Method for manufacturing optical components, apparatus for manufacturing optical components, preforms, optical components, lens units and equipment

By creating a temperature distribution and using a low-absorption rate film on the preform, the demolding process for small-diameter optical components is simplified, preventing scratches and cracks while reducing apparatus complexity and cost.

JP2026105739APending Publication Date: 2026-06-26CANON KK

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
CANON KK
Filing Date
2024-12-16
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing methods for demolding small-diameter optical components risk causing scratches or cracks, and methods involving mold deformation complicate the molding apparatus and increase costs.

Method used

A method involving a heating step to create a temperature distribution on the preform, where the outer region has a lower temperature than the central region, and using a film with a lower electromagnetic wave absorption rate to reduce adhesion force during demolding.

Benefits of technology

Enables easy demolding of small-diameter optical components without scratches or cracks, reducing the complexity and cost of the molding process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a method for manufacturing components that enables easy release of the optical component from the mold without causing scratches or cracks. [Solution] The method for manufacturing the component comprises a heating step of heating a preform to form a temperature distribution on the preform, and a molding step of pressing the preform with the temperature distribution formed on it using a mold to form a component from the preform, wherein the preform has a first region and a second region outside the first region, and the heating step forms a temperature distribution in which the temperature of the second region is lower than the temperature of the first region.
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Description

Technical Field

[0001] The present invention relates to a method for manufacturing an optical member, an apparatus for manufacturing an optical member, a preform, an optical member, a lens unit, and a device.

Background Art

[0002] In recent years, with the increase in magnification and miniaturization of optical devices, high-precision and miniaturization of optical systems have been required. As an optical member employed in these optical systems, there is an optical member made of glass, and with the miniaturization of products, the necessity of molding an optical member with a small outer diameter has been increasing. In molding a small-diameter optical member, since the diameters of the mold and the optical member are small, the amount of thermal deformation becomes small, and there are cases where the mold and the optical member do not separate. Therefore, a method for separating the mold and the optical member has been proposed.

[0003] Patent Document 1 discloses a method of separating a mold and an optical member by protruding a separating member from a portion where the mold and the optical member are in contact and bringing the separating member into contact with the optical member to apply an external force for separation.

[0004] Also, as a method different from the method of separating by bringing a separating member into contact with an optical member, there is a method disclosed in Patent Document 2. Patent Document 2 discloses a method of forming a thin elastic portion on the outer peripheral portion of a mold and changing the curvature of the outer peripheral portion by applying an external force to this elastic portion to separate the mold and the optical member.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, the method of demolding by applying external force as described in Patent Document 1 may cause scratches or cracks in the optical component before it is demolded from the mold. Furthermore, the method of demolding by deforming the thin elastic portion of the outer circumference of the mold as described in Patent Document 2 may complicate the molding apparatus and lead to increased costs for the optical component.

[0007] This invention has been made in view of the above problems, and aims to provide a method for manufacturing optical components, an apparatus for manufacturing optical components, a preform, an optical component, a lens unit, and equipment that can easily release the mold from the component without causing scratches or cracks. [Means for solving the problem]

[0008] According to one aspect of the present invention, the invention comprises a heating step of heating a preform to form a temperature distribution on the preform, and a molding step of pressing the preform with the temperature distribution formed on it using a mold to form a member from the preform, wherein the preform has a first region and a second region outside the first region. The heating step provides a method for manufacturing a member that forms a temperature distribution in which the temperature of the second region is lower than the temperature of the first region.

[0009] According to another aspect of the present invention, there is a manufacturing apparatus for a member comprising a mold, a heating unit that heats a preform to form a temperature distribution on the preform, and a drive system that presses the preform on which the temperature distribution has been formed with the mold to form a member from the preform or to release the member from the mold, wherein the preform has a first region and a second region outside the first region, and the heating unit forms the temperature distribution in which the temperature of the second region is lower than the temperature of the first region.

[0010] According to another aspect of the present invention, a preform used for press forming, comprising a first region and A preform is provided which has a second region outside the first region, wherein a film with a lower electromagnetic wave absorption rate than the preform is formed in the second region.

[0011] According to another aspect of the present invention, a member is provided having a main body and a film attached to the main body that has a lower electromagnetic wave absorption rate than the main body, wherein the main body has a first region and a second region outside the first region, and the second region alternately comprises a third region to which the film is attached and a fourth region to which the main body is exposed. [Effects of the Invention]

[0012] According to the present invention, it is possible to easily release the mold from the component without causing scratches or cracks. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic diagram showing a molding apparatus according to the first embodiment of the present invention. [Figure 2A] This is a cross-sectional view showing the state before press molding in the manufacturing method of an optical member according to the first embodiment of the present invention. [Figure 2B] This is a cross-sectional view showing the state during press molding in the method for manufacturing an optical component according to the first embodiment of the present invention. [Figure 2C] This is a cross-sectional view showing the state after demolding in the manufacturing method of an optical component according to the first embodiment of the present invention. [Figure 3A] This is a plan view showing a molded optical component manufactured by the manufacturing method of an optical component according to the first embodiment of the present invention. [Figure 3B] This is a cross-sectional view showing a molded optical component manufactured by the manufacturing method of an optical component according to the first embodiment of the present invention. [Figure 4] This is a cross-sectional view showing a mold in a molding apparatus according to a modified example 1 of the first embodiment of the present invention. [Figure 5] This is a cross-sectional view showing a mold in a molding apparatus according to a modified example 2 of the first embodiment of the present invention. [Figure 6]It is a cross-sectional view showing a mold in a molding apparatus according to Modification Example 3 of the first embodiment of the present invention. [Figure 7] It is a cross-sectional view showing a mold in a molding apparatus according to Modification Example 4 of the first embodiment of the present invention. [Figure 8] It is a cross-sectional view showing a mold in a molding apparatus according to Modification Example 5 of the first embodiment of the present invention. [Figure 9A] It is a cross-sectional view showing a mold and a heater in a molding apparatus according to the second embodiment of the present invention. [Figure 9B] It is a cross-sectional view showing a heater in a molding apparatus according to the second embodiment of the present invention. [Figure 10A] It is a cross-sectional view showing a mold and a heater in a molding apparatus according to Modification Example 1 of the second embodiment of the present invention. [Figure 10B] It is a plan view showing a heater in a molding apparatus according to Modification Example 1 of the second embodiment of the present invention. [Figure 11A] It is a cross-sectional view showing a mold and a heater in a molding apparatus according to Modification Example 2 of the second embodiment of the present invention. [Figure 11B] It is a plan view showing a heater in a molding apparatus according to Modification Example 2 of the second embodiment of the present invention. [Figure 12A] It is a cross-sectional view showing a mold and a heater in a molding apparatus according to Modification Example 3 of the second embodiment of the present invention. [Figure 12B] It is a plan view showing a heater in a molding apparatus according to Modification Example 3 of the second embodiment of the present invention. [Figure 13A] It is a schematic view showing an interchangeable lens according to the third embodiment of the present invention. [Figure 13B] It is a cross-sectional view showing a lens unit in an interchangeable lens according to the third embodiment of the present invention. [Figure 14A] It is a schematic view showing a camera according to the third embodiment of the present invention. [Figure 14B] [[ID=4x2]]It is a cross-sectional view showing a lens unit in a camera according to the third embodiment of the present invention. [Figure 15A] It is a schematic view showing an information terminal according to the third embodiment of the present invention. [Figure 15B] This is a cross-sectional view showing a lens unit in a camera mounted on an information terminal according to a third embodiment of the present invention. [Modes for carrying out the invention]

[0014] [First Embodiment] A first embodiment of the present invention will be described with reference to Figures 1 to 8, describing an apparatus for manufacturing optical components, a method for manufacturing optical components, a preform, and an optical component. In this embodiment, the manufacturing of an optical component will be described as an example of a component. The embodiments and examples shown below are illustrative, and for example, the detailed configuration can be modified as appropriate without departing from the spirit of the present invention. In addition, in the following descriptions of embodiments and examples, elements indicated by the same reference numeral in the figures will have the same function unless otherwise specified. In addition, if multiple identical elements are arranged in the figures, the reference numeral and its description may be omitted. Also, for the convenience of illustration and explanation, the shape, size, arrangement, etc. of the elements shown in the figures may be represented schematically.

[0015] First, the configuration of the optical component manufacturing apparatus according to this embodiment will be explained with reference to Figure 1. Figure 1 is a schematic diagram showing the optical component molding apparatus 100 according to this embodiment. Note that Figure 1 shows the state of the molding die 10 before molding.

[0016] The optical component molding apparatus 100 according to this embodiment is an optical component manufacturing apparatus that manufactures optical components by press molding. As shown in Figure 1, the molding apparatus 100 according to this embodiment includes a molding die 10, a drive system 12, a heater 14, and a gas introduction pipe 16. The molding apparatus 100 also includes a position sensor 18, a temperature sensor 20, a heater output control device 22, a flow rate control device 24, and a controller 26.

[0017] The mold 10 is a mold having, for example, a cylindrical upper mold member 1 and, for example, a cylindrical lower mold member 2. The upper mold member 1 is positioned above the lower mold member 2. The upper mold member 1 has a molding surface 1a that contacts the preform 3 from above, and the lower mold member 2 has a molding surface 2a that contacts the preform 3 from below. The molding surfaces 1a and 2a each have a shape corresponding to the optical functional surface of the optical member to be molded, and each has a shape corresponding to one and the other opposing faces of the optical member. The upper mold member 1 and the lower mold member 2 are positioned vertically so that their respective molding surfaces 1a and 2a face each other. The preform 3 to be molded into an optical member is positioned between the opposing molding surfaces 1a and 2a. The mold 10 is, for example, a mold in which the upper mold member 1 and the lower mold member 2 are made of metal, but it may also be a mold in which one or both of the upper mold member 1 and the lower mold member 2 are made of a material other than metal.

[0018] For example, to form an optical component having a biconvex lens shape, both molding surfaces 1a and 2a can be concave. Furthermore, the surface roughness of molding surfaces 1a and 2a can be 30 nm or less in maximum height Rmax. Also, materials such as cemented carbide can be used for the upper mold member 1 and lower mold member 2. From the viewpoint of ensuring wear resistance, smoothness, etc., a film such as a diamond-like carbon (hereinafter referred to as "DLC") film is formed on molding surfaces 1a and 2a. However, it is not necessary for a film such as a DLC film to be formed on molding surfaces 1a and 2a. Furthermore, the shapes of molding surfaces 1a and 2a are not particularly limited, and various shapes can be adopted depending on the shape of the optical component to be molded, as shown in the modified examples described later.

[0019] The drive system 12 presses the preform 3, which has a temperature distribution formed in the heating process as described later, with the mold 10 in the molding process to form an optical member from the preform 3, or releases the optical member from the mold 10 in the release process. Specifically, the drive system 12 is, for example, a motor, and moves one or both of the upper mold member 1 and the lower mold member 2 in the vertical direction during press molding of the optical member. As a result, the drive system 12 brings the upper mold member 1 and the lower mold member 2 closer to each other in the vertical direction, bringing the molding surface 1a and the molding surface 2a closer to each other, and presses the preform 3 between the molding surface 1a and the molding surface 2a to form the optical member. In addition, the drive system 12 moves one or both of the upper mold member 1 and the lower mold member 2 in the vertical direction during release after molding of the optical member. As a result, the drive system 12 separates the upper mold member 1 and the lower mold member 2 in the vertical direction, separating the molding surface 1a and the molding surface 2a from each other to open the mold. The position sensor 18 detects the vertical position of the upper mold member 1 or the lower mold member 2, which is driven by the drive system 12, and outputs position information related to that position. The operation of the drive system 12 is controlled by the controller 26 based on the position information output from the position sensor 18.

[0020] Furthermore, the heater 14 is a heating unit for heating the mold 10, which includes the upper mold member 1 and the lower mold member 2, and the preform 3 to a temperature suitable for press molding. The heater 14 is, for example, an infrared heater, which heats the mold 10 and the preform 3 by irradiating them with energy using electromagnetic waves such as infrared rays. As the heater 14, for example, one that can heat to 1000°C or higher in an inert atmosphere such as N2 gas can be used. The temperature sensor 20 is, for example, provided on the mold 10, and detects the temperature of the mold 10 and outputs temperature information related to the temperature of the mold 10. The heater output control device 22 controls the output of the heater 14. The operation of the heater output control device 22 is controlled by the controller 26 based on the temperature information output from the temperature sensor 20.

[0021] The gas inlet pipe 16 is a cooling unit that cools the mold 10 in order to remove the optical component molded from the mold 10. The gas inlet pipe 16 is configured to blow a cooling gas such as N2 gas onto the mold 10, including the upper mold member 1 and the lower mold member 2, which are the objects to be cooled, and onto the heater 14. The flow rate control device 24 controls the flow rate of the cooling gas in the gas inlet pipe 16. The operation of the flow rate control device 24 is controlled by the controller 26 based on the temperature information output from the temperature sensor 20. Note that the cooling unit for cooling the mold 10 is not limited to the gas inlet pipe 16, and the mold 10 may be cooled by other cooling mechanisms.

[0022] The controller 26 is an information processing device that functions as a control unit for managing and controlling each part of the molding apparatus 100. The controller 26 has a processor (not shown) that performs various calculations, controls, and discriminations. The controller 26 also has storage (not shown) that stores various control programs executed by the processor, databases referenced by the processor, etc. The controller 26 also has memory (not shown) that temporarily stores data being processed by the processor, input data, etc. The controller 26 is not particularly limited, but it can be configured as a general-purpose computer device such as a personal computer, or it can be configured as a computer device dedicated to the molding apparatus 100. Furthermore, each function of the controller 26 can be realized by a single computer device, or it can be realized by multiple computer devices.

[0023] The controller 26 controls the vertical movement of one or both of the upper mold member 1 and the lower mold member 2 by controlling the operation of the drive system 12 based on position information output from the position sensor 18. The controller 26 also controls the temperature of the mold 10 by controlling the temperature of the heater 14 by controlling the operation of the heater output control device 22 based on temperature information output from the temperature sensor 20. By controlling the temperature of the heater 14, the controller 26 can control the temperature of the mold 10 and the preform 3 to a desired temperature during press molding. Furthermore, the controller 26 controls the temperature of the mold 10 by controlling the flow rate control device 24 based on temperature information output from the temperature sensor 20 to control the flow rate of the cooling gas in the gas introduction pipe 16. By controlling the flow rate of the cooling gas, the controller 26 can control the temperature of the mold 10 and the optical member to a desired temperature during cooling after press molding.

[0024] Preform 3 is a molding material that can be molded into optical components such as optical glass. Examples of optical glass used as the material for preform 3 include borosilicate glass, lanthanum glass, and fluorine glass. However, preform 3 is not limited to being made of optical glass; it may also be made of a resin such as a thermoplastic resin, or a composite material of glass and resin. The shape of preform 3 is not particularly limited, but for example, it may have two opposing surfaces 3a and 3b, and both surfaces 3a and 3b may be disc-shaped with an outward convex shape. During press molding, preform 3 is placed on the molding surface 2a of the lower mold member 2 such that one surface 3a faces the molding surface 1a of the upper mold member 1 and the other surface 3b faces the molding surface 2a of the lower mold member 2.

[0025] A film 4 is partially formed on the surface of the preform 3, having an electromagnetic wave absorption rate lower than that of the preform 3. The electromagnetic waves referred to here are infrared rays and other electromagnetic waves from the mold 10 and the heater 14 that heats the preform 3. Preferably, the film 4 has an electromagnetic wave absorption rate that is 50% or more lower than that of the preform 3 with respect to the peak wavelength of the electromagnetic waves.

[0026] Specifically, the film 4 is formed on the surface of the outer peripheral region of the preform 3, which has a central region and an outer peripheral region outside the central region, i.e., on the outer peripheral regions of surfaces 3a and 3b, which are the surfaces of the preform 3. The film 4 is also formed on the side surface of the preform 3 between the outer peripheral portion of surface 3a and the outer peripheral region of surface 3b. The outer peripheral region of the preform 3 is a peripheral region with a predetermined width that is outside the central region of the preform 3. The central region of the preform 3 is surrounded by the outer peripheral region of the preform 3. Preferably, the outer peripheral region of the preform 3 is a region that is outside the optically effective diameter of the optical member 5 formed from the preform 3. Here, the optically effective diameter means the diameter of the optically functional surface of the optical member 5. Specifically, when the preform 3 has a planar shape such as a circle, it is preferable that it is a region that is outside the central region which accounts for 90% of the outer diameter of the preform 3.

[0027] The film 4 is not particularly limited, but can be formed by methods such as sputtering, vapor deposition, chemical vapor deposition (CVD), wet coating, or brush coating. The film 4 can be pre-formed on the preform 3 using these film formation methods in a film formation step prior to the manufacturing of the optical component. Alternatively, the film 4 can be formed on the preform 3 using these film formation methods as one step in the manufacturing of the optical component. Furthermore, the film 4 may be formed continuously, intermittently, or partially in the outer peripheral region of the preform 3. The thickness of the film 4 is not particularly limited, but can be in the range of several tens of nanometers to 100 nanometers.

[0028] Furthermore, it is preferable that the film 4 is a film that does not easily adhere to films such as DLC films formed on the molding surfaces 1a and 2a of the upper mold member 1 and the lower mold member 2. The film 4 is composed of, for example, an oxide or a material containing carbon. Specifically, examples of films 4 include films made of silicon dioxide (hereinafter referred to as "SiO2"), zirconia (hereinafter referred to as "ZrO2"), hydrocarbons (hereinafter referred to as "CH"), DLC, tin oxide (hereinafter referred to as "SnO2"), alumina (hereinafter referred to as "Al2O3"), etc. In this embodiment, as will be described later, a temperature distribution is formed on the preform 3 during the heating process due to the formation of the film 4.

[0029] Next, a method for manufacturing an optical component using the molding apparatus 100 according to this embodiment will be described with reference to Figures 2A to 3B. Figures 2A to 2C are cross-sectional views showing the mold 10, preform 3 or optical component 5 and film 4 in the method for manufacturing an optical component according to this embodiment. Figure 2A shows the state before press molding, Figure 2B shows the state during press molding, and Figure 2C shows the state after press molding. Figure 3A is a plan view showing the optical component 5 after molding. Figure 3B is a cross-sectional view showing the optical component 5 after molding.

[0030] The method for manufacturing an optical component using the molding apparatus 100 according to this embodiment comprises a heating step, a press molding step, a cooling step, and a demolding step, which are performed sequentially. The temperature, press load, shape of the mold 10, etc., selected in the series of molding processes can be appropriately set depending on the type of material such as optical glass that constitutes the preform 3, the shape of the optical component, etc.

[0031] Before the heating process begins, the mold 10 is in an open state, with a predetermined gap between the upper mold member 1 and the lower mold member 2. First, in the heating process, the controller 26 controls the output of the heater 14 via the heater output control device 22, and heats the mold 10 with the heater 14 so that the temperature of the mold 10 reaches a first temperature. When the temperature of the mold 10 reaches the first temperature, as shown in Figure 2A, the preform 3 is placed on the center of the molding surface 2a of the lower mold member 2, and the preform 3 is placed between the molding surface 1a of the upper mold member 1 and the molding surface 2a of the lower mold member 2. In this way, the preform 3 is placed in the mold 10. The preform 3 may have a film 4 formed on it in advance in a film formation process prior to the implementation of the optical member manufacturing method as described above, or the film 4 may be formed by a film formation process as one of the steps in the optical member manufacturing method.

[0032] After the preform 3 is placed, in the subsequent heating process, the controller 26 controls the output of the heater 14 via the heater output control device 22, heating the mold 10 with the heater 14 so that its temperature reaches a second temperature higher than the first temperature. This heats the preform 3 placed in the mold 10, softening it until its viscosity is suitable for press molding.

[0033] Here, as described above, a film 4 is formed on the surface of the outer periphery of the preform 3, having an electromagnetic wave absorption rate lower than that of the preform 3. Therefore, in the preform 3, the electromagnetic wave absorption rate changes between the outer periphery where the film 4 is formed and the central region, which is the region inside the outer periphery. Since the electromagnetic wave absorption rate of the film 4 formed on the outer periphery is lower than that of the preform 3, when the preform 3 is heated by radiation, the central region of the preform 3 becomes hotter than the outer periphery of the preform 3. In this way, the formation of the film 4 creates a temperature distribution in the preform 3 during the heating process. In terms of temperature distribution, from the viewpoint of moldability, it is preferable that the temperature of the central and outer regions of the preform 3 is above the glass dislocation point of the preform 3. Also, in terms of temperature distribution, from the viewpoint of ensuring better release properties, it is preferable that the temperature of the outer periphery of the preform 3 is 10°C or more lower than the temperature of the central region of the preform 3.

[0034] Next, in the press forming process, as shown in Figure 2B, the controller 26 controls the operation of the drive system 12 to move the upper mold member 1, located above the preform 3, downward, applying a press load to the softened preform 3 and pressing it down. At this point, a temperature distribution is formed on the preform 3 as described above. As a result, the controller 26 transfers the shapes of the molding surfaces 1a and 2a of the upper mold member 1 and the lower mold member 2 to the preform 3, thereby obtaining an optical member 5 with the desired shape. The controller 26 maintains the press state, pressing the optical member 5 for a certain period even after the press forming is complete, before proceeding to the next cooling process.

[0035] Next, in the cooling process, the controller 26 cools the mold 10 and optical member 5 to a desired temperature by controlling the flow rate of the cooling gas blown out from the gas introduction pipe 16 via the flow rate control device 24. When the mold 10 reaches a third temperature lower than the second temperature, the controller 26 proceeds to the demolding process.

[0036] Next, in the demolding process, as shown in Figure 2C, the controller 26 moves the upper mold member 1, which was positioned above the optical member 5 molded from the preform 3, upward to relieve the press load on the optical member 5. Once the press load is relieved, the optical member 5, which had been crushed by the press load, deforms and is released from the molding surfaces 1a and 2a of the upper mold member 1 and lower mold member 2. After demolding, the optical member 5 is removed from the mold 10.

[0037] In this way, the optical component 5 is manufactured by press molding. The above manufacturing method is just one example, and various modifications are possible. For example, although the above description describes the case in which the upper mold member 1 is moved downward and upward, it is not limited to this. For example, by moving the lower mold member 2 upward and downward together with the upper mold member 1, or instead of the upper mold member 1, the preform 3 can be pressed in the molding process and the optical component 5 can be released from the mold 10 in the release process.

[0038] As shown in Figures 3A and 3B, the optical member 5 may have a film 4 remaining attached to it after being removed from the mold 10. In this case, the optical member 5 has a main body portion 51 formed from a preform 3 and a film 4 partially attached to the surface of the main body portion 51. The main body portion 51 has a central region corresponding to the central region of the preform 3 and an outer peripheral region corresponding to the outer peripheral region of the preform 3. The film 4 is formed on the outer peripheral region of the main body portion 51. Specifically, the main body portion 51 has surfaces 5a and 5b corresponding to surfaces 3a and 3b of the preform 3. The film 4 remains attached to the outer peripheral regions of surfaces 5a and 5b of the main body portion 51. The film 4 has an electromagnetic wave absorption rate lower than the electromagnetic wave absorption rate of the main body portion 51 made from the preform 3. It is preferable that the outer peripheral region of the main body portion 51 to which the film 4 is attached is a region outside the optically effective diameter of the optical member 5. Specifically, when the main body portion 51 has a planar shape such as a circle, it is preferable that the region is outside the central region which accounts for 90% of the outer diameter of the main body portion 51.

[0039] The film 4 attached to the outer peripheral regions of surfaces 5a and 5b has cracks 4a, such as fissures, that expose surfaces 5a and 5b. The cracks 4a occur in a manner that divides the film 4 in the circumferential direction of the optical member 5. As a result, the outer peripheral region of the main body 51 consists of alternating areas where the film 4 is attached and areas where surfaces 5a and 5b of the main body 51 are exposed through the cracks 4a.

[0040] If the film 4 is attached to the optical component 5, the attached film 4 may be removed or left attached. The film 4 can be removed from the optical component 5 by etching or the like. Depending on the material, the film 4 may also disappear from the optical component 5 after molding due to the heat generated when molding the optical component 5 from the preform 3.

[0041] As described above, in this embodiment, a film 4 having a lower electromagnetic wave absorption rate than the electromagnetic wave absorption rate of the preform 3 is formed on the outer peripheral region of the preform 3. As a result, in this embodiment, during the heating process, the outer peripheral region of the preform 3, where the film 4 has been formed, is at a lower temperature than the central region of the preform 3. The viscosity of the preform 3 material, such as glass, increases as the temperature decreases. Therefore, due to the temperature distribution formed on the preform 3 during the heating process with the film 4 formed, the viscosity of the material in the outer peripheral region of the preform 3 becomes higher than the viscosity of the material in the central region of the preform 3. When the preform 3 is press-molded during the molding process with the viscosity of the material higher in the outer peripheral region than in the central region, the material in the outer peripheral region of the preform 3 becomes less likely to penetrate the molding surfaces 1a and 2a of the mold 10. As a result, the true contact area between the outer peripheral region of the preform 3 and the molding surfaces 1a and 2a of the mold 10 decreases, and the adhesion force between them decreases. In this way, the adhesion force between the outer peripheral region of the optical member 5 molded from the preform 3 and the mold 10 can be reduced, so that demolition occurs from the outer peripheral region of the optical member 5 during the cooling process or demolding process. When demolition occurs in the outer peripheral region of the optical member 5, stress concentrates on the undemolished and outermost part of the optical member 5, causing continuous demolition, and allowing demolition to occur all the way to the center of the optical member 5.

[0042] On the other hand, in the method of releasing an optical component by applying an external force to it, as described in Patent Document 1, if the optical component and the mold are tightly bonded, stress can concentrate at the point of contact between the optical component and the release agent, potentially causing scratches or cracks in the optical component before it can be released from the mold. In particular, small-diameter or thin-walled optical components have low strength, making them prone to cracking due to stress concentration in the method described in Patent Document 1.

[0043] Furthermore, the method described in Patent Document 2, which involves deforming the thin, elastic portion of the outer periphery of the mold to release the mold, requires a pressurizing member to deform the elastic portion, and a separate drive system to drive this pressurizing member must be provided in the device. For this reason, the method described in Patent Document 2 complicates the molding apparatus, which may lead to increased costs for optical components.

[0044] Thus, according to this embodiment, by reducing the adhesion force between the preform 3 and the molding surfaces 1a and 2a of the mold 10 in the outer peripheral region of the preform 3, demolding can be easily initiated from the outer peripheral region of the optical member 5 molded from the preform 3. Therefore, according to this embodiment, even small-diameter or thin-walled optical members 5 with low strength can be easily demolded from the mold 10 without causing scratches or cracks.

[0045] The optical component 5 manufactured as described above can be used in the interchangeable lens 201 shown in Figures 13A and 13B, the camera 202 shown in Figures 14A and 14B, and the lens unit 101 of a camera mounted on an information terminal 203 such as a smartphone shown in Figures 15A and 15B. These will be described in the third embodiment.

[0046] <Modification 1 of the first embodiment> A modification 1 of the first embodiment will be described with reference to Figure 4. Figure 4 is a cross-sectional view showing the mold 10 in the molding apparatus 100 according to this modification.

[0047] The configuration of the molding apparatus 100 in this modified example is the same as that of the molding apparatus 100 in the first embodiment, except for the shape of the mold 10. In this modified example, the shape of the mold 10 is changed in order to change the shape of the optical member 5 to be molded to a convex meniscus shape. That is, in this modified example, as shown in Figure 4, in the mold 10, the molding surface 1a of the upper mold member 1 is formed in a convex shape, and the molding surface 2a of the lower mold member 2 is formed in a concave shape. In addition, the shapes of the molding surfaces 1a and 2a are changed so that the thickness of the central region of the optical member 5 to be molded is greater than the thickness of the outer peripheral region. An optical member 5 having a convex meniscus shape can also be molded using a mold 10 having the shape changed in this way.

[0048] <Modification 2 of the first embodiment> A second modification of the first embodiment will be described with reference to Figure 5. Figure 5 is a cross-sectional view showing the mold 10 in the molding apparatus 100 according to this modification.

[0049] The configuration of the molding apparatus 100 in this modified example is the same as that of the molding apparatus 100 in the first embodiment, except for the shape of the mold 10. In this modified example, the shape of the mold 10 is changed in order to change the shape of the optical member 5 to be molded to a shape having multiple inflection points. That is, in this modified example, as shown in Figure 5, the shape of the mold 10 is changed to a shape having multiple inflection points corresponding to the multiple inflection points that the optical member 5 to be molded should have. It is also possible to mold an optical member 5 having multiple inflection points using a mold 10 having such a modified shape.

[0050] <Modification 3 of the first embodiment> A third modification of the first embodiment will be described with reference to Figure 6. Figure 6 is a cross-sectional view showing the mold 10 in the molding apparatus 100 according to this modification.

[0051] The configuration of the molding apparatus 100 in this modified example is the same as that of the molding apparatus 100 in the first embodiment, except for the shape of the mold 10. In this modified example, the shape of the mold 10 is changed in order to change the shape of the optical member 5 to be molded to a shape having multiple inflection points different from those in Modified Example 2. That is, in this modified example, as shown in Figure 6, the shape of the mold 10 is changed to a shape having multiple inflection points corresponding to the multiple inflection points that the optical member 5 to be molded should have, different from those in Modified Example 2. Using the mold 10 having the modified shape in this way, it is also possible to mold an optical member 5 having multiple inflection points different from those in Modified Example 2.

[0052] <Modification 4 of the First Embodiment> A fourth modification of the first embodiment will be described with reference to Figure 7. Figure 7 is a cross-sectional view showing the mold 10 in the molding apparatus 100 according to this modification.

[0053] The configuration of the molding apparatus 100 in this modified example is the same as that of the molding apparatus 100 in the first embodiment, except for the shape of the mold 10. In this modified example, the shape of the mold 10 is changed in order to change the shape of the optical member 5 to be molded to a concave meniscus shape. That is, in this modified example, as shown in Figure 7, the molding surface 1a of the upper mold member 1 is formed in a convex shape, and the molding surface 2a of the lower mold member 2 is formed in a concave shape. In addition, the shapes of the molding surfaces 1a and 2a are changed so that the thickness of the central region of the optical member 5 to be molded is thinner than the thickness of the outer peripheral region. An optical member 5 having a concave meniscus shape can also be molded using a mold 10 having the shape changed in this way.

[0054] <Modification 5 of the First Embodiment> A fifth modification of the first embodiment will be described with reference to Figure 8. Figure 8 is a cross-sectional view showing the mold 10 in the molding apparatus 100 according to this modification.

[0055] The configuration of the molding apparatus 100 in this modified example is the same as that of the molding apparatus 100 in the first embodiment, except for the shape of the mold 10. In this modified example, the shape of the mold 10 is changed in order to change the shape of the optical member 5 to be molded to a double-concave shape. That is, in this modified example, as shown in Figure 8, the molding surfaces 1a and 2a of the upper mold member 1 and the lower mold member 2 are changed to a convex shape. An optical member 5 having a double-concave shape can also be molded using a mold 10 having the shape changed in this way.

[0056] (Example 1-1) In Example 1-1, an optical member 5 having a biconvex shape was molded using the manufacturing method for optical members according to the first embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ10.0 mm, a total height of 2.9 mm, a center thickness of 2.9 mm, an end thickness of 1.4 mm, an optical effective diameter of φ9.3 mm on the upper surface 5a, and an optical effective diameter of φ8.9 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 500°C. In addition, an SiO2 film was formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0057] In the heating process, the mold 10 was heated to a first temperature of 450°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 560°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since an SiO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 10.2°C lower than the temperature of the central region. The temperature measurement points for the central and outer periphery regions of the preform 3 were the center point of the upper surface 3a of the preform 3 placed in the mold 10, and the outermost point of the upper surface 3a of the preform 3, respectively. An infrared camera (FLIR T860, a high-performance thermography camera for research and development manufactured by FLIR Systems) was used to measure the temperature of the preform 3.

[0058] In the next molding process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N, and the preform 3 was pressed to form an optical member 5 having a biconvex shape from the preform 3.

[0059] During the cooling and demolding processes, when the mold 10 reached a third temperature of 450°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0060] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0061] (Comparative Example 1-1) In Comparative Example 1-1, the same mold 10 as in Example 1-1 was used, and the optical member 5 was molded in the same manner as in Example 1-1 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0062] (Examples 1-2) In Example 1-2, an optical member 5 having a biconvex shape was molded using the manufacturing method for optical members according to the first embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ15.0 mm, a total height of 4.3 mm, a center thickness of 4.3 mm, an end thickness of 2.2 mm, an effective optical diameter of φ14.1 mm on the upper surface 5a, and an effective optical diameter of φ13.0 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. A ZrO2 film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0063] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a ZrO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 11.0°C lower than the temperature of the central region.

[0064] In the next molding process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N, and the preform 3 was pressed to form an optical member 5 having a biconvex shape from the preform 3.

[0065] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0066] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0067] (Comparative Example 1-2) In Comparative Example 1-2, the same mold 10 as in Example 1-2 was used, and the optical member 5 was molded in the same manner as in Example 1-2 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0068] (Examples 1-3) In Examples 1-3, an optical member 5 having a biconvex shape was molded using the manufacturing method for optical members according to the first embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ20.0 mm, a total height of 5.8 mm, a center thickness of 5.8 mm, an end thickness of 2.8 mm, an optical effective diameter of φ18.7 mm on the upper surface 5a, and an optical effective diameter of φ17.8 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. A CH film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0069] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a ZrO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 10.5°C lower than the temperature of the central region.

[0070] In the next molding process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N, and the preform 3 was pressed to form an optical member 5 having a biconvex shape from the preform 3.

[0071] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0072] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0073] (Comparative Examples 1-3) In Comparative Example 1-3, the same mold 10 as in Example 1-3 was used, and the optical member 5 was molded in the same manner as in Example 1-3 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0074] (Examples 1-4) In Examples 1-4, an optical member 5 having a convex meniscus shape was molded using the manufacturing method of an optical member according to Modification 1 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ9.8 mm, a total height of 1.4 mm, a center thickness of 1.4 mm, an end thickness of 0.7 mm, an optical effective diameter of φ8.2 mm on the upper surface 5a, and an optical effective diameter of φ8.6 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 458°C. A DLC film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0075] In the heating process, the mold 10 was heated to a first temperature of 400°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 510°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a DLC film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 15.1°C lower than the temperature of the central region.

[0076] In the next molding process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N, and the preform 3 was pressed to form an optical component 5 having a convex meniscus shape from the preform 3.

[0077] During the cooling and demolding processes, when the mold 10 reached a third temperature of 400°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0078] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0079] (Comparative Examples 1-4) In Comparative Example 1-4, the same mold 10 as in Example 1-4 was used, and the optical member 5 was molded in the same manner as in Example 1-4 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0080] (Examples 1-5) In Examples 1-5, an optical member 5 having a convex meniscus shape was molded using the manufacturing method of an optical member according to Modification 1 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ14.7 mm, a total height of 2.0 mm, a center thickness of 2.0 mm, an end thickness of 1.0 mm, an effective optical diameter of φ12.3 mm on the upper surface 5a, and an effective optical diameter of φ13.0 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. A DLC film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0081] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a SnO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 10.3°C lower than the temperature of the central region.

[0082] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical component 5 having a convex meniscus shape from the preform 3.

[0083] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0084] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0085] (Comparative Examples 1-5) In Comparative Example 1-5, the same mold 10 as in Example 1-5 was used, and the optical member 5 was molded in the same manner as in Example 1-5 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0086] (Examples 1-6) In Examples 1-6, an optical member having a convex meniscus shape was molded using the manufacturing method of an optical member according to Modification 1 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ19.5 mm, a total height of 2.7 mm, a center thickness of 2.7 mm, an end thickness of 1.4 mm, an optical effective diameter of φ16.4 mm on the upper surface 5a, and an optical effective diameter of φ17.3 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. In addition, an Al2O3 film was formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0087] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since an Al2O3 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 11.4°C lower than the temperature of the central region.

[0088] In the next molding process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N, and the preform 3 was pressed to form an optical component 5 having a convex meniscus shape from the preform 3.

[0089] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0090] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0091] (Comparative Examples 1-6) In Examples 1-6, the same mold 10 as in Examples 1-6 was used, and the optical member 5 was molded in the same manner as in Examples 1-6 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0092] (Examples 1-7) In Examples 1-7, an optical member 5 having multiple inflection points was molded using the manufacturing method of an optical member according to Modification 2 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ9.7 mm, a total height of 1.4 mm, a center thickness of 1.4 mm, an end thickness of 0.6 mm, an optical effective diameter of φ9.3 mm on the upper surface 5a, and an optical effective diameter of φ9.1 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 500°C. A ZrO2 film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0093] In the heating process, the mold 10 was heated to a first temperature of 450°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 560°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a ZrO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 10.6°C lower than the temperature of the central region.

[0094] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical component 5 having multiple inflection points from the preform 3.

[0095] During the cooling and demolding processes, when the mold 10 reached a third temperature of 450°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0096] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0097] (Comparative Examples 1-7) In Comparative Example 1-7, the same mold 10 as in Example 1-7 was used, and the optical member 5 was molded in the same manner as in Example 1-7 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0098] (Examples 1-8) In Examples 1-8, an optical member 5 having multiple inflection points was molded using the manufacturing method of an optical member according to Modification 2 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ14.6 mm, a total height of 2.1 mm, a center thickness of 2.1 mm, an end thickness of 0.9 mm, an optical effective diameter of φ14.0 mm on the upper surface 5a, and an optical effective diameter of φ13.7 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 458°C. In addition, an SiO2 film was formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0099] In the heating process, the mold 10 was heated to a first temperature of 400°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 510°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since an SiO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 14.1°C lower than the temperature of the central region.

[0100] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical component 5 having multiple inflection points from the preform 3.

[0101] During the cooling and demolding processes, when the mold 10 reached a third temperature of 400°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0102] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0103] (Comparative Examples 1-8) In Comparative Example 1-8, the same mold 10 as in Example 1-8 was used, and the optical member 5 was molded in the same manner as in Example 1-8 from a preform 3 that had the same shape as in Example 1-8, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0104] (Examples 1-9) In Examples 1-9, an optical member 5 having multiple inflection points was molded using the manufacturing method of an optical member according to Modification 2 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ19.4 mm, a total height of 2.9 mm, a center thickness of 2.9 mm, an end thickness of 1.1 mm, an optical effective diameter of φ18.6 mm on the upper surface 5a, and an optical effective diameter of φ18.3 mm on the lower surface 5a. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 616°C. In addition, an SiO2 film was formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0105] In the heating process, the mold 10 was heated to a first temperature of 560°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 670°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since an SiO2 film 4 was formed on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 13.2°C lower than the temperature of the central region.

[0106] In the next molding process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N, and the preform 3 was pressed to form an optical component 5 having multiple inflection points from the preform 3.

[0107] During the cooling and demolding processes, when the mold 10 reached a third temperature of 560°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0108] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0109] (Comparative Examples 1-9) In Comparative Example 1-9, the same mold 10 as in Example 1-9 was used, and the optical member 5 was molded in the same manner as in Example 1-9 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0110] (Examples 1-10) In Examples 1-10, an optical member 5 having multiple inflection points was molded using the manufacturing method of an optical member according to Modification 3 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ10.0 mm, a total height of 1.9 mm, a center thickness of 1.0 mm, an end thickness of 1.0 mm, an optical effective diameter of φ9.1 mm on the upper surface 5a, and an optical effective diameter of φ8.3 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 500°C. In addition, an SiO2 film was formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0111] In the heating process, the mold 10 was heated to a first temperature of 450°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 560°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since an SiO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 11.3°C lower than the temperature of the central region.

[0112] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical component 5 having multiple inflection points from the preform 3.

[0113] During the cooling and demolding processes, when the mold 10 reached a third temperature of 450°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0114] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0115] (Comparative Example 1-10) In Comparative Example 1-10, the same mold 10 as in Example 1-10 was used, and the optical member 5 was molded in the same manner as in Example 1-10 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0116] (Examples 1-11) In Example 1-11, an optical member 5 having multiple inflection points was molded using the manufacturing method of an optical member according to Modification 3 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ15.0 mm, a total height of 2.9 mm, a center thickness of 1.5 mm, an end thickness of 1.5 mm, an optical effective diameter of φ13.7 mm on the upper surface 5a, and an optical effective diameter of φ12.5 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 612°C. A ZrO2 film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0117] In the heating process, the mold 10 was heated to a first temperature of 560°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 670°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a ZrO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 19.5°C lower than the temperature of the central region.

[0118] In the next molding process, the mold 10 and the preform 3 are brought into contact with a press load of 4000N to press the preform 3 and mold an optical component 5 having multiple inflection points from the preform 3.

[0119] During the cooling and demolding processes, when the mold 10 reached a third temperature of 560°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. With the press load removed, the optical member 5, which had been crushed up to that point, became deformable, and the optical member 5 was released from the mold 10.

[0120] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0121] (Comparative Example 1-11) In Comparative Example 1-11, the same mold 10 as in Example 1-11 was used, and the optical member 5 was molded in the same manner as in Example 1-11 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0122] (Examples 1-12) In Examples 1-12, an optical member 5 having multiple inflection points was molded using the manufacturing method of an optical member according to Modification 3 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ20.0 mm, a total height of 3.8 mm, a center thickness of 2.0 mm, an end thickness of 2.0 mm, an optical effective diameter of φ18.2 mm on the upper surface 5a, and an optical effective diameter of φ16.6 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 616°C. A CH film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0123] In the heating process, the mold 10 was heated to a first temperature of 560°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 670°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a CH film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 18.3°C lower than the temperature of the central region.

[0124] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a load of 4000N to press the preform 3, thereby forming an optical component 5 having multiple inflection points from the preform 3.

[0125] During the cooling and demolding processes, when the mold 10 reached a third temperature of 560°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0126] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0127] (Comparative Example 1-12) In Comparative Example 1-12, the same mold 10 as in Example 1-12 was used, and the optical member 5 was molded in the same manner as in Example 1-12 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0128] (Examples 1-13) In Examples 1-13, an optical member 5 having a concave meniscus shape was molded using the manufacturing method of an optical member according to Modification 4 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ9.7 mm, a total height of 2.6 mm, a center thickness of 1.4 mm, an end thickness of 2.3 mm, an optical effective diameter of φ7.2 mm on the upper surface 5a, and an optical effective diameter of φ9.2 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 500°C. A CH film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0129] In the heating process, the mold 10 was heated to a first temperature of 450°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 560°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a CH film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 20.5°C lower than the temperature of the central region.

[0130] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3 and form an optical component 5 having a concave meniscus shape.

[0131] During the cooling and demolding processes, when the mold 10 reached a third temperature of 450°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0132] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0133] (Comparative Example 1-13) In Comparative Example 1-13, the same mold 10 as in Example 1-13 was used, and the optical member 5 was molded in the same manner as in Example 1-13 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0134] (Examples 1-14) In Examples 1-14, an optical member 5 having a concave meniscus shape was molded using the manufacturing method of an optical member according to Modification 4 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ14.5 mm, a total height of 3.9 mm, a center thickness of 0.6 mm, an end thickness of 3.5 mm, an optical effective diameter of φ10.9 mm on the upper surface 5a, and an optical effective diameter of φ13.9 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. A ZrO2 film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0135] In the heating process, the mold 10 was heated to a first temperature of 450°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 560°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a ZrO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 21.0°C lower than the temperature of the central region.

[0136] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical component 5 having a concave meniscus shape from the preform 3.

[0137] During the cooling and demolding processes, when the mold 10 reached a third temperature of 450°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0138] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0139] (Comparative Example 1-14) In Comparative Example 1-14, the same mold 10 as in Example 1-14 was used, and the optical member 5 was molded in the same manner as in Example 1-14 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0140] (Examples 1-15) In Examples 1-15, an optical member 5 having a concave meniscus shape was molded using the manufacturing method of an optical member according to Modification 4 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ19.3 mm, a total height of 5.3 mm, a center thickness of 0.8 mm, an end thickness of 4.6 mm, an optical effective diameter of φ14.5 mm on the upper surface 5a, and an optical effective diameter of φ18.5 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. In addition, an SiO2 film was formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0141] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since an SiO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 18.5°C lower than that of the central region.

[0142] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical component 5 having a concave meniscus shape from the preform 3.

[0143] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0144] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0145] (Comparative Example 1-15) In Comparative Example 1-15, the same mold 10 as in Example 1-15 was used, and the optical member 5 was molded in the same manner as in Example 1-15 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0146] (Examples 1-16) In Example 1-16, an optical member 5 having a double-concave shape was molded using the manufacturing method of an optical member according to Modification 5 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ9.3 mm, a total height of 2.9 mm, a center thickness of 0.6 mm, an end thickness of 2.9 mm, an optical effective diameter of φ8.8 mm on the upper surface 5a, and an optical effective diameter of φ8.7 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 458°C. A ZrO2 film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0147] In the heating process, the mold 10 was heated to a first temperature of 400°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 510°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a ZrO2 film 4 was formed as a film on the outer periphery of the preform, the temperature of the outer periphery of the preform 3 was 19.8°C lower than the temperature of the central region.

[0148] In the next press forming process, the mold 10 and the preform 3 are brought into contact with a press load of 4000N to press the preform 3 and form the optical member 5 having a double-concave shape from the preform 3.

[0149] During the cooling and demolding processes, when the mold 10 reached a third temperature of 400°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0150] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0151] (Comparative Example 1-16) In Comparative Example 1-16, the same mold 10 as in Example 1-16 was used, and the optical member 5 was molded in the same manner as in Example 1-16 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0152] (Examples 1-17) In Example 1-17, an optical member 5 having a double-concave shape was molded using the manufacturing method of an optical member according to Modification 5 of the First Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ14.8 mm, a total height of 5.6 mm, a center thickness of 1.0 mm, an end thickness of 5.6 mm, an optical effective diameter of φ13.7 mm on the upper surface 5a, and an optical effective diameter of φ13.9 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 612°C. In addition, a SnO2 film was formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0153] In the heating process, the mold 10 was heated to a first temperature of 560°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 670°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a SnO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 19.3°C lower than the temperature of the central region.

[0154] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming the optical member 5 having a double-concave shape from the preform 3.

[0155] During the cooling and demolding processes, when the mold 10 reached a third temperature of 560°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0156] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0157] (Comparative Example 1-17) In Comparative Example 1-17, the same mold 10 as in Example 1-17 was used, and the optical member 5 was molded in the same manner as in Example 1-17 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0158] (Examples 1-18) In Example 1-18, an optical member 5 having a double-concave shape according to Modification 5 of the First Embodiment was molded. The dimensions of the molded optical member 5 were an outer diameter of φ19.4 mm, a total height of 6.0 mm, a center thickness of 1.3 mm, an end thickness of 6.0 mm, an optical effective diameter of φ18.0 mm on the upper surface 5a, and an optical effective diameter of φ18.3 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 616°C. A ZrO2 film was also formed on the preform 3 as a film 4. An infrared heater was used as the heater 14 used to heat the mold 10 and the preform 3.

[0159] In the heating process, the mold 10 was heated to a first temperature of 560°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 670°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Since a ZrO2 film 4 was formed as a film on the outer periphery of the preform 3, the temperature of the outer periphery of the preform 3 was 19.3°C lower than the temperature of the central region.

[0160] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N, and the preform 3 was pressed to form an optical member 5 having a double-concave shape.

[0161] During the cooling and demolding processes, when the mold 10 reached a third temperature of 560°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0162] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown). Since the cracked film 4 was attached to the outer peripheral region of the removed optical component 5, it was possible to easily apply black paint to that outer peripheral region.

[0163] (Comparative Example 1-18) In Comparative Example 1-18, the same mold 10 as in Example 1-18 was used, and the optical member 5 was molded in the same manner as in Example 1-18 from the same preform 3, except that the film 4 was not formed. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical member 5 occurred.

[0164] (Comparative Example 1-19) In Comparative Example 1-19, the same mold 10 as in Example 1-18 was used, and the optical component 5 was molded from the same preform 3 as in Example 1-18, except that the film 4 was not formed. In Comparative Example 1-19, the optical component 5 was molded by press molding after heating the preform 3 so that the central region was 9.0°C higher than the outer peripheral region during the heating process. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical component 5 occurred.

[0165] (Comparative Example 1-20) In Comparative Example 1-20, the same mold 10 as in Example 1-18 was used, and the optical component 5 was molded from the same preform 3 as in Example 1-18, except that the film 4 was not formed. In Comparative Example 1-20, the optical component 5 was molded by press molding after heating the preform 3 so that the central region was 11.0°C higher than the outer peripheral region during the heating process. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, and demolding of the optical component 5 occurred.

[0166] Table 1 below shows the shape and outer diameter of the optical element 5, the glass dislocation temperature of the optical glass constituting the preform 3, the type of film 4, and whether or not demolding occurred for the examples and comparative examples of the first embodiment described above. "Yes" indicates that demolding occurred, and "No" indicates that demolding did not occur.

[0167] [Table 1]

[0168] [Second Embodiment] A second embodiment of the present invention, describing an apparatus for manufacturing optical components and a method for manufacturing optical components, will be explained with reference to Figures 9A to 12B. Note that the same configuration as in the first embodiment will be omitted or simplified in its description. While the first embodiment described a case where a temperature distribution is formed on the preform 3 by a film 4, this embodiment describes a case where a temperature distribution is formed on the preform 3 by a heater 30.

[0169] First, the optical component molding apparatus 100 according to this embodiment will be described with reference to Figures 9A and 9B. Figure 9A is a cross-sectional view showing the mold 10, preform 3, and heater 30 in the optical component molding apparatus 100 according to this embodiment. Figure 9B is a plan view showing the heater 30 in the optical component molding apparatus 100 according to this embodiment. Note that Figure 9A shows the state of the mold 10 before molding.

[0170] The basic configuration of the optical component molding apparatus 100 according to this embodiment is the same as that of the optical component molding apparatus 100 according to the first embodiment. The optical component molding apparatus 100 according to this embodiment differs from the optical component molding apparatus 100 according to the first embodiment in that it has a heater 30 instead of a heater 14, as shown in Figures 9A and 9B. The molding apparatus 100 may have a heater 30 in addition to the heater 14.

[0171] The heater 30 is a heating unit that heats the mold 10, which includes the upper mold member 1 and the lower mold member 2, and the preform 3 to a temperature suitable for press molding. Specifically, the heater 30 is, for example, an infrared heater, which heats the mold 10 and the preform 3 by irradiating them with energy using electromagnetic waves such as infrared rays. The heater output control device 22 controls the output of the heater 30. The operation of the heater output control device 22 is controlled by the controller 26 based on the temperature information output from the temperature sensor 20. In the first embodiment as well, the heater 30 can be used to heat the mold 10 and the preform 3 in the same way as in this embodiment.

[0172] The heater 30 is configured to be moved and positioned between the upper mold member 1 and the lower mold member 2 in the mold 10 so as to face the preform 3 on the molding surface 2a of the lower mold member 2 during the heating process. The heater 30 is also configured to be moved away from between the upper mold member 1 and the lower mold member 2 so as not to interfere with the press molding by the upper mold member 1 and the lower mold member 2 during the molding process. The movement of the heater 30 is controlled by the controller 26.

[0173] Furthermore, the heater 30 has a central portion 301 and an outer peripheral portion 302 located on the outer periphery of the central portion. The central portion 301 faces the central region of the preform 3 during the heating process and heats the central region of the preform 3. The outer peripheral portion 302 faces the outer peripheral region of the preform 3 during the heating process and heats the outer peripheral region of the preform 3. The outer peripheral region of the preform 3 referred to here corresponds to the outer peripheral region of the preform 3 on which the film 4 is formed in the first embodiment. When the heater 30 is facing the preform 3 during the heating process, it is configured such that the distance between the central portion 301 and the central region of the preform 3 is shorter than the distance between the outer peripheral portion 302 and the outer peripheral region of the preform 3. That is, when the heater 30 is facing the preform 3 during the heating process, the central portion 301 is configured to be more convex toward the preform 3 than the outer peripheral portion 302. As a result, during the heating process, the heating surface of the central portion 301 of the heater 30 is closer to the preform 3 than the heating surface of the outer peripheral portion 302. The heater 30 can deliver more energy to the central region of the preform 3 than to the outer region of the preform 3, thereby raising the temperature of the central region of the preform 3 above that of the outer region. In this way, the heater 30 can irradiate the central region of the preform 3 with more energy than the outer region of the preform 3, thereby creating a temperature distribution on the preform 3 similar to that of the first embodiment.

[0174] The mold 10 can be configured in the same way as in the first embodiment, including its shape including the molding surfaces 1a and 2a, the surface roughness of the molding surfaces 1a and 2a, the material, the film on the molding surfaces 1a and 2a, etc.

[0175] The preform 3 can be configured in the same way as in the first embodiment, except that the film 4 is not formed on it. In this embodiment as well, the film 4 may be formed on the outer peripheral region of the preform 3, similar to the first embodiment.

[0176] In the manufacturing method of the optical component according to this embodiment, the heater 30 is placed facing the preform 3 in the heating step to heat the preform 3 with the heater 30, and in the molding step, the heater 30 is moved out of the way between the upper mold member 1 and the lower mold member 2. Except for these points, the manufacturing method of the optical component according to this embodiment can be used to manufacture the optical component 5 in the same way as in the first embodiment.

[0177] As described above, in this embodiment, by heating the preform 3 with the heater 30 during the heating process, the amount of energy supplied to the central region of the preform 3 can be made greater than the amount of energy supplied to the outer peripheral region of the preform 3. When the amount of energy supplied to the central region of the preform 3 is increased in this way, the temperature of the central region of the preform 3 rises, and the temperature of the outer peripheral region of the preform 3 becomes lower than the temperature of the central region of the preform 3. The viscosity of the material of the preform 3, such as glass, increases as the temperature decreases. Therefore, due to the temperature distribution formed on the preform 3 by the heating process using the heater 30, the viscosity of the material in the outer peripheral region of the preform 3 becomes higher than the viscosity of the material in the central region of the preform 3. When the preform 3 is press-molded in the molding process with the viscosity of the material higher in the outer peripheral region than in the central region in this way, the material in the outer peripheral region of the preform 3 becomes less likely to penetrate the molding surfaces 1a and 2a of the mold 10. Therefore, the true contact area between the outer peripheral region of the preform 3 and the molding surfaces 1a and 2a of the mold 10 decreases, and the adhesion force between them decreases. In this way, the adhesion force between the outer peripheral region of the optical member 5 molded from the preform 3 and the mold 10 can be reduced, so that demolition occurs from the outer peripheral region of the optical member 5 during the cooling process or demolding process.

[0178] Thus, in this embodiment as well, by reducing the adhesion force between the preform 3 and the molding surfaces 1a and 2a of the mold 10 in the outer peripheral region of the preform 3, demolding can be easily initiated from the outer peripheral region of the optical member 5 molded from the preform 3. Therefore, according to this embodiment, even small-diameter or thin-walled optical members 5 with low strength can be easily demolded from the mold 10 without causing scratches or cracks.

[0179] <Modification 1 of the second embodiment> A modification 1 of the second embodiment will be described with reference to Figures 10A and 10B. Figure 10A is a cross-sectional view showing the mold 10, preform 3, and heater 30 in the molding apparatus 100 according to this modification. Figure 10B is a plan view showing the heater 30 in the molding apparatus 100 according to this modification. Note that Figure 10A shows the state of the mold 10 before molding.

[0180] The configuration of the molding apparatus 100 according to this modified example is the same as that of the molding apparatus 100 according to the second embodiment, except for the configuration of the heater 30. In this modified example, the shape of the heater 30 is changed. That is, in this modified example, as shown in Figures 10A and 10B, an insulating material 303 is provided on the surface of the outer peripheral portion 302 of the heater 30 that faces the preform 3. The insulating material 303 insulates the heat radiated from the outer peripheral portion 302 of the heater 30 toward the preform 3. Note that the insulating material 303 does not necessarily need to be provided on the surface of the outer peripheral portion 302 of the heater 30 that faces the preform 3; it is sufficient if it is provided between the outer peripheral portion 302 of the heater 30 and the outer peripheral region of the preform 3.

[0181] As described above, in this modified example, an insulating material 303 is provided on the surface of the outer peripheral portion 302 of the heater 30. This makes it possible to reduce the amount of energy that the heater 30 imparts to the outer peripheral region of the preform 3 to less than the amount of energy that the heater 30 imparts to the central region of the preform 3. Thus, in this modified example, the temperature of the outer peripheral region of the preform 3 becomes lower than the temperature of the central region of the preform 3, and a temperature distribution similar to that of the first embodiment can be formed in the preform 3.

[0182] <Modification 2 of the second embodiment> A second modification of the second embodiment will be described using Figures 11A and 11B. Figure 11A is a cross-sectional view showing the mold 10, preform 3, and heater 30 in the molding apparatus 100 according to this modification. Figure 11B is a plan view showing the heater 30 in the molding apparatus 100 according to this modification. Note that Figure 11A shows the state of the mold 10 before molding.

[0183] The configuration of the molding apparatus 100 according to this modified example is the same as that of the molding apparatus 100 according to the second embodiment, except for the configuration of the heater 30. In this modified example, the configuration of the heater 30 is changed, and its heat distribution is altered. That is, in this modified example, as shown in Figures 11A and 11B, the heater 30 has a strip-shaped heating element 304 made of, for example, an electric heating wire. The heating element 304 is arranged in a spiral pattern from the center to the outer circumference of the heater 30. The heating element 304 has a narrow portion 304a in the center and a wider portion 304b in the outer circumference which is wider than the narrow portion 304a. The narrow portion 304a heats the central region of the preform 3 in the heating process by facing it. The wider portion 304b heats the outer circumference of the preform 3 in the heating process by facing it. The density of the heating element 304 is lower in the wider portion 304b than in the narrow portion 304a.

[0184] Thus, in this modified example, the density of the heating element 304 in the outer peripheral portion of the heater 30 is lower than that of the narrow portion 304a in the central portion. As a result, the amount of energy that the heater 30 imparts to the outer peripheral region of the preform 3 can be made smaller than the amount of energy that the heater 30 imparts to the central region of the preform 3. In this way, in this modified example, the temperature of the outer peripheral region of the preform 3 becomes lower than the temperature of the central region of the preform 3, and a temperature distribution similar to that of the first embodiment can be formed on the preform 3.

[0185] <Modification 3 of the second embodiment> A third modification of the second embodiment will be described using Figures 12A and 12B. Figure 12A is a cross-sectional view showing the mold 10, preform 3, and heater 30 in the molding apparatus 100 according to this modification. Figure 12B is a plan view showing the heater 30 in the molding apparatus 100 according to this modification. Note that Figure 12A shows the state of the mold 10 before molding.

[0186] The configuration of the molding apparatus 100 in this modified example is the same as that of the molding apparatus 100 in the second embodiment described above, except for the configuration of the heater 30. In this modified example, the configuration of the heater 30 is changed, and its heat distribution is altered. That is, in this modified example, as shown in Figures 12A and 12B, the heater 30 has heating elements 305 and 306. Heating element 305 is located in the central part of the heater 30, and heating element 306 is located in the outer periphery of the heater 30. Heating element 305 heats the central region of the preform 3, and heating element 306 heats the outer periphery of the preform 3. The power density of the heating element 306 in the outer periphery is lower than the power density of the heating element 305 in the central part.

[0187] Thus, in this modified example, the power density of the heating element 306 in the outer periphery of the heater 30 is lower than the power density of the heating element 305 in the central part. As a result, the amount of energy that the heater 30 imparts to the outer periphery of the preform 3 can be made smaller than the amount of energy that the heater 30 imparts to the central region of the preform 3. In this way, in this modified example, the temperature of the outer periphery of the preform 3 becomes lower than the temperature of the central region of the preform 3, and a temperature distribution similar to that of the first embodiment can be formed in the preform 3.

[0188] (Example 2-1) In Example 2-1, an optical member having a biconvex shape was formed using the manufacturing method for optical members according to the second embodiment. The dimensions of the formed optical member 5 were an outer diameter of φ20.0 mm, a total height of 5.8 mm, a center thickness of 5.8 mm, an end thickness of 2.8 mm, an effective optical diameter of φ18.7 mm on the upper surface 5a, and an effective optical diameter of φ17.8 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. An infrared heater was used for the heater 30 used to heat the mold 10 and the preform 3. Because this infrared heater provides more energy to the central region of the preform 3 than to the outer region, the surface of the heater 30 had a raised shape only in the part that heated the central region of the preform 3.

[0189] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Because more energy was supplied to the central region of the preform 3, the temperature of the outer region of the preform 3 was 10.6°C lower than the temperature of the central region.

[0190] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a load of 4000N to press the preform 3, thereby forming an optical member 5 having a biconvex shape from the preform 3.

[0191] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0192] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown).

[0193] (Comparative Example 2-1) In Comparative Example 2-1, the same mold 10 and preform 3 as in Example 2-1 were used, and a flat infrared heater was used instead of the heater 30 to mold the optical component 5. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical component 5 occurred.

[0194] (Example 2-2) In Example 2-2, an optical member 5 having a biconvex shape was molded using the manufacturing method of an optical member according to Modification 1 of the Second Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ20.0 mm, a total height of 5.8 mm, a center thickness of 5.8 mm, an end thickness of 2.8 mm, an optical effective diameter of φ18.7 mm on the upper surface 5a, and an optical effective diameter of φ17.8 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. An infrared heater was used for the heater 30 used to heat the mold 10 and the preform 3. Since this infrared heater provides more energy to the central region of the preform 3 than to the outer region, the part of the preform 3 that heats the outer region was covered with an insulating material 303.

[0195] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Because more energy was supplied to the central region of the preform 3, the temperature of the outer region of the preform 3 was 11.1°C lower than the temperature of the central region.

[0196] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical member 5 having a biconvex shape from the preform 3.

[0197] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0198] Subsequently, the upper mold member 1 of the mold 10 located above the optical component was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown).

[0199] (Comparative Example 2-2) In Comparative Example 2-2, the same mold 10 and preform 3 as in Example 2-2 were used, and the optical component 5 was molded using the infrared heater used in Comparative Example 2-1 instead of the heater 30. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical component 5 occurred.

[0200] (Examples 2-3) In Example 2-3, an optical member 5 having a biconvex shape was molded using the manufacturing method of an optical member according to Modification 2 of the Second Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ20.0 mm, a total height of 5.8 mm, a center thickness of 5.8 mm, an end thickness of 2.8 mm, an optical effective diameter of φ18.7 mm on the upper surface 5a, and an optical effective diameter of φ17.8 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. An infrared heater was used for the heater 30 used to heat the mold 10 and the preform 3. Because this infrared heater provides more energy to the central region of the preform 3 than to the outer region, the width of the wider portion 304b of the heating element 304 that heats the outer region of the preform 3 was wider than the width of the narrower portion 304a of the heating element 304 that heats the central region. By increasing the width of the wider portion 304b of the heating element 304 and reducing the density of the heating element 304, the temperature of the outer peripheral region of the preform 3 was lowered.

[0201] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Because more energy was supplied to the central region of the preform 3, the temperature of the outer region of the preform 3 was 10.8°C lower than the temperature of the central region.

[0202] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical member 5 having a biconvex shape from the preform 3.

[0203] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0204] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown).

[0205] (Comparative Example 2-3) In Comparative Example 2-3, the same mold 10 and preform 3 as in Example 2-3 were used, but the infrared heater used in Comparative Example 2-1 was used instead of the heater 30 to mold the optical component 5. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical component 5 occurred.

[0206] (Examples 2-4) In Example 2-4, an optical member 5 having a biconvex shape was molded using the manufacturing method of an optical member according to Modification 3 of the Second Embodiment. The dimensions of the molded optical member 5 were an outer diameter of φ20.0 mm, a total height of 5.8 mm, a center thickness of 5.8 mm, an end thickness of 2.8 mm, an optical effective diameter of φ18.7 mm on the upper surface 5a, and an optical effective diameter of φ17.8 mm on the lower surface 5b. The preform 3 was made of optical glass for glass molding with a glass dislocation point temperature of 512°C. An infrared heater was used as the heater 30 used to heat the mold 10 and the preform 3. This infrared heater had electric heating elements 305 and 306 with different power densities in the central and outer regions of the preform 3 in order to supply more energy to the central region than to the outer region. Electric heating element 305 was a high-power-density element placed in the central region corresponding to the central region of the preform 3. Electric heating element 306 was a low-power-density element placed in the outer region corresponding to the outer region of the preform 3. Because the power density of heater 30 is higher in the central part than in the outer part, it was possible to supply more energy to the central region of preform 3.

[0207] In the heating process, the mold 10 was heated to a first temperature of 460°C, and then the preform 3 was placed in the mold 10. Subsequently, the preform 3 was heated to a second temperature of 570°C, which is higher than the first temperature, to soften the preform 3 until its viscosity was suitable for press molding. Because more energy was supplied to the central region of the preform 3, the temperature of the outer region of the preform 3 was 18.5°C lower than the temperature of the central region.

[0208] In the next press forming process, the mold 10 and the preform 3 were brought into contact with a press load of 4000N to press the preform 3, thereby forming an optical member 5 having a biconvex shape from the preform 3.

[0209] During the cooling and demolding processes, when the mold 10 reached a third temperature of 460°C, lower than the second temperature, using the gas introduction pipe 16, the press load applied to the mold 10 was removed. Once the press load was removed, the optical member 5, which had been crushed, became deformable, and the optical member 5 was released from the mold 10.

[0210] Subsequently, the upper mold member 1 of the mold 10 located above the optical component 5 was moved upward to open the mold 10, and the optical component 5 was removed from the mold 10 by an optical component transport mechanism (not shown).

[0211] (Comparative Example 2-4) In Comparative Example 2-4, the same mold 10 and preform 3 as in Example 2-4 were used, and the optical component 5 was molded using the infrared heater used in Comparative Example 2-1 instead of the heater 30. After the heating, molding, and cooling processes described above, the press load was removed at the third temperature, but no demolding of the optical component 5 occurred.

[0212] Table 2 below shows the shape and outer diameter of the optical member 5, the glass dislocation point temperature of the optical glass constituting the preform 3, the configuration of the heater 30, and whether or not demolding occurred for the examples and comparative examples of the second embodiment described above. "Yes" indicates that demolding occurred, and "No" indicates that demolding did not occur.

[0213] [Table 2]

[0214] [Third Embodiment] A third embodiment of the present invention, consisting of an interchangeable lens, camera, and information terminal, will be described with reference to Figures 13A to 15B. Note that the same configurations as those in the first and second embodiments will be omitted or simplified in their description.

[0215] The optical component 5 manufactured by the manufacturing method of the optical component according to the first or second embodiment described above can be used in various devices. In this embodiment, interchangeable lenses, cameras, and information terminals will be described as examples of devices in which the optical component 5 is used.

[0216] Figures 13A and 13B are schematic diagrams and cross-sectional views, respectively, of an interchangeable lens 201 using optical element 5 and its lens unit 101. As shown in Figure 13A, the interchangeable lens 201 has a lens unit 101. As shown in Figure 13B, the lens unit 101 has a plurality of optical elements 102, 103, and 104 and a lens barrel 105. The lens barrel 105 is a support that supports the plurality of optical elements 102, 103, and 104 so as to be aligned in the optical axis direction of the lens unit 101. Optical element 5 is used as some or all of the plurality of optical elements 102, 103, and 104. The lens unit 101 guides the incident light through the plurality of optical elements 102, 103, and 104 to the image sensor 106 of an interchangeable lens camera to which the interchangeable lens 201 is attached.

[0217] Figures 14A and 14B are schematic diagrams and cross-sectional views, respectively, of a camera 202 using optical element 5 and its lens unit 101. As shown in Figure 14A, the camera 202 has a lens unit 101 and a housing 2021 that houses the lens unit 101. As shown in Figure 14B, the lens unit 101 has a plurality of optical elements 102, 103, and 104 and a lens barrel 105. The lens barrel 105 is a support that supports the plurality of optical elements 102, 103, and 104 so as to be aligned in the optical axis direction of the lens unit 101. Optical element 5 is used as some or all of the plurality of optical elements 102, 103, and 104. The lens unit 101 guides the incident light to the image sensor 106 of the camera 202 via the plurality of optical elements 102, 103, and 104.

[0218] Figures 15A and 15B are schematic diagrams and cross-sectional views, respectively, of an information terminal 203 and its lens unit 101, in which the optical element 5 is used. As shown in Figure 15, the information terminal 203 is a smartphone or the like, and has a lens unit 101 of a mounted camera and a housing 2031 that houses the lens unit 101. As shown in Figure 15B, the lens unit 101 has a plurality of optical elements 102, 103, and 104 and a lens barrel 105. The lens barrel 105 is a support that supports the plurality of optical elements 102, 103, and 104 so as to be aligned in the optical axis direction of the lens unit 101. Optical element 5 is used as some or all of the plurality of optical elements 102, 103, and 104. The lens unit 101 guides the incident light to the image sensor 106 of the camera mounted on the information terminal 203 via the plurality of optical elements 102, 103, and 104.

[0219] This embodiment includes the following methods and configurations. (Method 1) A heating step of heating the preform to form a temperature distribution on the preform, The process includes a molding step of pressing the preform, on which the temperature distribution has been formed, with a mold to form a component from the preform, The preform has a first region and a second region outside the first region. The heating step forms a temperature distribution in which the temperature of the second region is lower than the temperature of the first region. A method for manufacturing a component characterized by the above. (Method 2) A method for manufacturing a member according to Method 1, characterized by having a mold release step for releasing the member from the mold. (Method 3) The heating step creates a temperature distribution in which the temperature of the second region is 10°C or more lower than the temperature of the first region. A method for manufacturing a component according to method 1 or 2, characterized by the following: (Method 4) The method for manufacturing a member according to any one of methods 1 to 3, characterized in that the heating step forms a temperature distribution in which the temperature of the second region is equal to or greater than the glass dislocation point of the preform. (Method 5) The aforementioned preform has a circular planar shape, The method for manufacturing a member according to any one of methods 1 to 4, characterized in that the second region is an area outside the first region that occupies 90% of the outer diameter of the preform. (Method 6) The second region is the peripheral region of the preform, The first region is the region enclosed by the second region. A method for manufacturing a member according to any one of methods 1 to 5. (Method 7) The heating step involves heating the preform with electromagnetic waves, A method for manufacturing a member according to any one of methods 1 to 6, characterized in that the second region has a lower electromagnetic wave absorption rate than the first region. (Method 8) The method for manufacturing a member according to method 7, characterized in that a film with a lower electromagnetic wave absorption rate than the preform is formed in the second region. (Method 9) The method for manufacturing a member according to Method 8, characterized in that the film has an absorption rate of electromagnetic waves that is 50% or more lower than that of the preform with respect to the peak wavelength of the electromagnetic waves. (Method 10) The method for manufacturing a member according to method 8 or 9, characterized in that the aforementioned film is composed of a material containing an oxide or carbon. (Method 11) The process includes a film-forming step of forming the film on the surface of the second region, The aforementioned film formation process involves forming the film using one of the following methods: vapor deposition, sputtering, chemical vapor deposition, wet coating, or brush coating. A method for manufacturing a member according to any one of methods 8 to 10. (Method 12) The method for manufacturing a member according to any one of methods 1 to 11, characterized in that the heating step involves irradiating the first region with greater energy than the second region to form the temperature distribution. (Method 13) The heating step involves heating the preform by irradiating it with energy using a heater. The heater has a first portion for heating the first region and a second portion for heating the second region. The first distance between the first part and the first region is shorter than the second distance between the second part and the second region. A method for manufacturing a component according to method 12, characterized in that (Method 14) The heating step involves heating the preform by irradiating it with energy using a heater. The heater has a first portion for heating the first region and a second portion for heating the second region. An insulating material is provided between the second part and the second region. A method for manufacturing a component according to method 12, characterized in that (Method 15) The heating step involves heating the preform by irradiating it with energy using a heater. The heater has a heating element that includes a first portion for heating the first region and a second portion for heating the second region. The width of the first part is narrower than the width of the second part. The density of the heating element is lower in the second portion than in the first portion. A method for manufacturing a component according to method 12, characterized in that (Method 16) The heating step involves heating the preform by irradiating it with energy using a heater. The heater comprises a first heating element for heating the first region and a second heating element for heating the second region. The power density of the second heating element is lower than that of the first heating element. A method for manufacturing a component according to method 12, characterized in that (Composition 1) Type and, A heating unit that heats the preform to form a temperature distribution on the preform, The system includes a drive system that presses the preform, on which the temperature distribution is formed, with the mold to form a member from the preform or to release the member from the mold, The preform has a first region and a second region outside the first region. The heating section forms a temperature distribution in which the temperature of the second region is lower than the temperature of the first region. A manufacturing apparatus for components characterized by the following features. (Configuration 2) The manufacturing apparatus for the member according to configuration 1, characterized in that the heating section irradiates the first region with greater energy than the second region to form the temperature distribution. (Composition 3) The heating unit is a heater that heats the preform by irradiating it with the energy, The heater has a first portion for heating the first region and a second portion for heating the second region. The first distance between the first part and the first region is shorter than the second distance between the second part and the second region. A manufacturing apparatus for the component described in configuration 2, characterized by the above. (Composition 4) The heating unit is a heater that heats the preform by irradiating it with the energy, The heater has a first portion for heating the first region and a second portion for heating the second region. An insulating material is provided between the second part and the second region. A manufacturing apparatus for the component described in configuration 2, characterized by the above. (Composition 5) The heating unit is a heater that heats the preform by irradiating it with the energy, The heater has a heating element that includes a first portion for heating the first region and a second portion for heating the second region. The width of the first part is narrower than the width of the second part. The density of the heating element is lower in the second portion than in the first portion. A manufacturing apparatus for the component described in configuration 2, characterized by the above. (Composition 6) The heating unit is a heater that heats the preform by irradiating it with the energy, The heater comprises a first heating element for heating the first region and a second heating element for heating the second region. The power density of the second heating element is lower than that of the first heating element. A manufacturing apparatus for the component described in configuration 2, characterized by the above. (Composition 7) A preform used in press molding, The first area and, It comprises a second region outside the first region, A film with a lower electromagnetic wave absorption rate than the preform is formed in the second region. A preform characterized by the following features. (Composition 8) The main body and It has a film attached to the main body part, and the electromagnetic wave absorption rate of the film is lower than that of the main body part. The main body part has a first region and a second region outside the first region. In the second region, a third region to which the film is attached and a fourth region where the main body part is exposed are arranged alternately. A member characterized by this. (Configuration 9) The member according to Configuration 8, wherein the film is made of a material containing an oxide or carbon. (Configuration 10) The member according to Configuration 8 or 9, and a support for supporting the member, A lens unit characterized in that the member is a lens. (Configuration 11) The lens unit according to Configuration 10, and a housing for housing the lens unit ​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​203... Information terminal 303...Insulation 304... Heating element 305... Electric heating element 306... Electric heating element

Claims

1. A heating step of heating the preform to form a temperature distribution on the preform, The process includes a molding step of pressing the preform, on which the temperature distribution has been formed, with a mold to form a component from the preform, The preform has a first region and a second region outside the first region. The heating step creates a temperature distribution in which the temperature of the second region is lower than the temperature of the first region. A method for manufacturing a component characterized by the above.

2. The method for manufacturing a member according to claim 1, characterized by having a mold release step for releasing the member from the mold.

3. The heating step creates a temperature distribution in which the temperature of the second region is 10°C or more lower than the temperature of the first region. A method for manufacturing a member according to claim 1 or 2, characterized by the above.

4. The method for manufacturing a member according to claim 1 or 2, characterized in that the heating step forms a temperature distribution in which the temperature of the second region is equal to or greater than the glass dislocation point of the preform.

5. The aforementioned preform has a circular planar shape, The method for manufacturing a member according to claim 1 or 2, characterized in that the second region is an area outside the first region which occupies 90% of the outer diameter of the preform.

6. The second region is the peripheral region of the preform, The first region is the region enclosed by the second region. A method for manufacturing a member according to claim 1 or 2, characterized by the above.

7. The heating step involves heating the preform with electromagnetic waves, The method for manufacturing a member according to claim 1 or 2, characterized in that the second region has a lower electromagnetic wave absorption rate than the first region.

8. The method for manufacturing a member according to claim 7, characterized in that a film with a lower electromagnetic wave absorption rate than the preform is formed in the second region.

9. The method for manufacturing a member according to claim 8, characterized in that the film has an absorption rate of electromagnetic waves that is 50% or more lower than that of the preform with respect to the peak wavelength of the electromagnetic waves.

10. The method for manufacturing the member according to claim 8, characterized in that the film is made of a material containing an oxide or carbon.

11. The process includes a film-forming step of forming the film on the surface of the second region, The aforementioned film formation process involves forming the film using one of the following methods: vapor deposition, sputtering, chemical vapor deposition, wet coating, or brush coating. A method for manufacturing a component according to claim 8.

12. The method for manufacturing a member according to claim 1 or 2, characterized in that the heating step involves irradiating the first region with greater energy than the second region to form the temperature distribution.

13. The heating step involves heating the preform by irradiating it with energy using a heater. The heater has a first portion for heating the first region and a second portion for heating the second region. The first distance between the first part and the first region is shorter than the second distance between the second part and the second region. A method for manufacturing a component according to claim 12, characterized in that it is a method for manufacturing a component.

14. The heating step involves heating the preform by irradiating it with energy using a heater. The heater has a first portion for heating the first region and a second portion for heating the second region. An insulating material is provided between the second portion and the second region. A method for manufacturing a component according to claim 12, characterized in that it is a method for manufacturing a component.

15. The heating step involves heating the preform by irradiating it with energy using a heater. The heater has a heating element that includes a first portion for heating the first region and a second portion for heating the second region. The width of the first part is narrower than the width of the second part. The density of the heating element is lower in the second portion than in the first portion. A method for manufacturing a component according to claim 12, characterized in that it is a method for manufacturing a component.

16. The heating step involves heating the preform by irradiating it with energy using a heater. The heater comprises a first heating element for heating the first region and a second heating element for heating the second region. The power density of the second heating element is lower than that of the first heating element. A method for manufacturing a component according to claim 12, characterized in that it is a method for manufacturing a component.

17. Type and, A heating unit that heats the preform to form a temperature distribution on the preform, The system includes a drive system that presses the preform, on which the temperature distribution described above has been formed, with the mold to form a member from the preform or to release the member from the mold, The preform has a first region and a second region outside the first region. The heating section forms a temperature distribution in which the temperature of the second region is lower than the temperature of the first region. A manufacturing apparatus for components characterized by the following features.

18. The manufacturing apparatus for a component according to claim 17, characterized in that the heating section irradiates the first region with greater energy than the second region to form the temperature distribution.

19. The heating unit is a heater that heats the preform by irradiating it with the energy, The heater has a first portion for heating the first region and a second portion for heating the second region. The first distance between the first part and the first region is shorter than the second distance between the second part and the second region. The apparatus for manufacturing the component according to feature 18.

20. The heating unit is a heater that heats the preform by irradiating it with the energy, The heater has a first portion for heating the first region and a second portion for heating the second region. An insulating material is provided between the second portion and the second region. The apparatus for manufacturing the component according to feature 18.

21. The heating unit is a heater that heats the preform by irradiating it with the energy, The heater has a heating element that includes a first portion for heating the first region and a second portion for heating the second region. The width of the first part is narrower than the width of the second part. The density of the heating element is lower in the second portion than in the first portion. The apparatus for manufacturing the component according to feature 18.

22. The heating unit is a heater that heats the preform by irradiating it with the energy, The heater comprises a first heating element for heating the first region and a second heating element for heating the second region. The power density of the second heating element is lower than that of the first heating element. The apparatus for manufacturing the component according to feature 18.

23. A preform used in press molding, The first area and, It has a second region outside the first region, A film with a lower electromagnetic wave absorption rate than the preform is formed in the second region. A preform characterized by the following features.

24. The main body and It has a film attached to the main body that has a lower electromagnetic wave absorption rate than the main body, The main body has a first region and a second region outside the first region. In the second region, a third region to which the film is attached and a fourth region to which the main body is exposed are arranged alternately. A component characterized by the following features.

25. The member according to claim 24, characterized in that the film is made of a material containing an oxide or carbon.

26. The member according to claim 24 or 25, It has a support that supports the aforementioned member, The lens unit is characterized in that the aforementioned component is a lens.

27. The lens unit according to claim 26, A housing that houses the aforementioned lens unit and A device characterized by having the following features.