Method for manufacturing a display device

JP2026102813APending Publication Date: 2026-06-23SEMICON ENERGY LAB CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SEMICON ENERGY LAB CO LTD
Filing Date
2026-03-18
Publication Date
2026-06-23

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  • Figure 2026102813000001_ABST
    Figure 2026102813000001_ABST
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Abstract

This invention provides a method for manufacturing a novel display device. [Solution] A method for manufacturing a display device comprising the steps of: sequentially forming an anode, a first EL layer, a first cathode, and a first layer; forming a first resist mask on the first layer; selectively removing a portion of each of the anode, the first EL layer, the first cathode, and the first layer; removing a portion of the first resist mask; selectively removing other portions of each of the first EL layer, the first cathode, and the first layer; and removing the first resist mask. The first resist mask is formed using a multi-gradation mask.
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Claims

[Claim 1] A method for manufacturing a display device including a light-emitting element, A step of sequentially forming a first conductive film, an EL layer, a second conductive film, and a first layer, A step of forming a resist mask on the first layer, A step of selectively removing a portion of the first conductive film, the EL layer, the second conductive film, and the first layer using the resist mask, thereby forming a stack of the anode, the EL layer, the second conductive film, and the first layer of the light-emitting element. A step of removing a portion of the resist mask, Using the resist mask from which the aforementioned portion has been removed, a step is made to selectively remove other portions of the EL layer, the second conductive film, and the first layer located on the anode of the light-emitting element, thereby forming the EL layer of the light-emitting element and the cathode of the first light-emitting element. A method for manufacturing a display device, comprising the step of removing a resist mask from which the aforementioned portion has been removed.