Interference prevention flexible wiring board, method, and apparatus for audio equipment with imaging function

Abstract

We provide an interference-preventing flexible wiring board for an audio device with imaging capabilities. [Solution] The flexible wiring board is an integrated strip-shaped multilayer circuit structure, with differential signal lines 121 for transmitting digital video and a main clock line 131 arranged on the outer conductive layers 120 and 130, and covered with an electromagnetic shielding film 160 to form a shield cavity. In addition, analog audio drive lines 122 and an independent microphone grounding line are integrated on the flexible wiring board, the grounding line is physically isolated from the main grounding network and is electrically connected only at terminal or pad locations, and a package body 170 is provided to provide outer layer protection.

Description

Technical Field

[0001] The present invention relates to the technical field of application-specific integrated circuits, and particularly to an interference-preventing flexible wiring board, method and device for an audio device with an imaging function. The interference-preventing flexible wiring board and its laminated structure according to the present invention are applied to an application-specific integrated circuit (ASIC) integrated in a wearable audio device having an imaging function and its peripheral interconnection structure. In the structural design, it is specifically optimized for the mixed transmission needs of high-speed digital video signals, analog audio signals and control signals. Particularly, it relates to a flexible wiring board structure that provides stable signal transmission, electromagnetic shielding and reliable interconnection to an application-specific integrated circuit in a narrow space.

Background Art

[0002] Bone conduction earphones can transmit audio information to the user and retain the ability to perceive ambient environmental sounds due to their "open-ear" characteristics, and are widely applied in sports, outdoor and safe and sensitive scenarios. As a typical prior art, as disclosed in the Chinese Utility Model Patent No. 205336486 Specification (bone conduction wireless earphones), its overall structure usually includes a headband assembly, an earhook assembly, and an ear unit provided at the ear position.

[0003] In conventional bone conduction earphone products, the electrical connection between the battery, the Bluetooth wiring board and the audio transducer is usually realized by a plurality of mutually independent circular conductors. For example, in the prior art, in order to realize power supply and the transmission of audio signals, the headband wire member, the left wire member and the right wire member are often penetrated into the narrow gap between the metal support strip and the silicon sleeve respectively. Such a harness structure can meet the basic needs of low-speed audio signals and DC power supplies, but its design premise does not consider the application scenarios of high-speed data transmission and the coexistence of multiple signal types.

[0004] With the advancement of wearable technology, there is a growing market demand for a combination of "first-person view (FPV) imaging" functionality and "high-quality audio experience." However, further integrating imaging functionality based on the external form factor and wearing structure of conventional bone conduction earphones presents numerous technical challenges, which are mainly reflected in the following areas.

[0005] First, in terms of spatial constraints and wiring, the ear hook assembly of bone conduction earphones is usually designed as a slender structure, often with a diameter of 5 mm or less, to balance wearing comfort and aesthetic requirements. Conventional circular enameled wire, stranded wire, or parallel harness solutions are only applicable to low-speed signal and power transmission. When introducing a camera module, it is necessary to additionally wire multiple lines for transmitting high-speed digital video signals, such as differential signal lines for the MIPI interface. If conventional wire harness methods are adopted, the overall volume of the wire harness increases significantly, making it difficult to lay within the existing ear hook cavity and thus structurally impractical.

[0006] Next, and more importantly, are electromagnetic interference and common ground noise. Camera modules need to transmit high-speed, high-frequency digital pulse signals during operation, and the rapid jumps in their signal edges can generate noticeable high-frequency electromagnetic radiation signals. In contrast, audio transducers require high-current analog drive signals, and microphones output analog audio signals with extremely low amplitude. When these signal lines of different properties are placed side by side in a narrow linear space, electromagnetic noise from high-speed digital signals is easily coupled to the analog audio lines through crosstalk, further forming a noticeable noise floor or noise that is audibly apparent.

[0007] Furthermore, conventional designs generally employ a common grounding circuit. When an audio transducer is in operation, its large current flows through the grounding wire, generating fluctuations in the ground potential. High-frequency grounding noise generated by the camera's digital circuit is also superimposed on the same grounding network. This common grounding interference due to grounding impedance (interference due to impedance coupling of the common ground) can not only degrade the sound pickup quality of the microphone but also negatively affect the stability of the video signal.

[0008] Furthermore, in terms of mechanical reliability and protective performance, conventional technology often involves loosely positioning wire components inside a silicone sleeve, resulting in a lack of clear hierarchical fixing and structural protection. When introducing a slide-adjustable camera structure, the connecting lines must repeatedly undergo push-pull and bending stresses, and conventional wire components are prone to fatigue failure at the connection points. At the same time, it is difficult to achieve a secure seal in the transition region between the wire component and the rigid housing, making it difficult for the entire device to meet high levels of protection requirements in terms of waterproofing, sweatproofing, etc.

[0009] In summary, conventional technologies lack an integrated interconnection solution that simultaneously achieves high-speed video signal transmission and high-current audio drive under very limited spatial conditions (for example, in connection areas with a width not exceeding 12 mm), effectively isolates electromagnetic interference and common ground noise control, is adaptable to dynamic sliding structures, and possesses good mechanical and protective performance. [Prior art documents] [Patent Documents]

[0010] [Patent Document 1] China Utility Model No. 205336486 Specification [Overview of the project] [Problems that the invention aims to solve]

[0011] Conventional bone conduction earphones typically use multiple circular wire bundles to connect to the battery, main board, and speaker. However, as wearable devices become more multifunctional, integrating imaging capabilities into bone conduction earphones presents significant challenges to conventional wiring methods. On the one hand, the internal space of the ear hook assembly is extremely narrow (usually less than 5 millimeters wide), making it difficult to accommodate the complex harness required to transmit high-speed digital video signals. On the other hand, the high-frequency radiation of high-speed digital video signals (e.g., MIPI signals) is prone to causing serious electromagnetic interference with the high-current analog drive signals of bone conduction and the weak analog signals of the microphone, potentially increasing the audio noise floor and reducing the signal-to-noise ratio. Furthermore, when a sliding adjustment function is added to the camera module, conventional wire connection methods are susceptible to fatigue failure from repeated pushing and pulling, making it difficult to achieve a high level of waterproof sealing at the connection points of each component. Therefore, the object of the present invention is to provide an interference-preventing flexible wiring board for an audio device with imaging capabilities, a method for manufacturing the same, and an earphone, which solve the common ground interference problem in mixed transmission of high-speed digital and analog signals in a confined space, ensure signal integrity, and satisfy the structural requirements of dynamic bending and waterproof sealing. [Means for solving the problem]

[0012] To achieve the above objectives, the present invention proposes the following technical solutions.

[0013] 1. To provide an interference prevention flexible wiring board for an audio device with imaging function, the flexible wiring board comprising a flexible conductive laminated structure, an electromagnetic shielding film, and a package body, wherein the flexible conductive laminated structure is configured as an integrated flexible strip structure and is divided into a mounting section and a connection section along its longitudinal direction, with the width of the connection section being between 2 and 12 mm, the flexible conductive laminated structure comprising a first conductive layer and a second conductive layer as outer signal layers, and a core layer located between the first conductive layer and the second conductive layer, the first conductive layer, the core layer, and the second conductive layer being separated by an insulating medium, and differential signal lines and a main clock line being formed in the first conductive layer and / or the second conductive layer, the differential signal lines being used to transmit digital video signals, and the main clock line being used to synchronize the clock frequencies of a master device and a slave device. The core layer forms a reference potential layer in at least a portion of its area, and the electromagnetic shielding film covers the outer surfaces of the first conductive layer and the second conductive layer, respectively, thereby enclosing the core layer, the differential signal line group, and the main clock line together in a shield cavity formed by the electromagnetic shielding film in at least a portion of the connection portion. The package body is provided at the connection portion and covers the flexible conductive laminated structure, forming an outer layer protection. The flexible conductive laminated structure further has an analog audio drive line group and an electrically independent microphone ground wire. The analog audio drive line group is used to transmit drive current to the audio transducer, and the microphone ground wire is physically isolated from the main grounding network of the flexible conductive laminated structure. The microphone ground wire is electrically connected to the main grounding network only at the terminal portion and / or pad location.

[0014] 2. A method for manufacturing the above-described interference-preventing flexible wiring board is provided, the method comprising the steps of: providing a core layer that forms a reference potential layer in at least a portion of the region; forming a first conductive layer and a second conductive layer on the upper and lower surfaces of the core layer, respectively, and physically isolating the first conductive layer and the second conductive layer from the core layer with an insulating medium to form a flexible conductive laminated structure; forming a differential signal line group and a main clock line by performing a patterning process on the first conductive layer and / or the second conductive layer; and constructing an electromagnetic shielding cavity that encloses the core layer, the differential signal line group and the main clock line by laminating electromagnetic shielding films to the outer surfaces of the first conductive layer and the second conductive layer, respectively. The process includes cutting a flexible conductive laminated structure covered with an electromagnetic shielding film into an integrated flexible strip structure and dividing it along the longitudinal direction into a mounting section and a connection section with a width of 2 to 12 mm, and forming a package body on the connection section to cover the flexible conductive laminated structure and form an outer layer protection. The flexible conductive laminated structure further has a group of analog audio drive lines and an electrically independent microphone ground line formed thereon. The group of analog audio drive lines is used to transmit drive current to the audio transducer, and the microphone ground line is physically isolated from the main grounding network of the flexible conductive laminated structure.

[0015] 3. An audio device with imaging function is provided, the device comprising a back-mounted assembly, an ear-hook assembly, an anti-interference flexible wiring board according to any one of claims 1 to 11, at least one ear unit, a camera module, and a main control circuit board, wherein the back-mounted assembly is used to surround the back of the user's head, the ear-hook assembly is connected to both ends of the back-mounted assembly, each ear-hook assembly has a proximal end connected to the back-mounted assembly and a distal end extending along the upper part of the user's auricle toward the user's face region, the anti-interference flexible wiring board is connected to the distal end, the at least one ear unit is physically connected to the distal end of the ear-hook assembly via the anti-interference flexible wiring board, the ear unit has a rigid housing, an audio transducer is housed inside the rigid housing, and the camera module is ear -Slidably connected to the outside of the unit and used to collect first-person view video signals, the main control circuit board is located in the internal cavity of the ear hook assembly, where the anti-interference flexible wiring board is a flexible bridge member connecting the ear hook assembly and the ear housing assembly, the connection portion of the anti-interference flexible wiring board is inserted into the ear hook assembly and inserted into the main control circuit board, the mounting portion of the anti-interference flexible wiring board extends into the rigid housing of the ear unit and is electrically connected to the camera module, the package body of the anti-interference flexible wiring board covers and seals the connection point between the distal end of the ear hook assembly and the rigid housing of the ear unit, forming an outer layer protection, and the anti-interference flexible wiring board simultaneously transmits the video signal from the camera module and the audio signal from the audio transducer as the main mixed signal transmission channel. [Effects of the Invention]

[0016] The proposed technology according to the present invention has the following beneficial effects.

[0017] 1. Excellent interference prevention performance. A unique layered design places high-speed digital video signals (differential lines / clock lines), which are prone to generating radiation, in the outer layer, while sensitive analog audio signals are placed in the inner core layer adjacent to the electromagnetic shielding film. The Faraday cage, consisting of shielding films, effectively contains high-frequency radiation and further blocks signal crosstalk by using the core layer as a reference ground plane.

[0018] 2. Solving common ground interference. In situations where bone conduction earphones have both high current drive and weak microphone signals, the present invention designs physically isolated and independent microphone ground wires, which are joined only at the endpoints (e.g., the terminal or pad area), effectively blocking ground loop noise and ensuring cleanliness of recordings and calls.

[0019] 3. Integration in extremely narrow spaces. This invention solves the spatial problem of simultaneously transmitting audio and video signals within a delicate ear hook by integrating multiple complex signals into an integrated, flexible strip-shaped structure with a width of 3.5 mm or less, thereby replacing conventional bulky and heavy harnesses.

[0020] IV. Reliable structural connection and protection. The interference-preventing flexible wiring board not only serves for signal transmission but also acts as a flexible bridge component to connect the rigid ear hook and ear unit. Furthermore, the package body can cover and seal the connection points between the rigid housings, achieving structural integration and excellent waterproof performance.

[0021] 5. Adaptable to slide adjustment. At the device level, the design of the flexible extension and redundant bent segments provided in the camera module cleverly solves the problem of line expansion and contraction during camera slide adjustment, preventing the main wiring board from breaking due to repeated stretching, and improving the product's mechanical lifespan and user experience.

[0022] Furthermore, the interference prevention flexible printed circuit board of the present invention is configured as a flexible interconnection structure for mounting and connecting at least one integrated circuit for a specific application. Here, the integrated circuit for a specific application is used for image signal processing, audio signal processing, or a control chip for wireless communication, and high-speed digital signals, analog signals, and control signals are simultaneously generated during operation.

[0023] Regarding the problems of electromagnetic coupling, common ground noise, and signal integrity degradation that are likely to occur when the integrated circuit for a specific application operates in a narrow space, the present invention installs a reference potential layer in the flexible conductive layer structure, arranges the high-speed differential signal line group in the outer layer adjacent to the electromagnetic shielding film, physically isolates the analog audio drive line group and the independent microphone ground line, and combines it with the shield and protection structure formed throughout the package body, thereby providing a stable and low-interference signal interconnection environment for the integrated circuit for a specific application, and enabling the integrated circuit for a specific application to operate reliably within the limited space of the wearable device.

Brief Description of the Drawings

[0024] To more clearly explain the embodiments of the present disclosure or the prior art solutions, the accompanying drawings used in the embodiments or the prior explanations are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. Those skilled in the art can obtain other drawings based on these drawings without creative labor.

[0025] [Figure 1] It is a cross-sectional view of an interference prevention flexible printed circuit board of an audio device with an imaging function according to an embodiment of the present technical solution. [Figure 2] It is a top view of an interference prevention flexible printed circuit board of an audio device with an imaging function according to an embodiment of the present technical solution. [Figure 3] It is a flowchart of a manufacturing method of an interference prevention flexible printed circuit board according to an embodiment of the present technical solution. [Figure 4] It is a cross-sectional view of a core layer according to an embodiment of the present technical solution. [Figure 5] Figure 4 is a cross-sectional view showing a core layer with a first conductive layer and a second conductive layer formed on the upper and lower surfaces, respectively. [Figure 6] Figure 5 is a cross-sectional view showing an insulating medium formed on the first conductive layer and the second conductive layer. [Figure 7] Figure 5 is a cross-sectional view showing an electromagnetic shielding film formed on the first conductive layer and the second conductive layer. [Figure 8] Figure 7 is a schematic diagram illustrating the transformation of a flexible conductive laminated structure covered with an electromagnetic shielding film into an integrated flexible strip structure. [Figure 9] This is a schematic perspective view of an audio device with imaging function according to an embodiment of the present invention. [Figure 10] This is a schematic diagram of the exploded structure of an audio device with imaging function according to an embodiment of this proposed technology. [Figure 11] This is a schematic diagram showing the structure in which the camera module of an audio device with imaging capabilities is slidably connected. [Figure 12] This is a schematic diagram illustrating the structure of an interference-preventing flexible wiring board as a flexible bridge component connecting the ear hook assembly and the ear unit. [Figure 13] This is a schematic diagram of a structure in which an elastic element is filled in the gap between the interference-preventing flexible wiring board, the ear hook assembly, and the ear unit. [Modes for carrying out the invention]

[0026] The technical concepts in embodiments of this disclosure are described below with reference to the accompanying drawings of embodiments of this disclosure. Clearly, the embodiments described are some of the embodiments of this disclosure, but not all of them. All other embodiments that can be obtained by those skilled in the art without creative work based on embodiments of this disclosure are included in the scope of protection of this disclosure.

[0027] Refer to Figure 1. This is an interference-preventing flexible wiring board 100 for an audio device with imaging function according to an embodiment of the present invention. The interference-preventing flexible wiring board 100 mainly comprises a flexible conductive laminated structure 110, an electromagnetic shielding film 160, and a package body 170. Here, as shown in Figure 2, the flexible conductive laminated structure 110 is configured as an integrated flexible strip structure and is divided along its longitudinal direction into a mounting section 111 and a connection section 112, with the width W of the connection section 112 being between 2 and 12 mm. Specifically, the width W of the connection section 112 can be adjusted according to the structural form, wearing method, and internal wiring needs of the wearable audio device to which it is applied. If the wearable audio device has an over-ear structure, the connection section 112 usually needs to be inserted into an elongated curved space extending along the outside of the user's auricle, and the lateral dimensions of the space are limited by the contour of the ear and wearing comfort. Accordingly, in a preferred embodiment, when applied to an over-ear structure, the width W of the connector 112 is preferably limited to within 3.5 mm to fit into the narrow passage inside the over-ear assembly and avoid causing pressure or a foreign body sensation to the user's ear. In another embodiment, when the wearable audio device is a head-mounted structure, the connector 112 may be positioned along the outside of the head or in a headband structure, and the available lateral space is increased compared to the over-ear structure. Accordingly, the width W of the connector 112 can be moderately increased to accommodate more conductive layers, shielding structures or reinforced package bodies, but is usually limited to within 12 mm in order to maintain a slim overall appearance and ensure wearing comfort. In any value within the above range for the width W of the connector 112, the design goal is to minimize the lateral dimension as much as possible in order to reduce the burden on the user during prolonged wear of the wearable device, while satisfying the requirements for signal transmission, electromagnetic shielding, and structural strength. Therefore, in specific applications, the width W of the connecting portion 112 tends to be selected to a small value within the above range, in order to balance structural compactness and wearing comfort.In this embodiment, the flexible strip structure has an overall elongated shape and is inserted to fit into the narrow internal space of a wearable audio device cavity. The mounting portion 111 is mainly for mounting or electrically connecting a functional module, which includes, for example, a camera module, an audio transducer interface, or other electronic components, and the connection portion 112 is a flexible bridge segment extending outward from the mounting portion 111 to realize electrical connection and signal transmission between different structural members. Specifically, since the connection portion 112 extends along the longitudinal direction, its lateral dimension is limited to within 12 mm or less by the mounting structure of the wearable device, thereby allowing it to be inserted into various narrow internal passages and avoiding adverse effects on wearing comfort and external dimensions. Compared to conventional wire harness structures formed using multiple circular conductors, the integrated flexible strip structure is advantageous in that it significantly reduces wiring volume by integrating multiple signal lines into the same flexible conductive laminate, thereby improving the overall structural consistency and reliability. Furthermore, since the mounting portion 111 and the connecting portion 112 are integrally formed in the same flexible conductive laminated structure 110, the problems of stress concentration due to welding, bending, or tension at the connection nodes of conventional wire members are avoided. The flexible conductive laminated structure 110 is better adapted to the problems of repeated bending and displacement that occur during the daily use of wearable devices, thereby improving the overall mechanical durability and service life of the device.

[0028] Specifically, the flexible conductive laminated structure 110 comprises a first conductive layer 120 and a second conductive layer 130 as outer signal layers, and a core layer 140 located between the first conductive layer 120 and the second conductive layer 130, with the first conductive layer 120, the core layer 140, and the second conductive layer 130 separated by an insulating medium 150. The core layer is at least one conductive layer or composite conductive layer located in the middle of the flexible conductive laminated structure 100, and its main function is to provide a reference potential, a signal return path, and mechanical support. In this embodiment, the first conductive layer 120 and the second conductive layer 130 are provided on opposite sides of the flexible conductive laminated structure 110, respectively, and are used to form the outermost conductive layer structure of the laminate, while the core layer 140 is provided between the first conductive layer 120 and the second conductive layer 130 and is used to provide internal structural support for the laminate. With the above-described multilayer structure, the flexible conductive laminated structure 110 can form a clearly defined hierarchical laminated structure even when the overall thickness is strictly limited. This is advantageous for integrating multilayer conductive layers within limited lateral dimensions and satisfies the need for placement in narrow spaces.

[0029] Furthermore, the core layer 140 may consist of a single conductive layer, or it may consist of multiple internal conductive layers separated by an insulating medium 150. For example, in this embodiment, the core layer 140 may be a double-sided copper-clad flexible substrate, that is, a two-layer conductive layer structure separated by one insulating medium may be selected. In one modification, the core layer 140 may be a multilayer conductive structure formed by stacking at least two single-sided copper-clad flexible substrates, depending on the specific structural strength requirements or the number of laminated layers required. The insulating medium 150 is placed between adjacent conductive layers, electrically isolating each conductive layer, and also plays a supporting and buffering role in the mechanical structure. By rationally selecting the thickness and material properties of the insulating medium 150, it is possible to achieve both reliable interlayer insulation and overall flexibility without significantly increasing the total thickness of the laminate.

[0030] In this embodiment, the first conductive layer 120, the second conductive layer 130, and the core layer 140 may all be manufactured from adhesive-free rolled copper material. By omitting the conventional adhesive layer structure, the overall thickness of the flexible conductive laminated structure 110 can be effectively reduced, thereby securing more sufficient space for stacking elements for the mounting section 111. Furthermore, rolled copper has better grain orientation consistency and ductility compared to electrolytic copper, and the flexible conductive laminated structure 110 exhibits superior flexibility and fatigue resistance during repeated bending or flexing processes. Therefore, the adhesive-free rolled copper laminated structure is particularly suitable for laying in connection section 112 areas with limited width along curved paths, meeting the dynamic bending needs that the connection section 112 must withstand during use.

[0031] The first conductive layer 120 and / or the second conductive layer 130 have a differential signal line group 121 for transmitting digital video signals and a main clock line 131 formed thereon, and the differential signal line group 121 is the main clock line 131 for synchronizing the clock frequencies of the master device and the slave device. In this embodiment, the differential signal line group 121 is arranged in the first conductive layer 120 and the main clock line 131 is arranged in the second conductive layer 130, and by arranging the differential signal line group 121 and the main clock line 131 in the outermost layer of the flexible conductive laminate structure 110, a concentrated arrangement of high-speed signal lines can be achieved in a limited lateral space, and a clear spatial positional relationship can be provided to the subsequent electromagnetic shield structure.

[0032] In this embodiment, the core layer 140 forms a reference potential layer in at least a portion of its region to provide a stable reference potential to the signal lines on the first conductive layer 120 and / or the second conductive layer 130. The differential signal line group 121 and the core layer 140 are separated from each other by an insulating medium 150, and the insulating medium 150 layer has a preset interlayer thickness range, thereby forming a relatively stable geometric distance between the differential signal line group 121 and the core layer 140. For example, the thickness of the insulating medium 150 may be 15 μm to 60 μm, in one modification the thickness of the insulating medium 150 is about 25 μm, and in another modification the thickness of the insulating medium 150 is about 50 μm. Here, the thickness of the insulating medium can be adjusted according to the dielectric constant of the material and the inter-line distance of the line width, and can be verified by impedance testing. By designing the material type of the insulating medium 150 and the interlayer thickness thereof, the differential signal line group 121 can obtain desired distributed capacitance and distributed inductance parameters during the transmission process, thereby enabling control over high-speed signal characteristic impedance, maintaining signal integrity of digital video signals, and reducing the risk of reflection and distortion.

[0033] Furthermore, the flexible conductive laminated structure 110 has a group of analog audio drive lines 122 formed therein for transmitting drive current to the audio transducer. Because the current carried by the analog audio drive line group 122 during operation is larger than that of high-speed digital video signals, a relatively large line width is adopted in the wiring design. In this embodiment, the line width of the analog audio drive line group 122 is 0.2 mm or more, and ground shielding wires 123 with a line width of 0.3 mm or more are installed parallel to both sides of the analog audio drive line group 122, thereby forming lateral electromagnetic isolation for the analog audio drive line group 122 within the same conductive layer and reducing the influence of crosstalk from adjacent lines. Generally, so-called fine circuits refer to those with a width of 1 mil or less (approximately 0.25 mm), and when transmitting high dynamic audio signals, the DC resistance (DCR) of the circuit is greatly increased, so it is necessary to design a wide circuit to reduce audio distortion and avoid the circuit temperature becoming too high due to the current-thermal effect, which would affect reliability in a narrow, enclosed space. Based on the principle of electromagnetic compatibility, the wider the grounding wire, the lower its inductance and impedance, allowing coupled interference noise to be effectively introduced into the main grounding network. Therefore, by installing the wide grounding shield wire 123 in the same layer, the lateral coupling capacitance can be used to absorb edge radiated fields from adjacent analog audio drive wire groups 122, forming effective lateral electromagnetic isolation for the analog audio drive wire groups 122 within the same conductive layer. The above line width range is set in accordance with the overall thickness, number of layers, and spatial limitations of the flexible conductive laminate structure 110, while satisfying the requirements for current load and interference prevention, thereby achieving a favorable balance between interference prevention capability and structural dimensions and having good processability. In one modified example, if the core layer 140 is composed of multiple internal conductive layers, for example, the core layer 140 includes three or more internal conductive layers, and the analog audio drive wire groups 122 can be assigned to different internal conductive layers to share the audio drive current and improve the overall current withstand capability.Distributing the analog audio drive line group 122 across different internal conductive layers is advantageous not only for reducing the current density in a single conductive layer, but also for improving the reliability of the audio drive path without increasing the lateral dimensions of the flexible conductive laminated structure 110.

[0034] In this embodiment, the flexible conductive laminated structure 110 is provided with a main grounding network to provide a common reference potential and return path to each type of circuit within the flexible conductive laminated structure 110, and the grounding shield wire 123 is connected to the main grounding network to enhance the lateral electromagnetic isolation effect with respect to the analog audio drive wire group 122. The main grounding network may be formed by at least one internal conductive layer in the core layer 140, or by grounding lines provided in the first conductive layer 120 and / or the second conductive layer 130 and the reference potential layer in the core layer 140, thereby forming a continuous and low-impedance grounding network within the laminated structure. Specifically, the main grounding network extends along the longitudinal direction of the flexible strip structure and is connected to an external circuit system via terminals or pad areas to achieve consistency with the main equipment reference. The main grounding network is intended to carry the return current of high-speed digital signals, the return current of audio drive signals, and common return currents generated by other functional modules. Therefore, in the structural design, it is preferable to have a larger equivalent cross-sectional area to reduce the impedance of the grounding path and reduce fluctuations in the grounding potential. In one embodiment, the core layer 140 forms a continuous reference potential layer in part or all of its area and is a major component of the main grounding network. This allows signal lines located in adjacent conductive layers to obtain a stable reference plane, which is advantageous for controlling the signal return path and reducing loop area. In another embodiment, the main grounding network can be electrically connected to grounding wires located in different conductive layers via conductive connection structures (e.g., conductive vias, conductive points of conductive adhesive, or local conductive voltage connection structures). Preferably, the conductive connection structures are provided in areas where bending is less necessary to reduce the risk of fatigue due to repeated bending.

[0035] Furthermore, in order to reduce the impact of common ground noise on audio signal quality, the flexible conductive laminated structure 110 is further provided with an electrically independent microphone ground wire 141. The microphone ground wire 141 is continuously arranged along an independent conductive path within the entire length range of the connection portion 112 of the flexible strip-shaped structure, and is not electrically connected to the analog audio drive line group 122 or high-speed signal lines along its path, nor is it electrically connected to the main grounding network, thereby structurally maintaining a physical isolation relationship with the main grounding network. That is, the microphone ground wire 141 maintains a predetermined distance from the main grounding network along its course, and no conductive structure or conductive adhesive contact point is provided in the non-pad area. Therefore, the microphone ground wire 141 is equipotentially connected to the main grounding network only at the terminal portion and / or pad position to form a single-point ground structure, thereby avoiding the audio drive current or high-speed digital signal return current being superimposed on the microphone grounding path, and reducing the impact of common ground interference on the microphone's sound pickup quality. In a preferred embodiment, a nanowaterproof coating layer may be provided on the outer surface of the flexible conductive laminated structure 110, the nanowaterproof coating layer being a thin film layer having hydrophobic properties, further improving the protective ability of the flexible conductive laminated structure 110 in wet, sweaty, or watery environments. Specifically, the nanowaterproof coating layer covering at least one exposed surface of the flexible conductive laminated structure 110 includes, but is not limited to, covering the outer surface of the first conductive layer 120, the second conductive layer 130, or an electronic component attached to the first conductive layer 120 and the second conductive layer 130, thereby forming a continuous hydrophobic protective interface on the outside of the flexible conductive laminated structure 110. By providing the nanowaterproof coating layer on the surface, the adhesion of moisture or sweat to the surface of the flexible conductive laminated structure 110 can be reduced, making it easier for liquids to form droplets and roll off, and reducing the possibility of moisture accumulating on the surface or penetrating into the interior.In this embodiment, the nanowaterproof coating layer may be a functional coating having a nanoscale thickness, and its material may be a fluorine-containing polymer, a siloxane-based material, a nanomodified resin, or other coating material having hydrophobic or superhydrophobic properties. The nanowaterproof coating layer may be formed by spray coating, immersion coating, chemical vapor deposition, plasma treatment, or other film formation processes applied to the surface of the flexible wiring board, and maintains good adhesion to the outer surface of the flexible conductive laminated structure 110. Because the thickness of the nanowaterproof coating layer is relatively thin, it provides hydrophobic protection without significantly affecting the overall thickness, bending performance, or electrical properties of the flexible conductive laminated structure 110. Furthermore, by providing the nanowaterproof coating layer, the influence of humidity changes on the characteristic impedance of the differential signal line group 121 and the continuity of the electromagnetic shield can be reduced.

[0036] The electromagnetic shielding film 160 covers the outer surfaces of the first conductive layer 120 and the second conductive layer 130, respectively, thereby enclosing the core layer 140, the differential signal line group 121, and the main clock line 131 together in a shield cavity formed by the electromagnetic shielding film 160 in at least a portion of the connection portion 112. By installing the electromagnetic shielding film 160 on the outside of the flexible conductive laminated structure 110, the connection portion 112 forms a structurally sealed electromagnetic shield space, providing external shielding to the high-speed signal lines inside the flexible conductive laminated structure 110. In this embodiment, the electromagnetic shielding film 160 may be a conductive metal thin film or a composite conductive film, and the electromagnetic shielding film 160 is laid continuously along the longitudinal direction of the flexible strip-shaped structure, covering the outer surfaces of the first conductive layer 120 and the second conductive layer 130. With the above configuration, the flexible conductive laminated structure 110 achieves constraint on the internal electromagnetic field under limited thickness conditions by forming a shield cavity structure in the region of the connection portion 112 that is limited by the electromagnetic shielding films 160 on both the upper and lower sides. In this embodiment, the differential signal line group 121 specifically includes MCN, MCP, MDN0, and MDP0 lines for transmitting MIPI interface signals. The differential signal line group 121 is arranged directly adjacent to the electromagnetic shielding film 160 in the lamination direction. Here, "adjacent" means that only one insulating medium is interposed between the differential signal line group 121 and the electromagnetic shielding film 160 on the corresponding side, and that there are no other conductive layers or signal lines between the differential signal line group 121 and the electromagnetic shielding film 160. By positioning the differential signal line group 121 in close proximity to the electromagnetic shielding film 160 using the above-described "proximity" structure, the shortest possible electromagnetic coupling distance is formed. During the transmission of high-speed digital signals, the high-frequency electromagnetic field generated by the differential signal line group 121 can be absorbed or reflected by the electromagnetic shielding film 160 within the near-field region. This reduces the coupling of high-frequency energy to other conductive lines inside the flexible conductive laminated structure 110, thereby reducing crosstalk and electromagnetic interference.Furthermore, since the differential signal line group 121 itself employs a differential structure with pairs of lines, the signal currents have opposite directions in the two complementary lines, thus achieving a certain degree of radiation self-cancellation. However, under high-speed operating conditions, remaining common-mode components or high-frequency edge radiation may still exist. By placing the differential signal line group 121 and the electromagnetic shielding film 160 in very close proximity in the stacking direction, the residual radiation components can be further suppressed, thereby improving the electromagnetic compatibility of high-speed digital signals in terms of structure. In this embodiment, the electromagnetic shielding film 160 may be electrically connected to the main grounding network and grounded as the reference potential layer of the electromagnetic shield during operation. In one modification, the electromagnetic shielding film 160 may be connected to the main grounding network in a part of the region, satisfying the shielding effect while maintaining the bending performance of the flexible conductive laminated structure 110. With the above method, the electromagnetic shielding film 160 provides an effective electromagnetic isolation environment for the high-speed differential signal line group 121 without significantly increasing the thickness of the structure. Therefore, through the cooperative configuration of the electromagnetic shielding film 160 and the differential signal line group 121, this embodiment can achieve stable transmission of high-speed digital video signals in a flexible strip structure with limited width, and can effectively reduce electromagnetic interference to the analog audio drive line group 122, the microphone ground line 141, and other low-level signal lines during the transmission process of high-speed digital video signals. Accordingly, the present invention, through layered wiring and shield isolation design, effectively reduces common ground interference in mixed transmission of high-speed digital and analog signals in a narrow and limited space, and significantly improves signal quality.

[0037] The package body 170 is mainly provided on the connection portion 112, covering the flexible conductive laminated structure 110 and forming an outer layer protection. Here, the package body 170 is continuously provided along the longitudinal direction of the connection portion 112, covering the flexible conductive laminated structure 110 overall and preventing the connection portion 112 from being directly exposed to the external environment. In this embodiment, the package body 170 is preferably made of a waterproof elastic material, such as a silicone material. By selecting silicone, which has good elasticity and a flexible feel, as the material for the package body 170, the connection portion 112 can fit the contour of the user's ear or head during the wearing process, improving wearing comfort and reducing pressure on the skin. At the same time, the silicone material has good rebound properties, and when the connection portion 112 is bent or displaced, it can be deformed without easily cracking or permanently deforming due to the flexible conductive laminated structure 110. Furthermore, the silicon material itself has excellent water and sweat resistance, and the package body 170 completely covers the flexible conductive laminated structure 110 in a sealed manner, thereby forming a continuous protective layer in the area of ​​the connection portion 112. This prevents moisture, sweat, or dust from penetrating into the flexible conductive laminated structure 110 along the connection portion 112, improving the reliability of the device during daily wear and exercise. In one embodiment, the package body 170 is formed by injection molding, overmolding, or press molding to achieve close contact between the package body 170 and the flexible conductive laminated structure 110. Specifically, the package body 170 not only provides waterproofing and protection, but also offers a flexible cushioning function to distribute mechanical stress caused by bending, pulling, or external force on the connection portion 112, thereby reducing the risk of stress concentration at the terminal or pad location of the flexible conductive laminated structure 110 and further improving the overall mechanical durability of the structure.

[0038] In one variation, the package body 170 may be made of another material having elasticity and protective properties, such as thermoplastic elastomer (TPE) or thermoplastic polyurethane (TPU), making trade-offs between flexibility, abrasion resistance, or molding efficiency in different application scenarios. The selection of these different materials does not alter the basic function of the package body 170, and still provides sealing and outer layer protection for the flexible conductive laminated structure 110. The arrangement of the package body 170 allows the flexible conductive laminated structure 110 to simultaneously possess multiple functions in the connection area 112, including waterproofing, protection, cushioning, and comfortable bonding.

[0039] Referring to Figure 3, Figure 3 is a flowchart of a method for manufacturing an interference-preventing flexible wiring board for an audio device with imaging function according to an embodiment of the present invention, and mainly includes the following steps.

[0040] In the first step S1, as shown in Figure 4, a core layer 140 is provided, which forms a reference potential layer in at least a portion of its area. In one embodiment, the core layer 140 may include at least one conductive layer that is continuously provided within at least a portion of the core layer 140 to form a reference potential layer. The reference potential layer is used to provide a stable reference potential and return path to high-speed signal lines and other signal lines in a subsequent laminated structure. In this embodiment, the core layer 140 employs a double-sided copper cladding structure, i.e., conductive layers are formed on the upper and lower surfaces of the first insulating medium 151, and at least one of the conductive layers can be used as the reference potential layer. Specifically, the core layer 140 is used as an intermediate layer in the overall structure to provide mechanical support and electrical reference to the conductive layers that are formed later, and the first insulating medium 151 is preferably, for example, polyimide (PI) resin or another insulating substrate applied to flexible wiring boards, in order to achieve a balance of heat resistance, mechanical strength and bending performance. In one modified example, the core layer 140 may be composed of a plurality of internal conductive layers, for example, by providing a plurality of conductive layers separated by an insulating medium on a multilayer flexible substrate, at least one of the internal conductive layers forms a reference potential layer in a predetermined region. With this method, the area, position, and continuity of the reference potential layer can be flexibly adjusted according to the actual design requirements, provided that the overall thickness is limited. In one preferred embodiment, by continuously forming the reference potential layer in a portion of the core layer 140, a stable reference plane can be provided for high-speed signal lines, and in other regions, the reference potential layer can be adjusted, for example, by partially installing openings or partitioning it, without affecting its basic function as a reference potential layer, according to the needs of the element layout or structure.

[0041] By completing the provision of the core layer 140 in step S1 above, the core layer 140 has structurally flexible support capabilities and provides electrically stable reference potential conditions for the conductive layers and signal lines to be formed subsequently, laying the foundation for the formation of the conductive structure and electromagnetic shielding structure in subsequent steps.

[0042] In the second step S2, referring to Figure 5, a first conductive layer 120 and a second conductive layer 130 are formed on the upper and lower surfaces of the core layer 140, respectively. The first conductive layer 120 and the second conductive layer 130 are physically isolated from the core layer 140 by a second insulating medium 152, thereby forming a flexible conductive laminated structure 110. A differential signal line group 121 and a main clock line 131 are formed by patterning the first conductive layer 120 and / or the second conductive layer 130. In this embodiment, the first conductive layer 120 and the second conductive layer 130 are provided on opposite sides of the core layer 140, respectively. By providing the second insulating medium 152 between the core layer 140 and the corresponding first conductive layer 120 and second conductive layer 130, the first conductive layer 120, the second conductive layer 130 and the substrate layer are electrically isolated from each other, and they are structurally stable and stacked to form a continuous flexible conductive laminated structure 110 as a whole. In detail, the second insulating medium 152 is formed by using a flexible substrate that is the same as or compatible with the first insulating medium 151, ensuring that the flexible conductive laminated structure 110 has consistent mechanical properties in subsequent bending or flexing processes. In this embodiment, the method of patterning the first conductive layer 120 and / or the second conductive layer 130 may include photolithography, etching, or other circuit shaping processes applied to flexible wiring boards, which can form signal lines in a predetermined direction on the first conductive layer 120 and / or the second conductive layer 130. The patterning process forms the differential signal line group 121 for transmitting digital video signals and the main clock line 131 for providing timing synchronization on the first conductive layer 120 and / or the second conductive layer 130. The patterning process may be performed after the lamination is complete or before the first conductive layer 120 and the second conductive layer 130 are bonded to the core layer 140. The specific process sequence can be adjusted according to manufacturing conditions.

[0043] In this embodiment, the flexible conductive laminated structure 110 is further formed with a group of analog audio drive lines 122 for transmitting drive current to an audio transducer. The group of analog audio drive lines 122 is selectable according to the current load requirements and the overall laminated layout, and is formed within the first conductive layer 120, the second conductive layer 130, or the core layer 140 by a patterning process. Furthermore, the flexible conductive laminated structure 110 is further formed with an electrically independent microphone ground wire 141, preferably formed within the core layer 140, continuously arranged along the longitudinal direction of the flexible conductive laminated structure 110, and maintaining independent wiring within the entire length of the connection portion 112 of the flexible strip-shaped structure. During the formation process, the microphone ground wire 141 is not electrically connected to the signal lines in the first conductive layer 120 or the second conductive layer 130, and is structurally physically isolated from the main grounding network of the flexible conductive laminated structure 110. Therefore, the microphone ground wire 141 is equipotentially connected to the main ground wire network only at predetermined pad positions to form a single-point ground structure. This method enables independent planning of the microphone's ground path during the manufacturing stage, and avoids superposition with high-speed signal return current or audio drive current during subsequent use, thereby reducing the impact of common ground noise on microphone signal quality.

[0044] By completing step S2 described above, a flexible conductive laminated structure 110 with a completed structural and electrically defined circuit is obtained, providing a foundation for subsequent steps such as bonding electromagnetic shielding films, cutting strip-shaped structures, and forming package bodies.

[0045] Furthermore, as shown in Figure 6, after the patterning process of the first conductive layer 120 and the second conductive layer 130 is completed, the outer surfaces of the first conductive layer 120 and the second conductive layer 130 can be covered with the third insulating medium 153 to protect the signal circuits located within the first conductive layer 120 and the second conductive layer 130. In this embodiment, the third insulating medium 153 is provided on the outermost surface of the flexible conductive laminate structure 110 and forms a temporary or permanent insulating coating for signal lines exposed to the outside before subsequent process steps. By providing the third insulating medium 153, the first conductive layer 120 and the second conductive layer 130 can avoid the risk of unintended damage, contamination, or short circuits during subsequent processing, transport, or lamination processes, thereby improving the stability and yield of the manufacturing process. In one embodiment, the third insulating medium 153 may be a coating film, a protective film, or a solder resist layer, and its material may be a polyimide film, a heat-resistant insulating coating layer, or other insulating material applicable to flexible wiring boards. The third insulating medium 153 is formed by methods such as bonding, coating, or lamination, and maintains good adhesion between the first conductive layer 120 and the second conductive layer 130, thereby achieving effective protection without significantly increasing the overall thickness. In this embodiment, the third insulating medium 153 continuously covers the first conductive layer 120 and the second conductive layer 130, allowing it to adapt to subsequent process operations such as bending, cutting, or bonding of the electromagnetic shielding film 160. Depending on the welding or connection needs of the element, partial openings can be provided in the third insulating medium 153 to expose predetermined pads or connection areas in subsequent processes.

[0046] By placing the third insulating medium 153 outside the first conductive layer 120 and the second conductive layer 130, reliable electrical and mechanical protection can be provided to the outer layer signal circuit during the manufacturing stage. Furthermore, it is possible to provide relatively flat and stable surface conditions for the subsequent bonding of the electromagnetic shielding film, which is advantageous for forming a structurally complete flexible conductive laminated structure 110.

[0047] In the third step S3, as shown in Figure 7, an electromagnetic shielding cavity enclosing the core layer 140, the differential signal line group 121, and the main clock line 131 is constructed by laminating an electromagnetic shielding film 160 to the outer surfaces of the first conductive layer 120 and the second conductive layer 130, respectively. Here, the electromagnetic shielding film 160 is preferably conductive silver foil and employs a multilayer composite structure, specifically including a conductive adhesive layer 163, a metal layer 162, and an outermost protective layer 161. Here, the conductive adhesive layer 163 is provided on the side closer to the flexible conductive laminated structure 110 and is for establishing a stable electrical connection relationship with the first conductive layer 120 or the second conductive layer 130 during the lamination process, the metal layer 162 is for providing the main electromagnetic shielding function, and the protective layer 161 is for mechanical and environmental protection of the metal layer 162, preventing oxidation, wear, or external force damage. In one preferred embodiment, the conductive adhesive layer 163 is filled into the opening region of the third insulating medium 153 during the bonding process, so that the first conductive layer 120 and the second conductive layer 130 can form a reliable electrical connection via the conductive adhesive layer 163 and the metal layer 162. In one modified example, the electromagnetic shielding film 160 may be made of other shielding materials having good conductivity and flexibility, such as conductive copper foil, nickel-plated metal foil, or composite conductive film, depending on the needs of different products, and still aims to establish a reliable electrical connection with the flexible conductive laminate structure 110 to form a continuous shielding passage. Here, the third insulating medium 153 forms an opening at a predetermined grounding position so as to expose the grounding region of the first conductive layer 120 and / or the second conductive layer 130, and the conductive adhesive layer 163 fills the opening and contacts the grounding region during bonding, thereby providing continuous conductivity of the electromagnetic shielding film 160 to the main grounding network.

[0048] With the above design, the electromagnetic shielding film 160 can form a continuous conductive coating structure with the flexible conductive laminated structure 110, constituting a sealed or semi-sealed electromagnetic shielding cavity. Therefore, the core layer 140, the differential signal line group 121, and the main clock line 131 are entirely covered inside the shielding cavity formed by the electromagnetic shielding film 160, thereby significantly reducing the leakage of electromagnetic radiation to the outside during high-speed digital signal transmission. Furthermore, since the differential signal line group 121 is installed adjacent to the electromagnetic shielding film 160 in the lamination direction, the electromagnetic field generated during the operation of high-frequency digital video signals is absorbed at close range by the electromagnetic shielding film 160 and reflected or attenuated by the metal layer 162, thereby reducing electromagnetic interference to analog audio circuits and other sensing signal circuits inside the lamination. At the same time, using the core layer 140 as a reference potential layer to form a stable electromagnetic environment together with the electromagnetic shielding film 160 is advantageous for further improving the signal integrity of high-speed signal transmission.

[0049] According to step S3 described above, a structurally complete and electrically continuous electromagnetic shielding cavity can be formed in a specific region without significantly increasing the overall thickness of the flexible conductive laminated structure 110, providing the basic conditions for achieving stable mixed transmission of high-speed digital video signals and analog audio signals in a subsequent narrow space.

[0050] In the fourth step S4, as shown in Figure 8, the flexible conductive laminated structure 110 covered with the electromagnetic shielding film 160 is cut into an integrated flexible strip structure and divided along its longitudinal direction into a mounting portion 111 and a connection portion 112, with the width W of the connection portion 112 being between 2 and 12 millimeters. In a preferred embodiment, the width W of the connection portion 112 can be limited to 3.5 millimeters or less. Specifically, the cutting step is performed after the bonding of the electromagnetic shielding film 160 is completed, so that the flexible strip structure after cutting leaves the complete flexible conductive laminated structure 110 and the electromagnetic shielding film 160 within the areas of the mounting portion 111 and the connection portion 112, thereby avoiding damage to the continuity of the electromagnetic shield or the integrity of the interlayer structure due to improper cutting during subsequent use. The flexible conductive laminated structure 110 may be in the form of connection plates arranged in a matrix before cutting, and is cut by a precision cutting process, for example, by laser cutting, punching, or numerically controlled die cutting, to cut the flexible conductive laminated structure 110 into an integrated flexible strip structure extending along the longitudinal direction. The contour shape of the flexible strip structure may be designed in advance according to the overall structure of the product, and the flexible strip structure after cutting forms a shape that extends continuously in the longitudinal direction. In this embodiment, at least a mounting section 111 and a connection section 112 with different functions are partitioned along the longitudinal direction of the flexible strip structure. Here, the mounting section 111 has a structure with a larger local width than the connection section 112 for housing or mounting electronic elements, pad areas, or for electrical connection with components such as a camera module 240 or a wiring board, and the connection section 112 is used as a channel to which the mounting section 111 extends to the outside and is electrically connected, mainly to realize a flexible bridge and signal transmission in a narrow space. In one preferred embodiment, the connecting portion 112 is cut into a narrow structure with a width W of 3.5 mm or less so that it can fit into the internal space of an ear hook assembly, folding cavity, or other narrow passage in an audio device.By limiting the width of the connection portion 112 to the above range, it is possible to lay and bend the flexible strip structure under conditions of a small radius of curvature without sacrificing the multiple laminated structures and shielding structures, thereby achieving both wiring density and ease of installation.

[0051] Furthermore, the mounting portion 111 and the connecting portion 112 are integrally molded structures, and there is no independent joining or welding interface between them, thus avoiding problems of mechanical stress concentration or electrical discontinuity due to interface transitions. The overall cutting and molding process creates a smooth transition between the mounting portion 111 and the connecting portion 112 of the flexible strip structure, which is advantageous in maintaining structural reliability during subsequent assembly or dynamic bending processes. In modified examples, the specific length ratio, external contour, or local width of the connecting portion 112 and the mounting portion 111 can be adjusted according to the needs of different product structures, and the connecting portion 112 can maintain a width of 3.5 millimeters or less, enabling flexible connection and signal transmission functions.

[0052] In the fourth step S4 described above, the flexible conductive laminated structure 110 is formally transformed from a semi-finished product in the form of board connections into an integrated flexible strip structure with clearly defined functional compartments, laying the foundation for the subsequent formation of the package body and assembly with the internal structure of the audio device.

[0053] In the fifth step S5, as shown in Figure 1, the flexible conductive laminated structure 110 is covered and an outer layer protection is formed by forming the package body 170 on the connection portion 112. In this embodiment, the package body 170 is mainly formed in the connection portion 112 area of ​​the flexible strip-shaped structure, and the mounting portion 111 is at least partially exposed or only partially protected, facilitating electrical connection and assembly with subsequent main control circuit boards, camera modules, or other electronic components. By limiting the provision of the package body 170 to the connection portion 112, the bending area is sufficiently protected, and unnecessary restrictions on welding, assembly, and dimensional layout of the mounting portion 111 can be avoided. In a preferred embodiment, the package body 170 is made of a waterproof elastic material, preferably a silicon material, and is formed by injection molding. Specifically, after the fourth step S4 is completed, the cut and molded flexible strip structure is placed in a pre-set cavity to position the connection portion 112 within the injection area of ​​the cavity, and the mounting portion 111 is made to protrude outside the cavity by a positioning structure. Subsequently, a liquid or semi-fluid silicone material is injected into the cavity by an injection molding process, so that the liquid or semi-fluid silicone material covers the outer surface of the connection portion 112, forming a continuous and dense package body 170 after curing. In this embodiment, since the silicone rubber material has good elastic recovery performance and a flexible feel after curing, the package body 170 provides effective mechanical cushioning and stress distribution to the flexible conductive laminate structure 110 without significantly increasing the overall rigidity of the connection portion 112. If the connection portion 112 is repeatedly bent, twisted, or pulled during use, the package body 170 can absorb and disperse the external force, reducing the risk of fatigue damage to the internal conductive layer and insulating medium.

[0054] Furthermore, during the molding process, the package body 170 is continuously bonded to the electromagnetic shielding film 160, the third insulating medium 153, and the outer surface of the flexible conductive laminated structure 110, thereby forming a continuous sealing structure in the region of the connection portion 112. Specifically, the package body 170 is continuously molded along the longitudinal direction of the connection portion 112, forming a package transition segment integrated in the transition region between the connection portion 112 and the mounting portion 111, thereby avoiding the formation of a leakage passage at the boundary. In one embodiment, the package body 170 has a sealing structure formed at at least one end of the connection portion 112, and the sealing structure extends around the outer circumference of the flexible conductive laminated structure 110, covering and sealing the edges of the electromagnetic shielding film 160 and the third insulating medium 153, thereby reducing the risk of capillary penetration of liquid along the interlayer interface. In another embodiment, the package body 170 forms a continuous seal lip or seal ring band at the assembly joint position with the external housing or ear hook assembly 220, so that after assembly, the package body 170 forms a sealed fit with the inner wall of the housing, either surface contact or line contact, blocking the path for sweat and water vapor to enter the interior of the connection portion 112 along the fitting gap. This allows the package body 170 to achieve a reliable waterproof sealing effect during wearing and exercise, and designing the seal of the package body 170 with reasonable package body continuity and assembly sealing conditions contributes to improved waterproofing capabilities, and can be used to achieve, for example, IPX7 or IPX8 level waterproofing needs. In one modification, the package body 170 may be made of a polymer material other than silicone, having elasticity, waterproofness and biocompatibility, such as thermoplastic elastomer (TPE), liquid silicone rubber (LSR), or polyurethane elastomer, as long as the molding process can stably cover the connection portion 112 and provide the corresponding protective and cushioning effects.

[0055] By step S5 described above, an integrated package body 170 having waterproof, cushioning, and fixing functions can be formed on the connection part 112 without changing the internal lamination relationship and electrical structure of the flexible conductive laminated structure 110. The interference-preventing flexible wiring board 100 can be used not only as a signal transmission carrier but also as a flexible bridge member between different rigid structures inside the audio device, thereby significantly improving the reliability and service life of the entire device in complex operating environments.

[0056] Refer to Figures 9 and 10. Figures 9 and 10 are schematic perspective views and exploded views of an audio device 200 with imaging function according to an embodiment of the present invention. The audio device 200 with imaging function mainly includes a rear-hook assembly 210, an ear hook assembly 220, at least one ear unit 230, a camera module 240, and a main control circuit board 250.

[0057] The after-attachment assembly 210 is designed to surround the back of the user's head so as to straddle the occipital region of the user when worn, thereby providing overall support and stable positioning to the audio device with imaging function 200. In this embodiment, the after-attachment assembly 210 employs a structural form having a certain elastic recovery capability so that the after-attachment assembly 210 can be appropriately expanded when worn and rebound after release to fit different user head sizes. In one embodiment, the after-attachment assembly 210 may include an internal support member and an external adhesive coating layer, the internal support member may be made of an elastic metal, engineering plastic or composite material and is used to provide basic structural strength, and the external adhesive coating layer may be formed of silicone or other elastic material to improve wearing comfort and avoid a hard, constricting feeling in direct contact with the skin. In one modification, the after-attachment assembly 210 may employ an integrally molded elastic structure without providing a separate independent internal support member.

[0058] The ear hook assembly 220 is connected to both ends of the rear-hook assembly 210, that is, in this embodiment, there are at least two ear hook assemblies 220, each ear hook assembly 220 having a proximal end 220a connected to the rear-hook assembly and a distal end 220b extending along the upper part of the user's auricle toward the user's face. When worn, the ear hook assembly 220 is positioned along the outside of the user's auricle, providing structural support and positioning references for the audio device with imaging function 200, and stably positioning the front-end functional assembly near the user's ear. In this embodiment, the ear hook assembly 220 itself does not directly realize the audio output function; rather, the main function of the ear hook assembly 220 is as a structural carrier, and the audio output and imaging functions of the internal wiring channels are jointly realized by the ear unit 230 connected to the ear hook assembly 220 and the anti-interference flexible wiring board 100. More specifically, as shown in Figure 10, the ear hook assembly 220 can form an elongated internal cavity 221, which is provided along the extending direction of the ear hook assembly 220 and accommodates at least a portion of the structure of the main control circuit board 250 and the anti-interference flexible wiring board 100. By forming the internal cavity 221 inside the ear hook assembly 220, the connection portion 112 of the anti-interference flexible wiring board 100 can be inserted along the inside of the ear hook assembly 220, thereby avoiding the exposure of the wire member in appearance and reducing the possibility of friction between the wire member and the skin or external objects during wear. In this embodiment, the main control circuit board 250 is provided in the internal cavity 221 of one of the ear hook assemblies 220 and is positioned on the side closer to the rear ear hook assembly 210, and is structurally positioned close to the rear support region, which is advantageous for the overall center of gravity distribution and wearing stability. The main control circuit board 250 is mainly used to control the overall functions of the audio device with imaging function 200, and can integrate circuit modules for video signal processing, audio signal processing, wireless communication, and power management.Furthermore, the main control circuit board 250 is provided with a connector 251 for insertion and connection to the connection portion 112 of the interference prevention flexible wiring board 100. By installing the connector 251, the interference prevention flexible wiring board 100 can establish an electrical connection with the main control circuit board 250 by insertion during the assembly stage, thereby reducing the effect of thermal stress on the flexible wiring board due to the welding process and improving assembly efficiency and reliability. In one embodiment, the internal cavity 221 of the ear hook assembly 220 may be positioned relative to the connection portion 112 of the interference prevention flexible wiring board 100, and a guide structure or position limiting structure may be formed in a part of the cavity 221 to ensure that the connection portion 112 of the interference prevention flexible wiring board 100 maintains a predetermined direction inside the ear hook assembly 220, thereby avoiding pressing, twisting, or stress concentration due to relative displacement during mounting or use. With the above structural arrangement, one ear hook assembly 220 may be used as an integration carrier for the interference-preventing flexible wiring board 100 and the main control circuit board 250, while the other ear hook assembly 220 may be used to house power-related elements (e.g., a battery or its protection circuit), which is advantageous for left and right balance weights, and its specific arrangement can be adjusted according to product needs, thereby realizing a division of functions between the left and right ear hook assemblies 220, improving the flexibility of the overall structural layout and wearing stability.

[0059] In a preferred embodiment, the main control circuit board 250 may further be provided with a heat dissipation element 270 for effectively dissipating the heat generated by the main control circuit board 250 during video processing, audio processing, or wireless communication operation. Specifically, the heat dissipation element 270 can be in close contact with the main control circuit board 250 via a heat conductive medium, which may be a heat dissipation adhesive, a heat conductive pad, or other elastic material having heat conductive properties, thereby forming a stable heat conduction path between the main control circuit board 250 and the heat dissipation element 270. In this embodiment, the heat dissipation element 270 extends along the thickness direction of the ear hook assembly 220 and penetrates the panel cover 222 of the ear hook assembly 220, thereby directly exposing at least a portion of the heat dissipation element 270 to the external environment. With the above configuration, the heat generated when the main control circuit board 250 is operating is conducted to the heat dissipation element 270 via the heat conduction medium, and further released from the heat dissipation element 270 to the outside air, thereby lowering the operating temperature of the main control circuit board 250. In one modification, the heat dissipation element 270 may be a metal heat dissipation sheet, a metal heat dissipation block, or a structural member having a heat dissipation function, and may form an integral structure with the panel cover 222. In another modification, the heat dissipation element 270 may partially penetrate only the panel cover 222, or may be provided in an area close to the outer surface of the ear hook assembly 220, thereby satisfying the heat dissipation effect while achieving both appearance integrity and wearing comfort. By introducing the heat dissipation element 270 into the ear hook assembly 220, the heat dissipation capacity of the main control circuit board 250 can be effectively improved without significantly increasing the volume or weight of the device, which is advantageous in ensuring the performance stability and reliability of the audio device 200 with imaging function during long-term operation or under high load conditions. Furthermore, the heat dissipation element 270 may also integrate a temperature sensor, which is electrically connected to the main control circuit board 250 and monitors the temperature changes of the main control circuit board 250 in real time while it is operating.Specifically, the temperature sensor may be located on the side of the heat dissipation element 270 closer to the main control circuit board 250, or in the heat conduction path between the heat dissipation element 270 and the main control circuit board 250, so that the temperature sensor can accurately sense the change in the amount of heat generated by the main control circuit board 250 and conducted to the heat dissipation element 270, and reflect the actual operating temperature of the main control circuit board 250. In this embodiment, the temperature sensor may be a thermistor, a digital temperature sensor, or other temperature sensing element applied to an electronic device, and is electrically connected to the main control circuit board 250 via a wire or pad so that the main control circuit board 250 can acquire the corresponding temperature signal. In one embodiment, the main control circuit board 250 can adjust operating parameters related to video processing, audio processing, or wireless communication based on the temperature information output from the temperature sensor, or if the temperature exceeds a preset threshold, it can perform control measures such as frequency reduction, power limiting, or protection off. By integrating the temperature sensor into the heat dissipation element 270 and forming a closed-loop monitoring and control relationship with the main control circuit board 250, heat management can be achieved through coordination between structural and circuit control aspects, preventing performance degradation, signal quality deterioration, or reliability reduction due to overheating of the main control circuit board 250. As a result, the audio device with imaging function 200 can maintain stable signal transmission and overall functional expression under long-term operation, high-load operation, or high ambient temperature conditions.

[0060] At least one ear unit 230 is physically connected to the distal end 220b of the ear hook assembly 220 via the anti-interference flexible wiring board 100, positioned close to the user's ear, and used as the functional integration end of the imaging audio device 200. The ear unit 230 has a rigid housing 231, which may be made of plastic, metal, or composite material, and provides structural support and positional protection for internal functional elements. Inside the rigid housing 231, a housing space is formed for accommodating an audio transducer 232, a microphone, and at least one electronic element related to the imaging function. In this embodiment, the ear unit 230 achieves an electrical connection and physical structure bridge by the anti-interference flexible wiring board 100 and the ear hook assembly 220. Specifically, the mounting portion 111 of the interference-preventing flexible wiring board 100 extends along the assembly direction of the ear unit 230 and enters the interior of the rigid housing 231, and is electrically connected to the audio transducer 232, microphone and / or other electronic elements, and the connection portion 112 of the interference-preventing flexible wiring board 100 is provided inserted along the interior of the ear hook assembly 220, establishing a flexible electrical connection passage between the ear unit 230 and the main control circuit board 250. With the above structure, the interference-preventing flexible wiring board 100 is positioned as an electrical signal transmission carrier and also as a flexible bridge member connecting the ear hook assembly 220 and the ear unit 230, so that the ear unit 230 can generate minute displacements or angular changes relative to the ear hook assembly 220 during wearing or use, improving the reliability of the overall structure without applying excessive mechanical stress to the internal conductive circuit. In this embodiment, at least one microphone 234 for collecting the user's voice or ambient sound is provided inside the ear unit 230.The microphone 234 forms a direct grounding network with the connector 251 via an independent microphone grounding wire 141 on the interference-preventing flexible wiring board 100, and electrically forms a one-point grounding relationship with the main grounding wire network on the flexible conductive laminated structure 110, thereby isolating common ground interference caused by the return of audio drive current or high-speed digital signals and improving the signal-to-noise ratio and stability of the microphone's sound pickup. In this embodiment, the audio transducer 232 may be a bone conduction transducer, used to transmit audio signals to the user's skull or ear skeletal structure via the ear unit 230 in the manner of mechanical vibration, thereby achieving an audio output effect in a binaural open state. In one modified example, the audio transducer 232 may be an air conduction speaker for radiating sound into the user's ear canal in the manner of air vibration, thereby meeting the needs of different users regarding sound quality, wearing method, or usage scenario. Furthermore, even if the audio transducer 232 employs a bone conduction or air conduction method, it is electrically connected to the main control circuit board 250 via the interference prevention flexible wiring board 100, and can share the interference prevention structure, independent grounding design, and package body protection structure provided by the interference prevention flexible wiring board 100, thus offering versatility and expandability in structural design.

[0061] Furthermore, the main control circuit board 250 is provided with at least one application-specific integrated circuit for performing video signal processing, audio signal processing, and system control functions. The application-specific integrated circuit is electrically connected to the camera module 240, audio transducer 232, and microphone 234 via the anti-interference flexible wiring board 100. Because the application-specific integrated circuit deals with both high-speed digital and analog signals during operation, it has high requirements for impedance continuity, electromagnetic shielding effect, and grounding stability with respect to the external interconnect structure. Accordingly, the present invention designs the anti-interference flexible wiring board 100 as a flexible printed wiring board with a multi-layer structure and forms a reference potential layer in its core layer 140, thereby enabling the application-specific integrated circuit to obtain a stable signal reference plane signal even in different operating modes, and effectively reducing problems of signal reflection, crosstalk, or noise amplification due to inappropriate interconnect structures.

[0062] The camera module 240 is slidably connected to the outside of the ear unit 230 and is used to collect first-person view video signals. In this embodiment, the camera module 240 is positioned on the side of the ear unit 230 closest to the user's face, so that when worn, the camera module 240 can acquire a shooting angle control that basically matches the user's line of sight, thereby realizing a first-person view (FPV) video acquisition effect. In this embodiment, the camera module 240 includes a main body 241 and a flexible extension 242 that extends integrally from the main body 241. An image sensor and its corresponding optical elements are integrated within the main body 241 to establish an electrical connection between the camera module 240 and the interference-preventing flexible wiring board 100 and to provide a structurally flexible transition. Specifically, the flexible extension portion 242 has a redundant bent portion 243, which may have an S-shape, U-shape, or wave-shaped structure in its natural state, or it may be designed to have a meandering structure that can be repeatedly bent. Here, the flexible extension portion 242 and the redundant bent portion 243 may be integrally formed using the same flexible wiring board material system, rather than being formed by joining different materials, and both the flexible extension portion 242 and the redundant bent portion 243 include a flexible insulating layer based on polyimide (PI) and a rolled copper foil conductive layer provided on the surface of the base material. The redundant bent portion 243 extends along the longitudinal direction of the flexible extension portion 242 to provide sufficient expansion and contraction margin within a limited structural space, and the total length of the redundant bent portion 243 is preferably between 10 and 30 mm. The single bent portion in the redundant bent portion 243 may have a preset minimum bending radius to ensure that fatigue fracture of the conductive circuit or damage to the insulating layer does not occur during repeated bending or sliding of the flexible extension portion 242, and the minimum bending radius is preferably 0.3 mm or more, and more preferably 0.5 mm or more.In one embodiment, the meandering structure may be composed of a plurality of consecutive curved units to balance deformation capacity and structural stability, and the pitch between adjacent curved units is preferably 0.8 mm to 2.5 mm. With the above dimensions and structural design, the redundant bent portion 243 can absorb the relative displacement caused by the camera module 240 by changes in the bending angle or expansion and compression of the bending width when the camera module 240 slides along the front-rear direction, thereby preventing mechanical stress from being directly transmitted to the weld position or connection terminal between the flexible extension portion 242 and the interference-preventing flexible wiring board 100. Therefore, the redundant bent portion 243 not only provides the structurally necessary expansion and contraction buffer function, but can also significantly improve the connection reliability and service life of the camera module 240 during repeated adjustments or long-term use. In practice, the entire anti-interference flexible wiring board 100 needs to be limited to maintain a width of 12 mm or less. Therefore, in particular, the use of narrow widths of 3.5 mm or less is not suitable for complex bending designs to adapt to narrow and limited spaces, but is suitable for providing redundant bending designs because the placement space for the camera module 240 is open. By providing the redundant bending portion 243, the flexible extension portion 242 has a margin that can be deformed in the longitudinal direction. When the camera module 240 slides in the front-rear direction relative to the ear unit 230, the flexible extension portion 242 can absorb the displacement change by unfolding or compressing the redundant bending portion 243, thus preventing tensile or compressive stress due to sliding from being directly transmitted to the anti-interference flexible wiring board 100 or the weld / connection area.

[0063] In one embodiment, the redundant bent portion 243 can be verified for reliability by bending fatigue testing. For example, by performing a reciprocating tensile bending test with the redundant bent portion 243 as the bending center, under conditions of a bending radius of 1.0 mm and a bending angle of ±90°, it can withstand more than 10,000 tensile bending cycles without causing poor conductivity or obvious resistance abnormalities, thereby meeting the reliability requirements for daily wear and repeated use of wearable devices. Note that the above number of tensile bending cycles and test conditions are exemplary embodiments, and in practice, the bending radius, bending angle, or number of tests can be adjusted according to the product design requirements, material specifications, and usage scenarios. With the above structural design, the camera module 240 achieves a slide adjustment function while still maintaining its electrical connection path in a flexible state, significantly reducing the risk of fatigue failure of the conductive circuit due to repeated sliding or adjustment, and improving the reliability of the camera function during long-term use.

[0064] The camera module 240 integrates a vibration isolation module, which is provided on the main body 241 or the main body portion 241, and is used to maintain stability of image acquisition when the camera module 240 moves with the user's head. That is, when the camera module 240 moves, walks, or rotates with the user's head, it is used to compensate for vibrations during the image acquisition process. In a preferred embodiment, the vibration isolation module may be a gyroscope, which detects the angular velocity or angular displacement change of the camera module 240 in real time in at least one direction, and outputs the corresponding motion data to the image processing unit of the camera module 240 or the main control circuit board 250 to perform vibration isolation correction calculations. Specifically, the gyroscope may be located within the main body portion 241 of the camera module 240, or it may be mounted on the wiring board of the main body portion 241. By aligning the gyroscope and the lens assembly in spatial position, the angular motion information detected by the gyroscope more accurately reflects the actual change in the lens's orientation, improving the accuracy and response consistency of the vibration compensation algorithm. In one embodiment, the gyroscope can perform electronic image stabilization (EIS) on the collected image signal based on head motion data detected in cooperation with the image sensor. For example, by performing cutting, displacement, or resampling on the image frame, it can compensate for slight head movements or screen shake caused by walking. In another embodiment, the motion data output by the gyroscope may be transmitted to the main control circuit board 250, which performs vibration stabilization calculations in a batch or integrates them with the video encoding processing flow. By integrating the vibration damping module into the camera module 240, the audio device with imaging function 200 can continuously acquire a relatively stable first-person perspective video screen while the user is wearing it, exercising, or engaging in daily activities, making it particularly suitable for outdoor recording, exercise recording, or long-term wear applications.Since the vibration isolation module and the camera module 240 are provided as an integrated unit, it is possible to effectively improve image acquisition quality and user experience without relying on additional mechanical vibration isolation structures, thus without significantly increasing the volume or weight of the camera module 240.

[0065] In this embodiment, as shown in Figure 10, a connection terminal 244 is welded to the end of the flexible extension 242, and the connection terminal 244 may be welded and fixed to the mounting portion 111 of the interference-preventing flexible wiring board 100 by a surface mount process, or the connection terminal 244 may be inserted into the corresponding interface of the mounting portion 111 of the interference-preventing flexible wiring board 100, thereby simultaneously achieving electrical conductivity and mechanical fixation between the camera module 240 and the interference-preventing flexible wiring board 100. By adopting a surface mount method for connection, connection reliability can be ensured, and the height dimension of the welding area can be reduced, which is further advantageous for miniaturizing and compacting the overall structure. Preferably, a guide rail 233 or slide groove extending in the front-rear direction is formed on the outside of the ear unit 230, and the camera module 240 is slidably connected by fitting with the guide rail 233 or slide groove. Specifically, as shown in Figure 11, the camera module 240 further includes a case assembly 245. In addition to being used to house the main body 241 and the flexible extension 242, the case assembly 245 further includes a position limiting structure that matches the guide rail 233 to restrict the sliding path of the camera module 240 and displace the camera module 240 only along a predetermined direction, thereby ensuring stability and controllability of the shooting field of view adjustment. The user can change the horizontal field of view range of the shooting screen by adjusting the position of the camera module 240 in the front-rear direction according to their mounting position or usage needs. By installing the camera module 240 in a slidable structure and combining the coordinated design of the flexible extension 242 and the redundant bent portion 243, the audio device with imaging function 200 achieves adjustability of the shooting field of view and high reliability of the electrical connection structure without increasing the overall volume or compromising mounting stability, making it particularly suitable for application scenes with high demands for stability of the first-person field of view, such as sports and outdoor recording.

[0066] Specifically, as shown in Figure 12, the interference-preventing flexible wiring board 100 extends continuously along the structural connection path of the device as a flexible bridge connecting the ear hook assembly 220 and the ear unit 230. The connection portion 112 of the interference-preventing flexible wiring board 100 is inserted into the internal cavity 221 of the ear hook assembly 220 and electrically connected to the main control circuit board 250 provided inside the ear hook assembly 220 by a plug-in method, and the mounting portion 111 of the interference-preventing flexible wiring board 100 extends forward and enters the interior of the rigid housing 231 of the ear unit 230 and is electrically connected to the camera module 240 and / or the audio transducer 232. With the above structure, the interference-preventing flexible wiring board 100 is positioned to simultaneously perform the dual functions of electrical interconnection and structural transition within the entire device structure, eliminating the need to separately provide an independent harness or multi-stage connecting member between the ear hook assembly 220 and the ear unit 230, thereby forming a structurally continuous integrated connection path. In this embodiment, the package body 170 of the interference-preventing flexible wiring board 100 is positioned within the area of ​​the connection portion 112, extending and covering the connection area between the distal end 220b of the ear hook assembly 220 and the rigid housing 231 of the ear unit 230, thereby forming a continuous outer layer protective structure within that area. The covering and sealing of the package body 170 prevents the interference-preventing flexible wiring board 100 from being directly exposed to the external environment at the transient position where it penetrates the ear hook assembly 220 and enters the ear unit 230, which is advantageous in preventing moisture, sweat, or dust from entering the inside of the device along the connection path. Here, the interference-preventing flexible wiring board 100 is used as the main mixed signal transmission channel for the entire device to simultaneously transmit the video signal from the camera module 240 and the audio signal from the audio transducer 232.By integrating high-speed digital video signals and analog audio signals into the same flexible conductive laminated structure 110, stable transmission of multiple types of signals can be achieved under structural conditions with limited width, in accordance with the differential distribution line, electromagnetic shielding, and independent grounding design, while avoiding the volume expansion and interference problems associated with conventional multi-harness solutions.

[0067] In this embodiment, the audio device with imaging function 200 further includes a rigid support strip 260 embedded inside the package body 170, the rigid support strip 260 and the anti-interference flexible wiring board 100 are arranged side by side along the longitudinal direction and are physically connected to the ear hook assembly 220 and the ear unit 230. The rigid support strip 260 is structurally designed to receive tensile or bending loads from between the ear hook assembly 220 and the ear unit 230, thereby bearing the main mechanical stresses during mounting, movement, or application of external forces to the device, and preventing the anti-interference flexible wiring board 100 from directly receiving tensile or bending stresses. In this embodiment, the rigid support strip 260 may be made of metal steel wire so as to provide sufficient tensile strength and bending rigidity without significantly increasing the thickness of the package body 170, and so as to be able to cooperate with the anti-interference flexible wiring board 100 in stretching along the longitudinal direction to receive mechanical tensile or bending loads between the ear hook assembly and the ear unit. In one modification, the rigid support strip 260 may be made of stainless steel wire (e.g., SUS304, SUS316) or spring steel wire to improve sweat corrosion resistance and long-term elastic recovery ability, or a titanium alloy wire to reduce weight while maintaining high specific strength, further improving wearing comfort and fatigue durability during prolonged use. By installing the rigid support strip 260 and the anti-interference flexible wiring board 100 side by side, the anti-interference flexible wiring board 100 maintains the necessary flexibility while having sufficient structural stability, thereby improving the overall reliability of the connection structure between the ear hook assembly 220 and the ear unit 230 without significantly increasing the thickness of the connection area.

[0068] In a preferred embodiment, as shown in Figure 13, before performing the step of covering and sealing the package body 170, an elastic element 280 is filled into the gap between the anti-interference flexible wiring board 100 and the ear hook assembly 220 and the ear unit 230, thereby forming a tight bond between the anti-interference flexible wiring board 100 and the ear hook assembly 220 and the ear unit 230 without any apparent gaps. The elastic element 280 can be selected from waterproof rubber, waterproof silicone, or other materials having elastic and waterproof properties, and can be installed on the anti-interference flexible wiring board 100 by coating, adhesive application, or bonding. By introducing the step of filling the elastic element 280 before molding the package body 170, structural gaps in the connection area can be eliminated in advance, and the package body 170 formed thereafter can form a sealing interface that transitions continuously with the ear hook assembly 220, the ear unit 230 and the anti-interference flexible wiring board 100 during the covering process, thereby reducing the risk of water ingress due to structural gaps. At the same time, the elastic element 280 forms a flexible buffer layer between the package body 170 and the interference-preventing flexible wiring board 100, absorbing minute assembly deviations or displacement changes due to thermal expansion and cooling contraction, thereby further improving the reliability and assembly tolerance of the overall seal structure.

[0069] The above structural design allows the interference-preventing flexible wiring board 100, the rigid support strip 260, the elastic element 280, and the package body 170 to work together within the connection area, thereby not only achieving a stable electrical connection between the ear hook assembly 220 and the ear unit 230, but also forming an integrated connection structure that combines waterproofing, protection, and mechanical reinforcement functions, thereby significantly improving the reliability and durability of the audio device 200 with imaging function in complex operating environments.

[0070] In one modified example, the audio device with imaging function 200 may be a head-mounted or over-ear wearable device. Specifically, the head-mounted wearable device fixes the audio device to the user's head via a headband, back strap, or frame structure, and positions the ear unit 230, the camera module 240, and the interference-preventing flexible wiring board 100 along the contour of the head. The over-ear wearable device can support and position the main functional modules of the audio device with imaging function 200 near the user's ear via an over-ear assembly 220 provided on the outside of the user's auricle. Whether a head-mounted or over-ear structure is adopted, the interference-preventing flexible wiring board 100 acts as a flexible bridge member connecting different structural members, realizing mixed transmission of imaging signals and audio signals within a structural space with limited width, and working in cooperation with the electromagnetic shielding structure, independent grounding structure, and package body 170 to achieve stable signal transmission and reliable structural connection. Therefore, this proposed technology is not limited to a specific mounting configuration, and its technical effects can also be applied to other wearable audio devices or multifunctional wearable devices that employ similarly spatially limited wiring structures.

[0071] As described above, the interference-preventing flexible wiring board 100 constitutes a core signal channel between each functional module in the audio device with imaging function 200. Specifically, the digital video signal from the camera module 240 is transmitted to the main control circuit board 250 for processing via the differential signal line group 121 on the interference-preventing flexible wiring board 100, the audio drive signal output from the main control circuit board 250 is transmitted to the audio transducer 232 via the analog audio drive line group 122 on the interference-preventing flexible wiring board 100 to realize audio output, and the audio signal collected by the microphone 234 is transmitted to the main control circuit board 250 via the electrically independent microphone ground line 141 and corresponding signal line provided on the interference-preventing flexible wiring board 100. In the above signal transmission process, the control high-speed digital video signal, the analog audio drive signal, and the weak audio acquisition signal are integrated into the same flexible conductive laminated structure 110. Furthermore, through the collaborative design of the interlayer distribution, reference potential layer, electromagnetic shielding film 160, and independent grounding structure, effective separation and stable transmission of different types of signals are achieved in a flexible strip structure with limited width. As a result, the interference-preventing flexible wiring board 100 performs the function of mixed transmission of multiple signals and, as a flexible bridge member connecting the ear hook assembly 220 and the ear unit 230, structurally matches the package body 170 and support structure, meeting the overall requirements for dynamic bending, waterproof sealing, and mechanical reliability.

[0072] Therefore, this proposed technology, through an integrated design for signal paths, electromagnetic environments, and structural connections, achieves stable coexistence and coordinated operation of high-speed video signals and high-quality audio signals in the audio device 200 with imaging function without increasing the volume or mounting burden of the device, and possesses good engineering practicality and widespread adoption value.

[0073] It should be noted that the embodiments described above are not limitations and are used solely to illustrate the technical concepts of this disclosure. While this disclosure has been described in detail with reference to the embodiments described above, those skilled in the art will understand that it is still possible to modify the technical concepts described in the embodiments above or to make equivalent substitutions to some of the technical features, and that such modifications or substitutions do not deviate from the essence of the corresponding technical concepts from the concept and scope of each embodiment of the invention and remain within the scope of the claims of the invention. [Explanation of symbols]

[0074] 100 Interference-preventing flexible wiring board 110 Flexible conductive laminated structure 111 Implementation Section 112 Connection part 120 First conductive layer 121 Differential signal line group 122 Analog audio drive wire group 123 Grounding Shield Wire 130 Second conductive layer 131 Main clock line 140 core layers 141 Microphone ground wire 150 Insulating medium 151 First insulating medium 152 Second insulating medium 153 Third insulating medium 160 Electromagnetic shielding film 161 Protective layer 162 Metal layer 163 Conductive adhesive layer 170 Package Body 200 Audio device with imaging function 210 Post-assembly 220 Earhook Assembly 220a Proximal end 220b Distal end 221 Internal Cavity 222 Panel Cover 230 Ear Unit 231 Hard Housing 232 Audio Transducers 233 Guide rail 234 Mike 240 Camera Module 241 Main body 242 Flexible extension 243 Redundant folded segments 244 Connection terminals 245 Case Assembly 250 Main control circuit board 251 Connector 260 Rigid support strip 270 Heat dissipation element 280 Elastic elements

Claims

1. A flexible wiring board for preventing interference in an audio device with imaging capabilities, comprising a flexible conductive laminated structure, an electromagnetic shielding film, and a package body, The aforementioned flexible conductive laminated structure is configured as an integrated flexible strip-shaped structure and is divided along its longitudinal direction into a mounting portion and a connection portion, with the width of the connection portion being between 2 and 12 mm. The flexible conductive laminated structure comprises a first conductive layer and a second conductive layer as outer signal layers, and a core layer located between the first conductive layer and the second conductive layer, wherein the first conductive layer, the core layer, and the second conductive layer are separated by an insulating medium. A differential signal line group and a main clock line are formed in the first conductive layer and / or the second conductive layer, the differential signal line group is used to transmit digital video signals, the main clock line is used to synchronize the clock frequencies of the master device and the slave device, and the core layer forms a reference potential layer in at least a portion of its region. The electromagnetic shielding film covers the outer surfaces of the first conductive layer and the second conductive layer, respectively, so that in at least a portion of the connection area, the core layer, the differential signal line group, and the main clock line are all enclosed within a shield cavity formed by the electromagnetic shielding film. The package body is provided at the connection portion, covers the flexible conductive laminated structure, and forms an outer protective layer. The flexible conductive laminated structure further includes a group of analog audio drive lines and an electrically independent microphone ground line, the group of analog audio drive lines is used to transmit drive current to an audio transducer, the microphone ground line is physically isolated from the main grounding network of the flexible conductive laminated structure, and the microphone ground line is electrically connected to the main grounding network only at terminal and / or pad locations, characterized in that it is an interference-preventing flexible wiring board for an audio device with imaging function.

2. The interference-preventing flexible wiring board for an audio device with imaging function according to claim 1, characterized in that the core layer has a composite structure consisting of a single conductive layer or a plurality of internal conductive layers separated by an insulating medium.

3. The interference-preventing flexible wiring board for an audio device with imaging function according to claim 2, wherein, when the core layer has multiple internal conductive layers, the group of analog audio drive lines is assigned to different internal conductive layers to increase current withstand capability.

4. The interference-preventing flexible wiring board for an audio device with imaging function according to claim 1, characterized in that the first conductive layer, the second conductive layer, and the core layer all employ rolled copper without the use of adhesive in order to satisfy the dynamic bending requirements of the connection portion.

5. The differential signal line group includes MCN, MCP, MDN0 and MDP0 lines for transmitting MIPI signals, and the differential signal line group is directly adjacent to the electromagnetic shielding film in the stacking direction, so that the electromagnetic shielding film absorbs high-frequency radiation at close range, as described in claim 1, which is an interference-preventing flexible wiring board for an audio device with imaging function.

6. The interference-preventing flexible wiring board for an audio device with imaging function according to claim 1, characterized in that the line width of the group of analog audio drive lines is 0.2 mm or more, and in order to isolate interference on the same layer, ground shielding wires with a line width of 0.3 mm or more are installed parallel to both sides of the group of analog audio drive lines.

7. The interference prevention flexible wiring board for an audio device with imaging function according to claim 1, characterized in that the microphone ground wire maintains independent wiring over the entire length of the connection portion of the flexible strip structure and is equipotentially connected to the main ground wire network only at the pad position.

8. The interference-preventing flexible wiring board for an audio device with imaging function according to claim 1, characterized in that the core layer serves as a reference ground plane for the first conductive layer and the second conductive layer, and a medium of a specific thickness is placed between the differential signal line group and the core layer to control the characteristic impedance.

9. The interference-preventing flexible wiring board for an audio device with imaging function according to claim 1, characterized in that the package body is made of a waterproof elastic material and seals and covers the flexible conductive laminated structure.

10. The interference-preventing flexible wiring board for an audio device with imaging function according to claim 1, characterized in that the flexible strip structure is designed in a U-shape overall, and the length of the connection portion matches the outer half-circumference of a human ear.

11. The interference-preventing flexible wiring substrate for an audio device with imaging function according to claim 1, characterized in that a nano-waterproof coating layer having hydrophobic properties is provided on the outer surface of the flexible conductive laminated structure.

12. A method for manufacturing an interference-preventing flexible wiring board for an audio device with imaging function according to any one of claims 1 to 11, A step of providing a core layer that forms a reference potential layer in at least a portion of the region, The process involves forming a first conductive layer and a second conductive layer on the upper and lower surfaces of the core layer, respectively, physically isolating the first conductive layer and the second conductive layer from the core layer with an insulating medium to form a flexible conductive laminated structure, and then performing a patterning process on the first conductive layer and / or the second conductive layer to form a differential signal line group and a main clock line. A step of constructing an electromagnetic shield cavity that encloses the core layer, the differential signal line group, and the main clock line by bonding electromagnetic shield films to the outer surfaces of the first conductive layer and the second conductive layer, respectively, The process involves cutting the flexible conductive laminated structure covered with the electromagnetic shielding film into an integrated flexible strip structure, and dividing it along the longitudinal direction into a mounting portion and a connection portion with a width of 2 to 12 mm, The process of forming the package body at the connection portion includes the step of covering the flexible conductive laminated structure and forming an outer protective layer, A method for manufacturing an interference-preventing flexible wiring board for an audio device with imaging function, characterized in that the flexible conductive laminated structure further has a group of analog audio drive lines and an electrically independent microphone ground line formed thereon, the group of analog audio drive lines is used to transmit drive current to an audio transducer, and the microphone ground line is physically isolated from the main grounding network of the flexible conductive laminated structure.

13. The method for manufacturing an interference-preventing flexible wiring board for an audio device with imaging function according to claim 12, characterized in that the electrically independent microphone ground wire is formed within the core layer, so that the microphone ground wire maintains independent wiring over the entire length of the connection portion of the flexible strip structure and is equipotentially connected to the main ground wire network only at the pad position.

14. The method for manufacturing an interference-preventing flexible wiring board for an audio device with imaging function according to claim 12, characterized in that the package body is made of a waterproof elastic material and is formed by injection molding.

15. An audio device with imaging function, comprising a rear-mounted assembly, an ear-mounted assembly, an interference-preventing flexible wiring board according to any one of claims 1 to 11, at least one ear unit, a camera module, and a main control circuit board, The aforementioned rear-mounted assembly is used to surround the back of the user's head. The ear hook assemblies are connected to both ends of the rear-hook assemblies, and each ear hook assemblies has a proximal end that connects to the rear-hook assemblies and a distal end that extends along the upper part of the user's auricle toward the user's face. The interference-preventing flexible wiring board is connected to the distal end, The at least one ear unit is physically connected to the distal end of the ear hook assembly via the interference-preventing flexible wiring board, the ear unit having a rigid housing, and an audio transducer is housed inside the rigid housing. The camera module is slidably connected to the outside of the ear unit and is used to collect first-person view video signals. The main control circuit board is provided within the internal cavity of the ear hook assembly. The interference-preventing flexible wiring board is a flexible bridge member connecting the ear hook assembly and the ear unit, the connection portion of the interference-preventing flexible wiring board is inserted into the ear hook assembly and attached to the main control circuit board, the mounting portion of the interference-preventing flexible wiring board extends into the rigid housing of the ear unit and is electrically connected to the camera module, and the package body of the interference-preventing flexible wiring board covers and seals the connection point between the distal end of the ear hook assembly and the rigid housing of the ear unit, forming an outer layer protection. The aforementioned interference-preventing flexible wiring board is characterized in that it simultaneously transmits the video signal of the camera module and the audio signal of the audio transducer as the main mixed signal transmission channel, thereby providing an audio device with imaging capabilities.

16. The camera module comprises a main body and a flexible extension integrally extending from the main body, the flexible extension is provided with redundant bent segments, the redundant bent segments are S-shaped, U-shaped, or wave-shaped, and when the camera module slides relative to the ear unit, the deformation of the flexible extension provides an expansion and contraction margin, as described in claim 15.

17. The audio device with imaging function according to claim 16, characterized in that a connection terminal is welded to the end of the flexible extension, and the camera module achieves electrical conductivity and mechanical connection between the camera module and the interference-preventing flexible wiring board by welding and fixing the connection terminal to the mounting portion of the interference-preventing flexible wiring board using a surface mount process.

18. The audio device with imaging function according to claim 16, wherein the camera module has an integrated vibration isolation module, the vibration isolation module is provided in or on the main body, and is used to maintain the stability of image acquisition when the camera module moves with the user's head.

19. The audio device with a shooting function according to claim 15, characterized in that a guide rail or slide groove extending in the front-to-back direction is provided on the outside of the ear unit, and the camera module is slidably connected by the guide rail or slide groove, allowing the user to adjust the horizontal position of the shooting field of view.

20. The audio device with imaging function according to claim 15, further comprising a rigid support strip embedded inside the package body, wherein the rigid support strip is arranged alongside the interference-preventing flexible wiring board, reinforces the curved shape of the flexible bridge member, and physically connects the ear hook assembly and the ear unit to withstand mechanical tensile force.

21. The audio device with imaging function according to claim 15, characterized in that the main control circuit board is provided with a connector, and the connection portion of the interference prevention flexible wiring board is inserted into the connector and connected.

22. The audio device with imaging function according to claim 21, wherein the ear unit is further provided with a microphone, and the microphone is connected to the connector via an independent microphone ground wire of the interference-preventing flexible wiring board to isolate common ground interference.

23. The audio device with imaging function according to claim 15, characterized in that the audio transducer is a bone conduction transducer for transmitting sound to the user's skull by vibration.

24. The audio device with imaging function according to claim 15, characterized in that the audio transducer is an air conduction speaker for radiating sound into the user's ear canal.

25. The audio device with imaging function according to claim 15, characterized in that the audio device with imaging function is a head-mounted or ear-hook type wearable device.

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