Circuit board and connector unit

Abstract

To realize a flexible substrate. [Solution] A substrate (2) according to one embodiment of the present disclosure comprises: a first substrate portion (2a) in which a reinforcing member (12) is disposed between the folded-back portion of the flexible substrate (11), with a flexible substrate (11') having a first portion (11a) having a notch (11e) and a second portion (11b) extending from the first portion (11a) being folded back so that the tip portion (11i) of the second portion (11b) is positioned inside the notch (11e) of the first portion (11a); a second substrate portion (2b) in which the portion of the flexible substrate (11) on the notch (11e) side and the tip portion of the second portion (11b) are superimposed on a rigid substrate (13); and a flexible portion (2c) disposed between the first substrate portion (2a) and the second substrate portion (2b) of the flexible substrate (11).

Description

Technical Field

[0001] The present disclosure relates to a substrate and a connector unit.

Background Art

[0002] For example, as shown in FIG. 16, the substrate 101 of Patent Document 1 includes a structural component 102 and a rigid substrate 103. The structural component 102 has a configuration in which a reinforcing plate 105 is disposed between the folded flexible substrates 104, and is a portion to be inserted into a connection connector.

[0003] The rigid substrate 103 is thicker than the thickness that can be inserted into the connection connector to form a stepped portion with the structural component 102. As shown in FIG. 16, the pad 104a of the flexible substrate 104 is connected to the pad 103a of the rigid substrate 103 via the wiring 104b. Such a substrate 101 has a strong configuration in which the reinforcing plate 105 of the structural component 102 and the rigid substrate 103 are joined by an adhesive.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Since the substrate 101 of Patent Document 1 has a strong configuration in which the structural component 102 and the reinforcing plate 105 are joined, it has the problem of lacking flexibility.

[0006] An object of the present disclosure is to realize a substrate and a connector unit having flexibility.

Means for Solving the Problems

[0007] A substrate according to one aspect of the present disclosure comprises a first substrate portion in which a flexible substrate having a first portion having a notch and a second portion extending from the first portion is folded back, and a reinforcing member is disposed between the folded portions of the flexible substrate, with the tip of the second portion positioned inside the notch of the first portion when viewed from the thickness direction of the flexible substrate, With the flexible substrate folded back, the portion of the first part of the flexible substrate on the side of the notch and the tip of the second part are superimposed on the rigid substrate, forming a second substrate portion. With the flexible substrate folded back, a flexible portion is disposed between the first substrate portion and the second substrate portion of the flexible substrate, It is equipped with.

[0008] The above-mentioned substrate includes a first pad formed on one of the portions of the folded side of the flexible substrate that sandwiches the reinforcing member, A second pad formed on the other portion of the folded side of the flexible substrate that sandwiches the reinforcing member, Equipped with, The first wiring connected to the first pad and the second wiring connected to the second pad preferably extend toward the second substrate portion.

[0009] In the substrate described above, it is preferable that the tip of the second portion is housed inside the notch of the first portion.

[0010] In the aforementioned substrate, it is preferable that in the second substrate portion, the portion of the first portion of the flexible substrate on the notched side and the tip portion of the second portion are sandwiched between the rigid substrate.

[0011] In the above-mentioned substrate, it is preferable that in the second substrate portion, the portion of the flexible substrate on the notched side of the first portion and the tip portion of the second portion sandwich the rigid substrate.

[0012] In the above-described substrate, it is preferable that the reinforcing member has an engaging portion that can engage with an engaged portion of a connector to which the substrate is connected.

[0013] A connector unit according to one aspect of the present disclosure is the above-described substrate, a connector connected to the substrate, and is provided with an engaging portion provided on a reinforcing member of the substrate and an engaged portion provided on the connector are engageable.

Effect of the Invention

[0014] According to the present disclosure, a flexible substrate and a connector unit can be realized.

Brief Description of the Drawings

[0015] [Figure 1] It is a perspective view of the connector unit of the embodiment seen from the + side of the Z axis. [Figure 2] It is a perspective view of the connector unit of the embodiment seen from the - side of the Z axis. [Figure 3] It is an exploded perspective view of the connector unit of the embodiment seen from the + side of the Z axis. [Figure 4] It is a perspective view of the substrate of the connector unit of the embodiment seen from the + side of the Z axis. [Figure 5] It is a perspective view of the substrate of the connector unit of the embodiment seen from the - side of the Z axis. [Figure 6] It is a view of the substrate of the connector unit in the embodiment seen from the + side of the Y axis. [Figure 7] It is a view of the flexible substrate in the state before being folded seen from the - side of the Z axis. [Figure 8] It is a perspective view of the connector of the connector unit of the embodiment seen from the + side of the Z axis. [Figure 9] It is a perspective view of the connector of the connector unit of the embodiment seen from the - side of the Z axis. [Figure 10]It is an exploded perspective view of the connector of the connector unit according to the embodiment as viewed from the +Z axis side. [Figure 11] It is a view of the contact assembly of the connector in the connector unit according to the embodiment as viewed from the +Z axis side. [Figure 12] It is a view of the contact assembly of the connector in the connector unit according to the embodiment as viewed from the -Z axis side. [Figure 13] It is a perspective view of the first contact group and the second contact group in the contact assembly of the connector according to the embodiment as viewed from the +Z axis side. [Figure 14] It is a view of the substrate of the connector unit in another embodiment as viewed from the +Y axis side. [Figure 15] It is a view of the substrate of the connector unit in another embodiment as viewed from the +Y axis side. [Figure 16] It is a view showing FIG. 2 of Patent Document 1.

Mode for Carrying Out the Invention

[0016] Hereinafter, specific embodiments to which the present disclosure is applied will be described in detail with reference to the drawings. However, the present disclosure is not limited to the following embodiments. Also, for clarity of explanation, the following description and drawings are simplified as appropriate. Here, in the following description, a three-dimensional (XYZ) coordinate system is used for clarity of explanation.

[0017] First, the configuration of the connector unit according to the present embodiment will be described. FIG. 1 is a perspective view of the connector unit according to the present embodiment as viewed from the +Z axis side. FIG. 2 is a perspective view of the connector unit according to the present embodiment as viewed from the -Z axis side. FIG. 3 is an exploded perspective view of the connector unit according to the present embodiment as viewed from the +Z axis side. [[ID=!!]]

[0018] The connector unit 1 includes, for example, a substrate 2 and a connector 3 as shown in FIGS. 1 to 3. The substrate 2 is used, for example, to connect a main board on which a CPU (Central Processing Unit) or the like is mounted and the connector 3.

[0019] Figure 4 is a perspective view of the circuit board of the connector unit in this embodiment, viewed from the Z-axis+ side. Figure 5 is a perspective view of the circuit board of the connector unit in this embodiment, viewed from the Z-axis- side. Figure 6 is a view of the circuit board of the connector unit in this embodiment, viewed from the Y-axis+ side.

[0020] As shown in Figures 4 and 5, the substrate 2 comprises a flexible substrate 11, a reinforcing member 12, and a rigid substrate 13. The flexible substrate 11 has a base material made of a thin film such as polyimide, and is folded back at the Y-axis side end of the flexible substrate 11.

[0021] Figure 7 is a view of the flexible circuit board before it is folded, seen from the Z-axis side. In Figure 7, the first pad, the second pad, the first wiring, and a portion of the second wiring are typically shown. The flexible circuit board before folding is denoted by reference numeral 11' to distinguish it from the flexible circuit board 11 after it has been folded.

[0022] As shown in Figure 7, the flexible substrate 11' comprises a first portion 11a, a second portion 11b, a first pad 11c, and a second pad 11d. The first portion 11a is, for example, substantially rectangular in shape, elongated in the Y-axis direction when viewed from the Z-axis direction, and has a notch 11e on the Y-axis+ side of the first portion 11a.

[0023] The notch 11e is, for example, a roughly rectangular shape that is elongated in the Y-axis direction when viewed from the Z-axis direction, as shown in Figure 7, with the Y-axis+ end of the notch 11e being open. The notch 11e is located approximately in the center of the flexible substrate 11' in the X-axis direction.

[0024] In the first portion 11a, for example as shown in Figure 7, a substantially rectangular third portion 11f, which is elongated in the Y-axis direction when viewed from the Z-axis direction, is positioned on the Y-axis- side relative to the notch 11e, and on both sides of the X-axis direction of the notch 11e, a substantially rectangular fourth portion 11g, which is elongated in the Y-axis direction when viewed from the Z-axis direction, extends from the third portion 11f towards the Y-axis+ side.

[0025] As shown in Figure 7, the third portion 11f has a fold line 11h for folding back the flexible substrate 11'. The fold line 11h extends in the X-axis direction and is positioned at a predetermined location in the third portion 11f with a gap in the Y-axis direction so that it can sandwich the reinforcing member 12 when the flexible substrate 11' is folded back, and so that the tip portion (the Y-axis side portion in Figure 7) 11i of the second portion 11b can be accommodated inside the notch 11e.

[0026] The second portion 11b extends from the first portion 11a toward the Y-axis, as shown in Figure 7. The second portion 11b is positioned approximately in the center of the first portion 11a in the X-axis direction. The width dimension of the second portion 11b in the X-axis direction is approximately equal to the width dimension of the notch 11e of the first portion 11a in the X-axis direction. Also, the length of the second portion 11b in the Y-axis direction is approximately equal to the length of the fourth portion 11g in the Y-axis direction.

[0027] The first pad 11c is positioned on the Z-axis-side surface of the third portion 11f, as shown in Figure 7. The first pad 11c is positioned at a distance in the X-axis direction from the Y-axis-side fold line 11h in the third portion 11f. The first wiring 11j is connected to the first pad 11c. The first wiring 11j extends from the first pad 11c toward the Y-axis.

[0028] The second pad 11d is positioned on the Z-axis-side face of the third portion 11f, as shown in Figure 7. The second pad 11d is positioned at a distance in the X-axis direction from the Y-axis-side bend line 11h in the third portion 11f. The second wiring 11k is connected to the second pad 11d. The second wiring 11k extends from the second pad 11d toward the Y-axis-+ side.

[0029] This flexible substrate 11' is bent approximately 90° clockwise along each folding line 11h from the state shown in Figure 7 when viewed from the X-axis + side, and the Y-axis - end is folded back to form the flexible substrate 11.

[0030] At this time, as shown in Figures 5 and 6, the tip portion 11i of the second portion 11b is housed inside the notch portion 11e of the first portion 11a, and the Y-axis positive end of the second portion 11b is positioned approximately equal to the Y-axis positive end of the fourth portion 11g.

[0031] As shown in Figures 4 and 5, the tip portion 11i of the second portion 11b and the fourth portion 11g are arranged approximately parallel to the XY plane. Furthermore, the Y-axis-side portion of the second portion 11b and the Y-axis-side portion of the fourth portion 11g are bent, so that in the Z-axis direction, the tip portion 11i of the second portion 11b and the Y-axis-+ side portion of the fourth portion 11g are positioned approximately in the center of the flexible substrate 11.

[0032] Furthermore, as shown in Figures 4 and 5, the first pad 11c is located on the Z-axis+ side of the flexible substrate 11, and the second pad 11d is located on the Z-axis- side of the flexible substrate 11.

[0033] Furthermore, the first wiring 11j and the second wiring 11k extend towards the Y-axis + side. Therefore, the first wiring 11j and the second wiring 11k are not located in the folded portion 11l of the flexible substrate 11.

[0034] As shown in Figures 4 and 5, the reinforcing member 12 is positioned between the folded third portion 11f of the flexible substrate 11 and is fixed to the third portion 11f via an insulating adhesive member 14.

[0035] As shown in Figures 4 and 5, the reinforcing member 12 has a shape that corresponds to the folded third portion 11f of the flexible substrate 11 when viewed from the Z-axis direction, and is, for example, a roughly rectangular shape that is long in the Y-axis direction. The reinforcing member 12 should preferably have high rigidity and insulating properties relative to the flexible substrate 11.

[0036] In this case, the reinforcing member 12 may be provided with an engaging portion 12a that engages with the engaged portion 21c of the connector 3, as shown in Figures 4 and 5. The engaging portion 12a protrudes outward from the X-axis direction from the X-axis positive end and the X-axis negative end of the substantially rectangular portion 12b of the reinforcing member 12.

[0037] The engaging portion 12a is, for example, substantially rectangular when viewed from the Z-axis direction, as shown in Figures 4 and 5, and has thickness in the Z-axis direction. Here, the engaging portion 12a is preferably fixed to a protrusion 11m formed on the third portion 11f of the flexible substrate 11 via an adhesive member 14.

[0038] The rigid substrate 13 has higher rigidity than the flexible substrate 11 and is made of a base material such as FR4 (Flame Retardant Type 4). As shown in Figures 4 and 5, the rigid substrate 13 is fixed to the second portion 11b and the fourth portion 11g of the flexible substrate 11 via an insulating adhesive member 15, with the tip portion 11i of the second portion 11b of the flexible substrate 11 sandwiched inside the notch portion 11e in the Z-axis direction.

[0039] The rigid substrate 13 is roughly rectangular in shape, elongated in the X-axis direction when viewed from the Z-axis direction, as shown in Figures 4 and 5. A pad 13a is placed on the Z-axis+ side of the rigid substrate 13 on the Z-axis+ side.

[0040] The pad 13a is connected to the first wiring 11j and the second wiring 11k of the flexible substrate 11 via vias 13b formed on the rigid substrate 13, as shown in Figure 6. A board-to-board connector, for example, can be connected to the pad 13a. Note that in Figure 6, only a typical via 13b is shown in a simplified manner.

[0041] In such a substrate 2, as shown in Figures 4 and 5, the portion where the reinforcing member 12 is placed between the folded third portion 11f of the flexible substrate 11 constitutes the first substrate portion 2a, and the portion where the second portion 11b and the fourth portion 11g of the flexible substrate 11 are sandwiched between the rigid substrate 13 constitutes the second substrate portion 2b.

[0042] Furthermore, in the substrate 2, as shown in Figures 4 and 5, the Y-axis-side portion of the second portion 11b and the Y-axis-side portion of the fourth portion 11g of the flexible substrate 11, which are positioned between the first substrate portion 2a and the second substrate portion 2b, constitute the flexible portion 2c. This allows the substrate 2 to be bent at the flexible portion 2c, thereby realizing a flexible substrate 2.

[0043] Connector 3 is connected to the circuit board 2, as shown in Figures 1 and 2. Figure 8 is a perspective view of the connector of the connector unit of this embodiment, viewed from the Z-axis+ side. Figure 9 is a perspective view of the connector of the connector unit of this embodiment, viewed from the Z-axis- side. Figure 10 is an exploded perspective view of the connector of the connector unit of this embodiment, viewed from the Z-axis+ side.

[0044] As shown in Figures 8 to 10, the connector 3 comprises a shell 21 and a contact assembly 22. The shell 21 is made of a conductive material. The shell 21 comprises, for example, a first portion 21a and a second portion 21b. The first portion 21a is substantially cylindrical and extends in the Y-axis direction. The first portion 21a is, for example, substantially rectangular and elongated in the X-axis direction when viewed from the Y-axis direction.

[0045] As shown in Figures 8 to 10, the second portion 21b protrudes from the X-axis+ and X-axis- ends of the first portion 21a toward the Y-axis+ side. The second portion 21b includes an engaged portion 21c and a connecting portion 21d. The engaged portion 21c has a roughly C-shape when viewed from the X-axis direction, with the Y-axis+ side open so that the engaging portion 12a of the substrate 2 can engage with it, and is arranged substantially parallel to the YZ plane.

[0046] As shown in Figures 8 to 10, the Y-axis positive end of the engaged portion 21c is bent inward from the open portion of the engaged portion 21c so as to narrow the height of the open portion of the engaged portion 21c in the Z-axis direction. The interior of the engaged portion 21c is approximately rectangular when viewed from the X-axis direction, and the height of the interior of the engaged portion 21c in the Z-axis direction is approximately equal to the height of the engaging portion 12a of the substrate 2 in the Z-axis direction.

[0047] In this case, the engaged portion 21c may have an inclined portion 21e at the Y-axis+ end of the bent portion 21f of the engaged portion 21c, which slopes toward the inward side of the open portion of the engaged portion 21c in the Z-axis direction as it moves toward the Y-axis- side, as shown in Figures 8 to 10.

[0048] As shown in Figures 8 to 10, the connecting portion 21d connects the first portion 21a and the engaged portion 21c. The connecting portion 21d is, for example, substantially rectangular when viewed from the Y-axis direction and extends in the Y-axis direction.

[0049] The contact assembly 22 is inserted into and held inside the first portion 21a of the shell 21, as shown in Figures 8 and 9. Figure 11 is a view of the connector contact assembly in the connector unit of this embodiment, viewed from the Z-axis+ side. Figure 12 is a view of the connector contact assembly in the connector unit of this embodiment, viewed from the Z-axis- side.

[0050] Figure 13 is a perspective view of the first contact group and the second contact group in the connector contact assembly of this embodiment, viewed from the Z-axis+ side. As shown in Figures 11 to 13, the contact assembly 22 comprises the first contact group 31, the second contact group 32, and an insulating member 33.

[0051] The first contact group 31 comprises a plurality of contacts 34, as shown in Figures 11 to 13. The contacts 34 are spaced apart in the X-axis direction. For example, the contacts 34 are compression contacts with a roughly Z-shape when viewed from the X-axis direction, and comprise a first portion 34a, a second portion 34b, and a third portion 34c.

[0052] The first portion 34a extends in the Y-axis direction, for example, as shown in Figure 13. The Y-axis-side portion of the first portion 34a constitutes a first electrical contact 34d that is connected to the contacts of the connector.

[0053] The second portion 34b extends in the Y-axis direction, for example, as shown in Figure 13. The Y-axis positive portion of the second portion 34b constitutes a second electrical contact 34e that is connected to the first pad 11c of the first substrate portion 2a of the substrate 2.

[0054] The second electrical contact 34e is curved in a roughly C-shape, with the Z-axis+ side open when viewed from the X-axis direction, as shown in Figure 13, for example. The third portion 34c extends in the Z-axis direction, for example, and connects the Y-axis+ end of the first portion 34a to the Y-axis- end of the second portion 34b.

[0055] The second contact group 32 comprises multiple contacts 35, as shown in Figure 13. The contacts 35 are, for example, plane-symmetric with respect to the contacts 34 of the first contact group 31, with respect to the XY plane, and are spaced apart in the X-axis direction.

[0056] More specifically, the contact 35 comprises a first portion 35a having a first electrical contact 35d connected to a contact of a connection connector, a second portion 35b having a second electrical contact 35e connected to a second pad 11d of a first substrate portion 2a of the substrate 2, and a third portion 35c connecting the first portion 35a and the second portion 35b, as shown in Figure 13.

[0057] As shown in Figures 11 and 12, the insulating member 33 is an insulator (housing) that holds the first contact group 31 and the second contact group 32. The insulating member 33 comprises a first portion 33a and a second portion 33b.

[0058] The first portion 33a is a flat plate shape substantially parallel to the XY plane, as shown in Figures 11 and 12, and is substantially rectangular in shape, elongated in the X-axis direction when viewed from the Y-axis direction. The first portion 33a is shaped to correspond to the shape of the insulating member of the connector, so that the insulating member that holds the contacts in the connector can be fitted into the first portion 33a.

[0059] As shown in Figure 11, the first portion 34a of contact 34 of the first contact group 31 is exposed from the Z-axis+ side surface of the first portion 33a. Also, as shown in Figure 12, the first portion 35a of contact 35 of the second contact group 32 is exposed from the Z-axis- side surface of the first portion 33a.

[0060] As shown in Figures 11 and 12, the second portion 33b is positioned on the Y-axis+ side relative to the first portion 33a and is continuous with the first portion 33a. The second portion 33b has a roughly C-shape with the Y-axis+ side open when viewed from the Z-axis direction, and includes a wall portion 33c and a protruding portion 33d.

[0061] The wall portion 33c is, for example, as shown in Figures 11 and 12, substantially rectangular in shape, elongated in the X-axis direction when viewed from the Y-axis direction, and has an outer shape that is substantially equal to the inner shape of the first portion 21a of the shell 21. The wall portion 33c has thickness in the Y-axis direction and protrudes outward from the first portion 33a when viewed from the Y-axis direction, toward the outer side of the insulating member 33.

[0062] As shown in Figure 12, the wall portion 33c has a plurality of through portions 33e. The through portions 33e extend in the Y-axis direction and through which the first portion 34a of the contact 34 of the first contact group 31 and the first portion 35a of the contact 35 of the second contact group 32 pass. In other words, the wall portion 33c arranges the contact 34 of the first contact group 31 and the contact 35 of the second contact group 32.

[0063] As shown in Figures 11 and 12, the portion of the wall 33c that includes the third portion 34c of contact 34 in the first contact group 31 and the portion of the second contact group 32 that includes the third portion 35c of contact 35 protrude in the Y-axis direction.

[0064] The protruding portion 33d, for example as shown in Figures 11 and 12, projects from the X-axis+ end and the X-axis- end of the wall portion 33c toward the Y-axis+ side. The protruding portion 33d is approximately rectangular in shape, elongated in the Y-axis direction when viewed from the X-axis direction.

[0065] In this case, the distance in the X-axis direction between the X-axis positive side protrusion 33d and the X-axis negative side protrusion 33d should be approximately equal to the width dimension in the X-axis direction of the Y-axis negative end of the first substrate portion 2a on the substrate 2. Furthermore, as shown in Figures 11 and 12, the protrusion 33d may have a curved portion 33f at its Y-axis positive end that curves toward the inward side of the insulating member 33 as it moves toward the Y-axis negative side.

[0066] As shown in Figures 11 and 12, within the space formed by the wall portion 33c and the protruding portion 33d, the portion on the Y-axis+ side, including the third portion 34c of contact 34 in the first contact group 31, and the portion on the Y-axis+ side, including the third portion 35c of contact 35 in the second contact group 32, are arranged when viewed from the Z-axis direction.

[0067] Furthermore, as shown in Figures 11 and 12, the insulating member 33 is preferably divided into a first insulating member 33g that holds the first contact group 31, a second insulating member 33h that holds the second contact group 32, and a third insulating member 33i that holds the first insulating member 33g and the second insulating member 33h.

[0068] Such a contact assembly 22 is inserted into the first portion 21a of the shell 21 from the Y-axis+ side to the Y-axis- side, and is held in the first portion 21a of the shell 21, as shown in Figures 11 and 12.

[0069] At this time, as shown in Figures 8 and 9, the Y-axis+ portion of contact 34 in the first contact group 31, including the third portion 34c of contact 34, the Y-axis+ portion of contact 35 in the second contact group 32, and the protruding portion 33d of the second portion 33b of insulating member 33 protrude from the first portion 21a toward the Y-axis+ side between the second portion 21b of shell 21.

[0070] Next, the process for manufacturing the substrate 2 in the connector unit 1 of this embodiment will be described. First, for example, a reinforcing member 12 is fixed to the Y-axis+ side portion of the third portion 11f of the unfolded flexible substrate 11' via an adhesive member 14.

[0071] Next, the third portion 11f of the flexible substrate 11' is folded along the folding line 11h to enclose the reinforcing member 12, and the third portion 11f is folded back, and the reinforcing member 12 is fixed to the portion of the third portion 11f located on the Z-axis+ side via the adhesive member 14.

[0072] Next, the Y-axis-side portion of the second portion 11b and the Y-axis-side portion of the fourth portion 11g of the flexible substrate 11 are bent, and the tip portion 11i of the second portion 11b is housed inside the notch portion 11e of the first portion 11a, while the tip portion 11i of the second portion 11b and the Y-axis-+ side portion of the fourth portion 11g are positioned approximately in the center of the flexible substrate 11 in the Z-axis direction.

[0073] Next, the rigid substrate 13 is fixed to the second portion 11b and the fourth portion 11g of the flexible substrate 11 via adhesive members 15, while sandwiching the portion of the second portion 11b of the flexible substrate 11 where the tip portion 11i of the second portion 11b is housed inside the notch portion 11e with the rigid substrate 13.

[0074] Then, by connecting the pad 13a of the rigid substrate 13 on the Z-axis+ side to the first wiring 11j and the second wiring 11k of the flexible substrate 11 via the via 13b, a substrate 2 having a first substrate portion 2a, a second substrate portion 2b, and a flexible portion 2c can be manufactured.

[0075] Next, the process for manufacturing the connector 3 of the connector unit 1 of this embodiment will be explained. First, the contacts 34 of the first contact group 31 and the contacts 35 of the second contact group 32 are insert-molded into the insulating member 33 to form the contact assembly 22.

[0076] At this time, first, the contact 34 of the first contact group 31 is insert-molded into the first insulating member 33g and held by the first insulating member 33g, and the contact 35 of the second contact group 32 is insert-molded into the second insulating member 33h and held by the second insulating member 33h.

[0077] Then, the first insulating member 33g and the second insulating member 33h are insert-molded into the third insulating member 33i. This allows the contacts 34 of the first contact group 31 and the contacts 35 of the second contact group 32 to be insert-molded into the third insulating member 33i with high precision.

[0078] Next, the contact assembly 22 is inserted into the first portion 21a of the shell 21 from the Y-axis+ side to the Y-axis- side, and the contact assembly 22 is held in place by the first portion 21a of the shell 21, thereby manufacturing the connector 3.

[0079] Next, the process of connecting the substrate 2 to the connector 3 in the connector unit 1 of this embodiment will be explained. First, the substrate 2 is brought closer to the connector 3 from the Y-axis + side toward the Y-axis - side, and the Y-axis - end of the first substrate portion 2a of the substrate 2 is inserted between the protruding portion 33d of the insulating member 33 of the connector 3, while the engaging portion 12a of the reinforcing member 12 on the substrate 2 is inserted into the engaged portion 21c of the shell 21 on the connector 3 and engaged.

[0080] At the same time, the Y-axis-side end of the first substrate portion 2a of the substrate 2 is inserted between the second portion 34b of contact 34 of the first contact group 31 of the connector 3 and the second portion 35b of contact 35 of the second contact group 32, thereby connecting the first pad 11c and the second pad 11d of the first substrate portion 2a of the substrate 2 to the second electrical contact 34e of the first contact group 31 and the second electrical contact 35e of the second contact group 32 of the connector 3. In other words, the connector 3 of this embodiment is connected to the substrate 2 by a solderless method.

[0081] This allows the substrate 2 to be connected to the connector 3. In this case, if the height in the Z-axis direction inside the engaged portion 21c of the shell 21 is approximately equal to the height in the Z-axis direction of the engaged portion 12a of the substrate 2, the position of the substrate 2 in the Z-axis direction relative to the connector 3 can be fixed.

[0082] Furthermore, if the distance in the X-axis direction between the X-axis positive side protrusion 33d and the X-axis negative side protrusion 33d of the insulating member 33 in the connector 3 is approximately equal to the width dimension in the X-axis direction of the Y-axis negative end of the first substrate portion 2a in the substrate 2, the position of the substrate 2 in the X-axis direction relative to the connector 3 can be fixed.

[0083] Furthermore, if the engaged portion 21c of the shell 21 is provided with an inclined portion 21e, the engaged portion 12a of the reinforcing member 12 on the substrate 2 can be smoothly inserted into the engaged portion 21c of the shell 21 on the connector 3 and engaged.

[0084] Furthermore, if the protruding portion 33d of the insulating member 33 in the connector 3 has a curved portion 33f, the Y-axis side end of the first substrate portion 2a of the substrate 2 can be smoothly inserted between the protruding portions 33d.

[0085] Next, the procedure for replacing the circuit board 2 or the connector 3 in the connector unit 1 of this embodiment will be explained. In the connector unit 1 of this embodiment, the circuit board 2 and the connector 3 are connected by engaging the engaging portion 12a of the circuit board 2 with the engaged portion 21c of the connector 3.

[0086] Therefore, by releasing the engagement between the engaging portion 12a of the circuit board 2 and the engaged portion 21c of the connector 3, the circuit board 2 or the connector 3 can be replaced. In particular, if the circuit board 2 and the connector 3 are connected by a solderless connection, the circuit board 2 or the connector 3 can be easily replaced.

[0087] Such a connector unit 1 can be connected to a motherboard of an electrical device, for example, and the connection connector can be connected to it. For example, the connection connector is inserted into the first portion 21a of the shell 21 of the connector 3, from the Y-axis minus side towards the Y-axis plus side.

[0088] Then, the contacts of the connecting connector are connected to the first electrical contact 34d of contact 34 in the first contact group 31 and the first electrical contact 35d of contact 35 in the second contact group 32 of connector 3. This allows the connecting connector to be connected to connector 3 of connector unit 1.

[0089] As described above, the substrate 2 and connector unit 1 of this embodiment are provided with a flexible portion 2c between the first substrate portion 2a and the second substrate portion 2b. Therefore, the substrate 2 can be bent at the flexible portion 2c, making it possible to realize a flexible substrate 2.

[0090] Furthermore, in the substrate 2 and connector unit 1 of this embodiment, since the flexible substrate 11 is formed by folding, for example, there is no need to individually form the flexible substrate on the Z-axis+ side and the flexible substrate on the Z-axis- side, and the substrate 2 can be manufactured at low cost.

[0091] Furthermore, in the substrate 2 and connector unit 1 of this embodiment, the first wiring 11j and the second wiring 11k of the first substrate portion 2a of the substrate 2 are not arranged on the folded portion 11l of the flexible substrate 11. Therefore, the substrate 2 and connector unit 1 of this embodiment can suppress the degradation of signal transmission characteristics.

[0092] In the substrate 2 and connector unit 1 of this embodiment, if the tip portion 11i of the second portion 11b of the flexible substrate 11 is housed inside the notch portion 11e of the first portion 11a, the thickness of the second substrate portion 2b of the substrate 2 in the Z-axis direction can be reduced.

[0093] Here, for example, if the rigid substrate 13 on the Z-axis side is equipped with pads, the pads of the rigid substrate 13 on the Z-axis side will also be connected to the first wiring 11j and the second wiring 11k of the flexible substrate 11 via vias.

[0094] In this case, the via 13b of the rigid substrate 13 on the Z-axis+ side and the via of the rigid substrate 13 on the Z-axis- side can be made to be at approximately the same height in the Z-axis direction. This makes the signal transmission paths approximately the same length, and thus suppresses the degradation of the signal transmission characteristics.

[0095] In the substrate 2 and connector unit 1 of this embodiment, if the engaging portion 12a of the substrate 2 and the engaged portion 21c of the connector 3 are configured to engage with each other, the substrate 2 or the connector 3 can be easily replaced in relation to the electrical equipment.

[0096] In this embodiment, when the substrate 2 and connector unit 1 are connected without soldering, the decrease in impedance can be suppressed compared to when they are connected with solder, which contributes to improving the signal transmission characteristics.

[0097] In this embodiment, the second substrate portion 2b of the substrate 2 is configured such that a flexible substrate 11 is sandwiched between rigid substrates 13. However, as shown in Figure 14, the rigid substrate 13 may be positioned on only one side of the flexible substrate 11, either the Z-axis+ side or the Z-axis- side. Alternatively, as shown in Figure 15, the rigid substrate 13 may be sandwiched between the tip portion 11i and the fourth portion 11g of the second portion 11b of the flexible substrate 11.

[0098] The substrate 2 in this embodiment is illustrative and only needs to have a flexible portion 2c between the first substrate portion 2a and the second substrate portion 2b. Furthermore, the flexible substrate 11' only needs to have a shape that, when the flexible substrate 11' is folded back, allows the tip portion 11i of the second portion 11b to be positioned inside the notch portion 11e of the first portion 11a when viewed from the Z-axis direction.

[0099] The configuration of the connector 3 in this embodiment is illustrative, and it is preferable that it be configured to at least allow engagement of the engaging portion 12a of the substrate 2. Similarly, the shape of the engaging portion 12a of the substrate 2 is illustrative, and in short, it is preferable that the configuration allows engagement between the substrate 2 and the connector 3.

[0100] This disclosure is not limited to the embodiments described above, and may be modified as appropriate without departing from the spirit of the invention. [Explanation of symbols]

[0101] 1 Connector Unit 2 substrate, 2a first substrate section, 2b second substrate section, 2c flexible section 3 Connectors 11 Flexible circuit board, 11a First section, 11b Second section, 11c First pad, 11d Second pad, 11e Notch, 11f Third section, 11g Fourth section, 11h Folding line, 11i Tip of the second section of the flexible circuit board, 11j First wiring, 11k Second wiring, 11l Folded section of the flexible circuit board, 11m Protrusion 12 Reinforcement member, 12a Engaging portion, 12b Approximately rectangular portion of the reinforcement member 13 Rigid board, 13a pad, 13b via 14 Adhesive members 15 Adhesive members 21 Shell, 21a First part, 21b Second part, 21c Engaged part, 21d Connecting part, 21e Inclined part, 21f Bent part in the engaged part 22 Contact Assembly 31. First Contact Group 32. Second Contact Group 33 insulating member, 33a first part, 33b second part, 33c wall part, 33d protruding part, 33e through part, 33f curved part, 33g first insulating member, 33h second insulating member, 33i third insulating member 34 Contacts, 34a First part, 34b Second part, 34c Third part, 34d First electrical contact, 34e Second electrical contact 35 Contacts, 35a First part, 35b Second part, 35c Third part, 35d First electrical contact, 35e Second electrical contact 101 circuit board 102 Structural components 103 Rigid substrate, 103a pad 104 Flexible circuit board, 104a Pads, 104b Wiring 105 Reinforcement plate

Claims

1. A flexible substrate having a first portion with a notch and a second portion extending from the first portion is folded back, and when viewed from the thickness direction of the flexible substrate, the tip of the second portion is positioned inside the notch of the first portion, and a reinforcing member is positioned between the folded portion of the flexible substrate to form a first substrate portion, With the flexible substrate folded back, the portion of the first part of the flexible substrate on the side of the notch and the tip of the second part are superimposed on the rigid substrate, forming a second substrate portion. With the flexible substrate folded back, a flexible portion is disposed between the first substrate portion and the second substrate portion of the flexible substrate, A substrate comprising the above.

2. A first pad formed on one of the portions of the folded side of the flexible substrate that sandwiches the reinforcing member, A second pad formed on the other portion of the folded side of the flexible substrate that sandwiches the reinforcing member, Equipped with, The substrate according to claim 1, wherein the first wiring connected to the first pad and the second wiring connected to the second pad extend toward the second substrate portion.

3. The substrate according to claim 1 or 2, wherein the tip of the second portion is housed inside the notch of the first portion.

4. The substrate according to claim 3, wherein in the second substrate portion, the portion of the flexible substrate on the side of the notch of the first portion and the tip portion of the second portion are sandwiched by the rigid substrate.

5. The substrate according to claim 1 or 2, wherein in the second substrate portion, the portion of the flexible substrate on the side of the notch of the first portion and the tip portion of the second portion sandwich the rigid substrate.

6. The substrate according to claim 1 or 2, wherein the reinforcing member has an engaging portion that can engage with the engaged portion of the connector to which the substrate is connected.

7. A substrate according to claim 1 or 2, A connector connected to the aforementioned circuit board, Equipped with, A connector unit in which an engaging portion provided on a reinforcing member of the substrate and an engaged portion provided on the connector can be engaged.

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