Imaging device
The imaging device enhances heat dissipation by transferring heat from the circuit board to its outer surface and using a fan to cool multiple sides, improving cooling efficiency and reducing dust entry, addressing the challenge of increased heat generation in high-resolution imaging devices.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- KYOCERA CORP
- Filing Date
- 2024-12-06
- Publication Date
- 2026-06-18
AI Technical Summary
Existing imaging devices face challenges in heat dissipation due to increased heat generation, particularly with improvements in resolution, necessitating enhanced cooling mechanisms.
The imaging device incorporates a housing that supports heat transfer from a circuit board to its outer surface and uses a fan to blow air directly onto the housing's outer surfaces, including multiple sides, with a case design that maintains positive pressure and includes a dust filter to prevent dust entry.
This configuration improves heat dissipation efficiency and maintains device aesthetics while reducing dust ingress, offering flexible placement options and effective cooling even under installation constraints.
Smart Images

Figure 2026099574000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an imaging device.
Background Art
[0002] In order to grasp the surrounding scenery, the installation of imaging devices on moving bodies such as vehicles has been progressing. In such an imaging device, heat dissipation is required. Therefore, an air replacement inside the imaging device using a ventilation fan has been proposed (see Patent Document 1).
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] There is a need to improve heat dissipation against an increase in the heat generation amount of an imaging device in response to an improvement in characteristics of the imaging device such as resolution.
[0005] An object of the present disclosure is to improve heat dissipation in an imaging device.
Means for Solving the Problems
[0006] An imaging device according to a first aspect includes <s a housing that houses a circuit board that processes an image signal output by an image sensor and supports heat generated by the circuit board in a heat - transferable manner, and a fan that blows air to the outer surface of the housing.
Effects of the Invention
[0007] According to the present disclosure, heat dissipation in the imaging device is improved.
Brief Description of the Drawings
[0008] [Figure 1] This is a partial cross-sectional view of an imaging device according to the first embodiment. [Figure 2] Figure 1 is a perspective view of the imaging device with its case removed. [Figure 3] Figure 1 is a schematic diagram showing the general configuration of the imaging unit. [Figure 4] This is a partial cross-sectional view showing a modified image of the imaging device in Figure 1. [Figure 5] This is a partial cross-sectional view of the imaging device according to the second embodiment. [Modes for carrying out the invention]
[0009] Embodiments of this disclosure will be described below with reference to the drawings. In the components shown in the following drawings, the same components are denoted by the same reference numerals.
[0010] As shown in Figure 1, the imaging device 10 according to the first embodiment of this disclosure comprises a housing 11 and a fan 12. The imaging device 10 may further comprise an imaging unit 13 and a case 14. As shown in Figure 2, the imaging device 10 may be a stereo camera having two imaging units 13.
[0011] The imaging device 10 may be designed to be mounted on a moving object. A moving object in this disclosure may include, for example, not only a vehicle but also an aircraft. Vehicles may include, for example, automobiles, industrial vehicles, railway vehicles, passenger vehicles, and fixed-wing aircraft that travel on runways. Automobiles may include, for example, passenger cars, trucks, buses, motorcycles, and trolleybuses. Industrial vehicles may include, for example, industrial vehicles for agriculture and construction. Industrial vehicles may include, for example, forklifts and golf carts. Industrial vehicles for agriculture may include, for example, tractors, cultivators, transplanters, binders, combines, and lawnmowers. Industrial vehicles for construction may include, for example, bulldozers, scrapers, excavators, cranes, dump trucks, and road rollers. Vehicles may include those that are powered by human effort. The classification of vehicles is not limited to the examples above. For example, automobiles may include industrial vehicles that can travel on roads. The same vehicle may be included in multiple classifications. Aircraft may include, for example, fixed-wing aircraft and rotary-wing aircraft.
[0012] The housing 11 houses a circuit board for processing image signals, which will be described later. The housing 11 may further house an imaging optical system and an image sensor. As described later, the imaging optical system, image sensor, and circuit board constitute an imaging unit 13, and the imaging unit 13 may be housed in the housing 11.
[0013] As shown in Figure 3, the imaging unit 13 may be configured to include an imaging optical system 15, an image sensor 16, and a circuit board 17.
[0014] The imaging optical system 15 may be composed of at least one optical element such as a lens. The imaging optical system 15 may form an optical image of an object. The imaging optical system 15 has an optical axis ox. The direction parallel to the optical axis ox and toward the object is defined as the first direction in this specification.
[0015] The imaging element 16 may be located on the optical axis ox of the imaging optical system 15. The light receiving surface of the imaging element 16 may be located at the imaging position of the optical image of an object separated from the imaging optical system 15 by a predetermined distance. The imaging element 16 may output an image signal corresponding to the subject image by imaging the subject image formed by the imaging optical system 15. The imaging element 16 is, for example, a CCD (Charge Coupled Device), a CMOS (Complementary Metal Oxide Semiconductor) image sensor, or the like.
[0016] The circuit board 17 processes the image signal output by the imaging element 16. For example, electronic components 18 may be mounted on the circuit board 17. The electronic components 18 are, for example, components for driving the imaging element 16, signal processing of the image signal, and the like.
[0017] In a configuration where the imaging device 10 has a plurality of imaging units 13 such as a stereo camera, the circuit board 17 may be shared by the plurality of imaging units 13. For example, the imaging device 10 may have a circuit board 17 extending from the position of an arbitrary imaging unit 13 to the position of another imaging unit 13.
[0018] The housing 11 supports the heat generated by the circuit board in a heat transferable manner to the outer surface of the housing 11. Supporting in a heat transferable manner includes the housing 11 supporting while directly or indirectly contacting the circuit board 17. Also, holding in a heat transferable manner may include a mode of supporting while being separated in a state close to the circuit board 17.
[0019] When the housing 11 indirectly contacts the circuit board 17, for example, it is a configuration in which a heat dissipation member is interposed between the circuit board 17 and the housing 11. Also, when the housing 11 indirectly contacts the circuit board 17, for example, it is a configuration in which electronic components 18 and a heat dissipation member are interposed between the circuit board 17 and the housing 11. The heat dissipation member is, for example, a silicone resin with high variability and heat conductivity.
[0020] The housing 11 may be formed of a material with high heat conductivity such as a metal like aluminum.
[0021] As shown in FIG. 1, the housing 11 may have, as an outer surface, a first surface s1, a second surface s2, a third surface s3, a pair of fourth surfaces s4, and a fifth surface s5.
[0022] The first surface s1 may be a surface on the first direction side of the housing 11. The surface on the first direction side may mean a surface that is located on the first direction side from the center of the housing 11 and faces the first direction. The surface facing the first direction may include not only a surface whose normal line is parallel to the first direction but also a surface whose normal line is within an angular range of, for example, ±45 degrees with respect to the first direction. A surface sandwiched by the surfaces on the first direction side according to the above definition may be included in the first surface s1 even if it is outside the range of the surface facing the first direction.
[0023] The second surface s2 is a surface on the second direction side of the housing 11. The second direction is a direction perpendicular to the first direction. Also, the second direction is a direction in which the imaging device is designed to be attached so that the second direction faces the vertically upward side in a moving body placed horizontally. In other words, the second direction is a direction facing the vertically upward side. The surface on the second direction side may mean, similar to the surface on the first direction side, a surface facing the second direction. The vertically upward side may mean that the vertical direction component obtained by decomposing the second direction is positive in the vertically upward direction.
[0024] The third surface s3 is a surface on the opposite direction side of the first direction of the housing 11. The surface on the opposite direction side of the first direction may mean, similar to the surface on the first direction side, a surface facing the opposite direction of the first direction.
[0025] The fourth surface s4 may be continuous with the first surface s1, the second surface s2, and the third surface s3. For example, the fourth surface s4 is a surface on both sides in a third direction that is perpendicular to both the first direction and the second direction. The surfaces on both sides in the third direction may mean, similar to the surface on the first direction side, a surface facing the third direction and a surface facing the opposite direction of the third direction.
[0026] The fifth surface s5 is the surface on the housing 11 that is opposite to the second direction. The surface opposite to the second direction may be similar to the surface on the second direction side, meaning a surface that faces the opposite direction to the second direction.
[0027] The fan 12 blows air toward the outer surface of the housing 11. The fan 12 may blow air toward at least a portion of the first surface s1, at least a portion of the second surface s2, at least a portion of the third surface s3, and at least a portion of the fourth surface s4. The fan 12 may blow air toward at least a portion of the first surface s1, at least a portion of the third surface s3, and at least a portion of the fourth surface s4, and at least a portion of the fifth surface s5.
[0028] In the example shown in Figure 1, the fan 12 blows air onto at least a portion of the first surface s1 and at least a portion of the fifth surface s5. Specifically, the fan 12 is positioned near the boundary between the first surface s1 and the fifth surface s5 so as to be inclined in both the first and second directions.
[0029] The configuration in which the fan 12 blows air toward a specific object such as the outer surface of the housing 11 may be such that air can be blown by positioning the fan 12 so as to overlap the specific object in the direction normal to the air blowing surface. In a configuration in which the fan 12 has a sleeve for blowing air, the air blowing surface is a virtual surface defined by an inner circumference circle perpendicular to the axial direction at the air outlet of the sleeve. The axial direction means the direction parallel to the central axis of the sleeve, or in other words, the central axis of the cylindrical member. In a configuration in which the fan 12 is formed by a rotor blade without a sleeve, the air blowing surface is an arbitrary surface that is the trajectory traced by the rotor blade in a rotating state when viewed from the axial direction.
[0030] The case 14 may surround the housing 11. The case 14 may have an opening on the first direction side. It may be attached to the mobile body such that the opening is in close contact with the mobile body's windshield 19. Alternatively, the case 14 may be formed of a transparent material on the first direction side.
[0031] The case 14 may have a first opening 20 and a second opening 21. The fan 12 may be located in the first opening 20. Being located in the first opening 20 of the fan 12 may mean being located in the first opening 20 itself, or being located somewhere within a sleeve that is continuously provided in the first opening 20.
[0032] With the configuration described above, the first opening 20 may function as an intake port for the case 14. The second opening 21 may function as an exhaust port for the case 14. The second opening 21 may be formed such that the amount of change in the pressure boosted by the fan 12 while passing through the exhaust flow path formed by the second opening 21 is greater than the amount of change in the pressure in the flow path from the first opening 20 to the second opening 21.
[0033] For example, the first opening 20 may be larger than the second opening 21. A larger opening means a larger opening area. Furthermore, an exhaust cover 22 may be provided over the second opening 21. The exhaust cover 22 may increase the resistance of exhaust through the second opening 21. The exhaust cover 22 is, for example, a plate-shaped member inclined with respect to the axial direction of the second opening 21. Alternatively, as shown in Figure 4, a resistance section 23 may be provided that forms an exhaust flow path together with the second opening 21. A meandering flow path may be formed inside the resistance section 23. The resistance section 23 may be mounted on the case 14 so that the meandering flow path communicates with the second opening 21.
[0034] As shown in Figures 1 and 4, the fan 12 may be provided with a dust filter 24. The dust filter 24 is, for example, a material such as a mesh or nonwoven fabric, which has fine holes that communicate from one surface to the other.
[0035] The imaging device 10 of the first embodiment, having the configuration described above, includes a housing 11 that houses a circuit board 17 for processing image signals output by the image sensor 16 and supports the circuit board 17 in a way that allows heat to be transferred, and a fan 12 that blows air onto the outside of the housing 11. With this configuration, the imaging device 10 can be cooled by blowing air directly onto the housing 11, rather than by exchanging air. Therefore, the imaging device 10 has improved heat dissipation compared to a configuration that is cooled by exchanging air.
[0036] Furthermore, in the imaging device 10 of the first embodiment, the outer surface further has a fifth surface s5 on the opposite side of the second direction, and the fan 12 blows air to at least a part of the first surface s1, at least a part of the third surface s3, and at least a part of the fourth surface s4, and at least a part of the fifth surface s5. With this configuration, the imaging device 10 dissipates heat from the housing 11 from two sides, thus improving heat dissipation compared to a configuration that dissipates heat from one side. In addition, in a configuration having the above configuration and further comprising a case 14, the imaging device 10 draws in and blows air that is relatively cold and remains below the circuit board 17, which is a heat source, within the case 14, thereby improving cooling efficiency.
[0037] Furthermore, in the imaging device 10 of the first embodiment, the housing 11 is surrounded by a case 14 having a first opening 20 and a second opening 21, and the fan 12 is located in the first opening 20. In a configuration in which a case is provided to improve aesthetics, it is conceivable to provide the fan in either the intake port or the exhaust port. In a configuration in which the fan is provided in the exhaust port, it is necessary to provide the intake port so that the housing is located in the airflow path. On the other hand, the imaging device 10 having the above configuration improves aesthetics by concealing the entire device with the case 14, while also providing more flexibility in the placement of the intake port compared to a configuration in which the fan is provided in the exhaust port of the case. In addition, with the above configuration, the imaging device 10 can maintain a positive pressure inside the case 14 compared to the outside of the case 14 by the fan 12. Therefore, the imaging device 10 reduces the possibility of dust entering the case 14 through gaps, etc., compared to a configuration in which the fan is provided in the exhaust port that creates negative pressure inside the case.
[0038] Furthermore, in the imaging device 10 of the first embodiment, the first opening 20 is larger than the second opening 21. With this configuration, the entire inside of the case 14 can be maintained under positive pressure in the imaging device 10. Therefore, the imaging device 10 further reduces the possibility of dust entering the inside of the case 14.
[0039] Furthermore, in the imaging device 10 of the first embodiment, a dust filter 24 is provided on the fan 12. With this configuration, the imaging device 10 can reduce the possibility of dust entering from the fan 12.
[0040] Next, an imaging device according to a second embodiment of this disclosure will be described. In the second embodiment, the configuration of the housing differs from that of the first embodiment. The second embodiment will be described below, focusing on the differences from the first embodiment. Note that parts having the same configuration as in the first embodiment will be denoted by the same reference numerals.
[0041] As shown in Figure 5, the imaging device 100 according to the second embodiment is configured to include a housing 110 and a fan 120, similar to the first embodiment. The imaging device 100 may further include an imaging unit 13 and a case 140, as in the second embodiment. In the second embodiment, the configuration of the imaging unit 13 is the same as in the first embodiment.
[0042] In the second embodiment, the housing 110 supports the heat generated by the circuit board so as to be able to transfer heat to the outer surface of the housing 11, similar to the first embodiment. In the second embodiment, unlike the first embodiment, the housing 110 may have a projection 250. The projection 250 may be formed of a thermally conductive material. The projection 250 may protrude from the housing 110. The projection 250 may protrude, for example, so as to extend beyond the third surface s3 in the opposite direction to the first direction. The projection 250 may be U-shaped when viewed from the second direction. The projection 250 may be provided so as to sandwich the housing 110 when viewed from the second direction.
[0043] In the second embodiment, the fan 120 blows air toward the outer surface of the housing 110, similar to the first embodiment. In the second embodiment, unlike the first embodiment, the fan 120 may blow air toward the protruding portion 250, which is the outer surface of the housing 110. Specifically, the fan 120 may be positioned so that its blowing surface faces the portion of the protruding portion 250 that protrudes in the opposite direction to the first direction from the third surface s3. The fan 120 may be positioned, for example, on the side of the protruding portion that is opposite to the second direction.
[0044] In the second embodiment, the case 140 may surround the housing 110, similar to the first embodiment. In the second embodiment, the case 140 may have a first opening 200 and a second opening 21, similar to the first embodiment. In the second embodiment, the configuration of the second opening 21 is the same as in the first embodiment. In the second embodiment, unlike the first embodiment, the first opening 200 may be positioned to allow air to be blown from the fan 120 to the portion of the protruding part 250 that protrudes in the opposite direction to the first direction from the third surface s3.
[0045] The imaging device 100 of the second embodiment, having the configuration described above, also includes a housing 110 that houses a circuit board 17 for processing image signals output by the image sensor 16 and supports the circuit board 17 in a way that allows heat to be transferred, and a fan 120 that blows air to the outside of the housing 110. Therefore, the imaging device 100 also improves heat dissipation compared to a configuration that cools by exchanging air.
[0046] Furthermore, the imaging device 100 of the second embodiment also includes a case 140 surrounding the housing 110, having a first opening 200 and a second opening 21, with the fan 120 located in the first opening 200. Therefore, the imaging device 100 also improves aesthetics by concealing the entire device with the case 140, while providing greater flexibility in the placement of the intake port compared to a configuration where the fan is located at the exhaust port of the case. In addition, the imaging device 100 also reduces the possibility of dust entering the case 140 through gaps, etc., compared to a configuration where the fan is located at the exhaust port that creates negative pressure inside the case.
[0047] Furthermore, in the imaging device 100 of the second embodiment, the first opening 200 is larger than the second opening 21. Therefore, the imaging device 100 also further reduces the possibility of dust entering the case 140.
[0048] Furthermore, in the imaging device 100 of the second embodiment, a dust filter 24 is also provided on the fan 120. Therefore, the imaging device 100 can also reduce the possibility of dust entering from the fan 120.
[0049] Furthermore, in the imaging device 100 of the second embodiment, the housing 110 has thermal conductivity and a protrusion 250 that protrudes from the housing 110, and the fan 120 blows air onto the protrusion 250. With this configuration, the imaging device 10 can cool the housing 110 regardless of the constraints on the installation locations of the housing 110 and the fan 120, specifically, even if there are constraints that hinder airflow from the fan 120 to the outer surface of the housing 110. The outer surface is the outer surface of the housing 110 that is opposite to the inner surface. For example, in a configuration in which the imaging device 100 further comprises a case 140, constraints tend to arise on the installation locations of the housing 110 and the fan 120 within the case 140, making it difficult to overlap the airflow surface of the fan 120 with the outer surface of the housing 110. In such a configuration, the imaging device 100 can cool the housing 110 even if the airflow surface of the fan 120 cannot overlap with the outer surface of the housing 110.
[0050] In one embodiment, (1) the imaging device is A housing that houses a circuit board for processing image signals output by an image sensor and supports the circuit board in a way that allows heat to be transferred, The enclosure is equipped with a fan that blows air onto the outer surface of the enclosure.
[0051] (2) In the imaging device described in (1) above, The housing contains an imaging optical system that forms an optical image on the light-receiving surface of the image sensor. The outer surface has a first surface on the side of a first direction parallel to the optical axis of the imaging optical system and facing the object side, a second surface on the side of a second direction perpendicular to the first direction and facing vertically upward, a third surface on the side opposite to the first direction, and a fourth surface continuous with the first surface, the second surface and the third surface. The fan blows air onto at least a portion of the first surface, at least a portion of the second surface, at least a portion of the third surface, and at least a portion of the fourth surface.
[0052] (3) In the imaging device described in (2) above, The outer surface further has a fifth surface on the side opposite to the second direction, The fan blows air onto at least a portion of the first surface, at least a portion of the third surface, and at least a portion of the fourth surface, and at least a portion of the fifth surface.
[0053] (4) In the imaging device described in (1) above, The housing has thermal conductivity and protrusions that extend from the housing, The fan blows air onto the protruding part.
[0054] (5) Any imaging device described in (1) to (4) above is The enclosure is further comprised of a case having a first opening and a second opening, The fan is located in the first opening.
[0055] (6) In the imaging device described in (5) above, The first opening is larger than the second opening.
[0056] (7) In the imaging device described in (5) or (6) above, The aforementioned fan is equipped with a dust filter.
[0057] The diagrams illustrating the embodiments described herein are schematic. Dimensions and proportions shown in the drawings do not necessarily correspond to actual dimensions.
[0058] While embodiments relating to this disclosure have been described based on the drawings and examples, it should be noted that those skilled in the art can make various modifications or alterations based on this disclosure. Therefore, it should be noted that these modifications or alterations are within the scope of this disclosure. For example, the functions included in each component can be rearranged in a logically consistent manner, and multiple components can be combined into one or separated.
[0059] Each of the features described in this disclosure may be replaced by an alternative feature that works for the same, equivalent, or similar purposes, unless expressly disregarded. Thus, unless expressly disregarded, each of the disclosed features is merely an example of an entire set of identical or equivalent features.
[0060] Furthermore, the embodiments relating to this disclosure are not limited to any specific configuration of the embodiments described above. The embodiments relating to this disclosure can be extended to all novel features described in this disclosure, or combinations thereof.
[0061] In this disclosure, the designations "First," "Second," etc., are identifiers used to distinguish the configurations. Configurations distinguished by the designations "First," "Second," etc., in this disclosure may have their numbers swapped. For example, the first opening may swap the identifiers "First" and "Second" with the second opening. The swapping of identifiers occurs simultaneously. The configurations remain distinguishable even after the swapping of identifiers. Identifiers may be deleted. Configurations from which identifiers have been deleted are distinguished by codes. The designations "First," "Second," etc., in this disclosure should not be used alone to interpret the order of the configurations or to justify the existence of smaller numbered identifiers. [Explanation of Symbols]
[0062] 10, 100 Imaging device 11, 110 cabinets 12,120 fans 13 Imaging Unit 14,140 cases 15 Imaging Optical System 16 Image sensor 17 Circuit board 18 Electronic Components 19 Windshield 20, 200 First opening 21 Second opening 22 Exhaust cover 23 Resistance section 24 Dust filters 250 Protrusion ox optical axis s1, s2, s3, s4, s5: First face, second face, third face, fourth face, fifth face
Claims
1. A housing that houses a circuit board for processing image signals output by an image sensor and supports the circuit board in a way that allows heat to be transferred, The enclosure comprises a fan that blows air onto the outer surface of the housing. Imaging device.
2. In the imaging apparatus according to claim 1, The housing contains an imaging optical system that forms an optical image on the light-receiving surface of the image sensor. The outer surface has a first surface on the side of a first direction parallel to the optical axis of the imaging optical system and facing the object side, a second surface on the side of a second direction perpendicular to the first direction and facing vertically upward, a third surface on the side opposite to the first direction, and a fourth surface continuous with the first surface, the second surface and the third surface. The fan blows air onto at least a portion of the first surface, at least a portion of the second surface, at least a portion of the third surface, and at least a portion of the fourth surface. Imaging device.
3. In the imaging device according to claim 2, The aforementioned outer surface further has a fifth surface on the side opposite to the second direction, The fan blows air onto at least a portion of the first surface, at least a portion of the third surface, and at least a portion of the fourth surface, and at least a portion of the fifth surface. Imaging device.
4. In the imaging apparatus according to claim 1, The housing has thermal conductivity and a protruding portion that extends from the housing, The fan blows air onto the protruding part. Imaging device.
5. In the imaging apparatus according to any one of claims 1 to 4, The aforementioned housing is further provided with a case having a first opening and a second opening, The fan is located at the first opening. Imaging device.
6. In the imaging apparatus according to claim 5, The first opening is larger than the second opening. Imaging device.
7. In the imaging apparatus according to claim 5, The aforementioned fan is equipped with a dust filter. Imaging device.