Elements and methods for manufacturing the same, as well as electronic devices.

Abstract

The present invention provides an element that includes a cured product having structural units containing a silsesquioxane skeleton, and in which the thickness variation of the cured product is small. [Solution] An element having a cured product, wherein the cured product is a cured product of a resin composition containing an organosilicon compound having a structure represented by the following formulas (A) and (B), and the organosilicon compound is An element in which the proportion of structures represented by the following formula (B) where m=2 is greater than the proportion of structures represented by the following formula (B) where m=1. TIFF2026104760000040.tif71167

Description

[Technical Field]

[0001] This invention relates to an element, a method for manufacturing the same, and an electronic device. [Background technology]

[0002] Organosilicon compounds containing a silsesquioxane skeleton are attracting attention from various fields because they have a unique structure based on siloxane bonds (Si-O-Si) with high bond energy, and because of the unique effects that can be expected from this structure. Among such organosilicon compounds containing a silsesquioxane skeleton, silicon-based polymers with a silsesquioxane skeleton as the main chain are known. These silicon-based polymers are particularly expected to be useful in semiconductor devices due to their excellent heat resistance and electrical insulation properties, in lenses due to their excellent transparency, and in adhesives due to their excellent adhesion properties, and further research is being conducted to enhance their functionality. For example, Patent Document 1 discloses a silicon-based polymer that can produce a silicone film with excellent heat resistance. Furthermore, studies have also been conducted on compositions using silicon-based polymers along with other components, and Patent Document 2 discloses a composition that can form a cured product with excellent heat resistance by using a silicon-based polymer along with a compound containing a specific element. Furthermore, Patent Document 3 discloses a technique for obtaining a laminate for semiconductor devices and the like that has high electrical connection reliability by using a film obtained using a silicon-based polymer as an insulating film. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2010-116464 [Patent Document 2] International Publication No. 2022 / 215759 [Patent Document 3] International Publication No. 2021 / 261403 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] As mentioned above, organosilicon compounds containing a silsesquioxane skeleton have primarily been studied for their heat resistance and electrical insulation properties, and their application to various devices is anticipated. On the other hand, materials containing organosilicon compounds are not particularly easy to handle, and the stability of their material properties has sometimes been a problem. In particular, when these materials are used in layers, further improvement in terms of variations in layer thickness has been required. If this variation in thickness is not small, variations in physical properties will occur throughout the entire layer. However, in the field of organosilicon compounds, there has been little research on improving variations in thickness, and there is still room for further investigation. Therefore, the object of the present invention is to provide an element having a cured product of a resin composition containing an organosilicon compound containing a silsesquioxane skeleton, wherein the thickness variation of the cured product is small. [Means for solving the problem]

[0005] As a result of diligent research, the inventors of the present invention have found that the above problem can be solved by controlling the number of two specific structures in the organosilicon compound contained in the resin composition used to obtain the cured product in an element having a cured product, and have completed the present invention.

[0006] In other words, the gist of this invention is as follows: Item 1. An element having a cured product, The cured product is an organosilicon compound having structures represented by the following formulas (A) and (B). It is a cured product of a resin composition containing The aforementioned organosilicon compound, The proportion of structures represented by the following formula (B) where m=2 is, The proportion of structures represented by the following formula (B) where m=1 is greater than the proportion of structures represented by the formula (B) below. element. [ka] (In the above formula (A), R 1 is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; R 2 is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; (In the above formula (B), R 3 is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; m is an integer from 1 to 30; R 1 , R 2 , and R 3 If at least any one of them is an alkyl group having 1 to 40 carbon atoms, the alkyl group having 1 to 40 carbon atoms is independently such that at least one hydrogen atom is independently a halogen atom, a cycloalkyl group A having 5 or 6 carbon atoms 12 , or an aryl group A having 6 to 20 carbon atoms 14 and may be replaced, and at least one -CH2- may be independently replaced by -O-, -CO-, a cycloalkylene group A having 5 or 6 carbon atoms 13 , or an arylene group A having 6 to 20 carbon atoms 15 ; R 1 , R 2 , and R 3 If at least any one of them is a cycloalkyl group having 5 or 6 carbon atoms, the cycloalkyl group having 5 or 6 carbon atoms is independently such that at least one hydrogen atom is independently a halogen atom, an alkyl group A having 1 to 40 carbon atoms 21 , a cycloalkyl group A having 5 or 6 carbon atoms 22 , or an aryl group A having 6 to 20 carbon atoms 24 and may be replaced, and at least one -CH2- may be independently replaced by -O- or -CO-;<时间戳解析失败>R 1 , R 2 , and R 3If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group is independently composed of at least one hydrogen atom independently composed of a halogen atom and an alkyl group A having 1-C40 atoms. 31 , a cycloalkyl group A with 5 or 6 carbon atoms 32 , or an aryl group A having 6 to 20 carbon atoms 34 It can be replaced with; Alkyl group A 21 and alkyl group A 31 The group may independently have at least one hydrogen atom replaced by a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH2- may independently have -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; cycloalkyl group A 12 , cycloalkylene group A 13 cycloalkyl group A 22 and cycloalkyl group A 32 It independently requires at least one water The elementary atoms may be independently replaced by halogen atoms, C1-C40 alkyl groups, C5- or C6 cycloalkyl groups, or C6-C20 aryl groups, and at least one -CH2- may be independently replaced by -O-, -CO-; aryl group A 14 , Arylene group A 15 aryl group A 24 and aryl group A 34 (Independently, at least one hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.)

[0007] Item 2. The organosilicon compound consists of a compound represented by the following formula (1): It includes at least the structure represented by the following formula (3): The proportion of structures represented by the following formula (3) where n=2 is, The proportion of structures represented by the following formula (3) where n=1 is greater than the proportion of structures where n=1. The element described in item 1. [ka] (In the above formula (1), X includes one or more structures represented by the above formula (2), and does not include any other structures; when X includes two or more structures represented by the above formula (2), the two or more structures may be the same or different; Y 1 This is a single bond or a structure represented by formula (3) above; In equation (2) above, R 1 R in formula (A) is independent of the above. 1 It is synonymous with; R 2 R in formula (A) is independent of the above. 2 It is synonymous with; Y 2 This is a single bond or a structure represented by formula (3) above, and Y 1 It may be the same as or different from; In equation (3) above, R 3 R in formula (B) is independent of the above. 3 This is equivalent to; n is an integer between 1 and 30.

[0008] Item 3. The element according to item 1 or 2, wherein the resin composition comprises a compound having a functional group that can chemically bond with the organosilicon compound.

[0009] Item 4. The device according to Item 3, wherein the compound having the functional group is a compound having two or more of one or more groups represented by the following formulas (F-1) to (F-8). [ka] (In the above equations (F-1) to (F-8), R 4(* represents a bond site.)

[0010] Item 5. The device according to Item 4, wherein the compound having the functional group comprises one or more silicon compounds selected from hydrolyzable organosilane compounds represented by the following formula (10) and partially hydrolyzed condensates of said hydrolyzable organosilane compounds. R 5 4-a SiZ a (10) (In the above equation (10), R 5 (i) is independently a C1-C20 alkyl group, a C3-C6 cycloalkyl group, or a C6-C20 aryl group, in which at least one hydrogen atom may be independently substituted with a halogen atom; Z is independently one of the groups represented by formulas (F-1) to (F-8); and a is an integer from 2 to 4.

[0011] Item 6. The element described in Item 5, wherein formula (10) is formula (11) below. R 6 4-b Si(OR) 7 ) b (11) (In the above equation (11), R 6 R is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom; 7(b is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; b is an integer from 2 to 4.)

[0012] Item 7. Further comprising at least one component selected from the group consisting of chips, wafers, and electrodes, The element according to any one of claims 1 to 6, wherein at least a portion of the cured material is in contact with at least one component selected from the group consisting of a chip, a wafer, and an electrode.

[0013] Item 8. A group in which at least a portion of the cured product independently consists of a chip, a wafer, and an electrode. The element according to item 7, which is in contact with at least one member selected from the above.

[0014] Item 9. Having at least one object to be coated, selected from chips and electrodes, and a support substrate for supporting the object to be coated, At least a portion of the object to be coated is covered with the cured material. The element described in item 7 or 8.

[0015] Item 10. An element according to any one of items 1 to 9, having a laminate having a layer structure of three or more layers, wherein at least one of the intermediate layers included in the laminate is the cured product.

[0016] Item 11. Electronic equipment having an element as described in any one of items 1 to 10.

[0017] Item 12. Includes a step of applying a resin composition to form a cured product, The resin composition is It contains organosilicon compounds having structures represented by the following formulas (A) and (B), The aforementioned organosilicon compound, The proportion of structures represented by the following formula (B) where m=2 is, The proportion of structures represented by the following formula (B) where m=1 is greater than the proportion of structures represented by the formula (B) below. A method for manufacturing an element. [ka] (In the above formula (A), R 1 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; 2 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In the above formula (B), R 3 m is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; m is an integer from 1 to 30; R 1 , R 2 , and R 3 If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. 12 , or an aryl group A having 6 to 20 carbon atoms 14 It may be replaced by at least one -CH2- independently being -O-, -CO-, or a cycloalkylene group A having 5 or 6 carbon atoms. 13 , or an arylene group A having 6 to 20 carbon atoms 15 It can be replaced with; R 1 , R 2 , and R 3 If at least one of them is a cycloalkyl group having 5 or 6 carbon atoms, then the cycloalkyl group having 5 or 6 carbon atoms is independently at least A single hydrogen atom independently forms a halogen atom, and an alkyl group A has 1 to 40 carbon atoms. 21 , a cycloalkyl group A with 5 or 6 carbon atoms 22 , or an aryl group A having 6 to 20 carbon atoms 24 It may be replaced by, and at least one -CH2- may be independently replaced by -O- or -CO-; R 1 , R 2 , and R 3If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group is independently composed of at least one hydrogen atom independently composed of a halogen atom and an alkyl group A having 1-C40 atoms. 31 , a cycloalkyl group A with 5 or 6 carbon atoms 32 , or an aryl group A having 6 to 20 carbon atoms 34 It can be replaced with; Alkyl group A 21 and alkyl group A 31 The group may independently have at least one hydrogen atom replaced by a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH2- may independently have -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; cycloalkyl group A 12 , cycloalkylene group A 13 cycloalkyl group A 22 and cycloalkyl group A 32 The group A may be independently replaced by at least one hydrogen atom with a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH2- may be independently replaced by -O-, -CO-, etc. 14 , Arylene group A 15 aryl group A 24 and aryl group A 34 (Independently, at least one hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.) [Effects of the Invention]

[0018] According to the present invention, it is possible to provide an element having a cured product of a resin composition containing an organosilicon compound containing a silsesquioxane skeleton, wherein the thickness variation of the cured product is small. [Brief explanation of the drawing]

[0019] [Figure 1] This diagram schematically represents a cross-section of an element, which is one embodiment of the present invention. [Figure 2] This diagram schematically represents a cross-section of an element, which is one embodiment of the present invention. [Figure 3] This diagram schematically represents a cross-section of an element, which is one embodiment of the present invention. [Figure 4] This diagram schematically represents a cross-section of an element, which is one embodiment of the present invention. [Figure 5] This diagram schematically represents a cross-section of an element, which is one embodiment of the present invention. [Figure 6] This figure shows an example of the process for forming a hardened product. [Modes for carrying out the invention]

[0020] The present invention will be described in detail below. The following descriptions of constituent elements may be based on representative embodiments or specific examples, but the present invention is not limited to such embodiments. In this specification, numerical ranges represented by "~" mean a range that includes the numbers written before and after "~" as the lower and upper limits. Also, in this specification, "hydrogen" in the description of structural formulas means "hydrogen atom (H)". Similarly, "carbon atom (C)" may be referred to as "carbon". In this specification, "adjacent groups" means two groups each bonded to one atom, or two groups each bonded to two adjacent atoms in the structural formula (two atoms directly bonded by a covalent bond). Furthermore, in this specification, the expression "A or B" may be read as "at least one selected from the group consisting of A and B." Furthermore, in this specification, when considering the structure "ABC", the structure in which B is a single bond refers to the structure "AC".

[0021] The compound represented by formula (1) is sometimes abbreviated as compound (1). At least one compound selected from a group of substances may be abbreviated as compound (1). "Compound (1)" means one compound represented by formula (1), a mixture of two compounds, or a mixture of three or more compounds. These rules also apply to compounds represented by other formulas. In the chemical formula of a compound, the substituent R X1 symbol is used for a plurality of compounds. In these compounds, the two groups represented by any two Rs X1 may be the same or different. For example, in compound (2-1), R X1 is a phenyl group, and in compound (2-2), R X1 is a phenyl group in some cases. In compound (2-1), R X1 is a phenyl group, and in compound (2-2), R X1 is a cyclohexyl group in some cases. This rule also applies to symbols such as R X2 , R X3 , etc. Also, in the chemical formula of a compound, the symbol of the repeating unit n 5 is used for a plurality of compounds. In these compounds, the two numerical values represented by any two ns 5 may be the same or different. This rule also applies to symbols such as j 3 , k 2 , etc. The expression "at least one 'A'" means that the number of 'A's is arbitrary. The expression "at least one 'A' may be replaced by 'B'" means that when the number of 'A's is one, the position of 'A' is arbitrary, and when the number of 'A's is two or more, their positions can be selected without limitation. This rule also applies to the expression "at least one 'A' has been replaced by 'B'". The expression "at least one 'A' may be replaced by 'B', 'C', or 'D'" means that when any 'A' is replaced by 'B', when any 'A' is replaced by 'C', and when any 'A' is replaced by 'D', and also when a plurality of 'A's are replaced by at least two of 'B', 'C', and / or 'D'. Note that it does not include the case where two consecutive -CH2- are replaced by -O- to form -O-O-. In an alkyl group or the like, it does not include the case where -CH2- in the methyl moiety (-CH2-H) is replaced by -O- to form -O-H. Alkyl and alkylene may each be a straight-chain group or a branched group in any case. This also applies when any hydrogen in these groups is replaced by a halogen or a cyclic group, etc., and when any -CH2- is replaced by -O-, -CO-, a cycloalkylene group, an arylene group, etc. In addition, in this specification, 1 , R 2 , and R 3 the expression "at least any one of" means that it represents at least any one of a plurality of R 1 , a plurality of R 2 , and a plurality of R 3 . Specifically, the object may be, for example, only one R 1 among a plurality of R 1 . [[ID=)19]] [[ID=2)0]]A halogen atom means a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom. [[ID=2)1]] [[ID=2)2]]Also, although this specification describes a plurality of embodiments, various conditions in each embodiment can be applied to each other within the applicable range. [[ID=2)3]] [[ID=2)4]]

[0022] [[ID=2)5]] An element according to one embodiment of the present invention has a cured product, the cured product being a cured product of a resin composition containing an organosilicon compound having a structure represented by the following formulas (A) and (B), wherein the proportion of the organosilicon compound having a structure represented by the following formula (B) with m=2 is greater than the proportion of the structure represented by the following formula (B) with m=1. The conditions for the following formulas (A) and (B) will be described later.

[0023] [ka]

[0024] The inventors have conducted thorough research and found that the viscosity of the resin composition used in the production of the cured product in this embodiment is stable, and that the moldability when the cured product is formed in layers is excellent. Specifically, because the difference in viscosity depending on where the resin composition is applied is small, there is less variation in the liquid level of the application liquid, making it easier to achieve a flat surface, and thus it is possible to obtain a cured product with small variations in thickness. By reducing the variation in the thickness of the cured product, the stability of the properties of the cured product, and consequently the stability of the properties of the element having the cured product, can be improved. The inventors speculate that the reason for the small difference in viscosity depending on where the above resin composition is applied is as follows. The structure represented by formula (B) above with m=2 has a weaker cohesive force (attractive force) than the structure represented by formula (B) above with m=1. Therefore, if the number of structures represented by formula (B) above with m=2 is greater than the number of structures represented by formula (B) above with m=1, the aggregation of organosilicon compounds (component A) can be suppressed. This aggregation results in non-uniform viscosity in the resin composition, causing differences in viscosity depending on the location of the applied resin composition. Furthermore, the inventors have confirmed that in the cured product embodiment, the difference in viscosity of the resin composition due to the application speed is smaller compared to the cured product embodiment of the conventional embodiment. The inventors speculate that the above aggregation also affects this difference in viscosity due to the application speed. Specifically, it is speculated that when aggregates are contained in the resin composition, if the application speed is slow, aggregation occurs due to the attractive force between components A, resulting in high viscosity, and if the application speed is fast, the attractive force of components A is overcome, the aggregation is released, and the viscosity is lower. Therefore, in embodiments using conventional organosilicon compounds that are prone to aggregation, differences in the viscosity of the resin composition occur depending on the application speed, and consequently, on the application site. Conversely, in embodiments containing component A according to this embodiment, aggregation is suppressed, and it is presumed that the difference in viscosity due to the application speed (application site) is small. Therefore, by using the above resin composition, it is possible to obtain a cured product with excellent heat resistance and insulation properties, as well as a product with minimal variation in thickness, which allows the cured product to be suitably used as a component of an element. In this specification, a small variation in the thickness of the cured product is also expressed as having excellent flatness.

[0025] [Composition of the hardened material] The cured material may be provided as a single layer, or it may be provided in contact with other members. Furthermore, if it is provided in contact with other members, the other members may be provided in contact with only one side of the cured material, or with both sides. Specific forms of the cured material will be described later. For example, a resin assembly containing the raw materials for the cured material in one member... When a resin composition is cured after applying a material and then bringing another component into contact with it, if the thickness varies in different locations, gaps and voids may occur in the thinner areas, potentially leading to a deterioration of the element's properties. In other words, if the viscosity difference of the applied resin composition is small, the variation in the properties of the cured product after curing will also be small. Therefore, with the cured product according to this embodiment, stable properties are more likely to be obtained, and consequently, with any composition containing this cured product, stable properties are more likely to be obtained.

[0026] The cured product is a cured product of a resin composition containing organosilicon compounds having structures represented by formulas (A) and (B).

[0027] [Organosilicon compound (component A)] ·Aspect 1 The organosilicon compounds described below will be explained using formulas (A) and (B), and the embodiments of the organosilicon compounds described in this section will also be referred to as "Embodiment 1". While numerous embodiments of organosilicon compounds are shown in this specification, the conditions in these embodiments can be arbitrarily combined with each other to the extent applicable.

[0028] [ka]

[0029] In this specification, "organosilicon compounds having structures represented by formulas (A) and (B)" is a concept consisting of a group of organosilicon compounds having structures represented by multiple formulas (A) and (B). In this specification, the "organosilicon compounds having structures represented by formulas (A) and (B)" included in the resin composition may be one type or two or more types. Furthermore, the structure represented by formula (B) with m=2 refers to the "structure represented by formula (B) with m=2" included in all of the above organosilicon compounds included in the resin composition. Similarly, the structure represented by formula (B) with m=1 refers to the "structure represented by formula (B) with m=1" included in all of the above organosilicon compounds included in the resin composition. Furthermore, the organosilicon compound includes at least the structure represented by formula (B), specifically at least the structure represented by formula (B) where m=2, but the structure represented by formula (B) may be sandwiched between the structures represented by formula (A) or may be not sandwiched between the structures represented by formula (A).

[0030] In this specification, the structure represented by the above formula (B) with m=2 is (-O-Si(-R 3 This refers to a structure where the number of consecutive structures represented by )2-) is 2. In other words, (-O-Si(-R 3 The structure in which )2-) is linked three times in a row is represented by equation (B) where m=1 and Although it contains a structure where m=2, it is treated as a structure represented by equation (B) where m=3. Similarly, the structure represented by the above equation (B) where m=1 is (-O-Si(-R 3 This refers to a structure where the number of consecutive structures represented by )2-) is 1. In other words, (-O-Si(-R 3 A structure in which )2-) is repeated is not treated as a structure represented by equation (B) where m=1.

[0031] The inventors conducted thorough research and found that the resin composition containing the above-mentioned organosilicon compound exhibits a small rate of viscosity change over time. The inventors speculate on the reason for this as follows: If the proportion of structures represented by equation (B) with m=2 is greater than the proportion of structures represented by equation (B) with m=1, aggregation of organosilicon compounds can be suppressed, and the rate of change in viscosity over time can be reduced. Therefore, the above resin composition not only yields a cured product with excellent heat resistance and insulation properties because it contains a compound with a silsesquioxane skeleton, but also has excellent storage properties as a resin composition because its viscosity changes over time at a low rate.

[0032] In equation (A), R 1From the viewpoint of ease of synthesis, and from the viewpoint of being able to adjust various properties such as heat resistance, refractive index, mechanical properties, and optical properties (hereinafter collectively referred to as "the viewpoint of ease of synthesis and adjustment of various properties"), these are, independently, alkyl groups having 1 to 40 carbon atoms, cycloalkyl groups having 5 or 6 carbon atoms, or aryl groups having 6 to 20 carbon atoms; R 2 This is the R mentioned above. 1 From a similar viewpoint, these are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups.

[0033] In the above formula (B), R 3 This is the R mentioned above. 1 From a similar viewpoint, they are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In the above formula (B), m is an integer from 1 to 30, but is preferably from 2 to 25, and more preferably from 2 to 20, from the viewpoint of ease of composition.

[0034] R 1 When R is an aryl group, the following effects can be obtained: improved heat resistance, improved refractive index, and improved rigidity (allowing for adjustment of mechanical properties). 1 When the alkyl group is used, a moderate and well-balanced refractive index is easily obtained (it is possible to lower the refractive index compared to when it is an aryl group), and toughness is easily improved (mechanical properties can be adjusted). For the effects obtained when these aryl or alkyl groups are used, see R 2 or R 3 The same applies when it is an aryl group or an alkyl group.

[0035] Below, R 1 , R 2 , and R 3 The substituents that can be present are described below, and these groups make it easier to ensure ease of synthesis while maintaining a small rate of change in viscosity over time when used in a resin composition.

[0036] R 1 , R 2 , and R 3 If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. 12 , or an aryl group A having 6 to 20 carbon atoms 14 It may be replaced by at least one -CH2- independently being -O-, -CO-, or a cycloalkylene group A having 5 or 6 carbon atoms. 13 , or an arylene group A having 6 to 20 carbon atoms 15 It can be replaced with this.

[0037] R 1 , R 2 , and R 3 If at least one of the C5 or C6 cycloalkyl groups is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1-C40 alkyl group A 21 , a cycloalkyl group A with 5 or 6 carbon atoms 22 , or an aryl group A having 6 to 20 carbon atoms 24 Place They may be replaced, and at least one -CH2- may be independently replaced with -O- or -CO-.

[0038] R 1 , R 2 , and R 3 If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group is independently composed of at least one hydrogen atom independently composed of a halogen atom and an alkyl group A having 1-C40 atoms. 31 , a cycloalkyl group A with 5 or 6 carbon atoms 32 , or an aryl group A having 6 to 20 carbon atoms 34 It can be replaced with this.

[0039] Alkyl group A 21 and alkyl group A 31Independently, at least one hydrogen atom may be independently replaced by a halogen atom, a carbon-5 or carbon-6 cycloalkyl group, or a carbon-6 to carbon-20 aryl group, and at least one -CH2- may be independently replaced by -O-, -CO-, a carbon-5 or carbon-6 cycloalkylene group, or a carbon-6 to carbon-20 arylene group. Cycloalkyl group A 12 , cycloalkylene group A 13 cycloalkyl group A 22 and cycloalkyl group A 32 The hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH2- may be independently replaced by -O- or -CO-. Aryl group A 14 , Arylene group A 15 aryl group A 24 and aryl group A 34 The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.

[0040] Furthermore, organosilicon compounds having the structures represented by formulas (A) and (B) above are preferably free of vinyl groups or alkenyl groups, from the viewpoint of minimizing the risk of polymerization reactions occurring and affecting viscosity.

[0041] Furthermore, organosilicon compounds must contain at least one structure represented by formula (B) with m=2, while they may or may not contain one structure represented by formula (B) with m=1. If no structure represented by formula (B) with m=1 is included, the proportion of such structures will be 0%.

[0042] [Aspect 2] The organosilicon compound according to the above-described embodiment 1 comprises a compound represented by the following formula (1), and contains at least a structure represented by the following formula (3), wherein the proportion of structures represented by the following formula (3) with n=2 is greater than the proportion of structures represented by the following formula (3) with n=1. This embodiment is also referred to as "embodiment 2". The proportion of structures with n=1 or n=2 represents the ratio of the number of structures represented by the above formula (B) with m=1 or m=2 to the total number of structures represented by the above formula (B).

[0043] [ka]

[0044] In the above formula (1), X includes one or more structures represented by the above formula (2), and does not include any other structures; when X includes two or more structures represented by the above formula (2), the two or more structures may be the same or different; Y 1 This is a single bond or a structure represented by formula (3) above; In equation (2) above, R 1 R in equation (A) above is independent of R 1 It is synonymous with; R 2 R in equation (A) above is independent of R 2 It is synonymous with; Y 2 This is a single bond or a structure represented by formula (3) above, and Y 1 It may be the same as or different from; In equation (3) above, R 3 R in equation (B) above is independent of the others. 3 This is synonymous; from the viewpoint of ease of composition, n is an integer from 1 to 30, but is preferably an integer from 2 to 25, and more preferably an integer from 2 to 20. Furthermore, organosilicon compounds contain two or more structures represented by the above formula (2) where X is and two or more Y 2 The structure may be represented by the above formula (3).

[0045] In this specification, the structure represented by the above formula (3) with n=2 is (-O-Si(-R 3 This refers to a structure where the number of consecutive structures represented by )2-) is 2. In other words, (-O-Si(-R 3 A structure in which )2-) is linked three times in a row includes a structure represented by equation (3) where n=1 or 2, but it is treated as a structure represented by equation (3) where n=3. Similarly, the structure represented by the above equation (3) where n=1 is (-O-Si(-R 3 This refers to a structure where the number of consecutive structures represented by )2-) is 1. In other words, (-O-Si(-R 3 A structure in which )2-) is repeated is represented by equation (3) and is not treated as a structure where n=1.

[0046] (Aspect 3) The organosilicon compound according to Embodiment 1 or 2 described above is preferably further satisfied with the following conditions. This embodiment is also referred to as "Embodiment 3".

[0047] R 1 From the viewpoint of ease of synthesis and the ability to obtain various properties such as optical properties, these are independently an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group. R 2 R 1 From a similar viewpoint, they are independently C1-C20 alkyl groups, cyclohexyl groups, or phenyl groups. R 3 R 1 From a similar viewpoint, they are independently alkyl groups having 1 to 20 carbon atoms, or cyclohexyl groups.

[0048] From the viewpoint of maintaining a small rate of change in viscosity over time when used in a resin composition, and ensuring ease of synthesis, the following substituents are preferred among the substituents in the above embodiment 1 or 2.

[0049] R 1 , R 2 , and R 3If at least one of the C1-C20 alkyl groups is an alkyl group having 1 to 20 carbon atoms, then the alkyl group having 1 to 20 carbon atoms may independently have at least one hydrogen atom independently replaced by a fluorine atom, and at least one -CH2- may independently have at least one -O- or -CO- atom replaced by a -O- or -CO-.

[0050] R 1 , R 2 , and R 3 If at least one of the groups is a cyclohexyl group, the cyclohexyl group may be independently replaced by at least one hydrogen atom with a fluorine atom, or by a C1-C20 alkyl group (where at least one hydrogen atom in the alkyl group may be replaced by a fluorine atom, and at least one -CH2- may be independently replaced by -O- or -CO-), or by at least one -CH2- may be independently replaced by -O- or -CO-.

[0051] R 1 , and R 2 If at least one of the groups is a phenyl group, the phenyl group may be independently replaced by at least one hydrogen atom independently of a fluorine atom, or by a C1-C20 alkyl group (where at least one hydrogen atom in the alkyl group may be replaced by a fluorine atom, and at least one -CH2- may be independently replaced by -O- or -CO-).

[0052] (Aspect 4) The organosilicon compound according to Embodiment 3 described above is preferably further satisfied with the following conditions. This embodiment is also referred to as "Embodiment 4".

[0053] R 1 From the viewpoint of ease of synthesis and the ability to obtain various properties such as optical properties, the group is an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group. R 2 R 1 From a similar perspective, the group is an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group. R3 R 1 From a similar perspective, it is an alkyl group having 1 to 20 carbon atoms, or a cyclohexyl group.

[0054] From the viewpoint of maintaining a small rate of change in viscosity over time when used in a resin composition, while also ensuring ease of synthesis, the following substituents are preferred among the substituents in the above embodiment 3.

[0055] R 1 , R 2 , and R 3 If at least one of the groups is an alkyl group having 1 to 20 carbon atoms, then at least one of the alkyl groups having 1 to 20 carbon atoms may be independently replaced by an O- group.

[0056] R 1 , R 2 , and R 3 If at least one of the groups is a cyclohexyl group, the cyclohexyl group may be independently replaced by an alkyl group having 1 to 20 carbon atoms in which at least one -CH2- in the alkyl group may be independently replaced by -O-, and at least one -CH2- may be independently replaced by -O-.

[0057] R 1 , and R 2 If at least one of the groups is a phenyl group, the phenyl group may be independently replaced by at least one hydrogen atom of an alkyl group having 1 to 20 carbon atoms (at least one -CH2- in the alkyl group may be independently replaced by -O-).

[0058] (Aspect 5) The organosilicon compound according to the above-described embodiment 4 is preferably further satisfied with the following conditions. This embodiment is also referred to as "embodiment 5".

[0059] R 1From the viewpoints of ease of synthesis and adjustment of various properties, it is a cyclohexyl group or a phenyl group in which at least one hydrogen atom may be replaced by an alkyl group having 1 to 20 carbon atoms. R 2 is the same as the above R 1 From the same viewpoints, it is an alkyl group having 1 to 20 carbon atoms or a phenyl group in which at least one hydrogen atom may be replaced by an alkyl group having 1 to 20 carbon atoms. R 3 is the same as the above R 1 From the same viewpoints, it is an alkyl group having 1 to 20 carbon atoms.

[0060] (Aspect 6) The organosilicon compound according to Aspect 5 described above preferably further satisfies the following conditions. In addition, the aspect of this item is also referred to as "Aspect 6".

[0061] R 1 From the viewpoints of ease of synthesis and adjustment of various properties, it is a phenyl group in which at least one hydrogen atom may be replaced by an alkyl group having 1 to 20 carbon atoms. R 3 is the same as the above R 1 From the same viewpoints, it is an alkyl group having 1 to 20 carbon atoms.

[0062] (Aspect 7) The organosilicon compound according to Aspect 6 described above preferably further satisfies the following conditions. In addition, the aspect of this item is also referred to as "Aspect 7".

[0063] R 2 and R 3 From the viewpoints of ease of synthesis and adjustment of various properties, it is an alkyl group having 1 to 6 carbon atoms.

[0064] (Aspect 8) The organosilicon compound according to Aspect 7 described above preferably further satisfies the following conditions. In addition, the aspect of this item is also referred to as "Aspect 8".

[0065] R 1 From the viewpoints of ease of synthesis and adjustment of various properties, it is a phenyl group. R 2 and R 3 From the viewpoint of ease of synthesis and adjustment of various properties, it is a methyl group. The above describes embodiments 1 to 8.

[0066] The structure of organosilicon compounds is, 1 This can be identified by 1H-NMR analysis. This identification also allows for the analysis of the proportion of structures represented by formula (B) above with m=2 (in the case of embodiment 2, the proportion of structures represented by formula (3) with n=2) and the proportion of structures with m=1 (in the case of embodiment 2, the proportion of structures represented by formula (3) with n=1). For example, the proportion of structures represented by formula (B) with m=2 is the proportion when the proportion of all structures represented by formula (B) is set to 100%. In other words, the denominator of this proportion is the total number of structures represented by formula (B) with different numbers of m when an organosilicon compound having structures represented by formulas (A) and (B) is composed of multiple types of organosilicon compounds with different numbers of m. The same applies to the proportion of structures with m=1, and also to the proportion of structures with n=2 and n=1 in embodiment 2.

[0067] When considering the structure represented by formula (B) in the entirety of all organosilicon compounds having structures represented by formulas (A) and (B) contained in the resin composition, the proportion of structures represented by formula (B) with m=2 should be greater than the proportion of structures represented by formula (B) with m=1. The ratio of the proportion of structures represented by formula (B) where m=2 (m=2 / m=1) to the proportion of structures represented by formula (B) where m=1 (m=2 / m=1) is not particularly limited as long as it is greater than 1. However, when the proportion of all structures represented by formula (B) is taken as 100%, from the viewpoint of minimizing the rate of change in viscosity over time when it is made into a resin composition, it is preferable that the proportion of structures where m=1 is 30% or less and m=2 / m=1 is 1.05 or more, and more preferably that the proportion of structures where m=1 is 25% or less and m=2 / m=1 is 1.1 or more. Furthermore, the upper limit of this ratio may be 9.0 or less.

[0068] The ratio of the number of structures represented by formula (B) with m=1 to the total number of structures represented by formula (B) is not particularly limited, but from the viewpoint of ensuring a small rate of change in viscosity over time when made into a resin composition, it is preferably 25% or less, more preferably 23% or less, and even more preferably 20% or less. The proportion of the structure represented by formula (B) with m=2 to the entire structure represented by formula (B) is not particularly limited, but from the viewpoint of ensuring a small rate of change in viscosity over time when it is made into a resin composition, it is preferably 20% or more, more preferably 23% or more, and even more preferably 25% or more. The proportion of structures represented by formula (B) above with m=1 and the proportion of structures represented by formula (B) above with m=2 can be achieved by adjusting the reaction temperature, reaction time, amount of catalyst, solid content concentration, etc.

[0069] Furthermore, if there are multiple types of organosilicon compounds with different structures, as represented by formulas (A) and (B), the "proportion of structures represented by formula (B) with m=2" refers to the proportion of structures with m=2 included in the total number of organosilicon compounds. The same applies to the "proportion of structures represented by formula (B) with m=1".

[0070] There are no particular restrictions on how to make the proportion of structures represented by formula (B) with m=2 greater than the proportion of structures represented by formula (B) with m=1. This can be achieved, for example, by adjusting synthesis conditions such as reaction temperature, reaction time, catalyst amount, and solid content concentration. Specifically, for example, if the reaction temperature is too high or the reaction time is too long, the cleavage of siloxane bonds will proceed, making it easier for the proportion of structures with m=1 to increase. If the reaction temperature is too low or the reaction time is too short, raw materials will remain, and the amount of organosilicon compound obtained will decrease.

[0071] The organosilicon compounds having the structures represented by the above formulas (A) and (B) are, more specifically, organosilicon compounds having the structure represented by the following formula (1-1), The structure includes at least the structure represented by the following formula (1-2), The proportion of the structure represented by the following formula (1-2) is, The proportion of structures represented by the following formula (1-3) is greater than the proportion of structures represented by the above formula (1-3). It may be an organosilicon compound.

[0072] [ka]

[0073] In the above equations (1-1), (1-2), and (1-3), R X1 , R X2 , and R X3 These are, independently, the R mentioned above. 1 , R 2 , and R 3 It is synonymous with [the above]. n 1 Independently, from the viewpoint of ease of composition, is 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. n 2 Independently, from the viewpoint of ease of composition, is 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. n 3 Independently, from the viewpoint of ease of composition, is 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. j 1 These are independently either 0 or 1. j 2 These are independently either 0 or 1. j 1 +j 2 It is either 1 or 2. k 1 This represents an integer between 1 and 1,000. n in equation (1-1) above 1 , n 2 , or n 3When it is 2, the structure represented by (-O-Si(-R X3 )2-) corresponding to these symbols becomes Formula (1-2), and n 1 , n 2 , or n 3 When it is 1, the structure represented by (-O-Si(-R X3 )2-) corresponding to these symbols becomes Formula (1-3). In addition, in this specification, the structure represented by the above Formula (1-2) means a structure in which the number of consecutive (-O-Si(-R X3 )2-) structures is 2. That is, a structure in which (-O-Si(-R X3 )2-) is connected in three consecutive units includes the structure represented by Formula (1-3) or (1-2), but is not treated as the structure represented by Formula (1-3) or (1-2). Similarly, the structure represented by the above Formula (1-3) means a structure in which the number of consecutive (-O-Si(-R X3 )2-) structures is 1. That is, a structure in which (-O-Si(-R X3 )2-) is consecutive is not treated as the structure represented by Formula (1-3).

[0074] The organosilicon compound having the structure represented by the above Formula (1-1) more specifically includes an embodiment containing one or more compounds selected from the group consisting of the compounds represented by the following Formulas (2-1), (2-2), and (2-3). Similarly in this case, it includes at least the structure represented by the above Formula (1-2), and the ratio of the structure represented by the above Formula (1-2) is larger than the ratio of the structure represented by the above Formula (1-3). [[ID=CI]] [[ID=CI]]

[0075] [[ID=CI]] [[ID=CI]]

Chemical formula

[0076]

Chemical formula

[0077]

Chemical formula

[0078] In the above equations (2-1), (2-2), and (2-3), R X1 , R X2 , and R X3 These are independently R in equations (1-1), (1-2), and (1-3) above, respectively. X1 , R X2 , and R X3 It is synonymous with [the above]. n 4 , n 5 , n 6 , j 3 , j 4 , and k 2 The conditions are independent of each other, in the above equation (1-1) n 1 , n 2 , n 3 , j 1 , j 2 , and k 1 The same conditions can be applied.

[0079] The embodiment comprising one or more compounds selected from the group consisting of compounds represented by the above formulas (2-1), (2-2), and (2-3) may more specifically be, for example, an embodiment comprising one or more compounds selected from the group consisting of compounds represented by the above formulas (2-2) and (2-3).

[0080] Furthermore, organosilicon compounds having the structures represented by formulas (A) and (B) above may be, for example, compounds represented by the following formula (1'). In this case as well, the compound contains at least the structure represented by formula (B) above, and the proportion of structures represented by formula (B) with m=2 is greater than the proportion of structures represented by the following formula (B) with m=1.

[0081] [ka]

[0082] In the above equation (1'), R P1 , R P2 , and R P3 These are, independently, the R mentioned above.1 , R 2 , and R 3 It is synonymous with n. P1 Independently, from the viewpoint of ease of synthesis, the above-mentioned n 1 It is synonymous with n P2 The above n is independent of the above 1 It is synonymous with [the above]. In equation (1') above, k represents an integer between 1 and 1,000. Note that when specifying the structure of organosilicon compounds, the weight-average molecular weight or number-average molecular weight shown below may be used instead of k.

[0083] The weight-average molecular weight of the organosilicon compound is not particularly limited, but is preferably 3,000 to 700,000, more preferably 5,000 to 600,000, and even more preferably 7,000 to 500,000. When the weight-average molecular weight is within the above range, the resin composition containing the organosilicon compound can be adjusted to a viscosity that facilitates stirring and coating. The weight-average molecular weight can be adjusted by the reaction temperature, the amount of raw materials, the amount of catalyst used if one is used, etc.

[0084] The weight-average molecular weight mentioned above can be measured by gel permeation chromatography (GPC) analysis. An example of specific measurement conditions for GPC analysis is shown below. (Example of measurement conditions for GPC analysis) Columns: Two Shodex KF805L and Shodex KF804L columns (manufactured by Resona Co., Ltd.) connected in series. Mobile phase: THF Flow rate: 1.0ml / min Temperature: 40℃ Detector: RI Molecular weight standard sample: Polystyrene with known molecular weight

[0085] [NMR (Nuclear Magnetic Resonance Spectrum)] As mentioned above 1 For 1H-NMR measurements, for example, the JNM-ECZ500R manufactured by JEOL Ltd. can be used. 1In 1H-NMR measurements, the sample is dissolved in a deuterated solvent such as deuterated acetone (manufactured by Wako Pure Chemical Industries, Ltd.), and measurements can be performed at room temperature, 500 MHz, and with 16 integration cycles. 1 From the integration ratio of the H-NMR spectrum, the proportion of structures represented by equation (B) with m=2 and the proportion of structures represented by equation (B) with m=1 can be calculated.

[0086] [Viscosity measurement] The viscosity of the resin composition containing the above compound can be measured using, for example, an E-type rotational viscometer manufactured by Toki Sangyo Co., Ltd. This measurement can be performed, for example, under conditions of 25°C and 20 rpm.

[0087] [Method for producing organosilicon compounds] The method for producing the organosilicon compounds described above is not particularly limited. An example of a production method is shown below, but it is not limited to this.

[0088] An example of a method for producing organosilicon compounds is a method for producing organosilicon compounds that includes a step of reacting a compound represented by the following formula (4) (a compound containing a silsesquioxane skeleton) with at least one of the compounds represented by the following formula (5) and the following formula (6) at a temperature of 0°C or higher and less than 80°C. Specifically, it is preferable to produce the compounds by polymerizing each of the above components in the presence of a catalyst. The reaction temperature is preferably 20°C or higher and 70°C or lower, from the viewpoint of the weight-average molecular weight of the resulting organosilicon compound and from the viewpoint of the ratio of the proportion of n=2 structures to the proportion of n=1 structures being likely to exceed 1.

[0089] [ka]

[0090] In equation (4) above, R A1 and R A2 The condition is R in equation (A) above. 1 and R 2 The conditions can be applied similarly to each of them. Also, R in equations (5) and (6) above.A3 and R A4 The condition of R in equation (B) above is independent of the condition of R 3 The same conditions can be applied to n in equations (5) and (6) above. A1 and n A2 The condition of can be applied independently to the same condition for m in equation (B) above. That is, R A1 , R A2 , R A3 , R A4 , n A1 , and n A2 These are R in the above-described embodiment 1. 1 , R 2 , R 3 , R 3 The following conditions are met: , m, and m.

[0091] In equation (4) above, R A1 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; A2 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; A7 These are, independently, hydrogen atoms, or -(Si(R B3 )2-O) p -Si(R B3 )2-OH(p independently represents 0 or an integer from 1 to 30); R B3 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In equation (5) above, R A3 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n A1 It is an integer between 1 and 30, preferably between 1 and 6, and more preferably between 1 and 4, from the viewpoint of availability; In the above equation (6), R A4These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n A2 is an integer between 1 and 30; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. B2 , or an aryl group A having 6 to 20 carbon atoms B4 It may be replaced by at least one -CH2- independently being -O-, -CO-, or a cycloalkylene group A having 5 or 6 carbon atoms. B3 , or an arylene group A having 6 to 20 carbon atoms B5 It can be replaced with; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C5 or C6 cycloalkyl groups is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1-C40 alkyl group A C1 , a cycloalkyl group A with 5 or 6 carbon atoms C2 , or an aryl group A having 6 to 20 carbon atoms C4 It may be replaced by, and at least one -CH2- may be independently replaced by -O- or -CO-; R A1 , R A2 , R A3 , R A4 , and R B3 If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group is independently composed of at least one hydrogen atom independently composed of a halogen atom and an alkyl group A having 1-C40 atoms. D1 , a cycloalkyl group A with 5 or 6 carbon atoms D2 , or an aryl group A having 6 to 20 carbon atomsD4 It can be replaced with; Alkyl group A C1 and alkyl group A D1 The group may independently have at least one hydrogen atom replaced by a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH2- may independently have -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; cycloalkyl group A B2 , cycloalkylene group A B3 cycloalkyl group A C2 and cycloalkyl group A D2 The group A may be independently replaced by at least one hydrogen atom with a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH2- may be independently replaced by -O-, -CO-, etc. B4 , Arylene group A B5 aryl group A C4 and aryl group A D4 The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.

[0092] Furthermore, R A1 , R A2 , R A3 , R A4 , R B3 , n A1 , and n A2 The conditions of not only Embodiment 1 described above, but also Embodiments 2 to 7, which are limited embodiments of Embodiment 1, can be applied in the same way.

[0093] The order in which the reaction is carried out is not restricted. The reaction may be carried out by heating a mixture containing all the raw materials, or by adding and mixing each raw material as it is added.

[0094] The ratio of the total amount of at least one of the compounds represented by formula (5) and formula (6) to the total amount of the compound represented by formula (4) is not particularly limited, but it is preferably 0.3 or more, more preferably 0.5 or more, even more preferably 0.7 or more, and preferably 15 or less, more preferably 10 or less, and even more preferably 5 or less in molar ratio. If the ratio is above the lower limit of the above range, it is easier to obtain an organosilicon compound with flexibility. If the ratio is below the upper limit of the above range, it is easier to obtain an organosilicon compound with high heat resistance.

[0095] The compound represented by formula (4) above can be obtained, for example, by reacting the compound represented by formula (7) below with the compound represented by formula (8) below and hydrolyzing them, as described in Japanese Patent Publication No. 2006-222207. Here, X represents a halogen atom or a hydrogen atom. The compound represented by formula (7) can also be obtained by hydrolyzing and condensing the compound represented by formula (9) in the presence of sodium hydroxide and water, as described in Japanese Patent Publication No. 2006-222207.

[0096] [ka]

[0097] In equations (7) to (9) above, R A1 and R A2 These are R in equations (4) to (6) above, respectively. A1 and R A2 It is synonymous with [the above].

[0098] The reactions of the compounds represented in (4) to (6) above typically use acids or bases as catalysts. In the method for producing organosilicon compounds described above in this embodiment, an acid is preferred as a catalyst, considering the stability of silsesquioxane during the reaction. Examples of acid catalysts include: Examples include hydrochloric acid, phosphoric acid, toluenesulfonic acid, methanesulfonic acid, trifluoromethanesulfonic acid, sulfuric acid, fluorosulfuric acid, nitric acid, acetic acid, activated clay, or cation exchange resins such as sulfonic acid-based ion exchange resins (commercial products include RCP-160M ​​(strong acid cation exchange resin, manufactured by Mitsubishi Chemical Corporation)). Among these, sulfuric acid, methanesulfonic acid, trifluoromethanesulfonic acid, activated clay, or cation exchange resins are preferred, with sulfuric acid being more preferred. Furthermore, the shape of the catalyst is not particularly limited, but from the viewpoint of reaction rate, it is preferable to be a liquid rather than a solid. The amount of catalyst used (or its content in a mixture) is not particularly limited, as long as it is sufficient to promote the polymerization reaction. From the viewpoint of promoting the reaction, the amount of catalyst is preferably 0.5% by mass or more, more preferably 0.7% by mass or more, and even more preferably 0.9% by mass or more, relative to the total mass of the raw materials of the organosilicon compound. Furthermore, from the viewpoint of cost-effectiveness and polymerization stability, it is preferably 40% by mass or less, preferably 20% by mass or less, and more preferably 10% by mass or less.

[0099] The above reaction is preferably carried out using a solvent. The solvent is not particularly limited as long as it is capable of dissolving the compound represented by formula (4) above, as well as at least one of the compounds represented by formula (5) above and the compound represented by formula (6) above, and does not react with the catalyst when a catalyst is used. Examples of such solvents include hydrocarbon solvents such as butane, hexane, heptane, octane, or cyclohexane; aromatic hydrocarbon solvents such as benzene, toluene, xylene, mesitylene, or anisole; ether solvents such as diethyl ether, diisopropyl ether, 1,2-dimethoxyethane, tetrahydrofuran (THF), 2-methyltetrahydrofuran (2MTHF), 4-methyltetrahydropyran (MTHP), cyclopentyl methyl ether (CPME), or dioxane; halogenated hydrocarbon solvents such as methylene chloride, chloroform, or carbon tetrachloride; ester solvents such as ethyl acetate; glycol ester solvents such as propylene glycol monomethyl ether acetate (PGMEA); sulfur-containing or nitrogen-containing solvents such as dimethylformamide (DMF), dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP), or pyridine; alcohol solvents such as methanol, ethanol, isopropanol, or butanol; and ketone solvents such as acetone or methyl ethyl ketone. Among these, toluene, xylene, mesitylene, anisole, THF, 2MTHF, MTHP, or CPME are preferred, and toluene, MTHP, or CPME are more preferred. The solvent may be a single solvent or two or more solvents. The amount of solvent used is not particularly limited and may be set appropriately depending on the size of the reactor used and the amount of components to be dissolved. However, for example, the total content of the compound represented by formula (4) above, and at least one of the compounds represented by formula (5) above and formula (6) below is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and even more preferably 40 to 60% by mass.

[0100] Furthermore, the reactions of the compounds represented by (4) to (6) above may be carried out with the addition of water.

[0101] The reactions of the compounds represented by (4) to (6) above may be carried out using other components, as long as they allow for the production of the organosilicon compounds described above.

[0102] The reaction temperature should be between 0°C and 80°C, but preferably between 10°C and 75°C, more preferably between 15°C and 70°C, and even more preferably between 20°C and 70°C, from the viewpoint of making the proportion of structures represented by formula (B) with m=2 greater than the proportion of structures represented by formula (B) with m=1 in the target product group.

[0103] The reaction time is not particularly limited; for example, it may be between 0.5 hours and 48 hours, between 1 hour and 40 hours, or between 2 hours and 30 hours.

[0104] The reaction atmosphere is not particularly limited; for example, the reaction may be carried out in the atmosphere or in the presence of an inert gas such as nitrogen or argon.

[0105] For more specific methods of synthesizing organosilicon compounds, refer to the methods described in, for example, Japanese Patent Publication No. 2010-116464 and Japanese Patent Publication No. 2020-90572.

[0106] The content of organosilicon compounds in the resin composition is not particularly limited, but it is preferably 5% by mass or more and 90% by mass or less, more preferably 10% by mass or more and 85% by mass or less, and even more preferably 15% by mass or more and 80% by mass or less, based on 100% by mass of the resin composition. To obtain the desired film thickness after coating, it is preferable that the content is above the lower limit of the above range. Also, from the viewpoint of solubility, it is preferable that the content is below the upper limit of the above range.

[0107] The resin composition may also contain components other than the organosilicon compounds described above, such as a compound (component B) having a functional group that can chemically bond with component A, which will be described later.

[0108] [Compounds having functional groups that can chemically bond with organosilicon compounds] The resin composition may contain components other than the organosilicon compound (component A) described above. For example, the resin composition may contain a compound (component B) having a functional group that can chemically bond with component A. In particular, if component B has two or more functional groups that can chemically bond with component A, component B acts as a crosslinking agent, so that a crosslinked product (siloxane polymer) of component A bonded via component B can be obtained. Component B may be used alone or in combination of two or more types.

[0109] Component B, which has a functional group that can chemically bond with component A, is a compound having two or more of one or more of the groups represented by the following formulas (F-1) to (F-8).

[0110] [ka]

[0111] In the above equations (F-1) to (F-8), R 4 It independently contains at least one hydrogen atom. A C1-C20 alkyl group in which one hydrogen atom may be independently substituted with a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently substituted with a halogen atom; * represents a bonding site. Of the above groups, groups that can take on either a linear or branched chain structure may take either a linear or branched chain structure.

[0112] R 4The functional group is not particularly limited as long as it is independently a hydrogen atom, a C1-C20 alkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently substituted with a halogen atom. However, from the viewpoint of reactivity with component A, it is preferably a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a butyl group, and is particularly preferably a hydrogen atom, a methyl group, or an ethyl group. Of the above functional groups, the propyl group or butyl group may have either a linear or branched structure.

[0113] From the viewpoint of curability and viscosity change rate over time, among the groups represented by the above formulas (F-1) to (F-8), one or more groups represented by (F-1) to (F-6) are preferred, and one or more groups represented by (F-2) and (F-6) are particularly preferred.

[0114] The following describes the more specific structure of component B. Component B can take on either a linear or branched structure, and may also have a ring structure.

[0115] From the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, component B preferably contains one or more silicon compounds from among the hydrolyzable organosilane compounds represented by the following formula (10) and the partially hydrolyzed condensates of said hydrolyzable organosilane compounds. In this specification, the expression "compound X includes compound Y and compound Z" may also be expressed as "compound X includes compound Y and compound Z". R 5 4-a SiZ a (10) In the above equation (10), R 5F is independently a C1-C20 alkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently substituted with a halogen atom; Z is independently one of the groups represented by the above formulas (F-1) to (F-8); and a is an integer from 2 to 4.

[0116] R 5 The group is not particularly limited as long as it is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom. However, from the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, it is preferable that the group is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and is particularly preferable that the group is an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 20 carbon atoms.

[0117] Furthermore, from the viewpoint of reactivity with component A, the above formula (10) is preferably the following formula (11). R 6 4-b Si(OR) 7 ) b (11) In the above equation (11), R 6 This is an alkyl group having 1 to 20 carbon atoms, in which at least one hydrogen atom may be independently substituted with a halogen atom, and at least one hydrogen atom R is a cycloalkyl group having 3 to 6 carbon atoms, in which case at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms, in which case at least one hydrogen atom may be independently substituted with a halogen atom; 7 b is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; b is an integer from 2 to 4.

[0118] R 6 The group is not particularly limited as long as it is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom. However, from the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, it is preferable that the group is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and is particularly preferable that the group is an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 20 carbon atoms.

[0119] R 7 The elements are not particularly limited as long as they are a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, but from the viewpoint of reactivity with component A, an alkyl group having 1 to 6 carbon atoms is particularly preferred.

[0120] Furthermore, component B may be a compound having one or more structural units of the following formulas (B-1) to (B-4).

[0121] [ka]

[0122] In formulas (B-1) to (B-4), R B1Independently, each of the above formulas (F-1) to (F-8) represents any of the groups, or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently substituted with a halogen atom such as a fluorine, chlorine, or bromine atom, for example, any of chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, or cyanoethyl groups, where * represents a bonding site. Note that among the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure.

[0123] Component B can be obtained, for example, by using at least one compound of the following formulas (B-5) and (B-6) by known methods such as ring-opening polymerization and hydrolysis condensation, or by the method described in International Publication No. 2014 / 098189.

[0124] [ka]

[0125] In formula (B-5), R B2These are independently any of the groups represented by the above formulas (F-1) to (F-8), or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently substituted with a halogen atom such as a fluorine, chlorine, or bromine atom, such as chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure.

[0126] R in equation (B-6) B4 This group is independently any of the groups represented by the above formulas (F-1) to (F-8), or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or at least one hydrogen atom is independently substituted with a halogen atom such as a fluorine, chlorine, or bromine atom. Examples include chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure.

[0127] In formulas (B-5) and (B-6), b 1 is an integer between 3 and 6, and b 2 It is 0 or an integer from 1 to 9.

[0128] More specifically, examples of component B include 1,3-dimethoxytetramethyldisiloxane, 1,5-dimethoxyhexamethyltrisiloxane, polydimethylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with methyldimethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with methyldimethoxysiloxy sealed at both ends of the molecular chain, and methyldimethoxysiloxane with methyldimethoxysiloxy sealed at both ends of the molecular chain. C-bound polydiphenylsiloxane, molecular chain end-to-end methyldimethoxysiloxy-bound dimethylsiloxane / dimethoxysiloxane copolymer, molecular chain end-to-end methyldimethoxysiloxy-bound methylphenylsiloxane / dimethoxysiloxane copolymer, molecular chain end-to-end methyldimethoxysiloxy-bound diphenylsiloxane / dimethoxysiloxane copolymer, molecular chain end-to-end trimethoxysiloxy-bound polydimethylsiloxane, molecular chain end-to-end trimethoxysiloxy-bound polymethylphenylsiloxane, molecular chain end-to-end trimethoxysiloxy-bound polydiphenylsiloxane, molecular chain end-to-end trimethoxysiloxy-bound dimethylsiloxane / dimethoxysiloxane copolymer, molecular chain end-to-end trimethoxysiloxy-bound methylphenylsiloxane / dimethoxysiloxane copolymer, or molecular chain end-to-end trimethoxysiloxy-bound diphenylsiloxane / dimethoxysiloxane copolymer;

[0129] 1,3-Diethoxytetramethyldisiloxane, 1,5-Diethoxyhexamethyltrisiloxane, Polydimethylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Diethoxysiloxane copolymer with dimethylethoxysiloxy sealed at both ends of the molecular chain Body, molecular chain with dimethylethoxysiloxy sealed at both ends: methylphenylsiloxane / diethoxysiloxane copolymer, molecular chain with dimethylethoxysiloxy sealed at both ends: diphenylsiloxane / diethoxysiloxane copolymer, molecular chain with methyldiethoxysiloxy sealed at both ends: polydimethylsiloxane, molecular chain with methyldiethoxysiloxy sealed at both ends: polymethylphenylsiloxane, molecular chain with methyldiethoxysiloxy sealed at both ends: polydiphenylsiloxane Nylsiloxane, dimethylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, triethoxysiloxane Sisiloxy-bound polymethylphenylsiloxane, triethoxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, triethoxysiloxy-bound dimethylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain, triethoxysiloxy-bound methylphenylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain, or triethoxysiloxy-bound diphenylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain;

[0130] 1,3-Dihydroxytetramethyldisiloxane, 1,5-Dihydroxyhexamethyl Trisiloxane, 1,5-dihydroxyhexaphenyltrisiloxane, polydimethylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with methyldihydroxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with methyldihydroxysiloxy sealed at both ends of the molecular chain , molecular chains with methyldihydroxysiloxy sealed dimethylsiloxane / dihydroxysiloxane copolymer, molecular chains with methyldihydroxysiloxy sealed methylphenylsiloxane / dihydroxysiloxane copolymer, molecular chains with methyldihydroxysiloxy sealed diphenylsiloxane / dihydroxysiloxane copolymer, molecular chains with trihydroxysiloxy sealed polydimethylsiloxane, molecular chains with trihydroxysiloxy sealed polymethylphenylsiloxane, molecular chains with trihydroxysiloxy sealed polydiphenylsiloxane, molecular chains with trihydroxysiloxy sealed dimethylsiloxane / dihydroxysiloxane copolymer, molecular chains with trihydroxysiloxy sealed methylphenylsiloxane / dihydroxysiloxane copolymer, or molecular chains with trihydroxysiloxy sealed diphenylsiloxane / dihydroxysiloxane copolymer;

[0131] 1,1,3,3-Tetramethyldisiloxane, 1,1,3,3,5,5-Hexamethyltrisiloxane, Polydimethylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Dihydrogensiloxane copolymer with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Molecular dimethylhydrogensiloxy-bound methylphenylsiloxane / dihydrogensiloxane copolymer, dimethylhydrogensiloxy-bound diphenylsiloxane / dihydrogensiloxane copolymer, methyldihydrogensiloxy-bound polydimethylsiloxane, methyldihydrogensiloxy-bound polymethylphenylsiloxane, methyldihydrogensiloxy-bound polydiphenylsiloxane, methyldihydrogensiloxy-bound polydiphenylsiloxane, methyldihydrogensiloxy-bound dimethylsiloxane / dihydrogensiloxane copolymer, methyldihydrogensiloxy-bound methylphenylsiloxane / dihydrogensiloxane copolymer, methyldihydrogensiloxy-bound diphenylsiloxane / dihydrogensiloxane copolymer, trihydrogensiloxy-bound polydimethylsiloxane, trihydro Polymethylphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain; polydiphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain; dimethylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain; methylphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain; or diphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain;

[0132] 1,3-Diacetoxytetramethyldisiloxane, 1,5-Diacetoxyhexamethyltrisiloxane, Polydimethylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Diacetoxysiloxane copolymer with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / Diacetoxysiloxane copolymer with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Diphenylsiloxane / Diacetoxysiloxane copolymer with dimethylacetoxysiloxy sealed at both ends of the molecular chain, Polydimethylsiloxane with methyldiacetoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with methyldiacetoxysiloxy sealed at both ends of the molecular chain Phenylsiloxane, dimethylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxy sealed at both ends of the molecular chain, polydimethylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain;

[0133] 1,3-Diethylmethylketoximetetramethyldisiloxane, 1,5-Diethylmethylketoximehexamethyltrisiloxane, Polydimethylsiloxane with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Diethylmethylketoximesiloxane copolymer with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain Body, molecular chain with dimethylethylmethylketoximesiloxane sealed methylphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with dimethylethylmethylketoximesiloxane sealed diphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with methyldiethylmethylketoximesiloxane sealed polydimethylsiloxane, molecular chain with methyldiethylmethylketoximesiloxane sealed polymethylphenylsiloxane, molecular chain with methyldiethylmethylketoximesiloxane sealed polydiphenylsiloxane Lusiloxane, molecular chain end-to-end methyldiethylmethylketoximesiloxane-diethylmethylketoximesiloxane copolymer, molecular chain end-to-end methyldiethylmethylketoximesiloxane-diethylmethylketoximesiloxane copolymer, molecular chain end-to-end methyldiethylmethylketoxime-bound diphenylsiloxane-diethylmethylketoximesiloxane copolymer, molecular chain end-to-end triethylmethylketoximesiloxane-bound polydimethylsiloxane, molecular chain end-to-end triethylmethylketoximesiloxane Symsiloxy-bound polymethylphenylsiloxane, triethylmethylketoximesiloxane-bound polydiphenylsiloxane at both ends of the molecular chain, triethylmethylketoximesiloxane-bound dimethylsiloxane / diethylmethylketoximesiloxane copolymer at both ends of the molecular chain, triethylmethylketoximesiloxane-bound methylphenylsiloxane / diethylmethylketoximesiloxane copolymer at both ends of the molecular chain, or triethylmethylketoximesiloxane-bound diphenylsiloxane / diethylmethylketoximesiloxane copolymer at both ends of the molecular chain;

[0134] (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OCH3)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units; (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OC2H5)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OC2H5)SiO 1 / 2 Unit and (CH3)2Si O 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units;

[0135] (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO2 / 2 Units and (CH3)(OH)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units; (CH3)2(CH=CH2)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(CH=CH2)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(CH=CH2)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(CH=CH2)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units;

[0136] (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)HSiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2A copolymer consisting of units, (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 Copolymers consisting of units, and in each of these exemplary compounds, some or all of the methyl groups are substituted with ethyl groups, other alkyl groups such as propyl groups, or aryl groups such as phenyl groups;

[0137] Methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, glycidyltrimethoxysilane, mercaptotrimethoxysilane, mercaptotriethoxysilane, aminopropyltriethoxysilane, tetramethoxysilane, partially condensed tetramethoxysilane, tetraethoxysilane, partially condensed tetraethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, isobutyltrimethoxysilane, ethyltrimethoxysilane, vinyltriethoxysilane, phenyltrimethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, methyltriacetate Examples include toxysilane, vinyltriacetoxysilane, ethyltriacetoxysilane, dibutoxydiacetoxysilane, phenyl-tripropionoxysilane, methyltris(methylethylketoxymo)silane, vinyl-tris-methylethylketoxymosilane, methyltris(methylethylketoxyimino)silane, methyltris(isopropeneoxy)silane, vinyltris(isopropeneoxy)silane, ethyl polysilicate, n-propyl orthosilicate, ethyl orthosilicate, dimethyltetraacetoxydisiloxane, oximesilane, acetoxysilane, acetonoxymesilane, or enoxysilane.

[0138] Furthermore, compounds having one or more structural units of the above formulas (B-1) to (B-4) also include the compounds listed below. 1,6-Bis(trimethoxysilyl)hexane, bis(trialkoxysilylalkyl)amine, bis(dialkoxyalkylsilylalkyl)amine, bis(trialkoxysilylalkyl)N-alkylamine, bis(dialkoxyalkylsilylalkyl)N-alkylamine, bis(trialkoxysilylalkyl)urea, bis(dialkoxyalkylsilylalkyl)urea, bis(3-trimethoxysilylpropyl)amine, bis(3-triethoxysilylpropyl)amine, bis(4-trimethoxysilylbutyl)amine, bis(4- Triethoxysilylbutyl)amine, bis(3-trimethoxysilylpropyl)N-methylamine, bis(3-triethoxysilylpropyl)N-methylamine, bis(4-trimethoxysilylbutyl)N-methylamine, bis(4-triethoxysilylbutyl)N-methylamine, bis(3-trimethoxysilylpropyl)urea, bis(3-triethoxysilylpropyl)urea, bis(4-trimethoxysilylbutyl)urea, bis(4-triethoxysilylbutyl)urea, bis(3-dimethoxymethylsilylpropyl)amine, bis(3-diethyl Bis(4-dimethoxymethylsilylpropyl)amine, bis(4-dimethoxymethylsilylbutyl)amine, bis(4-diethoxymethylsilylbutyl)amine, bis(3-dimethoxymethylsilylpropyl)N-methylamine, bis(3-diethoxymethylsilylpropyl)N-methylamine, bis(4-dimethoxymethylsilylbutyl)N-methylamine, bis(4-diethoxymethylsilylbutyl)N-methylamine, bis(3-dimethoxymethylsilylpropyl)urea, bis(3-diethoxymethylsilylpropyl)urea, bis(4-dimethoxymethylsilyl Bis(4-diethoxymethylsilylbutyl)urea, bis(3-dimethoxyethylsilylpropyl)amine, bis(3-diethoxyethylsilylpropyl)amine, bis(4-dimethoxyethylsilylbutyl)amine, bis(4-diethoxyethylsilylbutyl)amine, bis(3-dimethoxyethylsilylpropyl)N-methylamine, bis(3-diethoxyethylsilylpropyl)N-methylamine, bis(4-dimethoxyethylsilylbutyl)N-methylamine, bis(4-diethoxyethylsilylbutyl)N-methylamine,Bis(3-dimethoxyethylsilylpropyl)urea, bis(3-diethoxyethylsilylpropyl)urea, bis(4-dimethoxyethylsilylbutyl)urea, and / or bis(4-diethoxyethylsilylbutyl)urea; bis(triethoxysilylpropyl)amine, bis(trimethoxysilylpropyl)amine, bis(trimethoxysilylpropyl)urea, bis(triethoxysilylpropyl)urea, or bis(diethoxymethylsilylpropyl)N-methylamine; di or trialkoxysilane-terminated polypropylene Compounds containing organic groups in the main chain, such as alkylsiloxanes, di- or trialkoxysilyl-terminated polyarylalkylsiloxanes, di- or trialkoxysilyl-terminated polypropylene oxides, polyurethanes, or polyacrylates; polyisobutylene; di- or triacetoxy-terminated polydialkyls; polyarylalkylsiloxanes; di- or trioxyiminosilyl-terminated polydialkyls; polyarylalkylsiloxanes; or di- or triacetonoxy-terminated polydialkyls, or polyarylalkyls.

[0139] Examples of commercially available products containing component B include the Cyraplane FM11 series, Cyraplane FM88 series, Cyraplane FM99 series, and Cyraplane FM08 series (all product names) manufactured by JNC Corporation, the SR series (product name) manufactured by Konishi Chemical Industry Co., Ltd., MKC Silicate MS57 (product name), MKC Silicate MS51 (product name) (average tetramethoxysilane pentamer), MKC Silicate MS56, and MS56S (all product names) manufactured by Mitsubishi Chemical Corporation, and Methyl Silicate 51 (average tetramethoxysilane tetramer), Methyl Silicate 53 (average tetramethoxysilane heptomer), Ethyl Silicate 40 (average tetraethoxysilane pentamer), or Ethyl Silicate 48 (average tetraethoxysilane decaper) manufactured by Colcoat Co., Ltd.

[0140] Specifically, a preferred example of component B is having one or more of the structures of the above formulas (B-1) to (B-4), and having at least two or more R in the same formula. B1 However, it is preferable that it be one of the above formulas (F-1) to (F-8).

[0141] More specifically, examples of preferred component B include 1,3-dimethoxytetramethyldisiloxane, 1,5-dimethoxyhexamethyltrisiloxane, and dimethylmethyl Sisiloxy-bound polydimethylsiloxane, dimethylmethoxysiloxy-bound polymethylphenylsiloxane at both ends of the molecular chain, dimethylmethoxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, dimethylmethoxysiloxy-bound dimethylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain, dimethylmethoxysiloxy-bound methylphenylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain, dimethylmethoxysiloxy-bound diphenylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain, Polydimethylsiloxane with trimethoxysiloxy sealed at both ends of the subchain, polymethylphenylsiloxane with trimethoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with trimethoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dimethoxysiloxane copolymer with trimethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dimethoxysiloxane copolymer with trimethoxysiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / dimethoxysiloxane copolymer with trimethoxysiloxy sealed at both ends of the molecular chain;

[0142] 1,3-Diethoxytetramethyldisiloxane, 1,5-Diethoxyhexamethyltrisiloxane, Polydimethylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / diethoxysiloxane copolymer with dimethylethoxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / diethoxysiloxane copolymer with dimethylethoxysiloxy sealed at both ends of the molecular chain, Diphenylsiloxane / diethoxysiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain Copolymers, diphenylsiloxane / diethoxysiloxane copolymers with methyldiethoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / diethoxysiloxane copolymers with triethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diethoxysiloxane copolymers with triethoxysiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / diethoxysiloxane copolymers with triethoxysiloxy sealed at both ends of the molecular chain;

[0143] 1,3-Dihydroxytetramethyldisiloxane, 1,5-Dihydroxyhexamethyltrisiloxane, 1,5-Dihydroxyhexaphenyltrisiloxane, Polydimethylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, both ends of the molecular chain Dimethylhydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer, trihydroxysiloxy-bound polydimethylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound polymethylphenylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound dimethylsiloxane / dihydroxysiloxane copolymer, trihydroxysiloxy-bound methylphenylsiloxane / dihydroxysiloxane copolymer at both ends of the molecular chain, or trihydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer at both ends of the molecular chain;

[0144] 1,1,3,3-Tetramethyldisiloxane, 1,1,3,3,5,5-Hexamethyltrisiloxane, Polydimethylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Dihydrogensiloxane copolymer with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / Dihydrogensiloxane copolymer with dimethylhydrogensiloxy sealed at both ends of the molecular chain, Dimethylhydrogensiloxy sealed at both ends of the molecular chain Diphenylsiloxane / dihydrogensiloxane copolymer, polydimethylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain;

[0145] Methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, tetramethoxysilane, partially condensed tetramethoxysilane, tetraethoxysilane, or partially condensed tetraethoxysilane;

[0146] (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OCH3)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OCH3)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units; (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OC2H5)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OC2H5)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units;

[0147] (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)(OH)SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2(OH)SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO3 / 2 A copolymer consisting of units;

[0148] (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and SiO 4 / 2 A copolymer consisting of units, (CH3)3SiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)HSiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 A copolymer consisting of units, or (CH3)2HSiO 1 / 2 Units and (CH3)2SiO 2 / 2 Units and (C6H5)2SiO 2 / 2 Units and (CH3)SiO 3 / 2 Examples include copolymers composed of units.

[0149] Since component A has hydroxyl groups, component B can be, for example, a condensation-crosslinkable compound having three or more groups or atoms that undergo a condensation reaction with the hydroxyl groups in component A. Specifically, examples of compounds having three condensation-reactive groups include methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, glycidyltrimethoxysilane, mercaptotrimethoxysilane, mercaptotriethoxysilane, aminopropyltriethoxysilane, methyltris(isopropeneoxy)silane, or vinyltris(isopropeneoxy)silane; examples of compounds having four condensation-reactive groups include tetramethoxysilane or tetraethoxysilane; and examples of compounds having five or more condensation-reactive groups include the partial hydrolysis condensates of the above compounds. When these are used, for example, the resin composition can be crosslinked with component A by placing it in a water-containing atmosphere such as ordinary air at room temperature and under light irradiation or heating conditions.

[0150] The content ratio of component B in the resin composition is not particularly limited, but it is preferably 0.1 parts by mass or more and 50 parts by mass or less, more preferably 0.3 parts by mass or more and 40 parts by mass or less, and even more preferably 0.5 parts by mass or more and 30 parts by mass or less, per 100 parts by mass of component (A). If the content ratio is above the lower limit of the above range, a cured film with excellent heat resistance can be obtained. If the content ratio is below the upper limit of the above range, a resin composition and cured film with excellent solubility and toughness can be obtained.

[0151] [Other ingredients] The resin composition may contain components other than components A and B (other components), such as organopolysiloxanes other than components A and B, curing catalysts, solvents, fillers, ion scavengers, surfactants, flame retardants, UV absorbers, light stabilizers, antioxidants, pigments, inorganic oxides, ion adsorbents, photosensitizers, curing retarders, curing inhibitors, organic resins, or heat dissipation fillers. Examples of other components are shown below.

[0152] (curing catalyst) The resin composition may contain a curing catalyst (component C). The catalyst can, for example, promote the chemical reaction between crosslinkable functional groups in component A when chemically reacting components A with each other, or promote the chemical reaction between component A and component B when component B is used. Component C may be used alone or in combination of two or more types. Furthermore, when a solvent is used, it is preferable that component C is soluble in the solvent from the viewpoint of reaction efficiency.

[0153] From the viewpoint of curability, the curing catalyst (component C) preferably contains one or more elements from among tin (Sn), zirconium (Zr), titanium (Ti), aluminum (Al), sulfur (S), iodine (I), nitrogen (N), phosphorus (P), platinum (Pt), iron (Fe), zinc (Zn), cobalt (Co), and rhodium (Rh), more preferably contains one or more elements from among Zr, Ti, Al, S, I, N, and P, and particularly preferably contains the elements Zr, Ti, S, I, N, and P.

[0154] Examples of Sn-containing compounds include dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin diacetate, dioctyltin diacetate, dibutyltin maleate, dioctyltin maleate, or 2-ethylhexanoate.

[0155] Examples of Zr-containing compounds include n-propyl zirconate, n-butyl zirconate, zirconium tetraacetylacetonate, or zirconium monoacetylacetonate.

[0156] Examples of Ti-containing compounds include tetraisopropyl titanate, tetran-butyl titanate, butyl titanate dimer, tetraoctyl titanate, titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethylacetoacetate, titanium dodecylbenzenesulfonate compounds, titanium phosphate ester complexes, titanium octylene glycolate, titanium ethylacetoacetate, titanium lactate ammonium salt, titanium lactate, or titanium triethanolamine.

[0157] Examples of Al-containing compounds include aluminum secondary butoxide, aluminum trisacetylacetonate, aluminum bisethylacetoacetate monoacetylacetonate, or aluminum trisethylacetoacetate.

[0158] S-containing compounds include 2-butenyldimethylsulfonium, 2-butenyltetramethylenesulfonium, 3-methyl-2-butenyldimethylsulfonium, 4-hydroxyphenylcinnamylmethylsulfonium, α-naphthylmethyltetramethylenesulfonium, cinnamyldimethylsulfonium, cinnamyltetramethylenesulfonium, biphenylmethyldimethylsulfonium, biphenylmethyltetramethylenesulfonium, [biphenyl]-4-yl[4-[[biphenyl]-4-ylthio]phenyl](phenyl)sulfonium, and phenyl Methyldimethylsulfonium, phenylmethyltetramethylenesulfonium, fluorenylmethyldimethylsulfonium, fluorenylmethyltetramethylenesulfonium, (9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene-2-yl)thio]phenyl](phenyl)sulfonium, bis[4-(diphenylsulfonio)phenyl]sulfide, diphenyl[4-(phenylthio)phenyl]sulfonium, triphenylsulfonium, bis[4-(di(4-(2-hydroxyethoxy))phenylsulfonium] [Nio)phenyl]sulfide, benzylmethylphenylsulfonium, benzyl(4-hydroxyphenyl)methylsulfonium, (4-hydroxyphenyl)methyl(2-methylbenzyl)sulfonium, (4-hydroxyphenyl)methyl(4-methylbenzyl)sulfonium, (4-hydroxyphenyl)methyl(1-naphthyl)sulfonium, dibenzyl-4-hydroxyphenylsulfonium, 4-acetoxyphenylbenzylsulfonium, 4-acetoxyphenyldimethylsulfonium, or 4-acetoxyphenylmethyl(2-methylbenzyl) Cations such as dinitryl(sulfonium), tris(pentafluoroethyl)trifluorophosphate, trifluorotris(pentafluoroethyl)phosphate, hexafluorophosphate, tetrafluoroborate, tetrakis(pentafluorophenyl)borate, hexafluoroantimonate, p-toluenesulfonate, dodecylbenzenesulfonate, trifluoromethanesulfonate, perfluorobutanesulfonate, bis(trifluorosulfonyl)imide, trifluoromethanesulfonate, perfluorobutanesulfonate,Examples include sulfonium salts consisting of anions such as methanesulfonate or camphor sulfonate, or products from Sunapro Co., Ltd. such as TA-90, TA-100, TA-100FG, TA-120, TA-160, CPI-200K, CPI-210S, or LW-S1.

[0159] Compounds containing I include diphenyliodonium chloride, diphenyliodonium trifluoromethanesulfate, diphenyliodonium mesylate, diphenyliodonium tosylate, diphenyliodonium bromide, diphenyliodonium tetrafluoroborate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluoroarsenate, bis(p-tert-butylphenyl)iodonium hexafluorophosphate, bis(p-tert-butylphenyl)iodonium mesylate, and bis(p-tert-butylphenyl)iodonium. Examples include iodonium salts such as t-butylphenyl)iodonium tosylate, bis(p-tert-butylphenyl)iodonium trifluoromethanesulfonate, bis(p-tert-butylphenyl)iodonium tetrafluoroborate, bis(p-tert-butylphenyl)iodonium chloride, bis(p-chlorophenyl)iodonium chloride, (4-isopropylphenyl)(p-tolyl)iodonium trifluorotris(perfluoroethyl)phosphate, or bis(p-chlorophenyl)iodonium tetrafluoroborate.

[0160] Examples of N-containing compounds include trimethylsilylamine and bis(trimethylsilyl)amine. Silazanes such as tris(trimethylsilyl)amine, methyldiphenylsilylamine, bis(methyldiphenylsilyl)amine, or tris(methyldiphenylsilylamine), Cyclic silazanes such as hexamethylcyclotrisilazane, octamethylcyclotetrasilazane, decamethylcyclopentasilazane, trimethyltriphenylcyclotrisilazane, tetramethyltetraphenylcyclotetrasilazane, pentamethylpentaphenylcyclopentasilazane, hexaphenylcyclotrisilazane, octaphenylcyclotetrasilazane, or decaphenylcyclopentasilazane; Inorganic polysilazanes such as perhydropolysilazanes, or organic polysilazanes such as methylpolysilazanes; Aminoguanidine, 1,1,3,3-tetramethylguanidine, n-dodecylguanidine, methylolguanidine, dimethylolguanidine, 1-phenylguanidine, 1,3-diphenylguanidine, 1,3-di-o-tolylguanidine, triphenylguanidine, or 1-benzyl-2,3-dimethylcyanoguanidine, 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidium=2-(3-benzoylphenyl)propionate, 1,2-dicyclohexyl-4,4,5,5- Organic guanidines such as tetramethylbiguanidium=n-butyltriphenyl borate and (Z)-{[bis(dimethylamino)methylidene]amino}-N-cyclohexyl(cyclohexylamino)methaneiminium=tetrakis(3-fluorophenyl) borate; carbamates such as 9-anthrylmethyl N,N-diethylcarbamate, 1-(anthraquinone-2-yl)ethyl imidazole-1-carboxylic acid, and 4-(methacryloyloxy)piperidine-1-carboxylic acid(2-nitrophenyl)methyl; Amides such as dicyandiamide, (E)-1-piperidino-3-(2-hydroxyphenyl)-2-propen-1-one; Alkylimidazoles such as 2-ethyl-4-methylimidazole, 1-methylimidazole, 1,2-dimethylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, and 2-isopropylimidazole; carbamylalkyl-substituted imidazoles such as 1-(2-carbamylethyl)imidazole; cyanoalkyl-substituted imidazoles such as 1-cyanoethyl-2-methylimidazole; aromatic-substituted imidazoles such as 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 1-benzyl-2-methylimidazole; alkenyl-substituted imidazoles such as 1-vinyl-2-methylimidazole; or allyl-substituted imidazoles such as 1-allyl-2-ethyl-4-methylimidazole; or polyimidazoles; Ureas such as 1,1'-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea) or 3-{3-[(3,3-dimethylureido)methyl]-3,5,5-trimethylcyclohexyl}-1,1-dimethylurea; Amines such as bis(2-morpholinoethyl) ether and 1,1'-[[3-(dimethylamino)propyl]imino](2-propanol); Ammonium such as 2-ethylhexane salt of triethylmethylammonium;

[0161] Furthermore, examples include 1,5,7-triazabicyclo[4.4.0]deca-5-ene 2-(9-oxoxanthene-2-yl)propionic acid, 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 1,5-diazabicyclo[4.3.0]nonene-5 (DBN), the phenol salt of DBU, the 2-ethylhexanoate of DBU, the formate of DBU, the o-phthalate of DBU, the p-toluenesulfonate of DBU, the phenol novolac resin salt of DBU, the trimellitate of DBU, the tetraphenylborate salt of a benzyl modified form of DBU, the 2-ethylhexanoate of DBN, the phenol resin salt of DBN, or the biphenyl-type phenol resin salt of DBN.

[0162] Other examples include ketimines, which are reaction products of polyamines and carbonyl compounds. Examples of amines include diamines such as ethylenediamine, propylenediamine, trimethylenediamine, tetramethylenediamine, 1,3-diaminobutane, 2,3-diaminobutane, pentamethylenediamine, 2,4-diaminopentane, hexamethylenediamine, p-phenylenediamine, and p,p'-biphenylenediamine; polyhydramines such as 1,2,3-triaminopropane, triaminobenzene, tris(2-aminoethyl)amine, or tetra(aminomethyl)methane; polyalkylene polyamines such as diethylenetriamine, triethylenetriamine, or tetraethylenepentamine; or polyoxyalkylene polyamines, etc. Carbonyl compounds include acetaldehyde, propionaldehyde, n Examples include aldehydes such as butyraldehyde, isobutyraldehyde, diethylacetaldehyde, glyoxal, or benzaldehyde; cyclic ketones such as cyclopentanone, trimethylcyclopentanone, cyclohexanone, or trimethylcyclohexanone; aliphatic ketones such as acetone, methyl ethyl ketone, methyl propyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, diethyl ketone, dipropyl ketone, diisopropyl ketone, dibutyl ketone, or diisobutyl ketone; or β-dicarbonyl compounds such as acetylacetone, methyl acetoacetate, ethyl acetoacetate, dimethyl malonate, diethyl malonate, methyl ethyl malonate, or dibenzoylylmethane.

[0163] Examples of P-containing compounds include benzyltriphenylphosphonium bromide and ethyltriphenylphosphonium methanesulfonate.

[0164] Examples of Pt-containing compounds include platinum powder, platinum black, platinum-supported silica powder, platinum-supported activated carbon, chloroplatinic acid, an alcoholic solution of chloroplatinic acid, platinum olefin complexes, or platinum alkenylsiloxane complexes. Examples of these alkenylsiloxanes include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, alkenylsiloxanes in which some of the methyl groups of these alkenylsiloxanes are replaced with ethyl groups, phenyl groups, etc., and alkenylsiloxanes in which the vinyl groups of these alkenylsiloxanes are replaced with allyl groups, hexenyl groups, etc. Examples of iron-containing compounds include iron octoate. Examples of Zn-containing compounds include zinc octoate. Examples of Co-containing compounds include optically active ketoiminatocobalt complexes such as (1R,2R)-N,N'-bis(2-acetyl-3-oxo-2-butenylidene)-1,2-dimethylethylenediaminetocobalt(II) and (1S,2S)-N,N'-bis(2-acetyl-3-oxo-2-butenylidene)-1,2-dimethylethylenediaminetocobalt(II). Examples of Rh-containing compounds include (RhCl3[(C8H 17 Examples include 2S and 3).

[0165] Commercially available products containing component C include TA-90, TA-100, TA-100FG, TA-120, TA-160, CPI-200K, CPI-210S, CPI-101A, CPI-110A, CPI-100B, CPI-100P, CPI-110, CPI-110B, CPI-110P, CPI-310B, and CPI-310F, all manufactured by Sunapro Co., Ltd. G, CPI-410B, CPI-410S, ES-1B, VC-1S, VC-1FG, HS-1, HS-1A, HS-1P, HS-1N, HS-1TF, HS-1NF, HS -1MS, HS-1CS, LW-S1, LW-S1NF, IK-1, IK-2, IK-1FG, NP-TM2, NA-CS1, NP-SE10, PURECAT (registered trademark) TX-1, DBU (registered trademark), DBN, NP-TM2, NP-SE10, NA-CS1, U-CAT881, U-CAT SA1, U-CAT SA102, U-CAT SA603, U-CAT SA810, U-CAT SA506, U-CAT SA841, U-CAT SA851, U-CAT SA838A, U-CAT5002, U-CAT891, U-CAT1102, U-CAT881, U-CAT891, U-CAT5003, U-CAT5050, U-CAT3512T, U-CAT3513N, U-CAT660M, U-CAT2024, or U-CAT18X etc.; or SAN-AID SI-45, SAN-AID SI-60, SAN-AID SI-80, SAN-AID manufactured by Sanshin Chemical Industry Co., Ltd. SI-100, SAN-AID SI-150, SAN-AID SI-300, SAN-AID SI-360, SAN-AID SI-110, SAN-AID SI-B2A, SAN-AID SI-B7, SAN-AID SI-B3A, SAN-AID SI-B3, SAN-AID SI-B4 or SAN-AID SI-B5, etc.;Alternatively, examples include TA-8, TA-21, TA-23, TA-30, TC-100, TC-401, TC-710, TC-810, TC-1040, TC-245, TC-750, TC-300, TC-310, TC-400, TA-12, TA-80, TA-90, TC-120, TC-230, TC-800, TC-315, TC-335, TC-500, TC-510, ZA-45, ZA-65, ZC-150, ZC-162, ZC-540, ZC-700, ZC-580, ZC-200, ZC-320, ZC-126, ZC-300, AL-3001, AL-3100, AL-3200, etc., manufactured by Matsumoto Fine Chemical Co., Ltd. ;

[0166] Among these, dibutyltin dilaurate, n-propyl zirconate, n-butyl zirconate, zirconium tetraacetylacetonate, zirconium monoacetylacetonate, titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethyl acetoacetate, aluminum trisacetylacetonate, aluminum bis-ethyl acetoacetate monoacetylacetonate, aluminum tris-ethyl acetoacetate, Benzyl(4-hydroxyphenyl)methylsulfonium tris(pentafluoroethyl)trifluorophosphate, TA-100FG, (4-isopropylphenyl)(p-tolyl)iodonium trifluorotris(perfluoroethyl)phosphate, IK-1, IK-1FG, SAN-AID SI-B7, SAN-AID SI-B3A, SAN-AID SI-B3, SAN-AID SI-B4, SAN-AID SI-B5, diphenyl[4-(phenylthio)phenyl]sulfonium hexafluorophosphate, diphenyl[4-(phenylthio)phenyl]sulfonium trifluorotris(pentafluoroethyl)phosphate, diphenyl[4-(phenylthio)phenyl]sulfonium tetrakis(pentafluorophenyl)borate, biphenyl]-4-yl[4-[[biphenyl]-4-ylthio]phenyl](phenyl)sulfonium tetrakis(pentafluorophenyl)borate, (9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene Preferred are 9-2-yl)thio]phenyl](phenyl)sulfonium trifluorotris(pentafluoroethyl)phosphate, 9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene-2-yl)thio]phenyl](phenyl)sulfonium tetrakis(pentafluorophenyl)borate, 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidium=2-(3-benzoylphenyl)propionate, o-phthalates of the above DBU, p-toluenesulfonates of the above DBU, and phenol novolac resin salts of the above DBU.

[0167] The content of component C in the resin composition is not particularly limited, but the content of the catalyst relative to 100 parts by mass of the total of components A and B is preferably, for example, 0.00001 parts by mass or more and 20 parts by mass or less, more preferably 0.00002 parts by mass or more and 15 parts by mass or less, and even more preferably 0.00004 parts by mass or more and 10 parts by mass or less.

[0168] (solvent) The resin composition may further contain a solvent capable of dissolving components A and B. The solvent is preferably one that does not condense with components A and B, and more preferably one that is unreactive with all of the constituent components. One type of solvent may be used alone, or two or more types may be used in combination.

[0169] Examples of solvents include aliphatic hydrocarbons, aromatic hydrocarbons, ethers, halogenated hydrocarbons, or ester solvents. More specifically, methanol, ethanol, propanol, isopropanol, butanol, t-butyl alcohol, tetrahydrofuran, 2-methyltetrahydrofuran, 4-methyltetrahydropyran, cyclopentyl methyl ether, methyl ethyl ketone, methyl isobutyl ketone, acetonitrile, propionitrile, benzonitrile, ethyl acetate, isobutyl acetate, butyl acetate, butyl propionate, ethyl lactate, oxypropyl alcohol. Methyl acetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-oxypropionate, ethyl 3-oxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-hydroxyisobutyrate, methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, methyl 2-methoxypropionate, methyl 2-meth Ethyl xypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, methyl xyisobutyrate, acetylacetone, dioxane, ethylene glycol, diethyl ether, diethylene glycol, propylene glycol, dipropylene glycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol monophenyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether,Diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monophenyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monophenyl ether, ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, glycerin, cyclohexanol, 1,4-butanediol, triethylene glycol, tripropylene glycol, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate Butyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, tripropylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, hexane, heptane, cyclohexane, benzene, toluene, xylene, anisole, benzaldehyde, benzonitrile, 1,3-dimethoxybenzene, acetophenone, 4'-methoxyacetophenone, 4'-ethoxyacetophenone, phenyl acetate, 3-methoxyphenol, 1,2-methylenedioxybenzene, 2-phenoxyethanol, diethylene glycol monophenyl ether, 1,2,4-trimethoxybenzene, 2'-hydroxyacetophenone, 1,4-diethoxybenzene, 1,3,5-trimethoxybenzene, t-butyl benzoate, benzyl alcohol, 1,4-dimethoxybenzene, 1,2,3-trimethoxybenzene, 2-methoxytoluene, 3-methoxytoluene, 4-methoxytoluene, 2,5-dimethylanisole, thioanisole, 4-ethylanisole,Examples include t-butylbenzene, 4-t-butyltoluene, 2-phenylanisole, t-anethole, 3,4-dimethoxytoluene, γ-butyrolactone, N,N-dimethylacetamide, N,N-dimethylformamide, N,N-diethylformamide, N-methyl-2-pyrrolidone, dimethylimidazolidinone, dimethyl sulfoxide, methylene chloride, chloroform, or carbon tetrachloride.

[0170] Among these, from the viewpoint of solubility in resin compositions, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, isobutyl acetate, butyl acetate, methyl 3-methoxypropionate, acetylacetone, propylene glycol monomethyl ether acetate, toluene, anisole, benzaldehyde, benzonitrile, tetrahydrofuran, diethylene glycol ethyl methyl ether, tetraethylene glycol dimethyl ether, diethylene glycol dimethyl ether, tripropylene glycol dimethyl ether, triethylene glycol dimethyl ether, 1,3-dimethoxybenzene, acetophenone, 4'-methoxyacetophenone, 4'-ethoxyacetophenone, phenyl acetate, 3-methoxyphenone Preferred alternatives include alcohol, 1,2-methylenedioxybenzene, 2-phenoxyethanol, 1,2,4-trimethoxybenzene, 2'-hydroxyacetophenone, 1,4-diethoxybenzene, 1,3,5-trimethoxybenzene, benzyl alcohol, 1,4-dimethoxybenzene, 1,4-diethoxybenzene, 1,2,3-trimethoxybenzene, 2-methoxytoluene, 3-methoxytoluene, 4-methoxytoluene, 2,5-dimethylanisole, thioanisole, 4-ethylanisole, t-butylbenzene, 4-t-butyltoluene, 2-phenylanisole, 3,4-dimethoxytoluene, N,N-dimethylacetamide, N,N-dimethylformamide, N,N-diethylformamide, or dimethyl sulfoxide.

[0171] The solvent content in the resin composition is not particularly limited, but it is preferably 5 to 80% by mass, more preferably 10 to 75% by mass, and even more preferably 15 to 70% by mass, based on 100% by mass of the resin composition.

[0172] (Compounds containing specific elements) The resin composition may further contain a compound having one or more of the elements Ce, La, Pr, Nd, Y, and Fe (hereinafter also referred to as a "specific element-containing compound").

[0173] The valencies of Ce, La, Pr, Nd, Y, and Fe can range from divalent to tetravalent.

[0174] The compound containing a specific element may contain one or more of the elements Ce, La, Pr, Nd, Y, and Fe.

[0175] A specific element-containing compound having one or more of the elements Ce, La, Pr, Nd, Y, and Fe may be in hydrate or non-hydrate form.

[0176] Examples of specific element-containing compounds having one or more of the elements Ce, La, Pr, Nd, Y, and Fe include cerium(IV) oxide, cerium(III) bromide, cerium(III) acetylacetonate, cerium(IV) methoxyethoxide, cerium(IV) isopropoxide, tris(isopropylcyclopentadienyl)cerium, tris(cyclopentadienyl)cerium, cerium silicide, and diammonium cerium nitrate. Cerium(IV), Cerium hydroxide(IV), Cerium acetate(III), Cerium tungstate(III), Cerium oxalate(III), Cerium perchlorate(III), Cerium bromide(III), Tetrakis(2,2,6,6-tetramethyl-3,5-heptanedionato)cerium(IV), Tris(1,2,3,4-tetramethyl-2,4-cyclopentadienyl)cerium(III), 2,4-pentanedionatocerium(III), Trifluoroacetylacetonate Cerium compounds such as cerium(III), cerium(III) fluoride, cerium(III) sulfide, cerium(III) phosphate, cerium(III) stearate, cerium(III) 2-ethylhexanoate, cerium(III) trifluoromethanesulfonate, cerium(III) chloride, cerium(IV) fluoride, cerium(IV) sulfate, cerium(III) iodide, cerium(III) nitrate, cerium(III) carbonate, and cerium(IV) trifluoromethanesulfonate.

[0177] Yttrium(III) oxide, yttrium(III) isopropoxide, yttrium(III) hexafluoroacetylacetonate, tris(cyclopentadienyl)yttrium, tris(butylcyclopentadienyl)yttrium, tris(methylcyclopentadienyl)yttrium, tris(n-propylcyclopentadienyl)yttrium, tris[N,N-bis(trimethylsilyl)amide]yttrium(III), yttrium(III) perchlorate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato)yttrium(III), yttrium(I II) Yttrium compounds such as acetylacetonate, yttrium(III) chloride, yttrium(III) oxalate, yttrium(III) acetate, yttrium(III) fluoride, yttrium(III) iodide, yttrium(III) 2-ethylhexanoate, yttrium(III) nitrate, yttrium(III) sulfide, yttrium(III) bromide, yttrium(III) trifluoromethanesulfonic acid, yttrium(III) neodecanoate, yttrium(III) phosphate, yttrium(III) carbonate, yttrium(III) sulfate, yttrium(III) naphthenate, etc.

[0178] Lanthanum(III) oxide, lanthanum(III) isopropoxide, lanthanum tris(hexamethyldisilazide), lanthanum(III) ethoxide, tris(cyclopentadienyl)lanthanum, tris[N,N-bis(trimethylsilyl)amide]lanthanum, tris(isopropylcyclopentadienyl)lanthanum, lanthanum carbonate, tris(6,6,7,7,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)lanthanum(III), lanthanum(III) perchlorate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato)lanthanum(III), tris[N,N-bis(trimethyl Compounds containing lanthanum, such as silyl)amide lanthanum(III), lanthanum(III) acetylacetonate, lanthanum chloride, lanthanum sulfate(III), 2-ethylhexanoate lanthanum(III), lanthanum fluoride(III), lanthanum chloride, lanthanum iodide(III), lanthanum boride, lanthanum sulfide(III), lanthanum bromide(III), lanthanum nitride(III), lanthanum trifluoromethanesulfonic acid(III), lanthanum nitrate(III), lanthanum carbonate(III), lanthanum acetate(III), tris(N,N'-di-i-propylformamidinate)lanthanum(III), lanthanum phosphate(III), etc.

[0179] Praseodymium(III) oxide, praseodymium(IV) oxide, praseodymium(III) hexafluoroacetylacetonate, praseodymium(III) hexafluoro-2,4-pentanedione, praseodymium(III) acetylacetonate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato)praseodymium(III), tris(6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)praseodymium(III), tris(isopropyl Praseodymium compounds such as cyclopentadienyl(III)praseodymium(III), isopropoxypraseodymium(III), praseodymium chloride(III), praseodymium fluoride(III), praseodymium acetate(III), praseodymium sulfate(III), praseodymium bromide(III), praseodymium iodide(III), praseodymium phosphate(III), praseodymium carbonate(III), praseodymium trifluoromethanesulfonic acid(III), praseodymium nitrate(III), praseodymium perchlorate(III), etc.

[0180] Neodymium(III) oxide, neodymium(III) isopropoxide, trifluoroacetylacetonate neodymium(III), tris(2,2,6,6-tetramethyl-3,5-heptanedionate)neodymium, tris(tetramethylcyclopentadienyl)neodymium, trifluoroacetylacetonate neodymium, tris(isopropylcyclopentadienyl)neodymium, neodymium(III) trifluoromethanesulfonate, neodymium fluoride, tris(cyclopentadienyl)neodinium, neodymium(III) perchlorate, neodymium(III) fluoride, 2,4-pentanedione neodymium(III), tris[N,N-bis(trimethylsilyl) Neodymium compounds such as neodymium(III), tris(2,2,6,6-tetramethyl-3,5-heptanedionato)neodymium(III), tris(6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)neodymium(III), neodymium(III) hexafluoroacetylacetonate, neodymium(III) 2-ethylhexanoate, neodymium(III) chloride, neodymium(III) titanate, neodymium(III) bromide, neodymium(III) iodide, neodymium(III) nitride, neodymium(III) acetate, neodymium(III) nitrate, neodymium carbonate, neodymium(III) sulfate, neodymium(III) oxalate, etc.

[0181] Iron(II) oxide, iron(III) oxide, iron(III) acetylacetonate, iron(III) ethoxide, iron(III) isopropoxide, iron(III) 2,4-pentanedione, iron(III) trifluoroacetylacetonate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato) iron(III), tris(hexafluoroacetylacetonate) iron(III), iron(III) sulfate, iron(II) hexacyanoate, iron(III) acrylate, ethylenediaminetetraacetic acid, iron(III)-sodium salt, ammonium iron(III) citrate, triammonium iron(III) trioxalate, tris(2-eth Examples of iron compounds include iron(III) phosphate, iron(III) phosphate, iron(III) fluoride, iron(III) chloride, iron(III) oxyhydroxide, iron(III) bromide, iron(III) trifluoromethanesulfonate, iron(III) tetraphenylporfin chloride, iron(III) ammonium hexacyanoferrate, iron(III) nitrate, potassium hexacyanoferrate, sodium pentacyanonitrosylferrate, iron(III) citrate, iron(III) diphosphate, iron(III) perchlorate, potassium iron(III) trisoxalate, iron(III) 1,3,5-benzenetricarboxylate, and iron(III) phosphate.

[0182] In addition to the compounds listed above, compounds containing one or more elements from Ce, La, Pr, Nd, Y, and Fe, into which a siloxane skeleton has been introduced, can also be used. For example, in the case of compounds containing cerium, a reaction product of a cerium carboxylate and a siloxane compound having a carboxylate can be used, as described in Japanese Patent Publication No. 2020-132789.

[0183] Among these, cerium(III) acetylacetonate, cerium(III) nitrate, cerium(III) 2-ethylhexanoate, tris(cyclopentadienyl)cerium, yttrium(III) (acetylacetonate), yttrium(III) nitrate, yttrium(III) 2-ethylhexanoate, tris(cyclopentadienyl)yttrium, lanthanum(III) acetylacetonate, lanthanum(III) 2-ethylhexanoate, tris(C) Clopentadienyl)lanthanum, praseodymium(III) nitrate, neodymium(III) nitrate, neodymium(III) 2-ethylhexanoate, tris(cyclopentadienyl)neodinium, iron(III) acetylacetonate, iron(III) 2,4-pentanedione, tris(2,2,6,6-tetramethyl-3,5-heptanedionate)ferric acidate, iron(III) acrylate, tris(2-ethylhexanoate)ferric acidate, and iron(III) nitrate are preferred.

[0184] As a compound containing specific elements, commercially available products such as the trade name "Octope R" (manufactured by Hope Pharmaceutical Co., Ltd.) may be used.

[0185] The content of the compound containing the specific element is not particularly limited, but in terms of the balance between heat resistance and solubility, it is preferably 5 ppm or more and less than 5,000 ppm, more preferably 7 ppm or more and less than 3,000 ppm, and even more preferably 10 ppm or more and less than 2,000 ppm, based on the total mass of the resin composition excluding the solvent.

[0186] (Organopolysiloxanes other than components A and B) The resin composition may further contain organopolysiloxanes other than components A and B. These other organopolysiloxanes may be used individually or in combination of two or more. Other organopolysiloxanes are compounds having at least one of the structures shown in the following formulas (E-1) to (E-4), and do not contain any groups that crosslink with component A.

[0187] [ka]

[0188] In formulas (E-1) to (E-4), R E These are independently methyl, ethyl, propyl, and ethyl groups. Examples of functional groups include alkyl groups such as sopropyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, and decyl groups; aryl groups such as phenyl, tolyl, xylyl, and naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently substituted with a halogen atom such as a fluorine, chlorine, or bromine atom, such as chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure. Also, in equations (E-1) to (E-4), * represents a bonding site.

[0189] Other organopolysiloxane structures may be linear, partially branched, or cyclic. Commercially available products include KF-96L, KF-96A, KF-96, KF-96H, KF-50, KF-54, KF-965, KF-968, KF-410, KF-412 (all product names) from Shin-Etsu Chemical Co., Ltd., TSF451-0.65, TSF451-5A, TSF451-10, TSF451-100 (all product names) from Momentive Corporation, and WACKER® SILICONE FLUID AK0.65~10, WACKER® SILICONE FLUID AK20~5,000, and WACKER® SILICONE FLUID from Asahi Kasei Wacker Silicone Co., Ltd. Examples include AS100, WACKER® L053, WACKER® L060, or WACKER® MQ803 (all are product names).

[0190] The content of other organopolysiloxanes is 0.1 to 30 parts by mass, preferably 0.5 to 25 parts by mass, and more preferably 1 to 20 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0191] (Curing retarder) The resin composition may further contain a curing retarder from the viewpoint of storage stability. The curing retarder may be used alone or in combination of two or more types.

[0192] As curing retarders, for example, known ones used in hydrosilylation reactions can be used. Specifically, these include compounds containing two or more alkenyl groups, compounds containing aliphatic unsaturated bonds, organophosphorus compounds, or tin compounds and organic peroxides.

[0193] Compounds containing two or more alkenyl groups include disiloxanes and trisiloxanes containing vinyl or allyl at both ends, such as 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3-diallyl-1,1,3,3-tetramethyldisiloxane, 1,3-divinyl-1,3-dimethyl-1,3-diphenyldisiloxane, and 1,3-divinyl-1,1,3,3-tetraphenyldisiloxane, or vinyl-containing cyclic siloxanes such as 1,3,5,7-tetravinyltetramethylcyclotetrasiloxane.

[0194] Examples of compounds containing aliphatic unsaturated bonds include propargyl alcohols such as 3-methyl-1-dodecine-3-ol, 3,5-dimethyl-1-hexyn-3-ol, or 1-ethynyl-1-cyclohexanol, or en-yne compounds, maleic anhydride, or maleic acid esters such as dimethyl maleate.

[0195] Examples of organophosphorus compounds include triorganophosphines, diorganophosphines, organophosphons, or triorganophosphites. Examples of tin compounds include stannous halide dihydrate and stannous carboxylate. Examples of organic peroxides include di-t-butyl peroxide and di Examples include cumyl peroxide, benzoyl peroxide, or t-butyl perbenzoate.

[0196] Of these, 1,3-divinyldisiloxane, 1,3,5,7-tetravinyltetramethylcyclotetrasiloxane, or 1-ethynyl-1-cyclohexanol are preferred.

[0197] The content of the curing retarder is 10 to 200,000 times the content (mass) of component C, preferably 20 to 100,000 times, and more preferably 30 to 50,000 times.

[0198] (Adhesion-enhancing agent) The resin composition according to this embodiment may contain an adhesion promoter from the viewpoint of adhesion. The adhesion promoter may be used alone or in combination of two or more types.

[0199] Preferably, the adhesion promoter is an organosilicon compound having a hydroxyl group, a hydrogen atom bonded to Si, or an alkoxy or epoxy bonded to Si, and more preferably having at least one alkoxy bonded to Si. Such a compound can crosslink with other components in the resin composition while bonding with components such as the substrate on which the resin composition is laminated, thereby improving the adhesion of the resulting cured product. Furthermore, from the viewpoint of heat resistance and other factors, the adhesion promoter is more preferably having a silsesquioxane structure. Examples of such preferred adhesion promoters include compounds represented by the following formula (Z). Note that the above-mentioned adhesion promoter having a hydroxyl group, a hydrogen atom bonded to Si, or an alkoxy bonded to Si may also function as component B. In this case, any component that overlaps with component B is treated as component B.

[0200] [ka]

[0201] In formula (Z), R G0 R in equation (2) above is independent of the others. 1 This is synonymous with R. G1 Independently, R in equation (3) above 3 This is synonymous with Q being an independent group represented by the following formulas (Z1), (Z31), (Z32), (Z33), or (Z41), and may include formula (Z2) as a linking group.

[0202] R G1 Preferably, the group is an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, with methyl groups and phenyl groups being more preferred.

[0203] [ka]

[0204] In equations (Z1), (Z2), (Z31), (Z32), (Z33), and (Z41), * represents a bonding site, as described above.

[0205] In formula (Z2), R G2 R is independently an alkyl group having 1 to 6 carbon atoms, a cyclopentyl group, a cyclohexyl group, or a phenyl group. g is an average value satisfying 1 to 20. G2 A methyl group or a phenyl group is preferred as the element.

[0206] In formula (Z41), R G3 R is independently a methyl group, an ethyl group, a butyl group, or an isopropyl group. G3 A methyl group or an ethyl group is preferred.

[0207] The amount of adhesion promoter added is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 9 parts by mass, and even more preferably 0.5 to 8 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0208] (Filler) The resin composition may further contain fillers from the viewpoint of heat resistance, optical properties, thixotropy, etc. One type of filler may be used alone, or two or more types may be used in combination.

[0209] There are no particular limitations on the filler material; known materials can be used. Furthermore, the structure of the filler material may be amorphous or crystalline. The combination of fillers is also not limited.

[0210] As fillers, for example, various phosphors and metal oxides can be suitably used.

[0211] Phosphors include various types such as those that emit green light, blue light, yellow light, or red light. Specific examples of phosphors include known phosphors such as organic phosphors, inorganic phosphors, fluorescent pigments, or fluorescent dyes. Examples of organic phosphors include allyl sulfonamide-melamine formaldehyde cocondensate dyes, or peri Examples include perylene-based phosphors, and perylene-based phosphors are preferred due to their long-term usability. Inorganic phosphors are also preferred fluorescent materials. Inorganic phosphors are described below.

[0212] Examples of phosphors that emit green light include [SrAl2O4:Eu], [Y2SiO5:Ce,Tb], and [MgAl 11 O 19 :Ce,Tb],[Sr7Al 12 O 25 Examples include :Eu] or [(at least one of Mg, Ca, Sr, Ba)Ga2S4:Eu].

[0213] Examples of phosphors that emit light in blue include, for example, [Sr5(PO4)3Cl:Eu], [(SrCaBa)5(PO4)3Cl:Eu], [(BaCa)5(PO4)3Cl:Eu], [(at least one or more of Mg, Ca, Sr, Ba)2B5O9Cl:Eu,Mn], or [(at least one or more of Mg, Ca, Sr, Ba)(PO4)6Cl2:Eu,Mn], etc.

[0214] Examples of phosphors that emit light from green to yellow include at least yttrium-aluminum oxide phosphors activated with cerium, at least yttrium-gadolinium-aluminum oxide phosphors activated with cerium, at least yttrium-aluminum garnet oxide phosphors activated with cerium, or at least yttrium-gallium-aluminum oxide phosphors activated with cerium, etc. (so-called YAG-based phosphors). Specifically, [Ln3M5O 12 :R (Ln is at least one or more selected from Y, Gd, La, M includes at least one of Al and Ca, and R is a lanthanoid series.)], or [(Y1-xGax)3(Al1-yGay)5O 12 :R (R is at least one or more selected from Ce, Tb, Pr, Sm, Eu, Dy, Ho, 0 < Rx < 0.5, 0 < y < 0.5.)] can be used.

[0215] Examples of phosphors that emit light in red include, for example, [Y2O2S:Eu], [La2O2S:Eu], [Y2O3:Eu], or [Gd2O2S:Eu].

[0216] Also, examples of phosphors that emit light corresponding to blue LEDs include YAG-based phosphors such as [Y3(Al,Ga)5O 12 :Ce,(Y,Gd)3Al5O 12 :Ce,Lu3Al5O 12 :Ce,Y3Al5O 12 :Ce], TAG-based phosphors such as [Tb3Al5O 12 :Ce], [(Ba,Sr)2SiO4:Eu]-based phosphors, [Ca3Sc2Si3O 12[Ce] phosphors, silicate phosphors such as [(Sr,Ba,Mg)2SiO4:Eu], nitride phosphors such as [(Ca,Sr)2Si5N8:Eu], [(Ca,Sr)AlSiN3:Eu], [CaSiAlN3:Eu], [Cax(Si,Al) 12 (O,N) 16 Oxynitride phosphors such as [Eu], as well as [(Ba,Sr,Ca)Si2O2N2:Eu] phosphors, [Ca8MgSi4O 16 Cl2:Eu] phosphor, or [SrAl2O4:Eu,Sr4Al 14 O 25 Examples of phosphors include [Eu].

[0217] Among these, YAG-based phosphors, TAG-based phosphors, or silicate-based phosphors are preferred in terms of luminescence efficiency and brightness. In addition, other known phosphors can be used depending on the application and the desired emission color.

[0218] The phosphor content is preferably 1 to 90 parts by mass, and more preferably 2 to 50 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0219] Next, we will explain the case where the filler is a metal oxide. Suitable metal oxides include silica, alumina, yttrium oxide, zinc oxide, magnesium oxide, antimony oxide, titanium oxide, or zirconium oxide.

[0220] The content of metal oxides in the resin composition is preferably 1 to 95 parts by mass, more preferably 1 to 90 parts by mass, and even more preferably 1 to 85 parts by mass, based on 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0221] When titanium dioxide or aluminum oxide is used, it can be suitably used as a reflector material. Polyphthalamide resin is widely used as a reflector material. However, it has been pointed out that polyphthalamide resin is prone to degradation, particularly discoloration, with long-term use, and this resin composition can solve that problem.

[0222] In the case of silica, finely ground naturally occurring silica (natural silica) may be used, or industrially synthesized silica (synthetic silica) may be used. Natural silica has a crystalline axis because it is crystalline. Therefore, optical characteristics derived from the crystal can be expected, but its specific gravity is slightly higher than that of synthetic silica, which may affect its dispersion in the resin composition. Also, when obtained by crushing natural materials, the particles may have an irregular shape or a wide particle size distribution.

[0223] Synthetic silica can be wet-processed or dry-processed, but there are no particular limitations on its use. However, synthetic silica may contain crystal water regardless of the manufacturing method, and if this crystal water may have any effect on the resin composition, cured product, or various application components using them, it is preferable to select the synthetic silica while considering the number of crystal waters.

[0224] Synthetic silica is amorphous rather than crystalline, and therefore lacks a crystalline axis, meaning it doesn't exhibit the optical characteristics often associated with crystals. However, it offers advantages such as control over particle size distribution and the ability to create extremely small particles. In particular, fumed silica has nano-order particle sizes and exhibits excellent thixotropy.

[0225] Furthermore, silica generally has a large surface area and is a hydrophilic material (hydrophilic silica) due to the effect of silanols present on its surface, but it can also be made hydrophobic silica through chemical modification.

[0226] For example, from the viewpoint of being able to dissipate the heat generated when the resin composition is used as an element, it is preferable that the resin composition contains a heat dissipation filler as a filler. The heat dissipation filler may be used alone or in combination of two or more types.

[0227] Examples of heat dissipation fillers include alumina (Al2O3), boron nitride (BN), aluminum nitride (AlN), silicon carbide (SiC), magnesium oxide (MgO), zinc oxide (ZnO), and aluminum hydroxide (Al(OH)3).

[0228] (Ion scavenger) The resin composition may further contain an ion-scavenging agent from the viewpoint of insulation reliability. The ion-scavenging agent may be used alone or in combination of two or more types.

[0229] There are no particular restrictions on the ion trapper, and examples include anion trappers, cation trappers, or both ion trappers. Examples include DHT-4A, manufactured by Kyowa Chemical Industry Co., Ltd., and the IXE300 series, IXEPLAS-A series, or IXEPLAS-B series, manufactured by Toagosei Co., Ltd. The average particle size of the ion trapper is preferably 0.1 to 3.0 μm, and the maximum particle size is preferably 10 μm or less.

[0230] The content of the ion scavenger is preferably 0.1 to 10 parts by mass, and more preferably 0.3 to 9 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0231] (Surfactants) The resin composition may further contain a surfactant for the purpose of controlling its wettability to the substrate. One type of surfactant may be used alone, or two or more types may be used in combination.

[0232] Specific examples of surfactants include Polyflow No. 45, Polyflow KL-245, Polyflow No. 75, Polyflow No. 90, Polyflow No. 95 (all product names, manufactured by Kyoeisha Chemical Industry Co., Ltd.), Disperbyk 161, Disperbyk 162, Disperbyk 163, Disperbyk 164, Disperbyk 166, Disperbyk 170, Disperbyk 180, Disperbyk 181, Disperbyk 182, BYK-300, BYK-306, BY K-310, BYK-320, BYK-330, BYK-342, BYK-344, BYK-346 (all product names, manufactured by Big Chemie Japan Co., Ltd.), KP-341, KP-358, KP-368, KF-96-50CS, KF-50-100CS (all product names, manufactured by Shin-Etsu Chemical Co., Ltd.), Surflon SC-101, Surflon KH-40 (both product names, manufactured by Seimi Chemical Co., Ltd.), Futergent 222F, Futergent 251, FTX-218 (all product names, manufactured by Neos Co., Ltd.), TEGO Rad2100, 2200N, 2250, 2500, 2600, 2700 (product names, manufactured by Evonik Japan Co., Ltd.) EFTOP EF-351, EFTOP EF-352, EFTOP EF-601, EFTOP EF-801, EFTOPEF-802 (product names, manufactured by Mitsubishi Materials Corporation), Megafac F-171, Megafac F-177, Megafac F-475, Megafac F-477, Megafac F-556, Megafac R-08, Megafac R-30 (product names, manufactured by DIC Corporation), fluoroalkylbenzene sulfonate, fluoroalkyl carboxylate, fluoroalkyl polyoxyethylene ether, fluoroalkylammonium iodide, fluoroalkyl betaine, fluoroalkyl sulfonate, diglycerin tetrakis(fluoroalkyl polyoxyethylene ether), fluoroalkyltrimethylammonium salt, fluoroalkylaminosulfonate, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene lauryl ether Examples include polyoxyethylene oleyl ether, polyoxyethylene tridecyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene laurate, polyoxyethylene oleate, polyoxyethylene stearate, polyoxyethylene laurylamine, sorbitan laurate, sorbitan palmitate, sorbitan stearate, sorbitan oleate, sorbitan fatty acid ester, polyoxyethylene sorbitan laurate, polyoxyethylene sorbitan palmitate, polyoxyethylene sorbitan stearate, polyoxyethylene sorbitan oleate, polyoxyethylene naphthyl ether, alkylbenzene sulfonate, alkyldiphenyl ether disulfonate, or polyether-modified polydimethylsiloxane.

[0233] When the surfactant content is 0 to 3 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent, the wettability to the substrate tends to be excellent.

[0234] (Flame retardant) The resin composition may further contain a flame retardant from the viewpoint of flame retardancy. The inclusion of a flame retardant in the resin composition is preferable because it enhances the flame retardancy of the resulting cured film. The flame retardant is not particularly limited as long as it is a compound capable of imparting flame retardancy, but organophosphorus flame retardants are preferred from the viewpoint of low toxicity, low pollution, and safety. The flame retardant may be used alone or in combination of two or more types.

[0235] Examples of organophosphorus flame retardants include triphenylphosphate and tricresylphosphate. Examples include phosphate, trixylenyl phosphate, cresylphenyl phosphate, 2-ethylhexyldiphenyl phosphate, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, or condensed 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.

[0236] The flame retardant content is preferably 0 to 50 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0237] (UV absorbers, light stabilizers) The resin composition may contain an ultraviolet absorber or a light stabilizer (HALS) to prevent degradation by light. These components may be used individually or in combination of two or more types.

[0238] Examples of UV absorbers include benzotriazole compounds such as 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(3,5-di-t-butyl-2-hydroxyphenyl)benzotriazole, 2-(3,5-di-t-butyl-2-hydroxyphenyl)-5-chlorobenzotriazole, or 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole; triazine compounds such as 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-[(hexyl)oxy]phenol; benzophenone compounds such as 2-hydroxy-4-n-octyloxybenzophenone; and oxalic acid anilide compounds such as 2-ethoxy-2'-ethyloxalic acid bisanilide.

[0239] Examples of light stabilizers (HALS) include TINUVIN® 5100, TINUVIN 292 (compound name: bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, methyl(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate), and TINUVIN 152 (compound name: 2,4-bis[N-butyl-N-(1-cyclohexyloxy-2,2,6,6-teto [3,5-Bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl butylmalonate], TINUVIN144 (Compound name: Bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate), TINUVIN123 (Compound name: Decandiolic acid, Bis(2,2,6,6-Te Reaction product of tramethyl-1-(octyloxy)-4-piperidinyl) ester (in the presence of 1,1-dimethylethyl hydroperoxide and octane), TINUVIN111FDL (approximately 50%, TINUVIN622, compound name: (butanedioic acid polymer (4-hydroxy-2,2,6,6-tetramethylpiperidinyl-yl) in the presence of ethanol), approximately 50%, CHIMASSORB119, compound name: N-N'-N''-N'''-tetrakis(4,6-bis(butyl-(N-methyl-2,2,6,6-tetramethylpiperidine-4-yl)amino)triazine-2-yl)-4,7-diazadecane-1,10-diamine), (all manufactured by BASF), Adeka Stab LA series (manufactured by Adeka Corporation), specifically LA-52, LA-57, LA-62, or LA-67, etc.

[0240] The amount of each ultraviolet absorber or light stabilizer is preferably 0 to 20 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0241] (Antioxidant) The resin composition may further contain antioxidants to prevent oxidation of the resulting cured film, etc. The antioxidant may be used alone or in combination of two or more types.

[0242] Examples of antioxidants include dibutylhydroxytoluene, 2,6-t-butylphenol, 2,2'-methylenebis(6-t-butyl-4-ethylphenol, tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl isocyanurate), tris(3,5-t-butyl-4-hydroxybenzyl isocyanurate), 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 4,4'-butylidenebis(6-t-butyl-m-cresol), and 3-(3,5-di-t-butyl-4 -Hydroxyphenyl)propionate stearyl, tetrakis[3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]pentaerythritol, 2,2'-dimethyl-2,2'-(2,4,8,10-tetraoxaspiro[5,5]undecane-3,9-diyl)dipropane-1,1'-diyl=bis[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propanoate], 2,4,6-tris(3',5'-di-t-butyl-4'-hydroxybenzyl)mesitylene, pentaerythritol Litol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], triethylene glycol-bis-[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, or 3,5-di-t-butyl-4-hydroxybenzylphosphonate diethyl ester Hindered phenol compounds such as; amine compounds such as dinonyldiphenylamine, octylbutyldiphenylamine, n-butylamine, triethylamine, or diethylaminomethyl methacrylate; sulfur compounds such as bis(dibutyldithiocarbamate)methylene, pentaerythritol tetrakis[3-laurylthiopropionate], phenothiazine, dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, or distearyl-3,3'-thiodipropionate;Or triphenyl phosphite, diphenylisodecyl phosphite, phenyldiisodecyl phosphite, tris(nonylphenyl) phosphite, diisodecylpentaerythritol phosphite, tris(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis(octadecyl) phosphite, cyclic neopentanetetraylbi(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbi(2,4-di-t-butyl-4-methylphenyl) phosphite, bis[2-t- Phosphorus compounds such as butyl-6-methyl-4-{2-(octadecyloxycarbonyl)ethyl}phenyl]hydrogen phosphite and oxaphosphaphenanthrene oxides (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, or 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) are examples.

[0243] The antioxidant content is preferably 0 to 10 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent.

[0244] (Organic resin) The resin composition may further contain an organic resin. By selecting the type of organic resin, further improvements in functionality can be achieved. One type of organic resin may be used alone, or two or more types may be used in combination.

[0245] Examples of organic resins include acrylic resins, epoxy resins, polyimide resins, cyanate resins, maleimide resins, benzooxazine resins, phenoxy resins, unsaturated polyester resins, phenolic resins, melamine resins, urethane resins, and silicone resins. ru. Among these, resins that harden with a curing agent, such as epoxy resins, are preferably included together with the curing agent. Examples of curing agents for epoxy resins include acid anhydride compounds, phenolic compounds, amine compounds, heat or photoacid generators such as sulfonium salts or iodonium salts, photosensitizers, or active ester compounds.

[0246] (Photosensitizer) The resin composition may further contain a sensitizer. Further improvements in functionality can be achieved by selecting the type of sensitizer. One type of sensitizer may be used alone, or two or more types may be used in combination. Examples of sensitizers include anthracene compounds, thioxanthone compounds, cyanine compounds, merocyanine compounds, coumarin compounds, benzylidene ketone compounds, squarium compounds, (thia)pyrillium compounds, porphyrin compounds, coumarin compounds, pyrarisone compounds, oxazole compounds, thiophene type, naphthalene type, and the like. Examples of commercially available products include the Anthracure UVS series such as Anthracure UVS-1331, Anthracure UVS-1101, Anthracure UVS-581, or Anthracure UVS-2171 manufactured by Air Water Performance Chemical Co., Ltd., and NF-CO-01, NF-CO-02, NF-CO-02-AC, NF-CO-05, NF-CO-06, NF-PY-01, NF-PY-02, NF-TH-01, NF-NA-01, NF-py-A, NF-py-B, NF-py-C, NF-Ox-A, and NF-Co-A manufactured by Nippon Chemical Industrial Co., Ltd. The amount of each photosensitizer is preferably 0.001 to 40 parts by mass per 100 parts by mass of the total mass of component C, which is an optional component in the resin composition.

[0247] <Method for producing resin compositions> The method for producing the resin composition described above is not particularly limited, and can be obtained, for example, by mixing each component using a known mixer. For example, a method is to mix a predetermined amount of component A, as well as optional components B, C, and other components, at room temperature or under heating, using a mixing machine such as a stirrer, homodisper, homomixer, universal mixer, planetary mixer, kneader, three-roll mixer, or bead mill.

[0248] Alternatively, the resin composition may be manufactured by preparing and mixing individual components, such as a two-component or three-component type.

[0249] Another embodiment of the present invention provides a method for producing a resin composition using an organosilicon compound produced by the method for producing organosilicon compounds described above. Specifically, the method for producing a resin composition includes a compound production step of reacting a compound represented by formula (4) described above (a compound containing a silsesquioxane skeleton) with at least one of the compounds represented by formula (5) described above and the compound represented by formula (6) described above at a temperature of 20°C or higher and 70°C or lower to obtain a silicon compound. This embodiment may include steps other than the compound production step. Steps other than the compound production step may include, for example, a mixing step of mixing each component constituting the resin composition.

[0250] Furthermore, another embodiment of the present invention is a resin composition obtained by the manufacturing method described above. The conditions for this resin composition can be similarly applied to those for the resin composition described above.

[0251] <Cured product> The cured product according to the embodiment of the present invention is a cured product obtained by curing the resin composition described above. The curing method for obtaining the cured product is not particularly limited and can be carried out by known methods, for example, by treatment such as heating or light irradiation.

[0252] Since the viscosity change rate over time of the resin composition using component A is small, it is preferable to cure the above-mentioned resin composition in the form of a film to obtain a cured product as a silicone film. The film of the resin composition can be formed by known methods of coating it onto a substrate or sheet. Furthermore, the curing of the resin composition film can be determined based on conditions such as crosslinking. For example, a silicone film can be formed by heating the resin composition or its film. The following is an example of a curing method, but it is not limited to this method.

[0253] [Curing method] A cured product can be obtained, for example, by applying the above-mentioned resin composition to the surface of a substrate using a desired printing method (screen printing, letterpress printing, intaglio printing, planographic printing, inkjet printing, etc.), a dispenser, or spin coating, drying as necessary to form a coating film (coating film formation step), and then performing a heating step on the obtained coating film to cure it.

[0254] [Coating film formation process] In the coating film formation process, a resin composition is applied to the surface of the substrate to form a coating film. Examples of substrates include semiconductor substrates such as aluminum or glass substrates, copper substrates, copper alloy substrates, polyimide substrates, ceramic substrates, printed circuit boards, stainless steel substrates, and fiber-reinforced substrates such as CFRP or GFRP.

[0255] In the case of resin compositions containing a solvent, a drying treatment may be performed to remove the solvent before curing. Depending on the composition of the resin composition, the drying temperature is usually 50 to 250°C; the drying time is usually 5 to 120 minutes. Such a drying treatment allows for the formation of a coating film on the substrate that can maintain its shape.

[0256] [Heating process] After the coating film is formed, it is usually heat-treated at 70-350°C for 10-200 minutes.

[0257] Furthermore, a cured product is defined as any product in which crosslinking reactions or similar processes have occurred in at least some of the components of a resin composition, resulting in reduced fluidity; it is not limited to products that are completely cured. In other words, cured products include those that are elastic or viscous, or those that soften or melt when heated.

[0258] The cured product may be a B-stage cured product. A B-stage cured product refers to a cured product in a semi-cured state. Specifically, it is preferable that the B-stage cured product is solid at 25°C and has a softening point in the range of 50°C to 200°C. A B-stage cured product can be obtained by heating the resin composition, for example, in a temperature range of 100 to 350°C for 1 to 5 hours.

[0259] The shape of the cured product is not particularly limited and may be a shape formed by curing the resin composition in the form of a film, or a molded article formed by curing the resin composition to a predetermined shape using a mold or the like. The shape of the cured product is not particularly limited and may be, for example, a film, a sheet, a powder, granules, or a plate.

[0260] The average thickness of the cured product when it is in the form of a film, sheet, or plate is not particularly limited and can be set appropriately depending on the manner of use and the application of the element. The average thickness is, for example, the resistance From the viewpoint of ensuring thermal properties, the thickness is preferably 500 μm or less, more preferably 400 μm or less, and even more preferably 300 μm or less. From the viewpoint of ensuring sufficient insulating properties, the thickness is preferably 1 μm or more, more preferably 1.5 μm or more, and even more preferably 2 μm or more. The cured film may be a thick film with an average thickness of 20 μm or more and 500 μm or less. When a thick film is formed, the average thickness is more preferably 20 μm or more and 400 μm or less, and even more preferably 20 μm or more and 300 μm or less. A thick cured film is preferable from the viewpoint of insulation and mechanical strength. On the other hand, the cured product may be a thin film with an average thickness of 1 μm or more and 20 μm or less. When it is a thin film, the average thickness is more preferably 1.5 μm or more and 15 μm or less, and even more preferably 2 μm or more and 10 μm or less. When the cured product is a thin film, it is preferable in terms of heat resistance, curability and transparency. The method for measuring the average thickness of the cured material is not particularly limited, and known methods can be used. Furthermore, if the volume of the cured material can be calculated from the structure and arrangement of other components, the average thickness of the cured material may be calculated by dividing this volume by the area of ​​the cured material.

[0261] Furthermore, it is presumed that the proportion of specific structures of organosilicon compounds contained in the resin composition used to produce the cured product is maintained within the cured product.

[0262] <Characteristics of hardened material> (Variation in thickness) The variation in the thickness of the cured material can be evaluated by, for example, selecting five locations from the layer that allow for evaluation of the entire cured material, measuring the thickness of these five locations using a step gauge (e.g., P-16+ manufactured by KLA-Tencor Co., Ltd.), calculating the standard deviation from the values ​​obtained, and dividing this standard deviation by the average thickness of the layer (standard deviation / average thickness). Alternatively, the average value of these five measurements may be used as the average thickness. The above standard deviation / average thickness values ​​are not particularly limited, but from the viewpoint of obtaining stable characteristics, smaller values ​​are preferable. Specifically, it is preferable that it be 12% or less, more preferably 11% or less, and even more preferably 10% or less.

[0263] (insulating properties) While there are no particular limitations on the insulating properties of the cured product, from the viewpoint of preventing short circuits between wiring and electrodes, an insulating resistance of 100kΩ or more is preferable, 300kΩ or more is more preferable, and 500kΩ or more is even preferable. The method for evaluating the insulating properties described above is not particularly limited, but for example, an aluminum layer can be vacuum-deposited onto a chromium-deposited substrate, and the properties can be measured using a microammeter (for example, a Keysight Technologies femtopicoammeter B2981A).

[0264] <Component Configuration> The configuration of the element is not particularly limited as long as it has a cured material. The form of the cured material is not particularly limited, but from the viewpoint of ensuring stable characteristics due to small variations in thickness, it can be suitably used as, for example, a coating film for substrates that forms a metal elution prevention film, a gas barrier film, or an anti-reflective film; an insulating film, a encapsulant, a light-emitting diode encapsulant, a fouling prevention film, a component of an element such as a microlens, a light guide plate, a wavelength conversion layer, a light reflector, a buffer material, a sealing material, an optical waveguide material, a planarization film, a protective film, an underfill material, a die attach material, a display substrate, or a printed wiring substrate; an optical resin; an optical film; a contact lens, etc. When used as an insulating film in an element, the insulating film may be, for example, an insulating film that covers a chip, an electrode, or an element, an insulating film as a bonding layer in a laminate having the structure of a chip, an electrode, or an element, or an insulating film for rewiring.

[0265] The type of element is not particularly limited and includes semiconductor elements, integrated circuit devices, actuator elements (such as piezoelectric elements like MEMS), optical elements, thermoelectric elements, or passive elements (such as capacitors, inductors, and resistors). In particular, electronic components and semiconductor elements are preferred because they have a cured product with excellent heat resistance and insulation properties. In the case of electronic components, there are no particular restrictions on their type, and examples include actuator elements (such as piezoelectric elements like MEMS), thermoelectric elements, or passive elements (such as capacitors, inductors, and resistors).

[0266] In the case of semiconductor devices, there are no particular restrictions on their type, and examples include power semiconductor devices, various transistors such as junction field-effect transistors (JFETs), various diode devices such as light-emitting diodes, metal-oxide-semiconductor field-effect transistors (MOSFETs), Schottky source / drain MOSFETs, avalanche photoelectric conversion devices, solar cell devices, sensor devices, touch sensor devices, switching devices, resistive random-access memory, power conversion devices, or display devices.

[0267] Furthermore, the cured product is suitable as a material for all or part of an optical component because it is excellent not only in heat resistance and insulation but also in transparency. In this specification, "optical component" is used as a general term for a component having an optical function. Optical components are broadly classified into single optical elements, which have the function of changing the properties of light on their own, and electro-optical elements, which perform a predetermined function through interaction with electrons.

[0268] Single optical elements have the function of changing the transmission or reflection characteristics of incident light, and specific examples of their functions include polarization adjustment, light intensity adjustment, color tone adjustment, or optical path adjustment. Specific examples of single optical elements include polarizing members, coloring members, dimming members, wavelength conversion members, light shielding members, light-reducing members, reflective members, lenses, or mirrors. Electro-optical elements have the function of changing the characteristics of incident light based on electrical signals, or the function of converting optical signals into electrical signals or emitting light based on electrical signals based on photoelectric conversion. Specific examples of elements with the former function include electrochromic elements and liquid crystal elements. Specific examples of elements with the latter function include light-emitting elements such as LEDs and OLEDs.

[0269] The following describes an embodiment of the element that is particularly suitable when the cured material is used as an insulating layer, but the embodiment of the element is not limited to these.

[0270] [Element configuration 1] From the viewpoint of excellent insulating properties, the element further comprises at least one component selected from the group consisting of chips, wafers, circuit boards, elements (hereinafter also referred to as "element S" to distinguish it from the element described above), wiring, and electrodes, and it is preferable that at least a portion of at least one surface of the cured material is in contact with at least one component selected from the group consisting of chips, wafers, circuit boards, elements, wiring, and electrodes (Embodiment 1). A specific example of Embodiment 1 of this element is shown in Figure 1. In the element 10 shown in Figure 1, one surface of the cured material 11 is in contact with at least one component (contact member) 12 selected from the group consisting of chips, wafers, circuit boards, elements, wiring, and electrodes. In the element in Figure 1, the contact member 12 is in contact with the entire surface of one surface of the cured material 11, but it may also be in contact with a portion of one surface of the cured material 11.

[0271] The chip, wafer, circuit board, or element S can adopt known configurations that have been used in conventional elements. Wiring and electrodes can also utilize conventionally known electrode materials such as gold, copper, or aluminum.

[0272] [Element Embodiment 2] Embodiment 1 of the element described above may also be an embodiment (Embodiment 2) in which at least a portion of one surface of the cured material and at least a portion of the other surface independently contact at least one component selected from the group consisting of chips, wafers, circuit boards, element S, wiring, and electrodes. A specific example of this embodiment 2 is shown in Figure 2. In the element 10 shown in Figure 2, one surface of the cured material 11 is in contact with contact member 12A, and the other surface of the cured material 11 is in contact with contact member 12B. By having such a configuration, electrical contact between contact member 12A and contact member 12B can be prevented. In the element in Figure 2, contact members 12A and 12B are in contact with the entire surface of each surface of the cured material 11, but they may also be in contact with a portion of each surface of the cured material 11. Furthermore, contact members 12A and 12B may be the same component or different components.

[0273] [Element Embodiment 3] Furthermore, from the viewpoint of excellent insulating properties of the cured material, it is preferable that the element has at least one object to be coated, selected from chips, wiring, and electrodes, and a support substrate to support the object to be coated, wherein at least a part of the object to be coated is covered with the cured material (Element Embodiment 3). A specific example of this Element Embodiment 3 is shown in Figure 3. The support substrate can be a known type that has been used in conventional elements, such as a glass substrate, Si substrate, wafer, or circuit board. The element 10 shown in Figure 3(a) has at least one type of covering object 14, selected from chips, wiring, and electrodes, provided on a support substrate 13, and the covering object 14 is further covered with a cured material 11. This configuration prevents electrical contact between the covering objects 14. Furthermore, the element 10 shown in Figure 3(b) has at least one object to be coated 14, selected from chips, wiring, and electrodes, provided on a support substrate 13A, and the object to be coated 14 is covered with a cured material 11, and a support substrate 13B is provided on top of the cured material 11. The material and other conditions of the support substrate 13A and the support substrate 13B can be similarly applied to the material and other conditions of the support substrate 13. In addition, to further improve insulation, a structure may be provided in which an insulating layer is further provided between the cured material 11 and the support substrate 13B. The insulating layer is not particularly limited, and examples include a layer made of an inorganic material such as Si3N4 or SiO2, or a layer made of an organic material such as polyimide. Furthermore, in the element 10 shown in Figure 3(c), the support substrate 13 on which the object to be covered 14A is provided and the support substrate 13 on which the object to be covered 14B is provided are arranged facing outwards, and a cured material 11 is provided so as to cover the objects to be covered 14A and 14B. With this configuration, electrical contact between the objects to be covered 14A and 14B, and between the objects to be covered 14A and 14B can be prevented. The objects to be covered 14A and 14B may be made of the same material or different materials. The support substrate 13 on which the object to be covered 14A is provided and the support substrate 13 on which the object to be covered 14B is provided may be made of the same material or different materials. The method for manufacturing the element 10 shown in Figure 3(c) is not particularly limited. It may involve applying a resin composition capable of forming a cured product 11 to a support substrate 13 on which the object to be coated 14A is provided, drying it as necessary, and then laminating the support substrate 13 on which the object to be coated 14B is provided to cure the resin composition. Alternatively, two of the elements 10 shown in Figure 3(a) may be prepared and laminated and bonded together.

[0274] In Figure 3(c), electrical contact between the objects to be coated 14A and 14B, which are provided on the two substrates, is prevented. On the other hand, the element 10 may have a structure in which the objects to be coated 14A and 14B are in electrical contact. A specific example of this structure is shown in Figure 4. In the element 10 shown in Figure 4(a), two support substrates on which the object to be coated 14 is provided are bonded together via a cured material 11, and the objects to be coated 14 on the two substrates are electrically connected through conductive material filled into through holes 15 provided in the cured material 11. Alternatively, the element may have a barrier metal layer on the surface of the through holes 15. By providing a barrier metal layer, it is possible to prevent the diffusion of the conductive material filled into the through holes 15 into the cured material 11. Furthermore, the element 10 shown in Figure 4(b), which is a modified version of the element 10 shown in Figure 4(a), has a structure in which an insulating layer, such as an inorganic layer, is further provided between the cured material 11 in the structure of Figure 4(a). By further providing such an insulating layer, higher connection reliability can be obtained.

[0275] [Element configuration 4] The cured material may be provided as a layer connecting the members, as shown in the elements 2 and 3 described above. When the cured material is used as a layer connecting other members, the element may be in the form shown in Figure 5 (element element 4). In the element 10 shown in Figure 5, contact member 12A and contact member 12B are connected by the cured material 11. In Figure 5(a), the cured material is provided on the surface of contact member 12A, and contact member 12B is partially provided on top of it. In Figure 5(b), the cured material 11 is provided only at the location where contact member 12A and contact member 12B are connected. The element in Figure 5(a) can be obtained by applying a resin composition containing the cured material or a resin composition containing the raw material for the cured material to the surface of contact member 12A, drying it as necessary, then bringing contact member 12B into contact with the resin composition, and then drying or curing the resin composition. The element shown in Figure 5(b) can be obtained by impregnating a resin composition containing a cured product or a resin composition containing raw materials for a cured product between the contact member 12A and the contact member 12B, drying it as necessary, and then drying or curing the resin composition. A further insulating layer may be provided between the cured product 11 and the contact member 12A. The insulating layer is not particularly limited and can be made of an inorganic material such as Si3N4 or SiO2, or an organic material such as polyimide.

[0276] [Element configuration 5] The cured material may exist as a single layer or as a laminate as shown in Figures 1-4. When the cured material exists as a laminate, the number of layers is not particularly limited and may be two or more layers, three or more layers, four or more layers, or ten or fewer layers, or five or fewer layers. When the number of layers is three or more, any of the layers may be the cured material, but from the viewpoint of the cured material having excellent insulating properties, it is preferable that at least one of the intermediate layers included in the laminate is the cured material. In other words, the device has a laminate with a layer structure of three or more layers, and at least one of the intermediate layers included in the laminate is the cured material (device embodiment 5). The layers other than the cured material 11 included in the laminate are not particularly limited and known embodiments mounted on conventional devices can be adopted, for example, glass substrates, Si substrates, wafers, or circuit boards. In the case of a laminate, the number of hardened material layers included in the laminate is not particularly limited; it may be one layer or two or more layers. Furthermore, the form of layers other than the hardened material is not particularly limited; layers that can generally be used in devices together with insulating layers or other materials can be applied.

[0277] <Method of manufacturing the element> The method for manufacturing the element is not particularly limited and can be manufactured using known methods. An example of a method for manufacturing the element is shown below. A method for manufacturing an element according to another embodiment of the present invention includes a step of applying a resin composition to form a cured product, wherein the resin composition contains an organosilicon compound having a structure represented by the following formulas (A) and (B), and the proportion of the organosilicon compound having a structure represented by the following formula (B) with m=2 is greater than the proportion of the structure represented by the following formula (B) with m=1.

[0278] [ka] In the above formula (A), R 1 R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms;2 These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In the above formula (B), R 3 m is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; m is an integer from 1 to 30; R 1 , R 2 , and R 3 If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. 12 , or an aryl group A having 6 to 20 carbon atoms 14 It may be replaced by at least one -CH2- independently being -O-, -CO-, or a cycloalkylene group A having 5 or 6 carbon atoms. 13 , or an arylene group A having 6 to 20 carbon atoms 15 It can be replaced with; R 1 , R 2 , and R 3 If at least one of the C5 or C6 cycloalkyl groups is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1-C40 alkyl group A 21 , a cycloalkyl group A with 5 or 6 carbon atoms 22 , or an aryl group A having 6 to 20 carbon atoms 24 It may be replaced by, and at least one -CH2- may be independently replaced by -O- or -CO-; R 1 , R 2 , and R 3 If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group is independently composed of at least one hydrogen atom independently composed of a halogen atom and an alkyl group A having 1-C40 atoms. 31 , a cycloalkyl group A with 5 or 6 carbon atoms 32, or an aryl group A having 6 to 20 carbon atoms 34 It can be replaced with; Alkyl group A 21 and alkyl group A 31 The group may independently have at least one hydrogen atom replaced by a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH2- may independently have -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; cycloalkyl group A 12 , cycloalkylene group A 13 cycloalkyl group A 22 and cycloalkyl group A 32 The group A may be independently replaced by at least one hydrogen atom with a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH2- may be independently replaced by -O-, -CO-, etc. 14 , Arylene group A 15 aryl group A 24 and aryl group A 34 Independently, at least one hydrogen atom is independently a halogen atom, an alkyl group having 1 to 40 carbon atoms, and carbon It may be replaced with a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms.

[0279] The method for manufacturing the element includes a step of applying a resin composition to form a cured product. The step of applying a resin composition to form a cured product may include, for example, the following:

[0280] <Step in forming a cured product in the manufacturing method of an element> Examples of processes for forming a cured product include the following: By curing the resin composition by drying and / or heating while it is in contact with any material, a cured product can be obtained that is bonded to the material. "Drying and / or heating" is a concept that includes drying only, heating only, or both drying and heating.

[0281] One method involves using a resin composition containing raw materials for producing a cured product, applying the resin composition to a substrate or a component constituting an element, and then reacting the raw materials to form a cured product. In this case, the resin composition can be obtained by preparing the resin composition, applying it to any substrate, curing it by drying and / or heating, and then peeling it off the substrate. Alternatively, the resin composition can be obtained by preparing the resin composition, applying it to a component constituting an element, and curing it by drying and / or heating, or by applying the resin composition to a component constituting an element, drying it as necessary, and then bringing another component constituting an element into contact with the applied resin composition and curing it by drying and / or heating. As the resin composition containing the raw materials for producing the cured product, the resin composition described in the section on the method for producing the cured product can be used.

[0282] The method for manufacturing the element may include steps other than the step of forming a cured product, for example, steps that are generally provided for manufacturing elements.

[0283] Furthermore, regarding the process of forming the cured product, as described above, the product that has been cured after coating may be used as is. However, from the viewpoint of ensuring good surface flatness and further suppressing variations in thickness, the method described below may be adopted. This method will be explained using Figure 6, which shows an example of the process of forming the cured product. In addition, the detailed conditions of this method can be appropriately applied from the conditions disclosed in Japanese Patent Application Publication No. 2022-36828. First, as shown in the process in Figure 6(a), at least one object to be coated 14, selected from chips and electrodes, is bonded to the support substrate 13. Next, as shown in the process in Figure 6(b), the material 11' constituting the cured product 11 is deposited on the surface of the support substrate 13 by a wet process to cover multiple objects to be coated 14 and fill the spaces between adjacent objects to be coated 14. A step may be included between Figure 6(a) and Figure 6(b) to grind the surface of the objects to be coated 14 to reduce their thickness. Next, as shown in the process in Figure 6(c), an insulating film 18 is deposited on the material 11' constituting the cured product 11 by a CVD method, a PVD method such as sputtering, or a wet process. Because the above-mentioned CVD method and PVD method for depositing insulating films reflect the shape of the substrate, the material 11' constituting the cured product 11 and the insulating film 18 are formed in an uneven shape. Next, as shown in the process in Figure 6(d), the insulating film 18 and the material 11' constituting the cured product 11 are subjected to CMP treatment from the insulating film 18 side to be flattened by polishing and form the cured product 11. By using a material harder than the material of the cured product as the material for the insulating film 18, the insulating film 18 can act as a polishing stopper during the polishing process shown in Figure 6(d), preventing over-polishing. Examples of materials for the insulating film 18 include inorganic materials such as silicon oxide (SiO2), silicon nitride (Si3N4), aluminum oxide (Al2O3), or silicon carbide (SiC). The insulating film 18 may also be an organic insulating film, and examples of materials constituting the organic insulating film include organic materials such as polyimide. Furthermore, depending on the application, another support substrate or the like can be provided on the surface of the cured product 11 obtained in the process shown in Figure 6(d).

[0284] Alternatively, two elements obtained in the process shown in Figure 6 above may be prepared and stacked so that the cured material 11 faces each other.

[0285] Furthermore, although an insulating film 18 is formed in the process shown in Figure 6 above, it is not necessary to use an insulating film. In other words, after the process shown in Figure 6(b), the material 11' constituting the cured product 11 is subjected to CMP treatment and flattened by polishing to form the cured product 11.

[0286] <Applications of the element> The application of the element is not particularly limited and can be applied to any known application where the element can be used. For example, specific examples of applications in which the element can be used include electronic devices selected from the group consisting of home appliances, information equipment, video equipment, audio equipment, imaging devices, and amusement equipment, as well as hybrid devices thereof. Another example of an application in which the element can be used is a device for moving in at least one area selected from the group consisting of land, underground, air, space, sea, and underwater. Specific examples of such devices include vehicles, ships, and aircraft, which may be manned or unmanned (drones). Each of these products has the element described above and can therefore obtain stable characteristics. [Examples]

[0287] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0288] [Synthesis of organosilicon compounds] (Synthesis of organosilicon compound 1-1) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (170 g), octamethylcyclotetrasiloxane (compound A-2) (63.8 g), toluene (193 g), and 4-methyltetrahydropyran (MTHP) (48.1 g) were placed in a reactor and heated at 55°C. Sulfuric acid (7.39 g) was added dropwise, and the mixture was stirred for 24 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 5:1, by weight) to obtain organosilicon compound (1-1) (178 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 98,000 and a number-average molecular weight of 38,000. 1 From 1H-NMR analysis, the mean value of n in the following formula was 4.1, with 18% of structures having n=1 and 23% having n=2. The proportion of structures with n=1 or n=2 represents the ratio of the number of structures corresponding to m=1 or m=2 in formula (B) to the total number of structures represented by formula (B), respectively. This is also true for the following examples and comparative examples.

[0289] [ka]

[0290] (Synthesis of comparative organosilicon compound P-1) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (300 g), octamethylcyclotetrasiloxane (compound A-2) (125 g), toluene (350 g), and 4-methyltetrahydropyran (87.6 g) were placed in a reactor and heated at 85°C. Sulfuric acid (13.2 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene:ethyl acetate = 21:3:1, by weight) to obtain organosilicon compound (P-1) (326 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 96,000 and a number-average molecular weight of 36,000. 1 From 1H-NMR analysis, in the following equation (P-1), the mean value of n was 4.2, with 23% of the structures having n=1 and 22% having n=2.

[0291] [ka]

[0292] (Synthesis of organosilicon compounds 1-2) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (150 g), octamethylcyclotetrasiloxane (compound A-2) (54.4 g), toluene (43.9 g), and 4-methyltetrahydropyran (176 g) were placed in a reactor and heated at 50°C. Sulfuric acid (15.1 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-2) (157 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 37,000 and a number-average molecular weight of 20,000. 1From 1H-NMR analysis, in the following equation (1-2), the mean value of n was 4.1, with 19% of the structures having n=1 and 22% having n=2.

[0293] [ka]

[0294] (Synthesis of organosilicon compounds 1-3) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (150 g), octamethylcyclotetrasiloxane (compound A-2) (54.4 g), toluene (110 g), and 4-methyltetrahydropyran (110 g) were placed in a reactor and heated at 50°C. Sulfuric acid (15.1 g) was added dropwise, and the mixture was stirred for 24 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-3) (157 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 54,000 and a number-average molecular weight of 26,000. 1 From 1H-NMR analysis, in the following equation (1-3), the average value of n was 4.4, with 15% of the structures having n=1 and 20% having n=2.

[0295] [ka]

[0296] (Synthesis of comparative organosilicon compound P-2) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (450 g), octamethylcyclotetrasiloxane (compound A-2) (163 g), toluene (330 g), and 4-methyltetrahydropyran (330 g) were placed in a reactor and heated at 90°C. Sulfuric acid (45.4 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (P-2) (440 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 39,000 and a number-average molecular weight of 22,000. 1 From 1H-NMR analysis, in the following equation (P-2), the mean value of n was 4.3, with 21% of the structures having n=1 and 19% having n=2.

[0297] [ka]

[0298] (Synthesis of organosilicon compounds 1-4) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (15.0 g), octamethylcyclotetrasiloxane (compound A-2) (3.4 g), toluene (9.8 g), and 4-methyltetrahydropyran (9.8 g) were placed in a reactor and heated at 55°C. Sulfuric acid (1.2 g) was added dropwise, and the mixture was stirred for 7 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-4) (13.9 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 57,000 and a number-average molecular weight of 26,000. 1From 1H-NMR analysis, in the following equation (1-4), the mean value of n was 3.0, with 23% of structures having n=1 and 26% having n=2.

[0299] [ka]

[0300] (Synthesis of organosilicon compounds 1-5) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (30.0 g), octamethylcyclotetrasiloxane (compound A-2) (6.8 g), toluene (20.9 g), and 4-methyltetrahydropyran (20.9 g) were placed in a reactor and heated at 55°C. Sulfuric acid (5.0 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-5) (25.9 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 60,000 and a number-average molecular weight of 30,000. 1 From 1H-NMR analysis, in the following equations (1-5), the mean value of n was 3.2, with 20% of the structures having n=1 and 27% having n=2.

[0301] [ka]

[0302] (Synthesis of organosilicon compounds 1-6) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (30.0 g), octamethylcyclotetrasiloxane (compound A-2) (6.8 g), toluene (22.1 g), and 4-methyltetrahydropyran (22.1 g) were placed in a reactor and heated at 40°C. Sulfuric acid (7.4 g) was added dropwise, and the mixture was stirred for 4 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-6) (32.0 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 61,000 and a number-average molecular weight of 31,000. 1 From 1H-NMR analysis, in the following equations (1-6), the mean value of n was 3.2, with 15% of the structures having n=1 and 29% having n=2.

[0303] [ka]

[0304] (Synthesis of organosilicon comparative compound P-3) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (300.0 g), octamethylcyclotetrasiloxane (compound A-2) (67.6 g), toluene (195.6 g), and 4-methyltetrahydropyran (195.6 g) were placed in a reactor and heated at 85°C. Sulfuric acid (23.6 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (P-3) (316.1 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 33,000 and a number-average molecular weight of 18,000. 1From 1H-NMR analysis, in the following equation (P-3), the mean value of n was 3.0, with 27% of the structures having n=1 and 24% having n=2.

[0305] [ka]

[0306] [Preparation of resin composition] Each component shown in Table 1 was uniformly mixed and dissolved in the mass ratios shown in Tables 1 to 4 to prepare resin compositions (Examples 1 to 20 and Comparative Examples 1 to 8). In the tables, the non-volatile content concentration is defined as {(total mass of resin composition - mass of solvent) / total mass of resin composition} × 100.

[0307] The components used other than the organosilicon compound (component A) are listed below.

[0308] (A compound having a functional group that can chemically bond with organosilicon compounds (component B)) • MS51: MKC Silicate MS51 (trademark), manufactured by Mitsubishi Chemical Corporation, tetramethoxysilane average pentamer. • ES40: Tetraethoxysilane oligomer, manufactured by Colcoat Co., Ltd., average degree of polymerization: 4-5 Trimethoxyphenylsilane: Manufactured by Tokyo Chemical Industry Co., Ltd. • 1,6-Bis(trimethoxysilyl)hexane: Manufactured by Tokyo Chemical Industry Co., Ltd. Triacetoxyphenylsilane: Manufactured by Tokyo Chemical Industry Co., Ltd.

[0309] (solvent) Anisole: Manufactured by Fujifilm Wako Pure Chemical Corporation • EDM: Diethylene glycol ethyl methyl ether, manufactured by Toho Chemical Industry Co., Ltd. • PGMEA: Propylene glycol monomethyl ether acetate, Fujifilm Wako Manufactured by Junyaku Co., Ltd. • 1,3-Dimethoxybenzene: Manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.

[0310] (curing catalyst) • ZC-150: Zirconium tetraacetylacetonate, manufactured by Matsumoto Fine Chemical Co., Ltd. • TC-750: Titanium ethyl acetoacetate, manufactured by Matsumoto Fine Chemical Co., Ltd.

[0311] [Evaluation of filtration performance] A solution was prepared by uniformly mixing and dissolving each component in the mass ratios shown in Tables 1-4, excluding the curing catalyst (component C). Next, a solution was obtained by uniformly mixing and dissolving component C in the mass ratios shown in Tables 1-4. Then, 100 mL of this solution was used to perform pressure filtration by stacking two membrane filters (ADVANTEC T300A047A and T500A047A). In this process, the filtration performance was evaluated by classifying the 100 mL of solution that could be filtered completely as "A" and those that became clogged and could not be filtered as "B". For those samples that received a "B" rating in the above filtration performance evaluation, film formation was not possible, and therefore, the subsequent evaluations were not performed.

[0312] [Manufacturing of cured film (layer); evaluation of film thickness and flatness] Each component, excluding the curing catalyst (component C), was uniformly mixed and dissolved in the mass ratios shown in Tables 1-4 to prepare a solution. Then, component C was uniformly mixed and dissolved in the mass ratios shown in Tables 1-4 to obtain a solution. Using the solution, a film was deposited on a glass substrate (Corning Eagle XG) by spin coating (Mikasa MS-A150). The film was then heated in an oven (ESPEC STH-120) at 200°C for 90 minutes, followed by heating at 300°C for 1 hour to obtain a cured film. Subsequently, five locations were selected to evaluate the entire film, and the film at these locations was scraped with a cutter. The film thickness at the five locations was measured using a step gauge (KLA-Tencor P-16+), and the standard deviation was calculated. The average value of the film thickness measured at the five locations was taken as the average thickness (film thickness), and the flatness was evaluated as (standard deviation / average thickness) × 100 (%).

[0313] [Insulation resistance] Each component, excluding the curing catalyst (component C), was uniformly mixed and dissolved in the mass ratios shown in Tables 1-4 to prepare a solution. Then, component C was uniformly mixed and dissolved in the mass ratios shown in Tables 1-4 to obtain a solution. Using the solution, a film was deposited on a chromium vapor-deposited substrate (manufactured by Mitsuru Engineering Laboratory Co., Ltd.) by spin coating (MS-A150, manufactured by Mikasa Corporation). The film was then heated in an oven (STH-120, manufactured by ESPEC Corporation) at 200°C for 90 minutes, followed by firing at 300°C for 1 hour to obtain a cured film. Subsequently, 2 × 10⁶ units of aluminum were added to the fired film. -5 m 2 The substrate was vacuum-deposited (using Vacuum Devices Co., Ltd.'s VE-2030) to form a circular shape, and its insulation resistance was measured at an applied voltage of 500V using a micro-ammeter (Keysight Technologies' femtopicoammeter B2981A).

[0314] [Dielectric breakdown voltage] Similar to the insulation resistance measurement described above, a substrate with a cured aluminum film was prepared, and a voltage was applied at 200V intervals up to 1000V using the same apparatus. The voltage at which the current value exceeded 0.001A was defined as the dielectric breakdown voltage.

[0315] The content percentages of each component in Tables 1-4 represent the content percentage (parts by mass) when the content percentage of component A is set to 100 parts by mass.

[0316] [Table 1]

[0317] [Table 2]

[0318] [Table 3]

[0319] [Table 4]

[0320] Tables 1-4 show that, regarding the organosilicon compounds contained in the resin composition used to produce the cured product, the proportion of structures represented by formula (B) with m=2 is greater than the proportion of structures represented by formula (B) with m=1, resulting in a cured product (film) with less variation in thickness. Specifically, the solution in the example showed less change in viscosity from solution preparation to application compared to the solution in the comparative example, resulting in a smaller film thickness standard deviation (less variation in film thickness), meaning the film had good flatness. By using such cured materials, it is possible not only to obtain elements with stable properties, but also to improve the yield in the manufacturing of those elements. Furthermore, it was found that all of the cured materials produced in this embodiment possessed good insulation resistance. In addition, it was found that the small variation in the thickness of the cured materials prevented dielectric breakdown in the elements, resulting in good insulation properties. It should be noted that this evaluation of insulation resistance is not intended to show the relationship between the variation in the thickness of the cured materials and the properties of the cured materials, but rather to confirm that good insulation resistance can be obtained for the entire element, which is the cured material as a whole.

[0321] From the above, it was found that in a cured resin composition containing an organosilicon compound (component A) having structures represented by formulas (A) and (B), if the proportion of the organosilicon compound with a structure represented by the following formula (B) where m=2 is greater than the proportion of the structure represented by the following formula (B) where m=1, then it is possible to obtain a device with small variations in the thickness of the cured product and stable properties.

Claims

1. An element having a cured material, The cured product is a cured product of a resin composition containing an organosilicon compound having the structures represented by the following formulas (A) and (B). The aforementioned organosilicon compound, The proportion of structures represented by the following formula (B) where m = 2 is, The proportion of structures represented by the following formula (B) where m = 1 is greater than the proportion of structures represented by the formula (B) below. element. 【Chemistry 1】 (In the above formula (A), R １ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; ２ These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In the above formula (B), R ３ m is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; m is an integer from 1 to 30; R １ 、R ２ 、and R ３ When at least one of them is an alkyl group having 1 to 40 carbon atoms, the alkyl group having 1 to 40 carbon atoms is independently such that at least one hydrogen atom is independently a halogen atom, a cycloalkyl group A having 5 or 6 carbon atoms １２ or an aryl group A having 6 to 20 carbon atoms １４ may be replaced, and at least one -CH ２ - is independently -O-, -CO-, a cycloalkylene group A having 5 or 6 carbon atoms １３ or an arylene group A having 6 to 20 carbon atoms １５ may be replaced; R １ , R ２ , and R ３ If at least one of the C5 or C6 cycloalkyl group is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1 to C40 alkyl group A ２１ , a cycloalkyl group A having 5 or 6 carbon atoms ２２ , or an aryl group A having 6 to 20 carbon atoms ２４ It may be replaced by at least one -CH ２ The - can be independently replaced by -O- or -CO-; R １ , R ２ , and R ３ If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group independently comprises at least one hydrogen atom independently comprising a halogen atom and an alkyl group A having 1-C40 atoms. ３１ , a cycloalkyl group A having 5 or 6 carbon atoms ３２ , or an aryl group A having 6 to 20 carbon atoms ３４ It can be replaced with; Alkyl group A ２１ and alkyl group A ３１ Independently, at least one hydrogen atom is independently a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or a group having 6 to 20 carbon atoms. It may be replaced by an aryl group, and at least one -CH ２ The - can be independently replaced by -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; cycloalkyl group A １２ , cycloalkylene group A １３ cycloalkyl group A ２２ and cycloalkyl group A ３２ The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH ２ The - can be independently replaced by -O-, -CO-, etc.; aryl group A １４ , Arylene group A １５ aryl group A ２４ and aryl group A ３４ (Independently, at least one hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.)

2. The organosilicon compound consists of a compound represented by the following formula (1): It includes at least the structure represented by the following formula (3): The proportion of structures represented by the following formula (3) where n=2 is, The proportion of structures represented by the following formula (3) where n=1 is greater than the proportion of structures where n=1. The element according to claim 1. 【Chemistry 2】 (In formula (1) above, X includes one or more structures represented by formula (2) above, and does not include any other structures; when X includes two or more structures represented by formula (2) above, the two or more structures may be the same or different; Y １ This is a single bond or a structure represented by formula (3) above; In the above equation (2), R １ R in formula (A) is independent of the above. １ It is synonymous with; R ２ R in formula (A) is independent of the above. ２ It is synonymous with; Y ２ This is a single bond or a structure represented by formula (3) above, and Y １ It may be the same as or different from; In the above formula (3), R ３ R in formula (B) is independent of the above. ３ This is synonymous with [the above]; n is an integer between 1 and 30.

3. The element according to claim 1, wherein the resin composition comprises a compound having a functional group that can chemically bond with the organosilicon compound.

4. The device according to claim 3, wherein the compound having the functional group is a compound having two or more of one or more groups represented by the following formulas (F-1) to (F-8). 【Transformation 3】 (In the above formulas (F-1) to (F-8), R ４ (These are independently a hydrogen atom, a C1-C20 alkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently substituted with a halogen atom; * indicates a bonding site.)

5. The device according to claim 4, wherein the compound having the functional group comprises one or more silicon compounds selected from a hydrolyzable organosilane compound represented by the following formula (10) and a partially hydrolyzed condensate of the hydrolyzable organosilane compound. R ５ ４－ａ SiZ ａ (10) (In the above formula (10), R ５ (i) is independently a C1-C20 alkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently substituted with a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently substituted with a halogen atom; Z is independently one of the groups represented by formulas (F-1) to (F-8); and a is an integer from 2 to 4.

6. The element according to claim 5, wherein formula (10) is the following formula (11). R ６ ４－ｂ Si(ОR ７ ) ｂ (11) (In the above formula (11), R ６ R is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently substituted with a halogen atom; ７ (b is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; b is an integer from 2 to 4.)

7. It further comprises at least one component selected from the group consisting of chips, wafers, and electrodes, The element according to claim 1, wherein at least a portion of the cured material is in contact with at least one component selected from the group consisting of a chip, a wafer, and an electrode.

8. At least a portion of the cured product is independently selected from the group consisting of chips, wafers, and electrodes. The element according to claim 7, which contacts at least one selected member.

9. The system comprises at least one object to be coated, selected from chips and electrodes, and a support substrate for supporting the object to be coated. At least a portion of the object to be coated is covered with the cured material. The element according to claim 7.

10. The element according to claim 1, having a laminate having a layer structure of three or more layers, wherein at least one of the intermediate layers included in the laminate is the cured product.

11. An electronic device having the element according to any one of claims 1 to 10.

12. The process includes a step of applying a resin composition to form a cured product, The resin composition is The present invention contains organosilicon compounds having structures represented by the following formulas (A) and (B): The aforementioned organosilicon compound, The proportion of structures represented by the following formula (B) where m = 2 is, The proportion of structures represented by the following formula (B) where m = 1 is greater than the proportion of structures represented by the formula (B) below. A method for manufacturing an element. 【Chemistry 4】 (In the above formula (A), R １ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; ２ These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; In the above formula (B), R ３ m is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; m is an integer from 1 to 30; R １ , R ２ , and R ３ If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. １２ , or an aryl group A having 6 to 20 carbon atoms １４ It may be replaced by at least one -CH ２ The hyphens independently form -O-, -CO-, or a cycloalkylene group A with 5 or 6 carbon atoms. １３ , or an arylene group A having 6 to 20 carbon atoms １５ It can be replaced with; R １ , R ２ , and R ３ If at least one of them is a cycloalkyl group having 5 or 6 carbon atoms, then the cycloalkyl group having 5 or 6 carbon atoms is independently at least A single hydrogen atom independently forms a halogen atom, and an alkyl group A has 1 to 40 carbon atoms. ２１ , a cycloalkyl group A having 5 or 6 carbon atoms ２２ , or an aryl group A having 6 to 20 carbon atoms ２４ It may be replaced by at least one -CH ２ The - can be independently replaced by -O- or -CO-; R １ , R ２ , and R ３ If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group independently comprises at least one hydrogen atom independently comprising a halogen atom and an alkyl group A having 1-C40 atoms. ３１ , a cycloalkyl group A having 5 or 6 carbon atoms ３２ , or an aryl group A having 6 to 20 carbon atoms ３４ It can be replaced with; Alkyl group A ２１ and alkyl group A ３１ are each independently such that at least one hydrogen atom may be independently replaced by a halogen atom, a C5 or C6 cycloalkyl group, or a C6-20 aryl group, and at least one -CH ２ - may be independently replaced by -O-, -CO-, a C5 or C6 cycloalkylene group, or a C6-20 arylene group; cycloalkyl group A １２ , cycloalkylene group A １３ , cycloalkyl group A ２２ and cycloalkyl group A ３２ are each independently such that at least one hydrogen atom may be independently replaced by a halogen atom, a C1-40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-20 aryl group, and at least one -CH ２ - may be independently replaced by -O-, -CO-; aryl group A １４ , arylene group A １５ , aryl group A ２４ and aryl group A ３４ are each independently such that at least one hydrogen atom may be independently replaced by a halogen atom, a C1-40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-20 aryl group. )

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