Photosensitive resin composition and method for manufacturing a circuit board using the same

The photosensitive resin composition, incorporating a resin with phenolic hydroxyl groups and a compound with a methylol or alkoxyalkyl group, addresses the challenge of high-resolution pattern formation in circuit boards by enhancing insolubility and sensitivity, resulting in improved heat and chemical resistance.

JP2026109799APending Publication Date: 2026-07-02RESONAC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
RESONAC CORP
Filing Date
2024-12-20
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Photosensitive resin compositions face challenges in achieving high resolution for forming fine resin patterns in semiconductor devices and printed circuit boards, necessitating improved sensitivity and pattern formation capabilities.

Method used

A photosensitive resin composition comprising a resin with a phenolic hydroxyl group, a compound with a methylol or alkoxyalkyl group, and a photoacid generator, where the compound includes a specific group represented by formula (b1), enhancing the insolubility of unexposed areas and improving resolution through a crosslinking reaction.

Benefits of technology

The composition enables the formation of resin patterns with high resolution and improved heat resistance, chemical resistance, and sensitivity, facilitating the manufacturing of circuit boards with precise conductive patterns.

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Abstract

To provide a photosensitive resin composition that can form resin patterns with high resolution. [Solution] A photosensitive resin composition comprising (A) component: a resin having a phenolic hydroxyl group, (B) component: a compound having a methylol group or an alkoxyalkyl group, and (C) component: a photoacid generator, wherein (B) component contains a compound having a group represented by the following general formula (b1). JPEG2026109799000016.jpg38149 [In formula (b1), R b Each of these independently represents an alkyl group, and * represents a bond.
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