Heat medium supply device

Abstract

The present invention provides a heat transfer medium supply device that can continue to supply heat transfer medium to multiple processing chambers for semiconductor manufacturing even when a compressor fails. [Solution] The heat transfer medium supply device 1 includes a cooling device 3 for cooling the heat transfer medium, a heat transfer medium supply line 10 for transferring the heat transfer medium that has been cooled by the cooling device 3 and is used for temperature control of a plurality of processing chambers 100, and an operation control unit 5 that controls the operation of the cooling device 3 so that the temperature of the heat transfer medium measured by the heat transfer medium supply temperature measuring device 58 is maintained at a predetermined temperature. The cooling device 3 includes an evaporator 35 that evaporates the refrigerant liquid using the heat of the heat transfer medium to generate refrigerant vapor, a plurality of compressors 36 that compress the refrigerant vapor, and a condenser 38 that condenses the compressed refrigerant vapor to generate refrigerant liquid.

Description

Technical Field

[0001] The present invention relates to a heat medium supply device for supplying a heat medium used for temperature control of semiconductor manufacturing devices such as etching devices, CVD devices, and PVD devices.

Background Art

[0002] Semiconductor manufacturing devices (for example, etching devices, CVD devices, PVD devices) for manufacturing semiconductor devices are configured to execute a manufacturing process in a processing chamber while controlling the processing temperature. For example, in an etching device, the processing temperature of a wafer in the processing chamber is adjusted by flowing a liquid as a temperature-controlled heat medium through a flow path formed in a susceptor that supports the wafer.

[0003] The temperature-controlled heat medium is generated by a heat medium supply device having a cooling device for cooling the heat medium and a heating device for heating the heat medium. Conventionally, one processing chamber was connected to one heat medium supply device, but in recent years, a temperature control system in which a plurality of processing chambers are connected to one heat medium supply device has been proposed. In that case, constituent devices such as a cooling device, a heating device, a tank, a pump, and a control device can be shared, and energy saving, space saving, and cost reduction can be achieved compared to providing a plurality of heat medium supply devices.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when multiple processing chambers are connected, if the cooling device (especially the compressor) in the heat transfer medium supply unit fails, the supply of heat transfer medium to the multiple processing chambers becomes impossible, increasing the risk that all semiconductor manufacturing equipment connected to the heat transfer medium supply unit will shut down.

[0006] Therefore, the present invention provides a heat transfer medium supply device that can continue to supply heat transfer medium to multiple processing chambers for semiconductor manufacturing even when a compressor malfunctions. [Means for solving the problem]

[0007] In one embodiment, a heat medium supply device is provided for supplying a heat medium used for temperature control of a plurality of processing chambers for semiconductor manufacturing, comprising: a cooling device for cooling the heat medium; a heat medium pump for transferring the heat medium; a heat medium supply line for transferring the heat medium cooled by the cooling device and used for temperature control of the plurality of processing chambers; a heat medium supply temperature measuring device for measuring the temperature of the heat medium cooled by the cooling device; a heat medium return line for returning the heat medium after it has been used for temperature control of the plurality of processing chambers to the cooling device; and an operation control unit for controlling the operation of the cooling device so that the temperature of the heat medium measured by the heat medium supply temperature measuring device is maintained at a predetermined temperature, wherein the cooling device comprises: an evaporator that evaporates a refrigerant liquid using the heat of the heat medium to generate refrigerant vapor; a plurality of compressors for compressing the refrigerant vapor; and a condenser that condenses the compressed refrigerant vapor to generate the refrigerant liquid.

[0008] The cooling system is equipped with multiple compressors for multiple processing chambers. Therefore, even if one of the compressors fails, the other compressors can continue to operate, and the cooling system can continue to cool the heat transfer medium. As a result, the multiple processing chambers can continue their processing operations. Furthermore, compared to conventional cooling systems with a single compressor, the cooling capacity of each of the multiple compressors can be reduced. Therefore, the minimum load factor of the cooling system can be reduced. For example, when the target temperature of the multiple processing chambers is not very low, i.e., during low-load operation, energy-saving operation at low load can be achieved by stopping the operation of one of the multiple compressors.

[0009] In one embodiment, the plurality of compressors are each equipped with a plurality of inverters that change the operating frequency of the plurality of compressors, and the operation control unit is configured to switch the maximum operating frequency of the other compressors from the rated operating frequency to an overload operating frequency when any of the plurality of compressors fails, and the overload operating frequency is higher than the rated operating frequency. If one of the multiple compressors fails, the load on that single compressor increases, but the maximum operating frequency of the other compressors rises to the overload operating frequency. As a result, the compressor frequency increases, the cooling capacity increases, and the cooling system can maintain the cooling capacity necessary to regulate the temperature of the multiple processing chambers.

[0010] In one embodiment, the heat transfer medium supply line comprises a plurality of branch supply lines corresponding to the plurality of processing chambers, and the heat transfer medium supply device comprises a plurality of heat transfer medium flow rate control valves attached to each of the plurality of branch supply lines, and when one of the plurality of compressors fails and the supply temperature of the heat transfer medium measured by the heat transfer medium supply temperature measuring device exceeds a predetermined upper limit, the operation control unit is configured to stop supplying the heat transfer medium for temperature control of the processing chamber corresponding to the closed heat transfer medium flow rate control valve by closing a predetermined heat transfer medium flow rate control valve among the plurality of heat transfer medium flow rate control valves. In one embodiment, the heat transfer medium supply device is equipped with a plurality of flow rate measuring instruments attached to each of the plurality of branch lines, and if any of the plurality of compressors fails, the operation control unit is configured to control the plurality of heat transfer medium flow rate control valves to maintain a constant flow rate of the heat transfer medium supplied to the processing chamber that continues to supply the heat transfer medium.

[0011] When the supply temperature of the heat transfer medium exceeds a predetermined upper limit, it is determined that the heat transfer medium cannot maintain or reach the target temperature in all processing chambers. Therefore, the operation control unit closes a predetermined heat transfer medium flow control valve among the multiple heat transfer medium flow control valves, thereby using the heat transfer medium to regulate the temperature of fewer processing chambers. As a result, the remaining processing chambers can continue their processing operations. In this case, the order in which the heat transfer fluid flow control valves are stopped is often predetermined, but this may be determined by a signal from the processing chamber side, or the predetermined heat transfer fluid flow control valve may be determined each time based on the operating time, etc.

[0012] In one embodiment, the operation control unit is configured to generate a heat medium supply stop signal indicating the cessation of the supply of the heat medium. The control unit can signal the cessation of the heat transfer fluid supply, leading to a quicker recovery.

[0013] In one embodiment, the evaporator and the condenser are common to the plurality of compressors, and the cooling system further comprises a plurality of backflow prevention devices arranged on the discharge side of the plurality of compressors. Since multiple compressors are provided with a common evaporator and condenser, the entire cooling system can be made compact. Furthermore, if one of the compressors fails and stops operating, the backflow prevention device can prevent refrigerant vapor pressurized by the other operating compressors from flowing back into the stopped compressor.

[0014] In one embodiment, when any of the plurality of compressors fails, the operation control unit generates a compressor failure signal to identify the failed compressor. Identifying the faulty compressor allows for its prompt restoration.

[0015] In one embodiment, the evaporators and condensers are a plurality of evaporators and a plurality of condensers, each connected to the plurality of compressors. Since multiple compressors, multiple evaporators, and multiple condensers constitute multiple independent refrigerant circuits, the control unit can independently control the operating frequencies of the multiple compressors based on the target temperature required for the heat transfer medium. Furthermore, the control unit can also perform rotational operation of the multiple compressors to equalize their operating times.

[0016] In one embodiment, the plurality of evaporators are connected in parallel. Connecting multiple evaporators in parallel reduces the flow rate of the heat transfer medium to each evaporator, thereby reducing pressure loss on the heat transfer medium side.

[0017] In one embodiment, the plurality of evaporators are connected in series. Connecting multiple evaporators in series simplifies control because the method for controlling the heat transfer medium temperature remains unchanged even if one of the compressors stops. Furthermore, the temperature of the heat transfer medium can be gradually lowered (i.e., the evaporation temperature can be set in stages). Connecting multiple condensers in series and setting the temperature of the cooling water flowing through these condensers in stages also improves the overall efficiency of the cooling system. [Effects of the Invention]

[0018] The cooling device includes a plurality of compressors for a plurality of processing chambers. Therefore, even if any one of the plurality of compressors fails, the other compressors can continue operating, and the cooling device can cool the heat medium. As a result, the plurality of processing chambers can continue their processing operations. Also, compared to a conventional cooling device having one compressor, the refrigeration capacity of each of the plurality of compressors can be reduced. Therefore, the minimum load rate of the cooling device can be lowered.

Brief Description of the Drawings

[0019] [Figure 1] FIG. 8 is a schematic diagram showing an embodiment of a heat medium supply device that supplies a heat medium used for temperature adjustment of a plurality of processing chambers for semiconductor manufacturing. [Figure 2] FIG. 11 is a schematic diagram showing another embodiment of the heat medium supply device. [Figure 3] FIG. 14 is a schematic diagram showing still another embodiment of the heat medium supply device.

Embodiments for Carrying Out the Invention

[0020] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing an embodiment of a heat medium supply device that supplies a heat medium used for temperature adjustment of a plurality of processing chambers for semiconductor manufacturing. Examples of the heat medium include brine. Specific examples of brine include ethylene glycol, propylene glycol, calcium chloride, silicone oil, and fluorine-based inert liquids.

[0021] The plurality of processing chambers 100 are used for semiconductor manufacturing, and processing on wafers is performed within each processing chamber 100. In one example, one semiconductor manufacturing apparatus may have these plurality of processing chambers 100, and in another example, a plurality of semiconductor manufacturing apparatuses may each have a plurality of processing chambers 100. Examples of semiconductor manufacturing apparatuses include etching apparatuses, CVD apparatuses, PVD apparatuses, and the like.

[0022] The heat transfer medium supply device 1 of this embodiment is directly or indirectly connected to a plurality of processing chambers 100. In the embodiment shown in Figure 1, three processing chambers 100 are connected to the heat transfer medium supply device 1, but the number of processing chambers 100 is not limited to the embodiment shown in Figure 1. Four or more processing chambers 100 may be connected to the heat transfer medium supply device 1.

[0023] As shown in Figure 1, the heat transfer medium supply device 1 includes a cooling device 3 for cooling the heat transfer medium, an operation control unit 5 for controlling the operation of the cooling device 3, a heat transfer medium pump 7 for transferring the heat transfer medium, a heat transfer medium supply line 10 for transferring the heat transfer medium that has been cooled by the cooling device 3 and used for temperature control of multiple processing chambers 100, and a heat transfer medium return line 11 for returning the heat transfer medium that has been used for temperature control of the multiple processing chambers 100 back to the cooling device 3. The heat transfer medium supply line 10 includes multiple branch supply lines 10a corresponding to the multiple processing chambers 100, and the heat transfer medium return line 11 includes multiple merging return lines 11a corresponding to the multiple processing chambers 100.

[0024] Multiple branch feed lines 10a and multiple merging return lines 11a are directly or indirectly connected to multiple processing chambers 100. When the multiple branch feed lines 10a and multiple merging return lines 11a are directly connected to the multiple processing chambers 100, the heat transfer medium flows through the multiple branch feed lines 10a to the multiple processing chambers 100, and as it passes through the multiple processing chambers 100, the heat transfer medium directly cools these processing chambers 100. The heat transfer medium that has cooled the multiple processing chambers 100 flows into the multiple merging return lines 11a.

[0025] When multiple branching feed lines 10a and multiple merging return lines 11a are indirectly connected to multiple processing chambers 100, the heat transfer medium indirectly cools the multiple processing chambers 100 by cooling the other heat transfer mediums flowing through the multiple processing chambers 100. Specifically, the multiple branching feed lines 10a and multiple merging return lines 11a are connected to the multiple processing chambers 100 via multiple heat exchangers (not shown). The multiple heat exchangers perform heat exchange between the heat transfer medium supplied from the multiple branching feed lines 10a and the other heat transfer mediums flowing through the multiple processing chambers 100. The heat transfer medium that has undergone heat exchange in the multiple heat exchangers flows into the multiple merging return lines 11a. With this configuration, the heat transfer medium used in the heat transfer medium supply device and the heat transfer medium flowing through the processing chambers can be different heat transfer mediums, thus reducing the amount of heat transfer medium on the processing chamber side.

[0026] In the embodiment shown in Figure 1, the heat transfer medium supply device 1 further comprises a heat transfer medium tank 15 for storing the heat transfer medium. The heat transfer medium tank 15 is connected to a heat transfer medium return line 11. After being used to control the temperature of multiple processing chambers 100, the heat transfer medium is temporarily stored in the heat transfer medium tank 15. A heat transfer medium pump 7 is positioned between the heat transfer medium tank 15 and the cooling device 3 and transfers the heat transfer medium from the heat transfer medium tank 15 to the cooling device 3. The heat transfer medium supply device 1 is equipped with a liquid level detector 16 for detecting the liquid level of the heat transfer medium in the heat transfer medium tank 15.

[0027] Although not shown, in other embodiments, the heat transfer medium tank 15 may be connected to the heat transfer medium supply line 10. In this configuration, the heat transfer medium cooled by the cooling device 3 is temporarily stored in the heat transfer medium tank 15. The heat transfer medium pump 7 is located downstream of the heat transfer medium tank 15 and transfers the heat transfer medium in the heat transfer medium tank 15 toward the multiple processing chambers 100. In another embodiment, instead of multiple heat transfer fluid flow control valves, multiple heat transfer fluid pumps 7 are provided, each configured to individually control the rotational speed of multiple branch supply lines 10a.

[0028] In the embodiment shown in Figure 1, the cooling system 3 is composed of a plurality of compression chillers (turbo chillers) 30. These compression chillers 30 have the same configuration. Each compression chiller 30 includes an evaporator 35 that evaporates a refrigerant liquid using the heat of a heat transfer medium to generate refrigerant vapor, a compressor 36 that compresses the refrigerant vapor, and a condenser 38 that condenses the compressed refrigerant vapor with a cooling fluid (e.g., cooling water) to generate refrigerant liquid. The evaporator 35, compressor 36, and condenser 38 are connected by refrigerant piping 40. An expansion valve 41 is attached to the refrigerant piping 40 extending from the condenser 38 to the evaporator 35.

[0029] The compressor 36 comprises an impeller 45 for compressing refrigerant vapor and an electric motor 48 for rotating the impeller 45. The impeller 45 may be a single-stage impeller or a multi-stage impeller. The compressor 36 is equipped with an inverter 50 for changing the operating frequency of the electric motor 48. The inverter 50 is powered by a commercial power source. The inverter 50 is configured to supply variable-frequency power to the electric motor 48.

[0030] As shown in Figure 1, the cooling device 3 comprises multiple evaporators 35, multiple compressors 36, and multiple condensers 38 that constitute multiple compression chillers 30. The multiple evaporators 35 are connected in series by connecting pipes 54. One end of the connecting pipes 54 is connected to the heat transfer medium supply line 10, and the other end of the connecting pipes 54 is connected to the heat transfer medium return line 11. The multiple evaporators 35 gradually cool the heat transfer medium supplied from the heat transfer medium return line 11, and the cooled heat transfer medium flows into the heat transfer medium supply line 10.

[0031] Since the multiple compressors 36, multiple evaporators 35, and multiple condensers 38 constitute multiple independent refrigerant circuits, the operation control unit 5 can independently control the operating frequencies of the multiple compressors 36 based on the target temperature required for the heat transfer medium. Furthermore, the operation control unit 5 can also cause the multiple compressors 36 to perform rotational operation so that the operating times of the multiple compressors 36 are equalized.

[0032] In the embodiment shown in Figure 1, three compression refrigerators 30 (i.e., three evaporators 35, three compressors 36, and three condensers 38) are provided. However, the number of compression refrigerators 30 is not limited to the embodiment shown in Figure 1, and two, or four or more compression refrigerators 30 may be provided.

[0033] The cooling system 3 is equipped with multiple compressors 36 for multiple processing chambers 100. Therefore, even if one of the multiple compressors 36 fails, the other compressors 36 can continue to operate, and the cooling system 3 can continue to cool the heat transfer medium. As a result, the multiple processing chambers 100 can continue their processing operations. In addition, compared to a conventional cooling system 3 equipped with a single compressor 36, the cooling capacity of each of the multiple compressors 36 can be reduced. Therefore, the minimum load factor of the cooling system 3 can be reduced. For example, when the target temperature of the multiple processing chambers 100 is not very low, i.e., during low-load operation, energy-saving operation at low load can be achieved by stopping the operation of one of the multiple compressors 36.

[0034] The heat transfer medium supply device 1 includes a heat transfer medium supply temperature measuring device 58 that measures the temperature of the heat transfer medium cooled by the cooling device 3. The heat transfer medium supply temperature measuring device 58 is connected to the heat transfer medium supply line 10 and is located downstream of the cooling device 3. The heat transfer medium supply temperature measuring device 58 measures the temperature of the heat transfer medium before it is used to control the temperature of multiple processing chambers 100. The heat transfer medium supply temperature measuring device 58 is electrically connected to the operation control unit 5, and the measured temperature of the heat transfer medium is transmitted from the heat transfer medium supply temperature measuring device 58 to the operation control unit 5. The operation control unit 5 controls the operation of the cooling device 3 so that the temperature of the heat transfer medium measured by the heat transfer medium supply temperature measuring device 58 is maintained at a predetermined temperature.

[0035] The operation control unit 5 is comprised of at least one computer. The operation control unit 5 includes a storage device 5a containing a program for controlling the operation of the cooling device 3, and an arithmetic unit 5b that performs calculations according to the instructions contained in the program. The storage device 5a includes main memory such as random access memory (RAM) and auxiliary storage such as a hard disk drive (HDD) or solid state drive (SSD). Examples of arithmetic unit 5b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 5 is not limited to these examples.

[0036] The operation control unit 5 controls the operation of the cooling device 3, thereby cooling the heat transfer medium to a predetermined temperature. The predetermined temperature is a preset temperature, but it can be changed manually as needed, or it can be changed by signals from the semiconductor manufacturing equipment or from external sources.

[0037] In one embodiment, when any of the multiple compressors 36 fail, the operation control unit 5 is configured to generate a compressor 36 failure signal that identifies the faulty compressor 36. The compressor 36 failure signal is transmitted to an alarm device, an operation management device, an external terminal device, etc. (not shown). Since the compressor 36 failure signal identifies the faulty compressor 36, it leads to the prompt restoration of the compressor 36.

[0038] In one embodiment, the operation control unit 5 is configured to switch the maximum operating frequency of the other compressors 36 from the rated operating frequency to the overload operating frequency when one of the multiple compressors 36 fails. The rated operating frequency is the maximum operating frequency of the compressor 36 when the cooling system 3 is operating within a range below the upper limit of the cooling system 3's rated cooling capacity, and the overload operating frequency is the maximum operating frequency of the compressor 36 when the cooling system 3 is operating beyond the upper limit of the cooling system 3's rated cooling capacity. It is desirable that the overload operating frequency be higher than the rated operating frequency and set to the maximum frequency that is permissible without damaging the compressor 36. When one of the multiple compressors 36 fails, the cooling capacity decreases. In that case, by increasing the maximum operating frequency of the other compressors 36 to the overload operating frequency, the cooling capacity of each compressor increases, and the cooling device 3 can maintain the cooling capacity necessary for temperature control of the multiple processing chambers 100.

[0039] As shown in Figure 1, the heat transfer medium supply device 1 includes a plurality of flow meters 60 and a plurality of heat transfer medium flow control valves 61, each attached to a plurality of branch supply lines 10a. Each flow meter 60 is configured to measure the flow rate of the heat transfer medium flowing through each branch supply line 10a. Each flow meter 60 is electrically connected to the operation control unit 5, and the measured flow rate of the heat transfer medium is transmitted from each flow meter 60 to the operation control unit 5. Each heat transfer medium flow control valve 61 is an actuator-driven flow control valve, and is composed of, for example, an electric valve with a variable opening. The plurality of heat transfer medium flow control valves 61 are electrically connected to the operation control unit 5, and the operation of the heat transfer medium flow control valves 61 is controlled by the operation control unit 5.

[0040] The heat transfer medium supply device 1 includes a plurality of heat transfer medium return temperature measuring devices 63, each attached to a plurality of merging return lines 11a. Each heat transfer medium return temperature measuring device 63 is configured to measure the temperature of the heat transfer medium flowing through each merging return line 11a. Each heat transfer medium return temperature measuring device 63 is electrically connected to the operation control unit 5, and the measured temperature of the heat transfer medium after it has been used to regulate the temperature of the processing chamber 100 is transmitted from each heat transfer medium return temperature measuring device 63 to the operation control unit 5.

[0041] In one embodiment, if any of the multiple compressors 36 fail and the temperature of the heat medium measured by the heat medium supply temperature measuring device 58 exceeds a predetermined upper limit, the operation control unit 5 is configured to close a predetermined heat medium flow control valve 61 among the multiple heat medium flow control valves 61, thereby stopping the supply of heat medium for temperature control of the processing chamber 100 corresponding to the closed heat medium flow control valve 61. Here, the predetermined upper limit of the heat medium temperature is the temperature that is permissible during the process of the processing chamber 100.

[0042] When the temperature of the heat medium measured by the heat medium supply temperature measuring device 58 exceeds a predetermined upper limit, it is determined that the heat medium cannot maintain or reach the target temperature in all processing chambers 100. Therefore, the operation control unit 5 closes a predetermined heat medium flow control valve 61 among the plurality of heat medium flow control valves 61, so that the heat medium is used to regulate the temperature of fewer processing chambers 100. As a result, the processing operation of the processing chamber 100 from which the heat medium supply has been stopped is stopped, but the remaining processing chambers 100 can continue their processing operation.

[0043] For example, if the cooling capacity of the cooling device 3 falls to 2 / 3 of the required capacity (in the case of 3 processing chambers), the first of the three heat transfer medium flow control valves 61 is closed, and the supply of heat transfer medium to 2 processing chambers continues. If the cooling capacity of the cooling device 3 falls to 1 / 3 of the required capacity, the second heat transfer medium flow control valve is closed, and the supply of heat transfer medium to the remaining processing chamber continues.

[0044] Furthermore, since the processing temperature inside the processing chamber 100 can change during semiconductor manufacturing, the cooling load on the cooling device 3 is not constant during semiconductor manufacturing. Therefore, even if the cooling capacity decreases, it is possible to sequentially stop the supply of heat transfer medium to the processing chamber 100 where the cooling load has decreased (or disappeared) or to reduce the flow rate of heat transfer medium (while continuing to supply heat to the other processing chambers 100). With this control, even if the cooling capacity decreases, the supply of heat transfer medium to the multiple processing chambers 100 decreases sequentially, but semiconductor manufacturing can continue in at least one of the processing chambers 100.

[0045] In one embodiment, if any of the compressors fail, the operation control unit 5 is configured to control a plurality of heat transfer medium flow control valves 61 to maintain a constant flow rate of heat transfer medium to the processing chamber 100, which continues to receive the heat transfer medium. Closing one heat transfer medium flow control valve 61 increases the flow rate of heat transfer medium through the other heat transfer medium flow control valves 61. Therefore, the flow rate of heat transfer medium to the processing chamber 100 is adjusted by adjusting the other heat transfer medium flow control valves 61.

[0046] In one embodiment, if one of the multiple compressors 36 fails and the temperature of the heat medium measured by the heat medium supply temperature measuring device 58 exceeds a predetermined upper limit, the operation control unit 5 closes a predetermined heat medium flow control valve 61 among the multiple heat medium flow control valves 61, thereby stopping the supply of heat medium for temperature control of the processing chamber 100 corresponding to the closed heat medium flow control valve 61, and is further configured to generate a heat medium supply stop signal indicating the cessation of heat medium supply. The heat medium supply stop signal is transmitted to an alarm device, operation management device, external terminal device, etc. (not shown). Since the operation control unit 5 can notify of the cessation of heat medium supply, it leads to the rapid recovery of the compressor 36.

[0047] As shown in Figure 1, the multiple evaporators 35 of the cooling device 3 are connected in series. When multiple evaporators 35 are connected in series, the method of controlling the heat transfer medium supply temperature does not change even if one of the multiple compressors 36 stops, so the control of the cooling device 3 is simple. In addition, the temperature of the heat transfer medium can be lowered in stages (i.e., the evaporation temperature can be set in stages). Connecting multiple condensers 38 in series and setting the temperature of the cooling fluid (e.g., cooling water) flowing through these condensers 38 in stages also has the effect of improving the efficiency of the refrigerator. Specifically, the heat transfer medium is flowed sequentially through the multiple evaporators 35, while the cooling fluid (e.g., cooling water) is flowed sequentially through the multiple condensers 38 in the opposite direction. By lowering the condensation pressure (cooling fluid temperature) in a refrigeration cycle with a low evaporation pressure (low heat transfer medium temperature), the difference between the evaporation pressure and the condensation pressure becomes smaller, and the head required of the compressor 36 becomes smaller.

[0048] Figure 2 is a schematic diagram showing another embodiment of the heat transfer medium supply device 1. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to Figure 1, so redundant explanations are omitted. As shown in Figure 2, the heat transfer medium supply device 1 of this embodiment is the same as the embodiment shown in Figure 1 in that it has multiple compression chillers 30 (i.e., multiple evaporators 35, multiple compressors 36, and multiple condensers 38), but differs in that the multiple evaporators 35 are connected in parallel by connecting pipes 54.

[0049] By connecting multiple evaporators 35 in parallel, the flow rate of the heat transfer medium through each evaporator 35 is reduced, thereby reducing the pressure loss on the heat transfer medium side.

[0050] Figure 3 is a schematic diagram showing yet another embodiment of the heat transfer medium supply device 1. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to Figure 1, so redundant descriptions are omitted. As shown in Figure 3, in this embodiment, the cooling device 3 consists of a compression chiller 30 equipped with a plurality of compressors 36 and a common evaporator 35 and a common condenser 38 for these compressors 36. The plurality of compressors 36 are connected in parallel by the evaporator 35 and the condenser 38. Furthermore, the cooling device 3 is equipped with a plurality of backflow prevention devices 70, each located on the discharge side of the plurality of compressors 36. Each backflow prevention device 70 is configured to prevent the backflow of refrigerant vapor from the condenser 38 to each compressor 36.

[0051] Since a common evaporator 35 and a common condenser 38 are provided for multiple compressors 36, the entire cooling system 3 can be made compact. Furthermore, if any of the multiple compressors 36 fail and stop operating, the backflow prevention device 70 can prevent refrigerant vapor pressurized by the other operating compressors 36 from flowing back into the stopped compressor 36.

[0052] The embodiments described with reference to Figures 1 to 3 are used for cooling a plurality of processing chambers 100, but in other embodiments, the heat transfer medium supply device 1 may further include, in addition to the cooling device 3, a heating device (not shown) for the heat transfer medium to heat the plurality of processing chambers 100.

[0053] The embodiments described above are intended to enable persons with ordinary skill in the art to implement the present invention. Various modifications of the above embodiments can be made naturally by those skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments as well. Therefore, the present invention is not limited to the embodiments described, but is to be interpreted in the broadest sense according to the technical idea defined by the claims. [Explanation of symbols]

[0054] 1 Heat medium supply device 3 Cooling device 5. Operation Control Unit 7 Heat transfer fluid pump 10 Heat transfer medium supply line 10a Branch feed line 11 Heat transfer fluid return line 11a Merging return line 15 Heat transfer tank 16. Liquid level detector 30 Compression-type refrigerators (turbo refrigerators) 35 Evaporator 36 Compressor 38 Condenser 40 Refrigerant piping 41 Expansion valve 45 Impeller 48 Electric motor 50 Inverters 54 Connecting piping 58 Heat transfer medium supply temperature measuring device 60 Flow meter 61 Heat transfer fluid flow control valve 63 Heat transfer fluid return temperature measuring device 70 Backflow prevention device 100 Processing Chambers

Claims

1. A heat transfer medium supply device that supplies a heat transfer medium used for temperature control of multiple processing chambers for semiconductor manufacturing, A cooling device for cooling the heat transfer medium, A heat transfer medium pump for transferring the heat transfer medium, A heat transfer medium supply line for transferring the heat transfer medium, which is cooled by the cooling device and used for temperature control of the plurality of processing chambers, A heat medium supply temperature measuring device for measuring the temperature of the heat medium cooled by the cooling device, A heat transfer medium return line that returns the heat transfer medium used for temperature control of the plurality of processing chambers to the cooling device, The cooling device includes an operation control unit that controls the operation of the cooling device so that the temperature of the heat medium, as measured by the heat medium supply temperature measuring device, is maintained at a predetermined temperature. The cooling device, An evaporator that generates refrigerant vapor by evaporating the refrigerant liquid using the heat of the heat transfer medium, Multiple compressors for compressing the refrigerant vapor, A heat transfer medium supply device comprising a condenser that condenses the compressed refrigerant vapor to produce the refrigerant liquid.

2. Each of the aforementioned multiple compressors is equipped with a plurality of inverters that change the operating frequency of the plurality of compressors. The heat transfer medium supply device according to claim 1, wherein the operation control unit is configured to switch the maximum operating frequency of the other compressors from the rated operating frequency to an overload operating frequency when any of the plurality of compressors fails, and the overload operating frequency is higher than the rated operating frequency.

3. The heat transfer medium supply line comprises a plurality of branch supply lines corresponding to the plurality of processing chambers, The heat transfer medium supply device includes a plurality of heat transfer medium flow rate control valves attached to each of the plurality of branch supply lines, The heat medium supply device according to claim 1, wherein if any of the plurality of compressors fails and the supply temperature of the heat medium measured by the heat medium supply temperature measuring device exceeds a predetermined upper limit, the operation control unit is configured to stop supplying the heat medium for temperature control of the processing chamber corresponding to the closed heat medium flow control valve by closing a predetermined heat medium flow control valve among the plurality of heat medium flow control valves.

4. The heat transfer medium supply device is equipped with a plurality of flow rate measuring instruments attached to each of the plurality of branch lines, The heat medium supply device according to claim 3, wherein if any of the plurality of compressors fails, the operation control unit is configured to control the plurality of heat medium flow control valves to maintain a constant flow rate of the heat medium to the processing chamber that continues to supply the heat medium.

5. The heat medium supply device according to claim 3, wherein the operation control unit is configured to generate a heat medium supply stop signal indicating the cessation of the supply of the heat medium.

6. The evaporator and the condenser are common to the plurality of compressors, The heat transfer medium supply device according to claim 1, wherein the cooling device further comprises a plurality of backflow prevention devices arranged on the discharge side of the plurality of compressors.

7. The heat transfer medium supply device according to claim 1, wherein the operation control unit generates a compressor failure signal to identify the faulty compressor when any of the plurality of compressors fails.

8. The heat transfer medium supply device according to claim 1, wherein the evaporators and condensers are a plurality of evaporators and a plurality of condensers, each connected to the plurality of compressors.

9. The heat transfer medium supply device according to claim 8, wherein the plurality of evaporators are connected in parallel.

10. The heat transfer medium supply device according to claim 8, wherein the plurality of evaporators are connected in series.

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