81. This allows for a larger arrangement space for other electronic components, reduces the radial dimension of the circuit board 81, and helps to reduce the cost of the electronic control assembly 8. It also helps to miniaturize the electric pump. Third, the first sealing part 8311 and the second sealing part 8312 use less material, which helps to reduce the cost of the electronic control assembly 8. Fourth, the contact area between the electronic component 82 and the working medium is large, which helps to improve the heat dissipation effect of the electronic component 82.

[0028] Referring to Figures 3 to 6, the electronic component 82 includes a protective portion 824, an electrolyte solution 825, and a housing 826. The electronic component 82 has a receiving cavity 820. The cavity wall of the receiving cavity 820 includes at least a portion of the inner wall of the housing 826 and at least a portion of the inner wall of the protective portion 824. The electrolyte solution 825 is located in the receiving cavity 820. A portion of the pins 821 is located in the receiving cavity 820. The second interval 823 includes a first interval 8231 between the protective portion 824 and the housing 826 and a second interval 8232 between the pins 821 and the protective portion 824. The protective part 824 can keep the electrolyte solution 825 in a sealed environment. If the protective part 824 is in contact with the working medium for a long time, the protective part 824 is prone to expansion and deformation, which may put the electrolyte solution 825 in an open environment, thus making the electronic component 82 prone to failure. The first partition 8231 and the second partition 8232 can be filled, which can isolate the protective part 824 from the working medium, which is beneficial to improving the service life of the protective part 824, thus helping to keep the electrolyte solution 825 in a sealed environment, and thus helping to improve the reliability of the electronic component 82.

[0029] Electronic component 82 includes an insulating base 827, with a housing 826 fixedly connected to the insulating base 827. A portion of the insulating base 827 is located between the housing 826 and the circuit board 81 along the axial direction of the electronic control assembly 8. The insulating base 827 has a through hole 8271 and a groove 8272, which communicate with each other. At least a portion of the pins 821 are located in the through hole and at least a portion of the pins 821 are located in the groove 8272. The second interval 823 includes a third interval 8233 between the pins 821 and the insulating base 827 and a fourth interval 8234 between the housing 826 and the insulating base 827. In this embodiment, the housing 826 is a metal housing, and the insulating base 827 can isolate... The circuit board 81 and the housing 826 are connected to prevent the housing 826 from contacting the circuit board 81; the insulating base 827 contacts the protective part 824, which can prevent the working medium from contacting the protective part 824; the pins 821 of the electronic component 82 can be inserted into the groove 8272, so that the pins 821 can be flatly soldered and fixed to the circuit board 81, and the soldering area is large, which is conducive to improving the fixing strength; the third interval 8233 and the fourth interval 8234 can be filled, which can isolate the protective part 824 from the working medium, which is conducive to improving the service life of the protective part 824, thereby helping to keep the electrolyte solution 825 in a sealed environment, which is conducive to improving the reliability of the electronic component 82.

[0030] The sealing part 831 includes a medium. If the viscosity of the medium is high, the medium is usually in a viscous or paste-like state, which is not easy to flow and is difficult to fill the first gap 84 and the second gap 823. This allows the working medium to penetrate into the electronic components, which can easily cause the electronic components to fail. Referring to Figures 1 to 8, the gap of the first interval 84 is larger than the gap of the second interval 823. The cured medium forms a sealing part 831. At room temperature, the viscosity of the medium is less than 20,000 centipoise (cP). Filling begins from the first interval 84 with the smaller gap. Due to the lower viscosity of the sealing part 831, it has good fluidity and will flow from the first interval 84 to the second interval 823. The filling method is simple. In addition, for example, whether the first interval 84 and the second interval 823 are filled with medium can be detected by observing whether there is medium overflow at the fourth interval 8234. Compared with using other instruments and equipment for detection, the detection method is simple and the detection cost is low. Furthermore, at room temperature, the viscosity of the medium is less than or equal to 18,000 cP. Even further, at room temperature, the viscosity of the medium is less than or equal to 16,000 cP. The viscosity of the medium is low and the fluidity is good. For example, the capillary action can be used to allow the medium to fill the first interval 84 and the second interval 823 in a short time. The sealing part 831 has good oil and water resistance, and can maintain good sealing performance for a long time in the working medium environment. The sealing part 831 has good adhesion. For example, the adhesion between the sealing part 831 and the electronic component 82 or the adhesion between the sealing part 831 and the circuit board 81 is measured by the cross-cut test. The adhesion level is at least level 3, further, at least level 2, and preferably level 0. The sealing part 831 has low thixotropy and small deformation due to temperature, which is beneficial to improving the sealing effect of the sealing part 831. In this embodiment, the medium is cured by UV or high temperature, and other curing methods can also be used. No specific limitation is made here. After curing, the first gap 84 and the second gap 823 can be effectively sealed, which can effectively prevent the working medium, such as gear oil, from entering the interior of the electronic component 82, such as the interior of the electrolyte capacitor, through the first gap 84 and the second gap 823 and coming into contact with the protective part of the electrolyte capacitor. This is beneficial to improving the service life of the electronic component 82, and thus improving the reliability of the electric pump.

[0031] Referring to Figure 7, the sealing portion 831 includes a third sealing portion 8313, and the electronic component 82 includes an end portion 828 with a second gap 823. The third sealing portion 8313 includes a bottom portion 8314 and a side portion 8315. At least a portion of the side portion 8315 is circumferentially sealed to the outer side portion of at least a portion of the end portion 828. The bottom portion 8314 is sealed to the circuit board 81. The third sealing portion 8313 contacts the first sealing portion 8311 and the second sealing portion 8312. The third sealing portion 8313 can provide a first layer of protection for the electronic component 82, and the first sealing portion 8311 and the second sealing portion 8312 can provide a second layer of protection for the electronic component 82, thereby improving the protection effect of the electronic component 82 and effectively preventing the working medium from penetrating into the interior of the electronic component 82.

[0032] Referring to Figures 1 and 8, the electric pump includes metal components, such as the motor housing 11 or the stator core of the stator assembly 5. These metal components may have small metal particles attached to them, which are suspended in the working medium within the electric pump. After prolonged operation, these small metal particles can aggregate to form larger metal particles. If a larger particle simultaneously contacts the conductive parts of two electronic components 82, it can cause a short circuit. To solve this problem, the protective part 83 includes an insulating part 832, which at least covers the conductive parts of the electronic components 82. The insulating part 832 and the sealing part 831 are integrally formed; alternatively, the insulating part 832 and the sealing part 831 are separate structures, with the insulating part 832 contacting the sealing part 831. For example, the housing 826 is a metal housing, and the insulating part 832 covers the outer surface of the housing 826 of the electronic components 82, thereby preventing the aforementioned short circuit. In some embodiments, the insulating part 832 covers the housing 826 and the insulating part 832 covers the insulating base 827; or the insulating part 832 covers the housing 826 and the insulating part 832 covers the sealing part 831. The combination of the sealing part 831 and the insulating part 832 can more effectively protect the electronic component 82. The insulating part 832 is, for example, conformal coating.

[0033] Please refer to Figures 1 to 8. A method for manufacturing an electric pump includes:

[0034] The electronic components 82 and the circuit board 81 are fixedly connected to form a first space 84. A medium is filled into the first space 84 and the second space 823 inside the electronic components 82 that are connected to the first space 84. The medium with lower viscosity flows into the first space 84 and diffuses into the second space 823. The filling process takes less time, which is beneficial to improving the working efficiency of the preparation of the electronic control component 8.

[0035] The curing medium forms a sealing portion 831. First, since both the first interval 84 and the second interval 823 are filled with the sealing portion 831, the working medium is less likely to penetrate the interior of the electronic component 82, thus improving the protection of the electronic component 82. Second, the sealing portion 831 is located in the first interval 84 and the second interval 823, reducing the space occupied by the sealing portion 831 on the circuit board 81, allowing for more space to be arranged for other electronic components, reducing the radial dimension of the circuit board 81, which helps reduce the cost of the electronic control assembly 8, and also facilitates the miniaturization of the electric pump. Third, the implementation process of the sealing portion 831 is simple, which is beneficial for mass production. Fourth, the sealing portion 831 uses less material, which helps reduce the manufacturing cost of the electronic control assembly. Fifth, compared to the sealing portion covering the outer wall of the electronic component 82, the contact area between the electronic component 82 and the working medium is larger, which helps improve the heat dissipation effect of the electronic component 82. Furthermore, for example, the complete filling of the first interval 84 and the second interval 823 can be detected by externally observing whether there is medium overflow at the second interval 823 of the electronic component 82. Compared to using other instruments and equipment for detection, the detection method is simple and the detection cost is low.

[0036] The method for manufacturing the electric pump further includes, after curing the medium, spraying or coating at least a portion of the outer surface of the electronic component 82 to form an insulating portion 832, which covers the sealing portion 831. The combination of the insulating portion 832 and the sealing portion 831 provides more effective protection for the electronic component 82. In some embodiments, coating may be performed using methods such as vapor deposition.

[0037] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications without departing from the concept of this invention, and these modifications all fall within the protection scope of this application.

Claims

1. An electronic control component, characterized in that, The electronic control assembly (8) includes a circuit board (81), electronic components (82), and a protective part (83). The electronic components (82) include pins (821), which are fixedly connected to the circuit board (81). The electronic components (82) have a lower surface (822), and a first gap (84) exists between the lower surface (822) and the circuit board (81) in the axial direction of the electronic control assembly (8). The electronic components (82) also have a second gap (823). The protective part (83) includes a sealing part (831). The part (831) includes a first sealing part (8311) and a second sealing part (8312). The first sealing part (8311) is located in the first interval (84) and is sealed to the electronic component (82). The first sealing part (8311) is sealed to the circuit board (81). The second sealing part (8312) is located in the second interval (823) and is sealed to the electronic component (82). The first sealing part (8311) is connected to the second sealing part (8312).

2. An electric pump, characterized in that, The electric pump has a first chamber (20) and a second chamber (30). The electric pump has an inlet channel (141) that communicates with the first chamber (10). The first chamber (20) and the second chamber (30) are also connected. The electric pump includes an electronic control assembly (8) located in the second chamber (30). The electronic control assembly (8) includes a circuit board (81), electronic components (82), and a protective part (83). The electronic components (82) include pins (821) that are fixedly connected to the circuit board (81). The electronic components (82) have a lower surface (822) that is connected to the circuit board (81) in the axial direction of the electronic control assembly (8). 1) There is a first interval (84) between them; the electronic component (82) has a second interval (823), the protective part (83) includes a sealing part (831), the sealing part (831) includes a first sealing part (8311) and a second sealing part (8312), the first sealing part (8311) is located in the first interval (84), the first sealing part (8311) is sealed to the electronic component (82), the first sealing part (8311) is sealed to the circuit board (81), the second sealing part (8312) is located in the second interval (823), the first sealing part (8311) is connected to the second sealing part (8312), and the second sealing part (8312) is sealed to the electronic component (82).

3. The electric pump according to claim 2, characterized in that, The electronic component (82) includes a protective part (824), an electrolyte solution (825), and a housing (826). The electronic component (82) has a receiving cavity (820). The cavity wall of the receiving cavity (820) includes at least a portion of the inner wall of the housing (826) and at least a portion of the inner wall of the protective part (824). The electrolyte solution (825) is located in the receiving cavity (820). A portion of the pins (821) is located in the receiving cavity (820). The second interval (823) includes a first interval (8231) between the protective part (824) and the housing (826) and a second interval (8232) between the pins (821) and the protective part (824).

4. The electric pump according to claim 3, characterized in that, The electronic component (82) includes an insulating base (827), the housing (826) is fixedly connected to the insulating base (827), the insulating base (827) has a through hole (8271) and a groove (8272), the through hole (8271) and the groove (8272) are connected, at least a portion of the pins (821) are located in the through hole (8271), at least a portion of the pins (821) are located in the groove (8272), and the second interval (823) includes a third interval (8233) between the pins (821) and the insulating base (827) and a fourth interval (8234) between the housing (826) and the insulating base (827).

5. The electric pump according to claim 2, characterized in that, The gap of the first interval (84) is larger than the gap of the second interval (823), and the curing medium forms the sealing part (831). At room temperature, the viscosity of the medium is less than 20,000 cP.

6. The electric pump according to claim 3, characterized in that, The gap of the first interval (84) is larger than the gap of the second interval (823), and the curing medium forms the sealing part (831). At room temperature, the viscosity of the medium is less than 20,000 cP.

7. The electric pump according to claim 4, characterized in that, The gap of the first interval (84) is larger than the gap of the second interval (823), and the curing medium forms the sealing part (831). At room temperature, the viscosity of the medium is less than 20,000 cP.

8. The electric pump according to claim 2, characterized in that, The sealing portion (831) includes a third sealing portion (8313), the electronic component (82) includes an end portion (828), the end portion (828) has a second gap (823), the third sealing portion (8313) includes a bottom portion (8314) and a side portion (8315), at least a portion of the side portion (8315) is circumferentially sealed to at least a portion of the outer sidewall of the end portion (828), the bottom portion (8314) is sealed to the circuit board (81), the third sealing portion (8313) contacts the first sealing portion (8311), and the third sealing portion (8313) contacts the second sealing portion (8312).

9. The electric pump according to claim 3, characterized in that, The sealing portion (831) includes a third sealing portion (8313), the electronic component (82) includes an end portion (828), the end portion (828) has a second gap (823), the third sealing portion (8313) includes a bottom portion (8314) and a side portion (8315), at least a portion of the side portion (8315) is circumferentially sealed to at least a portion of the outer sidewall of the end portion (828), the bottom portion (8314) is sealed to the circuit board (81), the third sealing portion (8313) contacts the first sealing portion (8311), and the third sealing portion (8313) contacts the second sealing portion (8312).

10. The electric pump according to claim 4, characterized in that, The sealing portion (831) includes a third sealing portion (8313), the electronic component (82) includes an end portion (828), the end portion (828) has a second gap (823), the third sealing portion (8313) includes a bottom portion (8314) and a side portion (8315), at least a portion of the side portion (8315) is circumferentially sealed to at least a portion of the outer sidewall of the end portion (828), the bottom portion (8314) is sealed to the circuit board (81), the third sealing portion (8313) contacts the first sealing portion (8311), and the third sealing portion (8313) contacts the second sealing portion (8312).

11. The electric pump according to claim 5, characterized in that, The sealing portion (831) includes a third sealing portion (8313), the electronic component (82) includes an end portion (828), the end portion (828) has a second gap (823), the third sealing portion (8313) includes a bottom portion (8314) and a side portion (8315), at least a portion of the side portion (8315) is circumferentially sealed to at least a portion of the outer sidewall of the end portion (828), the bottom portion (8314) is sealed to the circuit board (81), the third sealing portion (8313) contacts the first sealing portion (8311), and the third sealing portion (8313) contacts the second sealing portion (8312).

12. The electric pump according to any one of claims 2-11, characterized in that, The protective part (83) includes an insulating part (832), which at least covers the conductive portion of the electronic component (82). The insulating part (832) and the sealing part (831) are integrally formed; or the insulating part (832) and the sealing part (831) are separate structures, with the insulating part (832) contacting the sealing part (831).

13. The electric pump according to claim 2, characterized in that, The electric pump includes a pump rotor (4), a motor rotor (6), and a stator assembly (5). The pump rotor (4) is located in the first chamber (20), and the motor rotor (6) is located in the second chamber (30). The pump rotor (4) and the motor rotor (6) are connected in a driving connection. The motor rotor (6) is located on the radial outer side of the stator assembly (5), and the stator assembly (5) is electrically connected to the electronic control assembly (8).

14. A method for preparing an electric pump, characterized in that, The preparation method includes: A first spacer (84) is formed by fixing electronic components (82) and circuit board (81) together, and a medium is filled into the first spacer (84) and the second spacer (823) in the electronic components (82) that are in communication with the first spacer (84); The medium is cured to form a sealing part (831).

15. The preparation method according to claim 14, characterized in that, After the medium is cured, at least a portion of the outer surface of the electronic component (82) is sprayed or coated to form an insulating portion (832), which contacts the sealing portion (831).

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