Hermetic seal package and method for manufacturing the same

Abstract

Improve existing packages, particularly those that interact with the internal areas of the packages. [Solution] The hermetic seal package of the present invention comprises at least one planar cover substrate having a flat outer surface and a narrow surrounding surface; a second substrate positioned adjacent to the cover substrate and in direct contact with the planar cover substrate; at least one functional region surrounded by the package and particularly positioned between the cover substrate and the second substrate; and a laser bonding line that directly and hermetically joins the cover substrate and the second substrate positioned adjacent to the cover substrate, wherein the cover substrate is formed as a transparent thin film substrate and has a thickness of less than 200 μm.

Claims

1. A hermetic seal package (1), wherein the hermetic seal package (1) is A cover substrate (3) that extends in a planar shape, having a flat outer surface (4) and a narrow surrounding surface, A second substrate (24) is arranged adjacent to the cover substrate and is in direct contact with the planar, extended cover substrate, Enclosed by the package, and particularly positioned between the cover substrate and the second substrate, at least one functional region (2, 18) is located. A laser bonding line (6, 6a) directly and hermetically joins the cover substrate and a second substrate arranged adjacent to the cover substrate. Equipped with, The cover substrate is formed as a transparent thin film substrate, and the cover substrate has a thickness of less than 200 μm, in a hermetic seal package (1).

2. The thickness of the cover substrate (3) is measured on the narrow periphery of the cover substrate, and / or The hermetic seal package (1) according to claim 1, wherein the cover substrate (3) has a thickness of less than 170 μm, preferably less than 150 μm, more preferably less than 125 μm and / or more than 10 μm, more preferably more than 20 μm.

3. The laser bonding line has a width W in a direction parallel to the planar extending direction of the cover substrate, and in particular has a width on the flat outer surface of the cover substrate. The hermetic seal package (1) according to claim 1 or 2, wherein the cover substrate has increased shear strength when bonded to the second substrate.

4. The laser bonding lines (6, 6a) have an initial height HL, and the cover substrate (3) has a thickness of less than half of HL, and / or Hermetic seal package (1) according to any one of claims 1 to 3, wherein T < D + WH and / or T > CN.

5. The flat outer surface (4) is at least one of the following: Coating layer (16) and / or Nanoprinting or nanoembossing (16) and / or Functional area (16) A hermetic seal package (1) according to any one of claims 1 to 4, having the following:

6. The flat outer surface (4) of the cover substrate (3) is formed to be flat, especially planar, and has no protrusions, and moreover has a maximum deviation from the flat surface of less than 5 μm, and moreover has an average roughness value Ra of 20 nm or less, and / or The hermetic seal package (1) according to any one of claims 1 to 5, characterized in that the cover substrate (3) is thinner than 200 μm in total, is particularly planar, and consistently has the thickness of the narrow surrounding surface.

7. The hermetic seal package (1) according to any one of claims 1 to 6, wherein the cover substrate (3) and the second substrate (24) form a contact surface or contact area (10), and the cover substrate and the second substrate are in contact at the contact surface or contact area (10), and the contact surface is free of foreign matter and, in particular, free of bonding materials such as adhesives or glass frit.

8. The adjacent second substrate (24) is a base substrate, and the base substrate is hermetically bonded to the cover substrate by the same laser bonding lines (6, 6a), or The hermetic seal package (1) according to any one of claims 1 to 7, wherein the adjacent second substrate is an intermediate substrate disposed between the cover substrate and the base substrate, the base substrate and the intermediate substrate are joined at a first bonding surface, and the cover substrate and the intermediate substrate are joined at a second bonding surface.

9. The hermetic seal package (1) according to any one of claims 1 to 8, wherein the at least one laser bonding line (6, 6a) has a thickness WH in a direction perpendicular to the planar extending direction of the cover substrate (3), the laser bonding line extends to the flat outer surface (4), and in particular the laser bonding line forms a part of the flat outer surface.

10. Hermetic seal package (1) according to any one of claims 1 to 9, wherein in the region of the laser bonding lines (6, 6a), there is a material modification of the cover substrate (3) and / or the adjacent second substrate (24), particularly a change in refractive index and / or a change in chemical composition, and the material modification forms a region of the flat outer surface (4).

11. The width W of the laser bonding lines (6, 6a) is greater than the thickness D of the cover substrate (3), and / or The hermetic seal package (1) according to any one of claims 3 to 10, wherein the width W of the laser bonding lines (6, 6a) and the thickness D of the cover substrate (3) are in a ratio such that W / D is 1 or more, and in particular W / D is 0.05 or more.

12. The hermetic seal package (1) according to any one of claims 1 to 11, wherein the functional region (2, 18) has a hermetic seal housing cavity for housing an object (5) such as an electronic circuit, a sensor, or a MEMS.

13. The hermetic seal package (1) according to any one of claims 1 to 12, wherein the cover substrate (3) is transparent to a certain wavelength range, at least partially and / or in at least a certain area.

14. The hermetic seal package (1) according to any one of claims 1 to 13, wherein the cover substrate (3) is made of glass, glass ceramic, silicon, sapphire, or a combination of the aforementioned materials, or the cover substrate is made of a ceramic material, particularly an oxide ceramic material.

15. In particular, an hermetically bonded substrate assembly (1, 9) for a package according to any one of claims 1 to 14, wherein the substrate assembly (1, 9) is A first substrate (3) that extends in a planar shape having a flat outer surface (4) and a narrow surrounding surface, A second substrate (24) is arranged adjacent to the first substrate and is in direct contact with the first substrate which is spread out in a planar manner, At least one laser bonding line (6, 6a) directly and hermetically joins the first substrate and the second substrate arranged adjacent to the first substrate. Equipped with, The first substrate is formed as a transparent thin film substrate, and the first substrate has a thickness of less than 200 μm. The laser bonding lines extend to the flat outer surface, and in particular the laser bonding lines form a portion of the flat outer surface, in a hermetically bonded substrate assembly (1, 9).

16. A method for providing an airtight package (1), wherein the package contains a functional area (2, 18), the functional area being formed in particular as a housing cavity (2) for housing at least one housing object (5), and the method is - A step of providing at least one cover substrate (3) and a second substrate (24), The cover substrate includes a transparent material, By arranging the at least two substrates so that they are directly adjacent to each other or overlapping each other, a contact region (10) is formed between the at least two substrates. The cover substrate is provided to have a flat outer surface (4) and a narrow surrounding surface, - The step of hermetically sealing the package by directly joining the at least two substrates to each other along the at least one contact area of ​​the package, - A step of manufacturing a thin film substrate from the cover substrate by ablation of the material of the cover substrate, particularly ablation by polishing, for example by sanding, and in which case the narrow surrounding surface maintains a thickness of less than 200 μm. Methods that include...

17. The hermetically sealed package (1) and / or cavity (2) is performed using a laser bonding process, and / or The method according to claim 16, wherein the hermetically sealing of the package (1) and / or the cavity (2) is performed at a temperature lower or higher than the temperature at which the package will be used afterward.

18. The method according to claim 16 or 17, wherein the at least two substrates (3, 24, 25) are provided as a wafer stack (9), and a plurality of hermetic packages (1) are manufactured together from the wafer stack in the same work process.

19. The method according to any one of claims 16 to 18, further comprising the step of separating the package (1) from the wafer stack (9), wherein the step is performed in particular by a laser cutting step or a laser separation step, wherein the same laser used for the bonding step is used.

20. A package (1) having a sealed hermetic seal housing cavity (2) inside, manufactured by the method according to any one of claims 16 to 19.

21. Use as a medical implant or as a sensor of a package (1) having a sealed hermetic seal housing cavity (2) inside, manufactured by the method of any one of claims 16 to 19.

22. A sensor unit and / or medical implant comprising a package (1) according to any one of claims 1 to 14 or a substrate assembly (1) according to claim 15.

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