Entropy source mounted substrate protection structure, and method for assembling the entropy source mounted substrate protection structure.

Abstract

To protect boards equipped with entropy sources from unauthorized parties and to enable the gradual detection of unauthorized attacks. [Solution] The protection structure for the entropy source mounting substrate comprises a main board (20) equipped with a pin header (21) for electrically connecting to the entropy source mounting substrate (10) and for utilizing the random numbers generated by the entropy source mounting substrate (10), a break plate (40) located between the entropy source mounting substrate (10) and the main board (20), an outer peripheral frame (30) fixed to the main board (20) to enclose the space on the pin header (21) side of the main board (20), and an inner cover material (50) that closes the space on the opposite side of the entropy source mounting substrate (10) from the main board (20).

Claims

1. Entropy source mounted substrate, A main board for utilizing random numbers generated by the entropy source board, which is equipped with pin headers for electrically connecting to the aforementioned entropy source board, A break plate is positioned between the aforementioned entropy source mounting board and the aforementioned main board, without interfering with the electrical connection to the aforementioned main board, by passing through the aforementioned pin header, An outer frame fixed to the main board in order to enclose the space on the pin header side of the main board, An inner cover material for closing the space on the side of the entropy source mounting substrate opposite to the main substrate, An entropy source mounted substrate protection structure comprising, The aforementioned break plate is supported and fixed to the outer peripheral frame such that it secures a lower space for fixing between it and the main circuit board, and also secures an upper space for fixing between it and the inner cover material. Entropy source mounted substrate protection structure.

2. The aforementioned upper space for fixing is solidified with a thermosetting resin to fix the break plate and main circuit board, and the entropy source mounting circuit board and inner cover material, respectively. The entropy source mounted substrate protection structure according to claim 1.

3. Between the lower surface of the main board and the upper surface of the break plate, there is a space below the board on which the entropy source is mounted. The aforementioned break plate is a thin plate comprising: the outermost horizontal portions at both ends in the longitudinal direction; the outermost vertical portions bent downward from the outermost horizontal portions in the opposite direction to the outermost vertical portions; the outermost vertical portions bent downward from the outermost horizontal portions; the entropy source mounting substrate support portions bent horizontally from the outermost vertical portions; and the central vertical portions bent upward from the entropy source mounting substrate support portions. The aforementioned central upright section is provided with vertical grooves, which are grooves running in the vertical direction. The aforementioned thermosetting resin is designed to solidify the space formed by the longitudinal grooves and the space beneath the substrate on which the entropy source is mounted. The entropy source mounted substrate protection structure according to either claim 1 or claim 2.

4. It includes a fixing side space which is a space enclosed by the inside of the outer peripheral frame, the upper surface of the main board, and the lower surface of the break plate, The aforementioned thermoplastic resin is designed to solidify the aforementioned fixing side space as well. The entropy source mounted substrate protection structure according to either claim 2 or claim 3.

5. The inner cover material is provided with an outer cover material that covers the opposite side of the inner cover material from where the break plate is located. The outer cover material was to be fixed in place using double-sided tape positioned between it and the inner cover material. The entropy source mounted substrate protection structure according to claim 1.

6. The aforementioned entropy source mounting substrate consists of two substrates: a first substrate and a second substrate. The aforementioned pin header is to be electrically connected to the first substrate and the second substrate. In the longitudinal center of the aforementioned break plate, two central upright sections and a central horizontal section sandwiched between the two central upright sections are provided in order to create a central fixing space between the first substrate and the second substrate. The aforementioned thermosetting resin also solidifies the aforementioned central space for fixing. The entropy source mounted substrate protection structure according to claim 1.

7. Entropy source mounted substrate, A main board for utilizing random numbers generated by the entropy source board, which is equipped with pin headers for electrically connecting to the aforementioned entropy source board, A break plate is positioned between the aforementioned entropy source mounting board and the aforementioned main board, without interfering with the electrical connection to the aforementioned main board, by passing through the aforementioned pin header, An outer frame fixed to the main board in order to enclose the space on the pin header side of the main board, An inner cover material for closing the space on the side of the entropy source mounting substrate opposite to the main substrate, Equipped with, A method for assembling an entropy source mounting substrate protection structure comprising an outer cover material that covers the opposite side of the inner cover material from where the break plate is located, The aforementioned break plate is supported and fixed to the outer frame in an outer frame fixing procedure that secures a lower fixing space between it and the main board, and also secures an upper fixing space between it and the inner cover material, The aforementioned lower and upper fixing spaces are solidified with thermosetting resin, thereby separating the break plate and main substrate from the entropy source mounting substrate and inner cover material. Each involves a solidification procedure for fixing the material, The outer cover material is fixed using double-sided tape positioned between it and the inner cover material, and Assembly method for a substrate protection structure with an entropy source.

Images