Circuit board inspection equipment

Abstract

Easily identify precise information to ensure accurate contact of the probe to the desired location. [Solution] The system includes a member moving mechanism 4 that moves a probing member 6, which is mounted so that its surfaces F6a and F6b are parallel to the substrate surfaces FXa and FXb, in a direction intersecting the substrate surface FX, and distance measuring units 8a and 8b that measure a first distance to the substrate surface FX and a second distance to the surface F6 in the Z-axis direction. When the control unit 10 identifies the positional misalignment between the position where the indentation is formed and the reference position where the indentation should be formed, if the position of the substrate surface FX in the Z-axis direction identified based on the first distance differs from the position of the surface F6 in the Z-axis direction identified based on the second distance, the control unit 10 controls the member moving mechanism 4 to move the probing member 6 so that the position of the surface F6 in the Z-axis direction coincides with the position of the substrate surface FX.

Description

Technical Field

[0001] The present invention identifies the direction and amount of displacement between the position where an indentation is formed by probing and the reference position where the indentation is to be formed, and is configured to be able to correct the position where the tip of the probe contacts according to the identified direction and amount of displacement when probing a substrate to be inspected. The present invention relates to a substrate inspection apparatus.

Background Art

[0002] As this type of substrate inspection apparatus, the applicant has disclosed an invention of an X-Y circuit board inspection apparatus (hereinafter, also simply referred to as a "substrate inspection apparatus") in the following patent document.

[0003] In this substrate inspection apparatus, probing is performed on a dedicated board to which an indentation sheet is attached, and an error occurring between the position where the tip of the probe should contact and the position where the tip of the probe is actually contacted is measured. According to the measured error, the position where the tip of the probe contacts during probing of the substrate to be measured (substrate to be inspected) can be corrected. Specifically, in the substrate inspection apparatus disclosed by the applicant, first, a dedicated board to which an indentation sheet is attached is held by a fixture (substrate holding unit). Next, probing for a specific point (x, y) on the indentation sheet is instructed. At this time, an indentation is formed at the position where the tip of the probe contacts on the indentation sheet. Subsequently, the indentation sheet is imaged in a state where the camera is moved so that the center of the camera coincides with the specific point (x, y). At this time, a region centered on the specific point (x, y) on the indentation sheet is imaged. Subsequently, by performing image processing on the imaging result, the coordinates of the center of gravity of the indentation in the imaging region are obtained.

[0004] When the position where the probe tip should be placed and the position where the probe tip is actually placed coincide, the calculated coordinates (centroid of the indentation) coincide with the center of the captured image (specific point (x,y)). Conversely, when the position where the probe tip should be placed and the position where the probe tip is actually placed do not coincide, an error occurs between the calculated coordinates (centroid of the indentation) and the center of the captured image (specific point (x,y)). Therefore, when an error occurs, the probing position is corrected according to the measured error when probing the substrate under inspection. This makes it possible to place the probe tip at the "position where the probe should be placed" on the substrate under inspection. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 6-331653 (page 3, Figures 1-3) [Overview of the project] [Problems that the invention aims to solve]

[0006] However, the substrate inspection apparatus disclosed by the applicant in the above-mentioned patent document has the following issues that need improvement.

[0007] Specifically, the substrate inspection apparatus disclosed by the applicant employs a configuration that, as described above, involves probing a dent sheet attached to a dedicated board, imaging the dent sheet, identifying the center of gravity of the dent through image analysis of the imaging results, and measuring the error between the identified center of gravity and a reference position to which the tip of the probe should be in contact. If an error occurs, the probing position is corrected according to the measured error.

[0008] In this case, this type of substrate inspection device is designed so that the trajectory of the probe tip during probing (when the probe is moved by the Z-axis movement mechanism) coincides with the optical axis of the camera lens (the center of the camera's imaging range: perpendicular to the surface of the substrate being inspected). However, the mounting position of the Z-axis movement mechanism relative to the XY-axis movement mechanism, and the mounting position of the probe relative to the Z-axis movement mechanism, may not be within tolerances and as designed during assembly or probe replacement, resulting in the trajectory of the probe tip being slightly tilted relative to the optical axis of the camera lens (perpendicular to the surface of the substrate being inspected). Furthermore, depending on the type of probe attached to the Z-axis movement mechanism, the trajectory of the probe tip may also be slightly tilted relative to the optical axis of the camera lens (perpendicular to the surface of the substrate being inspected).

[0009] In this case, if the movement trajectory of the probe tip does not coincide with the optical axis of the camera lens (orthogonal to the surface of the substrate under inspection or the surface of the indentation sheet), the magnitude of the error between the contact position of the probe tip with respect to the indentation sheet in the XY axis direction (i.e., the position of the centroid of the indentation identified by image analysis) and the optical axis of the camera lens (i.e., the center of the captured image) will differ depending on the position of the indentation sheet in the Z axis direction during probing. Here, the applicant has defined the above "intersection" to be sufficiently small, and the probe used is also designed so that the movement trajectory of its tip coincides with (or nearly coincides with) the optical axis of the camera lens, so the amount of difference in the magnitude of the error due to the position of the indentation sheet in the Z axis direction is very small. However, when inspecting substrates under inspection today, which are becoming finer-pitch, it is preferable to measure the error that may occur during probing of the substrate under inspection with greater accuracy.

[0010] Therefore, when measuring the error between the center of gravity of a dent and the reference position in this type of substrate inspection device, it is necessary to measure an accurate error that enables accurate probing of the substrate under inspection. This requires aligning the position of the surface of the dent sheet in the Z-axis direction with the position of the surface of the substrate under inspection in the Z-axis direction, i.e., performing probing on the dent sheet under the same conditions as when probing the substrate under inspection.

[0011] On the other hand, the substrates to be inspected by this type of substrate inspection device vary in thickness, and the position in the Z-axis direction of the substrate surface to which the probe should be made contact during inspection differs depending on the thickness of the substrate to be inspected. For this reason, when measuring the above error in the substrate inspection device disclosed by the applicant, various dedicated boards with different thicknesses are prepared according to the various substrates to be inspected, and from among these, a dedicated board with a thickness such that the position in the Z-axis direction of the surface of the attached indentation sheet coincides with the position in the Z-axis direction of the surface of the substrate to be inspected is selected, and probing (formation of indentations) is performed with the indentation sheet attached to the selected dedicated board and held in a fixture (substrate holding part).

[0012] Therefore, in the substrate inspection apparatus disclosed by the applicant, the process of selecting the appropriate dedicated board according to the thickness of the substrate to be inspected and holding it in the fixture is cumbersome. Furthermore, managing the dedicated boards of various thicknesses is also cumbersome, and when a large number of dedicated boards are stored haphazardly, it becomes difficult to select a dedicated board of the appropriate thickness. For this reason, it is desirable to improve these points.

[0013] This invention has been made in view of the aforementioned problems that need to be improved, and its main objective is to provide a substrate inspection device that can easily identify accurate information necessary for correction to accurately contact the tip of the probe with a desired position when probing the substrate to be inspected. [Means for solving the problem]

[0014] The substrate inspection apparatus according to the present invention comprises a substrate holding unit capable of holding a substrate to be inspected; a probing mechanism having an XY axis movement mechanism for moving a probe parallel to the substrate surface of the substrate to be inspected held by the substrate holding unit, and a Z axis movement mechanism attached to the XY axis movement mechanism for moving the probe in a direction intersecting the substrate surface; a member to be probed having a dent-forming surface on which a dent is formed at the contact position of the tip of the probe by probing by the probing mechanism; an imaging unit attached to the XY axis movement mechanism capable of imaging the dent-forming surface; and a control unit for controlling the probing mechanism and the imaging unit, wherein the control unit controls the probing mechanism to probe the member to be probed with the probe and controls the imaging unit to image the dent-forming surface, and identifies the position of the dent on the dent-forming surface based on the imaging data from the imaging unit, and identifies the direction and amount of the positional deviation between a reference position on which the dent should be formed by probing the member to be probed and the identified position of the dent. A substrate inspection apparatus configured to perform a misalignment identification process and, when probing the substrate to be inspected, to correct the position at which the tip of the probe makes contact according to the direction and amount of the misalignment identified by the misalignment identification process, wherein the member to be probed is mounted so that the indentation forming surface is parallel to the substrate surface, and a member moving mechanism moves the member to be probed in a direction intersecting the substrate surface, and the substrate in the Z-axis direction, which is the direction of movement of the probe during probing by the Z-axis moving mechanism The control unit includes a distance measuring unit that measures a first distance to the substrate surface and a second distance to the indentation-forming surface so that the position of the surface and the position of the indentation-forming surface in the Z-axis direction can be determined, and the control unit performs a first distance measuring process that causes the distance measuring unit to measure the first distance and a second distance measuring process that causes the distance measuring unit to measure the second distance, and when the position of the substrate surface in the Z-axis direction determined based on the first distance and the position of the indentation-forming surface in the Z-axis direction determined based on the second distance are different,The member movement mechanism is controlled to move the member being probed so that the position of the indentation-forming surface in the Z-axis direction coincides with the position of the substrate surface in the Z-axis direction.

[0015] Therefore, according to the substrate inspection apparatus of the present invention, even if the movement trajectory of the probe tip during probing (when the probe is moved by the Z-axis movement mechanism) does not coincide with the optical axis of the lens in the imaging unit (center of the imaging range of the imaging unit: orientation perpendicular to the substrate surface of the substrate to be inspected) due to differences in the mounting position of the Z-axis movement mechanism to the XY-axis movement mechanism, the mounting position of the probe to the Z-axis movement mechanism, and the type of probe attached to the Z-axis movement mechanism, the member to be probed is moved by the member movement mechanism so that the position of the indentation-forming surface in the Z-axis direction coincides with the position of the substrate surface in the Z-axis direction prior to the start of the position misalignment identification process. As a result, in the position misalignment identification process, probing can be performed on the indentation-forming surface of the member to be probed under the same conditions as when probing on the substrate surface of the substrate to be inspected, and an indentation can be formed on the indentation-forming surface. Therefore, since it is no longer necessary to prepare various probing members with different thicknesses according to the thickness of the substrates being inspected, the management of probing members becomes easier, and the work of changing probing members according to the thickness of the substrates being inspected is also eliminated. As a result, even a person unfamiliar with operating this type of device can easily identify the accurate information necessary for correction to accurately contact the tip of the probe with the desired position when probing the substrate being inspected. This makes it possible to reliably and easily contact the tip of the probe with any position on the substrate surface of the substrate being inspected.

[0016] Furthermore, the substrate inspection apparatus according to the present invention comprises a member moving mechanism comprising: a first movable body that is moved in a first direction parallel or substantially parallel to the substrate surface and the indentation forming surface; a ball screw mechanism having a screw shaft disposed along the first direction and engaged with the first movable body so as to be movable in the first direction; and a second movable body to which the member to be probed is attached and which is disposed in contact with the first movable body and is moved in a second direction parallel or substantially parallel to the Z-axis direction. At least one of the first contact portion of the first moving body with the second moving body, and the second contact portion of the second moving body with the first moving body, is formed to extend along a third direction that intersects both the first and second directions when viewed in a direction perpendicular to both the first and second directions, and is configured such that the second moving body is moved in the second direction when the first moving body is moved in the first direction by the rotation of the screw shaft.

[0017] Therefore, according to the substrate inspection apparatus of the present invention, unlike, for example, when the member movement mechanism is configured with a ball screw mechanism that directly moves the movable body to which the member to be probed is attached in the Z-axis direction by the rotation of a screw shaft, the space occupied in the Z-axis direction by the components of the member movement mechanism can be made sufficiently small, and the situation in which the presence of the member movement mechanism hinders probing on both the front and back surfaces of the member to be probed can be suitably avoided.

[0018] Furthermore, in the substrate inspection apparatus according to the present invention, the member moving mechanism is arranged such that the member to be probed is located within the movable range of the probe by the probing mechanism, while the first movable body, the second movable body, and the screw shaft are located outside the movable range of the probe by the probing mechanism.

[0019] Therefore, with the substrate inspection apparatus according to the present invention, there are no components (such as the first and second moving bodies and the screw shaft) within the movable range of the probe that may hinder the movement of the probe by the probing mechanism. As a result, it is possible to suitably avoid the situation in which the probe comes into contact with and is damaged by components of the member movement mechanism as the probe moves within the movable range of the probe.

[0020] Furthermore, the substrate inspection apparatus according to the present invention comprises an arm-shaped member detachably attached to the moving body in the member moving mechanism, and a pressure-sensitive sheet attached to the arm-shaped member to form the indentation-forming surface.

[0021] Therefore, according to the substrate inspection apparatus of the present invention, unlike configurations in which the attachment and detachment of the probing member, which is positioned within the movable range of the probe, to the member movement mechanism is restricted, the work of peeling off the pressure-sensitive sheet from the arm-shaped member or attaching the pressure-sensitive sheet to the arm-shaped member can be performed outside the movable range of the probe, thus making these operations easy to carry out. Furthermore, even if the work of peeling off the pressure-sensitive sheet from the arm-shaped member and attaching a new pressure-sensitive sheet is not performed immediately before disclosing the inspection of the substrate to be inspected (immediately before starting probing on the probing member), by preparing other probing members with pressure-sensitive sheets attached to the arm-shaped member in advance, it is possible to start the inspection simply by attaching the new probing member to the member movement mechanism.

[0022] Furthermore, the substrate inspection apparatus according to the present invention is configured to be able to probe both the front surface and the back surface of the substrate to be inspected, and is configured to be able to perform the positional misalignment identification process on both of these surfaces of the substrate to be inspected.

[0023] Therefore, according to the substrate inspection apparatus of the present invention, even when inspecting the substrate to be inspected while probing the probes against both surfaces of the substrate to be inspected, accurate information for accurately contacting the tip of the probe at desired positions on both the front and back surfaces can be surely and easily specified.

[0024] Note that the "substrate to be inspected" includes both a substrate on which various components are not mounted (a single substrate before component mounting) and a mounted substrate on which various components are mounted. Further, the "substrate surface of the substrate to be inspected" means "a surface on which the position (probing point) where the probe should be contacted during various inspections of the substrate to be inspected is defined". When inspecting by contacting the probe with a sub-substrate (an intermediate substrate such as a semiconductor package substrate) mounted on the main substrate, the surface of the sub-substrate (the component mounting surface on the sub-substrate) corresponds to the "substrate surface of the substrate to be inspected".

Advantages of the Invention

[0025] In the substrate inspection apparatus according to the present invention, a member moving mechanism that moves a probed member attached so that the indentation formation surface is parallel to the substrate surface of the inspection target substrate in a direction intersecting the substrate surface, and a first distance to the substrate surface and a second distance to the indentation formation surface are measured so that the position of the substrate surface in the Z-axis direction and the position of the indentation formation surface in the Z-axis direction can be specified. The control unit measures the first distance by the distance measuring unit and the second distance by the distance measuring unit prior to the start of the position deviation specifying process for specifying the direction and amount of the position deviation between the formation position of the indentation formed by probing the probed member and the reference position where the indentation is to be formed. When the position of the substrate surface in the Z-axis direction specified based on the first distance and the position of the indentation formation surface in the Z-axis direction specified based on the second distance are different, the member moving mechanism is controlled to move the probed member so that the position of the indentation formation surface in the Z-axis direction coincides with the position of the substrate surface in the Z-axis direction. Therefore, according to the substrate inspection apparatus according to the present invention, in a state where the probed member is moved by the member moving mechanism so that the position of the indentation formation surface in the Z-axis direction coincides with the position of the substrate surface in the Z-axis direction, probing is performed on the indentation formation surface of the probed member under the same conditions as when probing the substrate surface of the inspection target substrate, and an indentation can be formed on the indentation formation surface. Therefore, it is not necessary to prepare various probed members having different thicknesses according to the inspection target substrates of various thicknesses, so that the management of the probed members becomes easy, and the replacement work of the probed members according to the thickness of the inspection target substrate is also unnecessary. Even a person who is not used to operating this type of apparatus can easily specify the necessary information accurately for correcting the tip of the probe to be accurately contacted with a desired position during probing of the inspection target substrate.

Brief Description of the Drawings

[0026] [Figure 1] It is a configuration diagram showing the configuration of the substrate inspection apparatus 1. [Figure 2] It is an explanatory diagram for explaining the operation of the member moving mechanism 4. [Figure 3] This is another explanatory diagram illustrating the operation of the member movement mechanism 4. [Figure 4] This is an explanatory diagram illustrating the positional relationship between the probe's movable regions A0 and A1, the member movement mechanism 4, and the member being probed 6. [Modes for carrying out the invention]

[0027] The following describes an embodiment of the "substrate inspection apparatus" with reference to the attached drawings.

[0028] The substrate inspection apparatus 1 shown in Figure 1 is an example of a "substrate inspection apparatus" and is configured to inspect the quality of a substrate X, which is an example of a "substrate to be inspected". It comprises a substrate holding unit 2, probing mechanisms 3a, 3b, member moving mechanism 4, probes 5aa, 5ab, 5ba, 5bb, member to be probed 6, imaging units 7a, 7b, distance measuring units 8a, 8b, measurement unit 9, control unit 10, and storage unit 11.

[0029] The substrate holding section 2 is an example of a "substrate holding section" and is configured to hold substrates X of various thicknesses and sizes to be inspected. The probing mechanisms 3a and 3b (hereinafter also referred to as "probing mechanism 3" when not distinguishing between them) are an example of a "probing mechanism" and are configured to include an XY axis movement mechanism that moves probes 5aa, 5ab, 5ba, and 5bb (an example of a "probe": hereinafter also referred to as "probe 5" when not distinguishing between them) in parallel with respect to the substrate surface FXa (the front surface of the substrate X to be inspected) and the substrate surface FXb (the back surface of the substrate X to be inspected) of the substrate X to be inspected held by the substrate holding section 2, and a Z axis movement mechanism (neither of which is shown) attached to the XY axis movement mechanism that moves probes 5 in a direction intersecting the substrate surfaces FXa and FXb.

[0030] In this case, the substrate inspection apparatus 1 in this example is configured to perform various inspections with the probe 5 in contact with both sides of the substrate surface FXa and FXb of the substrate X to be inspected (hereinafter also referred to as "substrate surface FX" when not distinguishing between them). Specifically, the substrate inspection apparatus 1 in this example is configured so that the probing mechanism 3a moves probes 5aa and 5ab (hereinafter also referred to as "probe 5a" when not distinguishing between them) that come into contact with the substrate surface FXa of the substrate X to be inspected, and the probing mechanism 3b moves probes 5ba and 5bb (hereinafter also referred to as "probe 5b" when not distinguishing between them) that come into contact with the substrate surface FXb of the substrate X to be inspected (an example of a configuration that is "configured to be able to prob on both the front and back surfaces of the substrate to be inspected as substrate surfaces").

[0031] The component movement mechanism 4 is an example of a "component movement mechanism," and as described later, the component to be probed 6 is mounted such that the surface F6a of the indentation sheet 32a (an example of a "pressure-sensitive sheet") attached to the component to be probed 6 (an example of the "indentation-forming surface" of the component to be probed 6: see Figures 2 and 3) and the surface F6b of the indentation sheet 32b (an example of a "pressure-sensitive sheet") (another example of the component to be probed 6: see Figures 2 and 3) are parallel to the substrate surface FX of the substrate to be inspected X held by the substrate holding part 2. The component to be probed 6 is also configured to be moved in a direction intersecting the substrate surface FX of the substrate to be inspected X (for example, in the Z-axis direction, which is the direction of movement of the probe 5 by the Z-axis movement mechanism in the probing mechanism 3).

[0032] Specifically, as shown in Figures 2 and 3, the member moving mechanism 4 comprises bases 21a and 21b, moving bodies 22 and 23, a screw shaft 24, and a servo motor 25. Base 21a is fixed to the main frame (not shown) of the substrate inspection device 1 with a guide member (not shown) that guides the movement of the moving body 22 in the directions of arrows A1 and A2 (an example of a "first direction parallel or nearly parallel to the substrate surface and the indentation forming surface"), base 21b, and the servo motor 25 attached to it. Base 21b is attached to base 21a as described above with a guide member (not shown) that guides the movement of the moving body 23 in the directions of arrows B1 and BA2 (an example of a "second direction parallel or nearly parallel to the Z-axis direction") attached to it.

[0033] The movable body 22 is an example of a "first movable body that is moved in a first direction," and is attached to the base 21a so as to be able to move in the directions of arrows A1 and A2 according to the guidance of the guide member attached to the base 21a. The movable body 23 is an example of a "second movable body that has a probing member attached to it and is disposed in contact with the first movable body and is moved in a second direction," and has a probing member 6 that is detachably attached to it, and is attached to the base 21b so as to be able to move in the directions of arrows B1 and B2 according to the guidance of the guide member attached to the base 21b while in contact with the movable body 22.

[0034] The screw shaft 24 is an example of a "screw shaft that is arranged along a first direction and engaged with the first movable body so that the first movable body can move in the first direction," and is arranged along the directions of arrows A1 and A2 (the "first direction" described above), connected to a servo motor 25, and engaged with the movable body 22. The servo motor 25 rotates the screw shaft 24 according to the control of the control unit 10, thereby moving the movable body 22 in the directions of arrows A1 and A2. In this example, the substrate inspection device 1 is configured as a "ball screw mechanism" by the base 21a, the movable body 22, the screw shaft 24, and the servo motor 25.

[0035] Furthermore, in the member movement mechanism 4 of this example, both the contact portion 22a of the moving body 22 with the moving body 23 (an example of the "first contact portion") and the contact portion 23a of the moving body 23 with the moving body 22 (an example of the "second contact portion") are composed of slopes that extend along a "third direction" (for example, the direction of arrows C1 and C2 in both figures) that intersects both the "first direction" and the "second direction" when viewed in a direction perpendicular to both of the above-mentioned "first direction" and "second direction".

[0036] As a result, in this member movement mechanism 4, the movable body 22 is moved in the direction of arrow A1 by the rotation of the screw shaft 24, causing the movable body 23 to slide relative to the contact portion 22a in the direction of arrow C1 (the movable body 22 slides relative to the contact portion 23a in the direction of arrow C2), and the movable body 23 moves in the direction of arrow B1. Also, the movable body 22 is moved in the direction of arrow A2 by the rotation of the screw shaft 24, causing the movable body 23 to slide relative to the contact portion 22a in the direction of arrow C2 (the movable body 22 slides relative to the contact portion 23a in the direction of arrow C1), and the movable body 23 moves in the direction of arrow B2.

[0037] The probing member 6 is an example of a "probing member" and comprises an arm-shaped member 31 (an example of an "arm-shaped member") that is detachably attached to the movable body 23 of the member movement mechanism 4, and indentation sheets 32a and 32b (an example of a "pressure-sensitive sheet"; hereinafter also referred to as "indentation sheet 32" when not distinguishing between them) attached to both the front and back surfaces of a flat plate-shaped portion provided on the tip side of the arm-shaped member 31. In this example, both surfaces F6a, which is the surface of the indentation sheet 32a attached to the arm-shaped member 31 (the upper surface in both figures), and F6b, which is the surface of the indentation sheet 32b (the lower surface in both figures) (hereinafter also referred to as "surface F6" when not distinguishing between them), correspond to "indentation-forming surfaces where indentations are formed at the contact position of the tip of the probe."

[0038] Furthermore, as shown in Figure 4, in the substrate inspection apparatus 1 of this example, the member to be probed 6 (dent sheet 32) is positioned within the probe movable area A0, which can be moved by the XY axis movement mechanism, while the member movement mechanism 4 is arranged such that the base 21a, 21b, moving bodies 22, 23, screw shaft 24, and servo motor 25 are located outside the probe movable area A0. The probe movable area A1 shown in the figure is the area in which each probe 5 is moved when probing various substrates X to be inspected, which are held by the substrate holding part 2. In the substrate inspection apparatus 1 of this example, the member movement mechanism 4 is arranged such that the member to be probed 6 is located outside the probe movable area A1, which is defined within the probe movable area A0.

[0039] The imaging units 7a and 7b (hereinafter also referred to as "imaging unit 7" when not distinguished) are examples of "imaging units," and as shown in Figure 1, the imaging unit 7a is attached to the XY axis movement mechanism of the probing mechanism 3a together with the Z axis movement mechanism so as to be able to image the surface F6a of the member to be probed 6 and the substrate surface FXa of the substrate to be inspected, and the imaging unit 7b is attached to the XY axis movement mechanism of the probing mechanism 3b together with the Z axis movement mechanism so as to be able to image the surface F6b of the member to be probed 6 and the substrate surface FXb of the substrate to be inspected. In this case, the imaging unit 7a is attached to the XY axis movement mechanism of the probing mechanism 3a in a mounting position in which its optical axis is perpendicular to the substrate surface FXa of the substrate to be inspected X held by the substrate holding unit 2, and the imaging unit 7b is attached to the XY axis movement mechanism of the probing mechanism 3b in a mounting position in which its optical axis is perpendicular to the substrate surface FXb of the substrate to be inspected X held by the substrate holding unit 2.

[0040] The distance measuring units 8a and 8b (hereinafter also referred to as "distance measuring unit 8" when not distinguished) are examples of "distance measuring units," where the distance measuring unit 8a is attached to the XY axis movement mechanism of the probing mechanism 3a together with the Z axis movement mechanism and the imaging unit 7a, and the distance measuring unit 8b is attached to the XY axis movement mechanism of the probing mechanism 3b together with the Z axis movement mechanism and the imaging unit 7b. In this example of the substrate inspection apparatus 1, both distance measuring units 8a and 8b are configured as laser displacement meters.

[0041] In this case, the distance measuring unit 8a measures a distance that allows for the identification of the position of the substrate surface FXa of the substrate X to be inspected in the Z-axis direction (up and down direction in Figures 1-3), which is the direction of movement of the probe 5 during probing by the Z-axis movement mechanism (distance from the distance measuring unit 8a to the substrate surface FXa: an example of the "first distance"), and a distance that allows for the identification of the position of the surface F6a of the probing member 6 (dent sheet 32a) in the Z-axis direction (distance from the distance measuring unit 8a to the surface F6a: an example of the "second distance"), and outputs the measurement results to the control unit 10. The distance measuring unit 8b measures a distance that allows for the identification of the position of the surface FXb of the substrate X to be inspected in the Z-axis direction (distance from the distance measuring unit 8b to the surface FXb: another example of the "first distance"), and a distance that allows for the identification of the position of the surface F6b of the probing member 6 (dent sheet 32b) in the Z-axis direction (distance from the distance measuring unit 8b to the surface F6b: another example of the "second distance"), and outputs the measurement results to the control unit 10.

[0042] The measurement unit 9, in accordance with the control unit 10, measures predetermined electrical parameters of the substrate X to be inspected via a probe 5 that has been brought into contact with the substrate X by the probing mechanism 3, and outputs the measurement results to the control unit 10. The control unit 10 is an example of a "control unit" and comprehensively controls each component of the substrate inspection apparatus 1. Specifically, the control unit 10 is configured to perform probing by controlling the probing mechanism 3 to move the probe 5, thereby bringing the tip of the probe 5 into contact with the substrate X to be inspected, which is held by the substrate holding unit 2, and to control the measurement unit 9 to measure the electrical parameters of the substrate X to be inspected via the probe 5, and to perform an inspection process to check the quality of the substrate X to be inspected based on the measurement results.

[0043] In this case, the substrate inspection apparatus 1 in this example, as will be described later, performs a positional misalignment identification process to identify the direction and amount of misalignment between the reference position where an indentation should be formed by probing (the position where the tip of the probe 5 should be made contact) and the position where the tip of the probe 5 is actually made contact, prior to probing (probing against the substrate X to be inspected) during the inspection of the substrate X to be inspected. The apparatus is configured to correct the position where the tip of the probe 5 is made contact according to the identified direction and amount of misalignment. As a result, the substrate inspection apparatus 1 in this example is able to accurately make contact with the probing position defined on the substrate surface FX of the substrate X to be inspected. The positional misalignment identification process and other details will be explained in detail later.

[0044] The memory unit 11 stores the operation program of the control unit 10, inspection data for determining whether the substrate X to be inspected is good or bad (data such as the probing position to which the probe 5 should be made contact and the reference value to be measured by the measurement unit 9), and the calculation results of the control unit 10.

[0045] When inspecting a substrate X using this substrate inspection device 1, the substrate X is held by the substrate holding unit 2, and the probing member 6 (an arm-shaped member 31 to which a dent sheet 32 ​​is attached) is attached to the moving body 23 of the member moving mechanism 4.

[0046] In this case, as mentioned above, in the substrate inspection apparatus 1 of this example, the member to be probed 6 (arm-shaped member 31), which is attached to the member movement mechanism 4, is positioned within the probe movable area A0. Furthermore, in the substrate inspection apparatus 1 of this example, the probe movable area A0 is covered by a casing (not shown) to prevent dust from entering the probe movable area A0 and to ensure the safety of the operator during the inspection process. Therefore, when the member to be probed 6 (arm-shaped member 31) is attached to the member movement mechanism 4 and positioned within the probe movable area A0, the work of peeling the indentation sheet 32 ​​off the arm-shaped member 31 or attaching the indentation sheet 32 ​​to the arm-shaped member 31 becomes complicated.

[0047] However, in the substrate inspection apparatus 1 of this example, the probed member 6 (arm-shaped member 31) can be attached to and detached from the member moving mechanism 4 (moving body 23). This allows the arm-shaped member 31 to be removed from the member moving mechanism 4, and the work of peeling off and attaching the indentation sheet 32 ​​to be performed in a location where these tasks can be easily carried out. After that, the arm-shaped member 31 (probed member 6) with the indentation sheet 32 ​​attached can be attached to the moving body 23 and positioned within the probe movable area A0. Therefore, even a person unfamiliar with this type of work can reliably and easily perform the preliminary preparation work.

[0048] Next, the control unit 10 instructs the start of the inspection process for the substrate X to be inspected by operating an operation unit (not shown). At this time, the control unit 10 controls the probing mechanism 3a to move the distance measuring unit 8a to a position where probing of the substrate surface FXa of the substrate X to be inspected, which is held by the substrate holding unit 2, is possible (a position where the probe 5a can be brought into contact with the substrate surface FXa by moving the probing mechanism 3a in the Z-axis direction by the Z-axis movement mechanism). Next, the control unit 10 controls the distance measuring unit 8a to measure a distance at which the position of the substrate surface FXa in the Z-axis direction can be determined (distance from the distance measuring unit 8a to the substrate surface FXa: an example of the "first distance") (an example of the "first distance measuring process").

[0049] Next, the control unit 10 controls the probing mechanism 3a to move the distance measuring unit 8a to a position where probing is possible on the surface F6a (surface of the indentation sheet 32a) of the member to be probed 6 attached to the member moving mechanism 4 (a position where the probe 5a can be brought into contact with the surface F6a by movement in the Z-axis direction by the Z-axis movement mechanism of the probing mechanism 3a). Then, the control unit 10 controls the distance measuring unit 8a to measure a distance that allows the position of the surface F6a in the Z-axis direction to be determined (distance from the distance measuring unit 8a to the surface F6a: an example of the "second distance") (an example of the "second distance measurement process").

[0050] In this case, the "first distance measurement process" can be performed after the "second distance measurement process," but as will be described later, probing is performed on the indentation sheet 32a in the "position deviation identification process" which is performed after the "second distance measurement process." Therefore, in order to shorten the time required for the probe 5a etc. to move in the XY axis direction by the XY axis movement mechanism of the probing mechanism 3a, it is preferable to perform the "first distance measurement process" and the "second distance measurement process" in that order.

[0051] Next, the control unit 10 determines whether the position of the substrate surface FXa in the Z-axis direction, which is determined based on the "first distance" described above, matches the position of the surface F6a in the Z-axis direction, which is determined based on the "second distance". If the position of the substrate surface FXa in the Z-axis direction and the position of the surface F6a in the Z-axis direction are different, the control unit 10 controls the member movement mechanism 4 to move the member to be probed 6 in the Z-axis direction so that the position of the surface F6a in the Z-axis direction matches the position of the substrate surface FXa in the Z-axis direction. The operating principle of the movement of the member to be probed 6 in the Z-axis direction by the member movement mechanism 4 (movement in the direction of arrows B1 and B2 shown in Figures 2 and 3) is as described above, so a detailed explanation is omitted. This makes it possible to perform probing on the surface F6a of the member to be probed 6 under the same conditions as probing on the substrate surface FXa of the substrate X to be inspected.

[0052] Next, the control unit 10 performs a "position misalignment identification process." Specifically, the control unit 10 controls the XY axis movement mechanism of the probing mechanism 3a to move the probe 5a to a position where probing is possible at a specified position on the surface F6a of the member to be probed 6 (for example, "XY axis coordinates = Xn:Yn"). In this state, the control unit 10 controls the Z axis movement mechanism to probe the surface F6a (indentation sheet 32a) with the probe 5a. At this time, an indentation is formed on the indentation sheet 32a (surface F6a) by contact with the probe 5a.

[0053] Next, the control unit 10 controls the XY axis movement mechanism of the probing mechanism 3a to move the imaging unit 7a to a position where the optical axis coincides with the specified position (XY axis coordinates = Xn:Yn) on the surface F6a of the member to be probed 6. In this state, the imaging unit 7a is controlled to image the surface F6a of the member to be probed 6 (dent sheet 32a). At this time, the field of view range centered on the specified position (XY axis coordinates = Xn:Yn) on the dent sheet 32a is imaged, and the image data is output from the imaging unit 7a to the control unit 10.

[0054] Next, the control unit 10 analyzes the image data output from the imaging unit 7a to identify the location of the indentation on the surface F6a of the probing member 6 (indentation sheet 32a) (the contact position of the tip of the probe 5a). The method for identifying the location of the indentation by image analysis is the same as the processing procedure in the substrate inspection apparatus disclosed by the applicant in the aforementioned patent document, so a detailed explanation is omitted.

[0055] Next, the control unit 10 identifies the direction and amount of the positional displacement between the reference position (in this example, "XY axis coordinates = Xn:Yn") where an indentation should be formed by probing the member to be probed 6 (indentation sheet 32a) and the identified indentation formation position. Specifically, when the imaging unit 7a images the surface F6a of the member to be probed 6 (indentation sheet 32a) as described above, the imaging data captured with the optical axis aligned to the reference position (XY axis coordinates = Xn:Yn) where the indentation should be formed is output to the control unit 10. Therefore, when the center position in the image of the imaging data corresponds to the above reference position (XY axis coordinates = Xn:Yn), and this center position coincides with the indentation formation position, it can be determined that the tip of the probe 5a has come into contact with the reference position (the position where the optical axis of the imaging unit 7a is aligned) where the indentation should be formed, and an indentation has been formed (no positional displacement has occurred).

[0056] On the other hand, when the center position in the image of the captured data does not match the position where the indentation is formed, it can be determined that the tip of the probe 5a did not contact the reference position where the indentation should be formed (the position where the optical axis of the imaging unit 7a is aligned), and that the tip of the probe 5a contacted a position different from the reference position, resulting in the formation of an indentation (a positional misalignment occurred). At this time, the control unit 10 identifies the direction and amount of the positional misalignment between the center position of the image (reference position) and the position where the indentation is formed, and stores the identified information in the storage unit 11 as a correction value for probing position correction when probing the substrate surface FXa of the substrate X to be inspected. With the above, the "positional misalignment identification process" related to probing the substrate surface FXa of the substrate X to be inspected is completed.

[0057] Next, the control unit 10 performs a "position deviation identification process" for probing the substrate surface FXb of the substrate X to be inspected, using the same procedure as the "position deviation identification process" for probing the substrate surface FXa. At this time, in the same manner as the movement of the member to be probed in the Z-axis direction of the member to be probed 6 performed prior to the "position deviation identification process" for probing the substrate surface FXa, the control unit 10 performs a process to move the member to be probed 6 so that the position of the surface F6b of the member to be probed in the Z-axis direction matches the position of the substrate surface FXb of the substrate X to be inspected in the Z-axis direction. As a result, the "position deviation identification process" for probing the surface F6b of the member to be probed 6 is performed in a state where it is possible to perform probing on the surface F6b of the member to be probed 6 under the same conditions as probing on the substrate surface FXb of the substrate X to be inspected, and the correction value for probing position correction during probing on the substrate surface FXb is stored in the storage unit 11.

[0058] Subsequently, when each probe 5 is probed onto the substrate X to be inspected and measurement is performed by the measurement unit 9, the tip of probe 5a can be brought into contact with the reference position by correcting the target position of the probe relative to the substrate surface FXa based on the correction value identified by the "position deviation identification process," and the tip of probe 5b can be brought into contact with the reference position by correcting the target position of the probe relative to the substrate surface FXb.

[0059] Thus, in this substrate inspection apparatus 1, the probing member 6 is mounted so that its surface F6 (in this example, the surface of the indentation sheet 32) is parallel to the substrate surface FX of the substrate X to be inspected. A member moving mechanism 4 moves the probing member 6 in a direction intersecting the substrate surface FX, and the Z-axis moving mechanism of the probing mechanism 3 measures the "first distance" to the substrate surface FX and the "second distance" to the surface F6 so that the position of the substrate surface FX and the position of the surface F6 in the Z-axis direction can be determined. The control unit 10 is equipped with a distance measuring unit 8, and prior to starting the "position deviation identification process", the control unit 10 performs a "first distance measuring process" to cause the distance measuring unit 8 to measure a "first distance", and a "second distance measuring process" to cause the distance measuring unit 8 to measure a "second distance", and when the position of the substrate surface FX in the Z-axis direction, which is identified based on the "first distance", differs from the position of the surface F6 in the Z-axis direction, the control unit 10 controls the member moving mechanism 4 to move the member to be probed 6 so that the position of the surface F6 in the Z-axis direction coincides with the position of the substrate surface FX in the Z-axis direction.

[0060] Therefore, with this substrate inspection apparatus 1, even if the movement trajectory of the probe tip during probing (when the probe 5 is moved by the Z-axis movement mechanism) does not coincide with the optical axis of the lens in the imaging unit 7 (center of the imaging range of the imaging unit 7: orientation perpendicular to the substrate surface FX of the substrate X to be inspected) due to differences in the mounting position of the Z-axis movement mechanism to the XY-axis movement mechanism, the mounting position of the probe 5 to the Z-axis movement mechanism, and the type of probe 5 attached to the Z-axis movement mechanism, the member movement mechanism 4 moves the member to be probed 6 so that the position of the surface F6 in the Z-axis direction coincides with the position of the substrate surface FX in the Z-axis direction prior to the start of the "position misalignment identification process," the member to be probed 6 is moved by the member movement mechanism 4 so that the position of the surface F6 in the Z-axis direction coincides with the position of the substrate surface FX in the Z-axis direction. In this case, during the "position misalignment identification process," probing of the surface F6 of the member to be probed 6 can be performed under the same conditions as when probing the substrate surface FX of the substrate X to be inspected, and an indentation can be formed on the surface F6. Therefore, since it is no longer necessary to prepare various "probing members" with different thicknesses according to the thickness of the substrate X to be inspected, the management of the probing members 6 becomes easier, and the work of changing the probing members 6 according to the thickness of the substrate X to be inspected is also eliminated. As a result, even a person unfamiliar with operating this type of device can easily identify the accurate information necessary for correction to accurately contact the tip of the probe 5 with the desired position when probing the substrate X to be inspected. This makes it possible to reliably and easily contact the tip of the probe 5 with any position on the substrate surface FX of the substrate X to be inspected.

[0061] Furthermore, in this substrate inspection apparatus 1, the member moving mechanism 4 includes a movable body 22 that is moved in a "first direction" parallel or nearly parallel to the substrate surface FX and surface F6, and a ball screw mechanism having a screw shaft 24 that is arranged along the "first direction" and engages with the movable body 22 so that the movable body 22 can move in the "first direction", and a movable body 23 that is attached to the member to be probed 6 and is arranged in contact with the movable body 22 and is moved in a "second direction" parallel or nearly parallel to the Z-axis direction, and in the movable body 22 At least one of the contact portion 22a with the movable body 23 and the contact portion 23a of the movable body 23 with the movable body 22 (in this example, both contact portions 22a and 23a) is formed to extend along a "third direction" that intersects both the "first direction" and the "second direction" when viewed in a direction perpendicular to both the "first direction" and the "second direction", so that the movable body 23 is moved in the "second direction" when the movable body 22 is moved in the "first direction" by the rotation of the screw shaft 24.

[0062] Therefore, according to this substrate inspection apparatus 1, unlike when the "member movement mechanism" is configured with a "ball screw mechanism" that directly moves the "movable body (a component corresponding to the movable body 23 in the above example)" to which the "member to be probed" is attached in the Z-axis direction by the rotation of a "screw shaft", the space occupied in the Z-axis direction by the components of the "member movement mechanism" can be made sufficiently small, and the situation in which the presence of the "member movement mechanism" hinders probing on both the front and back surfaces of the "member to be probed" can be suitably avoided.

[0063] Furthermore, in this substrate inspection apparatus 1, the component moving mechanism 4 is arranged such that the component to be probed 6 is located within the probe movable area A0 of the probe 5 by the probing mechanism 3, while the bases 21a, 21b, movable bodies 22, 23, screw shaft 24, and servo motor 25 are located outside the probe movable area A0. Therefore, with this substrate inspection apparatus 1, there are no components (bases 21a, 21b, movable bodies 22, 23, screw shaft 24, and servo motor 25) that may obstruct the movement of the probe 5 by the probing mechanism 3 within the probe movable area A0. This effectively avoids the situation in which the probe 5 comes into contact with and is damaged by components of the component moving mechanism 4 as the probe 5 moves within the probe movable area A0.

[0064] Furthermore, in this substrate inspection apparatus 1, the member to be probed 6 is configured to include an arm-shaped member 31 that is detachably attached to the movable body 23 in the member movement mechanism 4, and a dent sheet 32 ​​that is attached to the arm-shaped member 31 to form a surface F6 (dent-forming surface). Therefore, unlike configurations in which the attachment and detachment of the member to be probed 6, which is located within the probe movable area A0, is restricted, this substrate inspection apparatus 1 allows operations such as peeling the dent sheet 32 ​​off the arm-shaped member 31 and attaching the dent sheet 32 ​​to the arm-shaped member 31 to be performed outside the probe movable area A0, thus making these operations easy to carry out. Furthermore, even without performing the task of peeling off the indentation sheet 32 ​​from the arm-shaped member 31 and attaching a new indentation sheet 32 ​​immediately before disclosing the inspection of the substrate X to be inspected (immediately before starting probing on the member to be probed 6), by preparing another member to be probed 6 with an indentation sheet 32 ​​attached to the arm-shaped member 31 in advance, it becomes possible to start the inspection simply by attaching the new member to be probed 6 to the member moving mechanism 4.

[0065] Furthermore, this substrate inspection device 1 is configured to be able to probe both sides of substrate surfaces FXa and FXb of the substrate X to be inspected, and is also configured to be able to perform a "position misalignment identification process" on both sides of substrate surfaces FXa and FXb of the substrate X to be inspected. Therefore, with this substrate inspection device 1, even when inspecting the substrate X with probes 5a and 5b probed on both sides of substrate surfaces FXa and FXb, it is possible to reliably and easily identify information for accurately contacting the tip of probe 5a at a desired position on substrate surface FXa, and accurate information for accurately contacting the tip of probe 5b at a desired position on substrate surface FXb.

[0066] The configuration of the "substrate inspection device" is not limited to the examples of substrate inspection device configurations described above.

[0067] For example, the explanation described an example in which the distance measuring units 8a and 8b are attached to and moved by the XY axis movement mechanism of the probing mechanisms 3a and 3b. However, the mounting position of the "distance measuring unit" is not limited to this example, and it can be attached to any position where the "first distance" and the "second distance" can be measured (not shown). In this case, the configuration is not limited to moving the "distance measuring unit" by "movement of the probing mechanism" or the like, as in the above-described substrate inspection apparatus 1, and the "distance measuring unit" can also be fixedly positioned at any position where the "first distance" and the "second distance" can be measured (not shown).

[0068] Furthermore, although the member movement mechanism 4 was described as an example in which both the contact portion 22a on the moving body 22 (an example of the "first contact portion on the first moving body") and the contact portion 23a on the moving body 23 (an example of the "second contact portion on the second moving body") are composed of inclined surfaces extending along a "third direction" that intersects both the "first direction" and the "second direction" when viewed in a direction perpendicular to both the "first direction" and the "second direction," it is also possible to replace this configuration with one of the "first contact portion on the first moving body" and the "second contact portion on the second moving body" being composed of an inclined surface extending along the "third direction" as the contact portions 22a and 23a, and the other being composed of a wheel that can roll on the inclined surface (not shown). In such a configuration as well, the "probing member" can be moved by the same operation as the moving bodies 22 and 23 in the member movement mechanism 4 described above.

[0069] Furthermore, although an example has been described in which the probing member 6 is configured with an indentation sheet 32 ​​(pressure-sensitive sheet) that constitutes an "indentation-forming surface," it is also possible to configure the "probing member" with a plate made of a material that forms (marks) an "indentation" at the "probe's contact position" without attaching a sheet body such as the indentation sheet 32 ​​(pressure-sensitive sheet) (not shown). [Industrial applicability]

[0070] According to the present invention, it becomes unnecessary to prepare various probing members with different thicknesses depending on the thickness of the substrate to be inspected, thus simplifying the management of the probing members. Since it eliminates the need to replace the probing member according to the thickness of the substrate being inspected, even those unfamiliar with operating this type of device can easily identify the precise information necessary for correcting the position of the probe tip to accurately contact the desired location when probing the substrate being inspected. Therefore, it can be widely applied to substrate inspection devices that correct the contact position of the probe tip according to the direction and amount of misalignment identified in advance. [Explanation of symbols]

[0071] 1. Circuit board inspection equipment 2 Board holding part 3a,3b Probing mechanism 4. Member movement mechanism 5aa, 5ab, 5ba, 5bb probes 6. Probing member 7a, 7b Imaging section 8a,8b Ranging section 9 Measuring part 10 Control Unit 11 Storage section 21a,21b base 22,23 Mobile Units 22a,23a Contact part 24 Screw shaft 25 Servo motors 31 Arm-shaped member 32a, 32b Indentation Sheet A0 Probe Movable Range A1 Probe range of motion F6a,F6b surface FXa,FXb board surface X Substrate to be inspected

Claims

1. A substrate holding section capable of holding the substrate to be inspected, A probing mechanism having an XY axis movement mechanism for moving a probe parallel to the substrate surface of the substrate to be inspected, which is held by the substrate holding part, and a Z axis movement mechanism attached to the XY axis movement mechanism for moving the probe in a direction intersecting the substrate surface, A member to be probed having a mark-forming surface on which a mark is formed at the contact position of the tip of the probe by probing by the probing mechanism, An imaging unit is attached to the XY axis movement mechanism so as to be able to image the indentation-forming surface, The system comprises the probing mechanism and the control unit for controlling the imaging unit, A substrate inspection apparatus configured such that the control unit controls the probing mechanism to probe the probe against the member to be probed, controls the imaging unit to image the indentation-forming surface, identifies the indentation formation position on the indentation-forming surface based on the imaging data from the imaging unit, and performs a positional misalignment identification process to identify the direction and amount of misalignment between a reference position where the indentation should be formed by probing the member to be probed and the identified indentation formation position, and corrects the position at which the tip of the probe contacts the substrate during probing of the substrate to be inspected according to the direction and amount of misalignment identified by the positional misalignment identification process, The probing member is mounted such that the indentation-forming surface is parallel to the substrate surface, and a member moving mechanism moves the probing member in a direction intersecting the substrate surface. The system includes a distance measuring unit that measures a first distance to the substrate surface and a second distance to the indentation-forming surface so as to be able to identify the position of the substrate surface in the Z-axis direction, which is the direction of movement of the probe during probing by the Z-axis movement mechanism, and the position of the indentation-forming surface in the Z-axis direction, The control unit performs a first distance measurement process to cause the distance measuring unit to measure the first distance and a second distance measurement process to cause the distance measuring unit to measure the second distance, prior to starting the position misalignment identification process, and controls the member movement mechanism to move the member to be probed so that the position of the mark-forming surface in the Z-axis direction matches the position of the substrate surface in the Z-axis direction when the position of the mark-forming surface in the Z-axis direction determined based on the first distance differs from the position of the mark-forming surface in the Z-axis direction determined based on the second distance.

2. The aforementioned member moving mechanism is The system comprises a first movable body that is moved in a first direction parallel or substantially parallel to the substrate surface and the indentation forming surface, and a ball screw mechanism having a screw shaft disposed along the first direction and engaged with the first movable body so as to be movable in the first direction, and a second movable body to which the probing member is attached and which is disposed in contact with the first movable body and is moved in a second direction parallel or substantially parallel to the Z-axis direction, The substrate inspection apparatus according to claim 1, wherein at least one of the first contact portion of the first moving body with the second moving body and the second contact portion of the second moving body with the first moving body is formed to extend along a third direction that intersects both the first and second directions when viewed in a direction perpendicular to both the first and second directions, and the second moving body is moved in the second direction by the rotation of the screw shaft of the first moving body in the first direction.

3. The substrate inspection apparatus according to claim 2, wherein the member moving mechanism is arranged such that the member to be probed is located within the movable range of the probe by the probing mechanism, and the first movable body, the second movable body, and the screw shaft are located outside the movable range of the probe by the probing mechanism.

4. The substrate inspection apparatus according to claim 2 or 3, wherein the probing member comprises an arm-shaped member detachably attached to the second moving body in the member moving mechanism, and a pressure-sensitive sheet attached to the arm-shaped member to form the indentation-forming surface.

5. The substrate inspection apparatus according to claim 1, which is configured to be able to probe both the front surface and the back surface of the substrate to be inspected, and to be able to perform the misalignment identification process on both of the substrate to be inspected.

Images