Liquid dispensing head, substrate for liquid dispensing head, and method for manufacturing a liquid dispensing head

Abstract

This technology provides a way to suppress the deterioration of recording quality. [Solution] The substrate 100 for the liquid discharge head is provided on the discharge port forming layer 31 along the discharge port row 5 and includes grooves 7 having the bottom of the discharge port forming layer 31 or the flow path wall forming layer 21.

Description

Technical Field

[0006] , ,

[0005] ,

[0007] , ,

[0001] The present invention relates to a liquid ejection head, a substrate for a liquid ejection head, and a method for manufacturing a liquid ejection head.

Background Art

[0002] Patent Document 1 discloses a liquid ejection head provided with holes for dividing the influence of stress on the ejection ports around the ejection port row. By providing holes for dividing the stress, the stress partially applied to the ejection port plate is reduced, and peeling from the substrate is suppressed. The holes have a structure with a large volume that reaches the substrate, with a depth that includes the ejection ports and the portions of the flow paths that supply liquid to the ejection ports. Further, the holes have a large opening area compared to the opening area of the ejection ports.

[0003] Thus, in the case of holes having a large opening area and a large volume, the ejected liquid or the liquid adhering to the ejection port surface where the ejection ports are formed may accumulate in the openings of the holes.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The liquid accumulated in the holes with a large volume may sometimes overflow from the holes during recording and reach the ejection ports. When the liquid overflowing from the holes reaches the ejection ports, there is a risk of affecting the recording and degrading the recording quality.

[0006] Therefore, the present invention provides a technique capable of suppressing a decrease in recording quality.

Means for Solving the Problems

[0007] Therefore, the liquid discharge head of the present invention comprises a liquid flow path through which liquid can flow, a plurality of discharge ports communicating with the liquid flow path and capable of discharging liquid, a row of discharge ports in which the plurality of discharge ports are arranged, a plurality of energy generating elements provided opposite to the discharge ports and generating energy for discharging the liquid in the liquid flow path from the discharge ports, and a substrate on which the energy generating elements are provided, wherein a flow path wall forming layer in which the liquid flow path is formed is formed on the substrate, a discharge port forming layer in which the row of discharge ports is formed is formed on the flow path wall forming layer, and grooves are provided in the discharge port forming layer along the row of discharge ports and have the bottom of the discharge port forming layer or the flow path wall forming layer. [Effects of the Invention]

[0008] According to the present invention, the liquid ejection head can provide a technology that can suppress a decrease in recording quality. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic perspective view showing an example of a circuit board for a liquid dispensing head. [Figure 2] This figure shows a cross-section at line II-II in Figure 1. [Figure 3] This is a cross-sectional view showing the manufacturing process for a substrate for a liquid dispensing head, in sequence. [Figure 4] This diagram shows a portion of the discharge port row and stress-dispersing grooves of a substrate for a liquid discharge head. [Figure 5] This is a cross-sectional view at VV in Figure 4. [Figure 6] This diagram shows a portion of the discharge port row and stress-dispersing grooves of a substrate for a liquid discharge head. [Figure 7] This diagram shows a portion of the discharge port row and stress-dispersing grooves of a substrate for a liquid discharge head. [Figure 8] This diagram shows a portion of the discharge port row and stress-dispersing grooves of a substrate for a liquid discharge head. [Modes for carrying out the invention]

[0010] (First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings.

[0011] Figure 1 is a schematic perspective view showing an example of a substrate 100 for a liquid discharge head in this embodiment. The substrate 100 for a liquid discharge head shown in Figure 1 has a substrate 1 in which discharge energy generating elements 2 are arranged at a predetermined pitch in the Y direction. A liquid flow path 20 and a discharge port 30 located in the Z direction relative to the discharge energy generating elements 2 are formed on the substrate 1. The discharge port 30 is provided facing the energy generating elements 2 and is configured to discharge the liquid in the liquid flow path by the action of the discharge energy generating elements 2. In addition, liquid supply ports 11 are formed on both sides of the discharge energy generating elements 2 on the substrate 1. Multiple rows of these discharge port rows 5, each having a discharge energy generating element 2 and a liquid supply port 11, are arranged in the X direction.

[0012] The stress-disrupting grooves 6 are provided in correspondence with the discharge port row 5 and are provided along the discharge port row 5. In this embodiment, one row of stress-disrupting grooves 6 is provided on each side along the discharge port row 5. The stress-disrupting grooves 6 are provided with a plurality of groove portions 7 arranged in the Y direction, and the groove portions 7 are arranged to have a length equal to or greater than the length of the discharge port row 5 in the Y direction. The stress-disrupting grooves 6 are parallel to the discharge port row 5, do not communicate with the liquid flow path 20, and are formed to have the same opening surface as the discharge port 30. When pressure is applied to the liquid filled into the liquid flow path 20 from the liquid supply port 11 by the liquid discharge energy generating element 2, droplets are discharged from the discharge port 30. Recording is performed by adhering the discharged droplets to a recording medium.

[0013] Figure 2 shows a cross-section along line II-II in Figure 1. In the liquid discharge head substrate 100, multiple discharge energy generating elements 2 (see Figure 1) are arranged on the substrate 1, and an insulating protective film (not shown) is formed on top of them. In addition, a liquid supply port 11 is formed on the substrate 1 to supply liquid to the discharge port 30. The flow path wall that defines the liquid flow path 20 is formed by a flow path wall forming layer 21, and the discharge port 30, the flow path ceiling 22, and the groove portion 7 that forms the stress-dividing groove row are formed by the discharge port forming layer 31.

[0014] Here, the insulating protective film is patterned by photolithography or dry etching to match the opening of the liquid supply port 11, and the liquid supply port 11 communicates with the liquid flow path 20 and the discharge port 30. In addition, the groove portion 7 of the stress-dividing groove 6 (see Figure 1) is provided through the discharge port forming layer 31, does not communicate with the liquid flow path 20, and opens on the same surface as the surface on which the discharge port 30 opens. The groove portion 7 has a bottom surface 23 formed by the flow path wall forming layer 21. By providing the groove portion 7 in the discharge port forming layer 31, the stress at the joint between the flow path wall forming layer 21 and the discharge port forming layer 31 can be dispersed and relieved. As a result, deformation of the discharge port 30 can be suppressed.

[0015] Figures 3(a) to 3(f) are cross-sectional views showing the manufacturing process of the liquid discharge head substrate 100 in sequence. The manufacturing method of the liquid discharge head substrate 100 will be explained below using Figures 3(a) to 3(f).

[0016] As shown in Fig. 3(a), a plurality of ejection energy generating elements 2 (see Fig. 1) are arranged on a substrate 1, and an insulating protective film (not shown) is formed thereon. The substrate 1 is not particularly limited as long as it is a material that can be used as a semiconductor element substrate such as silicon. The material of the ejection energy generating element 2 is a resistor such as TaSiN, and is not particularly limited as long as it can heat a liquid in accordance with an electrical signal to give ejection energy. The material of the insulating protective film is an insulating film such as SiN, SiC, or SiO, and is not particularly limited as long as it can protect electrical wiring from ink and other liquids. Further, a liquid supply port 11 penetrating the substrate 1 is formed in the substrate 1 by dry etching or the like. The liquid supply port 11 only needs to penetrate the substrate 1, and there is no particular limitation on the processing method.

[0017] As shown in Fig. 3(b), a flow path wall forming layer 21 fixed to a support member (not shown) is transferred onto the substrate 1 (flow path wall forming layer forming step). The flow path wall forming layer 21 uses a dry film resist, and the support member is not particularly limited as long as it is a material stable against the heat history of the flow path wall forming layer 21, such as polyethylene terephthalate or polyimide. Further, the material of the flow path wall forming layer 21 is preferably a negative photosensitive resin. Examples of the negative photosensitive resin used for the flow path wall forming layer 21 include cresol novolak resin and epoxy resin.

[0018] The temperature and pressure during transfer only need to be such that the flow path wall forming layer 21 softens to cover a step on the surface of the substrate 1 and the resin does not deteriorate. For example, a temperature of 60°C or higher and 140°C or lower and a pressure of 0.1 MPa or higher and 1.5 MPa or lower can be used. Thereafter, the support member is peeled off from the flow path wall forming layer 21, and only the flow path wall forming layer 21 is left on the substrate.

[0019] As shown in Fig. 3(c), a portion to be left as a permanent film in the flow path wall forming layer 21 is selectively exposed through a photomask, and a post-exposure bake (hereinafter referred to as PEB) is performed to optically determine a cured portion 21A and an uncured portion 21B. In this embodiment, since a form using a negative photosensitive resin is shown, the exposed portion becomes the cured portion, and the cured portion 21A becomes the flow path wall and the uncured portion 21B becomes the liquid flow path.

[0020] As shown in FIG. 3(d), a discharge port forming layer 31 fixed to a support member (not shown) is transferred onto the flow path wall forming layer (discharge port forming layer forming step). The discharge port forming layer 31 uses a dry film resist, and the support member is not particularly limited as long as it is a material stable against the heat history of the discharge port forming layer, such as polyethylene terephthalate or polyimide. Further, the material of the discharge port forming layer 31 is preferably a negative photosensitive resin. Examples of the negative photosensitive resin used for the discharge port forming layer 31 include cresol novolak resin and epoxy resin.

[0021] The temperature and pressure during transfer only need to be such that the discharge port forming layer 31 can be transferred and the already formed flow path wall forming layer 21 does not deform. For example, temperatures of 30°C or higher and 50°C or lower, and pressures of 0.1 MPa or higher and 0.5 MPa or lower can be used. Thereafter, the support member is peeled off from the discharge port forming layer 31, and only the discharge port forming layer 31 is left to remain on the flow path wall forming layer 21.

[0022] As shown in FIG. 3(e), the portion to be left as the permanent film of the discharge port forming layer 31 is selectively exposed through a photomask, and PEB is performed after exposure to optically determine the cured portion 31A and the uncured portions 31B and 31C. In this embodiment, since a form using a negative photosensitive resin is shown, the exposed portion becomes the cured portion, the cured portion 31A becomes the flow path ceiling 22, the uncured portion 31B becomes the discharge port 30, and the uncured portion 31C becomes the groove portion 7. Here, it is desirable to use a material more sensitive to light for the material used for the discharge port forming layer 31 than the material used for the flow path wall forming layer 21. Thereby, only the discharge port forming layer 31 can be selectively patterned.

[0023] As shown in FIG. 3(f), the uncured portions of the flow path wall forming layer 21 and the discharge port forming layer 31 are developed by dissolving and removing each uncured portion with a soluble liquid. In this step, by removing the uncured portion with a soluble solvent, a liquid flow path 20, a discharge port 30, and a groove portion 7 are formed (groove forming step). Thus, the formation of the discharge port 30 and the formation of the groove portion 7 are performed simultaneously.

[0024] Through the above process, the liquid flowing in from the liquid supply port 11 is discharged from the discharge port 30, and a liquid discharge head substrate 100 is completed, which has grooves 7 that have a stress-breaking effect in the discharge port forming layer 31. Then, this liquid discharge head substrate 100 is cut and separated into chips using a dicing saw or the like. After electrical wiring to drive the discharge energy generating element 2 (see Figure 1) is connected to each chip, a chip tank component for liquid supply is attached. This completes the liquid discharge head equipped with the liquid discharge head substrate 100.

[0025] In this embodiment, the stress-relieving groove 6 is formed by multiple groove portions 7, but it is sufficient if stress relief is achieved, and at least one groove is formed in the discharge port forming layer 31. From the viewpoint of the volume of the groove portion 7, it is desirable that the stress-relieving groove 6 be formed by multiple groove portions 7. In this embodiment, the groove portion 7 is formed so as to penetrate the discharge port forming layer 31, but the bottom surface of the groove portion 7 may be formed inside the discharge port forming layer 31, or the bottom surface of the groove portion 7 may be formed on the surface or inside the flow channel wall forming layer 21. In other words, it is not particularly limited as long as the bottom surface of the groove portion 7 does not reach the substrate 1. Accordingly, the bottom surface of the groove portion 7 is formed by the discharge port forming layer 31 or the flow channel wall forming layer 21.

[0026] Figure 4 shows a portion of the discharge port row 5 and stress-dividing groove (groove row) 6 of the liquid discharge head substrate 100 in this embodiment, and Figure 5 is a cross-sectional view at VV in Figure 4. The preferred arrangement of the groove 7 will be described below using Figures 4 and 5. As shown in Figures 4 and 5, the width h of the groove 7 in the X direction should be narrow to prevent liquid from entering, and if the thickness of the discharge port forming layer 31 is H, it is preferable to set h in the range of h = H / 2 to 5H. In this embodiment, the width h is in the range of 3 μm to 25 μm. It has been confirmed that the width of the groove 7 in the X direction has almost no effect on the stress-dividing effect. Therefore, it is desirable to narrow the width of the groove 7 in the X direction as much as possible in order to prevent liquid from entering. Also, it is desirable from the viewpoint of the stress-dividing effect that the distance D between the groove 7 and the liquid flow path 20 be 20 μm or less. Here, the stress-dividing effect can be confirmed by the degree of deformation of the discharge port 30 due to the shrinkage of the discharge port forming layer 31. Furthermore, distance D can be rephrased as the distance in the same plane as the discharge row 5 and perpendicular to the discharge row 5, from the wall on one side of the discharge row 5 that has a surface including the discharge direction of the liquid flow path 20 to the wall on the side closer to the discharge port that has a surface including the discharge direction of the groove 7. It was also confirmed that a shorter distance D results in less stress on the discharge port 30.

[0027] Thus, the stress-distributing groove 6 divides the nozzle-forming layer 31 into a first region 41 where the nozzle row 5 is provided and a second region 42 separated from the first region 41, in order to reduce the volume of the nozzle-forming layer 31 on which the nozzle row 5 is provided. By dividing it in this way, the volume of the nozzle-forming layer 31 in each region is reduced, and the influence of stress on the nozzles 30 can be reduced. Although it is explained here that the stress-distributing groove 6 divides the nozzle-forming layer 31 into a first region 41 and a second region 42, it is sufficient if the nozzle-forming layer 31 is not divided into a first region 41 and a second region 42, as long as the stress-distributing groove 6 creates free ends in the nozzle-forming layer 31 and can distribute the stress.

[0028] Furthermore, if we consider the distance (interval) S between adjacent discharge ports in the discharge port row 5, the shorter the distance S, the more likely the effect of stress is to become apparent. Specifically, when the distance S is 25 μm or less, the deformation around the discharge port due to stress becomes somewhat larger, and when the distance S is 10 μm or less, the deformation around the discharge port due to stress becomes even larger. However, the distance S is a value that directly affects the recording quality and cannot be set considering only the effect of stress. Therefore, the distance S may be 25 μm or less, or 10 μm or less.

[0029] Furthermore, if the distance between adjacent grooves 7 in the stress-dividing groove 6 is denoted as distance P, then it is preferable from the viewpoint of stress-dividing effect that distance P be 10 μm or less. When the distance P between grooves is greater than 10 μm, there is a tendency for parts of the discharge port row to have relatively large and small stress-dividing effects. Taking these factors into consideration, it is desirable to reduce the opening area of ​​the groove 7 and the volume of the groove 7, while keeping the distance P between grooves 10 μm or less.

[0030] (Examples) The following describes an embodiment of this design with reference to Figures 3(a) to 3(f).

[0031] As shown in Figure 3(a), multiple liquid discharge energy generating elements 2 (see Figure 1) were arranged on a substrate 1, and an insulating protective film (not shown) was formed on top of them. A silicon substrate was used for the substrate 1, and TaSiN was used for the heating resistor. The insulating protective film was formed by depositing SiO and SiN using plasma CVD. Subsequently, a mask resist was formed on top of the insulating protective film, and after patterning, the substrate 1 was processed by dry etching to form the liquid supply port 11.

[0032] As shown in Figure 3(b), a channel wall forming layer 21, which is a negative-type photosensitive resin, was formed as a dry film with a thickness of 15 μm on an insulating protective film (not shown) on a support member (not shown). A release-treated PET film was used as the support member for the dry film resist. The transfer temperature was 70°C and the pressure was 0.5 MPa. The peeling speed of the support member was 5 mm / s.

[0033] As shown in Figure 3(c), the portion of the channel wall forming layer 21 that will later become the channel sidewall was exposed to i-line light (wavelength 365 nm) via a photomask, and then PEB was performed to accelerate the curing reaction.

[0034] As shown in Figure 3(d), a nozzle-forming layer 31 made of a dry film-like negative-type photosensitive resin was formed on the channel wall-forming layer 21 with a thickness of 6 μm. A PET film treated with a release agent was used as the support member for the dry film resist. The temperature for transferring the nozzle-forming layer was 40°C and the pressure was 0.3 MPa. The peeling speed of the support member was 5 mm / s.

[0035] As shown in Figure 3(e), the portion of the discharge port forming layer 31 that will later become the channel ceiling 22 was exposed to i-line light (wavelength 365 nm) to optically determine the cured portion 31A that will become the channel ceiling 22, the uncured portion 31B that will become the discharge port 30, and the uncured portion 31C that will become the groove portion 7. Here, the uncured portion 21B of the channel wall forming layer 21 was also irradiated with light, but since the exposure amount was selected so that only the discharge port forming layer 31 would harden, no hardening reaction occurred. Subsequently, the material was heated on a hot plate at 90°C for 5 minutes as a PEB to accelerate the hardening reaction.

[0036] As shown in Figure 3(f), the uncured portions of the channel wall forming layer 21 and the discharge port forming layer 31 were removed collectively by a developing process to form the liquid channel 20, discharge port 30, and groove 7. Propylene glycol monomethyl acetate was used as the solvent for the unexposed portion, and the developing process was performed for 15 minutes. After these steps, recordings were made with the completed liquid discharge head, and high-quality discharge characteristics were confirmed.

[0037] Here, the liquid dispensing head was tested by varying the conditions for distances S, D, and P. The optimal conditions were defined as distance S being 10 μm or less, distance D being 20 μm or less, and distance P being 10 μm or less.

[0038] First, we investigated the case where the distance S between the discharge ports was 10 μm, the distance D between the groove 7 and the liquid flow path 20 was 10 μm, and the distance P between the grooves was 20 μm. Although there is a stress-dividing effect due to the groove 7, the distance P between the grooves is large, resulting in a difference in the stress-dividing effect between the grooved and non-grooved areas, and thus a distribution of stress within the row of the discharge port, which is important for high-quality recording. As a result, stress concentration points occurred, and variations in the discharge port shape occurred. Recording with this liquid discharge head resulted in high-quality recording, but the discharge characteristics were found to be inferior to those under optimal conditions.

[0039] Furthermore, we investigated the case where the distance S between discharge ports is 10 μm, the distance D between the groove 7 and the liquid flow path 20 is 30 μm, and the distance P between grooves is 10 μm. Because the distance P between grooves is 10 μm or less, no in-row stress distribution occurs at the discharge port. However, because the distance D between the groove 7 and the liquid flow path 20 is 30 μm, a liquid discharge head was completed in which the desired stress-dividing effect by the groove 7 could not be obtained. Recording with this liquid discharge head revealed that although the recording was of high quality, the discharge characteristics were inferior to those under optimal conditions. Observation of the liquid discharge head confirmed that slight deformation of the discharge port occurred due to the stress in the discharge port forming layer.

[0040] Thus, the substrate 100 for the liquid discharge head is provided on the discharge port forming layer 31 along the discharge port row 5 and includes grooves 7 having the bottom of the discharge port forming layer 31 or the flow path wall forming layer 21.

[0041] This makes it possible to provide a technology that can suppress the deterioration of recording quality.

[0042] (Second embodiment) A second embodiment of the present invention will be described below with reference to the drawings. Since the basic configuration of this embodiment is the same as that of the first embodiment, only the characteristic configurations will be described below.

[0043] Figure 6 shows a portion of the discharge port row 5 and stress-dispersing groove 6 of the liquid discharge head substrate 100 in this embodiment. In this embodiment, the liquid discharge head substrate 100 is described in which an elongated groove portion 7 is provided extending along the discharge port row 5.

[0044] In this embodiment, the groove 7 is a continuous series of grooves that extend in the Y direction along the discharge port row 5. In the stress-dividing groove 6 of the first embodiment, multiple grooves 7 were arranged, resulting in areas with grooves and areas without grooves in the Y direction, which sometimes led to differences in the stress-dividing effect between the grooved and non-grooved areas. Therefore, in this embodiment, by making the groove 7 a single groove extending in the Y direction, there are no areas without grooves in the Y direction, thus achieving the desired stress-dividing effect, and no deformation of the discharge port 30 was observed.

[0045] It is desirable that the groove 7 extends at least as long as, or longer than, the length of the discharge port row 5. The width of the groove 7 in the X direction is the same as in the first embodiment, and it is preferable that it be as narrow as possible in order to prevent liquid from entering. The distances S and D were the same as in the first embodiment. As a result, recordings made with the completed liquid discharge head confirmed high-quality discharge characteristics.

[0046] (Third embodiment) A third embodiment of the present invention will be described below with reference to the drawings. Since the basic configuration of this embodiment is the same as that of the first embodiment, only the characteristic configurations will be described below.

[0047] Figure 7 shows a portion of the discharge port row 5 and stress-dispersing groove 6 of the liquid discharge head substrate 100 in this embodiment. In this embodiment, the stress-dispersing groove 6 described in the first embodiment is provided in two rows (multiple rows) on one side of the discharge port row 5. In the first embodiment, there was only one row of stress-dispersing groove 6, so there were parts with grooves and parts without grooves in the Y direction, and there were differences in the stress-dispersing effect between the parts with grooves and parts without grooves.

[0048] In this embodiment, two rows of stress-dividing grooves 6 are arranged in a staggered pattern so that there are no grooved or grooveless areas in the Y direction. As a result, the desired stress-dividing effect is obtained because there are no grooveless areas in the Y direction, and no deformation of the discharge port was observed. The distances S, D, and P are the same as in the first embodiment, and the width of the groove 7 in the X direction is the same as in the first embodiment, and it is preferable to make it as narrow as possible in order to prevent liquid from entering. As a result, high-quality discharge characteristics were confirmed when the completed liquid discharge head was recorded. In this embodiment, two rows of stress-dividing grooves 6 are used, but multiple rows may also be used.

[0049] (Fourth embodiment) A fourth embodiment of the present invention will be described below with reference to the drawings. Since the basic configuration of this embodiment is the same as that of the first embodiment, only the characteristic configurations will be described below.

[0050] Figure 8 shows a portion of the discharge port row 5 and stress-relieving groove 6 of the liquid discharge head substrate 100 in this embodiment. In this embodiment, the groove portion 7 described in the second embodiment is provided in two rows on one side of the discharge port row 5. In the groove portion 7 described in the second embodiment, the desired stress-relieving effect was obtained because there were no groove-less areas in the Y direction. However, by providing two rows of groove portion 7 as in this embodiment, the area that absorbs strain caused by stress is increased, and thus it is expected that deformation of the discharge port 30 can be suppressed.

[0051] Similar to the second embodiment, it is desirable that the groove 7 extends at least as long as, or longer than, the length of the discharge port row 5. The width of the groove 7 in the X direction is the same as in the first embodiment, and it is preferable that it be as narrow as possible in order to prevent liquid from entering. The distances S and D were the same as in the first embodiment. As a result, recordings were made with the completed liquid discharge head and high-quality discharge characteristics were confirmed. In this embodiment, there are two rows of grooves 7, but there may be multiple rows.

[0052] This embodiment includes the following methods and configurations.

[0053] (Composition 1) A liquid channel capable of carrying liquid, Multiple discharge ports that communicate with the aforementioned liquid flow path and are capable of discharging liquid, The aforementioned row of discharge ports arranged in a plurality of outlets, A plurality of discharge energy generating elements are provided opposite the discharge port and generate energy for discharging the liquid in the liquid flow path from the discharge port, A liquid discharge head comprising a substrate on which the energy generating element is provided, A channel wall forming layer in which the liquid channel is formed is formed on the substrate. A discharge port forming layer on the flow channel wall forming layer is formed on the discharge port forming layer, A liquid discharge head characterized by having grooves provided in the discharge port forming layer along the row of discharge ports, and having the bottom of the discharge port forming layer or the flow path wall forming layer.

[0054] (Configuration 2) The liquid discharge head according to configuration 1, wherein the groove is provided through the discharge port forming layer.

[0055] (Composition 3) The liquid discharge head according to configuration 1 or 2, wherein the groove is a row of grooves arranged along the row of discharge ports.

[0056] (Composition 4) The liquid discharge head according to configuration 3, wherein multiple rows of grooves are provided on one side of the row of discharge ports.

[0057] (Composition 5) A liquid discharge head according to configuration 4, wherein the grooves are arranged in a staggered pattern in a plurality of groove rows.

[0058] (Composition 6) The liquid dispensing head according to configuration 3 or 4, wherein the spacing between adjacent grooves in the groove row is 10 μm or less.

[0059] (Composition 7) The liquid discharge head according to configuration 1 or 2, wherein the grooves are a series of grooves extending along the row of discharge ports.

[0060] (Composition 8) The liquid dispensing head according to configuration 7, wherein a series of grooves are provided in multiple rows on one side of the row of discharge ports.

[0061] (Composition 9) A liquid discharge head according to any one of configurations 1 to 8, wherein, on one side of the row of discharge ports, the distance in a first direction perpendicular to the row of discharge ports within the same plane as the row of discharge ports, from a wall having a surface including the discharge direction of the liquid flow path to the wall on the side closer to the discharge port having a surface including the discharge direction of the groove, is 20 μm or less.

[0062] (Composition 10) The liquid discharge head according to configuration 9, wherein the width h of the groove in the first direction is in the range of h = H / 2 to 5H, where H is the thickness of the discharge port forming layer.

[0063] (Composition 11) A liquid dispensing head according to any one of configurations 1 to 10, wherein the distance between adjacent dispensing ports in the row of dispensing ports is 25 μm or less.

[0064] (Composition 12) A liquid dispensing head according to any one of configurations 1 to 10, wherein the distance between adjacent dispensing ports in the row of dispensing ports is 10 μm or less.

[0065] (Composition 13) The liquid dispensing head according to any one of configurations 1 to 12, wherein the discharge port forming layer and the flow channel wall forming layer are made of a negative-type photosensitive resin.

[0066] (Composition 14) The liquid dispensing head according to configuration 10, wherein the width h of the groove in the first direction is in the range of 3 μm to 25 μm.

[0067] (Composition 15) A liquid channel capable of carrying liquid, Multiple discharge ports that communicate with the aforementioned liquid flow path and are capable of discharging liquid, The aforementioned row of discharge ports arranged in a plurality of outlets, A plurality of energy generating elements are provided opposite the discharge port and generate energy for discharging the liquid in the liquid flow path from the discharge port, A substrate for a liquid discharge head, comprising a substrate on which the energy generating element is provided, A channel wall forming layer in which the liquid channel is formed is formed on the substrate. A discharge port forming layer on the flow channel wall forming layer is formed on the discharge port forming layer, A substrate for a liquid discharge head, characterized by having grooves provided in the discharge port forming layer along the row of discharge ports, and having the bottom of the discharge port forming layer or the flow path wall forming layer.

[0068] (Method 1) A liquid channel capable of carrying liquid, Multiple discharge ports that communicate with the aforementioned liquid flow path and are capable of discharging liquid, The aforementioned row of discharge ports arranged in a plurality of outlets, A plurality of energy generating elements are provided opposite the discharge port and generate energy for discharging the liquid in the liquid flow path from the discharge port, A method for manufacturing a liquid discharge head comprising a substrate on which the energy generating element is provided, A step of forming a channel wall on the substrate, in which a channel wall forming layer on which the liquid channel is formed, A discharge port forming layer forming step, in which a discharge port forming layer is formed on the flow channel wall forming layer, A groove forming step is to form grooves in the discharge port forming layer along the discharge port row, with the discharge port forming layer or the flow path wall forming layer as the bottom, A method for manufacturing a liquid dispensing head, characterized by having a liquid dispensing head.

[0069] (Method 2) A method for manufacturing a liquid discharge head according to Method 1, wherein the formation of the discharge port and the formation of the groove are performed simultaneously. [Explanation of symbols]

[0070] 1 circuit board 5 Discharge port row 7 Groove 21 Channel wall forming layer 30 outlet 31 Discharge port forming layer 100 Substrate for liquid dispensing head

Claims

1. A liquid channel capable of carrying liquid, Multiple discharge ports that communicate with the aforementioned liquid flow path and are capable of discharging liquid, The aforementioned row of discharge ports arranged in a plurality of outlets, A plurality of energy generating elements are provided opposite the discharge port and generate energy for discharging the liquid in the liquid flow path from the discharge port, A liquid discharge head comprising a substrate on which the energy generating element is provided, A channel wall forming layer in which the liquid channel is formed is formed on the substrate. A discharge port forming layer on the flow channel wall forming layer is formed on the discharge port forming layer, A liquid discharge head characterized by having grooves provided in the discharge port forming layer along the row of discharge ports, and having the bottom of the discharge port forming layer or the flow path wall forming layer.

2. The liquid discharge head according to claim 1, wherein the groove is provided through the discharge port forming layer.

3. The liquid discharge head according to claim 1 or 2, wherein the groove is a row of grooves arranged along the row of discharge ports.

4. The liquid dispensing head according to claim 3, wherein the groove rows are provided in multiple rows on one side of the discharge port rows.

5. The liquid dispensing head according to claim 4, wherein the grooves are arranged in a staggered pattern in a plurality of rows of grooves.

6. The liquid dispensing head according to claim 3, wherein the spacing between adjacent grooves in the row of grooves is 10 μm or less.

7. The liquid dispensing head according to claim 1, wherein the grooves are a series of grooves extending along the row of discharge ports.

8. The liquid dispensing head according to claim 7, wherein a plurality of rows of the series of grooves are provided on one side of the row of discharge ports.

9. The liquid discharge head according to claim 1, wherein on one side of the row of discharge ports, the distance in a first direction perpendicular to the row of discharge ports, within the same plane as the row of discharge ports, from a wall having a surface including the discharge direction of the liquid flow path to the wall on the side closer to the discharge port having a surface including the discharge direction of the groove, is 20 μm or less.

10. The liquid discharge head according to claim 9, wherein the width h of the groove in the first direction is in the range of h = H / 2 to 5H, where H is the thickness of the discharge port forming layer.

11. The liquid dispensing head according to claim 1, wherein the distance between adjacent dispensing ports in the row of dispensing ports is 25 μm or less.

12. The liquid dispensing head according to claim 1, wherein the distance between adjacent dispensing ports in the row of dispensing ports is 10 μm or less.

13. The liquid discharge head according to claim 1, wherein the discharge port forming layer and the flow channel wall forming layer are made of a negative-type photosensitive resin.

14. The liquid dispensing head according to claim 10, wherein the width h of the groove in the first direction is in the range of 3 μm to 25 μm.

15. A liquid channel capable of carrying liquid, Multiple discharge ports that communicate with the aforementioned liquid flow path and are capable of discharging liquid, The aforementioned row of discharge ports arranged in a plurality of outlets, A plurality of energy generating elements are provided opposite the discharge port and generate energy for discharging the liquid in the liquid flow path from the discharge port, A substrate for a liquid discharge head, comprising a substrate on which the energy generating element is provided, A channel wall forming layer in which the liquid channel is formed is formed on the substrate. A discharge port forming layer on the flow channel wall forming layer is formed on the discharge port forming layer, A substrate for a liquid discharge head, characterized by being provided in the discharge port forming layer along the row of discharge ports and having grooves at the bottom of the discharge port forming layer or the flow path wall forming layer.

16. A liquid channel capable of carrying liquid, Multiple discharge ports that communicate with the aforementioned liquid flow path and are capable of discharging liquid, The aforementioned row of discharge ports arranged in a plurality of outlets, A plurality of energy generating elements are provided opposite the discharge port and generate energy for discharging the liquid in the liquid flow path from the discharge port, A method for manufacturing a liquid discharge head comprising a substrate on which the energy generating element is provided, A step of forming a channel wall on the substrate, in which a channel wall forming layer on which the liquid channel is formed, A discharge port forming layer forming step, in which a discharge port forming layer is formed on the flow channel wall forming layer, A groove forming step is to form grooves in the discharge port forming layer along the discharge port row, with the discharge port forming layer or the flow path wall forming layer as the bottom, A method for manufacturing a liquid dispensing head, characterized by having a liquid dispensing head.

17. The method for manufacturing a liquid discharge head according to claim 16, wherein the formation of the discharge port and the formation of the groove are performed simultaneously.

Images