Article packaging and article packaging method
JP2026101052APending Publication Date: 2026-06-22LINTEC CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- LINTEC CORP
- Filing Date
- 2024-12-10
- Publication Date
- 2026-06-22
AI Technical Summary
Technical Problem
Existing food packaging solutions, such as bending the opening or using clips, fail to provide sufficient holding force and airtightness for preserving contents.
Method used
A packaging system comprising a first and second self-adhesive adhesive layers laminated on films, with a protective member to prevent premature adhesion, allowing easy opening and sealing, and optionally including printed layers and dividing lines for improved handling.
Benefits of technology
The system ensures effective preservation by maintaining holding power and airtightness while facilitating easy opening and storage, suitable for various articles including snacks and food items.
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Smart Images

Figure 2026101052000001_ABST
Abstract
To provide an article packaging body and article packaging method suitable for preserving the contents. [Solution] A product packaging body 1 is provided, comprising a first film 10, a first self-adhesive adhesive layer 11 laminated on the first film 10, a second self-adhesive adhesive layer 21 positioned opposite the first self-adhesive adhesive layer 11, and a second film 20 laminated on the second self-adhesive adhesive layer 21. A product packaging method is also provided, which involves using this product packaging body 1 to peel off a protective member 30 from the second self-adhesive adhesive layer 21, placing a product on the second self-adhesive adhesive layer 21 from which the protective member 30 has been peeled off, peeling off the protective member 30 from the first self-adhesive adhesive layer 11, and bonding the second self-adhesive adhesive layer 21 and the first self-adhesive adhesive layer 11 so as to seal the periphery of the containment area 31 on which the product S is placed.
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Citation Information
Patent Citations
JP2013154906A