electronic machines

Abstract

The present invention provides a display device that combines touch detection functionality with fingerprint or vein pattern imaging functionality. [Solution] The display device comprises a first substrate, a first light-emitting element, a second light-emitting element, a light-receiving element, a light-shielding layer, a first resin layer, and a second resin layer. The first light-emitting element and the light-receiving element are arranged side by side on the first substrate, and the first resin layer is provided on the first light-emitting element and the light-receiving element. The light-shielding layer is provided on the first resin layer, and the second light-emitting element is provided on the light-shielding layer. The second resin layer is provided on the second light-emitting element. The first light-emitting element emits visible light upwards, and the second light-emitting element emits invisible light upwards. The light-receiving element is a photoelectric conversion element sensitive to visible and invisible light. In a plan view, the light-shielding layer has a portion located between the first light-emitting element and the light-receiving element, and the second light-emitting element overlaps with the light-shielding layer and is located inside the contour of the light-shielding layer.

Description

[Technical Field]

[0001] One aspect of the present invention relates to a display device. Another aspect of the present invention relates to an imaging device. One aspect relates to a touch panel.

[0002] Furthermore, one aspect of the present invention is not limited to the above-mentioned technical field. One aspect of the technical field is semiconductor devices, display devices, light-emitting devices, energy storage devices, and memory devices. Electronic equipment, lighting equipment, input devices, input / output devices, methods for driving them, or methods for manufacturing them. Laws can be cited as one example. Semiconductor devices function by utilizing semiconductor properties. This refers to all devices that can do so. [Background technology]

[0003] In recent years, mobile phones such as smartphones, tablet information terminals, and notebook PCs (personal computers) have become popular. Information terminal devices such as computer terminals are widely used. These often contain personal information, and various authentication technologies are being developed to prevent fraudulent use. It is being emitted.

[0004] For example, Patent Document 1 describes an electronic device equipped with a fingerprint sensor in the push-button switch section. This has been disclosed. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] U.S. Patent Application Publication No. 2014 / 0056493 [Overview of the project] [Problems that the invention aims to solve]

[0006] When adding authentication functions such as fingerprint authentication to an electronic device that functions as a personal information terminal. Therefore, a module for capturing fingerprints needs to be implemented in the electronic device. As the number increases, the cost of electronic devices also increases.

[0007] One aspect of the present invention aims to reduce the cost of electronic devices having authentication functions. Alternatively, one of the challenges is to reduce the number of parts in electronic devices. Or, fingerprints or One of the objectives is to provide a display device capable of imaging vein shapes, etc. Alternatively, To provide a display device that combines touch detection functionality with fingerprint or vein pattern imaging functionality. This will be one of the challenges. Alternatively, to provide an electronic device equipped with biometric authentication functionality and with a high screen-to-body ratio. One of the challenges is to create a display device that can emit both visible light and infrared light. One of the objectives is to provide a system that uses both visible light and infrared light as light sources for imaging. One of the objectives is to provide an imaging device capable of performing the following actions.

[0008] One aspect of the present invention provides a display device, imaging device, or electronic device having a novel configuration. One of the objectives is to address at least one of the problems of the prior art. One of the goals is to mitigate the problem.

[0009] Furthermore, the description of these problems does not preclude the existence of other problems. One approach does not require that all of these issues be resolved. The title can be extracted from descriptions such as the specification, drawings, and claims. [Means for solving the problem]

[0010] One aspect of the present invention is a display device including a first substrate, a first light-emitting element, a second light-emitting element, and a light-receiving element. , a light-shielding layer, a first resin layer, and a second resin layer. The first light-emitting element and the light-receiving element are arranged side by side on the first substrate. The first resin layer is provided on the first light-emitting element and the light-receiving element. The light-shielding layer is provided on the first resin layer. The second light-emitting element is provided on the light-shielding layer. The second resin layer is provided on the second light-emitting element. The first light-emitting element has a function of emitting visible light upward. The second light-emitting element has a function of emitting invisible light upward. The light-receiving element is a photoelectric conversion element that is sensitive to visible light and invisible light. In a plan view, the light-shielding layer has a portion located between the first light-emitting element and the light-receiving element. In addition, in a plan view, the second light-emitting element overlaps with the light-shielding layer and is located inside the contour of the light-shielding layer.

[0011] In addition, in the above, the invisible light preferably has intensity in a wavelength range of 750 nm or more and 900 nm or less.

[0012] In addition, in any of the above, it is preferable to further have a protective layer. At this time, the protective layer preferably includes an inorganic insulating material and is located between the first light-emitting element and the light-receiving element and the first resin layer.

[0013] In addition, in any of the above, the first light-emitting element preferably has a first pixel electrode, a first light-emitting layer, and a first electrode. Further, the light-receiving element preferably has a second pixel electrode, an active layer, and a first electrode. At this time, the first light-emitting layer and the active layer preferably contain different organic compounds from each other. In addition, the first electrode is via the first light-emitting layer. It has a portion that overlaps with the first pixel electrode and a portion that overlaps with the second pixel electrode via the active layer. It is preferable to do so. Furthermore, the first pixel electrode and the second pixel electrode are made of the same conductive material. It is preferable that it includes.

[0014] Furthermore, in any of the above, the second light-emitting element includes a third pixel electrode, a second light-emitting layer, and It is preferable to have a second electrode. In this case, the second electrode is transparent to invisible light. It is preferable that it has the property. Furthermore, in a plan view, the second electrode is positioned relative to the contour of the light-shielding layer. It is preferable that it be located on the inside.

[0015] Alternatively, the second electrode may preferably be transparent to both visible and invisible light. Furthermore, in a plan view, the second electrode is connected to the second light-emitting layer and the third pixel electrode via It has a portion that overlaps with the light-shielding layer, a portion that overlaps with the first light-emitting element, and a portion that overlaps with the light-receiving element. It is preferable to do so.

[0016] Another aspect of the present invention includes any of the above-mentioned display devices and a connector or integrated circuit. It is a display module having the following features.

[0017] Another aspect of the present invention includes the above-mentioned display module, an antenna, a battery, a housing, and a At least one of the following: camera, speaker, microphone, touch sensor, and operation button, It is an electronic device. Furthermore, when the electronic device emits visible light from the first light-emitting element... The first imaging function receives the first reflected light with a photodetector, and the second light-emitting element emits invisible light. It has a second imaging function, which involves receiving the second reflected light emitted by the light-receiving element with a photodetector. preferable. [Effects of the Invention]

[0018] According to one aspect of the present invention, the cost of electronic devices having authentication functions can be reduced. Or, It can reduce the number of parts in electronic devices. Or, it can capture fingerprints or vein patterns, etc. A display device can be provided that combines touch detection functionality with fingerprint or vein pattern imaging functionality. We can provide a display device equipped with a biometric authentication function and a high screen-to-body ratio. We can provide sub-devices, or display devices that can emit both visible light and infrared light. We can provide: an imaging device capable of imaging using both visible light and infrared light as light sources. We can provide the following:

[0019] According to one aspect of the present invention, a display device, imaging device, or electronic device having a novel configuration, etc. It can provide at least one of the problems of the prior art It can be reduced.

[0020] Furthermore, the description of these effects does not preclude the existence of other effects. One embodiment does not necessarily have to possess all of these effects. Furthermore, other effects may be considered. This information can be extracted from descriptions such as specifications, drawings, and claims. [Brief explanation of the drawing]

[0021] [Figure 1] Figures 1A to 1C show examples of the configuration of a display device. [Figure 2] Figures 2A and 2B show examples of display device configurations. [Figure 3] Figures 3A and 3B show examples of display device configurations. [Figure 4] Figures 4A and 4B show examples of the configuration of a display device. [Figure 5] Figures 5A to 5C show examples of display device configurations. [Figure 6] Figures 6A to 6D show examples of display device configurations. [Figure 7] Figures 7A and 7B show examples of display device configurations. [Figure 8] Figures 8A to 8G show examples of display device configurations. [Figure 9] Figure 9 shows an example of a display device configuration. [Figure 10] Figure 10A shows an example of the configuration of a display device. Figure 10B shows an example of the configuration of a transistor. [Figure 11] Figures 11A to 11C show examples of the configuration of electronic equipment. [Figure 12] Figure 12 shows an example of the configuration of an electronic device. [Figure 13] Figure 13 shows an example of the configuration of an electronic device. [Figure 14] Figure 14 shows an example of the system configuration. [Figure 15] Figure 15 is a flowchart illustrating how the system operates. [Figure 16] Figures 16A and 16B show examples of pixel circuit configurations. [Figure 17] Figures 17A and 17B show examples of electronic device configurations. [Figure 18] Figures 18A to 18D show examples of the configuration of electronic equipment. [Figure 19] Figures 19A to 19F show examples of the configuration of electronic equipment. [Modes for carrying out the invention]

[0022] The embodiments will be described below with reference to the drawings. However, many embodiments are described. It can be implemented in different ways, without deviating from its purpose and scope. Those skilled in the art will readily understand that the form and details can be modified in various ways. Therefore, the present invention This shall not be interpreted as being limited to the contents described in the following embodiments.

[0023] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0024] In each figure described herein, the size, layer thickness, or area of ​​each component is not specified. This may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. I can't.

[0025] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0026] In the following, expressions indicating direction, such as "up" and "down," generally correspond to the orientation shown in the drawing. It shall be used in this manner. However, for the purpose of making explanations easier, etc., the following may be included in the specification. The direction indicated by "up" or "down" may not always match that shown in the drawing. For example, When explaining the stacking order (or formation order) of a laminate, etc., the drawing should show the laminate as being constructed. The side being attacked (the surface to be formed, the support surface, the adhesive surface, the flat surface, etc.) is positioned above the laminate. Even when something is simply placed down, it may be described as having that orientation down, or the opposite orientation as up.

[0027] In this specification, a display panel, which is one form of a display device, displays an image or the like on its display surface. It has the function of (powering). Therefore, the display panel is one form of an output device.

[0028] Furthermore, in this specification, the substrate of the display panel may be, for example, FPC (Flexible Printed Circuit). (inted Circuit) or TCP (Tape Carrier Packa A connector such as a ge is attached, or the circuit board has a COG (Chip On A display panel module or display module is a device on which an IC is mounted using a glass or similar method. It may be called a display panel, or simply a display board.

[0029] In this specification, a touch panel, which is one form of a display device, displays images, etc. on its display surface. The display function, and the detection of a finger or stylus or other object touching or pressing on the display surface, It has the function of a touch sensor that detects approaching objects, etc. Therefore, touch A panel is one form of an input / output device.

[0030] A touch panel is, for example, a display panel (or display device) with a touch sensor. It can also be called a display panel (or display device) with a touch function. It can also be configured to have a panel and a touch sensor panel. Alternatively, the display panel The configuration can also include a touch sensor functioning either internally or on its surface.

[0031] Furthermore, in this specification, etc., a touch panel substrate is provided with a connector or IC mounted on it. This is sometimes called a touch panel module, display module, or simply a touch panel. There is a match.

[0032] (Embodiment 1) This embodiment describes a display device according to one aspect of the present invention.

[0033] A display device according to one aspect of the present invention includes a first light-emitting element that emits visible light and a second light-emitting element that emits invisible light. It comprises two light-emitting elements and a light-receiving element that is sensitive to invisible and visible light. The element functions as a display element for displaying images using visible light. (Photodetector) It is preferable that it is a photoelectric conversion element.

[0034] It is preferable that the first light-emitting element and the light-receiving element are arranged side by side on the same plane. The second light-emitting element is provided on a different surface from the first light-emitting element and the light-receiving element. preferable.

[0035] The first and second light-emitting elements are OLEDs (Organic Light Emitting Diode), or QLED (Quantum-dot Light) It is preferable to use EL elements such as (Emitting Diode). The light-emitting substances that children possess include fluorescent substances (fluorescent materials) and phosphorescent substances (phosphorescent materials). Materials), inorganic compounds (such as quantum dot materials), substances that exhibit thermally activated delayed fluorescence (thermally activated delayed Thermally activated delayed fluoresc Examples include ence:TADF (materials). Also, as a light-emitting element, microLEDs are used. LEDs such as (Light Emitting Diodes) can also be used.

[0036] For example, a pn-type or pin-type photodiode can be used as the light-receiving element. Yes, it is possible. The light-receiving element is a photoelectric conversion element that detects light incident on the light-receiving element and generates an electric charge. It functions in this way. The amount of charge generated by a photoelectric conversion element is determined by the amount of incident light. In particular, It is preferable to use an organic photodiode having a layer containing an organic compound as the light-receiving element. Organic photodiodes are easy to make thin, light, and large in area, and also shape Due to its high degree of freedom in shape and design, it can be applied to various display devices.

[0037] The first and second light-emitting elements have a laminated structure, for example, comprising a light-emitting layer between a pair of electrodes. This can be done. Furthermore, the photodetector has a laminated structure with an active layer between a pair of electrodes. This is possible. A semiconductor material can be used for the active layer of the photodetector. For example, silicon Inorganic semiconductor materials such as CON can be used.

[0038] In particular, OLEDs are used as the first and second light-emitting elements, and a light-receiving element is used. Using an organic photodiode (OPD) This is preferable. This allows for the fabrication of the first light-emitting element, the second light-emitting element, and the light-receiving element. It is possible to standardize some of the production equipment, manufacturing equipment, and materials that can be used therein. Therefore, manufacturing costs can be reduced. Furthermore, these manufacturing processes can be simplified, thus reducing production costs. It can improve retention.

[0039] Furthermore, it is preferable to use an organic compound in the active layer of the light-receiving element. At this time, the first By placing one electrode (also called a pixel electrode) of the light element and the light-receiving element on the same plane... This is preferable. Furthermore, the first light-emitting element and the other electrode of the light-receiving element are connected by a continuous conductive layer. It is more preferable to use electrodes formed by (also called common electrodes). Furthermore, the first It is more preferable that the light-emitting element and the light-receiving element have a common layer. This allows the first light emission This simplifies the manufacturing process for creating the element and the photodetector, thereby reducing manufacturing costs, and This can improve manufacturing yield.

[0040] By differentiating between the light-emitting layer of the first light-emitting element and the active layer of the photodetector, the first light-emitting element This allows the light-receiving element and the light-receiving element to be fabricated on the same plane. For example, the light-emitting layer and the active layer are each By using a film deposition method with a shielding mask such as a talus mask, it can be formed in island-like or strip-like shapes. In film deposition methods using shielding masks, different shielding masks are used, taking into consideration the extent of the deposited film. A margin (also called a margin or allowance) is provided between the two island-like patterns formed by the square. It can happen.

[0041] Furthermore, this margin is provided with a light-shielding layer that blocks light of wavelengths received by the photodetector. This is possible. Furthermore, the light-shielding layer defines the light-emitting region of the first light-emitting element and the light-receiving region of the light-receiving element. The configuration may include openings or slits.

[0042] Since the margin is an area that does not contribute to light emission or light reception, it is part of the display area of ​​the display device. Low ratio of light-emitting area to light-receiving area (effective light emission area ratio, or effective light-receiving area ratio) This leads to the next page.

[0043] Therefore, in one aspect of the present invention, a second invisible light emitting portion is provided in the portion corresponding to the margin. A light-emitting element is provided. This invisible light is used as a light source when the light-receiving element captures an image of the subject. Furthermore, the second light-emitting element can be positioned above the light-shielding layer (on the display side). This is preferable. Furthermore, the second light-emitting element overlaps with the light-shielding layer and, in a plan view, shields It is preferable to place it inside the contour of the light layer. That is, at the edge of the light-emitting region of the second light-emitting element. It is preferable to provide a second light-emitting element in the part so as to be located inside the edge of the light-shielding layer. i. As a result, some of the invisible light emitted by the second light-emitting element is blocked by the light-shielding layer. Therefore, it is possible to prevent direct incidence of light on the light-receiving element. As a result, the display device is noise-free. It is possible to capture a clear image with reduced distortion.

[0044] Examples of invisible light include infrared light and ultraviolet light. In particular, wavelength 700n Infrared light having one or more peaks in the range of m to 2500 nm can be suitably used. It is possible. In particular, light having intensity in the wavelength range of 750 nm to 1000 nm, preferably, By using light having one or more peaks in this wavelength range, the material used for the active layer of the photodetector can be changed. This is preferable because it broadens the range of choices.

[0045] By using the aforementioned infrared light as invisible light, the display device uses a light-receiving element to detect fingers and It can also image blood vessels, especially veins, in the hands and other areas. For example, wavelengths of 760 nm and nearby wavelengths. Because the light from the side is not absorbed by the reduced hemoglobin in the veins, light from the palm or fingers, for example, is not absorbed by the reduced hemoglobin in the vein. By receiving reflected light with a photodetector and creating an image, the location of veins can be detected. A module or electronic device having a display device according to one aspect of the invention displays an image of a vein. This allows for vein authentication, a type of biometric authentication.

[0046] Furthermore, by using the visible light emitted by the first light-emitting element as the light source, the palm print and fingertips can be identified. It can capture the shape of fingerprints and other features. Additionally, some infrared light is reflected by the skin's surface. Therefore, infrared light emitted by the second light-emitting element can also be used to image shapes such as fingerprints. A module or electronic device having a display device according to one aspect of the present invention displays the image of a captured fingerprint. By using the image, fingerprint authentication, a type of biometric authentication, can be performed.

[0047] Below, we will explain more specific configuration examples with reference to the drawings.

[0048] [Example of display device configuration 1] Figure 1A shows an example of the configuration of the display device 10. The display device 10 consists of a substrate 11 and a substrate 12. In between, there are light-emitting elements 21R, 21G, 21B, light-receiving element 22, and 23 It has IR and a light-shielding layer 24, etc. The display device 10 also has a light-emitting element 21R, light-emitting element 21 G, a resin layer 31 covering the light-emitting element 21B and the light-receiving element 22, and a light-emitting element 23IR and light shielding. It has a resin layer 32 covering layer 24.

[0049] The light-emitting element 21R, light-emitting element 21G, light-emitting element 21B, and light-receiving element 22 are located on the substrate 11. They are arranged in a row. In addition, the light-shielding layer 24 is made up of light-emitting elements 21R, 21G, and light-emitting elements. It is located on top of element 21B. The light-emitting element 23IR is arranged on top of the light-shielding layer 24. The light-shielding layer 24 is located between each light-emitting element in a plan view, and It has a portion located between one of the light-emitting elements and the light-receiving element 22. Similarly, the light-emitting element 23I R is also the portion located between each light-emitting element in a plan view, and the portion connected to any of the light-emitting elements. It has a portion located between it and the optical element 22.

[0050] The light-emitting element 21R, light-emitting element 21B, and light-emitting element 21G are red (R) and blue (B), respectively. It emits light, or green (G) light.

[0051] The display device 10 has multiple pixels arranged in a matrix. One pixel is It has the above subpixels. Each subpixel has one light-emitting element. For example, a pixel has, A configuration having three subpixels (three colors: R, G, and B, or yellow (Y), cyan (C), and (e.g., three colors including magenta (M)), or a configuration with four subpixels (R, G, B, white (W)). ) can be applied as four colors, or as four colors such as R, G, B, and Y. Furthermore, pixels are photodetectors It has a child 22. The light-receiving element 22 may be provided at all pixels, or at some pixels. They may be kicked. Also, one pixel may have multiple light-receiving elements 22.

[0052] Between two adjacent light-emitting elements, and between a light-emitting element and the light-receiving element 22, these are created. A margin is provided for the separation. In Figure 1A, the light-emitting element 21R and the light-emitting element 21B and are arranged with a distance M between them. For example, a light-emitting element or a light-receiving element. As the film that constitutes it, island-shaped organic films are formed by vacuum deposition using a metal mask. In addition, the precision of the alignment between the metal mask and the substrate, the deflection of the metal mask, and the scattering of vapors. Due to these factors, deviations from the design may occur in the shape and position of the island-like organic film. Therefore, adjacent The distance M between elements is 10 μm or more, preferably 20 μm or more, and more preferably 30 μm or more. Therefore, it is preferable that the particle size be 200 μm or less, preferably 100 μm or less.

[0053] In this specification, the term "light-emitting element" may refer to a light-emitting region. A specific example is when a light-emitting element has a pair of electrodes and a light-emitting layer between them. The region where these are stacked and emit light when an electric field is applied is called a light-emitting element (light-emitting region). This can happen. Therefore, some or all of the components of the light-emitting element may be different from the light-emitting region. It may be located in the region. Similarly, when referring to a light-receiving element, the light-receiving region may also be referred to as the light-receiving region. It can sometimes mean this.

[0054] The light-emitting element 23IR emits invisible light. Here, the light-emitting element 23IR emits infrared light IR This shows an example of what is emitted.

[0055] The photodetector 22 is a photoelectric converter that is sensitive to infrared light emitted by at least the light-emitting element 23IR. It is an element. The light-receiving element 22 has a sensitivity within the wavelength range of, for example, 700 nm to 900 nm. It is sufficient to have it.

[0056] Furthermore, the light-receiving element 22 receives not only infrared light, but also light-emitting elements 21R, 21B, and It is preferable that the light element 21G is sensitive to the light it emits. And if it is sensitive to infrared light, for example, in the wavelength range of 500 nm to 1000 nm, 50 In the wavelength range of 0 nm to 950 nm, or in the wavelength range of 500 nm to 900 nm, It is preferable that it has sensitivity.

[0057] Figure 1A shows a finger 60 touching the surface of the substrate 12. At this time, light is emitted. A portion of the infrared light (IR) emitted from element 23IR is reflected by the surface or inside of finger 60, A portion of the reflected light enters the light-receiving element 22. This allows information about the position touched by the finger 60 to be obtained. It is possible to obtain images of either or both the vein shape and the fingerprint shape of finger 60. It is possible.

[0058] Furthermore, if any of the light-emitting elements 21R, 21B, and 21G emit light The light can be used to acquire the position information of finger 60 or to capture fingerprints. (Figure 1B) For example, of the light G emitted from the light-emitting element 21G, the reflected light from the finger 60 is received This shows how the photonic element 22 receives light.

[0059] Furthermore, as shown in Figure 1C, even when the finger 60 is separated from the substrate 12, the position information of the finger 60 is also transmitted. It can be obtained. In other words, the display device 10 functions as a contactless touch panel. This is possible. Depending on the distance between the finger 60 and the substrate 12, the shape of the fingerprint or veins may be affected. In some cases, it may be possible to obtain it. In that case, the module to which the display device 10 is applied Alternatively, electronic devices can function as contactless biometric authentication devices.

[0060] The smaller the spacing between the light-receiving elements 22, the higher the resolution image can be captured. For example, the spacing between the light-receiving elements 22 is set to the distance between two protrusions of a fingerprint, preferably adjacent to each other. By making the spacing smaller than the distance between the concave and convex parts, it is possible to obtain a clear image of the fingerprint. Yes, it is possible. The distance between the recesses and protrusions of a human fingerprint is approximately 200 μm, so for example, a photodetector The spacing between the 22 elements is 400 μm or less, preferably 200 μm or less, more preferably 150 μm. The size is μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. The particle size should be 1 μm or larger, preferably 10 μm or larger, and more preferably 20 μm or larger.

[0061] Furthermore, the display device 10 can detect not only fingerprints, but also various other things that come into contact with or approach the surface of the substrate 12. It can capture images of objects. Therefore, the display device 10 can also function as an image sensor panel. It can be used. For example, the light-emitting element 21R, light-emitting element 21B, and light-emitting element 21G The light is emitted sequentially, and each time, an image is captured by the light-receiving element 22, and the three resulting images are combined. By doing so, a color image can be obtained. That is, the display device 10 is applied to The sub-device can also be used as an image scanner capable of color imaging. By imaging with the photodetector 22 while the sub-23IR is emitting light, infrared light is used. It can be used as an image scanner.

[0062] Furthermore, the display device 10 uses the light-receiving element 22 to enable touch panels or pen tablets, etc. It can also function as a capacitive touch sensor. By using the light-receiving element 22, Unlike cases using touch sensors or electromagnetic induction type sensors, etc., highly insulating detection Since position detection is possible even for the body, the material of the object being detected, such as a stylus, is not a factor. Various writing instruments (such as brushes, glass pens, and quill pens) can also be used.

[0063] [Example of display device configuration 2] The following describes a more specific example of the display device configuration.

[0064] Figure 2A shows a schematic top view of the display device 100, as illustrated below, as seen from the display surface side. Furthermore, Figure 2B shows a schematic cross-section corresponding to the cross-section cut by the dashed line X1-X2 in Figure 2A. A diagram is shown.

[0065] The display device 100 has a light-receiving element 110 between a pair of substrates (substrate 151 and substrate 152). , light-emitting element 190, light-emitting element 160, transistor 131, transistor 132, light-shielding layer It has 145, resin layer 141 and resin layer 142, etc.

[0066] The light-emitting element 190 emits one of the following colors of light: red (R), green (G), or blue (B).

[0067] Figure 2A shows the light-receiving element 110, the light-emitting element 190, the light-emitting element 160, and the light-shielding layer 145. The top surface shape is shown. Note that for the light-emitting element 190, the symbols R, G, and B are indicated for each emission color. They are distinguished by adding a symbol. Additionally, the light-receiving element 110 is labeled with the code PD.

[0068] Figure 2A shows rows in which R light-emitting elements 190 and G light-emitting elements 190 are arranged alternately, and light receiving Rows in which elements 110 and light-emitting elements 190 of B are arranged alternately are arranged alternately in the column direction. The relative positional relationship between each light-emitting element 190 and the light-receiving element 110 is not limited to this. Any two elements may be swapped with each other.

[0069] Between two adjacent light-emitting elements 190, and between adjacent light-receiving elements 110 and light-emitting elements 190 A light-shielding layer 145 is provided between them. Furthermore, a light-emitting element 160 is placed on the light-shielding layer 145. These are arranged in a layered configuration. In Figure 2A, a grid-shaped light-emitting element is placed on a grid-shaped light-shielding layer 145. A sub-element 160 is provided. The light-emitting element 160 is connected to the ring of the light-shielding layer 145, as shown in Figure 2A. It is preferable that it be located inside the border. In other words, in a plan view, the photodetector It is preferable that the edge of the light-shielding layer 145 is located between the child 110 and the light-emitting element 160. Furthermore, in a plan view, a light-shielding layer 145 is placed between the light-emitting element 190 and the light-emitting element 160. It is preferable that the other end is located there.

[0070] Figure 2A shows an example where the light-emitting element 160 is continuous across the entire display area. This configuration allows the entire display area to be either illuminated or not illuminated. This allows for extremely simplified control of the drive of the light-emitting element 160.

[0071] Figure 3A shows an example where strip-shaped light-emitting elements 160, which are long in the row direction, are arranged in the column direction. Yes, it is possible to make the strip-shaped light-emitting elements 160 light up sequentially. ru.

[0072] Figure 3B also shows an example where the island-shaped light-emitting elements 160 are arranged in a matrix. In this case, the light-emitting element 160 is driven by a passive matrix method. This is possible. Alternatively, an active matrix driving method may be applied.

[0073] Note that in Figure 3B, for the sake of ease of understanding, the top shape and size of the light-emitting element 160 are shown as follows: Although shown as being the same as the light-emitting element 190 and the light-receiving element 110, it is not limited to these. The top surface shape and size of the light-emitting element 160, each light-emitting element 190, and the light-receiving element 110 are different. You may do so.

[0074] As shown in Figure 2B, transistors 131 and 132 are located on the substrate 151. A layer is provided thereon, and an insulating layer 214 is provided on top of it.

[0075] The light-receiving element 110 has a pixel electrode 111, a photoelectric conversion layer 112, and a common electrode 113. The light-emitting element 190 has a pixel electrode 191, an EL layer 192, and a common electrode 113. The power conversion layer 112 has at least an active layer. The EL layer 192 has at least an emissive layer. do.

[0076] The light-emitting element 190 has the function of emitting visible light. Specifically, the light-emitting element 190 has the function of emitting visible light. By applying a voltage between the elemental electrode 191 and the common electrode 113, light 121 is emitted towards the substrate 152. This is an electroluminescent device that emits light.

[0077] The light-receiving element 110 has the function of detecting light. Specifically, the light-receiving element 110 is located on a substrate A photoelectric element that receives light 122 incident from the outside via 152 and converts it into an electrical signal. He is a child.

[0078] Pixel electrode 111 and pixel electrode 191 are provided on the same plane. Electrode 191 is preferably formed by processing the same conductive film. Pixel electrode 111 and Preferably, the pixel electrode 191 has the function of reflecting visible light and infrared light. The ends of the pole 111 and the pixel electrode 191 are covered by the partition wall 216. Common electrode 11 3 has the function of transmitting visible light and infrared light.

[0079] The common electrode 113 is provided in common to both the light-receiving element 110 and the light-emitting element 190. Specifically The common electrode 113 overlaps with the pixel electrode 111 via the photoelectric conversion layer 112, and EL It has a region that overlaps with the pixel electrode 191 via layer 192.

[0080] Furthermore, the light-receiving element 110 and the light-emitting element 190 are provided with common electrodes in addition to the common electrode 113. It may have layers. For example, the active layer and the luminescent layer may be made separately, and all other layers may be made together. This configuration can also be used for general purposes.

[0081] The layer used in common by the light-receiving element 110 and the light-emitting element 190 has functions in the light-emitting element and The function may differ from that of an optical element. In this specification, the function is based on that of a light-emitting element. The components are then named accordingly. For example, the hole injection layer is the hole injection layer in a light-emitting element. It functions as a hole transport layer in a photodetector. Similarly, the electron injection layer is a light-emitting element. It functions as an electron injection layer in the photodetector and as an electron transport layer in the photodetector. The hole transport layer functions as a hole transport layer in both the light-emitting element and the photodetector. Furthermore, the electron transport layer functions as an electron transport layer in both the light-emitting element and the photodetector.

[0082] A protective layer 195 is provided on the common electrode 113, covering the light-receiving element 110 and the light-emitting element 190. The protective layer 195 prevents impurities such as water from entering the light-receiving element 110 from the resin layer 141 side. It has the function of preventing diffusion to the light-emitting element 190. In addition, by providing a protective layer 195, During the process after the formation of the protective layer 195, the light-receiving element 110 and the light-emitting element 190 Damage can be reduced.

[0083] The protective layer 195 can be a single-layer or multi-layer structure including at least an inorganic insulating film. It is possible. Examples of inorganic insulating films include silicon oxide films, silicon oxide nitride films, and silicon oxide nitride films. Silicon nitride film, aluminum oxide film, aluminum oxide nitride film, hafnicarbon oxide film Examples include oxide films or nitride films such as um films.

[0084] A resin layer 141 is provided covering the protective layer 195. The resin layer 141 is a planarizing film. It works.

[0085] A light-shielding layer 145 is provided on the resin layer 141. The light-shielding layer 145 blocks visible light and infrared light. Absorption is preferable. As the light-shielding layer 145, for example, a metal material or a pigment (carbon A black matrix is ​​formed using resin materials containing dyes (such as black or other dyes). This is possible. The light-shielding layer 145 has a red color filter, a green color filter, and a blue The color filter may have a stacked structure in which two or more color filters are stacked.

[0086] A light-emitting element 160 is provided on the light-shielding layer 145. The light-emitting element 160 has electrodes 161, E It has an L layer 162 and an electrode 163.

[0087] The light-emitting element 160 has the function of emitting infrared light. Specifically, the light-emitting element 160 has the function of emitting infrared light. By applying a voltage between pole 161 and electrode 163, light 123 is emitted towards the substrate 152. It is an electroluminescent element.

[0088] The insulating layer 217 is provided to cover the ends of the electrode 161 and the light-shielding layer 145. It is preferable that it functions as a planarization film.

[0089] In Figure 2B, electrode 161, EL layer 162, and electrode 163 are shown in plan view. This shows an example where the material is processed to be located inside the contour of the light-shielding layer 145. In this case, as shown in Figure 2B, the electrode 163 covers the edge of the EL layer 162. This is preferable. As a result, electrode 163 functions as a protective layer, and the EL layer is accessible from the resin layer 142 side. This prevents impurities such as water from diffusing into 162, thereby improving the reliability of the light-emitting element 160. It is possible to do so.

[0090] Furthermore, it is preferable that electrode 161 has the function of reflecting infrared light. Electrode 163 is red It is preferable that it has the function of transmitting ambient light.

[0091] As shown in Figure 2B, the EL layer 1 is located on the upper part of the light-emitting element 190 and the upper part of the light-receiving element 110. It is preferable to have a configuration in which 62 and electrode 163 are not provided. This allows light 121 and light A portion of 122 is not absorbed by the EL layer 162 and electrode 163, improving luminous efficiency and light reception sensitivity. This enables the creation of highly accurate display devices.

[0092] A resin layer 142 is provided covering the light-emitting element 160. A substrate is placed on the resin layer 142. A 152 is provided. The resin layer 142 is for bonding the substrate 151 and the substrate 152. It is preferable that it functions as an adhesive layer.

[0093] Transistors 131 and 132 are on the same layer (substrate 151 in Figure 2B). It is in contact with the transistor. The pixel electrode 111 is in contact with the transistor through an opening provided in the insulating layer 214. It is electrically connected to the source or drain of the 131. The pixel electrode 191 is insulated The source or drain of transistor 132 is accessed through an opening in layer 214. It is electrically connected to the transistor 132, which has the function of controlling the drive of the light-emitting element 190. To possess.

[0094] At least a portion of the circuit electrically connected to the light-receiving element 110 is electrically connected to the light-emitting element 190. It is preferable that the circuits to be connected are formed using the same materials and processes. Therefore, compared to forming the two circuits separately, the thickness of the display device can be reduced. Furthermore, the manufacturing process can be simplified.

[0095] Here, the common electrode 113, which is provided in common to the light-emitting element 190 and the light-receiving element 110, is the first It is preferable to electrically connect to the wiring to which the potential is applied. The first potential is common Fixed potentials such as common potential, ground potential, and reference potential can be used. The first potential applied to the common electrode 113 is not limited to a fixed potential, but can be selected from two or more different potentials. It is also possible to select and give them options.

[0096] When the light-receiving element 110 receives light and converts it into an electrical signal, the pixel electrode 111 has a common It is preferable to apply a second potential lower than the first potential applied to the electrode 113. The potential of 2 depends on the configuration, optical characteristics, and electrical characteristics of the photodetector 110, and the light-receiving sensitivity. A potential can be selected and applied that optimizes the following: When considered as a photodiode, the cathode is designed to apply a reverse bias voltage. The first potential applied to the common electrode 113 which functions as a node, and the pixel electrode which functions as an anode. The second potential applied to pole 111 can be selected. Furthermore, the photodetector 110 is driven. If not done, the pixel electrode 111 will have a potential equal to or similar to the first potential, A potential higher than the first potential may be applied.

[0097] On the other hand, when the light-emitting element 190 is made to emit light, the pixel electrode 191 is supplied with power to the common electrode 113. It is preferable to apply a third potential that is higher than the first potential. The third potential is the light-emitting element Depending on the configuration of sub-unit 190, threshold voltage, and current-luminance characteristics, the required luminescence brightness and The potential can be selected and applied to make the light-emitting diode 190 When considered as a cathode, it functions as a cathode so that a forward bias voltage is applied. The first potential applied to the common electrode 113 and the potential applied to the pixel electrode 191 which functions as an anode A third potential can be selected. Note that when the light-emitting element 190 is not to emit light. The pixel electrode 191 has a potential that is the same as or of the same magnitude as the first potential, or a potential that is similar to the first potential. A lower potential may be applied.

[0098] In this case, the common electrode 113 is used as the cathode for the light-receiving element 110 and the light-emitting element 190. We have described an example where it functions as a dot and each pixel electrode functions as an anode, but this is not limited to this case. Instead, the common electrode 113 functions as the anode, and each pixel electrode functions as the cathode. This configuration is also possible. In that case, when driving the photodetector 110, the second potential is set as the second When applying a potential higher than potential 1 and driving the light-emitting element 190, the third potential is set as the third potential. You just need to apply a potential lower than 1.

[0099] [Configuration Example 2-2] Figure 4A shows a schematic cross-sectional view of a display device with some configurations different from those described above. The display device 100A shown is different from the display device 100 in that the configuration of the light-emitting element 160 is different. They are different.

[0100] The EL layer 162 and electrode 163 of the light-emitting element 160 overlap with the light-receiving element 110, respectively. It has a portion that is a part of the light-emitting element 190, and a portion that overlaps with the light-emitting element 190. With this configuration, Since the EL layer 162 and the electrode 163 can each be made from a continuous film, The process can be simplified. Furthermore, the EL layer 162 and the electrode 163 can be formed continuously. Therefore, it is possible to suppress the mixing of impurities contained in the atmosphere (such as water) between them. This can increase reliability.

[0101] The EL layer 162 and the electrode 163 transmit visible light emitted by the light-emitting element 190, therefore It is preferable to apply films that have low absorption to visible light. For example, EL layer 162 and The laminate of electrodes 163 has a transmittance of 50% or more to the light emitted by the light-emitting element 190. 0% or less, preferably 60% to 100%, more preferably 70% to 100% The materials and thicknesses of the EL layer 162 and the electrode 163 are selected accordingly. preferable.

[0102] Furthermore, the EL layer 162 and the electrode 163 are exposed to light 123 including infrared light emitted by the light-emitting element 160. Because the light 122 reflected from the object is transmitted through each film, each film has low absorption for infrared light. It is preferable to apply the following. For example, the laminate of the EL layer 162 and the electrode 163 is a light-emitting element. The transmittance to the infrared light emitted by 160 is 50% to 100%, preferably 60% or less. The EL layer 162 and It is preferable to select the material and thickness of the electrode 163 accordingly.

[0103] By increasing the transmittance of the EL layer 162 and the electrode 163 to visible light and infrared light, Because the light extraction efficiency is improved, the display brightness or luminescence of the display device can be increased. It can also increase the illuminance of the light 122 reaching the light-receiving element 110, thus enabling detection. It can increase sensitivity.

[0104] [Configuration Example 2-3] Figure 4B shows a schematic cross-sectional view of a display device 100B having a different configuration than described above. Figure 3 This corresponds to the cross-sectional schematic diagram corresponding to the dashed line X3-X4 in the top schematic diagram shown in B.

[0105] In Figure 4B, a conductive layer 167 is provided between the two light-emitting elements 160. 67 is a wiring harness that electrically connects the island-shaped electrodes 163 that each of the two light-emitting elements 160 has. It functions as a line.

[0106] The conductive material used for electrode 163 has high light transmittance, which allows light 123 emitted by light-emitting element 160 to pass through. This is preferable because it can improve extraction efficiency. However, it has high light transmittance and high conductivity. Balancing sex and other factors is not easy. If the electrical resistance of electrode 163 is high, a voltage drop will occur. Therefore, a distribution occurs in the voltage applied to each individual light-emitting element 160, and as a result, across the entire screen... The uniformity of the luminescence may be impaired. Therefore, the electrodes 163 of each light-emitting element 160 By giving them island-like top surfaces and electrically connecting them with a highly conductive conductive layer 167, Voltage drop can be suppressed.

[0107] In this example, the electrode 163 has an island-like top surface shape, but it is similar to the display device 100A described above. It may also be formed as a continuous film. In this case, it is preferable that the EL layer 162 be formed in an island-like manner. .

[0108] [Example of display device configuration 3] The following describes examples of circuit configurations that can be used in display devices.

[0109] Figure 5A shows a schematic perspective view of the display device 50. A display device according to one aspect of the present invention is shown in Figure 5A. As shown, a layer 51 having a light-emitting element 21 and a light-receiving element 22, and a layer having a light-emitting element 23 It can also be seen as a configuration in which 52 and another element are stacked on top of each other.

[0110] In layer 51, the light-emitting element 21 and the light-receiving element 22 are arranged in a matrix. Here, we show the case where the arrangement is rotated 45 degrees from Figure 2A, etc.

[0111] Layer 52 is provided with light-emitting elements 23. Here, the light-emitting elements 23 are arranged in a matrix. This shows an example of arrangement. Note that the arrangement of the light-emitting element 23 is not limited to this, and layers A single light-emitting element 23 may be placed over the entire 52, or a light-emitting element having a strip-shaped upper surface may be placed. The children 23 may be arranged in one direction.

[0112] Next, the circuit for controlling the light emission and light reception of the display device 50 will be described.

[0113] Figure 5B shows a block diagram illustrating an example of the configuration of layer 51 and its surrounding circuits. 1 has pixels 71 and 72. Pixel 71 functions as a sub-pixel and is red, green, Alternatively, it is a circuit for controlling the luminescence brightness of one of the blue light-emitting elements 21. Pixel 72 This is a circuit for controlling the light-receiving and readout operations of the light-receiving element 22.

[0114] Pixel 71 has at least a transistor (selection transistor) for controlling the selection and deselection of the pixel. A transistor (drive transistor) for controlling the current flowing through the light-emitting element 21. It has a zista. Pixel 71 can be driven by an active-matrix method. ru.

[0115] Furthermore, pixel 72 has at least a transistor (selection) for controlling the selection and deselection of the pixel. It has a selector transistor. Pixel 72 is driven by an active matrix system. It is possible.

[0116] In layer 51, circuit sections 75a, 76a, 77, and 78 are electrically connected. They are connected. The circuit section 75a has multiple pixels 7 arranged in the row direction via wiring GLa. It is electrically connected to 1. The circuit section 76a is arranged in a column direction via wiring SLa. Multiple pixels 71 are electrically connected. The circuit section 77 is connected in the row direction via wiring CL. Multiple pixels 72 arranged are electrically connected. The circuit section 78 is connected via wiring WL, Multiple pixels 72 arranged in the column direction are electrically connected. Note that the wiring GLa Wiring SLa, wiring CL, and wiring WL are each explicitly shown as a single wire, This could be multiple wires, each supplied with a different signal or potential.

[0117] Circuit section 75a is a scan line drive circuit (gate line drive circuit, gate driver, scan driver). It functions as a (also called an iba, etc.) circuit section 75a is a selection signal for selecting pixel 71 It has the function of generating a signal and outputting it to the wiring GLa. Circuit section 76a is a signal line drive circuit (so It functions as a data line drive circuit (also called a source driver, etc.). Circuit section 76a is a data It has the function of outputting a data signal (data potential) to the wiring SLa.

[0118] The circuit section 77 functions as a scan line driving circuit. The circuit section 77 supplies to the pixel 72 It has the function of generating timing signals and outputting them to wiring CL. The circuit section 78 reads It functions as a path. The circuit section 78 transmits the signal output from the pixel 72 via the wiring WL to the outside. Convert the data into a format that can be processed by the department's equipment (digital or analog data). It has the function of outputting data.

[0119] Figure 5C shows a block diagram illustrating an example of the configuration of layer 52 and its surrounding circuits. 2 has a pixel 73. The pixel 73 is a circuit for controlling the luminescence brightness of the light-emitting element 23. Yes. Pixel 73 can have the same configuration as pixel 71 above. Pixel 73 is active It can be driven using a matrix system.

[0120] In layer 52, circuit section 75b and circuit section 76b are electrically connected. b is electrically connected to a plurality of pixels 73 arranged in the row direction via wiring GLb. The circuit section 76b is electrically connected to a plurality of pixels 73 arranged in the column direction via wiring SLb. It continues.

[0121] Circuit section 75b functions as a scan line drive circuit, and circuit section 76b functions as a signal line drive circuit. It is possible. Circuit sections 75b and 76b are described in the same way as circuit sections 75a and 76a, respectively. It can be used as a substitute.

[0122] The light-emitting element 23 of layer 52 is generated by either a passive matrix method or a segment method. The configuration may also be such that the light emission is controlled. This allows for the configuration of the pixels and the configuration of the peripheral circuits. Because it can be simplified, manufacturing costs can be reduced.

[0123] Figure 6A shows an example where a passive matrix drive method is applied.

[0124] The display device shown in Figure 6A has a layer 52a, a circuit section 79a, and a circuit section 79b. Multiple light-emitting elements 23 are arranged in a matrix in 52a. The circuit section 79a is line SL X Electrically connected to the anodes of multiple light-emitting elements 23 arranged in the row direction via Circuit section 79b is wired SL Y Multiple light-emitting elements 23 arranged in a column direction via It is electrically connected to the cathode.

[0125] The light-emitting element 23 is connected to the wiring SL X The anode potential supplied from the circuit section 79a via and line SL Y The brightness is generated according to the potential difference with respect to the cathode potential supplied from the circuit section 79b via the circuit. It can emit light.

[0126] Figure 6B shows an example where a segment-based driving method is applied.

[0127] The display device shown in Figure 6B has a layer 52b and a circuit section 79c. Layer 52b has multiple The light-emitting elements 23 are arranged in a matrix. The circuit section 79c has multiple wires AL that are electrical They are connected. One wire AL has the anode of one light-emitting element 23 electrically connected to it. The connection is maintained. The anode of the light-emitting element 23 is connected to the circuit section 79c via the wiring AL. An anode potential is applied. In addition, each of the multiple light-emitting elements 23 has a cathode connected to wiring C. It is electrically connected to L. The cathode potential is applied to the wiring CL.

[0128] The configuration shown in Figure 6B involves applying an anode potential to each of the light-emitting elements 23 individually. It can be made to emit light.

[0129] The display device shown in Figure 6C has a layer 52c having a plurality of light-emitting elements 23 arranged in a column, It has a circuit section 79c. The anode of the light-emitting element 23 is connected to the circuit section 79c via wiring AL. Then the anode potential is applied. The cathode of the light-emitting element 23 is connected via wiring CL. An electric potential is applied.

[0130] The display device shown in Figure 6C has a configuration in which light-emitting elements 23, each having a strip-shaped upper surface, are arranged in one direction. This can be used suitably.

[0131] Figure 6D also shows an example where there is one light-emitting element 23. Layer 52c has one A light-emitting element 23 is provided. The anode of the light-emitting element 23 is connected to the circuit section 79 via wiring AL. An anode potential is applied from d, and a cathode potential is applied to the cathode via wiring CL. It is applied.

[0132] Since the display device shown in FIG. 6D includes one light-emitting element 23, the circuit unit 79d only needs to control the luminance of light emission (i.e., the magnitude of the anode potential) and the timing of light emission, and the circuit configuration can be simplified compared to the above. In addition, in FIGS. 6A to 6D, the light-emitting element 23 indicated by one circuit symbol can be composed of a plurality of light-emitting elements. For example, a plurality of light-emitting elements connected in series or in parallel can be regarded as one light-emitting element.

[0133]

[0134] [Device Structure]

[0135] Next, the detailed configurations of the light-emitting element, the light-receiving element, and the light-emitting and receiving element that can be used in the display device according to one aspect of the present invention will be described.

[0136] The light-emitting element exemplified below can be applied to the light-emitting element 21 exemplified above. Also, the light-receiving element and the light-emitting and receiving element exemplified below can be applied to the light-receiving element 22 exemplified above. Further, the light-emitting element exemplified below can be applied to the light-emitting element 23 exemplified above.

[0137]

[0138] The display device according to one aspect of the present invention may be any of a top emission type that emits light in a direction opposite to the substrate on which the light-emitting element is formed, a bottom emission type that emits light toward the substrate side on which the light-emitting element is formed, and a dual emission type that emits light on both sides.

[0139] In the present embodiment, a top emission type display device will be described as an example. In this specification, unless otherwise specified, elements (light-emitting elements, light-emitting layers, etc.) are multi-layered. Even when describing a configuration with multiple components, when describing matters common to each element: The letters are omitted in the explanation. For example, the light-emitting layer 283R and the light-emitting layer 283G, etc. When describing common elements, the term "emissive layer 283" may be used.

[0139] The display device 280A shown in Figure 7A includes a light-receiving element 270PD and a light-emitting element that emits red (R) light. Element 270R, light-emitting element 270G that emits green (G) light, and light-emitting element 270G that emits blue (B) light It has a light-emitting element 270B.

[0140] Each light-emitting element consists of a pixel electrode 271, a hole injection layer 281, a hole transport layer 282, a light-emitting layer, and an electron The device has a transport layer 284, an electron injection layer 285, and a common electrode 275 stacked in this order. Element 270R has an emissive layer 283R, and light-emitting element 270G has an emissive layer 283G. The light-emitting element 270B has a light-emitting layer 283B. The light-emitting layer 283R emits red light. It has a light-emitting material, the light-emitting layer 283G has a light-emitting material that emits green light, and the light-emitting layer 283B is It has a light-emitting substance that emits blue light.

[0141] The light-emitting element is activated by applying a voltage between the pixel electrode 271 and the common electrode 275. This is an electroluminescent element that emits light towards pole 275.

[0142] The photodetector 270PD consists of a pixel electrode 271, a hole injection layer 281, a hole transport layer 282, and an active Layer 273, electron transport layer 284, electron injection layer 285, and common electrode 275 are stacked in this order. To possess.

[0143] The light-receiving element 270PD is a photoelectric conversion element that receives light incident from outside the display device 280A and converts it into an electrical signal.

[0144] In this embodiment, in both the light-emitting element and the light-receiving element, it will be described that the pixel electrode 271 functions as an anode and the common electrode 275 functions as a cathode. That is, the light-receiving element is driven by applying a reverse bias between the pixel electrode 271 and the common electrode 275, detects the light incident on the light-receiving element, generates charges, and can extract them as a current.

[0145] In the display device of this embodiment, an organic compound is used for the active layer 273 of the light-receiving element 270PD. The light-receiving element 270PD can have the same configuration as the light-emitting element for the layers other than the active layer 273. Therefore, by adding a step of forming the active layer 273 to the manufacturing process of the light-emitting element, the light-receiving element 270PD can be formed in parallel with the formation of the light-emitting element. Also, the light-emitting element and the light-receiving element 270PD can be formed on the same substrate. Therefore, the light-receiving element 270PD can be incorporated into the display device without significantly increasing the manufacturing process.

[0146] In the display device 280A, an example is shown in which the light-receiving element 270PD and the light-emitting element have the same configuration except that the active layer 273 of the light-receiving element 270PD and the light-emitting layer 28 3 are made separately. However, the configurations of the light-receiving element 270PD and the light-emitting element are not limited to this. The light-receiving element 270 PD and the light-emitting element may also have layers that are made separately from each other in addition to the active layer 273 and the light-emitting layer 283. The light-receiving element 270PD and the light-emitting element preferably have one or more layers (common layers) that are commonly used. This allows the light-receiving element 270PD to be incorporated into the display device without significantly increasing the manufacturing process. It can incorporate a 270PD light-receiving element.

[0147] Of the pixel electrode 271 and the common electrode 275, the electrode that extracts light transmits visible light. A conductive film is used. In addition, a conductive film that reflects visible light is used on the electrode that does not extract light. It is preferable that they be present.

[0148] The light-emitting element of the display device of this embodiment has a micro-cavity It is preferable that the structure is applied. Therefore, one of the pair of electrodes of the light-emitting element It has electrodes that are transparent to and reflective of visible light (semitransmissive and semi-reflective electrodes). It is preferable that the other has an electrode (reflective electrode) that is reflective to visible light. It is beautiful. Because the light-emitting element has a microcavity structure, the light emitted from the light-emitting layer By causing resonance between the two electrodes, the light emitted from the light-emitting element can be intensified.

[0149] Furthermore, semi-transmissive / semi-reflective electrodes are electrodes that transmit visible light (transparent electrodes) to reflective electrodes. It can be formed into a layered structure with poles (also called poles).

[0150] The light transmittance of the transparent electrode shall be 40% or more. For example, the light-emitting element shall emit visible light (wavelength 4 It is preferable to use electrodes with a transmittance of 40% or more for light (between 00 nm and less than 750 nm). The reflectance of the semi-transparent / semi-reflective electrode for visible light is 10% to 95%, preferably 30%. The visible light reflectance of the reflective electrode shall be between 40% and 100%, if preferred. Or, it should be between 70% and 100%. Also, the resistivity of these electrodes should be 1 × 10⁻⁶ -2 Ω Preferably, the wavelength should be less than cm. When emitting light, the transmittance or reflectance of near-infrared light of these electrodes is equal to the transmittance of visible light. Alternatively, similar to reflectance, it is preferable that the above numerical range is satisfied.

[0151] The light-emitting element has at least a light-emitting layer 283. The light-emitting element has layers other than the light-emitting layer 283. Therefore, materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, and materials with high electron transport properties. Materials with high electron injection, materials with high electron injection, electron blocking materials, or bipolar materials (electron injection The system may further include a layer containing a substance with high transportability and hole transportability.

[0152] For example, a light-emitting element and a light-receiving element include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. One or more layers of the layering can have a common configuration. Also, the light-emitting element and the light-receiving element are One or more of the hole injection layer, hole transport layer, electron transport layer, and electron injection layer are fabricated separately from each other. It is possible.

[0153] The hole injection layer is a layer that injects holes from the anode into the hole transport layer, and is a material with high hole injection potential. This is a layer containing [a certain substance]. Materials with high hole implantation potential include aromatic amine compounds or hole transport materials. A composite material containing an electron-accepting material and an electron-accepting material can be used. .

[0154] In a light-emitting element, the hole transport layer emits holes injected from the anode by the hole injection layer. It is a layer that transports light to the light layer. In a photodetector, the hole transport layer transports light incident in the active layer. This layer transports holes generated based on the process to the anode. The hole transport layer contains a hole transport material. It is a layer. As a hole transport material, 1 × 10 -6 cm 2 Having a hole mobility of / Vs or greater A substance is preferred. In addition, any other substance can be used as long as it has higher hole transporting property than electrons. As the hole transporting material, a π-electron excess type heteroaromatic compound (for example, a carbazole derivative, a thiophene derivative, a furan derivative, etc.) or an aromatic amine ( a compound having an aromatic amine skeleton) and other materials with high hole transporting property are preferred.

[0155] In the light-emitting device, the electron transport layer is a layer that transports electrons injected from the cathode to the light-emitting layer through the electron injection layer. In the light-receiving device, the electron transport layer is a layer that transports electrons generated based on the incident light in the active layer to the cathode. The electron transport layer is a layer containing an electron transporting material. As the electron transporting material, a substance having an electron mobility of 1×10 -6 cm 2 [[ID=二十]] / Vs or more is preferred. In addition, any other substance can be used as long as it has higher electron transporting property than holes. As the electron transporting material, a metal complex having a quinoline skeleton, a metal complex having a benzoquinoline skeleton, a metal complex having an oxazole skeleton, a metal complex having a thiazole skeleton, etc., in addition, an oxadiazole derivative, a triazole derivative, an imidazole derivative, an oxazole derivative, a thiazole derivative, a phenanthroline derivative, a quinoline derivative having a quinoline ligand, a benzoquinoline derivative, a quinoxaline derivative, a dibenzo quinoxaline derivative, a pyridine derivative, a bipyridine derivative, a pyrimidine derivative, and other electron transporting materials such as π-electron deficient type heteroaromatic compounds containing nitrogen heteroaromatic compounds can be used.

[0156] The electron injection layer is a layer that injects electrons from the cathode into the electron transport layer, and a material with high electron injection property This is a layer containing [a certain substance]. Materials with high electron injection include alkali metals, alkaline earth metals, and [another substance]. Alternatively, those compounds can be used. Materials with high electron injection properties include those with electron transport properties. Composite materials containing both the material and a donor material (electron-donating material) can also be used.

[0157] The light-emitting layer 283 is a layer containing a light-emitting material. The light-emitting layer 283 emits one or more types of light. It may contain substances. Examples of luminescent substances include blue, purple, blue-violet, green, yellow-green, and yellow. Substances that emit light in various colors such as orange and red are used as appropriate. In addition, near-infrared light is used as the light-emitting material. It is also possible to use light-emitting materials.

[0158] Examples of luminescent materials include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials. It can be done.

[0159] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, and triphenylene derivatives. Body, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofluorene Dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrim Examples include din derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0160] Examples of phosphorescent materials include 4H-triazole skeletons, 1H-triazole skeletons, and imi Organometallic complexes having a dazole, pyrimidine, pyrazine, or pyridine skeleton. The form (especially iridium complexes) uses phenylpyridine derivatives having electron-withdrawing groups as ligands. Examples include organometallic complexes (especially iridium complexes), platinum complexes, and rare earth metal complexes.

[0161] The light-emitting layer 283 contains one or more organic compounds in addition to the light-emitting substance (guest material). It may contain host material, assist material, etc. One or more types of organic compounds In this case, either or both hole-transporting materials and electron-transporting materials can be used. Using one or more types of organic compounds, bipolar materials or TADF materials are used. That's fine.

[0162] The light-emitting layer 283 is, for example, a combination of phosphorescent material and holes that readily form excitation complexes. It is preferable to have a transportable material and an electron transportable material. Therefore, the energy transfer from the excited complex to the light-emitting material (phosphorescent material) is called ExTET (Ex Efficient luminescence using ciplex-triplet energy transfer This can be easily obtained. By selecting combinations that form excitation complexes that emit light, energy transfer can be controlled. This creates a smoother surface, allowing for efficient emission of light. This configuration enables high efficiency of the light-emitting element. It enables both low-voltage operation and long lifespan simultaneously.

[0163] As for combinations of materials that form excited complexes, the HOMO level of the hole transport material (highest) It is preferable that the occupied orbital level is greater than or equal to the HOMO level of the electron-transporting material. The LUMO level (lowest unoccupied orbital level) of the material is greater than or equal to the LUMO level of the electron transport material. This is preferable. The LUMO and HOMO levels of the material are determined by cyclic voltammetry. Derived from the electrochemical properties (reduction potential and oxidation potential) of the material measured by CV (Cold Voltage) measurement. It is possible.

[0164] The formation of excited complexes is, for example, the emission spectrum of hole transport materials, the emission spectrum of electron transport materials. The emission spectra of the individual molecules and the mixed film made by mixing these materials were compared, and the emission spectrum of the mixed film was determined. The vector shifts to a longer wavelength side than the emission spectrum of each material (or a new one is added to the longer wavelength side). This can be confirmed by observing phenomena (with a peak). Alternatively, hole transport Transient photoluminescence (PL) of material properties, transient PL of electron transport materials, and these materials The transient PL of mixed films containing a mixture of materials was compared, and the transient PL lifetime of the mixed film was compared to the transient PL lifetime of each material. Differences in transient response, such as having a longer lifespan component than life itself, or a larger proportion of the delay component. This can be confirmed by observing it. Furthermore, the transient PL mentioned above is transient electro It can also be read as luminescence (EL). In other words, transient EL of hole transport materials. The transient EL of electron-transporting materials and the transient EL of mixed films thereof were compared, and the transient response was determined. The formation of excited complexes can also be confirmed by observing the differences in the answers.

[0165] The active layer 273 contains a semiconductor. This semiconductor may be an inorganic semiconductor such as silicon, and Examples include organic semiconductors containing organic compounds. In this embodiment, the active layer 273 has An example of using an organic semiconductor as the semiconductor is shown. By using an organic semiconductor, the light-emitting layer 28 3 and the active layer 273 can be formed in the same way (for example, by vacuum deposition), and manufactured This is preferable because it allows for the standardization of equipment.

[0166] The n-type semiconductor material of the active layer 273 is fullerene (for example, C 60 , C 70 Examples include electron-accepting organic semiconductor materials such as fullerene derivatives. Fullerenes are, It has a shape similar to a soccer ball, and this shape is energetically stable. (Fullerene) In this case, both the HOMO and LUMO levels are deep (low). In fullerenes, the LUMO level is Because of its deep pores, it has extremely high electron-accepting properties. Usually, like benzene, When π-electron conjugation (resonance) spreads across a surface, electron-donating ability (donor ability) increases, but fullerenes Because it has a spherical shape, even though the π electrons are spread out widely, it has high electron-accepting properties. High electron-accepting ability allows for rapid and efficient charge separation, making it useful as a photodetector. Yes. C 60 , C 70 Both have a broad absorption band in the visible light region, and especially C 70 is C 60 Compared to other systems, it is preferable because it has a larger π-electron conjugation system and a broad absorption band in the long-wavelength region.

[0167] Furthermore, as materials for n-type semiconductors, metal complexes with a quinoline skeleton and benzoquinoline skeletons are also used. Metal complexes having a hexagram, metal complexes having an oxazole skeleton, metals having a thiazole skeleton Complex, oxadiazole derivative, triazole derivative, imidazole derivative, oxazo thiazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives, benzoquinol derivatives Dibenzoquinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyri Zin derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives Examples include rhodamine derivatives, triazine derivatives, and quinone derivatives.

[0168] The p-type semiconductor material of the active layer 273 is copper(II) phthalocyanine (Cop per(II) phthalocyanine (CuPc), tetraphenyldibenzo Tetraphenyldibenzoperiflanthene; DBP), Zinc Phthalocyanine (ZnPc) Examples include electron-donating organic semiconductor materials such as tin phthalocyanine (SnPc) and quinacridone. It can be done.

[0169] Furthermore, p-type semiconductor materials include carbazole derivatives, thiophene derivatives, and furan derivatives. Examples include conductors and compounds having an aromatic amine skeleton. Furthermore, as p-type semiconductor materials... For example, naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, Fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, Indol derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazol Calcium derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, ki Nacridone derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyf Examples include ruolene derivatives, polyvinylcarbazole derivatives, and polythiophene derivatives. .

[0170] The HOMO level of electron-donating organic semiconductor materials is the same as the HOM level of electron-accepting organic semiconductor materials. It is preferable that the LUMO level be shallower (higher) than the O level. LUMO level of electron-donating organic semiconductor materials It is preferable that the LUMO level is shallower (higher) than that of the electron-accepting organic semiconductor material.

[0171] As an electron-accepting organic semiconductor material, spherical fullerenes are used, and electron-donating organic semiconductors It is preferable to use an organic semiconductor material with a shape close to a plane as the main material. The offspring tend to gather together, and when molecules of the same type aggregate, the energy levels of the molecular orbitals Because it is nearby, carrier transportability can be improved.

[0172] For example, the active layer 273 is preferably formed by co-depositing an n-type semiconductor and a p-type semiconductor. Alternatively, the active layer 273 may be formed by stacking an n-type semiconductor and a p-type semiconductor.

[0173] Both low-molecular-weight compounds and high-molecular-weight compounds can be used for light-emitting and light-receiving elements. It may contain inorganic compounds. The layers constituting the light-emitting element and the light-receiving element are, By methods such as vapor deposition (including vacuum deposition), transfer, printing, inkjet, and coating. It can be formed.

[0174] The display device 280B shown in Figure 7B has the same structure for the light-receiving element 270PD and the light-emitting element 270R. It differs from the display device 280A in that it is a composite.

[0175] The light-receiving element 270PD and the light-emitting element 270R share an active layer 273 and a light-emitting layer 283R. To possess.

[0176] Here, the light-receiving element 270PD is combined with a light-emitting element that emits light with a longer wavelength than the light to be detected. A standard configuration is preferable. For example, a photodetector 270PD configured to detect blue light. This means that the configuration of one or both of the light-emitting elements 270R and 270G may be the same. Yes, it is possible. For example, a photodetector 270PD configured to detect green light has a light-emitting element 270R and A similar configuration can be achieved.

[0177] By making the light-receiving element 270PD and the light-emitting element 270R have a common configuration, the light-receiving element 2 Compared to a configuration in which 70PD and the light-emitting element 270R have layers that are made separately from each other, the film deposition process The number of steps and masks can be reduced. Therefore, the manufacturing process and production of the display device can be reduced. This can reduce manufacturing costs.

[0178] Furthermore, by making the light-receiving element 270PD and the light-emitting element 270R have a common configuration, light reception Compared to a configuration in which the element 270PD and the light-emitting element 270R have layers that create each other, This allows for a narrower margin for misalignment. This, in turn, allows for an increase in the aperture ratio of the pixels. This can improve the light extraction efficiency of the display device. This extends the lifespan of the light-emitting element. It is possible. Furthermore, the display device can display high brightness. It is also possible to increase the resolution of the image.

[0179] The light-emitting layer 283R has a light-emitting material that emits red light. The active layer 273 is more red than Organic compounds that absorb short-wavelength light (for example, green light and / or blue light) It possesses the following properties. The active layer 273 is less likely to absorb red light and absorbs light with wavelengths shorter than red light. It is preferable to have an organic compound that allows red light to be emitted from the light-emitting element 270R. The light is efficiently extracted, and the photodetector 270PD detects light with wavelengths shorter than red with high precision. It is possible.

[0180] Furthermore, in the display device 280B, the light-emitting element 270R and the light-receiving element 270PD have the same configuration. As an example, the light-emitting element 270R and the light-receiving element 270PD are of different thicknesses. It may have an optical adjustment layer.

[0181] The display device 280C shown in Figures 8A and 8B emits red (R) light and has a light receiving function. It has a light-emitting element 270SR, a light-emitting element 270G, and a light-emitting element 270B. The configuration of the optical element 270G and the light-emitting element 270B can be adapted from the display device 280A, etc.

[0182] The light-emitting element 270SR includes a pixel electrode 271, a hole injection layer 281, a hole transport layer 282, and an active Light layer 273, light-emitting layer 283R, electron transport layer 284, electron injection layer 285, and common electrode 27 The 5 is stacked in this order. The light-receiving element 270SR is exemplified in the display device 280B. The light-emitting element 270R and the light-receiving element 270PD have the same configuration.

[0183] Figure 8A shows the case where the light-emitting element 270SR functions as a light-emitting element. The light-emitting element 270B emits blue light, and the light-emitting element 270G emits green light. This shows an example of the 270SR emitting red light.

[0184] Figure 8B shows the case where the light-receiving element 270SR functions as a light-receiving element. The light-receiving element 270SR receives the blue light emitted by the light-receiving element 270B, and the light-receiving element 270G receives the blue light emitted by the light-receiving element 270G. This shows an example of receiving the green light it emits.

[0185] The light-emitting element 270B, the light-emitting element 270G, and the light-receiving element 270SR are, respectively, pixels. It has an electrode 271 and a common electrode 275. In this embodiment, the pixel electrode 271 is the anode. The following example illustrates the function where the common electrode 275 functions as the cathode. The 270SR is driven by applying a reverse bias between the pixel electrode 271 and the common electrode 275. Then, light incident on the light-emitting element 270SR is detected, an electric charge is generated, and it is extracted as an electric current. It is possible.

[0186] The light-emitting element 270SR can be described as having a configuration in which an active layer 273 is added to the light-emitting element. In other words, by simply adding a step of forming an active layer 273 to the manufacturing process of the light-emitting element, The light-emitting element 270SR can be formed in parallel with the formation of the optical element. The light-emitting and receiving elements can be formed on the same substrate. Therefore, the manufacturing process can be significantly reduced. Without compromising quality, it is possible to add either or both imaging and sensing functions to the display unit. can.

[0187] The stacking order of the light-emitting layer 283R and the active layer 273 is not limited. In Figures 8A and 8B, holes An active layer 273 is provided on the transport layer 282, and a light-emitting layer 283R is provided on the active layer 273. An example is shown. The stacking order of the light-emitting layer 283R and the active layer 273 may be reversed.

[0188] Furthermore, the light-emitting and receiving element includes a hole injection layer 281, a hole transport layer 282, an electron transport layer 284, and The electron injection layer 285 does not necessarily have to have at least one layer. Also, the light-emitting and receiving element is It may also have other functional layers, such as a hole blocking layer or an electron blocking layer.

[0189] In a light-receiving device, a conductive film that transmits visible light is used for the electrode that extracts light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light. .

[0190] The function and materials of each layer constituting the light-emitting and light-receiving elements are as follows: Since it is similar to the function and materials, a detailed explanation will be omitted.

[0191] Figures 8C to 8G show examples of stacked structures of light-emitting and receiving devices.

[0192] The light-emitting and receiving device shown in Figure 8C consists of a first electrode 277, a hole injection layer 281, and a hole transport layer 282. , light-emitting layer 283R, active layer 273, electron transport layer 284, electron injection layer 285, and second electron It has pole 278.

[0193] Figure 8C shows that a light-emitting layer 283R is provided on the hole transport layer 282, and an active layer is provided on the light-emitting layer 283R. This is an example of layer 273 being stacked.

[0194] As shown in Figures 8A to 8C, the active layer 273 and the light-emitting layer 283R are in contact with each other. That's fine.

[0195] Furthermore, it is preferable that a buffer layer be provided between the active layer 273 and the light-emitting layer 283R. In this case, it is preferable that the buffer layer has hole transport and electron transport properties. For example, it is preferable to use a bipolar material for the buffer layer. Alternatively, the buffer The layers include a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, a hole blocking layer, and an electron At least one of the child block layers can be used. Figure 8D shows a buffer layer and An example using the hole transport layer 282 is shown.

[0196] By providing a buffer layer between the active layer 273 and the light-emitting layer 283R, the light-emitting layer 283R This suppresses the transfer of excitation energy to the active layer 273. Furthermore, by using a buffer layer Furthermore, the optical path length (cavity length) of the microcavity structure can also be adjusted. Therefore, from a light-emitting / receiving element having a buffer layer between the active layer 273 and the light-emitting layer 283R, high High luminous efficiency can be obtained.

[0197] Figure 8E shows a hole injection layer 281 with a hole transport layer 282-1, an active layer 273, and a hole transport layer 2 This is an example of a laminated structure in which 82-2 and the light-emitting layer 283R are stacked in that order. Hole transport layer 28 Layer 2-2 functions as a buffer layer. It consists of hole transport layers 282-1 and 281-2. The hole transport layer may contain the same material or different materials. Instead of 281-2, you may use a layer that can be used as a buffer layer as described above. Alternatively, the positions of the active layer 273 and the light-emitting layer 283R may be swapped.

[0198] The light-emitting element shown in Figure 8F does not have a hole transport layer 282, unlike the light-emitting element shown in Figure 8A. It is different from the child. Thus, the light-emitting element has a hole injection layer 281, a hole transport layer 282, and an electron transport layer. The device does not necessarily have to have at least one of the electron feeding layer 284 and the electron injection layer 285. The light-emitting and receiving element may also have other functional layers, such as a hole blocking layer or an electron blocking layer. .

[0199] The light-emitting device shown in Figure 8G does not have an active layer 273 and an emissive layer 283R, and the emissive layer and active It differs from the light-emitting / receiving device shown in Figure 8A in that it has a layer 289 that also serves as a layer.

[0200] For example, the layer 289 that serves as both the light-emitting layer and the active layer can be used as the active layer 273. An n-type semiconductor, a p-type semiconductor that can be used in the active layer 273, and a light-emitting layer 283R A layer containing three materials, including a light-emitting substance, can be used.

[0201] Furthermore, the absorption spectrum of a mixed material of n-type and p-type semiconductors is shown for the lowest energy side. The absorption band and the maximum peak of the emission spectrum (PL spectrum) of the luminescent material overlap with each other. It is preferable not to be in contact with each other, and even more preferable to be sufficiently far apart.

[0202] [Example of display device configuration 4] The following describes a more specific configuration of a display device according to one aspect of the present invention.

[0203] Figure 9 shows a perspective view of the display device 200, and Figure 10A shows a cross-sectional view of the display device 200.

[0204] The display device 200 has a configuration in which substrate 151 and substrate 152 are bonded together. (Figure 9) The circuit board 152 is clearly indicated by a dashed line.

[0205] The display device 200 includes a display unit 262, a circuit 264, wiring 265, etc. Figure 9 shows the display This shows an example where IC (integrated circuit) 274 and FPC 272 are mounted on device 200. Therefore, the configuration shown in Figure 9 is a display module having a display device 200, an IC, and an FPC. It can also be called a "ru".

[0206] For example, a scan line drive circuit can be used as circuit 264.

[0207] The wiring 265 has the function of supplying signals and power to the display unit 262 and the circuit 264. The signal and power are input to wiring 265 from an external source via FPC272, or The signal is input from IC274 to wiring 265.

[0208] Figure 9 shows the COG (Chip On Glass) method or COF (Chip On Glass) method. This shows an example where IC274 is provided on substrate 151 using a film method, etc. 74 can be an IC that has, for example, a scan line drive circuit or a signal line drive circuit. The display device 200 and the display module may be configured without an IC. C may be implemented on the FPC using the COF method or similar.

[0209] Figure 10A shows a portion of the region including the FPC272 of the display device 200 shown in Figure 9, and circuit 2 A portion of the area including 64, a portion of the area including the display unit 262, and a portion of the area including the end An example of the cross-section when each is cut is shown.

[0210] The display device 200 shown in Figure 10A has a transistor 20 between substrate 151 and substrate 152. 8, transistor 209, transistor 210, light-emitting element 190, light-receiving element 110, and It has a light-emitting element 160, etc.

[0211] Transistors 208, 209, and 210 are all located on the circuit board. These transistors are formed on 151. These transistors are made from the same materials and using the same process. It can be manufactured.

[0212] Transistors 208, 209, and 210 are gates. Functional conductive layer 221, insulating layer 211 functioning as a gate insulating layer, channel forming region 2 A semiconductor layer having 31i and a pair of low-resistance regions 231n, one of the pair of low-resistance regions 231n A conductive layer 222a connects to one side, and a conductive layer 222 connects to the other side of the pair of low-resistance regions 231n. b. An insulating layer 225 that functions as a gate insulating layer, a conductive layer 223 that functions as a gate, and Furthermore, it has an insulating layer 215 that covers the conductive layer 223. The insulating layer 211 is connected to the conductive layer 221. It is located between the flannel-forming region 231i and the insulating layer 225, which forms a channel with the conductive layer 223. It is located between region 231i and region 231i.

[0213] The conductive layer 222a and the conductive layer 222b are provided on the insulating layer 225 and the insulating layer 215, respectively. The conductive layer 222a and conductive layer 22 are connected to the low-resistance region 231n through the cut-out opening. Of the two components (2b), one functions as the source and the other as the drain.

[0214] The structure of the transistors in the display device of this embodiment is not particularly limited. For example, Using Lehner-type transistors, staggered transistors, inverse staggered transistors, etc. It is possible to use either a top-gate or bottom-gate transistor structure. Alternatively, gates may be provided above and below the semiconductor layer in which the channel is formed. That's fine.

[0215] Transistors 208, 209, and 210 have channels A configuration is applied in which the semiconductor layer to be formed is sandwiched between two gates. The transistors may then be driven by supplying them with the same signal. Of the two gates, one is given a potential to control the threshold voltage, and the other is used for driving. The threshold voltage of the transistor may be controlled by applying a potential.

[0216] The crystallinity of semiconductor materials used in transistors is not particularly limited; amorphous semiconductors are also available. Single-crystal semiconductors, or semiconductors with crystalline properties other than single crystals (microcrystalline semiconductors, polycrystalline semiconductors) Either a single-crystal semiconductor or a semiconductor having a crystalline region in part may be used. Using a crystalline semiconductor is preferable because it suppresses the degradation of transistor characteristics.

[0217] The semiconductor layer of a transistor preferably contains a metal oxide (also called an oxide semiconductor). Alternatively, the semiconductor layer of the transistor may have silicon. For example, amorphous silicon, crystalline silicon (low-temperature polysilicon, single-crystal silicon) Examples include:

[0218] The semiconductor layer is, for example, made of indium and M (where M is gallium, aluminum, silicon). Boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, gelatin Lumanium, Zirconium, Molybdenum, Lanthanum, Cerium, Neodymium, Hafnium, (One or more selected from tantalum, tungsten, and magnesium), and zinc It is preferable that it has, in particular M is aluminum, gallium, yttrium, and It is preferable that the material be one or more species selected from tin.

[0219] In particular, indium (In), gallium (Ga), and zinc (Zn) are used as semiconductor layers. It is preferable to use an oxide containing IGZO.

[0220] When the semiconductor layer is In-M-Zn oxide, the In-M-Zn oxide film is used to form the film. For sputtering targets, it is preferable that the atomic ratio of In is greater than or equal to the atomic ratio of M. i. As an atomic ratio of metal elements in such a sputtering target, In:M:Zn =1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=2:1:3, In: M:Zn=3:1:2, In:M:Zn=4:2:3, In:M:Zn=4:2:4.1 , In:M:Zn=5:1:3, In:M:Zn=5:1:6, In:M:Zn=5:1 :7, In:M:Zn=5:1:8, In:M:Zn=10:1:3, In:M:Zn= Examples include 6:1:6 and In:M:Zn=5:2:5.

[0221] When using a target containing a polycrystalline oxide as a sputtering target, This is preferable because it facilitates the formation of a semiconductor layer having crystalline properties. The atom ratio is the positive or negative ratio of the atomic number of metal elements contained in the sputtering target described above. This includes a 40% variation. For example, the composition of the sputtering target used for the semiconductor layer is In the case of In:Ga:Zn = 4:2:4.1 [atomic ratio], the composition of the semiconductor layer to be deposited is: In some cases, the ratio of In:Ga:Zn may be in the vicinity of 4:2:3 [atomic ratio].

[0222] Note that when the atomic ratio is stated as In:Ga:Zn=4:2:3 or close to it, In When we set the ratio to 4, this includes the case where Ga is between 1 and 3, and Zn is between 2 and 4. Furthermore, when stating that the atomic ratio is In:Ga:Zn = 5:1:6 or close to it, When n is set to 5, Ga is greater than 0.1 and less than or equal to 2, and Zn is between 5 and 7. This includes cases where the atomic ratio is In:Ga:Zn = 1:1:1 or close to it. When listing, if In is set to 1, Ga must be greater than 0.1 and less than or equal to 2, and Zn must be 0. This includes cases where the value is greater than 1 and less than or equal to 2.

[0223] The transistors in circuit 264 and the transistors in display unit 262 have the same structure. It may be, or it may be a different structure. The multiple transistors in circuit 264 The structure may be the same for all, or there may be two or more types. Similarly, the display unit 262 may The structures of the multiple transistors may all be the same, or there may be two or more different structures.

[0224] The insulating layer 214 is provided covering the transistor and functions as a planarization layer. The number of gate insulating layers and insulating layers covering the transistor are not limited; each can be a single layer. It is acceptable to have two or more layers.

[0225] Impurities such as water or hydrogen do not diffuse into at least one layer of the insulating layer covering the transistor. It is preferable to use a pile material. This allows the insulating layer to function as a barrier layer. This is possible. With this configuration, impurities from the outside diffuse into the transistor. This can effectively suppress the problem and improve the reliability of the display device.

[0226] Figure 10A shows an example in which the insulating layer 225 covers the top and sides of the semiconductor layer. On the other hand, In the transistor 202 shown in Figure 10B, the insulating layer 225 is channel-shaped of the semiconductor layer 231. It overlaps with the forming region 231i, but does not overlap with the low-resistance region 231n. For example, the conductive layer 223 By using it as a mask and processing the insulating layer 225, the structure shown in Figure 10B can be fabricated. In Figure 10B, an insulating layer 215 is provided covering the insulating layer 225 and the conductive layer 223, and the insulating layer Through the opening 215, conductive layer 222a and conductive layer 222b each form a low-resistance region 231 It is connected to n. Furthermore, an insulating layer 218 covering the transistor may be provided.

[0227] Insulating layers 211, 225, and 215 are each made of inorganic insulating films. It is preferable that it be present. Examples of inorganic insulating films include silicon nitride films and silicon oxide nitride films. Films, silicon oxide films, silicon nitride films, aluminum oxide films, aluminum nitride films, etc. Any inorganic insulating film can be used. Also, hafnium oxide film, yttrium oxide film, Zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, ranyl oxide Tan film, cerium oxide film, neodymium oxide film, etc. may also be used. Two or more layers may be used.

[0228] Here, organic insulating films often have lower barrier properties compared to inorganic insulating films. Therefore, The insulating film preferably has an opening near the edge of the display device 200. This makes it possible to suppress the diffusion of impurities from the end of the device 200 through the organic insulating film. Alternatively, the edges of the organic insulating film may be positioned inward from the edges of the display device 200. An insulating film may be formed so that the organic insulating film is not exposed at the edges of the display device 200.

[0229] An organic insulating film is preferred for the insulating layer 214, which functions as a planarizing layer. The materials that can be used include acrylic resin, polyimide resin, epoxy resin, poly Mido resin, polyimidoamide resin, siloxane resin, benzocyclobutene resin, pheno Examples include resins and precursors of these resins.

[0230] In the region 228 shown in Figure 10A, an opening is formed in the insulating layer 214. This allows, Even when an organic insulating film is used for the insulating layer 214, the display can be seen from the outside through the insulating layer 214. The diffusion of impurities into part 262 can be suppressed. Therefore, the reliability of the display device 200 is improved. It can be improved.

[0231] The light-emitting element 190 consists of a pixel electrode 191, a common layer 114, and a light-emitting layer 196, from the insulating layer 214 side. The light-emitting element 19 has a stacked structure in which a common layer 115 and a common electrode 113 are stacked in that order. The pixel electrode 191 of 0 is connected to a pair of low-resistance regions of transistor 208 via the conductive layer 222b. It is electrically connected to one side of 231n. Transistor 208 drives the light-emitting element 190. It has a control function. The end of the pixel electrode 191 is covered by a partition wall 216. The elementary electrode 191 contains a material that reflects visible light, and the common electrode 113 contains a material that transmits visible light. include.

[0232] The light-receiving element 110 consists of a pixel electrode 111, a common layer 114, and an active layer 116, from the insulating layer 214 side. The photodetector 11 has a stacked structure in which a common layer 115 and a common electrode 113 are stacked in that order. The pixel electrode 111 of 0 is connected to a pair of low-resistance regions of transistor 209 via the conductive layer 222b. It is electrically connected to the other side of 231n. The end of the pixel electrode 111 is covered by the partition wall 216. The pixel electrode 111 contains a material that reflects visible light and infrared light, and the common electrode 113 This includes materials that transmit visible light and infrared light.

[0233] The light emitted by the light-emitting element 190 is emitted towards the substrate 152. In addition, the light-receiving element 110 Light is incident on the substrate 152. The substrate 152 is transparent to visible light and infrared light. It is preferable to use a material with high properties.

[0234] Pixel electrodes 111 and 191 can be manufactured using the same material and the same process. The common layer 114, common layer 115, and common electrode 113 are connected to the light-receiving element 110 and the light-emitting element 1 It is used in both with 90. The light-receiving element 110 and the light-emitting element 190 are the active layer 116 and light-emitting element. Except for the different configuration of layer 196, all other components can be the same. This allows for a more efficient manufacturing process. The light-receiving element 110 can be incorporated into the display device 200 without significantly increasing the size.

[0235] Furthermore, an inorganic insulating layer 195a and an organic insulating layer cover the light-receiving element 110 and the light-emitting element 190. Layers 195b and 195c are laminated together. A light-shielding layer 145 and a light-emitting element 160 are laminated on c. The light-emitting element 160 overlaps with the light-receiving area of ​​the light-receiving element 110 and the light-emitting area of ​​the light-emitting element 190. It is located in a place where there is no other option.

[0236] In the display device 200, the organic insulating layer 195b corresponds to the resin layer 141.

[0237] The edges of the inorganic insulating layer 195a and the edges of the inorganic insulating layer 195c are connected to the edges of the organic insulating layer 195b. It extends outward from the other and is in contact with each other. And the inorganic insulating layer 195a is in contact with the insulating layer 214 The insulating layer 215 (inorganic insulating layer) comes into contact with the insulating layer 215 (inorganic insulating layer) through an opening in the (organic insulating layer). This provides insulation The edge layer 215 and the protective layer 195 can surround the light-receiving element 110 and the light-emitting element 190. Therefore, the reliability of the light-receiving element 110 and the light-emitting element 190 can be improved.

[0238] Thus, the protective layer 195 may have a laminated structure of an organic insulating film and an inorganic insulating film. In this case, it is preferable that the end of the inorganic insulating film extends outward more than the end of the organic insulating film. .

[0239] The light-shielding layer 145 has openings at positions overlapping with the light-receiving element 110 and at positions overlapping with the light-emitting element 190. It has a light-shielding layer 145 that controls the range in which the light-receiving element 110 detects light. This is possible. In addition, by having the light-shielding layer 145, the light-emitting element 190 and the light-emitting element 160 This suppresses direct light incidence on the photodetector 110. Therefore, there is less noise. This enables the creation of highly sensitive sensors.

[0240] The light-emitting element 160 consists of an electrode 161, a buffer layer 164, and a light-emitting layer 166, from the light-shielding layer 145 side. It has a laminated structure in which a buffer layer 165 and an electrode 163 are stacked in that order. The ends are covered by an insulating layer 217. The electrode 161 contains a material that reflects infrared light. Electrode 163 contains a material that transmits visible light and infrared light.

[0241] The buffer layer 164, the light-emitting layer 166, and the buffer layer 165 have island-shaped upper surfaces. Furthermore, the electrode 163 covers the buffer layer 164, the light-emitting layer 166, and the buffer layer 165. It is provided as follows: Buffer layer 164, light-emitting layer 166, buffer layer 165, and electrode 1 63 is positioned so as not to overlap with the light-receiving area of ​​the light-receiving element 110 and the light-emitting area of ​​the light-emitting element 190. It is provided.

[0242] A resin layer 142 is provided covering the insulating layer 217 and the light-emitting element 160, and on the resin layer 142 A substrate 152 is provided on it. The resin layer 142 bonds the substrate 151 and the substrate 152 together. It functions as an adhesive layer.

[0243] A connection portion 204 is provided in the area of ​​substrate 151 where substrate 152 does not overlap. In the connecting section 204, the wiring 265 is connected to the FPC 272 via the conductive layer 266 and the connecting layer 242. They are electrically connected. The upper surface of the connection part 204 is made of the same conductive film as the pixel electrode 191. The conductive layer 266 obtained is exposed. This allows the connection part 204 and the FPC 272 to be It can be electrically connected via the connecting layer 242.

[0244] Various optical components can be placed on the outside of the substrate 152. These optical components include polarizing elements. Examples include plates, phase difference plates, light diffusion layers (such as diffusion films), anti-reflective layers, and light-gathering films. Furthermore, the outside of the substrate 152 has an antistatic film to suppress the adhesion of dust and dirt. A water-repellent film to prevent damage, a hard coat film to suppress scratches during use, an impact-absorbing layer, etc. You may place it there.

[0245] Substrates 151 and 152 are made of glass, quartz, ceramic, and sapphire, respectively. A flexible material can be used for substrates 151 and 152. Using this method can increase the flexibility of the display device.

[0246] The adhesive layer can be a photocuring adhesive such as an UV-curing type, a reaction-curing adhesive, or a thermosetting adhesive. Various types of curing adhesives, such as anaerobic adhesives, can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imi Plastic resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, E Examples include VA (ethylene vinyl acetate) resin. In particular, the moisture permeability of epoxy resins, etc. Materials with low properties are preferred. A two-part resin mixture may also be used. Furthermore, adhesive sheets, etc. You may use it.

[0247] The connecting layer 242 is an anisotropic conductive film (ACF: Anisotropic Co Anisotropic conductive paste (ACP) You can use methods such as Conductive Paste.

[0248] Here, the light-emitting element 190 and the light-emitting element 160 are top-emission type light-emitting elements. Although the child was applied, the light-emitting element is a top-emission type, bottom-emission type, dual Examples include light emission types. The electrode that extracts light uses a conductive film that transmits visible light. It is also preferable to use a conductive film that reflects visible light on the electrode that does not extract light. It seems so.

[0249] The light-emitting element has at least a light-emitting layer. The light-emitting element has a layer other than the light-emitting layer, such as a hole injection layer. Materials with high hole transport properties, materials with high hole transport properties, hole-blocking materials, materials with high electron transport properties, electron Blocking materials, or bipolar materials (materials with high electron transport and hole transport properties), etc. It may further include layers. For example, the common layer on the pixel electrode side may include a hole injection layer and holes It is preferable to have one or both of the transport layers. For example, the common layer on the common electrode side is an electron transport layer. It is preferable to have either or both a transmission layer and an electron injection layer.

[0250] Both low-molecular-weight compounds and high-molecular-weight compounds can be used for each common layer and the light-emitting layer. It may contain inorganic compounds. Each common layer and the layer constituting the light-emitting layer is, Formed by methods such as vapor deposition (including vacuum deposition), transfer, printing, inkjet, and coating. It is possible.

[0251] The light-emitting layer may contain an inorganic compound such as quantum dots as a light-emitting material.

[0252] The active layer 116 of the photodetector 110 includes a semiconductor. This semiconductor may be silicon, for example. Examples include inorganic semiconductors and organic semiconductors containing organic compounds. In this embodiment, active This section shows an example of using an organic semiconductor as the semiconductor material for the layer. By using an organic semiconductor, The light-emitting layer 196 of the light-emitting element 190 and the active layer 116 of the light-receiving element 110 are connected in the same way (for example) It is preferable because it can be formed by vacuum deposition and the manufacturing equipment can be standardized.

[0253] The n-type semiconductor material of the active layer 116 is fullerene (for example, C 60 , C 70 Examples include electron-accepting organic semiconductor materials such as fullerene derivatives. Fullerenes are, It has a shape similar to a soccer ball, and this shape is energetically stable. (Fullerene) In this case, both the HOMO and LUMO levels are deep (low). In fullerenes, the LUMO level is Because of its deep pores, it has extremely high electron-accepting properties. Usually, like benzene, When π-electron conjugation (resonance) spreads across a surface, electron-donating ability (donor ability) increases, but fullerenes Because it has a spherical shape, even though the π electrons are spread out widely, it has high electron-accepting properties. High electron-accepting ability allows for rapid and efficient charge separation, making it useful as a photodetector. Yes. C 60 , C 70 Both have a broad absorption band in the visible light region, and especially C 70 is C 60 Compared to other systems, it is preferable because it has a larger π-electron conjugation system and a broad absorption band in the long-wavelength region.

[0254] Furthermore, the n-type semiconductor material of the active layer 116 is a metal complex having a quinoline skeleton. Body, metal complex having a benzoquinoline skeleton, metal complex having an oxazole skeleton, thiazo Metal complexes having a metal skeleton, oxadiazole derivatives, triazole derivatives, imidazo oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives Derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoline derivatives, pi Lysine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene Examples include derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, and quinone derivatives. It is possible.

[0255] The p-type semiconductor material of the active layer 116 is copper(II) phthalocyanine (Cop per(II) phthalocyanine (CuPc), tetraphenyldibenzo Tetraphenyldibenzoperiflanthene; DBP), Zinc Phthalocyanine (ZnPc) Examples include electron-donating organic semiconductor materials such as tin phthalocyanine (SnPc) and quinacridone. It can be done.

[0256] Furthermore, p-type semiconductor materials include carbazole derivatives, thiophene derivatives, and furan derivatives. Examples include conductors and compounds having an aromatic amine skeleton. Furthermore, as p-type semiconductor materials... For example, naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, Fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, Indol derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazol Calcium derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, ki Nacridone derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyf Examples include ruolene derivatives, polyvinylcarbazole derivatives, and polythiophene derivatives. .

[0257] For example, the active layer 116 is preferably formed by co-depositing an n-type semiconductor and a p-type semiconductor. Alternatively, the active layer 116 may be formed by stacking an n-type semiconductor and a p-type semiconductor.

[0258] In addition to the gate, source, and drain of a transistor, various wirings that constitute a display device and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, and chromium. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten Examples include metals such as tungsten, and alloys in which such metals are the main component. A film containing this material can be used as a single layer or as a multilayer structure.

[0259] Furthermore, examples of conductive materials that are translucent include indium oxide, indium tin oxide, and indium tin oxide. Conductive oxides or graphites such as zinc oxide, zinc oxide, and zinc oxide containing gallium You can use silver, platinum, magnesium, nickel, or tungsten. Metal materials such as tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium. Alternatively, an alloy material containing the metal material can be used. Or, a nitride of the metal material. (For example, titanium nitride) may be used. Note that metal materials, alloy materials (or similar materials) When using nitrides, it is preferable to make them thin enough to be translucent. A laminated film of the aforementioned material can be used as a conductive layer. For example, an alloy of silver and magnesium and Using a multilayer film of indium tin oxide is preferable because it can improve conductivity. These include conductive layers such as various wirings and electrodes that constitute the display device, or display elements. It can also be used as a conductive layer (a conductive layer that functions as a pixel electrode or a common electrode). .

[0260] Examples of insulating materials that can be used for each insulating layer include acrylic resin and epoxy resin. Resins such as fats, silicon oxide, silicon oxide nitride, silicon nitride, silicon oxide, acid Examples include inorganic insulating materials such as aluminum oxide and hafnium oxide.

[0261] [About metal oxides] The following section describes metal oxides applicable to semiconductor layers.

[0262] In this specification, metal oxides containing nitrogen are also referred to as metal oxides (metal oxides). They are sometimes collectively referred to as metal oxynitrides (metal oxides). Also, metal oxides containing nitrogen are sometimes called metal oxynitrides (metal oxides). It may also be called tal oxynitride. For example, zinc oxynitride (ZnON) Metal oxides containing nitrogen, such as those mentioned above, may be used in the semiconductor layer.

[0263] Furthermore, in this specification, etc., CAAC (c-axis aligned crystal l) and when referring to CAC (Cloud-Aligned Composite) CAAC represents an example of a crystal structure, while CAC represents an example of a function or material composition. .

[0264] For example, the semiconductor layer is CAC (Cloud-Aligned Composite)- OS (Oxide Semiconductor) can be used.

[0265] CAC-OS or CAC-metal oxide is a material in which some parts are conductive. It has both electrical and insulating properties in some parts of the material, and the material as a whole has semiconductor properties. Furthermore, CAC-OS or CAC-metal oxide is used in the semiconductor of transistors. When used in body layers, the conductive function is the ability to conduct electrons (or holes) that act as carriers. Yes, the insulating function is the function of preventing the flow of electrons, which act as carriers. Conductive function and insulating function By having the relationship function and the other function work complementaryly, the switching function (On / The function to turn off the CAC-OS or CAC-metal oxide is added to the CAC-OS or CAC-metal oxide. This is possible. In CAC-OS or CAC-metal oxide, each By separating the functions, it is possible to maximize the performance of both.

[0266] Furthermore, CAC-OS or CAC-metal oxide provides conductive and insulating properties. It has conductive regions. The conductive regions have the conductive function described above, and the insulating regions have the insulating function described above. It has the function of being conductive. Furthermore, within the material, the conductive region and the insulating region are separated by nanoparticles. In some cases, they are separated by a bell. Also, conductive regions and insulating regions are located within the material. It may be unevenly distributed. Also, the conductive region appears blurred around the edges and connected in a cloud-like manner when observed. There are cases where this can happen.

[0267] Furthermore, in CAC-OS or CAC-metal oxide, the conductive region and The insulating region is defined as 0.5 nm to 10 nm, preferably 0.5 nm to 3 nm. They may be dispersed in the material in sizes smaller than m.

[0268] Furthermore, CAC-OS or CAC-metal oxide have different band gaps. It is composed of components having [a certain characteristic]. For example, CAC-OS or CAC-metal ox The ide consists of a component with a wide gap due to the insulating region and a component with a wide gap due to the conductive region. It consists of a component having a narrow gap. In this configuration, when the carrier is flowing... In components with a narrow gap, the carrier mainly flows. The component with a gap acts complementaryly with the component with a wide gap, and the component with a narrow gap In conjunction with the components that perform this action, carriers also flow to components with a wide gap. Therefore, the above CAC-OS or CAC-metal oxide in the channel formation region of the transistor When used in this way, a high current driving force, i.e., a large on-current, is required in the transistor's on state. Furthermore, high field-effect mobility can be obtained.

[0269] In other words, CAC-OS or CAC-metal oxide is a matrix composite Material (matrix composite), or metal matrix composite material (metal It can also be called a matrix composite.

[0270] Oxide semiconductors (metal oxides) include single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. It can be divided into conductors and non-single-crystal oxide semiconductors, for example, CAAC-OS(c- axis aligned crystalline oxide semiconductor ctor), polycrystalline oxide semiconductor, nc-OS (nanocrystalline oxide IDE semiconductor, pseudo-amorphous oxide semiconductor (a-like OS (amorphous-like oxide semiconductor), and non Examples include crystalline oxide semiconductors.

[0271] CAAC-OS has c-axis orientation and multiple nanocrystals are linked in the ab-plane direction. It has a crystalline structure that is linked and distorted. Note that distortion refers to the linkage between multiple nanocrystals. Within a region, between a region with a aligned grid arrangement and another region with a aligned grid arrangement, the grid arrangement This refers to the point where the orientation has changed.

[0272] Nanocrystals are based on a hexagonal shape, but they are not necessarily regular hexagons; they can also be non-regular hexagonal. There are also cases where the distortion has a grid arrangement such as pentagons and heptagons. Oh, in CAAC-OS, even near strain, there are clear grain boundaries. It is difficult to confirm this, also known as Lee. That is, due to the distortion of the lattice arrangement, the crystal grain It can be seen that the formation of the boundary is suppressed. This is because CAAC-OS is in the ab-plane direction. The arrangement of oxygen atoms is not dense, or the bond distance between atoms is reduced due to the substitution of metal elements. This is because distortion can be tolerated due to changes in the distance between the elements.

[0273] Furthermore, CAAC-OS consists of a layer containing indium and oxygen (hereinafter referred to as the In layer), and elements A layered crystalline structure in which layers containing M, zinc, and oxygen (hereinafter referred to as (M,Zn) layers) are stacked. It tends to have a layered structure (also called a layered structure). Note that indium and element M are mutually substituted. It is possible, and if element M in the (M,Zn) layer is replaced with indium, the (In,M,Zn) layer It can also be expressed as follows. Furthermore, if the indium in the In layer is substituted with element M, then (In,M) It can also be described as a layer.

[0274] CAAC-OS is a highly crystalline metal oxide. On the other hand, CAAC-OS has a clear bond. Because it is difficult to confirm grain boundaries, a decrease in electron mobility caused by grain boundaries is less likely to occur. It can be said that... Also, the crystallinity of metal oxides is affected by the inclusion of impurities or the formation of defects. CAAC-OS may decrease in quality due to impurities or defects (oxygen deficiency (V) O :oxy Also called gen vacancy. It can also be said to be a metal oxide with low gen vacancy. Metal oxides containing CAAC-OS have stable physical properties. Therefore, CAAC- Metal oxides containing OS are heat-resistant and highly reliable.

[0275] nc-OS is used in minute regions (for example, regions between 1 nm and 10 nm, especially regions larger than 1 nm). It has periodicity in the atomic arrangement in the region of 3 nm or less. Also, nc-OS has different na No regularity is observed in the crystal orientation between the crystals. Therefore, no orientation is observed throughout the entire film. Therefore, depending on the analytical method, nc-OS may be a-like OS or amorphous oxide. It can sometimes be indistinguishable from a semiconductor.

[0276] Furthermore, indium is a type of metal oxide containing indium, gallium, and zinc. Um-gallium-zinc oxide (hereinafter referred to as IGZO) is stable when formed into the nanocrystals described above. It may take on a structure. In particular, IGZO tends to have difficulty growing crystals in the atmosphere. Smaller crystals (for example) are preferable to larger crystals (here, crystals of a few millimeters or a few centimeters). In some cases, using the aforementioned nanocrystal structure may result in greater structural stability.

[0277] a-like OS is a metallic acid having a structure between nc-OS and amorphous oxide semiconductors. It is a monster. a-like OS has porous or low-density regions. That is, a-li ke OS has lower crystallinity compared to nc-OS and CAAC-OS.

[0278] Oxide semiconductors (metal oxides) can take on diverse structures, each possessing different properties. An oxide semiconductor according to one aspect of the present invention is an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, and a-li It may have two or more of the following: ke OS, nc-OS, and CAAC-OS.

[0279] The metal oxide film, which functions as a semiconductor layer, is either an inert gas or an oxygen gas. Both can be used to form the film. Note that the oxygen flow rate during metal oxide film formation is also important. There are no particular limitations on the ratio (oxygen partial pressure). However, to obtain a transistor with high field-effect mobility... In this case, the oxygen flow rate ratio (oxygen partial pressure) during the formation of the metal oxide film is 0% or higher. Preferably 30% or less, more preferably 5% to 30%, and even more preferably 7% to 15%. It is preferable.

[0280] The metal oxide preferably has an energy gap of 2 eV or more, and 2.5 eV or less. It is more preferable that it be above, and even more preferable that it be 3eV or more. In this way, By using metal oxides with a wide energy gap, the off-current of the transistor is reduced. It is possible.

[0281] The substrate temperature during metal oxide film formation is preferably 350°C or lower, and is between room temperature and 200°C. More preferably, and even more preferably above room temperature and below 130°C. Substrate during metal oxide film formation. A room temperature is preferable because it can increase productivity.

[0282] Metal oxide films can be formed by sputtering. In addition, for example, P LD method, PECVD method, thermal CVD method, ALD method, vacuum deposition method, etc. may be used.

[0283] The above is an explanation of metal oxides.

[0284] The display device of this embodiment has a light-receiving element and a light-emitting element in the display unit, and the display unit displays an image. It has both a display function and a light detection function. This allows the display unit to be external or display Compared to cases where sensors are installed externally, it is possible to make electronic devices smaller and lighter. It can also be combined with sensors installed outside the display unit or outside the display device to enable more... It is also possible to realize functional electronic devices.

[0285] The light-receiving element has at least one layer other than the active layer that is the same configuration as the light-emitting element (EL element). Furthermore, the light-receiving element has all layers other than the active layer as light-emitting elements (EL elements). ) can also be made to have the same configuration as ). For example, the process of fabricating the light-emitting element can involve depositing the active layer. By simply adding a step, the light-emitting element and the light-receiving element can be formed on the same substrate. Furthermore, the light-receiving element and the light-emitting element use the same material for the pixel electrode and the common electrode, respectively. It can be formed in the process. Also, a circuit electrically connected to a light-receiving element and a light-emitting element By manufacturing electrically connected circuits using the same materials and processes, a display device can be created. The manufacturing process can be simplified. In this way, a light-receiving element can be incorporated without complex processes. This allows for the creation of highly convenient display devices.

[0286] The configuration examples illustrated in this embodiment, and the corresponding drawings, etc., are at least a part of them. This can be combined with other configuration examples or drawings as appropriate.

[0287] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0288] (Embodiment 2) This embodiment describes an electronic device according to one aspect of the present invention.

[0289] [Example of electronic device configuration] A display device according to one aspect of the present invention acquires various biological information using infrared light and visible light. This can be done. Such biometric information can be used for both user authentication and healthcare purposes. It can be used by [person / group].

[0290] Among the biometric information that can be obtained using a display device according to one aspect of the present invention, for personal authentication Typical examples of biometric information that can be used include fingerprints, palm prints, veins, and irises. These biological information can be obtained using visible or infrared light, particularly for veins and rainbows. Color information is preferably acquired using infrared light.

[0291] Furthermore, among the biological information that can be obtained using the display device according to one aspect of the present invention, The biometric information that can be used for Scare applications includes pulse wave, blood glucose level, oxygen saturation, and neutral pH. This includes things like fat concentration.

[0292] Furthermore, the electronic device equipped with the display device shall be provided with means for acquiring other biometric information. This is preferable. For example, in addition to internal biological information such as electrocardiogram, blood pressure, and body temperature, facial expression, complexion, and pupils. This includes superficial biological information such as pores. It also includes step count, exercise intensity, elevation changes during travel, and diet (nutrition). Information such as calorie intake or nutrient intake is also important information for healthcare. By using information and other resources, comprehensive health management becomes possible, not only for daily health management, but also for other purposes. This can also lead to the early detection of injuries and illnesses.

[0293] For example, blood pressure is measured by the difference in timing between the two heartbeats in an electrocardiogram and a pulse wave (the length of pulse wave propagation time). It can be calculated from (sa). When blood pressure is high, the pulse wave propagation time is short, and conversely, when blood pressure is low, the pulse wave Wave propagation time becomes longer. Also, from the relationship between heart rate and blood pressure calculated from electrocardiogram and pulse wave, It can also estimate the user's physical condition. For example, if both heart rate and blood pressure are high, It can be inferred that the patient is in a state of tension or excitement, and conversely, if both heart rate and blood pressure are low, then lilac It can be inferred that the patient is in a state of dysregulation. Furthermore, a state of low blood pressure and high heart rate persists. If this occurs, it could indicate a heart condition or other underlying health issue.

[0294] Users can access biometric information measured by electronic devices, or self-assessment based on that information. Because one can check their physical condition at any time, their health awareness improves. As a result, they avoid overeating and excessive drinking. Review your daily habits, such as paying attention to moderate exercise or managing your physical condition. This can be done. Furthermore, it can also serve as an opportunity to seek medical attention from a healthcare provider if necessary. .

[0295] [Configuration Example 1] Figure 11A shows a schematic diagram of the electronic device 80. The electronic device 80 is a smartphone and It can be used as follows. The electronic device 80 comprises at least a housing 82, a display unit 81a, and It comprises a display section 81a and a sub-display section 81b. The display section 81a functions as the main display surface. The display section 81b functions as a sub-display surface. It functions as a display surface and has a curved shape that follows the side of the housing 82. Display section 81a and surface A display device according to one embodiment of the present invention is applied to the display unit 81b.

[0296] As shown in Figure 11A, the display unit 81b is displayed when the user grasps the electronic device 80 with their hand 60a. At that time, the finger 60 is positioned in a place where it will naturally touch. At this time, the electronic device 80 displays The fingerprint of the finger 60 touching part 81b can be obtained, and fingerprint authentication can be performed. Therefore, the authentication operation is performed simultaneously with the user's action of holding the electronic device 80, without the user being aware of it. Therefore, when the user picks up the electronic device 80 and looks at the screen... Since authentication is already complete and you are logged in, it will be ready to use immediately, This allows for the creation of electronic devices that combine safety with high convenience.

[0297] Also, as shown in Figure 11B, when the finger 60 touches the display unit 81a, the finger 60 can access the display unit 81a. It is possible to acquire the body's biological information. For example, imaging of vein shape and arterioles can be performed. It is possible to acquire various biological information such as pulse rate or oxygen concentration from the imaged data. This becomes possible.

[0298] Furthermore, as shown in Figure 11C, when the finger 60 touches along the display unit 81b, the display unit 8 Similar biometric information can also be obtained using method 1b.

[0299] Acquiring biometric information involves, for example, an application for users to acquire and manage biometric information. This can be done by executing the application. The system recognizes when the finger 60 touches the display unit 81a or the display unit 81b, and then performs imaging. This can be done. In addition, the aforementioned biological information can be obtained from the captured images, and the data can be stored or managed. This makes it possible to perform certain actions.

[0300] The electronic device 80a shown in Figure 12 includes a display unit 81a, a display unit 81b, and a display unit 81c It has the following: The display unit 81c is located on the opposite side of the display unit 81b, with the display unit 81a in between. ru.

[0301] As shown in Figure 12, the display unit 81c is displayed when the user grasps the electronic device 80a with their hand 60a. When this happens, one or more of the five fingers (60 in total), specifically the index finger, middle finger, ring finger, and little finger, It is positioned in a place where it can be naturally touched. Furthermore, the display unit 81b is positioned in a place where the thumb can be naturally touched. Display unit 81b and display unit 81c each perform fingerprint imaging. This allows fingerprint authentication to be performed using fingerprints from multiple fingertips. This is preferable because it allows for more accurate authentication.

[0302] Furthermore, because the electronic device 80a has a symmetrical configuration, it can be used with either the right or left hand. This is preferable as it can accommodate this.

[0303] [Configuration Example 2] Figure 13 shows a schematic diagram of the electronic device 80b. The electronic device 80b is a tablet terminal. It can be used as such. The electronic device 80b comprises at least a housing 82 and a display unit 81a. The system comprises a display unit 81a and a display unit 81b. The display unit 81a and the display unit 81b are equipped with a display unit 81b. The device is being applied.

[0304] The electronic device 80b is activated when the user places their hand 60a over the display unit 81a or the display unit 81b. By performing or making contact, personal authentication is performed, and the user's biometric information is obtained. It is possible.

[0305] The electronic device 80b is configured such that the user's hand 60a is placed on the display unit 81a or the display unit 81b. And its shape can be recognized. And it is appropriate for each region corresponding to each part of the hand 60a. The system then performs the acquisition of biometric information. For example, in the region 85a corresponding to the fingertip of the hand 60a, the finger It is possible to perform imaging of the crease shape and the vein shape. In addition, region 8 corresponding to the pad of the finger 5b allows for imaging of vein shape, arterioles, etc. It also supports the palm. In area 85c, imaging of palm prints, veins, arterioles, and dermis is performed. It is possible. Images of fingerprints, palm prints, and veins can be used for personal identification. Images of arterioles, veins, and the dermis can be used to acquire biological information.

[0306] Furthermore, when acquiring biometric information, an image resembling the shape of a hand is displayed on the display unit 81a or the display unit 81b. An image may be displayed, and the user may be prompted to place their hand 60a in accordance with the image. This allows for improved accuracy in recognizing the shape of hand 60a.

[0307] Thus, each time personal authentication is performed to start the electronic device 80b, the user This allows for the acquisition of biometric information without the user's awareness. Because it can store biometric information, it enables continuous health management. The user does not need to run health management application software each time. Furthermore, it is preferable because there is no risk of interruption in the acquisition and updating of biometric information.

[0308] [Example of system configuration] According to one aspect of the present invention, various biological information can be acquired periodically and continuously. This biometric information can be used for personal authentication or health management, etc.

[0309] For example, biometric information obtained using visible light and infrared light includes fingerprints, palm prints, and static data. These include pulse pattern, pulse wave, respiratory rate, pulse rate, oxygen saturation, blood glucose level, and triglyceride concentration. In addition, other things to consider include facial expressions, complexion, pupil size, and voiceprints. Using this method is preferable because it allows for a comprehensive assessment of the user's health status.

[0310] A typical example of a personal authentication method using biometric information is pattern matching. For example, from images such as fingerprints, palm prints, and vein patterns, the coordinates of multiple characteristic points and this The system calculates features such as vectors between the coordinates of points and compares them with the user's features obtained in advance. Authentication can be performed by comparison. Two or more images from among fingerprints, palm prints, and vein patterns are required. By using this method, highly accurate authentication can be performed.

[0311] Furthermore, machine learning may be used for personal authentication using biometric information or for determining health status. Even if you use a pre-trained model as the learning model for machine learning, Alternatively, a learning model that is updated using acquired user data may be used. Learning methods include, for example, supervised machine learning and unsupervised machine learning.

[0312] The following describes an example of the system configuration and operation of one embodiment of the present invention, as shown in the drawings. See the explanation below.

[0313] Figure 14 shows a block diagram of a system 90 equipped with a display device according to one aspect of the present invention. The system 90 includes an arithmetic unit 91, a storage unit 92, an input unit 93, an output unit 94, and a bus line It has 95, etc. System 90 has various electronic devices having a display unit, such as the electronic device 80 described above. It can be applied to sub-devices.

[0314] The arithmetic unit 91 communicates with the storage unit 92, input unit 93, output unit 94, etc. via the bus line 95. It is connected and has the function to control them comprehensively.

[0315] The memory unit 92 has the function of storing data or programs, etc. The arithmetic unit 91, By reading a program or data from the storage unit 92 and executing or processing it, Various components included in the power unit 93 and the output unit 94 can be controlled.

[0316] Various sensor devices can be applied as the input unit 93. Here, the input unit 9 The components of unit 3 include a light sensor 93a, a camera 93b, a microphone 93c, and an electrocardiogram sensor. This shows the monitor 93d, etc. The light sensor 93a is a light-receiving element provided by the above-mentioned display device. A sensor using this can be applied. The electrocardiogram monitor 93d measures, for example, an electrocardiogram. A pair of electrodes and a measuring instrument for measuring the voltage between the electrodes or the current flowing between the electrodes. The structure should include the following.

[0317] The output unit 94 has the function of providing various information to the user. The components of the output unit 94 include a display 94a, a speaker 94b, and This shows an example that includes a vibration device 94c, etc.

[0318] A display device according to one aspect of the present invention comprises a light-receiving element that functions as a light sensor and a display unit. Because it has a light-emitting element, one display device has the light sensor 93 of the input unit 93 shown in Figure 14. a, and the display 94a of the output unit 94 can also serve as a unit. That is, system 9 0 is realized by a configuration having the display device, the calculation unit 91, and the storage unit 92. It is possible.

[0319] For example, a display device that can acquire biometric information such as a user's fingerprints, palm prints, or vein patterns. The arithmetic unit 91 has the user's biometric information data that has been pre-stored in the storage unit 92, Based on the acquired biometric information, fingerprint authentication, palm print authentication, or vein authentication can be performed. can.

[0320] The following describes an example of how to operate a system according to one aspect of the present invention. This section explains the process of performing biometric authentication.

[0321] Figure 15 is a flowchart showing how the system operates. The process has steps S0 to S8.

[0322] In step S0, the operation begins.

[0323] In step S1, a decision is made as to whether or not to perform a system startup. For example, an electronic machine The device is powered on, the display is touched, or the orientation of the electronic device changes. When these are detected, the system decides to start up. If no notification is received, the process proceeds to step S8 and terminates.

[0324] In step S2, it is determined whether authentication is required. If authentication has already been performed, the system If Mu is logged in, authentication is deemed unnecessary, and the process proceeds to step S7. On the other hand, if the user is logged off, the system determines that authentication is required and proceeds to step S3. do.

[0325] In step S3, it is determined whether or not an authentication action has been detected. For example, in a part of the display unit If it is detected that the user's finger or palm has touched the device, it is determined that an authentication action has been detected. Then, proceed to step S4. On the other hand, if no detection occurs for a certain period of time, proceed to step S8. The operation will then terminate.

[0326] In step S4, authentication information is obtained. For example, the user's fingerprint, palm print, vein pattern, etc. The system takes images and then retrieves biological information from the captured images.

[0327] In step S5, it is determined whether the authentication was performed correctly. For example, in step S4 The fingerprint, palm print, or vein information obtained in this manner, and the raw data of the user who has been registered in advance. The system compares the data with the physical information and determines whether or not they match. The determination is made using a pattern that does not involve machine learning models. Authentication methods such as line matching, or authentication using machine learning models, can be performed. If authentication is successful, proceed to step S6. If not, the logoff state is maintained and the process returns to step S4.

[0328] In step S6, the system login is performed.

[0329] In step S7, the login state is maintained. Step S7 is when the user terminates The process terminates when an operation is performed or when no input is detected for a certain period of time. We will be migrating to S8.

[0330] In step S8, the operation terminates. Step S8 is at least logged off. This is the state. It may also be a power-off state, standby state, or sleep state. Step S8 The return from this state may be performed by the action detected in step S1 above.

[0331] This applies to the electronic device 80 shown in Figure 11A, or the electronic device 80a shown in Figure 12. In this case, the detection of the authentication operation in step S3 and the authentication information in step S4 Acquisition is performed by touching the display unit 81b or display unit 81c with a fingertip, as shown in Figures 11A and 12. This can be executed by doing so. In addition, the biometric information obtained in step S4 is The light-receiving element of the display unit 81b or the display unit 81c captures the reflected light from the fingertip. Images such as fingerprints obtained through this process can be used.

[0332] In other words, an electronic device according to one aspect of the present invention (for example, electronic device 80 or electronic device 80a) When the user's finger touches the display unit 81b or the display unit 81c, the calculation unit 91 displays The light-receiving element of unit 81b or display unit 81c captures the reflected light from the finger, thereby obtaining The fingerprint image can be used to perform fingerprint authentication. Because authentication can be performed without the user being aware of it, it combines convenience with high security. It is possible to realize electronic devices equipped with these features.

[0333] The above describes an example of the configuration and operation of a system according to one aspect of the present invention.

[0334] (Embodiment 3) In this embodiment, the pixel configuration that can be applied to a display device according to one aspect of the present invention is described below. Then, I will explain by referring to the drawings.

[0335] A display panel according to one aspect of the present invention includes a first pixel circuit having a light-receiving element and a light-emitting element. It has a second pixel circuit and a first pixel circuit and a second pixel circuit, respectively They are arranged in a camphor tree shape.

[0336] Figure 16A shows an example of a first pixel circuit having a light-receiving element, and Figure 16B shows a light-emitting element An example of a second pixel circuit is shown.

[0337] The pixel circuit PIX1 shown in Figure 16A consists of a light-receiving element PD, transistor M1, and transistor It has M2, transistor M3, transistor M4, and capacitive element C1. Here, This example shows the use of a photodiode as the photoelectric device (PD).

[0338] The photodetector PD has its cathode electrically connected to wiring V1 and its anode connected to transistor M1. It is electrically connected to either the source or drain of transistor M1. The gate of transistor M1 is wired Electrically connected to TX, with the other being either the source or drain, one electrode of the capacitive element C1, and the trap The source or drain of transistor M2 and the gate of transistor M3 are electrically connected. Connect. Transistor M2 has its gate electrically connected to wiring RES, and its source or gate. The other end of the rain is electrically connected to wiring V2. Transistor M3 is source or dray One end of the circuit is electrically connected to wiring V3, and the other end of the circuit is connected to transistor M4, either as the source or drain. Connect electrically to either the source or drain of transistor M4. The gate of transistor M4 is wired It is electrically connected to SE, and the other end of either the source or drain is electrically connected to wiring OUT1. .

[0339] A constant potential is supplied to wiring V1, wiring V2, and wiring V3, respectively. Photodetector PD When driving with reverse bias, supply a potential lower than the potential of wiring V1 to wiring V2. Transistor M2 is controlled by the signal supplied to wiring RES, and transistor A function that resets the potential of the node connected to the gate of M3 to the potential supplied to wiring V2. It has a transistor M1 controlled by a signal supplied to the wiring TX, and a photodetector P It has a function to control the timing at which the potential of the above node changes in accordance with the current flowing through D. Transistor M3 functions as an amplifying transistor that produces an output corresponding to the potential of the above node. Transistor M4 is controlled by a signal supplied to wiring SE, and the above node A selection transistor for reading the output corresponding to the potential using an external circuit connected to wiring OUT1. It functions as such.

[0340] The pixel circuit PIX2 shown in Figure 16B consists of a light-emitting element EL, a transistor M5, and a transistor It has M6, a transistor M7, and a capacitive element C2. Here, the light-emitting element EL is An example using light-emitting diodes is shown. In particular, an organic EL element is used as the light-emitting element (EL). It is preferable that they be present.

[0341] Transistor M5 has its gate electrically connected to wiring VG, and one of its sources or drains One side is electrically connected to the wiring VS, and the other side is either the source or the drain of the capacitive element C2. The electrodes and the gate of transistor M6 are electrically connected. One end of the drain is electrically connected to wiring V4, and the other end is connected to the anode of the light-emitting element EL, and Connect electrically to either the source or drain of transistor M7. 7 has its gate electrically connected to wiring MS, and the other side of the source or drain is connected to wiring OUT2. The cathode of the light-emitting element EL is electrically connected to wiring V5.

[0342] A constant potential is supplied to wiring V4 and wiring V5, respectively. Anode side of light-emitting element EL The cathode side can be made to a higher potential, while the anode side can be made to a lower potential. Transistor M 5 is controlled by a signal supplied to wiring VG and controls the selected state of pixel circuit PIX2. It functions as a selection transistor for that purpose. Also, transistor M6 is supplied to the gate. It functions as a drive transistor that controls the current flowing to the light-emitting element (EL) in accordance with the potential. When transistor M5 is conducting, the potential supplied to wiring VS is the same as that of transistor M6. It is supplied to the gate, and the luminescence brightness of the light-emitting element (EL) can be controlled according to its potential. Transistor M7 is controlled by a signal supplied to wiring MS, and transistor M6 and light emission It has the function of outputting the potential between itself and element EL to the outside via wiring OUT2.

[0343] In this embodiment, the display panel emits light in a pulsed manner to display an image. This may be displayed. By shortening the driving time of the light-emitting elements, the power consumption of the display panel can be reduced. Furthermore, heat generation can be suppressed. In particular, organic EL elements have excellent frequency characteristics. Therefore, it is suitable. The frequency can be, for example, between 1 kHz and 100 MHz. ru.

[0344] Here, the pixel circuit PIX1 has transistors M1, M2, and Transistor M3, transistor M4, and transistor M5 of the pixel circuit PIX2, Transistors M6 and M7 each have a semiconductor layer in which a channel is formed. It is preferable to apply a transistor using a metal oxide (oxide semiconductor) to this.

[0345] Using metal oxides with a wider band gap and lower carrier density than silicon Transistors can achieve extremely small off-currents. Therefore, their small The off-current allows the charge accumulated in the capacitive element connected in series with the transistor to be released over a long period of time. Therefore, it is possible to hold it in series, especially with capacitive element C1 or capacitive element C2. The transistors M1, M2, and M5 connected to it are made of oxide It is preferable to use transistors that incorporate semiconductors. Similarly, by using transistors that utilize oxide semiconductors, manufacturing costs can be reduced. It is possible.

[0346] Furthermore, in transistors M1 to M7, silicon is used in the semiconductor where the channel is formed. Transistors with capacitors applied can also be used. In particular, single-crystal silicon or polycrystalline silicon By using highly crystalline silicon such as Ricon, high field-effect mobility can be achieved. This is preferable because it allows for faster operation.

[0347] Furthermore, an oxide semiconductor is applied to one or more of the transistors M1 to M7. As a configuration that uses transistors with silicon applied to them, That's good too.

[0348] Note that in Figures 16A and 16B, the transistor is assumed to be an n-channel type transistor. Although it is written as such, a p-channel transistor can also be used.

[0349] The transistors in pixel circuit PIX1 and pixel circuit PIX2 are It is preferable that they be formed side by side on the same substrate. In particular, the transistors of the pixel circuit PIX1 The transistors of the zista and the pixel circuit PIX2 are mixed within a single region and periodically It is preferable to have an arrangement configuration.

[0350] Furthermore, a transistor and a capacitive element are positioned in a location that overlaps with the photodetector PD or light-emitting element EL. It is preferable to provide one or more layers having one or both of the above. This allows each pixel to This reduces the effective area occupied by the path, enabling the realization of a high-definition light-receiving or display unit.

[0351] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0352] (Embodiment 4) In this embodiment, the drawings show an electronic device to which a display device according to one aspect of the present invention can be applied. Refer to the explanation.

[0353] The electronic device of this embodiment has a display device according to one aspect of the present invention. The display device detects light Because it has the function of displaying information, biometric authentication is performed on the display unit, and touch or near touch It can detect the tactic. An electronic device according to one aspect of the present invention is difficult to misuse and secure It is an electronic device with an extremely high level of quality. Furthermore, it enhances the functionality and convenience of electronic devices. It is possible to do so.

[0354] Examples of electronic devices include television equipment, desktop or notebook computers, etc. Computers, monitors for computers, digital signage, pachinko machines In addition to electronic devices with relatively large screens such as large game consoles, digital cameras, and Digital video cameras, digital photo frames, mobile phones, portable game consoles, mobile information Examples include terminals and audio playback devices.

[0355] The electronic device of this embodiment includes sensors (force, displacement, position, velocity, acceleration, angular velocity, rotational speed). Distance, light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power, A device for detecting, detecting, or measuring radiation, flow rate, humidity, gradient, vibration, odor, or infrared radiation. They may have (including abilities).

[0356] The electronic device of this embodiment can have various functions. For example, various information ( Functions to display still images, videos, text images, etc. on the display unit, touch panel function, calendar A function to display the date or time, and to run various software (programs). Functions include wireless communication and the ability to read programs or data recorded on a recording medium. They may possess abilities such as [specific abilities / abilities].

[0357] The electronic device 6500 shown in Figure 17A is a portable device that can be used as a smartphone. It is a news terminal device.

[0358] The electronic device 6500 consists of a housing 6501, a display unit 6502, a power button 6503, and a button 6 It includes 504, speaker 6505, microphone 6506, camera 6507, and light source 6508, etc. The display unit 6502 is equipped with a touch panel function.

[0359] A display device according to one aspect of the present invention can be applied to the display unit 6502.

[0360] Figure 17B is a schematic cross-sectional view of the housing 6501, including the end on the microphone 6506 side.

[0361] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501, and the housing 650 Within the space surrounded by 1 and protective member 6510, display panel 6511, optical member 6512, The touch sensor panel 6513, printed circuit board 6517, battery 6518, etc. are located here. ru.

[0362] The protective member 6510 includes a display panel 6511, an optical member 6512, and a touch sensor panel. Nel 6513 is fixed by an adhesive layer (not shown).

[0363] In the area outside the display unit 6502, a portion of the display panel 6511 is folded back. The FPC6515 is connected to the folded portion. IC6516 is mounted. FPC6515 is located on printed circuit board 6517. It is connected to the terminal.

[0364] A flexible display according to one aspect of the present invention can be applied to the display panel 6511. Yes, it is possible. Therefore, it is possible to realize extremely lightweight electronic devices. Also, the display panel 6511 is extremely Because it is extremely thin, it can accommodate a large-capacity 6518 battery while keeping the thickness of electronic devices down. Yes, it is possible. Also, by folding back a part of the display panel 6511, the FPC6515 can be placed on the back of the pixel area. By positioning the connection point, it is possible to realize electronic devices with narrow bezels.

[0365] Figure 18A shows an example of a television system. The television system 7100 has a housing 710 A display unit 7000 is incorporated into 1. Here, the stand 7103 connects to the housing 710. This shows the configuration that supports option 1.

[0366] A display device according to one embodiment of the present invention can be applied to the display unit 7000.

[0367] The television device 7100 shown in Figure 18A is operated by the operation switches provided on the housing 7101. This can be done using the display unit, or a separate remote control unit 7111, etc. The 7000 may also be equipped with a touch sensor, allowing users to touch the display unit 7000 with their fingers or other objects to access the TV. The vision device 7100 may be operated. The remote control operator 7111 controls the remote control operation. It may have a display unit that displays information output from unit 7111. Remote control operator 71 The channel and volume can be controlled using the control keys or touch panel provided by unit 11. This allows the user to control the image displayed on the display unit 7000.

[0368] The television system 7100 will consist of a receiver and a modem, etc. The device can receive regular television broadcasts. It can also receive broadcasts via a modem via wired or By connecting to a wireless communication network, one-way communication (from sender to receiver) or It is also possible to communicate information in two directions (between a sender and receiver, or between receivers). be.

[0369] Figure 18B shows an example of a notebook personal computer. The Pewter 7200 consists of a casing 7211, a keyboard 7212, and a pointing device 72 13. It has external connection ports 7214, etc. The display unit 7000 is incorporated into the housing 7211. It is being done.

[0370] A display device according to one embodiment of the present invention can be applied to the display unit 7000.

[0371] Figures 18C and 18D show examples of digital signage.

[0372] The digital signage 7300 shown in Figure 18C consists of a housing 7301, a display unit 7000, and It has a speaker 7303, etc. Furthermore, it has an LED lamp, operation keys (power switch, or It may include an operating switch, connection terminals, various sensors, a microphone, etc. .

[0373] Figure 18D shows a digital signage 7400 mounted on a cylindrical column 7401. The digital signage 7400 has a display unit 7000 that is installed along the curved surface of the column 7401. To possess.

[0374] In Figures 18C and 18D, a display device according to one embodiment of the present invention is applied to the display unit 7000. It is possible.

[0375] The larger the display area 7000, the more information can be provided at once. The wider the display area 7000, the more easily it catches people's attention, which can, for example, enhance the effectiveness of advertising. can.

[0376] By applying a touch panel to the display unit 7000, images or videos can be displayed on the display unit 7000. It's desirable that it not only displays information but also allows users to operate it intuitively. Furthermore, route information... When used for purposes such as providing news or traffic information, intuitive operation is required. This can improve usability.

[0377] Also, as shown in Figures 18C and 18D, the digital signage 7300 or digital Talsignage 7400 is an information terminal 7311 that the user possesses, such as a smartphone. Alternatively, it is preferable that it be possible to communicate with the information terminal 7411 via wireless communication. For example, Table Information about the advertisement displayed on the display unit 7000 is transmitted to the information terminal 7311 or the information terminal 7411. It can be displayed on the screen of information terminal 7311 or information terminal 7411. By operating this, the display on the display unit 7000 can be switched.

[0378] Additionally, information terminals can be connected to the Digital Signage 7300 or Digital Signage 7400. A game is played using the screen of the 7311 or information terminal 7411 as the control device (controller). It can also be done. This allows a large number of users to participate in the game simultaneously and enjoy It is possible to do so.

[0379] The electronic equipment shown in Figures 19A to 19F consists of a housing 9000, a display unit 9001, and a speaker 9 003, Operation key 9005 (including power switch or operation switch), Connection terminal 90 06. Sensor 9007 (force, displacement, position, velocity, acceleration, angular velocity, rotational speed, distance, light, liquid) Magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power, radiation, flow rate, (Including functions that detect, identify, or measure humidity, gradient, vibration, odor, or infrared radiation) It includes a microphone 9008, etc.

[0380] The electronic devices shown in Figures 19A to 19F have various functions. For example, various information ( Functions to display still images, videos, text images, etc. on the display unit, touch panel function, calendar A function that displays the date or time, etc., through various software (programs) Functions that control processing, wireless communication functions, programs or data recorded on recording media It can have functions such as reading and processing data. Furthermore, the functions of electronic devices are related to these. It is not limited and can have a variety of functions. Even if an electronic device has multiple display units Good. Also, an electronic device can be equipped with a camera, etc., to take still images or videos, etc., and record them on a recording medium (external It has functions such as saving to (or built into the camera), displaying captured images on the display unit, etc. It's fine if you do that.

[0381] Details of the electronic equipment shown in Figures 19A to 19F will be explained below.

[0382] Figure 19A is a perspective view showing the personal digital assistant 9101. The personal digital assistant 9101 is, for example, For example, it can be used as a smartphone. Note that the mobile information terminal 9101 is a speed A connector (9003), connection terminal (9006), sensor (9007), etc. may be provided. Also, a portable information terminal may be provided. 9101 can display text or image information on its multiple surfaces. (See Figure 19A) This shows an example displaying three icons 9050. Also, information 90 is shown by a dashed rectangle. 51 can also be displayed on other sides of the display unit 9001. An example of information 9051 is: Notifications of incoming emails, social media messages, and phone calls; subject lines of emails or social media messages; sending messages. This includes the person's name, date, time, battery level, and antenna signal strength. Alternatively, Information 90 You may also display an icon such as 9050 in the position where 51 is displayed.

[0383] Figure 19B is a perspective view showing the personal digital assistant 9102. The personal digital assistant 9102 is a table The display unit 9001 has the function of displaying information on three or more sides. Here, information 9052, information This shows an example where information 9053 and information 9054 are displayed on different sides. For example, user This is with the personal digital assistant 9102 stored in the breast pocket of the clothing, and the personal digital assistant 9102 Information 9053, displayed in a position that can be observed from above, can also be viewed by the user. This allows you to check the display without taking the personal digital assistant 9102 out of your pocket, for example, to make a phone call. You can decide whether or not to accept it.

[0384] Figure 19C is a perspective view showing a wristwatch-type portable information terminal 9200. Also, the display unit 90 01 has a curved display surface, and can display information along the curved surface. Furthermore, the portable information terminal 9200 can communicate with, for example, a wireless headset. This also allows for hands-free calling. Furthermore, the 9200 mobile information terminal is connected The connection terminal 9006 is used for mutual data transmission with other information terminals, or for charging. It is also possible to perform the charging operation via wireless power supply.

[0385] Figures 19D, 19E, and 19F show a foldable portable information terminal 9201 from an oblique angle. This is a visual view. Figure 19D shows the mobile information terminal 9201 in its unfolded state, and Figure 19F shows it folded. Figure 19E is a perspective view of the state in which Figure 19D and Figure 19F are transitioning from one to the other. The portable information terminal 9201 is highly portable when folded, and when unfolded... The seamless, wide display area provides excellent readability. (Features of the 9201 mobile information terminal) The display unit 9001 is supported by three housings 9000 connected by hinges 9055. For example, the display unit 9001 is bent with a radius of curvature of 0.1 mm or more and 150 mm or less. It is possible.

[0386] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination. [Explanation of symbols]

[0387] 10: Display device, 11: Substrate, 12: Substrate, 21B: Light-emitting element, 21G: Light-emitting element, 21 R: light-emitting element, 21: light-emitting element, 22: light-receiving element, 23IR: light-emitting element, 23: light-emitting element , 24: light shielding layer, 31: resin layer, 32: resin layer, 50: display device, 51: layer, 52a: layer 52b: layer, 52c: layer, 52: layer, 60a: hand, 60: finger, 71: pixel, 72: pixel , 73: pixel, 75a: circuit section, 75b: circuit section, 76a: circuit section, 76b: circuit section, 7 7: Circuit section, 78: Circuit section, 79a: Circuit section, 79b: Circuit section, 79c: Circuit section, 79d :Circuit section, 80a:Electronic device, 80b:Electronic device, 80:Electronic device, 81a:Display section, 8 1b: Display section, 81c: Display section, 81: Display section, 82: Housing, 85a: Area, 85b: Area Area, 85c: Area, 90: System, 91: Processing Unit, 92: Memory Unit, 93a: Optical Sensor, 93b: Camera, 93c: Microphone, 93d: ECG monitor, 93: Input unit, 94a: Display Play, 94b: Speaker, 94c: Vibration device, 94: Output section, 95: Bus line, 10 0A: Display device, 100B: Display device, 100: Display device, 110: Light receiving element, 111: Pixel electrode, 112: Photoelectric conversion layer, 113: Common electrode, 114: Common layer, 115: Common layer, 116: Active layer, 121: Light, 122: Light, 123: Light, 131: Transistor, 132 : Transistor, 141: Resin layer, 142: Resin layer, 145: Light-shielding layer, 151: Substrate, 1 52: Substrate, 160: Light-emitting element, 161: Electrode, 162: EL layer, 163: Electrode, 164 : Buffer layer, 165: Buffer layer, 166: Light-emitting layer, 167: Conductive layer, 190: Light-emitting element Child, 191: Pixel electrode, 192: EL layer, 195a: Inorganic insulating layer, 195b: Organic insulating layer , 195c: inorganic insulating layer, 195: protective layer, 196: light-emitting layer, 200: display device, 202 :transistor, 204:connector, 208:transistor, 209:transistor, 21 0: Transistor, 211: Insulating layer, 214: Insulating layer, 215: Insulating layer, 216: Partition wall, 217: insulating layer, 218: insulating layer, 221: conductive layer, 222a: conductive layer, 222b: conductive Layer, 223: conductive layer, 225: insulating layer, 228: region, 231i: channel formation region, 2 31n: Resistive region, 231: Semiconductor layer, 242: Connecting layer, 262: Display unit, 264: Circuit ,265: wiring, 266: conductive layer, 270B: light-emitting element, 270G: light-emitting element, 270P D: light-receiving element, 270R: light-emitting element, 270SR: light-receiving element, 271: pixel electrode, 27 2: FPC, 273: Active layer, 274: IC, 275: Common electrode, 277: First electrode, 278: Second electrode, 280A: Display device, 280B: Display device, 280C: Display device, 281: Hole injection layer, 282: Hole transport layer, 283B: Emission layer, 283G: Emission layer, 28 3R: Emitting layer, 283: Emitting layer, 284: Electron transport layer, 285: Electron injection layer, 289: Layer

Claims

1. An electronic device having a display device that performs biometric authentication by imaging the blood vessels of a finger or hand, The display device comprises a substrate, a first light-emitting element, a second light-emitting element, a light-receiving element, a light-shielding layer, and a resin layer. The first light-emitting element and the light-receiving element are arranged above the substrate, The resin layer has a region positioned above the first light-emitting element and a region positioned above the light-receiving element. The light-shielding layer is positioned above the resin layer, The second light-emitting element is positioned above the light-shielding layer, The first light-emitting element has the function of emitting visible light upwards, The second light-emitting element has the function of emitting invisible light upwards, The light-receiving element is a photoelectric conversion element that is sensitive to visible light and invisible light. In a plan view, the light-shielding layer has a portion located between the first light-emitting element and the light-receiving element. In a plan view, the second light-emitting element overlaps with the light-shielding layer and is located inside the contour of the light-shielding layer, in an electronic device.

2. In claim 1, The invisible light is light having intensity in the wavelength range of 750 nm to 1000 nm, in the context of electronic equipment.

3. An electronic device having a display device that performs biometric authentication by imaging the blood vessels of a finger or hand, The display device comprises a substrate, a first light-emitting element, a second light-emitting element, a light-receiving element, a light-shielding layer, and a resin layer. The first light-emitting element and the light-receiving element are arranged above the substrate, The resin layer has a region positioned above the first light-emitting element and a region positioned above the light-receiving element. The light-shielding layer is positioned above the resin layer, The second light-emitting element is positioned above the light-shielding layer, The first light-emitting element has the function of emitting visible light upwards, The second light-emitting element has the function of emitting infrared light upwards, The light-receiving element is a photoelectric conversion element that is sensitive to visible light and infrared light. In a plan view, the light-shielding layer has a portion located between the first light-emitting element and the light-receiving element. In a plan view, the second light-emitting element overlaps with the light-shielding layer and is located inside the contour of the light-shielding layer, in an electronic device.

4. An electronic device having a display device that performs biometric authentication by imaging the blood vessels of a finger or hand, The display device comprises a substrate, a first light-emitting element, a second light-emitting element, a light-receiving element, a light-shielding layer, and a resin layer. The first light-emitting element and the light-receiving element are arranged above the substrate, The resin layer has a region positioned above the first light-emitting element and a region positioned above the light-receiving element. The light-shielding layer is positioned above the resin layer, The second light-emitting element is positioned above the light-shielding layer, The first light-emitting element has the function of emitting visible light upwards, The second light-emitting element has the function of emitting ultraviolet light upward, The light-receiving element is a photoelectric conversion element that is sensitive to visible light and ultraviolet light. In a plan view, the light-shielding layer has a portion located between the first light-emitting element and the light-receiving element. In a plan view, the second light-emitting element overlaps with the light-shielding layer and is located inside the contour of the light-shielding layer, in an electronic device.

Images