Coil components

Abstract

This invention provides a coil component that can improve SRF by reducing parasitic capacitance components while maintaining the size of the coil's air core. [Solution] The coil component 1000 includes a main body 100 having a first surface 101 and a second surface 102 facing each other in the X direction, a first side surface 105 and a second side surface 106 connecting the first and second surfaces and facing each other in the Y direction, a third side surface 103 and a fourth side surface 104 connecting the first and second side surfaces, a coil 300 disposed inside the main body and including a lead-out portion extending to the third side surface of the main body, external electrodes 400, 500 disposed on the third side surface of the main body and including a connecting portion connected to the lead-out portion, and a first insulating layer 610 disposed on the third side surface of the main body and exposing the connecting portion, wherein the distance between the connecting portion of the external electrode and the first side surface is different from the distance between the connecting portion of the external electrode and the second side surface.

Description

Technical Field

[0001] The present invention relates to coil components.

Background Art

[0002] An inductor, which is one type of coil component, is a typical passive electronic component used in electronic devices together with a resistor and a capacitor.

[0003] In addition to its inherent inductance characteristics, a power inductor has the characteristic of having a self-resonance frequency (SRF) due to unwanted parasitic components such as capacitance. For power inductors having the same capacitance value, the higher the SRF, the higher the frequency at which they operate as inductors. In special application fields such as ET Modulators, it is necessary to freely adjust the SRF of the power inductor so as to have a desired impedance value at a specific frequency.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to provide a coil component capable of reducing parasitic capacitance components and improving SRF while ensuring the size of the air core of the coil.

Means for Solving the Problems

[0005] According to one aspect of the present invention, a coil component is provided that includes a body having first and second surfaces facing each other in a first direction, a first and second surface connecting the first and second surfaces and a third surface connecting the first and second surfaces facing each other in a second direction, a coil disposed within the body and including a lead-out portion extending to the third surface of the body, an external electrode disposed on the third surface of the body and including a connecting portion connected to the lead-out portion, and a first insulating layer disposed on the third surface of the body and exposing the connecting portion, wherein the distance between the connecting portion of the external electrode and the first surface is different from the distance between the connecting portion of the external electrode and the second surface. [Effects of the Invention]

[0006] According to the present invention, it is possible to improve SRF by reducing parasitic capacitance components while ensuring the size of the coil's air core. [Brief explanation of the drawing]

[0007] [Figure 1] This diagram schematically shows a coil component according to one embodiment of the present invention. [Figure 2] This is a view of Figure 1 from above. [Figure 3] This figure shows a cross-section along the line I-I' in Figure 1. [Figure 4] This figure shows a cross-section along the line II-II' in Figure 1. [Figure 5] This is a view of Figure 1 from direction A. [Figure 6] This is a view of Figure 1 from direction B. [Figure 7] This is a coil component relating to one modified example, and corresponds to Figure 3. [Figure 8] This is a coil component relating to another modified example, and is shown in the figure corresponding to Figure 5. [Figure 9] This is another modified coil component, which corresponds to Figure 5. [Modes for carrying out the invention]

[0008] The terminology used in this application is used solely to describe specific embodiments and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, terms such as “includes” or “having” are intended to specify the existence of features, figures, stages, actions, components, parts, or combinations thereof described in the specification, and should be understood not to preemptively exclude the possibility of the existence or addition of one or more other features, figures, stages, actions, components, parts, or combinations thereof. Throughout the specification, “above” means located above or below the part in question, and does not necessarily mean located above the direction of gravity.

[0009] Furthermore, the term "connection" shall not refer only to cases where each component is in direct physical contact with another component, but shall also encompass cases where another component is interposed between the components, and each component is in contact with that other component.

[0010] The dimensions and thicknesses of each component shown in the drawings are arbitrary for illustrative purposes, and therefore the present invention is not necessarily limited to those shown.

[0011] In drawings, the Z direction can be defined as the third direction or length direction, the Y direction as the second direction or width direction, and the X direction as the first direction or thickness direction.

[0012] Hereinafter, coil components according to embodiments of the present invention will be described in detail with reference to the attached drawings. In describing these components with reference to the attached drawings, the same drawing number will be assigned to identical or corresponding components, and redundant explanations will be omitted.

[0013] Electronic devices utilize various types of electronic components, and various types of coil components can be appropriately used between these electronic components for purposes such as noise reduction.

[0014] That is, in an electronic device, coil components can be used for power inductors, high-frequency inductors, general beads, GHz beads, common mode filters, etc.

[0015] FIG. 1 is a diagram schematically showing a coil component according to an embodiment of the present invention, FIG. 2 is a view of FIG. 1 seen from above, FIG. 3 is a diagram showing a cross section along the line I-I' of FIG. 1, FIG. 4 is a diagram showing a cross section along the line II-II' of FIG. 1, FIG. 5 is a view of FIG. 1 seen from the A direction, and FIG. 6 is a view of FIG. 1 seen from the B direction. In FIG. 5, for the convenience of understanding and explanation of this embodiment, the second insulating layer 620 is omitted.

[0016] Referring to FIGS. 1 to 6, a coil component 1000 according to an embodiment of the present invention includes a main body 100, a coil 300, external electrodes 400 and 500, and a first insulating layer 610, and may further include a support member 200, an insulating film IF, and a second insulating layer 620.

[0017] The main body 100 forms the appearance of the coil component 1000 according to this embodiment, and the coil 300 is embedded inside.

[0018] The main body 100 can be formed in a hexahedron shape as a whole.

[0019] Hereinafter, an embodiment of the present invention will be described on the premise that the main body 100 is in a hexahedron shape by way of example. However, such an explanation does not exclude coil components including a main body formed in a shape other than a hexahedron from the scope of this embodiment.

[0020] The main body 100 may include a first surface 101 and a second surface 102 facing each other in the X direction (first direction), a first side surface 105 and a second side surface 106 facing each other in the Y direction (second direction), and a third side surface 103 and a fourth side surface 104 facing each other in the Z direction (third direction). Each of the first to fourth side surfaces 105, 106, 103, and 104 of the main body 100 can correspond to a plurality of side surfaces connecting the first surface 101 and the second surface 102 of the main body 100. When mounting the coil component 1000 according to this embodiment on a mounting board such as a printed circuit board, the first surface 101 of the main body 100 can be positioned to face the mounting surface of the mounting board and mounted on the mounting board.

[0021] The main body 100 may, for example, be formed such that the coil component 1000 according to this embodiment, which has external electrodes 400, 500 and insulating layers 610, 620 described later, has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. On the other hand, the numerical values ​​for length, width, and thickness of the coil component described above exclude tolerances, and the actual length, width, and thickness of the coil component due to tolerances may differ from the above values.

[0022] The main body 100 may include a magnetic material and a resin. Specifically, the main body 100 can be formed by laminating one or more magnetic composite sheets in which the magnetic material is dispersed in a resin. However, the main body 100 may have structures other than those in which the magnetic material is dispersed in a resin. For example, the main body 100 may be made of a magnetic material such as ferrite, or it may be made of a non-magnetic material.

[0023] The magnetic material may be ferrite or metallic magnetic powder.

[0024] The ferrite powder may be at least one of the following, for example: spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, and Ni-Zn; hexagonal ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, and Ba-Ni-Co; garnet-type ferrites such as Y-type; and Li-based ferrites.

[0025] The metallic magnetic powder may contain one or more elements selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic powder may be at least one of the following: pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder, or Fe-Cr-Al alloy powder.

[0026] The metallic magnetic powder may be amorphous or crystalline. For example, the metallic magnetic powder may be an Fe-Si-B-Cr amorphous alloy powder, but is not necessarily limited to this.

[0027] The ferrite and metallic magnetic powders may each have an average diameter of approximately 0.1 μm to 30 μm, but are not limited to this.

[0028] The main body 100 may contain two or more types of magnetic materials dispersed in the resin. Here, different types of magnetic materials mean that the magnetic materials dispersed in the resin are distinguishable from each other by any one of the following: average diameter, composition, crystallinity, and shape.

[0029] The resin may contain, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc., either alone or in combination.

[0030] The main body 100 may include a core 110 that penetrates the coil 300, which will be described later. The core 110 can be formed by filling the through-hole of the coil 300 with a magnetic composite sheet, but is not limited to this.

[0031] The support member 200 is embedded within the main body 100 and can support the coil 300, which will be described later.

[0032] The support member 200 may be formed from an insulating material containing at least one of a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, and a photosensitive insulating resin, or from an insulating material in which such an insulating resin is impregnated with a reinforcing material such as glass fiber or inorganic filler. For example, the support member 200 may be formed from insulating materials such as copper clad laminate (CCL), prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) resin, or PID (Photo Imageable Dielectric).

[0033] As inorganic fillers, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0034] When the support member 200 is formed of an insulating material containing reinforcing material, the support member 200 can provide superior rigidity. When the support member 200 is formed of an insulating material that does not contain glass fibers, the support member 200 is advantageous for reducing the overall thickness of the coil 300. When the support member 200 is formed of an insulating material containing a photosensitive insulating resin, the number of processes is reduced, which is advantageous for reducing production costs, and it is possible to process micropores.

[0035] The coil 300 is placed inside the main body 100 and exhibits the characteristics of a coil component. For example, when the coil component 1000 of this embodiment is used as a power inductor, the coil 300 can stabilize the power supply of electronic equipment by storing the electric field as a magnetic field and maintaining the output voltage.

[0036] The coil 300 is arranged on one surface of the support member 200 and can form at least one turn. In this embodiment, the coil 300 may include a first coil pattern 311 and a first lead portion 331 arranged on one surface of the support member 200 facing the second surface 102 of the main body 100, a second coil pattern 312 and a second lead portion 332 arranged on the other surface of the support member 200, and a via 320 that penetrates the support member 200 and connects the first coil pattern 311 and the second coil pattern 312. As a result, the coil 300 applied to this embodiment can be formed as a single coil that generates a magnetic field in a first direction (X direction) of the main body 100 with respect to the core 110.

[0037] Each of the first coil pattern 311 and the second coil pattern 312 may be in the form of a planar helix that forms at least one turn around the core 110 of the main body 100. For example, with reference to the directions in Figures 1, 3 and 4, the first coil pattern 311 can form at least one turn around the core 110 on the upper surface of the support member 200. The second coil pattern 312 can form at least one turn around the core 110 on the lower surface of the support member 200.

[0038] The extensions 331 and 332 are connected to the coil patterns 311 and 312 and can extend to the third side 103 and fourth side 104 of the main body 100, respectively. Specifically, the first extension 331 is positioned on one side (top) of the support member 200 and connected to the first coil pattern 311, and extends to the third side 103 of the main body 100. The second extension 332 is positioned on the other side (bottom) of the support member 200 and connected to the second coil pattern 312, and extends to the fourth side 104 of the main body 100. The extensions 331 and 332 can extend to the third side 103 and fourth side 104 of the main body 100 and can contact and connect with the external electrodes 400 and 500, which will be described later.

[0039] The distance between the drawer sections 331 and 332 and the first side surface 105 may differ from the distance between the drawer sections 331 and 332 and the second side surface 106. Referring to Figure 2, the drawer sections 331 and 332 may be positioned closer to the second side surface 106 than to the first side surface 105. However, this is not limited to this, and the drawer sections 331 and 332 may be positioned closer to the first side surface 105 than to the second side surface 106. By positioning the drawer sections 331 and 332 closer to the first side surface 105 or the second side surface 106 as described above, the size of the air core can be secured.

[0040] At least one of the coil patterns 311, 312, vias 320, and lead portions 331, 332 may include at least one conductive layer.

[0041] For example, when the first coil pattern 311, vias 320, and first lead-out portion 331 are formed by plating, each of the first coil pattern 311, vias 320, and first lead-out portion 331 may include a seed layer formed by electroless plating or vapor deposition such as sputtering, and an electroplated layer. Here, the electroplated layer may be a single-layer structure or a multilayer structure. The multilayer electroplated layer may be formed as a conformal film structure in which one electroplated layer covers the other electroplated layer, or it may be formed in a shape in which the other electroplated layer is laminated on only one side of the other electroplated layer. The seed layers of the first coil pattern 311, vias 320, and first lead-out portion 331 may be formed integrally without boundaries being formed between them, but this is not limited to that. The electroplated layers of the first coil pattern 311, vias 320, and first lead-out portion 331 may be formed integrally without boundaries being formed between them, but this is not limited to that.

[0042] As another example, when the first coil pattern 311 and the second coil pattern 311 are formed separately and then stacked together on the support member 200 to form the coil 300, the via 320 may include a high-melting-point metal layer and a low-melting-point metal layer having a melting point lower than that of the high-melting-point metal layer. Here, the low-melting-point metal layer can be formed with solder containing lead (Pb) and / or tin (Sn). At least a portion of the low-melting-point metal layer melts due to the pressure and temperature during stacking, and an intermetallic compound layer (IMC layer) can be formed at the boundary between the low-melting-point metal layer and the first coil pattern 311.

[0043] The first coil pattern 311 and the second coil pattern 312 may, for example, be formed to protrude from the upper and lower surfaces of the support member 200, respectively. In another example, the first coil pattern 311 may be embedded in the upper surface of the support member 200, with its upper surface exposed, and the second coil pattern 312 may be formed to protrude from the lower surface of the support member 200. In this case, a recess may be formed on the upper surface of the first coil pattern 311, and the upper surface of the support member 200 and the upper surface of the first coil pattern 311 may not be on the same plane. In yet another example, the first coil pattern 311 may be embedded in the upper surface of the support member 200, with its upper surface exposed, and the second coil pattern 312 may be embedded in the lower surface of the support member 200, with its lower surface exposed.

[0044] Each of the coil patterns 311, 312, vias 320, and lead-out sections 331, 332 can be formed from a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), molybdenum (Mo), or alloys thereof, but is not limited thereto.

[0045] The external electrodes 400 and 500 are positioned on the third side 103 and fourth side 104 of the main body 100 and can extend to the first surface 101 of the main body 100. The external electrodes 400 and 500 are connected to the lead-out portions 331 and 332 and can play a role in electrically connecting the coil 300 within the coil component 1000 to the electronic device when the coil component 1000 is mounted on an electronic device or the like.

[0046] The external electrodes 400 and 500 may include a first external electrode 400 positioned on the third side surface 103 of the main body 100 and connected to the first lead-out portion 331, and a second external electrode positioned on the fourth side surface 104 of the main body 100 and connected to the second lead-out portion 332. The first external electrode 400 and the second external electrode 500 can be separated in a third direction (Z direction) so as not to contact each other on the first surface 101 of the main body 100. The following description will focus on the first external electrode 400, and the description of the second external electrode 500 will be omitted as it may be redundant.

[0047] The first external electrode 400 may include a first lead-out portion 331 positioned on the third side surface 103 of the main body 100, and a first extension portion 412 extending from the first connecting portion 411 to the first surface 101 of the main body 100.

[0048] The first connecting portion 411 is positioned on the third side surface 103 of the main body 100 and can be in contact with and connected to the first extension portion 331. At least a portion of the first connecting portion 411 can be positioned in the opening O of the first insulating layer 610, which will be described later, and the side surface of the connecting portion 411 can be in contact with the first insulating layer 610.

[0049] The distance d1 between the first connecting portion 411 and the first side surface 105 may be different from the distance d2 between the first connecting portion 411 and the second side surface 106. Referring to Figure 5, the distance d1 between the first connecting portion 411 and the first side surface 105 is greater than the distance d2 between the first connecting portion 411 and the second side surface 106. The difference in the values ​​of d1 and d2 can mean, for example, a length difference of 100 μm or more between d1 and d2. However, it is not limited to this, and can include cases where there is a meaningful length difference depending on the size of the coil component 1000.

[0050] Furthermore, the connecting portions 411 and 511 may be positioned on only one of the intermediate surfaces M located midway between the first side surface 105 and the second side surface 106 of the main body 100. The distance between the first connecting portion 411 and the first side surface 105 can be measured in the following way. The first insulating layer 610 can be removed from the coil component 1000, and the length of a line segment parallel to the second direction (Y direction) connecting the first side surface 105 and the first connecting portion 411 can be determined. At this time, any five points separated in the first direction (X direction) can be selected, and the lengths of multiple line segments can be determined at these five points. The distance between the first connecting portion 411 and the first side surface 105 can represent the arithmetic mean of the lengths of the multiple line segments. Similarly, the distance between the first connecting portion 411 and the second side surface 106 can be measured by analogy from the above description.

[0051] As described above, the first connecting portion 411 is positioned closer to the second side surface 106 of the main body 100 than to the first side surface 105. However, it is not limited to this, and the first connecting portion 411 may be positioned closer to the first side surface 105 than to the second side surface 106 of the main body 100. Also, as shown in Figure 8, the connecting portions 411 and 511 can be positioned to straddle the intermediate surface M.

[0052] To reduce parasitic capacitance between coil 300 and external electrodes 400 and 500, the distance between coil 300 and external electrodes 400 and 500 can be adjusted. In conventional coil components, the outermost turn of coil 300 and external electrodes 400 and 500 lie on the same line in the third direction (Z direction), and adjusting the distance between them inevitably requires adjusting the margin of coil 300 in the third direction (Z direction). In such cases, while SRF characteristics are improved, the size of the air core may decrease, leading to a decrease in Isat and an increase in Rdc.

[0053] In contrast, the coil component according to this embodiment allows for adjustment of the distance between the coil 300 and the external electrodes 400 and 500 without changing the margin of the coil 300, by offsetting the connecting portion 411 from the center of the third side surface 103 of the main body 100. Referring to Figure 2, the outermost point of the coil 300 in the third direction (Z direction) is not located on the same line as the connecting portion 411. That is, the outermost turn of the coil 300 and the connecting portions 411 and 511 are not located on the same third direction (Z direction) line, but can be located diagonally in the second direction (Y direction). This makes it possible to ensure sufficient distance between the coil 300 and the connecting portion 411 while maintaining the size of the air core of the coil 300, thereby improving the SRF characteristics.

[0054] Referring to Figure 2, the second connecting portion 511 can be positioned on the fourth side surface 104 of the main body 100, closer to the second side surface 106 than to the first side surface 105. In other words, the second connecting portion 511 can also be positioned biased in the same direction as the first connecting portion 411. Therefore, when viewed from a third direction, at least a portion of the first connecting portion 411 and the second connecting portion 511 can overlap.

[0055] The first extension 412 can be connected to the first connecting portion 411 and positioned on the first surface 101 of the main body 100. The first extension 412 and the second extension 512 may be positioned spaced apart in a third direction (Z direction) on the first surface 101 of the main body 100. At least a portion of the first extension 412 can be positioned in the opening O of the first insulating layer 610, which will be described later, and the side surface of the first extension 412 can be in contact with the first insulating layer 610.

[0056] External electrodes 400 and 500 can be formed on the surface of the main body 100 by performing electroplating using the first insulating layer 610 formed on the surface of the main body 100 as a plating resist. If the main body 100 contains metallic magnetic powder, the metallic magnetic powder can be exposed on the surface of the main body 100. The metallic magnetic powder exposed on the surface of the main body 100 can impart conductivity to the surface of the main body 100 during electroplating, and the external electrodes 400 and 500 can be formed on the surface of the main body 100 by electroplating.

[0057] The connecting portions 411, 511 and extension portions 412, 512 of the external electrodes 400, 500 may be formed in the same plating process, and no boundary may be formed between them. That is, the first connecting portion 411 and the first extension portion 412 may be formed integrally, and the second connecting portion 511 and the second extension portion 512 may be formed integrally. Also, the connecting portions 411, 511 and the extension portions 412, 512 may be made of the same metal. However, this explanation does not exclude from the scope of the present invention cases in which the connecting portions 411, 511 and the extension portions 412, 512 are formed in different plating processes and a boundary is formed between them.

[0058] The external electrodes 400 and 500 can be formed from conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but are not limited to these.

[0059] External electrodes 400 and 500 can be formed in a thickness range of 0.5 μm to 100 μm. If the thickness of external electrodes 400 and 500 is less than 0.5 μm, detachment and peeling may occur during substrate mounting. If the thickness of external electrodes 400 and 500 exceeds 100 μm, it may be disadvantageous for thinning the coil component.

[0060] The first insulating layer 610 is positioned on the third side surface 103 and the fourth side surface 104 of the main body 100, allowing the connecting portions 411 and 511 to be exposed. The first insulating layer 610 can also be positioned on the first surface, the second surface, and the first to fourth side surfaces of the main body 100. The first insulating layer 610 is formed to surround the entire surface of the main body 100 together with the external electrodes 400 and 500. The first insulating layer 610 can, but is not limited to, function as a plating resist when the external electrodes 400 and 500 are formed by plating.

[0061] An opening O is formed in the first insulating layer 610, where the external electrodes 400 and 500 are placed. The opening O of the first insulating layer 610 can be formed on the third side surface 103, the fourth side surface 104, and the first surface 101 of the main body 100. The opening O can extend from the third side surface 103 to the first surface 101, and the opening O can extend from the fourth side surface 104 to the first surface 101. Referring to Figures 5 and 6, at least a portion of the connecting portions 411, 511 and the extension portions 412, 512 may be placed in the opening O.

[0062] This allows the first insulating layer 610 to expose the connecting portions 411, 511 and the extension portions 412, 512.

[0063] The first insulating layer 610 is made of thermoplastic resins such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, and acrylic; thermosetting resins such as phenol, epoxy, urethane, melamine, and alkyd; photosensitive resins; parylene; SiO x or SiN x It can include...

[0064] The first insulating layer 610 may have an adhesive function. For example, when the first insulating layer 610 is formed by laminating an insulating film onto the main body 100, the insulating film may contain an adhesive component and adhere to the surface of the main body 100. In such a case, an adhesive layer may be separately formed on one surface of the first insulating layer 610. However, it is not necessary for a separate adhesive layer to be formed on one surface of the first insulating layer 610, such as when forming the first insulating layer 610 using an insulating film in a semi-cured state (B-stage).

[0065] The first insulating layer 610 can be formed by applying a liquid insulating resin to the surface of the main body 100, laminating an insulating film onto the surface of the main body 100, or forming an insulating resin on the surface of the main body 100 by vapor deposition. In the case of an insulating film, a dry film (DF) containing a photosensitive insulating resin, an ABF (Ajinomoto Build-up Film) or polyimide film that does not contain a photosensitive insulating resin can be used.

[0066] The first insulating layer 610 can be formed in a thickness range of 10 nm to 100 μm. If the thickness of the first insulating layer 610 is less than 10 nm, the characteristics of the coil component may decrease, such as a decrease in Q factor, a decrease in breakdown voltage, and a decrease in self-resonant frequency (SRF). If the thickness of the first insulating layer 610 is greater than 100 μm, the total length, width, and thickness of the coil component may increase, which may be disadvantageous for thinning.

[0067] In the following, the arrangement relationship between the first insulating layer 610 and the first external electrode 400 will be described with reference to the third side surface 103 of the main body 100. However, this description can also be similarly applied to the first insulating layer 610 and the second external electrode 500 located on the fourth side surface 104 of the main body 100.

[0068] Referring to Figure 5, the first insulating layer 610 is positioned on the third side surface 103 of the main body 100 and may have one region 610R1 and the other region 610R2 that are separated from each other in the second direction (Y direction). For example, after forming the first insulating layer 610 over the entire third side surface 103 of the main body 100, a slit-shaped opening O extending along the first direction (X direction) is formed in the first insulating layer 610 to expose a part of the third side surface 103 of the main body 100, thereby separating the one region 610R1 and the other region 610R2 of the first insulating layer 610 from each other. The opening O is formed in the first insulating layer 610 by physical and / or chemical processing methods, allowing the third side surface 103 of the main body 100 to be exposed. The first connecting portion 411 of the first external electrode 400 can be formed on the third side surface 103 of the main body 100 exposed by the opening O. The first connecting portion 411 is positioned between one region 610R1 and the other region 610R2 of the first insulating layer 610, and is in contact with the first lead-out portion 331.

[0069] The length of one region 610R1 along the second direction (Y direction) may differ from the length of the other region 610R2 along the second direction (Y direction). As described above, the first connecting portion 411 may be positioned closer to the first side surface 105 than to the second side surface 106 of the main body 100, so the length of one region 610R1 along the second direction (Y direction) may be greater than the length of the other region 610R2 along the second direction. However, it is not limited to this, and the length of the other region 610R2 along the second direction may be greater than the length of one region 610R1 along the second direction (Y direction).

[0070] The length along the second direction (Y direction) of one region 610R1 can be measured in the following way: The length of a line segment parallel to the second direction (Y direction) can be determined by connecting the two outermost boundary lines opposite each other in the second direction (Y direction) of one region 610R1. At this time, five arbitrary points separated in the first direction (X direction) can be selected, and the lengths of multiple line segments can be determined at these five points. The length along the second direction (Y direction) of one region 610R1 can be said to be the arithmetic mean of the lengths of multiple line segments. Similarly, the length along the second direction (Y direction) of the other region 610R2 can be measured by analogy from the above explanation.

[0071] The second insulating layer 620 is disposed on the third side surface 103 and the fourth side surface 104 of the main body 100, respectively, and can cover the connecting portions 411 and 511 with respect to the first insulating layer 610 disposed on the third side surface 103 and the fourth side surface 104 of the main body. By covering the connecting portions 411 and 511 of the first external electrode 400 and the second external electrode 500, the second insulating layer 620 can prevent the coil component 1000 according to this embodiment from short-circuiting with other electronic components mounted adjacent to it when it is mounted on a mounting board such as a printed circuit board.

[0072] The second insulating layer 620 is made of thermoplastic resins such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, and acrylic; thermosetting resins such as phenol, epoxy, urethane, melamine, and alkyd; photosensitive resins; parylene; SiO2 x or SiN x It can include...

[0073] The second insulating layer 620 may have an adhesive function. For example, when forming the second insulating layer 620 by laminating an insulating film onto the main body 100, the insulating film may contain an adhesive component. In such a case, an adhesive layer may be separately formed on one surface of the second insulating layer 620. However, it is not necessary for a separate adhesive layer to be formed on one surface of the second insulating layer 620, such as when forming the second insulating layer 620 using an insulating film in a semi-cured state (B-stage).

[0074] The second insulating layer 620 can be formed by applying a liquid insulating resin to the surface of the main body 100, laminating an insulating film onto the surface of the main body 100, or forming an insulating resin on the first surface 101 and the second surface 102 of the main body 100 by vapor deposition. In the case of an insulating film, a dry film (DF) containing a photosensitive insulating resin, an ABF (Ajinomoto Build-up Film) or polyimide film that does not contain a photosensitive insulating resin can be used.

[0075] The second insulating layer 620 can be formed in a thickness range of 10 nm to 100 μm. If the thickness of the second insulating layer 620 is less than 10 nm, the characteristics of the coil component may decrease, such as a decrease in Q factor, a decrease in breakdown voltage, and a decrease in self-resonant frequency (SRF). If the thickness of the second insulating layer 620 is greater than 100 μm, the total length of the coil component may increase, which may be disadvantageous for thinning.

[0076] The insulating film IF can be placed along the surface of the coil 300.

[0077] The insulating film IF insulates the coil 300 from the main body 100. The insulating film IF covers the outer surface of the coil 300 and insulates the coil 300 from the main body 100. The insulating film IF may be placed between adjacent turns of the coil, or it may be placed on the support member 200.

[0078] The insulating film IF may include, but is not limited to, known insulating materials such as parylene. As another example, the insulating film IF may include an insulating material such as epoxy resin instead of parylene. The insulating film IF can be formed by, but is not limited to, vapor deposition. As another example, the insulating film IF can also be formed by laminating and curing insulating films for forming the insulating film IF on both sides of the support member 200 on which the coil 300 is formed, or by applying and curing insulating paste for forming the insulating film IF on both sides of the support member 200 on which the coil 300 is formed.

[0079] On the other hand, in the present invention, the insulating film IF is an optional configuration, and the insulating film IF may be omitted if the main body 100 can ensure sufficient electrical resistance under the operating conditions of the coil component 1000 according to this embodiment.

[0080] Figure 7 shows a coil component according to one modified example, and corresponds to Figure 3.

[0081] Referring to Figure 7, the coil component 1000' according to this embodiment differs from the coil component 1000 according to one embodiment of the present invention in that the external electrodes 400 and 500 are different.

[0082] The external electrodes 400, 500 may further include metal layers 420, 520 disposed on the extensions 412, 512. Specifically, the first external electrode 400 may include a first electrode layer 410 including a first connecting portion 411 and a first extension portion 412, and a first metal layer 420 disposed on the first extension portion 412. The second external electrode 500 may include a second electrode layer 510 including a second connecting portion 511 and a second extension portion 512, and a second metal layer 520 disposed on the second extension portion 512. The metal layers 510, 520 may include nickel (Ni) or tin (Sn). As shown in Figure 7, each of the metal layers 420, 520 may be formed of multiple layers. In this case, each of the metal layers 420 and 520 may have a double-layer structure consisting of a nickel (Ni) plating layer arranged in the extensions 412 and 512, and a tin (Sn) plating layer arranged in the nickel (Ni) plating layer, but is not limited to this.

[0083] Figure 8 shows a coil component relating to another modified example, and is a diagram corresponding to Figure 5.

[0084] Referring to Figure 8, the coil component 1000'' according to this embodiment differs from the coil component 1000 according to one embodiment of the present invention in the arrangement of the connecting portions 411 and 511.

[0085] The connecting portions 411 and 511 can be positioned to straddle an intermediate surface M located midway between the first side surface 105 and the second side surface 106 of the main body 100. Referring to Figure 8, at least a portion of the connecting portions 411 and 511 are positioned on both intermediate surfaces M.

[0086] Figure 9 shows a coil component relating to yet another modification, and corresponds to Figure 5.

[0087] Referring to Figure 9, the coil component 1000'' according to this embodiment differs from the coil component 1000 according to one embodiment of the present invention in that the height of the morphological connecting portions 411 and 511 of the first insulating layer 610 is different.

[0088] The opening O of the first insulating layer 610 does not have to extend to the second surface 102 of the main body 100. Therefore, the first insulating layer 610 may not have one region and other regions separated in the second direction (Y direction).

[0089] The height H411 of the first connecting portion 411 may be less than the distance H100 between the first surface 101 and the second surface 102 of the main body 100. In other words, the height of the first connecting portion 411 may be less than the height of the main body 100. By making the height of the first connecting portion 411 small, the area of ​​the external electrode that forms parasitic capacitance can be reduced, and the SRF characteristics can be improved.

[0090] Although one embodiment of the present invention has been described above, any person with ordinary skill in the art can modify and change the present invention in various ways, such as by adding, changing, or deleting components, without departing from the spirit of the invention as described in the claims, and this can also be said to be within the scope of the rights of the present invention. [Explanation of symbols]

[0091] 100: Main unit 110: Core 200: Support member 300: Coil 311, 312: Coil Pattern 320: Beer 331, 332: Drawer part 400, 500: External electrode 410, 510: Electrode layer 411, 511: Connection part 412, 512: Extension part 420, 520: Metal layer 610: First insulating layer 610R1, 610R2: One domain and other domains 620: Second insulating layer IF: Insulated film 1000: Coil parts

Claims

1. A body having a first surface and a second surface facing each other in a first direction, a first side surface and a second side surface connecting the first surface and the second surface, and a third side surface connecting the first side surface and the second side surface facing each other in a second direction, A coil is disposed within the main body and includes a pull-out section extending to the third side surface of the main body, An external electrode including a connecting portion that is positioned on the third side surface of the main body and connected to the pull-out portion, It includes a first insulating layer disposed on the third side surface of the main body and exposing the connecting portion, A coil component in which the distance between the connecting portion of the external electrode and the first side surface of the main body is different from the distance between the connecting portion of the external electrode and the second side surface of the main body.

2. The first insulating layer has an opening in which at least a portion of the connecting portion is positioned inside, The coil component according to claim 1, wherein the side surface of the connecting portion is in contact with the first insulating layer.

3. The coil component according to claim 1, wherein the external electrode further includes an extension that is connected to the connecting portion and positioned on the first surface of the main body.

4. The coil component according to claim 1, wherein the length of the connecting portion along the first direction is smaller than the distance between the first and second surfaces of the main body.

5. The coil component according to claim 1, wherein the connecting portion is positioned on only one of the intermediate surfaces located midway between the first and second sides.

6. The coil component according to claim 1, wherein the main body further has a third side surface and a fourth side surface facing the third direction.

7. The external electrode includes a first external electrode positioned on the third side surface of the main body and a second external electrode positioned on the fourth side surface of the main body. The coil component according to claim 6, wherein the connecting portion of the first external electrode and the connecting portion of the second external electrode overlap at least in part when viewed from the third direction.

8. The coil component according to claim 6, wherein the drawer portion includes a first drawer portion extending to the third side surface of the main body and a second drawer portion extending to the fourth side surface of the main body.

9. The coil component according to any one of claims 1 to 8, further comprising the first insulating layer and a second insulating layer covering the connecting portion.

10. The external electrode further includes a metal layer disposed on the extension, The coil component according to claim 3, wherein the metal layer comprises nickel (Ni) or tin (Sn).

11. A body having a first surface and a second surface facing each other in a first direction, a first side surface and a second side surface connecting the first surface and the second surface and facing each other in a second direction, and a third side surface connecting the first side surface and the second side surface, A coil is disposed within the main body and includes a pull-out section extending to the third side surface of the main body, A first insulating layer is provided on the third side surface of the main body, having one region and the other region separated from each other in the second direction, The external electrode includes a connecting portion that is positioned between one region and the other region of the first insulating layer and connected to the lead portion, A coil component in which the length of one region along the second direction is different from the length of the other region along the second direction.

12. The coil component according to claim 11, wherein the first insulating layer exposes the connecting portion.

13. The coil component according to claim 11, further comprising the connecting portion and a second insulating layer covering one region and the other region of the first insulating layer.

14. The coil component according to any one of claims 11 to 13, wherein the external electrode further includes an extension that is connected to the connecting portion and positioned on the first surface of the main body.

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