Antistatic resin composition and molded article thereof

Abstract

To provide an antistatic resin composition that can provide molded articles having excellent mechanical strength and excellent antistatic properties and their durability. [Solution] An antistatic resin composition containing 5 to 150 parts by mass of component (X) and 1 to 60 parts by mass of component (Y) per 100 parts by mass of synthetic resin. (X) Ingredients: Glass fiber. (Y) Component: One or more polymer compounds (E) obtained by reacting a polyester (a) obtained by reacting a diol (a1) and a dicarboxylic acid (a2), a compound (b) having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups.

Description

Technical Field

[0001] The present invention relates to an antistatic resin composition (hereinafter also simply referred to as "resin composition"), and more particularly to an antistatic resin composition containing glass fibers and capable of providing a molded body excellent in antistatic properties, and a molded body excellent in antistatic properties.

Background Art

[0002] Synthetic resins reinforced with glass fibers, particularly thermoplastic resins, are widely used because of their excellent mechanical strength and processability. In recent years, in particular, in the fields of automobiles, office equipment, electrical and electronic products, etc., engineering plastic resins such as polycarbonate resins, ABS resins, polycarbonate / ABS resins, etc., which are excellent in mechanical strength and heat resistance, have come to be used, and engineering plastic resins reinforced with glass fibers are being used (Patent Documents 1 and 2).

[0003] These thermoplastic resins have excellent insulating properties and are prone to charging, and may attract dust and dirt, damaging the appearance of the product. Also, when the molded product is an electrical or electronic product, the circuit may not operate properly due to charging. Furthermore, an electric shock may occur from the charged resin member, and not only will there be discomfort when receiving the electric shock, but there is also a possibility of inducing an explosion accident where there is a flammable gas or dust.

[0004] Today, in order to prevent the charging of resin members, measures such as adding an antistatic agent to the thermoplastic resin are taken. Such antistatic agents include a coating type used by spraying, dipping, coating, etc. on the resin molding surface, and a kneading type added as an additive to the polymer material and processed. However, the coating type not only has poor durability of antistatic properties, but also has a problem that the antistatic agent is wiped off when touching the surface. In response to such problems, Patent Document 3 proposes a polymer type antistatic agent used by kneading into a synthetic resin.

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] Japanese Patent Application Publication No. 7-216188 [Patent Document 2] Japanese Patent Publication No. 2007-186571 [Patent Document 3] Japanese Patent Publication No. 2012-241153 [Overview of the project] [Problems that the invention aims to solve]

[0006] However, these conventional resin molded articles using antistatic agents are not always sufficient in terms of antistatic performance and its duration, and further improvements are desired. Furthermore, there has been a problem where the mechanical strength of the molded article is compromised depending on the antistatic agent used.

[0007] Therefore, the object of the present invention is to provide an antistatic resin composition that can provide a molded article having excellent mechanical strength and excellent antistatic properties and their durability, and a molded article having excellent mechanical strength and excellent antistatic properties and their durability. [Means for solving the problem]

[0008] The inventors of this invention diligently studied and found that the above problems could be resolved by adopting the following configuration, and thus completed the present invention. In other words, the antistatic resin composition of the present invention is an antistatic resin composition containing 5 to 150 parts by mass of component (X) and 1 to 60 parts by mass of component (Y) below, per 100 parts by mass of synthetic resin. (X) Ingredients: Glass fiber. (Y) Component: One or more polymer compounds (E) obtained by reacting a polyester (a) obtained by reacting a diol (a1) and a dicarboxylic acid (a2), a compound (b) having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups.

[0009] The antistatic resin composition of the present invention preferably has a structure in which the polymer compound (E) comprises a polyester block (A) composed of the polyester (a) and a polyether block (B) composed of the compound (b), and is bonded via ester bonds or ether bonds formed by the reaction of a hydroxyl group or carboxyl group at the end of the polyester (a), a hydroxyl group at the end of the compound (b), and a hydroxyl group formed by the reaction of the epoxy group or epoxy group of the epoxy compound (D).

[0010] Furthermore, it is preferable that the antistatic resin composition of the present invention has a structure in which the polymer compound (E) is bonded via ester bonds to a block polymer (C) having carboxyl groups at both ends, which is formed by repeatedly and alternately bonding a block of polyester (A) and a block of polyether (B) via ester bonds, and to the epoxy compound (D).

[0011] Furthermore, it is preferable that the antistatic resin composition of the present invention further contains 0.01 to 15.0 parts by mass of one or more selected from the group consisting of alkali metal salts (F) and ionic liquids (G).

[0012] The molded article of the present invention is obtained from the antistatic resin composition. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide an antistatic resin composition that has excellent mechanical strength and excellent antistatic properties and their durability, and a molded article that has excellent mechanical strength and excellent antistatic properties and their durability. [Modes for carrying out the invention]

[0014] The embodiments of the present invention will be described in detail below. The antistatic resin composition of the present invention contains 5 to 150 parts by mass of component (X) and 1 to 60 parts by mass of component (Y) per 100 parts by mass of synthetic resin. (X) Ingredients: Glass fiber. (Y) Component: One or more polymer compounds (E) obtained by reacting a polyester (a) obtained by reacting a diol (a1) and a dicarboxylic acid (a2), a compound (b) having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups.

[0015] First, the synthetic resin used in the present invention will be described. While there are no particular limitations on the synthetic resins that can be used in the antistatic resin composition of the present invention, thermoplastic resins are preferred from the viewpoint of moldability, and among these, polycarbonate resins, polystyrene resins, polyester resins, polyether resins, and polyamide resins are more preferred from the viewpoint of the mechanical strength of the molded article and the antistatic properties and their durability, with polycarbonate resins being particularly preferred.

[0016] Examples of polycarbonate-based resins include polycarbonate, polycarbonate / ABS resin, polycarbonate / ASA resin, and branched polycarbonate.

[0017] Examples of polyester resins include polyalkylene terephthalates such as polyethylene terephthalate, polybutylene terephthalate, and polycyclohexanedimethylene terephthalate; aromatic polyesters such as polyalkylene naphthalates such as polyethylene naphthalate and polybutylene naphthalate; linear polyesters such as polytetramethylene terephthalate; and biodegradable aliphatic polyesters such as polyhydroxybutyrate, polycaprolactone, polybutylene succinate, polyethylene succinate, polylactic acid, polymalic acid, polyglycolic acid, polydioxane, and poly(2-oxetanone).

[0018] Examples of the polystyrene resin include vinyl group-containing aromatic hydrocarbons alone, and copolymers of vinyl group-containing aromatic hydrocarbons and other monomers (e.g., maleic anhydride, phenyl maleimide, (meth)acrylate esters, butadiene, (meth)acrylonitrile, etc.). Examples include polystyrene (PS) resin, high-impact polystyrene (HIPS), acrylonitrile-styrene (AS) resin, acrylonitrile-butadiene-styrene (ABS) resin, methyl methacrylate-butadiene-styrene (MBS) resin, heat-resistant ABS resin, acrylate-styrene-acrylonitrile (ASA) resin, styrene-maleic anhydride (SMA) resin, methacrylate-styrene (MS) resin, styrene-isoprene-styrene (SIS) resin, acrylonitrile-ethylene propylene rubber-styrene (AES) resin, styrene-butadiene-butylene-styrene (SBBS) resin, methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin and other thermoplastic resins, as well as hydrogenated styrene-based elastomer resins such as styrene-ethylene-butylene-styrene (SEBS) resin, styrene-ethylene-propylene-styrene (SEPS) resin, styrene-ethylene-propylene (SEP) resin, and styrene-ethylene-ethylene-propylene-styrene (SEEPS) resin obtained by hydrogenating the double bonds of butadiene or isoprene in these resins.

[0019] Examples of the polyether resin include polyacetal, polyphenylene ether, polyether ketone, polyether ether ketone, polyether ketone ketone, polyether ether ketone ketone, polyether sulfone, polyether imide, etc.

[0020] Examples of polyamide resins include polymers of ε-caprolactam (nylon 6), undecane lactam (nylon 11), lauryl lactam (nylon 12), aminocaproic acid, enantractam, 7-aminoheptanoic acid, 11-aminoundecanoic acid, 9-aminononanoic acid, α-pyrrolidone, α-piperidone, etc.; copolymers obtained by copolymerizing diamines such as hexamethylenediamine, nonanediamine, nonanemethylenediamine, methylpentadiamine, undecanemethylenediamine, dodecanemethylenediamine, and metaxylenediamine with carboxylic acid compounds such as adibic acid, sebacic acid, terephthalic acid, isophthalic acid, dodecanedicarboxylic acid, and glutaric acid, or mixtures of these polymers or copolymers. Other examples include aramid resins such as DuPont's "Kevlar®" and "Nomex," and Teijin Limited's "Twaron®" and "Conex."

[0021] Furthermore, examples of thermoplastic resins used in the present invention include polyolefin resins and chlorogenic resins.

[0022] Examples of polyolefin resins include, for example, polyethylene, low-density polyethylene, linear low-density polyethylene, high-density polyethylene, crosslinked polyethylene, ultra-high molecular weight polyethylene, polypropylene, homopolypropylene, impact copolymer polypropylene, random copolymer polypropylene, block copolymer polypropylene, isotactic polypropylene, syndiotactic polypropylene, hemi-isotactic polypropylene, polybutene, cycloolefin polymer, stereoblock polypropylene, poly-3-methyl-1-butene, poly-3-methyl-1-pentene, poly-4-methyl-1-pentene and other α-olefin polymers, block or random copolymers of ethylene and propylene, ethylene-methyl methacrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-butyl acrylate copolymer, ethylene-vinyl acetate copolymer and other α-olefin copolymers, polyfluoroolefin, and furthermore polyolefin thermoplastic elastomers. Two or more of these copolymers may also be used.

[0023] Examples of halogen-containing resins include polyvinyl chloride, polyvinylidene chloride, chlorinated polyethylene, chlorinated polypropylene, polyvinylidene fluoride, chlorinated rubber, vinyl chloride-vinyl acetate copolymer, vinyl chloride-ethylene copolymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-vinylidene chloride-vinyl acetate terpolymer, vinyl chloride-acrylic ester copolymer, vinyl chloride-maleic ester copolymer, vinyl chloride-cyclohexyl maleimide copolymer, and the like.

[0024] Furthermore, examples of thermoplastic resins include, for example, petroleum resins, coumarone resins, polyvinyl acetate, acrylic resins, polymethyl methacrylate, polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, polyphenylene sulfide, polyurethane, cellulose-based resins, polyimide resins, polysulfone, liquid crystal polymers and other thermoplastic resins and blends thereof can be used.

[0025] Furthermore, the thermoplastic resin may also be an elastomer such as isoprene rubber, butadiene rubber, acrylonitrile-butadiene copolymer rubber, styrene-butadiene copolymer rubber, fluororubber, silicone rubber, polyester elastomer, nitrile elastomer, nylon elastomer, vinyl chloride elastomer, polyamide elastomer, or polyurethane elastomer, and may be used in combination.

[0026] These thermoplastic resins may be used individually or in combination of two or more types. They may also be alloyed. These thermoplastic resins can be used regardless of molecular weight, degree of polymerization, density, softening point, proportion of insoluble matter in the solvent, degree of stereoregularity, presence or absence of catalyst residue, type and blending ratio of raw material monomers, and type of polymerization catalyst (e.g., Ziegler catalyst, metallocene catalyst, etc.).

[0027] Next, the glass fiber of component (X) of the present invention will be described. In the antistatic resin composition of the present invention, glass fibers are used as component (X). The type of glass fiber for component (X) is not particularly limited, and any of A glass, E glass, C glass, S glass, D glass, etc. can be used. Furthermore, the form is not particularly limited, and any glass fiber such as chopped strand, roving, yarn, or glass wool can be used, but chopped strand is preferred from the viewpoint of workability. When using chopped strand, it is preferable to use glass fibers with a fiber length (cut length) of 0.5 to 10 mm and a fiber diameter (filament diameter) of 8 to 20 μm, and especially with a fiber length of 2 to 5 mm and a fiber diameter of 10 to 15 μm.

[0028] The glass fibers described above may be treated with a surface treatment agent to improve wettability and adhesion with synthetic resins. Examples of such surface treatment agents include silane-based, titanate-based, aluminum-based, chromium-based, zirconium-based, and borane-based coupling agents. Among these, silane-based and titanate-based coupling agents are preferred, and silane-based coupling agents are particularly preferred. Examples of silane coupling agents include triethoxysilane, vinyltris(β-methoxyethoxy)silane, γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-chloropropyltrimethoxysilane.

[0029] Furthermore, the glass fibers may be bound together with a binding agent. Examples of binding agents include polypropylene resin, polyurethane resin, polyester resin, acrylic resin, epoxy resin, starch, and vegetable oil. The glass fiber of component (X) of this invention can be a commercially available product.

[0030] In the antistatic resin composition, the content of component (X) is 5 to 150 parts by mass per 100 parts by mass of synthetic resin, preferably 10 to 120 parts by mass, more preferably 20 to 100 parts by mass, and even more preferably 30 to 90 parts by mass, from the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article.

[0031] Next, the polymer compound (E) of component (Y) of the present invention will be described. Component (Y) of the present invention is one or more polymer compounds (E). This polymer compound (E) is a polymer compound obtained by reacting a polyester (a) obtained by reacting a diol (a1) and a dicarboxylic acid (a2), a compound (b) having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups.

[0032] The polymer compound (E) has a structure in which a polyester block (A) composed of polyester (a) and a polyether block (B) composed of compound (b) having hydroxyl groups at both ends are bonded via ester bonds or ether bonds formed by the reaction of hydroxyl groups formed by the reaction of hydroxyl groups formed by the reaction of hydroxyl groups at the ends of polyester (a), hydroxyl groups at the ends of compound (b), and epoxy groups of epoxy compound (D). This structure is preferable from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article.

[0033] The polyester block (A) of the polymer compound (E) is composed of polyester (a) obtained by the reaction of a diol (a1) and a dicarboxylic acid (a2). Polyester (a) can be obtained by esterifying the diol and the dicarboxylic acid.

[0034] Examples of diols (a1) used in polymer compound (E) according to the present invention include aliphatic diols and aromatic group-containing diols. Diol (a1) may also be a mixture of two or more types.

[0035] Examples of aliphatic diols include 1,2-ethanediol (ethylene glycol), 1,2-propanediol (propylene glycol), 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 2-methyl-1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 2,2-dimethyl-1,3-propanediol (neopentyl glycol), 2,2-diethyl-1,3-propanediol (3,3-dimethylolpentane), 2-n-butyl-2-ethyl-1,3-propanediol (3,3-dimethylolheptane), and 3-methyl Examples include -1,5-pentanediol, 1,6-hexanediol, 2,2,4-trimethyl-1,3-pentanediol, 2-ethyl-1,3-hexanediol, 2-methyl-1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,12-octadecanediol, 1,4-cyclohexanedimethanol, hydrogenated bisphenol A, 1,2-, 1,3- or 1,4-cyclohexanediol, cyclododecanediol, dimer diol, hydrogenated dimer diol, diethylene glycol, dipropylene glycol, and triethylene glycol. However, since aliphatic diols are preferably hydrophobic in terms of the mechanical strength of the molded article, the use of hydrophilic polyethylene glycol is undesirable.

[0036] Examples of aromatic group-containing diols include bisphenol A, 1,2-hydroxybenzene, 1,3-hydroxybenzene, 1,4-hydroxybenzene, 1,4-benzenedimethanol, ethylene oxide adducts of bisphenol A, propylene oxide adducts of bisphenol A, 1,4-bis(2-hydroxyethoxy)benzene, resorcinol, and polyhydroxyethyl adducts of mononuclear divalent phenol compounds such as pyrocatechol.

[0037] Among these diols, 1,4-cyclohexanedimethanol, 1,4-butanediol, and ethylene glycol are preferred in terms of antistatic properties, their persistence, and the mechanical strength of the molded article, with 1,4-butanediol and 1,4-cyclohexanedimethanol being more preferred.

[0038] Examples of dicarboxylic acid (a2) used in the polymer compound (E) according to the present invention include aliphatic dicarboxylic acids and aromatic dicarboxylic acids. Dicarboxylic acid (a2) may also be a mixture of two or more types.

[0039] The aliphatic dicarboxylic acid used in polymer compound (E) according to the present invention may be a derivative of the aliphatic dicarboxylic acid (for example, an acid anhydride, alkyl ester, alkali metal salt, acid halide, etc.). The aliphatic dicarboxylic acid and its derivatives may also be a mixture of two or more types.

[0040] Preferably, aliphatic dicarboxylic acids have 2 to 20 carbon atoms, and examples include oxalic acid, malonic acid, glutaric acid, methylsuccinic acid, dimethylmalonic acid, 3-methylglutaric acid, ethylsuccinic acid, isopropylmalonic acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanediic acid, dodecanediic acid (1,10-decanedicarboxylic acid), tridecanediic acid, tetradecanediic acid, hexadecanedioic acid, octadecanediic acid, eicosanedioic acid, 1,3-cyclopentanedicarboxylic acid, 1,2-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanediacetic acid, 1,3-cyclohexanediacetic acid, 1,2-cyclohexanediacetic acid, 1,1-cyclohexanediacetic acid, dimer acid, maleic acid, fumaric acid, etc. Among these aliphatic dicarboxylic acids, succinic acid or adipic acid is preferred in terms of antistatic properties, their persistence, and the mechanical strength of the molded product.

[0041] The aromatic dicarboxylic acid used in polymer compound (E) according to the present invention may be a derivative of the aromatic dicarboxylic acid (for example, an acid anhydride, an alkyl ester, an alkali metal salt, an acid halide, etc.). Furthermore, the aromatic dicarboxylic acid and its derivatives may be a mixture of two or more types.

[0042] Examples of aromatic dicarboxylic acids include aromatic dicarboxylic acids having 8 to 20 carbon atoms, such as terephthalic acid, isophthalic acid, phthalic acid, phenylmalonic acid, homophthalic acid, phenylsuccinic acid, β-phenylglutaric acid, α-phenyladipic acid, β-phenyladipic acid, biphenyl-2,2'-dicarboxylic acid, biphenyl-4,4'-dicarboxylic acid, naphthalenedicarboxylic acid, sodium 3-sulfoisophthalate, and potassium 3-sulfoisophthalate. Among these aromatic dicarboxylic acids, terephthalic acid, isophthalic acid, and phthalic acid (including phthalic anhydride) are preferred in terms of antistatic properties and their persistence, and the mechanical strength of the molded article, with phthalic acid (including phthalic anhydride) being more preferred.

[0043] In the polymer compound (E) according to the present invention, it is also preferable to use both aliphatic dicarboxylic acid and aromatic dicarboxylic acid in combination as the dicarboxylic acid (a2).

[0044] Dicarboxylic acid (a2) is preferably adipic acid, succinic acid, or phthalic acid (including phthalic anhydride) from the viewpoint of antistatic properties and their persistence, as well as the mechanical strength of the molded article, and combinations thereof are also preferred. .

[0045] Next, we will describe the polyether (B) block of the polymer compound (E), which has hydroxyl groups at both ends (b). The polyether (B) block is composed of compound (b), which has hydroxyl groups at both ends.

[0046] Compound (b) is preferably a compound having one or more ethyleneoxy groups represented by the following general formula (1) and hydroxyl groups at both ends, from the viewpoint of antistatic properties and their persistence, as well as the mechanical strength of the molded article.

[0047] [ka]

[0048] Compound (b) is preferably a hydrophilic compound, more preferably a polyether having an ethyleneoxy group represented by general formula (1), and even more preferably polyethylene glycol, with polyethylene glycol represented by the following general formula (2) being particularly preferred, from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article.

[0049] [ka]

[0050] In general formula (2), m represents a number from 5 to 250. From the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article, m is preferably 20 to 200, and more preferably 40 to 180.

[0051] Compound (b) includes polyethylene glycol obtained by the addition reaction of ethylene oxide, as well as polyethers obtained by the addition reaction of ethylene oxide with one or more other alkylene oxides (e.g., propylene oxide, 1,2-, 1,4-, 2,3-, or 1,3-butylene oxide), and this polyether may be random or blocked.

[0052] Furthermore, compound (b) may also contain polyethylene glycol and polytetramethylene glycol in combination, from the viewpoint of antistatic properties, their durability, and the mechanical strength of the molded article. When used in combination, the proportion of polytetramethylene glycol is preferably 10 to 80 mol% relative to the total number of moles of polyethylene glycol and polytetramethylene glycol, more preferably 15 to 70 mol%, and even more preferably 20 to 50 mol% from the viewpoint of antistatic properties, their durability, and the mechanical strength of the molded article.

[0053] Further examples of compound (b) include compounds in which ethylene oxide is added to an active hydrogen atom-containing compound, and compounds in which ethylene oxide and one or more other alkylene oxides (e.g., propylene oxide, 1,2-, 1,4-, 2,3-, or 1,3-butylene oxide) are added. These can be either random addition or block addition.

[0054] Examples of active hydrogen atom-containing compounds include glycols, divalent phenols, primary monoamines, secondary diamines, and dicarboxylic acids.

[0055] Examples of glycols that can be used include aliphatic glycols with 2 to 20 carbon atoms, alicyclic glycols with 5 to 12 carbon atoms, and aromatic glycols with 8 to 26 carbon atoms.

[0056] Examples of aliphatic glycols include ethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 1,3-hexanediol, 1,4-hexanediol, 1,6-hexanediol, 2,5-hexanediol, 1,2-octanediol, 1,8-octanediol, 1,10-decanediol, 1,18-octadecanediol, 1,20-eicosanediol, diethylene glycol, triethylene glycol, and thiodiethylene glycol.

[0057] Examples of alicyclic glycols include 1-hydroxymethyl-1-cyclobutanol, 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, 1-methyl-3,4-cyclohexanediol, 2-hydroxymethylcyclohexanol, 4-hydroxymethylcyclohexanol, 1,4-cyclohexanedimethanol, and 1,1'-dihydroxy-1,1'-dicyclohexyl.

[0058] Examples of aromatic glycols include dihydroxymethylbenzene, 1,4-bis(β-hydroxyethoxy)benzene, 2-phenyl-1,3-propanediol, 2-phenyl-1,4-butanediol, 2-benzyl-1,3-propanediol, triphenylethylene glycol, tetraphenylethylene glycol, and benzopinacol.

[0059] As divalent phenols, phenols having 6 to 30 carbon atoms can be used, such as catechol, resorcinol, 1,4-dihydroxybenzene, hydroquinone, bisphenol A, bisphenol F, bisphenol S, dihydroxydiphenyl ether, dihydroxydiphenyl thioether, binaphthol, and their alkyl (1 to 10 carbon atoms) or halogen-substituted derivatives.

[0060] Examples of primary monoamines include aliphatic primary monoamines having 1 to 20 carbon atoms, such as methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, s-butylamine, isobutylamine, n-amylamine, isoamylamine, n-hexylamine, n-heptylamine, n-octylamine, n-decylamine, n-octadecylamine, and n-icosylamine.

[0061] Examples of secondary diamines that can be used include aliphatic secondary diamines with 4 to 18 carbon atoms, heterocyclic secondary diamines with 4 to 13 carbon atoms, alicyclic secondary diamines with 6 to 14 carbon atoms, aromatic secondary diamines with 8 to 14 carbon atoms, and secondary alkanol diamines with 3 to 22 carbon atoms.

[0062] Examples of aliphatic secondary diamines include N,N'-dimethylethylenediamine, N,N'-diethylethylenediamine, N,N'-dibutylethylenediamine, N,N'-dimethylpropylenediamine, N,N'-diethylpropylenediamine, N,N'-dibutylpropylenediamine, N,N'-dimethyltetramethylenediamine, N,N'-diethyltetramethylenediamine, N,N'-dibutyltetramethylenediamine, N,N'-dimethylhexamethylenediamine, N,N'-diethylhexamethylenediamine, N,N'-dibutylhexamethylenediamine, N,N'-dimethyldecamethylenediamine, N,N'-diethyldecamethylenediamine, and N,N'-dibutyldecamethylenediamine.

[0063] Examples of heterocyclic secondary diamines include piperazine and 1-aminopiperidine.

[0064] Examples of alicyclic secondary diamines include N,N'-dimethyl-1,2-cyclobutanediamine, N,N'-diethyl-1,2-cyclobutanediamine, N,N'-dibutyl-1,2-cyclobutanediamine, N,N'-dimethyl-1,4-cyclohexanediamine, N,N'-diethyl-1,4-cyclohexanediamine, N,N'-dibutyl-1,4-cyclohexanediamine, N,N'-dimethyl-1,3-cyclohexanediamine, N,N'-diethyl-1,3-cyclohexanediamine, and N,N'-dibutyl-1,3-cyclohexanediamine.

[0065] Examples of aromatic secondary diamines include N,N'-dimethylphenylenediamine, N,N'-dimethylxylylenediamine, N,N'-dimethyldiphenylmethanediamine, N,N'-dimethyldiphenyletherdiamine, N,N'-dimethylbenzidine, and N,N'-dimethyl-1,4-naphthalenediamine.

[0066] Examples of secondary alkanoldiamines include N-methyldiethanolamine, N-octyldiethanolamine, N-stearyldiethanolamine, and N-methyldipropanolamine.

[0067] Dicarboxylic acids can be those having 2 to 20 carbon atoms, such as aliphatic dicarboxylic acids, aromatic dicarboxylic acids, and alicyclic dicarboxylic acids.

[0068] Examples of aliphatic dicarboxylic acids include oxalic acid, malonic acid, succinic acid, glutaric acid, methylsuccinic acid, dimethylmalonic acid, β-methylglutaric acid, ethylsuccinic acid, isopropylmalonic acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanediic acid, dodecanediic acid, tridecanediic acid, tetradecanediic acid, hexadecanedic acid, octadecanediic acid, and eicosanedic acid.

[0069] Examples of aromatic dicarboxylic acids include terephthalic acid, isophthalic acid, phthalic acid, phenylmalonic acid, homophthalic acid, phenylsuccinic acid, β-phenylglutaric acid, α-phenyladipic acid, β-phenyladipic acid, biphenyl-2,2'-dicarboxylic acid, biphenyl-4,4'-dicarboxylic acid, naphthalenedicarboxylic acid, sodium 3-sulfoisophthalate, and potassium 3-sulfoisophthalate.

[0070] Examples of alicyclic dicarboxylic acids include 1,3-cyclopentanedicarboxylic acid, 1,2-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanediacetic acid, 1,3-cyclohexanediacetic acid, 1,2-cyclohexanediacetic acid, and dicyclohexyl-4,4'-dicarboxylic acid.

[0071] These active hydrogen atom-containing compounds can be used individually or as a mixture of two or more.

[0072] Next, we will describe epoxy compounds (D) that have two or more epoxy groups constituting a polymer compound (E). The epoxy compound (D) used in the present invention is not particularly limited as long as it has two or more epoxy groups, and includes, for example, polyglycidyl ether compounds of mononuclear polyhydric phenol compounds such as hydroquinone, resorcinol, pyrocatechol, and phloroglucinol; dihydroxynaphthalene, biphenol, methylenebisphenol (bisphenol F), methylenebis(orthocresol), ethylidenebisphenol, isopropylidenebisphenol (bisphenol A), isopropylidenebis(orthocresol), tetrabromobisphenol A, 1,3-bis(4-hydroxycumylbenzene), 1,4-bis(4-hydroxycumylbenzene), 1,1,3-tris(4-hydroxyphenyl)butane, 1,1,2,2-tetra(4-hydroxyphenyl)ethane, thiobisphenol, sulfobisphenol, oxybisphenol, phenol novolac, orthocresol novolac, ethylphenol novolac, butylphenol novolac, octylphenol novolac, resol Polyglycidyl ether compounds of polynuclear polyhydric phenol compounds such as synnovolac and terpenephenol; polyglycidyl ethers of polyhydric alcohols such as ethylene glycol, propylene glycol, butylene glycol, hexanediol, diethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, polyglycol, thiodiglycol, glycerin, trimethylolpropane, pentaerythritol, sorbitol, bisphenol A-ethylene oxide adduct, and dicyclopentadiene dimethanol; homopolymers or copolymers of glycidyl esters and glycidyl methacrylates of aliphatic, aromatic, or alicyclic polybasic acids such as maleic acid, fumaric acid, itaconic acid, succinic acid, glutaric acid, suberic acid, adipic acid, azelaic acid, sebacic acid, dimer acid, trimer acid, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, trimesic acid, pyromellitic acid, tetrahydrophthalic acid, hexahydrophthalic acid, and endomethylenetetrahydrophthalic acid;Examples include epoxy compounds having a glycidylamino group such as N,N-diglycidylaniline, bis(4-(N-methyl-N-glycidylamino)phenyl)methane, and diglycidyl orthotoluidine; epoxides of cyclic olefin compounds such as vinylcyclohexene diepoxide, dicyclopentadiene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-6-methylcyclohexanecarboxylate, and bis(3,4-epoxy-6-methylcyclohexylmethyl)adipate; epoxidized conjugated diene polymers such as epoxidized polybutadiene and epoxidized styrene-butadiene copolymers; heterocyclic compounds such as triglycidyl isocyanurate; and epoxidized soybean oil. Furthermore, these epoxy compounds may be internally crosslinked by terminal isocyanate prepolymers, or their molecular weight may be increased using polyvalent active hydrogen compounds (polyvalent phenols, polyamines, carbonyl group-containing compounds, polyphosphate esters, etc.). Two or more epoxy compounds (D) may be used.

[0073] From the viewpoint of antistatic properties and their persistence, as well as the mechanical strength of the molded article, the epoxy compound (D) is preferably bisphenol F diglycidyl ether, dicyclopentadiene dimethanol diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, hexanediol diglycidyl ether, or polypropylene glycol diglycidyl ether, with bisphenol F diglycidyl ether and polypropylene glycol diglycidyl ether being more preferred.

[0074] Polypropylene glycol diglycidyl ether is preferred from the viewpoint of antistatic properties and their persistence, as well as the mechanical strength of the molded article, and is represented by the following general formula (4).

[0075] [ka]

[0076] In general formula (4), n represents a number from 1 to 30. From the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article, n is preferably 2 to 25, and more preferably 3 to 15.

[0077] The number-average molecular weight of polypropylene glycol diglycidyl ether is preferably 200 to 2000, more preferably 250 to 1500, and even more preferably 300 to 1000, from the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article.

[0078] Polypropylene glycol diglycidyl ether may be a commercially available product, such as ADEKA ED-506 (registered trademark) manufactured by ADEKA Corporation, and Denacol EX-920 and Denacol EX-931 (registered trademark) manufactured by Nagase ChemteX Corporation.

[0079] The epoxy equivalent of epoxy compound (D) is preferably 70 to 2,000, more preferably 100 to 1,000, and even more preferably 150 to 600, from the viewpoint of antistatic properties, their durability, and the mechanical strength of the molded article.

[0080] The polymer compound (E) according to the present invention is obtained by reacting a polyester (a) obtained by the reaction of a diol (a1) and a dicarboxylic acid (a2), a compound (b) having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups, and comprises a polyester block (A) composed of polyester (a) and a polyether block (B) composed of compound (b), and has a structure in which the hydroxyl or carboxyl groups at the ends of polyester (a), the hydroxyl groups at the ends of compound (b), and the epoxy groups of the epoxy compound having two or more epoxy groups, or hydroxyl groups formed by the reaction of these epoxy groups, are linked via ester bonds or ether bonds, which is preferable from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article.

[0081] Furthermore, from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article, the polymer compound (E) is preferably a structure in which a block polymer (C) having carboxyl groups at both ends is formed by repeatedly and alternately bonding polyester blocks (A) composed of polyester (a) and polyether blocks (B) composed of compound (b) via ester bonds, and an epoxy compound (D) is bonded via ester bonds formed by the carboxyl groups of the block polymer (C) and the epoxy groups of the epoxy compound (D). It is also preferable that the polymer compound (E) has a structure in which it is bonded via ester bonds formed by the reaction of carboxyl groups with hydroxyl groups formed by ring-opening of epoxy groups in reaction with carboxyl groups.

[0082] The polyester (a) constituting the polyester (A) block according to the present invention may consist of a diol (a1) and a dicarboxylic acid (a2), and preferably has a structure in which a residue of the diol (a1) with the hydroxyl group removed and a residue of the dicarboxylic acid (a2) with the carboxyl group removed are linked via an ester bond.

[0083] Furthermore, polyester (a) is preferably of a structure having carboxyl groups at both ends, from the viewpoint of antistatic properties and their persistence, as well as the mechanical strength of the molded article. Moreover, the degree of polymerization of polyester (a) is preferably in the range of 2 to 50 from the viewpoint of the mechanical strength of the molded article.

[0084] A polyester (a) having carboxyl groups at both ends can be obtained by esterifying a diol (a1) with a dicarboxylic acid (a2).

[0085] The dicarboxylic acid (a2) may also be a derivative thereof (for example, an acid anhydride, an ester such as an alkyl ester, an alkali metal salt, an acid halide, etc.). If polyester (a) is obtained using a derivative, both ends may be treated to form carboxyl groups, and the reaction may proceed in that state to obtain the next block polymer (C) having a structure with carboxyl groups at both ends.

[0086] The reaction ratio of dicarboxylic acid (a2) to diol (a1) is preferably such that dicarboxylic acid (a2) is used in excess so that both ends become carboxyl groups, and preferably in a molar ratio of 1 molar excess to diol (a1). A catalyst to promote the esterification reaction may be used for the esterification reaction, and conventionally known catalysts such as dibutyltin oxide, tetraalkyl titanate, zirconium acetate, and zinc acetate can be used.

[0087] Furthermore, if derivatives such as esters, alkali metal salts, or acid halides are used instead of dicarboxylic acids, the reaction between these derivatives and the diol may be followed by treatment of both ends to obtain a dicarboxylic acid, and the reaction may proceed in that state to obtain the next block polymer (C) having a structure with carboxyl groups at both ends.

[0088] A preferred polyester (a) consisting of a diol (a1) and a dicarboxylic acid (a2), having carboxyl groups at both ends, is preferably one that reacts with compound (b) to form an ester bond and create the structure of a block polymer (C). The carboxyl groups at both ends may be protected, modified, or in precursor form. Furthermore, an antioxidant such as a phenolic antioxidant may be added to the reaction system to suppress oxidation of the product during the reaction.

[0089] Compound (b), having hydroxyl groups at both ends, preferably reacts with polyester (a) to form an ester bond or ether bond, preferably an ester bond, to form the structure of block polymer (C), wherein the hydroxyl groups at both ends may be protected, modified, or in precursor form.

[0090] The block polymer (C) having a structure in which a polymer compound (E) according to the present invention has carboxyl groups at both ends comprises a block (A) composed of the polyester (a) and a block (B) composed of the compound (b), and these blocks are repeatedly and alternately bonded together via ester bonds formed by carboxyl groups and hydroxyl groups. An example of such a block polymer (C) is one having a structure represented by the following general formula (3).

[0091] [ka]

[0092] In general formula (3), (A) represents a block composed of polyester (a) having carboxyl groups at both ends, (B) represents a block composed of compound (b) having hydroxyl groups at both ends, and t is the number of repetitions in the repeating unit, preferably a number from 1 to 10 from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article. More preferably t is a number from 1 to 7, and most preferably a number from 1 to 5.

[0093] A block polymer (C) having a structure with carboxyl groups at both ends can be obtained by polycondensation reaction of a polyester (a) having carboxyl groups at both ends and a compound (b) having hydroxyl groups at both ends. However, it is not necessarily required to synthesize the polymer from the polyester (a) and compound (b) if the polyester (a) and compound (b) have a structure equivalent to one in which they are repeatedly and alternately bonded via ester bonds formed by carboxyl groups and hydroxyl groups.

[0094] By adjusting the reaction ratio of the polyester (a) and the compound (b) to such that X moles of compound (b) equals X+1 moles of polyester (a), a block polymer (C) having carboxyl groups at both ends can be preferably obtained.

[0095] During the reaction, after the synthesis reaction of polyester (a) is completed, the compound (b) may be added to the reaction system without isolating polyester (a) and the reaction may proceed as is.

[0096] A catalyst that promotes the esterification reaction may be used in the polycondensation reaction. Conventionally known catalysts such as dibutyltin oxide, tetraalkyl titanate, zirconium acetate, and zinc acetate can be used. In addition, antioxidants such as phenolic antioxidants may be added to the reaction system to suppress oxidation of the product during the reaction.

[0097] The polymer compound (E) according to the present invention preferably has a structure in which a block polymer (C) having a structure with carboxyl groups at both ends and an epoxy compound (D) having two or more epoxy groups are linked via an ester bond, from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article. The ester bond may be an ester bond formed by the reaction between the terminal carboxyl groups of the block polymer (C) and the epoxy groups of the epoxy compound (D), or an ester bond formed by the reaction between the hydroxyl groups formed by this reaction (reaction between carboxyl groups and epoxy groups) and the carboxyl groups. The presence of both ester bonds is preferable from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article.

[0098] Furthermore, such polymer compound (E) may also contain ester bonds formed by the carboxyl group of the polyester (a) and the epoxy group of the epoxy compound (D).

[0099] Furthermore, such polymer compound (E) may contain ester bonds formed by the reaction of a carboxyl group of polyester (a) with a hydroxyl group formed by the reaction of an epoxy group of the epoxy compound.

[0100] Furthermore, such polymer compound (E) may also contain ether bonds formed by a hydroxyl group of the polyester (a) or a hydroxyl group of compound (b) and an epoxy group of the epoxy compound (D).

[0101] To obtain a preferred polymer compound (E), the block polymer (C) and the epoxy compound (D) can be reacted. That is, the carboxyl groups of the block polymer (C) can be reacted with the epoxy groups of the epoxy compound (D). More preferably, the hydroxyl groups formed from the reacted epoxy groups can be reacted with the carboxyl groups. The number of epoxy groups in the epoxy compound (D) is preferably 0.5 to 5 equivalents, and more preferably 0.5 to 1.5 equivalents, of the number of carboxyl groups in the block polymer (C) to be reacted. Furthermore, the above reaction may be carried out in various solvents or in a molten state.

[0102] The epoxy compound (D) having two or more epoxy groups to be reacted is preferably in an amount of 0.1 to 2.0 equivalents, and more preferably in an amount of 0.2 to 1.5 equivalents, of the number of carboxyl groups in the block polymer (C) to be reacted.

[0103] During the reaction, after the synthesis reaction of the block polymer (C) is completed, the epoxy compound (D) may be added to the reaction system without isolating the block polymer (C) and the reaction may proceed as is. In this case, the carboxyl groups of the unreacted polyester (a) used in excess when synthesizing the block polymer (C) may react with some of the epoxy groups of the epoxy compound (D) to form ester bonds.

[0104] The preferred polymer compound (E) according to the present invention does not necessarily have to be synthesized from the block polymer (C) and the epoxy compound (D), as long as it has a structure equivalent to that of a block polymer (C) having a structure with carboxyl groups at both ends and an epoxy compound (D) having two or more epoxy groups, linked via ester bonds formed by the respective carboxyl groups and epoxy groups. The ester bonds formed by carboxyl groups and epoxy groups referred to here also include ester bonds formed by a carboxyl group and a hydroxyl group formed from the epoxy group by reaction with the carboxyl group.

[0105] Furthermore, the polymer compound (E) according to the present invention may be reacted with compound (b) and / or epoxy compound (D) without isolating polyester (a) after obtaining polyester (a) from diol (a1) and dicarboxylic acid (a2).

[0106] In the present invention, the number-average molecular weight of compound (b) constituting block (B) in polymer compound (E), which is composed of compound (b) having hydroxyl groups at both ends, is calculated from the measured hydroxyl value and is preferably 400 to 10,000, more preferably 1,000 to 8,000, and even more preferably 2,000 to 8,000, from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article. The method for measuring the hydroxyl value and the method for calculating the number-average molecular weight from the hydroxyl value are described below.

[0107] <Method for calculating the number-average molecular weight from the hydroxyl value> The hydroxyl value was measured using the hydroxyl value measurement method described below, and the number-average molecular weight (hereinafter also referred to as "Mn") was determined using the following formula. Number-average molecular weight = (56110 × 2) / hydroxyl value

[0108] <Hydroxyl Value Measurement Method> • Reagent A (acetylating agent) (1) Triethyl phosphate 1560 mL (2) Acetic anhydride 193 mL (3) Perchloric acid (60%) 16g Mix the above reagents in the order of (1) → (2) → (3). Reagent B Mix pyridine and pure water in a volume ratio of 3:1. Reagent C Add 2-3 drops of phenolphthalein solution to 500 mL of isopropyl alcohol, and neutralize with 1N-KOH aqueous solution. First, weigh 2 g of the sample into a 200 mL Erlenmeyer flask, add 10 mL of triethyl phosphate, and heat to dissolve. Add 15 mL of reagent A, stopper the flask, and shake vigorously. Add 20 mL of reagent B, stopper the flask, and shake vigorously. Add 50 mL of reagent C. Titrate with 1 N KOH aqueous solution and calculate using the following formula. Hydroxyl value [mgKOH / g] = 56.11 × f × (TB) / S f: Factor of 1N-KOH aqueous solution B: Blank titration volume [mL] T: Titration volume for this test [mL] S: Sample volume [g]

[0109] Furthermore, in the present invention, the number-average molecular weight of polyester (a) constituting the block (A) composed of polyester (a) in the polymer compound (E) is preferably 1,000 to 10,000, more preferably 1,500 to 8,000, and even more preferably 2,500 to 7,500, in terms of polystyrene equivalent, from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article. If the number-average molecular weight is less than 1,000, the storage stability may be poor, and if it exceeds 10,000, the reaction to obtain the polymer compound (E) may take a long time, which may be economically unviable, or the obtained polymer compound may become discolored due to the long reaction time.

[0110] For measuring the number-average molecular weight in terms of polystyrene, gel permeation chromatography (GPC) is preferred, and the measurement method is shown below.

[0111] <Method for measuring the number-average molecular weight based on polystyrene equivalent> The number-average molecular weight (hereinafter also referred to as "Mn") was measured by gel permeation chromatography (GPC). The measurement conditions for Mn were as follows: Equipment: GPC instrument manufactured by JASCO Corporation Solvent: Chloroform Reference material: Polystyrene Detector: Differential refractometer (RI detector) Column stationary phase: Shodex LF-804 manufactured by Showa Denko Corporation Column temperature: 40℃ Sample concentration: 1 mg / 1 mL Flow rate: 0.8mL / min. Injection volume: 100μL

[0112] Furthermore, the number-average molecular weight of the block polymer (C) having a structure with carboxyl groups at both ends in the polymer compound (E) is preferably 5,000 to 50,000, more preferably 10,000 to 45,000, and even more preferably 15,000 to 40,000, in terms of polystyrene equivalent, from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article. If the number-average molecular weight is less than 5,000, the storage stability may be poor, and if it exceeds 50,000, the reaction to obtain the polymer compound (E) may take a long time, making it economically uneconomical, or the obtained polymer compound (E) may become discolored due to the long reaction time. The method for measuring the number-average molecular weight in terms of polystyrene equivalent is preferably the gel permeation chromatography (GPC) method, and the measurement method is as described above.

[0113] Component (E) of the present invention may consist of one or more types.

[0114] In the antistatic resin composition, the content of component (Y) is 1 to 60 parts by mass per 100 parts by mass of synthetic resin, preferably 5 to 50 parts by mass, and more preferably 10 to 40 parts by mass, from the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article. If the content is less than 1 part by mass, sufficient antistatic properties may not be obtained, and if it exceeds 60 parts by mass, the physical properties of the molded article may be adversely affected.

[0115] The antistatic resin composition of the present invention preferably further contains one or more selected from the group consisting of alkali metal salts (F) and ionic liquids (G), from the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article.

[0116] The following explains alkali metal salts (F). Alkali metal salts (F) include salts of organic or inorganic acids. Examples of alkali metals include lithium, sodium, potassium, cesium, and rubidium. Examples of organic acids include aliphatic monocarboxylic acids with 1 to 18 carbon atoms, such as formic acid, acetic acid, propionic acid, butyric acid, and lactic acid; aliphatic dicarboxylic acids with 1 to 12 carbon atoms, such as oxalic acid, malonic acid, succinic acid, fumaric acid, maleic acid, and adipic acid; aromatic carboxylic acids such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, and salicylic acid; and sulfonic acids with 1 to 20 carbon atoms, such as methanesulfonic acid, p-toluenesulfonic acid, dodecylbenzenesulfonic acid, and trifluoromethanesulfonic acid. Examples of inorganic acids include hydrochloric acid, hydrobromic acid, sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, polyphosphate, nitric acid, and perchloric acid. In particular, salts of lithium, sodium, and potassium are preferred, with sodium being more preferred, from the viewpoint of antistatic properties, their durability, and safety to living organisms and the environment. Furthermore, from the viewpoint of antistatic properties and their durability, salts of acetate, perchloric acid, p-toluenesulfonic acid, and dodecylbenzenesulfonic acid are preferred, with dodecylbenzenesulfonic acid being more preferred. Two or more alkali metal salts may be used.

[0117] Specific examples of alkali metal salts (F) include lithium acetate, sodium acetate, potassium acetate, lithium chloride, sodium chloride, potassium chloride, lithium phosphate, sodium phosphate, potassium phosphate, lithium sulfate, sodium sulfate, lithium perchlorate, sodium perchlorate, potassium perchlorate, lithium p-toluenesulfonate, sodium p-toluenesulfonate, potassium p-toluenesulfonate, lithium dodecylbenzenesulfonate, sodium dodecylbenzenesulfonate, potassium dodecylbenzenesulfonate, etc. Among these, lithium p-toluenesulfonate, sodium p-toluenesulfonate, lithium dodecylbenzenesulfonate, sodium dodecylbenzenesulfonate, etc. are preferred in terms of antistatic properties, their persistence, and safety to living organisms and the environment, with sodium dodecylbenzenesulfonate being the most preferred.

[0118] In the antistatic resin composition of the present invention, the content of alkali metal salt (F) is preferably 0.01 to 15.0 parts by mass, more preferably 0.1 to 12.0 parts by mass, even more preferably 0.5 to 10.0 parts by mass, and even more preferably 1.0 to 8.0 parts by mass, per 100 parts by mass of synthetic resin, from the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article. If the amount of alkali metal salt (F) is less than 0.01 parts by mass, the effect of adding alkali metal salt (F) may not be sufficient, and if it exceeds 15.0 parts by mass, it may adversely affect the physical properties of the resin.

[0119] Next, we will explain ionic liquids (G). Examples of ionic liquids (G) include room-temperature molten salts having a melting point of 100°C or less, in which at least one of the cations or anions constituting the ionic liquid is an organic ion, and an initial conductivity of 1 to 200 ms / cm, preferably 10 to 200 ms / cm, such as the room-temperature molten salt described in International Publication No. 95 / 15572.

[0120] Examples of cations constituting the ionic liquid (G) include cations selected from the group consisting of amidinium, pyridinium, pyrazolium, and guanidinium cations.

[0121] Among these, the following are examples of amidinium cations. (1) Imidazolinium cation Examples include those with 5 to 15 carbon atoms, such as 1,2,3,4-tetramethylimida Zolinium, 1,3-dimethylimidazolinium; (2) Imidazolium cation Examples include those with 5 to 15 carbon atoms, such as 1,3-dimethylimidazolium and 1-ethyl-3-methylimidazolium. (3) Tetrahydropyrimidinium cation Examples include those with 6 to 15 carbon atoms, such as 1,3-dimethyl-1,4,5,6-tetrahydropyrimidinium and 1,2,3,4-tetramethyl-1,4,5,6-tetrahydropyrimidinium; (4) Dihydropyrimidinium cation Examples include those with 6 to 20 carbon atoms, such as 1,3-dimethyl-1,4-dihydropyrimidinium, 1,3-dimethyl-1,6-dihydropyrimidinium, 8-methyl-1,8-diazabicyclo[5,4,0]-7,9-undecadienium, and 8-methyl-1,8-diazabicyclo[5,4,0]-7,10-undecadienium.

[0122] Examples of pyridinium cations include those with 6 to 20 carbon atoms, such as 3-methyl-1-propylpyridinium and 1-butyl-3,4-dimethylpyridinium.

[0123] Examples of pyrazolium cations include those with 5 to 15 carbon atoms, such as 1,2-dimethylpyrazolium and 1-n-butyl-2-methylpyrazolium.

[0124] Examples of guanidinium cations include the following: (1) Guanidinium cation having an imidazolinium skeleton Examples include those with 8 to 15 carbon atoms, such as 2-dimethylamino-1,3,4-trimethylimidazolinium and 2-diethylamino-1,3,4-trimethylimidazolinium; (2) Guanidinium cation having an imidazolium skeleton Examples include those with 8 to 15 carbon atoms, such as 2-dimethylamino-1,3,4-trimethylimidazolium and 2-diethylamino-1,3,4-trimethylimidazolium; (3) Guanidinium cation having a tetrahydropyrimidinium skeleton Examples include those with 10 to 20 carbon atoms, such as 2-dimethylamino-1,3,4-trimethyl-1,4,5,6-tetrahydropyrimidinium and 2-diethylamino-1,3-dimethyl-4-ethyl-1,4,5,6-tetrahydropyrimidinium; (4) Guanidinium cation having a dihydropyrimidinium skeleton Examples include those with 10 to 20 carbon atoms, such as 2-dimethylamino-1,3,4-trimethyl-1,4-dihydropyrimidinium, 2-dimethylamino-1,3,4-trimethyl-1,6-dihydropyrimidinium, 2-diethylamino-1,3-dimethyl-4-ethyl-1,4-dihydropyrimidinium, and 2-diethylamino-1,3-dimethyl-4-ethyl-1,6-dihydropyrimidinium.

[0125] The cation may be used alone or in combination of two or more types. Of these, amidinium cation is preferred from the viewpoint of antistatic properties and their persistence, more preferably imidazolium cation, and particularly preferably 1-ethyl-3-methylimidazolium cation and 1-ethyl-3-methylimidazolium dodecylbenzene sulfonate.

[0126] In the ionic liquid (G), the following are examples of organic or inorganic acids that constitute the anion. Examples of organic acids include carboxylic acids, sulfuric acid esters, sulfonic acids, and phosphate esters; examples of inorganic acids include superacids (e.g., borofluoric acid, tetraboric acid, perchloric acid, hexafluorinated phosphoric acid, hexafluorinated antimonylic acid, and hexafluorinated arsenic acid), phosphoric acid, and boric acid. The above organic and inorganic acids may be used individually or in combination of two or more.

[0127] Among organic and inorganic acids, those preferred for the ionic liquid (G) in terms of antistatic properties and their persistence are the conjugate bases of superacids, acids that form anions other than the conjugate bases of superacids, and mixtures thereof, whose Hamett acidity function (-H0) of the anions constituting the ionic liquid (G) is 12 to 100.

[0128] Examples of anions other than conjugate bases of superacids include halogen (e.g., fluorine, chlorine, and bromine) ions, alkyl (1 to 12 carbon atoms) benzenesulfonic acid (e.g., p-toluenesulfonic acid and dodecylbenzenesulfonic acid) ions, and poly(n=1 to 25) fluoroalkanesulfonic acid (e.g., undecafluoropentanesulfonic acid) ions.

[0129] Furthermore, superacids include protonic acids, those derived from combinations of protonic acids and Lewis acids, and mixtures thereof. Examples of protonic acids as superacids include bis(trifluoromethylsulfonyl)imide acid, bis(pentafluoroethylsulfonyl)imide acid, tris(trifluoromethylsulfonyl)methane, perchloric acid, fluorosulfonic acid, alkane (1 to 30 carbon atoms) sulfonic acid (e.g., methanesulfonic acid, dodecanesulfonic acid, etc.), poly(n=1 to 30)fluoroalkane (1 to 30 carbon atoms) sulfonic acid (e.g., trifluoromethanesulfonic acid, pentafluoroethanesulfonic acid, heptafluoropropanesulfonic acid, nonafluorobutanesulfonic acid, undecafluoropentanesulfonic acid, and tridecafluorohexanesulfonic acid), borofluoric acid, and tetrafluoroboric acid. Of these, borofluoric acid, trifluoromethanesulfonic acid, bis(trifluoromethanesulfonyl)imide acid, and bis(pentafluoroethylsulfonyl)imide acid are preferred from the viewpoint of ease of synthesis.

[0130] Examples of protic acids used in combination with Lewis acids include hydrogen halides (e.g., hydrogen fluoride, hydrogen chloride, hydrogen bromide, and hydrogen iodide), perchloric acid, fluorosulfonic acid, methanesulfonic acid, trifluoromethanesulfonic acid, pentafluoroethanesulfonic acid, nonafluorobutanesulfonic acid, undecafluoropentanesulfonic acid, tridecafluorohexanesulfonic acid, and mixtures thereof. Of these, hydrogen fluoride is preferred from the viewpoint of the initial conductivity of the ionic liquid (G).

[0131] Examples of Lewis acids include boron trifluoride, phosphorus pentafluoride, antimony pentafluoride, arsenic pentafluoride, tantalum pentafluoride, and mixtures thereof. Of these, boron trifluoride and phosphorus pentafluoride are preferred from the viewpoint of the initial conductivity of the ionic liquid.

[0132] The combination of protonic acid and Lewis acid is arbitrary, but examples of superacids consisting of these combinations include tetrafluoroboric acid, hexafluorophosphate, tantalumic acid hexafluoride, antimonymic acid hexafluoride, tantalumsulfonic acid hexafluoride, boric acid tetrafluoride, phosphoric acid hexafluoride, triborate chloride, arsenic acid hexafluoride, and mixtures thereof.

[0133] Of these anions, the most preferred in terms of the antistatic properties and persistence of the ionic liquid are the conjugate bases of superacids (superacids consisting of protonic acids and superacids consisting of a combination of a protonic acid and a Lewis acid), and even more preferred are superacids consisting of protonic acids and conjugate bases of superacids consisting of a protonic acid and boron trifluoride and / or phosphorus pentafluoride.

[0134] Among the ionic liquids (G), those preferred in terms of antistatic properties and their persistence are ionic liquids having an amidinium cation, more preferred are ionic liquids having a 1-ethyl-3-methylimidazolium cation, and particularly preferred are 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide.

[0135] In the antistatic resin composition of the present invention, the content of the ionic liquid (G) is preferably 0.01 to 15.0 parts by mass, more preferably 0.1 to 12.0 parts by mass, even more preferably 0.5 to 10.0 parts by mass, and even more preferably 1.0 to 8.0 parts by mass, per 100 parts by mass of synthetic resin, from the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article. If the amount of ionic liquid (G) is less than 0.01 parts by mass, the effect of adding the ionic liquid (G) may not be sufficient, and if it exceeds 15.0 parts by mass, it may adversely affect the physical properties of the resin.

[0136] In the antistatic resin composition of the present invention, an alkali metal salt (F) and an ionic liquid (G) may be used in combination.

[0137] When compounding an alkali metal salt (F) and an ionic liquid (G) with a synthetic resin, they may be compounded directly, or one or more selected from the group consisting of alkali metal salts (F) and ionic liquids (G) may be added to the reaction system during the synthesis reaction of a polymer compound (E).

[0138] The antistatic resin composition of the present invention may also preferably contain a compatibilizer, from the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article. Examples of compatibilizers include one or more acid anhydride-modified polyolefins. Acid anhydride-modified polyolefins are polymers obtained by grafting an acid anhydride such as maleic anhydride onto a polyolefin.

[0139] The polyolefin portion of acid anhydride-modified polyolefins includes polymerized or copolymerized ethylene, propylene, α-olefin, or diene. Examples of α-olefins include 1-butene, 4-methyl-1-pentene, 1-pentene, 1-octene, 1-decene, and 1-dodecene, while examples of dienes include butadiene, isoprene, cyclopentadiene, and 1,11-dodecadiene. Other copolymer components may also be included. More specifically, examples include polyethylene, polypropylene, ethylene / propylene copolymer, ethylene / propylene / diene ternary copolymer, ethylene / 1-butene copolymer, ethylene / vinyl acetate copolymer, and mixtures thereof. Of these, from the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded article, polymers or copolymers of ethylene, propylene, α-olefins having 4 to 12 carbon atoms, butadiene, and isoprene are preferred, polymers or copolymers of ethylene, propylene, α-olefins having 4 to 8 carbon atoms, and butadiene are more preferred, and polymers or copolymers of ethylene, propylene, and butadiene are even more preferred.

[0140] Examples of acid anhydrides include maleic anhydride and itaconic anhydride, but maleic anhydride is preferred in terms of antistatic properties, their persistence, and the mechanical strength of the molded product.

[0141] Of the acid anhydride-modified polyolefins, maleic anhydride-modified polyolefins are preferred in terms of antistatic properties and their persistence, as well as the mechanical strength of the molded article, and maleic anhydride-modified polypropylene is more preferred. Acid anhydride-modified polyolefins can be obtained by conventionally known methods of grafting an acid anhydride such as maleic anhydride onto a polyolefin, and various commercially available products may be used.

[0142] In the antistatic resin composition of the present invention, the content of the compatibilizer is preferably 0.01 to 30.0 parts by mass, more preferably 0.1 to 20.0 parts by mass, and even more preferably 0.5 to 15.0 parts by mass, per 100 parts by mass of synthetic resin, from the viewpoint of antistatic properties, their persistence, and the mechanical strength of the molded article. If the content is less than 0.01 parts by mass, the effect of the addition may not be sufficient, and if it exceeds 30.0 parts by mass, it may adversely affect the physical properties of the resin.

[0143] The antistatic resin composition of the present invention may further contain salts of Group 2 elements, to the extent that it does not impair the effects of the present invention.

[0144] Salts of Group 2 elements include salts of organic or inorganic acids. Examples of Group 2 elements include beryllium, magnesium, calcium, strontium, and barium. Examples of organic acids include aliphatic monocarboxylic acids with 1 to 18 carbon atoms, such as formic acid, acetic acid, propionic acid, butyric acid, and lactic acid; aliphatic dicarboxylic acids with 1 to 12 carbon atoms, such as oxalic acid, malonic acid, succinic acid, fumaric acid, maleic acid, and adipic acid; aromatic carboxylic acids with 1 to 20 carbon atoms, such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, and salicylic acid; and sulfonic acids with 1 to 20 carbon atoms, such as methanesulfonic acid, p-toluenesulfonic acid, dodecylbenzenesulfonic acid, and trifluoromethanesulfonic acid. Examples of inorganic acids include hydrochloric acid, hydrobromic acid, sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, polyphosphate, nitric acid, and perchloric acid.

[0145] Furthermore, the antistatic resin composition of the present invention may contain a surfactant, to the extent that it does not impair the effects of the present invention. As the surfactant, nonionic, anionic, cationic, or amphoteric surfactants can be used.

[0146] Examples of nonionic surfactants include polyethylene glycol-type nonionic surfactants such as higher alcohol ethylene oxide adducts, fatty acid ethylene oxide adducts, higher alkylamine ethylene oxide adducts, and polypropylene glycol ethylene oxide adducts; and polyhydric alcohol-type nonionic surfactants such as fatty acid esters of polyethylene oxide and glycerin, fatty acid esters of pentaerythritol, fatty acid esters of sorbitol or sorbitan, alkyl ethers of polyhydric alcohols, and aliphatic amides of alkanolamines.

[0147] Examples of anionic surfactants include carboxylates such as alkali metal salts of higher fatty acids; sulfates such as higher alcohol sulfates and higher alkyl ether sulfates; sulfonates such as alkylbenzene sulfons, alkyl sulfons, and paraffin sulfons; and phosphates such as higher alcohol phosphates.

[0148] Examples of cationic surfactants include quaternary ammonium salts such as alkyltrimethylammonium salts.

[0149] Examples of amphoteric surfactants include amino acid-type amphoteric surfactants such as higher alkylaminopropionates, and betaine-type amphoteric surfactants such as higher alkyldimethyl betaine and higher alkyldihydroxyethyl betaine. These can be used individually or in combination of two or more.

[0150] When a surfactant is added, the amount added is preferably 0.1 to 5 parts by mass, and more preferably 0.3 to 4 parts by mass, per 100 parts by mass of synthetic resin.

[0151] Furthermore, the antistatic resin composition of the present invention may contain a polymeric antistatic agent, to the extent that it does not impair the effects of the present invention. As the polymeric antistatic agent, for example, known polymeric antistatic agents such as polyether ester amides can be used, and known polyether ester amides include, for example, the polyether ester amide consisting of a polyoxyalkylene adduct of bisphenol A described in Japanese Patent Publication No. 7-10989. In addition, a block polymer having a repeating structure with 2 to 50 bonding units between a polyolefin block and a hydrophilic polymer block can be used, for example, the block polymer described in U.S. Patent No. 6,552,131.

[0152] When a polymeric antistatic agent is incorporated, the amount is preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, per 100 parts by mass of synthetic resin.

[0153] Furthermore, the antistatic resin composition of the present invention may be further enriched with various additives, such as phenolic antioxidants, phosphorus-based antioxidants, thioether-based antioxidants, amine-based antioxidants, ultraviolet absorbers, and hindered amine-based light stabilizers, to the extent that they do not impair the effects of the present invention. This will stabilize the resin composition of the present invention.

[0154] Examples of phenolic antioxidants include 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-4-ethylphenol, 2-tert-butyl-4,6-dimethylphenol, styrenephenol, 2,2'-methylenebis(4-ethyl-6-tert-butylphenol), 2,2'-thiobis-(6-tert-butyl-4-methylphenol), 2,2'-thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], and 2-methyl-4,6-bis(octyl) (Fruphanylmethyl)phenol, 2,2'-isobutylidenebis(4,6-dimethylphenol), isooctyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, N,N'-Hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, 2,2'-oxamide-bis[ethyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2-ethylhexyl-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl) Ropionate, 2,2'-ethylenebis(4,6-di-tert-butylphenol), 3,5-di-tert-butyl-4-hydroxybenzenepropanoic acid and C13-15 alkyl ester, 2,5-di-tert-amylhydroquinone, polymer of hindered phenol (brand name AO.OH.98, Adeka Palmarol), 2,2'-methylenebis[6-(1-methylcyclohexyl)-p-cresol], 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2 -[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, 6-[3-(3-tert-butyl-4-hydroxy-5-methyl)propoxy]-2,4,8,10-tetra-tert-butylbenz[d,f][1,3,2]-dioxaphosphobine, hexamethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, bis[monoethyl(3,5-di-tert-butyl-4-hydroxybenzyl)phosphonate]calcium salt, 5,Reaction product of 7-bis(1,1-dimethylethyl)-3-hydroxy-2(3H)-benzofuranone and o-xylene, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazine-2-ylamino)phenol, DL-α-tocopherol (vitamin E), 2,6-bis(α-methylbenzyl)-4-methylphenol, bis[3,3-bis-(4'-hydroxy-3'-tert-butyl-phenyl)butanoic acid] glycol ester, 2,6-di-tert-butyl-p-cresol, 2,6-diphenyl Nyl-4-octadecyloxyphenol, stearyl(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, distearyl(3,5-di-tert-butyl-4-hydroxybenzyl)phosphonate, tridecyl-3,5-tert-butyl-4-hydroxybenzylthioacetate, thiodiethylenebis[(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 4,4'-thiobis(6-tert-butyl-m-cresol), 2-octylthio-4,6-di(3,5-di-tert-butyl 4-hydroxyphenoxy)-s-triazine, 2,2'-methylenebis(4-methyl-6-tert-butylphenol), bis[3,3-bis(4-hydroxy-3-tert-butylphenyl)butyric acid] glycol ester, 4,4'-butylidenebis(2,6-di-tert-butylphenol), 4,4'-butylidenebis(6-tert-butyl-3-methylphenol), 2,2'-ethylidenebis(4,6-di-tert-butylphenol), 1,1,3-tris(2-methyl-4-hydroxy-5-te rt-butylphenyl)butane, bis[2-tert-butyl-4-methyl-6-(2-hydroxy-3-tert-butyl-5-methylbenzyl)phenyl]terephthalate, 1,3,5-tris(2,6-dimethyl-3-hydroxy-4-tert-butylbenzyl)isocyanurate, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)isocyanurate, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-2,4,6-trimethylbenzene, 1,3,5-tris[(3,[5-di-tert-butyl-4-hydroxyphenyl)propionyloxyethyl]isocyanurate, tetrakis[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, 2-tert-butyl-4-methyl-6-(2-acryloyloxy-3-tert-butyl-5-methylbenzyl)phenol, 3,9-bis[2-(3-tert-butyl-4-hydroxy-5-methylhydrocinnamoyloxy)-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5] Undecane, triethylene glycol bis[β-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate], stearyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, palmityl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, myristyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, lauryl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide, etc. -(3,5-dialkyl-4-hydroxyphenyl)propionic acid derivative, N,N'-bis[2-"2-(3,5-di-tert-butyl-4-hydroxyphenyl)ethylcarbonyloxyethyl"]oxamide, N,N'-(1,3-propanediyl)bis[3,5-di-tert-butyl-4-hydroxybenzenepropanamide], 1,6-hexanediolbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 4-[[4,6-bis(octylthio)-1,3,5-triazine-2-yl]amino] -2,6-di-tert-butylphenol, N,N'-bis[3-(4-hydroxyphenyl)propanamide], bis[3-[3,5-di(tert-butyl)-4-hydroxyphenyl]propionic acid]thiobisethylene, N,N'-(1,6-hexanediyl)bis[3,5-di-tert-butyl-4-hydroxybenzenepropanamide], octyl 3-(4-hydroxy-3,5-diisopropylphenyl)propionic acid, calcium bis[3,5-di-tert-butyl-4-hydroxybenzyl(ethoxy)phosphonate], 2,Examples include 4-bis(octylthiomethyl)-6-methylphenol and 2,5,7,8-tetramethyl-2-(4,8,12-trimethyltridecyl)-2H-1-benzopyran-6-ol.

[0155] From the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded product, preferred phenolic antioxidants are 1,3,5-tris(3,5-di-tert-butyl-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 4,4',4”-(1-methylpropanyl-3-ylidene)tris(6-tert-butyl-m-cresol), and 6,6'-di-tert-butyl-4,4'-butylidene -m-cresol, octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 3,9-bis{2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl}-2,4,8,10-tetraoxas Pyro[5,5]undecane, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis(3-(3,5-di-tert-butyl-4-hydroxyphenylpropionamide)), benzenepropanoic Examples include quasid, 3,5-bis(1,1-dimethyl-ethyl)-4-hydroxy-C7-C9 branched alkyl esters, 4,6-bis(octylthiomethyl)-o-cresol, ethylenebis(oxyethylene)bis-(3-(5-tert-butyl-4-hydroxy-m-toluyl)propionate), and hexamethylenebis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate).

[0156] The amount of these phenolic antioxidants added is preferably 0.001 to 10 parts by mass, and more preferably 0.05 to 5 parts by mass, per 100 parts by mass of synthetic resin.

[0157] Next, as phosphorus-based antioxidants, for example, are bis(decyl)pentaerythritol diphosphite, bis(diisodecyl)pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, bis(stearyl)pentaerythritol diphosphite, trilauryl thiophosphite, heptakis(dipropylene glycol) triphosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-ter (t-butyl-4-methylphenyl) pentaerythritol diphosphite, bis(2,4,6-tri-tert-butylphenyl) pentaerythritol diphosphite, bis(2,4-dicumylphenyl) pentaerythritol diphosphite poly(dipropylene glycol) phenyl phosphite, tetra(tridecyl) isopropylidene diphenol diphosphite, tetra(tridecyl)-4,4'-n-butylidene bis(2-tert-butyl-5-methylphenol) diphosphite, hexa(tridecyl)-1,1,3-tris(2-methylphenyl) (Tyl-4-hydroxy-5-tert-butylphenyl)butane triphosphite, tetrakis(2,4-di-tert-butylphenyl)[1,1-biphenyl]-4,4'-diylbisphosphonite, tetrakis(2,4-di-tert-butyl-5-methylphenyl)-4,4'-biphenylidene phosphonite, tetra(C12~C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite, alkyl(C10)bisphenol A phosphite, 4,4'-butylidene-bis(3-methyl-6-tert-butylphenyl ditri Decyl) phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-butyl phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-ethylhexyl phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-decyl phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-dodecyl phosphite, 2,2'-methylenebis-4,6-di-tert-butylphenyl-2-octadecyl phosphite, 2,2'-ethylenebis(4,6-di-tert-butylphenyl)fluorophosphite, 6-ethylhexyl-2,4,8,10-tetra-tert-butyldibenzo[df][1,3,2]dioxaphosfepine, 6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[df][1,3,2]dioxaphosfepine (Sumilizer-GP), triethylphosphite, Tris(2-ethylhexyl) phosphite, tri(decyl) phosphite, triisodecyl phosphite, triisooctyl phosphite, trilauryl phosphite, tris(tridecyl) phosphite, tristearyl phosphite, tris(dipropylene glycol) phosphite, trioleyl phosphite, trisnonylphenyl phosphite, dioleylhydrogen phosphite, diisooctylphenyl phosphite, di(decyl) ) Monophenyl phosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenyl monodecyl phosphite, diphenyl mono(tridecyl) phosphite, diphenyloctyl phosphite, diphenyl isooctyl phosphite, diphenyl isodecyl phosphite, diphenyl tridecyl phosphite, diisooctyl phosphite, bis(tridecyl) phosphite, bis(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite, tris[2-[(2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphine-6-yl)oxy]ethyl]amine, tris(2,4-di-tert-butylphenyl) phosphite, tetraphenyl dipropyl glycol diphosphite, 2,4,6-tri-tert-butylphenyl-2-butyl-2-ethyl-1,3-propanediol phosphite, tetrakis(2,Examples include 4-di-tert-butylphenyl)biphenylenediphosphonite, hydrogenated bisphenol-A-pentaerythritol phosphite polymer (Johoku Chemical Industry Co., Ltd. product name JPH-3800), 2-hydroxyethyl methacrylate acid phosphate (Johoku Chemical Industry Co., Ltd. product name "JPA-514"), stenbisphenol-A phosphite polymer (Johoku Chemical Industry Co., Ltd. product name HBP), and stearyl acid phosphate zinc salt (Johoku Chemical Industry Co., Ltd. product name JP-518Zn).

[0158] From the viewpoint of antistatic properties and their persistence, and the mechanical strength of the molded product, preferred phosphorus-based antioxidants are 3,9-bis(octadecyloxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]undecane, 3,9-bis(2,6-di-tert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]undecane, 2,2'-methylenebis(4,6-di-tert-butylphenyl)2-ethylhexyl phosphite, tris(2,4-di-tert-butylphenyl) phosphite, tris(nonylphenyl) phosphite, tetra-C12-15-alkyl(propane-2,2-diylbis(4,1-phenylene))bis(phosphite), 2-ethylhexyldiphenyl Examples include diphenyl phosphite, isodecyl diphenyl phosphite, triisodecyl phosphite, triphenyl phosphite, 3,9-bis[2,4-bis(1-methyl-1-phenylethyl)phenoxy]-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]undecane, 3,9-bis[2,4-di-tert-butylphenoxy]-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5,5]undecane, tetrakis(2,4-di-tert-butylphenyl)-4,4'-bisphenyldiphosphonite, tetra(C12-C15 alkyl)-4,4'-isopropylidenediphenyl diphosphite, diphenyl mono(2-ethylhexyl) phosphite, and diphenylisodecyl phosphite.

[0159] The amount of these phosphorus-based antioxidants added is preferably 0.001 to 10 parts by mass, and more preferably 0.05 to 5 parts by mass, per 100 parts by mass of synthetic resin.

[0160] Next, as thioether-based antioxidants, for example, are 3,3'-thiodipropionic acid, alkyl(C12-14)thiopropionic acid, di(lauryl)-3,3'-thiodipropionate, di(tridecyl)-3,3'-thiodipropionate, di(myristyl)-3,3'-thiodipropionate, di(stearyl)-3,3'-thiodipropionate, and di(octadecyl)-3,3'-thiodipropionate. T, lauryl stearyl thiodipropionate, tetrakis[methylene-3-(dodecylthio)propionate]methane, thiobis(2-tert-butyl-5-methyl-4,1-phenylene)bis(3-(dodecylthio)propionate), 2,2'-thiodiethylenebis(3-aminobutenoate), 4,6-bis(octylthiomethyl)-o-cresol, 2,2'-thiodiethylenebis[3-(3,5 Examples include [-di-tert-butyl-4-hydroxyphenyl)propionate], 2,2'-thiobis(4-methyl-6-tert-butylphenol), 2-ethylhexyl-(3,5-di-tert-butyl-4-hydroxybenzyl)thioacetate, 4,4'-thiobis(6-tert-butyl-3-methylphenol), 4,4'-thiobis(4-methyl-6-tert-butylphenol), 4,4'-[thiobis(methylene)]bis(2-tert-butyl-6-methyl-1-hydroxybenzyl), bis(4,6-di-tert-butylphenol-2-yl)sulfide, tridecyl-3,5-di-tert-butyl-4-hydroxybenzylthioacetate, 1,4-bis(octylthiomethyl)-6-methylphenol, and 2,4-bis(dodecylthiomethyl)-6-methylphenol.

[0161] From the standpoint of antistatic properties and their persistence, and the mechanical strength of the molded product, preferred thioether-based antioxidants are 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], di(tridecyl)3,3'-thiodipropionate, bis[2-methyl-4-{3-n-dodecylthiopropionyloxy}-5-tert-butylphenyl]sulfide, 4-[ Examples include 4-hydroxy-3-tert-butyl-6-methylphenylthio]-2-tert-butyl-5-methylphenyl-3-dodecylthiopropanoate, bis[2-methyl-4-{3-n-alkyl(C12 or C14)thiopropionyloxy}-5-tert-butylphenyl]sulfide, didodecyl-3,3'-thiodipropionate, and 3,3'-thiodipropionic acid dioctadecyl ester.

[0162] The amount of these thioether-based antioxidants added is preferably 0.001 to 10 parts by mass, and more preferably 0.05 to 5 parts by mass, per 100 parts by mass of synthetic resin.

[0163] Next, as amine-based antioxidants, for example, amine oxide compounds such as dioctylmethylamine oxide, trioctylamine oxide, didecylmethylamine oxide, tridecylamine oxide, di(hydrogenated C12-14 alkyl)methylamine oxide, tri(hydrogenated C12-14 alkyl)amine oxide, di(hydrogenated C16-18 alkyl)methylamine oxide, tri(hydrogenated C16-18 alkyl)amine oxide, di(C20-22)alkylmethylamine oxide and tri(C20-22)alkyl)amine oxide, N,N- Examples of N,N-diarylhydroxylamines include dibenzylhydroxylamine, phenylnaphthylamine, 4,4'-dimethoxydiphenylamine, 4,4'-bis(α,α-dimethylbenzyl)diphenylamine, 4-isopropoxydiphenylamine, N,N-alkylarylhydroxylamine, N,N-dicycloalkylhydroxylamine, diethylhydroxylamine, dioctylhydroxylamine, didodecylhydroxylamine, and dioctadecylhydroxylamine.

[0164] Next, as UV absorbers, for example, 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5-tert-octylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3-tert-butyl-5-methylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-dicumylphenyl)benzotriazole, 2,2'-methylenebis(4-tert-octyl-6-benzotriazolylphenol), 2,2'-methylenebis(4-ethylhydroxy-6-benzotriazolylphenol), 2,2'-Methylenebis(4-methyl-6-benzotriazolylphenol), polyethylene glycol ester of 2-(2-hydroxy-3-tert-butyl-5-carboxyphenyl)benzotriazole, 2-[2-hydroxy-3-(2-acryloyloxyethyl)-5-methylphenyl]benzotriazole, 2-[2-hydroxy-3-(2-methacryloyloxyethyl)-5-tert-butylphenyl]benzotriazole, 2-[2-hydroxy-3-(2-methacryloyloxyethyl)-5-tert-octylphenyl 2-[2-hydroxy-3-(2-methacryloyloxyethyl)-5-tert-butylphenyl]-5-chlorobenzotriazole, 2-[2-hydroxy-5-(2-methacryloyloxyethyl)phenyl]benzotriazole, 2-[2-hydroxy-3-tert-butyl-5-(2-methacryloyloxyethyl)phenyl]benzotriazole, 2-[2-hydroxy-3-tert-amyl-5-(2-methacryloyloxyethyl)phenyl]benzotriazole, 2-[2-hydroxy-3-t 2-(2-hydroxyphenyl)benzotriazoles such as ert-butyl-5-(3-methacryloyloxypropyl)phenyl]-5-chlorobenzotriazole, 2-[2-hydroxy-4-(2-methacryloyloxymethyl)phenyl]benzotriazole, 2-[2-hydroxy-4-(3-methacryloyloxy-2-hydroxypropyl)phenyl]benzotriazole, and 2-[2-hydroxy-4-(3-methacryloyloxypropyl)phenyl]benzotriazole; 2-(4,6-diphenyl-1,3,5-triazine) -2-yl)-5-(hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-(octyloxy)phenol, 2-(4,6-bis(4-butoxy-2-methylphenyl)-1,3,5-triazine-2-yl)-3,5-dibutoxyphenol, 2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine-2-yl)-5-(3-(2-ethylhexyloxy)-2-hydroxypropoxy)phenol, 2-(4,6-di([1,1'-biphenyl]-4-yl)-1,3,Phenol-containing triazines such as 5-triazin-2-yl)-5-hexyloxyphenol and 2-methylhexyl-2-(4,(4,6-di([1,1'-biphenyl]-4-yl)-1,3,5-triazin-2-yl)-3-hydroxyphenoxy)propanoate; 2-hydroxybenzophenones such as 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,4-dihydroxybenzophenone, 5,5'-methylenebis(2-hydroxy-4-methoxybenzophenone), and 1,4-bis(4-benzoyl-3-hydroxyphenoxy)-butane; resorcinol monobenzoate, 2,4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate, octyl(3,5-di-te Benzoates such as rt-butyl-4-hydroxy)benzoate, dodecyl(3,5-di-tert-butyl-4-hydroxy)benzoate, tetradecyl(3,5-di-tert-butyl-4-hydroxy)benzoate, hexadecyl(3,5-di-tert-butyl-4-hydroxy)benzoate, octadecyl(3,5-di-tert-butyl-4-hydroxy)benzoate, behenyl(3,5-di-tert-butyl-4-hydroxy)benzoate, etc.; substituted oxanilides such as 2-ethyl-2'-ethoxyoxanilide, 2-ethoxy-4'-dodecyloxanilide, etc.; ethyl-2-cyano-3,3-diphenylacrylate, 2'-ethylhexyl-2-cyano-3,3-diphenylacrylate, ethyl-α-cyano-β,β-diphenyl acrylate, methyl-2-cyano-3-methyl-3-(p-methoxyphenyl)acrylate, 4-(2-cyano-3-(4-ethylphenoxy)-3-oxopropenyl)phenyl-4-propylcyclohexane-1-carboxylate, 4-(2-cyano-3-(4-ethylphenoxy)-3-oxopropenyl)phenyl-4-propylbenzoate, 4-butylphenyl-4-(2-cyano-3-oxo-3-(4-propylphenoxy)propenyl)benzoate, 4-(2-cyano-3 -(4-cyanophenoxy)-3-oxopropenyl)phenyl-4-pentylbenzoate, 4-(2-cyano-3-(4-fluorophenoxy)-3-oxopropenyl)phenyl-4-methylcyclohexane-1-carboxylate, 4-(2-cyano-3-(4-methoxyphenoxy)-3-oxopropenyl)phenyl-4-hexylcyclohexane-1-carboxylate, 4-(2-cyano-3-(4-ethoxyphenoxy)-3-oxopropenyl)phenyl-4-octylcyclohexane-1-carboxylate Luboxylate, 4-(2-cyano-3-oxo-3-(4-propoxyphenoxy)propenyl)phenyl-4-propylcyclohexane-1-carboxylate, 4-(2-cyano-3-oxo-3-(4-pentylphenoxy)propenyl)phenyl-4-propylcyclohexane-1-carboxylate, 4-(2-cyano-3-(4-octylphenoxy)-3-oxopropenyl)-4-propylcyclohexane-1-carboxylate, 1,3-bis-[(2'-cyano-3',3'-diphenylacrylate] Examples include cyanoacrylates such as liloyl)oxy]-2,2-bis-[[(2'-cyano-3',3'-diphenylacryloyl)oxy]methyl]propane; salicylic acids such as 4-tert-butylphenyl salicylate, amyl salicylate, menthyl salicylate, homomenthyl salicylate, octyl salicylate, phenyl salicylate, benzyl salicylate, and p-isopropanolphenyl salicylate; various metal salts or metal chelates, especially nickel and chromium salts or chelates.

[0165] Preferred UV absorbers in terms of antistatic properties, their durability, and the mechanical strength of the molded product include 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], and 2-(2H-benzotriazol-2 Examples include -yl)-p-cresol, 2-(5-chloro-2H-benzotriazol-2-yl)-6-tert-butyl-4-methylphenol, 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol, 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine, and [2-hydroxy-4-(octyloxy)phenyl](phenyl)methanone.

[0166] The amount of these ultraviolet absorbers added is preferably 0.001 to 30 parts by mass, more preferably 0.01 to 20 parts by mass, even more preferably 0.03 to 10 parts by mass, and even more preferably 0.05 to 5 parts by mass, per 100 parts by mass of synthetic resin.

[0167] Next, as hindered amine-based light stabilizers, for example, compounds having the structure of 2,2,6,6-tetramethylpiperidyl can be mentioned, specifically, for example, 2,2,6,6-tetramethyl-4-piperidyl stearate, 1,2,2,6,6-pentamethyl-4-piperidyl stearate, 2,2,6,6-tetramethyl-4-piperidyl benzoate, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(2,2,6,6-tetramethyl-1-( Octyloxy)piperidyl-4-yl) sebacate, methyl(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, butane-1,2,3,4-tetracarboxylic acid tetrakis(2,2,6,6-tetramethyl-4-piperidinyl), butane-1,2,3,4-tetracarboxylic acid tetrakis(1,2,2,6,6-pentamethyl-4-piperidinyl), bis(2,2,6,6-tetramethyl-4-piperidyl)·di(tridecyl)-1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl) Lysyl) di(tridecyl)-1,2,3,4-butanetetracarboxylate, bis(1,2,2,4,4-pentamethyl-4-piperidyl)-2-butyl-2-(3,5-diter-butyl-4-hydroxybenzyl)malonate, 1-(2-hydroxyethyl)-2,2,6,6-tetramethyl-4-piperidinol / diethyl succinate polycondensate, 1,6-bis(2,2,6,6-tetramethyl-4-piperidylamino)hexane / 2,4-dichloro-6-morpholino-s-triazine polycondensate, 1,6-bis(2,2,6,6-tetramethyl-4 -piperidylamino)hexane / 2,4-dichloro-6-tertiaryoctylamino-s-triazine polycondensate, polycondensate of 1-methyl-10-(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate and bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, ester of butanetetracarboxylic acid tetramethyl ester, spiroglycol and N-methylpiperidinol, polycondensate of butanetetracarboxylic acid, 3-hydroxy-2,2-dimethylpentanal and N-methylpiperidinol, 1,2,3,4-Butanetetracarboxylic acid tetramethyl ester, 2,2,6,6-tetramethyl-4-piperidinol and polycondensate of β,β,β',β'-tetramethyl-2,4,8,10-tetraoxaspiro[5.5]undecane-3,9-diethanol, 2,4-dichloro-6-(1,1,3,3-tetramethylbutylamino)-1,3,5-triazine-N,N'-bis(2,2,6, 6-Tetramethyl-4-piperidyl)hexamethylenediamine polycondensate, 2,4-dichloro-6-(1,1,3,3-tetramethylbutylamino)-1,3,5-triazine, 1,5,8,12-tetrakis[2,4-bis(N-butyl-N-(2,2,6,6-tetramethyl-4-piperidyl)amino)-s-triazine-6-yl]-1,5,8,12-tetraazadodecane, 1, 5,8,12-Tetrakis[2,4-bis(N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino)-s-triazine-6-yl]-1,5,8-12-tetraazadodecane, 1,6,11-Tris[2,4-bis(N-butyl-N-(2,2,6,6-tetramethyl-4-piperidyl)amino)-s-triazine-6-yl]aminoundecane, 1,6, Examples include 11-tris[2,4-bis(N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl)amino)-s-triazine-6-yl]aminoundecane, bis{4-(1-octyloxy-2,2,6,6-tetramethyl)piperidyl}decandionate, and bis{4-(2,2,6,6-tetramethyl-1-undecyloxy)piperidyl)carbonate.

[0168] Preferred hindered amine-based light stabilizers in terms of antistatic properties, their persistence, and the mechanical strength of the molded product include tetrakis(1,2,2,6,6-pentamethyl-4-piperidyl)butane-1,2,3,4-tetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidyl)butane-1,2,3,4-tetracarboxylate, a mixed ester of 1,2,3,4-butanetetracarboxylic acid and 1,2,2,6,6-pentamethyl-4-piperidinol and 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8-10-tetraoxospiro[5.5]undecane, and 1,2,3,4-butanetetracarboxylic acid and 2,2,6,6-tetramethyl-4- Examples include mixed esters of piperidinol and 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8-10-tetraoxospiro[5.5]undecane, bis(1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis(1-undecanoxy-2,2,6,6-tetramethylpiperidine-4-yl) carbonate, 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate, and 2,2,6,6-tetramethyl-4-piperidinyl esters of C12-21 saturated fatty acids and C18 unsaturated fatty acids.

[0169] The amount of these hindered amine-based light stabilizers added is preferably 0.001 to 30 parts by mass, more preferably 0.01 to 20 parts by mass, even more preferably 0.03 to 10 parts by mass, and still more preferably 0.05 to 5 parts by mass, per 100 parts by mass of synthetic resin.

[0170] Furthermore, when using a polyolefin resin as the synthetic resin, it is preferable to add a known neutralizing agent to neutralize the residual catalyst in the polyolefin resin as needed, to the extent that it does not impair the effects of the present invention. Examples of neutralizing agents include fatty acid metal salts such as calcium stearate, lithium stearate, and sodium stearate, or fatty acid amide compounds such as ethylenebis(stearoamide), ethylenebis(12-hydroxystearoamide), and stearamide, and these neutralizing agents may be used in mixtures.

[0171] The antistatic resin composition of the present invention may also contain, as necessary, other additives, to the extent that they do not impair the effects of the present invention, including, as needed, nucleating agents such as aromatic carboxylate metal salts, alicyclic alkyl carboxylate metal salts, p-ter-butylbenzoate aluminum, aromatic phosphate ester metal salts, dibenzylidene sorbitols, metal soaps, hydrotalcite, triazine ring-containing compounds, metal hydroxides, phosphate ester flame retardants, condensed phosphate ester flame retardants, phosphate flame retardants, inorganic phosphorus flame retardants, (poly)phosphate flame retardants, halogenated flame retardants, silicon flame retardants, antimony oxide such as antimony trioxide, other inorganic flame retardant aids, other organic flame retardant aids, neutralizing agents, antioxidants, fillers, pigments, lubricants, processing aids, plasticizers, reinforcing materials, pigments, dyes, foaming agents, and wood powder.

[0172] Examples of the above-mentioned triazine ring-containing compounds include melamine, ammeline, benzguanamine, acetoguanamine, phthalodiguanamine, melamine cyanurate, melamine pyrophosphate, butylenediguanamine, norbornenediguanamine, methylenediguanamine, ethylenedimelamine, trimethylenedimelamine, tetramethylenedimelamine, hexamethylenedimelamine, and 1,3-hexylenedimelamine.

[0173] Examples of the above-mentioned metal hydroxides include magnesium hydroxide, aluminum hydroxide, calcium hydroxide, barium hydroxide, zinc hydroxide, and Kissmer 5A (magnesium hydroxide: manufactured by Kyowa Chemical Industry Co., Ltd.).

[0174] Examples of the above-mentioned phosphate ester-based flame retardants include trimethyl phosphate, triethyl phosphate, tributyl phosphate, tributoxyethyl phosphate, trischloroethyl phosphate, trisdichloropropyl phosphate, triphenyl phosphate, tricresyl phosphate, cresyldiphenyl phosphate, trixylenyl phosphate, octyldiphenyl phosphate, xylenyldiphenyl phosphate, trisisopropylphenyl phosphate, 2-ethylhexyldiphenyl phosphate, t-butylphenyldiphenyl phosphate, bis-(t-butylphenyl)phenyl phosphate, tris-(t-butylphenyl) phosphate, isopropylphenyldiphenyl phosphate, bis-(isopropylphenyl)diphenyl phosphate, and tris-(isopropylphenyl) phosphate.

[0175] Examples of the above-mentioned condensed phosphate ester flame retardants include 1,3-phenylenebis(diphenyl phosphate), 1,3-phenylenebis(dixylenyl phosphate), and bisphenol Abis(diphenyl phosphate).

[0176] Examples of the above (poly)phosphate flame retardants include ammonium salts and amine salts of (poly)phosphates such as ammonium polyphosphate, melamine polyphosphate, piperazine polyphosphate, melamine pyrophosphate, and piperazine pyrophosphate.

[0177] Other inorganic flame retardants include, for example, inorganic compounds such as titanium dioxide, aluminum oxide, magnesium oxide, hydrotalcite, and montmorillonite, as well as surface-treated products thereof. Various commercially available products can be used, such as TIPAQUE R-680 (titanium dioxide: manufactured by Ishihara Sangyo Co., Ltd.), Kyowa Mag 150 (magnesium oxide: manufactured by Kyowa Chemical Industry Co., Ltd.), DHT-4A (hydrotalcite: manufactured by Kyowa Chemical Industry Co., Ltd.), and Alkamizer 4 (zinc-modified hydrotalcite: manufactured by Kyowa Chemical Industry Co., Ltd.). Other organic flame retardants include, for example, pentaerythritol.

[0178] Examples of the above-mentioned nucleating agents include inorganic and organic nucleating agents. Specific examples of inorganic nucleating agents include kaolinite, synthetic mica, clay, zeolite, silica, graphite, carbon black, magnesium oxide, titanium oxide, calcium sulfide, boron nitride, calcium carbonate, barium sulfate, aluminum oxide, neodymium oxide, and metal salts such as phenylphosphonate. These inorganic nucleating agents may be modified with organic substances to improve their dispersibility in the composition.

[0179] Specific examples of organic nucleating agents include sodium benzoate, potassium benzoate, lithium benzoate, calcium benzoate, magnesium benzoate, barium benzoate, lithium terephthalate, sodium terephthalate, potassium terephthalate, calcium oxalate, sodium laurate, potassium laurate, sodium myristate, potassium myristate, calcium myristate, sodium octacosanoate, calcium octacosanoate, sodium stearate, potassium stearate, lithium stearate, calcium stearate, magnesium stearate, barium stearate, sodium montanaate, calcium montanaate, sodium tolulate, sodium salicylate, potassium salicylate, zinc salicylate, and Examples include metal salts of organic carboxylic acids such as luminium dibenzoate, potassium dibenzoate, lithium dibenzoate, sodium β-naphthalate, and sodium cyclohexanecarboxylate; organic sulfonates such as sodium p-toluenesulfonate and sodium sulfisophthalate; carboxylic acid amides such as stearic acid amide, ethylenebislauric acid amide, palmitic acid amide, hydroxystearic acid amide, erucic acid amide, and tris(t-butylamide) trimesinate; benzylidene sorbitol and its derivatives; metal salts of phosphorus compounds such as sodium-2,2'-methylenebis(4,6-di-t-butylphenyl)phosphate; and sodium 2,2-methylbis(4,6-di-t-butylphenyl).

[0180] The above-mentioned neutralizing agents are added to neutralize the residual catalyst in the synthetic resin, and examples include fatty acid metal salts such as calcium stearate, lithium stearate, and sodium stearate, or fatty acid amide compounds such as ethylenebis(stearamide), ethylenebis(12-hydroxystearamide), and stearamide.

[0181] Examples of the above lubricants include pure hydrocarbon lubricants such as liquid paraffin, natural paraffin, microwax, synthetic paraffin, low molecular weight polyethylene, and polyethylene wax; halogenated hydrocarbon lubricants; fatty acid lubricants such as higher fatty acids and oxy fatty acids; fatty acid amide lubricants such as fatty acid amides and bis-fatty acid amides; ester lubricants such as lower alcohol esters of fatty acids, polyhydric alcohol esters of fatty acids such as glycerides, polyglycol esters of fatty acids, and fatty alcohol esters of fatty acids (ester waxes); lubricants such as metal soaps, fatty alcohols, polyhydric alcohols, polyglycols, polyglycerols, partial esters of fatty acids and polyhydric alcohols, partial esters of fatty acids and polyglycols, and polyglycerols; as well as silicone oils and mineral oils.

[0182] Examples of the above processing aids include acrylic processing aids, which can be obtained by polymerizing one type of (meth)acrylic acid ester or copolymerizing two or more types. Examples of (meth)acrylic acid esters to be polymerized or copolymerized include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, isopropyl acrylate, n-propyl methacrylate, isopropyl methacrylate, n-butyl acrylate, isobutyl acrylate, t-butyl methacrylate, n-hexyl acrylate, n-hexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, dodecyl methacrylate, tridecyl methacrylate, and other (meth)acrylic acid esters. In addition to the above, (meth)acrylic acid and (meth)acrylic acid esters containing hydroxyl groups can also be used.

[0183] Examples of the plasticizers mentioned above include polyester-based plasticizers, glycerin-based plasticizers, polycarboxylic acid ester-based plasticizers, polyalkylene glycol-based plasticizers, ether ester-based plasticizers, and epoxy-based plasticizers.

[0184] Examples of the above reinforcing materials include asbestos fibers, carbon fibers, graphite fibers, metal fibers, potassium titanate whiskers, aluminum borate whiskers, magnesium-based whiskers, silicon-based whiskers, warlastenite, sepiolite, asbestos, slag fibers, zonolite, elestadite, gypsum fibers, silica fibers, silica-alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, and other inorganic fibrous reinforcing materials such as boron fibers, polyester fibers, nylon fibers, acrylic fibers, regenerated cellulose fibers, acetate fibers, kenaf, ramie, cotton, jute, hemp, and sax. Examples of reinforcing materials include organic fibrous reinforcing materials such as isal, flax, linen, silk, Manila hemp, sugarcane, wood pulp, paper waste, recycled paper, and wool; glass flakes, non-swelling mica, graphite, metal foil, ceramic beads, clay, mica, sericite, zeolite, bentonite, dolomite, kaolin, fine silica powder, feldspar powder, potassium titanate, shirasu balloons, calcium carbonate, magnesium carbonate, barium sulfate, calcium oxide, aluminum oxide, titanium oxide, aluminum silicate, silicon dioxide, gypsum, novaculite, dawsonite, and white clay. These reinforcing materials may be coated or bundled with thermoplastic resins such as ethylene / vinyl acetate copolymers or thermosetting resins such as epoxy resins, or treated with coupling agents such as aminosilanes or epoxysilanes.

[0185] Examples of the above-mentioned fillers include talc, calcium carbonate, magnesium sulfate fibers, silica, clay, kaolin, alumina, and carbon black, and they may be subjected to processing such as pulverization or micronization, or surface treatment.

[0186] Examples of the above pigments include inorganic pigments, organic pigments, and metallic pigments. Examples of inorganic pigments include titanium dioxide, carbon black, titanium yellow, iron oxide pigments, ultramarine, cobalt blue, chromium oxide, spinel green, lead chromate pigments, and cadmium pigments.

[0187] Examples of organic pigments include azo pigments such as azo lake pigments, benzimidazolone pigments, diarylide pigments, and condensed azo pigments; phthalocyanine pigments such as phthalocyanine blue and phthalocyanine green; isoindolinone pigments, quinophthalone pigments, quinacridone pigments, perylene pigments, anthraquinone pigments, perinone pigments, and condensed polycyclic pigments such as dioxazine violet.

[0188] Examples of metallic pigments include flake-shaped aluminum metallic pigments, spherical aluminum pigments used to improve weld appearance, mica powder for pearlescent metallic pigments, and other materials such as glass polyhedral particles coated with metal by plating or sputtering.

[0189] Examples of the above dyes include nitroso dyes, nitro dyes, azo dyes, stilbene azo dyes, ketoimine dyes, triphenylmethane dyes, xanthene dyes, acridine dyes, quinoline dyes, methine / polymethine dyes, thiazole dyes, indamine / indophenol dyes, azine dyes, oxazine dyes, thiazine dyes, sulfur dyes, aminoketone / oxyketone dyes, anthraquinone dyes, indigoid dyes, phthalocyanine dyes, and the like.

[0190] Examples of the above-mentioned blowing agents include pyrolysis-type organic blowing agents and pyrolysis-type inorganic blowing agents. Examples of pyrolysis-type organic blowing agents include azo-based blowing agents such as azodicarbonamide, azobisisobutylnitrile, diazoaminobenzene, diethylazodicarboxylate, diisopropylazodicarboxylate, and azobis(hexahydrobenzonitrile); nitroso-based blowing agents such as N,N'-dinitropentamethylenetetramine and N,N'-dimethyl-N,N'-dinitroterephthalamine; and benzenesulfonyl hydrazide and p-toluenesulfonyl hydra Examples of hydrazide-based blowing agents include zide, 3,3'-disulfonehydrazidephenylsulfone, toluenedisulfonylhydrazone, thiobis(benzenesulfonylhydrazide), tolueneesulfonyl azide, toluenesulfonyl semicarbazide, and p,p'-bis(benzenesulfonylhydrazide) ether; carbazide-based blowing agents include p-toluenesulfonyl semicarbazide and 4,4'-oxybiz(sulfonyl semicarbazide); and triazine-based blowing agents include trihydrazinotriazine and 1,3-bis(o-biphenyltriazine). Examples of pyrolysis-type inorganic blowing agents include sodium bicarbonate, ammonium carbonate, ammonium nitrite, azide compounds, and sodium boride.

[0191] In addition, the antistatic resin composition of the present invention may optionally contain additives commonly used in synthetic resins, such as crosslinking agents, antifogging agents, plate-out inhibitors, surface treatment agents, fluorescent agents, antifungal agents, disinfectants, antibacterial agents, metal deactivators, mold release agents, etc., to the extent that they do not impair the effects of the present invention.

[0192] The method for producing the antistatic resin composition of the present invention is not particularly limited. It is sufficient to blend a synthetic resin, especially a thermoplastic resin, with glass fibers of component (X), a polymer compound (E) of component (Y), and optionally one or more alkali metal salts (F) and ionic liquids (G), as well as other optional components. Any commonly used method can be used. For example, dry blending using a blender or Henschl mixer, or melt blending using an extruder, Banbury mixer, kneader, etc.

[0193] There are no particular restrictions on the order of mixing; all components may be mixed simultaneously or in multiple stages. For example, one method involves pre-mixing all components except the polymer compound (E) of component (Y) and then mixing in the polymer compound (E), or pre-mixing the glass fiber of component (X), the polymer compound (E) of component (Y), and any additional additives before mixing in the synthetic resin.

[0194] Furthermore, as a method for compounding the polymer compound (E) of component (Y) into a synthetic resin, particularly a thermoplastic resin, the polymer compound (E) may be synthesized and compounded by kneading a block polymer (C) and an epoxy compound (D) having two or more epoxy groups together with the thermoplastic resin, at which time glass fibers of component (X), and optionally one or more selected from the group of alkali metal salts (F) and ionic liquids (G) may also be kneaded together at the same time. Alternatively, the polymer compound (E) may be compounded by mixing it with the thermoplastic resin during molding, such as injection molding, to obtain a molded product, at which time glass fibers, and optionally one or more selected from the group of alkali metal salts (F) and ionic liquids (G) may also be compounded. Furthermore, a masterbatch of polymer compound (E) and thermoplastic resin may be prepared in advance and this masterbatch may be compounded, at which time glass fibers of component (X), and optionally one or more selected from the group of alkali metal salts (F) and ionic liquids (G) may also be compounded.

[0195] A molded article can be obtained by molding the antistatic resin composition of the present invention. The molding method is not particularly limited and includes known molding methods such as extrusion molding, injection molding, compression molding, and lamination molding. Among these, extrusion molding is preferred in terms of antistatic properties, their durability, and the mechanical strength of the molded article. Extrusion molding is performed using an extruder, and as a specific method, for example, the resin composition is supplied to the hopper of the extruder, mechanically melted and kneaded in the extruder, and then extruded into the air through a die to form a molded article. As the extruder, a known extruder equipped with a single-screw or twin-screw mechanism is used, and the kneading of each component and extrusion molding are performed in a single extruder, which has the advantage of being easy to operate and highly productive. By molding the antistatic resin composition of the present invention, molded articles of various shapes such as resin plates, sheets, films, bottles, fibers, and irregularly shaped products can be manufactured.

[0196] The antistatic resin composition of the present invention and molded articles using the same can be used in a wide range of industrial fields, including electrical and electronic communications, agriculture, forestry and fisheries, mining, construction, food, textiles, clothing, medical, coal, petroleum, rubber, leather, automobiles, precision instruments, timber, building materials, civil engineering, furniture, printing, and musical instruments.

[0197] More specifically, the antistatic resin composition and its molded articles of the present invention are used in applications such as printers, personal computers, word processors, keyboards, PDAs (personal digital assistants), telephones, photocopiers, facsimile machines, ECRs (electronic cash registers), calculators, electronic organizers, cards, holders, stationery, and other office and OA equipment; washing machines, refrigerators, vacuum cleaners, microwave ovens, lighting fixtures, game consoles, irons, kotatsu (heated tables), and other home appliances; AV equipment such as TVs, VTRs, video cameras, radio cassette players, tape recorders, MiniDiscs, CD players, speakers, and liquid crystal displays; electrical and electronic components and communication equipment such as connectors, relays, capacitors, switches, printed circuit boards, coil bobbins, semiconductor encapsulating materials, LED encapsulating materials, electric wires, cables, transformers, deflection yokes, distribution boards, clocks, and other electrical and electronic components; automotive interior and exterior materials; printing plates, adhesive films, bottles, food containers, food packaging films, pharmaceutical and medical wrap films, product packaging films, agricultural films, agricultural sheets, and greenhouse films.

[0198] Furthermore, the antistatic resin composition of the present invention and molded articles using the same can be used for (filling, surface materials, etc.), belts, ceiling coverings, convertible tops, armrests, door trims, rear package trays, carpets, mats, sun visors, wheel covers, mattress covers, airbags, insulating materials, handrails, handrail straps, wire coverings, electrical insulating materials, paints, coatings, upholstery materials, flooring materials, corner walls, carpets, wallpaper, wall coverings, exterior materials, interior materials, roofing materials, decking materials, It can be used for a variety of applications, including wall materials, column materials, floorboards, fence materials, frameworks and moldings, window and door profiles, shingles, paneling, terraces, balconies, soundproofing boards, insulation boards, window materials, and other building and construction materials for automobiles, vehicles, ships, aircraft, buildings, houses, and civil engineering materials, as well as everyday goods and sports equipment such as clothing, curtains, sheets, nonwoven fabrics, plywood, synthetic fiberboards, carpets, doormats, sheets, buckets, hoses, containers, eyeglasses, bags, cases, goggles, skis, rackets, tents, musical instruments, and more.

[0199] Molded articles obtained using the antistatic resin of the present invention possess antistatic properties, their durability, and excellent mechanical strength. [Examples]

[0200] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. In the following examples, "%", "ppm", and "parts" are based on mass unless otherwise specified.

[0201] A polymer compound (E), which is component (Y) of the resin composition of the present invention, was manufactured according to the manufacturing example below. For the glass fiber component (X), a commercially available product, CS3PE-455S manufactured by Nitto Boseki Co., Ltd., was used.

[0202] In the following manufacturing example, the number-average molecular weight of compound (b) was calculated using the method described below in <Method for calculating number-average molecular weight from hydroxyl value>, while the number-average molecular weights of compounds other than compound (b) were calculated using the method described below in <Method for measuring number-average molecular weight by polystyrene equivalent>.

[0203] <Method for calculating the number-average molecular weight from the hydroxyl value> The hydroxyl value was measured using the hydroxyl value measurement method described below, and the number-average molecular weight was determined using the formula below. Number-average molecular weight = (56110 × 2) / hydroxyl value

[0204] <Hydroxyl Value Measurement Method> • Reagent A (acetylating agent) (1) Triethyl phosphate 1560 mL (2) Acetic anhydride 193 mL (3) Perchloric acid (60%) 16g Mix the above reagents in the order of (1) → (2) → (3). Reagent B Mix pyridine and pure water in a volume ratio of 3:1. Reagent C Add 2-3 drops of phenolphthalein solution to 500 mL of isopropyl alcohol, and neutralize with 1N-KOH aqueous solution.

[0205] First, weigh 2 g of the sample into a 200 mL Erlenmeyer flask, add 10 mL of triethyl phosphate, and heat to dissolve. Add 15 mL of reagent A, stopper the flask, and shake vigorously. Add 20 mL of reagent B, stopper the flask, and shake vigorously. Add 50 mL of reagent C. Titrate with 1 N KOH aqueous solution and calculate using the following formula. Hydroxyl value [mgKOH / g] = 56.11 × f × (TB) / S f: Factor of 1N-KOH aqueous solution B: Blank titration volume [mL] T: Titration volume for this test [mL] S: Sample volume [g]

[0206] <Method for measuring the number-average molecular weight based on polystyrene equivalent> The number-average molecular weight was measured by gel permeation chromatography (GPC). The measurement conditions for Mn were as follows: Equipment: GPC instrument manufactured by JASCO Corporation Solvent: Chloroform Reference material: Polystyrene Detector: Differential refractometer (RI detector) Column stationary phase: Shodex LF-804 manufactured by Showa Denko Corporation Column temperature: 40℃ Sample concentration: 1 mg / 1 mL Flow rate: 0.8mL / min. Injection volume: 100μL

[0207] [Manufacturing Example 1] Manufacturing of polymer compound (E)-1 In a separable flask, 122 g (1.35 mol) of 1,4-butanediol (a1)-1 and 168 g (1.42 mol) of succinic acid (a2)-1 were polymerized at atmospheric pressure for 3 hours while gradually increasing the temperature from 140°C to 190°C, in the presence of 0.2 g of an antioxidant (tetrakis[3-(3,5-diter-butyl-4-hydroxyphenyl)propionyloxymethyl]methane, ADEKA Stab AO-60, manufactured by ADEKA Corporation), to obtain polyester (a)-1. The number-average molecular weight Mn of the obtained polyester (a)-1 was 3,000. Next, 250 g of the obtained polyester (a)-1, 160 g of polyethylene glycol (b)-1 with a number average molecular weight of 3,300 as compound (b) having hydroxyl groups at both ends, 0.2 g of antioxidant (Adekastab AO-60), and 0.4 g of zirconium octate were added, and polymerization was carried out at 200°C for 3 hours under reduced pressure to obtain 400 g of block polymer (C)-1 having a structure with carboxyl groups at both ends. The number average molecular weight Mn of this block polymer (C)-1 having a structure with carboxyl groups at both ends was 16,500. 400 g of the resulting block polymer (C)-1, which has a structure with carboxyl groups at both ends, was charged with 3 g of bisphenol F diglycidyl ether (epoxy equivalent 170 g / eq) as epoxy compound (D)-1 having two or more epoxy groups, and polymerized under reduced pressure at 220°C for 5 hours to obtain polymer compound (E)-1.

[0208] [Manufacturing Example 2] Manufacturing of Polymer Compound (E)-2 In a separable flask, 656 g of 1,4-cyclohexanedimethanol(a1)-2, 708 g of adipic acid(a2)-2, 0.7 g of phthalic anhydride(a2)-3, and 0.7 g of antioxidant (tetrakis[3-(3,5-diter-butyl-4-hydroxyphenyl)propionyloxymethyl]methane, ADEKA stab AO-60, manufactured by ADEKA Corporation) were charged. Polymerization was carried out at atmospheric pressure for 4 hours while gradually increasing the temperature from 160°C to 210°C, and then at 210°C under reduced pressure for 3 hours to obtain polyester(a)-2. The number-average molecular weight Mn of the obtained polyester(a)-2 was 5,400. Next, 600 g of the obtained polyester (a)-2, 300 g of polyethylene glycol (b)-2 with a number average molecular weight of 4,000 as compound (b) having hydroxyl groups at both ends, 0.5 g of antioxidant (Adekastab AO-60), and 0.8 g of zirconium octate were added, and polymerization was carried out at 210°C for 7 hours under reduced pressure to obtain block polymer (C)-2 having a structure with carboxyl groups at both ends. The number average molecular weight Mn of this block polymer (C)-2 having a structure with carboxyl groups at both ends was 12,000. 360 g of the resulting block polymer (C)-2, which has a structure with carboxyl groups at both ends, was charged with 6 g of bisphenol F diglycidyl ether (epoxy equivalent 170 g / eq) as epoxy compound (D)-1, and polymerized under reduced pressure at 240°C for 3 hours to obtain polymer compound (E)-2.

[0209] [Manufacturing Example 3] Manufacturing of Polymer Compound (E)-3 In a separable flask, 111 g of 1,4-cyclohexanedimethanol(a1)-2, 122 g of adipic acid(a2)-2, 0.1 g of phthalic anhydride(a2)-3, and 0.4 g of antioxidant (tetrakis[3-(3,5-diter-butyl-4-hydroxyphenyl)propionyloxymethyl]methane, ADEKA stab AO-60, manufactured by ADEKA Corporation) were charged. Polymerization was carried out at atmospheric pressure for 4 hours while gradually increasing the temperature from 170°C to 215°C, and then at 215°C under reduced pressure for 3 hours to obtain polyester(a)-3. The number-average molecular weight Mn of the obtained polyester(a)-3 was 2931. Next, 205 g of the obtained polyester (a)-3, a mixture (b)-3 consisting of 144 g of polyethylene glycol with a number average molecular weight of 3650 and 40 g of polytetramethylene glycol with a number average molecular weight of 3042 (the proportion of polytetramethylene glycol being 25 mol% of the total number of moles of polyethylene glycol and polytetramethylene glycol), 0.4 g of antioxidant (Adekastab AO-60), and 3.4 g of zirconium octate were charged together. Polymerization was carried out under reduced pressure for 7 hours while gradually increasing the temperature from 215°C to 240°C to obtain block polymer (C)-3 having a structure with carboxyl groups at both ends. The number average molecular weight Mn of this block polymer (C)-3 having a structure with carboxyl groups at both ends was 22109. 392 g of the resulting block polymer (C)-3, which has a structure with carboxyl groups at both ends, was charged with 4.0 g of polypropylene glycol diglycidyl ether (number average molecular weight 530, epoxy equivalent 300 g / eq) as epoxy compound (D)-2, and polymerized under reduced pressure at 240°C for 3 hours to obtain 396 g of polymer compound (E)-3.

[0210] [Examples 1-27 and Comparative Examples 1-2] Test specimens were obtained using the resin compositions of each example and comparative example, blended according to the mixing ratios (parts by mass) listed in Tables 1 to 5 below, and following the test specimen preparation conditions shown below. The surface resistivity (SR value), Charpy impact strength, flexural modulus, and heat distortion temperature were measured using the obtained test specimens under the following conditions. The results are shown in Tables 1 to 5.

[0211] <Conditions for preparing polycarbonate / ABS resin composition test specimens> Based on the blending amounts (parts by mass) shown in Tables 1-5 below, polycarbonate / ABS resin compositions were granulated using an Ikegai Co., Ltd. twin-screw extruder (PCM30, 60 mesh) at 250°C and 6 kg / hour to obtain pellets. The obtained pellets were molded using a horizontal injection molding machine (NEX80: manufactured by Nissei Plastic Industrial Co., Ltd.) under processing conditions of resin temperature 250°C and mold temperature 50°C to obtain test pieces (100 mm × 100 mm × 3 mm) for measuring surface resistivity (SR value) and test pieces (80 mm × 10 mm × 4 mm) for measuring Charpy impact strength, flexural modulus, and heat distortion temperature. The polycarbonate / ABS resin used was polycarbonate / ABS = 7 / 3 (by mass ratio), and a melt flow rate of 40g / 10min (ISO1133, 260℃ × 5.00kg) was employed.

[0212] <Method for measuring surface resistivity (SR value)> The obtained test specimens for surface resistivity measurement (100 mm × 100 mm × 3 mm) were stored immediately after molding at a temperature of 25°C and a humidity of 50% RH. After 1 day and 30 days of storage following molding, the surface resistivity (Ω / □) was measured under the same conditions using an Advantest R8340 resistance meter with an applied voltage of 100 V and an application time of 1 minute. Measurements were performed on 5 test specimens, with 5 points on each specimen, and the average value was calculated.

[0213] <Charpy impact strength> Measurements were taken in accordance with ISO 179-1 (with notches).

[0214] <Flexural modulus> Measurements were taken in accordance with ISO 178.

[0215] <Heat distortion temperature> Measurements were taken in accordance with ISO 75-2.

[0216] [Table 1]

[0217] [Table 2]

[0218] [Table 3]

[0219] [Table 4]

[0220] [Table 5]

[0221] From the above, it can be seen that the antistatic resin composition of the present invention can provide a molded article with excellent antistatic performance, its durability, and mechanical strength.

Claims

1. An antistatic resin composition containing 5 to 150 parts by mass of component (X) and 1 to 60 parts by mass of component (Y) per 100 parts by mass of synthetic resin. (X) Component: Glass fiber. (Y) Component: One or more polymer compounds (E) obtained by reacting a polyester (a) obtained by reacting a diol (a1) and a dicarboxylic acid (a2), a compound (b) having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups.

2. The antistatic resin composition according to claim 1, wherein the polymer compound (E) comprises a polyester block (A) composed of the polyester (a) and a polyether block (B) composed of the compound (b), and has a structure formed by the reaction of a hydroxyl group or carboxyl group at the end of the polyester (a), a hydroxyl group at the end of the compound (b), and a hydroxyl group formed by the reaction of the epoxy group or epoxy group of the epoxy compound (D), and is linked via an ester bond or ether bond.

3. The antistatic resin composition according to claim 2, wherein the polymer compound (E) has a structure in which a block polymer (C) having carboxyl groups at both ends is formed by repeatedly and alternately bonding a polyester block (A) and a polyether block (B) via ester bonds, and the epoxy compound (D) is bonded via ester bonds.

4. Furthermore, the antistatic resin composition according to any one of claims 1 to 3 contains 0.01 to 15.0 parts by mass of one or more selected from the group consisting of alkali metal salts (F) and ionic liquids (G).

5. A molded article obtained from the antistatic resin composition according to any one of claims 1 to 3.

6. A molded article obtained from the antistatic resin composition described in claim 4.

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