Multilayer ceramic electronic components

Abstract

To provide multilayer ceramic electronic components that are miniaturized, have high capacity, and ensure moisture resistance reliability. [Solution] The disclosed multilayer ceramic electronic component includes a ceramic body comprising a plurality of dielectric layers and a plurality of internal electrodes arranged sandwiching the dielectric layers, an external electrode arranged outside the ceramic body, and a coating layer arranged on at least a portion of the outer surface of the ceramic body, wherein the coating layer comprises a water-repellent coating agent and at least one of a thermal stabilizer that removes free radicals generated from the water-repellent coating agent and an antioxidant that decomposes the free radical formation factors.

Description

[Technical Field]

[0001] This disclosure relates to multilayer ceramic electronic components. [Background technology]

[0002] Electronic components that use ceramic materials include capacitors, inductors, piezoelectric elements, varistors, and thermistors. Among these ceramic electronic components, multilayer ceramic capacitors (MLCCs) can be used in a wide variety of electronic devices due to their small size, guaranteed high capacitance, and ease of mounting.

[0003] Multilayer ceramic capacitors are chip-type electronic components that are mounted on the substrates of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic light-emitting diodes (OLEDs), computers, personal mobile devices, and smartphones, and play a role in charging or discharging electricity.

[0004] As the operating environments for multilayer ceramic capacitors become more diverse, the moisture resistance reliability of these capacitors is becoming increasingly important.

[0005] A multilayer ceramic capacitor can include internal electrodes located inside the ceramic body and external electrodes located outside the ceramic body and connected to the internal electrodes. To increase the effective capacitance for miniaturization and higher capacitance of a multilayer ceramic capacitor, one approach is to increase the size of the ceramic body and minimize the thickness of the external electrodes.

[0006] However, reducing the thickness of the external electrodes to increase the size of the ceramic body can lead to a decrease in the moisture resistance reliability of the multilayer ceramic capacitor. Furthermore, during the plating process of the external electrodes, penetration of the plating solution can induce defects in the internal structure of the external electrode terminals and the ceramic body, which can lead to degradation of the reliability of the final product, particularly during high-temperature and high-pressure operation, and ultimately result in failure. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] One aspect of the present invention is to provide a multilayer ceramic electronic component that is miniaturized and has high capacity while ensuring moisture resistance reliability.

[0008] However, the problems that the embodiments of the present invention aim to solve are not limited to those described above, and can be broadly expanded within the scope of the technical ideas included in the present invention. [Means for solving the problem]

[0009] A multilayer ceramic electronic component according to one embodiment includes a ceramic body comprising a plurality of dielectric layers and a plurality of internal electrodes arranged sandwiching the dielectric layers, an external electrode arranged outside the ceramic body, and a coating layer arranged on at least a portion of the outer surface of the ceramic body, wherein the coating layer comprises a water-repellent coating agent and at least one of a thermal stabilizer that removes free radicals generated from the water-repellent coating agent and an antioxidant that decomposes the free radical formation factors.

[0010] The coating layer may include a first layer containing the heat stabilizer, the antioxidant, and the water-repellent coating agent, and a second layer disposed on the first layer and containing the water-repellent coating agent.

[0011] The coating layer may include a first layer containing the heat stabilizer, the antioxidant, and the water-repellent coating agent; a second layer disposed on the first layer and containing the heat stabilizer; a third layer disposed on the second layer and containing the antioxidant; and a fourth layer disposed on the third layer and containing the water-repellent coating agent.

[0012] The coating layer may include a first layer containing the heat stabilizer, a second layer disposed on the first layer and containing the antioxidant, and a third layer disposed on the second layer and containing the water-repellent coating agent.

[0013] The coating layer may include a first layer containing the antioxidant, a second layer disposed on the first layer and containing the heat stabilizer, and a third layer disposed on the second layer and containing the water-repellent coating agent.

[0014] The coating layer may include a first layer containing the heat stabilizer and a second layer disposed on the first layer and containing the water-repellent coating agent.

[0015] The coating layer may be placed on the outer surface of the ceramic body, excluding the portion where the external electrodes are located.

[0016] At least one of the ceramic body and the external electrode may contain the components of the coating layer.

[0017] The water-repellent coating agent may also contain a fluorine-based compound comprising at least one of the following: a silane-fluorine compound, perfluoropolyether (PFPE), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), and polyvinyl fluoride (PVF).

[0018] The heat stabilizer may contain one or more selected from: a benzotriazole compound including hydroxyphenylbenzotriazole; a sebacate compound containing at least one of bis-(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and bis-(1-octyl-2,2,6,6-tetramethyl-4-piperidyl) sebacate; and a formamidine compound containing at least one of N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-phenylformamidine, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-phenylformamidine.

[0019] The antioxidant may include one or more selected from: a phosphorus compound containing a phosphite compound; a phenolic compound containing at least one of methylhydrocinnamate, benzenepropionic acid, tetrakis[methylene-3(3'5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate.

[0020] A multilayer ceramic electronic component according to another embodiment includes a ceramic body comprising a plurality of dielectric layers and a plurality of internal electrodes arranged sandwiching the dielectric layers, an external electrode arranged outside the ceramic body, and a coating layer arranged on at least a portion of the outer surface of the ceramic body, wherein the coating layer comprises a fluorine-based compound and at least one of a benzotriazole-based compound, a sebacate-based compound, a formamidine-based compound, a phenol-based compound, and a phosphorus-based compound.

[0021] The coating layer may include a first layer containing at least one of the benzotriazole-based compound, the sebacate-based compound, and the formamidine-based compound, at least one of the phenol-based compound and the phosphorus-based compound, and the fluorine-based compound, and a second layer disposed on the first layer and containing the fluorine-based compound.

[0022] The coating layer may include a first layer containing at least one of the benzotriazole-based compound, the sebacate-based compound, and the formamidine-based compound, a second layer disposed on the first layer and containing at least one of the benzotriazole-based compound, the sebacate-based compound, and the formamidine-based compound, a third layer disposed on the second layer and containing at least one of the phenol-based compound and the phosphorus-based compound, and a fourth layer disposed on the third layer and containing the fluorine-based compound.

[0023] The coating layer may include a first layer containing at least one of the benzotriazole-based compound, the sebacate-based compound, and the formamidine-based compound, a second layer disposed on the first layer and containing at least one of the phenol-based compound and the phosphorus-based compound, and a third layer disposed on the second layer and containing the fluorine-based compound.

[0024] The coating layer may include a first layer containing at least one of the phenol-based compound and the phosphorus-based compound, a second layer disposed on the first layer and containing at least one of the benzotriazole-based compound, the sebacate-based compound, and the formamidine-based compound, and a third layer disposed on the second layer and containing the fluorine-based compound.

[0025] The coating layer may include a first layer containing at least one of the benzotriazole-based compound, the sebacate-based compound, and the formamidine-based compound, and a second layer disposed on the first layer and containing the fluorine-based compound.

[0026] The benzotriazole-based compound includes hydroxyphenylbenzotriazole, the sebacate-based compound includes at least one of bis-(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and bis-(1-octyl-2,2,6,6-tetramethyl-4-piperidyl) sebacate, the formamidine-based compound includes at least one of N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-phenylformamidine, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-phenylformamidine, and the fluorine-based compound may include at least one of a silane-fluorine-based compound, perfluoro polyether (PFPE), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), and polyvinyl fluoride (PVF).

[0027] The phenolic compound includes at least one of methylhydrocinnamate, benzenepropionic acid, tetrakis[methylene-3(3’5’-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, and the phosphorus-based compound may include a phosphite-based compound.

[0028] At least one of the ceramic body and the external electrode may contain the components of the coating layer. [Effects of the Invention]

[0029] According to the multilayer ceramic electronic component of the present invention, the effective capacity of the multilayer ceramic electronic component can be increased, penetration of the plating solution during the plating process can be prevented, and the moisture resistance reliability of the multilayer ceramic electronic component can be improved.

[0030] However, it is obvious that the effects of the embodiments are not limited to those described above, and can be extended in various ways without departing from the spirit and scope of the present invention. [Brief explanation of the drawing]

[0031] [Figure 1] Figure 1 is a schematic perspective view showing a multilayer ceramic electronic component according to one embodiment. [Figure 2] Figure 2 is a separated perspective view showing the layered structure of the internal electrodes in the multilayer ceramic electronic component shown in Figure 1. [Figure 3] Figure 3 is a cross-sectional view taken along the line II-II' in Figure 1. [Figure 4a] Figure 4a is a cross-sectional view showing the manufacturing steps of a multilayer ceramic electronic component according to one embodiment. [Figure 4b] Figure 4b is a cross-sectional view showing the manufacturing steps of a multilayer ceramic electronic component according to one embodiment. [Figure 4c] Figure 4c is a cross-sectional view showing the manufacturing steps of a multilayer ceramic electronic component according to one embodiment. [Figure 5] Figure 5 is a cross-sectional view of a multilayer ceramic electronic component according to another embodiment. [Figure 6] Figure 6 is a cross-sectional view of a multilayer ceramic electronic component according to another embodiment. [Figure 7] Figure 7 is a graph showing the water-repellent coating performance of multilayer ceramic electronic components according to the examples and comparative examples. [Figure 8]Figure 8 is a graph showing the water-repellent coating performance of multilayer ceramic electronic components according to other embodiments. [Figure 9] Figure 9 is a graph showing the water-repellent coating performance of multilayer ceramic electronic components according to other embodiments. [Modes for carrying out the invention]

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that they can be easily implemented by a person ordinary skill in the art to which the present invention pertains. In order to clearly illustrate the present invention in the drawings, unnecessary parts have been omitted, and the same or similar components are denoted by the same reference numerals throughout the specification. In addition, some components in the accompanying drawings are exaggerated, omitted, or shown schematically, and the size of each component does not fully reflect its actual size.

[0033] The accompanying drawings are for illustrative purposes only to facilitate understanding of the embodiments disclosed herein, and the accompanying drawings shall not limit the technical ideas disclosed herein, and shall be understood to include any modifications, equivalents, or substitutions that fall within the concept and scope of the present invention.

[0034] Terms including ordinal numbers, such as "first," "second," etc., are used to describe various components, but these components are not limited by such terms. These terms are used solely for the purpose of distinguishing one component from others.

[0035] Furthermore, when a layer, membrane, region, plate, or other part is said to be "on top of" another part, this includes not only the case where it is "directly above" the other part, but also the case where the other part is in between. Conversely, when one part is said to be "directly above" another part, it means that there is no other part in between. Also, being "on top of" a reference part means being located above or below the reference part, and does not necessarily mean being located "above" in the opposite direction of gravity.

[0036] Throughout the specification, terms such as “includes” or “have” are intended to indicate the presence of features, figures, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood not to preemptively exclude the presence or possibility of adding one or more other features, figures, steps, actions, components, parts, or combinations thereof. Therefore, when a part “includes” a component, this does not exclude other components, but rather means that other components may be included, unless otherwise stated.

[0037] Furthermore, throughout the specification, "on a plane" means when the subject is viewed from above, and "on a cross-section" means when the subject is viewed from the side of a cross-section obtained by cutting the subject perpendicularly.

[0038] Furthermore, throughout the specification, the term "connected" does not only mean that two or more components are directly connected, but may also mean that two or more components are indirectly connected through other components, that they are not only physically connected but also electrically connected, or that they are a single unit, even though they are referred to by different names depending on their location or function.

[0039] Figure 1 is a schematic perspective view showing a multilayer ceramic electronic component according to one embodiment; Figure 2 is a separated perspective view showing the layered structure of the internal electrodes in the multilayer ceramic electronic component of Figure 1; and Figure 3 is a cross-sectional view cut along the line II-II' in Figure 1.

[0040] Referring to Figures 1 to 3, the multilayer ceramic electronic component 100 according to this embodiment includes a ceramic body 110, a first external electrode 120, a second external electrode 130, a plurality of first internal electrodes 150, and a plurality of second internal electrodes 160.

[0041] First, to clearly explain this embodiment, the directions are defined as follows: the L-axis, W-axis, and T-axis shown in the drawing represent the length, width, and thickness directions of the multilayer ceramic electronic component 100, respectively.

[0042] The thickness direction (T-axis direction) may be perpendicular to the broad surface (main surface) of the sheet-shaped component. For example, the thickness direction (T-axis direction) may be used as the same concept as the direction in which the dielectric layer 140 is stacked.

[0043] The length direction (L-axis direction) is parallel to the broad surface (main surface) of the sheet-shaped component and may intersect (or be perpendicular to) the thickness direction (T-axis direction). For example, the length direction (L-axis direction) may be the direction in which the first external electrode 120 and the second external electrode 130 face each other.

[0044] The width direction (W-axis direction) is a direction parallel to the wide surface (main surface) of the sheet-shaped component, and may simultaneously intersect (or be perpendicular to) the thickness direction (T-axis direction) and the length direction (L-axis direction).

[0045] The ceramic body 110 may be approximately hexahedral in shape, but this embodiment is not limited to this. Due to shrinkage during sintering, the ceramic body 110 may not be a perfect hexahedron, but may have a substantially hexahedral shape. For example, the ceramic body 110 may be approximately a right hexahedron, but the corners and vertices may have a rounded shape.

[0046] In this embodiment, for the sake of explanation, surfaces facing each other in the length direction (L-axis direction) are defined as the first surface S1 and the second surface S2, surfaces facing each other in the width direction (W-axis direction) and connecting the first surface S1 and the second surface S2 are defined as the third surface S3 and the fourth surface S4, and surfaces facing each other in the thickness direction (T-axis direction) and connecting the first surface S1 and the second surface S2 are defined as the fifth surface S5 and the sixth surface S6.

[0047] Therefore, the first direction, which is the direction in which the first surface S1 and the second surface S2 face each other, may be the length direction (L-axis direction), and the second and third directions, which are perpendicular to the first direction and perpendicular to each other, may be the thickness direction (T-axis direction) and the width direction (W-axis direction), or the width direction (W-axis direction) and the thickness direction (T-axis direction), respectively.

[0048] The length of the ceramic body 110 may represent the maximum length of a plurality of line segments parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of the ceramic body 110 that are opposite each other in the length direction (L-axis direction) as seen in the aforementioned cross-sectional photograph of the ceramic body 110 in the width direction (W-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-sectional photograph of the ceramic body 110 in the length direction (L-axis direction). On the other hand, the length of the ceramic body 110 may represent the minimum length of a plurality of line segments parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of the ceramic body 110 that are opposite each other in the length direction (L-axis direction) as seen in the aforementioned cross-sectional photograph. On the other hand, the length of the ceramic body 110 may represent the arithmetic mean of the lengths of at least two line segments parallel to the length direction (L-axis direction), obtained by connecting the two outermost boundary lines of the ceramic body 110 that are opposite each other in the length direction (L-axis direction) as seen in the aforementioned cross-sectional photograph.

[0049] The thickness of the ceramic body 110 may represent the maximum length of a plurality of line segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of the ceramic body 110, which are opposite each other in the thickness direction (T-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-sectional photograph of the ceramic body 110 in the length direction (L-axis direction) - thickness direction (T-axis direction), as shown above. On the other hand, the thickness of the ceramic body 110 may represent the minimum length of a plurality of line segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of the ceramic body 110, which are opposite each other in the thickness direction (T-axis direction), as shown above. On the other hand, the thickness of the ceramic body 110 may represent the arithmetic mean of the lengths of at least two line segments parallel to the thickness direction (T-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of the ceramic body 110, which are opposite each other in the thickness direction (T-axis direction), as shown above.

[0050] The width of the ceramic body 110 may represent the maximum length of a plurality of line segments parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of the ceramic body 110 in the width direction (W-axis direction) at the center of the ceramic body 110 in the thickness direction (T-axis direction), based on an optical microscope or scanning electron microscope (SEM) photograph of the cross-sectional photograph. On the other hand, the width of the ceramic body 110 may represent the minimum length of a plurality of line segments parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of the ceramic body 110 in the width direction (W-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph. On the other hand, the width of the ceramic body 110 may represent the arithmetic mean of the lengths of at least two line segments parallel to the width direction (W-axis direction), obtained by connecting the two outermost boundary lines that appear in the aforementioned cross-sectional photograph of the ceramic body 110 in the width direction (W-axis direction).

[0051] The ceramic body 110 may include multiple dielectric layers 140 stacked in the thickness direction (T-axis direction). The boundaries between the dielectric layers 140 may be unclear. For example, the boundaries between the dielectric layers 140 may be difficult to confirm without using a scanning electron microscope (SEM), and the multiple dielectric layers 140 may appear as a single integrated structure.

[0052] The first internal electrode 150 and the second internal electrode 160 may be stacked alternately with the dielectric layer 140 in between. Such a stacked structure may be repeated within the ceramic body 110, and the internal electrode closest to the fifth surface S5 of the ceramic body 110 may be either the first internal electrode 150 or the second internal electrode 160, and the internal electrode closest to the sixth surface S6 may be either the first internal electrode 150 or the second internal electrode 160.

[0053] The first internal electrode 150 and the second internal electrode 160 have different polarities, but they may be electrically insulated from each other by a dielectric layer 140 placed between them.

[0054] The first internal electrode 150 and the second internal electrode 160 may be arranged so as to be offset from each other in the longitudinal direction (L-axis direction) with the dielectric layer 140 in between. One end of the first internal electrode 150 may be exposed through the first surface S1 of the ceramic body 110, and one end of the second internal electrode 160 may be exposed through the second surface S2 of the ceramic body 110. The end of the first internal electrode 150 exposed from the first surface S1 of the ceramic body 110 may be connected to the first external electrode 120. The end of the second internal electrode 160 exposed from the second surface S2 of the ceramic body 110 may be connected to the second external electrode 130.

[0055] The first internal electrode 150 and the second internal electrode 160 may be formed by printing a conductive paste containing a conductive metal onto the surface of the dielectric layer 140. For example, the internal electrodes can be formed by printing a conductive paste containing nickel (Ni) or a nickel (Ni) alloy onto the surface of the dielectric layer using screen printing or gravure printing. However, this embodiment is not limited to this.

[0056] For example, the average thickness of the first internal electrode 150 and the second internal electrode 160 may be approximately 0.1 μm or more and 2 μm or less.

[0057] Here, the thickness of the internal electrode may refer to the average thickness of a single internal electrode placed between two dielectric layers. The average thickness of the internal electrode may also be the arithmetic mean of the thickness of a single internal electrode shown in a scanning electron microscope (SEM) photograph taken at a magnification of 10,000x for a cross section in the length direction (L direction) - thickness direction (T direction) at the center of the width direction (W direction) of the ceramic body 110, measured at 30 points evenly spaced in the length direction (L direction). The 30 points mentioned above may be designated as the active region described later. After measuring the average thickness of 10 internal electrodes in this manner, the average thickness of the internal electrode can be more generalized by deriving the arithmetic mean of the measured values.

[0058] When a voltage is applied to the first external electrode 120 and the second external electrode 130, charge accumulates between the first internal electrode 150 and the second internal electrode 160, which are opposite each other. In other words, capacitance can be obtained between the first internal electrode 150, which is electrically connected to the first external electrode 120, and the second internal electrode 160, which is electrically connected to the second external electrode 130. The capacitance of the multilayer ceramic electronic component 100 is proportional to the overlapping area of ​​the first internal electrode 150 and the second internal electrode 160, which overlap each other along the thickness direction (T-axis direction).

[0059] In other words, the multilayer ceramic electronic component 100 may include an active region and a margin region. The active region may refer to the region where the first internal electrode 150 and the second internal electrode 160 overlap along the thickness direction (T-axis direction), and the margin region may refer to the region between the active region and the first surface S1 of the ceramic body 110 and the region between the active region and the second surface S2 of the ceramic body 110.

[0060] Multilayer ceramic electronic components 100 are classified based on their length and width. Therefore, even multilayer ceramic electronic components with the same length and width can have different ceramic body sizes depending on the thickness of their external electrodes. In other words, multilayer ceramic electronic components with thinner external electrodes can have a larger ceramic body than those with thicker external electrodes. A larger ceramic body means a larger active region, and potentially a larger capacitance. As a result, the thinner the external electrodes of a multilayer ceramic electronic component, the greater the capacitance. In this embodiment, the thickness of the external electrodes can be reduced by forming thin electrode layers on the first and second surfaces of the ceramic body, thereby obtaining advantageous effects.

[0061] A first cover layer 143 and a second cover layer 145 may be arranged on the outside of the active region in the thickness direction (T-axis direction).

[0062] The first cover layer 143 is positioned between the fifth surface S5 of the ceramic body 110 and the internal electrode closest to it. The second cover layer 145 is positioned between the sixth surface S6 of the ceramic body 110 and the internal electrode closest to it.

[0063] That is, the first cover layer 143 may be disposed above the internal electrode at the uppermost part within the ceramic body 110, and the second cover layer 145 may be disposed below the internal electrode at the lowermost part. The first cover layer 143 and the second cover layer 145 can have the same composition as the dielectric layer 140. One or more dielectric layers can be laminated on the outer surfaces of the uppermost internal electrode and the lowermost internal electrode, respectively, to form the first cover layer 143 and the second cover layer 145.

[0064] The first cover layer 143 and the second cover layer 145 can serve to prevent damage to the first internal electrode 150 and the second internal electrode 160 due to physical or chemical stress.

[0065] The dielectric layer 140 can include a high dielectric constant ceramic material. For example, the ceramic material can include a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Further, these components can further include auxiliary components such as manganese (Mn) compounds, iron (Fe) compounds, chromium (Cr) compounds, cobalt (Co) compounds, nickel (Ni) compounds, etc. For example, the dielectric layer is (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, etc., but the present invention is not limited thereto.

[0066] In addition, the dielectric layer 140 may further include one or more of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant. The ceramic additive may be, for example, a transition metal oxide or carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like.

[0067] For example, the average thickness of the dielectric layer 140 may be 0.1 μm to 10 μm, but this embodiment is not limited to this.

[0068] The first external electrode 120 and the second external electrode 130 are supplied with voltages of different polarities from each other and can be connected to and electrically coupled with the exposed portions of the first internal electrode 150 and the second internal electrode 160, respectively.

[0069] The first external electrode 120 and the second external electrode 130 are positioned outside the ceramic body 110. The first external electrode 120 and the second external electrode 130 may also be positioned on both sides of the ceramic body 110 in the first direction.

[0070] The first external electrode 120 is positioned on the first surface S1 of the ceramic body 110 and may extend to a portion of at least one of the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6. The second external electrode 130 is positioned on the second surface S2 of the ceramic body 110 and may extend to a portion of at least one of the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6.

[0071] The first external electrode 120 and the second external electrode 130 may include a connecting portion and a band portion. The connecting portion may be located on the first surface S1 or the second surface S2 of the ceramic body 110 and connect to the exposed portion of the first internal electrode 150 or the second internal electrode 160. The band portion may include a portion extending from the connecting portion to a part of at least one of the third surface S3, fourth surface S4, fifth surface S5, and sixth surface S6 of the ceramic body 110.

[0072] The first external electrode 120 and the second external electrode 130 may contain at least one conductive metal such as copper (Cu), silver (Ag), or nickel (Ni), and may further contain glass, epoxy, etc. The first external electrode 120 and the second external electrode 130 may be formed by applying a conductive paste containing the metal and firing it.

[0073] On the other hand, the multilayer ceramic electronic component 100 may further include a first plating layer 180 and a second plating layer 190.

[0074] The first plating layer 180 covers the first external electrode 120. The first plating layer 180 may include a first layer for ensuring the mechanical, electrical, and chemical stability of the external electrode, and a second layer made of a low-melting-point material to allow soldering of the multilayer ceramic electronic component. The first layer may be placed on the first external electrode 120, and the second layer may be placed on the first layer. The first layer may contain nickel (Ni), and the second layer may contain tin (Sn), but this embodiment is not limited thereto.

[0075] The second plating layer 190 covers the second external electrode 130. The second plating layer 190 may include a first layer and a second layer. The first layer may be placed on the second external electrode 130, and the second layer may be placed on the first layer. The first layer may contain nickel (Ni), and the second layer may contain tin (Sn), but this embodiment is not limited thereto.

[0076] The multilayer ceramic electronic component 100 according to this embodiment may include a coating layer 170 disposed on at least a portion of the outer surface of the ceramic body 110. The coating layer 170 may be disposed on the outer surface of the ceramic body 110 excluding the portion where the first external electrode 120 and the second external electrode 130 are disposed.

[0077] The coating layer 170 may include a water-repellent coating agent to prevent the plating solution from penetrating through areas where the density of the external electrode is reduced or through floating areas between the external electrode and the ceramic body during the process of forming a plating layer on the external electrode. Furthermore, the coating layer 170 may include at least one of a heat stabilizer and an antioxidant to prevent the formation of free radicals from the water-repellent coating agent due to thermal energy, which could destroy the coating layer.

[0078] Here, the heat stabilizer removes free radicals generated from the water-repellent coating agent, and the antioxidant can decompose the free radical-forming factors. Referring to reaction equation 1, when thermal energy is applied to the water-repellent coating agent component consisting of molecular formula R·H, ROO· free radicals are formed, and the heat stabilizer reacts with the ROO· free radicals to remove them.

[0079] [ka]

[0080] At this time, the free radical of ROO· combines with R·H to form ROOH, which is a free radical-forming factor. However, as shown in reaction equation 2, the antioxidant reacts with ROOH and decomposes it into ROH. Therefore, the decomposition of ROOH into RO· and ·OH and the formation of free radicals can be prevented.

[0081] [ka]

[0082] In reaction equations 1 and 2, R may be a hydrocarbon residue, for example, a hydrocarbon residue in which at least one hydrogen atom is substituted with fluorine (F).

[0083] The coating layer 170 may consist of one layer containing at least one of a heat stabilizer and an antioxidant and a water-repellent coating agent, or it may consist of multiple layers each containing a heat stabilizer, an antioxidant, and a water-repellent coating agent. For example, it may consist of one layer containing a water-repellent coating agent, a heat stabilizer, and an antioxidant, or further containing a layer containing a water-repellent coating agent, or consisting of a first layer containing a heat stabilizer, a second layer containing an antioxidant, and a third layer containing a water-repellent coating agent, or consisting of a first layer containing a water-repellent coating agent, a heat stabilizer, and an antioxidant, a second layer containing a heat stabilizer, a third layer containing an antioxidant, and a fourth layer containing a water-repellent coating agent, and so on. A variety of variations are possible.

[0084] The water-repellent coating agent contains a fluorine-based compound, and may include at least one of the following: silane-fluorine compounds, perfluoropolyether (PFPE), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), and polyvinyl fluoride (PVF).

[0085] The heat stabilizer removes free radicals generated from the water-repellent coating agent and may contain at least one of a benzotriazole compound, a sebacate compound, and a formamidine compound. For example, the benzotriazole compound includes hydroxyphenylbenzotriazole, the sebacate compound includes at least one of bis-(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate and bis-(1-octyl-2,2,6,6-tetramethyl-4-piperidyl)sebacate, and the formamidine compound may include at least one of N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-phenylformamidine, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-phenylformamidine.

[0086] The antioxidant is one that decomposes free radical-forming factors and may include at least one of phenolic compounds and phosphorus compounds. For example, the phenolic compound may include at least one of methylhydrocinnamate, benzenepropionic acid, tetrakis[methylene-3(3'5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate, and the phosphorus compound may include a phosphite compound.

[0087] At least one of the first external electrode 120, the second external electrode 130, and the ceramic body 110 can contain the components of the coating layer 170. In particular, the components of the coating layer 170 can fill cracks on the surfaces of the first external electrode 120 and the second external electrode 130 or on the surface of the ceramic body 110, or in areas where the ceramic body 110 is separated from the first external electrode 120 and the second external electrode 130, thereby suppressing the penetration of moisture into the interior of the ceramic body 110.

[0088] In this embodiment, the coating layer 170 includes a first layer 171 containing a heat stabilizer, an antioxidant, and a water-repellent coating agent, and a second layer 173 disposed on the first layer 171 and containing a water-repellent coating agent.

[0089] The ceramic body 110 and the first external electrode 120 and second external electrode 130 may contain component 171a of the first layer 171. In particular, component 171a, which is a mixture of a heat stabilizer, an antioxidant, and a water-repellent coating agent, may be filled into the cracks on the surface of the first external electrode 120 and second external electrode 130 or the surface of the ceramic body 110, or into the boundaries between the ceramic body 110 and the first external electrode 120 and second external electrode 130.

[0090] In this embodiment, since the first layer 171 contains a heat stabilizer, an antioxidant, and a water-repellent coating agent, free radicals formed by thermal energy are removed, and the factors that form these free radicals are decomposed, thereby suppressing the deterioration of the first layer 171. Furthermore, since the second layer 173 is included on the first layer 171, the water-repellent performance of the coating layer 170 can be further improved.

[0091] The manufacturing process of a multilayer ceramic electronic component according to one embodiment will be described in detail below with reference to Figures 4a to 4c. Figures 4a to 4c are cross-sectional views of the manufacturing steps of a multilayer ceramic electronic component according to one embodiment.

[0092] Referring to Figure 4a, a first layer 171 containing a heat stabilizer, an antioxidant, and a water-repellent coating agent, and a second layer 173 containing a water-repellent coating agent are formed on the outer surface of the ceramic body 110 and the outer surfaces of the first external electrode 120 and the second external electrode 130. At this time, components 171a of the first layer 171 may be filled into cracks on the surface of the ceramic body 110 or the surface of the first external electrode 120 and the second external electrode 130, or into the boundary between the ceramic body 110 and the first external electrode 120 and the second external electrode 130.

[0093] Specifically, the first layer 171 may be formed by applying and drying a slurry of a heat stabilizer, an antioxidant, and a water-repellent coating agent to the outer surface of the ceramic body 110 and the outer surfaces of the first external electrode 120 and the second external electrode 130. The heat stabilizer can be mixed in an amount of 1 to 10 parts by weight per 100 parts by weight of the water-repellent coating agent, and the antioxidant can be mixed in an amount of 1 to 10 parts by weight per 100 parts by weight of the water-repellent coating agent.

[0094] Referring to Figure 4b, the coating layer 170 formed on the outer surfaces of the first external electrode 120 and the second external electrode 130 is removed by dry or wet polishing. At this time, even after removing the coating layer 170, components 171a of the first layer 171 that filled the surfaces of the first external electrode 120 and the second external electrode 130 may remain. At this time, ROH may remain in the components 171a of the first layer 171, and R may be a hydrocarbon residue (moiety), for example, a hydrocarbon residue in which at least one hydrogen atom is substituted with fluorine (F). Therefore, the surfaces of the first external electrode 120 and the second external electrode 130 can be completely sealed.

[0095] Referring to Figure 4c, the first plating layer 180 and the second plating layer 190 are formed on the outer surfaces of the first external electrode 120 and the second external electrode 130 from which the coating layer 170 has been removed. Since the ceramic body 110 and the first external electrode 120 and the second external electrode 130 are sealed by the coating layer 170, the penetration of the plating solution during the plating process can be suppressed.

[0096] Hereinafter, multilayer ceramic electronic components according to various embodiments will be described in more detail with reference to Figures 5 and 6. Figure 5 is a cross-sectional view of a multilayer ceramic electronic component according to another embodiment, and Figure 6 is a cross-sectional view of a multilayer ceramic electronic component according to another embodiment.

[0097] The multilayer ceramic electronic components shown in Figures 5 and 6 have generally the same configuration as the embodiments described with reference to Figures 1 to 3. Different configurations will be described below, and the same reference numerals will be used for the same configurations. Configurations not described separately may be configured in the same way as the embodiments shown in Figures 1 to 3.

[0098] Referring to Figure 5, the multilayer ceramic electronic component according to this embodiment includes a coating layer 170 disposed on at least a portion of the outer surface of the ceramic body 110. The coating layer 170 may be disposed on the outer surface of the ceramic body 110 excluding the portion where the first external electrode 120 and the second external electrode 130 are disposed.

[0099] The coating layer 170 includes a first layer 171 containing a heat stabilizer, an antioxidant, and a water-repellent coating agent, a second layer 173 placed on the first layer 171 containing a heat stabilizer, a third layer 175 placed on the second layer 173 containing an antioxidant, and a fourth layer 177 placed on the third layer 175 containing a water-repellent coating agent.

[0100] The ceramic body 110 and the first external electrode 120 and second external electrode 130 may contain component 171a of the first layer 171. In particular, component 171a, which is a mixture of a heat stabilizer, an antioxidant, and a water-repellent coating agent, may be filled into the cracks on the surface of the first external electrode 120 and second external electrode 130 or the surface of the ceramic body 110, or into the boundaries between the ceramic body 110 and the first external electrode 120 and second external electrode 130.

[0101] Referring to Figure 6, the multilayer ceramic electronic component according to this embodiment includes a coating layer 170 disposed on at least a portion of the outer surface of the ceramic body 110. The coating layer 170 may be disposed on the outer surface of the ceramic body 110 excluding the portion where the first external electrode 120 and the second external electrode 130 are disposed.

[0102] The coating layer 170 includes a first layer 171 containing a heat stabilizer, a second layer 173 placed on the first layer 171 and containing an antioxidant, and a third layer 175 placed on the second layer 173 and containing a water-repellent coating agent.

[0103] The ceramic body 110, the first external electrode 120, and the second external electrode 130 may contain component 171a of the first layer 171. In particular, the thermal stabilizer component 171a may be filled into cracks on the surfaces of the first external electrode 120 and the second external electrode 130, or into the boundaries between the ceramic body 110 and the first external electrode 120 and the second external electrode 130.

[0104] Experimental Example 1 The moisture resistance reliability of the examples and comparative examples will be examined below with reference to Figure 7.

[0105] Figure 7 is a graph showing the water-repellent coating performance of multilayer ceramic electronic components according to the examples and comparative examples. In Figure 7, the solid line a represents the examples, and the dotted line b represents the comparative examples.

[0106] In Figure 7, the embodiment is a multilayer ceramic electronic component in which the coating layer, which is disposed on at least a portion of the outer surface of the ceramic body, has the structure shown in Figures 1 to 3. Specifically, the coating layer has a structure that includes a first layer containing a heat stabilizer, an antioxidant, and a water-repellent coating agent, and a second layer disposed on the first layer and containing a water-repellent coating agent. On the other hand, the comparative example's coating layer contains only a water-repellent coating agent.

[0107] Specifically, a slurry containing a heat stabilizer, an antioxidant, and a water-repellent coating agent was applied to the outer surface of the ceramic body and the outer surfaces of the first and second external electrodes and dried to form the first layer. A slurry containing a water-repellent coating agent was then applied to the formed first layer and dried to form the second layer. Here, PFPE (perfluoropolyether) was used as the water-repellent coating agent as a silane-fluorine compound, hydroxyphenylbenzotriazole was used as the heat stabilizer, and benzenepropionic acid was used as the antioxidant. At this time, the heat stabilizer was used at a ratio of 10 parts by weight per 100 parts by weight of the water-repellent coating agent, and the antioxidant was used at a ratio of 10 parts by weight per 100 parts by weight of the water-repellent coating agent.

[0108] The water-repellent coating performance was measured using a contact angle measurement method, specifically the sessile drop method, which is a static contact angle measurement method. Specifically, after exposing multilayer ceramic electronic component chips to an environment of 85°C and 85% RH (relative humidity) for a set period of time (250, 500, 750, 1000 hours, etc.), a liquid droplet was dropped onto the surface of the chip, and the resulting contact angle was measured using an optical instrument.

[0109] Referring to Figure 7, in the case of Example (solid line a), the contact angle remained above 100 degrees even after 2000 hours, showing good water-repellent performance. However, in the case of Comparative Example (dotted line b), the contact angle rapidly decreased after 1500 hours, falling to below 90 degrees. This is because the water-repellent coating agent constituting the coating layer of the Comparative Example forms free radicals due to thermal energy, causing the coating layer to be destroyed. Therefore, it can be confirmed that the moisture resistance reliability of the Example was significantly improved compared to the Comparative Example.

[0110] Experimental Example 2 The moisture resistance reliability of multilayer ceramic electronic components according to other embodiments will be examined below with reference to Figure 8.

[0111] Figure 8 is a graph showing the water-repellent coating performance of multilayer ceramic electronic components according to other embodiments.

[0112] In Figure 8, a multilayer ceramic electronic component according to another embodiment is a multilayer ceramic electronic component in which the coating layer disposed on at least a portion of the outer surface of the ceramic body has the structure shown in Figure 5. Specifically, the coating layer includes a first layer containing a heat stabilizer, an antioxidant, and a water-repellent coating agent; a second layer disposed on the first layer and containing a heat stabilizer; a third layer disposed on the second layer and containing an antioxidant; and a fourth layer disposed on the third layer and containing a water-repellent coating agent.

[0113] Specifically, a slurry containing a heat stabilizer, an antioxidant, and a water-repellent coating agent was applied to the outer surface of the ceramic body and the outer surfaces of the first and second external electrodes and dried to form the first layer. A slurry containing a heat stabilizer was applied to the formed first layer and dried to form the second layer. A slurry containing an antioxidant was applied to the formed second layer and dried to form the third layer. A slurry containing a water-repellent coating agent was applied to the formed third layer and dried to form the fourth layer. Here, PFPE (perfluoropolyether) was used as the water-repellent coating agent as a silane-fluorine compound, hydroxyphenylbenzotriazole was used as the heat stabilizer, and benzenepropionic acid was used as the antioxidant as a phenolic compound. At this time, the heat stabilizer was used at a ratio of 10 parts by weight per 100 parts by weight of the water-repellent coating agent, and the antioxidant was used at a ratio of 10 parts by weight per 100 parts by weight of the water-repellent coating agent.

[0114] The water-repellent coating performance was measured using a contact angle measurement method, specifically the sessile drop method, which is a static contact angle measurement method. Specifically, after exposing multilayer ceramic electronic component chips to an environment of 85°C and 85% RH (relative humidity) for a set period of time (250, 500, 750, 1000 hours, etc.), a liquid droplet was dropped onto the surface of the chip, and the resulting contact angle was measured using an optical instrument.

[0115] Referring to Figure 8, it can be seen that in this embodiment, the contact angle remained above 100 degrees even after 2000 hours, demonstrating excellent water-repellent performance. Therefore, it can be confirmed that the moisture resistance reliability was significantly improved in this embodiment.

[0116] Experimental Example 3 The moisture resistance reliability of multilayer ceramic electronic components in various embodiments will be examined below with reference to Figure 9.

[0117] Figure 9 is a graph showing the water-repellent coating performance of multilayer ceramic electronic components according to other embodiments. In Figure 9, the dotted line c represents Embodiment 1, and the solid line d represents Embodiment 2.

[0118] In Figure 9, the multilayer ceramic electronic component according to Example 1 is a multilayer ceramic electronic component in which the coating layer disposed on at least a portion of the outer surface of the ceramic body has the structure shown in Figure 6. That is, the coating layer includes a first layer containing a thermal stabilizer, a second layer disposed on the first layer and containing an antioxidant, and a third layer disposed on the second layer and containing a water-repellent coating agent. On the other hand, the multilayer ceramic electronic component according to Example 2 includes a first layer containing an antioxidant, a second layer disposed on the first layer and containing a thermal stabilizer, and a third layer disposed on the second layer and containing a water-repellent coating agent, in which the coating layer disposed on at least a portion of the outer surface of the ceramic body.

[0119] Specifically, in Example 1, a slurry containing a heat stabilizer was applied to the outer surface of the ceramic body and the outer surfaces of the first and second external electrodes to form a first layer. A slurry containing an antioxidant was applied to the formed first layer and dried to form a second layer. A slurry containing a water-repellent coating agent was applied to the formed second layer and dried to form a third layer. In Example 2, a slurry containing an antioxidant was applied to the outer surface of the ceramic body and the outer surfaces of the first and second external electrodes to form a first layer. A slurry containing a heat stabilizer was applied to the formed first layer and dried to form a second layer. A slurry containing a water-repellent coating agent was applied to the formed second layer and dried to form a third layer. Here, PFPE (Perfluoropolyether) was used as the water-repellent coating agent as a silane-fluorine compound, hydroxyphenylbenzotriazole was used as the heat stabilizer, and benzenepropionic acid was used as the antioxidant as a phenolic compound. At this time, the heat stabilizer was used at a rate of 10 parts by weight per 100 parts by weight of the water-repellent coating agent, and the antioxidant was used at a rate of 10 parts by weight per 100 parts by weight of the water-repellent coating agent.

[0120] The water-repellent coating performance was measured using a contact angle measurement method, specifically the sessile drop method, which is a static contact angle measurement method. Specifically, after exposing multilayer ceramic electronic component chips to an environment of 85°C and 85% RH (relative humidity) for a set period of time (250, 500, 750, 1000 hours, etc.), a liquid droplet was dropped onto the surface of the chip, and the resulting contact angle was measured using an optical instrument.

[0121] Referring to Figure 9, in Example 1 (dotted line c), the contact angle remained above 120 degrees even after 2400 hours, demonstrating good water-repellent performance. In Example 2 (solid line d), the contact angle remained approximately 120 degrees even after 2400 hours, demonstrating good water-repellent performance. Therefore, it can be confirmed that the moisture resistance reliability was significantly improved in both Example 1 and Example 2.

[0122] While embodiments of the present invention have been described above, the present invention is not limited thereto. It can be implemented in various ways within the scope of the claims, description of the invention, and accompanying drawings, and these variations naturally also fall within the scope of the present invention. [Explanation of symbols]

[0123] 100: Multilayer ceramic electronic components 110: Ceramic body 120: 1st external electrode 130: 2nd external electrode 140: Dielectric layer 143: First Cover Layer 145: Second Cover Layer 150: 1st internal electrode 160:Second internal electrode 170: Coating layer 171: 1st layer 171a: Components of Layer 171 173:Second layer 175:Third layer 177: 4th layer 180: First plating layer 190: Second plating layer S1: 1st page S2: 2nd side S3:Side 3 S4:Side 4 S5:Side 5 S6:Side 6

Claims

1. A ceramic body comprising multiple dielectric layers and multiple internal electrodes arranged sandwiching the dielectric layers, External electrodes disposed outside the ceramic body, and The ceramic body includes a coating layer that is disposed on at least a portion of its outer surface, The aforementioned coating layer is Water-repellent coating agent, A multilayer ceramic electronic component comprising at least one of a thermal stabilizer that removes free radicals generated from the water-repellent coating agent and an antioxidant that decomposes the free radical-forming factors.

2. The multilayer ceramic electronic component according to claim 1, wherein the coating layer comprises a first layer containing the heat stabilizer, the antioxidant, and the water-repellent coating agent, and a second layer disposed on the first layer and containing the water-repellent coating agent.

3. The aforementioned coating layer is A first layer comprising the heat stabilizer, the antioxidant, and the water-repellent coating agent, A second layer, which is disposed on the first layer and contains the heat stabilizer, A third layer is disposed on the second layer and contains the antioxidant, The multilayer ceramic electronic component according to claim 1, comprising a fourth layer disposed on the third layer and containing the water-repellent coating agent.

4. The aforementioned coating layer is The first layer containing the aforementioned heat stabilizer, A second layer, which contains the antioxidant, is disposed on the first layer, and The multilayer ceramic electronic component according to claim 1, comprising a third layer disposed on the second layer and containing the water-repellent coating agent.

5. The aforementioned coating layer is The first layer containing the aforementioned antioxidant, A second layer, which includes the heat stabilizer, is disposed on the first layer, and The multilayer ceramic electronic component according to claim 1, comprising a third layer disposed on the second layer and containing the water-repellent coating agent.

6. The aforementioned coating layer is A first layer containing the aforementioned heat stabilizer, The multilayer ceramic electronic component according to claim 1, comprising: a second layer disposed on the first layer and containing the water-repellent coating agent.

7. The multilayer ceramic electronic component according to claim 1, wherein the coating layer is disposed on the outer surface of the ceramic body, excluding the portion on which the external electrodes are arranged.

8. The multilayer ceramic electronic component according to claim 1, wherein at least one of the ceramic body and the external electrode includes the components of the coating layer.

9. The water-repellent coating agent comprises a fluorine-based compound comprising at least one of silane-fluorine compounds, perfluoropolyether (PFPE), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), and polyvinyl fluoride (PVF), according to any one of claims 1 to 6.

10. The multilayer ceramic electronic component according to any one of claims 1 to 6, wherein the heat stabilizer comprises one or more selected from: a benzotriazole compound containing hydroxyphenylbenzotriazole; a sebacate compound containing at least one of bis-(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and bis-(1-octyl-2,2,6,6-tetramethyl-4-piperidyl) sebacate; and a formamidine compound containing at least one of N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-phenylformamidine, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-phenylformamidine.

11. The multilayer ceramic electronic component according to any one of claims 1 to 5, wherein the antioxidant comprises one or more selected from: a phosphorus compound containing a phosphite compound; and a phenolic compound containing at least one of methylhydrocinnamate, benzenepropionic acid, tetrakis[methylene-3(3'5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate.

12. A ceramic body comprising multiple dielectric layers and multiple internal electrodes arranged sandwiching the dielectric layers, External electrodes disposed outside the ceramic body, and The ceramic body includes a coating layer that is disposed on at least a portion of its outer surface, The aforementioned coating layer is Fluorine-based compounds and A multilayer ceramic electronic component comprising at least one of the following: a benzotriazole compound, a sebacate compound, a formamidine compound, a phenolic compound, and a phosphorus compound.

13. The aforementioned coating layer is A first layer comprising at least one of the benzotriazole compound, the sebacate compound, and the formamidine compound, at least one of the phenol compound and the phosphorus compound, and the fluorine compound, The multilayer ceramic electronic component according to claim 12, comprising a second layer disposed on the first layer and containing the fluorine-based compound.

14. The aforementioned coating layer is A first layer comprising at least one of the benzotriazole compound, the sebacate compound, and the formamidine compound, at least one of the phenol compound and the phosphorus compound, and the fluorine compound, A second layer is disposed on the first layer and contains at least one of the benzotriazole compound, the sebacate compound, and the formamidine compound, A third layer is disposed on the second layer and contains at least one of the phenolic compound and the phosphorus compound, The multilayer ceramic electronic component according to claim 12, comprising a fourth layer disposed on the third layer and containing the fluorine-based compound.

15. The aforementioned coating layer is A first layer comprising at least one of the benzotriazole compound, the sebacate compound, and the formamidine compound, A second layer is disposed on the first layer and contains at least one of the phenolic compound and the phosphorus compound, The multilayer ceramic electronic component according to claim 12, comprising a third layer disposed on the second layer and containing the fluorine-based compound.

16. The aforementioned coating layer is A first layer comprising at least one of the phenolic compound and the phosphorus compound, A second layer is disposed on the first layer and contains at least one of the benzotriazole compound, the sebacate compound, and the formamidine compound, The multilayer ceramic electronic component according to claim 12, comprising a third layer disposed on the second layer and containing the fluorine-based compound.

17. The aforementioned coating layer is A first layer comprising at least one of the benzotriazole compound, the sebacate compound, and the formamidine compound, The multilayer ceramic electronic component according to claim 12, comprising a second layer disposed on the first layer and containing the fluorine-based compound.

18. The aforementioned benzotriazole compound includes hydroxyphenylbenzotriazole, The sebacate compound comprises at least one of bis-(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and bis-(1-octyl-2,2,6,6-tetramethyl-4-piperidyl) sebacate. The formamidine compound comprises at least one of N-(4-alkoxycarbonylphenyl)-N'-alkyl-N'-phenylformamidine, N-(4-methoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, N-(4-ethoxycarbonylphenyl)-N'-methyl-N'-phenylformamidine, and N-(4-ethoxycarbonylphenyl)-N'-ethyl-N'-phenylformamidine. The multilayer ceramic electronic component according to any one of claims 12 to 17, wherein the fluorine-based compound comprises at least one of silane-fluorine compounds, perfluoropolyether (PFPE), polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), and polyvinyl fluoride (PVF).

19. The phenolic compound comprises at least one of methylhydrocinnamate, benzenepropionic acid, tetrakis[methylene-3(3'5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, and triethylene glycol bis(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate. The multilayer ceramic electronic component according to any one of claims 12 to 16, wherein the phosphorus-based compound includes a phosphite-based compound.

20. The multilayer ceramic electronic component according to claim 12, wherein at least one of the ceramic body and the external electrode includes the components of the coating layer.

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